WO2023197364A1 - 显示屏及其制作方法 - Google Patents

显示屏及其制作方法 Download PDF

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Publication number
WO2023197364A1
WO2023197364A1 PCT/CN2022/088654 CN2022088654W WO2023197364A1 WO 2023197364 A1 WO2023197364 A1 WO 2023197364A1 CN 2022088654 W CN2022088654 W CN 2022088654W WO 2023197364 A1 WO2023197364 A1 WO 2023197364A1
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WO
WIPO (PCT)
Prior art keywords
conductive
conductive glue
glue
display screen
matrix resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/088654
Other languages
English (en)
French (fr)
Inventor
罗成胜
马蹄遥
江应传
鲜于文旭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US17/779,836 priority Critical patent/US12193157B2/en
Publication of WO2023197364A1 publication Critical patent/WO2023197364A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present application relates to the field of display, and specifically to a display screen and a manufacturing method thereof.
  • Display technology has developed rapidly in recent years, and as pixel sizes continue to decrease, application scenarios have become wider. It has gradually developed from the original large-scale indoor and outdoor long-distance advertising screens to indoor and outdoor short-distance high-definition displays.
  • large-screen displays mainly use splicing display technology, which means splicing small-sized sub-boards into large screens of any size.
  • Figure 1 shows a new type of display screen structure.
  • the connection between the daughter board 1 and the motherboard 2 is realized through adhesive material, so that one motherboard 2 can connect multiple daughter boards 1 at the same time, thereby realizing Splicing of multiple sub-boards 1.
  • the daughter board 1 on the left connects the soldering pads 11 of the daughter board 1 and the soldering pads 21 of the motherboard 2 through the conductive glue 3 , so that the daughter board 1 is electrically connected to the motherboard 2 .
  • the conductive adhesive 3 is cured, if there is an abnormality between the daughter board 1 and the mother board 2, the daughter board 1 and the mother board 2 need to be separated for rework.
  • it is difficult to separate the daughter board 1 and the mother board 2 such as As shown in the daughter board 1 on the right, when the daughter board 1 and the motherboard 2 are separated, the following problems are likely to occur:
  • the conductive adhesive 3 remains on the surface of the motherboard 2.
  • the residual conductive adhesive 3 is difficult to clean, making it difficult to control the thickness of the conductive adhesive 3 after subsequent rework, and the thickness uniformity of the conductive adhesive 3 is low;
  • the conductive adhesive 3 adheres the soldering pad 21 of the motherboard 2 to the daughter board 1, causing damage to the motherboard 2.
  • Embodiments of the present application provide a display screen and a manufacturing method thereof, which can solve the technical problem that the daughter board and the mother board are difficult to separate for rework after assembly.
  • An embodiment of the present application provides a display screen, including:
  • At least one daughter board arranged opposite to the mother board;
  • a first conductive glue is provided between the motherboard and the daughter board, and there is a first adhesion between the first conductive glue and the daughter board;
  • a second conductive glue is provided between the first conductive glue and the motherboard. There is a second adhesion between the first conductive glue and the second conductive glue. The second conductive glue and the There is a third adhesion force between the motherboards;
  • both the first adhesion force and the second adhesion force are greater than the third adhesion force.
  • the material of the first conductive glue includes a first base resin and a first conductive substance
  • the material of the second conductive glue includes a second base resin and a second conductive substance.
  • the content of the first matrix resin in the first conductive adhesive is greater than the content of the second matrix resin in the second conductive adhesive.
  • the material of the first conductive glue includes 8-22wt% of the first matrix resin
  • the material of the second conductive glue includes 3-17wt% of the second matrix resin.
  • the first matrix resin contains polar groups
  • the second matrix resin contains polar groups
  • the morphology of the first conductive object is non-granular.
  • the shape of the first conductive object is linear, dendritic or scale-like.
  • the morphology of the second conductive material is granular.
  • the sub-board is provided with a first soldering pad, and the first conductive glue is connected to the first soldering pad;
  • the motherboard is provided with a second soldering pad, and the second conductive glue is connected to the second soldering pad;
  • the first bonding pad is electrically connected to the second bonding pad through the first conductive glue and the second conductive glue.
  • the daughter board is provided with a groove corresponding to the first soldering pad, the first soldering pad is provided at the bottom of the groove, and the first conductive adhesive Covered in the groove, and the surface of the first conductive glue away from the first pad exceeds the opening of the groove.
  • the width of the portion of the first conductive glue that exceeds the opening of the groove is greater than the width of the groove.
  • An embodiment of the present application also provides a method for making a display screen, including:
  • Step B1 Provide a motherboard and at least one daughter board
  • Step B2 Form a first conductive glue on the sub-board, and there is a first adhesion between the first conductive glue and the sub-board;
  • Step B3 Form a second conductive glue on the first conductive glue, and there is a second adhesion between the first conductive glue and the second conductive glue;
  • Step B4 Assemble the motherboard and the daughter board.
  • the first conductive glue and the second conductive glue are disposed between the motherboard and the daughter board.
  • the second conductive glue and the daughter board are There is a third adhesion force between the motherboards, and both the first adhesion force and the second adhesion force are greater than the third adhesion force.
  • step B2 includes:
  • Step B21 Set the first conductive paste on the daughter board
  • Step B22 Solidify the first conductive slurry to obtain the first conductive glue.
  • the step B3 includes: disposing a second conductive slurry on the first conductive glue to form the second conductive glue;
  • the components of the first conductive slurry include a first matrix resin and a first conductive object
  • the components of the second conductive slurry include a second matrix resin and a second conductive object
  • the first conductive slurry The content of the first matrix resin in the material is greater than the content of the second matrix resin in the second conductive slurry.
  • the first conductive slurry includes 10-20 wt% of the first matrix resin, and the second conductive slurry includes 5-15 wt% of the second matrix resin.
  • the first matrix resin contains polar groups
  • the second matrix resin contains polar groups
  • the morphology of the first conductive object is non-granular.
  • the shape of the first conductive object is linear, dendritic or scale-like.
  • the morphology of the second conductive material is granular.
  • step B4 after assembling the motherboard and the daughter board, the second conductive adhesive is pre-cured.
  • the manufacturing method of the display screen further includes:
  • Step B5 Conduct an electrical test on the first conductive glue and the second conductive glue. If the conductive properties of the first conductive glue and the second conductive glue are qualified, perform step B6; if the conductive properties of the first conductive glue and the second conductive glue are qualified If the conductive properties of the first conductive glue and the second conductive glue are abnormal, perform step B7;
  • Step B6 Perform post-curing treatment on the second conductive adhesive
  • Step B7 Separate the motherboard and the daughterboard, clean the motherboard and the daughterboard, and repeat steps B3 to B5.
  • the embodiment of the present application adopts a display screen and a manufacturing method thereof.
  • a first conductive glue and a second conductive glue between the daughter board and the motherboard, there is a first adhesion force between the first conductive glue and the daughter board.
  • a second adhesion between the conductive glue and the second conductive glue there is a third adhesion between the second conductive glue and the motherboard. Both the first adhesion and the second adhesion are greater than the third adhesion when rework is required.
  • the second conductive adhesive is not easy to remain on the mother board, which can reduce the difficulty of cleaning the mother board and facilitate control.
  • the thickness of the second conductive adhesive is uniform during subsequent rework; in addition, because the second conductive adhesive easily separates from the motherboard, it will not damage the film layer of the motherboard or daughter board.
  • Figure 1 is a schematic structural diagram of a motherboard and a daughterboard separated after assembly in traditional technology provided by an embodiment of the present application;
  • Figure 2 is a schematic flowchart of a method for manufacturing a display screen provided by an embodiment of the present application
  • FIG. 3 is a schematic structural diagram of a motherboard provided by an embodiment of the present application.
  • Figure 4 is a schematic structural diagram of a daughter board provided by an embodiment of the present application.
  • Figure 5 is a schematic structural diagram of forming the first conductive glue on the daughter board according to the embodiment of the present application.
  • Figure 6 is a schematic structural diagram of forming a second conductive adhesive on a first conductive adhesive according to an embodiment of the present application
  • Figure 7 is a schematic structural diagram of assembling the motherboard and the daughter board together and pre-curing the second conductive adhesive according to the embodiment of the present application;
  • Figure 8 is a schematic structural diagram of post-curing the second conductive adhesive of one of the daughter boards and separating the other daughter board from the motherboard according to the embodiment of the present application;
  • Figure 9 is a schematic diagram of the principle of solidifying conductive slurry to form conductive adhesive provided by the embodiment of the present application.
  • Figure 10 is a schematic structural diagram of a display screen provided by an embodiment of the present application.
