WO2023136004A1 - Film stratifié et procédé de fabrication de pièces de support - Google Patents

Film stratifié et procédé de fabrication de pièces de support Download PDF

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Publication number
WO2023136004A1
WO2023136004A1 PCT/JP2022/045546 JP2022045546W WO2023136004A1 WO 2023136004 A1 WO2023136004 A1 WO 2023136004A1 JP 2022045546 W JP2022045546 W JP 2022045546W WO 2023136004 A1 WO2023136004 A1 WO 2023136004A1
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WO
WIPO (PCT)
Prior art keywords
film
support piece
forming film
adhesive
piece forming
Prior art date
Application number
PCT/JP2022/045546
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English (en)
Japanese (ja)
Inventor
義信 尾崎
奎佑 大河原
紘平 谷口
裕貴 橋本
孝博 黒田
奏美 中村
Original Assignee
株式会社レゾナック
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Filing date
Publication date
Application filed by 株式会社レゾナック filed Critical 株式会社レゾナック
Publication of WO2023136004A1 publication Critical patent/WO2023136004A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Definitions

  • the present disclosure relates to a laminated film and a method for manufacturing a support piece.
  • Patent Document 1 As one mode of a semiconductor device, there is a structure in which a semiconductor chip is stacked over a controller chip arranged over a substrate.
  • the semiconductor assembly described in Patent Document 1 has a structure called a so-called dolmen structure (or tunnel structure).
  • This conventional semiconductor assembly includes a package substrate, a controller die disposed on the package substrate, and a memory die disposed above the controller die, with the memory die supported by support members such as pillars.
  • Patent Literature 1 In the semiconductor assembly of Patent Literature 1 described above, a resin film with a silicon chip is used as a support member of the dolmen structure using the same process as in the manufacture of ordinary semiconductor chips. However, this method has the problem of using a relatively expensive silicon chip and requiring a wafer polishing process.
  • a method of forming support pieces with a dolmen structure by separating the film for forming support pieces into individual pieces without using silicon chips is being investigated.
  • a laminated film obtained by laminating an adhesive film and a supporting piece-forming film on one surface of a base film can be used.
  • voids may expand between the adhesive film and the supporting piece forming film due to the tension applied to the adhesive film. In the portion where the void occurs, there is a possibility that trouble may occur when picking up the support piece.
  • the present disclosure has been made to solve the above problems, and provides a laminated film capable of suppressing expansion of voids between an adhesive film and a film for forming a support piece, and a method for manufacturing a support piece using the same. intended to
  • a laminated film according to one aspect of the present disclosure includes a base film, and an adhesive film and a supporting piece-forming film provided on one side of the base film, and the supporting piece-forming film is used to form the supporting piece.
  • the supporting piece-forming film is singulated into a plurality of supporting pieces by a cutting pattern extending over the entire thickness of the supporting piece-forming film, and the non-cutting pattern is not formed in at least a partial region of the peripheral edge portion of the supporting piece-forming film.
  • a notch is provided.
  • the supporting piece-forming film is separated into a plurality of supporting pieces in advance. Therefore, it is possible to omit the dicing of the supporting piece forming film after the laminate of the adhesive film and the supporting piece forming film is fixed to the ring frame.
  • the non-cut portion provided in at least a part of the peripheral edge portion of the supporting piece forming film allows the adhesive film and the supporting piece forming film to be separated from each other when the adhesive film is attached to the ring frame. Even if a void occurs between the cut patterns, the expansion of the void can be stopped at the boundary between the cut pattern and the non-cut portion. Therefore, in this laminated film, expansion of voids between the adhesive film and the supporting piece forming film can be suppressed.
  • the non-cut portion may be provided over the entire peripheral portion of the support piece forming film.
  • the boundary portion between the cut pattern and the non-cut portion can be positioned on the expansion path of the void. Therefore, expansion of voids between the adhesive film and the supporting piece forming film can be suppressed more reliably.
  • the supporting piece forming film may include a thermosetting resin layer.
  • the laminated film it is possible to enhance the holding performance of the supporting piece-forming film by the base film. Also, it is possible to suitably connect the supporting piece to the substrate of the semiconductor device after being picked up.
  • the supporting piece-forming film may further include a resin layer or metal layer having higher rigidity than the thermosetting resin layer. Since the support piece forming film includes a layer with high rigidity, the followability to a pick-up tool such as a suction collet can be improved while the followability to the push-up jig is reduced. When the metal layer is included, the optical contrast between the resin material and the metal material can enhance the visibility of the support piece during pickup.
  • thermosetting resin layers may be provided so as to sandwich a resin layer or a metal layer. In this case, even if the thermosetting resin layer is not subjected to a heat curing treatment, it is possible to more sufficiently secure the pick-up property of the supporting piece.
