WO2023127732A1 - 電子部品 - Google Patents

電子部品 Download PDF

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Publication number
WO2023127732A1
WO2023127732A1 PCT/JP2022/047657 JP2022047657W WO2023127732A1 WO 2023127732 A1 WO2023127732 A1 WO 2023127732A1 JP 2022047657 W JP2022047657 W JP 2022047657W WO 2023127732 A1 WO2023127732 A1 WO 2023127732A1
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WO
WIPO (PCT)
Prior art keywords
internal electrode
layer
electrode layer
metal component
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/047657
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English (en)
French (fr)
Japanese (ja)
Inventor
晋一 山口
祥一郎 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2023570965A priority Critical patent/JP7655406B2/ja
Priority to CN202280069511.1A priority patent/CN118103934A/zh
Publication of WO2023127732A1 publication Critical patent/WO2023127732A1/ja
Priority to US18/667,267 priority patent/US12562314B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/129—Ceramic dielectrics containing a glassy phase, e.g. glass ceramic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Definitions

  • the present invention relates to electronic components.
  • an electronic component which is a multilayer ceramic capacitor, includes a laminate in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately laminated, and two end faces provided on both sides in the length direction of the laminate. and two external electrodes arranged respectively (see Patent Document 1).
  • An object of the present invention is to provide an electronic component that is highly reliable when a voltage is applied.
  • the present invention provides a laminate in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately laminated, and two electrodes provided on both sides in the length direction of the laminate. and two external electrodes respectively arranged on two end faces, wherein the internal electrode layer has a facing portion facing another internal electrode layer adjacent in the stacking direction, and extends from the facing portion to one of the end faces.
  • a first internal electrode layer having a lead portion connected to the external electrode disposed on the one end face; the facing portion; and a second internal electrode layer having a lead portion connected to the external electrodes arranged in an alternate manner, and the lead portions are arranged at the center in the stacking direction from the facing portion side toward the end face.
  • a solid-solution layer in which the components are solid-dissolved is provided, and the second metal component in the solid-solution layer is 0.001 or more and 0 .
  • FIG. 1 is a schematic perspective view of a laminated ceramic capacitor 1 of an embodiment
  • FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 1 of FIG. 1 taken along line II-II.
  • FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 1 of FIG. 1 taken along line III-III.
  • FIG. 4 is a flow chart explaining an example of a method for manufacturing the multilayer ceramic capacitor 1.
  • FIG. 3A to 3C are diagrams for explaining steps up to manufacturing a laminated sheet 103 in the manufacturing method of the multilayer ceramic capacitor 1.
  • FIG. FIG. 3 is a diagram for explaining a lamination step in the manufacturing method of the multilayer ceramic capacitor 1;
  • FIG. 1 is a schematic perspective view of a laminated ceramic capacitor 1 of an embodiment.
  • FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 1 of FIG. 1 taken along line II-II.
  • FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 1 of FIG. 1 taken along line III-III.
  • a laminated ceramic capacitor 1 includes a laminate 2 and a pair of external electrodes 3 provided at both ends of the laminate 2 .
  • the laminate 2 includes an inner layer portion 10 in which dielectric layers 11 and internal electrode layers 12 are alternately laminated.
  • the direction in which the pair of external electrodes 3 are provided in the multilayer ceramic capacitor 1 is defined as the length direction L as a term that indicates the orientation of the multilayer ceramic capacitor 1 .
  • the direction in which the dielectric layers 11 and the internal electrode layers 12 are stacked is defined as a stacking direction T.
  • a direction crossing both the length direction L and the stacking direction T is defined as a width direction W.
  • the width direction W is orthogonal to both the length direction L and the stacking direction T.
  • the stacking direction T is also referred to as a thickness direction.
  • the multilayer ceramic capacitor 1 has a withstand voltage of, for example, about 25V. Then, it has a substantially rectangular parallelepiped shape, the length direction L dimension is 0.6 mm or more and 3.2 mm or less, the width direction W dimension is 0.3 mm or more and 2.5 mm or less, and the thickness direction (stacking direction T) dimension is 0. .3 mm or more and 2.5 mm or less, preferably 1005 size to 2012 size multilayer ceramic capacitor 1, length direction L dimension of 1.0 mm or more and 2.0 mm or less, width direction W dimension and thickness direction (laminating direction) T) Dimension is 0.5 mm or more and 1.25 mm or less.
