WO2023226841A1 - 用于去除卷带芯片的芯片剔除装置 - Google Patents

用于去除卷带芯片的芯片剔除装置 Download PDF

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Publication number
WO2023226841A1
WO2023226841A1 PCT/CN2023/094678 CN2023094678W WO2023226841A1 WO 2023226841 A1 WO2023226841 A1 WO 2023226841A1 CN 2023094678 W CN2023094678 W CN 2023094678W WO 2023226841 A1 WO2023226841 A1 WO 2023226841A1
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WIPO (PCT)
Prior art keywords
cutting tool
chip
tape
blanking hole
removal device
Prior art date
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PCT/CN2023/094678
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English (en)
French (fr)
Inventor
贾跃耀
李良松
陈秀龙
Original Assignee
颀中科技（苏州）有限公司
合肥颀中科技股份有限公司
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Publication of WO2023226841A1 publication Critical patent/WO2023226841A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of chip packaging technology, in particular to a chip removal device for removing tape chips.
  • Flip Chip technology also known as "flip chip packaging” or “flip chip packaging method” is a type of chip packaging technology. This packaging technology is different from the past method of placing the chip on the substrate and then using wire bonding technology to connect the chip to the connection points on the substrate. Instead, solder joints are grown on the chip connection points, and then the chip is turned over so that the solder joints are directly connected to the substrate.
  • flip-chip technology has been widely used in microprocessor packaging, and has also become a mainstream packaging technology for graphics, special applications, and computer chipsets.
  • representative examples of flip-chip technology are chip-on-glass (COG) and chip-on-film (COF).
  • thin film flip-chip packaging is a soft film construction technology that fixes integrated circuits (ICs) on a substrate.
  • a soft additional circuit board is used as a packaging chip carrier to connect the chip with the flexible substrate circuit. Combining, and setting packaging colloid on the upper side of the flexible substrate next to the chip for packaging.
  • the tape carrying the flexible substrate is generally placed on the operating table.
  • the vacuum adsorption hole set on the operating table will absorb the tape, and then it is lowered through the sealing machine with a clamp.
  • the tape is pressed and clamped to position it on the operating table, and then the chip is bonded to the flexible substrate.
  • the chip After the chip is combined on the flexible substrate, the chip needs to be tested. After the test is completed, the chip that does not meet the requirements needs to be removed from the tape. In the prior art, the corresponding chip is surrounded by stamping during removal.
  • the flexible substrate is cut directly from the tape and Using the above method, it is easy for the flexible substrate with attached chips to be adsorbed on the cutting tool. At the same time, during actual use, it is found that since the flexible substrate is coated with glue, products with thicker flexible substrates need to be coated. There are two layers of glue, one of which is aluminum foil and one is tape. When cutting in the existing method, products containing two layers of glue are prone to glue overflowing.
  • the knife body of the existing technology is in contact with the roll when it falls If the blade connected to the tape comes into contact with the cut tape at the same time, it will cause squeezing of the tape. This extrusion will cause the colloid to overflow, resulting in glue overflow.
  • the object of the present invention is to provide a chip removal device for removing tape chips to solve the deficiencies in the prior art. It can effectively reduce the negative pressure formed in the avoidance groove, thereby preventing the cutting blade from causing damage to the material being cut. It can absorb the fallen tape; and effectively avoid the occurrence of glue overflow during the cutting process.
  • the chip removal device provided by the present invention for removing tape chips includes:
  • a carrying platform is used to carry the tape and has a blanking hole that penetrates the carrying platform;
  • a support frame is provided on the bearing platform and has a support arm extending above the blanking hole;
  • a cutting tool is slidably disposed on the support arm.
  • the cutting tool is opposite to the blanking hole and slides in a direction close to or away from the blanking hole; the cutting tool is in contact with the blanking hole. Hole matching;
  • the cutting tool is provided with an escape groove that opens toward the bearing platform and a rectangular cutter body that surrounds the escape groove; the rectangular cutter body has four edge blades connected end to end and formed on two adjacent edges.
  • the corner cutting part at the intersection position of the blades, the edge blades are arc-shaped and bent in a direction away from the carrying platform.
  • the cutting tool also has a plurality of blowing channels connected with the escape groove.
  • the chip rejecting device for removing tape chips as described above wherein, preferably, the air blowing channel has an air outlet provided at the bottom of the escape groove and an air inlet provided opposite to the air outlet, The air inlet is provided on a side of the cutting tool facing away from the escape groove.
  • a slot is provided on the side of the carrying platform away from the support frame, and the blanking hole has a slot provided in the slot.
  • the tank body is in an elliptical shape, and the long axis of the elliptical shape is consistent with the length direction of the blanking hole.
  • the support frame is provided with a rectangular sliding hole adapted to the cutting tool, and the cutting tool has a rectangular sliding hole corresponding to the cutting tool.
  • the sliding part with sliding fit of the rectangular sliding hole has four sliding surfaces connected end to end, and two adjacent sliding surfaces are connected by a chamfered part.
  • the cutting tool further has a stroke limiter provided on the sliding part, and the stroke limiter is configured as Limit the penetration of the rectangular sliding hole.
  • the support frame is fixed on the carrying platform and is integrally formed with the carrying platform.
  • the carrying platform further has an anti-static protection plate, and a protective cover is provided on the side of the supporting frame facing the carrying platform.
  • the protective cover includes a transverse plate and vertical connecting plates arranged on opposite sides of the transverse plate, and the vertical connecting plates are fixed on the On the support frame, a pair of opposing limiting portions are provided on the transverse plate, and a limiting groove is formed between the pair of limiting portions.
  • the edge blade is set in an arc shape and bent in a direction away from the bearing platform.
  • the corner cutting portion is first connected to the tape. After the corner cutting part comes into contact with the tape, because the edge blade is set in an arc shape, there is still a gap between the edge blade and the tape to be cut. It is precisely because of the existence of this gap that the avoidance groove can be It is always connected to the outside world, so that the rectangular cutter body gradually combines with the tape during the falling process, which can effectively reduce the negative pressure formed in the avoidance groove, thereby preventing the cutting blade body from adsorbing the cut tape;
  • Figure 1 is a first structural schematic diagram of a chip removal device for removing tape chips disclosed in an embodiment of the present invention
  • Figure 2 is a second structural schematic diagram of a chip removal device for removing tape chips disclosed in an embodiment of the present invention
  • Figure 3 is a top view of a chip removal device for removing tape chips disclosed in an embodiment of the present invention.
  • Figure 4 is a cross-sectional view along the AA direction in Figure 3;
  • Figure 5 is a bottom view of Figure 3;
  • Figure 6 is a schematic diagram of the installation structure of the platform and the support frame in the chip removal device for removing tape chips disclosed in the embodiment of the present invention
  • Figure 7 is a first structural schematic diagram of a cutting tool in a chip removal device for removing tape chips disclosed in an embodiment of the present invention
  • Figure 8 is a second structural schematic diagram of a cutting tool in a chip removal device for removing tape chips disclosed in an embodiment of the present invention
  • Figure 9 is a front view of the cutting tool in the chip removal device for removing tape chips disclosed in the embodiment of the present invention.
  • Figure 10 is a top view of Figure 9;
  • Figure 11 is a schematic structural diagram of a protective cover in a chip removal device for removing tape chips disclosed in an embodiment of the present invention
  • 3-Cutting tool 31-avoidance groove, 32-rectangular knife body, 321-edge blade, 322-corner cutting part, 33-blowing channel, 331-air outlet, 332-air inlet, 34-sliding part, 341-sliding surface, 342-chamfer part, 35-stroke limit part.
  • a chip removal device for removing tape chips includes: a carrying platform 1, a support frame 2 and a cutting tool 3;
  • the carrying platform 1 is used to carry the tape, and has a blanking hole 10 that penetrates the carrying platform 1; the tape with the chip attached is placed on the carrying platform 1, and after placement, the chip on the tape is exactly located on the drop.
  • the position of the material hole 10 is that after the tape is punched, the tape with the chip attached is cut and then leaks out through the blanking hole 10.
  • the support frame 2 is arranged on the bearing platform 1 and has a support arm 21 extending on the upper side of the blanking hole 10; the support arm 21 is used to fix and support the cutting tool 3.
  • the cutting tool 3 is slidably disposed on the support arm 21.
  • the cutting tool 3 is opposite to the blanking hole 10 and slides in a direction approaching or away from the blanking hole 10; the cutting tool 3 Compatible with the blanking hole 10;
  • the cutting tool 3 can pass through the blanking hole 10.
  • the size of the blanking hole 10 is slightly larger than the size of the cutting tool 3.
  • the cutting tool 3 can slide up and down along the blanking hole 10, so that when the cutting tool 3 falls, it can Drop the cut chip from the blanking hole 10.
  • the cutting tool 3 is provided with an escape groove 31 that opens toward the carrying platform 1 and a rectangular blade body 32 that surrounds the escape slot 31; the rectangular blade body 32 has a sequence of The four connected edge blades 321 and the corner cutting portion 322 formed at the intersection of two adjacent edge blades 321 are arc-shaped and bent in a direction away from the carrying platform 1 .
  • edge blades 321 are set up and connected end to end to cut the four sides of the chip respectively, so that the tape attached to the chip can be easily removed.
  • the edge blade 321 is set in an arc shape and bent in a direction away from the carrying platform 1.
  • the corner cutting portion 322 first contacts the tape, and then the corner cutting portion 322 contacts the tape. After the tapes are in contact, because the edge blade 321 is set in an arc shape, there is still a gap between the edge blade 321 and the tape to be cut.
  • the knife body 32 gradually combines with the web during the falling process, which can effectively reduce the negative pressure formed in the escape groove 31 and thereby form the adsorption of the cut web.
  • the entire rectangular cutter body 32 will be attracted to the tape at the moment of falling. It is easy to form a negative pressure in the escape groove 31, thereby causing the adsorption of the cut tape.
  • the chip faces downward just opposite to the position of the blanking hole 10 , and the chip is positioned in the blanking hole 10 .
  • the tape with the chip attached can also be positioned on the bearing platform so that the chip faces upward.
  • the escape groove 31 just covers the chip. It can be understood that the above The depth of the relief groove 31 is not less than the thickness of the chip.
  • the corner cutting portion 322 of the edge is cut first, and then gradually transitions. It can avoid the problem of glue overflow.
  • the edge blade 321 is arranged in an arc shape that is bent away from the bearing platform 2.
  • the edge blade 321 can also be arranged relatively inclined, and the distance between the edge blade 321 and the bearing platform is unequal. of.
  • the material of the rectangular cutter body 32 is tungsten steel 90HRA. Compared with the high-speed steel HRC60 in the prior art, the use of tungsten steel 90HRA can further reduce the adsorption of the tape and weaken the friction effect.
  • the cutting tool 3 also has There are a plurality of blowing channels 33 connected with the escape groove 31 .
  • the air blowing channel 33 is connected to an air pump, and the air pump discharges air into the escape groove 31 so that the tape adsorbed on the cutting tool 3 can be further cut off.
  • the air blowing channel 33 has an air outlet 331 provided at the bottom of the avoidance groove 31 and an air inlet 332 provided opposite to the air outlet 331 .
  • the air inlet 332 is provided at the bottom of the avoidance groove 31 .
  • a groove body 11 is provided on the side of the carrying platform 1 away from the support frame 2, and the blanking hole 10 has a slot 11 provided on the side of the supporting platform 1.
  • the escape outlet at the bottom of the tank body 11 , the size of the tank body 11 is larger than the size of the blanking hole 10 .
  • Providing the trough 11 and setting the size of the trough 11 to be larger than the blanking hole 10 can enable the cut tape to quickly enter the wider trough 11 after being pushed out of the blanking hole 10, which is beneficial to The falling of the cut tape reduces the adsorption of the tape on the cutting tool 3 and affects the use of the cutting tool 3 .
  • the groove body 11 is elliptical, and the long axis of the ellipse is consistent with the length direction of the blanking hole 10 . Since the blanking hole 10 is adapted to the rectangular cutter body 32, the blanking hole 10 is also rectangular and has a length direction and a width direction.
  • the cross section of the groove body 11 has a rectangular elliptical structure, and the long axis direction of the ellipse is in line with the falling direction.
  • the length directions of the material holes 10 are in the same direction.
  • the support frame 2 is provided with a rectangular sliding hole 22 that is adapted to the cutting tool 3, and the cutting tool 3 has a sliding hole that slides with the rectangular sliding hole 22.
  • the sliding part 34 has four sliding surfaces 341 connected end to end, and two adjacent sliding surfaces 341 are connected by a chamfered part 342.
  • the chamfered portion 342 can make the sliding between the sliding portion 34 and the support arm 21 smoother.
  • the chamfered portion 342 is a plane connecting two adjacent sliding surfaces 341.
  • the entire sliding portion 34 is in the shape of eight. Angular shape.
  • the chamfered portion 342 can also be an arc connecting two adjacent sliding surfaces 341. Setting the arc as a circular arc can better reduce friction during the sliding process.
  • the entire sliding surface 341 can also be arranged in a cylindrical shape to further reduce the relative friction generated during the sliding process.
  • the cutting tool 3 also has a stroke limiting portion 35 provided on the sliding portion 34.
  • the stroke limiting portion 35 is configured to limit penetration of the rectangular sliding hole 32 .
  • the rectangular cutter body 32 is integrally formed with the sliding part 34 , and the stroke limiting part 35 is provided on an end of the sliding part 34 away from the rectangular cutter body 32 , and the stroke limiting part 35 is used to communicate with the sliding part 34 .
  • the upper surfaces of the support arms 21 are in contact to prevent the cutting tool 3 from excessively sliding downward in the vertical direction, thereby protecting the cutting tool 3 .
  • the support frame 2 is fixed on the bearing platform 1 and is integrally formed with the bearing platform 1 .
  • Setting the support frame 2 to be integrally formed with the bearing platform 1 can make the entire device more stable, and the cutting tool 3 can also slide more smoothly when sliding on the support arm 21 .
  • the integrally formed arrangement can also make the distance between the support arm 21 and the bearing platform 1 closer, thereby reducing the sliding stroke of the cutting tool 3, thereby reducing the wear of the cutting tool 3 during the sliding process.
  • the bearing platform 1 is also provided with an anti-static protection plate 12 , and a protective cover 23 is provided on the side of the support frame 2 facing the bearing platform 1 .
  • the anti-static protection plate 12 and the protective cover 23 are opposite to each other and both are made of anti-static materials. After the tape is placed on the carrying platform 1, the tape is located on the anti-static protection plate 12, and the anti-static protection The plate 12 can effectively prevent the tape from coming into contact with the metal carrying platform 1, thereby generating static electricity.
  • the protective cover 23 wraps the cutting tool 3, and a perforation is formed on the protective cover 23 to match the rectangular blade body 32.
  • the protective cover 23 can effectively prevent the debris after cutting from being brought in along with the rectangular blade body 32. in the rectangular sliding hole 22 , thus affecting the sliding of the cutting tool 3 in the rectangular sliding hole 22 .
  • the protective cover 23 includes a transverse plate 231 and vertical connecting plates 232 provided on opposite sides of the transverse plate 231.
  • the vertical connecting plates 232 are fixed on the support frame 2.
  • the transverse plate 231 A pair of opposing limiting portions 233 are provided on the upper side, and a limiting groove 2312 adapted to the tape is formed between the pair of limiting portions 233 .

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  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Packaging Frangible Articles (AREA)

Abstract

一种用于去除卷带芯片的芯片剔除装置，包括：承载台（1），具有落料孔（10）；支撑架（2），具有支撑臂（21）；裁切刀具（3），滑动在支撑臂（21）上，裁切刀具（3）沿靠近或远离落料孔（10）的方向滑动；裁切刀具（3）上设置有避让槽（31）和矩形刀体（32）；矩形刀体（32）具有四个边缘刀片（321）和边角裁切部（322）。该装置能够避免裁切刀体对被裁切掉的卷带的吸附并避免了裁切时溢胶情况的出现。

Description

用于去除卷带芯片的芯片剔除装置 技术领域
本发明涉及芯片封装技术领域，特别是一种用于去除卷带芯片的芯片剔除装置。
背景技术
覆晶技术(Flip Chip)，也称“倒晶封装”或“倒晶封装法”，是芯片封装技术的一种。此封装技术有别于过去芯片置放于基板上，再用打线技术将芯片与基板上的连结点连接的方式。而是在芯片连接点上长焊点，然后将芯片翻转过来使焊点与基板直接连结。目前覆晶技术已经被普遍应用在微处理器封装，而且也成为绘图、特种应用、和电脑芯片组等的主流封装技术。特别地，覆晶技术的代表性实施例为玻璃覆晶封装(Chip On Glass，COG)和薄膜覆晶封装(Chip On Film，COF)。
在上述封装工艺中，薄膜覆晶封装是一种将集成电路(IC)固定在基板上的晶粒软膜构装技术，运用软质附加电路板作为封装芯片载体将芯片与可挠性基板电路结合，并在芯片旁侧可挠性基板的上侧设置封装胶体进行封装。
在芯片与可挠性基板结合的过程中一般先将承载有可挠性基板的卷带放置在操作台上，操作台上设置的真空吸附孔将卷带吸附，然后通过封胶机带夹具下压卷带并将卷带夹紧定位在操作台上，然后再将芯片结合在可挠性基板上。
在将芯片结合在可挠性基板上之后需要对芯片进行测试，在测试完成后需要将不符合要求的芯片从卷带上剔除，现有技术中在剔除的时候通过冲压的方式将相应芯片周围的可挠性基板直接从卷带上裁切掉，采 用上述方式容易出现附着芯片的可挠性基板吸附在裁切刀具上，同时在实际使用过程中发现由于可挠性基板上涂覆有涂胶，对于可挠性基板较厚的产品需要涂覆两层涂胶，其中一层是铝箔一层是胶带，在现有方式裁切的时候含有两层涂胶的产品容易出现向外溢胶的情况，现有技术的刀体在下落的时候与卷带相接的刀片同时与被裁切的卷带接触，则会造成对卷带的挤压，这种挤压会造成胶体的外溢，从而出现溢胶的情况出现。
发明内容
本发明的目的是提供一种用于去除卷带芯片的芯片剔除装置，以解决现有技术中的不足，它能够有效的降低避让槽内形成负压，进而避免裁切刀体对被裁切掉的卷带的吸附；且有效的避免了裁切过程中溢胶情况的出现。
本发明提供的用于去除卷带芯片的芯片剔除装置，包括：
承载台，用于承载卷带，并具有贯穿所述承载台的落料孔；
