WO2023282217A1 - 粘着テープ - Google Patents
粘着テープ Download PDFInfo
- Publication number
- WO2023282217A1 WO2023282217A1 PCT/JP2022/026547 JP2022026547W WO2023282217A1 WO 2023282217 A1 WO2023282217 A1 WO 2023282217A1 JP 2022026547 W JP2022026547 W JP 2022026547W WO 2023282217 A1 WO2023282217 A1 WO 2023282217A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tackifier
- pressure
- sensitive adhesive
- styrene
- adhesive tape
- Prior art date
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 49
- 239000000203 mixture Substances 0.000 claims abstract description 88
- 239000000853 adhesive Substances 0.000 claims abstract description 75
- 230000001070 adhesive effect Effects 0.000 claims abstract description 70
- 239000011347 resin Substances 0.000 claims abstract description 60
- 229920005989 resin Polymers 0.000 claims abstract description 60
- 229920003048 styrene butadiene rubber Polymers 0.000 claims abstract description 41
- 150000003505 terpenes Chemical class 0.000 claims abstract description 36
- 235000007586 terpenes Nutrition 0.000 claims abstract description 36
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims abstract description 33
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 23
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 23
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 23
- 150000002148 esters Chemical class 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 239000000155 melt Substances 0.000 claims abstract description 15
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 84
- 229920001400 block copolymer Polymers 0.000 claims description 24
- 239000002174 Styrene-butadiene Substances 0.000 claims description 22
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 22
- 239000011115 styrene butadiene Substances 0.000 claims description 22
- -1 polypropylene Polymers 0.000 claims description 12
- 239000004743 Polypropylene Substances 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 229920001155 polypropylene Polymers 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 9
- 229920001971 elastomer Polymers 0.000 abstract description 7
- 239000005060 rubber Substances 0.000 abstract description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 24
- 238000000034 method Methods 0.000 description 17
- 239000003208 petroleum Substances 0.000 description 17
- 239000004014 plasticizer Substances 0.000 description 17
- 239000010410 layer Substances 0.000 description 15
- 239000000178 monomer Substances 0.000 description 13
- 239000012943 hotmelt Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000005011 phenolic resin Substances 0.000 description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 239000006096 absorbing agent Substances 0.000 description 7
- 239000003963 antioxidant agent Substances 0.000 description 7
- 125000003118 aryl group Chemical group 0.000 description 7
- 238000004898 kneading Methods 0.000 description 7
- 239000010734 process oil Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000004745 nonwoven fabric Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 229920000359 diblock copolymer Polymers 0.000 description 5
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920006132 styrene block copolymer Polymers 0.000 description 5
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 4
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 229920001083 polybutene Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 229940057995 liquid paraffin Drugs 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920006163 vinyl copolymer Polymers 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- BKUSIKGSPSFQAC-RRKCRQDMSA-N 2'-deoxyinosine-5'-diphosphate Chemical compound O1[C@H](CO[P@@](O)(=O)OP(O)(O)=O)[C@@H](O)C[C@@H]1N1C(NC=NC2=O)=C2N=C1 BKUSIKGSPSFQAC-RRKCRQDMSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- VTFXHGBOGGGYDO-UHFFFAOYSA-N 2,4-bis(dodecylsulfanylmethyl)-6-methylphenol Chemical compound CCCCCCCCCCCCSCC1=CC(C)=C(O)C(CSCCCCCCCCCCCC)=C1 VTFXHGBOGGGYDO-UHFFFAOYSA-N 0.000 description 1
- ROHFBIREHKPELA-UHFFFAOYSA-N 2-[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]prop-2-enoic acid;methane Chemical compound C.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O ROHFBIREHKPELA-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- GPZYYYGYCRFPBU-UHFFFAOYSA-N 6-Hydroxyflavone Chemical compound C=1C(=O)C2=CC(O)=CC=C2OC=1C1=CC=CC=C1 GPZYYYGYCRFPBU-UHFFFAOYSA-N 0.000 description 1
- UYQYTUYNNYZATF-UHFFFAOYSA-N 6-methyl-4,6-bis(octylsulfanylmethyl)cyclohexa-1,3-dien-1-ol Chemical compound CCCCCCCCSCC1=CC=C(O)C(C)(CSCCCCCCCC)C1 UYQYTUYNNYZATF-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 102100035474 DNA polymerase kappa Human genes 0.000 description 1
- 101710108091 DNA polymerase kappa Proteins 0.000 description 1
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- 241001649081 Dina Species 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 241000705989 Tetrax Species 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- STLLXWLDRUVCHL-UHFFFAOYSA-N [2-[1-[2-hydroxy-3,5-bis(2-methylbutan-2-yl)phenyl]ethyl]-4,6-bis(2-methylbutan-2-yl)phenyl] prop-2-enoate Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(C(C)C=2C(=C(C=C(C=2)C(C)(C)CC)C(C)(C)CC)OC(=O)C=C)=C1O STLLXWLDRUVCHL-UHFFFAOYSA-N 0.000 description 1
- IORUEKDKNHHQAL-UHFFFAOYSA-N [2-tert-butyl-6-[(3-tert-butyl-2-hydroxy-5-methylphenyl)methyl]-4-methylphenyl] prop-2-enoate Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)OC(=O)C=C)=C1O IORUEKDKNHHQAL-UHFFFAOYSA-N 0.000 description 1
- VSVVZZQIUJXYQA-UHFFFAOYSA-N [3-(3-dodecylsulfanylpropanoyloxy)-2,2-bis(3-dodecylsulfanylpropanoyloxymethyl)propyl] 3-dodecylsulfanylpropanoate Chemical compound CCCCCCCCCCCCSCCC(=O)OCC(COC(=O)CCSCCCCCCCCCCCC)(COC(=O)CCSCCCCCCCCCCCC)COC(=O)CCSCCCCCCCCCCCC VSVVZZQIUJXYQA-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- WTOOLIQYCQJDBG-BJILWQEISA-N but-1-ene;(e)-but-2-ene Chemical compound CCC=C.C\C=C\C WTOOLIQYCQJDBG-BJILWQEISA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- RRZCFXQTVDJDGF-UHFFFAOYSA-N dodecyl 3-(3-octadecoxy-3-oxopropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC RRZCFXQTVDJDGF-UHFFFAOYSA-N 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 235000010985 glycerol esters of wood rosin Nutrition 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000007757 hot melt coating Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002953 preparative HPLC Methods 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229920000428 triblock copolymer Polymers 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09J157/02—Copolymers of mineral oil hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Definitions
- the present invention relates to adhesive tapes.
- Adhesive tapes are used in industrial fields such as home appliances, automobiles, construction, etc., for the purpose of, for example, joining various assembly members.
- Adhesives used for adhesive tapes include acrylic adhesives and rubber adhesives, and acrylic adhesives are often used. However, acrylic pressure-sensitive adhesives do not have sufficient adhesion to olefinic materials.
- Patent Document 1 discloses a base polymer comprising a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound, and a tackifying resin (TH) having a hydroxyl value of 80 mgKOH/g or more.
- TH tackifying resin
- Patent Document 2 discloses a hot melt composition containing a styrene block copolymer (A) and a liquid softening agent (B), wherein the styrene block copolymer (A) is a styrene heat
- the hot melt composition which is a hydrogenated product of a plastic elastomer, has a viscosity ratio ( ⁇ 1/ ⁇ 2) between the melt viscosity ( ⁇ 1) at 140°C and the melt viscosity ( ⁇ 2) at 180°C, and the melt viscosity at 180°C is Hot melt compositions are disclosed that are characterized by specific ranges.
