WO2023112925A1 - 紫外線硬化性シリコーン組成物 - Google Patents
紫外線硬化性シリコーン組成物 Download PDFInfo
- Publication number
- WO2023112925A1 WO2023112925A1 PCT/JP2022/045907 JP2022045907W WO2023112925A1 WO 2023112925 A1 WO2023112925 A1 WO 2023112925A1 JP 2022045907 W JP2022045907 W JP 2022045907W WO 2023112925 A1 WO2023112925 A1 WO 2023112925A1
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- WIPO (PCT)
- Prior art keywords
- component
- curable silicone
- silicone composition
- group
- alkenyl group
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 112
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 70
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 68
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 27
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 21
- 239000003054 catalyst Substances 0.000 claims abstract description 19
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 34
- -1 cyclic diene compound Chemical class 0.000 claims description 26
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 22
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 15
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000003566 sealing material Substances 0.000 claims description 8
- 125000006736 (C6-C20) aryl group Chemical group 0.000 claims description 6
- 239000008393 encapsulating agent Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000003446 ligand Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 238000003848 UV Light-Curing Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 150000003057 platinum Chemical class 0.000 claims 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 abstract description 2
- 125000004429 atom Chemical group 0.000 abstract 1
- 238000003860 storage Methods 0.000 description 25
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 19
- 238000001879 gelation Methods 0.000 description 11
- 125000001183 hydrocarbyl group Chemical group 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 230000032683 aging Effects 0.000 description 10
- 238000007259 addition reaction Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000002156 mixing Methods 0.000 description 7
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 7
- 125000004122 cyclic group Chemical group 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000005481 NMR spectroscopy Methods 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 125000000962 organic group Chemical group 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 125000000882 C2-C6 alkenyl group Chemical group 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229910052681 coesite Inorganic materials 0.000 description 4
- 229910052906 cristobalite Inorganic materials 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 229910052682 stishovite Inorganic materials 0.000 description 4
- 229910052905 tridymite Inorganic materials 0.000 description 4
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000006376 (C3-C10) cycloalkyl group Chemical group 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 2
- 125000003601 C2-C6 alkynyl group Chemical group 0.000 description 2
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 238000006459 hydrosilylation reaction Methods 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000004975 3-butenyl group Chemical group C(CC=C)* 0.000 description 1
- 125000006043 5-hexenyl group Chemical group 0.000 description 1
- OAMPHQJBPJRVOS-UHFFFAOYSA-N C1(C=CC=C1)CC(=O)[Pt](C)C Chemical compound C1(C=CC=C1)CC(=O)[Pt](C)C OAMPHQJBPJRVOS-UHFFFAOYSA-N 0.000 description 1
- VEQBYDJGCMGZIQ-UHFFFAOYSA-N C1(C=CC=C1)CC[Pt](C)C Chemical compound C1(C=CC=C1)CC[Pt](C)C VEQBYDJGCMGZIQ-UHFFFAOYSA-N 0.000 description 1
