WO2023284018A1 - 一种门阀装置、清洁方法和机械设备 - Google Patents
一种门阀装置、清洁方法和机械设备 Download PDFInfo
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- WO2023284018A1 WO2023284018A1 PCT/CN2021/109288 CN2021109288W WO2023284018A1 WO 2023284018 A1 WO2023284018 A1 WO 2023284018A1 CN 2021109288 W CN2021109288 W CN 2021109288W WO 2023284018 A1 WO2023284018 A1 WO 2023284018A1
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- Prior art keywords
- gate valve
- lifting
- assembly
- cleaning
- swing gate
- Prior art date
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- 238000004140 cleaning Methods 0.000 title claims abstract description 148
- 238000000034 method Methods 0.000 title claims abstract description 113
- 230000008569 process Effects 0.000 claims abstract description 73
- 239000004065 semiconductor Substances 0.000 description 23
- 238000005530 etching Methods 0.000 description 22
- 238000010586 diagram Methods 0.000 description 11
- 238000012423 maintenance Methods 0.000 description 10
- 230000003749 cleanliness Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Definitions
- the present application relates to, but is not limited to, a gate valve arrangement, a cleaning method and a mechanical device.
- the semiconductor etching machine In the manufacturing process of the semiconductor memory, it is necessary to perform various processes on the wafer by using a semiconductor etching machine. Since most processes need to be carried out in a vacuum environment, the semiconductor etching machine includes a vacuum chamber and a process chamber, which are isolated by a swing gate valve.
- the small door panel on the side of the swing gate valve close to the vacuum chamber is close to the side wall of the vacuum chamber. If the small door panel needs to be cleaned, the semiconductor etching machine must be stopped as a whole, and then the small door panel must be removed and cleaned separately. , which brings great inconvenience to the production process and reduces the production efficiency of the semiconductor etching machine.
- the embodiment of the present application provides a gate valve device, the gate valve device is installed in mechanical equipment including a vacuum chamber and a process chamber, a swing gate valve is provided between the vacuum chamber and the process chamber, and the gate valve device An opening arranged on the side of the vacuum chamber close to the swing gate valve;
- the door valve device includes a cleaning assembly, a first lifting assembly and a second lifting assembly, and the cleaning assembly is arranged on the second lifting assembly;
- the first lifting component is used to control whether the opening of the vacuum chamber close to the side of the swing gate valve is in a closed state
- the second lift assembly is used to control the cleaning assembly to clean the swing gate valve when the opening of the vacuum chamber close to the swing gate valve is in a closed state.
- the embodiment of the present application provides a cleaning method, which is applied to the gate valve device.
- the gate valve device is installed in mechanical equipment including a vacuum chamber and a process chamber, and a swing gate valve is arranged between the vacuum chamber and the process chamber.
- the door valve device is arranged on the opening of the vacuum chamber near the side of the swing door valve;
- the door valve device includes a cleaning assembly, a first lifting assembly and a second lifting assembly, and the cleaning assembly is arranged on the second lifting assembly
- the method includes:
- the cleaning component is controlled by the second lift component to clean the swing gate valve.
- the embodiment of the present application provides a mechanical device, which includes a vacuum chamber, a process chamber, a swing gate valve, and the gate valve device according to the first aspect.
- Fig. 1 is the structural representation of a kind of semiconductor etching machine that the related art provides
- Fig. 2 is a partial structural schematic diagram of a semiconductor etching machine provided by the related art
- FIG. 3 is a schematic structural diagram of a gate valve device provided in an embodiment of the present application.
- Figure 4A is a schematic side view of a gate valve device provided in the embodiment of the present application.
- Figure 4B is a schematic front view of a gate valve device provided in the embodiment of the present application.
- Fig. 5 is a structural schematic diagram of a cleaning method provided in the embodiment of the present application.
- FIG. 6 is an application scene diagram of the cleaning method provided by the embodiment of the present application.
- FIG. 7 is a schematic structural diagram of a mechanical device provided by an embodiment of the present application.
- first ⁇ second ⁇ third involved in the embodiment of the present application is only used to distinguish similar objects, and does not represent a specific ordering of objects. Understandably, “first ⁇ second ⁇ third The specific order or sequence of "three” can be interchanged where permitted so that the embodiments of the application described herein can be practiced in other orders than those illustrated or described herein.
- the semiconductor etching machine In the manufacturing process of semiconductor memory, it is necessary to use semiconductor etching machines to perform various processes on wafers. Since most processes need to be carried out in a vacuum atmosphere, the semiconductor etching machine includes a vacuum chamber and a process chamber, which are separated by a swing gate valve.
- FIG. 1 it shows a schematic structural diagram of a semiconductor etching machine provided in the related art.
- semiconductor etching machine 10 comprises vacuum chamber 101 and a plurality of process chambers 102, for example process chamber B in Figure 1, process chamber C, process chamber D, each process chamber 102 It is connected to the vacuum chamber 101 through a swing gate valve 103 .
- FIG. 2 it shows a schematic diagram of a partial structure of a semiconductor etching machine provided in the related art.
- the small door panel 1032 near the process chamber 102 also referred to as Chamber
- the side near the vacuum chamber 101 also referred to as VTM
- the position of the small door plate 1031 is close to the VTM side wall, so the position of the small door plate 1031 is not cleaned. If the small door plate 1031 is to be cleaned, the whole machine will be stopped and the small door plate 1031 will be removed for cleaning.
- the method of cleaning by removing the small door panel is very inconvenient, and if there is too much downtime, the output of the semiconductor etching machine will be significantly reduced; however, if the vacuum chamber side is not cleaned for a long time If the door panel is small, it will also have an impact on the quality of the product, especially for those products that require higher cleanliness.
- an embodiment of the present application provides a gate valve device, the basic idea is: the gate valve device is installed in mechanical equipment including a vacuum chamber and a process chamber, a swing gate valve is provided between the vacuum chamber and the process chamber, and The gate valve device is arranged on the opening of the vacuum chamber near the side of the swing gate valve; the gate valve device includes a cleaning component, a first lifting component and a second lifting component, and the cleaning component is arranged on the second lifting component; wherein, the first lifting component, It is used to control whether the opening of the vacuum chamber close to the swing gate valve is in a closed state; the second lifting component is used to control the cleaning component to clean the swing gate valve when the opening of the vacuum chamber close to the swing gate valve is in a closed state. Clean up.
- the vacuum on one side of the vacuum chamber can be isolated by the first lifting component, so that the swing gate valve can be cleaned during the operation of the equipment, and equipment damage caused by frequent downtime can be avoided; the swing gate valve can be automatically cleaned by the second lift component.
- the cleaning process does not need to be disassembled for cleaning, which improves the cleaning efficiency; in addition, because the swing gate valve can be easily cleaned through the gate valve device, the cleanliness of the product is improved, thereby improving the operating efficiency of the overall equipment.
- FIG. 3 shows a schematic structural diagram of a door valve device 20 provided in an embodiment of the present application.
- the gate valve device 20 is installed in mechanical equipment including a vacuum chamber and a process chamber, a swing gate valve is arranged between the vacuum chamber and the process chamber, and the gate valve device is arranged near the swing gate valve in the vacuum chamber opening on one side;
- the door valve device 20 includes a cleaning assembly 201, a first lifting assembly 202 and a second lifting assembly 203, and the cleaning assembly 201 is arranged on the second lifting assembly 203; wherein,
- the first lifting assembly 202 is used to control whether the opening of the vacuum chamber close to the side of the swing gate valve is in a closed state
- the second lift assembly 203 is used to control the cleaning assembly 201 to clean the swing gate valve when the opening of the vacuum chamber close to the swing gate valve is in a closed state.
- the gate valve device 20 provided in the embodiment of the present application is applied to mechanical equipment, such as a semiconductor etching machine.
- the mechanical equipment includes a vacuum chamber 101 and a process chamber 102 , the inside of the vacuum chamber 101 is in a vacuum state, and the process chamber 102 is a chamber for etching reaction.
- a swing gate valve 103 is provided between the vacuum chamber 101 and the process chamber 102 for controlling whether the vacuum chamber 101 communicates with the process chamber 102 .
- FIG. 4A shows a schematic side view of a gate valve device provided in an embodiment of the present application.
- FIG. 4B it shows a front structural schematic view of a gate valve device provided in the embodiment of the present application.
- the gate valve device 20 is disposed at the opening of the vacuum chamber on the side close to the swing gate valve.
- the door valve device 20 includes a first lifting assembly 202 and a second lifting assembly 203 , and a cleaning assembly 201 is disposed on the second lifting assembly 203 .