- Patent Document 3 a styrene-based thermoplastic elastomer A, a tackifying resin B, a plasticizer C, and a vinyl copolymer D having an ethylene-carbonyl bond are contained, and the mass part of the plasticizer C is C, and a hot melt adhesive characterized in that the ratio represented by D/C is 0.10 to 0.80, where D is the part by mass of the vinyl copolymer D having an ethylene-carbonyl bond. It is
- JP 2013-216853 A Japanese Patent Application Laid-Open No. 2019-116608 JP 2020-203977 A
- Conventional rubber-based adhesives may exhibit high adhesive strength to materials that are difficult to adhere to with acrylic adhesives, such as olefin-based materials. was not sufficient.
- conventional adhesive tapes mainly have a process of applying an adhesive composition in which the adhesive is dissolved in a solvent such as solvent or water to the base material and volatilizing the solvent or water. The required energy and cost were large, and the manufacturing time was long. Accordingly, there has been a demand for an adhesive composition that has a low melt viscosity at high temperatures and that can be applied sufficiently by various hot-melt methods, for example.
- the present invention has been made in view of such circumstances, and is an adhesive tape having a holding power for olefinic materials at high temperatures, which was difficult with adhesive tapes using conventional rubber adhesives, Moreover, the present invention provides an adhesive tape having high adhesive strength.
- a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition
- the pressure-sensitive adhesive composition comprises a styrene-butadiene block copolymer, a first tackifier, and a second tackifier.
- the third tackifier wherein the styrene-butadiene-based block copolymer is partially hydrogenated in the butadiene portion
- the first tackifier comprises a rosin ester that is liquid at 23°C and a rosin ester that is liquid at 23°C.
- At least one liquid terpene resin the second tackifier has a softening point of 70 to 120 ° C.
- the third tackifier has a softening point of 140 ° C. or higher
- JISZ0237 is 100 minutes or more at 70° C.
- the melt viscosity of the adhesive composition at 200° C. is 100,000 cp or less.
- the present inventors found that in a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition, the pressure-sensitive adhesive composition contains a styrene-butadiene-based block copolymer in which the butadiene portion is partially hydrogenated.
- a first tackifier, a second tackifier, and a third tackifier, each having specific physical properties, are combined, and the holding power of the adhesive tape and the viscosity of the adhesive composition at high temperatures are improved.
- the pressure-sensitive adhesive tape has sufficiently high holding power and adhesive strength, and the present invention was completed.
- a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition comprises a styrene-butadiene block copolymer, a first tackifier, a second tackifier, and a 3 tackifiers, wherein the styrene-butadiene block copolymer is partially hydrogenated in the butadiene portion, and the first tackifier is a rosin ester liquid at 23°C and a terpene liquid at 23°C at least one of the system resins, the second tackifier has a softening point of 70 to 120 ° C., the third tackifier has a softening point of 140 ° C.
- the pressure-sensitive adhesive composition comprises a styrene-butadiene block copolymer, a first tackifier, a second tackifier, and a 3 tackifiers, wherein the styren
- the adhesive tape contains 45 to 55 parts by mass of the styrene-butadiene block copolymer and 5 to 15 parts by mass of the first tackifier, per 100 parts by mass of the adhesive composition. part, 10 parts by mass or more of the second tackifier, and a total of 30 to 50 parts by mass of the second tackifier and the third tackifier.
- the adhesive tape which concerns on this invention the adhesive tape which has the high adhesive force with respect to the olefinic material in a high temperature, and the holding power in a high temperature can be obtained.
- the pressure-sensitive adhesive tape according to the present invention has a low melt viscosity at high temperatures, and for example, a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer containing an adhesive composition that can be sufficiently coated by various hot-melt methods can be obtained.
- the pressure-sensitive adhesive tape according to the present invention can make use of its properties to bond various members together with higher reliability and at a lower cost in industrial fields such as home appliances, automobiles, and construction. Since the adhesive tape according to one embodiment of the present invention has the above characteristics, it can be It can be suitably used for fixing parts, OA equipment, home appliances, and the like.
- FIG. 1 is a schematic diagram of an adhesive tape according to one embodiment of the present invention.
- the adhesive tape according to the present invention comprises an adhesive layer containing an adhesive composition.
- the adhesive composition according to the present invention contains a styrene-butadiene block copolymer, a first tackifier, a second tackifier and a third tackifier.
- the tackifier means a tackifier, and refers to a thermoplastic resin that is liquid or solid at room temperature and is added to enhance the adhesiveness.
- Specific examples of tackifiers include rosin-based, terpene-based, and petroleum-based tackifiers.
- the styrene-butadiene-based block copolymer according to the present invention is a block copolymer containing a block having a styrene-derived monomer unit and a block having a butadiene-derived monomer unit. means a polymer.
- Styrene-butadiene-based block copolymers can be used singly. For example, those having different contents of monomer units derived from styrene or those having different diblock copolymer contents. can be used in combination of two or more.
- the styrene-butadiene-based block copolymer preferably has a styrene-derived monomer unit content of 5 to 50% by mass, more preferably 10 to 40% by mass.
- the content of monomer units derived from styrene is, for example, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50% by mass. or within a range between the two. By setting the amount in such a range, the obtained adhesive tape has appropriate adhesive strength and holding power to the adherend.
- the content of monomer units derived from styrene can be measured according to JIS K6383.
- the butadiene portion is partially hydrogenated.
- the butadiene portion of the styrene-butadiene-based block copolymer is preferably hydrogenated in an amount of 20 to 90% by mass, more preferably in an amount of 30 to 80% by mass.
- Specific examples of styrene-butadiene block copolymers in which the butadiene portion is partially hydrogenated include styrene-butadiene-butylene-styrene block copolymers (SBBS).
- the styrene-butadiene-based block copolymer according to the present invention contains monomer units derived from block B-styrene containing monomer units derived from block A-butadiene containing monomer units derived from styrene.
- a triblock copolymer containing block C is preferably included.
- the styrene-butadiene-based block copolymer according to the present invention includes a block A containing monomer units derived from styrene and a diblock copolymer containing block B containing monomer units derived from butadiene. is preferred.
- the block B containing monomer units derived from butadiene is preferably partially hydrogenated.
- the block B containing monomer units derived from butadiene preferably has a butadiene block and a butylene block.
- the styrene-butadiene-based block copolymer according to the present invention preferably contains 50 to 85% by mass of the diblock copolymer, when the styrene-butadiene-based block copolymer is 100% by mass. It is more preferable to contain % by mass.
- the content of the diblock copolymer is, for example, 50, 55, 60, 65, 70, 75, 80, 85% by mass.
- styrene-butadiene block copolymer may be used for the adhesive, but two or more types may be used in combination.
- resins with different viscosities and styrene contents it is possible to adjust adhesive strength and melt viscosity within appropriate ranges.
- the weight-average molecular weight of the styrene-butadiene-based block copolymer is not particularly limited, but is, for example, preferably 30,000 to 500,000, more preferably 60,000 to 300,000.
- a weight average molecular weight can be calculated
- the first tackifier according to the present invention is at least one of a rosin ester that is liquid at 23°C and a terpene resin that is liquid at 23°C.
- a rosin ester that is liquid at 23°C or a terpene resin that is liquid at 23°C can be used singly or in combination of two or more.
- a liquid rosin ester for example, Super Ester A-18, Estergum AT, etc. are sold by Arakawa Chemical Co., Ltd., and can be freely selected and used.
- terpene-based resins can be preferably used because they lower the viscosity during coating but do not lower the holding power.
- terpene-based resins examples include Daimaron (liquid terpene resin, flash point 174 ° C.), YS resin CP (liquid terpene resin, flash point 178 ° C.), YS resin PX300N (terpene resin, flash point 202 ° C.), YS POLYSTAR T30 (terpene phenolic resin, flash point 205°C) and YS Resin LP (aromatic modified terpene resin, flash point 220°C) are commercially available from Yasuhara Chemical Co., Ltd., and can be freely selected and used. Among them, YS resin LP can be preferably used because it has a high flash point, low heat loss, and high compatibility with the styrene-butadiene block copolymer of the present invention.
