WO2023209953A1 - 部品突上げ装置及び部品実装装置 - Google Patents

部品突上げ装置及び部品実装装置 Download PDF

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Publication number
WO2023209953A1
WO2023209953A1 PCT/JP2022/019285 JP2022019285W WO2023209953A1 WO 2023209953 A1 WO2023209953 A1 WO 2023209953A1 JP 2022019285 W JP2022019285 W JP 2022019285W WO 2023209953 A1 WO2023209953 A1 WO 2023209953A1
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WO
WIPO (PCT)
Prior art keywords
tool
head
push
component
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/019285
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English (en)
French (fr)
Japanese (ja)
Inventor
武 小木曽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to KR1020247027365A priority Critical patent/KR102908723B1/ko
Priority to PCT/JP2022/019285 priority patent/WO2023209953A1/ja
Priority to CN202280093112.9A priority patent/CN118743006A/zh
Priority to JP2024517765A priority patent/JP7712481B2/ja
Publication of WO2023209953A1 publication Critical patent/WO2023209953A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Definitions

  • the present invention includes a component pushing-up device that pushes up and peels off the die from below the wafer sheet when picking up a die (bare chip) from a wafer attached to a wafer sheet, and the component pushing-up device.
  • a component pushing-up device that pushes up and peels off the die from below the wafer sheet when picking up a die (bare chip) from a wafer attached to a wafer sheet, and the component pushing-up device.
  • a component mounting apparatus that picks up a die (bare chip) from a diced wafer and mounts it on a substrate.
  • a wafer camera captures an image of the wafer that is carried into a predetermined position (component placement area) inside the machine by a wafer feeder to recognize the wafer, and then the die is picked by a head equipped with a die holding function. This action is repeated.
  • the component mounting apparatus is equipped with a component lifting device that peels the die from the wafer sheet prior to picking the die by lifting the die from below the wafer attached to the wafer sheet.
  • the component push-up device includes a cylindrical suction housing and one or more push-up pins that are retractably installed in the center of the cylindrical suction housing. The die is pushed up from below using a pin.
  • This component push-up device is a type of component push-up device in which a component push-up unit pushes up a die while moving relative to a wafer.
  • the push-up unit is equipped with a push-up head (peeling promotion head mounting part) that can be rotated between vertical and horizontal positions, and the push-up tool is removably attached to the tool mounting part of the push-up head. be done.
  • the standby push-up tool is placed horizontally.
  • the push-up head is displaced from the vertical position to the horizontal position, and the push-up head moves vertically and horizontally to the standby position of the push-up tool.
  • the push-up tool mounted on the tool mounting section is locked by the locking arm, and in this state, the push-up head is moved backward, thereby removing the push-up tool from the tool mounting section.
  • the push-up head moves to the position of the replacement push-up tool, so that the push-up tool is mounted on the tool mounting section.
  • the thrusting head is reset from the horizontal position to the vertical position, thereby completing the replacement of the thrusting tool.
  • the present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a technology that contributes to smooth attachment and detachment of a push-up tool to a tool mounting part in a component push-up device in which the push-up tool can be automatically replaced. With the goal.
  • a component pushing-up device is a component pushing-up device that peels a die from a wafer sheet by pushing up a die from below a wafer attached to a wafer sheet, and the component pushing-up device peels the die from the wafer sheet.
  • a push-up tool includes a suction surface that suctions the bottom surface of a sheet under negative pressure, a push-up pin that can protrude and retract from the suction surface toward the wafer sheet side, and a push-up head that includes a tool mounting portion to which the push-up tool is attached.
  • the apparatus includes a head part for holding, and a head support part for supporting the head part so as to be elastically displaceable in a second direction perpendicular to the first direction.
  • the component mounting apparatus includes a component supply section in which diced wafers are placed and attached to a wafer sheet, and a component mounting device that picks dies from the wafers placed in the component supply section. and a component pushing device according to any one of claims 1 to 6, which pushes up the die from below the wafer sheet when the head picks the die.
  • FIG. 1 is a plan view of a main body of a component mounting apparatus according to the present invention (a component mounting apparatus equipped with a component pushing-up device according to the present invention).
  • FIG. 2 is a plan view showing a wafer table and a wafer table drive mechanism.
  • FIG. 3 is a schematic perspective view of the push-up unit and tool storage unit.
  • FIG. 4 is a sectional view of the tip portion of the thrusting head.
  • FIG. 5 is a sectional view of the push-up tool and the head main body in a separated state.
  • FIG. 6 is a perspective view of the head main body of the thrust-up head, the thrust-up tool, and the tool storage table.
  • FIG. 7 is a diagram showing the support structure of the chuck head in the base frame, in which (a) is a perspective view and (b) is a plan view.
  • FIG. 8 is an explanatory diagram of the operation of each part when replacing the push-up tool.
  • FIG. 9 is an explanatory diagram of the operation of each part when replacing the push-up tool.
  • FIG. 10 is an explanatory diagram of the operation of each part when replacing the push-up tool.
  • FIG. 11 is a schematic side view of the chuck head during the tool mounting operation.
  • FIG. 1 is a top plan view showing an apparatus main body 100 of a component mounting apparatus 1 according to an embodiment of the present invention.
  • the component mounting apparatus 1 is a hybrid component mounting apparatus that can mount a die 7a (component) diced from a wafer 7 onto a substrate P in addition to completed components such as transistors and capacitors.
  • XYZ orthogonal coordinates are shown to clarify the directional relationship.
  • the device main body 100 includes a base 2, a conveyor 3, a head unit 4, a component supply section 5, a push-up unit 40, and a tool storage unit 60.
  • the base 2 is a base on which various devices included in the device main body 100 are mounted.
  • the conveyor 3 is a transport line for substrates P installed on the base 2 so as to extend in the X direction.
  • the conveyor 3 carries the board P from outside the machine to a predetermined mounting work position, and after the mounting work, transports the board P from the mounting work position to the outside of the machine. Note that the position where the board P is shown in FIG. 1 is the mounting work position.
  • the component supply units 5 are provided on the ⁇ Y side and the +Y side with the conveyor 3 interposed therebetween.
  • the head unit 4 picks up the components at the component supply section 5, moves to the mounting work position, and mounts the components on the board P.
  • the head unit 4 includes a plurality of heads 4H, each of which is equipped with a suction nozzle that suctions and holds the component under negative pressure during the pickup.
  • the head 4H can move forward and backward (up and down) in the Z direction with respect to the head unit 4, and can rotate around an axis.
  • the head unit 4 is equipped with a board recognition camera 12 that takes an image of the board P. The federal mark attached to the board P is recognized by the image taken by the board recognition camera 12.
  • the apparatus main body 100 includes a head unit drive mechanism D1 that allows the head unit 4 to be moved in the horizontal direction (XY direction) between the component supply section 5 and the board P held at the mounting work position.
  • the head unit drive mechanism D1 is installed between a pair of Y-axis rails 13, a Y-axis motor 14, a ball screw shaft 15, and a pair of Y-axis rails 13 on the +X side and -X side provided on the elevated frame 11, respectively.
  • the support frame 16 is provided with a support frame 16.
  • the ball screw shaft 15 is screwed into a nut provided on the support frame 16.
  • the head unit drive mechanism D1 also includes an unillustrated guide member mounted on the support frame 16, an X-axis motor 17, and a ball screw shaft 18. The guide member supports the head unit 4 so as to be movable in the X direction, and the ball screw shaft 18 is screwed into a nut (not shown) provided on the head unit 4.
  • this head unit drive mechanism D1 By the operation of this head unit drive mechanism D1, the head unit 4 moves in the horizontal direction. That is, the ball screw shaft 15 is rotationally driven by the Y-axis motor 14, so that the head unit 4 moves in the Y direction together with the support frame 16, and the ball screw shaft 18 is rotationally driven by the X-axis motor 17. As a result, the head unit 4 moves in the X direction with respect to the support frame 16.
  • the component supply section 5 includes a first component supply section 5A located on the -Y axis of the conveyor 3 and a second component supply section 5B located on the +Y side.
  • a plurality of tape feeders 19 are arranged in parallel along the conveyor 3 in the first component supply section 5A.
  • the tape feeder 19 is a component supply device of a type that feeds a tape containing completed components such as the transistors and capacitors described above at regular intervals while feeding the tape.
  • the second component supply section 5B includes a wafer supply device 6 that supplies a plurality of dies 7a in the form of wafers 7, and a wafer supply device 6 that picks up the dies 7a from the wafer 7 and transfers them to a predetermined delivery position with respect to the head unit 4.
  • a component transfer unit 33, a wafer camera 39, and a component recognition camera 10 are provided.
  • the wafer supply device 6 includes a wafer storage elevator 22, a wafer table 20, and a wafer drawer unit 23.
  • the wafer storage elevator 22 stores the wafer sheets 8a to which the wafers 7 are attached in multiple stages, with the wafer sheets 8a being held by the wafer holders 8.
  • the wafer storage elevator 22 raises and lowers the wafers 7 stored in multiple stages as one, and arranges any wafer 7 at a height corresponding to the height of the wafer table 20.
  • the wafer table 20 is placed on the -Y side of the wafer storage elevator 22.
  • the wafer table 20 is a workbench for taking out parts that holds the wafer holder 8 (wafer 7).
  • the wafer supply device 6 includes a wafer table drive mechanism D2 that allows the wafer table 20 to be moved in the horizontal direction (XY direction).
  • FIG. 2 is a plan view showing the wafer table 20 and the wafer table drive mechanism D2.
  • the wafer table drive mechanism D2 includes a pair of X-axis rails 30 on the +Y side and -Y side, an X-axis motor 31, a ball screw shaft 32, and a plate-shaped support frame 26 installed on the pair of X-axis rails 30. Equipped with.
  • the ball screw shaft 32 is threaded into a nut provided on the support frame 26.
  • the wafer table drive mechanism D2 includes a pair of Y-axis rails 27 provided on the support frame 26 on the +X side and the -X side, a Y-axis motor 28, and a ball screw shaft 32.
  • the ball screw shaft 32 is screwed into a nut provided on the wafer table 20.
  • this wafer table drive mechanism D2 By the operation of this wafer table drive mechanism D2, the wafer table 20 moves in the horizontal direction. That is, the ball screw shaft 32 is rotationally driven by the X-axis motor 31, so that the wafer table 20 moves together with the support frame 26 in the X direction, and the ball screw shaft 29 is rotationally driven by the Y-axis motor 28. As a result, the wafer table 20 moves in the Y direction with respect to the support frame 26.
  • the target die 7a is placed at a predetermined pickup position P1 defined by the XY coordinates by moving the wafer table 20.
  • the wafer drawer unit 23 takes the wafer holder 8 in and out between the wafer storage elevator 22 and the wafer table 20.
  • the wafer drawer unit 23 includes a drawer head 24 that can lock the wafer holder 8, and a drawer head drive device 25 that moves the drawer head 24 in the Y direction.
  • the wafer drawer unit 23 moves the wafer holder 8 by moving the drawer head 24 in the Y direction, with the wafer holder 8 locked by the drawer head 24. That is, the wafer 7 is taken in and out of the wafer storage elevator 22 together with the wafer holder 8 .
  • This loading and unloading of the wafer holder 8 is made possible by arranging the wafer table 20 at a predetermined wafer loading/unloading position that closely opposes the -Y side of the wafer storage elevator 22.
  • the component transfer unit 33 includes a transfer head 34 for picking up the die 7a placed at the pickup position P1 from the wafer 7, a transfer table 38 for delivering the die 7a to the head unit 4, and a transfer head 34. It is provided with a transfer head drive mechanism D3 that allows the transfer head to be moved.
  • the transfer head 34 includes a suction nozzle 34a that holds the die 7a by suctioning it under negative pressure.
  • the transfer head 34 picks up the die 7a by suctioning the die 7a under negative pressure at the pickup position P1.
  • the suction nozzle 34a can move forward and backward (up and down) in the Z direction with respect to the base portion of the transfer head 34, and can rotate around a horizontal axis. By rotating the transfer head 34 around the horizontal axis, it becomes possible to vertically invert the attitude of the die 7a.
  • the transfer table 38 is a transfer table for transferring the die 7a held by the suction nozzle 34a to the head 4H of the head unit 4.
  • the transfer table 38 is arranged at a predetermined transfer position close to the mounting work position.
  • the transfer head drive mechanism D3 includes a rail 37 that movably supports the transfer head 34, a ball screw shaft 36 arranged parallel to the rail 37, and a motor 35.
  • the ball screw shaft 36 is screwed into a nut provided on the transfer head 34.
  • the transfer head drive mechanism D3 moves the transfer head 34 in the space between the pickup position P1 and the transfer table 38 by rotationally driving the ball screw shaft 36 by the motor 35.
  • the wafer camera 39 images a portion of the wafer 7 held on the wafer table 20 at the pickup position P1, that is, the die 7a within the field of view of the camera from above. Based on this captured image, the position of the die 7a to be picked up is recognized.
  • the wafer camera 39 is supported by an elevated frame (not shown) so as to be positioned above the transfer head 34 with the transfer head 34 disposed at the pickup position P1. This avoids interference with the transfer head 34.
  • the component recognition camera 10 is arranged at a position adjacent to the +X side of the transfer table 38.
  • the component recognition camera 10 images the components (the die 7a and the completed component) adsorbed on the head 4H of the head unit 4 from below before mounting on the board P. Based on this captured image, the state of suction of the component by the head 4H is recognized.
  • FIG. 3 is a schematic perspective view of the push-up unit 40 and tool storage unit 60.
  • these push-up unit 40 and tool storage unit 60 correspond to the "component push-up device" of the present invention, and in the following explanation, the push-up unit 40 and tool storage unit 60 will be referred to as "component push-up device”.
  • component push-up device sometimes referred to as
  • the push-up unit 40 and the tool storage unit 60 are arranged below the component supply section 5, specifically, below the support frame 26 of the wafer table drive mechanism D2. .
  • the wafer table 20 is provided with a circular opening 20a, and the support frame 26 is provided with an unillustrated opening at a position that can overlap with the opening 20a.
  • a push-up unit 40 is arranged below these openings. That is, when the wafer holder 8 is held on the wafer table 20, the wafer 7 is placed inside the opening 20a. The push-up unit 40 pushes up the die 7a through each opening of the support frame 26 and the wafer table 20.
  • the push-up unit 40 includes a push-up head 41 and a push-up head drive mechanism D6. As shown in FIGS. 3 and 4(a), the push-up head 41 includes a shaft-shaped head main body portion 42 extending in the Z direction, and a push-up tool 45 attached to the upper end portion of the head body portion 42. Note that FIG. 4A is a cross-sectional view of the tip portion of the thrusting head 41. As shown in FIG.
  • the thrusting head 41 is arranged so that the head main body portion 42 is located at the pickup position P1.
  • the head main body part 42 has a cylindrical shape and is provided with a thrust main shaft 44 at its center that moves forward and backward (up and down) in the Z direction.
  • the push-up tool 45 includes a suction housing 46 (sometimes referred to as a "suction dome") for suctioning the wafer sheet 8a from below, and a pin holder 48 disposed inside the suction housing 46.
  • the suction housing 46 is a cylindrical member with an open top, including a suction surface portion 46a having a circular suction surface in plan view for suctioning the wafer sheet 8a under negative pressure, and a cylindrical portion 46b extending downward from the periphery thereof.
  • a plurality of pin holes 47 are formed in the suction surface portion 46a in a predetermined arrangement.
  • a push-up tool 45 is removably attached to the tip (upper end) of the head main body 42 via the suction housing 46.
  • a tool mounting part 43 having a smaller diameter than other parts is formed at the tip of the head main body part 42, and by fitting the cylindrical part 46b of the suction housing 46 into this tool mounting part 43, A push-up tool 45 is attached to the head body portion 42. That is, by moving the push-up tool 45 relative to the tool mounting portion 43 in the Z direction (corresponding to the “first direction” of the present invention), the push-up tool 45 is moved relative to the tool mounting portion 43. It is configured to be detachable.
  • the mounting structure of the push-up tool 45 on the head main body 42 may be such that, for example, a circular recess is formed as the tool mounting portion 43 at the tip of the head main body 42, and the push-up tool 45 is fitted into the circular recess. good.
  • the thrusting tool 45 is attached to the thrusting head 41.
  • the pin holder 48 is a member in which one or more push-up pins 50 are erected on a disc-shaped pin base 49, and is movable in the Z direction along the inner peripheral surface of the cylindrical portion 46b. is maintained. As shown in FIG. 4(b), the pin holder 48 is pushed up against the suction housing 46 by the forward (upward) movement of the push-up main shaft 44. As a result, the push-up pin 50 projects upward from the suction surface portion 46a through the pin hole 47. When the push-up main shaft 44 moves backward (downward), the pin holder 48 descends with respect to the suction housing 46 by its own weight or by the biasing force of an elastic member (such as a spring) not shown. As a result, the push-up pin 50 is retracted into the suction housing 46 (pin hole 47). That is, the push-up pin 50 is provided so as to be able to protrude and retract upward from the suction surface portion 46a.
  • a tool storage unit 60 which will be described later, holds and stores a plurality of push-up tools 45 having different configurations, and when picking the die 7a, a tool storage unit 60, which will be described later, holds and stores a plurality of push-up tools 45 with different configurations.
  • a thrusting tool 45 is attached to the thrusting head 41.
  • a tapered part 461 is formed at the opening edge of the cylindrical part 46b of the push-up tool 45 (suction housing 46), and a tapered part 431 is formed on the outer peripheral surface of the tip of the tool mounting part 43. It is formed.
  • the thrusting head drive mechanism D6 is composed of, for example, a cylinder mechanism using air as a drive source. Due to the operation of the thrust head drive mechanism D6, the thrust head 41 moves forward and backward (up and down) at the pickup position P1. Specifically, a predetermined push-up height position where the suction surface portion 46a comes into contact with the lower surface of the wafer sheet 8a, and a predetermined standby height position (position shown in FIG. 3) that is retracted downward from the push-up height position Move forward and backward between.
  • a first tool detection sensor Se1 capable of detecting the presence or absence of the push-up tool 45 at the tip of the push-up head 41 is arranged on the -Y side of the push-up head 41 arranged at the standby height position. There is.
  • the tool storage unit 60 is provided adjacent to the +X side of the push-up unit 40, as shown in FIGS. 2 and 3.
  • the tool storage unit 60 includes a tool storage section 60A and a tool transfer mechanism 60B.
  • the tool storage section 60A holds and stores a plurality of types of push-up tools 45, and the tool transfer mechanism 60B transports the push-up tools 45 between the push-up unit 40 and the tool storage section 60A.
  • the tool storage unit 60A includes a tool storage table 61 that holds the push-up tool 45, a storage table drive mechanism D4 that moves the tool storage table 61, and a code reading sensor Se3.
  • the tool storage table 61 is arranged at a position adjacent to the head body portion 42 of the thrusting head 41 on the +X side.
  • the tool storage table 61 has a rectangular shape in plan view that is elongated in the X direction, and includes a plurality of tool holding sections 62 on the upper surface.
  • the tool holding portion 62 is a circular recess formed on the upper surface of the tool storage table 61.
  • the inner diameter of the tool holding part 62 is set to a size that allows the push-up tool 45 (suction housing 46) to fit therein, and the push-up tool 45 has its lower end loosely fitted into the tool holding part 62. It is supported on a tool storage table 61.
  • the tool storage table 61 is provided with three tool holders 62 arranged in a row at equal intervals in the X direction. As shown in FIG. 2, in plan view, each tool holding portion 62 is provided such that its center is located on a straight line L1 extending in the X direction through the center of the head body portion 42 of the thrusting head 41. It is being The first tool 45A is placed in the tool holding part 62 at the -X side end (hereinafter referred to as a first tool holding part 62A), and the second tool is placed in the middle tool holding part 62 (hereinafter referred to as a second tool holding part 62B).
  • the tool holding part 62 (appropriately, third tool holding part 62C) at the +X side end.
  • the first tool 45A is attached to the push-up head 41, so the first tool holding portion 62A is empty.
  • FIG. 6 is a perspective view showing the head main body portion 42 of the push-up head 41, the push-up tool 45, and the tool storage table 61.
  • a positioning convex portion 43a is provided on the outer circumferential surface of the tool mounting portion 43 of the head main body portion 42
  • a positioning recess 56 is provided on the outer circumferential surface of the push-up tool 45 (suction housing 46).
  • the push-up tool 45 is mounted on the tool mounting portion 43 in a state in which it is positioned around the vertical axis by fitting the positioning convex portion 43a and the positioning recess 56.
  • a positioning convex portion 63 is provided on the inner circumferential surface of each tool holding portion 62 of the tool storage table 61, and the push-up tool 45 can be moved vertically by fitting the positioning convex portion 63 and the positioning concave portion 56. It is held by the tool holding part 62 in a state in which it is positioned around the periphery.
  • the positioning convex portion 43a of the head main body portion 42 and each positioning convex portion 63 of each tool holding portion 62 are both on the straight line L in plan view, and are both provided on the -X side.
  • the push-up tool 45 is held on the tool storage table 61 in the same posture as the head body section 42 is attached to the tool attachment section 43 (in this example, both the vertical direction and the direction around the axis are the same).
  • Ru a second tool detection sensor Se2 is embedded in the inner bottom surface of each tool holding part 62, and the presence or absence of the push-up tool 45 in each tool holding part 62 can be detected.
  • the storage table drive mechanism D4 is composed of, for example, a screw feeding mechanism using a motor as a drive source. Due to the operation of the storage table drive mechanism D4, the tool storage table 61 is moved horizontally in the The tool is alternatively placed at the tool insertion/removal position P2. Note that the storage table drive mechanism D4 may be constituted by a cylinder mechanism using air as a drive source.
  • the code reading sensor Se3 is a sensor that reads the identification mark of each push-up tool 45 held on the tool storage table 61.
  • the code reading sensor Se3 is arranged on the ⁇ Y side of the tool loading/unloading position P2, and reads the identification information recorded in the identification information recording section provided on the side surface of the push-up tool 45 placed at the tool loading/unloading position P2. .
  • a notch-like flat surface portion 52 for the cord is formed on the outer peripheral portion of the -Y side of the cylindrical portion 46b of the push-up tool 45 (suction housing 46).
  • a one-dimensional or two-dimensional identification code 54 is provided on the code plane part 52 as an identification information recording part.
  • the code reading sensor Se3 reads this identification code 54.
  • the tool transfer mechanism 60B includes a chuck head 65 and a chuck head drive mechanism D5 that moves the chuck head 65 in the Z direction and the X direction.
  • the chuck head 65 is an electrically or air-driven parallel opening/closing chuck device that is equipped with a pair of claws 66 that can be opened and closed in the X direction on the ⁇ Y side side of a head main body portion 65a having a generally rectangular parallelepiped shape. .
  • the chuck head 65 holds the push-up tool 45 by pinching the push-up tool 45 from both sides in the X direction with the pair of claws 66 .
  • the chuck head drive mechanism D5 includes, for example, a slider 72 that moves in the X direction by a screw feed mechanism that uses a motor as a drive source, and a base frame 68 that similarly moves in the Z direction by a screw feed mechanism that uses a motor as a drive source.
  • the base frame 68 is a vertically flat block-shaped structure, and the chuck head 65 is supported by this base frame 68.
  • the chuck head drive mechanism D5 By the operation of the chuck head drive mechanism D5, the base frame 68 moves in the X direction together with the slider 72, and the base frame 68 moves in the Z direction with respect to the slider 72.
  • the chuck head 65 moves in the X direction and the Z direction.
  • the chuck head drive mechanism D5 may be configured to move the slider 72 and the base frame 68 using a cylinder mechanism using air as a drive source.
  • FIG. 7(a) is a perspective view showing the support structure of the chuck head 65 on the base frame 68. As shown in the figure, the chuck head 65 is supported on the upper surface of the base frame 68 via a connecting part 80 and a plurality of positioning parts 82.
  • the connecting portion 80 is interposed between the base frame 68 and the chuck head 65 to connect them, and a part or all of the connecting portion 80 is elastically deformed, so that the chuck head 65 is moved relative to the base frame 68 in the XY direction (i.e. , horizontal direction/corresponding to the "second direction" of the present invention).
  • the connecting portion 80 includes, for example, a shaft portion fixed to one side of the lower surface of the head main body portion 65a and the upper surface of the base frame 68, a cylindrical portion fixed to the other side into which the shaft portion is inserted, and these shafts.
  • the chuck head 65 is provided with an elastic body such as rubber, resin, or a spring that is interposed between the cylindrical part and the cylindrical part, and allows the chuck head 65 to be displaced in the X and Y directions by elastically deforming the elastic body.
  • the positioning section 82 positions the chuck head 65 with respect to the base frame 68 in the XY directions.
  • the positioning portion 82 includes a positioning convex portion 84 provided on the upper surface of the base frame 68 and a positioning recess 87 provided on the lower surface side of the chuck head 65.
  • the positioning convex part 84 is made of, for example, a well-known ball plunger, and includes a cylinder part 85a arranged upright on the upper surface of the base frame 68, and a sphere 85b held at the tip (upper end) of the cylinder part 85a so as to be able to protrude and retract and roll freely. It includes a coil spring 85c that urges the sphere 85b toward the tip of the cylinder portion 85a.
  • the positioning recess 87 is provided on the lower surface of a positioning block 86 fixed to the lower surface of the chuck head 65.
  • the positioning recess 87 is a conical recess that is concave upward so that the inner diameter gradually decreases from the bottom to the top, and the tip of the positioning convex 84, that is, the sphere 85b is pressed into the center portion. As a result, the chuck head 65 is positioned at a position where the center of the positioning convex portion 84 coincides with the center of the positioning recess 87 .
  • FIG. 7(b) is a schematic plan view showing the arrangement of the connecting portion 80 and the positioning convex portion 84.
  • the connecting portion 80 is placed at the center of gravity of the head body portion 65a, and the positioning portions 82 are placed at four locations surrounding the connecting portion 80.
  • the positioning parts 82 are arranged so that the straight-line distances d1 between their centers C2 and the center C1 of the connecting parts 80 are equal, and the straight-line distances d2 between the centers of adjacent parts in the X direction and the Y direction are equal. It is located in The position where the elastic body of the connecting part 80 is not deformed is the reference position Rp of the chuck head 65, and the chuck head 65 is positioned at this reference position Rp by the positioning part 82.
  • the pair of claws 66 are arranged at positions intersecting the straight line L, and the chuck head 65 is moved in the X direction and the Z direction by the operation of the chuck head drive mechanism D5. do. Therefore, the chuck head 65 clamps the push-up tool 45 on the straight line L.
  • cutout-shaped chuck flat portions 53 are provided at the outer peripheral portions of the +X side and the ⁇ X axis, respectively.
  • Each chuck flat portion 53 is a plane parallel to each other.
  • each claw 66 has a clamping surface parallel to the flat part 53, and the chuck head 65 clamps the chuck flat part 53 of the push-up tool 45 with the clamping surface of the pair of claws 66. Therefore, the push-up tool 45 is held and conveyed by the chuck head 65 while maintaining the posture placed on the tool holding section 62.
  • the chuck head 65, the base frame 68, the connecting part 80, and the positioning part 82 correspond to the "head holding member" of the present invention, and the chuck head 65 corresponds to the "head part” of the present invention.
  • the base frame 68, the connecting part 80, and the positioning part 82 correspond to the "head support part” of the present invention, and the base frame 68 corresponds to the "base part” of the present invention.
  • the basic operation when mounting the die 7a on the substrate P in the component mounting apparatus 1 described above is as follows. First, the wafer table 20 is placed at the wafer loading/unloading position, and the wafer holder 8 is pulled out from the wafer storage elevator 22 to the wafer table 20 by the wafer pulling unit 23 . As a result, the wafer sheet 8a to which the assembly (wafer 7) of a large number of dies 7a, 7a, . . . is attached is placed on the wafer table 20.
  • the wafer table 20 By moving the wafer table 20, the die 7a to be picked up is placed at the pickup position P1, and the wafer camera 39 images the die 7a. At this time, the transfer head 34 of the component transfer unit 33 retreats from the pickup position P1. The image taken by the wafer camera 39 is for recognizing the die 7a that the transfer head 34 attracts in a later picking operation.
  • the transfer head 34 When the imaging of the die 7a is completed, the transfer head 34 is placed at the pickup position P1, and the suction nozzle 34a picks up the die 7a recognized by the imaging by the wafer camera 39. At this time, the die 7a is pushed up by the push-up head 41. Specifically, the push-up head 41 is displaced (raised) from the standby height position to the push-up height position, and the wafer sheet 8a is suctioned under negative pressure by the suction surface portion 46a. Thereafter, the push-up pin 50 projects from the suction surface portion 46a by the operation of the push-up main shaft 44, and the die 7a is pushed up through the wafer sheet 8a.
  • the transfer head 34 moves from above the wafer table 20 to above the transfer table 38.
  • the die 7a is transferred to the head unit 4 with the suction nozzle 34a in the suction posture, the die 7a is released onto the transfer table 38.
  • the transfer head 34 retreats from above the transfer table 38, and the head unit 4 moves above the transfer table 38, and the head 4H picks up the die 7a from the transfer table 38.
  • the head unit 4 moves above the component recognition camera 10, above the board P at the mounting work position, and descends. Thereby, the die 7a is mounted on the substrate P.
  • the suction nozzle 34a rotates above the transfer table 38, thereby changing the position of the die 7a. Flip it upside down. Thereafter, the head unit 4 moves above the transfer head 34, and the head 4H picks up the die 7a directly from the suction nozzle 34a. After picking the die 7a, similarly to the above, the head unit 4 moves above the component recognition camera 10 and above the board P at the mounting work position. Thereby, the die 7a is mounted on the substrate P.
  • the optimum form of the push-up tool 45 used when picking the die 7a differs depending on the size of the die 7a, the circuit formed therein, etc., as described above. Therefore, when the type of die 7a is changed, the push-up tool 45 attached to the push-up head 41 is replaced accordingly.
  • FIG. 8 is an explanatory diagram of the operation of each part when replacing the push-up tool.
  • (a) is a plan view
  • (b) is a side view from the -Y side, each schematically showing the push-up unit 40 and tool storage unit 60. It shows.
  • the first tool 45A is attached to the push-up head 41, and therefore the first tool holding section 62A of the tool storage table 61 is empty.
  • the tool storage unit 60 is arranged such that the second tool holding section 62B is located at the tool loading/unloading position P2, and the chuck head 65 is located at a standby position above the tool loading/unloading position P2.
  • the chuck head 65 moves from the standby position to above the push-up head 41, and then lowers on the spot to pick up the first tool 45A attached to the push-up head 41. It is held between the claws 66. Thereby, the chuck head 65 holds the first tool 45A.
  • the chuck head 65 rises while holding the first tool 45A, moves to the standby position, that is, above the tool loading/unloading position P2, and then lowers.
  • the empty tool holding part 62 (that is, the first tool holding part 62A) is detected based on the presence or absence of a signal output from the second tool detection sensor Se2, and the empty tool holding part 62 is placed at the tool loading/unloading position P2. If not, the tool storage table 61 is moved so that the empty tool holding section 62 is placed at the tool loading/unloading position P2.
  • the chuck head 65 ascends after releasing the first tool 45A to the first tool holding portion 62A.
  • the first tool 45A is returned to the tool storage table 61 (first tool holding section 62A), and the tool return operation is completed.
  • the first tool 45A is held on the chuck head 65 in the same posture as when it is attached to the push-up head 41 by having the flat chuck portion 53 held by the claws 66. Therefore, the first tool 45A returned to the first tool holding part 62A can be positioned by the positioning recess 56 and the positioning protrusion 63, and the first tool 45A can be held in the same posture as when it is attached to the push-up head 41. It is held in the section 62A.
  • the process moves to a tool mounting operation.
  • the tool storage table 61 moves in the X direction, and the push-up tool 45 (here, the third tool 45C) to be mounted is placed at the tool insertion/removal position P2.
  • the chuck head 65 descends from the standby position, holds the third tool 45C, and rises, as shown in FIGS. 10(b) and 10(c). After moving above the head body portion 42 of the thrusting head 41, it descends. As a result, the third tool 45C is attached to the push-up head 41.
  • FIG. 11 is a schematic side view of the chuck head during the tool mounting operation.
  • the third tool 45C when the third tool 45C is mounted on the tool mounting portion 43, due to a movement error of the chuck head 65, the center axis Ax1 of the cylindrical portion 46b of the third tool 45C and the tool mounting It is assumed that a misaligned state occurs in which the center axis Ax2 of the portion 43 is mutually shifted in the XY direction.
  • the third tool 45C approaches the head main body part 42, the taper part 461 of the third tool 45C and the taper part 431 of the tool mounting part 43 move the third tool 45C so that the central axes Ax1 and AX2 coincide with each other.
  • Tool 45C is guided. This guidance applies a lateral (XY direction) load to the third tool 45C.
  • the chuck head 65 is supported so as to be elastically displaceable in the X and Y directions relative to the base frame 68, so that when the load of the third tool 45C is input as an external force, As shown in FIG. 11(b), it is displaced together with the third tool 45C. That is, the chuck head 65 is displaced from the reference position Rp with respect to the base frame 68 together with the third tool 45C so that the load acting on the third tool 45C is eliminated.
  • the chuck head 65 moves to the standby position above the tool loading/unloading position P2, as shown in FIG. 10(d). This completes the tool return operation.
  • the chuck head 65 is moved by the elastic force of the connecting portion 80 (elastic body) as shown in FIG. As shown in (c), it is reset to the reference position Rp. Thereby, the chuck head 65 is positioned at the reference position Rp by the positioning section 82.
  • the push-up tool 45 is pushed up when the push-up tool 45 is attached to the head body section 42 (tool mounting section 43).
  • the chuck head 65 is displaced in the XY direction together with the lifting tool 45 so that the load is eliminated.
  • the push-up tool 45 is mounted in a state where the load on the push-up tool 45 is suppressed or eliminated.
  • Such a situation also occurs when the push-up tool 45 attached to the head main body portion 42 is removed. That is, as shown in FIGS. 9A and 9B, when the push-up tool 45 is held by the chuck head 65, the opening/closing center of the pair of claws 66 is located either left or right (X direction) from the center of the push-up tool 45. If it is misaligned, a lateral (XY direction) load may be generated on the push-up tool 45 when the push-up tool 45 is held. In this case as well, the chuck head 65 is displaced in the XY directions with respect to the base frame 68 so that the load is eliminated.
  • the operation of attaching and removing the pushing-up tool 45 to and from the head main body portion 42 becomes smoother. That is, the replacement operation of the push-up tool 45 is performed more smoothly. Therefore, there are inconveniences caused by mounting or removing the push-up tool 45 while the load is still applied, such as deterioration of the fitting condition due to wear of the push-up tool 45 or the head main body portion 42 (tool mounting portion 43), and even worse. Deterioration of die push-up performance is effectively suppressed or prevented.
  • the chuck head 65 is provided so as to be elastically displaceable with respect to the base frame 68, the chuck head 65 is displaced by the minimum amount of movement required depending on the magnitude of the load, and the load is It becomes possible to eliminate the problem.
  • the chuck head 65 is positioned at the reference position Rp by the positioning section 82, and only when the load is applied, this positioning state is released and the chuck head 65 is displaced. Therefore, while controlling the operation of the chuck head 65 based on the reference position Rp, the chuck head 65 can be displaced only when necessary as described above, and the chuck head 65 can be displaced while the uplift tool 45 is being conveyed. This prevents loss of position accuracy due to instability of the position.
  • the urging force of the positioning part 82 causes the chuck head 65 to move to the reference position. It is reset to position Rp. Therefore, it becomes possible to more reliably reset the chuck head 65 that has been displaced from the reference position Rp to the reference position Rp.
  • the diameter of the positioning recess 87 of the positioning portion 82 is set so that the sphere 85b of the positioning convex portion 84 is located within the positioning recess 87 based on the estimated value of the misalignment.
  • the positioning portion 82 is always held in such a way that the sphere 85b is pressed against the slope of the positioning recess 87 by the elastic force of the coil spring 85c. It is configured.
  • the positioning section 82 is configured to generate a biasing force that biases the chuck head 65 displaced from the reference position Rp toward the reference position Rp. Therefore, according to this component lifting device, it is possible to reliably reset the chuck head 65 displaced from the reference position Rp to the reference position Rp.
  • the chuck head 65 can be stably positioned at the reference position Rp by the centering effect. Can be done.
  • the component mounting apparatus 1 described above is an example of an embodiment of a component mounting apparatus according to the present invention (a component mounting apparatus equipped with a component pushing-up apparatus of the present invention), and the component mounting apparatus 1 and the component pushing-up apparatus ( The specific configurations of the push-up unit 40 and tool storage unit 60) can be changed as appropriate without departing from the gist of the present invention.
  • the configuration in which the chuck head 65 is elastically displaceable in the XY directions with respect to the base frame 68, and the structure in which the chuck head 65 is positioned at the reference position Rp are not limited to the structure of the embodiment, and may be used as appropriate. Can be changed.
  • the push-up head 41 is arranged at the pick-up position P1, and as the wafer 7 moves in the XY direction with respect to the push-up head 41, the die 7a to be picked up is arranged at the pick-up position P1.
  • This is the configuration that will be used.
  • the push-up head 41 side may be moved in the XY direction and placed below the die 7a to be picked up.
  • the push-up head 41 is moved to a predetermined tool exchange area, and a position adjacent to the tool exchange area is set so that the tool exchange is performed on the push-up head 41 placed in this tool exchange area.
  • the tool storage unit 60 may be disposed at.
  • a component pushing-up device is a component pushing-up device that peels a die from a wafer sheet by pushing up a die from below a wafer attached to a wafer sheet, and the component pushing-up device peels the die from the wafer sheet.
  • a push-up tool includes a suction surface that suctions the bottom surface of a sheet under negative pressure, a push-up pin that can protrude and retract from the suction surface toward the wafer sheet side, and a push-up head that includes a tool mounting portion to which the push-up tool is attached.
  • the apparatus includes a head part for holding, and a head support part for supporting the head part so as to be elastically displaceable in a second direction perpendicular to the first direction.
  • this component pushing-up device for example, when the pushing-up tool held by the holding member is attached to the tool mounting part, the pushing-up tool is fitted into the tool mounting part without any load. Then, the head portion holding the push-up tool is displaced in the second direction with respect to the head support portion together with the push-up tool. Similarly, when the holding member holds the push-up tool and removes it from the tool mounting section, the head section is displaced in the second direction so that the push-up tool is removed without any load. Therefore, the push-up tool can be more smoothly attached to and detached from the tool mounting portion.
