WO2023127414A1 - プリント配線板及びコイル装置 - Google Patents

プリント配線板及びコイル装置 Download PDF

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Publication number
WO2023127414A1
WO2023127414A1 PCT/JP2022/044755 JP2022044755W WO2023127414A1 WO 2023127414 A1 WO2023127414 A1 WO 2023127414A1 JP 2022044755 W JP2022044755 W JP 2022044755W WO 2023127414 A1 WO2023127414 A1 WO 2023127414A1
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WO
WIPO (PCT)
Prior art keywords
coil
view
plan
coil portion
base film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/044755
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
将希 宮原
航 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Printed Circuits Inc
Priority to US18/720,856 priority Critical patent/US20250071899A1/en
Priority to KR1020247020571A priority patent/KR20240125583A/ko
Priority to JP2023570765A priority patent/JPWO2023127414A1/ja
Priority to CN202280086007.2A priority patent/CN118451791A/zh
Publication of WO2023127414A1 publication Critical patent/WO2023127414A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/006—Printed inductances flexible printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09272—Layout details of angles or corners
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination

Definitions

  • the present disclosure relates to printed wiring boards and coil devices.
  • This application claims priority from Japanese Patent Application No. 2021-212226 filed on December 27, 2021. All the contents described in the Japanese patent application are incorporated herein by reference.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2020-181852
  • Patent Document 1 describes a printed wiring board.
  • the printed wiring board described in Patent Document 1 has a flexible substrate, first coil wiring, and second coil wiring.
  • the flexible substrate has a first side and a second side.
  • the second surface is the opposite surface of the first surface.
  • a flexible substrate has a plurality of portions in plan view. Each of the multiple portions of the flexible substrate is aligned along the first direction.
  • the first direction is the longitudinal direction of the flexible substrate in plan view. Two adjacent boundaries of the plurality of portions of the flexible substrate are along the second direction.
  • the second direction is a direction orthogonal to the first direction.
  • the first wiring is arranged on the first surface and has a plurality of first coils.
  • Each of the plurality of first coils is a portion of the first wiring spirally wound in plan view.
  • Each of the plurality of first coils is arranged on each of the plurality of portions of the flexible substrate.
  • the second wiring is arranged on the second surface and has a plurality of second coils.
  • Each of the plurality of second coils is a portion of the second wiring spirally wound in plan view.
  • Each of the plurality of second coils is arranged on each of the plurality of portions of the flexible substrate.
  • the flexible substrate is zigzag along two adjacent boundaries of the plurality of portions.
  • a coil device is obtained in which a plurality of first coils and second coils are alternately laminated with one of the plurality of portions of the flexible substrate interposed therebetween.
  • a printed wiring board includes a base film having a first main surface and a second main surface, first wiring arranged on the first main surface, and a second wiring arranged on the second main surface. 2 wiring.
  • the base film has a first portion and a second portion. The first portion and the second portion are arranged along the first direction, which is the longitudinal direction of the base film in plan view.
  • a first boundary which is a boundary between the first portion and the second portion, extends along the second direction orthogonal to the first direction in plan view.
  • the first wiring includes a first coil portion located in the first portion and spirally wound in plan view, and a first coil portion located in the second portion and spirally wound in plan view. and a second coil portion. When the base film is bent along the first boundary so that the first coil portion overlaps the second coil portion in plan view, the first portion is arranged to partially overlap the second portion in plan view.
  • FIG. 1 is a plan view of a printed wiring board 100.
  • FIG. FIG. 2 is a bottom view of printed wiring board 100 .
  • FIG. 3A is a cross-sectional view along IIIA-IIIA in FIG.
  • FIG. 3B is a partially enlarged view of FIG. 3A.
  • FIG. 4 is a cross-sectional view of the coil device 200.
  • FIG. 5 is a cross-sectional view of the coil device 200A.
  • each of the plurality of portions of the flexible substrate has the same shape in plan view. Therefore, the thickness of the coil device obtained from the printed wiring board described in Patent Document 1 increases regardless of the location. As a result, this coil device has room for improvement in terms of integrability.
  • the present invention has been made in view of the problems of the prior art as described above. More specifically, the present disclosure provides a printed wiring board that, when assembled, results in a coil device that is locally reduced in thickness.
