WO2023136004A1 - Laminated film and support piece manufacturing method - Google Patents

Laminated film and support piece manufacturing method Download PDF

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Publication number
WO2023136004A1
WO2023136004A1 PCT/JP2022/045546 JP2022045546W WO2023136004A1 WO 2023136004 A1 WO2023136004 A1 WO 2023136004A1 JP 2022045546 W JP2022045546 W JP 2022045546W WO 2023136004 A1 WO2023136004 A1 WO 2023136004A1
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Prior art keywords
film
support piece
forming film
adhesive
piece forming
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PCT/JP2022/045546
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French (fr)
Japanese (ja)
Inventor
義信 尾崎
奎佑 大河原
紘平 谷口
裕貴 橋本
孝博 黒田
奏美 中村
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株式会社レゾナック
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Publication of WO2023136004A1 publication Critical patent/WO2023136004A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Definitions

  • the present disclosure relates to a laminated film and a method for manufacturing a support piece.
  • Patent Document 1 As one mode of a semiconductor device, there is a structure in which a semiconductor chip is stacked over a controller chip arranged over a substrate.
  • the semiconductor assembly described in Patent Document 1 has a structure called a so-called dolmen structure (or tunnel structure).
  • This conventional semiconductor assembly includes a package substrate, a controller die disposed on the package substrate, and a memory die disposed above the controller die, with the memory die supported by support members such as pillars.
  • Patent Literature 1 In the semiconductor assembly of Patent Literature 1 described above, a resin film with a silicon chip is used as a support member of the dolmen structure using the same process as in the manufacture of ordinary semiconductor chips. However, this method has the problem of using a relatively expensive silicon chip and requiring a wafer polishing process.
  • a method of forming support pieces with a dolmen structure by separating the film for forming support pieces into individual pieces without using silicon chips is being investigated.
  • a laminated film obtained by laminating an adhesive film and a supporting piece-forming film on one surface of a base film can be used.
  • voids may expand between the adhesive film and the supporting piece forming film due to the tension applied to the adhesive film. In the portion where the void occurs, there is a possibility that trouble may occur when picking up the support piece.
  • the present disclosure has been made to solve the above problems, and provides a laminated film capable of suppressing expansion of voids between an adhesive film and a film for forming a support piece, and a method for manufacturing a support piece using the same. intended to
  • a laminated film according to one aspect of the present disclosure includes a base film, and an adhesive film and a supporting piece-forming film provided on one side of the base film, and the supporting piece-forming film is used to form the supporting piece.
  • the supporting piece-forming film is singulated into a plurality of supporting pieces by a cutting pattern extending over the entire thickness of the supporting piece-forming film, and the non-cutting pattern is not formed in at least a partial region of the peripheral edge portion of the supporting piece-forming film.
  • a notch is provided.
  • the supporting piece-forming film is separated into a plurality of supporting pieces in advance. Therefore, it is possible to omit the dicing of the supporting piece forming film after the laminate of the adhesive film and the supporting piece forming film is fixed to the ring frame.
  • the non-cut portion provided in at least a part of the peripheral edge portion of the supporting piece forming film allows the adhesive film and the supporting piece forming film to be separated from each other when the adhesive film is attached to the ring frame. Even if a void occurs between the cut patterns, the expansion of the void can be stopped at the boundary between the cut pattern and the non-cut portion. Therefore, in this laminated film, expansion of voids between the adhesive film and the supporting piece forming film can be suppressed.
  • the non-cut portion may be provided over the entire peripheral portion of the support piece forming film.
  • the boundary portion between the cut pattern and the non-cut portion can be positioned on the expansion path of the void. Therefore, expansion of voids between the adhesive film and the supporting piece forming film can be suppressed more reliably.
  • the supporting piece forming film may include a thermosetting resin layer.
  • the laminated film it is possible to enhance the holding performance of the supporting piece-forming film by the base film. Also, it is possible to suitably connect the supporting piece to the substrate of the semiconductor device after being picked up.
  • the supporting piece-forming film may further include a resin layer or metal layer having higher rigidity than the thermosetting resin layer. Since the support piece forming film includes a layer with high rigidity, the followability to a pick-up tool such as a suction collet can be improved while the followability to the push-up jig is reduced. When the metal layer is included, the optical contrast between the resin material and the metal material can enhance the visibility of the support piece during pickup.
  • thermosetting resin layers may be provided so as to sandwich a resin layer or a metal layer. In this case, even if the thermosetting resin layer is not subjected to a heat curing treatment, it is possible to more sufficiently secure the pick-up property of the supporting piece.
  • a method for manufacturing a support piece according to one aspect of the present disclosure is a method for manufacturing a support piece using the above-described laminated film.
  • dicing of the support piece forming film after fixing the laminate of the adhesive film and the support piece forming film to the ring frame can be omitted.
  • the spread of the voids can be stopped at the boundary between the cut pattern and the non-cut portion. Therefore, expansion of voids between the adhesive film and the support piece-forming film can be suppressed.
  • a peeling process for peeling the non-cut portion from the supporting piece forming film may be provided.
  • a non-cut portion is a portion where voids may occur in the fixing process.
  • FIG. 1 is a schematic cross-sectional view showing an example of a semiconductor device having a dolmen structure
  • FIG. 1 is a schematic plan view showing a laminated film according to one embodiment of the present disclosure
  • FIG. 3 is a schematic cross-sectional view of the laminated film shown in FIG. 2
  • 4 is a flow chart showing a method of manufacturing a support piece according to an embodiment of the present disclosure
  • It is a typical sectional view showing a fixing process.
  • It is a typical perspective view which shows a peeling process.
  • It is a typical perspective view showing a pick-up process.
  • (a) and (b) are schematic plan views showing laminated films according to modifications.
  • the "layer” in this specification encompasses both an aspect in which it is formed on the entire surface of the object to be formed and an aspect in which it is formed on a part of the object to be formed when observed as a plan view.
  • the “step” used herein is not necessarily limited to an independent step, and may include a step that achieves its intended action even if it cannot be clearly distinguished from other steps.
  • FIG. 1 is a schematic cross-sectional view showing an example of a semiconductor device having a dolmen structure.
  • the semiconductor device 1 shown in FIG. and a plurality of wires W electrically connected to each other.
  • the controller chip 3 , memory chips 4 , 5 and 6 and wires W are sealed with a sealing material 7 .
  • the substrate 2 is, for example, an organic substrate.
  • the substrate 2 may be a metal substrate such as a lead frame.
  • a plurality of supporting pieces D are arranged around the controller chip 3 .
  • An adhesive layer 8 is provided on one side of each of the controller chip 3 and the memory chips 4, 5 and 6, respectively.
  • the controller chip 3 is fixed to the surface of the substrate 2 via an adhesive layer 8 .
  • the memory chips 4, 5, 6 are stacked in a stepped manner with an adhesive layer 8 interposed therebetween so that a connection space for the wires W is formed.
  • the stack of memory chips 4, 5, 6 is supported above the controller chip 3 (on the side opposite to the substrate 2) by a plurality of supporting pieces D via an adhesive layer 8 on one side of the memory chip 4, which is the bottom layer. .
  • the wire W is used to connect the substrate 2 and the controller chip 3, but the substrate 2 and the controller chip 3 are bump-connected (for example, Cu bump and solder connection). may be configured.
  • FIG. 2 is a schematic plan view showing a laminated film according to an embodiment of the present disclosure
  • FIG. 3 is the typical sectional drawing.
  • the laminated film 11 includes a base film 12, and an adhesive film 13 and a supporting piece forming film 14 provided on one side of the base film 12.
  • FIGS. 2 and 3 are schematic plan views showing a laminated film according to an embodiment of the present disclosure.
  • the base film 12 is a long film extending in one direction with a predetermined width.
  • the laminate L of the adhesive film 13 and the supporting piece forming film 14 are arranged at predetermined intervals in the extending direction of the base film 12 .
  • the base film 12 is a film that serves as a base for the laminated film 11 .
  • it is made of a material such as polyethylene terephthalate (PET) or polyolefin.
  • PET polyethylene terephthalate
  • the base film 12 may have heat shrinkability.
  • the adhesive film 13 is a film for fixing the supporting piece forming film 14 to a ring frame 18 (see FIG. 5, etc.) described later.
  • the adhesive film 13 includes an adhesive layer and a substrate layer, and is arranged so that the adhesive layer faces the substrate film 12 and the support piece forming film 14 .
  • the adhesive film 13 is formed into a circle having a diameter smaller than the width of the base film 12 by processing means such as punching.
