WO2023155407A1

WO2023155407A1 - Semiconductor element overturning apparatus

Info

Publication number: WO2023155407A1
Application number: PCT/CN2022/115662
Authority: WO
Inventors: 林海涛; 赵凯; 梁猛; 郑建峰; 张恒涛
Original assignee: 上海世禹精密机械有限公司
Priority date: 2022-02-21
Filing date: 2022-08-30
Publication date: 2023-08-24
Also published as: CN114506649A; CN114506649B

Abstract

A semiconductor element overturning apparatus, comprising: a frame body (1); a loading and unloading module, the loading and unloading module being connected to the frame body (1) and used for loading and unloading external workpieces; a lifting module connected to the loading and unloading module and used for lifting the workpieces; and an overturning module connected to the frame body (1) and used for overturning the workpieces. The apparatus can perform distribution at different positions according to production requirements of subsequent procedures, so as to implement modular transfer, thereby achieving intelligent machining and conveying of workpieces without manual operation; the transfer process is smooth, the speed is high, and the efficiency is high, thus the stability of a machining period can be guaranteed, and the labor cost is reduced; and workpieces can be overturned when being transferred and transported, so that the problem that special workpieces need to be overturned is solved.

Description

Semiconductor element flipping equipment

technical field

The invention relates to the technical field of semiconductor element production, processing and transfer equipment, in particular to a semiconductor element flipping equipment.

Background technique

The existing semiconductor component transfer equipment cannot be modularized to meet the needs of different production processes, nor can the workshop fully automate the operation of the product line, and the cleanliness level does not meet higher requirements, which affects the production and processing of products and prolongs processing Due to the transportation cycle, the accuracy of the construction period cannot be guaranteed, so a semiconductor element flipping device is designed for this.

Contents of the invention

According to an embodiment of the present invention, a semiconductor element flipping device is provided, including:

frame;

The loading and unloading module is connected to the frame body and is used for loading and unloading external workpieces;

The jacking module, which is connected with the loading and unloading module, is used to lift the workpiece;

The overturning module is connected with the frame body and used for overturning the workpiece.

Further, the loading and unloading module includes:

The first Z-axis linear module, the first Z-axis linear module is connected to the frame body, and is used to provide a driving force for moving along the Z-axis direction;

A box body, the box body is connected to the output end of the first Z-axis linear module;

A pair of conveyor belts, a pair of conveyor belts are symmetrically arranged on both side walls inside the box;

The whole row of cylinders, the whole row of cylinders are connected with the box, and are used for the whole row positioning of the workpiece.

Further, the loading and unloading module also includes:

The adjusting rod is connected with the box body and is used for adjusting the width of both sides of the box body.

Further, the jacking module includes:

The second Z-axis linear module, the second Z-axis linear module is connected with the casing, and is used to provide a driving force moving along the Z-axis direction;

The storage table, the storage table is located between the two side walls inside the cabinet, the bottom of the storage table runs through the bottom of the cabinet and is connected to the output end of the second Z-axis linear module;

The material stopper is connected with the storage table, and is used to block and limit the workpiece when there are workpieces on the storage table.

Further, the retaining component includes:

A pair of stoppers, a pair of stoppers are located on both sides of the storage table;

The stopper driving mechanism is connected with the storage table, and the output end of the stopper driving mechanism is connected with a pair of stoppers for driving the stoppers to rotate 90 degrees.

Further, the flipping module contains:

A pair of overturning assemblies are arranged on both sides of the top of the frame body, and are used for overturning the workpiece.

Further, one of the rollover components contains:

Linear cylinder, the linear cylinder is arranged on the top side of the frame body, and is used to provide the driving force to move along the X-axis direction;

A turning motor, which is connected to the output end of the linear cylinder;

The clamping cylinder is connected to the output end of the turning motor;

The gripper is connected to the output end of the clamping cylinder;

The guide assembly is connected with the turning motor and the frame body.

Further, the guide component contains:

Guide rails, the guide rails are arranged on the frame body;

The guide block is connected with the turning motor, and the guide block is slidably arranged on the guide rail.

According to the semiconductor element flipping device of the embodiment of the present invention, different positions can be allocated according to the production requirements of subsequent processes, so as to achieve modular transfer and transfer, realize intelligent workpiece processing and transportation, without manual operation, and the transfer process is smooth. And the speed is fast and the efficiency is high, which can ensure the stability of the processing cycle and save labor costs. It can realize the flipping of workpieces during transfer and transportation, and solve the problem that special workpieces need to be flipped.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the claimed technology.

Description of drawings

FIG. 1 is a first perspective structural view of a semiconductor element flipping device according to an embodiment of the present invention.

FIG. 2 is a second perspective structural view of a semiconductor element flipping device according to an embodiment of the present invention.

Fig. 3 is a three-dimensional structure diagram of a material ejecting module of a semiconductor device overturning device according to an embodiment of the present invention.

