WO2023155410A1 - Semiconductor element transport device - Google Patents

Abstract

A semiconductor element transport device comprising: a transfer module, for transferring and conveying a workpiece; an arraying module, located at one side of the transfer module and used for transferring and placing the workpiece; and a grabbing and rotating module, provided at a top portion of the arraying module and used for grabbing and rotating the workpiece that is placed on the arraying module. The device can distribute different positions of various parts according to production requirements of subsequent procedures, achieving modular transfer and transport, such that intelligent workpiece machining and conveying are achieved, manual operation is not needed, the transfer process is smooth, speed is high, efficiency is high, the stability of a machining period can be guaranteed, and labor costs are saved.

Description

Semiconductor component transfer equipment technical field

The invention relates to a workpiece transfer device, in particular to a semiconductor element transfer device.

Background technique

The existing semiconductor component transfer equipment cannot be modularized to meet the needs of different production processes, nor can the workshop fully automate the operation of the product line, and the cleanliness level does not meet higher requirements, which affects the production and processing of products and prolongs processing The transportation cycle cannot guarantee the accuracy of the construction period, so a semiconductor component transfer equipment is designed for this.

Contents of the invention

According to an embodiment of the present invention, a semiconductor element transfer device is provided, including:

Transfer module, the transfer module is used to transfer and transport the workpiece;

The whole row module, the whole row module is located on one side of the transfer module, which is used for the transfer placement of workpieces;

The grabbing and rotating module is arranged on the top of the whole row module, and is used for grabbing and rotating the workpiece placed on the whole row module.

Further, the transit module includes:

Box body, the box body is located on one side of the whole row of modules;

The box driving device, which is located at the bottom of the box, is used to drive the movement of the box;

The fork picker is located in the box and is used to fork the workpiece;

A fork lifter driving device, the fork lifter drive device is arranged in the box body, the fork lifter drive device is connected with the fork lifter, and is used to drive the fork lifter to move;

Conveyor belt, the conveyor belt is arranged in the box, used for conveying workpieces.

Further, the box driving device includes:

The first rotating mechanism, the first rotating mechanism is arranged at the bottom of the box body, and is used to drive the box body to rotate.

Further, the box drive device also includes:

The first Y-axis driving mechanism, the first Y-axis driving mechanism is arranged on the bottom of the rotating mechanism, and is used to drive the casing to move along the Y-axis;

X-axis driving mechanism, the X-axis driving mechanism is arranged at the bottom of the first Y-axis driving mechanism, and is used to drive the box to move along the X-axis;

The first Z-axis driving mechanism, the first Z-axis driving mechanism is arranged at the bottom of the first Y-axis driving mechanism, and is used to drive the box to move along the Z-axis.

Further, the transfer module also includes: a code reader, which is arranged on the box body.

Further, the fork drive device includes:

The third Z-axis driving mechanism, the third Z-axis driving mechanism is arranged in the box body, the output end of the third Z-axis driving mechanism is connected with the fork, and is used to drive the fork to move along the Z-axis;

The second Y-axis driving mechanism is arranged in the box body, and the output end of the second Y-axis driving mechanism is connected with the third Z-axis driving mechanism for driving the fork to move along the Y-axis.

Further, the full list of modules contains:

The whole row platform, the whole row platform is set on one side of the transfer module;

Several stoppers are arranged around the top of the whole column, any stopper is provided with a storage slot, and the outside of any stopper is provided with clamping holes.

Further, the grab rotation module contains:

Grabbing mechanism, which is located on the top of the whole table, is used to grab workpieces;

The rotary lifting mechanism is connected with the grasping mechanism and is used to drive the grasping mechanism to move.

Further, the grabbing mechanism includes:

a bottom plate, the bottom plate is arranged at the output end of the rotary lifting mechanism;

Four cylinders, the four cylinders are arranged around the top of the bottom plate;

The four jaws are respectively connected to the output ends of the four cylinders.

Further, the rotary lifting mechanism includes:

The second rotating mechanism, the output end of the second rotating mechanism is connected with the grasping mechanism, and is used to drive the grasping mechanism to rotate;

The second Z-axis driving mechanism, the output end of the second Z-axis driving mechanism is connected with the second rotating mechanism, and is used to drive the grabbing mechanism to move along the Z-axis.