- the first lifting assembly 202 can control the opening of the vacuum chamber near the swinging door valve side to be in a closed state by descending, thereby isolating the vacuum on the side of the vacuum chamber; then, the second lifting assembly 203 controls the cleaning assembly 201 Clean the swing gate valve. It should be understood that, in other embodiments, the first lifting assembly 202 can also isolate the vacuum at the side of the vacuum chamber by rising.
- the second lifting assembly 203 can control the cleaning assembly 201 to swing the door valve. Clean the door panel on the side close to the vacuum chamber.
- the swing gate valve can be cleaned conveniently during the operation of the mechanical equipment without stopping the mechanical equipment and then removing the swing gate valve for cleaning, avoiding damage to the mechanical equipment due to frequent downtime, and improving product cleanliness and improving production efficiency.
- the first elevating assembly 202 and the second elevating assembly 203 can adopt power components of various principles, and the telescopic link will be used for specific description below.
- the first lift assembly 202 includes a first telescopic link 2021 and a first lift valve body 2022, and the first telescopic link 2021 is used to drive the first lift valve body 2022 in the first Swipe between the vertical height and the second vertical height.
- the first lifting assembly 202 is specifically used to control the opening of the vacuum chamber close to the side of the swing gate valve to be in an open state when the first lifting valve body 2022 slides to the first vertical height; or when the first lifting valve body slides to the first vertical height In the case of the second vertical height, the opening of the side of the control vacuum chamber close to the swing gate valve is in a closed state.
- the first lifting assembly 202 may be in the form of a telescopic valve. Therefore, the first lift assembly 202 includes a first telescopic link 2021 and a first lift valve body 2022 .
- the first telescopic link 2021 is a power part, such as a hydraulic part, a pneumatic part, etc.
- the first telescopic link 2021 can drive the first lifting valve body 2022 to slide between the first vertical height and the second vertical height.
- the opening of the vacuum chamber near the swing gate valve side is in an open state; when the second lift valve body 2021 is at the second vertical height, the second lift valve body 2021 will vacuum The opening of the chamber near the swing gate valve side is completely closed, thereby isolating the vacuum on the side of the vacuum chamber.
- the first vertical height may be higher than the second vertical height, or the first vertical height may be lower than the second vertical height.
- the gate valve device 20 it is necessary to provide a separate space for the gate valve device 20 that is higher than or lower than the swing gate valve, so as to accommodate the first lift when there is no need to close the opening of the vacuum chamber on the side close to the swing gate valve.
- Valve body 2022 it is necessary to provide a separate space for the gate valve device 20 that is higher than or lower than the swing gate valve, so as to accommodate the first lift when there is no need to close the opening of the vacuum chamber on the side close to the swing gate valve.
- the door valve device 20 further includes a safety pin 204 and a safety slot 205, the safety pin 204 is arranged on the first lifting valve body 2022, and the safety slot 205 is arranged at the bottom of the door valve device 20;
- the safety pin 204 is used for inserting into the safety slot 205 when the first lifting valve body 2022 slides to the second vertical height, so as to lock the first lifting valve body 2022 .
- a locking mechanism may also be provided for the first lifting valve body 2022 .
- the first lift valve body 2022 needs to descend to close the opening of the vacuum chamber on the side close to the swing gate valve.
- a safety pin 204 can be set on the first lift valve body 2022, and a safety slot 205 can be set at the bottom of the equipment opposite to the first lift valve body 2022, so that after the first lift valve body 2022 descends, the safety pin 204 will be inserted into the safety pin. Socket 205, so as to realize locking, and prevent the first lifting valve body 2022 from rising due to external force or other reasons, causing damage to the equipment.
- safety pin 204 can also be additionally connected with a small telescopic link, so as to automatically control the locking and unlocking actions of the safety pin 204 and the safety slot 205 .
- the second lifting assembly 203 includes a second telescopic link 2031 and a second lifting valve body 2032, and the cleaning assembly 201 is arranged on the second lifting valve body 2032;
- the second telescopic link 2031 is used to drive the second lifting valve body 2032 to slide from the first vertical height to the second vertical height, so that the cleaning assembly 201 and the swing gate valve are within the same height range.
- the second lifting assembly 203 includes a second telescopic link 2031 and a second lifting valve body 2032 , and the cleaning assembly 201 is disposed on the second lifting valve body 2032 .
- the second telescopic connecting rod 2031 and the first telescopic connecting rod 2021 may be power parts of the same principle, or may be different.
- the second telescopic link 2031 is used to drive the second lifting valve body 2032 to slide from the first vertical height to the second vertical height, so that the cleaning assembly 201 and the swing gate valve are within the same height range.
- the first lift valve body 2022 and the second lift valve body 2032 are actually hidden in the closed space above the swing gate valve/below the swing gate valve, so as not to affect Communication/isolation status between vacuum chamber and process chamber.
- the space can be set as a closed space, for example, a reversing door is set at the bottom/top of the confined space, when cleaning is required, the reversing door is opened, and the first lifting valve body is lowered/raised first, isolating the vacuum chamber side vacuum, the second lifting valve body 2032 is lowered/raised, thereby controlling the cleaning assembly 201 to be at the same height as the swing gate valve to be cleaned, so as to facilitate subsequent cleaning; after cleaning, control the first lifting valve body 2022 and the second lifting valve body The second lifting valve body 2032 returns to the closed space, thereby preventing the gate valve device 20 from affecting the normal operation of the semiconductor etching machine.
- a reversing door is set at the bottom/top of the confined space, when cleaning is required, the reversing door is opened, and the first lifting valve body is lowered/raised first, isolating the vacuum chamber side vacuum, the second lifting valve body 2032 is lowered/raised, thereby controlling the cleaning assembly
- first lift valve body 2022 and the second lift valve body 2032 can be set in opposite sliding directions.
- first lift valve body 2022 is hidden in a closed space higher than the swing gate valve
- second lift valve body 2032 is hidden in a closed space lower than the swing gate valve. In use, the first lift valve body 2022 needs to descend, while the second lift valve body 2032 needs to rise.
- the cleaning assembly 201 includes a chute 2011, a micro pusher 2012 and a dirt removal member 2013, the chute 2011 is arranged on the second lifting valve body 2032, and one end of the micro pusher 2012 is set on the chute On 2011, the other end of the micro propeller 2012 is provided with a dirt removal part 2013;
- the micro pusher 2012 is used to control the movement of the dirt removal part 2013 in the horizontal direction, so that the dirt removal part 2013 contacts the swing gate valve;
- the chute 2011 is used to control the movement of the dirt removing member 2013 in the vertical direction when the cleaning component 201 touches the swing gate valve, so as to clean the swing gate valve.
- the cleaning assembly 201 may include a chute 2011 , a micro propeller 2012 and a dirt removal member 2013 .
- the dirt removal member 2013 and the swing gate valve are not at the same horizontal position, which can reduce the resistance when the second lifting assembly 203 descends and improve the life of the dirt removal member 2013 at the same time.
- the micro propeller 2012 drives the dirt removal member 2013 to move in the horizontal direction until the dirt removal member 2013 touches the surface of the swing gate valve near the vacuum side, that is, the small door plate 1031 in FIG. 2 . Then, the chute 2011 drives the dirt removing member 2013 to move vertically, so as to clean the swing gate valve.
- the dirt removal member 2013 can be a hard sponge.
- the cleaning assembly 201 also includes a telescopic carrying plate 206, which is arranged on the second lifting valve body 2032, and the telescopic carrying plate 206 is located below the dirt removal member 2013; wherein,
- the telescopic carrying tray 206 is used to accommodate part of the dirt generated during the cleaning process of the swing gate valve by the cleaning assembly 201 .
- a telescopic carrier plate 206 can be set under the dirt removing part 2013 to accommodate dirt.
- the telescopic carrying tray 206 can be set in a state of linkage with the dirt removal member 2013, or in a state of independent control.
- the gate valve device 20 also includes a switch gate 207;
- the second telescopic link 2031 is also used to drive the second lifting valve body 2032 to slide from the second vertical height to the first vertical height;
- the opening and closing door 207 is used for exposing the dirt removal member 2013 and the telescopic carrying tray 206 when the second telescopic assembly 203 slides to the first vertical height.
- the second telescopic link 2031 will also drive the second lifting valve body 2032 to slide from the second vertical height to the first vertical height, that is, the second lifting valve body 2032 returns to the higher/lower Storage space for swing gate valves.
- the storage space has a switch door 207.
- the switch door 207 By opening the switch door 207, the dirt removal part 2013 and the telescopic carrier tray 206 can be exposed, thereby replacing the dirt removal part 2013, cleaning the telescopic carrier tray 206, and improving the efficiency of subsequent cleaning.
- close the opening and closing door 207 and slide the first telescopic link 2021 from the second vertical height to the first vertical height, thereby restoring the communication between the vacuum chamber and the swing door valve, and completing the cleaning process.