FIG. 4 is a first perspective structural view of a flipping module of a semiconductor element flipping device according to an embodiment of the present invention.

FIG. 5 is a second perspective structural view of a flipping module of a semiconductor element flipping device according to an embodiment of the present invention.

FIG. 6 is a third perspective structural view of a flipping module of a semiconductor element flipping device according to an embodiment of the present invention.

Detailed ways

The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, and the present invention will be further elaborated.

First, the semiconductor element flipping device according to the embodiment of the present invention will be described in conjunction with FIGS. 1 to 6, which is used to transfer semiconductor elements (such as wafers, PCB boards, etc.) and flip the transferred workpieces. It has a wide range of application scenarios .

As shown in FIGS. 1-6 , the semiconductor element flipping device according to the embodiment of the present invention has a frame body 1 , a loading and unloading module, a jacking module and a flipping module.

Specifically, as shown in Figures 1-2, in this embodiment, the loading and unloading module is connected to the frame body 1 for loading and unloading external workpieces, and the jacking module is connected to the loading and unloading module for jacking up the workpiece , the turning module is connected with the frame body 1, and is used to turn over the workpiece. Through the mutual cooperation of the loading and unloading module, the lifting module and the turning module, the workpiece can be automatically loaded and unloaded, and the workpiece can be turned over without manual operation. , the transfer process is smooth, fast and efficient, which can ensure the stability of the processing cycle and save labor costs.

Further, as shown in FIGS. 1-3 , in this embodiment, the loading and unloading module includes: a first Z-axis linear module 21 , a box body 22 , a pair of conveyor belts 23 and an array of cylinders 24 . The first Z-axis linear module 21 is connected to the frame body 1 for providing driving force to move along the Z-axis direction, and the box body 22 is connected to the output end of the first Z-axis linear module 21 for supporting the Parts, a pair of conveyor belts 23 are symmetrically arranged on the inner side walls of the box body 22, and a pair of conveyor belts 23 are used for docking external workpieces, and the whole row of cylinders 24 is connected with the box body 22 for aligning the workpieces.

Further, as shown in Figures 1 to 3, in this embodiment, the loading and unloading module also includes: an adjustment rod 25, which is connected to the box body 22, and is used to adjust the width of both sides of the box body 22, and is suitable for different widths. workpieces, increasing the utility of the equipment.

Further, as shown in FIGS. 1-3 , in this embodiment, the ejecting module includes: a second Z-axis linear module 31 , a storage table 32 and a stopper. The second Z-axis linear module 31 is connected to the box body 22, and is used to provide a driving force for moving along the Z-axis direction. The storage table 32 is located between the inner side walls of the box body 22, and the bottom of the storage table 32 runs through the box body. The bottom of 22 is connected to the output end of the second Z-axis linear module 31 for supporting the workpiece, and the stopper is connected to the storage table 32 for blocking the workpiece when there is a workpiece on the storage table 32 bit.

Further, as shown in FIGS. 1-3 , in this embodiment, the stopper assembly includes: a pair of stoppers 331 and a stopper driving mechanism 332 . A pair of stoppers 331 are located on both sides of the storage platform 32, the stopper drive mechanism 332 is connected with the storage platform 32, the output end of the stopper drive mechanism 332 is connected with a pair of stoppers 331, and the stopper drive mechanism 332 is crank slider drive The mechanism is used to drive the block 331 to rotate 90 degrees, so that the block 331 can stand or lie down.

Further, as shown in Figures 1-2, 4-6, in this embodiment, the overturning module includes: a pair of overturning assemblies, and a pair of overturning assemblies are arranged on both sides of the top of the frame body 1 for overturning the workpiece, Ensure stability when flipping.

Further, as shown in Figures 1-2, 4-6, in this embodiment, one of the turning components includes: a linear cylinder 41, a turning motor 42, a clamping cylinder 43, jaws 44 and a guide component. The linear cylinder 41 is arranged on the top side of the frame body 1, and is used to provide the driving force for moving along the X-axis direction. The turning motor 42 is connected with the output end of the linear cylinder 41 to provide turning force. The clamping cylinder 43 and the turning motor 42 The output end is connected, and the clamping claw 44 is connected with the output end of the clamping cylinder 43, and the clamping cylinder 43 drives the clamping jaw 44 to clamp the workpiece. The guide assembly is connected with the flipping motor 42 and the frame body 1 for guiding function to ensure accuracy.

Further, as shown in FIGS. 1-2 , 4-6 , in this embodiment, the guide assembly includes: a guide rail 451 and a guide block 452 . The guide rail 451 is arranged on the frame body 1, the guide block 452 is connected with the turning motor 42, and the guide block 452 is slidably arranged on the guide rail 451, by being provided with the guide block 452 and the guide rail 451, good guidance can be provided for the movement of the turning motor 42 Effect.