支撑架，设置在所述承载台上并具有延伸设置在所述落料孔上侧的支撑臂；
裁切刀具，滑动设置在所述支撑臂上，所述裁切刀具与所述落料孔位置相对并沿靠近或远离所述落料孔的方向滑动；所述裁切刀具与所述落料孔相适配；
所述裁切刀具上设置有开口朝向承载台的避让槽和围成所述避让槽的矩形刀体；所述矩形刀体具有首尾顺次相连的四个边缘刀片和形成在相邻两个边缘刀片相交位置的边角裁切部，所述边缘刀片呈弧形并朝背离所述承载台的方向弯曲。
如上所述的用于去除卷带芯片的芯片剔除装置，其中，优选的是，所述裁切刀具上还具有若干与所述避让槽连通的吹气通道。
如上所述的用于去除卷带芯片的芯片剔除装置，其中，优选的是，所述吹气通道具有设置在所述避让槽底部的出气口和与所述出气口相对设置的进气口，所述进气口设置在所述裁切刀具上背离所述避让槽的一侧。
如上所述的用于去除卷带芯片的芯片剔除装置，其中，优选的是，所述承载台上背离所述支撑架的一侧设置有槽体，所述落料孔具有设置在所述槽体底部的避让出口，所述槽体的尺寸大于所述落料孔的尺寸。
如上所述的用于去除卷带芯片的芯片剔除装置，其中，优选的是，所述槽体呈椭圆形，且椭圆形的长轴与落料孔的长度方向相一致。
如上所述的用于去除卷带芯片的芯片剔除装置，其中，优选的是，所述支撑架上设置有与所述裁切刀具相适配的矩形滑孔，所述裁切刀具具有与所述矩形滑孔滑动配合的滑动部，所述滑动部具有首尾相接的四个滑动面，相邻两个滑动面之间通过倒角部连接。
如上所述的用于去除卷带芯片的芯片剔除装置，其中，优选的是，所述裁切刀具还具有设置在所述滑动部上的行程限位部，所述行程限位部被设置为限制穿设所述矩形滑孔。
如上所述的用于去除卷带芯片的芯片剔除装置，其中，优选的是，所述支撑架固定在所述承载台上并与所述承载台一体成型。
如上所述的用于去除卷带芯片的芯片剔除装置，其中，优选的是，所述承载台上还具有防静电保护板，所述支撑架上朝向承载台的一侧设置有保护盖。
如上所述的用于去除卷带芯片的芯片剔除装置，其中，优选的是，所述保护盖包括横向板和设置在横向板相对两侧的竖向连接板，竖向连接板固定在所述支撑架上，所述横向板上设置有相对设置的一对限位部，一对限位部之间形成限位槽。
与现有技术相比，本发明设置本实施例中将边缘刀片设置成弧形并且朝背离承载台的方向弯曲，在裁切的过程中边角裁切部先与卷带相接 触，在边角裁切部与卷带相接触之后，此时由于边缘刀片设置成弧形，边缘刀片距离待裁切的卷带之间还有间隙，正因为该间隙的存在能够使避让槽一直与外界连通，使矩形刀体在下落的过程中是渐进的与卷带结合，能够有效的降低避让槽内形成负压，进而避免裁切刀体对被裁切掉的卷带的吸附；
此外，由于矩形刀体在下落的过程中先是四个边角与卷带相接触并被裁切，然后边缘刀片内部的部分逐渐与卷带相接触也被裁切，采用这种方式能够有效的避免溢胶情况的出现。
附图说明
图1是本发明实施例公开的用于去除卷带芯片的芯片剔除装置的第一结构示意图；
图2是本发明实施例公开的用于去除卷带芯片的芯片剔除装置的第二结构示意图；
图3是本发明实施例公开的用于去除卷带芯片的芯片剔除装置的俯视图；
图4是图3中AA方向的剖视图；
图5是图3的仰视图；
图6是本发明实施例公开的用于去除卷带芯片的芯片剔除装置中的承台台与支撑架的安装结构示意图；
图7是本发明实施例公开的用于去除卷带芯片的芯片剔除装置中裁切刀具的第一结构示意图；
图8是本发明实施例公开的用于去除卷带芯片的芯片剔除装置中裁切刀具的第二结构示意图；
图9是本发明实施例公开的用于去除卷带芯片的芯片剔除装置中裁切刀具的主视图；
图10是图9的俯视图；
图11是本发明实施例公开的用于去除卷带芯片的芯片剔除装置中保护盖的结构示意图；
附图标记说明：1-承载台，10-落料孔，11-槽体，12-防静电保护板，
2-支撑架，21-支撑臂，22-矩形滑孔，23-保护盖，231-横向板，232-竖向连接板，233-限位部，
3-裁切刀具，31-避让槽，32-矩形刀体，321-边缘刀片，322-边角裁切部，33-吹气通道，331-出气口，332-进气口，34-滑动部，341-滑动面，342-倒角部，35-行程限位部。
具体实施方式
下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能解释为对本发明的限制。
本发明的实施例：如图1-11所示，用于去除卷带芯片的芯片剔除装置，包括：承载台1、支撑架2和裁切刀具3；
所述承载台1用于承载卷带，并具有贯穿所述承载台1的落料孔10；附着有芯片的卷带被放置在承载台1上，在放置后卷带上的芯片正好位于落料孔10的位置，在卷带被冲裁后附着有芯片的卷带被裁切然后通过落料孔10漏出。
所述支撑架2设置在所述承载台1上并具有延伸在所述落料孔10上侧的支撑臂21；所述支撑臂21用于固定支撑裁切刀具3。