According to the semiconductor element transfer equipment of the embodiment of the present invention, different positions of parts can be allocated according to the production requirements of subsequent processes, so as to achieve modular transfer and transfer, realize intelligent workpiece processing and transportation, without manual operation, transfer The process is smooth, fast and efficient, which can ensure the stability of the processing cycle and save labor costs.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the claimed technology.

Description of drawings

FIG. 1 is a schematic perspective view of a semiconductor element transfer device according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of a first perspective structure of a transfer module of a semiconductor device transfer device according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of a second perspective structure of a transfer module of a semiconductor device transfer device according to an embodiment of the present invention.

FIG. 4 is a schematic diagram of a first three-dimensional structure of an alignment module of a semiconductor element transfer device according to an embodiment of the present invention.

Detailed ways

The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, and the present invention will be further elaborated.

Firstly, a semiconductor element transfer device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4 , which is used for transfer of workpieces (take PCB boards as an example), and has a wide range of application scenarios.

As shown in FIGS. 1 to 4 , the semiconductor element transfer equipment according to the embodiment of the present invention has a transfer module, an array module, and a grabbing and rotating module.

Specifically, as shown in FIG. 1 , in this embodiment, the transfer module is used to transfer and transport workpieces, the alignment module is located on one side of the transfer module, and is used for transferring and placing workpieces, and the grabbing and rotating module is arranged on the side of the alignment module. The top is used to grab and rotate the workpieces placed on the entire row of modules. Through the mutual cooperation of the transfer module, sorting module and grabbing and rotating modules, the intelligent transfer of workpieces can be realized and the efficiency can be improved.

Further, as shown in FIGS. 1-3 , in this embodiment, the transfer module includes: a box body 1 , a box body driving device, a fork lifter 13 , a fork lifter drive device, and a conveyor belt 15 . The box body 1 is located on one side of the whole array module, the box body driving device is located at the bottom of the box body 1, and is used to drive the box body 1 to move. The drive device is arranged in the box body 1, the fork lifter drive device is connected with the fork lifter 13, and is used to drive the fork lifter 13 to move, and the conveyor belt 15 is arranged in the box body 1, and is used for conveying workpieces, passing through the box body 1, The mutual cooperation of the box driving device, the fork picker 13, the fork picker drive device and the conveyor belt 15 can realize the transshipment of the workpiece, and the workpiece is transported.

Further, as shown in Figures 1 to 3, in this embodiment, the box driving device includes: a first rotating mechanism 121, which is arranged at the bottom of the box 1, and is used to drive the box 1 to rotate. A rotating mechanism 121 adopts a motor-driven mechanism, so that the occupied space is saved when the workpiece is conveyed, and a very long conveying track is not required.

Further, as shown in FIGS. 1-3 , in this embodiment, the box driving device further includes: a first Y-axis driving mechanism 122 , an X-axis driving mechanism 123 and a first Z-axis driving mechanism 124 . The first Y-axis driving mechanism 122 is arranged at the bottom of the rotating mechanism. The first Y-axis driving mechanism 122 adopts a motor screw module driving mechanism to drive the box body 1 to move along the Y-axis. The X-axis driving mechanism 123 is arranged on the first Y-axis driving mechanism. The bottom of the Y-axis drive mechanism 122, the X-axis drive mechanism 123 adopts a motor belt drive mechanism for driving the box body 1 to move along the X-axis, the first Z-axis drive mechanism 124 is arranged at the bottom of the first Y-axis drive mechanism 122, and the second A Z-axis drive mechanism 124 adopts a motor screw drive mechanism to drive the cabinet 1 to move along the Z-axis, and the cabinet 1 is driven by the first Y-axis drive mechanism 122, the X-axis drive mechanism 123 and the first Z-axis drive mechanism 124. Adjust the position of the X-axis, Y-axis, and Z-axis to ensure the flexibility of the equipment and facilitate position adjustment.

Further, as shown in Figures 1 to 3, in this embodiment, the transfer module also includes: a code reader 16, which is arranged on the box body 1, and is used to read the code of the workpiece and identify the identification of the workpiece, so as to facilitate Record statistics.

