WO2023115551A1 - 显示面板 - Google Patents

显示面板 Download PDF

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Publication number
WO2023115551A1
WO2023115551A1 PCT/CN2021/141273 CN2021141273W WO2023115551A1 WO 2023115551 A1 WO2023115551 A1 WO 2023115551A1 CN 2021141273 W CN2021141273 W CN 2021141273W WO 2023115551 A1 WO2023115551 A1 WO 2023115551A1
Authority
WO
WIPO (PCT)
Prior art keywords
display panel
bonding pad
driving chip
pad group
color filter
Prior art date
Application number
PCT/CN2021/141273
Other languages
English (en)
French (fr)
Inventor
潘海龙
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Publication of WO2023115551A1 publication Critical patent/WO2023115551A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads

Definitions

  • the present application relates to the field of display technology, in particular to the field of display panel manufacturing technology, in particular to the display panel.
  • the driver chip is located below the display area, since the side of the driver chip far away from the display area needs to be sequentially provided with bonding pads and bonded to the bonding pads.
  • the flexible printed circuit board and the need to reserve a bending area for the flexible printed circuit board to bend lead to a larger size under the display area, which greatly increases the size of the lower frame of the display panel, which is not conducive to the development of a narrow frame of the display screen.
  • the arrangement of the driver chip, the bonding pad and the flexible printed circuit board of the panel in the prior art is not conducive to the development of the narrow frame of the display screen, and urgently needs to be improved.
  • the embodiment of the present application provides a display panel to solve the technical problem that the arrangement of the driver chip, the bonding pad and the flexible printed circuit board in the existing panel is not conducive to the development of the narrow frame of the display screen.
  • an embodiment of the present application provides a display panel, including:
  • An array substrate including a first area and a second area arranged along a first direction;
  • a driving component the driving component includes a driving chip located in the second area and at least one bonding pad group electrically connected to the driving chip, the driving component is electrically connected to the Drive traces inside;
  • a color filter substrate is arranged opposite to the array substrate, the color filter substrate is formed with an opening, and the driving chip is located on the side of the array substrate close to the color filter substrate and opposite to the opening within the third area set;
  • the orthographic projection of the driving chip on the first plane overlaps the orthographic projection of the bonding pad group on the first plane, and the first plane is parallel to the first direction and perpendicular to said display panel;
  • the two sides of the driving chip are provided with the binding pad group, and the orthographic projection of the driving chip on the first plane is located at the normal projection of the binding pad group on the first plane. within the projection, or the orthographic projection of the bonding pad group on the first plane is located within the orthographic projection of the driving chip on the first plane.
  • the bonding pad group is located on a side of the array substrate close to the color filter substrate;
  • the driving assembly further includes a flexible printed circuit board, the flexible printed circuit board is connected to the side of the display panel close to the bonding pad group, and is bent to be fixed on the array substrate away from the On one side of the color filter substrate, the flexible printed circuit board is electrically connected to the bonding pad group.
  • the bonding pad group is electrically connected to the driving chip through a wire group, and the driving chip is electrically connected to the driving wire.
  • the orthographic projection of the driving chip on the first plane is located within the orthographic projection of the bonding pad group on the first plane;
  • the group of bonding pads includes a plurality of bonding pads, each of the bonding pads includes a first end and a second end oppositely arranged along the first direction, and the group of bonding pads A plurality of the first ends in the second direction are arranged flush along the second direction, the second direction is perpendicular to the first direction, and among the two adjacent bonding pads, all the ones that are relatively close to the driving chip
  • the size of the bonding pads in the first direction is smaller than the size of the bonding pads relatively far away from the driving chip in the first direction, so that the bonding pads in the bonding pad group A plurality of the second ends form a size difference in the first direction;
  • the wire group includes a plurality of wires corresponding to a plurality of the bonding pads one by one, and the second end of each of the bonding pads is electrically connected to the driving chip through the corresponding wire , each of the wires is located in the size difference region formed by the corresponding bonding pad.
  • the display panel further includes:
  • the sealant is located between the color filter substrate and the array substrate, and the sealant is at least opposite to the edge of the opening.
  • the display panel further includes:
  • a plurality of supporting parts are located between the color filter substrate and the array substrate, and the plurality of supporting parts are at least arranged along the edge of the opening.
  • At least one bonding pad group includes a plurality of bonding pads arranged along the second direction or the first direction, and the second direction is perpendicular to the first direction.
  • the embodiment of the present application also provides a display panel, including:
  • An array substrate including a first area and a second area arranged along a first direction;
  • a driving component the driving component includes a driving chip located in the second area and at least one bonding pad group electrically connected to the driving chip, the driving component is electrically connected to the Drive traces inside;
  • a color filter substrate is arranged opposite to the array substrate, the color filter substrate is formed with an opening, and the driving chip is located on the side of the array substrate close to the color filter substrate and opposite to the opening within the third area set;
  • the orthographic projection of the driving chip on the first plane overlaps the orthographic projection of the bonding pad group on the first plane, and the first plane is parallel to the first direction and perpendicular to the display panel.
  • the bonding pad group is located on a side of the array substrate close to the color filter substrate;
  • the driving assembly further includes a flexible printed circuit board, the flexible printed circuit board is connected to the side of the display panel close to the bonding pad group, and is bent to be fixed on the array substrate away from the On one side of the color filter substrate, the flexible printed circuit board is electrically connected to the bonding pad group.
  • the bonding pad group is electrically connected to the driving chip through a wire group, and the driving chip is electrically connected to the driving wire.
  • the bonding pad groups are provided on both sides of the driving chip.
  • the orthographic projection of the driving chip on the first plane is located within the orthographic projection of the bonding pad group along the first plane, or the bonding pad group The orthographic projection on the first plane is located within the orthographic projection of the driving chip on the first plane.
  • the orthographic projection of the driving chip on the first plane is located within the orthographic projection of the binding pad group on the first plane;
  • the group of bonding pads includes a plurality of bonding pads, each of the bonding pads includes a first end and a second end oppositely arranged along the first direction, and the group of bonding pads A plurality of the first ends in the second direction are arranged flush along the second direction, the second direction is perpendicular to the first direction, and among the two adjacent bonding pads, all the ones that are relatively close to the driving chip
  • the size of the bonding pads in the first direction is smaller than the size of the bonding pads relatively far away from the driving chip in the first direction, so that the bonding pads in the bonding pad group A plurality of the second ends form a size difference in the first direction;
  • the wire group includes a plurality of wires corresponding to a plurality of the bonding pads one by one, and the second end of each of the bonding pads is electrically connected to the driving chip through the corresponding wire , each of the wires is located in the size difference region formed by the corresponding bonding pad.
  • the display panel further includes:
  • the sealant is located between the color filter substrate and the array substrate, and the sealant is at least opposite to the edge of the opening.
  • the display panel further includes:
  • a plurality of supporting parts are located between the color filter substrate and the array substrate, and the plurality of supporting parts are at least arranged along the edge of the opening.
  • the driving chip is located on a side of the array substrate away from the color filter substrate;
  • the driving chip is fixed on the side of the flexible printed circuit board away from the color filter substrate, the driving chip is electrically connected to the flexible printed circuit board, and the bonding pad group is electrically connected to The drive traces.
  • At least one bonding pad group includes a plurality of bonding pads arranged along a second direction or the first direction, and the second direction is perpendicular to the first direction.
  • each bonding pad group includes a plurality of bonding pads arranged along the first direction, and each bonding pad includes a Lap end;
  • the flexible printed circuit board is disposed close to the plurality of overlapping ends in the group of bonding pads, and the flexible printed circuit board is connected to the plurality of overlapping ends.
  • the first region includes a fourth region connected to the edge of the array substrate and along the first direction;
  • the driving wires located in the fourth region are stacked, and the driving wires located in different layers are electrically connected through via holes.
  • the driving assembly further includes a conductive part, and the conductive part is located between the side of the display panel and the flexible printed circuit board;
  • one side of the conductive part is electrically connected to the bonding pad group, and the other side of the conductive part is electrically connected to the flexible printed circuit board.
  • the display panel further includes:
  • a fixing part is located on an edge of the display panel close to the flexible printed circuit board, and is connected to the edge of the display panel and the flexible printed circuit board.
  • the present application provides a display panel, and the display panel includes: an array substrate, including a first area and a second area arranged along a first direction, the first area is used for display; a driving assembly, the driving assembly includes a The driving chip in the second area and at least one bonding pad group electrically connected to the driving chip, the driving assembly is electrically connected to the driving wiring in the first area; the color filter substrate, the The color filter substrate is arranged opposite to the array substrate, the color filter substrate is formed with an opening, and the driving chip is located in a third area opposite to the opening on the side of the array substrate close to the color filter substrate ; Wherein, the orthographic projection of the driving chip on the first plane overlaps the orthographic projection of the bonding pad group on the first plane, and the first plane is parallel to the first direction and perpendicular to on the display panel.
  • the present application arranges the driving chip to extend along the second direction and then overlap the bonding pad group, so that the projection of the driving chip in the second direction and the projection of the bonding pad group in the second direction coincide.
  • the two directions are perpendicular to the first direction, avoiding that the two projections respectively occupy different spaces in the first direction, and avoiding that the sum of the projections has a large size in the first direction, effectively shortening the size of the array substrate in the first direction, which is beneficial Narrow bezel development of display panels.
  • FIG. 1 is a schematic top view of an array substrate in a first display panel provided by the present application.
  • FIG. 2 is a schematic top view of the array substrate in the second display panel provided by the present application (including the perspective structure of the driving chip).
  • FIG. 3 is a schematic diagram of an exploded structure of the first display panel provided by the present application.
  • FIG. 4 is a schematic diagram of the exploded structure of the second display panel provided by the present application (including the perspective structure of the driving chip).
  • FIG. 5 is a left view of a part of the structure of the first display panel provided by the present application.
  • FIG. 6 is a front view of a part of the structure of the second display panel provided by the present application.
  • FIG. 7 is a schematic top view of an array substrate in a third display panel provided by the present application.