- the door valve device 20 also includes an air pump assembly 208;
- the air pump assembly 208 is used to extract part of the dirt generated during the cleaning process of the swing gate valve by the cleaning assembly 201;
- the air pump assembly 208 includes an air pump 2081, a switch valve 2082 and a filter screen 2083.
- the air pump 2081 is connected to the closed chamber through a pipeline, and the switch valve 2082 and the filter screen 2083 are arranged on the end of the pipeline close to the closed chamber.
- the opening of the vacuum chamber close to the swing gate valve is in a closed state, the cavity formed between the first lifting assembly 202 and the swing gate valve.
- the door valve device 20 further includes an air pump assembly 208 .
- an air pump assembly 208 can extract the closed chamber, so that most of the removed dirt will be sucked away, and a small part Will fall into the telescopic carrier tray 206.
- Air pump assembly 208 comprises air pump 2081, switch valve 2082 and filter screen 2083, and filter screen 2083 is to avoid large particle dirt to block air pump assembly, and switch valve 2082 is used for controlling whether air pump communicates with this closed chamber, avoids the vacuum state of vacuum chamber
- the air pump 2081 is affected in the non-operating state of the gate valve device 20 .
- the air pump 2081 includes various types such as a dry pump and the like.
- the force of the micro propeller 2012 is less than or equal to the first threshold, and the signal response time of the first lift assembly 202 and the second lift assembly 203 is less than or equal to the second threshold.
- the force of the micro-propeller 2012 is less than or equal to the first threshold, preferably 2 Newtons.
- the gate valve device 20 can be designed manually or signal-controlled.
- the door valve device 20 is controlled by signals, in one embodiment, the first lifting assembly 202, the second lifting assembly 203, the micro thruster 2012, the chute 2011, the telescopic carrier plate 206, the air pump 2081, the safety pin 204, etc. Set to electric.
- the signal response time of these devices must be less than or equal to the second threshold, preferably 1 second.
- Dirt remover 2013 needs to choose unbreakable, such as sponge, steel wire, brush, etc., preferably hard sponge, under the premise of unbreakable, hard sponge has good cleaning power, low cost and will not damage the small door panel.
- unbreakable such as sponge, steel wire, brush, etc.
- the above devices can be replaced by other devices with similar functions, or other devices can be added on the basis of the above.
- detergent storage for example, detergent storage, detergent spray, distilled water tank, etc.
- the swing gate valve near the vacuum chamber side is not easy to clean, and the whole machine needs to stop working and then be removed for cleaning. , which leads to the fact that the swing gate valve near the vacuum chamber side cannot be cleaned during the maintenance of ordinary machines, and if it is not cleaned for a long time, it may cause the swing gate valve near the vacuum chamber side to have deposits on it, which will eventually affect the yield of the product.
- a new type of door panel that is, a door valve device, is installed on the side of the vacuum chamber, so that the machine can be cleaned without removing the swing door valve during machine maintenance, and the door panel can be easily cleaned during machine maintenance. , Increase product yield.
- the gate valve device is more flexible, and the staff can lower the first telescopic link in the gate valve device to the bottom during chamber maintenance until the safety pin of the first telescopic link passes through the small telescopic link inside. Inserting into the safety pin slot plays the role of secondary locking; then, after the first telescopic link is completed, the second telescopic link drives the cleaning component to automatically clean the side of the swing gate valve close to the vacuum chamber. In this way, there is no need to shut down the whole machine to clean the swing gate valve, and it can be cleaned together during the maintenance of the chamber.
- the gate valve device itself is an independent micro system with strong independence, which can be cleaned and maintained at any time, and does not need to be installed in the chamber. Clean it during maintenance or maintenance of the whole machine.
- the embodiments of the present application provide a gate valve device, cleaning method and mechanical equipment, the gate valve device is installed in the mechanical equipment including a vacuum chamber and a process chamber, a swing gate valve is arranged between the vacuum chamber and the process chamber, and The gate valve device is arranged on the opening of the vacuum chamber near the side of the swing gate valve; the gate valve device includes a cleaning component, a first lifting component and a second lifting component, and the cleaning component is arranged on the second lifting component; wherein, the first lifting component, It is used to control whether the opening of the vacuum chamber close to the swing gate valve is in a closed state; the second lifting component is used to control the cleaning component to clean the swing gate valve when the opening of the vacuum chamber close to the swing gate valve is in a closed state. Clean up.
- the vacuum on one side of the vacuum chamber can be isolated by the first lifting component, so that the swing gate valve can be cleaned during the operation of the equipment, and equipment damage caused by frequent downtime can be avoided; the swing gate valve can be automatically cleaned by the second lift component.
- the cleaning process does not need to be disassembled for cleaning, which improves the cleaning efficiency; in addition, because the swing gate valve can be easily cleaned through the gate valve device, the cleanliness of the product is improved, thereby improving the operating efficiency of the overall equipment.
- FIG. 5 shows a schematic structural diagram of a cleaning method provided in an embodiment of the present application.
- the method may include:
- S301 Control the opening of the vacuum chamber on the side close to the swing gate valve to be in a closed state through the first lifting assembly.
- S302 Cleaning the swing gate valve by controlling the cleaning component through the second lifting component.
- the cleaning method provided in the embodiment of the present application is applied to a semiconductor etching machine.
- a semiconductor etching machine includes a process chamber and a vacuum chamber, and a swing gate valve is arranged between the process chamber and the vacuum chamber.
- a swing gate valve is arranged between the process chamber and the vacuum chamber.
- a gate valve device is installed in the semiconductor etching machine, so that the surface of the swing gate valve on the side close to the vacuum chamber is conveniently cleaned by using the gate valve device.
- the cleaning method provided by the embodiment of the present application is applied to the gate valve device, the gate valve device is installed in the mechanical equipment including the vacuum chamber and the process chamber, a swing gate valve is provided between the vacuum chamber and the process chamber, and the gate valve The device is arranged at the opening of the vacuum chamber near the side of the swing gate valve; the gate valve device includes a cleaning component, a first lifting component and a second lifting component, and the cleaning component is arranged on the second lifting component.
- the opening of the vacuum chamber close to the swing door valve is controlled by the first lifting assembly to be in a closed state to isolate the vacuum environment on the side of the vacuum chamber; secondly, the second lifting assembly controls The cleaning component cleans the swing gate valve.
- the gate valve device can be used to clean the swing gate valve at random without stopping the overall semiconductor etching machine, which is simple and convenient, and thus avoids affecting the cleanliness of the product.
- first elevating assembly and the second elevating assembly can use power components of various principles, and only the telescopic link will be used for illustration below.
- the first lift assembly includes a first telescoping link and a first lift valve body.
- controlling the opening of the vacuum chamber close to the side of the swing gate valve to be in a closed state through the first lifting assembly may include:
- the first lift valve body is driven to slide from the first vertical height to the second vertical height by using the first telescopic link, so as to control the opening of the vacuum chamber close to the side of the swing gate valve to be in a closed state.
- the first lift assembly is composed of a first telescopic link and a first lift valve body, and the first telescopic link can drive the first lift valve body to slide from the first vertical height to the second vertical height, thereby isolating the vacuum Vacuum on chamber side.
- the first telescopic link can be an air pressure component, a hydraulic component, etc., and the first vertical height can be lower than the second vertical height, or the first vertical height can also be higher than the second vertical height.
- a locking mechanism may be provided additionally, so as to ensure that the first lifting assembly will not slide accidentally when isolating the vacuum on the side of the vacuum chamber.
- the door valve assembly further includes a safety pin and a safety slot; the method may further include:
- the safety pin is inserted into the safety slot to lock the first lift valve body.
- the second lifting assembly includes a second telescopic link and a second lifting valve body, and the cleaning assembly includes a dirt removal member, a chute, and a micro pusher; therefore, in some embodiments, the second lifting assembly controls Cleaning kits clean swing gate valves and can include:
- the chute is used to control the movement of the dirt removal member in the vertical direction, so as to clean the swing gate valve.
- the second telescopic link is used to drive the second lift valve body to slide to the height where the swing gate valve is located, so that the cleaning component and the swing gate valve are in the same height range ; Then, use the micro-propeller to control the movement of the dirt removal part in the horizontal direction until the dirt removal part touches the swing gate valve; finally, use the chute to control the movement of the dirt removal part in the vertical direction to clean the swing gate valve.
- the door valve device also includes a telescopic carrying plate and a switch door. Therefore, in some embodiments, after the swing gate valve is cleaned by controlling the cleaning assembly through the second lifting assembly, the method may further include:
- the telescopic bearing tray is used to accommodate part of the dirt generated during the cleaning process of the swing gate valve by the cleaning component.
- a telescopic carrying plate is also provided under the dirt removing part, so that part of the dirt generated by the dirt removing part during the cleaning process is collected by the telescopic carrying plate.