  • a printed wiring board includes a base film having a first main surface and a second main surface, first wiring arranged on the first main surface, and arranged on the second main surface and a second wiring.
  • the base film has a first portion and a second portion.
  • the first portion and the second portion are arranged along the first direction, which is the longitudinal direction of the base film in plan view.
  • a first boundary which is a boundary between the first portion and the second portion, extends along the second direction orthogonal to the first direction in plan view.
  • the first wiring includes a first coil portion located in the first portion and spirally wound in plan view, and a first coil portion located in the second portion and spirally wound in plan view. 2 coil section.
  • the second wiring is located in the first portion and is located in the third coil portion wound spirally in plan view, and in the second portion, and a fourth coil portion spirally wound in plan view.
  • the third coil portion and the fourth coil portion may respectively overlap the first coil portion and the second coil portion in plan view.
  • the base film may further have a third portion.
  • the first portion may be sandwiched between the second portion and the third portion in the first direction.
  • a second boundary which is a boundary between the first portion and the third portion, may extend along the second direction.
  • the first wiring includes a fifth coil portion located in the first portion and spirally wound in plan view, and a fifth coil portion located in the third portion and spirally wound in plan view. 6 coil parts.
  • the second wiring includes a seventh coil portion located in the first portion and spirally wound in plan view, and a seventh coil portion located in the third portion and spirally wound in plan view. 8 coil parts.
  • the seventh coil portion and the eighth coil portion may respectively overlap the fifth coil portion and the sixth coil portion in plan view.
  • the base film is bent along the first boundary so that the first coil portion overlaps the second coil portion in plan view, and the base film is bent along the first boundary so that the fifth coil portion overlaps the sixth coil portion in plan view.
  • the second portion may be spaced apart from the third portion when bent along the boundary.
  • a coil device includes a base film having a first main surface and a second main surface, first wiring arranged on the first main surface, and and a second wiring.
  • the base film has a first portion and a second portion. The first portion and the second portion are arranged along the first direction, which is the longitudinal direction of the base film in plan view, before the base film is bent.
  • a first boundary which is a boundary between the first portion and the second portion, extends along the second direction orthogonal to the first direction in plan view.
  • the first wiring includes a first coil portion located in the first portion and spirally wound in plan view, and a first coil portion located in the second portion and spirally wound in plan view. and a second coil portion.
  • the base film is bent along the first boundary so that the first coil portion overlaps the second coil portion in plan view. The first portion partially overlaps the second portion in plan view with the base film being bent.
  • the thickness of the portion where the first portion and the second portion do not overlap is smaller than the thickness of the portion where the first portion and the second portion overlap, it is easy to install. has been improved.
  • the second wiring is located in the first portion and is wound in a spiral shape in a plan view
  • the third coil portion is located in the second portion
  • You may have the 4th coil part wound spirally in planar view.
  • the third coil portion and the fourth coil portion may respectively overlap the first coil portion and the second coil portion in plan view.
  • the first wiring may further have a first connection portion connecting the first coil portion and the second coil portion.
  • the first connecting portion may extend to cross the first boundary.
  • the first connecting portion is located inside the bent base film, the first connecting portion is less likely to be damaged.
  • the coil device of (4) above may further include electronic components.
  • the second major surface located in the first portion may partially face the second major surface located in the second portion when the base film is bent.
  • the second portion may be spaced apart from the first portion while the base film is bent.
  • the electronic component may be arranged between the first portion and the second portion with the base film bent, and may be connected to the second wiring.
  • the coil device of (7) above it is possible to secure a space for arranging the electronic component between the first portion and the second portion while the base film is bent.
  • the base film may further have a third portion.
  • the first portion may be sandwiched between the second portion and the third portion in the first direction before the base film is bent.
  • a second boundary which is a boundary between the first portion and the third portion, may extend along the second direction.
  • the first wiring includes a fifth coil portion located in the first portion and spirally wound in plan view, and a fifth coil portion located in the third portion and spirally wound in plan view. You may have a 6th coil part.
  • the second wiring includes a seventh coil portion located in the first portion and wound spirally in plan view, and a seventh coil portion located in the third portion and spirally wound in plan view. You may have the 8th coil part which is.
  • the seventh coil portion and the eighth coil portion may respectively overlap the fifth coil portion and the sixth coil portion in plan view.
  • the base film is bent along the first boundary so that the first coil portion overlaps the second coil portion in plan view, and is bent along the second boundary so that the fifth coil portion overlaps the sixth coil portion in plan view. It may be bent along.
  • the second portion may be spaced apart from the third portion while the base film is bent.
  • the first principal surface located in the first portion partially faces the first principal surface located in the third portion in a state in which the base film is bent.
  • the first wiring may further have a second connection portion connecting the fifth coil portion and the sixth coil portion. The second connection may extend across the second boundary.
  • the second connecting portion since the second connecting portion is located inside the bent base film, the second connecting portion is less likely to be damaged.
  • the coil device of (8) above may further include an electronic component arranged between the second portion and the third portion with the base film bent.
  • the coil device of (10) above there is a portion where the thickness is reduced between the second portion and the third portion, and the electronic component can be arranged in this portion.
  • a printed wiring board according to the first embodiment and a coil device according to the first embodiment will be described.
  • the printed wiring board according to the first embodiment is referred to as printed wiring board 100 and the coil device according to the first embodiment is referred to as coil device 200 .
  • FIG. 1 is a plan view of the printed wiring board 100.
  • FIG. FIG. 2 is a bottom view of printed wiring board 100 .
  • FIG. 3A is a cross-sectional view along IIIA-IIIA in FIG.
  • FIG. 3B is a partially enlarged view of FIG. 3A. Illustration of the protective layer 50 is omitted in FIG. 1, and illustration of the protective layer 60 is omitted in FIG.
  • the printed wiring board 100 has a base film 10, first wirings 20, and second wirings 30.
  • FIG. 1 is a plan view of the printed wiring board 100.
  • FIG. FIG. 2 is a bottom view of printed wiring board 100 .
  • FIG. 3A is a cross-sectional view along IIIA-IIIA in FIG.
  • FIG. 3B is a partially enlarged view of FIG. 3A. Illustration of the protective layer 50 is omitted in FIG. 1, and illustration of the protective layer 60 is omitted in FIG.
  • the printed wiring board 100 has a base film 10, first wirings 20, and second wirings
  • the base film 10 has a first main surface 10a and a second main surface 10b.
  • the first main surface 10a and the second main surface 10b are end surfaces of the base film 10 in the thickness direction.
  • the second principal surface 10b is the opposite surface of the first principal surface 10a.
  • the base film 10 is made of a flexible, electrically insulating resin material.
  • the base film 10 is made of polyimide, fluorine resin, or the like, for example.
  • the longitudinal direction of the base film 10 in plan view be a first direction DR1.
  • the width direction of the base film 10 in plan view is defined as a second direction DR2.
  • the second direction DR2 is orthogonal to the first direction DR1.
  • the first direction DR1 and the second direction DR2 are orthogonal to the thickness direction of the base film 10 .
  • the base film 10 includes a first side and a second side that are parallel to each other, and a third side and a fourth side that are parallel to each other and orthogonal to the first side (second side). It is The first side and the second side are longer than the third side and the fourth side.
  • the direction from the third side to the fourth side is the longitudinal direction (first direction DR1) of the base film 10 in plan view, and the direction from the first side to the second side is the width direction (first direction DR1) of the base film 10 in plan view. second direction DR2).
  • the base film 10 has a first portion 11 and a second portion 12 .
  • Base film 10 may further have a third portion 13 .
  • the first portion 11, the second portion 12 and the third portion 13 are arranged along the first direction DR1.
  • First portion 11 is sandwiched between second portion 12 and third portion 13 in first direction DR1.
  • the boundary between the first portion 11 and the second portion 12 (see dotted lines in FIGS. 1 and 2) and the boundary between the first portion 11 and the third portion 13 (see dotted lines in FIGS. 1 and 2) ) is along the second direction DR2. That is, the first portion 11, the second portion 12 and the third portion 13 are rectangular in plan view.
  • the width of the first portion 11 in the first direction DR1 is greater than the width of the second portion 12 in the first direction DR1 and the width of the third portion 13 in the first direction DR1.
  • the first wiring 20 is arranged on the first main surface 10a.
  • the first wiring 20 has a first coil portion 21 , a second coil portion 22 and a first connection portion 23 .
  • the first coil portion 21 and the second coil portion 22 are spirally wound in plan view.