  • a method for manufacturing a support piece according to one aspect of the present disclosure is a method for manufacturing a support piece using the above-described laminated film.
  • dicing of the support piece forming film after fixing the laminate of the adhesive film and the support piece forming film to the ring frame can be omitted.
  • the spread of the voids can be stopped at the boundary between the cut pattern and the non-cut portion. Therefore, expansion of voids between the adhesive film and the support piece-forming film can be suppressed.
  • a peeling process for peeling the non-cut portion from the supporting piece forming film may be provided.
  • a non-cut portion is a portion where voids may occur in the fixing process.
  • FIG. 1 is a schematic cross-sectional view showing an example of a semiconductor device having a dolmen structure
  • FIG. 1 is a schematic plan view showing a laminated film according to one embodiment of the present disclosure
  • FIG. 3 is a schematic cross-sectional view of the laminated film shown in FIG. 2
  • 4 is a flow chart showing a method of manufacturing a support piece according to an embodiment of the present disclosure
  • It is a typical sectional view showing a fixing process.
  • It is a typical perspective view which shows a peeling process.
  • It is a typical perspective view showing a pick-up process.
  • (a) and (b) are schematic plan views showing laminated films according to modifications.
  • the "layer” in this specification encompasses both an aspect in which it is formed on the entire surface of the object to be formed and an aspect in which it is formed on a part of the object to be formed when observed as a plan view.
  • the “step” used herein is not necessarily limited to an independent step, and may include a step that achieves its intended action even if it cannot be clearly distinguished from other steps.
  • FIG. 1 is a schematic cross-sectional view showing an example of a semiconductor device having a dolmen structure.
  • the semiconductor device 1 shown in FIG. and a plurality of wires W electrically connected to each other.
  • the controller chip 3 , memory chips 4 , 5 and 6 and wires W are sealed with a sealing material 7 .
  • the substrate 2 is, for example, an organic substrate.
  • the substrate 2 may be a metal substrate such as a lead frame.
  • a plurality of supporting pieces D are arranged around the controller chip 3 .
  • An adhesive layer 8 is provided on one side of each of the controller chip 3 and the memory chips 4, 5 and 6, respectively.
  • the controller chip 3 is fixed to the surface of the substrate 2 via an adhesive layer 8 .
  • the memory chips 4, 5, 6 are stacked in a stepped manner with an adhesive layer 8 interposed therebetween so that a connection space for the wires W is formed.
  • the stack of memory chips 4, 5, 6 is supported above the controller chip 3 (on the side opposite to the substrate 2) by a plurality of supporting pieces D via an adhesive layer 8 on one side of the memory chip 4, which is the bottom layer. .
  • the wire W is used to connect the substrate 2 and the controller chip 3, but the substrate 2 and the controller chip 3 are bump-connected (for example, Cu bump and solder connection). may be configured.
  • FIG. 2 is a schematic plan view showing a laminated film according to an embodiment of the present disclosure
  • FIG. 3 is the typical sectional drawing.
  • the laminated film 11 includes a base film 12, and an adhesive film 13 and a supporting piece forming film 14 provided on one side of the base film 12.
  • FIGS. 2 and 3 are schematic plan views showing a laminated film according to an embodiment of the present disclosure.
  • the base film 12 is a long film extending in one direction with a predetermined width.
  • the laminate L of the adhesive film 13 and the supporting piece forming film 14 are arranged at predetermined intervals in the extending direction of the base film 12 .
  • the base film 12 is a film that serves as a base for the laminated film 11 .
  • it is made of a material such as polyethylene terephthalate (PET) or polyolefin.
  • PET polyethylene terephthalate
  • the base film 12 may have heat shrinkability.
  • the adhesive film 13 is a film for fixing the supporting piece forming film 14 to a ring frame 18 (see FIG. 5, etc.) described later.
  • the adhesive film 13 includes an adhesive layer and a substrate layer, and is arranged so that the adhesive layer faces the substrate film 12 and the support piece forming film 14 .
  • the adhesive film 13 is formed into a circle having a diameter smaller than the width of the base film 12 by processing means such as punching.
  • the adhesive film 13 is made of, for example, an ultraviolet-curing adhesive, and has a property that its adhesiveness decreases when irradiated with ultraviolet rays.
  • the adhesive layer of the adhesive film 13 may be an ultraviolet curable adhesive or a pressure-sensitive (non-ultraviolet curable) adhesive.
  • the adhesive films 13 are further arranged at both ends of the base film 12 in the width direction so as to surround the center adhesive film 13. It is The adhesive films 13 at both ends have the role of eliminating unevenness differences between the center and both ends of the laminated film 11 when the laminated film 11 is formed in a roll form. As a result, even when the number of turns increases, it is possible to avoid the occurrence of problems such as winding misalignment and voids due to unevenness.
  • the supporting piece forming film 14 is a film for forming the supporting pieces D (see FIG. 1) in the semiconductor device 1 described above.
  • the supporting piece forming film 14 is formed into a circle having a diameter one size smaller than that of the adhesive film 13 by processing means such as punching.