- the door valve device also includes an air pump assembly. Therefore, in some embodiments, the method may also include:
- the air pump component is used to extract part of the dirt generated during the cleaning process.
- a closed chamber is actually formed between the first lifting valve body and the swing gate valve, and an air pump can be provided for the closed chamber.
- an air pump can be provided for the closed chamber.
- the integral gate valve device can be set to be manual or electric, preferably electronically controlled.
- the force of the micro-propeller is less than or equal to the first threshold; the signal response time of the first lifting assembly and the second lifting assembly is less than or equal to the second threshold.
- the first threshold is 2 Newtons and the second threshold is 1 second.
- FIG. 6 shows an application scene diagram of the cleaning method provided by the embodiment of the present application.
- this cleaning method is applied to the gate valve device, in particular, the vacuum chamber in Figure 6 is only a part, and the cleaning process includes the following steps:
- the second lifting assembly 203 descends.
- the second lifting assembly 203 contains a cleaning assembly 201 inside.
- the cleaning assembly 201 may include a micro-propeller and a hard sponge at its front end, a small chute for assisting the sliding of the micro-propeller, and a telescopic bearing plate;
- the gate valve device provided by the embodiment of the present application itself can be regarded as an independent miniature system, it is highly independent and can be cleaned and maintained at any time, and does not need to be cleaned during chamber maintenance or complete machine maintenance.
- the embodiment of the present application provides a cleaning method, which is applied to a gate valve device, the gate valve device is installed in mechanical equipment including a vacuum chamber and a process chamber, a swing gate valve is arranged between the vacuum chamber and the process chamber, and the gate valve
- the device is arranged at the opening of the vacuum chamber near the side of the swing gate valve;
- the gate valve device includes a cleaning assembly, a first lifting assembly and a second lifting assembly, and the cleaning assembly is arranged on the second lifting assembly
- the method includes: passing the first lifting assembly The opening of the side of the control vacuum chamber close to the swing gate valve is in a closed state; the swing gate valve is cleaned by controlling the cleaning component through the second lifting component.
- the vacuum on one side of the vacuum chamber can be isolated by the first lifting component, so that the swing gate valve can be cleaned during the operation of the equipment, and equipment damage caused by frequent downtime can be avoided; the swing gate valve can be automatically cleaned by the second lift component.
- the cleaning process does not need to be disassembled for cleaning, which improves the cleaning efficiency; in addition, because the swing gate valve can be easily cleaned through the gate valve device, the cleanliness of the product is improved, thereby improving the operating efficiency of the overall equipment.
- FIG. 7 shows a schematic structural diagram of a mechanical device 30 provided in an embodiment of the present application.
- the mechanical equipment 30 includes a vacuum chamber 304 , a process chamber 301 , a swing gate valve 302 and a gate valve device 303 , and the process chamber 301 , swing gate valve 302 , gate valve device 303 and vacuum chamber 304 are arranged in sequence.
- the gate valve device 304 is the gate valve device described in any one of the foregoing embodiments, such as the gate valve device 20 .