  • FIG. 8 is a schematic top view of an array substrate in a fourth display panel provided by the present application.
  • FIG. 9 is a schematic top view of the array substrate and the structures above it in the first display panel provided by the present application.
  • FIG. 10 is a schematic bottom view of the array substrate and the structures below it in the second display panel provided by the present application.
  • FIG. 11 is a front view of a part of the structure of the second display panel provided by the present application.
  • FIG. 12 is a front view of a part of the structure of the first display panel provided by the present application.
  • FIG. 13 is a left side view of the flexible printed circuit board in the unbent state of the second display panel provided by the present application.
  • Embodiments of the present application provide a display panel, and the display panel includes but is not limited to the following embodiments and combinations of the following embodiments.
  • the display panel 100 includes: an array substrate 10, including a first area A1 and a second area A2 arranged along a first direction D1, and the first area A1
  • the driving component 20 includes a driving chip 201 located in the second area A2 and at least one bonding pad group 202 electrically connected to the driving chip 201, the driving component 20 is electrically connected to the driving wiring 90 located in the first area A1; wherein, the orthographic projection of the driving chip 201 on the first plane overlaps with that of the bonding pad group 202 on the first plane Orthographic projection on , the first plane is parallel to the first direction D1 and perpendicular to the display panel 100 , referring to FIG. 1 , it can also be understood that the projection of the driving chip 201 along the second direction D2 overlaps with the A projection of the bonding pad group along the second direction D2, where the second direction D2 is perpendicular to the first direction D1.
  • the two ends of the driving chip 201 are respectively electrically connected to the driving wiring 90 and at least one bonding pad group 202 in the first area A1, where the first auxiliary line L1 is defined as being located on the array substrate 10 and The auxiliary line parallel to the first direction D1, if the bonding pad group 202 is arranged on the side of the driving chip 201 away from the first area A1, that is, the projection of the bonding pad group 202 on the first auxiliary line L1 and the driving chip
  • the projections of 201 on the first auxiliary line L1 occupy space without overlapping, resulting in a larger size of the second area A2 in the first direction D1, which is not conducive to the development of narrow borders of the display panel.
  • the driver chip 201 by setting the driver chip 201 so that the projection of the driver chip 201 along the second direction D2 overlaps the projection of the bonding pad group along the second direction D2, that is, the driver chip 201 extends along the second direction D2 Then overlap the bonding pad group 202, that is, the projection of the bonding pad group 202 on the first auxiliary line L1 overlaps with the projection of the driving chip 201 on the first auxiliary line L1, so as to prevent the two from occupying each other without overlapping.
  • the required length can be less than the bonding pad group 202.
  • the sum of the size of the pad group 202 in the first direction D1 and the size of the driver chip 201 in the first direction D1 effectively reduces the length of the first auxiliary line L1, which is equivalent to reducing the length of the second auxiliary line L1 according to the above analysis.
  • the size of the area A2 in the first direction D1 is conducive to the development of narrow borders of the display panel.
  • the first auxiliary line L1 and the second auxiliary line L2 do not exist on the array substrate 10 , but are only assumed auxiliary lines for the convenience of analysis.
  • the display panel includes a front side and a back side that are oppositely arranged.
  • the first area A1 defined for display is located on the front side of the array substrate 10.
  • the second area A2 are defined along the first direction.
  • the second area A2 here can be located on the front side and the back side of the array substrate 10, or the part of the front side and the back side of the array substrate 10 adjacent to the first area A1 along the first direction D1 can be included in the second area A2.
  • Area A2 that is, in this embodiment, there is no restriction on where the driver chip 201 is located on the front side or the back side of the array substrate 10 , and there is no restriction on the front side or the back side where the bonding pad group 202 is located on the array substrate 10 .
  • the driver chip 201 and the bonding pad group 202 can be located on the front side of the array substrate 10; It may be located on the reverse side of the array substrate 10 .
  • the display panel 100 further includes: a color filter substrate 30 , the color filter substrate 30 is arranged opposite to the array substrate 10 ; wherein, the bonding welding The disk group 202 is located on the side of the array substrate 10 close to the color filter substrate 30, as shown in FIG.
  • the driving chip 201 is located on the side of the array substrate 10 away from the color filter substrate 30; wherein, the driving assembly 20 further includes a flexible printed circuit board 203, and the flexible printed circuit board 203 is connected to On the side of the display panel 100 close to the bonding pad group 202, as shown in FIG. 3, FIG. 4, FIG. 5 and FIG. 6, the flexible printed circuit board 203 is also bent to be fixed on the array On the side of the substrate 10 away from the color filter substrate 30 , the flexible printed circuit board 203 is electrically connected to the bonding pad group 202 .
  • a liquid crystal layer may be provided between the color filter substrate 30 and the array substrate 10
  • a backlight module may be provided on the side of the array substrate 10 away from the color filter substrate 30, and a backlight module may be provided on the side of the color filter substrate 30 away from the array substrate 10.
  • the upper polarizer, the lower polarizer may be disposed between the backlight module and the array substrate 10 .
  • the backlight module provides light to the side close to the array substrate 10
  • the lower polarizer is used to convert the light beam generated by the backlight module into polarized light
  • the upper polarizer is used to analyze the electrical modulation of the liquid crystal layer and the color filter substrate.
  • the polarized light of a specific color selected at 30 produces a contrast between light and dark, thereby producing a display image.
  • the bonding pad group 202 may be arranged close to at least one side of the array substrate 10.
  • the flexible printed circuit board 203 is connected to the side of the display panel 100 close to the bonding pad group 202. It can be understood that The flexible printed circuit board 203 and the bonding pad group 202 are electrically connected to the side of the display panel 100 . Further, the flexible printed circuit board 203 is also bent from the side of the display panel 100 to be fixed on the side of the array substrate 10 away from the color filter substrate 30 , which can prevent the flexible printed circuit board 203 from bending from the positive side of the array substrate 10 Too much space is occupied in the plane where the array substrate 10 is located, which further facilitates the development of narrow borders of the display panel.
  • the bonding pad group 202 and the driving chip 201 in the first direction D1 there is no limitation on the distribution of the bonding pad group 202 and the driving chip 201 in the first direction D1, as long as the projections of the two on the first auxiliary line L1 overlap, for example As shown in FIG. 5, in the first direction D1, the bonding pad group 202 may exceed the driving chip 201, and in the direction opposite to the first direction D1, the driving chip 201 may exceed the bonding pad group 202; or For example, as shown in FIG. 6 , in the first direction D1 and in the direction opposite to the first direction D1 , the bonding pad group 202 can exceed the driving chip 201 .
  • the driving chip 201 is located on the side of the array substrate 10 close to the color filter substrate 30; As shown in FIG. 8 , the bonding pad group 202 is electrically connected to the driving chip 201 through the wire group 204 , and the driving chip 201 is electrically connected to the driving wire 90 .
  • the flexible printed circuit board 203 is electrically connected to the bonding pad group 202, the bonding pad group 202 is electrically connected to the driving chip 201 through the wire group 204, and the driving chip 201 is electrically connected to the driving circuit.
  • the wire 90 that is, the flexible printed circuit board 203 can be electrically connected to the driving wire 90 located in the first area A1 through the bonding pad group 202, the wire group 204, and the driving chip 201 in sequence, so as to control the display of the display panel 100.
  • the number of flexible printed circuit boards 203 can be 2.
  • the wire set 204 is electrically connected to the bonding pad set 202 on at least one side.
  • the flexible printed circuit board 203 and the driver chip 201 in this embodiment can be considered to be packaged by COG (Chip On Glass, chip on glass) technology, that is, the driver chip 201 is located on the array substrate 10 close to the color filter substrate 30 On one side, the flexible printed circuit board 203 is bent from the side of the array substrate 10 close to the bonding pad group 202 to be fixed on the side of the array substrate 10 away from the color filter substrate 30 .
  • the driving chip 201 is electrically connected to the flexible printed circuit board 203 through the wire group 204 and the bonding pad group 202 in order to be loaded with original electrical signals.
  • the wire 90 is electrically connected to the light emitting device, so as to control the display image of the display panel 100 .
  • the bonding pad groups 202 are provided on both sides of the driving chip 201 . It can be understood that the number of bonding pad groups 202 in this embodiment is set relatively large, which increases the number of original signals that the driver chip 201 can receive, and can enrich the screen display of the display panel 100, or can be understood as bonding
  • the bonding pad group 202 has more distribution areas around the driving chip 201 , which is more convenient for the electrical connection between the bonding pad group 202 and the driving chip 201 , and can also shorten the length of the wire group 204 to improve the reliability of signal transmission.
  • the driving chip 201 in this embodiment extends along the second direction D2, it can overlap at least one bonding pad group 202. Furthermore, after the driving chip 201 in this embodiment extends along the second direction D2 It is also possible to overlap the two bonding pad groups 202, so that the projections of the two bonding pad groups 202 on the first auxiliary line and the projection of the driver chip 201 on the first auxiliary line overlap, and further, wherein A bonding pad group 202 may also overlap another bonding pad group 202 after extending along the second direction D2, so as to avoid increasing the second bonding pad group 202 under the premise that the number of bonding pad groups 202 increases and the distribution area increases.
  • the increase of the size of the area A2 in the first direction D1 is beneficial to the development of narrow borders of the display panel.
  • the orthographic projection of the driving chip 201 on the first plane is located between the orthographic projection of the bonding pad group 202 on the first plane. or the orthographic projection of the bonding pad group 202 on the first plane is located within the orthographic projection of the driving chip 201 on the first plane.
  • the orthographic projection of the driving chip 201 along the second direction D2 is located within the orthographic projection of the bonding pad group 202 along the second direction D2
  • the orthographic projection of the bonding pad group 202 along the second direction D2 is located within the orthographic projection of the driving chip 201 along the second direction D2.
  • the bonding pad group can be made 202 on the first auxiliary line, the total length of the projection of the driving chip 201 on the first auxiliary line is equal to the size of the driving chip 201 in the first direction D1, the size of the bonding pad group 202 in the first direction D1
  • the larger of the two dimensions avoids the projection of the smaller one in the first direction D1 along the second direction D2 beyond the larger one in the first direction D1 to project in the first direction D2 Occupying additional space on D1 is conducive to the development of narrow bezels for display panels.