  • a pair of outer surfaces facing in the lamination direction T are referred to as a first main surface Aa and a second main surface Ab
  • a pair of outer surfaces facing in the width direction W The outer surfaces are defined as a first side surface Ba and a second side surface Bb
  • a pair of outer surfaces facing each other in the length direction L are defined as a first end surface Ca and a second end surface Cb.
  • the first main surface Aa and the second main surface Ab they will be collectively referred to as the main surface A, and the first side surface Ba and the second side surface Bb will need to be specifically distinguished for explanation. If not, they will be collectively referred to as the side surface B, and the first end surface Ca and the second end surface Cb will be collectively described as the end surface C unless it is necessary to distinguish them for description.
  • the laminate 2 includes an inner layer portion 10, outer layer portions 13 arranged on both sides of the inner layer portion 10 in the lamination direction T, and side gap portions 30 provided on both sides of the inner layer portion 10 and the outer layer portion 13 in the width direction W. and
  • Inner layer portion 10 In the inner layer portion 10, dielectric layers 11 and internal electrode layers 12 are alternately laminated one by one.
  • the dielectric layer 11 is formed by, for example, adding a binder, a plasticizer, a dispersant, etc. to a mixture obtained by adding and mixing a ceramic powder such as BaTiO 3 , a glass component, and a sintering aid as necessary.
  • a ceramic green sheet obtained by molding a slurry containing an agent and an organic solvent into a sheet is sintered.
  • the thickness of the dielectric layer 11 is, for example, 0.8 ⁇ m or more and 4.1 ⁇ m or less. Also, the number of dielectric layers 11 is 200 or more and 650 or less.
  • the internal electrode layer 12 is obtained by sintering an internal electrode layer paste containing a powder of the first metal component, which is the main component, a binder, additives such as a plasticizer and a dispersant, an organic solvent, and the like. is.
  • the first metal component that is the main component of the internal electrode layer 12 is Ni in the embodiment, and the first metal component is hereinafter described as Ni.
  • the internal electrode layers 12 include a plurality of first internal electrode layers 12A and a plurality of second internal electrode layers 12B.
  • the first internal electrode layers 12A and the second internal electrode layers 12B are alternately arranged.
  • the thickness of the internal electrode layer 12 is, for example, 0.5 ⁇ m or more and 1.1 ⁇ m or less. Further, the number of internal electrode layers 12 is 200 or more and 650 or less in total including the first internal electrode layers 12A and the second internal electrode layers 12B.
  • the first internal electrode layer 12A includes a first facing portion 12Aa facing the second internal electrode layer 12B, and a first lead portion 12Ab drawn from the first facing portion 12Aa toward the first end surface Ca. An end portion of the first lead-out portion 12Ab is exposed on the first end surface Ca and electrically connected to a first external electrode 3A, which will be described later.
  • the second internal electrode layer 12B includes a second facing portion 12Ba facing the first internal electrode layer 12A, and a second lead portion 12Bb drawn from the second facing portion 12Ba to the second end face Cb. An end portion of the second lead portion 12Bb is electrically connected to a second external electrode 3B, which will be described later. Charges are accumulated in the first facing portion 12Aa of the first internal electrode layer 12A and the second facing portion 12Ba of the second internal electrode layer 12B.
  • first facing portion 12Aa and the second facing portion 12Ba do not need to be distinguished from each other, they will be collectively referred to as the facing portion 12a, and the first lead-out portion 12Ab and the second lead-out portion 12Bb will be specifically referred to. When there is no need to distinguish and explain, they will be collectively explained as the drawer portion 12b.
  • FIG. 2 is a cross section extending in the stacking direction T and the length direction L through the central portion in the width direction W intersecting the stacking direction T and the length direction L.
  • the curved portion 121 is provided in an end region closer to the end surface C than the position at the distance D1 from the end surface C.
  • the curved portion 121 curves toward the central portion in the stacking direction T as it goes from the facing portion 12a side toward the end face C.
  • the term "curvature" includes two or more points of inflection, and includes only one point of inflection, and the magnitude of the inflection does not matter.