  • the adhesive film 13 is made of, for example, an ultraviolet-curing adhesive, and has a property that its adhesiveness decreases when irradiated with ultraviolet rays.
  • the adhesive layer of the adhesive film 13 may be an ultraviolet curable adhesive or a pressure-sensitive (non-ultraviolet curable) adhesive.
  • the adhesive films 13 are further arranged at both ends of the base film 12 in the width direction so as to surround the center adhesive film 13. It is The adhesive films 13 at both ends have the role of eliminating unevenness differences between the center and both ends of the laminated film 11 when the laminated film 11 is formed in a roll form. As a result, even when the number of turns increases, it is possible to avoid the occurrence of problems such as winding misalignment and voids due to unevenness.
  • the supporting piece forming film 14 is a film for forming the supporting pieces D (see FIG. 1) in the semiconductor device 1 described above.
  • the supporting piece forming film 14 is formed into a circle having a diameter one size smaller than that of the adhesive film 13 by processing means such as punching.
  • the supporting piece forming film 14 is made of, for example, a thermosetting resin composition. That is, the supporting piece forming film 14 is composed of the thermosetting resin layer 15 .
  • thermosetting resin composition that constitutes the support piece forming film 14 can go through a semi-cured (B stage) state and then become a fully cured (C stage) state by a subsequent curing treatment.
  • a thermosetting resin composition includes an epoxy resin, a curing agent, and an elastomer (eg, an acrylic resin).
  • the thermosetting resin composition further contains an inorganic filler, a curing accelerator, and the like, if necessary.
  • the support piece forming film 14 is separated into a plurality of support pieces D by a cut pattern 16 extending over the entire thickness of the support piece forming film 14 .
  • the cut pattern 16 has a lattice shape in plan view of the support piece forming film 14, and the support piece forming film 14 is cut by full cutting of the support piece forming film 14. It is in a state in which the cut reaches from one surface side to the other surface side. This cut may reach one side (adhesive layer) of the adhesive film 13 . Due to the cutting pattern 16 , rectangular supporting pieces D are arranged in advance in a matrix on the supporting piece forming film 14 .
  • a non-cut portion 17 in which the cut pattern 16 is not formed is provided in at least a partial region of the peripheral edge portion 14a of the support piece forming film 14. As shown in FIG. In the example of FIG. 2, the non-cut portion 17 is provided over the entire peripheral portion 14a of the film 14 for forming support pieces.
  • a laminated body is prepared in which the supporting piece forming film 14 is provided on one side of the base film 12.
  • the supporting piece forming film 14 is pre-cut, and the cutting pattern 16 extending over the entire thickness of the supporting piece forming film 14 is used to singulate a plurality of supporting pieces D.
  • a non-cut portion 17 in which the cut pattern 16 is not formed is provided in at least a partial region (here, the whole area) of the peripheral edge portion 14a of the support piece forming film 14 .
  • the adhesive film 13 is laminated on the base film 12 and the supporting piece forming film 14 . After the adhesive film 13 is laminated, the adhesive film 13 is pre-cut and the surplus portions are peeled off to obtain the laminated film 11 shown in FIGS.
  • FIG. 4 is a flowchart illustrating a method of manufacturing a support piece according to an embodiment of the present disclosure. As shown in FIG. 4, this support piece manufacturing method includes a fixing step (step S01), a peeling step (step S02), and a picking up step (step S03).
  • the fixing step is a step of fixing the laminate L of the adhesive film 13 separated from the base film 12 and the support piece forming film 14 to the ring frame 18 by attaching the adhesive film 13 to the ring frame 18 .
  • the fixing step is carried out by using a general laminating device 21 used for laminating a dicing film on a semiconductor wafer.
  • the lamination device 21 includes a stage 22 on which the ring frame 18 is placed, a suction table 23 and rollers 24 .
  • the base film 12 is peeled off from the laminated film 11 .
  • the laminated body L of the adhesive film 13 and the supporting piece forming film 14 is placed on the ring frame 18 placed on the stage 22 so that the supporting piece forming film 14 faces the suction table 23 side. .
  • the suction table 23 may or may not be in contact with the supporting piece forming film 14 .
  • the suction table 23 is adjusted to the same height as the ring frame 18, if the suction mechanism operates and an error (for example, an error indicating that the wafer is not detected) occurs, the height of the suction table 23 is increased.
  • the height may be one step lower than the height of the ring frame 18 .
  • void V may be generated between the adhesive film 13 and the support piece forming film 14 at the peripheral edge portion 14 a of the support piece forming film 14 .
  • voids V are likely to occur on the sticking start position side and the sticking end position side of the adhesive film 13 by the roller 24 , and the voids V that have occurred are caused by the pressure from the roller 24 , and the supporting piece forming film. 14 from the peripheral edge portion 14a toward the central portion side.
  • the above-described non-cut portion 17 is provided on the entire peripheral portion 14a of the support piece forming film 14. As shown in FIG. Therefore, even if a void V occurs between the adhesive film 13 and the supporting piece forming film 14, the boundary portion R between the cut pattern 16 and the non-cut portion 17 is positioned on the expansion path of the void V. can be made The expansion of the void V is stopped at the boundary portion R between the cut pattern 16 and the non-cut portion 17, and the expansion of the void V toward the central portion of the support piece forming film 14 is suppressed.
  • the peeling step is a step of peeling the non-cut portion 17 from the supporting piece forming film 14 .
  • the peeling process is performed between the fixing process and the pick-up process.
  • the non-notched portion 17 is peeled off from the peripheral edge portion 14a of the film 14 for supporting piece formation.
  • Voids V generated in the fixing process can be removed by peeling off the non-cut portions 17 .
  • the non-cut portion 17 may be peeled regardless of the presence or absence of the void V, and the generation of the void V is confirmed by visual recognition or the like, and the non-cut portion 17 where the void V is confirmed is selectively peeled.
  • the adhesive film 13 is made of an ultraviolet curable adhesive
  • the adhesive film 13 may be irradiated with ultraviolet rays before the non-cut portion 17 is peeled off, depending on the adhesive strength of the adhesive. In this case, for example, by irradiating ultraviolet rays from the back surface of the adhesive film 13 (the substrate layer on the side opposite to the supporting piece forming film 14), the non-notched portions 17 can be peeled off smoothly.
  • the pick-up step is a step of sequentially picking up a plurality of support pieces D separated by the cutting pattern 16 from the adhesive film 13 .
  • the support piece forming film 14 is separated into a plurality of support pieces D by the cutting pattern 16 in advance, the dicing process before the pick-up process is unnecessary.
  • the adhesive film 13 is irradiated with ultraviolet rays to reduce the adhesive force between it and the support piece forming film 14 .
  • the adhesive layer of the adhesive film 13 is a pressure-sensitive (non-ultraviolet curable) adhesive
  • the pick-up process can proceed without irradiating ultraviolet rays.
  • the support piece D is sucked by the suction collet 25 and the support piece D is picked up.
  • the support piece D to be picked up may be pushed up from the adhesive film 13 side by a pushing jig or the like.
  • the support piece forming film 14 is separated into a plurality of support pieces D in advance. Therefore, dicing of the support piece forming film 14 after fixing the laminate L of the adhesive film 13 and the support piece forming film 14 to the ring frame 18 can be omitted.
  • the non-cut portion 17 provided in at least a partial region of the peripheral edge portion 14a of the supporting piece forming film 14 allows the adhesive film 13 to be attached to the ring frame 18. Even if a void V occurs between the support piece forming film 14 and the film 14 for forming a support piece, the spread of the void V can be stopped at the boundary portion R between the cut pattern 16 and the non-cut portion 17 . Therefore, in the laminated film 11, expansion of the void V between the adhesive film 13 and the supporting piece forming film 14 can be suppressed.
  • the supporting piece forming film 14 includes a thermosetting resin layer.
  • the laminated film 11 it is possible to enhance the holding performance of the support piece forming film 14 by the base film 12 .
  • the connection of the supporting piece D to the substrate 2 of the semiconductor device 1 after being picked up can be preferably carried out.
  • dicing of the support piece forming film 14 after fixing the laminate L of the adhesive film 13 and the support piece forming film 14 to the ring frame 18 can be omitted.
  • the expansion of the void V is stopped by the boundary portion R between the cut pattern 16 and the non-cut portion 17. be able to. Therefore, expansion of the void V between the adhesive film 13 and the supporting piece forming film 14 can be suppressed.
