CN118451791A - 印刷布线板及线圈装置 - Google Patents
印刷布线板及线圈装置 Download PDFInfo
- Publication number
- CN118451791A CN118451791A CN202280086007.2A CN202280086007A CN118451791A CN 118451791 A CN118451791 A CN 118451791A CN 202280086007 A CN202280086007 A CN 202280086007A CN 118451791 A CN118451791 A CN 118451791A
- Authority
- CN
- China
- Prior art keywords
- coil
- coil portion
- base film
- view
- plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/006—Printed inductances flexible printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09272—Layout details of angles or corners
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-212226 | 2021-12-27 | ||
| JP2021212226 | 2021-12-27 | ||
| PCT/JP2022/044755 WO2023127414A1 (ja) | 2021-12-27 | 2022-12-05 | プリント配線板及びコイル装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118451791A true CN118451791A (zh) | 2024-08-06 |
Family
ID=86998599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280086007.2A Pending CN118451791A (zh) | 2021-12-27 | 2022-12-05 | 印刷布线板及线圈装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250071899A1 (https=) |
| JP (1) | JPWO2023127414A1 (https=) |
| KR (1) | KR20240125583A (https=) |
| CN (1) | CN118451791A (https=) |
| TW (1) | TW202335002A (https=) |
| WO (1) | WO2023127414A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025110630A1 (ko) | 2023-11-20 | 2025-05-30 | 주식회사 엘지에너지솔루션 | 구조가 개선된 전지 모듈 및 이를 포함하는 전지 팩 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58124918U (ja) * | 1982-02-17 | 1983-08-25 | オリンパス光学工業株式会社 | 積層形プリントコイル基板 |
| WO2008121394A1 (en) * | 2007-03-29 | 2008-10-09 | Flextronics Ap, Llc | Method of producing a multi-turn coil from folded flexible circuitry |
| JP2011192710A (ja) * | 2010-03-12 | 2011-09-29 | Sumitomo Electric Ind Ltd | フレキシブルプリント配線板、トランス、トランスの製造方法 |
| JP2019009327A (ja) * | 2017-06-27 | 2019-01-17 | イビデン株式会社 | コイル |
| JP2020181852A (ja) | 2019-04-23 | 2020-11-05 | イビデン株式会社 | コイル基板の製造方法 |
| JP2021019014A (ja) * | 2019-07-17 | 2021-02-15 | イビデン株式会社 | コイル部品とトランス |
-
2022
- 2022-12-05 US US18/720,856 patent/US20250071899A1/en active Pending
- 2022-12-05 JP JP2023570765A patent/JPWO2023127414A1/ja active Pending
- 2022-12-05 CN CN202280086007.2A patent/CN118451791A/zh active Pending
- 2022-12-05 KR KR1020247020571A patent/KR20240125583A/ko active Pending
- 2022-12-05 WO PCT/JP2022/044755 patent/WO2023127414A1/ja not_active Ceased
- 2022-12-26 TW TW111149915A patent/TW202335002A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202335002A (zh) | 2023-09-01 |
| JPWO2023127414A1 (https=) | 2023-07-06 |
| US20250071899A1 (en) | 2025-02-27 |
| KR20240125583A (ko) | 2024-08-19 |
| WO2023127414A1 (ja) | 2023-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4929487B2 (ja) | 積層セラミック電子部品 | |
| CN107851503B (zh) | 柔性电感器 | |
| JP5091719B2 (ja) | 配線回路基板 | |
| US20190326047A1 (en) | Common mode choke coil | |
| CN103841772B (zh) | 布线电路基板及其制造方法 | |
| CN105513616A (zh) | 带电路的悬挂基板 | |
| CN118451791A (zh) | 印刷布线板及线圈装置 | |
| JP2006324406A (ja) | フレックスリジッド多層配線板 | |
| JP4790558B2 (ja) | 配線回路基板の製造方法 | |
| CN110225647A (zh) | 带电路的悬挂基板集合体和带电路的悬挂基板集合体的制造方法 | |
| CN207802503U (zh) | 多层基板以及电子设备 | |
| EP3035019A1 (en) | Stator slot temperature sensor and assemblying method of the same | |
| US20210315098A1 (en) | Inductor bridge and electronic device | |
| US10886048B2 (en) | Laminated coil substrate | |
| CN101754580A (zh) | 配线电路基板及其连接构造 | |
| US10136207B2 (en) | Printed circuit board used as voice coil, method for manufacturing the same and loudspeaker with the same | |
| JP7715067B2 (ja) | フラットケーブル | |
| JP7818430B2 (ja) | 積層コイル部品 | |
| CN209299595U (zh) | 部件安装基板 | |
| JP6439384B2 (ja) | コイル部品 | |
| CN101908344B (zh) | 布线电路基板 | |
| WO2025089181A1 (ja) | コイル装置 | |
| JP2022115404A (ja) | 配線回路基板 | |
| JP4645261B2 (ja) | フレキシブルプリント基板 | |
| JP2022115402A (ja) | 配線回路基板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |