WO2023248302A1 - はんだ接合部材、半導体装置、はんだ接合方法、および、半導体装置の製造方法 - Google Patents

はんだ接合部材、半導体装置、はんだ接合方法、および、半導体装置の製造方法 Download PDF

Info

Publication number
WO2023248302A1
WO2023248302A1 PCT/JP2022/024565 JP2022024565W WO2023248302A1 WO 2023248302 A1 WO2023248302 A1 WO 2023248302A1 JP 2022024565 W JP2022024565 W JP 2022024565W WO 2023248302 A1 WO2023248302 A1 WO 2023248302A1
Authority
WO
WIPO (PCT)
Prior art keywords
mass
less
solder
melting point
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/024565
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
浩次 山▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to CN202280096842.4A priority Critical patent/CN119343201A/zh
Priority to JP2024528112A priority patent/JPWO2023248302A1/ja
Priority to PCT/JP2022/024565 priority patent/WO2023248302A1/ja
Priority to DE112022007400.0T priority patent/DE112022007400T5/de
Publication of WO2023248302A1 publication Critical patent/WO2023248302A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0233—Sheets or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present disclosure relates to a solder joint member, a semiconductor device, a solder joint method, and a method for manufacturing a semiconductor device.
  • solder which does not contain lead (Pb), which is a substance subject to environmental regulations, is being adopted as the solder used for joining such joints.
  • Pb lead
  • solder having a composition of Sn-3Ag-0.5Cu (wt%) (Sn-3Ag-0.5Cu solder) is known.
  • the melting point of Sn-3Ag-0.5Cu solder is 220°C.
  • the members to be joined may warp or accumulate high residual stress due to thermal contraction. Therefore, in joint reliability evaluation (heat cycle test, power cycle test) after cooling, stress is released and cracks are likely to occur in the solder joint at an early stage.
  • Bi, In, etc. which have the effect of lowering the melting point, are added to the Sn-3Ag-0.5Cu solder.
  • Patent Document 1 Japanese Unexamined Patent Publication No. 2002-120085
  • a lead-free solder alloy has a melting temperature lower than 215° C. and contains substantially 76-96% tin, 0.2-2.5%
  • a solder alloy is disclosed consisting of % copper, 2.5-4.5% silver, and greater than 0 up to 12% indium. It is stated that this makes it possible to provide a lead-free solder that has a moderate melting temperature range (175 to 210° C.) useful for mainstream electronic manufacturing, and provides high strength and high fatigue resistance.
  • Patent Document 2 Japanese Unexamined Patent Publication No. 2018-149558
  • a lead-free solder alloy is disclosed that contains 1% by mass or more and 6% by mass or less of In, with the remainder being Sn. Further, a lead-free solder alloy is disclosed which further contains Bi in an amount of 1% by mass or more and 5.5% by mass or less in addition to the above composition.
  • preheating is from 170°C to 190°C for 110 seconds, the peak temperature is 245°C, and the time at 200°C or higher is 65 seconds. , it is disclosed that the time at 220°C or higher is 45 seconds, and the cooling rate from the peak temperature to 200°C is 3 to 8°C/second.
  • Patent Document 1 and Patent Document 2 do not pay attention to the structure (structure) of the joint after soldering, and there are problems in actual use.
  • Sn which is the main component of the solder
  • Sn which is the main component of the solder
  • other additive elements are locally concentrated relative to Sn, the main component, and a phase with a melting point different from the melting point of the solder itself before use occurs. is formed.
  • the other additive element is Bi
  • a Sn-Bi eutectic phase melting point 140° C.
  • the main phase solidifies first, and then a phase having a lower melting point (eg, Sn--Bi phase) solidifies.
  • Such a timing shift in solidification causes shrinkage cavities (crevasse-like gaps that occur during the solidification process), stress due to thermal contraction, and the like, which may damage the semiconductor elements that are the members to be joined.