  • the supporting piece forming film 14 is made of, for example, a thermosetting resin composition. That is, the supporting piece forming film 14 is composed of the thermosetting resin layer 15 .
  • thermosetting resin composition that constitutes the support piece forming film 14 can go through a semi-cured (B stage) state and then become a fully cured (C stage) state by a subsequent curing treatment.
  • a thermosetting resin composition includes an epoxy resin, a curing agent, and an elastomer (eg, an acrylic resin).
  • the thermosetting resin composition further contains an inorganic filler, a curing accelerator, and the like, if necessary.
  • the support piece forming film 14 is separated into a plurality of support pieces D by a cut pattern 16 extending over the entire thickness of the support piece forming film 14 .
  • the cut pattern 16 has a lattice shape in plan view of the support piece forming film 14, and the support piece forming film 14 is cut by full cutting of the support piece forming film 14. It is in a state in which the cut reaches from one surface side to the other surface side. This cut may reach one side (adhesive layer) of the adhesive film 13 . Due to the cutting pattern 16 , rectangular supporting pieces D are arranged in advance in a matrix on the supporting piece forming film 14 .
  • a non-cut portion 17 in which the cut pattern 16 is not formed is provided in at least a partial region of the peripheral edge portion 14a of the support piece forming film 14. As shown in FIG. In the example of FIG. 2, the non-cut portion 17 is provided over the entire peripheral portion 14a of the film 14 for forming support pieces.
  • a laminated body is prepared in which the supporting piece forming film 14 is provided on one side of the base film 12.
  • the supporting piece forming film 14 is pre-cut, and the cutting pattern 16 extending over the entire thickness of the supporting piece forming film 14 is used to singulate a plurality of supporting pieces D.
  • a non-cut portion 17 in which the cut pattern 16 is not formed is provided in at least a partial region (here, the whole area) of the peripheral edge portion 14a of the support piece forming film 14 .
  • the adhesive film 13 is laminated on the base film 12 and the supporting piece forming film 14 . After the adhesive film 13 is laminated, the adhesive film 13 is pre-cut and the surplus portions are peeled off to obtain the laminated film 11 shown in FIGS.
  • FIG. 4 is a flowchart illustrating a method of manufacturing a support piece according to an embodiment of the present disclosure. As shown in FIG. 4, this support piece manufacturing method includes a fixing step (step S01), a peeling step (step S02), and a picking up step (step S03).
  • the fixing step is a step of fixing the laminate L of the adhesive film 13 separated from the base film 12 and the support piece forming film 14 to the ring frame 18 by attaching the adhesive film 13 to the ring frame 18 .
  • the fixing step is carried out by using a general laminating device 21 used for laminating a dicing film on a semiconductor wafer.
  • the lamination device 21 includes a stage 22 on which the ring frame 18 is placed, a suction table 23 and rollers 24 .
  • the base film 12 is peeled off from the laminated film 11 .
  • the laminated body L of the adhesive film 13 and the supporting piece forming film 14 is placed on the ring frame 18 placed on the stage 22 so that the supporting piece forming film 14 faces the suction table 23 side. .
  • the suction table 23 may or may not be in contact with the supporting piece forming film 14 .
  • the suction table 23 is adjusted to the same height as the ring frame 18, if the suction mechanism operates and an error (for example, an error indicating that the wafer is not detected) occurs, the height of the suction table 23 is increased.
  • the height may be one step lower than the height of the ring frame 18 .
  • void V may be generated between the adhesive film 13 and the support piece forming film 14 at the peripheral edge portion 14 a of the support piece forming film 14 .
  • voids V are likely to occur on the sticking start position side and the sticking end position side of the adhesive film 13 by the roller 24 , and the voids V that have occurred are caused by the pressure from the roller 24 , and the supporting piece forming film. 14 from the peripheral edge portion 14a toward the central portion side.
  • the above-described non-cut portion 17 is provided on the entire peripheral portion 14a of the support piece forming film 14. As shown in FIG. Therefore, even if a void V occurs between the adhesive film 13 and the supporting piece forming film 14, the boundary portion R between the cut pattern 16 and the non-cut portion 17 is positioned on the expansion path of the void V. can be made The expansion of the void V is stopped at the boundary portion R between the cut pattern 16 and the non-cut portion 17, and the expansion of the void V toward the central portion of the support piece forming film 14 is suppressed.
  • the peeling step is a step of peeling the non-cut portion 17 from the supporting piece forming film 14 .
  • the peeling process is performed between the fixing process and the pick-up process.
  • the non-notched portion 17 is peeled off from the peripheral edge portion 14a of the film 14 for supporting piece formation.
  • Voids V generated in the fixing process can be removed by peeling off the non-cut portions 17 .
  • the non-cut portion 17 may be peeled regardless of the presence or absence of the void V, and the generation of the void V is confirmed by visual recognition or the like, and the non-cut portion 17 where the void V is confirmed is selectively peeled.
  • the adhesive film 13 is made of an ultraviolet curable adhesive
