WO2023284285A1 - 一种耐高温半芳香族共聚酰胺及其制备方法、组合物及成型品 - Google Patents
一种耐高温半芳香族共聚酰胺及其制备方法、组合物及成型品 Download PDFInfo
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- WO2023284285A1 WO2023284285A1 PCT/CN2022/074273 CN2022074273W WO2023284285A1 WO 2023284285 A1 WO2023284285 A1 WO 2023284285A1 CN 2022074273 W CN2022074273 W CN 2022074273W WO 2023284285 A1 WO2023284285 A1 WO 2023284285A1
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- WIPO (PCT)
- Prior art keywords
- acid
- copolyamide
- aromatic
- temperature
- monomer
- Prior art date
Links
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- 238000002360 preparation method Methods 0.000 title abstract description 10
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 claims abstract description 62
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- 239000000178 monomer Substances 0.000 claims abstract description 46
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- 239000003795 chemical substances by application Substances 0.000 claims description 28
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 26
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- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 7
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- 238000002844 melting Methods 0.000 claims description 7
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- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 7
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- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 5
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- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 5
- LNETULKMXZVUST-UHFFFAOYSA-N 1-naphthoic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1 LNETULKMXZVUST-UHFFFAOYSA-N 0.000 claims description 4
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 4
- BTZVDPWKGXMQFW-UHFFFAOYSA-N Pentadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCC(O)=O BTZVDPWKGXMQFW-UHFFFAOYSA-N 0.000 claims description 4
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 claims description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 4
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 claims description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims description 4
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 claims description 4
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- 239000010452 phosphate Substances 0.000 claims description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 claims description 4
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- 229910001382 calcium hypophosphite Inorganic materials 0.000 claims description 3
- 229940064002 calcium hypophosphite Drugs 0.000 claims description 3
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- CNALVHVMBXLLIY-IUCAKERBSA-N tert-butyl n-[(3s,5s)-5-methylpiperidin-3-yl]carbamate Chemical compound C[C@@H]1CNC[C@@H](NC(=O)OC(C)(C)C)C1 CNALVHVMBXLLIY-IUCAKERBSA-N 0.000 claims description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 2
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 claims description 2
- ZSPDYGICHBLYSD-UHFFFAOYSA-N 2-methylnaphthalene-1-carboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C)=CC=C21 ZSPDYGICHBLYSD-UHFFFAOYSA-N 0.000 claims description 2
- UOBYKYZJUGYBDK-UHFFFAOYSA-N 2-naphthoic acid Chemical compound C1=CC=CC2=CC(C(=O)O)=CC=C21 UOBYKYZJUGYBDK-UHFFFAOYSA-N 0.000 claims description 2
- AWQSAIIDOMEEOD-UHFFFAOYSA-N 5,5-Dimethyl-4-(3-oxobutyl)dihydro-2(3H)-furanone Chemical compound CC(=O)CCC1CC(=O)OC1(C)C AWQSAIIDOMEEOD-UHFFFAOYSA-N 0.000 claims description 2
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- GONOPSZTUGRENK-UHFFFAOYSA-N benzyl(trichloro)silane Chemical compound Cl[Si](Cl)(Cl)CC1=CC=CC=C1 GONOPSZTUGRENK-UHFFFAOYSA-N 0.000 claims description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 2
- ONIHPYYWNBVMID-UHFFFAOYSA-N diethyl benzene-1,4-dicarboxylate Chemical compound CCOC(=O)C1=CC=C(C(=O)OCC)C=C1 ONIHPYYWNBVMID-UHFFFAOYSA-N 0.000 claims description 2
- FPIQZBQZKBKLEI-UHFFFAOYSA-N ethyl 1-[[2-chloroethyl(nitroso)carbamoyl]amino]cyclohexane-1-carboxylate Chemical compound ClCCN(N=O)C(=O)NC1(C(=O)OCC)CCCCC1 FPIQZBQZKBKLEI-UHFFFAOYSA-N 0.000 claims description 2
- 229910052816 inorganic phosphate Inorganic materials 0.000 claims description 2
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- 229910001380 potassium hypophosphite Inorganic materials 0.000 claims description 2
- CRGPNLUFHHUKCM-UHFFFAOYSA-M potassium phosphinate Chemical compound [K+].[O-]P=O CRGPNLUFHHUKCM-UHFFFAOYSA-M 0.000 claims description 2
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- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 2
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/28—Preparatory processes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Definitions
- the invention belongs to the field of macromolecular materials, and in particular relates to a high-temperature-resistant and low-aromatic copolyamide, a preparation method and a composition thereof.