  • the orthographic projection of the driving chip 201 on the first plane is located within the orthographic projection of the bonding pad group 202 on the first plane, and 7, it can also be understood that the orthographic projection of the driving chip 201 along the second direction D2 is located within the orthographic projection of the bonding pad group 202 along the second direction D2;
  • the bonding pad group 202 includes a plurality of bonding pads 2021, each of the bonding pads 2021 includes a first end and a second end oppositely arranged along the first direction D1, and the bonding pads
  • the plurality of first ends in the group 202 are arranged flush along the second direction D2, and among the two adjacent bonding pads 2021, the bonding pad 2021 that is relatively close to the driving chip 201
  • the size in the first direction D1 is smaller than the size in the first direction D1 of the bonding pads 2021 relatively far away from the driving chip 201, so that the bonding pads in the bonding pad group 202 A plurality of the second ends form a
  • the driving chip 201 is included between the group of bonding pads 202 in the first direction D1.
  • a plurality of first ends are further disposed flushly along the second direction D2, and in the bonding pad group 202, the size of the bonding pad 2021 that is closer to the driving chip 201 in the first direction D1
  • the interval between the plurality of bonding pads 2021 and the driver chip 201 can be formed to accommodate the wire group 204 , avoiding additional reserved space for setting the wire group 204 .
  • a corresponding size difference area can be formed between each bonding pad 2021 and the driver chip 201, and the intersection of multiple size difference areas can be 0, and setting a corresponding wire 2041 in each size difference area can avoid multiple
  • the intersecting wires 2041 can reduce the difficulty of laying out multiple wires 2041 and improve the reliability of the wire group 204 working.
  • multiple bonding pads 2021 can also be placed laterally and arranged along the first direction D1, as long as the bonding pad group 202 composed of multiple bonding pads 2021 is in the first auxiliary position. It is sufficient that the projection on the line L1 overlaps with the projection of the driving chip 201 on the first auxiliary line L1.
  • the color filter substrate 30 is formed with an opening 301 , and the driving chip 201 is located in a third area A3 corresponding to the opening 301 on the array substrate 10 .
  • the color filter substrate 30 can be arranged relative to the array substrate 10 and fixed on the array substrate 10, and then according to the bonding pad group 202 The distribution of the color filter substrate 30 can cover the bonding pad group 202, and the color filter substrate 30 is cut to expose the third region A3 in the second region A2 that is not provided with the bonding pad group 202 for later setting.
  • Driver chip 201 is formed with an opening 301 , and the driving chip 201 is located in a third area A3 corresponding to the opening 301 on the array substrate 10 .
  • the driver chip 201 can be fixed and electrically connected to the third area A3 of the array substrate 10 by binding, specifically, multiple pins in the driver chip 201 can be respectively electrically connected to A plurality of pins in the third area A3 of the array substrate 10 are electrically connected to the driving wires 90 located in the second area A2.
  • the driving chip 201 is generally fixed on the array substrate 10 after the assembly of the array substrate 10 and the color filter substrate 30 is completed. Therefore, in this embodiment, the opening 301 is provided so that the third area on the array substrate 10 corresponding to the opening 301 A3 is exposed, so that it is convenient to arrange the driving chip 201 in the third area A3. It should be noted that, in combination with the above discussion, since the wire group 204 extends from the third area A3 to connect to the bonding pad group 202, the wire group 204 can be formed before the color filter substrate 30 is assembled, so as to prevent the color filter substrate 30 from being assembled. Afterwards, the wire group 204 beyond the third area A3 cannot be formed.
  • the display panel 100 further includes: a sealant 40 located between the color filter substrate 30 and the array substrate 10 , and the sealant 40 is at least in contact with the The edges of the opening 301 are opposite to each other. It should be noted that the edge of the opening 301 makes the electrical devices and wires in the second area A2 in contact with the air and water vapor in the outside world. In this embodiment, by setting the sealant 40 at least opposite to the edge of the opening 301, the outside The air and water vapor enter into the second area A2 except the third area A3. Further, the sealant 40 can also be disposed opposite to the edge of the array substrate 10 , and also prevent outside air and water vapor from entering the second area A2 except the third area A3 .
  • the composition material of the sealant 40 can be an insulating material, such as shown in FIG. 203 electrical connection paths; and for example, the composition material of the sealant 40 can be a conductive material, and the sealant 40 can be set in contact with the bonding pad 2021 to assist the electrical properties of the bonding pad group 202 and the flexible printed circuit board 203
  • the sealant 40 should avoid connecting any two bonding pads 2021 to avoid short circuit between the two bonding pads 2021 .
  • the display panel 100 further includes: a plurality of support parts 50 located between the color filter substrate 30 and the array substrate 10 , and a plurality of the support parts 50 is disposed at least along the edge of the opening 301 .
  • the multiple support parts 50 in this embodiment are located at least along the edge of the opening 301 , can ensure the fixing effect on the edge of the opening 301 and improve the stability of the array substrate 10 and the color filter substrate 30 in a box.
  • a plurality of supporting parts 50 may be evenly distributed in the second area A2 except the third area A3 to further support the array substrate 10 and the color filter substrate 30 .
  • the sealant 40 and the plurality of supporting parts 50 may be formed before the array substrate 10 and the color filter substrate 30 are assembled into a box.
  • the driving chip 201 is located on the side of the array substrate 10 away from the color filter substrate 30; wherein, referring to FIG. 2, FIG. 4, FIG. 11, the driving chip 201 is fixed on the side of the flexible printed circuit board 203 away from the color filter substrate 30, the driving chip 201 is electrically connected to the flexible printed circuit board 203, and the binding The pad group 202 is electrically connected to the driving trace 90 .
  • the driving chip 201 is electrically connected to the flexible printed circuit board 203, the flexible printed circuit board 203 is electrically connected to the bonding pad group 202, and the bonding pad group 202 is electrically connected to the driving wire 90 That is, the driving chip 201 can be electrically connected to the driving wiring 90 in the first area A1 through the flexible printed circuit board 203 and the bonding pad group 202 in sequence, so as to control the display image of the display panel 100 .
  • the number of flexible printed circuit boards 203 can be 2. For example, as shown in FIG. 2 and FIG. And it is electrically connected to the two flexible printed circuit boards 203 located on both sides of the second area A2.
  • the flexible printed circuit boards 203 correspond one-to-one, and each driver chip 201 can be disposed close to the corresponding flexible printed circuit board 203 so as to be fixed and electrically connected to the corresponding flexible printed circuit board 203 .
  • the flexible printed circuit board 203 and the driver chip 201 in this embodiment can be considered to be encapsulated by COF (Chip On Film, chip-on-film) technology
  • the driver chip 201 is fixed on the flexible printed circuit board 203
  • the flexible printed circuit board The plate 203 is bent from the side of the array substrate 10 close to the bonding pad group 202 to be fixed on the side of the array substrate 10 away from the color filter substrate 30 , so that the driver chip 201 is fixed on the flexible printed circuit board 203 away from the color filter substrate 30 side.
  • the driving chip 201 is loaded with the original electrical signal, and further, the driving signal formed by the driving chip 201 processing the original signal is electrically connected to the light-emitting device through the flexible printed circuit board 203, the bonding pad group 202, and the driving wire 90 in turn. , so as to control the display screen of the display panel 100 .
  • At least one bonding pad group 202 includes a plurality of The bonding pad 2021.
  • a plurality of bonding pads 2021 can be arranged along the second direction D2, correspondingly, as shown in Figure 3 and Figure 7 , the flexible printed circuit board can be connected to the outer side parallel to the second direction D2 in the second area A2, so as to be electrically connected to the end of each bonding pad 2021 away from the first area A1;
  • the bonding pads 2021 can be arranged along the first direction D1.
  • the flexible printed circuit board can be connected to the outer side of the second area A2 parallel to the first direction D1, so as to be electrically connected to each bonding pad 2021.
  • a plurality of bonding pads 2021 can be arranged along the first direction D1, correspondingly, as shown in Figure 4 and Figure 10, the flexible printing The circuit board can be connected to the outer side of the second area A2 parallel to the first direction D1 to be electrically connected to one end of each bonding pad 2021 close to the edge of the second area A2.
  • each bonding pad group 202 includes a plurality of bonding pads 2021 arranged along the first direction D1 , each of the bonding pads 2021 includes an overlapping end close to the edge of the display panel; wherein, as shown in FIG. 4, FIG. 8 and FIG. 10, the flexible printed circuit board 203 is close to the bonding pad A plurality of overlapping ends in the disk pack 202 are provided, and the flexible printed circuit board 203 is connected to the plurality of overlapping ends.
  • the plurality of bonding pads 2021 are arranged along the first direction D1 relative to the second direction D2, because it avoids being far away from the first direction in the second area A2.
  • the flexible printed circuit board 203 is disposed on one side of an area A1, which can further shorten the size of the display panel 100 in the first direction D1, and facilitates the development of a narrow border at the lower edge of the display panel.
  • the first area A1 includes a fourth area A4 connected to the edge of the array substrate 10 and along the first direction D1; wherein The driving wires 90 located in the fourth area A4 are arranged in stacked layers, and the driving wires 90 located in different layers are electrically connected through via holes.
  • the bonding pad group 202 includes a plurality of bonding pads 2021 arranged along the first direction D1, that is, the flexible printed circuit board 203 is connected to the array substrate 10 parallel to the first direction D1. This will additionally occupy the size of the array substrate 10 in the second direction D2.
  • the drive wiring 90 located in the fourth area A4 is stacked, and the drive lines 90 located in different layers
  • the driving wires 90 are electrically connected through vias, that is, the driving wires 90 originally located on the same layer are stacked and the signal transmission is maintained through the vias, so as to avoid the driving wires 90 being arranged on the same layer and occupying too much space in the second direction D2.