  • the method for manufacturing a support piece according to the present embodiment includes a peeling step for peeling the non-cut portion 17 from the support piece forming film 14 between the fixing step and the pick-up step.
  • the non-cut portion 17 is a portion where voids V may occur in the fixing process.
  • the non-cut portion 17 is provided over the entire peripheral edge portion 14a of the support piece forming film 14, but the non-cut portion 17 can be any part or a plurality of portions of the support piece forming film 14. It may be provided in a part. Even when the non-cut portion 17 is provided over the entire peripheral portion 14a of the support piece forming film 14, the non-cut portion 17 does not necessarily have a continuous shape.
  • a non-cut portion 17 may be provided in a dotted line shape or a broken line shape in the peripheral edge portion 14 a of the support piece forming film 14 .
  • the shape may be partially discontinuous, such as, for example, a C shape.
  • the supporting piece forming film 14 may further include a resin layer 31 or a metal layer 32 having higher rigidity than the thermosetting resin layer 15, as shown in FIG. 8(a).
  • a polyimide layer for example, is used as the resin layer 31 .
  • the metal layer 32 for example, a copper layer, an aluminum layer, or the like is used. In this case, since the supporting piece forming film 14 includes a layer with high rigidity, the followability to a pick-up tool such as the suction collet 25 can be improved while the followability to the pushing jig and the like is reduced. .
  • the optical contrast between the resin material and the metal material can enhance the visibility of the support piece D during pickup.
  • thermosetting resin layer 15 may be provided in a plurality of layers so as to sandwich the resin layer 31 or the metal layer 32 therebetween. Also in this case, the same effects as in the case of FIG. 8A are obtained.
  • one thermosetting resin layer 15 is provided on each of one surface side and the other surface side of the resin layer 31 or the metal layer 32.
  • a plurality of thermosetting resin layers 15 may be provided on each of the other surfaces.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)

Abstract

A laminated film 11 comprises: a substrate film 12; and adhesive films 13 and support-piece forming films 14, which are disposed on one surface of the substrate film 12. The support-piece forming films 14 are singulated into a plurality of support pieces D by utilizing cut patterns 16 which extend over the entirety of the thickness of the support-piece forming films 14. An uncut section 17, in which the cut pattern 16 is not formed, is provided in at least some regions of a peripheral edge section 14a of the support-piece forming films 14.

Description

積層フィルム及び支持片の製造方法LAMINATED FILM AND SUPPORTING PIECE MANUFACTURING METHOD
　本開示は、積層フィルム及び支持片の製造方法に関する。 The present disclosure relates to a laminated film and a method for manufacturing a support piece.
　近年、半導体装置の分野では、高集積化、小型化、高速化の要求が高まっている。半導体装置の一態様として、基板上に配置されたコントローラチップ上に半導体チップを積層した構造がある。特許文献１に記載の半導体アセンブリは、いわゆるドルメン構造（或いはトンネル構造）と称される構造を有している。この従来の半導体アセンブリは、パッケージ基板と、パッケージ基板上に配置されたコントローラダイと、コントローラダイの上方に配置されたメモリダイとを備え、メモリダイが支柱のような支持部材によって支持されている。 In recent years, in the field of semiconductor devices, there has been an increasing demand for higher integration, miniaturization, and higher speed. As one mode of a semiconductor device, there is a structure in which a semiconductor chip is stacked over a controller chip arranged over a substrate. The semiconductor assembly described in Patent Document 1 has a structure called a so-called dolmen structure (or tunnel structure). This conventional semiconductor assembly includes a package substrate, a controller die disposed on the package substrate, and a memory die disposed above the controller die, with the memory die supported by support members such as pillars.
特表２０１７－５１５３０６号公報Japanese translation of PCT publication No. 2017-515306
　上述した特許文献１の半導体アセンブリでは、通常の半導体チップの製造と同様の工程を用いて、シリコンチップ付きの樹脂フィルムをドルメン構造の支持部材としている。しかしながら、この手法では、比較的高価なシリコンチップを用いること、及びウェハの研磨工程が必要になることが課題となっている。 In the semiconductor assembly of Patent Literature 1 described above, a resin film with a silicon chip is used as a support member of the dolmen structure using the same process as in the manufacture of ordinary semiconductor chips. However, this method has the problem of using a relatively expensive silicon chip and requiring a wafer polishing process.
　このような課題に対し、シリコンチップを用いず、支持片形成用フィルムを個片化することでドルメン構造の支持片を形成する手法が検討されている。この手法には、例えば基材フィルムの一面に粘着フィルムと支持片形成用フィルムとを積層した積層フィルムを用いることができる。しかしながら、ウェハを伴わない積層フィルムをリングフレームに貼り付ける際に、粘着フィルムに加わる張力に起因して粘着フィルムと支持片形成用フィルムとの間にボイドが拡がることが考えられる。ボイドが生じた部分では、支持片のピックアップの際に不具合が生じるおそれがある。 In order to address such issues, a method of forming support pieces with a dolmen structure by separating the film for forming support pieces into individual pieces without using silicon chips is being investigated. For this technique, for example, a laminated film obtained by laminating an adhesive film and a supporting piece-forming film on one surface of a base film can be used. However, when attaching the laminated film without the wafer to the ring frame, it is conceivable that voids may expand between the adhesive film and the supporting piece forming film due to the tension applied to the adhesive film. In the portion where the void occurs, there is a possibility that trouble may occur when picking up the support piece.
　本開示は、上記課題の解決のためになされたものであり、粘着フィルムと支持片形成用フィルムとの間のボイドの拡がりを抑制できる積層フィルム、及びこれを用いた支持片の製造方法を提供することを目的とする。 The present disclosure has been made to solve the above problems, and provides a laminated film capable of suppressing expansion of voids between an adhesive film and a film for forming a support piece, and a method for manufacturing a support piece using the same. intended to
　本開示の一側面に係る積層フィルムは、基材フィルムと、基材フィルムの一面側に設けられた粘着フィルム及び支持片形成用フィルムと、を備え、支持片形成用フィルムは、当該支持片形成用フィルムの厚さ全体に及ぶ切込パターンにより複数の支持片に個片化されており、支持片形成用フィルムの周縁部の少なくとも一部の領域には、切込パターンが形成されていない非切込部が設けられている。 A laminated film according to one aspect of the present disclosure includes a base film, and an adhesive film and a supporting piece-forming film provided on one side of the base film, and the supporting piece-forming film is used to form the supporting piece. The supporting piece-forming film is singulated into a plurality of supporting pieces by a cutting pattern extending over the entire thickness of the supporting piece-forming film, and the non-cutting pattern is not formed in at least a partial region of the peripheral edge portion of the supporting piece-forming film. A notch is provided.
　この積層フィルムでは、支持片形成用フィルムが予め複数の支持片に個片化されている。したがって、粘着フィルム及び支持片形成用フィルムの積層体をリングフレームに固定した後の支持片形成用フィルムのダイシングを省略できる。また、この積層フィルムでは、支持片形成用フィルムの周縁部の少なくとも一部の領域に設けられた非切込部により、粘着フィルムをリングフレームに貼り付ける際に粘着フィルムと支持片形成用フィルムとの間にボイドが生じたとしても、当該ボイドの拡がりを切込パターンと非切込部との境界部分で食い止めることができる。したがって、この積層フィルムでは、粘着フィルムと支持片形成用フィルムとの間のボイドの拡がりを抑制できる。 In this laminated film, the supporting piece-forming film is separated into a plurality of supporting pieces in advance. Therefore, it is possible to omit the dicing of the supporting piece forming film after the laminate of the adhesive film and the supporting piece forming film is fixed to the ring frame. Further, in this laminated film, the non-cut portion provided in at least a part of the peripheral edge portion of the supporting piece forming film allows the adhesive film and the supporting piece forming film to be separated from each other when the adhesive film is attached to the ring frame. Even if a void occurs between the cut patterns, the expansion of the void can be stopped at the boundary between the cut pattern and the non-cut portion. Therefore, in this laminated film, expansion of voids between the adhesive film and the supporting piece forming film can be suppressed.
　非切込部は、支持片形成用フィルムの周縁部の全体にわたって設けられていてもよい。この場合、ボイドの起点の位置に関わらず、ボイドの拡がり経路上に切込パターンと非切込部との境界部分を位置させることができる。したがって、粘着フィルムと支持片形成用フィルムとの間のボイドの拡がりをより確実に抑制できる。 The non-cut portion may be provided over the entire peripheral portion of the support piece forming film. In this case, regardless of the position of the starting point of the void, the boundary portion between the cut pattern and the non-cut portion can be positioned on the expansion path of the void. Therefore, expansion of voids between the adhesive film and the supporting piece forming film can be suppressed more reliably.