  • the first coil portion 21 and the second coil portion 22 are located in the first portion 11 and the second portion 12, respectively. More specifically, the first coil portions 21 are arranged near the four corners of the first portion 11 next to the second portion 12 in plan view.
  • the second coil portion 22 is arranged to face the first coil portion 21 across the boundary between the first portion 11 and the second portion 12 in plan view.
  • the first connection portion 23 connects the other end of the first coil portion 21 and the other end of the second coil portion 22 .
  • the first connecting portion 23 extends to cross the boundary between the first portion 11 and the second portion 12 .
  • the first connection portion 23 extends, for example, along the first direction DR1.
  • the second wiring 30 is arranged on the second main surface 10b.
  • the second wiring 30 has a third coil portion 31 and a fourth coil portion 32 .
  • the third coil portion 31 and the fourth coil portion 32 are spirally wound in plan view.
  • the third coil portion 31 and the fourth coil portion 32 are located in the first portion 11 and the second portion 12, respectively. More specifically, the third coil portions 31 are arranged near the four corners of the first portion 11 next to the second portion 12 in plan view.
  • the fourth coil portion 32 is arranged to face the third coil portion 31 across the boundary between the first portion 11 and the second portion 12 in plan view.
  • the third coil portion 31 is arranged to overlap the first coil portion 21 in plan view.
  • the fourth coil portion 32 is arranged to overlap the second coil portion 22 in plan view.
  • One end and the other end of the third coil portion 31 are located on the innermost circumference and the outermost circumference of the third coil portion 31, respectively.
  • One end and the other end of the fourth coil portion 32 are located on the innermost circumference and the outermost circumference of the fourth coil portion 32, respectively.
  • the first wiring 20 further has a fifth coil portion 24 , a sixth coil portion 25 and a second connection portion 26 .
  • the fifth coil portion 24 and the sixth coil portion 25 are spirally wound in plan view.
  • the fifth coil portion 24 and the sixth coil portion 25 are located in the first portion 11 and the third portion 13, respectively. More specifically, the fifth coil portions 24 are arranged near the four corners of the first portion 11 on the third portion 13 side in plan view.
  • the sixth coil portion 25 is arranged to face the fifth coil portion 24 across the boundary between the first portion 11 and the third portion 13 in plan view.
  • the second connection portion 26 connects the other end of the fifth coil portion 24 and the other end of the sixth coil portion 25 .
  • the second connecting portion 26 extends across the boundary between the first portion 11 and the third portion 13 .
  • the second connection portion 26 extends, for example, along the first direction DR1.
  • the second wiring 30 further has a seventh coil portion 33 and an eighth coil portion 34 .
  • the seventh coil portion 33 and the eighth coil portion 34 are spirally wound in plan view.
  • the seventh coil portion 33 and the eighth coil portion 34 are located in the first portion 11 and the third portion 13, respectively. More specifically, the seventh coil portion 33 is arranged near four corners of the first portion 11 on the side of the third portion 13 in plan view.
  • the eighth coil portion 34 is arranged to face the seventh coil portion 33 across the boundary between the first portion 11 and the third portion 13 in plan view.
  • the seventh coil portion 33 is arranged to overlap the fifth coil portion 24 in plan view.
  • the eighth coil portion 34 is arranged to overlap the sixth coil portion 25 in plan view.
  • One end and the other end of the seventh coil portion 33 are located on the innermost circumference and the outermost circumference of the seventh coil portion 33, respectively.
  • One end and the other end of the eighth coil portion 34 are located on the innermost circumference and the outermost circumference of the eighth coil portion 34, respectively.
  • One end of the first coil portion 21 is a land 27a.
  • the other end of the second coil portion 22 is a land 27b.
  • One end of the third coil portion 31 is a land 35a.
  • the land 35a is arranged so as to overlap the land 27a in plan view.
  • the other end of the third coil portion 31 is a land 35b.
  • One end of the fourth coil portion 32 is a land 35c.
  • the land 35c is arranged to overlap the land 27b in plan view.
  • the other end of the fourth coil portion 32 is a land 35d.
  • One end of the fifth coil portion 24 is a land 27c.
  • the other end of the sixth coil portion 25 is a land 27d.
  • One end of the seventh coil portion 33 is a land 35e.
  • the land 35e is arranged to overlap the land 27c in plan view.
  • the other end of the seventh coil portion 33 is a land 35f.
  • One end of the eighth coil portion 34 is a land 35g.