Further, as shown in FIGS. 1 to 3 , in this embodiment, the forklift drive device includes: a third Z-axis drive mechanism 141 and a second Y-axis drive mechanism 142 . The third Z-axis drive mechanism 141 is arranged in the box body 1, the output end of the third Z-axis drive mechanism 141 is connected with the fork 13, and the third Z-axis drive mechanism 141 adopts a cylinder drive mechanism for driving the fork 13 Moving along the Z-axis, the second Y-axis driving mechanism 142 is arranged in the box body 1, the output end of the second Y-axis driving mechanism 142 is connected with the third Z-axis driving mechanism 141, and the second Y-axis driving mechanism 142 adopts a motor screw The drive mechanism is used to drive the fork lifter 13 to move along the Y axis. The third Z-axis drive mechanism 141 drives the fork lifter 13 to rise and fall for position adjustment. By cooperating with the second Y-axis drive mechanism 142, the fork lifter 13 Forward and backward, the workpiece can be forked.

Further, as shown in FIGS. 1 and 4 , in this embodiment, the alignment module includes: alignment table 21 and several stoppers 22 . The alignment table 21 is arranged on one side of the transfer module, and several blocks 22 are arranged around the top of the alignment table 21, any block 22 is provided with a storage slot 221, and the outside of any block 22 is provided with a clamping hole 222, Several stoppers 22 can place workpieces through the storage slots 221 thereon, and the clamping holes 222 are used for cooperating with the jaws 313 in the grabbing rotation module, so as to realize grabbing of the workpieces.

Further, as shown in FIG. 1 , in this embodiment, the grasping and rotating module includes: a grasping mechanism and a rotating and lifting mechanism. The grabbing mechanism is located on the top of the alignment table 21 and is used to grab workpieces. The rotating lifting mechanism is connected with the grabbing mechanism and is used to drive the grabbing mechanism to move. Through the rotating lifting mechanism and the grabbing mechanism, the workpiece can be grasped and rotated.

Further, as shown in FIG. 1 , in this embodiment, the grabbing mechanism includes: a bottom plate 311 , four cylinders 312 and four jaws 313 . Base plate 311 is arranged on the output end of rotary lifting mechanism, and base plate 311 is used for fixing four cylinders 312, and four cylinders 312 are arranged around the top of base plate 311, and four jaws 313 are respectively connected with the output ends of four cylinders 312, four The four cylinders 312 are respectively used to drive the movement of the four jaws 313, so as to clamp the workpiece.

Further, as shown in FIG. 1 , in this embodiment, the rotating lifting mechanism includes: a second rotating mechanism 321 and a second Z-axis driving mechanism 322 . The output end of the second rotating mechanism 321 is connected with the grasping mechanism, and the second rotating mechanism 321 adopts a motor drive mechanism for driving the grasping mechanism to rotate, and the output end of the second Z-axis driving mechanism 322 is connected with the second rotating mechanism 321, The second Z-axis driving mechanism 322 adopts a motor screw driving mechanism, which is used to drive the grabbing mechanism to move along the Z-axis.

When in use, the first Y-axis drive mechanism 122, the X-axis drive mechanism 123, and the first Z-axis drive mechanism 124 are used to adjust the position of the box 1 on the X-axis, Y-axis, and Z-axis to a suitable position. Then the second Y-axis drive mechanism 142 drives the fork lifter 13 to move forward to a suitable position, and then the third Z-axis drive mechanism 141 drives the fork lifter 13 to rise to a suitable position, and the fork lifter 13 forks the workpiece. Then the second Y-axis drive mechanism 142 drives the fork picker 13 to reset backward, and then the third Z-axis drive mechanism 141 drives the fork picker 13 to descend, so that the workpiece falls on the conveyor belt 15, and then passes through the first rotation mechanism. 121 rotates at an appropriate angle so that the workpiece is facing the alignment table 21, and the conveyor belt 15 transports the workpiece to the storage slots 221 of several stoppers 22, and then the second rotating mechanism 321 is driven down by the second Z-axis driving mechanism 322 to drive the gripper. The fetching mechanism descends, and at this moment, the four cylinders 312 drive the four jaws 313 to open outwards. When the four jaws 313 fall to the position of the clamping hole 222, the four cylinders 312 drive the four jaws 313 inward. contraction, the four jaws 313 are inserted into the clamping holes 222 on several blocks 22, thereby clamping the workpiece, and then the second rotation mechanism 321 is driven up by the second Z-axis driving mechanism 322, indirectly driving the workpiece up and down. The workpiece is rotated by the second rotating mechanism 321 to enter the next process, and it can also work in reverse to transfer the workpiece. In addition, in this case, according to the requirements of the subsequent process, different positions of each component can be allocated to achieve modularized transfer.