- the vacuum on one side of the vacuum chamber can be isolated by the first lifting assembly, so that the swing gate valve can be cleaned during the operation of the equipment, avoiding frequent The equipment is damaged due to downtime; the swing gate valve can be cleaned automatically through the second lifting component without dismantling and cleaning, which improves the cleaning efficiency; in addition, because the swing gate valve can be easily cleaned through the gate valve device, the product quality is improved. Cleanliness, thereby improving the operating efficiency of the overall equipment.
- the mechanical device 30 may be a semiconductor etching machine.
- the gate valve device includes a cleaning component, a first lifting component and a second lifting component, and the cleaning component is arranged on the second lifting component; wherein, the first lifting component is used to control the vacuum chamber to be close to the swinging gate valve Whether the opening on one side is in a closed state; the second lifting component is used to control the cleaning component to clean the swinging gate valve when the opening of the vacuum chamber close to the swinging gate valve is in a closed state.
- the vacuum on one side of the vacuum chamber can be isolated by the first lifting component, and the swing gate valve can be cleaned during the operation of the equipment without stopping the working process of the mechanical equipment; the swing gate valve can be automatically cleaned by the second lift component Disposal without removing the swing gate valve for cleaning, improving cleaning efficiency.
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Abstract
本申请实施例提供了一种门阀装置、清洁方法和机械设备，该门阀装置包括清洁组件、第一升降组件和第二升降组件，且清洁组件设置在第二升降组件上；其中，第一升降组件，用于控制真空腔室靠近摇摆门阀一侧的开口是否处于封闭状态；第二升降组件，用于在真空腔室靠近摇摆门阀一侧的开口处于封闭状态的情况下，控制清洁组件对摇摆门阀进行清洁处理。这样，通过第一升降组件能够隔绝真空腔室一侧的真空，可以在设备运行过程中进行摇摆门阀的清洁，无需停止机械设备的工作进程；通过第二升降组件可以自动化的对摇摆门阀进行清洁处理，无需拆下摇摆门阀进行清洁，提高了清洁效率。
Description
相关申请的交叉引用
本申请要求在2021年07月16日提交中国专利局、申请号为202110808805.9、申请名称为“一种门阀装置、清洁方法和机械设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
本申请涉及但不限于一种门阀装置、清洁方法和机械设备。
在半导体存储器的制造工序中，需要利用半导体蚀刻机对晶圆片进行各种工艺处理。由于大部分工艺处理需要在真空环境下进行，因此半导体蚀刻机中包含真空腔室和工艺腔室，该真空腔室和工艺腔室之间通过摇摆门阀隔离。
然而，摇摆门阀靠近于真空腔室一侧的小门板是紧靠真空腔室侧壁的，如果需要对小门板进行清洁，必须要将半导体蚀刻机整体停下来，然后将小门板拆下来单独进行，给生产过程带来了极大的不便，降低了半导体蚀刻机的生产效率。
发明内容
第一方面，本申请实施例提供了一种门阀装置，该门阀装置安装在包括真空腔室和工艺腔室的机械设备中，真空腔室和工艺腔室之间设置有摇摆门阀，且门阀装置设置在真空腔室靠近摇摆门阀一侧的开口；
门阀装置包括清洁组件、第一升降组件和第二升降组件，且清洁组件设置在第二升降组件上；其中，
第一升降组件，用于控制真空腔室靠近摇摆门阀一侧的开口是否处于封闭状态；
第二升降组件，用于在真空腔室靠近摇摆门阀一侧的开口处于封闭状态的 情况下，控制清洁组件对摇摆门阀进行清洁处理。
第二方面，本申请实施例提供了一种清洁方法，应用于门阀装置，门阀装置安装在包括真空腔室和工艺腔室的机械设备中，真空腔室和工艺腔室之间设置有摇摆门阀，且门阀装置设置在真空腔室靠近摇摆门阀一侧的开口；门阀装置包括清洁组件、第一升降组件和第二升降组件，且清洁组件设置在第二升降组件上，该方法包括：
通过第一升降组件控制真空腔室靠近摇摆门阀一侧的开口处于封闭状态；
通过第二升降组件控制清洁组件对摇摆门阀进行清洁处理。
第三方面，本申请实施例提供了一种机械设备，该机械设备包括真空腔室、工艺腔室、摇摆门阀和如第一方面的门阀装置。
图1为相关技术提供的一种半导体蚀刻机的结构示意图；
图2为相关技术提供的一种半导体蚀刻机的局部结构示意图；
图3为本申请实施例提供的一种门阀装置的结构示意图；
图4A为本申请实施例中提供的一种门阀装置的侧视结构示意图
图4B为本申请实施例中提供的一种门阀装置的正视结构示意图
图5为本申请实施例提供的一种清洁方法的结构示意图
图6为本申请实施例提供的清洁方法的应用场景图；
图7为本申请实施例提供的一种机械设备的结构示意图。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。可以理解的是，此处所描述的具体实施例仅仅用于解释相关申请，而非对该申请的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与有关申请相关的部分。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术 领域的技术人员通常理解的含义相同。本文中所使用的术语只是为了描述本申请实施例的目的，不是旨在限制本申请。
在以下的描述中，涉及到“一些实施例”，其描述了所有可能实施例的子集，但是可以理解，“一些实施例”可以是所有可能实施例的相同子集或不同子集，并且可以在不冲突的情况下相互结合。
需要指出，本申请实施例所涉及的术语“第一\第二\第三”仅是用于区别类似的对象，不代表针对对象的特定排序，可以理解地，“第一\第二\第三”在允许的情况下可以互换特定的顺序或先后次序，以使这里描述的本申请实施例能够以除了在这里图示或描述的以外的顺序实施。
在半导体存储器的制造工序中，需要利用半导体蚀刻机到对晶圆片进行各种工艺处理。由于大部分工艺处理需要在真空气氛下进行，因此半导体蚀刻机中包含真空腔室和工艺腔室，该真空腔室和工艺腔室之间通过摇摆门阀隔离。
参见图1，其示出了相关技术提供的一种半导体蚀刻机的结构示意图。如图1所示，半导体蚀刻机10包括真空腔室101和多个工艺腔室102，例如图1中的工艺腔室B、工艺腔室C、工艺腔室D，每个工艺腔室102均通过摇摆门阀103与真空腔室101连接。
参见图2，其示出了相关技术提供的一种半导体蚀刻机的局部结构示意图。如图2所示，在腔室保养的时候，靠近工艺腔室102(也称为Chamber)一侧的小门板1032比较容易的可以进行清洁，但是靠近真空腔室101(也称为VTM)侧的小门板1031的位置紧贴VTM侧壁，所以小门板1031的位置就清洁不到，如果要清洁小门板1031就要整机停下来去拆小门板1031下来清洁。
然而，在相关技术中，通过拆下小门板进行清洁的方法非常不方便，而且如果宕机时间太多，半导体蚀刻机的产量会明显减少；但是，如果长时间不清洁靠近真空腔室侧的小门板，那么还会对产品的质量有影响，尤其对那些要求清洁度较高的产品影响很大。
基于此，本申请实施例提供了一种门阀装置，基本思想是：门阀装置安装在包括真空腔室和工艺腔室的机械设备中，真空腔室和工艺腔室之间设置有摇 摆门阀，且门阀装置设置在真空腔室靠近摇摆门阀一侧的开口；该门阀装置包括清洁组件、第一升降组件和第二升降组件，且清洁组件设置在第二升降组件上；其中，第一升降组件，用于控制真空腔室靠近摇摆门阀一侧的开口是否处于封闭状态；第二升降组件，用于在真空腔室靠近摇摆门阀一侧的开口处于封闭状态的情况下，控制清洁组件对摇摆门阀进行清洁处理。这样，通过第一升降组件能够隔绝真空腔室一侧的真空，从而可以在设备运行过程中进行摇摆门阀的清洁，避免经常宕机导致设备损坏；通过第二升降组件可以自动化的对摇摆门阀进行清洁处理，无需拆下清洁，提高了清洁效率；另外，由于通过该门阀装置能够方便地对摇摆门阀进行清洁，提高了产品洁净性，从而提高了整体设备的运行效率。