- the first tackifier preferably has a viscosity at 25° C. of 500 to 150,000 cp, more preferably 1,000 to 100,000 cp.
- the viscosity at 25° C. is, for example, 500, 1000, 2000, 5000, 10000, 20000, 50000, 100000, 120000, 150000 cp, and may be within a range between any two of the numerical values exemplified herein. .
- the second tackifier has a softening point of 70-120°C.
- the second tackifier those having a softening point of 70 to 120° C. can be used singly or in combination of two or more.
- the temperature of the second tackifier is preferably 80-120°C, more preferably 85-115°C.
- the softening point is, for example, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120 ° C., and within the range between any two of the numerical values illustrated here There may be.
- C9 petroleum resin hydrogenated C9 petroleum resin, C5 petroleum resin, alicyclic petroleum resin, alicyclic/aromatic petroleum resin, rosin resin (polymerized rosin ester, modified polymerized rosin esters, stabilized rosin esters, etc.), terpene-based resins (terpene resins, aromatic modified terpene resins, terpene phenol resins, hydrogenated terpene phenol resins, etc.) can be used.
- terpene-based resins terpene resins, aromatic modified terpene resins, terpene phenol resins, hydrogenated terpene phenol resins, etc.
- the second tackifier more preferably contains a terpene resin.
- the third tackifier has a softening point of 140° C. or higher.
- the third tackifier those having a softening point of 140° C. or higher can be used singly or in combination of two or more.
- the third tackifier preferably has a softening point of 140 to 180°C, more preferably 140 to 170°C.
- the softening point is, for example, 140, 145, 150, 155, 160, 165, 170, 175, 180 ° C. It may be within the range between any two of the numerical values illustrated here .
- the softening point of the tackifier can be defined as a value measured based on the softening point test method (ring and ball method) specified in JIS K5902 and JIS K2207. Specifically, the sample is melted as quickly as possible at the lowest possible temperature and carefully filled into a ring placed on a flat metal plate to avoid the formation of bubbles. After it cools down, cut off the raised part from the plane including the top of the ring with a slightly heated knife. Next, a supporter (ring base) is placed in a glass container (heating bath) having a diameter of 85 mm or more and a height of 127 mm or more, and glycerin is poured to a depth of 90 mm or more.
- ring and ball method the softening point test method
- the steel ball (diameter 9.5 mm, weight 3.5 g) and the ring filled with the sample are immersed in the glycerin without touching each other, and the temperature of the glycerin is kept at 20° C. ⁇ 5° C. for 15 minutes. .
- a steel ball is then centered on the surface of the sample in the ring and placed in position on the support.
- the distance from the upper end of the ring to the glycerin surface is kept at 50 mm, a thermometer is placed, the center of the mercury ball of the thermometer is set at the same height as the center of the ring, and the container is heated.
- the Bunsen burner flame used for heating is directed halfway between the center and the rim of the bottom of the vessel to ensure even heating.
- the rate at which the bath temperature rises after reaching 40° C. from the start of heating can be 5.0 ⁇ 0.5° C. per minute.
- the temperature at which the sample gradually softens and flows down the ring until it finally touches the bottom plate is read and taken as the softening point. Two or more softening points can be measured at the same time, and the average value can be used. Also, since the softening point is about 50° C. higher than the glass transition point of the tackifier, the softening point can be estimated by detecting the Tg using a DSC (differential scanning calorimeter).
- C9 petroleum resin hydrogenated C9 petroleum resin
- C5 petroleum resin alicyclic petroleum resin, alicyclic/aromatic petroleum resin
- terpene resin aromatic modified terpene resins, terpene phenol resins, hydrogenated terpene phenol resins, etc.
- rosin-based resins polymerized rosin esters, modified polymerized rosin esters, stabilized rosin esters, etc.
- alkylphenol compounds and the like.
- the third tackifier can include hydrogenated C9 petroleum resin, C5 petroleum resin, terpene resin. From the viewpoint of cost, hydrogenated C9 petroleum resin and C5 petroleum resin are preferable. Hydrogenated C9 petroleum resin is more preferable from the viewpoint of less odor than other petroleum resins.
- a terpene phenol resin is preferably included from the viewpoint of obtaining a PSA composition that has a low melt viscosity and is easy to coat.
- the pressure-sensitive adhesive composition according to one embodiment of the present invention contains a styrene-butadiene-based block copolymer, a first tackifier, a second tackifier, and a third tackifier. Mandatory to include. Further, in the pressure-sensitive adhesive composition according to one embodiment of the present invention, the holding power of the pressure-sensitive adhesive tape provided with the pressure-sensitive adhesive layer made of the pressure-sensitive adhesive composition and the melt viscosity of the pressure-sensitive adhesive composition are adjusted within the ranges described below. For example, the content of each component is not particularly limited.
- the pressure-sensitive adhesive composition according to one embodiment of the present invention depends on the type of each component. is easier to adjust, and the adhesive force of the adhesive tape is easier to control.
- the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains 45 to 55 parts by mass of the styrene-butadiene-based block copolymer per 100 parts by mass of the pressure-sensitive adhesive composition.
- the content of the styrene-butadiene block copolymer is specifically, for example, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55 parts by mass, and the numerical values exemplified here may be in the range between any two of
- the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains 5 to 15 parts by mass of the first tackifier per 100 parts by mass of the pressure-sensitive adhesive composition.
- the content of the first tackifier is, for example, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15 parts by mass, and any of the numerical values illustrated here It may be in a range between the two.
- the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains 10 parts by mass or more of the second tackifier, and 10 to 40 parts by mass when the pressure-sensitive adhesive composition is 100 parts by mass. is more preferable, and it is even more preferable to contain 15 to 25 parts by mass.
- Specific examples of the content of the second tackifier are 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40 parts by mass, even if it is within the range between any two of the numerical values illustrated here good.
- the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains a total of 30 to 50 parts by mass of the second tackifier and the third tackifier per 100 parts by mass of the pressure-sensitive adhesive composition. .
- the contents of the second tackifier and the third tackifier are, for example, 46, 47, 48, 49, 50 parts by mass, and may be within a range between any two of the numerical values exemplified here.
- the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains 10 to 30 parts by mass, preferably 15 to 25 parts by mass, of the third tackifier when the pressure-sensitive adhesive composition is 100 parts by mass. is preferred.
- Specific examples of the content of the third tackifier are 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29 and 30 parts by mass, and may be within a range between any two of the numerical values exemplified here.
- the pressure-sensitive adhesive composition according to one embodiment of the present invention contains 45 to 55 parts by mass of a styrene-butadiene block copolymer and 5 to 15 parts by mass of a first tackifier, per 100 parts by mass of the pressure-sensitive adhesive composition.
- Parts by mass, 10 parts by mass or more of the second tackifier, and a total of 30 to 50 parts by mass of the second tackifier and the third tackifier are more preferably contained, and the styrene-butadiene block copolymer is 45 to 55 parts by mass, 5 to 15 parts by mass of the first tackifier, 10 parts by mass or more of the second tackifier, 10 parts by mass or more of the third tackifier, the second tackifier and the third tackiness It is more preferable to contain 30 to 50 parts by mass of fire in total.
- the pressure-sensitive adhesive composition according to one embodiment of the present invention includes, when the pressure-sensitive adhesive composition is 100 parts by mass, 45 to 55 parts by mass of a styrene-butadiene block copolymer and 5 parts by mass of the first tackifier. It is even more preferable to contain up to 15 parts by mass, 10 to 40 parts by mass or more of the second tackifier, and 10 to 30 parts by mass of the third tackifier.
- the holding power and adhesive strength of the pressure-sensitive adhesive tape are more appropriately adjusted, and the pressure-sensitive adhesive composition
- the adhesive tape has a lower melt viscosity at 200°C.