  • the land 35g is arranged to overlap the land 27d in plan view.
  • the other end of the eighth coil portion 34 is a land 35h.
  • the first wiring 20 and the second wiring 30 are formed by, for example, a semi-additive method.
  • the first wiring 20 and the second wiring 30 have a seed layer 41 and an electrolytic plating layer 42 .
  • the seed layer 41 has a first layer 41a and a second layer 41b.
  • the first layer 41a is arranged on the main surfaces of the base film 10 (the first main surface 10a and the second main surface 10b).
  • the second layer 41b is arranged on the first layer 41a.
  • the first layer 41a is made of, for example, a nickel-chromium alloy.
  • the second layer 41b is made of copper, for example.
  • the through-holes 10c are arranged at positions overlapping the lands 27a and 35a in plan view, positions overlapping the lands 27b and 35c in plan view, positions overlapping the lands 27c and lands 35e in plan view, and positions overlapping the lands 27c and 35e in plan view. It is formed at a position overlapping the land 27d and the land 35g.
  • the through hole 10c penetrates the base film 10 along the thickness direction.
  • the second layer 41b is also arranged on the inner wall surface of the through hole 10c.
  • the electrolytic plating layer 42 is arranged on the seed layer 41 (second layer 41b). Electroplated layer 42 is embedded in through hole 10c.
  • the electrolytic plating layer 42 embedded in the through hole 10c electrically connects the first coil portion 21 and the third coil portion 31, and electrically connects the second coil portion 22 and the fourth coil portion 32. be done.
  • the fifth coil portion 24 and the seventh coil portion 33 are electrically connected, and the sixth coil portion 25 and the eighth coil portion 34 are electrically connected by the electrolytic plating layer 42 embedded in the through hole 10c. be.
  • the electrolytic plated layer 42 is a layer formed by electrolytic plating.
  • the electrolytic plating layer 42 is made of copper, for example.
  • first wiring 20 and the second wiring 30 are formed by the semi-additive method.
  • first wiring 20 and the second wiring 30 may be formed by the subtractive method.
  • the printed wiring board 100 further has a protective layer 50 and a protective layer 60 .
  • the protective layer 50 has a first layer 51 and a second layer 52 .
  • the protective layer 60 has a first layer 61 and a second layer 62 .
  • the first layer 51 is arranged on the first main surface 10 a so as to cover the first wiring 20 .
  • the first layer 51 is made of, for example, an adhesive.
  • the second layer 52 is arranged on the first layer 51 .
  • the second layer 52 is made of polyimide, for example.
  • the first layer 61 is arranged on the second main surface 10 b so as to cover the second wiring 30 .
  • the first layer 61 is made of, for example, an adhesive.
  • the second layer 62 is arranged on the first layer 61 .
  • the second layer 62 is made of polyimide, for example.
  • the protective layer 60 may be removed at positions overlapping the vicinity of the boundary between the first portion 11 and the second portion 12 and the vicinity of the boundary between the first portion 11 and the third portion in plan view.
  • FIG. 4 is a cross-sectional view of the coil device 200.
  • coil device 200 has printed wiring board 100 and adhesive sheet 70 .
  • the base film 10 is bent so that the second coil portion 22 overlaps the first coil portion 21 in plan view.
  • the base film 10 is bent, for example, so that the portion of the first main surface 10a located on the second portion 12 faces the portion of the first main surface 10a located on the first portion 11 .
  • the base film 10 is bent so that the sixth coil portion 25 overlaps the fifth coil portion 24 in plan view.
  • the base film 10 is bent, for example, so that the portion of the first main surface 10a located in the third portion 13 faces the portion of the first main surface 10a located in the first portion 11 .
  • the first coil portion 21 is arranged to overlap the third coil portion 31 in plan view
  • the second coil portion 22 is arranged to overlap the fourth coil portion 32 in plan view
  • the fifth coil portion 24 is arranged to overlap the seventh coil portion 33 in plan view
  • the sixth coil portion 25 is arranged to overlap the eighth coil portion 34 . Therefore, when the base film 10 is bent as described above, the first coil portion 21, the second coil portion 22, the third coil portion 31, and the fourth coil portion 32 overlap each other in plan view to form one coil.
  • the fifth coil portion 24, the sixth coil portion 25, the seventh coil portion 33, and the eighth coil portion 34 overlap each other in plan view to form one coil.