下面将结合附图对本申请各实施例进行详细说明。
在本申请的一实施例中，参见图3，其示出了本申请实施例提供的一种门阀装置20的结构示意图。如图3所示，该门阀装置20安装在包括真空腔室和工艺腔室的机械设备中，真空腔室和工艺腔室之间设置有摇摆门阀，且门阀装置设置在真空腔室靠近摇摆门阀一侧的开口；
门阀装置20包括清洁组件201、第一升降组件202和第二升降组件203，且清洁组件201设置在第二升降组件203上；其中，
第一升降组件202，用于控制真空腔室靠近摇摆门阀一侧的开口是否处于封闭状态；
第二升降组件203，用于在真空腔室靠近摇摆门阀一侧的开口处于封闭状态的情况下，控制清洁组件201对摇摆门阀进行清洁处理。
需要说明的是，本申请实施例中提供的门阀装置20应用于机械设备，机械设备可以是诸如半导体蚀刻机。如图1和图2所示，该机械设备包括真空腔室101和工艺腔室102，真空腔室101的内部为真空状态，工艺腔室102为发生蚀刻反应的腔室。在真空腔室101和工艺腔室102之间设置有摇摆门阀103，用于控制真空腔室101是否与工艺腔室102连通。
在此基础上，参见图4A，其示出了本申请实施例中提供的一种门阀装置的侧视结构示意图。参见图4B，其示出了本申请实施例中提供的一种门阀装置的正视结构示意图。如图4A和图4B所示，门阀装置20设置在真空腔室靠近摇摆门阀一侧的开口。具体地，门阀装置20包括第一升降组件202和第二升降组件203，且第二升降组件203上设置有清洁组件201。该门阀装置20在工作时，第一升降组件202通过下降可以控制真空腔室靠近摇摆门阀一侧的开口处于封闭状态，从而隔绝真空腔室侧的真空；然后，第二升降组件203控制清洁组件201对摇摆门阀进行清洁工作。应理解，在其他实施例中，第一升降组件202也可以通过上升隔绝真空腔室侧的真空。
这样，在机械设备的运行过程中，虽然真空腔室中一直为真空状态，但是由于第一升降组件202可以隔绝真空腔室侧的真空，从而第二升降组件203可以控制清洁组件201对摇摆门阀靠近真空腔室一侧的门板进行清洁。这样，在机械设备的运行过程中可以方便地对摇摆门阀进行清洁，无需将机械设备停下来然后拆下摇摆门阀进行清洁，避免机械设备因经常宕机而损坏，同时提高了产品洁净性，提高了生产效率。
第一升降组件202和第二升降组件203可以采用多种原理的动力零件，以下仅以伸缩连杆进行具体说明。
请参见图4A，在一些实施例中，第一升降组件202包括第一伸缩连杆2021和第一升降阀体2022，且第一伸缩连杆2021用于驱动第一升降阀体2022在第一垂直高度和第二垂直高度之间滑动。
第一升降组件202，具体用于在第一升降阀体2022滑动到第一垂直高度的情况下，控制真空腔室靠近摇摆门阀一侧的开口处于开启状态；或者在第一升降阀体滑动到第二垂直高度的情况下，控制真空腔室靠近摇摆门阀一侧的开口处于封闭状态。
需要说明的是，第一升降组件202可以是伸缩阀门的形式。因此，第一升降组件202包括第一伸缩连杆2021和第一升降阀体2022。第一伸缩连杆2021为动力件，例如液压件、气压件等，第一伸缩连杆2021可以驱动第一升降阀体 2022在第一垂直高度和第二垂直高度之间滑动。
在第一升降阀体2022在第一垂直高度时，真空腔室靠近摇摆门阀一侧的开口处于开启状态，在第二升降阀体2021在第二垂直高度时，第二升降阀体2021将真空腔室靠近摇摆门阀一侧的开口完全封闭，从而隔绝真空腔室一侧的真空。
在这里，第一垂直高度可以高于第二垂直高度，或者第一垂直高度可以低于第二垂直高度。换句话说，对于机械设备而言，需要为门阀装置20单独设置有一个高于摇摆门阀或者低于摇摆门阀的空间，从而在无需关闭真空腔室靠近摇摆门阀一侧的开口时容纳第一升降阀体2022。
进一步地，在一些实施例中，门阀装置20还包括安全销204和安全插槽205，安全销204设置在第一升降阀体2022上，安全插槽205设置在门阀装置20的底部；
安全销204，用于当第一升降阀体2022滑动到第二垂直高度时插入安全插槽205，以锁定第一升降阀体2022。
需要说明的是，为了提高安全性，还可以为第一升降阀体2022设置锁定机构。以第一垂直高度高于第二垂直高度为例，此时第一升降阀体2022需要下降以关闭真空腔室靠近摇摆门阀一侧的开口。此时，可以在第一升降阀体2022设置安全销204，同时与第一升降阀体2022相对的设备底部设置安全插槽205，从而第一升降阀体2022下降后，安全销204将插入安全插槽205中，从而实现锁定，避免第一升降阀体2022由于外力或其他原因以外上升，导致设备损坏。
应理解，安全销204也可以额外连接一个小的伸缩连杆，从而自动化控制安全销204与安全插槽205的锁定和解锁动作。
类似地，第二升降组件203包括第二伸缩连杆2031和第二升降阀体2032，且清洁组件201设置在第二升降阀体2032上；
第二伸缩连杆2031，用于驱动第二升降阀体2032从第一垂直高度滑动到第二垂直高度，以使得清洁组件201和摇摆门阀处于同一高度范围内。
需要说明的是，第二升降组件203包括第二伸缩连杆2031和第二升降阀体2032，且清洁组件201设置在第二升降阀体2032上。
在这里，第二伸缩连杆2031和第一伸缩连杆2021可以是相同原理的动力件，也可以不同。第二伸缩连杆2031用于带动第二升降阀体2032从第一垂直高度滑动到第二垂直高度，以使得清洁组件201和摇摆门阀处于同一高度范围内。
换句话说，在门阀装置20的非工作状态下，第一升降阀体2022和第二升降阀体2032其实是隐藏于高于摇摆门阀/低于摇摆门阀的封闭空间内的，从而不会影响真空腔室和工艺腔室之间的连通/隔绝状态。特别的，该空间可以设置成密闭空间，例如在该密闭空间的底部/顶部设置翻转门，在需要进行清洁时，开启翻转门，第一升降阀体先降低/升高，隔绝真空腔室侧的真空，第二升降阀体2032后降低/升高，从而控制清洁组件201与待清洁的摇摆门阀处于同一高度，以便于后续进行清洁；在清洁结束后，控制第一升降阀体2022和第二升降阀体2032返回该密闭空间，从而避免门阀装置20影响半导体蚀刻机的正常工作。
特别地，第一升降阀体2022和第二升降阀体2032可以设置为相反的滑动方向，示例性的，第一升降阀体2022隐藏在高于摇摆门阀的封闭空间，而第二升降阀体2032隐藏在低于摇摆门阀的封闭空间，使用中，第一升降阀体2022需要下降，而第二升降阀体2032需要上升。
进一步地，在一些实施例中，清洁组件201包括滑槽2011、微型推进器2012和污垢去除件2013，滑槽2011设置在第二升降阀体2032上，微型推进器2012的一端设置在滑槽2011上，微型推进器2012的另一端设置有污垢去除件2013；
微型推进器2012，用于控制污垢去除件2013沿水平方向运动，以使得污垢去除件2013接触到摇摆门阀；
滑槽2011，用于在清洁组件201接触到摇摆门阀的情况下，控制污垢去除件2013沿垂直方向运动，以实现对摇摆门阀进行清洁处理。
需要说明的是，如图4A和图4B所示，清洁组件201可以包括滑槽2011、微型推进器2012和污垢去除件2013。在清洁过程开始前，在水平方向上，污垢去除件2013和摇摆门阀并不处于同一水平位置，这样能够减小第二升降组件 203下降时的阻力，同时提高污垢去除件2013的寿命。
在清洁组件201与摇摆门阀处于同一高度后，微型推进器2012驱动污垢去除件2013沿水平方向运动，直至污垢去除件2013接触到摇摆门阀靠近真空一侧的表面，即图2中的小门板1031。然后，滑槽2011驱动污垢去除件2013沿垂直方向运动，从而实现对摇摆门阀进行清洁处理。
还需要说明的是，污垢去除件2013可以是硬质海绵。
进一步地，清洁组件201还包括伸缩承载盘206，伸缩承载盘设置206在第二升降阀体2032上，且伸缩承载盘206位于污垢去除件2013的下方；其中，
伸缩承载盘206，用于收容清洁组件201对摇摆门阀进行清洁处理的过程中产生的部分污垢。
需要说明的是，污垢去除件2013在对小门板进行清洁时会产生一些污垢碎屑，为了避免污染整体机械设备，可以在污垢去除件2013的下方设置一伸缩承载盘206，从而收容污垢。在这里，伸缩承载盘可206以设置成与污垢去除件2013联动的状态，或者单独控制的状态。
进一步地，在一些实施例中，门阀装置20还包括开关门207；
第二伸缩连杆2031，还用于驱动第二升降阀体2032从第二垂直高度滑动到第一垂直高度；
开关门207，用于在第二伸缩组件203滑动到第一垂直高度的情况下，显露污垢去除件2013和伸缩承载盘206。
需要说明的是，在清洁过程结束后，第二伸缩连杆2031还会驱动第二升降阀体2032从第二垂直高度滑动到第一垂直高度，即第二升降阀体2032返回高于/低于摇摆门阀的存储空间。该存储空间具有一开关门207，通过打开开关门207，可以显露污垢去除件2013和伸缩承载盘206，从而更换污垢去除件2013、清洁伸缩承载盘206，提高后续清洁的效率。在这之后，关闭该开关门207，将第一伸缩连杆2021从第二垂直高度滑动到第一垂直高度，从而恢复真空腔室与摇摆门阀之间的连通，完成本次清洁过程。
进一步地，在一些实施例中，门阀装置20还包括气泵组件208；
气泵组件208，用于抽取清洁组件201对摇摆门阀进行清洁处理的过程中产生的部分污垢；