- SMT surface mount technology
- the development trend of "replacing steel with plastic” in the automotive industry the market demand for high-temperature-resistant polyamides has increased dramatically.
- SMT technology requires that the melting point of the material is not lower than 215°C, and lead-free solder puts forward higher requirements for the heat resistance of the material.
- the increase in the combustion temperature of automobile fuel is conducive to the full combustion of fuel, reduces fuel consumption, and reduces the emission of carbon dioxide and other toxic gases, while the increase in fuel combustion temperature requires higher heat resistance for the peripheral parts of the automobile engine.
- Traditional general-purpose plastics and common engineering plastics can no longer meet the market's demand for material heat resistance.
- high-temperature-resistant polyamide is higher than 270°C, and it has excellent short-term and long-term heat resistance.
- Common high-temperature-resistant polyamides include PA46, PA5T, PA6T, PA9T, PA10T, PA11T, PA12T, PA MXD6, PMIA, PPTA, etc.
- PA10T the full name of polydecanediamine terephthalamide, the benzene ring structure of terephthalic acid endows it with high rigidity, high heat resistance, high mechanical strength and high dimensional stability.
- PA10T with the advantages of melt processability and low water absorption, and 1,10-decanediamine can be obtained from biomass raw material castor oil through saponification cracking, ammoniation and other steps, so PA10T is a promising Bio-based high temperature resistant polyamide. Similar to other semi-aromatic high-temperature resistant polyamides, PA10T has the disadvantages of poor melt fluidity and narrow melt processing window, so other comonomers are often introduced to improve its melt fluidity and lower its melting point.
- Patent CN101759853B provides a preparation method of semi-aromatic polyamide: first, monomers and auxiliary agents are added to the polymerization tank for condensation polymerization to obtain a prepolymer with a lower intrinsic viscosity, dry the water, and then transfer to the thickening equipment
- this method uses many types of equipment and is complicated to operate.
- the invention provides a high-temperature-resistant semi-aromatic copolyamide and its preparation method, composition and molded product.
- the monomer raw materials of the copolyamide include diacid monomers and diamine monomers, and the diacid monomers include but are not limited to aromatic dibasic acids and/or derivatives thereof, aliphatic dibasic acids, and the dibasic dibasic acids Amine monomers include but not limited to decanediamine and pentamethylenediamine, and the molar ratio of the decanediamine to pentamethylenediamine is (1-30):1.
- aromatic dibasic acids include, but are not limited to, amides of aromatic dibasic acids, and esters of aromatic dibasic acids, such as C1-C10 alkyl esters of aromatic dibasic acids.
- the 1,10-decanediamine (decanediamine for short) in the monomer is 1,10-decanediamine derived from chemical sources or biological substances, preferably 1,10-decanediamine derived from biological substances.
- the 1,5-pentanediamine (pentamethylenediamine for short) in the monomer is pentamethylenediamine derived from chemical sources or biological substances, preferably 1,5-pentanediamine derived from biological substances.
- Biomass is a variety of organisms formed through photosynthesis. Biomass sources refer to preparations using these organisms through biological methods (eg, biofermentation). Chemically derived means prepared by chemical methods.
- the molar ratio of the decanediamine to the aromatic dibasic acid is 1:(0.7-1.5), further 1:(0.8-1.2), for example 1:0.98, 1:0.95.
- the molar ratio of decanediamine to pentamethylenediamine is (2-30):1, further (2-20):1, such as 19:1, 18:1, 10:1 , 6.5:1, 4:1.
- the molar ratio of the diamine monomer to the diacid monomer is (1-1.3):1, further (1-1.1):1, and further (1-1.06):1 , further (1.01-1.04):1.