  • the degree of curvature of the curved portion 121 is the smallest in the central portion of the internal electrode layer 12 in the stacking direction T, and in the embodiment, the curved portion 121 of the internal electrode layer 12 in the center of the stacking direction T is substantially straight.
  • the degree of curvature of the curved portion 121 increases toward the main surface A side. That is, the degree of curvature of the curved portion 121 of the internal electrode layer 12 closest to the main surface A is the largest. In other words, the curved portion 121 farthest in the stacking direction T from the central portion has the greatest degree of curvature.
  • the distance D2 in the stacking direction T between the stacking direction T position of the end portion of the curved portion 121 on the side of the end surface C and the stacking direction T position of the opposing portion 12a is It is 3 ⁇ m or more and 100 ⁇ m or less.
  • Solid solution layer 20 At the interface with the dielectric layer 11 or the outer layer portion 13 on both sides of the curved portion 121 in the stacking direction T, a first metal component, which is Ni, which is the main component of the internal electrode layer 12, is added with a second metal component different from the first metal component.
  • a solid-solution layer 20 is provided in which two metal components are dissolved in a molar ratio of 0.001 or more and 0.1 or less with respect to the sum of the molar amount of the first metal component and the second metal component.
  • the second metal component is preferably Sn, In, Ga, Zn, Bi, Pb, Fe, V, Y or Cu. Sn.
  • the solid solution layer 20 is a layer in which Sn atoms are randomly substituted for Ni within the Ni atomic arrangement structure while maintaining the Ni atomic arrangement structure.
  • the thickness of the solid solution layer 20 is preferably 1 nm or more and 20 nm or less.
  • the solid solution layer 20 can be measured by measuring 10 points in a region including the interface between the dielectric layer 11 and the internal electrode 12 by TEM analysis. The number of moles uses the average value of 10 points.
  • the solid solution layer 20 is provided on the curved portion 121 of the internal electrode layer 12 . Further, in the embodiment, the solid solution layer 20 further includes the entire lead portion 12Ab and the lead portion 12Bb including the curved portion 121, and an area within at least 10 ⁇ m from the side of the lead portion 12Ab and the lead portion 12Bb of the facing portion 12Aa and the facing portion 12Ba. extends to Note that the solid solution layer 20 may be provided only on the curved portion 121 of the internal electrode layer 12 . In addition, the solid solution layers 20 are provided at the interface with the dielectric layer 11 or the outer layer portion 13 on both sides of the curved portion 121 in the lamination direction T, but the present invention is not limited to this.
  • the solid solution layers 20 are provided on both sides of all the internal electrode layers 12 in the stacking direction T at the interface with the dielectric layer 11 or the outer layer portion 13.
  • the solid solution layer is not limited to this. 20 may be provided only on some of the internal electrode layers 12 .
  • outer layer portion 13 The outer layer portions 13 are provided on both sides of the inner layer portion 10 in the stacking direction T, and are made of the same dielectric ceramic material as the dielectric layer 11 .
  • the side gap portions 30 are provided on both sides of the inner layer portion 10 and the outer layer portion 13 in the width direction W, and are made of the same dielectric ceramic material as the dielectric layer 11 .
  • the external electrodes 3 are provided on both end surfaces C of the laminate 2 .
  • the external electrode 3 covers not only the end surface C, but also the main surface A and part of the side surface B on the end surface C side.
  • the end of the first lead-out portion 12Ab of the first internal electrode layer 12A is exposed on the first end surface Ca and electrically connected to the first external electrode 3A.
  • the end of the second lead-out portion 12Bb of the second internal electrode layer 12B is exposed on the second end surface Cb and electrically connected to the second external electrode 3B.
  • a plurality of capacitor elements are electrically connected in parallel between the first external electrode 3A and the second external electrode 3B.
  • FIG. 4 is a flow chart illustrating an example of a method for manufacturing the multilayer ceramic capacitor 1. As shown in FIG. This manufacturing method is an example, and the present invention is not limited to this.
  • 5A and 5B are diagrams for explaining steps up to manufacturing a laminated sheet 103, which will be described later, in the manufacturing method of the multilayer ceramic capacitor 1.
  • FIG. The process up to the production of this laminated sheet 103 is also an example, and the present invention is not limited to this.