裁切刀具3滑动设置在所述支撑臂21上，所述裁切刀具3与所述落料孔10位置相对并沿靠近或远离所述落料孔10的方向滑动；所述裁切刀具3与所述落料孔10相适配；
裁切刀具3能够穿设落料孔10，落料孔10的尺寸略大于裁切刀具3的尺寸，裁切刀具3能够沿着落料孔10上下滑动，这样在裁切刀具3下落的时候能够将裁切后的芯片从落料孔10落下。
如图7-9所示，所述裁切刀具3上设置有开口朝向承载台1的避让槽31和围成所述避让槽31的矩形刀体32；所述矩形刀体32具有首尾顺次相连的四个边缘刀片321和形成在相邻两个边缘刀片321相交位置的边角裁切部322，所述边缘刀片321呈弧形并朝背离所述承载台1的方向弯曲。
设置四个边缘刀片321首尾顺次相连以分别对芯片四个侧边进行裁切，从而能够方便的实现对附着芯片的卷带的切除。本实施例中将边缘刀片321设置成弧形并且朝背离承载台1的方向弯曲，在裁切的过程中边角裁切部322先与卷带相接触，在边角裁切部322与卷带相接触之后，此时由于边缘刀片321设置成弧形，边缘刀片321距离待裁切的卷带之间还有间隙，正因为该间隙的存在能够使避让槽31一直与外界连通，使矩形刀体32在下落的过程中是渐进的与卷带结合，能够有效的降低避让槽31内形成负压，进而形成的对被裁切掉的卷带的吸附。
如果矩形刀体32靠近承载台1的一侧是平整的，也就是所有边缘刀片321的裁切的位置都在一个平面，则整个矩形刀体32在下落的过程中在与卷带吸附的瞬间容易使避让槽31内形成负压，进而产生对裁切掉的卷带的吸附。
在实际使用过程中附着有芯片的卷带在定位在承载台1后，芯片朝下正好与落料孔10的位置相对，芯片定位在落料孔10内。当然由于有 避让槽31的存在，也可以将附着有芯片的卷带在定位到承载台后，使芯片朝上，在裁切刀具3下落的时候避让槽31正好罩住芯片，可以理解的是，所述避让槽31的深度不小于芯片的厚度。
此外，由于矩形刀体32在下落的过程中先是四个边角与卷带相接触并被裁切，然后边缘刀片321内部的部分逐渐与卷带相接触也被裁切，采用这种方式能够有效的避免溢胶情况的出现。如果矩形刀体32在下落的时候与卷带相接的四个边缘刀片321都是平面并且同时与被裁切的卷带接触，则会造成对卷带的挤压，这种挤压会造成胶体的外溢，从而出现溢胶的情况出现。
现有技术中如果裁切的过程一个面裁切下去，切口边缘会残留较多的胶体，造成切不干净，本实施例中边缘的边角裁切部322先进行裁切，然后逐渐过渡，能够避免溢胶问题的出现。
此外，将刀体设置成弧形也能够有效的降低刀具的损伤，弧形的设计降低了在冲下去裁切的冲击力，刀体如果以一整个平面冲裁的话其对卷带带来更大的冲击力，不利于使用过程中的稳定支撑。
在上述实施例中所述边缘刀片321设置成朝背离承载台2弯曲的弧形，在另一实施例中边缘刀片321还可以相对设置成倾斜的，边缘刀片321距离承载台的距离是不等的。
矩形刀体32的材料为钨钢90HRA，采用钨钢90HRA相比于现有技术的高速钢HRC60，能够进一步的降低对卷带的吸附，且能够减弱摩擦作用。
为了更有效的避免被裁切后的卷带被吸附，所述裁切刀具3上还具 有若干与所述避让槽31连通的吹气通道33。吹气通道33连接有气泵，通过气泵向避让槽31内出气，从而能够进一步的将吸附在裁切刀具3上的卷带切除。
如图4所示，所述吹气通道33具有设置在所述避让槽31底部的出气口331和与所述出气口331相对设置的进气口332，所述进气口332设置在所述裁切刀具3上背离所述避让槽31的一侧。
进一步的，为了更好的实现被裁切后的卷带掉落，所述承载台1上背离所述支撑架2的一侧设置有槽体11，所述落料孔10具有设置在所述槽体11底部的避让出口，所述槽体11的尺寸大于所述落料孔10的尺寸。
设置槽体11并将槽体11的尺寸设置成大于落料孔10，能够使被裁切后的卷带在从落料孔10被推出后迅速进入到更开阔的槽体11，从而有利于被裁切后的卷带的下落，降低卷带吸附在裁切刀具3上从而影响裁切刀具3的使用。
所述槽体11呈椭圆形，且椭圆形的长轴与落料孔10的长度方向相一致。落料孔10由于与矩形刀体32相适配，所以落料孔10也呈矩形并具有长度方向和宽度方向，所述槽体11的横截面矩形椭圆结构，并且椭圆的长轴方向与落料孔10的长度方向同向。
如图6-10所示，所述支撑架2上设置有与所述裁切刀具3相适配的矩形滑孔22，所述裁切刀具3具有与所述矩形滑孔22滑动配合的滑动部34，所述滑动部34具有首尾相接的四个滑动面341，相邻两个滑动面341之间通过倒角部342连接。
设置倒角部342能够使滑动部34与支撑臂21之间的滑动更加的顺畅，在本实施例中倒角部342为连接相邻的两个滑动面341的平面，整个滑动部34呈八角形。当然倒角部342还可以为连接相邻的两个滑动面341的圆弧，设置成圆弧能够更好的减弱滑动过程中的摩擦。当然在另一实施例中整个滑动面341还可以设置成圆柱状以进一步的降低滑动过程中产生的相对摩擦。