  • the driving wires 90 located in the fifth area of the array substrate 10 opposite to the fourth area A4 can also be arranged in stacked layers, and the driving wires 90 located in different layers can also be electrically connected through via holes. sexual connection.
  • FIG. 5 FIG. 6, FIG. 10, FIG. 11 and FIG.
  • the flexible printed circuit boards 203 wherein, one side of the conductive part 209 is electrically connected to the bonding pad group 202, and the other side of the conductive part 209 is electrically connected to the flexible printed circuit board.
  • circuit board 203 It can be understood that, in combination with the above discussion, the flexible printed circuit board 203 is connected to the side of the display panel 100 close to the bonding pad group 202.
  • the conductive part 209 is arranged between the flexible printed circuit board 203 and the bonding pad group 202 to achieve electrical connection, wherein the flexible printed circuit board 203 can be bound to the conductive part 209 by anisotropic conductive adhesive.
  • the conductive part 209 by providing the conductive part 209, it is possible to avoid setting the flexible printed circuit board 203 to be bent downward from the side of the array substrate 10 close to the color filter substrate 30 to form a curved section, so that the display panel 100 can move in the first direction. Dimension shortening on D1.
  • the number of conductive parts 209 may be equal to the number of bonding pads 2021 in the corresponding bonding pad group 202, and a plurality of conductive parts 209 and a plurality of bonding pads 2021 correspond one-to-one, and each conductive part 209 It is close to and electrically connected to the corresponding bonding pad 2021 , so that the corresponding bonding pad 2021 is electrically connected to the flexible printed circuit board 203 .
  • the number of conductive parts 209 may be equal to the number of bonding pads 2021 in the corresponding bonding pad group 202, and a plurality of conductive parts 209 and a plurality of bonding pads 2021 correspond one-to-one, and each conductive part 209 It is close to and electrically connected to the corresponding bonding pad 2021 , so that the corresponding bonding pad 2021 is electrically connected to the flexible printed circuit board 203 .
  • the display panel 100 further includes: a fixing portion 60 , the fixing portion 60 is located in the display panel 100 and is close to the flexible printed circuit board 203 and connected to the edge of the display panel 100 and the flexible printed circuit board 203 .
  • the conductive part 209 is used to electrically connect the bonding pad group 202 and the flexible printed circuit board 203, and is not enough to fix the flexible printed circuit board 203 on the side of the display panel 100.
  • the flexible printed circuit board 203 can be fixed on the side of the display panel 100 by providing the fixing portion 60 , so as to improve the stability of the display panel 100 .
  • the size of the fixing portion 60 in the direction in which the corresponding binding pads 2021 are arranged may be greater than or equal to the size occupied by the plurality of binding pads 2021.
  • the fixing portion 60 may be connected to the array substrate 10.
  • the edge and the flexible printed circuit board 203, and the edge connected to the color filter substrate 30 and the flexible printed circuit board 203, further, the fixing part 60 can also cover the top and bottom of the conductive part 209, further improving the conductive part 209, flexible printed circuit
  • the board 203 is fixed on the side of the display panel 100 for stability.
  • the upper surface of the fixing portion 60 close to the color filter substrate 30 may not exceed the upper surface of the upper polarizer on the side of the color filter substrate 30 away from the array substrate 10 , and the same Reasonably, the lower surface of the fixing portion 60 close to the array substrate 10 may not protrude beyond the lower surface of the lower polarizer located on the side of the color filter substrate 30 away from the array substrate 10 to avoid interference.
  • the present application provides a display panel, and the display panel includes: an array substrate, including a first area and a second area arranged along a first direction, the first area is used for display; a driving assembly, the driving assembly includes a The driving chip in the second area and at least one bonding pad group electrically connected to the driving chip, the driving assembly is electrically connected to the driving wiring in the first area; the color filter substrate, the The color filter substrate is arranged opposite to the array substrate, the color filter substrate is formed with an opening, and the driving chip is located in a third area opposite to the opening on the side of the array substrate close to the color filter substrate ; Wherein, the orthographic projection of the driving chip on the first plane overlaps the orthographic projection of the bonding pad group on the first plane, and the first plane is parallel to the first direction and perpendicular to on the display panel.
