CN118743006A - 元件上推装置以及元件安装装置 - Google Patents

元件上推装置以及元件安装装置 Download PDF

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Publication number
CN118743006A
CN118743006A CN202280093112.9A CN202280093112A CN118743006A CN 118743006 A CN118743006 A CN 118743006A CN 202280093112 A CN202280093112 A CN 202280093112A CN 118743006 A CN118743006 A CN 118743006A
Authority
CN
China
Prior art keywords
tool
push
head
pushing
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280093112.9A
Other languages
English (en)
Chinese (zh)
Inventor
小木曾武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of CN118743006A publication Critical patent/CN118743006A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Manipulator (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN202280093112.9A 2022-04-28 2022-04-28 元件上推装置以及元件安装装置 Pending CN118743006A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/019285 WO2023209953A1 (ja) 2022-04-28 2022-04-28 部品突上げ装置及び部品実装装置

Publications (1)

Publication Number Publication Date
CN118743006A true CN118743006A (zh) 2024-10-01

Family

ID=88518099

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280093112.9A Pending CN118743006A (zh) 2022-04-28 2022-04-28 元件上推装置以及元件安装装置

Country Status (4)

Country Link
JP (1) JP7712481B2 (https=)
KR (1) KR102908723B1 (https=)
CN (1) CN118743006A (https=)
WO (1) WO2023209953A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049221B2 (ja) * 1979-01-05 1985-10-31 東洋紡績株式会社 熱硬化性射出成形材料
JPS5959388A (ja) * 1982-09-24 1984-04-05 富士通株式会社 支持装置
JP2004066364A (ja) * 2002-08-02 2004-03-04 Ricoh Co Ltd コンプライアンス機構
JP4687636B2 (ja) * 2006-11-27 2011-05-25 パナソニック株式会社 電子部品実装装置および電子部品実装装置におけるｒｆタグの情報の読取り・書込み方法
JP4333769B2 (ja) 2007-04-09 2009-09-16 パナソニック株式会社 チップ実装装置およびチップ実装装置における剥離促進ヘッドの交換方法
JP5686469B2 (ja) * 2011-01-28 2015-03-18 富士機械製造株式会社 ダイ供給装置
JP5777161B2 (ja) * 2011-11-10 2015-09-09 富士機械製造株式会社 ダイ突き上げ動作管理システム
JP5941701B2 (ja) 2012-02-23 2016-06-29 ファスフォードテクノロジ株式会社 ダイボンダ
WO2014083606A1 (ja) * 2012-11-27 2014-06-05 富士機械製造株式会社 ダイ供給装置

Also Published As

Publication number Publication date
KR20240130816A (ko) 2024-08-29
KR102908723B1 (ko) 2026-01-07
JP7712481B2 (ja) 2025-07-23
WO2023209953A1 (ja) 2023-11-02
JPWO2023209953A1 (https=) 2023-11-02

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