- the total amount of the diamine monomer and the diacid monomer accounts for more than 85%, further more than 90%, and further more than 95% of the total amount of monomer raw materials of the copolyamide, Further more than 97%, said percentage is mole percentage.
- the total amount of decanediamine and pentamethylenediamine accounts for more than 85% of the total amount of diamine monomers, further more than 90%, further more than 95%, and the percentage is mole percentage.
- the total amount of the aromatic dibasic acid and/or its derivatives and the aliphatic dibasic acid accounts for more than 85% of the total amount of the diacid monomers, and is further more than 90%, Further more than 95%, said percentage is mole percentage.
- the aromatic dibasic acid is any one or a combination of two or more of the diacids containing benzene rings with 8 or more carbon atoms, further including terephthalic acid, m-benzene One or a combination of two or more of dicarboxylic acid and phthalic acid.
- the aromatic dibasic acid derivatives include, but are not limited to, one or a combination of two or more of phthaloyl chloride, dimethyl terephthalate and diethyl terephthalate.
- the aliphatic dibasic acid is any one and combination of aliphatic dibasic acids with 2 to 18 carbon atoms, further including oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid Acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid One or a combination of two or more of basic acid, hexadecanedibasic acid, heptadecanedibasic acid and octadecanedibasic acid.
- the copolyamide is PA10T/5T/5X/10X.
- the X represents a structural unit derived from an aliphatic dibasic acid, especially the number of carbon atoms contained in the aliphatic dibasic acid, and the aliphatic dibasic acid has the same limitations as described above.
- T stands for terephthalic acid.
- copolyamide PA10T/5T/56/106 represents a copolyamide prepared from decanedidiamine, terephthalic acid, pentamethylenediamine, and adipic acid as monomers.
- the raw material of the copolyamide also includes additives accounting for 0.01% to 3% of the total mass of the monomers, and the additives include but are not limited to end-capping agents, catalysts, flame retardants, antioxidants, Any one or a combination of two or more of ultraviolet absorbers, infrared absorbers, crystal nucleating agents, fluorescent whitening agents and antistatic agents.
- the raw material of the copolyamide further includes 0.1% to 0.5% of an antioxidant, further 0.1% to 0.3% of an antioxidant, accounting for the total mass of monomers.
- the antioxidant is selected from one or a combination of two or more of phenolic antioxidants, inorganic phosphate antioxidants, phosphite antioxidants and carbon free radical scavenger antioxidants.
- the raw material of the copolyamide further includes 0-0.07% of catalyst, further 0.005-0.05% of catalyst, accounting for the total mass of monomers.
- Described catalyst comprises phosphate, hypophosphite, further comprises the phosphate of alkali metal and/or alkaline earth metal, the hypophosphite of alkali metal and/or alkaline earth metal, further comprises potassium hypophosphite, sodium hypophosphite, One or a combination of calcium hypophosphite and magnesium hypophosphite.
- the total mass of the phosphate and hypophosphite accounts for more than 85%, further more than 90%, and further more than 95% of the total mass of the catalyst.
- the raw material of the copolyamide also includes 0-1% of the end-capping agent accounting for the total mass of monomers, further 0.1-0.5% of the end-capping agent, and further 0.15%-0.4% of the end-capping agent terminal agent.
- the end-capping agent includes any one of C2-C16 aliphatic carboxylic acids, C7-C10 aromatic carboxylic acids and combinations thereof.
- the structure of the aliphatic carboxylic acid end-capping agent is a monobasic acid with a straight chain, a branched chain or a cyclic structure, and a saturated monobasic acid with a straight chain, a branched chain or a cyclic structure.
- aliphatic carboxylic acids with saturated cyclic structures has a better effect of reducing the YI value of polymers compared to aliphatic carboxylic acids with linear structures, mainly because aliphatic carboxylic acids with cyclic structures have larger steric positions
- the resistance effect can destroy the coplanarity of atomic groups, reduce the superposition degree of ⁇ electrons, and shift the absorption spectrum to the short-wave direction.
- the capping agent includes any one of C2-C10 aliphatic carboxylic acids and C7-C10 aromatic carboxylic acids and combinations thereof.
