WO2023155409A1

WO2023155409A1 - Semiconductor element transport device

Info

Publication number: WO2023155409A1
Application number: PCT/CN2022/115664
Authority: WO
Inventors: 梁猛; 林海涛; 赵凯; 时威; 郑建峰
Original assignee: 上海世禹精密机械有限公司
Priority date: 2022-02-21
Filing date: 2022-08-30
Publication date: 2023-08-24
Also published as: CN216749844U

Abstract

Disclosed is a semiconductor element transport device, comprising: an object placement platform; a conveying module, located on one side of the object placement platform and used for conveying a workpiece to be machined; an arraying and transferring platform, located on one side of the conveying module and used for adjusting the position of the workpiece to be machined; and a grabbing module, provided on one side of the arraying and transferring platform and used for grabbing the workpiece to be machined that is on the arraying and transferring platform. The present invention can distribute different positions of various parts according to production requirements of subsequent procedures so as to achieve modular transfer and transport, such that intelligent workpiece machining and conveying are achieved, manual operation is not needed, the transfer process is smooth, speed is high, efficiency is high, the stability of a machining period can be guaranteed, and labor costs are saved.

Description

Semiconductor component transfer equipment

technical field

The invention relates to the technical field of workpiece transfer devices, in particular to semiconductor element transfer equipment.

Background technique

The existing semiconductor component loading and unloading machines cannot be modularized to meet the needs of different production processes, nor can the workshop fully automate the operation of the product line, and the cleanliness level does not meet higher requirements, which affects the production and processing of products and prolongs The cycle of processing and transportation cannot guarantee the accuracy of the construction period, so a semiconductor component transfer equipment is designed for this.

Contents of the invention

According to an embodiment of the present invention, a semiconductor element transfer device is provided, including:

shelf;

The conveying module, which is located on one side of the storage table, is used to convey the workpiece to be processed;

The whole row of transfer platform, the whole row of transfer platform is located on one side of the conveying module, and the whole row of transfer platform is used to adjust the position of the workpiece to be processed;

The grabbing module is arranged on one side of the transfer platform of the whole row, and is used for grabbing the workpieces to be processed on the transfer platform of the whole row.

Further, the delivery module contains:

The box body is located on one side of the storage table;

a fork extractor, the fork extractor is arranged on the box body;

A fork lifter drive mechanism, the fork lifter drive mechanism is arranged in the box, the fork lifter drive mechanism is connected with the fork lifter, and is used to drive the fork lifter to move;

Conveyor belt, the conveyor belt is set on the inner wall of the box, used to transport the workpiece to be processed;

The box driving device is arranged at the bottom of the box and is used to drive the box to move.

Further, the box driving device includes:

a first rotating mechanism, the first rotating mechanism is arranged at the bottom of the box, and is used to drive the box to rotate;

Y-axis driving mechanism, the Y-axis driving mechanism is arranged at the bottom of the rotating mechanism, and is used to drive the box to move along the Y-axis;

X-axis driving mechanism, the X-axis driving mechanism is arranged at the bottom of the Y-axis driving mechanism, and is used to drive the box to move along the X-axis;

The first Z-axis driving mechanism, the first Z-axis driving mechanism is arranged at the bottom of the Y-axis driving mechanism, and is used to drive the box to move along the Z-axis.

Further, the conveying module further includes: a code reader, which is arranged on the top of the box.

Further, the grab module contains:

Suction cup, the suction cup is set on one side of the transfer platform of the whole row, and is used to suck the workpieces to be processed on the transfer platform of the whole row;

The suction cup driving device is arranged on one side of the whole row transfer platform, and the suction cup driving device is connected with the suction cups to drive the suction cups to move.

Further, the suction cup drive unit includes:

The second Z-axis driving mechanism, the second Z-axis driving mechanism is arranged on one side of the whole-row transfer platform, and is used to provide the driving force along the Z-axis;

The second rotating mechanism, the second rotating mechanism is arranged at the output end of the second Z-axis driving mechanism, and the output end of the second rotating mechanism is connected with the sucker for driving the sucker to rotate.

According to the semiconductor element transfer equipment of the embodiment of the present invention, different positions of parts can be allocated according to the production requirements of subsequent processes, so as to achieve modular transfer and transfer, realize intelligent workpiece processing and transportation, without manual operation, transfer The process is smooth, fast and efficient, which can ensure the stability of the processing cycle and save labor costs.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the claimed technology.

Description of drawings

FIG. 1 is a schematic diagram of a first three-dimensional structure of a semiconductor device transfer device according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of a second three-dimensional structure of a semiconductor device transfer device according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of a third three-dimensional structure of a semiconductor device transfer device according to an embodiment of the present invention.

FIG. 4 is a schematic perspective view of a grasping module of a semiconductor component transfer device according to an embodiment of the present invention.

