WO2023124046A1 - 一种隧穿氧化层、n型双面太阳能晶硅电池及制备方法 - Google Patents
一种隧穿氧化层、n型双面太阳能晶硅电池及制备方法 Download PDFInfo
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- 229910021419 crystalline silicon Inorganic materials 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims abstract description 37
- 230000005641 tunneling Effects 0.000 title claims abstract description 35
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 82
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 68
- 239000010703 silicon Substances 0.000 claims abstract description 67
- 238000000034 method Methods 0.000 claims abstract description 58
- 239000003513 alkali Substances 0.000 claims abstract description 26
- 238000000151 deposition Methods 0.000 claims abstract description 26
- 238000000231 atomic layer deposition Methods 0.000 claims abstract description 23
- 238000000137 annealing Methods 0.000 claims abstract description 19
- 238000002161 passivation Methods 0.000 claims abstract description 19
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 16
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052796 boron Inorganic materials 0.000 claims abstract description 14
- 238000005498 polishing Methods 0.000 claims abstract description 13
- 238000004140 cleaning Methods 0.000 claims abstract description 9
- 238000009792 diffusion process Methods 0.000 claims abstract description 8
- 235000012431 wafers Nutrition 0.000 claims description 55
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 38
- 238000005406 washing Methods 0.000 claims description 26
- 239000001301 oxygen Substances 0.000 claims description 22
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 21
- 230000008021 deposition Effects 0.000 claims description 21
- 229910052760 oxygen Inorganic materials 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims description 14
- 229920005591 polysilicon Polymers 0.000 claims description 14
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 13
- 239000012686 silicon precursor Substances 0.000 claims description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- 229910000077 silane Inorganic materials 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 6
- 230000005684 electric field Effects 0.000 claims description 6
- 235000013842 nitrous oxide Nutrition 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 238000007517 polishing process Methods 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 229910001882 dioxygen Inorganic materials 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 238000005554 pickling Methods 0.000 claims description 4
- 238000010926 purge Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- -1 silver-aluminum Chemical compound 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 21
- 229910052814 silicon oxide Inorganic materials 0.000 abstract description 17
- 230000000903 blocking effect Effects 0.000 abstract description 11
- 239000012535 impurity Substances 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 85
- 239000010408 film Substances 0.000 description 36
- 238000006243 chemical reaction Methods 0.000 description 13
- 239000000243 solution Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000005247 gettering Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910017604 nitric acid Inorganic materials 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical group O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 description 1
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000000746 body region Anatomy 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006388 chemical passivation reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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Abstract
Description
Claims (15)
- 一种隧穿氧化层的制备方法,其特征在于,其包括以下步骤:先在硅片表面形成富余-OH,再采用等离子体增强原子层沉积法,在所述硅片背面沉积形成隧穿氧化层。
- 根据权利要求1所述的隧穿氧化层的制备方法,其特征在于,形成富余-OH的方法为:在硼扩散后的碱抛光工序中,使用NaOH或KOH与H 2O 2配制而成的碱液清洗所述硅片。
- 根据权利要求1所述的隧穿氧化层的制备方法,其特征在于,所述等离子体增强原子层沉积法包括以下步骤:S1、通入硅前驱体,吸附硅片表面的硅原子,吹扫氩气,吹掉多余的硅原子,以在硅片表面保留吸附一层硅原子;S2、通入氧源,并在射频电源产生的电场作用下,在所述硅片表面沉积形成SiO x膜;S3、重复步骤S1~S2,形成所述隧穿氧化层。