  • Ceramic green sheet production step S1 First, a ceramic slurry containing ceramic powder, a binder and a solvent is prepared. This ceramic slurry is printed in a sheet form on a carrier film using a die coater, a gravure coater, a micro gravure coater, or the like, to produce a ceramic green sheet 101 for the inner layer shown in FIG. 5(a).
  • an internal electrode layer forming region P which includes a region where the curved portion 121 printed with the solid solution layer paste 20P is formed, is applied to the internal electrode layer forming region P, which will be the internal electrode layer 12.
  • a paste 102 is printed.
  • the solid solution layer paste 20P is printed at the same position as the position where the internal electrode layer paste 102 was printed in the one-side solid solution layer paste printing step S2.
  • the lamination sheet 103 is produced by the above steps.
  • FIG. 6 is a diagram for explaining the lamination process.
  • a plurality of laminated sheets 103 are laminated such that the internal electrode forming regions P printed with the solid-solution layer paste 20P and the internal electrode layer paste 102 are shifted by half a pitch between the adjacent laminated sheets 103.
  • Sheets 103 are stacked.
  • ceramic green sheets 112 for outer layer portions are stacked on both sides of the laminated sheet 103 in which a plurality of laminated sheets are laminated.
  • Thermal compression step S6 Subsequently, the ceramic green sheet 112 for the outer layer portion and the plurality of stacked laminated sheets 103 are thermocompression bonded. Thereby, the mother block 110 is formed.
  • the end region at a constant distance in the length direction L from the end face C of the laminated body 2 cut along the cutting line X is the region where the lead portion 12b is formed.
  • a portion where the internal electrode layer paste 102 is printed and a portion where it is not printed are laminated alternately.
  • the internal region separated from the end surface C by a certain distance or more is a region where the facing portion 12a is formed, and only the portion of the laminated sheet 103 on which the internal electrode layer paste 102 is printed is laminated.
  • the number of the internal electrode layer pastes 102 in the region where the lead-out portion 12b is arranged is half that in the region where the facing portion 12a is arranged, the number of layers of the internal electrode layer paste 102 increases toward the end face C side as compared to the internal region. The thickness in direction T is reduced. For this reason, a curved portion 121 that curves toward the end face C side is formed in the lead portion 12b.
  • the laminate 2 having the external electrodes 3 formed thereon is heated at the set firing temperature in a nitrogen atmosphere for a predetermined time. Thereby, the multilayer ceramic capacitor 1 is manufactured. At this time, the ceramic green sheets 101 for the inner layer and the ceramic green sheets 112 for the outer layer are sintered into ceramics, and the dielectric layer 11 and the outer layer 13 are formed.
  • the internal electrode layer paste 102 becomes the internal electrode layer 12, but the solid solution layer paste 20P printed on both sides of the internal electrode layer paste 102 in the stacking direction T is heated and dissolved. It becomes layer 20 .
  • the curved portion 121 is formed by deforming the drawer portion 12b by stacking and pressing the plurality of laminated sheets 103 in the laminating step S5 or the thermocompression bonding step S6.
  • the strength of the portion of the drawn-out portion 12b where the curved portion 121 is formed may be reduced due to this deformation.
  • the strength of the curved portion 121 is improved, and the multilayer ceramic capacitor 1 has a withstand voltage (withstand voltage performance) is improved.
  • the solid solution of Sn in Ni changes the state (electrical barrier height) in the vicinity of the interface with the dielectric layer 11 in the curved portion 121, and the high temperature load life can be improved. As described above, it is possible to obtain the multilayer ceramic capacitor 1 having excellent reliability when a voltage is applied.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2022/047657 2021-12-28 2022-12-23 電子部品 Ceased WO2023127732A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023570965A JP7655406B2 (ja) 2021-12-28 2022-12-23 電子部品
CN202280069511.1A CN118103934A (zh) 2021-12-28 2022-12-23 电子部件
US18/667,267 US12562314B2 (en) 2021-12-28 2024-05-17 Electronic component

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JP2021-214978 2021-12-28
JP2021214978 2021-12-28

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US18/667,267 Continuation US12562314B2 (en) 2021-12-28 2024-05-17 Electronic component

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US12562314B2 (en) * 2021-12-28 2026-02-24 Murata Manufacturing Co., Ltd. Electronic component

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US20240304393A1 (en) 2024-09-12
JP7655406B2 (ja) 2025-04-02
US12562314B2 (en) 2026-02-24
JPWO2023127732A1 (https=) 2023-07-06

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