5 is a schematic diagram of a testing structure of a grasping module of a semiconductor component transfer device according to an embodiment of the present invention.

FIG. 6 is a schematic perspective view of the three-dimensional structure of an array of transfer platforms of a semiconductor device transfer device according to an embodiment of the present invention.

Detailed ways

The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, and the present invention will be further elaborated.

Firstly, a semiconductor element transfer device according to an embodiment of the present invention will be described with reference to FIGS. 1-6 , which is used for transferring workpieces and has a wide range of application scenarios.

As shown in FIGS. 1 to 6 , the semiconductor component transfer equipment according to the embodiment of the present invention has a storage table 1 , a conveying module, an alignment transfer platform 3 and a grabbing module.

Specifically, as shown in Figures 1 to 3, in this embodiment, the storage table 1 is used to place workpieces that need to be processed and to be transported, and the conveying module is located on one side of the storage table 1, and is used to transport the workpieces to be processed. 3 is located on one side of the conveying module. The whole-row transfer platform 3 is used to adjust the position of the workpiece to be processed. The whole-row transfer platform 3 adopts the form of a cylinder baffle mechanism, and the cylinder drives the baffle to adjust the position of the processed workpiece. For workpiece positioning, the grabbing module is set on one side of the whole-row transfer platform 3, and is used to grab the workpieces to be processed on the whole-row transfer platform 3 for workpiece grabbing. The grasping modules cooperate with each other to realize the intelligent transfer of workpieces.

Further, as shown in FIGS. 1-3 , in this embodiment, the conveying module includes: a box body 21 , a fork lifter 22 , a drive mechanism for the fork lifter 23 , a conveyor belt 26 and a box body 21 drive device. The box body 21 is positioned at one side of the storage table 1, the fork extractor 22 is arranged on the box body 21, the fork extractor drive mechanism 23 is arranged in the box body 21, and the fork extractor drive mechanism 23 is connected with the fork extractor 22 for Drive the fork lifter 22 to move along the Z axis and the Y axis, the drive mechanism 23 of the fork lifter adopts the form of combining the motor drive mechanism and the cylinder drive mechanism, the motor drive mechanism drives the fork lifter 22 to move along the Y axis, and the cylinder drive mechanism drives the fork The picker moves along the Z axis, so that the picker 22 can pick up the processing workpiece on the storage table 1, and place it on the conveyor belt 26. The conveyor belt 26 is arranged on the inner wall of the box body 21, and is used to transport the workpiece to be processed. The processed workpieces are transported to the alignment transfer platform 3 , and the driving device of the box body 21 is arranged at the bottom of the box body 21 to drive the box body 21 to move.

Further, as shown in FIGS. 1-3 , in this embodiment, the driving device for the box body 21 includes: a first rotating mechanism 241 , a Y-axis driving mechanism 242 , an X-axis driving mechanism 243 and a first Z-axis driving mechanism 244 . The first rotating mechanism 241 is arranged on the bottom of the box body 21, and is used to drive the rotation of the box body 21, which can save space. The box body 21 moves along the Y-axis, and the Y-axis driving mechanism 242 adopts a screw module driving mechanism. The mechanism 243 adopts a motor belt drive mechanism. The first Z-axis drive mechanism 244 is arranged at the bottom of the Y-axis drive mechanism 242 for driving the box body 21 to move along the Z-axis. The first Z-axis drive mechanism 244 adopts a motor screw drive mechanism. Through the Y-axis driving mechanism 242, the X-axis driving mechanism 243 and the first Z-axis driving mechanism 244, the X, Y, and Z-axis positions of the box body 21 are adjusted, so that the box body 21 can be connected with the storage table 1 and the The entire row of transfer platforms 3 is aligned so that workpieces can be aligned for transfer.

Further, as shown in FIGS. 1-3 , in this embodiment, the conveying module further includes: a code reader 25 , which is arranged on the top of the box 21 and used for reading and recording the workpiece.

Further, as shown in FIGS. 1-3 , in this embodiment, the grasping module includes: a suction cup 41 and a driving device for the suction cup 41 . The suction cup 41 is arranged on one side of the whole-row transfer platform 3, and is used to suck the workpieces to be processed on the whole-row transfer platform 3. The driving device of the suction cup 41 is arranged on one side of the whole-row transfer platform 3. To drive the suction cup 41 to move.

Further, as shown in FIGS. 1-3 , in this embodiment, the driving device for the suction cup 41 includes: a second Z-axis driving mechanism 421 and a second rotating mechanism 422 . The second Z-axis driving mechanism 421 is arranged on one side of the whole-row transfer platform 3, and is used to provide the driving force along the Z-axis. The second Z-axis driving mechanism 421 adopts a motor-driven mechanism, and the second rotating mechanism 422 is arranged on the second Z-axis The output end of the driving mechanism 421 and the output end of the second rotating mechanism 422 are connected with the sucker 41 for driving the sucker 41 to rotate, and the second rotating mechanism 422 adopts a motor-driven mechanism.

