WO2024001154A1 - 一种晶圆旋转机构、晶圆旋转夹持机构及晶圆清洗干燥系统 - Google Patents

一种晶圆旋转机构、晶圆旋转夹持机构及晶圆清洗干燥系统 Download PDF

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Publication number
WO2024001154A1
WO2024001154A1 PCT/CN2023/071168 CN2023071168W WO2024001154A1 WO 2024001154 A1 WO2024001154 A1 WO 2024001154A1 CN 2023071168 W CN2023071168 W CN 2023071168W WO 2024001154 A1 WO2024001154 A1 WO 2024001154A1
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wafer
state
wafer rotation
power
lower mechanism
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PCT/CN2023/071168
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English (en)
French (fr)
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殷骐
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杭州众硅电子科技有限公司
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Publication of WO2024001154A1 publication Critical patent/WO2024001154A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing

Definitions

  • the invention belongs to the technical field of semiconductor integrated circuit chip manufacturing, and in particular relates to a wafer rotating mechanism, a wafer rotating clamping mechanism and a wafer cleaning and drying system.
  • the wafer in a wafer cleaning and drying system, can be dried by centrifugal force to throw the liquid attached to it to the outside of the wafer.
  • some methods use a servo motor to directly drive the rotating base.
  • the structure is simple and the transmission is reliable, it also has an obvious shortcoming: when the machine is powered off, the motor will lock up or decelerate very quickly. At this time, there is a risk that the wafer will detach from the clamping mechanism and cause fragmentation, which will have a great impact on the normal use of the equipment.
  • the present invention provides an upper mechanism that can maintain a rotating state with the wafer rotating base when the power is off, so that the wafer can slowly decelerate until it stops, and the wafer rotation of the wafer fragments can be avoided.
  • mechanism, wafer rotation clamping mechanism and wafer cleaning and drying system are provided.
  • a wafer rotation mechanism including:
  • the lower mechanism is used to output rotational power
  • the upper mechanism can be connected to the wafer rotating base
  • the upper mechanism and the lower mechanism have a working state and a separated state.
  • the upper mechanism rotates driven by the lower mechanism.
  • the separated state the upper mechanism and the lower mechanism are separated;
  • the upper mechanism and the lower mechanism switch from the working state to the separated state, and the upper mechanism takes the wafer rotating base to rotate under the action of inertia until it stops.
  • the lower mechanism is provided separately from the power source, and the lower mechanism can rotate with the power source.
  • the lower mechanism stops outputting rotational power.
  • the clutch structure includes contact surfaces respectively provided on the lower mechanism and the upper mechanism, and an electromagnetic induction component.
  • the electromagnetic induction component When the electromagnetic induction component is energized, there is a repulsive force between the lower mechanism and the upper mechanism to realize the coupling between the lower mechanism and the upper mechanism.
  • Contactless transmission connection of the mechanism When the electromagnetic induction component is energized, there is a repulsive force between the lower mechanism and the upper mechanism to realize the coupling between the lower mechanism and the upper mechanism.
  • the electromagnetic induction component includes electromagnets arranged at intervals on the lower mechanism and permanent magnets arranged on the upper mechanism at intervals.
  • the permanent magnets and the electromagnets have the same magnetic properties and are arranged in a staggered manner.
  • the clutch structure includes an upper contact surface provided on the upper mechanism, a lower contact surface provided on the lower mechanism, an elastic member, and a push rod.
  • the elastic member drives the lower contact surface and the upper contact surface to contact the transmission;
  • the push rod drives the lower contact surface or the upper contact surface to compress the elastic member to separate the upper and lower contact surfaces.
  • the invention also discloses a wafer rotation and clamping mechanism, which includes the above-mentioned wafer rotation mechanism, a wafer rotation base, a wafer support mechanism located on the outer periphery of the wafer rotation base, and a wafer rotation clamping mechanism;
  • the upper mechanism and the lower mechanism switch from the working state to the separation state, the upper mechanism brings the wafer rotating base to rotate under the action of inertia, and the wafer rotating clamping mechanism remains subject to centrifugal force. state, its bottom keeps moving outward, and its end presses down to contact the wafer to cooperate with the wafer support mechanism to fix the wafer until the wafer rotating base stops rotating and the wafer rotating clamping mechanism relaxes the pressure on the wafer. .
  • the invention also discloses a wafer drying system, including the above-mentioned wafer rotation clamping mechanism.
  • the invention also discloses a wafer cleaning system, which includes the above-mentioned wafer rotation clamping mechanism.
  • the beneficial effects of the present invention are: 1) When the wafer rotation clamping mechanism is powered on, the clutch mechanism ensures that the lower mechanism connected to the power source and the upper mechanism where the wafer rotation clamping mechanism is located are rigidly connected, and the transmission is stable and reliable; 2 ) When the power is suddenly cut off, the clutch mechanism can be disconnected immediately. At this time, the upper body where the wafer rotation clamping mechanism is located is not subject to motor braking and slowly decelerates to stop rotating under the action of inertia, ensuring that the wafer is placed stably and preventing the wafer from rotating.
  • the non-contact clutch mechanism has no friction or impact between the execution parts, reducing the generation of impurity particles and reducing the risk of damage to the clutch mechanism; 4)
  • the clutch mechanism is driven by electromagnetic induction components, and the electromagnet responds quickly (the fastest is only 14ms) , loses magnetism at the moment of power outage, and the upper body where the wafer rotation clamping mechanism is located receives less braking force from the motor; 5)
  • the friction disc type clutch mechanism has a fast disengagement speed, and the moment the adhesion force is reduced, the torque that can be transmitted by friction is instantly reduced.