  • Embodiments of the present application provide a display screen and a manufacturing method thereof. Each is explained in detail below. It should be noted that the order of description of the following embodiments does not limit the preferred order of the embodiments.
  • an embodiment of the present application provides a method for manufacturing a display screen.
  • the sub-board 100 may be a display device, specifically a liquid crystal display panel, a light-emitting diode display panel, an organic light-emitting diode display panel or other display devices, which is not uniquely limited here.
  • the manufacturing method of the display screen includes the following steps:
  • Step B1 as shown in Figures 3 and 4, provide a motherboard 200 and at least one daughter board 100;
  • Step B2 as shown in Figure 5, form the first conductive glue 320 on the sub-board 100, and there is a first adhesion force between the first conductive glue 320 and the sub-board 100;
  • Step B3 as shown in Figure 6, form the second conductive glue 420 on the first conductive glue 320, and there is a second adhesion between the first conductive glue 320 and the second conductive glue 420;
  • Step B4 as shown in Figure 7, assemble the motherboard 200 and the daughterboard 100.
  • the first conductive glue 320 and the second conductive glue 420 are disposed between the motherboard 200 and the daughterboard 100, and the second conductive glue 420 is between the motherboard 200 and the motherboard 200.
  • the third adhesion force both the first adhesion force and the second adhesion force are greater than the third adhesion force.
  • the first conductive glue 320 and the second conductive glue 420 are disposed between the daughter board 100 and the motherboard 200.
  • the first conductive glue 320 and the daughter board 100 have a first adhesion force.
  • Adhesion as shown in Figure 8, when rework is required, during the separation process of the daughter board 100 and the mother board 200, due to the small adhesion between the second conductive glue 420 and the mother board 200, the mother board 200 is not easily
  • the remaining second conductive adhesive 420 can reduce the difficulty of cleaning the motherboard 200 and help control the thickness uniformity of the second conductive adhesive 420 during subsequent rework; in addition, since the second conductive adhesive 420 can easily separate from the motherboard 200, it will not be damaged.
  • the film layer of the motherboard 200 or the daughter board 100 when rework is required, during the separation process of the daughter board 100 and the mother board 200, due to the small adhesion between the second conductive glue 420 and the mother board 200, the mother board 200 is not easily
  • the remaining second conductive adhesive 420 can reduce the difficulty of cleaning the motherboard 200 and help control the thickness uniformity of the second conductive adhesive 420 during subsequent rework; in addition, since the second conductive adhesive 420 can easily separate from the motherboard 200, it will not be damaged.
  • the daughter board 100 is provided with a first bonding pad 110
  • the motherboard 200 is provided with a second bonding pad 210 corresponding to the first bonding pad 110 .
  • the motherboard 200 is provided with a driving circuit to drive The circuit includes the above-mentioned second bonding pad 210, and the driving circuit drives the daughter board 100 to display images through the second bonding pad 210 and the first bonding pad 110.
  • the daughter board 100 may be provided with multiple first soldering pads 110
  • the motherboard 200 may be provided with multiple second soldering pads 210.
  • the first soldering pads 110 and the second soldering pads 210 are one.
  • the number of the first bonding pads 110 and the second bonding pads 210 can be adjusted according to actual situation selection and specific requirement settings, and is not uniquely limited here.
  • the first conductive adhesive 320 is formed on the first bonding pad 110 .
  • the second conductive adhesive 420 is formed on the first conductive adhesive 320 , and the second conductive adhesive 420 is also disposed corresponding to the first pad 110 .
  • the first bonding pad 110 and the second bonding pad 210 are arranged oppositely, and the second conductive adhesive 420 is in contact with the second bonding pad 210 .
  • step B2 includes:
  • Step B21 Set the first conductive paste 310 on the daughter board 100.
  • the first conductive paste 310 may be provided through, but is not limited to, a dispensing process or a nanoimprint technology.
  • the first conductive paste 310 at least covers the first welding surface. the surface of pad 110;
  • Step B22 Solidify the first conductive paste 310 to obtain the first conductive glue 320.
  • the first conductive glue 320 is stably fixed on the surface of the first bonding pad 110, which greatly improves the third conductive glue 320 between the first conductive glue 320 and the sub-board 100.
  • the daughter board 100 is provided with a groove 120 corresponding to the first bonding pad 110 .
  • the groove 120 corresponds to the first bonding pad 110 one-to-one, and the groove 120 exposes the first bonding pad 110 . surface, so that the first conductive paste 310 is disposed on the surface of the first bonding pad 110 .
  • the first bonding pad 110 is disposed at the bottom of the groove, the surface of the first bonding pad 110 does not protrude from the opening of the groove 120 , and the first conductive adhesive 320 is away from the surface of the first bonding pad 110 and exceeds the groove. 120 openings.
  • the first conductive paste 310 is filled in the groove 120 of the sub-board 100, so that the first conductive glue 320 formed in the subsequent step B22 covers the groove 120.
  • the first conductive adhesive 320 can be bonded to both the surface of the first bonding pad 110 and the side wall of the groove 120, thereby increasing the contact area between the first conductive adhesive 320 and the sub-board 100.
  • the first adhesion between the first conductive glue 320 and the sub-board 100 is greatly improved.
  • a metal layer is formed on one side of the substrate, and the metal layer includes the first bonding pad 110. Subsequently, a groove 120 is opened from the other side of the substrate.
  • the groove 120 can be, but is not limited to, made by laser. The depth of the opening of the groove 120 is until the surface of the first bonding pad 110 is just exposed, thereby obtaining the daughter board 100 .
  • the thickness of the first conductive paste 310 is greater than the depth of the groove 120 , that is, the surface of the first conductive paste 310 away from the first pad 110 exceeds the depth of the groove 120 .
  • the plane where the opening is located, and the surface of the subsequently produced first conductive adhesive 320 away from the first bonding pad 110 also exceeds the plane where the opening of the groove 120 is located.
  • the depth of the groove 120 refers to the first bonding pad 110. The distance from the exposed surface of the pad 110 to the opening of the groove 120 .
  • the thickness of the subsequently produced first conductive glue 320 is greater than the depth of the groove 120 , that is, the first conductive glue 320 exceeds the opening of the groove 120 , ensuring that the first conductive glue 320 fills the groove 120 , and Since the thickness of the first conductive slurry 310 is greater than the depth of the groove 120 , and since the first conductive slurry 310 has certain fluid characteristics, the portion beyond the opening of the groove 120 will overflow outward from the opening of the groove 120 , that is, the first conductive slurry 310 has certain fluid characteristics.
  • the cross-sectional area of the portion of a conductive paste 310 that exceeds the opening of the groove 120 is greater than the cross-sectional area of the opening of the groove 120 , and the cross-sectional area of the portion of the subsequently produced first conductive paste 320 that exceeds the opening of the groove 120 It is also larger than the cross-sectional area of the opening of the groove 120, which can increase the contact area between the first conductive glue 320 and the second conductive glue 420, and can greatly improve the second adhesion between the first conductive glue 320 and the second conductive glue 420.
  • the width of the portion of the first conductive paste 310 that exceeds the opening of the groove 120 is greater than the width of the groove 120
  • the width of the portion of the subsequently produced first conductive paste 320 that exceeds the opening of the groove 120 is also greater than the width of groove 120.
  • the depth of the groove 120 may be 5 microns to 10 microns.
  • the depth of the groove 120 may be 5 microns, 6 microns, 7 microns, 8 microns, 9 microns or 10 microns.
  • the selection is based on the actual situation.
  • the depth of the groove 120 can be adjusted appropriately and is not uniquely limited here.
  • the thickness of the first conductive paste 310 may be 6 microns to 20 microns.
  • the thickness of the first conductive paste 310 may be 6 microns, 7 microns, 8 microns, 9 microns, 10 microns, 11 microns, 12 microns. micron, 13 micron, 14 micron, 15 micron, 16 micron, 17 micron, 18 micron, 19 micron or 20 micron.
  • the thickness of the first conductive paste 310 can be appropriately adjusted according to the actual selection and specific requirements. , there is no unique limitation here.
  • the thickness of the first conductive glue 320 can be 6 microns to 20 microns.
  • the thickness of the first conductive glue 320 can be 6 microns, 7 microns, 8 microns, 9 microns, 10 microns, 11 microns, 12 microns, 13 microns, 14 microns, 15 microns, 16 microns, 17 microns, 18 microns, 19 microns or 20 microns.
  • the thickness of the first conductive adhesive 320 can be adjusted appropriately according to the actual situation and specific needs. No unique limitation.