When in use, the workpiece to be transported is first placed on the storage table 1, and then the forklift 22 is driven forward by the forklift drive mechanism 23 to fork the workpiece, and the forklift drive mechanism 23 drives the forklift 22 Retreat, then descend and fork the workpiece onto the conveyor belt 26 on the box body 21. At this time, the code reader 25 reads the code, and rotates the box body 21 through the first rotating mechanism 241 to allow the box body 21 to rotate 180 degrees. The X, Y, and Z axis positions of the box body 21 are adjusted by the Y-axis drive mechanism 242, the X-axis drive mechanism 243, and the first Z-axis drive mechanism 244, so that the forked workpieces on the box body 21 are aligned with the alignment transfer platform 3 , and then transport the workpieces through the conveyor belt 26, so that the workpieces can be transported on the entire row of transfer platforms 3, and then adjust the position of the workpieces through the entire row of transfer platforms 3, and then drive the second rotation mechanism 422 downward through the second Z-axis driving mechanism 421 , and then drives the suction cup 41 to suck the workpiece, and finally drives the suction cup 41 to rotate through the second rotating mechanism 422, thereby rotating the workpiece and completing the transfer of the workpiece. In addition, in this case, according to the requirements of the subsequent process, different positions of each component can be allocated to achieve modularized transfer.

Above, the semiconductor element transfer equipment according to the embodiment of the present invention has been described with reference to FIGS. The workpiece is processed and transported without manual operation. The transfer process is smooth, fast and efficient, which can ensure the stability of the processing cycle and save labor costs.

It should be noted that in this specification, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or device comprising a set of elements includes not only those elements , but also includes other elements not expressly listed, or also includes elements inherent in such process, method, article or equipment. Without further limitations, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

Although the content of the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as limiting the present invention. Various modifications and alterations to the present invention will become apparent to those skilled in the art upon reading the above disclosure. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

A semiconductor element transfer device, characterized in that it comprises:

shelf;

a conveying module, the conveying module is located on one side of the storage table, and is used for conveying workpieces to be processed;

A whole-row transfer platform, the whole-row transfer platform is located on one side of the conveying module, and the whole-row transfer platform is used to adjust the position of the workpiece to be processed;

A grabbing module, the grabbing module is arranged on one side of the full-line transfer platform, and is used for grabbing the workpieces to be processed on the full-line transfer platform.
The semiconductor component transfer equipment according to claim 1, wherein the delivery module comprises:

a box, the box is located on one side of the storage table;

a fork, the fork is arranged on the box;

A fork lifter driving mechanism, the fork lifter drive mechanism is arranged in the box, the fork lifter drive mechanism is connected with the fork lifter, and is used to drive the fork lifter to move;

a conveyor belt, the conveyor belt is arranged on the inner wall of the box, and is used to transport workpieces to be processed;

A box driving device, the box driving device is arranged at the bottom of the box, and is used to drive the box to move.
The semiconductor component transfer equipment according to claim 2, wherein the box driving device comprises:

a first rotation mechanism, the first rotation mechanism is arranged at the bottom of the box, and is used to drive the box to rotate;

A Y-axis driving mechanism, the Y-axis driving mechanism is arranged at the bottom of the rotating mechanism, and is used to drive the box to move along the Y-axis;

X-axis driving mechanism, the X-axis driving mechanism is arranged at the bottom of the Y-axis driving mechanism, and is used to drive the box to move along the X-axis;

A first Z-axis driving mechanism, the first Z-axis driving mechanism is arranged at the bottom of the Y-axis driving mechanism, and is used to drive the box to move along the Z-axis.
The semiconductor component transfer equipment according to claim 2, wherein the conveying module further comprises: a code reader, and the code reader is arranged on the top of the box.
The semiconductor component transfer device according to claim 1, wherein the grasping module comprises:

a suction cup, the suction cup is arranged on one side of the whole-row transfer platform, and is used to suck the workpiece to be processed on the whole-row transfer platform;

A suction cup driving device, the suction cup driving device is arranged on one side of the whole-row transfer platform, the suction cup driving device is connected with the suction cups, and is used to drive the suction cups to move.
The semiconductor element transfer device according to claim 5, wherein the chuck driving device comprises:

A second Z-axis driving mechanism, the second Z-axis driving mechanism is arranged on one side of the whole-row transfer platform, and is used to provide a driving force along the Z-axis;

A second rotating mechanism, the second rotating mechanism is arranged at the output end of the second Z-axis driving mechanism, the output end of the second rotating mechanism is connected with the suction cup, and is used to drive the suction cup to rotate.