  • Patent Document 1 and Patent Document 2 the addition of In has the effect of lowering the melting point of the solder.
  • In is a metal that is easily oxidized, if the solder contains a large amount of In, there is a possibility that voids may be formed due to oxidation of In during initial bonding. For this reason, in practice, it is necessary to make the amount of In added smaller than that described in the above-mentioned literature.
  • An object of the present disclosure is to provide a solder that can suppress the occurrence of defects caused by joints formed using solder.
  • the solder joint member of this embodiment is A solder joint member that joins a first object and a second object, Sn as a main component, 3% by mass or more but less than 4% by mass of Ag, 0.5% by mass or more and less than 1.0% by mass of Cu, 2.5% by mass or more and less than 4% by mass of Bi, and 0.5% by mass or more and less than 4% by mass of Bi.
  • Sn--Bi--Sb alloy phase that covers at least a portion of the Sn--Bi alloy phase and has a melting point of 170° C. or more and less than 180° C.
  • solder joint member of the present disclosure has two phases with a lower melting point than the main phase inside near the joint interface with the target object (joint object), the stress generated during thermal contraction (solidification contraction) is alleviated. , the occurrence of defects caused by stress is suppressed. Therefore, a highly reliable junction (and a semiconductor device having the same) is provided.
  • the stress generated after bonding is also alleviated, so a bonded portion (and a semiconductor device having the same) that can maintain high reliability even after bonding is provided.
  • FIG. 2 is a schematic cross-sectional view showing the first step in FIG. 1.
  • FIG. FIG. 2 is a schematic cross-sectional view showing the second step in FIG. 1.
  • FIG. FIG. 2 is a schematic cross-sectional view showing the third step in FIG. 1.
  • FIG. FIG. 2 is a schematic cross-sectional view showing the fourth step in FIG. 1.
  • FIG. FIG. 2 is a schematic cross-sectional view showing the fifth step in FIG. 1.
  • 3 is a DSC measurement result of a solder joint member of Comparative Example 1.
  • 3 is a cross-sectional observation result of the solder joint member of Example 1.
  • 3 is a cross-sectional observation result of a solder joint member of Comparative Example 1.
  • 1 is a schematic cross-sectional view of a solder joint member according to Embodiment 1.
  • the solder joint member 4 of this embodiment is a member that joins the first object 2 (for example, a substrate) and the second object 3 (for example, a semiconductor element) (see FIG. 6).
  • the solder joint member 4 is a member made of solder (solder alloy) that is solidified after being melted in a heating process, and is a member that is made of solder (solder alloy) that is solidified after being melted in a heating process, and is a member that is made of solder (solder alloy) that is solidified after being melted in a heating process. It is a member that exists in a state where it is joined to both.
  • the solder joint member 4 of this embodiment has a multiphase structure, and includes a plurality of separated phases having different melting points.
  • the Sn-Bi-Sb alloy phase 11 (medium melting point phase), the Sn-Bi alloy phase 10 (low melting point phase), and the main phase 12 (high melting point phase) are basically: They exist in this order from the member to be joined (first object 2 or second object 3) side.
  • the Ag content is 3% by mass or more and less than 4% by mass
  • the Cu content is 0.5% by mass or more and less than 1.0% by mass. It has been confirmed that the effects of the present disclosure can be obtained if the contents of Ag and Cu are within this range.
  • the heating temperature (maximum temperature reached) is 220°C or more and less than 230°C
  • the heating time (time during which the temperature is maintained at 220°C or more and less than 230°C) is 10 minutes or more and less than 20 minutes.