  • the adhesive film 13 may be irradiated with ultraviolet rays before the non-cut portion 17 is peeled off, depending on the adhesive strength of the adhesive. In this case, for example, by irradiating ultraviolet rays from the back surface of the adhesive film 13 (the substrate layer on the side opposite to the supporting piece forming film 14), the non-notched portions 17 can be peeled off smoothly.
  • the pick-up step is a step of sequentially picking up a plurality of support pieces D separated by the cutting pattern 16 from the adhesive film 13 .
  • the support piece forming film 14 is separated into a plurality of support pieces D by the cutting pattern 16 in advance, the dicing process before the pick-up process is unnecessary.
  • the adhesive film 13 is irradiated with ultraviolet rays to reduce the adhesive force between it and the support piece forming film 14 .
  • the adhesive layer of the adhesive film 13 is a pressure-sensitive (non-ultraviolet curable) adhesive
  • the pick-up process can proceed without irradiating ultraviolet rays.
  • the support piece D is sucked by the suction collet 25 and the support piece D is picked up.
  • the support piece D to be picked up may be pushed up from the adhesive film 13 side by a pushing jig or the like.
  • the support piece forming film 14 is separated into a plurality of support pieces D in advance. Therefore, dicing of the support piece forming film 14 after fixing the laminate L of the adhesive film 13 and the support piece forming film 14 to the ring frame 18 can be omitted.
  • the non-cut portion 17 provided in at least a partial region of the peripheral edge portion 14a of the supporting piece forming film 14 allows the adhesive film 13 to be attached to the ring frame 18. Even if a void V occurs between the support piece forming film 14 and the film 14 for forming a support piece, the spread of the void V can be stopped at the boundary portion R between the cut pattern 16 and the non-cut portion 17 . Therefore, in the laminated film 11, expansion of the void V between the adhesive film 13 and the supporting piece forming film 14 can be suppressed.
  • the supporting piece forming film 14 includes a thermosetting resin layer.
  • the laminated film 11 it is possible to enhance the holding performance of the support piece forming film 14 by the base film 12 .
  • the connection of the supporting piece D to the substrate 2 of the semiconductor device 1 after being picked up can be preferably carried out.
  • dicing of the support piece forming film 14 after fixing the laminate L of the adhesive film 13 and the support piece forming film 14 to the ring frame 18 can be omitted.
  • the expansion of the void V is stopped by the boundary portion R between the cut pattern 16 and the non-cut portion 17. be able to. Therefore, expansion of the void V between the adhesive film 13 and the supporting piece forming film 14 can be suppressed.
  • the method for manufacturing a support piece according to the present embodiment includes a peeling step for peeling the non-cut portion 17 from the support piece forming film 14 between the fixing step and the pick-up step.
  • the non-cut portion 17 is a portion where voids V may occur in the fixing process.
  • the non-cut portion 17 is provided over the entire peripheral edge portion 14a of the support piece forming film 14, but the non-cut portion 17 can be any part or a plurality of portions of the support piece forming film 14. It may be provided in a part. Even when the non-cut portion 17 is provided over the entire peripheral portion 14a of the support piece forming film 14, the non-cut portion 17 does not necessarily have a continuous shape.
  • a non-cut portion 17 may be provided in a dotted line shape or a broken line shape in the peripheral edge portion 14 a of the support piece forming film 14 .
  • the shape may be partially discontinuous, such as, for example, a C shape.
  • the supporting piece forming film 14 may further include a resin layer 31 or a metal layer 32 having higher rigidity than the thermosetting resin layer 15, as shown in FIG. 8(a).
  • a polyimide layer for example, is used as the resin layer 31 .
  • the metal layer 32 for example, a copper layer, an aluminum layer, or the like is used. In this case, since the supporting piece forming film 14 includes a layer with high rigidity, the followability to a pick-up tool such as the suction collet 25 can be improved while the followability to the pushing jig and the like is reduced. .
  • the optical contrast between the resin material and the metal material can enhance the visibility of the support piece D during pickup.
  • thermosetting resin layer 15 may be provided in a plurality of layers so as to sandwich the resin layer 31 or the metal layer 32 therebetween. Also in this case, the same effects as in the case of FIG. 8A are obtained.
  • one thermosetting resin layer 15 is provided on each of one surface side and the other surface side of the resin layer 31 or the metal layer 32.
  • a plurality of thermosetting resin layers 15 may be provided on each of the other surfaces.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un film stratifié (11) comprenant : un film de substrat (12) ; ainsi que des films adhésifs (13) et des films de formation de pièces de support (14) disposés sur une surface du film de substrat (12). Les films de formation de pièces de support (14) sont séparés en une pluralité de pièces de support (D) au moyen de motifs de découpe (16) s'étendant sur toute l'épaisseur des films de formation de pièces de support (14). Une section non découpée (17), dans laquelle le motif de découpe (16) n'est pas formé, est située dans au moins certaines zones d'une partie bord périphérique (14a) des films de formation de pièces de support (14).
PCT/JP2022/045546 2022-01-11 2022-12-09 Film stratifié et procédé de fabrication de pièces de support WO2023136004A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022002409 2022-01-11
JP2022-002409 2022-01-11