- the number of carbon atoms of the end-capping agent is, for example, 3, 4, 5, 6, 7, 8, or 9.
- the capping agent includes acetic acid, propionic acid, butyric acid, pentanoic acid, hexanoic acid, heptanoic acid, caprylic acid, nonanoic acid, decanoic acid, trimethylacetic acid, isobutyric acid, benzoic acid, cyclohexanecarboxylic acid , toluic acid, ⁇ -naphthoic acid, ⁇ -naphthoic acid, methylnaphthoic acid and phenylacetic acid in any one or a combination of two or more.
- the total mass of the C2-C10 aliphatic carboxylic acids and C7-C10 aromatic carboxylic acids accounts for more than 85%, further more than 90%, and further more than 95% of the total mass of the end-capping agent.
- the melting point of the copolyamide is above 270°C, further between 270°C and 310°C, such as 280°C, 290°C, 300°C, and 305°C.
- the relative viscosity of the copolyamide is 1.6-3.2, further 2.2-3.0, further 2.2-2.6, for example 2.3, 2.4, 2.5.
- the water absorption of the copolyamide is 0.1-1%, further 0.2-0.8%, such as 0.4%, 0.6% or 0.7%.
- the tensile strength of the copolyamide is 50-140 MPa, more preferably 60-120 MPa, further 70-110 MPa, such as 80 MPa, 90 MPa, 95 MPa, 100 MPa or 105 MPa.
- the flexural strength of the copolyamide is 70-130 MPa, further 85-130 MPa, further 90-130 MPa, such as 100 MPa, 105 MPa, 110 MPa, 115 MPa, 120 MPa or 125 MPa.
- the heat distortion temperature of the copolyamide is 95-130°C, further 100-125°C, such as 105°C, 110°C, 115°C or 120°C.
- the YI value of the copolyamide is 15 or less, further 13 or less, further 10 or less, further 7 or less, for example 2-7, 6 or 5.
- the inventor found that the amino group belongs to a kind of chromogenic group, which can deepen the color of the polymer containing chromogenic group.
- the use of the catalyst can reduce the terminal amino group concentration of the polymer, increase the molecular weight of the polymer, and obtain a polymer with better mechanical properties and a lower YI value.
- the polymerization is prone to the problems of high polymer viscosity and poor melt fluidity.
- the melt viscosity is generally reduced by increasing the temperature, increasing the shear rate, etc.
- the increase in temperature will promote the yellowing of the polymer.
- the addition of the end-capping agent can regulate the viscosity of the polymer melt, reduce the crosslinking of terminal amino groups under high temperature conditions, increase the fluidity of the polymer melt, and reduce the YI value of the polymer.
- Another aspect of the present invention provides a method for preparing high temperature resistant semi-aromatic copolyamides, the method comprising the following steps:
- the salt formed by the reaction of diamine and diacid is polyamide salt (also known as nylon salt), and the polyamide salt can be polycondensed to obtain polyamide or copolyamide.
- the temperature raising process in step 1) is carried out in an inert gas atmosphere; the inert gas includes one or more of nitrogen, argon or helium.
- the holding time in step 1) is 0.5-2 hours.
- the drain water in step 2) is concentrated until the concentration of the polyamide salt is 40wt%-80wt%, further 55wt%-65wt%.
- reaction time in step 2) is 0.5-2 hours, further 1-1.5 hours;
- the pressure during the reaction in step 2) is kept at 2.5-3 MPa.
- step 3) the depressurization of exhaust gas reduces the pressure in the reaction system to 0-0.2 MPa (gauge pressure).
- the temperature of the reaction system after the decompression in step 3) is 315-335°C.
- the method further includes step 4) vacuuming treatment: vacuuming to a degree of vacuum below -0.02MPa, further between -0.05MPa and -0.1MPa.
- the vacuum treatment step before melting and discharging can avoid a small amount of small molecules such as water remaining in the reaction system when the pressure drops to 0 during the decompression stage. Problems that affect the properties of materials.
- the time for maintaining the above vacuum degree is 0-300s, further 0-90s, and further 5-90s.