  • the solder joint member of this embodiment can be formed more reliably, and the effects of the solder joint member described above can be obtained.
  • Embodiment 4 ⁇ Method for manufacturing semiconductor devices>
  • the method of manufacturing a semiconductor device according to this embodiment is a method of manufacturing a semiconductor device including a substrate and a semiconductor element.
  • the method for manufacturing a semiconductor device according to this embodiment is similar to that in Embodiment 3.
  • the method includes the step of joining a substrate (substrate wiring such as a copper plate) and a semiconductor element using a soldering method. This provides a highly reliable semiconductor device.
  • Example 1 An example of a procedure for manufacturing a semiconductor element assembly (a assembly of a semiconductor element and a substrate) in the semiconductor device manufacturing method of this embodiment will be described below with reference to the flowchart shown in FIG. 1. .
  • the solder sheet 1 is cut into a predetermined size (see FIG. 2).
  • a roll-shaped solder sheet 1 was produced by a rolling process at 100° C. or lower so that the thickness was 100 ⁇ m. Thereafter, it was cut into a size of 5 mm x 5 mm, which is the same size as the semiconductor element size described below.
  • solder sheet 1 was placed on the substrate 2 (copper plate) (see FIG. 3).
  • a tough pitch copper plate (thickness: 1 mm, size: 10 mm x 10 mm) was used.
  • the outermost surface of the substrate 2 is made of solid copper, and no plating treatment is applied to the outermost surface.
  • a predetermined amount of a rust preventive agent having a decomposition temperature of 100° C. or lower that does not affect bondability may be applied to the outermost surface of the CuMo alloy plate to prevent oxidation.
  • an organic agent that thermally decomposes at a high temperature of 100° C. or higher may be used as a tack material so that the solder sheet 1 does not shift from its initial position.
  • the viscosity of the tack material is preferably 200 Pa ⁇ s or more.
  • a resist film may be applied to areas other than the joints of the Cu plates so that the solder sheet 1 does not shift.
  • the solder sheet 1 may be slightly curved during cutting or handling. This is because the solder sheet 1 is completely melted by heating, so there is no influence from the initial shape of the solder sheet 1. However, since a semiconductor element will be mounted in the next step, if the curve is so large that the semiconductor element cannot be mounted, it may be corrected to be parallel on another flat plate.
  • the laminate of each member obtained in the above steps was placed on the hot plate 6 in the heating furnace 5 (see FIG. 5). Then, formic acid, which is a typical organic acid capable of reducing an oxide film, is sealed in the heating furnace 5, and the solder sheet 1 is heated at 180°C for 5 minutes and then at 230°C for 10 minutes. was melted to form a solder joint member 4.
  • formic acid which is a typical organic acid capable of reducing an oxide film
  • the sample (semiconductor element assembly) on which the solder joint member 4 was formed was placed on the cooling plate 7 and cooled (see FIG. 6).
  • the sample was gradually cooled over 360 seconds to 130° C. (for a 100° C. temperature drop from 230° C. to 130° C.) at which the sample could be taken out.
  • FIG. 7 is a schematic cross section showing a bonding interface part 8 (a part of the solder bonding member 4 and substrate 2 side, including the bonding interface between the two) of the semiconductor element assembly (see FIG. 6) obtained after the fifth step. It is a diagram.
  • the bonding interface 8 includes, in order from the substrate 2 side, an interfacial compound 9 (a compound containing the components of the substrate 2 and the components of the solder sheet 1), a Sn--Bi alloy phase 10 (low melting point phase), a Sn-Bi-Sb alloy phase 11 (medium melting point phase), and a main phase 12.
  • each phase in the entire solder joint member 4 including the substrate 2 side and the semiconductor element 3 side is as shown in FIG. 12.