- the pressure-sensitive adhesive composition according to the present invention contains plasticizers, antioxidants, ultraviolet absorbers, stabilizers, fillers, modifiers, and so on within a range that does not impede the effects of the present invention. It may contain various additives such as a substance.
- the adhesive composition according to one embodiment of the present invention can contain a plasticizer.
- the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably has a plasticizer content of less than 4 parts by mass with respect to 100 parts by mass of the pressure-sensitive adhesive composition.
- the content of the plasticizer is, for example, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 3.5 parts by mass. may be in the range between any two of
- the pressure-sensitive adhesive composition according to one embodiment of the present invention may also contain no plasticizer.
- the pressure-sensitive adhesive composition according to one embodiment of the present invention comprises a styrene-butadiene-based block copolymer and first, second and third tackifiers, and the blending amounts of these tackifiers provide the adhesive tape holding power And by adjusting the melt viscosity of the adhesive composition to be appropriate, the holding power, adhesive strength, and adhesiveness of the adhesive tape can be improved even if the plasticizer content is small or no plasticizer is included.
- the resulting pressure-sensitive adhesive tape has an excellent balance of melt viscosities at 200°C of the agent composition.
- plasticizers include phthalate-based plasticizers, polybutene, paraffin-based process oils, naphthene-based process oils, aromatic process oils, liquid paraffin, and hydrocarbon-based synthetic oils.
- polybutene examples include homopolymers of isobutene, copolymers of isobutene and n-butene, and the like.
- examples of commercially available products include “10N” manufactured by NOF, "Indopol H-100” manufactured by Ineos, “Nisseki Polybutene” manufactured by Nippon Petrochemical, “Tetrax” manufactured by Nippon Petrochemical and the like.
- Examples of the paraffin-based process oil examples include “PW-32” manufactured by Idemitsu Kosan Co., Ltd., “Dianafresia S32” manufactured by Idemitsu Kosan Co., Ltd., and "PS-32” manufactured by Idemitsu Kosan Co., Ltd.
- naphthenic process oils examples include “KN4010” manufactured by PetroChina, “Dianafrecia N28” manufactured by Idemitsu Kosan Co., Ltd., “Dianafrecia N90” manufactured by Idemitsu Kosan Co., Ltd., “Dianafrecia U46” manufactured by Idemitsu Kosan Co., Ltd., and “Dianafrecia U46” manufactured by Idemitsu Kosan Co., Ltd. "Diana Process Oil NR” and the like.
- aromatic process oils examples include “Aromax” manufactured by Nippon Oil Co., Ltd.
- liquid paraffin examples include “P-100” manufactured by MORESCO and “Kaydol” manufactured by Sonneborn.
- hydrocarbon-based synthetic oils examples include “Lucant HC-10” manufactured by Mitsui Chemicals, Inc. and “Lucant HC-20” manufactured by Mitsui Chemicals.
- Phthalic acid ester plasticizers include DINA (diisononyl adipate), DEHP (di-(2-ethylhexyl) phthalate), DBP (dibutyl phthalate), BBP (butylbenzyl phthalate), DINP (diisononyl phthalate), DIDP (diisodecyl phthalate) and DNOP (di-normal octyl phthalate).
- the total content of the plasticizers exemplified above is preferably within the above numerical range.
- it is particularly preferable that the total content of the phthalate-based plasticizer is within the above numerical range.
- antioxidants examples include 2,6-di-t-butyl-4-methylphenol, n-octadecyl-3-(4′-hydroxy-3′,5′-di-t-butylphenyl)propionate, 2,2'-methylenebis(4-methyl-6-t-butylphenol), 2,2'-methylenebis(4-ethyl-6-t-butylphenol), 2,4-bis(octylthiomethyl)-o-cresol , 2-t-butyl-6-(3-t-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2,4-di-t-amyl-6-[1-(3 ,5-di-t-amyl-2-hydroxyphenyl)ethyl]phenyl acrylate, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)]acrylate, tetrakis[
- UV absorbers examples include 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-3',5'-t-butylphenyl)benzotriazole, 2-( Benzotriazole UV absorbers such as 2′-hydroxy-3′,5′-di-t-butylphenyl)-5-chlorobenzotriazole, benzophenone UV absorbers such as 2-hydroxy-4-methoxybenzophenone, salicylic acid Examples include ester-based UV absorbers, cyanoacrylate-based UV absorbers, and hindered amine-based light stabilizers. These can be used alone or in combination.
- fillers examples include, but are not limited to, calcium carbonate, kaolin, talc, titanium oxide, mica, styrene beads, and silica. These particulate fillers can be used singly or in combination.
- the adhesive composition according to one embodiment of the present invention must have a melt viscosity at 200° C. of 100,000 cp or less for hot-melt coating. Further, the melt viscosity at 200°C is more preferably 20,000 cp or more and 90,000 cp or less. Specifically, the melt viscosity at 200° C. is, for example, 20,000, 30,000, 40,000, 50,000, 60,000, 70,000, 80,000, 90,000, 100,000 cp. or within a range between the two.
- the melt viscosity at 200° C. can be controlled by appropriately selecting the type of blending of the pressure-sensitive adhesive composition and adjusting the blending amount.
- the melt viscosity of the pressure-sensitive adhesive composition can be measured using a rheometer at 200° C. and a shear rate of 10 (1/s).
- a method for producing a pressure-sensitive adhesive composition according to one embodiment of the present invention includes a tackifier or the like that kneads raw materials including a first tackifier, a second tackifier, and a third tackifier with a kneader kneader.
- a kneading step can be included.
- an antioxidant and a plasticizer can be further added.
- kneading step such as a tackifier, kneading can be performed, for example, for 3 to 30 minutes at 5 to 25 rpm.
- a method for producing a pressure-sensitive adhesive composition according to one embodiment of the present invention is a styrene-butadiene-based block copolymer, further added with a styrene-butadiene-based block copolymer and kneaded after the step of kneading with a tackifier or the like. It is preferable to have an addition/kneading step. In the step of adding and kneading the styrene-butadiene block copolymer, kneading can be performed, for example, for 20 to 200 minutes at 5 to 25 rpm.
- Adhesive Layer/Adhesive Tape The adhesive tape according to the present invention comprises an adhesive layer containing the above adhesive composition.
- the pressure-sensitive adhesive layer is formed by heating and dissolving the pressure-sensitive adhesive composition, for example, with a melter, and coating it on the substrate.
- the coating method is not particularly limited, but it is preferable to heat, melt, and knead the raw materials of the pressure-sensitive adhesive and apply the adhesive by a hot-melt method. That is, the method for producing an adhesive tape according to one embodiment of the present invention preferably includes a coating step of applying the adhesive composition to a substrate by a hot-melt method.
- Conventional adhesive tapes for the automotive field, etc. have a process of applying an adhesive composition, in which the adhesive is dissolved in a solvent such as solvent or water, to the base material, and volatilizing the solvent or water.
- the pressure-sensitive adhesive composition according to the present invention has a low viscosity at high temperatures and can be applied by a hot-melt method, so that a pressure-sensitive adhesive tape can be produced in a short time with little energy and cost.
- a coating method a non-contact coating method or a contact method can be adopted.
- Cross coating can be given as an example of the non-contact coating method.
- slot die coating can be cited as an example of the contact method.
- the thickness of the pressure-sensitive adhesive layer is not particularly limited, it is preferably 40 to 100 ⁇ m.
- the thickness of the pressure-sensitive adhesive layer is, for example, 40, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100 ⁇ m. may be within the range of Conventional solvent-based pressure-sensitive adhesive compositions require a longer drying process depending on the thickness of the pressure-sensitive adhesive layer to form a thicker pressure-sensitive adhesive layer, resulting in increased energy consumption and cost.
- the pressure-sensitive adhesive composition according to the present invention Viscosity at high temperature is within a specific range, and coating by hot melt method is possible, so that a relatively thick pressure-sensitive adhesive layer can be manufactured with less energy and cost than before, and in a short time. be able to.