其中，气泵组件208包括气泵2081、开关阀2082和滤网2083，气泵2081通过管道与封闭腔室连接，开关阀2082和滤网2083设置在管道靠近封闭腔室的一端，封闭腔室是指在真空腔室靠近摇摆门阀一侧的开口处于封闭状态的情况下，第一升降组件202和摇摆门阀之间形成的腔室。
需要说明的是，如图4A和图4B所示，门阀装置20还包括气泵组件208。在门阀装置20的清洁过程中，门阀装置20摇摆门阀之间其实形成了一个封闭腔室，气泵组件208可以对该封闭腔室进行抽取，从而被去除的污垢大部分会被抽取离开，少部分会落入伸缩承载盘206中。
气泵组件208包括气泵2081、开关阀2082和滤网2083，滤网2083是为了避免大颗粒污垢堵塞气泵组件，开关阀2082用于控制气泵是否与该封闭腔室连通，避免真空腔室的真空状态在门阀装置20的非工作状态下影响到气泵2081。在这里，气泵2081包括多种类型，如干泵等。
进一步地，在一些实施例中，微型推进器2012的作用力小于或等于第一阈值，第一升降组件202和第二升降组件203的信号响应时间小于或等于第二阈值。
需要说明的是，微型推进器2012的作用力小于或等于第一阈值，优选为2牛顿。
门阀装置20可以设计成手动的或者信号控制的。当门阀装置20是信号控制的，在一个实施例中，第一升降组件202、第二升降组件203、微型推进器2012、滑槽2011、伸缩承载盘206、气泵2081、安全销204等可以均设置成电动的。考虑到清洁过程的效率问题，这些器件的信号响应时间必须小于或等于第二阈值，优选为1秒。
污垢去除件2013需要选择不易破损的，例如海绵、钢丝、毛刷等，优选为硬质海绵，在不易破损的前提下，硬质海绵清洁力好、成本低且不会损伤小门板。
特别地，根据实际应用场景，以上器件均可以利用功能相似的其他器件进行替换，或者在以上基础上增加其他器件。例如，清洁剂存储件、清洁剂喷洒件、蒸馏水水箱等。
综上，在相关技术提供的半导体蚀刻机的传送区域，即工艺腔室和真空腔室之间，靠近真空腔室侧的摇摆门阀不易清洁，需要整机停止工作然后将其拆下才能进行清洁，这导致普通机台保养的时候清洁不到靠近真空腔室侧的摇摆门阀，而且长时间不清洁可能会导致靠近真空腔室侧的摇摆门阀产生附着物在上面，最终影响产品的良率。在申请实施例中，在真空腔室一侧，加装一个新型门板，即门阀装置，从而机台保养的时候无需拆下摇摆门阀即可进行清洁，能够方便地在机台保养的时候清洁门板，增加产品良率。
具体地，门阀装置灵活性较强，工作人员可以在腔室保养的时候，将门阀装置中的第一伸缩连杆下降到底部，直至第一伸缩连杆的安全销通过内部的小伸缩连杆插入安全销插槽，起到二次锁定的作用；然后，在第一伸缩连杆动作完成后，第二伸缩连杆带动清洁组件对摇摆门阀靠近真空腔室的一侧进行自动清洁。这样，无需宕整机下来进行摇摆门阀的清洁，在腔室保养的时候一起清洁就可以了，门阀装置本身是一个独立的微型系统，独立性很强，可以随时清洁保养，并不用在腔室保养或者整机保养的时候再清洁。
本申请实施例提供了一种门阀装置、清洁方法和机械设备，该门阀装置安装在包括真空腔室和工艺腔室的机械设备中，真空腔室和工艺腔室之间设置有摇摆门阀，且门阀装置设置在真空腔室靠近摇摆门阀一侧的开口；该门阀装置包括清洁组件、第一升降组件和第二升降组件，且清洁组件设置在第二升降组件上；其中，第一升降组件，用于控制真空腔室靠近摇摆门阀一侧的开口是否处于封闭状态；第二升降组件，用于在真空腔室靠近摇摆门阀一侧的开口处于封闭状态的情况下，控制清洁组件对摇摆门阀进行清洁处理。这样，通过第一升降组件能够隔绝真空腔室一侧的真空，从而可以在设备运行过程中进行摇摆门阀的清洁，避免经常宕机导致设备损坏；通过第二升降组件可以自动化的对摇摆门阀进行清洁处理，无需拆下清洁，提高了清洁效率；另外，由于通过该 门阀装置能够方便地对摇摆门阀进行清洁，提高了产品洁净性，从而提高了整体设备的运行效率。
在本申请的另一实施例中，参见图5，其示出了本申请实施例提供的一种清洁方法的结构示意图。如图5所示，该方法可以包括：
S301：通过第一升降组件控制真空腔室靠近摇摆门阀一侧的开口处于封闭状态。
S302：通过第二升降组件控制清洁组件对摇摆门阀进行清洁处理。
需要说明的是，本申请实施例提供的清洁方法应用于半导体刻蚀机。
在相关技术中，半导体蚀刻机中包括工艺腔室和真空腔室，且工艺腔室和真空腔室之间设置有摇摆门阀，在清洁摇摆门阀在靠近真空腔室一侧的表面时，需要让整体半导体蚀刻机停止工作，然后拆下摇摆门阀进行清洁，复杂度较高。
在本申请实施例中，在半导体蚀刻机中加装了一门阀装置，从而利用该门阀装置方便地对摇摆门阀在靠近真空腔室一侧的表面进行清洁。换句话说，本申请实施例提供的清洁方法应用于门阀装置，门阀装置安装在包括真空腔室和工艺腔室的机械设备中，真空腔室和工艺腔室之间设置有摇摆门阀，且门阀装置设置在真空腔室靠近摇摆门阀一侧的开口；门阀装置包括清洁组件、第一升降组件和第二升降组件，且清洁组件设置在第二升降组件上。
基于这样的结构，在进行清洁时，首先，通过第一升降组件控制真空腔室靠近摇摆门阀一侧的开口处于封闭状态，以隔绝真空腔室侧的真空环境；其次，通过第二升降组件控制清洁组件对摇摆门阀进行清洁处理。这样，不需要使整体半导体蚀刻机停止工作，可以随机利用门阀装置对摇摆门阀进行清洁，简单方便，进而避免影响产品洁净度。
还需要说明的是，第一升降组件和第二升降组件可以通过多种原理的动力零件，以下仅以伸缩连杆进行说明。
在一些实施例中，第一升降组件包括第一伸缩连杆和第一升降阀体。相应地，所述通过第一升降组件控制真空腔室靠近摇摆门阀一侧的开口处于封闭状 态，可以包括：
利用第一伸缩连杆驱动第一升降阀体从第一垂直高度滑动到第二垂直高度，以控制真空腔室靠近摇摆门阀一侧的开口处于封闭状态。
需要说明的是，第一升降组件由第一伸缩连杆和第一升降阀体构成，第一伸缩连杆能够驱动第一升降阀体从第一垂直高度滑动到第二垂直高度，从而隔绝真空腔室侧的真空。第一伸缩连杆可以为气压件、液压件等，第一垂直高度可以低于第二垂直高度，或者第一垂直高度也可以高于第二垂直高度。
进一步地，为了更好的隔绝真空腔室侧的真空，可以额外设置锁定机构，从而保证第一升降组件在隔绝真空腔室侧的真空时不会产生意外滑动。因此，在一些实施例中，门阀装置还包括安全销和安全插槽；该方法还可以包括：
当利用第一伸缩连杆驱动第一升降阀体从第一垂直高度滑动到第二垂直高度时，将安全销插入安全插槽中，以锁定第一升降阀体。
需要说明的是，在第一升降阀体从第一垂直高度滑动到第二垂直高度时，将安全销插入安全插槽中，从而锁定第一升降阀体。
进一步地，第二升降组件包括第二伸缩连杆和第二升降阀体，清洁组件包括污垢去除件、滑槽和微型推进器；因此，在一些实施例中，所述通过第二升降组件控制清洁组件对摇摆门阀进行清洁处理，可以包括：
利用第二伸缩连杆驱动第二升降阀体从第一垂直高度滑动到第二垂直高度，以使得清洁组件和摇摆门阀处于同一高度范围内；
利用微型推进器控制污垢去除件沿水平方向运动，直至污垢去除件接触到摇摆门阀；
利用滑槽控制污垢去除件沿垂直方向运动，以实现对摇摆门阀进行清洁处理。
需要说明的是，在利用第一升降组件隔绝真空腔室侧的真空后，利用第二伸缩连杆驱动第二升降阀体滑动到摇摆门阀所在的高度，从而清洁组件和摇摆门阀处于同一高度范围；然后，利用微型推进器控制污垢去除件沿水平方向运动，直至污垢去除件接触到摇摆门阀；最后，利用滑槽控制污垢去除件沿垂直 方向运动，以实现对摇摆门阀进行清洁处理。
进一步地，门阀装置还包括伸缩承载盘和开关门。因此，在一些实施例中，在通过第二升降组件控制清洁组件对摇摆门阀进行清洁处理之后，该方法还可以包括：
控制第二升降阀体从第二垂直高度滑动到第一垂直高度；
通过开关门显露污垢去除件和伸缩承载盘，对污垢去除件进行更换和/或对伸缩承载盘进行清理；
其中，伸缩承载盘用于收容清洁组件对摇摆门阀进行清洁处理的过程中产生的部分污垢。
需要说明的是，为了防止清洁过程中产生的污垢影响后续生产过程，在污垢去除件下方还设置有伸缩承载盘，这样污垢去除件在进行清洁过程中产生的部分污垢被伸缩承载盘收集。在清洁过程后，第二升降阀体返回第一垂直高度，然后打开门阀装置处的开关门，更换污垢去除件，和/或清理伸缩承载盘。
进一步地，门阀装置还包括气泵组件。因此，在一些实施例中，该方法还可以包括：
在清洁组件对摇摆门阀进行清洁处理的过程中，利用气泵组件抽取清洁处理的过程中产生的部分污垢。
需要说明的是，在清洁过程中，第一升降阀体和摇摆门阀之间其实形成了一个密闭腔室，可以为该密闭腔室设置一气泵。这样，在清洁过程中，可以通过气泵抽取密闭腔室的气体，从而除去清洁过程中的污垢。
还需要说明的是，整体门阀装置可以设置成手动的或者电动，优选为电控控制的。此时，考虑到清洁效率和安全性，微型推进器的作用力小于或等于第一阈值；第一升降组件和第二升降组件的信号响应时间小于或等于第二阈值。例如，第一阈值为2牛顿，第二阈值是1秒。
请参见图6，其示出了本申请实施例提供的清洁方法的应用场景图。如图6所示，该清洁方法应用于门阀装置，特别地，图6中的真空腔室仅为部分，清洁过程包括如下步骤：
S100：在工艺腔室进行保养的时候，第一升降组件202下降关闭，隔绝真空腔室侧的真空；
S200：第二升降组件203下降，第二升降组件203内部含有清洁组件201，清洁组件201可以包括微型推进器及其前端的硬质海绵、以及辅助微型推进器滑动的小滑槽、以及伸缩承载盘；
S300：当第二升降组件203中的门阀下降时，伸缩承载盘伸缩到摇摆门阀的下面，然后微型推进器伸缩到摇摆门阀的表面，特别地，微型推进器可控制作用力的大小；当微型推进器前端的硬质海绵接触到摇摆门阀表面后，控制硬质海绵沿着辅助的小滑槽上下滑动以达到清洁其表面的目的；