  • the upper body where the wafer rotation clamping mechanism is located immediately enters the inertial rotation state; 6)
  • the clutch surfaces contact in the form of bevels.
  • the bevels can be used as guides to smooth the upper and lower clutch surfaces.
  • the claw side clutch surface can slide away from the motor side clutch surface through the inclined surface to disengage the linkage.
  • Figure 1 is a schematic diagram of the upper mechanism and the lower mechanism of the wafer rotation mechanism of the present invention in a working state.
  • FIG. 2 is a schematic diagram of the upper mechanism and the lower mechanism of the wafer rotation mechanism of the present invention in a separated state.
  • FIG. 3 is a front view of the wafer rotation clamping mechanism in Embodiment 1 of the present invention.
  • Figure 4 is a schematic diagram of the clutch structure in Embodiment 1 of the present invention, which is in a working state at this time.
  • Figure 5 is an A-A cross-sectional view of the upper mechanism and the lower mechanism in the working state in the second embodiment of the present invention.
  • Figure 6 is an A-A cross-sectional view of the upper mechanism and the lower mechanism in a separated state in the second embodiment of the present invention.
  • Figure 7 is a front view of the upper mechanism and the lower mechanism in a separated state in the third embodiment of the present invention.
  • Figure 8 is a cross-sectional view of the upper mechanism and the lower mechanism in a separated state in the third embodiment of the present invention.
  • Figure 9 is a front view of the upper mechanism and the lower mechanism in working condition in the third embodiment of the present invention.
  • Figure 10 is a cross-sectional view of the upper mechanism and the lower mechanism in working condition in the third embodiment of the present invention.
  • Figure 11 is a front view of the upper mechanism and the lower mechanism in a separated state in the fourth embodiment of the present invention.
  • Figure 12 is a front view of the upper and lower toothed discs in a separated state in Embodiment 4 of the present invention.
  • Figure 13 is a front view of the upper mechanism and the lower mechanism in working condition in the fourth embodiment of the present invention.
  • Figure 15 is a cross-sectional view of the upper mechanism and the lower mechanism in working condition in Embodiment 5 of the present invention.
  • a wafer rotation mechanism includes a power source 1, a lower mechanism 2 connected to the power source 1, and an upper mechanism 3 that can be connected to the wafer rotation base 4.
  • the lower mechanism 2 can As the power source 1 rotates, and in practical applications most rotate at high speeds exceeding 1,000 revolutions per minute, the power source 1 may specifically be a motor output shaft.
  • the above-mentioned lower mechanism 2 and the power source 1 are arranged separately.
  • the power source 1 and the lower mechanism 2 can also be an integrated structure, as long as the function of outputting rotational power is achieved.
  • the upper mechanism 3 and the lower mechanism 2 have a working state and a separated state.
  • the upper mechanism 3 rotates driven by the lower mechanism 2, which can be synchronous and high-speed rotation;
  • the upper mechanism 3 and the lower mechanism 2 is separated, that is, the upper mechanism 3 loses the power output of the lower mechanism 2.
  • the upper mechanism 3 and the lower mechanism 2 switch from the working state to the separated state.
  • the lower mechanism 2 stops outputting rotational power, that is, the power source 1 and the lower mechanism 2 stop rotating, or the power source 1 and the lower mechanism 2 stop rotating.
  • the rotation speed drops rapidly, but the upper mechanism 3 still carries the wafer rotating base 4 to rotate under the action of inertia until it stops.
  • the upper mechanism 3 will not slowly stop rotating with the lower mechanism 2, but will also stop rotating immediately with the lower mechanism 2. Instead, it will stop rotating without external force. , maintaining a rotating state under the action of inertia.
  • a wafer rotation clamping mechanism includes the above-mentioned wafer rotation mechanism, a wafer rotation base, a wafer support mechanism arranged on the outer periphery of the wafer rotation base, and a wafer rotation clamping mechanism 41.
  • Both the wafer support mechanism and the wafer rotating clamping mechanism 41 can be of existing structures.
  • the characteristic of the wafer rotating clamping mechanism 41 is that its center of gravity is close to the bottom, so that when the wafer rotates, the clamping mechanism 41 rotates with the wafer.
  • the base rotates circumferentially, the bottom will tilt upward, so that the wafer rotation clamping mechanism 41, which is originally in a vertical state, approaches a horizontal lateral state, so that its upper end can press down on the wafer 42.
  • the upper mechanism 3 and the lower mechanism 2 switch from the working state to the separated state.
  • the upper mechanism 3 brings the wafer rotating base 4 to rotate under the action of inertia, and the wafer rotating clamping mechanism 41 remains under the action of centrifugal force. , that is, its bottom moves outward and tilts upward, and its end contacts the wafer 42 downward.
  • the wafer support mechanism and the wafer rotation clamping mechanism 41 With the cooperation of the wafer support mechanism and the wafer rotation clamping mechanism 41, the wafer 42 is firmly clamped.
  • the wafer rotating clamping mechanism 41 relaxes the pressure on the wafer 42.
  • the wafer 42 also stops rotating, even if the wafer rotating clamping mechanism 41 does not press down on the wafer 42. As a result, the wafer 42 will not rotate away from the wafer rotation base 4 .