- the pressure-sensitive adhesive tape according to the present invention is more preferably a double-sided tape having pressure-sensitive adhesive layers on both sides of a nonwoven fabric. Moreover, it is more preferable that the pressure-sensitive adhesive tape according to the present invention has a pressure-sensitive adhesive layer having the thickness described above on both sides of the nonwoven fabric.
- FIG. 1 shows the configuration of an adhesive tape according to one embodiment of the present invention.
- the adhesive tape has an adhesive layer 2 and an adhesive layer 4 on both sides of the nonwoven fabric 3 .
- the double-sided release film 1 is attached to the surface of the pressure-sensitive adhesive layer 2 opposite to the surface in contact with the nonwoven fabric.
- the adhesive tape according to the present invention preferably has an adhesive strength to polypropylene resin at 80°C based on JIS Z0237 of 2.40 N/cm or more, more preferably 3.00 N/cm or more. Even more preferably, it is 3.50 N/cm or more.
- the adhesive strength is, for example, 2.40, 2.50, 2.60, 2.70, 2.80, 2.90, 3.00, 3.50, 4.00, 4.50, 5.00, 5.50, 6.00, 6.50, 7.00, 7.50, 8.00, 8.50, 9.00, 9.50, 10.00 N/cm, where It may be in a range between any two of the numerical values given.
- Adhesion is adjusted by adjusting the type and amount of the adhesive composition, and in particular, the formulation of the adhesive composition is adjusted so that the holding power of the adhesive tape and the melt viscosity of the adhesive composition are within specific numerical ranges. It can be controlled by adjusting the type and amount. Adhesive strength can be obtained by measuring 180° peel adhesive strength to polypropylene resin in an 80° C. atmosphere based on JIS Z0237 "10. Adhesive strength.”
- the adhesive tape according to the present invention has a holding power at 70°C based on JIS Z0237 of 100 minutes or more, preferably 150 minutes or more.
- the holding power is, for example, 1100, 1150, 1200, 1250, 1300 minutes, and may be in the range between any two of the values exemplified here.
- Holding power can be controlled by adjusting the formulation type and amount of the adhesive composition.
- the holding power is determined by attaching an adhesive tape with an adhesive area of 25 mm ⁇ 25 mm to a SUS plate in an atmosphere of 70 ° C based on JIS Z0237 "13. Holding power", setting the load to 1 kg, and measuring the time until the weight falls. can be evaluated with
- the pressure-sensitive adhesive tape according to the present invention has high adhesive strength and high holding power to olefin-based materials such as polypropylene at high temperatures, has low viscosity at high temperatures, and can be coated by a hot-melt method. Therefore, the adhesive tape can be produced in a short time with less energy and cost.
- the pressure-sensitive adhesive tape according to the present invention makes use of such properties and can bond various members together with higher reliability and at a lower cost in industrial fields such as home appliances, automobiles, and construction.
- the adhesive tape according to one embodiment of the present invention is used, for example, for fixing parts around automobile doors and ceilings, trunk rooms, and instrument panels, fixing interior parts in the automobile field such as assembly around air conditioners and car navigation systems, and OA equipment. , home appliances and the like.
- a kneader kneader (manufactured by Toshin Co., Ltd.) was heated to 200° C. in advance.
- a first tackifier, a second tackifier, a third tackifier, an antioxidant and a plasticizer were added to a kneader kneader and kneaded at 15 rpm for 10 minutes.
- a styrene-butadiene block copolymer in which the butadiene portion was partially hydrogenated was added and further kneaded at 15 rpm for 100 minutes to obtain adhesive compositions 1-27.
- Tables 1 and 2 show the blending amounts (parts by mass) of each component.
- the viscosity of the first tackifier in the table is the viscosity at 25°C.
- the softening points and the like of the components used as the third tackifier are shown below.
- QUINTONE2940 manufactured by Zeon Corporation: C5, softening point 141°C P-140 (manufactured by Arakawa Chemical Co., Ltd.): Hydrogenated C9, softening point 140 ° C.
- T-145 manufactured by Yasuhara Chemical Co., Ltd.
- terpene phenol resin softening point 145 ° C.
- T-160 manufactured by Yasuhara Chemical Co., Ltd.
- terpene phenol resin softening point 160 ° C.
- DS-816 (manufactured by Harima Kasei Co., Ltd.): Polymerized rosin ester, softening point 150°C DS-822 (manufactured by Harima Kasei Co., Ltd.): polymerized rosin ester, softening point 165°C
- weight-average molecular weights of the components used as the styrene-butadiene-based block copolymer in which the butadiene portion is partially hydrogenated are shown below.
- Asaprene N521 manufactured by Asahi Kasei Corporation: SBBS (a styrene-butadiene-based block copolymer in which the butadiene portion is partially hydrogenated, a styrene-butadiene-butylene-styrene block copolymer), weight average molecular weight 15
- Ten Thousand Tuftec P1500 manufactured by Asahi Kasei Corporation
- SBBS styrene-butadiene-butylene-styrene block copolymer, which is a styrene-butadiene-based block copolymer in which the butadiene portion is partially hydrogenated
- the pressure-sensitive adhesive compositions 1 to 27 were heated to 200° C. with a melter and dissolved, and then applied to a cellulose/rayon nonwoven fabric (Daifuku Paper Co., Ltd., 5200 18 g/m 2 ) at a thickness of 50 ⁇ m using a slot die coater (ITW Dynatec). It was processed, laminated with a double-sided release paper, and wound up. Further, a 50 ⁇ m-thick adhesive composition was applied to the surface not coated with the adhesive composition using a slot die coater (ITW Dynatec).
- the film thickness in the present invention was measured by subtracting the film thickness of the substrate from the layer thickness of the tape, and dividing the film thickness by 2 in the case of a double-faced tape.
- a spring type dial gauge specified in JIS B 7503 was used as the film thickness measuring machine, and the measuring pressure was set to 20 to 60 kpa.
- Adhesive strength the adhesive strength (180° peel adhesive strength) to polypropylene resin was measured in an 80°C atmosphere.
- a PET film having a thickness of 25 ⁇ m was attached to one side of a double-sided tape, and the other side of the tape was attached to a polypropylene plate and pressed under pressure of 2 kg. This sample was set in an autograph, and after 30 minutes had passed, the adhesive force was measured.
- the polypropylene plate used for this measurement was a 2 mm thick Kobe poly sheet (product number: PP-N-BN, manufactured by Showa Denko Materials Co., Ltd.) punched into 5 cm x 20 cm pieces. The results are shown in Tables 1 and 2.
