JPWO2023248302A1 - - Google Patents

Info

Publication number
JPWO2023248302A1
JPWO2023248302A1 JP2024528112A JP2024528112A JPWO2023248302A1 JP WO2023248302 A1 JPWO2023248302 A1 JP WO2023248302A1 JP 2024528112 A JP2024528112 A JP 2024528112A JP 2024528112 A JP2024528112 A JP 2024528112A JP WO2023248302 A1 JPWO2023248302 A1 JP WO2023248302A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024528112A
Other languages
Japanese (ja)
Other versions
JPWO2023248302A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023248302A1 publication Critical patent/JPWO2023248302A1/ja
Publication of JPWO2023248302A5 publication Critical patent/JPWO2023248302A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0233—Sheets or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Die Bonding (AREA)
JP2024528112A 2022-06-20 2022-06-20 Pending JPWO2023248302A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/024565 WO2023248302A1 (ja) 2022-06-20 2022-06-20 はんだ接合部材、半導体装置、はんだ接合方法、および、半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023248302A1 true JPWO2023248302A1 (https=) 2023-12-28
JPWO2023248302A5 JPWO2023248302A5 (https=) 2025-01-07

Family

ID=89379589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528112A Pending JPWO2023248302A1 (https=) 2022-06-20 2022-06-20

Country Status (4)

Country Link
JP (1) JPWO2023248302A1 (https=)
CN (1) CN119343201A (https=)
DE (1) DE112022007400T5 (https=)
WO (1) WO2023248302A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7209126B1 (ja) * 2022-10-03 2023-01-19 有限会社 ナプラ 接合材用金属粒子

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010050185A1 (ja) * 2008-10-27 2010-05-06 パナソニック株式会社 半導体の実装構造体およびその製造方法
JP2012081521A (ja) * 2003-04-25 2012-04-26 Cookson Electronics Assembly Materials Group Alpha Metals Loetsysteme Gmbh Ｓｎ、ＡｇおよびＣｕからなるはんだ物質
WO2018193760A1 (ja) * 2017-04-18 2018-10-25 富士電機株式会社 半導体装置および半導体装置の製造方法
JP2018181605A (ja) * 2017-04-13 2018-11-15 ニホンハンダ株式会社 金属製部材接合用シート、金属製部材の接合方法および金属製部材接合体
JP2020157349A (ja) * 2019-03-27 2020-10-01 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手
WO2021261486A1 (ja) * 2020-06-23 2021-12-30 千住金属工業株式会社 はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、及びｅｃｕ電子回路装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012081521A (ja) * 2003-04-25 2012-04-26 Cookson Electronics Assembly Materials Group Alpha Metals Loetsysteme Gmbh Ｓｎ、ＡｇおよびＣｕからなるはんだ物質
WO2010050185A1 (ja) * 2008-10-27 2010-05-06 パナソニック株式会社 半導体の実装構造体およびその製造方法
JP2018181605A (ja) * 2017-04-13 2018-11-15 ニホンハンダ株式会社 金属製部材接合用シート、金属製部材の接合方法および金属製部材接合体
WO2018193760A1 (ja) * 2017-04-18 2018-10-25 富士電機株式会社 半導体装置および半導体装置の製造方法
JP2020157349A (ja) * 2019-03-27 2020-10-01 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手
WO2021261486A1 (ja) * 2020-06-23 2021-12-30 千住金属工業株式会社 はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、及びｅｃｕ電子回路装置

Also Published As

Publication number Publication date
DE112022007400T5 (de) 2025-04-03
WO2023248302A1 (ja) 2023-12-28
CN119343201A (zh) 2025-01-21

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