  • the coil composed of the first coil portion 21, the second coil portion 22, the third coil portion 31, and the fourth coil portion 32 generates a magnetic field by applying a current from the land 35b and the land 35d.
  • a coil composed of the coil portion 24, the sixth coil portion 25, the seventh coil portion 33, and the eighth coil portion 34 generates a magnetic field by applying a current from the land 35f and the land 35h.
  • the second portion 12 partially overlaps the first portion 11 in plan view
  • the third portion 13 partially overlaps the first portion 11 in plan view. overlapping.
  • the second portion 12 and the third portion 13 are separated from each other in the first direction DR1.
  • the thickness of the portion where the first portion 11 overlaps neither the second portion 12 nor the third portion 13 is Alternatively, the thickness is smaller than the thickness of the portion overlapping the third portion 13 .
  • an electronic component may be placed in the space between the second portion 12 and the third portion 13 when the base film 10 is bent as described above. This electronic component is, for example, a magnetic sensor.
  • the adhesive sheet 70 is positioned between the portion of the protective layer 50 on the first portion 11 and the protective layer 50 on the second portion 12 and the first portion 11 . It is arranged between the overlying portion of the protective layer 50 and the portion of the protective layer 50 overlying the third portion 13 . Thereby, the base film 10 is maintained in the bent state as described above.
  • the adhesive sheet 70 is made of, for example, an adhesive.
  • a device (such as an actuator) in which the coil device 200 is incorporated has electronic components, for example. Since the coil device 200 can be incorporated into an actuator or the like so that an electronic component or the like is arranged in the portion where the thickness is reduced, the assemblability is improved.
  • the portion of the first main surface 10 a where the base film 10 is located on the first portion 11 faces the portion of the first main surface 10 a located on the second portion 12 and is located on the first portion 11 . Since the portion of the first main surface 10a is bent to face the portion of the first main surface 10a located on the third portion 13, the first connecting portion 23 and the second connecting portion 26 are formed on the bent base. inside the film 10; Therefore, tensile stress is less likely to act on the first connection portion 23 and the second connection portion 26, and cracks are suppressed from occurring in the first connection portion 23 and the second connection portion 26.
  • the radius of curvature of the first main surface 10a becomes smaller than the radius of curvature of the neutral axis.
  • the position where the radius of curvature is smaller than the neutral axis is inside the bent base film 10 .
  • the coil device 200 can be assembled by using the printed wiring board 100 and bending the base film 10 . Therefore, according to the printed wiring board 100, a coil device whose thickness is partially reduced can be obtained.
  • the coil device 200 since one coil is configured by stacking a plurality of coil portions, the total number of turns of the one coil is increased, and the thrust is improved. From another point of view, the thrust can be maintained or improved even if the width of the wiring is increased in each coil portion to lower the electric resistance value.
  • FIG. 200A A coil device according to the second embodiment will be described.
  • the coil device according to the second embodiment is referred to as a coil device 200A.
  • points different from the coil device 200A will be mainly described, and redundant description will not be repeated.
  • FIG. 5 is a cross-sectional view of the coil device 200A. As shown in FIG. 5, coil device 200A includes printed wiring board 100 and adhesive sheets 71 and 72 .
  • the first wiring 20 does not have the fifth coil portion 24 and the first connecting portion 23, and the second wiring 30 does not have the third coil portion 31.
  • the second wiring 30 has the third connecting portion 36 .
  • the third connection portion 36 extends along the first direction DR1 so as to cross the boundary between the first portion 11 and the second portion 12 in plan view.
  • the portion of the second main surface 10b located in the first portion 11 faces the portion of the second main surface 10b located in the second portion 12, and the first main surface 10b located in the first portion 11
  • the base film 10 is bent so that the portion 10 a faces the portion of the first main surface 10 a located in the third portion 13 .
  • the adhesive sheet 71 disposed between the portion of the protective layer 60 on the first portion 11 and the protective layer 60 on the second portion 12 and the protective layer 50 on the first portion 11 and the portion of the protective layer 50 on the third portion 13 keeps the base film 10 bent as described above.