When in use, the storage table 32 and the pair of conveyor belts 23 are at the same height. When the workpiece is conveyed by external equipment, the stopper driving mechanism 332 drives the stopper 331 at the rear end to rotate forward 90 degrees to lie down, and a Run the conveyor belt 23, dock the workpieces delivered by the external equipment, flow the workpieces into the box body 22 and place them on the top shelf 32, and then use the whole row of cylinders 24 to limit the workpieces in a row. The stopper 331 at the end rotates 90 degrees in the opposite direction and stands to block and limit the workpiece. Then the second Z-axis linear module 31 drives the storage table 32 to the flip position. At this time, the linear cylinder 41 in the pair of flip components drives the flip The motor 42 moves toward the workpiece to the clamping position, allowing the clamping cylinder 43 to operate, and the driving jaw 44 can clamp the workpiece, and then the first Z-axis linear module 21 drives the box body 22 and the storage table 32 to a safe low position, It will not interfere with the turning, and then the turning motor 42 runs to drive the workpiece to turn over. After the workpiece is turned over, the storage table 32 rises to catch the workpiece. If the workpiece has an adsorption action subsequently, the storage table 32 falls to the same height as the pair of conveyor belts 23 for adsorption. Wait, if there is no adsorption action, the storage table 32 drops to a height below the pair of conveyor belts 23, and the workpiece falls on the pair of conveyor belts 23, and is transported out of the casing 22 by a pair of conveyors.

Above, referring to Figures 1 to 6, the semiconductor element flipping equipment according to the embodiment of the present invention has been described. Different positions can be assigned according to the production requirements of subsequent processes, so as to achieve modular transfer and transfer, and realize intelligent workpiece processing and transportation. , without manual operation, the transfer process is smooth, fast and efficient, which can ensure the stability of the processing cycle and save labor costs. It can realize the flipping of workpieces during transfer and transportation, and solve the problem of flipping special workpieces.

It should be noted that in this specification, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or device comprising a set of elements includes not only those elements , but also includes other elements not expressly listed, or also includes elements inherent in such process, method, article or equipment. Without further limitations, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

Although the content of the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as limiting the present invention. Various modifications and alterations to the present invention will become apparent to those skilled in the art upon reading the above disclosure. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

A semiconductor element flipping device, characterized in that it comprises:

frame;

A loading and unloading module, the loading and unloading module is connected to the frame body and is used for loading and unloading external workpieces;

a jacking module, the jacking module is connected to the loading and unloading module, and is used to jack up the workpiece;

An overturning module, the overturning module is connected with the frame body and is used for overturning the workpiece.
The semiconductor element flipping device according to claim 1, wherein the loading and unloading module comprises:

A first Z-axis linear module, the first Z-axis linear module is connected to the frame body, and is used to provide a driving force for moving along the Z-axis direction;

a box, the box is connected to the output end of the first Z-axis linear module;

A pair of conveyor belts, the pair of conveyor belts are symmetrically arranged on both side walls inside the box;

The whole row of cylinders is connected with the box and used for the whole row of positioning of the workpieces.
The semiconductor element flipping device according to claim 2, wherein the loading and unloading module further comprises:

An adjustment rod, the adjustment rod is connected with the box body, and is used for adjusting the width of both sides of the box body.
The semiconductor element flipping device according to claim 2, wherein the top material module comprises:

a second Z-axis linear module, the second Z-axis linear module is connected to the box, and is used to provide a driving force for movement along the Z-axis;

a storage table, the storage table is located between the inner side walls of the box, the bottom of the storage table runs through the bottom of the box and is connected to the output end of the second Z-axis linear module;

A material stopper, the material stopper is connected with the storage table, and is used for blocking and limiting the workpiece when there is the workpiece on the storage table.
The semiconductor element flipping device according to claim 4, wherein the stopper assembly comprises:

A pair of stoppers, a pair of said stoppers are located on both sides of said storage table;

A stopper drive mechanism, the stopper drive mechanism is connected with the storage table, the output end of the stopper drive mechanism is connected with the pair of stoppers, and is used to drive the stoppers to rotate 90 degrees.
The semiconductor element flipping device according to claim 1, wherein the flipping module comprises:

A pair of overturning assemblies, the pair of overturning assemblies are arranged on both sides of the top of the frame body, and are used to overturn the workpiece.
The semiconductor element flipping device according to claim 6, wherein one of the flipping components comprises:

a linear cylinder, the linear cylinder is arranged on the top side of the frame body, and is used to provide a driving force to move along the X-axis direction;

A turning motor, the turning motor is connected to the output end of the linear cylinder;

A clamping cylinder, the clamping cylinder is connected to the output end of the turning motor;

A clamping jaw, the clamping jaw is connected to the output end of the clamping cylinder;

A guide assembly, the guide assembly is connected with the turning motor and the frame body.
The semiconductor element flipping device according to claim 7, wherein the guide assembly comprises:

a guide rail, the guide rail is arranged on the frame body;

A guide block, the guide block is connected with the turning motor, and the guide block is slidably arranged on the guide rail.