- IRRUJIXHAWFBGN-UHFFFAOYSA-N C1(C=CC=C1)[Pt](C)C Chemical compound C1(C=CC=C1)[Pt](C)C IRRUJIXHAWFBGN-UHFFFAOYSA-N 0.000 description 1
- KMPMRMCJBLYQOK-UHFFFAOYSA-N C1CC=C(CCC=C1)[Pt](c1ccccc1)c1ccccc1 Chemical compound C1CC=C(CCC=C1)[Pt](c1ccccc1)c1ccccc1 KMPMRMCJBLYQOK-UHFFFAOYSA-N 0.000 description 1
- 125000001313 C5-C10 heteroaryl group Chemical group 0.000 description 1
- URHURAUXXZJQAP-UHFFFAOYSA-N C=1C=CC=CC=1[Pt]C1=CC=CC=C1 Chemical compound C=1C=CC=CC=1[Pt]C1=CC=CC=C1 URHURAUXXZJQAP-UHFFFAOYSA-N 0.000 description 1
- OYQCSYKOPBBKFX-UHFFFAOYSA-N CC1(C=CC=C1)[Pt](CC)CC Chemical compound CC1(C=CC=C1)[Pt](CC)CC OYQCSYKOPBBKFX-UHFFFAOYSA-N 0.000 description 1
- UHBJJUVTDNUPOC-UHFFFAOYSA-N CC1(C=CC=C1)[Pt](CCCCCC)(CCCCCC)CCCCCC Chemical compound CC1(C=CC=C1)[Pt](CCCCCC)(CCCCCC)CCCCCC UHBJJUVTDNUPOC-UHFFFAOYSA-N 0.000 description 1
- NFWSDWFQFNAYNJ-UHFFFAOYSA-N CC1=C(C(C=C1)([SiH2]C1=CC=CC=C1)[Pt](C1=CC=CC=C1)(C1=CC=CC=C1)C1=CC=CC=C1)C Chemical compound CC1=C(C(C=C1)([SiH2]C1=CC=CC=C1)[Pt](C1=CC=CC=C1)(C1=CC=CC=C1)C1=CC=CC=C1)C NFWSDWFQFNAYNJ-UHFFFAOYSA-N 0.000 description 1
- MFOSYVSTRIDTFC-UHFFFAOYSA-N CCC[Pt](CCC)C1=CCCC=CCC1 Chemical compound CCC[Pt](CCC)C1=CCCC=CCC1 MFOSYVSTRIDTFC-UHFFFAOYSA-N 0.000 description 1
- JENQHJHCTBJYFC-UHFFFAOYSA-N CC[Pt](CC)C1=C(C)CCC=CCC1 Chemical compound CC[Pt](CC)C1=C(C)CCC=CCC1 JENQHJHCTBJYFC-UHFFFAOYSA-N 0.000 description 1
- FALJXSPLMPMHEL-UHFFFAOYSA-N C[Pt](C)C Chemical compound C[Pt](C)C FALJXSPLMPMHEL-UHFFFAOYSA-N 0.000 description 1
- YGBYJRVGNBVTCQ-UHFFFAOYSA-N C[Pt](C)C.[CH]1C=CC=C1 Chemical compound C[Pt](C)C.[CH]1C=CC=C1 YGBYJRVGNBVTCQ-UHFFFAOYSA-N 0.000 description 1
- XILIQYZLOIYIGT-UHFFFAOYSA-N C[Pt]C Chemical compound C[Pt]C XILIQYZLOIYIGT-UHFFFAOYSA-N 0.000 description 1
- XZXJVONANSQPKV-UHFFFAOYSA-N C[Si](C)(C)C1(C=CC=C1)[Pt](C)(C)C Chemical compound C[Si](C)(C)C1(C=CC=C1)[Pt](C)(C)C XZXJVONANSQPKV-UHFFFAOYSA-N 0.000 description 1
- PSDAMADHWAVTIU-UHFFFAOYSA-N C[Si](C)(C)C1(C=CC=C1)[Pt](C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound C[Si](C)(C)C1(C=CC=C1)[Pt](C1=CC=CC=C1)C1=CC=CC=C1 PSDAMADHWAVTIU-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- WNCWUCSNEKCAAI-UHFFFAOYSA-N carbanide;2-methylcyclopenta-1,3-diene;platinum(4+) Chemical compound [CH3-].[CH3-].[CH3-].[Pt+4].CC1=[C-]CC=C1 WNCWUCSNEKCAAI-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000005708 carbonyloxy group Chemical group [*:2]OC([*:1])=O 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Definitions
- the present invention relates to an ultraviolet-curable silicone composition, and more particularly to an ultraviolet-curable silicone composition whose cured product can be suitably used as a sealing material for electronic parts, optical parts, bonding materials, and the like. .
- Silicone compositions are used as electrical insulation sealing materials and the like because they are excellent in heat resistance and can provide good adhesion and adhesiveness to these parts.
- UV-curable addition-reactive silicone compositions that utilize hydrosilylation are widely used because they are excellent in productivity because they are cured by UV irradiation for a short period of time, and they can adhere members to each other satisfactorily. .
- Patent Document 1 discloses (A) an organopolysiloxane having an average of 0.1 or more silicon-bonded alkenyl groups per molecule; Organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms; and (C) a photoactive platinum complex curing catalyst in a predetermined ratio, containing UV curable damping material for objective lens driving device
- Organopolysiloxane gel compositions are disclosed which demonstrate that certain polymer design advantages can be combined with rapid curing upon UV irradiation.