- Double-sided release film Adhesive layer 3
- Nonwoven fabric Adhesive layer
Abstract
Description
粘着テープに用いられる粘着剤としては、アクリル系粘着剤、ゴム系粘着剤があり、アクリル系粘着剤が多く使用されている。しかしながら、アクリル系粘着剤は、オレフィン系の材料に対する粘着力が十分ではなかった。
また、特許文献2には、スチレン系ブロック共重合体(A)と液状軟化剤(B)とを含有するホットメルト組成物であって、スチレン系ブロック共重合体(A)が、スチレン系熱可塑性エラストマーの水素添加物であり、ホットメルト組成物は、140℃における溶融粘度(η1)と180℃における溶融粘度(η2)との粘度比(η1/η2)、及び、180℃における溶融粘度が特定の範囲であることを特徴とするホットメルト組成物が開示されている。
さらに、特許文献3には、スチレン系熱可塑性エラストマーA、粘着付与樹脂B、可塑剤C、及びエチレン-カルボニル結合を有するビニル共重合体Dを含有し、前記可塑剤Cの質量部をC、及び前記エチレン-カルボニル結合を有するビニル共重合体Dの質量部をDとした場合にD/Cで示される比率が0.10~0.80であることを特徴とするホットメルト接着剤が開示されている。
[1]粘着剤組成物を含む粘着剤層を備える粘着テープであって、前記粘着剤組成物は、スチレン-ブタジエン系ブロック共重合体、第1のタッキファイヤー、第2のタッキファイヤー、及び第3のタッキファイヤーを含み、前記スチレン-ブタジエン系ブロック共重合体は、ブタジエン部分が部分的に水素添加され、前記第1のタッキファイヤーは、23℃で液体のロジンエステル及び23℃で液体のテルペン系樹脂のうちの少なくとも1種であり、前記第2のタッキファイヤーは、軟化点が70~120℃であり、前記第3のタッキファイヤーは、軟化点が140℃以上であり、前記粘着テープは、JISZ0237に基づく70℃における保持力が100分以上であり、さらに前記粘着剤組成物の200℃の溶融粘度が10万cp以下であることを特徴とする、粘着テープ。
[2]前記粘着剤組成物は、前記粘着剤組成物を100質量部としたとき、前記スチレン-ブタジエン系ブロック共重合体を45~55質量部、前記第1のタッキファイヤーを5~15質量部、前記第2のタッキファイヤーを10質量部以上、前記第2のタッキファイヤーと前記第3のタッキファイヤーとを合計で30~50質量部含有する、[1]に記載の粘着テープ。
[3]前記第2のタッキファイヤーは、テルペン系樹脂を含む、[1]又は[2]に記載の粘着テープ。
[4]前記第3のタッキファイヤーは、ロジン系樹脂、または、テルペン系樹脂を含む、[1]~[3]のいずれかに記載の粘着テープ。
[5]前記粘着テープは、JISZ0237に基づく80℃におけるポリプロピレン樹脂に対する粘着力が2.40N/cm以上である、[1]~[4]のいずれかに記載の粘着テープ。
本発明に係る粘着テープは、粘着剤組成物を含む粘着剤層を備える。
本発明に係る粘着剤組成物は、スチレン-ブタジエン系ブロック共重合体、第1のタッキファイヤー、第2のタッキファイヤー、及び第3のタッキファイヤーを含む。
なお、本発明において、タッキファイヤーとは、粘着付与剤を意味し、常温において液状または固形である粘着性を高めるために添加される熱可塑性樹脂のことをいう。タッキファイヤーとしては、具体的には、ロジン系、テルペン系、石油系などが挙げられる。
本発明に係るスチレン-ブタジエン系ブロック共重合体は、スチレン由来の単量体単位を有するブロック及びブタジエン由来の単量体単位を有するブロックを含むブロック共重合体を意味する。スチレン-ブタジエン系ブロック共重合体は、1種単独で用いることも可能であるし、例えば、スチレンに由来する単量体単位の含有率が異なるものや、ジブロック共重合体含有率が異なるものを2種以上組み合わせて用いることもできる。
ブタジエン部分が部分的に水素添加されているスチレン-ブタジエン系ブロック共重合体としては、具体的には、スチレン-ブタジエン-ブチレン-スチレンブロック共重合体(SBBS)が挙げられる。
また、本発明に係るスチレン-ブタジエン系ブロック共重合体は、スチレンに由来する単量体単位を含むブロックA-ブタジエンに由来する単量体単位を含むブロックBを含むジブロック共重合体を含むことが好ましい。
ここで、ブタジエンに由来する単量体単位を含むブロックBは、その一部が水素添加されていることが好ましい。すなわち、ブタジエンに由来する単量体単位を含むブロックBは、ブタジエンブロック及びブチレンブロックを有することが好ましい。
本発明に係るスチレン-ブタジエン系ブロック共重合体は、スチレン-ブタジエン系ブロック共重合体を100質量%としたとき、上記ジブロック共重合体を50~85質量%含むことが好ましく、55~80質量%含むことがより好ましい。上記ジブロック共重合体の含有率は、具体的には例えば、50,55,60,65,70,75,80,85質量%であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。ジブロック共重合体の含有率を上記数値範囲内とすることにより、適度なタックを有する粘着剤組成物を得ることができる。本発明においては、粘着剤に用いるスチレン-ブタジエン系ブロック共重合体は1種類でもよいが、2種類以上を組み合わせて用いる事もできる。粘度やスチレン含有率が異なる樹脂を適切に選択する事で、粘着力や、溶融粘度を適切な範囲に調整する事ができる。
本発明に係る第1のタッキファイヤーは、23℃で液体のロジンエステル及び23℃で液体のテルペン系樹脂のうちの少なくとも1種である。第1のタッキファイヤーとしては、23℃で液体のロジンエステル、又は23℃で液体のテルペン系樹脂を、1種単独で、又は2種以上を組み合わせて用いることができる。
このような液体ロジンエステルとしては、一例として、荒川化学社よりスーパーエステルA-18、エステルガムATなどが販売されており、自由に選択して用いる事ができる。
特に、テルペン系樹脂は、塗工時の粘度を下げるが保持力を下げないため好ましく用いる事ができる。このようなテルペン系樹脂の一例として、ダイマロン(液状テルペン樹脂、引火点174℃)、YSレジンCP(液状テルペン樹脂、引火点178℃)、YSレジンPX300N(テルペン樹脂、引火点202℃)、YSポリスターT30(テルペンフェノール樹脂、引火点205℃)、YSレジンLP(芳香族変性テルペン樹脂、引火点220℃)がヤスハラケミカル社より市販されており、自由に選択して用いる事ができる。中でも、引火点が高く、加熱減量が低く、さらに本発明に係るスチレン-ブタジエン系ブロック共重合体との相溶性が高い事からYSレジンLPを好ましく用いる事ができる。
第2のタッキファイヤーは、軟化点が70~120℃である。第2のタッキファイヤーとしては、軟化点70~120℃のものを、1種単独で、又は2種以上を組み合わせて用いることができる。
第2のタッキファイヤーは、80~120℃であることが好ましく、85~115℃であることがより好ましい。
軟化点は、具体的には例えば、70,75,80,85,90,95,100,105,110,115,120℃であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。
第3のタッキファイヤーは、軟化点が140℃以上である。第3のタッキファイヤーとしては、軟化点が140℃以上のものを、1種単独で、又は2種以上を組み合わせて用いることができる。
第3のタッキファイヤーは、軟化点が140~180℃であることが好ましく、140~170℃であることがより好ましい。軟化点は、具体的には例えば、140,145,150,155,160,165,170,175,180℃であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。
また、軟化点はタッキファイヤーのガラス転移点の約50℃高い温度である事から、DSC(示差走査熱量測定機)を用いて、Tgを検出する事で軟化点を推定する事ができる。この手法を利用した粘着剤中のタッキファイヤーの軟化点の同定法としては分取HPLCを用いて、粘着剤中のタッキファイヤー成分を単離し、この単離した試料のDSC測定結果からTgを測定し、軟化点を推定する方法がある。