　支持片形成用フィルムは、熱硬化性樹脂層を含んで構成されていてもよい。この場合、積層フィルムにおいて、基材フィルムによる支持片形成用フィルムの保持性能を高めることが可能となる。また、ピックアップ後の半導体装置の基板への支持片の接続を好適に実施できる。 The supporting piece forming film may include a thermosetting resin layer. In this case, in the laminated film, it is possible to enhance the holding performance of the supporting piece-forming film by the base film. Also, it is possible to suitably connect the supporting piece to the substrate of the semiconductor device after being picked up.
　支持片形成用フィルムは、熱硬化性樹脂層よりも剛性の高い樹脂層又は金属層を更に含んで構成されていてもよい。支持片形成用フィルムが剛性の高い層を含むことで、突上治具への追従性が低下する一方で、吸引コレット等のピックアップツールへの追従性を高めることができる。金属層を含む場合、樹脂材料と金属材料との間の光学的なコントラストにより、ピックアップ時の支持片の視認性を高めることができる。 The supporting piece-forming film may further include a resin layer or metal layer having higher rigidity than the thermosetting resin layer. Since the support piece forming film includes a layer with high rigidity, the followability to a pick-up tool such as a suction collet can be improved while the followability to the push-up jig is reduced. When the metal layer is included, the optical contrast between the resin material and the metal material can enhance the visibility of the support piece during pickup.
　熱硬化性樹脂層は、樹脂層又は金属層を挟むように複数層設けられていてもよい。この場合、熱硬化性樹脂層に対する熱硬化処理を実施しなくても、支持片のピックアップ性を一層十分に確保できる。 A plurality of thermosetting resin layers may be provided so as to sandwich a resin layer or a metal layer. In this case, even if the thermosetting resin layer is not subjected to a heat curing treatment, it is possible to more sufficiently secure the pick-up property of the supporting piece.
　本開示の一側面に係る支持片の製造方法は、上記積層フィルムを用いた支持片の製造方法であって、粘着フィルムをリングフレームに貼り付けることにより、基材フィルムから剥離した粘着フィルム及び支持片形成用フィルムの積層体をリングフレームに固定する固定工程と、切込パターンによって個片化されている複数の支持片を粘着フィルムから順次ピックアップするピックアップ工程と、を備える。 A method for manufacturing a support piece according to one aspect of the present disclosure is a method for manufacturing a support piece using the above-described laminated film. A fixing step of fixing a laminate of pieces forming films to a ring frame, and a picking up step of sequentially picking up a plurality of supporting pieces separated into pieces by a cut pattern from an adhesive film.
　この支持片の製造方法では、粘着フィルム及び支持片形成用フィルムの積層体をリングフレームに固定した後の支持片形成用フィルムのダイシングを省略できる。また、固定工程において粘着フィルムと支持片形成用フィルムとの間にボイドが生じたとしても、当該ボイドの拡がりを切込パターンと非切込部との境界部分で食い止めることができる。したがって、粘着フィルムと支持片形成用フィルムとの間のボイドの拡がりを抑制できる。 In this support piece manufacturing method, dicing of the support piece forming film after fixing the laminate of the adhesive film and the support piece forming film to the ring frame can be omitted. In addition, even if voids are formed between the adhesive film and the supporting piece forming film in the fixing step, the spread of the voids can be stopped at the boundary between the cut pattern and the non-cut portion. Therefore, expansion of voids between the adhesive film and the support piece-forming film can be suppressed.
　固定工程とピックアップ工程との間に、非切込部を支持片形成用フィルムから剥離する剥離工程を備えていてもよい。非切込部は、固定工程においてボイドが生じ得る部分である。ピックアップ工程の実施前に非切込部を剥離しておくことで、ピックアップの際に不具合が生じることを好適に防止できる。 Between the fixing process and the pick-up process, a peeling process for peeling the non-cut portion from the supporting piece forming film may be provided. A non-cut portion is a portion where voids may occur in the fixing process. By peeling off the non-cut portion before performing the pick-up process, it is possible to suitably prevent problems from occurring during pick-up.
　本開示によれば、粘着フィルムと支持片形成用フィルムとの間のボイドの拡がりを抑制できる。 According to the present disclosure, expansion of voids between the adhesive film and the support piece forming film can be suppressed.
ドルメン構造を有する半導体装置の一例を示す模式的な断面図である。1 is a schematic cross-sectional view showing an example of a semiconductor device having a dolmen structure; FIG. 本開示の一実施形態に係る積層フィルムを示す模式的な平面図である。1 is a schematic plan view showing a laminated film according to one embodiment of the present disclosure; FIG. 図２に示した積層フィルムの模式的な断面図である。FIG. 3 is a schematic cross-sectional view of the laminated film shown in FIG. 2; 本開示の一実施形態に係る支持片の製造方法を示すフローチャートである。4 is a flow chart showing a method of manufacturing a support piece according to an embodiment of the present disclosure; 固定工程を示す模式的な断面図である。It is a typical sectional view showing a fixing process. 剥離工程を示す模式的な斜視図である。It is a typical perspective view which shows a peeling process. ピックアップ工程を示す模式的な斜視図である。It is a typical perspective view showing a pick-up process. （ａ）及び（ｂ）は、変形例に係る積層フィルムを示す模式的な平面図である。(a) and (b) are schematic plan views showing laminated films according to modifications.
　以下、図面を参照しながら、本開示の一側面に係る積層フィルム及び支持片の製造方法の好適な実施形態について詳細に説明する。 Hereinafter, preferred embodiments of a method for manufacturing a laminated film and a supporting piece according to one aspect of the present disclosure will be described in detail with reference to the drawings.
　以下の説明では、同一要素には同一符号を用い、重複する説明は省略する。図中の寸法及び寸法割合は便宜的なものであり、必ずしも実際の寸法を反映したものではない。本明細書中、「～」を用いて示された数値範囲は、「～」の前後に記載される数値をそれぞれ最小値及び最大値として含む。本明細書において段階的に記載されている数値範囲の上限値又は下限値は、他の段階の数値範囲の上限値又は下限値に置き換えてもよい。 In the following description, the same reference numerals are used for the same elements, and overlapping descriptions are omitted. Dimensions and dimensional proportions in the drawings are for convenience and do not necessarily reflect actual dimensions. In this specification, the numerical range indicated using "-" includes the numerical values before and after "-" as the minimum and maximum values, respectively. The upper limit or lower limit of the numerical range described stepwise in this specification may be replaced with the upper limit or lower limit of the numerical range in other steps.
　本明細書における「層」は、平面図として観察したときに、被形成物の全面に形成されている態様、及び被形成物の一部に形成されている態様のいずれも包含される。本明細書における「工程」は、必ずしも独立した工程に限られず、他の工程と明確に区別できない場合であってもその工程の所期の作用が達成されるものも含まれ得る。 The "layer" in this specification encompasses both an aspect in which it is formed on the entire surface of the object to be formed and an aspect in which it is formed on a part of the object to be formed when observed as a plan view. The “step” used herein is not necessarily limited to an independent step, and may include a step that achieves its intended action even if it cannot be clearly distinguished from other steps.
　図１は、ドルメン構造を有する半導体装置の一例を示す模式的な断面図である。同図に示す半導体装置１は、基板２と、基板２の一面に配置されたコントローラチップ３と、複数のメモリチップ４，５，６と、これらのチップのそれぞれを基板２上の電極（不図示）と電気的に接続する複数のワイヤＷとを備えている。コントローラチップ３、メモリチップ４，５，６、及びワイヤＷは、封止材７によって封止されている。 FIG. 1 is a schematic cross-sectional view showing an example of a semiconductor device having a dolmen structure. The semiconductor device 1 shown in FIG. ) and a plurality of wires W electrically connected to each other. The controller chip 3 , memory chips 4 , 5 and 6 and wires W are sealed with a sealing material 7 .