进一步的，为了更好的实现裁切刀具3在滑动过程中行程的限位，所述裁切刀具3还具有设置在所述滑动部34上的行程限位部35，所述行程限位部35被设置为限制穿设所述矩形滑孔32。
所述矩形刀体32与所述滑动部34一体成型，所述行程限位部35设置在所述滑动部34上远离所述矩形刀体32的一端，所述行程限位部35用于与所述支撑臂21的上表面相抵接以避免裁切刀具3在竖向方向上过度的向下滑动，从而实现了对裁切刀具3的保护。
在本实施例中，所述支撑架2固定在所述承载台1上并与所述承载台1一体成型。将支撑架2设置成与承载台1一体成型能够使整个装置更加的稳定，裁切刀具3在支撑臂21上滑动的时候也能更加的平稳滑动。此外一体成型的设置也能够使支撑臂21距离承载台1的距离更近，从而降低裁切刀具3的滑动行程，进而降低裁切刀具3滑动过程中的磨损。
所述承载台1上还具有防静电保护板12，所述支撑架2上朝向承载台1的一侧设置有保护盖23。
防静电保护板12和保护盖23位置相对并且两者都是防静电材料制成，在卷带放置在承载台1后卷带位于防静电保护板12上，防静电保护 板12能够有效的避免卷带与金属材质的承载台1接触，从而产生静电。
保护盖23对裁切刀具3形成包裹，保护盖23上形成与矩形刀体32相适配的穿孔，设置保护盖23能够有效的避免裁切后的碎屑随着矩形刀体32带入到矩形滑孔22内，从而影响裁切刀具3在矩形滑孔22内的滑动。
如图11所示，所述保护盖23包括横向板231和设置在横向板231相对两侧的竖向连接板232，竖向连接板232固定在所述支撑架2上，所述横向板231上设置有相对设置的一对限位部233，一对限位部233之间形成与卷带相适配的限位槽2312。
上文已详细说明了本发明的实施例。然而，前述说明是为了易于理解本发明的内容，而不是旨在限定本发明的记载。本发明可以包括在不脱离本发明的主旨的情况下可以更改和改进的那些方案。此外，本发明包括本发明的等同物。

Claims (10)

  1. 一种用于去除卷带芯片的芯片剔除装置，其特征在于，包括：
    承载台，用于承载卷带，并具有贯穿所述承载台的落料孔；
    支撑架，设置在所述承载台上并具有延伸设置在所述落料孔上侧的支撑臂；
    裁切刀具，滑动设置在所述支撑臂上，所述裁切刀具与所述落料孔位置相对并沿靠近或远离所述落料孔的方向滑动；所述裁切刀具与所述落料孔相适配；
    所述裁切刀具上设置有开口朝向承载台的避让槽和围成所述避让槽的矩形刀体；所述矩形刀体具有首尾顺次相连的四个边缘刀片和形成在相邻两个边缘刀片相交位置的边角裁切部，所述边缘刀片呈弧形并朝背离所述承载台的方向弯曲。
  2. 根据权利要求1所述的用于去除卷带芯片的芯片剔除装置，其特征在于：所述裁切刀具上还具有若干与所述避让槽连通的吹气通道。
  3. 根据权利要求2所述的用于去除卷带芯片的芯片剔除装置，其特征在于：所述吹气通道具有设置在所述避让槽底部的出气口和与所述出气口相对设置的进气口，所述进气口设置在所述裁切刀具上背离所述避让槽的一侧。
  4. 根据权利要求1所述的用于去除卷带芯片的芯片剔除装置，其特征在于：所述承载台上背离所述支撑架的一侧设置有槽体，所述落料孔具有设置在所述槽体底部的避让出口，所述槽体的尺寸大于所述落料孔的尺寸。
  5. 根据权利要求4所述的用于去除卷带芯片的芯片剔除装置，其特征在于：所述槽体呈椭圆形，且椭圆形的长轴与落料孔的长度方向相一致。
  6. 根据权利要求1所述的用于去除卷带芯片的芯片剔除装置，其特征在于：所述支撑架上设置有与所述裁切刀具相适配的矩形滑孔，所述裁切刀具具有与所述矩形滑孔滑动配合的滑动部，所述滑动部具有首尾 相接的四个滑动面，相邻两个滑动面之间通过倒角部连接。
  7. 根据权利要求6所述的用于去除卷带芯片的芯片剔除装置，其特征在于：所述裁切刀具还具有设置在所述滑动部上的行程限位部，所述行程限位部被设置为限制穿设所述矩形滑孔。
  8. 根据权利要求1所述的用于去除卷带芯片的芯片剔除装置，其特征在于：所述支撑架固定在所述承载台上并与所述承载台一体成型。
  9. 根据权利要求1所述的用于去除卷带芯片的芯片剔除装置，其特征在于：所述承载台上还具有防静电保护板，所述支撑架上朝向承载台的一侧设置有保护盖。
  10. 根据权利要求9所述的用于去除卷带芯片的芯片剔除装置，其特征在于：所述保护盖包括横向板和设置在横向板相对两侧的竖向连接板，竖向连接板固定在所述支撑架上，所述横向板上设置有相对设置的一对限位部，一对限位部之间形成限位槽。
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