本発明の一実施形態に係る粘着剤組成物は、スチレン-ブタジエン系ブロック共重合体、第1のタッキファイヤー、第2のタッキファイヤー、及び第3のタッキファイヤーを含むことを必須とする。また、本発明の一実施形態に係る粘着剤組成物は、該粘着剤組成物からなる粘着剤層を備える粘着テープの保持力及び粘着剤組成物の溶融粘度が後述の範囲内に調整されれば、各々の成分の含有量は特に制限されない。本発明の一実施形態に係る粘着剤組成物は、各成分の種類によるが、一例として、各成分の含有量を以下とすることで、該粘着テープの保持力及び粘着剤組成物の溶融粘度をより調整しやすく、また、該粘着テープの粘着力を制御しやすい。
本発明に係る粘着剤組成物は、上記成分に加えて、本発明の効果を阻害しない範囲で、可塑剤、酸化防止剤、紫外線吸収剤、安定剤、充填剤、改質剤、などの各種添加剤を含んでいてもよい。
本発明の一実施形態に係る粘着剤組成物は、可塑剤を含有することができる。本発明の一実施形態に係る粘着剤組成物は、粘着剤組成物100質量部に対し、可塑剤の含有量が、4質量部未満であることが好ましい。可塑剤の含有量は、具体的には例えば、0.5,1.0,1.5,2.0,2.5,3.0,3.5質量部であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。本発明の一実施形態に係る粘着剤組成物は、可塑剤を含有しないものとすることもできる。
本発明の一実施形態に係る粘着剤組成物は、スチレン-ブタジエン系ブロック共重合体、第1、第2及び第3のタッキファイヤーを有し、またこれらの配合量が、粘着テープの保持力及び粘着剤組成物の溶融粘度が適切になるよう調整されていることにより、可塑剤の含有量が少なくても、又は可塑剤を含まなくても、粘着テープの保持力、粘着力、該粘着剤組成物の200℃の溶融粘度のバランスに優れる粘着テープとなる。
パラフィン系プロセスオイルとしては、例えば、出光興産社製「PW-32」、出光興産社製「ダイアナフレシアS32」、出光興産社製「PS-32」等が挙げられる。
ナフテン系プロセスオイルとしては、例えば、PetroChina社製「KN4010」、出光興産社製「ダイアナフレシアN28」、出光興産社製「ダイアナフレシアN90」、出光興産社製「ダイアナフレシアU46」、出光興産社製「ダイアナプロセスオイルNR」等が挙げられる。
芳香族系プロセスオイルとしては、例えば、新日本石油社製「アロマックス」が挙げられる。流動パラフィンとしては、MORESCO社製「P-100」、Sonneborn社製「Kaydol」等が挙げられる。
炭化水素系合成油としては三井化学社製「ルーカントHC-10」、三井化学社製「ルーカントHC-20」等が挙げられる。
フタル酸エステル系の可塑剤としては、DINA(ジイソノニルアジペート)、DEHP(ジ-(2-エチルヘキシル)フタレート)、DBP(ジブチルフタレート)、BBP(ブチルベンジルフタレート)、DINP(ジイソノニルフタレート)、DIDP(ジイソデシルフタレート)、DNOP(ジノルマルオクチルフタレート)が挙げられる。
本発明の一実施形態に係る粘着剤組成物は、上記に例示した可塑剤の合計含有量が、上記数値範囲内であることが好ましい。また、本発明の一実施形態に係る粘着剤組成物は、特には、フタル酸エステル系の可塑剤の合計含有量が、上記数値範囲内であることが好ましい。
酸化防止剤としては、例えば、2,6-ジ-t-ブチル-4-メチルフェノール、n-オクタデシル-3-(4'-ヒドロキシ-3',5'-ジ-t-ブチルフェニル)プロピオネート、2,2'-メチレンビス(4-メチル-6-t-ブチルフェノール)、2,2'-メチレンビス(4-エチル-6-t-ブチルフェノール)、2,4-ビス(オクチルチオメチル)-o-クレゾール、2-t-ブチル-6-(3-t-ブチル-2-ヒドロキシ-5-メチルべンジル)-4-メチルフェニルアクリレート、2,4-ジ-t-アミル-6-〔1-(3,5-ジ-t-アミル-2-ヒドロキシフェニル)エチル〕フェニルアクリレート、2-[1-(2-ヒドロキシ-3,5-ジ-tert-ぺンチルフェニル)]アクリレート、テトラキス〔メチレン-3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート〕メタン、2,4-ビス[(ドデシルチオ)メチル]-6-メチルフェノール等のフェノール系酸化防止剤、ジラウリルチオジプロピオネート、ラウリルステアリルチオジプロピオネート、ペンタエリスリトールテトラキス(3-ラウリルチオプロピオネート)等のイオウ系酸化防止剤、トリス(ノニルフェニル)ホスファイト、トリス(2,4-ジ-t-ブチルフェニル)ホスファイト等のリン系酸化防止剤、ラクトン系酸化防止剤等を例示できる。紫外線吸収剤としては、例えば、2-(2'-ヒドロキシ-5'-メチルフェニル)ベンゾトリアゾール、2-(2'-ヒドロキシ-3',5'-t-ブチルフェニル)ベンゾトリアゾール、2-(2'-ヒドロキシ-3',5'-ジ-t-ブチルフェニル)-5-クロロベンゾトリアゾール等のベンゾトリアゾール系紫外線吸収剤、2-ヒドロキシ-4-メトキシベンゾフェノン等のベンゾフェノン系紫外線吸収剤、サリチル酸エステル系紫外線吸収剤、シアノアクリレート系紫外線吸収剤、ヒンダードアミン系光安定剤を例示できる。これらは単独又は組み合わせて使用することができる。
充填剤としては、特に限定されるものではないが、例えば、炭酸カルシウム、カオリン、タルク、酸化チタン、雲母、スチレンビーズ、シリカ等が挙げられる。これらの微粒子充填剤は、単独又は混合して使用することができる。
本発明の一実施形態に係る粘着剤組成物は、ホットメルト塗工をするために200℃の溶融粘度が10万cp以下でなければならない。さらに200℃の溶融粘度は、2万cp以上、9万cp以下であることがより好ましい。
200℃の溶融粘度は、具体的には例えば、2万,3万,4万,5万,6万,7万,8万,9万,10万cpであり、ここで例示した数値の何れか2つの間の範囲内であってもよい。
200℃の溶融粘度は、粘着剤組成物の配合の種類を適切に選択し、さらにその配合量を、調整することによって、制御することができる。
粘着剤組成物の溶融粘度は、レオメーターを用いて200℃で、せん断速度10(1/s)で測定することができる。
本発明の一実施形態に係る粘着剤組成物の製造方法は特に限定されない。例えば、本発明の一実施形態に係る粘着剤組成物の製造方法は、第1のタッキファイヤー、第2のタッキファイヤー、第3のタッキファイヤーを含む原料を、ニーダー混練機で混練するタッキファイヤー等混練工程を含むことができる。また、上記工程において、酸化防止剤、可塑剤をさらに添加することもできる。
タッキファイヤー等混練工程では、例えば、3~30分間、5~25rpmで、混練を行うことができる。
本発明の一実施形態に係る粘着剤組成物の製造方法は、上記タッキファイヤー等混練工程の後、さらにスチレン-ブタジエン系ブロック共重合体を添加して混練する、スチレン-ブタジエン系ブロック共重合体添加・混練工程を有することが好ましい。スチレン-ブタジエン系ブロック共重合体添加・混練工程では、例えば、20~200分間、5~25rpmで、混練を行うことができる。
本発明に係る粘着テープは、上記粘着剤組成物を含む粘着剤層を備える。
従来の自動車分野用等の粘着テープは、粘着剤を溶剤や水等の溶媒に溶解させた粘着剤組成物を基材に塗布し、溶剤や水を揮発させる工程を有するものであったため、製造に要されるエネルギー、コストが大きく、製造時間が長かった。本発明に係る粘着剤組成物は、高温での粘度が低く、ホットメルト方式による塗工が可能であるため、少ないエネルギー及びコストで、かつ短時間で粘着テープを製造することができる。
塗工方法としては、非接触塗工方式又は接触方式を採用することができる。非接触塗工方式の例としては、クロスコートを挙げることができる。また、接触方式の例としては、スロットダイコーティングを挙げることができる。
本発明に係る粘着テープは、JIS Z0237に基づく80℃におけるポリプロピレン樹脂に対する粘着力が2.40N/cm以上であることが好ましく、3.00N/cm以上であることがより好ましく3.50N/cm以上であることがさらにより好ましい。粘着力は、具体的には例えば、2.40,2.50,2.60,2.70,2.80,2.90,3.00,3.50,4.00,4.50,5.00,5.50,6.00,6.50,7.00,7.50,8.00,8.50,9.00,9.50,10.00N/cmであり、ここで例示した数値の何れか2つの間の範囲内であってもよい。