- keeping the vacuum degree within the above range is beneficial to the quality of the product, and is also beneficial to the copolyamide melt discharge, thereby facilitating subsequent processing.
- the method further includes step 5): discharging, strand drawing and pelletizing.
- the method further includes adding additives at any stage of step 1), step 2), step 3), and step 4).
- the additives are as defined above.
- the preparation method of described high temperature resistant semi-aromatic copolyamide comprises the following steps:
- Another aspect of the present invention provides a composition comprising the high temperature resistant semi-aromatic copolyamide described in any one of the above compositions.
- Another aspect of the present invention provides a molded product prepared from the above-mentioned high-temperature-resistant semi-aromatic copolyamide as a raw material.
- the copolyamide of the present invention can be molded by any molding method such as injection molding, extrusion molding, blow molding, vacuum molding, melt spinning, and film molding. These molded products can be molded into desired shapes, and can be used in resin molded products such as automobile parts and machine parts.
- the implementation of the present invention has at least the following advantages:
- the copolyamide synthesized by the present invention has the same comprehensive performance as polyamide, and can use the monomer pentamethylenediamine developed with independent intellectual property rights, avoiding the use of foreign monopoly monomer hexamethylenediamine.
- copolyamide synthesized by the present invention has excellent mechanical properties, and its tensile properties, bending resistance and impact resistance are all comparable to polyamide products such as polyamide PA6 and polyamide PA66 used in the market.
- the copolyamide synthesized by the present invention has lower water absorption, better dimensional stability, higher heat distortion temperature, and lower yellowness index, and can be used in more harsh use environments, expanding the range to a certain extent.
- the scope of use of polyamide is not limited to a certain extent.
- the preparation method of the copolyamide of the present invention is simple, the process parameters are easy to control, and it does not need the assistance of large instruments, so it is convenient for quantitative production.
- Ubbelohde viscometer concentrated sulfuric acid method Accurately weigh 0.5 ⁇ 0.0002g of the dried polyamide sample, add 50mL concentrated sulfuric acid (98%) to dissolve, measure and record the flow time t0 of the solvent concentrated sulfuric acid in a constant temperature water bath at 25°C and the flow time t of the polyamide solution.
- Bending strength test refers to standard ISO-178, test condition: 2mm/min;
- Tensile strength test refers to standard ISO-572-2, test condition: 50mm/min;
- the yellow index refers to the yellow value based on the CIE standard C light source and magnesium oxide.
- the calculation method of the yellowness index YI is as follows:
- YI (100(1.28X-1.06Z))/Y, where X, Y and Z are the measured tristimulus values respectively.
- the detection temperature is 25 ⁇ 5°C; relative humidity: 50 ⁇ 20%.
- Example 5 Basically the same as Example 3, the only difference between this Example 5 and Example 3 is that the raw materials for the preparation of the copolyamide PA10T/5T/56/106 in this Example 5 do not contain a catalyst.
- Example 6 Basically the same as Example 3, the only difference between this Example 6 and Example 3 is that the raw materials for the preparation of the copolyamide PA10T/5T/56/106 in this Example 6 do not contain an end-capping agent.
- the temperature of the post-reaction system is 325° C. to obtain a copolyamide melt; after discharge, the copolymer melt is subjected to strand cutting to obtain high temperature resistant semi-aromatic copolyamide PA10T/5T/56/106.
- the mass concentration of nylon salt in the mixture is 50 wt %;
- the temperature of the reaction system is raised to 130°C, and the drain water is concentrated until the mass concentration of nylon salt is 65wt%; the temperature is raised to 250°C again, and the pressure is maintained at 2.5MPa for 1 hour; the pressure in the reaction system is reduced to 0MPa (gauge pressure) by keeping the pressure at 250°C. , evacuate to make the pressure -0.07MPa, the vacuum time is 30s, and the reaction system is cooled to room temperature to obtain a solid prepolymer;
- the copolyamide PA10T/5T/5X/10X is prepared by a one-step method in the examples, which has the advantage of easy operation.
- Comparative Example 1 is prepared by a two-step method of prepolymerization and then solid phase thickening, which has low utilization rate of equipment and complicated operation.