  • the clutch structure includes contact surfaces 51 and 52 respectively provided on the lower mechanism 2 and the upper mechanism 3, and an electromagnetic induction component 53.
  • the electromagnetic induction component 53 includes electromagnets 531 arranged at intervals on the lower mechanism 2, and electromagnets 531 arranged on the upper part at intervals.
  • the permanent magnet 532 of the mechanism 3 has the same magnetism as the electromagnet 531, and the permanent magnet 532 and the electromagnet 531 are arranged in a crosswise manner. When the electromagnetic induction component 53 is energized, there is a repulsive force between the lower mechanism 2 and the upper mechanism 3.
  • the electromagnet 531 loses its magnetism, the repulsive force between the permanent magnet 532 and the electromagnet 531 disappears, and the repulsive force existing between the contact surface 51 of the lower mechanism 2 and the contact surface 52 of the upper mechanism 3 disappears.
  • the lower mechanism 2 and the upper mechanism 3 cannot be connected in transmission. At this time, the lower mechanism 2 stops rotating or rotates slowly, and the upper mechanism 3 continues to rotate under the action of inertia until it stops rotating.
  • the clutch structure includes contact surfaces 51 and 52 provided on the lower mechanism 2 and the upper mechanism 3 respectively, magnetic bodies 542 and metal parts 543 provided on the lower mechanism 2 and the upper mechanism 3 respectively, and a reset member 541.
  • the magnetic body 542 is located in the lower mechanism 2 and is an electromagnetic coil.
  • the metal piece 543 is located in the upper mechanism 3 .
  • the reset piece 541 is connected between the upper mechanism 3 and the metal piece 543 .
  • the positions of the magnetic body 542 and the metal piece 543 can also be interchanged.
  • the magnetic body 542 overcomes the elastic force of the reset piece 541 and attracts the metal piece 543 under the action of the magnetic force.
  • the magnetic force generates sufficient static friction to transmit the motor torque, and transmits the motor speed to the wafer rotating base 4 to drive the wafer 42 along with it.
  • Power source 1 rotates.
  • the magnetic body 542 instantly loses its magnetic force, and the metal piece 543 moves upward under the action of the reset piece 541.
  • the magnetic body 542 that has lost its magnetism and the metal piece 543 disconnect the adsorption connection.
  • the lower mechanism 2 and the upper mechanism 3 cannot be connected in transmission. At this time, the lower mechanism 2 stops rotating or rotates slowly, and the upper mechanism 3 continues to rotate under the action of inertia until it stops rotating.
  • the clutch structure in this embodiment is also a contact transmission connection.
  • the clutch structure includes a lower contact surface 552 provided on the lower mechanism 2, an upper contact surface 551 provided on the upper mechanism 3, an elastic member 56, and a push rod 57.
  • the elastic member 56 drives the lower contact surface 552 to move upward so that it It is in contact with the upper contact surface 551 for transmission.
  • the upper contact surface 551 and the lower contact surface 552 are both friction disk structures. There is no relative sliding between the two during transmission connection, that is, they are approximately a rigid body.
  • the push rod 57 can be configured to move downward to drive the lower contact surface 552 to move, or can be configured to move upward to drive the upper contact surface 551 to move.
  • the elastic member 56 cooperates with the upper contact surface 551.
  • the lower contact surface 552 is driven to move.
  • the push rod 57 In the power-on working state, the push rod 57 is in a retracted state under the action of the cylinder, that is, there is a distance between the push rod 57 and the lower contact surface 552, that is, there is no force between the two, as shown in Figures 9 and 10.
  • the lower mechanism 2 stops rotating or rotates slowly, and the upper mechanism 3 continues to rotate under the action of inertia until it stops rotating.
  • the push rod 57 actuating air lever can be a single-acting cylinder.
  • the connected solenoid valve is a normally open valve.
  • the push rod 57 is pulled back under the action of the internal spring.
  • the solenoid valve is ventilated.
  • the air pressure Under the action, the push rod 57 extends to perform separation; the push rod 57 executes the air lever and can also be a double-acting cylinder.
  • the connected solenoid valve is a single electronically controlled two-position five-way solenoid valve. In the working state, the air pressure controls the withdrawal of the push rod 57 , when the power is off, the solenoid valve switches the air flow toward the push rod 57 and extends to perform separation.
  • the clutch structure in this embodiment is also a contact transmission connection.
  • the clutch structure includes an upper gear plate 581 provided on the upper mechanism 3 and a lower gear plate 582 provided on the lower mechanism 2.
  • the upper gear plate 581 and the lower gear plate 582 engage in transmission.
  • the upper gear plate 581 and the lower gear plate 581 engage in transmission.
  • the lower gear plate 582 meshes with the upper gear plate 581 under the action of the bottom support force.
  • the power source 1 drives the lower gear plate 582 to rotate.
  • the lower gear plate 582 and the upper gear plate 581 are in contact with each other on the right inclined plane.
  • the combined force of thrust and friction forms the driving force for the upper toothed disc 581 to rotate in the same direction; when the power is turned off, the lower toothed disc 582 and the upper toothed disc 581 separate along the inclined plane to prevent the upper mechanism 3 from being affected by the braking force of the motor.
  • the clutch structure includes a push rod 591 and a groove 592 respectively provided on the upper mechanism 3 and the lower mechanism 2.
  • the push rod 591 is inserted into the groove 592 and is transmitted through the mating surface of the side of the push rod 591 and the groove 592.
  • the rotational torque of the power source 1 drives the upper mechanism 3 to rotate; when the power is turned off, the push rod 591 is pulled out from the groove 592, so that the upper mechanism 3 is not affected by the braking force of the motor.
  • the opening of the groove 592 is chamfered, and the top of the push rod 591 is also designed with a chamfer or arc surface to ensure smooth insertion.
  • a wafer drying system includes a wafer rotating clamping mechanism with any of the above structures.
  • Other structures are existing technologies and will not be described again.
  • a wafer cleaning system includes a wafer rotating clamping mechanism with any of the above structures.
  • Other structures are existing technologies and will not be described again.
  • a single-chip cleaning machine integrates wafer cleaning and wafer drying functions, and includes a wafer rotating clamping mechanism with any of the above structures.
  • Other structures are existing technologies and will not be described again.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

本发明公开了一种晶圆旋转机构，包括：下部机构，用于输出旋转动力；上部机构，可与晶圆旋转基座相连；上部机构和下部机构具有工作状态和分离状态，当处于工作状态，上部机构在下部机构带动下旋转，当处于分离状态，上部机构和下部机构分离；断电状态下，上部机构和下部机构从工作状态切换至分离状态，上部机构带着晶圆旋转基座在惯性作用下旋转直至停止。本发明还公开了一种晶圆旋转夹持机构。本发明又公开了一种晶圆干燥系统、晶圆清洗系统。本发明晶圆旋转夹持机构在通电状态下，传动稳定、可靠；突然断电时，离合机构能立刻断开，晶圆转动夹持机构所在的上部体在惯性作用下缓慢减速至停止转动，确保晶圆放置稳定，避免晶圆碎片。

Description

一种晶圆旋转机构、晶圆旋转夹持机构及晶圆清洗干燥系统 技术领域
本发明属于半导体集成电路芯片制造技术领域，尤其是涉及一种晶圆旋转机构、晶圆旋转夹持机构及晶圆清洗干燥系统。
背景技术
随着电子产业、半导体产业的不断发展，产业对于半导体硅片、陶瓷以及光学玻璃表面的质量和加工精度提出了更高的要求。促使相应的晶圆加工设备越来越先进。在现有的半导体加工过程中，部分设备会用到晶圆旋转机构，如单片清洗机，清洗干燥系统等，此类设备的晶圆旋转机构利用离心力的方式夹持晶圆，这种方式的原理是把晶圆固定在一个可以高速旋转的基台上，使用一个电机让其达到一个较高的转速，夹持装置在离心力作用下夹紧晶圆。例如晶圆清洗干燥系统，晶圆可以通过离心力让附着在其上面的液体甩到晶圆外部来达到一个干燥的效果。更进一步有的此方式通过伺服电机直驱旋转基台，虽然结构简单传动可靠，但同时也具有一个明显的缺点：当机台断电时电机会随之断电抱死或极快减速，此时晶圆有脱离夹持机构而导致碎片的风险，对设备的正常使用产生极大影响。
发明内容
为了克服现有技术的不足，本发明提供一种断电情况下上部机构能够带着晶圆旋转基座保持旋转的状态，使得晶圆可以慢慢减速直至停止，避免晶圆碎片的晶圆旋转机构、晶圆旋转夹持机构及晶圆清洗干燥系统。
本发明解决其技术问题所采用的技术方案是：一种晶圆旋转机构，包括：
下部机构，用于输出旋转动力；
上部机构，可与晶圆旋转基座相连；
所述上部机构和下部机构具有工作状态和分离状态，当处于工作状态时，所述上部机构在下部机构带动下旋转，当处于分离状态时，所述上部机构和下部机构分离；
断电状态下，所述上部机构和下部机构从工作状态切换至分离状态，所述上部机构带着晶圆旋转基座在惯性作用下旋转直至停止。
进一步的，所述下部机构与动力源分体设置，下部机构可随动力源旋转。
进一步的，断电状态下，所述下部机构停止输出旋转动力。
进一步的，所述上部机构和下部机构之间具有离合结构，通电状态下，所述下部机构和上部机构通过离合结构非接触式传动连接，使得下部机构可带动上部机构同步旋转。
进一步的，所述离合结构包括分别设于下部机构和上部机构的接触面，及电磁感应组件，在电磁感应组件通电状态下，下部机构和上部机构之间存在排斥力，以实现下部机构和上部机构的非接触式传动连接。
进一步的，所述电磁感应组件包括间隔布设于下部机构的电磁体，及间隔布设于上部机构的永磁体，该永磁体和电磁体磁性相同，且交错设置。
进一步的，所述上部机构和下部机构之间具有离合结构，所述下部机构和上部机构通过离合结构接触式传动连接，使得下部机构可带动上部机构同步旋转。
进一步的，所述离合结构包括分别设于上部机构和下部机构的磁性体和金属件，及复位件，在断电状态下，所述磁性体和金属件断开吸附连接。
进一步的，所述离合结构包括设于上部机构的上接触面，设于下部机构的下接触面，弹性件，及推杆，所述弹性件驱动下接触面和上接触面接触传动；在断电状态下，所述推杆驱动下接触面或上接触面压缩弹性件，以将上、下接触面分离。
进一步的，所述离合结构包括设于上部机构的上齿盘，及设于下部机构的下齿盘， 所述上齿盘和下齿盘啮合传动。
进一步的，所述离合结构包括分别设于上部机构和下部机构的推杆和凹槽，在断电状态下，所述推杆脱离凹槽，以将上部机构和下部机构分离。
进一步的，处于分离位时，所述上部机构和下部机构的间距为0.1-5mm。
本发明还公开了一种晶圆旋转夹持机构，包括上述的晶圆旋转机构，晶圆旋转基座，设于晶圆旋转基座外周的晶圆支撑机构，及晶圆转动夹持机构；断电状态下，所述上部机构和下部机构从工作状态切换至分离状态，所述上部机构带着晶圆旋转基座在惯性作用下旋转，所述晶圆转动夹持机构保持受到离心力作用的状态，其底部保持向外运动，其端部下压抵接晶圆，以配合晶圆支撑机构固定晶圆，直至晶圆旋转基座停止转动，晶圆转动夹持机构放松对晶圆的压持。
本发明还公开了一种晶圆干燥系统，包括上述的晶圆旋转夹持机构。
本发明还公开了一种晶圆清洗系统，包括上述的晶圆旋转夹持机构。
本发明的有益效果是，1)晶圆旋转夹持机构在通电状态下，离合机构确保与动力源相连的下部机构和晶圆转动夹持机构所在的上部机构刚性连接，传动稳定、可靠；2)突然断电时，离合机构能立刻断开，此时晶圆转动夹持机构所在的上部体不受电机制动作用在惯性作用下缓慢减速至停止转动，确保晶圆放置稳定，避免晶圆碎片；3)非接触式离合机构执行部分间无摩擦或冲击作用，减少杂质颗粒产生，降低离合机构损坏风险；4)采用电磁感应组件驱动的离合机构，电磁体响应快(最快仅14ms)，在断电瞬间失去磁性，晶圆转动夹持机构所在的上部体受电机制动力少；5)采用摩擦盘式的离合机构脱离速度快，贴合力减少瞬间摩擦力可传导的力矩瞬间减少，晶圆转动夹持机构所在的上部体立刻进入惯性自转状态；6)采用上、下齿盘或顶销式的离合机构，离合面以斜面形式接触，啮合时斜面可作为导向使上下离合面平顺结合；分开时 卡爪侧离合面可通过斜面与电机侧离合面滑离，脱开联动。
附图说明
图1为本发明晶圆旋转机构的上部机构和下部机构处于工作状态的示意图。
图2为本发明晶圆旋转机构的上部机构和下部机构处于分离状态的示意图。
图3为本发明实施例一中晶圆旋转夹持机构的主视图。
图4为本发明实施例一中离合结构的简示图，此时处于工作状态。
图5为本发明实施例二中上部机构和下部机构处于工作状态的A-A剖视图。
图6为本发明实施例二中上部机构和下部机构处于分离状态的A-A剖视图。
图7为本发明实施例三中上部机构和下部机构处于分离状态的主视图。
图8为本发明实施例三中上部机构和下部机构处于分离状态的剖视图。
图9为本发明实施例三中上部机构和下部机构处于工作状态的主视图。
图10为本发明实施例三中上部机构和下部机构处于工作状态的剖视图。
图11为本发明实施例四中上部机构和下部机构处于分离状态的主视图。
图12为本发明实施例四中上齿盘和下齿盘处于分离状态的主视图。
图13为本发明实施例四中上部机构和下部机构处于工作状态的主视图。
图14为本发明实施例四中上齿盘和下齿盘处于啮合工作状态的主视图。
图15为本发明实施例五中上部机构和下部机构处于工作状态的剖视图。
具体实施方式
为了使本技术领域的人员更好的理解本发明方案，下面将结合本发明实施例中的附图，对发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本 发明保护的范围。
如图1、图2所示，一种晶圆旋转机构，包括动力源1，与动力源1相连的下部机构2，及可与晶圆旋转基座4相连的上部机构3，下部机构2可以随着动力源1旋转，且在实际应用中多数为每分钟超过1000转的高速旋转，动力源1具体可以是电机输出轴。上述下部机构2和动力源1分体设置，当然在其他实施例中，动力源1和下部机构2也可以是一体结构，只要达到用于输出旋转动力的功能即可。
上部机构3和下部机构2具有工作状态和分离状态，当处于工作状态时，上部机构3在下部机构2的带动下旋转，可以是同步高速旋转；当处于分离状态时，上部机构3和下部机构2分离，即上部机构3失去了下部机构2的动力输出。
断电状态下，上部机构3和下部机构2从工作状态切换至分离状态，此时下部机构2停止输出旋转动力，即动力源1和下部机构2停止旋转，或者动力源1和下部机构2的旋转速度急速下降，但是上部机构3仍然带着晶圆旋转基座4在惯性作用下旋转直至停止。换句话说，因为上部机构3与下部机构2之间没有连接，上部机构3不会随着下部机构2缓慢停止旋转，也会随着下部机构2立刻停止旋转，而是在不受外力作用下，在惯性作用下保持旋转的状态。
如图3所示，一种晶圆旋转夹持机构，包括上述的晶圆旋转机构，晶圆旋转基座，设置在晶圆旋转基座外周的晶圆支撑机构，及晶圆转动夹持机构41。晶圆支撑机构、晶圆转动夹持机构41均可以为现有结构，晶圆转动夹持机构41的特点是，其重心位置靠近底部，从而当晶圆转动夹持机构41随着晶圆旋转基座周向旋转时，底部会向上翘起，使得本来处于竖直状态的晶圆转动夹持机构41接近于水平横向状态，从而其上端部可以向下压持晶圆42。
断电状态下，上部机构3和下部机构2从工作状态切换至分离状态，上部机构3 带着晶圆旋转基座4在惯性作用下旋转，晶圆转动夹持机构41保持受到离心力作用的状态，即其底部向外运动、向上翘起，其端部向下抵接在晶圆42上，在晶圆支撑机构和晶圆转动夹持机构41的配合下，晶圆42被稳固夹持，直至晶圆旋转基座4停止转动，晶圆转动夹持机构41放松对晶圆42的压持，此时晶圆42也停止转动，即使晶圆转动夹持机构41不对晶圆42产生下压作用，晶圆42也不会旋转脱离晶圆旋转基座4。
实施例一
如图4所示，上部机构3和下部机构2之间具有离合结构，在通电状态下，下部机构2和上部机构3通过离合结构非接触式传动连接，使得下部机构2可以带动上部机构3同步旋转。
具体的，离合结构包括分别设置在下部机构2和上部机构3的接触面51、52，及电磁感应组件53，电磁感应组件53包括间隔布设在下部机构2的电磁体531，及间隔布设在上部机构3的永磁体532，该永磁体532和电磁体531的磁性相同，且永磁体532和电磁体531交叉排列。在电磁感应组件53通电状态下，下部机构2和上部机构3之间存在排斥力，具体是交错的永磁体532和电磁体531存在排斥力，沿圆周方向推动下部机构2和上部机构3相对转动，从而实现下部机构2和上部机构3的非接触式传动连接。当然永磁体532和电磁体531的位置也可以互换。
一旦处于断电状态下，电磁体531失去磁性，永磁体532和电磁体531之间的排斥力消失，下部机构2的接触面51和上部机构3的接触面52之间存在的排斥力消失，下部机构2和上部机构3就无法传动连接。此时，下部机构2停止转动或者缓慢旋转，上部机构3在惯性作用下继续旋转，直至停止转动。
实施例二
如图3、图5、图6所示，上部机构3和下部机构2之间具有离合结构，在通电状 态下，下部机构2和上部机构3通过离合结构接触式传动连接，使得下部机构2可以带动上部机构3同步旋转。
具体的，离合结构包括分别设置在下部机构2和上部机构3的接触面51、52，分别设置在下部机构2和上部机构3的磁性体542和金属件543，及复位件541。在本实施例中，磁性体542位于下部机构2，为电磁线圈，金属件543位于上部机构3，复位件541连接在上部机构3和金属件543之间。当然在其他实施例中，磁性体542和金属件543的位置也可以互换。
在通电状态下，磁性体542在磁力作用下克服复位件541的弹力与金属件543吸合，磁力产生足够大的静摩擦传递电机力矩，将电机转速传递晶圆旋转基座4带动晶圆42随动力源1转动。
一旦处于断电状态下，磁性体542瞬间失去磁力，金属件543在复位件541的作用下向上移动，失去磁性的磁性体542和金属件543断开吸附连接，如图6所示，下部机构2的接触面51和上部机构3的接触面52分开，且两者保持0.1-1mm的分开间隙，即图中H1＝0.1-1mm。下部机构2和上部机构3就无法传动连接。此时，下部机构2停止转动或者缓慢旋转，上部机构3在惯性作用下继续旋转，直至停止转动。
实施例三
如图7-图10所示，本实施例中离合结构也为接触式传动连接。
具体的，离合结构包括设置在下部机构2的下接触面552，设置在上部机构3的上接触面551，弹性件56，及推杆57，弹性件56驱动下接触面552向上移动以使得其与上接触面551接触传动，在本实施例中，上接触面551和下接触面552均为摩擦盘结构，传动连接时两者不存在相对滑动，即近似为一个刚体。推杆57可以设置为向下运动驱动下接触面552活动，也可以设置为向上运动驱动上接触面551活动，此时弹性 件56与上接触面551配合。在本实施例中为驱动下接触面552活动。
在通电工作状态下，推杆57在气缸作用下处于缩回状态，即推杆57与下接触面552存在距离，也就是两者不存在力的作用，如图9、图10所示。
在断电状态下，推杆57在气缸作用下驱动下接触面552向下移动，压缩弹性件56，使得上接触面551和下接触面552相互分离，即两者不会发生传动，且两者保持0.1-5mm的分开间隙，即图8中H2＝0.1-5mm。此时，下部机构2停止转动或者缓慢旋转，上部机构3在惯性作用下继续旋转，直至停止转动。
推杆57执行气杠可以为单作用气缸，此时连接电磁阀为常开阀，在工作状态下气缸不通气在内部弹簧作用下将推杆57抽回，断电时电磁阀通气，在气压作用下推杆57伸出执行分离；推杆57执行气杠也可以为双作用气缸，此时连接电磁阀为单电控两位五通电磁阀，在工作状态下气压控制推杆57抽回，断电时电磁阀切换气流走向推杆57伸出执行分离。
实施例四
如图11-图14所示，本实施例中离合结构也为接触式传动连接。
具体的，离合结构包括设置在上部机构3的上齿盘581，及设置在下部机构2的下齿盘582，该上齿盘581和下齿盘582啮合传动，此时上齿盘581和下齿盘582之间存在齿面间推力。
当下齿盘582停止转动时，上齿盘581顺着左侧斜面逆时针继续转动。
工作状态下，下齿盘582在底部支撑力作用下与上齿盘581啮合，动力源1带动下齿盘582转动，此时下齿盘582对上齿盘581在右侧斜面产生的平面间的推力以及摩擦力的合力形成上齿盘581沿同向旋转的驱动力；断电时下齿盘582与上齿盘581沿斜面脱离，避免上部机构3受电机制动力影响。
实施例五
如图15所示，本实施例中离合结构也为接触式传动连接。
具体的，离合结构包括分别设置在上部机构3和下部机构2的推杆591和凹槽592，工作状态下，推杆591插入凹槽592内，通过推杆591侧面与凹槽592配合面传递动力源1旋转力矩带动上部机构3转动；断电时推杆591从凹槽592抽出，使上部机构3不受电机制动力影响。
凹槽592开口开有倒角，推杆591顶部也设计有倒角或圆弧面，确保插入平顺。
实施例六
一种晶圆干燥系统，包括有上述任意结构的晶圆旋转夹持机构。其他结构为现有技术，不再赘述。
实施例七
一种晶圆清洗系统，包括有上述任意结构的晶圆旋转夹持机构。其他结构为现有技术，不再赘述。
实施例八
一种单片清洗机，其集合晶圆清洗和晶圆干燥功能，包括有上述任意结构的晶圆旋转夹持机构。其他结构为现有技术，不再赘述。
上述具体实施方式用来解释说明本发明，而不是对本发明进行限制，在本发明的精神和权利要求的保护范围内，对本发明作出的任何修改和改变，都落入本发明的保护范围。

Claims (15)

  1. 一种晶圆旋转机构，其特征在于，包括：
    下部机构(2)，用于输出旋转动力；
    上部机构(3)，可与晶圆旋转基座(4)相连；
    所述上部机构(3)和下部机构(2)具有工作状态和分离状态，当处于工作状态时，所述上部机构(3)在下部机构(2)带动下旋转，当处于分离状态时，所述上部机构(3)和下部机构(2)分离；
    断电状态下，所述上部机构(3)和下部机构(2)从工作状态切换至分离状态，所述上部机构(3)带着晶圆旋转基座(4)在惯性作用下旋转直至停止。
  2. 根据权利要求1所述的晶圆旋转机构，其特征在于：所述下部机构(2)与动力源(1)分体设置，下部机构(2)可随动力源(1)旋转。
  3. 根据权利要求1或2所述的晶圆旋转机构，其特征在于：断电状态下，所述下部机构(2)停止输出旋转动力。
  4. 根据权利要求1所述的晶圆旋转机构，其特征在于：所述上部机构(3)和下部机构(2)之间具有离合结构，通电状态下，所述下部机构(2)和上部机构(3)通过离合结构非接触式传动连接，使得下部机构(2)可带动上部机构(3)同步旋转。
  5. 根据权利要求4所述的晶圆旋转机构，其特征在于：所述离合结构包括分别设于下部机构(2)和上部机构(3)的接触面(51、52)，及电磁感应组件(53)，在电磁感应组件(53)通电状态下，下部机构(2)和上部机构(3)之间存在排斥力，以实现下部机构(2)和上部机构(3)的非接触式传动连接。
  6. 根据权利要求5所述的晶圆旋转机构，其特征在于：所述电磁感应组件(53)包括间隔布设于下部机构(2)的电磁体(531)，及间隔布设于上部机构(3) 的永磁体(532)，该永磁体(532)和电磁体(531)磁性相同，且交错设置。
  7. 根据权利要求1所述的晶圆旋转机构，其特征在于：所述上部机构(3)和下部机构(2)之间具有离合结构，所述下部机构(2)和上部机构(3)通过离合结构接触式传动连接，使得下部机构(2)可带动上部机构(3)同步旋转。
  8. 根据权利要求7所述的晶圆旋转机构，其特征在于：所述离合结构包括分别设于上部机构(3)和下部机构(2)的磁性体(542)和金属件(543)，及复位件(541)，在断电状态下，所述磁性体(542)和金属件(543)断开吸附连接。
  9. 根据权利要求7所述的晶圆旋转机构，其特征在于：所述离合结构包括设于上部机构(3)的上接触面(551)，设于下部机构(2)的下接触面(552)，弹性件(56)，及推杆(57)，所述弹性件(56)驱动下接触面(552)和上接触面(551)接触传动；在断电状态下，所述推杆(57)驱动下接触面(552)或上接触面(551)压缩弹性件(56)，以将上、下接触面分离。
  10. 根据权利要求7所述的晶圆旋转机构，其特征在于：所述离合结构包括设于上部机构(3)的上齿盘(581)，及设于下部机构(2)的下齿盘(582)，所述上齿盘(581)和下齿盘(582)啮合传动。
  11. 根据权利要求7所述的晶圆旋转机构，其特征在于：所述离合结构包括分别设于上部机构(3)和下部机构(2)的推杆(591)和凹槽(592)，在断电状态下，所述推杆(591)脱离凹槽(592)，以将上部机构(3)和下部机构(2)分离。
  12. 根据权利要求1所述的晶圆旋转机构，其特征在于：处于分离位时，所述上部机构(3)和下部机构(2)的间距为0.1-5mm。
  13. 一种晶圆旋转夹持机构，其特征在于：包括如权利要求1-12中任一项所述的晶 圆旋转机构，晶圆旋转基座(4)，设于晶圆旋转基座外周的晶圆支撑机构，及晶圆转动夹持机构(41)；断电状态下，所述上部机构(3)和下部机构(2)从工作状态切换至分离状态，所述上部机构(3)带着晶圆旋转基座(4)在惯性作用下旋转，所述晶圆转动夹持机构(41)保持受到离心力作用的状态，其底部保持向外运动，其端部下压抵接晶圆(42)，以配合晶圆支撑机构固定晶圆(42)，直至晶圆旋转基座(4)停止转动，晶圆转动夹持机构(41)放松对晶圆(42)的压持。
  14. 一种晶圆干燥系统，其特征在于：包括如权利要求12所述的晶圆旋转夹持机构。
  15. 一种晶圆清洗系统，其特征在于：包括如权利要求12所述的晶圆旋转夹持机构。
PCT/CN2023/071168 2022-06-27 2023-01-09 一种晶圆旋转机构、晶圆旋转夹持机构及晶圆清洗干燥系统 WO2024001154A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN114823476B (zh) * 2022-06-27 2022-11-18 杭州众硅电子科技有限公司 一种晶圆旋转机构、晶圆旋转夹持机构及晶圆清洗干燥系统