S400：摇摆门阀上的附着物，即污垢，会掉入可伸缩承载盘，以及黏附在硬质海绵上，剩下的微量附着物会被干泵(图中未示出)抽走；
S500：当清洁完毕后，微型推进器和可伸缩承载盘会退回第二升降组件内，并随着第二升降组件203上升，然后通过可开关门更换硬质海绵/清理伸缩承载盘。
这样，由于本申请实施例提供的门阀装置本身可以看作是一个独立的微型系统，独立性很强，可以随时清洁保养，并不用在腔室保养或者整机保养的时候再清洁。
本申请实施例提供了一种清洁方法，应用于门阀装置，该门阀装置安装在包括真空腔室和工艺腔室的机械设备中，真空腔室和工艺腔室之间设置有摇摆门阀，且门阀装置设置在真空腔室靠近摇摆门阀一侧的开口；门阀装置包括清洁组件、第一升降组件和第二升降组件，且清洁组件设置在第二升降组件上，该方法包括：通过第一升降组件控制真空腔室靠近摇摆门阀一侧的开口处于封闭状态；通过第二升降组件控制清洁组件对摇摆门阀进行清洁处理。这样，通过第一升降组件能够隔绝真空腔室一侧的真空，从而可以在设备运行过程中进行摇摆门阀的清洁，避免经常宕机导致设备损坏；通过第二升降组件可以自动化的对摇摆门阀进行清洁处理，无需拆下清洁，提高了清洁效率；另外，由于通过该门阀装置能够方便地对摇摆门阀进行清洁，提高了产品洁净性，从而提 高了整体设备的运行效率。
在又一种实施例中，参见图7，其示出了本申请实施例提供的一种机械设备30的结构示意图。该机械设备30包括真空腔室304、工艺腔室301、摇摆门阀302和门阀装置303，且工艺腔室301、摇摆门阀302、门阀装置303和真空腔室304依次设置。其中，门阀装置304为前述实施例中任一项所述的门阀装置，比如门阀装置20。
如图7所示，对于机械设备30来说，由于其包括门阀装置303，通过第一升降组件能够隔绝真空腔室一侧的真空，从而可以在设备运行过程中进行摇摆门阀的清洁，避免经常宕机导致设备损坏；通过第二升降组件可以自动化的对摇摆门阀进行清洁处理，无需拆下清洁，提高了清洁效率；另外，由于通过该门阀装置能够方便地对摇摆门阀进行清洁，提高了产品洁净性，从而提高了整体设备的运行效率。
在一个实施例中，该机械设备30可以为半导体蚀刻机。
以上，仅为本申请的较佳实施例而已，并非用于限定本申请的保护范围。
需要说明的是，在本申请中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
上述本申请实施例序号仅仅为了描述，不代表实施例的优劣。
本申请所提供的几个方法实施例中所揭露的方法，在不冲突的情况下可以任意组合，得到新的方法实施例。
本申请所提供的几个产品实施例中所揭露的特征，在不冲突的情况下可以任意组合，得到新的产品实施例。
本申请所提供的几个方法或设备实施例中所揭露的特征，在不冲突的情况下可以任意组合，得到新的方法实施例或设备实施例。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。
在本申请实施例中，门阀装置包括清洁组件、第一升降组件和第二升降组件，且清洁组件设置在第二升降组件上；其中，第一升降组件，用于控制真空腔室靠近摇摆门阀一侧的开口是否处于封闭状态；第二升降组件，用于在真空腔室靠近摇摆门阀一侧的开口处于封闭状态的情况下，控制清洁组件对摇摆门阀进行清洁处理。这样，通过第一升降组件能够隔绝真空腔室一侧的真空，可以在设备运行过程中进行摇摆门阀的清洁，无需停止机械设备的工作进程；通过第二升降组件可以自动化的对摇摆门阀进行清洁处理，无需拆下摇摆门阀进行清洁，提高了清洁效率。
Claims (15)
- 一种门阀装置，安装在包括真空腔室和工艺腔室的机械设备中，所述真空腔室和所述工艺腔室之间设置有摇摆门阀，且所述门阀装置设置在所述真空腔室靠近所述摇摆门阀一侧的开口；所述门阀装置包括清洁组件、第一升降组件和第二升降组件，且所述清洁组件设置在所述第二升降组件上；其中，所述第一升降组件，用于控制所述真空腔室靠近所述摇摆门阀一侧的开口是否处于封闭状态；所述第二升降组件，用于在所述真空腔室靠近所述摇摆门阀一侧的开口处于封闭状态的情况下，控制所述清洁组件对所述摇摆门阀进行清洁处理。
- 根据权利要求1所述的门阀装置，其中，所述第一升降组件包括第一伸缩连杆和第一升降阀体，且所述第一伸缩连杆用于驱动所述第一升降阀体在第一垂直高度和第二垂直高度之间滑动；所述第一升降组件，具体用于在所述第一升降阀体滑动到所述第一垂直高度的情况下，控制所述真空腔室靠近所述摇摆门阀一侧的开口处于开启状态；或者在所述第一升降阀体滑动到第二垂直高度的情况下，控制所述真空腔室靠近所述摇摆门阀一侧的开口处于封闭状态。
- 根据权利要求2所述的门阀装置，所述门阀装置还包括安全销和安全插槽，所述安全销设置在所述第一升降阀体上，所述安全插槽设置在所述门阀装置的底部；所述安全销，用于当所述第一升降阀体滑动到所述第二垂直高度时插入所述安全插槽，以锁定所述第一升降阀体。
- 根据权利要求1所述的门阀装置，其中，所述第二升降组件包括第二伸缩连杆和第二升降阀体，且所述清洁组件设置在所述第二升降阀体上；所述第二伸缩连杆，用于驱动所述第二升降阀体从第一垂直高度滑动到第二垂直高度，以使得所述清洁组件和所述摇摆门阀处于同一高度范围内。
- 根据权利要求4所述的门阀装置，其中，所述清洁组件包括滑槽、微型推进器和污垢去除件，所述滑槽设置在所述升降阀体上，所述微型推进器的一端设置在所述滑槽上，所述微型推进器的另一端设置有所述污垢去除件；所述微型推进器，用于控制所述污垢去除件沿水平方向运动，以使得所述污垢去除件接触到所述摇摆门阀；所述滑槽，用于在所述清洁组件接触到所述摇摆门阀的情况下，控制所述污垢去除件沿垂直方向运动，以实现对所述摇摆门阀进行清洁处理。
- 根据权利要求5所述的门阀装置，其中，所述清洁组件还包括伸缩承载盘，所述伸缩承载盘设置在所述第二升降阀体上，且所述伸缩承载盘位于所述污垢去除件的下方；其中，所述伸缩承载盘，用于收容所述清洁组件对所述摇摆门阀进行清洁处理的过程中产生的部分污垢。
- 根据权利要求6所述的门阀装置，所述门阀装置还包括开关门；所述第二伸缩连杆，还用于驱动所述第二升降阀体从所述第二垂直高度滑动到所述第一垂直高度；所述开关门，用于在所述第二伸缩组件滑动到所述第一垂直高度的情况下，显露所述污垢去除件和所述伸缩承载盘。
- 根据权利要求1至7任一项所述的门阀装置，所述门阀装置还包括气泵组件；所述气泵组件，用于抽取所述清洁组件对所述摇摆门阀进行清洁处理的过程中产生的部分污垢；其中，所述气泵组件包括气泵、开关阀和滤网，所述气泵通过管道与封闭腔室连接，所述开关阀和所述滤网设置在所述管道靠近所述封闭腔室的一端，所述封闭腔室是指在所述真空腔室靠近所述摇摆门阀一侧的开口处于封闭状态的情况下，所述第一升降组件和所述摇摆门阀之间形成的腔室。
- 一种清洁方法，应用于门阀装置，所述门阀装置安装在包括真空腔室和工艺腔室的机械设备中，所述真空腔室和所述工艺腔室之间设置有摇摆门阀， 且所述门阀装置设置在所述真空腔室靠近所述摇摆门阀一侧的开口；所述门阀装置包括清洁组件、第一升降组件和第二升降组件，且所述清洁组件设置在所述第二升降组件上，所述方法包括：通过所述第一升降组件控制所述真空腔室靠近所述摇摆门阀一侧的开口处于封闭状态；通过第二升降组件控制所述清洁组件对所述摇摆门阀进行清洁处理。
- 根据权利要求9所述的清洁方法，其中，所述第一升降组件包括第一伸缩连杆和第一升降阀体；所述通过所述第一升降组件控制所述真空腔室靠近所述摇摆门阀一侧的开口处于封闭状态，包括：利用所述第一伸缩连杆驱动所述第一升降阀体从第一垂直高度滑动到第二垂直高度，以控制所述真空腔室靠近所述摇摆门阀一侧的开口处于封闭状态。
- 根据权利要求10所述的清洁方法，其中，所述门阀装置还包括安全销和安全插槽；所述方法还包括：当所述利用所述第一伸缩连杆驱动所述第一升降阀体从第一垂直高度滑动到第二垂直高度时，将所述安全销插入所述安全插槽中，以锁定所述第一升降阀体。
- 根据权利要求9所述的清洁方法，其中，所述第二升降组件包括第二伸缩连杆和第二升降阀体，所述清洁组件包括污垢去除件、滑槽和微型推进器；所述通过第二升降组件控制所述清洁组件对所述摇摆门阀进行清洁处理，包括：利用所述第二伸缩连杆驱动所述第二升降阀体从第一垂直高度滑动到第二垂直高度，以使得所述清洁组件和所述摇摆门阀处于同一高度范围内；利用所述微型推进器控制所述污垢去除件沿水平方向运动，直至所述污垢去除件接触到所述摇摆门阀；利用所述滑槽控制所述污垢去除件沿垂直方向运动，以实现对所述摇摆门阀进行清洁处理。
- 根据权利要求12所述的清洁方法，其中，所述门阀装置还包括伸缩承载盘和开关门；在所述通过第二升降组件控制所述清洁组件对所述摇摆门阀进行清洁处理之后，所述方法还包括：控制所述第二升降阀体从所述第二垂直高度滑动到所述第一垂直高度；通过所述开关门显露所述污垢去除件和所述伸缩承载盘，对所述污垢去除件进行更换和/或对所述伸缩承载盘进行清理；其中，所述伸缩承载盘用于收容所述清洁组件对所述摇摆门阀进行清洁处理的过程中产生的部分污垢。
- 根据权利要求9至13任一项所述的清洁方法，其中，所述门阀装置还包括气泵组件；所述方法还包括：在所述清洁组件对所述摇摆门阀进行清洁处理的过程中，利用所述气泵组件抽取所述清洁处理的过程中产生的部分污垢。
- 一种机械设备，所述机械设备包括真空腔室、工艺腔室、摇摆门阀和如权利要求1至8任一项所述的门阀装置。
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