  • Figure 8 shows the DSC measurement results of the sample.
  • the horizontal axis represents the heating temperature in DSC measurement
  • the vertical axis represents the heat flow of the solder joint member 4. Note that when changing from solid to liquid, an endothermic reaction occurs, so the heat flow has a negative value.
  • the vertical axis is a logarithmic axis, the unit of heat flow is mW, and the numerical values shown in FIG. 8 are relative values (values relative to the Pt pan).
  • the bonding strength of the sample was measured by a die shear test. As a result, the bonding strength was 48 MPa. This value is higher than the target value of 40 MPa. Note that when a similar bonded body was obtained using general-purpose Sn-3Ag-0.5Cu solder, the peel strength of the bonded body was 40 MPa, so a bonding strength higher than this was set as the target value. The reason why the bonding strength was high is presumed to be that the addition of Bi and Sb to the solder caused a solid solution strengthening mechanism to work in part.
  • the amount of warpage (maximum distance from the substrate) of the semiconductor element in the sample (semiconductor element assembly) was measured. As a result, the amount of warpage in the entire semiconductor element was 10 ⁇ m or less, exceeding the target of 30 ⁇ m or less. On the other hand, when using general-purpose Sn-3Ag-0.5Cu solder, the amount of warpage was 40 ⁇ m, which did not meet the target.
  • Example 1 In order to consider the effect of adding Sb, the same procedure as in Example 1 was performed except that solder sheet 1 did not contain Sb (solder sheet 1 had a composition of Sn-3.5Ag-0.7Cu-3.3Bi). A sample (semiconductor element assembly) was prepared using the same method, and the same evaluation was performed.
  • FIG. 9 shows the DSC measurement results of Comparative Example 1.
  • Comparative Example 1 no intermediate melting point phase was observed, and the low melting point phase was also outside the range of "135° C. or higher and lower than 145° C.” of Example 1. This is considered to be because the added Sb has the effect of increasing the melting points of the low melting point phase and the intermediate melting point phase.
  • the main phase 12 as in Example 1, a peak corresponding to a phase having a melting point of 210° C. or more and less than 220° C. is observed. It is thought that this became more obvious due to the concentration of Sb at the bonding interface.
  • Example 2 The amounts of Bi and Sb added were varied as shown in Table 1. With respect to the bonded samples obtained in the same manner as in Example 1 except for the above, the presence or absence of solidification cracks was visually confirmed using SEM photographs. The confirmation results are shown in Table 1. In Table 1, “OK” indicates that there is no solidification cracking, and “NG” indicates that there is solidification cracking.
  • Solder sheet 1 Solder sheet, 2 First object (substrate: copper plate), 3 Second object (semiconductor element), 4 Solder joint member, 5 Heating furnace, 6 Hot plate, 7 Cooling plate, 8 Bonding interface, 9 Interfacial compound , 10 Sn-Bi alloy phase (low melting point phase), 11 Sn-Bi-Sb alloy phase (medium melting point phase), 12 main phase.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Die Bonding (AREA)
PCT/JP2022/024565 2022-06-20 2022-06-20 はんだ接合部材、半導体装置、はんだ接合方法、および、半導体装置の製造方法 Ceased WO2023248302A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202280096842.4A CN119343201A (zh) 2022-06-20 2022-06-20 焊料接合构件、半导体装置、焊料接合方法及半导体装置的制造方法
JP2024528112A JPWO2023248302A1 (https=) 2022-06-20 2022-06-20
PCT/JP2022/024565 WO2023248302A1 (ja) 2022-06-20 2022-06-20 はんだ接合部材、半導体装置、はんだ接合方法、および、半導体装置の製造方法
DE112022007400.0T DE112022007400T5 (de) 2022-06-20 2022-06-20 Lötverbindungselement, Halbleitervorrichtung, Lötverbindungsverfahren und Verfahren zum Herstellen einer Halbleitervorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/024565 WO2023248302A1 (ja) 2022-06-20 2022-06-20 はんだ接合部材、半導体装置、はんだ接合方法、および、半導体装置の製造方法