  • the coil device 200A has an electronic component 81 and an electronic component 82. With the base film 10 bent as described above, the electronic component 81 and the electronic component 82 are arranged between the first portion 11 and the second portion 12 and between the first portion 11 and the third portion 13, respectively. are placed in The electronic component 81 is electrically connected to the lands 37a and 37b arranged on the second main surface 10b, and the electronic component 82 is connected to the lands 28a and 28b arranged on the first main surface 10a. electrically connected.
  • the land 28 a and the land 28 b form part of the first wiring 20
  • the land 37 a and the land 37 b form part of the second wiring 30 .
  • the protective layer 60 and the adhesive sheet 71 are opened to expose the lands 37a and 37b, and the protective layer 50 and the adhesive sheet 71 are opened to expose the lands 28a and 28b.
  • the electronic component 81 and the electronic component 82 can be arranged between the first portion 11 and the second portion 12 and between the first portion 11 and the third portion 13, respectively. And the electronic component 82 can be mounted in a state of being hidden from the outside.
  • 10 base film 10a first main surface, 10b second main surface, 10c through hole, 11 first part, 12 second part, 13 third part, 20 first wiring, 21 first coil part, 22 second coil part, 23 first connection part, 24 fifth coil part, 25 sixth coil part, 26 second connection part, 27a, 27b, 27c, 27d land, 28a, 28b land, 30 second wiring, 31 third coil part , 32 fourth coil portion, 33 seventh coil portion, 34 eighth coil portion, 35a, 35b, 35c, 35d, 35e, 35f, 35g, 35h land, 36 third connection portion, 37a land, 37b land, 41 seed Layer 41a First layer 41b Second layer 42 Electroplated layer 50 Protective layer 51 First layer 52 Second layer 60 Protective layer 61 First layer 62 Second layer 70, 71, 72 Adhesive sheet, 81, 82 electronic components, 100 printed wiring board, 200, 200A coil device, DR1 first direction, DR2 second direction.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
PCT/JP2022/044755 2021-12-27 2022-12-05 プリント配線板及びコイル装置 Ceased WO2023127414A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US18/720,856 US20250071899A1 (en) 2021-12-27 2022-12-05 Printed wiring board and coil device
KR1020247020571A KR20240125583A (ko) 2021-12-27 2022-12-05 프린트 배선판 및 코일 장치
JP2023570765A JPWO2023127414A1 (https=) 2021-12-27 2022-12-05
CN202280086007.2A CN118451791A (zh) 2021-12-27 2022-12-05 印刷布线板及线圈装置

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JP2021-212226 2021-12-27
JP2021212226 2021-12-27

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WO2023127414A1 true WO2023127414A1 (ja) 2023-07-06

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JP (1) JPWO2023127414A1 (https=)
KR (1) KR20240125583A (https=)
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WO2025110630A1 (ko) 2023-11-20 2025-05-30 주식회사 엘지에너지솔루션 구조가 개선된 전지 모듈 및 이를 포함하는 전지 팩

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58124918U (ja) * 1982-02-17 1983-08-25 オリンパス光学工業株式会社 積層形プリントコイル基板
JP2011192710A (ja) * 2010-03-12 2011-09-29 Sumitomo Electric Ind Ltd フレキシブルプリント配線板、トランス、トランスの製造方法
JP2020181852A (ja) * 2019-04-23 2020-11-05 イビデン株式会社 コイル基板の製造方法
JP2021019014A (ja) * 2019-07-17 2021-02-15 イビデン株式会社 コイル部品とトランス

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008121394A1 (en) * 2007-03-29 2008-10-09 Flextronics Ap, Llc Method of producing a multi-turn coil from folded flexible circuitry
JP2019009327A (ja) * 2017-06-27 2019-01-17 イビデン株式会社 コイル

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58124918U (ja) * 1982-02-17 1983-08-25 オリンパス光学工業株式会社 積層形プリントコイル基板
JP2011192710A (ja) * 2010-03-12 2011-09-29 Sumitomo Electric Ind Ltd フレキシブルプリント配線板、トランス、トランスの製造方法
JP2020181852A (ja) * 2019-04-23 2020-11-05 イビデン株式会社 コイル基板の製造方法
JP2021019014A (ja) * 2019-07-17 2021-02-15 イビデン株式会社 コイル部品とトランス

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JPWO2023127414A1 (https=) 2023-07-06
US20250071899A1 (en) 2025-02-27
KR20240125583A (ko) 2024-08-19
CN118451791A (zh) 2024-08-06

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