- 根据权利要求3所述的隧穿氧化层的制备方法,其特征在于,所述射频电源为40kHz-400kHz的方形波或者正弦波电源。
- 根据权利要求3或4所述的隧穿氧化层的制备方法,其特征在于,所述沉积的温度为80℃-400℃;和/或,所述硅前驱体为有机硅源或硅烷;所述氧源为氧气或笑气。
- 根据权利要求3所述的隧穿氧化层的制备方法,其特征在于,所述SiO x膜的沉积次数为1次-400次;和/或,所述隧穿氧化层的厚度为1nm-2nm。
- 一种N型双面太阳能晶硅电池的制备方法,其特征在于,其包括以下步骤:将N型硅片依次进行清洗制绒、硼扩散、碱抛光;在碱抛光后的N型硅片的正面依次形成P型掺杂层、钝化层、减反射层;在碱抛光后的N型硅片的背面先采用如权利要求1至6中任一项所述的隧穿氧化层的制备方法形成隧穿氧化层,再形成N型掺杂多晶硅层,进行退火,清洗后,形成减反射层。
- 根据权利要求7所述的N型双面太阳能晶硅电池的制备方法,其特征在于,所述方法还包括:在正面的减反射层上形成正面电极,在背面的减反射层上形成背面电极。
- 根据权利要求7或8所述的N型双面太阳能晶硅电池的制备方法,其特征在于,所述退火的温度为850℃-1100℃。
- 根据权利要求7至9中任一项所述的N型双面太阳能晶硅电池的制备方法,其特征在于,所述碱抛光的方法包括依次进行预清洗、水洗、刻蚀、水洗、碱洗、水洗、酸洗和水洗,其中碱洗采用NaOH或KOH与H 2O 2按照体积比1:9-10配制而成的碱液,碱洗 温度为45°-55°。
- 根据权利要求7至10中任一项所述的N型双面太阳能晶硅电池的制备方法,其特征在于,在所述P型掺杂层的正面利用等离子体原子层沉积PEALD方式制备氧化铝钝化层,其中,射频电源为40kHz,沉积的温度为430℃。
- 根据权利要求11所述的N型双面太阳能晶硅电池的制备方法,其特征在于,在所述氧化铝钝化层正面利用等离子体气相沉积法PECVD沉积含有多层不同折射率的含氮化硅的减反射层。
- 根据权利要求7至11所述的N型双面太阳能晶硅电池的制备方法,其特征在于,在所述N型掺杂多晶硅层的背面制备含氮化硅的减反射层。
- 根据权利要求8所述的N型双面太阳能晶硅电池的制备方法,其特征在于,通过印刷银铝浆来在正面的减反射层上形成正面电极,以及通过印刷银浆来在背面的减反射层上形成背面电极。
- 一种N型双面太阳能晶硅电池,其特征在于,其包括N型硅片,以及依次叠加位于所述N型硅片正面的P型掺杂层、钝化层、减反射层,依次叠加于所述N型硅片背面的隧穿氧化层、N型掺杂多晶硅层和减反射层,所述隧穿氧化层按照根据权利要求1至6中任一项所述的隧穿氧化层的制备方法形成。
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Publication number | Priority date | Publication date | Assignee | Title |
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CN116741892A (zh) * | 2023-08-16 | 2023-09-12 | 常州亿晶光电科技有限公司 | 一种硼掺杂选择性发射极电池的制备方法 |
CN117199186A (zh) * | 2023-09-27 | 2023-12-08 | 淮安捷泰新能源科技有限公司 | 一种N-TOPCon电池的制作方法 |
CN117476817A (zh) * | 2023-12-28 | 2024-01-30 | 无锡松煜科技有限公司 | 具有低电子-空穴复合率的叠层钝化结构的制备方法 |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080305646A1 (en) * | 2007-06-08 | 2008-12-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Atomic layer deposition |
CN102487004A (zh) * | 2010-12-01 | 2012-06-06 | 中芯国际集成电路制造(上海)有限公司 | 利用化学气相淀积填充隔离槽的方法 |
CN105322047A (zh) * | 2014-05-28 | 2016-02-10 | 茂迪股份有限公司 | 太阳能电池的制造方法 |
CN107527806A (zh) * | 2017-09-29 | 2017-12-29 | 睿力集成电路有限公司 | 介电薄膜、介电层结构及制作方法 |
CN110205608A (zh) * | 2019-07-09 | 2019-09-06 | 深圳扑浪创新科技有限公司 | 一种光致发光的纳米材料薄膜边缘的保护方法 |
CN112928061A (zh) * | 2019-12-05 | 2021-06-08 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
CN214176054U (zh) * | 2020-12-25 | 2021-09-10 | 湖南红太阳光电科技有限公司 | 一种制备氧化硅和掺杂多晶硅的一体式设备 |
CN114373831A (zh) * | 2021-12-30 | 2022-04-19 | 通威太阳能(眉山)有限公司 | 一种隧穿氧化层、n型双面太阳能晶硅电池及制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009200360A (ja) * | 2008-02-22 | 2009-09-03 | Tkx:Kk | シリコン部材の表面処理方法 |
-
2021
- 2021-12-30 CN CN202111650174.9A patent/CN114373831A/zh active Pending
-
2022
- 2022-07-27 AU AU2022424722A patent/AU2022424722A1/en active Pending
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- 2022-07-27 EP EP22908852.1A patent/EP4254517A1/en active Pending
- 2022-07-27 US US18/548,380 patent/US20240145610A1/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080305646A1 (en) * | 2007-06-08 | 2008-12-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Atomic layer deposition |
CN102487004A (zh) * | 2010-12-01 | 2012-06-06 | 中芯国际集成电路制造(上海)有限公司 | 利用化学气相淀积填充隔离槽的方法 |
CN105322047A (zh) * | 2014-05-28 | 2016-02-10 | 茂迪股份有限公司 | 太阳能电池的制造方法 |
CN107527806A (zh) * | 2017-09-29 | 2017-12-29 | 睿力集成电路有限公司 | 介电薄膜、介电层结构及制作方法 |
CN110205608A (zh) * | 2019-07-09 | 2019-09-06 | 深圳扑浪创新科技有限公司 | 一种光致发光的纳米材料薄膜边缘的保护方法 |
CN112928061A (zh) * | 2019-12-05 | 2021-06-08 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
CN214176054U (zh) * | 2020-12-25 | 2021-09-10 | 湖南红太阳光电科技有限公司 | 一种制备氧化硅和掺杂多晶硅的一体式设备 |
CN114373831A (zh) * | 2021-12-30 | 2022-04-19 | 通威太阳能(眉山)有限公司 | 一种隧穿氧化层、n型双面太阳能晶硅电池及制备方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116741892A (zh) * | 2023-08-16 | 2023-09-12 | 常州亿晶光电科技有限公司 | 一种硼掺杂选择性发射极电池的制备方法 |
CN116741892B (zh) * | 2023-08-16 | 2023-11-07 | 常州亿晶光电科技有限公司 | 一种硼掺杂选择性发射极电池的制备方法 |
CN117199186A (zh) * | 2023-09-27 | 2023-12-08 | 淮安捷泰新能源科技有限公司 | 一种N-TOPCon电池的制作方法 |
CN117476817A (zh) * | 2023-12-28 | 2024-01-30 | 无锡松煜科技有限公司 | 具有低电子-空穴复合率的叠层钝化结构的制备方法 |
CN117476817B (zh) * | 2023-12-28 | 2024-03-29 | 无锡松煜科技有限公司 | 具有低电子-空穴复合率的叠层钝化结构的制备方法 |
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