  • the above-mentioned step B3 specifically includes: disposing the second conductive paste 410 on the first conductive glue 320 , which may be, but is not limited to, inkjet printing technology, stencil printing technology, or screen printing technology. or dispensing process to dispose the second conductive slurry 410, thereby forming the second conductive glue 420.
  • the components of the first conductive paste 310 include a first matrix resin, a first conductive material and a first auxiliary agent, and the components of the second conductive slurry 410 include a second matrix resin, a second conductive material and a second auxiliary agent.
  • the content of the first matrix resin in the first conductive paste 310 is greater than the content of the second matrix resin in the second conductive paste 410 .
  • the subsequently produced first conductive paste 320 is in contact with the sub-board 100.
  • the adhesion between the first conductive glue 320 and the second conductive glue 420 is greater than the adhesion between the second conductive glue 420 and the motherboard 200 , so that the first adhesion and the second adhesion are are greater than the third adhesion force.
  • the thickness of the second conductive paste 410 may be 20 microns to 200 microns.
  • the thickness of the second conductive paste 410 may be 20 microns, 30 microns, 40 microns, 50 microns, 60 microns, 70 microns, or 80 microns.
  • the thickness of the second conductive paste 410 can be adjusted appropriately and is not uniquely limited here.
  • the thickness of the second conductive glue 420 can be 20 microns to 200 microns.
  • the thickness of the second conductive glue 420 can be 20 microns, 30 microns, 40 microns, 50 microns, 60 microns.
  • the first conductive paste 310 includes 10-20wt% of the first matrix resin, 50-80wt% of the first conductive material and 1-5wt% of the first additive
  • the second conductive paste 410 includes 5-15wt % of the second matrix resin, 60-85wt% of the second conductive material and 0.1-3wt% of the second additive. It can be understood that the mass ratio of each component in the first conductive slurry 310 and the second conductive slurry 410 can be appropriately adjusted according to actual selection and specific requirements, and is not uniquely limited here.
  • the first matrix resin and the second matrix resin can be photo-curing resin or thermo-curing resin. Appropriate selections can be made according to the actual situation, and are not uniquely limited here.
  • the first matrix resin can be selected from one or more of epoxy resin, phenolic resin, polyurethane resin, acrylic resin, silicone resin, etc.
  • the second matrix resin can be selected from epoxy resin, One or more of phenolic resin, polyurethane resin, acrylic resin, silicone resin, etc.
  • the materials of the first matrix resin and the second matrix resin can be the same or different, and are set according to the actual situation and specific needs.
  • the materials of the first matrix resin and the second matrix resin can be modified appropriately and are not uniquely limited here.
  • the first matrix resin and the second matrix resin are selected from epoxy resin.
  • Epoxy resin has high adhesion and wettability, and also has excellent mechanical and thermal properties, low shrinkage, good
  • the adhesive ability and other advantages enable the subsequently produced first conductive glue 320 and second conductive glue 420 to have good adhesion properties.
  • the first matrix resin contains polar groups
  • the second matrix resin contains polar groups
  • the interaction between the polar groups of the first matrix resin and the polar groups of the second matrix resin makes the third matrix resin
  • the first conductive adhesive 320 and the second conductive adhesive 420 have extremely strong adhesion, that is, the second adhesion can be greatly improved.
  • the second adhesion force is much greater than the third adhesion force, so during the process of separating the daughter board 100 and the mother board 200, the second conductive adhesive 420 will not remain on the mother board 200, which can reduce the rework process.
  • the difficulty of cleaning the board 200 greatly reduces the risk of damage to the film layer of the motherboard 200 (the second soldering pad 210, etc.).
  • the polar groups of the first matrix resin and the second matrix resin can be selected from polar groups such as hydroxyl group and carboxyl group. According to the actual situation and specific needs, the polar groups can be appropriately modified. Here No unique limitation.
  • the materials of the first conductor and the second conductor can be selected from conductive materials.
  • the materials of the first conductor and the second conductor can be selected from conductive materials such as gold, silver, copper, molybdenum, and aluminum. One or more of them may be selected according to the actual situation and specific requirements.
  • the materials of the first conductive object and the second conductive object may be appropriately modified, and are not uniquely limited here.
  • the morphology of the first conductive object is non-granular. Specifically, the morphology of the first conductive object is linear, dendritic or scale-like.
  • the first conductive paste 310 is cured, the first matrix resin has better fluidity in the molten state, and the first matrix resin and the first conductive object can fully contact, which is beneficial to improve the quality of the first conductive object and the first matrix.
  • the contact area of the resin is conducive to improving the adhesion of the first conductive glue 320, and a dense film layer structure can be obtained. Such an arrangement can increase the second adhesion.
  • the first conductive material may be silver nanowires.
  • the morphology of the second conductive material is granular. Compared with the first conductive material, the morphology of the second conductive material is smoother and granular.
  • the second conductive slurry is When the material 410 is cured, the second matrix resin mainly exists on the upper and lower sides of the second conductive object, and the connectivity in the middle is weak. The fluidity of the second matrix resin in the molten state is weak, resulting in the adhesion of the second conductive adhesive 420. Weakening, so set, can reduce the third adhesion force.
  • the second conductive substance may be silver nanoparticles.
  • the particle size of the second conductive material should be controlled between 10 nanometers and 200 nanometers, so as to ensure that the second conductive paste 410 (or the second conductive glue 420) has sufficient adhesion to adhere to the second solder joint. On the pad 210, it can also ensure that the second conductive adhesive 420 can be peeled off from the motherboard 200 during the rework process, thereby reducing residues.
  • step B4 after assembling the motherboard 200 and the daughterboard 100, the second conductive glue 420 is pre-cured. Specifically, ultraviolet light can be used for 5 seconds to 10 seconds, so that the second conductive glue 420 can be pre-cured.
  • the adhesive 420 is in a dry state. At this time, the adhesion between the second conductive adhesive 420 and the motherboard 200 is weak. If subsequent rework is required, the daughter board 100 and the second conductive adhesive 420 thereon can be completely removed from the motherboard.
  • the motherboard 200 is peeled off to reduce the residual glue remaining on the motherboard 200 .
  • the manufacturing method of the display screen also includes:
  • Step B5 Conduct an electrical test on the first conductive glue 320 and the second conductive glue 420. If the conductive properties of the first conductive glue 320 and the second conductive glue 420 are qualified, then perform step B6; If the conductive performance of the second conductive adhesive 420 is abnormal, perform step B7;
  • Step B6 as shown in Figure 8, perform post-curing treatment on the second conductive adhesive 420;
  • Step B7 as shown in Figure 8, separate the motherboard 200 and the daughter board 100, clean the motherboard 200 and the daughter board 100, and repeat steps B3 to B5.
  • the step of electrically testing the first conductive glue 320 and the second conductive glue 420 may include: testing whether the on-resistance of the first conductive glue 320 and the second conductive glue 420 meets the requirements, For example, test whether the conductive resistance of the first conductive glue 320 and the second conductive glue 420 is in the range of 100 ohms-200 ohms.
  • step B7 is performed.
  • the step of cleaning the motherboard 200 and the daughter board 100 may include: using a solvent to remove the second conductive glue 420 on the motherboard 200 to facilitate subsequent rework.
  • the solvent may be selected from dichloride.
  • the embodiment of the present application also provides a display screen, which is produced by the above method.
  • the display screen includes a motherboard 200, at least one daughter board 100, a first conductive glue 320 and a second conductive glue 420.
  • the daughter board 100 Disposed opposite the motherboard 200, the first conductive glue 320 is disposed between the motherboard 200 and the daughter board 100. There is a first adhesion force between the first conductive glue 320 and the daughter board 100.
  • the second conductive glue 420 is disposed between the first conductive glue and the daughter board 100.
  • the daughter board 100 is provided with a first soldering pad 110
  • the motherboard 200 is provided with a second soldering pad 210 corresponding to the first soldering pad 110 .
  • the motherboard 200 is provided with a driving circuit to drive The circuit includes the above-mentioned second bonding pad 210, and the driving circuit drives the daughter board 100 to display images through the second bonding pad 210 and the first bonding pad 110.
  • the first conductive glue 320 is disposed corresponding to the first welding pad 110, and the first conductive glue is connected to the corresponding first welding pad 110;
  • the second conductive glue 420 is disposed corresponding to the second welding pad 210, and the second conductive glue 420 is disposed corresponding to the second welding pad 210.
  • 420 is connected to the corresponding second bonding pad 210;
  • the first bonding pad 110 is electrically connected to the second bonding pad 210 through the corresponding first conductive glue 320 and second conductive glue 420.
  • the daughter board 100 may be provided with multiple first soldering pads 110
  • the motherboard 200 may be provided with multiple second soldering pads 210.