　基板２は、例えば有機基板である。基板２は、リードフレーム等の金属基板であってもよい。コントローラチップ３の周囲には、複数の支持片Ｄが配置されている。コントローラチップ３及びメモリチップ４，５，６の片面には、接着層８がそれぞれ設けられている。コントローラチップ３は、接着層８を介して基板２の表面に固定されている。メモリチップ４，５，６は、ワイヤＷの接続スペースが形成されるように、接着層８を介して階段状に積層されている。メモリチップ４，５，６の積層体は、最下層のメモリチップ４の片面の接着層８を介し、複数の支持片Ｄによってコントローラチップ３の上方（基板２と反対側）で支持されている。 The substrate 2 is, for example, an organic substrate. The substrate 2 may be a metal substrate such as a lead frame. A plurality of supporting pieces D are arranged around the controller chip 3 . An adhesive layer 8 is provided on one side of each of the controller chip 3 and the memory chips 4, 5 and 6, respectively. The controller chip 3 is fixed to the surface of the substrate 2 via an adhesive layer 8 . The memory chips 4, 5, 6 are stacked in a stepped manner with an adhesive layer 8 interposed therebetween so that a connection space for the wires W is formed. The stack of memory chips 4, 5, 6 is supported above the controller chip 3 (on the side opposite to the substrate 2) by a plurality of supporting pieces D via an adhesive layer 8 on one side of the memory chip 4, which is the bottom layer. .
　なお、図１の例では、基板２とコントローラチップ３との接続にワイヤＷが用いられているが、基板２とコントローラチップ３とがバンプ接続（例えばＣｕバンプとハンダを用いた接続）された構成となっていてもよい。 In the example of FIG. 1, the wire W is used to connect the substrate 2 and the controller chip 3, but the substrate 2 and the controller chip 3 are bump-connected (for example, Cu bump and solder connection). may be configured.
　次に、上述した支持片Ｄの製造に用いられる積層フィルムについて説明する。図２は、本開示の一実施形態に係る積層フィルムを示す模式的な平面図である。また、図３は、その模式的な断面図である。図２及び図３に示すように、積層フィルム１１は、基材フィルム１２と、基材フィルム１２の一面側に設けられた粘着フィルム１３及び支持片形成用フィルム１４とを備えている。 Next, the laminated film used for manufacturing the support piece D described above will be described. FIG. 2 is a schematic plan view showing a laminated film according to an embodiment of the present disclosure; FIG. Moreover, FIG. 3 is the typical sectional drawing. As shown in FIGS. 2 and 3, the laminated film 11 includes a base film 12, and an adhesive film 13 and a supporting piece forming film 14 provided on one side of the base film 12. As shown in FIGS.
　本実施形態では、基材フィルム１２は、長尺のフィルムとなっており、所定の幅をもって一方向に延在している。粘着フィルム１３及び支持片形成用フィルム１４の積層体Ｌは、基材フィルム１２の延在方向に所定の間隔をもって配列されている。基材フィルム１２は、積層フィルム１１の土台となるフィルムである。例えばポリエチレンテレフタレート（ＰＥＴ）、ポリオレフィンなどの材料によって形成されている。基材フィルム１２は、熱収縮性を有していてもよい。 In this embodiment, the base film 12 is a long film extending in one direction with a predetermined width. The laminate L of the adhesive film 13 and the supporting piece forming film 14 are arranged at predetermined intervals in the extending direction of the base film 12 . The base film 12 is a film that serves as a base for the laminated film 11 . For example, it is made of a material such as polyethylene terephthalate (PET) or polyolefin. The base film 12 may have heat shrinkability.
　粘着フィルム１３は、支持片形成用フィルム１４を後述のリングフレーム１８（図５等参照）に固定するためのフィルムである。粘着フィルム１３は、粘着層及び基材層を含んで構成され、粘着層が基材フィルム１２及び支持片形成用フィルム１４を向くように配置されている。粘着フィルム１３は、例えばパンチング等の加工手段によって、基材フィルム１２の幅よりも小さい直径の円形に形成されている。粘着フィルム１３は、例えば紫外線硬化型の粘着剤によって構成され、紫外線の照射によって粘着性が低下する性質を有している。粘着フィルム１３の粘着層は、紫外線硬化型の粘着剤のほか、感圧型（非紫外線硬化型）の粘着剤であってもよい。 The adhesive film 13 is a film for fixing the supporting piece forming film 14 to a ring frame 18 (see FIG. 5, etc.) described later. The adhesive film 13 includes an adhesive layer and a substrate layer, and is arranged so that the adhesive layer faces the substrate film 12 and the support piece forming film 14 . The adhesive film 13 is formed into a circle having a diameter smaller than the width of the base film 12 by processing means such as punching. The adhesive film 13 is made of, for example, an ultraviolet-curing adhesive, and has a property that its adhesiveness decreases when irradiated with ultraviolet rays. The adhesive layer of the adhesive film 13 may be an ultraviolet curable adhesive or a pressure-sensitive (non-ultraviolet curable) adhesive.
　図２の例では、基材フィルム１２の幅方向の中央の円形の粘着フィルム１３に加え、基材フィルム１２の幅方向の両端部に中央の粘着フィルム１３を囲うように粘着フィルム１３が更に配置されている。この両端部の粘着フィルム１３は、積層フィルム１１をロール形態とする場合に、積層フィルム１１の中央と両端との凹凸差を解消する役割を有している。これにより、巻き数が増えた場合でも、凹凸差による巻きずれ、ボイド等の不具合の発生を回避できる。 In the example of FIG. 2, in addition to the circular adhesive film 13 in the center of the base film 12 in the width direction, the adhesive films 13 are further arranged at both ends of the base film 12 in the width direction so as to surround the center adhesive film 13. It is The adhesive films 13 at both ends have the role of eliminating unevenness differences between the center and both ends of the laminated film 11 when the laminated film 11 is formed in a roll form. As a result, even when the number of turns increases, it is possible to avoid the occurrence of problems such as winding misalignment and voids due to unevenness.
　支持片形成用フィルム１４は、上述した半導体装置１における支持片Ｄ（図１参照）を形成するためのフィルムである。支持片形成用フィルム１４は、例えばパンチング等の加工手段によって、粘着フィルム１３よりも一回り小さい直径の円形に形成されている。支持片形成用フィルム１４は、例えば熱硬化性樹脂組成物によって構成されている。すなわち、支持片形成用フィルム１４は、熱硬化性樹脂層１５によって構成されている。 The supporting piece forming film 14 is a film for forming the supporting pieces D (see FIG. 1) in the semiconductor device 1 described above. The supporting piece forming film 14 is formed into a circle having a diameter one size smaller than that of the adhesive film 13 by processing means such as punching. The supporting piece forming film 14 is made of, for example, a thermosetting resin composition. That is, the supporting piece forming film 14 is composed of the thermosetting resin layer 15 .
　支持片形成用フィルム１４を構成する熱硬化性樹脂組成物は、半硬化（Ｂステージ）状態を経て、その後の硬化処理によって完全硬化物（Ｃステージ）状態となり得る。熱硬化性樹脂組成物には、エポキシ樹脂と、硬化剤と、エラストマ（例えば、アクリル樹脂）とが含まれる。熱硬化性樹脂組成物には、必要に応じて、無機フィラー及び硬化促進剤等が更に含まれる。 The thermosetting resin composition that constitutes the support piece forming film 14 can go through a semi-cured (B stage) state and then become a fully cured (C stage) state by a subsequent curing treatment. A thermosetting resin composition includes an epoxy resin, a curing agent, and an elastomer (eg, an acrylic resin). The thermosetting resin composition further contains an inorganic filler, a curing accelerator, and the like, if necessary.
　支持片形成用フィルム１４は、当該支持片形成用フィルム１４の厚さ全体に及ぶ切込パターン１６により複数の支持片Ｄに個片化されている。図２及び図３の例では、切込パターン１６は、支持片形成用フィルム１４の平面視において格子状をなしており、支持片形成用フィルム１４のフルカットによって、当該支持片形成用フィルム１４の一面側から他面側に切り込みが到達した状態となっている。この切り込みは、粘着フィルム１３の一面側（粘着層）まで到達していてもよい。切込パターン１６により、支持片形成用フィルム１４には、矩形の支持片Ｄが予めマトリクス状に配列された状態となっている。 The support piece forming film 14 is separated into a plurality of support pieces D by a cut pattern 16 extending over the entire thickness of the support piece forming film 14 . In the example of FIGS. 2 and 3, the cut pattern 16 has a lattice shape in plan view of the support piece forming film 14, and the support piece forming film 14 is cut by full cutting of the support piece forming film 14. It is in a state in which the cut reaches from one surface side to the other surface side. This cut may reach one side (adhesive layer) of the adhesive film 13 . Due to the cutting pattern 16 , rectangular supporting pieces D are arranged in advance in a matrix on the supporting piece forming film 14 .