CN115632029B (zh) * 2022-12-22 2023-03-17 河北博特半导体设备科技有限公司 一种高精度晶圆承片台的陶瓷旋转台结构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002282802A (ja) * 2001-03-29 2002-10-02 Shinko Pantec Co Ltd 洗浄方法
JP2006135113A (ja) * 2004-11-08 2006-05-25 Okamoto Machine Tool Works Ltd デバイスウエハの真空チャックシステムおよびそれを用いてデバイスウエハ裏面を研磨する方法
JP2009117584A (ja) * 2007-11-06 2009-05-28 Tokyo Seimitsu Co Ltd ウェーハ処理装置
CN211924524U (zh) * 2020-03-14 2020-11-13 南安市跃启机械贸易有限公司 一种带有防护机构的机械用风扇
JP2021174881A (ja) * 2020-04-24 2021-11-01 株式会社ディスコ テーブル機構
CN114823476A (zh) * 2022-06-27 2022-07-29 杭州众硅电子科技有限公司 一种晶圆旋转机构、晶圆旋转夹持机构及晶圆清洗干燥系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0821215B2 (ja) * 1987-12-21 1996-03-04 株式会社日立製作所 回転磁気シート装置
JPH09312326A (ja) * 1996-05-21 1997-12-02 Toshiba Corp 基板回転保持装置
KR100589449B1 (ko) * 1997-04-17 2006-06-14 세키스이가가쿠 고교가부시키가이샤 전자회로부품
JP3909915B2 (ja) * 1997-06-09 2007-04-25 芝浦メカトロニクス株式会社 スピン処理装置
JP2000306284A (ja) * 1999-04-23 2000-11-02 Sharp Corp キャプスタンモータ制御装置
TW452917B (en) * 1999-10-29 2001-09-01 Winbond Electronics Corp Holder
JP3971132B2 (ja) * 2001-07-02 2007-09-05 大日本スクリーン製造株式会社 基板処理装置
JP2003059893A (ja) * 2001-08-15 2003-02-28 Ae Techno Kk スピンドライヤー
JP4363864B2 (ja) * 2003-02-21 2009-11-11 中川電化産業株式会社 ギヤードモータ
JP4753832B2 (ja) * 2006-10-19 2011-08-24 大日本スクリーン製造株式会社 基板回転保持装置および基板処理装置
JP7082517B2 (ja) * 2018-04-19 2022-06-08 株式会社ディスコ 加工装置
CN111681984B (zh) * 2020-06-10 2023-09-15 上海御微半导体技术有限公司 一种片材承载装置及晶圆检测设备
CN111900849B (zh) * 2020-07-07 2023-01-17 东南大学 一种机械臂用主动安全电机及其控制方法
CN111883475A (zh) * 2020-07-17 2020-11-03 北京北方华创微电子装备有限公司 晶圆清洗设备中的卡盘装置及晶圆清洗设备
CN114256126A (zh) * 2020-09-25 2022-03-29 长鑫存储技术有限公司 晶圆加工设备及晶圆输送方法
CN216282376U (zh) * 2021-07-23 2022-04-12 杭州众硅电子科技有限公司 一种晶圆紧固装置
CN216698333U (zh) * 2022-01-18 2022-06-07 沈阳超夷微电子设备有限公司 一种晶圆夹持装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002282802A (ja) * 2001-03-29 2002-10-02 Shinko Pantec Co Ltd 洗浄方法
JP2006135113A (ja) * 2004-11-08 2006-05-25 Okamoto Machine Tool Works Ltd デバイスウエハの真空チャックシステムおよびそれを用いてデバイスウエハ裏面を研磨する方法
JP2009117584A (ja) * 2007-11-06 2009-05-28 Tokyo Seimitsu Co Ltd ウェーハ処理装置
CN211924524U (zh) * 2020-03-14 2020-11-13 南安市跃启机械贸易有限公司 一种带有防护机构的机械用风扇
JP2021174881A (ja) * 2020-04-24 2021-11-01 株式会社ディスコ テーブル機構
CN114823476A (zh) * 2022-06-27 2022-07-29 杭州众硅电子科技有限公司 一种晶圆旋转机构、晶圆旋转夹持机构及晶圆清洗干燥系统

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