  • the first soldering pads 110 and the second soldering pads 210 are one.
  • the number of the first bonding pads 110 and the second bonding pads 210 can be adjusted according to actual situation selection and specific requirement settings, and is not uniquely limited here.
  • the daughter board 100 is provided with a groove 120 corresponding to the first soldering pad 110.
  • the groove 120 corresponds to the first soldering pad 110 one by one.
  • the groove 120 exposes the surface of the first soldering pad 110, and the first conductive adhesive 320 covers the surface of the first soldering pad 110. in groove 120.
  • the first bonding pad 110 is disposed at the bottom of the groove, the surface of the first bonding pad 110 does not protrude from the opening of the groove 120 , and the first conductive adhesive 320 is away from the surface of the first bonding pad 110 and exceeds the groove. 120 opening setting.
  • the first conductive adhesive 320 can be bonded to both the surface of the first bonding pad 110 and the side wall of the groove 120, thereby increasing the contact area between the first conductive adhesive 320 and the sub-board 100.
  • the first adhesion between the first conductive glue 320 and the sub-board 100 is greatly improved.
  • the thickness of the first conductive glue 320 is greater than the depth of the groove 120 , that is, the surface of the first conductive glue 320 away from the first pad 110 also exceeds the plane where the opening of the groove 120 is located.
  • the groove 120 The depth refers to the distance from the exposed surface of the first bonding pad 110 to the opening of the groove 120 .
  • the contact area between the first conductive glue 320 and the second conductive glue 420 can be increased, and the second adhesion between the first conductive glue 320 and the second conductive glue 420 can be greatly improved.
  • the width of the portion of the first conductive glue 320 that exceeds the opening of the groove 120 is also greater than the width of the groove 120 .
  • the depth of the groove 120 may be 5 microns to 10 microns.
  • the depth of the groove 120 may be 5 microns, 6 microns, 7 microns, 8 microns, 9 microns or 10 microns.
  • the selection is based on the actual situation.
  • the depth of the groove 120 can be adjusted appropriately and is not uniquely limited here.
  • the thickness of the first conductive glue 320 can be 6 microns to 20 microns.
  • the thickness of the first conductive glue 320 can be 6 microns, 7 microns, 8 microns, 9 microns, 10 microns, 11 microns, 12 microns, 13 microns, 14 microns, 15 microns, 16 microns, 17 microns, 18 microns, 19 microns or 20 microns.
  • the thickness of the first conductive adhesive 320 can be adjusted appropriately according to the actual situation and specific needs. No unique limitation.
  • the material of the first conductive glue 320 includes a first base resin, a first conductive substance, and a first auxiliary agent
  • the material of the second conductive glue 420 includes a second base resin, a second conductive substance, and a second auxiliary agent.
  • the content of the first matrix resin in the conductive adhesive 320 is greater than the content of the second matrix resin in the second conductive adhesive 420 .
  • the adhesion between the first conductive glue 320 and the sub-board 100 is improved.
  • the adhesion force between the first conductive glue 320 and the second conductive glue 420 is greater than the adhesion force between the second conductive glue 420 and the motherboard 200 , so that the first adhesion force and the second adhesion force are both greater than the third adhesion force. .
  • the thickness of the second conductive glue 420 can be 20 microns to 200 microns.
  • the thickness of the second conductive glue 420 can be 20 microns, 30 microns, 40 microns, 50 microns, 60 microns, 70 microns, 80 microns, 90 microns, 100 microns, 110 microns, 120 microns, 130 microns, 140 microns, 150 microns, 160 microns, 170 microns, 180 microns, 190 microns or 200 microns, of course, depending on the actual situation and specific needs, second The thickness of the conductive adhesive 420 can be adjusted appropriately and is not limited here.
  • the first conductive adhesive 320 includes 8-22wt% of the first matrix resin, 48-82wt% of the first conductive material, and 0.5-5.5wt% of the first additive.
  • the second conductive adhesive 420 includes 3-17wt%.
  • the second matrix resin, 58-87wt% of the second conductive material and 0.01-3.5wt% of the second additive can be understood that the mass ratio of each component in the first conductive glue 320 and the second conductive glue 420 can be appropriately adjusted according to the selection of actual conditions and specific requirements, and is not uniquely limited here.
  • the first matrix resin and the second matrix resin can be photo-curing resin or thermo-curing resin. Appropriate selections can be made according to the actual situation, and are not uniquely limited here.
  • the first matrix resin can be selected from one or more of epoxy resin, phenolic resin, polyurethane resin, acrylic resin, silicone resin, etc.
  • the second matrix resin can be selected from epoxy resin, One or more of phenolic resin, polyurethane resin, acrylic resin, silicone resin, etc.
  • the materials of the first matrix resin and the second matrix resin can be the same or different, and are set according to the actual situation and specific needs.
  • the materials of the first matrix resin and the second matrix resin can be modified appropriately and are not uniquely limited here.
  • the first matrix resin and the second matrix resin are selected from epoxy resin.
  • Epoxy resin has high adhesion and wettability, and also has excellent mechanical and thermal properties, low shrinkage, good
  • the adhesive ability and other advantages enable the subsequently produced first conductive glue 320 and second conductive glue 420 to have good adhesion properties.
  • the first matrix resin contains polar groups
  • the second matrix resin contains polar groups
  • the interaction between the polar groups of the first matrix resin and the polar groups of the second matrix resin makes the third matrix resin
  • the first conductive adhesive 320 and the second conductive adhesive 420 have extremely strong adhesion, that is, the second adhesion can be greatly improved.
  • the second adhesion force is much greater than the third adhesion force, so during the process of separating the daughter board 100 and the mother board 200, the second conductive adhesive 420 will not remain on the mother board 200, which can reduce the rework process.
  • the difficulty of cleaning the board 200 greatly reduces the risk of damage to the film layer of the motherboard 200 (the second soldering pad 210, etc.).
  • the polar groups of the first matrix resin and the second matrix resin can be selected from polar groups such as hydroxyl group and carboxyl group. According to the actual situation and specific needs, the polar groups can be appropriately modified. Here No unique limitation.
  • the morphology of the first conductive object is non-granular. Specifically, the morphology of the first conductive object is linear, dendritic or scale-like.
  • the first matrix resin has better fluidity in the molten state, and the first matrix resin and the first conductive object can fully contact each other, which is beneficial to increasing the contact area between the first conductive object and the first matrix resin, and is beneficial to improving the first conductive adhesive
  • an adhesion of 320 a dense film layer structure can be obtained. This setting can increase the second adhesion.
  • the first conductive material may be silver nanowires.
  • the morphology of the second conductive object is granular. Compared with the first conductive object, the morphology of the second conductive object is smoother and granular, and the second matrix resin mainly exists. On the upper and lower sides of the second conductive object, the connectivity in the middle is weak, and the fluidity of the second matrix resin in the molten state is weak, which weakens the adhesion of the second conductive glue 420. This arrangement can reduce the third adhesion. .
  • the second conductive substance may be silver nanoparticles.
  • the particle size of the second conductive material should be controlled between 10 nanometers and 200 nanometers, which can not only ensure that the second conductive adhesive 420 has sufficient adhesion to adhere to the second bonding pad 210, but also ensure the rework process.
  • the second conductive adhesive 420 can be peeled off from the motherboard 200 to reduce residue.

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Abstract

一种显示屏及其制作方法，通过在子板（100）和母板（200）之间设置第一导电胶（320）和第二导电胶（420），第一导电胶（320）和子板（100）之间具有第一附着力，第一导电胶（320）和第二导电胶（420）之间具有第二附着力，第二导电胶（420）和母板（200）之间具有第三附着力，第一附着力和第二附着力均大于第三附着力，可以解决子板（100）和母板（200）在组装后难以分离以进行返工的技术问题。

Description

显示屏及其制作方法 技术领域
本申请涉及显示领域，具体涉及一种显示屏及其制作方法。
 背景技术
近年来显示技术发展迅速，随着像素尺寸不断减小，应用场景也变得广泛。从原来的室内外大型远距离广告屏逐渐发展到室内外近距离高清显示屏。目前，大屏幕显示主要采用拼接显示技术，即将小尺寸的子板拼接成任意尺寸的大屏。
请参阅图1，图1示出的是一种新型的显示屏结构，通过胶材来实现子板1与母板2的连接，使得一块母板2可以同时连接多块子板1，从而实现多块子板1的拼接。如图1所示，左边的子板1通过导电胶3连接子板1的焊垫11和母板2的焊垫21，从而使得子板1电性连接于母板2。在导电胶3固化后，若子板1和母板2出现异常，则需要将子板1和母板2分离以进行返工(Rework)，然而，子板1和母板2之间难以分离，如右边的子板1所示，在将子板1和母板2分离时，容易出现以下问题：
(1)母板2的表面残留导电胶3，残留导电胶3难以进行清理，导致后续返工后难以控制导电胶3的厚度，导电胶3的厚度均一性低；
(2)导电胶3将子板1的焊垫11粘附在母板2上，导致子板1损坏；
(3)导电胶3将母板2的焊垫21粘附在子板1上，导致母板2损坏。
因此，亟需一种能够解决上述问题的技术方案。
 技术问题
本申请实施例提供一种显示屏及其制作方法，可以解决子板和母板在组装后难以分离以进行返工的技术问题。
 技术解决方案
本申请实施例提供一种显示屏，包括：
母板；
至少一个子板，与所述母板相对设置；
第一导电胶，设于所述母板和所述子板之间，所述第一导电胶和所述子板之间具有第一附着力；
第二导电胶，设于所述第一导电胶和所述母板之间，所述第一导电胶和所述第二导电胶之间具有第二附着力，所述第二导电胶和所述母板之间具有第三附着力；
其中，所述第一附着力和所述第二附着力均大于所述第三附着力。
可选的，在本申请的一些实施例中，所述第一导电胶的材料包括第一基体树脂和第一导电物，所述第二导电胶的材料包括第二基体树脂和第二导电物，所述第一导电胶中所述第一基体树脂的含量大于所述第二导电胶中所述第二基体树脂的含量。
可选的，在本申请的一些实施例中，所述第一导电胶的材料包括8-22wt%的第一基体树脂，所述第二导电胶的材料包括3-17wt%的第二基体树脂。
可选的，在本申请的一些实施例中，所述第一基体树脂含有极性基团，所述第二基体树脂含有极性基团。
可选的，在本申请的一些实施例中，所述第一导电物的形貌为非颗粒状。
可选的，在本申请的一些实施例中，所述第一导电物的形貌为线状、树枝状或鳞片状。
可选的，在本申请的一些实施例中，所述第二导电物的形貌为颗粒状。
可选的，在本申请的一些实施例中，所述子板设有第一焊垫，所述第一导电胶与所述第一焊垫连接；
所述母板设有第二焊垫，所述第二导电胶与所述第二焊垫连接；
所述第一焊垫通过所述第一导电胶和所述第二导电胶电性连接于所述第二焊垫。
可选的，在本申请的一些实施例中，所述子板对应所述第一焊垫设有凹槽，所述第一焊垫设于所述凹槽的底部，所述第一导电胶覆盖在所述凹槽中，且所述第一导电胶远离所述第一焊垫的表面超出所述凹槽的开口。
可选的，在本申请的一些实施例中，所述第一导电胶超过所述凹槽的开口的部分的宽度大于所述凹槽的宽度。
本申请实施例还提供一种显示屏的制作方法，包括：
步骤B1、提供母板和至少一个子板；
步骤B2、在所述子板上形成第一导电胶，所述第一导电胶和所述子板之间具有第一附着力；
步骤B3、在所述第一导电胶上形成第二导电胶，所述第一导电胶和所述第二导电胶之间具有第二附着力；
步骤B4、组装所述母板和所述子板，所述第一导电胶和所述第二导电胶设于所述母板和所述子板之间，所述第二导电胶和所述母板之间具有第三附着力，所述第一附着力和所述第二附着力均大于所述第三附着力。
可选的，在本申请的一些实施例中，所述步骤B2包括：
步骤B21、在所述子板上设置第一导电浆料；
步骤B22、对所述第一导电浆料进行固化处理，得到所述第一导电胶。
可选的，在本申请的一些实施例中，所述步骤B3包括：在所述第一导电胶上设置第二导电浆料，从而形成所述第二导电胶；
其中，所述第一导电浆料的组分包括第一基体树脂和第一导电物，所述第二导电浆料的组分包括第二基体树脂和第二导电物，所述第一导电浆料中所述第一基体树脂的含量大于所述第二导电浆料中所述第二基体树脂的含量。
可选的，在本申请的一些实施例中，所述第一导电浆料包括10-20wt%的第一基体树脂，所述第二导电浆料包括5-15wt%的第二基体树脂。
可选的，在本申请的一些实施例中，所述第一基体树脂含有极性基团，所述第二基体树脂含有极性基团。
可选的，在本申请的一些实施例中，所述第一导电物的形貌为非颗粒状。
可选的，在本申请的一些实施例中，所述第一导电物的形貌为线状、树枝状或鳞片状。
可选的，在本申请的一些实施例中，所述第二导电物的形貌为颗粒状。
可选的，在本申请的一些实施例中，在所述步骤B4中，组装所述母板和所述子板后，对所述第二导电胶进行预固化处理。
可选的，在本申请的一些实施例中，所述显示屏的制作方法还包括：
步骤B5、对所述第一导电胶和所述第二导电胶进行电性测试，若所述第一导电胶和所述第二导电胶的导电性能合格，则执行步骤B6；若所述第一导电胶和所述第二导电胶的导电性能异常，则执行步骤B7；
步骤B6、对所述第二导电胶进行后固化处理；
步骤B7、分离所述母板和所述子板，并对所述母板和所述子板进行清洁处理，重复所述步骤B3-所述步骤B5。
 有益效果
本申请实施例采用一种显示屏及其制作方法，通过在子板和母板之间设置第一导电胶和第二导电胶，第一导电胶和子板之间具有第一附着力，第一导电胶和第二导电胶之间具有第二附着力，第二导电胶和母板之间具有第三附着力，第一附着力和第二附着力均大于第三附着力，当需要返工时，在子板和母板分离的过程中，由于第二导电胶和母板之间的粘附力小，母板不容易残留有第二导电胶，可以降低母板的清理难度，有利于控制后续返工时第二导电胶的厚度均一性；此外，由于第二导电胶容易脱离母板，不会损坏母板或子板的膜层。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的传统技术中母板和子板组装后分离的结构示意图；
图2是本申请实施例提供的显示屏的制作方法的流程示意图；
图3是本申请实施例提供的母板的结构示意图；
图4是本申请实施例提供的子板的结构示意图；
图5是本申请实施例提供的在子板上形成第一导电胶的结构示意图；
图6是本申请实施例提供的在第一导电胶上形成第二导电胶的结构示意图；
图7是本申请实施例提供的将母板和子板组装在一起并对第二导电胶进行预固化处理的结构示意图；
图8是本申请实施例提供的对其中一块子板的第二导电胶进行后固化处理以及将另一块子板从母板上分离的结构示意图；
图9是本申请实施例提供的导电浆料固化形成导电胶的原理示意图；
图10是本申请实施例提供的显示屏的结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请中，在未作相反说明的情况下，使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下，具体为附图中的图面方向；而“内”和“外”则是针对装置的轮廓而言的。
本申请实施例提供一种显示屏及其制作方法。以下分别进行详细说明。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
请参阅图2，本申请实施例提供一种显示屏的制作方法，通过将多个子板100组装在一个母板200上，从而使得多个子板100拼接在一起，以实现大屏幕显示。在本申请实施例中，子板100可以为显示器件，具体可以为液晶显示面板、发光二极管显示面板、有机发光二极管显示面板或其他显示器件，在此不做唯一限定。
具体的，显示屏的制作方法包括以下步骤：
步骤B1、如图3和图4所示，提供母板200和至少一个子板100；
步骤B2、如图5所示，在子板100上形成第一导电胶320，第一导电胶320和子板100之间具有第一附着力；
步骤B3、如图6所示，在第一导电胶320上形成第二导电胶420，第一导电胶320和第二导电胶420之间具有第二附着力；
步骤B4、如图7所示，组装母板200和子板100，第一导电胶320和第二导电胶420设于母板200和子板100之间，第二导电胶420和母板200之间具有第三附着力，第一附着力和第二附着力均大于第三附着力。
本申请实施例的显示屏的制作方法，通过在子板100和母板200之间设置第一导电胶320和第二导电胶420，第一导电胶320和子板100之间具有第一附着力，第一导电胶320和第二导电胶420之间具有第二附着力，第二导电胶420和母板200之间具有第三附着力，第一附着力和第二附着力均大于第三附着力，如图8所示，当需要返工时，在子板100和母板200分离的过程中，由于第二导电胶420和母板200之间的粘附力小，母板200不容易残留有第二导电胶420，可以降低母板200的清理难度，有利于控制后续返工时第二导电胶420的厚度均一性；此外，由于第二导电胶420容易脱离母板200，不会损坏母板200或子板100的膜层。
具体的，如图3和图4所示，在上述步骤B1中，子板100设有第一焊垫110，母板200对应第一焊垫110设有第二焊垫210。本申请实施例通过使第一焊垫110和第二焊垫210电性连接，可以通过一块母板200同时驱动控制至少两块子板100，具体来说，母板200设有驱动电路，驱动电路包括上述第二焊垫210，驱动电路通过第二焊垫210和第一焊垫110驱动子板100显示图像。
具体的，在本申请实施例中，子板100可以设有多个第一焊垫110，母板200可以设有多个第二焊垫210，第一焊垫110和第二焊垫210一一对应，根据实际情况的选择和具体需求设置，可以对第一焊垫110和第二焊垫210的数量进行调整，在此不做唯一限定。
具体的，如图5所示，在上述步骤B2中，第一导电胶320形成于第一焊垫110上。如图6所示，在上述步骤B3中，第二导电胶420形成于第一导电胶320上，第二导电胶420也对应第一焊垫110设置。如图7所示，在上述步骤B4中，第一焊垫110与第二焊垫210相对设置，第二导电胶420抵接于第二焊垫210上。通过上述设置，使得母板200和子板100之间电性连接，可以通过一块母板200同时控制至少两块子板100显示图像。
具体的，上述步骤B2包括：
步骤B21、在子板100上设置第一导电浆料310，具体可以但不限于通过点胶工艺或者纳米压印技术设置第一导电浆料310，第一导电浆料310至少覆盖在第一焊垫110的表面；
步骤B22、对第一导电浆料310进行固化处理，得到第一导电胶320。本申请实施例中，通过对第一导电浆料310进行固化处理，使得第一导电胶320稳定地固定在第一焊垫110的表面，大大提高第一导电胶320和子板100之间的第一附着力。
具体的，如图4和图5所示，子板100对应第一焊垫110设有凹槽120，凹槽120和第一焊垫110一一对应，凹槽120露出第一焊垫110的表面，以便于将第一导电浆料310设置在第一焊垫110的表面。在此实施例中，第一焊垫110设置于凹槽的底部，第一焊垫110的表面并未突出凹槽120的开口，第一导电胶320远离第一焊垫110的表面超出凹槽120的开口。在上述步骤B21中，第一导电浆料310填充在子板100的凹槽120中，使得后续步骤B22形成的第一导电胶320覆盖在凹槽120中。通过上述设置，使得第一导电胶320既能粘接在第一焊垫110的表面，又能粘接在凹槽120的侧壁，从而增大第一导电胶320和子板100的接触面积，大大提高第一导电胶320和子板100之间的第一附着力。
在本申请实施例中，通过在衬底的一侧形成金属层，金属层包括第一焊垫110，随后，从衬底的另一侧开设凹槽120，凹槽120可以但不限于通过激光开孔的方式得到，凹槽120的开孔深度直至刚好裸露出第一焊垫110的表面，从而获得子板100。
具体的，如图5所示，在上述步骤B21中，第一导电浆料310的厚度大于凹槽120的深度，即第一导电浆料310远离第一焊垫110的表面超出凹槽120的开口所在的平面，后续所制得的第一导电胶320远离第一焊垫110的表面也超出凹槽120的开口所在的平面，需要理解的是，凹槽120的深度指的是第一焊垫110被裸露的表面至凹槽120的开口的距离。通过上述设置，使得后续制得的第一导电胶320的厚度大于凹槽120的深度，即第一导电胶320超出凹槽120的开口，能保证第一导电胶320填充满凹槽120，而由于第一导电浆料310的厚度大于凹槽120的深度，由于第一导电浆料310具有一定的流体特性，超出凹槽120的开口的部分会由凹槽120的开口向外溢出，即第一导电浆料310超过凹槽120的开口的部分的横截面积大于凹槽120的开口的横截面积，后续所制得的第一导电胶320超过凹槽120的开口的部分的横截面积也大于凹槽120的开口的横截面积，可以增加第一导电胶320与第二导电胶420的接触面积，可以大大提高第一导电胶320和第二导电胶420之间的第二附着力。在此实施例中，第一导电浆料310超过凹槽120的开口的部分的宽度大于凹槽120的宽度，后续所制得的第一导电胶320超过凹槽120的开口的部分的宽度也大于凹槽120的宽度。
具体的，凹槽120的深度可以为5微米-10微米，例如，凹槽120的深度可以为5微米、6微米、7微米、8微米、9微米或10微米，当然，根据实际情况的选择和具体需求设置，凹槽120的深度可以做适当调整，在此不做唯一限定。
具体的，第一导电浆料310的厚度可以为6微米-20微米，例如，第一导电浆料310的厚度可以为6微米、7微米、8微米、9微米、10微米、11微米、12微米、13微米、14微米、15微米、16微米、17微米、18微米、19微米或20微米，当然，根据实际情况的选择和具体需求设置，第一导电浆料310的厚度可以做适当调整，在此不做唯一限定。
具体的，第一导电胶320的厚度可以为6微米-20微米，例如，第一导电胶320的厚度可以为6微米、7微米、8微米、9微米、10微米、11微米、12微米、13微米、14微米、15微米、16微米、17微米、18微米、19微米或20微米，当然，根据实际情况的选择和具体需求设置，第一导电胶320的厚度可以做适当调整，在此不做唯一限定。
具体的，如图6所示，上述步骤B3具体包括：在第一导电胶320上设置第二导电浆料410，具体可以但不限于通过喷墨印刷技术、钢网印刷技术、丝网印刷技术或点胶工艺来设置第二导电浆料410，从而形成第二导电胶420。其中，第一导电浆料310的组分包括第一基体树脂、第一导电物和第一助剂，第二导电浆料410的组分包括第二基体树脂、第二导电物和第二助剂，第一导电浆料310中第一基体树脂的含量大于第二导电浆料410中第二基体树脂的含量。本申请实施例中，通过使第一导电浆料310中第一基体树脂的含量大于第二导电浆料410中第二基体树脂的含量，使得后续制得的第一导电胶320与子板100之间的附着力以及第一导电胶320与第二导电胶420之间的附着力均大于第二导电胶420与母板200之间的附着力，从而使得第一附着力和第二附着力均大于第三附着力。
具体的，第二导电浆料410的厚度可以为20微米-200微米，例如，第二导电浆料410的厚度可以为20微米、30微米、40微米、50微米、60微米、70微米、80微米、90微米、100微米、110微米、120微米、130微米、140微米、150微米、160微米、170微米、180微米、190微米或200微米，当然，根据实际情况的选择和具体需求设置，第二导电浆料410的厚度可以做适当调整，在此不做唯一限定。
具体的，所制得的显示屏中，第二导电胶420的厚度可以为20微米-200微米，例如，第二导电胶420的厚度可以为20微米、30微米、40微米、50微米、60微米、70微米、80微米、90微米、100微米、110微米、120微米、130微米、140微米、150微米、160微米、170微米、180微米、190微米或200微米，当然，根据实际情况的选择和具体需求设置，第二导电胶420的厚度可以做适当调整，在此不做唯一限定。
具体的，第一导电浆料310包括10-20wt%的第一基体树脂、50-80wt%的第一导电物和1-5wt%的第一助剂，第二导电浆料410包括5-15wt%的第二基体树脂、60-85wt%的第二导电物和0.1-3wt%的第二助剂。可以理解的是，根据实际情况的选择和具体需求设置，第一导电浆料310和第二导电浆料410中各组分的质量配比可以做适当调整，在此不做唯一限定。
具体的，在本申请实施例中，第一基体树脂和第二基体树脂可以为光固化树脂或热固化树脂，根据实际情况可以做适当选择，在此不做唯一限定。
具体来说，第一基体树脂可以选自环氧树脂、酚醛树脂、聚氨酯树脂、丙烯酸树脂和有机硅树脂等中的一种或多种，同样地，第二基体树脂可以选自环氧树脂、酚醛树脂、聚氨酯树脂、丙烯酸树脂和有机硅树脂等中的一种或多种，第一基体树脂和第二基体树脂的材料可以相同，也可以不同，根据实际情况的选择和具体需求设置，第一基体树脂和第二基体树脂的材料可以做适当修改，在此不做唯一限定。
本申请实施例中，第一基体树脂和第二基体树脂选自环氧树脂，环氧树脂有较高的黏附性和浸润性，而且还具有优良的机械性能和热性能、低收缩率、良好的粘接能力等优点，使得后续制得的第一导电胶320和第二导电胶420具有良好的粘附性能。
具体的，第一基体树脂含有极性基团，第二基体树脂含有极性基团，第一基体树脂的极性基团和第二基体树脂的极性基团之间的相互作用，使得第一导电胶320和第二导电胶420之间具有极强的附着力，也即可以大大提高第二附着力。在此实施例中，第二附着力远大于第三附着力，所以在分离子板100和母板200的过程中，第二导电胶420不会残留在母板200上，可以减少返工环节母板200的清洁难度，大大降低了母板200的膜层(第二焊垫210等)受损的风险。
具体的，第一基体树脂和第二基体树脂的极性基团可以选自羟基、羧基等极性基团，根据实际情况的选择和具体需求设置，极性基团可以做适当修改，在此不做唯一限定。
具体的，第一导电物和第二导电物的材料可以选自导电材料，具体来说，第一导电物和第二导电物的材料可以选自金、银、铜、钼和铝等导电材料中的一种或多种，根据实际情况的选择和具体需求设置，第一导电物和第二导电物的材料可以做适当修改，在此不做唯一限定。
具体的，如图9所示，第一导电物的形貌为非颗粒状，具体来说，第一导电物的形貌为线状、树枝状或鳞片状。当对第一导电浆料310进行固化时，第一基体树脂在熔融状态下的流动性更好，第一基体树脂和第一导电物可以充分接触，有利于提高第一导电物和第一基体树脂的接触面积，有利于提高第一导电胶320的附着力，可以得到致密的膜层结构，如此设置，可以增大第二附着力。在此实施例中，第一导电物可以为银纳米线。
具体的，如图9所示，第二导电物的形貌为颗粒状，相比于第一导电物而言，第二导电物的形貌为较光滑的颗粒状，当对第二导电浆料410进行固化时，第二基体树脂主要存在于第二导电物的上下两侧，中间的连通性弱，第二基体树脂在熔融状态下的流动性弱，使得第二导电胶420的附着力减弱，如此设置，可以减小第三附着力。在此实施例中，第二导电物可以为银纳米粒子。
具体的，在第二导电浆料410(或者第二导电胶420)中，第二导电物的粒径越大，则第二导电浆料410(或者第二导电胶420)的附着力越小。若第二导电物的粒径太大，第二导电浆料410(或者第二导电胶420)的附着力过小，所制得的显示屏中，第一焊垫110和第二焊垫210容易接触不良；若第二导电物的粒径太小，第二导电浆料410(或者第二导电胶420)的附着力过大，则会导致返工环节子板100难以从母板200上剥离。
为了避免上述问题，第二导电物的粒径宜控制在10纳米-200纳米，既能保证第二导电浆料410(或者第二导电胶420)有足够的附着力以粘附在第二焊垫210上，又能保证返工环节第二导电胶420能从母板200上剥离下来，减少残留。
具体的，如图7所示，在步骤B4中，组装母板200和子板100后，对第二导电胶420进行预固化处理，具体可以采用紫外光照射5秒-10秒，使得第二导电胶420呈表干状态，此时，第二导电胶420与母板200的粘附力弱，若后续需要返工时，可以较完整地将子板100及其上的第二导电胶420从母板200上剥离下来，减少残留在母板200上的残胶。
具体的，显示屏的制作方法还包括：
步骤B5、对第一导电胶320和第二导电胶420进行电性测试，若第一导电胶320和第二导电胶420的导电性能合格，则执行步骤B6；若第一导电胶320和第二导电胶420的导电性能异常，则执行步骤B7；
步骤B6、如图8所示，对第二导电胶420进行后固化处理；
步骤B7、如图8所示，分离母板200和子板100，并对母板200和子板100进行清洁处理，重复步骤B3-步骤B5。
具体的，在上述步骤B5中，对第一导电胶320和第二导电胶420进行电性测试的步骤可以包括：测试第一导电胶320和第二导电胶420的导通电阻是否满足要求，例如，测试第一导电胶320和第二导电胶420的导通电阻是否在100欧姆-200欧姆的范围内，若第一导电胶320和第二导电胶420的导通电阻在100欧姆-200欧姆的范围内，则执行步骤B6；若第一导电胶320和第二导电胶420的导通电阻在100欧姆-200欧姆的范围以外，则执行步骤B7。
具体的，在上述步骤B7中，对母板200和子板100进行清洁处理的步骤可以包括：采用溶剂去除母板200上的第二导电胶420，以便于后续进行返工，溶剂可以选自二氯甲烷、四氯化碳和丙酮等中的一种或几种。
请参阅图10，本申请实施例还提供一种显示屏，采用上述方法制得，显示屏包括母板200、至少一个子板100、第一导电胶320和第二导电胶420，子板100与母板200相对设置，第一导电胶320设于母板200和子板100之间，第一导电胶320和子板100之间具有第一附着力，第二导电胶420设于第一导电胶320和母板200之间，第一导电胶320和第二导电胶420之间具有第二附着力，第二导电胶420和母板200之间具有第三附着力；其中，第一附着力和第二附着力均大于第三附着力。
具体的，子板100设有第一焊垫110，母板200对应第一焊垫110设有第二焊垫210。本申请实施例通过使第一焊垫110和第二焊垫210电性连接，可以通过一块母板200同时驱动控制至少两块子板100，具体来说，母板200设有驱动电路，驱动电路包括上述第二焊垫210，驱动电路通过第二焊垫210和第一焊垫110驱动子板100显示图像。在此实施例中，第一导电胶320对应第一焊垫110设置，第一导电胶与对应的第一焊垫110连接；第二导电胶420对应第二焊垫210设置，第二导电胶420与对应的第二焊垫210连接；第一焊垫110通过对应的第一导电胶320和第二导电胶420电性连接于第二焊垫210。
具体的，在本申请实施例中，子板100可以设有多个第一焊垫110，母板200可以设有多个第二焊垫210，第一焊垫110和第二焊垫210一一对应，根据实际情况的选择和具体需求设置，可以对第一焊垫110和第二焊垫210的数量进行调整，在此不做唯一限定。
具体的，子板100对应第一焊垫110设有凹槽120，凹槽120和第一焊垫110一一对应，凹槽120露出第一焊垫110的表面，第一导电胶320覆盖在凹槽120中。在此实施例中，第一焊垫110设置于凹槽的底部，第一焊垫110的表面并未突出凹槽120的开口，第一导电胶320远离第一焊垫110的表面超出凹槽120的开口设置。通过上述设置，使得第一导电胶320既能粘接在第一焊垫110的表面，又能粘接在凹槽120的侧壁，从而增大第一导电胶320和子板100的接触面积，大大提高第一导电胶320和子板100之间的第一附着力。
具体的，第一导电胶320的厚度大于凹槽120的深度，即第一导电胶320远离第一焊垫110的表面也超出凹槽120的开口所在的平面，需要理解的是，凹槽120的深度指的是第一焊垫110被裸露的表面至凹槽120的开口的距离。通过上述设置，既能保证第一导电胶320填充满凹槽120，又能使第一导电胶320超过凹槽120的开口的部分的横截面积也大于凹槽120的开口的横截面积，可以增加第一导电胶320与第二导电胶420的接触面积，可以大大提高第一导电胶320和第二导电胶420之间的第二附着力。在此实施例中，第一导电胶320超过凹槽120的开口的部分的宽度也大于凹槽120的宽度。
具体的，凹槽120的深度可以为5微米-10微米，例如，凹槽120的深度可以为5微米、6微米、7微米、8微米、9微米或10微米，当然，根据实际情况的选择和具体需求设置，凹槽120的深度可以做适当调整，在此不做唯一限定。
具体的，第一导电胶320的厚度可以为6微米-20微米，例如，第一导电胶320的厚度可以为6微米、7微米、8微米、9微米、10微米、11微米、12微米、13微米、14微米、15微米、16微米、17微米、18微米、19微米或20微米，当然，根据实际情况的选择和具体需求设置，第一导电胶320的厚度可以做适当调整，在此不做唯一限定。
具体的，第一导电胶320的材料包括第一基体树脂、第一导电物和第一助剂，第二导电胶420的材料包括第二基体树脂、第二导电物和第二助剂，第一导电胶320中第一基体树脂的含量大于第二导电胶420中第二基体树脂的含量。本申请实施例中，通过使第一导电胶320中第一基体树脂的含量大于第二导电胶420中第二基体树脂的含量，使得第一导电胶320与子板100之间的附着力以及第一导电胶320与第二导电胶420之间的附着力均大于第二导电胶420与母板200之间的附着力，从而使得第一附着力和第二附着力均大于第三附着力。