  • the present application arranges the driving chip to extend along the second direction and then overlap the bonding pad group, so that the projection of the driving chip in the second direction and the projection of the bonding pad group in the second direction coincide.
  • the two directions are perpendicular to the first direction, avoiding that the two projections respectively occupy different spaces in the first direction, and avoiding that the sum of the projections has a large size in the first direction, effectively shortening the size of the array substrate in the first direction, which is beneficial

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Abstract

一种显示面板（100），包括电性连接的驱动芯片（201）和绑定焊盘组（202），以及相对设置的阵列基板（10）与彩膜基板（30），阵列基板（10）包括沿第一方向（D1）排列的第一区域（A1）和第二区域（A2），驱动芯片（201）位于阵列基板（10）靠近彩膜基板（30）的一侧中对应于彩膜基板（30）中的开口（301）的第三区域（A3）内，驱动芯片（201）和绑定焊盘组（202）在平行于第一方向（D1）且垂直于显示面板（100）的第一平面上的正投影重叠。

Description

显示面板 技术领域
本申请涉及显示技术领域，尤其涉及显示面板制造技术领域，具体涉及显示面板。
 背景技术
目前，市场对显示屏的窄边框需求越来越高，以至于全面屏的普及。
其中，现有的COG(Chip On Glass,玻璃上的芯片)面板中，驱动芯片位于显示区下方，由于驱动芯片远离显示区的一侧需要依次设置绑定焊盘、于绑定焊盘绑定柔性印刷电路板以及需要预留弯折区供柔性印刷电路板弯曲，导致显示区下方的尺寸较大，极大增加了显示面板的下边框尺寸，不利于显示屏的窄边框发展。
综上所述，现有技术中面板的驱动芯片、绑定焊盘以及柔性印刷电路板的设置方式不利于显示屏的窄边框发展，急需改进。
 技术问题
本申请实施例提供显示面板，以解决现有的面板中驱动芯片、绑定焊盘以及柔性印刷电路板的设置方式不利于显示屏的窄边框发展的技术问题。
 技术解决方案
为解决上述技术问题，本申请实施例提供显示面板，包括：
阵列基板，包括沿第一方向排列的第一区域和第二区域；
驱动组件，所述驱动组件包括位于所述第二区域内的驱动芯片以及电性连接至所述驱动芯片的至少一绑定焊盘组，所述驱动组件电性连接至位于所述第一区域内的驱动走线；
彩膜基板，所述彩膜基板和所述阵列基板相对设置，所述彩膜基板形成有开口，所述驱动芯片位于所述阵列基板靠近所述彩膜基板的一侧中与所述开口相对设置的第三区域内；
其中，所述驱动芯片在第一平面上的正投影重叠于所述绑定焊盘组在所述第一平面上的正投影，所述第一平面平行于所述第一方向，且垂直于所述显示面板；
其中，所述驱动芯片的两侧设有所述绑定焊盘组，所述驱动芯片在所述第一平面上的正投影位于所述绑定焊盘组在所述第一平面上的正投影之内，或者所述绑定焊盘组在所述第一平面上的正投影位于所述驱动芯片在所述第一平面上的正投影之内。
在一实施例中，所述绑定焊盘组位于所述阵列基板靠近所述彩膜基板的一侧；
其中，所述驱动组件还包括柔性印刷电路板，所述柔性印刷电路板连接于所述显示面板中靠近所述绑定焊盘组的侧边，并弯曲至固定于所述阵列基板远离所述彩膜基板的一侧，所述柔性印刷电路板电性连接于所述绑定焊盘组。
在一实施例中，所述绑定焊盘组通过导线组电性连接至所述驱动芯片，所述驱动芯片电性连接至所述驱动走线。
在一实施例中，所述驱动芯片在所述第一平面上的正投影位于所述绑定焊盘组在所述第一平面上的正投影之内；
其中，所述绑定焊盘组包括多个绑定焊盘，每一所述绑定焊盘包括沿所述第一方向相对设置的第一端和第二端，所述绑定焊盘组中的多个所述第一端沿第二方向平齐设置，所述第二方向垂直于所述第一方向，相邻的两所述绑定焊盘中，相对靠近所述驱动芯片的所述绑定焊盘在所述第一方向上的尺寸，小于相对远离所述驱动芯片的所述绑定焊盘在所述第一方向上的尺寸，以使所述绑定焊盘组中的多个所述第二端在所述第一方向上形成尺寸差；
其中，所述导线组包括与多个所述绑定焊盘一一对应的多条导线，每一所述绑定焊盘的第二端通过对应的所述导线电性连接至所述驱动芯片，每一所述导线位于对应的所述绑定焊盘形成的尺寸差区域内。
在一实施例中，所述显示面板还包括：
密封胶，位于所述彩膜基板和阵列基板之间，且所述密封胶至少与所述开口的边缘相对设置。
在一实施例中，所述显示面板还包括：
多个支撑部，位于所述彩膜基板和阵列基板之间，且多个所述支撑部至少沿着所述开口的边缘而设置。
在一实施例中，至少一所述绑定焊盘组包括沿所述第二方向或者所述第一方向排列的多个所述绑定焊盘，所述第二方向垂直于所述第一方向。
本申请实施例还提供显示面板，包括：
阵列基板，包括沿第一方向排列的第一区域和第二区域；
驱动组件，所述驱动组件包括位于所述第二区域内的驱动芯片以及电性连接至所述驱动芯片的至少一绑定焊盘组，所述驱动组件电性连接至位于所述第一区域内的驱动走线；
彩膜基板，所述彩膜基板和所述阵列基板相对设置，所述彩膜基板形成有开口，所述驱动芯片位于所述阵列基板靠近所述彩膜基板的一侧中与所述开口相对设置的第三区域内；
其中，所述驱动芯片在第一平面上的正投影重叠于所述绑定焊盘组在所述第一平面上的正投影，所述第一平面平行于所述第一方向，且垂直于所述显示面板。
在一实施例中，所述绑定焊盘组位于所述阵列基板靠近所述彩膜基板的一侧；
其中，所述驱动组件还包括柔性印刷电路板，所述柔性印刷电路板连接于所述显示面板中靠近所述绑定焊盘组的侧边，并弯曲至固定于所述阵列基板远离所述彩膜基板的一侧，所述柔性印刷电路板电性连接于所述绑定焊盘组。
在一实施例中，所述绑定焊盘组通过导线组电性连接至所述驱动芯片，所述驱动芯片电性连接至所述驱动走线。
在一实施例中，所述驱动芯片的两侧设有所述绑定焊盘组。
在一实施例中，所述驱动芯片在所述第一平面上的正投影位于所述绑定焊盘组沿在所述第一平面上的正投影之内，或者所述绑定焊盘组在所述第一平面上的正投影位于所述驱动芯片在所述第一平面上的正投影之内。
在一实施例中，所述驱动芯片在所述第一平面上的正投影位于所述绑定焊盘组沿在所述第一平面上的正投影之内；
其中，所述绑定焊盘组包括多个绑定焊盘，每一所述绑定焊盘包括沿所述第一方向相对设置的第一端和第二端，所述绑定焊盘组中的多个所述第一端沿第二方向平齐设置，所述第二方向垂直于所述第一方向，相邻的两所述绑定焊盘中，相对靠近所述驱动芯片的所述绑定焊盘在所述第一方向上的尺寸，小于相对远离所述驱动芯片的所述绑定焊盘在所述第一方向上的尺寸，以使所述绑定焊盘组中的多个所述第二端在所述第一方向上形成尺寸差；
其中，所述导线组包括与多个所述绑定焊盘一一对应的多条导线，每一所述绑定焊盘的第二端通过对应的所述导线电性连接至所述驱动芯片，每一所述导线位于对应的所述绑定焊盘形成的尺寸差区域内。
在一实施例中，所述显示面板还包括：
密封胶，位于所述彩膜基板和阵列基板之间，且所述密封胶至少与所述开口的边缘相对设置。
在一实施例中，所述显示面板还包括：
多个支撑部，位于所述彩膜基板和阵列基板之间，且多个所述支撑部至少沿着所述开口的边缘而设置。
在一实施例中，所述驱动芯片位于所述阵列基板远离所述彩膜基板的一侧；
其中，所述驱动芯片固定于所述柔性印刷电路板远离所述彩膜基板的一侧，所述驱动芯片电性连接于所述柔性印刷电路板，所述绑定焊盘组电性连接至所述驱动走线。
在一实施例中，至少一所述绑定焊盘组包括沿第二方向或者所述第一方向排列的多个所述绑定焊盘，所述第二方向垂直于所述第一方向。
在一实施例中，每一所述绑定焊盘组包括沿所述第一方向排列的多个所述绑定焊盘，每一所述绑定焊盘包括靠近所述显示面板的边缘的搭接端；
其中，所述柔性印刷电路板靠近所述绑定焊盘组中的多个所述搭接端而设置，所述柔性印刷电路板连接于多个所述搭接端。
在一实施例中，所述第一区域包括连接于阵列基板的边缘且沿所述第一方向的第四区域；
其中，位于所述第四区域内的所述驱动走线叠层设置，位于不同层的所述驱动走线通过过孔电性连接。
在一实施例中，所述驱动组件还包括导电部，所述导电部位于所述显示面板的侧部和所述柔性印刷电路板之间；
其中，所述导电部的一侧电性连接于所述绑定焊盘组，所述导电部的另一侧电性连接于所述柔性印刷电路板。
在一实施例中，所述显示面板还包括：
固定部，所述固定部位于所述显示面板中靠近所述柔性印刷电路板的边缘上，且连接于所述显示面板的边缘和所述柔性印刷电路板。
 有益效果
本申请提供了显示面板，显示面板包括：阵列基板，包括沿第一方向排列的第一区域和第二区域，所述第一区域用于显示；驱动组件，所述驱动组件包括位于所述第二区域内的驱动芯片以及电性连接至所述驱动芯片的至少一绑定焊盘组，所述驱动组件电性连接至位于所述第一区域内的驱动走线；彩膜基板，所述彩膜基板和所述阵列基板相对设置，所述彩膜基板形成有开口，所述驱动芯片位于所述阵列基板靠近所述彩膜基板的一侧中与所述开口相对设置的第三区域内；其中，所述驱动芯片在第一平面上的正投影重叠于所述绑定焊盘组在所述第一平面上的正投影，所述第一平面平行于所述第一方向，且垂直于所述显示面板。其中，本申请通过将驱动芯片设置为沿第二方向延伸后重叠于绑定焊盘组，使得驱动芯片在第二方向上的投影和绑定焊盘组在第二方向上的投影重合，第二方向垂直于第一方向，避免两投影分别在第一方向各自占用不同的空间，避免投影之和在第一方向的尺寸较大，有效缩短了阵列基板在第一方向上的尺寸，有利于显示面板的窄边框发展。