- Example 3 By comparing Example 3 with Comparative Example 1, it can be seen that the improvement of the pre-polymerization viscosity by solid-phase thickening is very limited, and the YI value of the sample is much higher than the YI value of the sample prepared by the one-step method. It is caused by factors such as uneven heating of the sample in the phase viscosification equipment. The yellowing of the sample indicates that the sample has undergone aging degradation, which leads to a corresponding decrease in mechanical properties.
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Abstract
Description
Claims (10)
- 一种耐高温半芳香族共聚酰胺,其特征在于,所述共聚酰胺的单体原料包括二酸单体和二胺单体,所述二酸单体包括芳香族二元酸和/或其衍生物、和脂肪族二元酸,所述二胺单体包括癸二胺和戊二胺,所述癸二胺和戊二胺的摩尔比为(1~30):1。
- 如权利要求1所述的耐高温半芳香族共聚酰胺,其特征在于,所述单体中的癸二胺为化学来源或者生物物质来源的1,10-癸二胺,优选为生物物质来源的1,10-癸二胺;和/或,所述单体中的戊二胺为化学来源或者生物物质来源的戊二胺,优选为生物物质来源的1,5-戊二胺;和/或,所述癸二胺和芳香族二元酸的摩尔比为1:(0.7~1.5),进一步为1:(0.8~1.2);和/或,所述癸二胺和戊二胺的摩尔比为(2~30):1,进一步为(2~20):1;和/或,所述戊二胺和脂肪族二元酸的摩尔比为(1~1.3):1,进一步为(1~1.1):1,进一步为(1~1.06):1;和/或,所述二胺单体和二酸单体的摩尔比为(1~1.3):1,进一步为(1~1.1):1,进一步为(1~1.06):1,进一步为(1.01~1.04):1;和/或,所述二胺单体和二酸单体的总量占所述共聚酰胺的单体原料总量的85%以上,进一步为90%以上,进一步为95%以上,进一步为97%以上,所述百分比为摩尔百分比;和/或,所述癸二胺和戊二胺总量占所述二胺单体总量的85%以上,进一步为90%以上,进一步为95%以上,所述百分比为摩尔百分比;和/或,所述芳香族二元酸和/或其衍生物、脂肪族二元酸的总量占所述二酸单体总量的85%以上,进一步为90%以上,进一步为95%以上,所述百分比为摩尔百分比;和/或,所述共聚酰胺为PA10T/5T/5X/10X。
- 如权利要求1所述的耐高温半芳香族共聚酰胺,其特征在于,所述芳香族二元酸为碳原子数为8以上的含有苯环的二酸中的任意一种或两种以上的组合,进一步包括对苯二甲酸、间苯二甲酸和邻苯二甲酸中的一种及或两种以上组合;和/或,所述芳香族二元酸衍生物包括但不限于对苯二甲酰氯、对苯二甲酸二甲酯和对苯二甲酸二乙酯中的一种或两种以上的组合;和/或,所述脂肪族二元酸为碳原子数为2~18的脂肪族二酸中的任意一种及其组合,进一步包括乙二酸、丙二酸、丁二酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十一碳二元酸、十二碳二元酸、十三碳二元酸、十四碳二元酸、十五碳二元酸、十六碳二元酸、十七碳二元酸、十八碳二元酸中的一种或者两种以上的组合。