Publications (1)

Publication Number Publication Date
WO2023248302A1 true WO2023248302A1 (ja) 2023-12-28

Family

ID=89379589

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/024565 Ceased WO2023248302A1 (ja) 2022-06-20 2022-06-20 はんだ接合部材、半導体装置、はんだ接合方法、および、半導体装置の製造方法

Country Status (4)

Country Link
JP (1) JPWO2023248302A1 (https=)
CN (1) CN119343201A (https=)
DE (1) DE112022007400T5 (https=)
WO (1) WO2023248302A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12611737B2 (en) * 2022-10-03 2026-04-28 Tdk Corporation Metal particle for joint material

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010050185A1 (ja) * 2008-10-27 2010-05-06 パナソニック株式会社 半導体の実装構造体およびその製造方法
JP2012081521A (ja) * 2003-04-25 2012-04-26 Cookson Electronics Assembly Materials Group Alpha Metals Loetsysteme Gmbh Ｓｎ、ＡｇおよびＣｕからなるはんだ物質
WO2018193760A1 (ja) * 2017-04-18 2018-10-25 富士電機株式会社 半導体装置および半導体装置の製造方法
JP2018181605A (ja) * 2017-04-13 2018-11-15 ニホンハンダ株式会社 金属製部材接合用シート、金属製部材の接合方法および金属製部材接合体
JP2020157349A (ja) * 2019-03-27 2020-10-01 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手
WO2021261486A1 (ja) * 2020-06-23 2021-12-30 千住金属工業株式会社 はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、及びｅｃｕ電子回路装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012081521A (ja) * 2003-04-25 2012-04-26 Cookson Electronics Assembly Materials Group Alpha Metals Loetsysteme Gmbh Ｓｎ、ＡｇおよびＣｕからなるはんだ物質
WO2010050185A1 (ja) * 2008-10-27 2010-05-06 パナソニック株式会社 半導体の実装構造体およびその製造方法
JP2018181605A (ja) * 2017-04-13 2018-11-15 ニホンハンダ株式会社 金属製部材接合用シート、金属製部材の接合方法および金属製部材接合体
WO2018193760A1 (ja) * 2017-04-18 2018-10-25 富士電機株式会社 半導体装置および半導体装置の製造方法
JP2020157349A (ja) * 2019-03-27 2020-10-01 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手
WO2021261486A1 (ja) * 2020-06-23 2021-12-30 千住金属工業株式会社 はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、及びｅｃｕ電子回路装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12611737B2 (en) * 2022-10-03 2026-04-28 Tdk Corporation Metal particle for joint material

Also Published As

Publication number Publication date
DE112022007400T5 (de) 2025-04-03
JPWO2023248302A1 (https=) 2023-12-28
CN119343201A (zh) 2025-01-21

Similar Documents

Publication Publication Date Title
TWI461252B (zh) A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component
JP5943066B2 (ja) 接合方法および接合構造体の製造方法
JP5041102B2 (ja) 鉛フリーはんだ合金、接合用部材及びその製造法、並びに電子部品
JP2014223678A5 (https=)
WO2013132942A1 (ja) 接合方法、接合構造体およびその製造方法
JP4115979B2 (ja) 非鉛系はんだ材
JP5633816B2 (ja) Ａｕ−Ｓｎ合金はんだ
JP4959539B2 (ja) 積層はんだ材およびそれを用いたはんだ付方法ならびにはんだ接合部
WO2023248302A1 (ja) はんだ接合部材、半導体装置、はんだ接合方法、および、半導体装置の製造方法
JP6936351B2 (ja) 成形はんだの製造方法
JP6688417B2 (ja) はんだ接合方法
KR20070082065A (ko) 무연 솔더 조성물과 이를 이용한 전자기기 및 인쇄회로기판
JPH07299585A (ja) はんだ合金
JP4745878B2 (ja) はんだ皮膜及びそれを用いたはんだ付方法
WO2024069866A1 (ja) 接合部材および半導体装置
KR100903026B1 (ko) 솔더링용 무연합금
JP2014200794A (ja) Ａｕ−Ｓｎ系はんだ合金
JP2006000925A (ja) 無鉛はんだ合金およびその製造方法
JP2017124426A (ja) Ｃｕ系基材とＺｎ−Ａｌ系合金はんだとのクラッド材によって接合された接合体

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22947866

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2024528112

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 202280096842.4

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 112022007400

Country of ref document: DE

WWP Wipo information: published in national office

Ref document number: 202280096842.4

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 112022007400

Country of ref document: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22947866

Country of ref document: EP

Kind code of ref document: A1