JPWO2023209953A1 - - Google Patents
Info
- Publication number
- JPWO2023209953A1 JPWO2023209953A1 JP2024517765A JP2024517765A JPWO2023209953A1 JP WO2023209953 A1 JPWO2023209953 A1 JP WO2023209953A1 JP 2024517765 A JP2024517765 A JP 2024517765A JP 2024517765 A JP2024517765 A JP 2024517765A JP WO2023209953 A1 JPWO2023209953 A1 JP WO2023209953A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/019285 WO2023209953A1 (ja) | 2022-04-28 | 2022-04-28 | 部品突上げ装置及び部品実装装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023209953A1 true JPWO2023209953A1 (https=) | 2023-11-02 |
| JP7712481B2 JP7712481B2 (ja) | 2025-07-23 |
Family
ID=88518099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024517765A Active JP7712481B2 (ja) | 2022-04-28 | 2022-04-28 | 部品突上げ装置及び部品実装装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7712481B2 (https=) |
| KR (1) | KR102908723B1 (https=) |
| CN (1) | CN118743006A (https=) |
| WO (1) | WO2023209953A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5959388A (ja) * | 1982-09-24 | 1984-04-05 | 富士通株式会社 | 支持装置 |
| JP2013172122A (ja) * | 2012-02-23 | 2013-09-02 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049221B2 (ja) * | 1979-01-05 | 1985-10-31 | 東洋紡績株式会社 | 熱硬化性射出成形材料 |
| JP2004066364A (ja) * | 2002-08-02 | 2004-03-04 | Ricoh Co Ltd | コンプライアンス機構 |
| JP4687636B2 (ja) * | 2006-11-27 | 2011-05-25 | パナソニック株式会社 | 電子部品実装装置および電子部品実装装置におけるｒｆタグの情報の読取り・書込み方法 |
| JP4333769B2 (ja) | 2007-04-09 | 2009-09-16 | パナソニック株式会社 | チップ実装装置およびチップ実装装置における剥離促進ヘッドの交換方法 |
| JP5686469B2 (ja) * | 2011-01-28 | 2015-03-18 | 富士機械製造株式会社 | ダイ供給装置 |
| JP5777161B2 (ja) * | 2011-11-10 | 2015-09-09 | 富士機械製造株式会社 | ダイ突き上げ動作管理システム |
| WO2014083606A1 (ja) * | 2012-11-27 | 2014-06-05 | 富士機械製造株式会社 | ダイ供給装置 |
-
2022
- 2022-04-28 WO PCT/JP2022/019285 patent/WO2023209953A1/ja not_active Ceased
- 2022-04-28 CN CN202280093112.9A patent/CN118743006A/zh active Pending
- 2022-04-28 JP JP2024517765A patent/JP7712481B2/ja active Active
- 2022-04-28 KR KR1020247027365A patent/KR102908723B1/ko active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5959388A (ja) * | 1982-09-24 | 1984-04-05 | 富士通株式会社 | 支持装置 |
| JP2013172122A (ja) * | 2012-02-23 | 2013-09-02 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240130816A (ko) | 2024-08-29 |
| KR102908723B1 (ko) | 2026-01-07 |
| JP7712481B2 (ja) | 2025-07-23 |
| WO2023209953A1 (ja) | 2023-11-02 |
| CN118743006A (zh) | 2024-10-01 |
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