KR102908723B1 - 부품 밀어올림 장치 및 부품 실장 장치 - Google Patents

부품 밀어올림 장치 및 부품 실장 장치

Info

Publication number
KR102908723B1
KR102908723B1 KR1020247027365A KR20247027365A KR102908723B1 KR 102908723 B1 KR102908723 B1 KR 102908723B1 KR 1020247027365 A KR1020247027365 A KR 1020247027365A KR 20247027365 A KR20247027365 A KR 20247027365A KR 102908723 B1 KR102908723 B1 KR 102908723B1
Authority
KR
South Korea
Prior art keywords
tool
pushing
head
wafer
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247027365A
Other languages
English (en)
Korean (ko)
Other versions
KR20240130816A (ko
Inventor
타케시 오기소
Original Assignee
야마하하쓰도키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야마하하쓰도키 가부시키가이샤 filed Critical 야마하하쓰도키 가부시키가이샤
Publication of KR20240130816A publication Critical patent/KR20240130816A/ko
Application granted granted Critical
Publication of KR102908723B1 publication Critical patent/KR102908723B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H01L21/68742—
    • H01L21/67017—
    • H01L21/67144—
    • H01L21/67242—
    • H01L21/67721—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Manipulator (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020247027365A 2022-04-28 2022-04-28 부품 밀어올림 장치 및 부품 실장 장치 Active KR102908723B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/019285 WO2023209953A1 (ja) 2022-04-28 2022-04-28 部品突上げ装置及び部品実装装置

Publications (2)

Publication Number Publication Date
KR20240130816A KR20240130816A (ko) 2024-08-29
KR102908723B1 true KR102908723B1 (ko) 2026-01-07

Family

ID=88518099

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247027365A Active KR102908723B1 (ko) 2022-04-28 2022-04-28 부품 밀어올림 장치 및 부품 실장 장치

Country Status (4)

Country Link
JP (1) JP7712481B2 (https=)
KR (1) KR102908723B1 (https=)
CN (1) CN118743006A (https=)
WO (1) WO2023209953A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135431A (ja) * 2006-11-27 2008-06-12 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装装置におけるｒｆタグの情報の読取り・書込み方法
JP2013105773A (ja) * 2011-11-10 2013-05-30 Fuji Mach Mfg Co Ltd ダイ突き上げ動作管理システム
JP2013172122A (ja) * 2012-02-23 2013-09-02 Hitachi High-Tech Instruments Co Ltd ダイボンダ
JP6049221B2 (ja) * 2012-11-27 2016-12-21 富士機械製造株式会社 ダイ供給装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049221B2 (ja) * 1979-01-05 1985-10-31 東洋紡績株式会社 熱硬化性射出成形材料
JPS5959388A (ja) * 1982-09-24 1984-04-05 富士通株式会社 支持装置
JP2004066364A (ja) * 2002-08-02 2004-03-04 Ricoh Co Ltd コンプライアンス機構
JP4333769B2 (ja) 2007-04-09 2009-09-16 パナソニック株式会社 チップ実装装置およびチップ実装装置における剥離促進ヘッドの交換方法
JP5686469B2 (ja) * 2011-01-28 2015-03-18 富士機械製造株式会社 ダイ供給装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135431A (ja) * 2006-11-27 2008-06-12 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装装置におけるｒｆタグの情報の読取り・書込み方法
JP2013105773A (ja) * 2011-11-10 2013-05-30 Fuji Mach Mfg Co Ltd ダイ突き上げ動作管理システム
JP2013172122A (ja) * 2012-02-23 2013-09-02 Hitachi High-Tech Instruments Co Ltd ダイボンダ
JP6049221B2 (ja) * 2012-11-27 2016-12-21 富士機械製造株式会社 ダイ供給装置

Also Published As

Publication number Publication date
KR20240130816A (ko) 2024-08-29
JP7712481B2 (ja) 2025-07-23
WO2023209953A1 (ja) 2023-11-02
JPWO2023209953A1 (https=) 2023-11-02
CN118743006A (zh) 2024-10-01

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