- Patent Document 2 (A) an organopolysiloxane having a viscosity at 25° C. of 50 to 100,000 mPa s and containing at least two alkenyl groups in one molecule; Organohydrogenpolysiloxane such as linear organohydrogenpolysiloxane having hydrogen atoms (Si—H groups) only at both ends of the molecular chain; and (C) one or more kinds of light selected from a specific group of compounds Disclosed is an ultraviolet curable liquid silicone composition for an image display device, which contains an active hydrosilylation reaction catalyst in a predetermined proportion and has a predetermined viscosity, and can be used under mild temperature conditions of 100° C. or less for several minutes to several tens of minutes. It has been shown that curing is possible at , and that a cured product having good mechanical and optical properties is obtained.
- Organohydrogenpolysiloxane such as linear organohydrogenpolysiloxane having hydrogen atoms (Si—
- the UV-curable silicone compositions disclosed in Patent Documents 1 and 2 cure by irradiation with UV rays and exhibit predetermined mechanical and optical properties.
- the viscosity of the composition increases, the curability of the composition fluctuates, and the quality of the cured product is unstable.
- a two-pack composition is also used.
- the composition containing a photoactive curing catalyst which is one of the two agents, shows changes in viscosity and curability over time, and a two-part ultraviolet curing with improved storage stability.
- An object of the present invention is to provide an ultraviolet curable silicone composition with excellent curability and storage stability.
- the present inventors focused on alkenyl group-containing polyorganosiloxanes and polyorganohydrogensiloxanes constituting ultraviolet-curable silicone compositions, and as a result of intensive research, the polyorganosiloxanes It has been found that the storage stability of the composition can be improved without impairing the curability by keeping the alkenyl group content in the siloxane within a predetermined range and using a predetermined polyorganohydrogensiloxane, leading to the present invention. rice field.
- the present invention relates to the following [1] to [9].
- [1] (A) a polyorganosiloxane having at least one alkenyl group per molecule and an average alkenyl group content of 0.3 mmol/g or less; (B) at least three per molecule a polyorganohydrogensiloxane having hydrogen atoms bonded to silicon atoms; and (C) a platinum-based catalyst activated by ultraviolet light.
- Component (B) is (B1) R c1 2 HSiO 1/2 units (wherein R c1 is independently a C 1 -C 6 alkyl group or a C 6 -C 20 aryl group) and a polyorganohydrogensiloxane containing SiO 4/2 units.
- component (B1) is a polyorganohydrogensiloxane to which 3 to 6 SiO 4/2 units and 6 to 12 R c1 2 HSiO 1/2 units are bonded;
- a UV curable silicone composition as described.
- an ultraviolet curable silicone composition with excellent curability and storage stability is provided.
- the UV-curable silicone composition comprises (A) a polyorganosiloxane having at least one alkenyl group per molecule and an average alkenyl group content of 0.3 mmol/g or less; (B) 1 molecule a polyorganohydrogensiloxane having at least three silicon-bonded hydrogen atoms therein; and (C) a platinum-based catalyst activated by ultraviolet light.
- the average alkenyl group content of component (A) is 0.3 mmol/g or less, and (B) polyorganohydrogensiloxane having at least 3 silicon-bonded hydrogen atoms per molecule is used.
- organic group means a group containing carbon.
- n-valent the valency of the organic group is indicated by the description "n-valent", where n is any natural number.
- a “monovalent organic group” means a carbon-containing group having only one bond. A bond may be possessed by an element other than carbon. Even if the valence is not explicitly stated, the appropriate valence can be ascertained by those skilled in the art from the context.
- hydrocarbon group means a group containing carbon and hydrogen from which at least one hydrogen atom has been removed from the molecule.
- Such hydrocarbon groups are not particularly limited, but examples of hydrocarbon groups that may be substituted with one or more substituents include hydrocarbon groups having 1 to 20 carbon atoms, such as An aliphatic hydrocarbon group, an aromatic hydrocarbon group, etc. are mentioned.