　支持片形成用フィルム１４の周縁部１４ａの少なくとも一部の領域には、図２に示すように、切込パターン１６が形成されていない非切込部１７が設けられている。図２の例では、非切込部１７は、支持片形成用フィルム１４の周縁部１４ａの全体にわたって設けられている。 As shown in FIG. 2, a non-cut portion 17 in which the cut pattern 16 is not formed is provided in at least a partial region of the peripheral edge portion 14a of the support piece forming film 14. As shown in FIG. In the example of FIG. 2, the non-cut portion 17 is provided over the entire peripheral portion 14a of the film 14 for forming support pieces.
　積層フィルム１１の作製にあたっては、基材フィルム１２の一面側に支持片形成用フィルム１４が設けられた積層体を用意する。支持片形成用フィルム１４をプリカットし、当該支持片形成用フィルム１４の厚さ全体に及ぶ切込パターン１６により複数の支持片Ｄに個片化する。プリカットの際、支持片形成用フィルム１４の周縁部１４ａの少なくとも一部の領域（ここでは全体）に切込パターン１６が形成されていない非切込部１７を設ける。 In the preparation of the laminated film 11, a laminated body is prepared in which the supporting piece forming film 14 is provided on one side of the base film 12. The supporting piece forming film 14 is pre-cut, and the cutting pattern 16 extending over the entire thickness of the supporting piece forming film 14 is used to singulate a plurality of supporting pieces D. As shown in FIG. At the time of pre-cutting, a non-cut portion 17 in which the cut pattern 16 is not formed is provided in at least a partial region (here, the whole area) of the peripheral edge portion 14a of the support piece forming film 14 .
　非切込部１７の形成の後、支持片形成用フィルム１４のうち切込パターン１６及び非切込部１７が設けられた円形部分を残し、余剰部分を巻き取り等によって剥離する。次に、粘着フィルム１３を基材フィルム１２及び支持片形成用フィルム１４にラミネートする。粘着フィルム１３のラミネート後、当該粘着フィルム１３をプリカットし、余剰部分を剥離することで、図２及び図３に示した積層フィルム１１が得られる。 After the formation of the non-cut portions 17, the circular portions provided with the cut patterns 16 and the non-cut portions 17 of the support piece forming film 14 are left, and the surplus portions are peeled off by winding or the like. Next, the adhesive film 13 is laminated on the base film 12 and the supporting piece forming film 14 . After the adhesive film 13 is laminated, the adhesive film 13 is pre-cut and the surplus portions are peeled off to obtain the laminated film 11 shown in FIGS.
　次に、上述した積層フィルム１１を用いた支持片の製造方法について説明する。図４は、本開示の一実施形態に係る支持片の製造方法を示すフローチャートである。図４に示すように、この支持片の製造方法は、固定工程（ステップＳ０１）と、剥離工程（ステップＳ０２）と、ピックアップ工程（ステップＳ０３）とを備えている。 Next, a method for manufacturing a support piece using the laminated film 11 described above will be described. FIG. 4 is a flowchart illustrating a method of manufacturing a support piece according to an embodiment of the present disclosure; As shown in FIG. 4, this support piece manufacturing method includes a fixing step (step S01), a peeling step (step S02), and a picking up step (step S03).
　固定工程は、粘着フィルム１３をリングフレーム１８に貼り付けることにより、基材フィルム１２から剥離した粘着フィルム１３及び支持片形成用フィルム１４の積層体Ｌをリングフレーム１８に固定する工程である。本実施形態では、図５に示すように、半導体ウェハへのダイシングフィルムのラミネートに用いられる一般的なラミネート装置２１を流用して固定工程を実施する。 The fixing step is a step of fixing the laminate L of the adhesive film 13 separated from the base film 12 and the support piece forming film 14 to the ring frame 18 by attaching the adhesive film 13 to the ring frame 18 . In this embodiment, as shown in FIG. 5, the fixing step is carried out by using a general laminating device 21 used for laminating a dicing film on a semiconductor wafer.
　ラミネート装置２１は、リングフレーム１８が載置されるステージ２２と、吸着テーブル２３と、ローラ２４とを含んで構成されている。粘着フィルム１３のラミネートにあたっては、積層フィルム１１から基材フィルム１２を剥離する。次に、ステージ２２上に載置されたリングフレーム１８に対し、支持片形成用フィルム１４が吸着テーブル２３側を向くように、粘着フィルム１３及び支持片形成用フィルム１４の積層体Ｌを配置する。 The lamination device 21 includes a stage 22 on which the ring frame 18 is placed, a suction table 23 and rollers 24 . When laminating the adhesive film 13 , the base film 12 is peeled off from the laminated film 11 . Next, the laminated body L of the adhesive film 13 and the supporting piece forming film 14 is placed on the ring frame 18 placed on the stage 22 so that the supporting piece forming film 14 faces the suction table 23 side. .
　吸着テーブル２３は、支持片形成用フィルム１４に接していてもよく、接していなくてもよい。吸着テーブル２３をリングフレーム１８と同レベルの高さに合わせた場合に、吸着機構が作動してエラー（例えばウェハが未検出である旨のエラー）が発生する場合には、吸着テーブル２３の高さをリングフレーム１８の高さよりも一段低くしておいてもよい。 The suction table 23 may or may not be in contact with the supporting piece forming film 14 . When the suction table 23 is adjusted to the same height as the ring frame 18, if the suction mechanism operates and an error (for example, an error indicating that the wafer is not detected) occurs, the height of the suction table 23 is increased. The height may be one step lower than the height of the ring frame 18 .
　粘着フィルム１３及び支持片形成用フィルム１４の積層体Ｌを配置した後、ローラ２４によって圧力を付与し、リングフレーム１８に粘着フィルム１３の周縁部を貼り付ける。これにより、粘着フィルム１３及び支持片形成用フィルム１４の積層体Ｌがリングフレーム１８に固定される。 After arranging the laminate L of the adhesive film 13 and the supporting piece forming film 14 , pressure is applied by the rollers 24 to attach the peripheral portion of the adhesive film 13 to the ring frame 18 . As a result, the laminate L of the adhesive film 13 and the supporting piece forming film 14 is fixed to the ring frame 18 .
　ローラ２４によって圧力を付与する際、粘着フィルム１３に張力がかかり、粘着フィルム１３が吸着テーブル２３側に撓むように変形し得る。このため、支持片形成用フィルム１４にピール作用が働き、支持片形成用フィルム１４の周縁部１４ａにおいて粘着フィルム１３と支持片形成用フィルム１４との間にボイドＶが生じ得る。図５の例では、ボイドＶは、ローラ２４による粘着フィルム１３の貼付開始位置側及び貼付終了位置側で生じ易く、発生したボイドＶは、ローラ２４からの圧力に応じて、支持片形成用フィルム１４の周縁部１４ａから中央部側に向かって進行する。 When pressure is applied by the roller 24, tension is applied to the adhesive film 13, and the adhesive film 13 can be deformed so as to bend toward the adsorption table 23 side. For this reason, a peeling action acts on the support piece forming film 14 , and a void V may be generated between the adhesive film 13 and the support piece forming film 14 at the peripheral edge portion 14 a of the support piece forming film 14 . In the example of FIG. 5 , voids V are likely to occur on the sticking start position side and the sticking end position side of the adhesive film 13 by the roller 24 , and the voids V that have occurred are caused by the pressure from the roller 24 , and the supporting piece forming film. 14 from the peripheral edge portion 14a toward the central portion side.
　このような現象に対し、積層フィルム１１では、支持片形成用フィルム１４の周縁部１４ａの全体に上述した非切込部１７が設けられている。このため、粘着フィルム１３と支持片形成用フィルム１４との間にボイドＶが生じたとしても、当該ボイドＶの拡がり経路上に切込パターン１６と非切込部１７との境界部分Ｒを位置させることができる。ボイドＶの拡がりは、切込パターン１６と非切込部１７との境界部分Ｒで食い止められ、支持片形成用フィルム１４の中央部へのボイドＶの拡がりが抑制される。 In order to cope with such a phenomenon, in the laminated film 11, the above-described non-cut portion 17 is provided on the entire peripheral portion 14a of the support piece forming film 14. As shown in FIG. Therefore, even if a void V occurs between the adhesive film 13 and the supporting piece forming film 14, the boundary portion R between the cut pattern 16 and the non-cut portion 17 is positioned on the expansion path of the void V. can be made The expansion of the void V is stopped at the boundary portion R between the cut pattern 16 and the non-cut portion 17, and the expansion of the void V toward the central portion of the support piece forming film 14 is suppressed.
　剥離工程は、非切込部１７を支持片形成用フィルム１４から剥離する工程である。剥離工程は、固定工程とピックアップ工程との間に実施される。ここでは、図６に示すように、支持片形成用フィルム１４の周縁部１４ａから非切込部１７を剥離する。非切込部１７の剥離により、固定工程で生じたボイドＶを除去することができる。 The peeling step is a step of peeling the non-cut portion 17 from the supporting piece forming film 14 . The peeling process is performed between the fixing process and the pick-up process. Here, as shown in FIG. 6, the non-notched portion 17 is peeled off from the peripheral edge portion 14a of the film 14 for supporting piece formation. Voids V generated in the fixing process can be removed by peeling off the non-cut portions 17 .
　非切込部１７の剥離には、例えば半導体ウェハからバックグラインドテープを剥離するときと同様に、非切込部１７に付着させた粘着層を引っ張る手法、熱圧着を用いた手法などを用いることができる。非切込部１７は、ボイドＶの発生の有無に関わらずに剥離してもよく、ボイドＶの発生を視認等によって確認し、ボイドＶが確認された非切込部１７を選択的に剥離してもよい。粘着フィルム１３が紫外線硬化型の粘着剤によって構成されている場合、当該粘着剤の粘着力によっては非切込部１７の剥離前に粘着フィルム１３への紫外線照射を実施してもよい。この場合、例えば粘着フィルム１３の裏面（支持片形成用フィルム１４と反対側の基材層）から紫外線を照射することで、非切込部１７の剥離をスムーズに行うことができる。 For peeling off the non-cut portion 17, for example, a method of pulling an adhesive layer adhered to the non-cut portion 17, a method using thermocompression bonding, or the like can be used in the same manner as when peeling back grind tape from a semiconductor wafer. can be done. The non-cut portion 17 may be peeled regardless of the presence or absence of the void V, and the generation of the void V is confirmed by visual recognition or the like, and the non-cut portion 17 where the void V is confirmed is selectively peeled. You may When the adhesive film 13 is made of an ultraviolet curable adhesive, the adhesive film 13 may be irradiated with ultraviolet rays before the non-cut portion 17 is peeled off, depending on the adhesive strength of the adhesive. In this case, for example, by irradiating ultraviolet rays from the back surface of the adhesive film 13 (the substrate layer on the side opposite to the supporting piece forming film 14), the non-notched portions 17 can be peeled off smoothly.
　ピックアップ工程は、切込パターン１６によって個片化されている複数の支持片Ｄを粘着フィルム１３から順次ピックアップする工程である。本実施形態では、支持片形成用フィルム１４が予め切込パターン１６によって複数の支持片Ｄに個片化されているため、ピックアップ工程前のダイシング工程は不要となっている。 The pick-up step is a step of sequentially picking up a plurality of support pieces D separated by the cutting pattern 16 from the adhesive film 13 . In this embodiment, since the support piece forming film 14 is separated into a plurality of support pieces D by the cutting pattern 16 in advance, the dicing process before the pick-up process is unnecessary.
　ピックアップ工程では、粘着フィルム１３に対して紫外線を照射し、支持片形成用フィルム１４との間の粘着力を低下させる。粘着フィルム１３の粘着層が感圧型（非紫外線硬化型）の粘着剤である場合、紫外線の照射を省略してピックアップ工程を進めることができる。次に、図７に示すように、支持片Ｄを吸引コレット２５で吸引し、支持片Ｄをピックアップする。吸引コレット２５による支持片Ｄの吸引にあたっては、ピックアップする支持片Ｄを突上治具等で粘着フィルム１３側から突き上げてもよい。 In the pick-up process, the adhesive film 13 is irradiated with ultraviolet rays to reduce the adhesive force between it and the support piece forming film 14 . When the adhesive layer of the adhesive film 13 is a pressure-sensitive (non-ultraviolet curable) adhesive, the pick-up process can proceed without irradiating ultraviolet rays. Next, as shown in FIG. 7, the support piece D is sucked by the suction collet 25 and the support piece D is picked up. In sucking the support piece D by the suction collet 25, the support piece D to be picked up may be pushed up from the adhesive film 13 side by a pushing jig or the like.
　以上説明したように、積層フィルム１１では、支持片形成用フィルム１４が予め複数の支持片Ｄに個片化されている。したがって、粘着フィルム１３及び支持片形成用フィルム１４の積層体Ｌをリングフレーム１８に固定した後の支持片形成用フィルム１４のダイシングを省略できる。また、積層フィルム１１では、支持片形成用フィルム１４の周縁部１４ａの少なくとも一部の領域に設けられた非切込部１７により、粘着フィルム１３をリングフレーム１８に貼り付ける際に粘着フィルム１３と支持片形成用フィルム１４との間にボイドＶが生じたとしても、当該ボイドＶの拡がりを切込パターン１６と非切込部１７との境界部分Ｒで食い止めることができる。したがって、積層フィルム１１では、粘着フィルム１３と支持片形成用フィルム１４との間のボイドＶの拡がりを抑制できる。 As described above, in the laminated film 11, the support piece forming film 14 is separated into a plurality of support pieces D in advance. Therefore, dicing of the support piece forming film 14 after fixing the laminate L of the adhesive film 13 and the support piece forming film 14 to the ring frame 18 can be omitted. In addition, in the laminated film 11, the non-cut portion 17 provided in at least a partial region of the peripheral edge portion 14a of the supporting piece forming film 14 allows the adhesive film 13 to be attached to the ring frame 18. Even if a void V occurs between the support piece forming film 14 and the film 14 for forming a support piece, the spread of the void V can be stopped at the boundary portion R between the cut pattern 16 and the non-cut portion 17 . Therefore, in the laminated film 11, expansion of the void V between the adhesive film 13 and the supporting piece forming film 14 can be suppressed.
　積層フィルム１１では、支持片形成用フィルム１４が熱硬化性樹脂層を含んで構成されている。これにより、積層フィルム１１において、基材フィルム１２による支持片形成用フィルム１４の保持性能を高めることが可能となる。また、ピックアップ後の半導体装置１の基板２への支持片Ｄの接続を好適に実施できる。 In the laminated film 11, the supporting piece forming film 14 includes a thermosetting resin layer. As a result, in the laminated film 11 , it is possible to enhance the holding performance of the support piece forming film 14 by the base film 12 . Moreover, the connection of the supporting piece D to the substrate 2 of the semiconductor device 1 after being picked up can be preferably carried out.
　本実施形態に係る支持片の製造方法では、粘着フィルム１３及び支持片形成用フィルム１４の積層体Ｌをリングフレーム１８に固定した後の支持片形成用フィルム１４のダイシングを省略できる。また、固定工程において粘着フィルム１３と支持片形成用フィルム１４との間にボイドＶが生じたとしても、当該ボイドＶの拡がりを切込パターン１６と非切込部１７との境界部分Ｒで食い止めることができる。したがって、粘着フィルム１３と支持片形成用フィルム１４との間のボイドＶの拡がりを抑制できる。 In the support piece manufacturing method according to the present embodiment, dicing of the support piece forming film 14 after fixing the laminate L of the adhesive film 13 and the support piece forming film 14 to the ring frame 18 can be omitted. In addition, even if a void V occurs between the adhesive film 13 and the supporting piece forming film 14 in the fixing step, the expansion of the void V is stopped by the boundary portion R between the cut pattern 16 and the non-cut portion 17. be able to. Therefore, expansion of the void V between the adhesive film 13 and the supporting piece forming film 14 can be suppressed.
　本実施形態に係る支持片の製造方法では、固定工程とピックアップ工程との間に、非切込部１７を支持片形成用フィルム１４から剥離する剥離工程を備えている。非切込部１７は、固定工程においてボイドＶが生じ得る部分である。ピックアップ工程の実施前に非切込部１７を剥離しておくことで、ピックアップの際に不具合が生じることを好適に防止できる。 The method for manufacturing a support piece according to the present embodiment includes a peeling step for peeling the non-cut portion 17 from the support piece forming film 14 between the fixing step and the pick-up step. The non-cut portion 17 is a portion where voids V may occur in the fixing process. By peeling off the non-cut portion 17 before performing the pick-up process, it is possible to suitably prevent problems from occurring during pick-up.