Publications (1)

Publication Number Publication Date
WO2023136004A1 true WO2023136004A1 (fr) 2023-07-20

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PCT/JP2022/045546 WO2023136004A1 (fr) 2022-01-11 2022-12-09 Film stratifié et procédé de fabrication de pièces de support

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WO (1) WO2023136004A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012248607A (ja) * 2011-05-26 2012-12-13 Hitachi Chem Co Ltd ダイボンドダイシングシート及びそれを用いた半導体装置の製造方法
JP2020053453A (ja) * 2018-09-25 2020-04-02 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP2020181894A (ja) * 2019-04-25 2020-11-05 日立化成株式会社 ドルメン構造を有する半導体装置の製造方法
WO2021038785A1 (fr) * 2019-08-29 2021-03-04 昭和電工マテリアルズ株式会社 Procédé de fabrication de pièce de support, procédé de fabrication de dispositif à semi-conducteur et film stratifié formant une pièce de support

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012248607A (ja) * 2011-05-26 2012-12-13 Hitachi Chem Co Ltd ダイボンドダイシングシート及びそれを用いた半導体装置の製造方法
JP2020053453A (ja) * 2018-09-25 2020-04-02 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP2020181894A (ja) * 2019-04-25 2020-11-05 日立化成株式会社 ドルメン構造を有する半導体装置の製造方法
WO2021038785A1 (fr) * 2019-08-29 2021-03-04 昭和電工マテリアルズ株式会社 Procédé de fabrication de pièce de support, procédé de fabrication de dispositif à semi-conducteur et film stratifié formant une pièce de support

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