 附图说明
下面通过附图来对本申请进行进一步说明。需要说明的是，下面描述中的附图仅仅是用于解释说明本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
下面通过附图来对本申请进行进一步说明。需要说明的是，下面描述中的附图仅仅是用于解释说明本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请提供的第一种显示面板中阵列基板的俯视示意图。
图2为本申请提供的第二种显示面板中阵列基板的俯视示意图（含对于驱动芯片的透视结构）。
图3为本申请提供的第一种显示面板的爆炸结构示意图。
图4为本申请提供的第二种显示面板的爆炸结构示意图（含对于驱动芯片的透视结构）。
图5为本申请提供的第一种显示面板中部分结构的左视图。
图6为本申请提供的第二种显示面板中部分结构的正视图。
图7为本申请提供的第三种显示面板中阵列基板的俯视示意图。
图8为本申请提供的第四种显示面板中阵列基板的俯视示意图。
图9为本申请提供的第一种显示面板中阵列基板以及位于其上方的结构的俯视示意图。
图10为本申请提供的第二种显示面板中阵列基板以及位于其下方的结构的仰视示意图。
图11为本申请提供的第二种显示面板中部分结构的正视图。
图12为本申请提供的第一种显示面板中部分结构的正视图。
图13为本申请提供的第二种显示面板中柔性印刷电路板未弯折状态下的左视图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整的描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请中的术语“第一”、“第二”、“第三”等是用于区别不同对象，而不是用于描述特定顺序。此外，术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或模块的过程、方法、系统、产品或设备没有限定于已列出的步骤或模块，而是可选地还包括没有列出的步骤或模块，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或模块。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个时间位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
下面结合附图和具体实施例对本申请做进一步的说明。本申请实施例提供显示面板，所述显示面板包括但不限于以下实施例以及以下实施例之间的组合。
在一实施例中，如图1和图2所示，所述显示面板100包括：阵列基板10，包括沿第一方向D1排列的第一区域A1和第二区域A2，所述第一区域A1用于显示；驱动组件20，所述驱动组件20包括位于所述第二区域A2内的驱动芯片201以及电性连接至所述驱动芯片201的至少一绑定焊盘组202，所述驱动组件20电性连接至位于所述第一区域A1内的驱动走线90；其中，所述驱动芯片201在第一平面上的正投影重叠于所述绑定焊盘组202在所述第一平面上的正投影，所述第一平面平行于所述第一方向D1，且垂直于所述显示面板100，参照图1，也可以理解为所述驱动芯片201沿第二方向D2的投影重叠于所述绑定焊盘组沿所述第二方向D2的投影，所述第二方向D2垂直于所述第一方向D1。
具体的，驱动芯片201的两端分别电性连接于位于第一区域A1内的驱动走线90和至少一绑定焊盘组202，此处定义第一辅助线L1为位于阵列基板10上且平行于第一方向D1的辅助线，若绑定焊盘组202设于驱动芯片201远离第一区域A1的一侧，即绑定焊盘组202在第一辅助线L1上的投影和驱动芯片201在第一辅助线L1上的投影毫无重叠地各自占用了空间，导致第二区域A2在第一方向D1上的尺寸较大，不利于显示面板的窄边框发展。
可以理解的，本实施例通过将驱动芯片201设置为驱动芯片201沿第二方向D2的投影重叠于绑定焊盘组沿第二方向D2的投影，即使得驱动芯片201沿第二方向D2延伸后重叠于绑定焊盘组202，即绑定焊盘组202在第一辅助线L1上的投影和驱动芯片201在第一辅助线L1上的投影重叠，避免两者毫无重叠地各自占用了空间，换一种说法，对于第一辅助线L1中对应于绑定焊盘组202的投影和驱动芯片201的投影之和的第二辅助线L2而言，所需满足的长度可以小于绑定焊盘组202在第一方向D1的尺寸和驱动芯片201在第一方向D1的尺寸之和，有效减小了第一辅助线L1的长度，根据上文分析，相当于减小了第二区域A2在第一方向D1上的尺寸，有利于显示面板的窄边框发展。
需要注意的是，此处第一辅助线L1、第二辅助线L2并不存在于阵列基板10上，只是为了便于分析而假设出的辅助线。其中，显示面板包括相对设置的正侧和反侧，此处定义用于显示的第一区域A1位于阵列基板10的正侧，本实施例只限定第一区域A1和第二区域A2沿第一方向D1排列，此处的第二区域A2可以位于阵列基板10的正侧、反侧，或者阵列基板10中沿第一方向D1相邻于第一区域A1的部分正侧、反侧均可以包含于第二区域A2，即本实施例中对于驱动芯片201位于阵列基板10中的正侧或者反侧不做限制，对于绑定焊盘组202位于阵列基板10中的正侧或者反侧也不做限制。例如图1所示，驱动芯片201和绑定焊盘组202可以位于阵列基板10中的正侧；又例如图2所示绑定焊盘组202可以位于阵列基板10中的正侧驱动芯片201可以位于阵列基板10中的反侧。
在一实施例中，如图3和图4所示，所述显示面板100还包括：彩膜基板30，所述彩膜基板30和所述阵列基板10相对设置；其中，所述绑定焊盘组202位于所述阵列基板10靠近所述彩膜基板30的一侧，如图3所示，所述驱动芯片201位于所述阵列基板10靠近所述彩膜基板30的一侧，或者如图4所示，所述驱动芯片201位于所述阵列基板10远离所述彩膜基板30的一侧；其中，所述驱动组件20还包括柔性印刷电路板203，所述柔性印刷电路板203连接于所述显示面板100中靠近所述绑定焊盘组202的侧边，结合图3、图4、图5和图6所示，所述柔性印刷电路板203还弯曲至固定于所述阵列基板10远离所述彩膜基板30的一侧，所述柔性印刷电路板203电性连接于所述绑定焊盘组202。
其中，彩膜基板30和阵列基板10之间可以设有液晶层，阵列基板10远离彩膜基板30的一侧可以设有背光模组，彩膜基板30远离阵列基板10的一侧可以设有上偏光片，背光模组和阵列基板10之间可以设有下偏光片。具体的，背光模组向靠近阵列基板10的一侧提供光线，下偏光片用于将背光模组产生的光束转换为偏振光，上偏光片用于解析经液晶层电调制以及经彩膜基板30选取的特定颜色的偏振光，产生明暗对比，从而产生显示画面。
进一步的，绑定焊盘组202可以靠近阵列基板10的至少一侧边设置，结合上文论述，柔性印刷电路板203连接于显示面板100中靠近绑定焊盘组202的侧边，可以理解为柔性印刷电路板203和绑定焊盘组202电性连接于显示面板100的侧边。进一步的，所述柔性印刷电路板203还自显示面板100的侧边弯曲至固定于阵列基板10远离彩膜基板30的一侧，可以避免柔性印刷电路板203自阵列基板10的正侧弯曲而在阵列基板10所处的平面中占用过多的空间，进一步利于显示面板的窄边框发展。
需要注意的是，本实施例中对于在第一方向D1上绑定焊盘组202和驱动芯片201的分布不作限定，只需满足两者在第一辅助线L1上的投影重叠即可，例如图5所示，在第一方向D1上，绑定焊盘组202可以超出于驱动芯片201，在与第一方向D1相反的方向上，驱动芯片201可以超出于绑定焊盘组202；或者例如图6所示，在第一方向D1上、与第一方向D1相反的方向上，绑定焊盘组202均可以超出于驱动芯片201。
在一实施例中，如图1和图3所示，所述驱动芯片201位于所述阵列基板10靠近所述彩膜基板30的一侧；其中，结合图1、图3、图5至图8所示，所述绑定焊盘组202通过导线组204电性连接至所述驱动芯片201，所述驱动芯片201电性连接至所述驱动走线90。
其中，结合上文论述，柔性印刷电路板203电性连接于绑定焊盘组202，绑定焊盘组202通过导线组204电性连接至驱动芯片201，驱动芯片201电性连接至驱动走线90，即柔性印刷电路板203可以依次通过绑定焊盘组202、导线组204、驱动芯片201以电性连接至位于第一区域A1内的驱动走线90，从而控制显示面板100的显示画面。具体的，柔性印刷电路板203的数目可以为2，例如结合图1、图3所示，驱动芯片201的数目可以为1，驱动芯片201可以靠近第二区域A2的中部而设置，以便于通过导线组204电性连接至位于至少一侧的绑定焊盘组202。
可以理解的，本实施例中的柔性印刷电路板203、驱动芯片201可以认为通过COG(Chip On Glass,玻璃上的芯片)的技术封装，即驱动芯片201位于阵列基板10靠近彩膜基板30的一侧，柔性印刷电路板203自阵列基板10中靠近绑定焊盘组202的侧部弯曲至固定于阵列基板10远离彩膜基板30的一侧。具体的，驱动芯片201依次通过导线组204和绑定焊盘组202电性连接至柔性印刷电路板203以被加载原始电信号，进一步的，驱动芯片201处理原始信号形成的驱动信号通过驱动走线90电性连接至发光器件，从而控制显示面板100的显示画面。
在一实施例中，如图7和图8所示，所述驱动芯片201的两侧设有所述绑定焊盘组202。可以理解的，本实施例中的绑定焊盘组202的数目设置的较多，增加了驱动芯片201可以接收的原始信号的数量，可以丰富显示面板100的画面显示，或者可以理解为绑定焊盘组202在驱动芯片201的周围分布区域较多，更加便于绑定焊盘组202和驱动芯片201的电性连接，也可以缩短导线组204的长度，提高信号传输的可靠性。
结合上文论述，本实施例中的驱动芯片201沿第二方向D2延伸后可以重叠于至少一绑定焊盘组202，进一步的，本实施例中的驱动芯片201沿第二方向D2延伸后也可以重叠于两绑定焊盘组202，以使得两绑定焊盘组202在第一辅助线上的投影、驱动芯片201在第一辅助线上的投影三者重叠，再进一步的，其中一绑定焊盘组202沿第二方向D2延伸后也可以重叠于另一绑定焊盘组202，以在绑定焊盘组202的数目增加以及分布区域增加的前提下，避免增加第二区域A2在第一方向D1上的尺寸的增加，有利于显示面板的窄边框发展。
在一实施例中，如图7和图8所示，所述驱动芯片201在所述第一平面上的正投影位于所述绑定焊盘组202在所述第一平面上的正投影之内，或者所述绑定焊盘组202在所述第一平面上的正投影位于所述驱动芯片201在所述第一平面上的正投影之内。同理，结合图7和图8，也可以理解为所述驱动芯片201沿所述第二方向D2的正投影位于所述绑定焊盘组202沿所述第二方向D2的正投影之内，或者所述绑定焊盘组202沿所述第二方向D2的正投影位于所述驱动芯片201沿所述第二方向D2的正投影之内。