　本開示は、上記実施形態に限られるものではない。例えば上記実施形態では、非切込部１７が支持片形成用フィルム１４の周縁部１４ａの全体にわたって設けられているが、非切込部１７は、支持片形成用フィルム１４の任意の一部分又は複数部分に設けられていてもよい。非切込部１７を支持片形成用フィルム１４の周縁部１４ａの全体にわたって設ける場合においても、非切込部１７は必ずしも連続した形状でなくてもよい。支持片形成用フィルム１４の周縁部１４ａにおいて、非切込部１７が点線状、破線状に設けられていてもよい。また、例えばＣ字状のように、一部のみを非連続とした形状であってもよい。 The present disclosure is not limited to the above embodiments. For example, in the above-described embodiment, the non-cut portion 17 is provided over the entire peripheral edge portion 14a of the support piece forming film 14, but the non-cut portion 17 can be any part or a plurality of portions of the support piece forming film 14. It may be provided in a part. Even when the non-cut portion 17 is provided over the entire peripheral portion 14a of the support piece forming film 14, the non-cut portion 17 does not necessarily have a continuous shape. A non-cut portion 17 may be provided in a dotted line shape or a broken line shape in the peripheral edge portion 14 a of the support piece forming film 14 . Alternatively, the shape may be partially discontinuous, such as, for example, a C shape.
　支持片形成用フィルム１４は、図８（ａ）に示すように、熱硬化性樹脂層１５よりも剛性の高い樹脂層３１又は金属層３２を更に含んで構成されていてもよい。樹脂層３１としては、例えばポリイミド層が用いられる。金属層３２としては、例えば銅層、アルミニウム層などが用いられる。この場合、支持片形成用フィルム１４が剛性の高い層を含むことで、突上治具等への追従性が低下する一方で、吸引コレット２５等のピックアップツールへの追従性を高めることができる。金属層３２を含む場合、樹脂材料と金属材料との間の光学的なコントラストにより、ピックアップ時の支持片Ｄの視認性を高めることができる。 The supporting piece forming film 14 may further include a resin layer 31 or a metal layer 32 having higher rigidity than the thermosetting resin layer 15, as shown in FIG. 8(a). A polyimide layer, for example, is used as the resin layer 31 . As the metal layer 32, for example, a copper layer, an aluminum layer, or the like is used. In this case, since the supporting piece forming film 14 includes a layer with high rigidity, the followability to a pick-up tool such as the suction collet 25 can be improved while the followability to the pushing jig and the like is reduced. . When the metal layer 32 is included, the optical contrast between the resin material and the metal material can enhance the visibility of the support piece D during pickup.
　また、図８（ｂ）に示すように、熱硬化性樹脂層１５は、樹脂層３１又は金属層３２を挟むように複数層設けられていてもよい。この場合においても、図８（ａ）の場合と同様の作用効果が奏される。図８（ｂ）の例では、樹脂層３１又は金属層３２の一面側及び他面側に熱硬化性樹脂層１５が１層ずつ設けられているが、樹脂層３１又は金属層３２の一面側及び他面側に熱硬化性樹脂層１５が複数層ずつ設けられていてもよい。 Also, as shown in FIG. 8(b), the thermosetting resin layer 15 may be provided in a plurality of layers so as to sandwich the resin layer 31 or the metal layer 32 therebetween. Also in this case, the same effects as in the case of FIG. 8A are obtained. In the example of FIG. 8B, one thermosetting resin layer 15 is provided on each of one surface side and the other surface side of the resin layer 31 or the metal layer 32. A plurality of thermosetting resin layers 15 may be provided on each of the other surfaces.
　１１…積層フィルム、１２…基材フィルム、１３…粘着フィルム、１４…支持片形成用フィルム、１４ａ…周縁部、１５…熱硬化性樹脂層、１６…切込パターン、１７…非切込部、３１…樹脂層、３２…金属層、Ｄ…支持片、Ｌ…積層体。 DESCRIPTION OF SYMBOLS 11... Laminated film, 12... Base film, 13... Adhesive film, 14... Film for supporting piece formation, 14a... Peripheral part, 15... Thermosetting resin layer, 16... Cut pattern, 17... Non-cut part, 31... Resin layer, 32... Metal layer, D... Support piece, L... Laminate.

Claims (7)

  1. 　基材フィルムと、
    　前記基材フィルムの一面側に設けられた粘着フィルム及び支持片形成用フィルムを備え、
    　前記支持片形成用フィルムは、当該支持片形成用フィルムの厚さ全体に及ぶ切込パターンにより複数の支持片に個片化されており、
    　前記支持片形成用フィルムの周縁部の少なくとも一部の領域には、前記切込パターンが形成されていない非切込部が設けられている積層フィルム。     a base film;
    An adhesive film and a film for forming a support piece provided on one side of the base film,
    The support piece-forming film is singulated into a plurality of support pieces by a cut pattern extending over the entire thickness of the support piece-forming film,
    A laminated film in which a non-cut portion in which the cut pattern is not formed is provided in at least a partial region of the peripheral edge portion of the support piece-forming film.
  2. 　前記非切込部は、前記支持片形成用フィルムの周縁部の全体にわたって設けられている請求項１記載の積層フィルム。 The laminated film according to claim 1, wherein the non-cut portion is provided over the entire peripheral portion of the support piece forming film.
  3. 　前記支持片形成用フィルムは、熱硬化性樹脂層を含んで構成されている請求項１又は２記載の積層フィルム。 The laminated film according to claim 1 or 2, wherein the supporting piece-forming film comprises a thermosetting resin layer.
  4. 　前記支持片形成用フィルムは、前記熱硬化性樹脂層よりも剛性の高い樹脂層又は金属層を更に含んで構成されている請求項３記載の積層フィルム。 The laminated film according to claim 3, wherein the supporting piece-forming film further includes a resin layer or a metal layer having higher rigidity than the thermosetting resin layer.
  5. 　前記熱硬化性樹脂層は、前記樹脂層又は前記金属層を挟むように複数層設けられている請求項４記載の積層フィルム。 The laminated film according to claim 4, wherein the thermosetting resin layer is provided in a plurality of layers so as to sandwich the resin layer or the metal layer.
  6. 　請求項１～５のいずれか一項記載の積層フィルムを用いた支持片の製造方法であって、
    　前記粘着フィルムをリングフレームに貼り付けることにより、前記基材フィルムから剥離した前記粘着フィルム及び前記支持片形成用フィルムの積層体をリングフレームに固定する固定工程と、
    　前記切込パターンによって個片化されている複数の支持片を前記粘着フィルムから順次ピックアップするピックアップ工程と、を備える支持片の製造方法。     A method for manufacturing a support piece using the laminated film according to any one of claims 1 to 5,
    A fixing step of fixing the laminate of the adhesive film and the supporting piece forming film separated from the base film to the ring frame by attaching the adhesive film to the ring frame;
    A method of manufacturing a support piece, comprising: a picking up step of sequentially picking up a plurality of support pieces separated by the cutting pattern from the adhesive film.
  7. 　前記固定工程と前記ピックアップ工程との間に、前記非切込部を前記支持片形成用フィルムから剥離する剥離工程を備える請求項６記載の支持片の製造方法。 The method for manufacturing a support piece according to claim 6, comprising a peeling step of peeling the non-cut portion from the support piece forming film between the fixing step and the pick-up step.
PCT/JP2022/045546 2022-01-11 2022-12-09 Laminated film and support piece manufacturing method WO2023136004A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012248607A (en) * 2011-05-26 2012-12-13 Hitachi Chem Co Ltd Die-bond dicing sheet and method for manufacturing semiconductor device using the same
JP2020053453A (en) * 2018-09-25 2020-04-02 古河電気工業株式会社 Electronic device packaging tape
JP2020181894A (en) * 2019-04-25 2020-11-05 日立化成株式会社 Manufacturing method of semiconductor device having dolmen structure
WO2021038785A1 (en) * 2019-08-29 2021-03-04 昭和電工マテリアルズ株式会社 Support piece manufacturing method, semiconductor device manufacturing method, and support piece-forming layered film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012248607A (en) * 2011-05-26 2012-12-13 Hitachi Chem Co Ltd Die-bond dicing sheet and method for manufacturing semiconductor device using the same
JP2020053453A (en) * 2018-09-25 2020-04-02 古河電気工業株式会社 Electronic device packaging tape
JP2020181894A (en) * 2019-04-25 2020-11-05 日立化成株式会社 Manufacturing method of semiconductor device having dolmen structure
WO2021038785A1 (en) * 2019-08-29 2021-03-04 昭和電工マテリアルズ株式会社 Support piece manufacturing method, semiconductor device manufacturing method, and support piece-forming layered film

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