  • the head support section includes a base section and a connecting section that is interposed between the base member and the head section to connect them, and the connecting section is one of the connecting sections.
  • the head part is configured to be displaced in the second direction with respect to the base member by elastically deforming the head part or the whole part.
  • the head portion is displaced in the second direction by elastically deforming the connecting portion interposed between the base portion and the head portion.
  • the connecting portion is deformed. In other words, it is possible to displace the head portion in the second direction by an amount of movement corresponding to the magnitude of the load.
  • the head support section further includes a positioning section that positions the head section at a predetermined reference position with respect to the base section in the two directions, and the positioning section is configured to The head section is configured to allow displacement of the head section in the second direction by inputting an external force in the second direction to the head section.
  • this component push-up device when a load is applied to the push-up tool when it is fitted into the tool mounting portion (when an external force in the second direction is input), the head portion is displaced from the reference position in the second direction. , otherwise, the head section is positioned at the reference position by the positioning section. Therefore, while maintaining the positional accuracy of the head part, it is possible to displace the head part only when a load is generated on the push-up tool when fitting into the tool mounting part.
  • the positioning section is configured to generate a biasing force that biases the head toward the reference position in a state displaced from the reference position in the second direction.
  • this component lifting device it becomes possible to more reliably reset the head portion displaced from the reference position in the second direction to the reference position.
  • the positioning portion may be provided at a plurality of positions surrounding the connecting portion. According to this configuration, it is possible to more accurately reset the head portion displaced from the reference position in the second direction to the reference position.
  • the above component lifting device further includes a tool storage table capable of supporting each of the plurality of lifting tools, and the tool transfer mechanism holds the lifting tool attached to the lifting head.
  • a tool return operation in which the tool is removed by a member and returned to the tool storage table, and/or the uplift tool supported by the tool storage table is held by the holding member and attached to the tool mounting portion of the upthrust head.
  • the tool is configured to perform a mounting operation.
  • this component push-up device it is possible to smoothly attach and detach the push-up tool to and from the tool mounting portion in the tool return operation and tool mounting operation.
  • the tool mounting portion may be formed so that the pushing up tool is fitted therein.
  • at least one of the tool mounting portion and the push-up tool is provided with a tapered portion that guides the push-up tool with respect to the tool mounting portion.
  • this component push-up device when the push-up tool is attached to the tool mounting section, the push-up tool is guided so that these centers coincide, and the push-up tool is smoothly attached to the tool mounting section. It becomes possible to fit them together.
  • the component mounting apparatus includes a component supply section in which diced wafers are placed and attached to a wafer sheet, and a component mounting device that picks dies from the wafers placed in the component supply section. and the above-mentioned component pushing device that pushes up the die from below the wafer sheet when the head picks the die.
  • this component mounting apparatus since it is equipped with the component push-up device as described above, it becomes possible to more smoothly attach and detach the push-up tool to and from the tool mounting section.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Manipulator (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PCT/JP2022/019285 2022-04-28 2022-04-28 部品突上げ装置及び部品実装装置 Ceased WO2023209953A1 (ja)

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KR1020247027365A KR102908723B1 (ko) 2022-04-28 2022-04-28 부품 밀어올림 장치 및 부품 실장 장치
PCT/JP2022/019285 WO2023209953A1 (ja) 2022-04-28 2022-04-28 部品突上げ装置及び部品実装装置
CN202280093112.9A CN118743006A (zh) 2022-04-28 2022-04-28 元件上推装置以及元件安装装置
JP2024517765A JP7712481B2 (ja) 2022-04-28 2022-04-28 部品突上げ装置及び部品実装装置

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Citations (4)

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Publication number Priority date Publication date Assignee Title
JPS5959388A (ja) * 1982-09-24 1984-04-05 富士通株式会社 支持装置
JP2004066364A (ja) * 2002-08-02 2004-03-04 Ricoh Co Ltd コンプライアンス機構
JP2012156413A (ja) * 2011-01-28 2012-08-16 Fuji Mach Mfg Co Ltd ダイ供給装置
JP2013172122A (ja) * 2012-02-23 2013-09-02 Hitachi High-Tech Instruments Co Ltd ダイボンダ

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Publication number Priority date Publication date Assignee Title
JPS6049221B2 (ja) * 1979-01-05 1985-10-31 東洋紡績株式会社 熱硬化性射出成形材料
JP4687636B2 (ja) * 2006-11-27 2011-05-25 パナソニック株式会社 電子部品実装装置および電子部品実装装置におけるｒｆタグの情報の読取り・書込み方法
JP4333769B2 (ja) 2007-04-09 2009-09-16 パナソニック株式会社 チップ実装装置およびチップ実装装置における剥離促進ヘッドの交換方法
JP5777161B2 (ja) * 2011-11-10 2015-09-09 富士機械製造株式会社 ダイ突き上げ動作管理システム
WO2014083606A1 (ja) * 2012-11-27 2014-06-05 富士機械製造株式会社 ダイ供給装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5959388A (ja) * 1982-09-24 1984-04-05 富士通株式会社 支持装置
JP2004066364A (ja) * 2002-08-02 2004-03-04 Ricoh Co Ltd コンプライアンス機構
JP2012156413A (ja) * 2011-01-28 2012-08-16 Fuji Mach Mfg Co Ltd ダイ供給装置
JP2013172122A (ja) * 2012-02-23 2013-09-02 Hitachi High-Tech Instruments Co Ltd ダイボンダ

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CN118743006A (zh) 2024-10-01

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