- 如权利要求1所述的耐高温半芳香族共聚酰胺,其特征在于,所述共聚酰胺的原料中还包括占单体总质量0.01%~3%的添加剂,所述添加剂包括但不限于封端剂、催化剂、阻燃剂、抗氧化剂、紫外线吸收剂、红外线吸收剂、结晶成核剂、荧光增白剂和抗静电剂中的任意一种或两种以上的组合;和/或,所述共聚酰胺的原料中还包括占单体总质量0.1%~0.5%的抗氧剂,所述抗氧剂包括酚类抗氧剂、无机磷酸盐类抗氧剂、亚磷酸酯类抗氧剂和碳自由基捕获剂类抗氧剂中的一种或两种以上的组合;和/或,所述共聚酰胺的原料中还包括占单体总质量0~0.07%的催化剂,进一步为0.005~0.05%的催化剂,所述催化剂包括磷酸盐、次亚磷酸盐,进一步包括碱金属和/或碱土金属的磷酸盐、碱金属和/或碱土金属的次亚磷酸盐,进一步包括次亚磷酸钾、次亚磷酸钠、次亚磷酸钙、次亚磷酸镁中的一种或两种以上的组合;和/或,所述共聚酰胺的原料中还包括占单体总质量0~1%的封端剂,进一步0.1~0.5%的封端剂,所述封端剂包括C2~C16的脂肪族羧酸和C7~C10的芳香族羧酸中任意一种及其组合,进一步地,所述封端剂包括C2~C10的脂肪族羧酸和C7~C10的芳香族羧酸中任意一种及其组合,所述封端剂例如包括乙酸、丙酸、丁酸、戊酸、己酸、庚酸、辛酸、壬酸、癸酸、三甲基乙酸、异丁酸、苯甲酸、环己烷甲酸、甲苯甲酸、α-萘甲酸、β-萘甲酸、甲基萘甲酸以及苯基乙酸中的任意一种或两种以上的组合。
- 如权利要求1~4中任一项所述的耐高温半芳香族共聚酰胺,其特征在于,所述共聚酰胺的熔点为270℃以上,进一步为270℃~310℃;和/或,所述共聚酰胺的热变形温度为95~130℃,进一步为100~125℃;和/或,所述共聚酰胺的吸水率为0.1~1%,进一步为0.2~0.8%;和/或,所述共聚酰胺的相对粘度为1.0~3.2,进一步为2.2~3.0,进一步为2.2~2.6;和/或,所述共聚酰胺的拉伸强度为50~140MPa,进一步为60~120MPa,进一步为70~110MPa;和/或,所述共聚酰胺的弯曲强度为70~130MPa,进一步为85~130MPa,进一步为90~130MPa;和/或,所述共聚酰胺的黄色指数YI值为15以下,进一步为13以下,进一步为10以下,进一步为7以下。
- 一种制备耐高温半芳香族共聚酰胺的方法,其特征在于,所述方法包括以下步骤:1)将癸二胺、戊二胺、芳香族二元酸和/或其衍生物、以及脂肪族二元酸加入到水中,升温至 70~90℃,可选择地在70~90℃保温0.5~3h,形成包含聚酰胺盐的混合物;2)将所述包含聚酰胺盐的混合物加热升温至120~140℃,排水浓缩,然后升温至240~255℃进行反应;以及3)排气降压。
- 根据权利要求6所述的方法,其特征在于,步骤1)所述升温过程在惰性气体氛围中进行;和/或,步骤1)所述的保温时间为0.5~2h;和/或,步骤2)所述排水浓缩至聚酰胺盐的浓度为40wt%~80wt%,进一步为55wt%~65wt%;和/或,步骤2)所述反应进行的时间为0.5~2h,进一步为1~1.5h;和/或,步骤2)所述反应进行过程中压力保持为2.5~3MPa;和/或,步骤3)所述排气降压使反应体系内压力降至0~0.2MPa(表压);和/或,步骤3)所述降压结束后反应体系的温度为315~335℃;和/或,包括步骤4):抽真空处理:抽真空至真空度为-0.02MPa以下,进一步为-0.05MPa至-0.1MPa,可选择地,在该真空度保持的时间为0~300s,进一步为0~90s,更进一步为5~90s;和/或,包括步骤5):出料,拉条和切粒。
- 根据权利要求6或7所述的方法,其特征在于,包括在步骤1)、2)、3)和4)的任意阶段加入添加剂,所述添加剂占单体总质量的0.01%~3%,所述添加剂包括但不限于封端剂、催化剂、阻燃剂、抗氧化剂、紫外线吸收剂、红外线吸收剂、结晶成核剂、荧光增白剂和抗静电剂中的任意一种或两种以上的组合。
- 一种组合物,其特征在于,包括权利要求1-5中任一项所述的耐高温半芳香族共聚酰胺。
- 一种权利要求1-5中任一项所述的耐高温半芳香族共聚酰胺为原料制备的成型品。
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