可以理解的，本实施例中不论驱动芯片201在第一方向D1上的尺寸、绑定焊盘组202在第一方向D1上的尺寸的大小如何，通过如上限定，可以使得绑定焊盘组202在第一辅助线上的投影、驱动芯片201在第一辅助线上的投影的总长度等于驱动芯片201在第一方向D1上的尺寸、绑定焊盘组202在第一方向D1上的尺寸两者中的较大者，避免在第一方向D1上的尺寸较小的一者沿第二方向D2的投影超出于在第一方向D1上的尺寸较大的一者以在第一方向D1上占用额外的空间，有利于显示面板的窄边框发展。
在一实施例中，如图7所示，所述驱动芯片201在所述第一平面上的正投影位于所述绑定焊盘组202在所述第一平面上的正投影之内，同理，结合图7，也可以理解为所述驱动芯片201沿所述第二方向D2的正投影位于所述绑定焊盘组202沿所述第二方向D2的正投影之内；其中，所述绑定焊盘组202包括多个绑定焊盘2021，每一所述绑定焊盘2021包括沿所述第一方向D1相对设置的第一端和第二端，所述绑定焊盘组202中的多个所述第一端沿所述第二方向D2平齐设置，相邻的两所述绑定焊盘2021中，相对靠近所述驱动芯片201的所述绑定焊盘2021在所述第一方向D1上的尺寸，小于相对远离所述驱动芯片201的所述绑定焊盘2021在所述第一方向D1上的尺寸，以使所述绑定焊盘组202中的多个所述第二端在所述第一方向D1上形成尺寸差；其中，所述导线组204包括与多个所述绑定焊盘2021一一对应的多条导线2041，每一所述绑定焊盘2021的第二端通过对应的所述导线2041电性连接至所述驱动芯片201，每一所述导线2041位于对应的所述绑定焊盘2021形成的尺寸差区域内。
具体的，本实施例在驱动芯片201沿第二方向D2的投影位于绑定焊盘组202之内的基础上，即在第一方向D1上，驱动芯片201包含于绑定焊盘组202之内，进一步将多个第一端沿第二方向D2平齐设置，且在绑定焊盘组202中，与驱动芯片201的距离越近的绑定焊盘2021在第一方向D1上的尺寸越小，以在多个绑定焊盘2021与驱动芯片201之间形成区间以容纳导线组204，避免额外预留空间设置导线组204。进一步的，每一绑定焊盘2021和驱动芯片201之间可以形成对应的尺寸差区域，且多个尺寸差区域的交集可以为0，每一尺寸差区域设置对应的导线2041可以避免多条导线2041相交，可以降低多条导线2041布局的难度，提高导线组204工作的可靠性。当然，如图8所示，多个绑定焊盘2021也可以横向放置，并且沿第一方向D1排列，只需满足多个绑定焊盘2021组成的绑定焊盘组202在第一辅助线L1上的投影和驱动芯片201在第一辅助线L1上的投影重叠即可。
在一实施例中，如图3所示，所述彩膜基板30形成有开口301，所述驱动芯片201位于所述阵列基板10上对应于所述开口301的第三区域A3内。需要注意的是，为保证彩膜基板30和阵列基板10对位的准确性，可以先将彩膜基板30相对于阵列基板10设置且固定于阵列基板10上，再根据绑定焊盘组202的分布以使得彩膜基板30可以覆盖绑定焊盘组202，对彩膜基板30进行切割以裸露出第二区域A2中未设有绑定焊盘组202的第三区域A3以便于后期设置驱动芯片201。其中，驱动芯片201可以通过绑定的方式固定且电性连接于阵列基板10中的第三区域A3，具体为驱动芯片201中的多个引脚可以通过异方性导电胶分别电性连接于阵列基板10中的第三区域A3中的多个引脚，以电性连接至位于第二区域A2内的驱动走线90。
可以理解的，驱动芯片201一般在阵列基板10和彩膜基板30组装完成以后固定于阵列基板10，因此，本实施例中通过设置开口301以使阵列基板10上对应于开口301的第三区域A3裸露出来，进而便于在第三区域A3内设置驱动芯片201。需要注意的是，结合上文论述，由于导线组204自第三区域A3延伸至连接于绑定焊盘组202，故导线组204可以形成于组装彩膜基板30之前，避免彩膜基板30组装之后无法形成制作超出于第三区域A3的导线组204。
在一实施例中，结合图3和图9所示，所述显示面板100还包括：密封胶40，位于所述彩膜基板30和阵列基板10之间，且所述密封胶40至少与所述开口301的边缘相对设置。需要注意的是，开口301的边缘使得第二区域A2中的电学器件和导线接触于外界的空气、水汽，本实施例中通过设置至少与开口301的边缘相对设置的密封胶40，可以避免外界的空气、水汽进入至第二区域A2中除去第三区域A3的区域。进一步的，密封胶40还可以和阵列基板10的边缘相对设置，同样避免外界的空气、水汽进入至第二区域A2中除去第三区域A3的区域。
具体的，例如密封胶40的组成材料可以为绝缘材料，例如图9所示，密封胶40可以避开绑定焊盘组202而设置，可以避免阻挡绑定焊盘组202和柔性印刷电路板203电性连接的路径；又例如密封胶40的组成材料可以为导电材料，密封胶40可以与绑定焊盘2021接触设置，以辅助绑定焊盘组202和柔性印刷电路板203的电性连接的路径，需要注意的是，密封胶40应该避免连接任意两绑定焊盘2021，以避免两绑定焊盘2021短路。
在一实施例中，结合图3和图9所示，所述显示面板100还包括：多个支撑部50，位于所述彩膜基板30和阵列基板10之间，且多个所述支撑部50至少沿着所述开口301的边缘而设置。可以理解的，由于开口301边缘的路径较长，且考虑到阵列基板10和彩膜基板30成盒的稳固性，本实施例中的多个支撑部50位于至少沿着开口301的边缘而设置，可以保证对于开口301的边缘的固定作用，提高阵列基板10和彩膜基板30成盒的稳固性。进一步的，多个支撑部50可以均匀地分布于第二区域A2中除去第三区域A3的区域内，进一步支撑阵列基板10和彩膜基板30。其中，密封胶40和多个支撑部50可以形成于阵列基板10和彩膜基板30成盒之前。
在一实施例中，如图2和图4所示，所述驱动芯片201位于所述阵列基板10远离所述彩膜基板30的一侧；其中，结合图2、图4、图10和图11所示，所述驱动芯片201固定于所述柔性印刷电路板203远离所述彩膜基板30的一侧，所述驱动芯片201电性连接于所述柔性印刷电路板203，所述绑定焊盘组202电性连接至所述驱动走线90。
其中，结合上文论述，驱动芯片201电性连接于柔性印刷电路板203，柔性印刷电路板203电性连接于绑定焊盘组202，绑定焊盘组202电性连接至驱动走线90，即驱动芯片201可以依次通过柔性印刷电路板203、绑定焊盘组202以电性连接至位于第一区域A1内的驱动走线90，从而控制显示面板100的显示画面。具体的，柔性印刷电路板203的数目可以为2，例如结合图2、图4所示，驱动芯片201的数目可以为1，驱动芯片201可以靠近第二区域A2的中部而设置，以便于固定且电性连接至位于第二区域A2两侧的两个柔性印刷电路板203上，又例如结合图10、图11所示，驱动芯片201的数目可以为2，两个驱动芯片201和两个柔性印刷电路板203一一对应，每一驱动芯片201可以靠近对应的柔性印刷电路板203而设置，以便于固定且电性连接至对应的柔性印刷电路板203上。
可以理解的，本实施例中的柔性印刷电路板203、驱动芯片201可以认为通过COF(Chip On Film,覆晶薄膜)的技术封装，驱动芯片201固定于柔性印刷电路板203上，柔性印刷电路板203自阵列基板10中靠近绑定焊盘组202的侧部弯曲至固定于阵列基板10远离彩膜基板30的一侧，以使驱动芯片201固定于柔性印刷电路板203远离彩膜基板30的一侧。具体的，驱动芯片201被加载原始电信号，进一步的，驱动芯片201处理原始信号形成的驱动信号依次通过柔性印刷电路板203、绑定焊盘组202、驱动走线90电性连接至发光器件，从而控制显示面板100的显示画面。
在一实施例中，如图1、图2、图7至图10所示，至少一所述绑定焊盘组202包括沿所述第二方向D2或者所述第一方向D1排列的多个所述绑定焊盘2021。具体的，对于COG的技术封装，例如图1、图3、图7和图9所示，多个绑定焊盘2021可以沿第二方向D2排列，相应的，如图3、图7所示，柔性印刷电路板可以连接于第二区域A2中平行于第二方向D2的外侧，以电性连接于每一绑定焊盘2021远离第一区域A1的一端；又例如图8所示，多个绑定焊盘2021可以沿第一方向D1排列，相应的，柔性印刷电路板可以连接于第二区域A2中平行于第一方向D1的外侧，以电性连接于每一绑定焊盘2021靠近第二区域A2的边缘的一端。具体的，对于COF的技术封装，例如图2、图4和图10所示，多个绑定焊盘2021可以沿第一方向D1排列，相应的，如图4和图10所示，柔性印刷电路板可以连接于第二区域A2中平行于第一方向D1的外侧，以电性连接于每一绑定焊盘2021靠近第二区域A2的边缘的一端。
在一实施例中，如图2、图4、图8和图10所示，每一所述绑定焊盘组202包括沿所述第一方向D1排列的多个所述绑定焊盘2021，每一所述绑定焊盘2021包括靠近所述显示面板的边缘的搭接端；其中，如图4、图8和图10所示，所述柔性印刷电路板203靠近所述绑定焊盘组202中的多个所述搭接端而设置，所述柔性印刷电路板203连接于多个所述搭接端。可以理解的，结合上文论述，对于COG或者COF的技术封装，多个绑定焊盘2021沿第一方向D1排列相对于沿第二方向D2排列，由于避免了在第二区域A2中远离第一区域A1的一侧设置柔性印刷电路板203，可以进一步缩短显示面板100在第一方向D1的尺寸，有利于显示面板的下边缘的窄边框发展。
在一实施例中，如图2、图4、图8和图10所示，所述第一区域A1包括连接于阵列基板10的边缘且沿所述第一方向D1的第四区域A4；其中，位于所述第四区域A4内的所述驱动走线90叠层设置，位于不同层的所述驱动走线90通过过孔电性连接。
需要注意的是，在绑定焊盘组202包括沿第一方向D1排列的多个绑定焊盘2021的基础上，即柔性印刷电路板203连接于阵列基板10中平行于第一方向D1的侧边，这样会额外占用阵列基板10在第二方向D2上的尺寸，可以理解的，本实施例通过将位于第四区域A4内的驱动走线90叠层设置，且位于不同层的所述驱动走线90通过过孔电性连接，即将原本位于同一层的驱动走线90叠层设置并且通过过孔保持信号的传输，避免驱动走线90同层设置而在第二方向D2上占用过多的空间，有效缩短了阵列基板10在第二方向D2上的尺寸，在实现有利于显示面板的下边缘的窄边框发展的同时，可以避免增加显示面板的左边缘、右边缘的边框。当然，本实施例中位于阵列基板10中与第四区域A4相对设置的第五区域内的驱动走线90也可以叠层设置，并且，位于不同层的驱动走线90也可以通过过孔电性连接。
在一实施例中，结合图5、图6、图10、图11和图12所示，所述驱动组件20还包括导电部209，所述导电部209位于所述显示面板100的侧部和所述柔性印刷电路板203之间；其中，所述导电部209的一侧电性连接于所述绑定焊盘组202，所述导电部209的另一侧电性连接于所述柔性印刷电路板203。可以理解的，结合上文论述，柔性印刷电路板203连接于显示面板100中靠近绑定焊盘组202的侧边，本实施例中通过在显示面板100的侧部和柔性印刷电路板203之间设置导电部209，可以实现柔性印刷电路板203和绑定焊盘组202的电性连接，其中，柔性印刷电路板203可以通过异方性导电胶绑定于导电部209。因此，本实施例中通过设置导电部209可以避免将柔性印刷电路板203设置为自阵列基板10靠近彩膜基板30的一侧向下弯曲而形成弯曲段，可以实现显示面板100在第一方向D1上的尺寸的缩短。
其中，导电部209的数量可以等于对应的绑定焊盘组202中绑定焊盘2021的数量，且多个导电部209和多个绑定焊盘2021一一对应，且每一导电部209靠近于且电性连接于对应的绑定焊盘2021，以使对应的绑定焊盘2021电性连接至柔性印刷电路板203。具体的，结合图3、图5和图12所示，例如绑定焊盘组202中绑定焊盘2021的数量为4时，在4个绑定焊盘2021靠近阵列基板10的边缘的4个端部可以设置与4个绑定焊盘2021一一对应的4个导电部209；结合图4、图6、图10和图11所示，例如绑定焊盘组202中绑定焊盘2021的数量为3时，在3个绑定焊盘2021靠近阵列基板10的边缘的一端可以设置与3个绑定焊盘2021一一对应的3个导电部209。需要注意的是，如图12所示，在阵列基板10和彩膜基板30成盒之后，可以先形成所有的导电部209于显示面板100中对应于多个绑定焊盘2021的侧部，再于导电部209远离显示面板100的侧部的一侧形成柔性短路部203。
在一实施例中，如图5、图6和图11所示，所述显示面板100还包括：固定部60，所述固定部60位于所述显示面板100中靠近所述柔性印刷电路板203的边缘上，且连接于所述显示面板100的边缘和所述柔性印刷电路板203。需要注意的是，导电部209用于电性连接绑定焊盘组202和柔性印刷电路板203，不足以将柔性印刷电路板203固定于显示面板100的侧部，可以理解的，本实施例中通过设置固定部60可以将柔性印刷电路板203固定于显示面板100的侧部，提高显示面板100的稳固性。具体的，固定部60在对应的多个绑定焊盘2021排列方向上的尺寸可以大于或者等于多个绑定焊盘2021所占的尺寸，进一步的，固定部60可以连接于阵列基板10的边缘和柔性印刷电路板203、以及连接于彩膜基板30的边缘和柔性印刷电路板203，进一步的，固定部60还可以覆盖导电部209顶端和底端，进一步提高导电部209、柔性印刷电路板203固定于显示面板100的侧部的稳固性。
需要注意的是，如图13所示，在阵列基板10和彩膜基板30成盒之后，可以于显示面板100中对应于多个绑定焊盘2021的侧部因此形成所有的导电部209和柔性电路部203之后，再于阵列基板10的边缘和柔性印刷电路板203之间、彩膜基板30的边缘和柔性印刷电路板203之间进行点胶处理形成所有的固定部60，进一步的，结合图13和图6所示，将柔性电路部203向阵列基板10远离彩膜基板30的一侧弯曲，以将柔性电路部203固定于阵列基板10远离彩膜基板30的一侧。其中，如图13所示，在显示面板的厚度方向，靠近彩膜基板30的固定部60的上表面可以不超出位于彩膜基板30远离阵列基板10一侧的上偏光片的上表面，同理，靠近阵列基板10的固定部60的下表面可以不超出位于彩膜基板30远离阵列基板10一侧的下偏光片的下表面，以免发生干涉。
本申请提供了显示面板，显示面板包括：阵列基板，包括沿第一方向排列的第一区域和第二区域，所述第一区域用于显示；驱动组件，所述驱动组件包括位于所述第二区域内的驱动芯片以及电性连接至所述驱动芯片的至少一绑定焊盘组，所述驱动组件电性连接至位于所述第一区域内的驱动走线；彩膜基板，所述彩膜基板和所述阵列基板相对设置，所述彩膜基板形成有开口，所述驱动芯片位于所述阵列基板靠近所述彩膜基板的一侧中与所述开口相对设置的第三区域内；其中，所述驱动芯片在第一平面上的正投影重叠于所述绑定焊盘组在所述第一平面上的正投影，所述第一平面平行于所述第一方向，且垂直于所述显示面板。其中，本申请通过将驱动芯片设置为沿第二方向延伸后重叠于绑定焊盘组，使得驱动芯片在第二方向上的投影和绑定焊盘组在第二方向上的投影重合，第二方向垂直于第一方向，避免两投影分别在第一方向各自占用不同的空间，避免投影之和在第一方向的尺寸较大，有效缩短了阵列基板在第一方向上的尺寸，有利于显示面板的窄边框发展。
以上对本申请实施例所提供的显示面板进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种显示面板，其中，包括：
    阵列基板，包括沿第一方向排列的第一区域和第二区域；
    驱动组件，所述驱动组件包括位于所述第二区域内的驱动芯片以及电性连接至所述驱动芯片的至少一绑定焊盘组，所述驱动组件电性连接至位于所述第一区域内的驱动走线；
    彩膜基板，所述彩膜基板和所述阵列基板相对设置，所述彩膜基板形成有开口，所述驱动芯片位于所述阵列基板靠近所述彩膜基板的一侧中与所述开口相对设置的第三区域内；
    其中，所述驱动芯片在第一平面上的正投影重叠于所述绑定焊盘组在所述第一平面上的正投影，所述第一平面平行于所述第一方向，且垂直于所述显示面板；
    其中，所述驱动芯片的两侧设有所述绑定焊盘组，所述驱动芯片在所述第一平面上的正投影位于所述绑定焊盘组在所述第一平面上的正投影之内，或者所述绑定焊盘组在所述第一平面上的正投影位于所述驱动芯片在所述第一平面上的正投影之内。
  2. 根据权利要求1所述的显示面板，其中，所述绑定焊盘组位于所述阵列基板靠近所述彩膜基板的一侧；
    其中，所述驱动组件还包括柔性印刷电路板，所述柔性印刷电路板连接于所述显示面板中靠近所述绑定焊盘组的侧边，并弯曲至固定于所述阵列基板远离所述彩膜基板的一侧，所述柔性印刷电路板电性连接于所述绑定焊盘组。
  3. 根据权利要求2所述的显示面板，其中，所述绑定焊盘组通过导线组电性连接至所述驱动芯片，所述驱动芯片电性连接至所述驱动走线。
  4. 根据权利要求3所述的显示面板，其中，所述驱动芯片在所述第一平面上的正投影位于所述绑定焊盘组在所述第一平面上的正投影之内；
    其中，所述绑定焊盘组包括多个绑定焊盘，每一所述绑定焊盘包括沿所述第一方向相对设置的第一端和第二端，所述绑定焊盘组中的多个所述第一端沿第二方向平齐设置，所述第二方向垂直于所述第一方向，相邻的两所述绑定焊盘中，相对靠近所述驱动芯片的所述绑定焊盘在所述第一方向上的尺寸，小于相对远离所述驱动芯片的所述绑定焊盘在所述第一方向上的尺寸，以使所述绑定焊盘组中的多个所述第二端在所述第一方向上形成尺寸差；
    其中，所述导线组包括与多个所述绑定焊盘一一对应的多条导线，每一所述绑定焊盘的第二端通过对应的所述导线电性连接至所述驱动芯片，每一所述导线位于对应的所述绑定焊盘形成的尺寸差区域内。
  5. 根据权利要求3所述的显示面板，其中，所述显示面板还包括：
    密封胶，位于所述彩膜基板和阵列基板之间，且所述密封胶至少与所述开口的边缘相对设置。
  6. 根据权利要求3所述的显示面板，其中，所述显示面板还包括：
    多个支撑部，位于所述彩膜基板和阵列基板之间，且多个所述支撑部至少沿着所述开口的边缘而设置。
  7. 根据权利要求2所述的显示面板，其中，至少一所述绑定焊盘组包括沿所述第二方向或者所述第一方向排列的多个所述绑定焊盘，所述第二方向垂直于所述第一方向。
  8. 一种显示面板，其中，包括：
    阵列基板，包括沿第一方向排列的第一区域和第二区域；
    驱动组件，所述驱动组件包括位于所述第二区域内的驱动芯片以及电性连接至所述驱动芯片的至少一绑定焊盘组，所述驱动组件电性连接至位于所述第一区域内的驱动走线；
    彩膜基板，所述彩膜基板和所述阵列基板相对设置，所述彩膜基板形成有开口，所述驱动芯片位于所述阵列基板靠近所述彩膜基板的一侧中与所述开口相对设置的第三区域内；
    其中，所述驱动芯片在第一平面上的正投影重叠于所述绑定焊盘组在所述第一平面上的正投影，所述第一平面平行于所述第一方向，且垂直于所述显示面板。
  9. 根据权利要求8所述的显示面板，其中，所述绑定焊盘组位于所述阵列基板靠近所述彩膜基板的一侧；
    其中，所述驱动组件还包括柔性印刷电路板，所述柔性印刷电路板连接于所述显示面板中靠近所述绑定焊盘组的侧边，并弯曲至固定于所述阵列基板远离所述彩膜基板的一侧，所述柔性印刷电路板电性连接于所述绑定焊盘组。
  10. 根据权利要求9所述的显示面板，其中，所述绑定焊盘组通过导线组电性连接至所述驱动芯片，所述驱动芯片电性连接至所述驱动走线。
  11. 根据权利要求10所述的显示面板，其中，所述驱动芯片的两侧设有所述绑定焊盘组。
  12. 根据权利要求10所述的显示面板，其中，所述驱动芯片在所述第一平面上的正投影位于所述绑定焊盘组在所述第一平面上的正投影之内，或者所述绑定焊盘组在所述第一平面上的正投影位于所述驱动芯片在所述第一平面上的正投影之内。
  13. 根据权利要求10所述的显示面板，其中，所述驱动芯片在所述第一平面上的正投影位于所述绑定焊盘组在所述第一平面上的正投影之内；
    其中，所述绑定焊盘组包括多个绑定焊盘，每一所述绑定焊盘包括沿所述第一方向相对设置的第一端和第二端，所述绑定焊盘组中的多个所述第一端沿第二方向平齐设置，所述第二方向垂直于所述第一方向，相邻的两所述绑定焊盘中，相对靠近所述驱动芯片的所述绑定焊盘在所述第一方向上的尺寸，小于相对远离所述驱动芯片的所述绑定焊盘在所述第一方向上的尺寸，以使所述绑定焊盘组中的多个所述第二端在所述第一方向上形成尺寸差；
    其中，所述导线组包括与多个所述绑定焊盘一一对应的多条导线，每一所述绑定焊盘的第二端通过对应的所述导线电性连接至所述驱动芯片，每一所述导线位于对应的所述绑定焊盘形成的尺寸差区域内。
  14. 根据权利要求10所述的显示面板，其中，所述显示面板还包括：
    密封胶，位于所述彩膜基板和阵列基板之间，且所述密封胶至少与所述开口的边缘相对设置。
  15. 根据权利要求10所述的显示面板，其中，所述显示面板还包括：
    多个支撑部，位于所述彩膜基板和阵列基板之间，且多个所述支撑部至少沿着所述开口的边缘而设置。
  16. 根据权利要求9所述的显示面板，其中，至少一所述绑定焊盘组包括沿所述第二方向或者所述第一方向排列的多个所述绑定焊盘，所述第二方向垂直于所述第一方向。
  17. 根据权利要求16所述的显示面板，其中，每一所述绑定焊盘组包括沿所述第一方向排列的多个所述绑定焊盘，每一所述绑定焊盘包括靠近所述显示面板的边缘的搭接端；
    其中，所述柔性印刷电路板靠近所述绑定焊盘组中的多个所述搭接端而设置，所述柔性印刷电路板连接于多个所述搭接端。
  18. 根据权利要求17所述的显示面板，其中，所述第一区域包括连接于阵列基板的边缘且沿所述第一方向的第四区域；
    其中，位于所述第四区域内的所述驱动走线叠层设置，位于不同层的所述驱动走线通过过孔电性连接。
  19. 根据权利要求9所述的显示面板，其中，所述驱动组件还包括导电部，所述导电部位于所述显示面板的侧部和所述柔性印刷电路板之间；
    其中，所述导电部的一侧电性连接于所述绑定焊盘组，所述导电部的另一侧电性连接于所述柔性印刷电路板。
  20. 根据权利要求9所述的显示面板，其中，所述显示面板还包括：
    固定部，所述固定部位于所述显示面板中靠近所述柔性印刷电路板的边缘上，且连接于所述显示面板的边缘和所述柔性印刷电路板。
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