粘着力は、粘着剤組成物の配合の種類及び量を調整し、特には、粘着テープの保持力及び粘着剤組成物の溶融粘度を特定の数値範囲になるよう、粘着剤組成物の配合の種類及び量を調整することで制御することができる。粘着力は、JIS Z0237「10.粘着力」に基づき、80℃雰囲気下でポリプロピレン樹脂に対する180°ピール粘着力を測定することで求めることができる。
本発明に係る粘着テープは、JIS Z0237に基づく70℃における保持力が100分以上であり、150分以上であることがより好ましい。保持力は、具体的には例えば、100,150,200,250,300,350,400,450,500,550,600,650,700,750,800,850,900,950,1000,1050,1100,1150,1200,1250,1300分であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。保持力は、粘着剤組成物の配合の種類及び量を調整することで制御することができる。保持力は、JIS Z0237「13.保持力」に基づき70℃雰囲気下で、SUS板に粘着面積25mm×25mmで粘着テープを貼り付け、荷重1kgとして、おもりが落下するまでの時間を測定することで評価できる。
事前にニーダー混練機(トーシン社製)を200℃に昇温した。ニーダー混練機に、第1のタッキファイヤー、第2のタッキファイヤー、第3のタッキファイヤー、酸化防止剤、可塑剤を添加して10分間15rpmで混練した。その後、ブタジエン部分が部分的に水素添加されたスチレン-ブタジエン系ブロック共重合体を添加し、さらに100分15rpmで混練し、粘着剤組成物1~27を得た。各成分の配合量(質量部)を表1及び表2に示す。なお、表中の第1のタッキファイヤーの粘度は25℃での粘度である。
アルコン P-110(荒川化学工業株式会社製):完全水添C9、軟化点110±5℃
PX1150N(ヤスハラケミカル社製):テルペン樹脂、軟化点115±5℃
ペトロタック90(東ソー株式会社製):C5/C9、軟化点95℃
ESCOREZ 1310(エクソンモービル):C5、軟化点88~98℃
QUINTONE2940(日本ゼオン社製):C5、軟化点141℃
P-140(荒川化学社製):水添C9、軟化点140℃
T-145(ヤスハラケミカル社製):テルペンフェノール樹脂、軟化点145℃
T-160(ヤスハラケミカル社製):テルペンフェノール樹脂、軟化点160℃
DS-816(ハリマ化成社製):重合ロジンエステル、軟化点150℃
DS-822(ハリマ化成社製):重合ロジンエステル、軟化点165℃
アサプレン N521(旭化成株式会社製):SBBS(ブタジエン部分が部分的に水素添加されているスチレン-ブタジエン系ブロック共重合体である、スチレン-ブタジエン-ブチレン-スチレンブロック共重合体)、重量平均分子量15万
タフテック P1500(旭化成株式会社製):SBBS(ブタジエン部分が部分的に水素添加されているスチレン-ブタジエン系ブロック共重合体である、スチレン-ブタジエン-ブチレン-スチレンブロック共重合体)、重量平均分子量8万
粘着剤組成物1~27を、メルターで200℃に加温して溶解させ、スロットダイコーター(ITWダイナテック社)でセルロール・レーヨン不織布(大福製紙、5200 18g/m2)に50μm厚で塗工し、両面剥離紙と貼合して巻き取った。さらに、粘着剤組成物が塗工されていない面に対して、同様にスロットダイコーター(ITWダイナテック社)を用いて50μm厚の粘着剤組成物を塗工した。本発明における膜厚とは、基材の膜厚をテープの層厚から差し引き、両面テープの場合はその膜厚を2で割る事で測定した。膜厚測定機は、バネ式のJIS B 7503に規定するダイヤルゲージを使用し、測定圧力は20~60kpaとした。
得られた粘着剤組成物、及び粘着テープについて、以下の評価を行った。
<粘着剤組成物の200℃粘度>
レオメーター(アントンパール製、MCR302)を用いて、200℃で、コーンプレート(1°、25mm径)を用いてせん断速度10(1/s)で粘度測定を行った。結果を表1及び表2に示す。
JIS Z0237「10.粘着力」に基づき、80℃雰囲気下でポリプロピレン樹脂に対する粘着力(180°ピール粘着力)を測定した。まず、厚み25μmのPETフィルムを両面テープの片側に貼り付け、そのテープの他方の面をポリプロピレン板に貼り付け2kgで圧着した。このサンプルをオートグラフにセットし、30分経過後、粘着力測定を行った。本測定に使用したポリプロピレン板はコウベポリシート(品番 PP-N-BN、昭和電工マテリアルズ株式会社製)2mm厚を5cm×20cmに打ち抜いて使用した。結果を表1及び表2に示す。
JIS Z0237「13.保持力」に基づき70℃における保持力を測定した。70℃雰囲気下で、SUS板に粘着面積25mm×25mmで粘着テープを貼り付けた。荷重は1kgとして、おもりが落下するまでの時間を測定した。結果を表1及び表2に示す。
2 粘着剤層
3 不織布
4 粘着剤層
Claims (5)
- 粘着剤組成物を含む粘着剤層を備える粘着テープであって、
前記粘着剤組成物は、スチレン-ブタジエン系ブロック共重合体、第1のタッキファイヤー、第2のタッキファイヤー、及び第3のタッキファイヤーを含み、
前記スチレン-ブタジエン系ブロック共重合体は、ブタジエン部分が部分的に水素添加され、
前記第1のタッキファイヤーは、23℃で液体のロジンエステル及び23℃で液体のテルペン系樹脂のうちの少なくとも1種であり、
前記第2のタッキファイヤーは、軟化点が70~120℃であり、
前記第3のタッキファイヤーは、軟化点が140℃以上であり、
前記粘着テープは、JIS Z0237に基づく70℃における保持力が100分以上であり、さらに前記粘着剤組成物の200℃の溶融粘度が10万cp以下であることを特徴とする、粘着テープ。 - 前記粘着剤組成物は、前記粘着剤組成物を100質量部としたとき、
前記スチレン-ブタジエン系ブロック共重合体を45~55質量部、
前記第1のタッキファイヤーを5~15質量部、
前記第2のタッキファイヤーを10質量部以上、
前記第2のタッキファイヤーと前記第3のタッキファイヤーとを合計で30~50質量部含有する、
請求項1に記載の粘着テープ。 - 前記第2のタッキファイヤーは、テルペン系樹脂を含む、請求項1又は2に記載の粘着テープ。
- 前記第3のタッキファイヤーは、ロジン系樹脂、または、テルペン系樹脂を含む、請求項1又は請求項2に記載の粘着テープ。
- 前記粘着テープは、JIS Z0237に基づく80℃におけるポリプロピレン樹脂に対する粘着力が2.40N/cm以上である、請求項1又は請求項2に記載の粘着テープ。
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JP2019116608A (ja) | 2018-05-14 | 2019-07-18 | 積水フーラー株式会社 | ホットメルト組成物 |
JP2020203977A (ja) | 2019-06-17 | 2020-12-24 | 積水フーラー株式会社 | ホットメルト接着剤 |
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JPS56163174A (en) * | 1980-05-22 | 1981-12-15 | Arakawa Chem Ind Co Ltd | Hot melt-type pressure sensitive adhesive |
JPH0195175A (ja) * | 1987-08-31 | 1989-04-13 | Minnesota Mining & Mfg Co <3M> | 使い捨ておむつ及び成人失禁用被服のための再固定可能な閉止装置 |
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JP2020203977A (ja) | 2019-06-17 | 2020-12-24 | 積水フーラー株式会社 | ホットメルト接着剤 |
WO2021065662A1 (ja) * | 2019-10-01 | 2021-04-08 | デンカ株式会社 | ホットメルト粘着剤組成物、粘着テープ、及び粘着テープの製造方法 |
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