Above, the semiconductor element transfer equipment according to the embodiment of the present invention has been described with reference to FIGS. The workpiece is processed and transported without manual operation. The transfer process is smooth, fast and efficient, which can ensure the stability of the processing cycle and save labor costs.

It should be noted that in this specification, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or device comprising a set of elements includes not only those elements , but also includes other elements not expressly listed, or also includes elements inherent in such process, method, article or equipment. Without further limitations, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

Although the content of the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as limiting the present invention. Various modifications and alterations to the present invention will become apparent to those skilled in the art upon reading the above disclosure. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims (10)

A semiconductor element transfer device, characterized in that it comprises: Transfer module, the transfer module is used to transfer and transport the workpiece; A whole-row module, the whole-row module is located on one side of the transfer module, and is used for transfer placement of workpieces; The grabbing and rotating module is arranged on the top of the line-up module, and is used for grabbing and rotating the workpiece placed on the line-up module. The semiconductor element transfer equipment according to claim 1, wherein the transfer module comprises: a box body, the box body is located on one side of the whole row of modules; a box driving device, the box driving device is located at the bottom of the box, and is used to drive the box to move; a fork, the fork is located in the box, and is used to fork the workpiece; a drive device for the fork, the drive device for the fork is arranged in the box, the drive device for the fork is connected with the fork, and is used to drive the movement of the fork; The conveyor belt is arranged in the box and is used for conveying workpieces. The semiconductor component transfer equipment according to claim 2, wherein the box driving device comprises: A first rotating mechanism, the first rotating mechanism is arranged at the bottom of the box, and is used to drive the box to rotate. The semiconductor element transfer equipment according to claim 3, wherein the box driving device further comprises: a first Y-axis driving mechanism, the first Y-axis driving mechanism is arranged at the bottom of the rotating mechanism, and is used to drive the box to move along the Y-axis; X-axis driving mechanism, the X-axis driving mechanism is arranged at the bottom of the first Y-axis driving mechanism, and is used to drive the box to move along the X-axis; A first Z-axis driving mechanism, the first Z-axis driving mechanism is arranged at the bottom of the first Y-axis driving mechanism, and is used to drive the box to move along the Z-axis. The semiconductor component transfer equipment according to claim 2, wherein the transfer module further comprises: a code reader, and the code reader is arranged on the box body. The semiconductor component transfer equipment according to claim 2, wherein the fork drive device comprises: The third Z-axis driving mechanism, the third Z-axis driving mechanism is arranged in the box, the output end of the third Z-axis driving mechanism is connected with the fork, and is used to drive the fork along Z-axis movement; A second Y-axis driving mechanism, the second Y-axis driving mechanism is arranged in the box, and the output end of the second Y-axis driving mechanism is connected with the third Z-axis driving mechanism for driving the fork The fetcher moves along the Y axis. The semiconductor element transfer equipment according to claim 1, wherein the whole array module comprises: An alignment platform, the alignment platform is arranged on one side of the transfer module; A plurality of stoppers, the several stoppers are arranged around the top of the alignment table, any one of the stoppers is provided with a storage slot, and the outside of any one of the stoppers is provided with clamping holes. The semiconductor component transfer device according to claim 7, wherein the grasping and rotating module comprises: a grabbing mechanism, the grabbing mechanism is located on the top of the alignment table and is used to grab workpieces; A rotating lifting mechanism, the rotating lifting mechanism is connected with the grasping mechanism, and is used to drive the grasping mechanism to move. The semiconductor element transfer device according to claim 8, wherein the grasping mechanism comprises: a bottom plate, the bottom plate is arranged at the output end of the rotary lifting mechanism; four cylinders, the four cylinders are arranged around the top of the bottom plate; Four jaws, the four jaws are respectively connected with the output ends of the four cylinders. The semiconductor element transfer equipment according to claim 8, wherein the rotating lifting mechanism comprises: a second rotating mechanism, the output end of the second rotating mechanism is connected to the grabbing mechanism, and is used to drive the grabbing mechanism to rotate; The second Z-axis driving mechanism, the output end of the second Z-axis driving mechanism is connected with the second rotating mechanism, and is used to drive the grabbing mechanism to move along the Z-axis.

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