具体的，第二导电胶420的厚度可以为20微米-200微米，例如，第二导电胶420的厚度可以为20微米、30微米、40微米、50微米、60微米、70微米、80微米、90微米、100微米、110微米、120微米、130微米、140微米、150微米、160微米、170微米、180微米、190微米或200微米，当然，根据实际情况的选择和具体需求设置，第二导电胶420的厚度可以做适当调整，在此不做唯一限定。
具体的，第一导电胶320包括8-22wt%的第一基体树脂、48-82wt%的第一导电物和0.5-5.5wt%的第一助剂，第二导电胶420包括3-17wt%的第二基体树脂、58-87wt%的第二导电物和0.01-3.5wt%的第二助剂。可以理解的是，根据实际情况的选择和具体需求设置，第一导电胶320和第二导电胶420中各组分的质量配比可以做适当调整，在此不做唯一限定。
具体的，在本申请实施例中，第一基体树脂和第二基体树脂可以为光固化树脂或热固化树脂，根据实际情况可以做适当选择，在此不做唯一限定。
具体来说，第一基体树脂可以选自环氧树脂、酚醛树脂、聚氨酯树脂、丙烯酸树脂和有机硅树脂等中的一种或多种，同样地，第二基体树脂可以选自环氧树脂、酚醛树脂、聚氨酯树脂、丙烯酸树脂和有机硅树脂等中的一种或多种，第一基体树脂和第二基体树脂的材料可以相同，也可以不同，根据实际情况的选择和具体需求设置，第一基体树脂和第二基体树脂的材料可以做适当修改，在此不做唯一限定。
本申请实施例中，第一基体树脂和第二基体树脂选自环氧树脂，环氧树脂有较高的黏附性和浸润性，而且还具有优良的机械性能和热性能、低收缩率、良好的粘接能力等优点，使得后续制得的第一导电胶320和第二导电胶420具有良好的粘附性能。
具体的，第一基体树脂含有极性基团，第二基体树脂含有极性基团，第一基体树脂的极性基团和第二基体树脂的极性基团之间的相互作用，使得第一导电胶320和第二导电胶420之间具有极强的附着力，也即可以大大提高第二附着力。在此实施例中，第二附着力远大于第三附着力，所以在分离子板100和母板200的过程中，第二导电胶420不会残留在母板200上，可以减少返工环节母板200的清洁难度，大大降低了母板200的膜层(第二焊垫210等)受损的风险。
具体的，第一基体树脂和第二基体树脂的极性基团可以选自羟基、羧基等极性基团，根据实际情况的选择和具体需求设置，极性基团可以做适当修改，在此不做唯一限定。
具体的，如图9所示，第一导电物的形貌为非颗粒状，具体来说，第一导电物的形貌为线状、树枝状或鳞片状。第一基体树脂在熔融状态下的流动性更好，第一基体树脂和第一导电物可以充分接触，有利于提高第一导电物和第一基体树脂的接触面积，有利于提高第一导电胶320的附着力，可以得到致密的膜层结构，如此设置，可以增大第二附着力。在此实施例中，第一导电物可以为银纳米线。
具体的，如图9所示，第二导电物的形貌为颗粒状，相比于第一导电物而言，第二导电物的形貌为较光滑的颗粒状，第二基体树脂主要存在于第二导电物的上下两侧，中间的连通性弱，第二基体树脂在熔融状态下的流动性弱，使得第二导电胶420的附着力减弱，如此设置，可以减小第三附着力。在此实施例中，第二导电物可以为银纳米粒子。
具体的，在第二导电胶420中，第二导电物的粒径越大，则第二导电胶420的附着力越小。若第二导电物的粒径太大，第二导电胶420的附着力过小，所制得的显示屏中，第一焊垫110和第二焊垫210容易接触不良；若第二导电物的粒径太小，第二导电胶420的附着力过大，则会导致返工环节子板100难以从母板200上剥离。
为了避免上述问题，第二导电物的粒径宜控制在10纳米-200纳米，既能保证第二导电胶420有足够的附着力以粘附在第二焊垫210上，又能保证返工环节第二导电胶420能从母板200上剥离下来，减少残留。
以上对本申请实施例所提供的一种显示屏及其制作方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种显示屏，其包括：
    母板；
    至少一个子板，与所述母板相对设置；
    第一导电胶，设于所述母板和所述子板之间，所述第一导电胶和所述子板之间具有第一附着力；
    第二导电胶，设于所述第一导电胶和所述母板之间，所述第一导电胶和所述第二导电胶之间具有第二附着力，所述第二导电胶和所述母板之间具有第三附着力；
    其中，所述第一附着力和所述第二附着力均大于所述第三附着力。
  2. 如权利要求1所述的显示屏，其中，所述第一导电胶的材料包括第一基体树脂和第一导电物，所述第二导电胶的材料包括第二基体树脂和第二导电物，所述第一导电胶中所述第一基体树脂的含量大于所述第二导电胶中所述第二基体树脂的含量。
  3. 如权利要求2所述的显示屏，其中，所述第一导电胶的材料包括8-22wt%的第一基体树脂，所述第二导电胶的材料包括3-17wt%的第二基体树脂。
  4. 如权利要求3所述的显示屏，其中，所述第一基体树脂含有极性基团，所述第二基体树脂含有极性基团。
  5. 如权利要求2所述的显示屏，其中，所述第一导电物的形貌为非颗粒状。
  6. 如权利要求5所述的显示屏，其中，所述第一导电物的形貌为线状、树枝状或鳞片状。
  7. 如权利要求2所述的显示屏，其中，所述第二导电物的形貌为颗粒状。
  8. 如权利要求1所述的显示屏，其中，所述子板设有第一焊垫，所述第一导电胶与所述第一焊垫连接；
    所述母板设有第二焊垫，所述第二导电胶与所述第二焊垫连接；
    所述第一焊垫通过所述第一导电胶和所述第二导电胶电性连接于所述第二焊垫。
  9. 如权利要求8所述的显示屏，其中，所述子板对应所述第一焊垫设有凹槽，所述第一焊垫设于所述凹槽的底部，所述第一导电胶覆盖在所述凹槽中，且所述第一导电胶远离所述第一焊垫的表面超出所述凹槽的开口。
  10. 如权利要求9所述的显示屏，其中，所述第一导电胶超过所述凹槽的开口的部分的宽度大于所述凹槽的宽度。
  11. 一种显示屏的制作方法，其包括：
    步骤B1、提供母板和至少一个子板；
    步骤B2、在所述子板上形成第一导电胶，所述第一导电胶和所述子板之间具有第一附着力；
    步骤B3、在所述第一导电胶上形成第二导电胶，所述第一导电胶和所述第二导电胶之间具有第二附着力；
    步骤B4、组装所述母板和所述子板，所述第一导电胶和所述第二导电胶设于所述母板和所述子板之间，所述第二导电胶和所述母板之间具有第三附着力，所述第一附着力和所述第二附着力均大于所述第三附着力。
  12. 如权利要求11所述的显示屏的制作方法，其中，所述步骤B2包括：
    步骤B21、在所述子板上设置第一导电浆料；
    步骤B22、对所述第一导电浆料进行固化处理，得到所述第一导电胶。
  13. 如权利要求12所述的显示屏的制作方法，其中，所述步骤B3包括：在所述第一导电胶上设置第二导电浆料，从而形成所述第二导电胶；
    其中，所述第一导电浆料的组分包括第一基体树脂和第一导电物，所述第二导电浆料的组分包括第二基体树脂和第二导电物，所述第一导电浆料中所述第一基体树脂的含量大于所述第二导电浆料中所述第二基体树脂的含量。
  14. 如权利要求13所述的显示屏的制作方法，其中，所述第一导电浆料包括10-20wt%的第一基体树脂，所述第二导电浆料包括5-15wt%的第二基体树脂。
  15. 如权利要求13所述的显示屏的制作方法，其中，所述第一基体树脂含有极性基团，所述第二基体树脂含有极性基团。
  16. 如权利要求13所述的显示屏的制作方法，其中，所述第一导电物的形貌为非颗粒状。
  17. 如权利要求16所述的显示屏的制作方法，其中，所述第一导电物的形貌为线状、树枝状或鳞片状。
  18. 如权利要求13所述的显示屏的制作方法，其中，所述第二导电物的形貌为颗粒状。
  19. 如权利要求13所述的显示屏的制作方法，其中，在所述步骤B4中，组装所述母板和所述子板后，对所述第二导电胶进行预固化处理。
  20. 如权利要求19所述的显示屏的制作方法，其中，所述显示屏的制作方法还包括：
    步骤B5、对所述第一导电胶和所述第二导电胶进行电性测试，若所述第一导电胶和所述第二导电胶的导电性能合格，则执行步骤B6；若所述第一导电胶和所述第二导电胶的导电性能异常，则执行步骤B7；
    步骤B6、对所述第二导电胶进行后固化处理；
    步骤B7、分离所述母板和所述子板，并对所述母板和所述子板进行清洁处理，重复所述步骤B3-所述步骤B5。
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