- the above “aliphatic hydrocarbon group” may be linear, branched or cyclic, and may be saturated or unsaturated. Hydrocarbon groups may also contain one or more ring structures.
- Such a hydrocarbon group has one or more nitrogen atom (N), oxygen atom (O), sulfur atom (S), silicon atom (Si), amide bond, sulfonyl It may have a heteroatom or a structure containing a heteroatom such as a bond, a siloxane bond, a carbonyl group, or a carbonyloxy group.
- the substituents of the "hydrocarbon group” are not particularly limited, but include, for example, a halogen atom; C 1-6 alkyl optionally substituted by one or more halogen atoms group, C 2-6 alkenyl group, C 2-6 alkynyl group, C 3-10 cycloalkyl group, C 3-10 unsaturated cycloalkyl group, 5-10 membered heterocyclyl group, 5-10 membered unsaturated heterocyclyl groups, C 6-10 aryl groups and 5-10 membered heteroaryl groups.
- alkyl groups and phenyl groups can be unsubstituted or substituted unless otherwise specified.
- Substituents for such groups are not particularly limited, but for example, one or more groups selected from halogen atoms, C 1-6 alkyl groups, C 2-6 alkenyl groups and C 2-6 alkynyl groups mentioned.
- a siloxane compound is constructed by combining the structural units described above, and may be substituted with other groups such as halogens such as fluorine and hydrocarbon groups such as phenyl groups for the methyl groups of the above structural units.
- DH 20 D 20 it does not mean that 20 DH units are followed by 20 D units, and each unit may be arranged in any desired arrangement. It is understood.
- a siloxane compound can have various three-dimensional structures depending on the T unit or the Q unit.
- Component (A) is a polyorganosiloxane having at least one alkenyl group per molecule and an average alkenyl group content of 0.3 mmol/g or less.
- Component (A) functions as a base polymer for the UV-curable silicone composition.
- the alkenyl group may be attached to the terminal of the molecular main chain, to a side chain in the middle of the molecular chain, or to both.
- molecular backbone refers to the longest relatively connecting chain in the molecule.
- the molecular structure of component (A) is not particularly limited as long as the siloxane bond is the main skeleton, and may be linear, branched, cyclic or three-dimensional network, and the siloxane skeleton is divalent. may be interrupted by an organic group of Component (A) may be used alone or in combination of two or more.
- Component (A) has at least one alkenyl group in one molecule.
- Component (A) can be a mixture of polyorganosiloxanes having at least one alkenyl group per molecule.
- component (A) can be a mixture of a polyorganosiloxane having one alkenyl group per molecule and a polyorganosiloxane having two or more alkenyl groups per molecule.
- the component (A) is polyorganosiloxane having two or more alkenyl groups per molecule with respect to 100% by mass of the component (A).
- component (A) preferably contains 30% by mass or more, more preferably 50% by mass or more, and even more preferably 80% by mass or more.
- the upper limit of the content of polyorganosiloxane having two or more alkenyl groups in one molecule is 100% by mass based on 100% by mass of component (A).
- component (A) preferably contains a polyorganosiloxane having two alkenyl groups in one molecule. , more preferably a linear polyorganosiloxane having one alkenyl group at each end of the molecular main chain.
- component (A) preferably contains 30% by mass or more, preferably 50% by mass or more, of a polyorganosiloxane having two alkenyl groups in one molecule with respect to 100% by mass of component (A). is more preferable, and it is even more preferable to contain 80% by mass or more.
- the upper limit of the content of polyorganosiloxane having two alkenyl groups in one molecule is 100% by mass based on 100% by mass of component (A).
- the alkenyl group content of component (A) is 0.3 mmol/g or less on average. By setting the alkenyl group content within the above range, it is possible to obtain an ultraviolet curable silicone composition having both excellent curability and storage stability.
- component (A) is a mixture of multiple polyorganosiloxanes having at least one alkenyl group in one molecule
- the alkenyl group content of component (A) is the average value of the mixture.
- the alkenyl group content of component (A) is determined by 1 H NMR measurement, and from the peak areas of CH 2 ⁇ CH— and CH 3 — groups, the molar ratio of CH 2 ⁇ CH— and CH 3 — groups is obtained.
- the alkenyl group content of the component (A) is preferably measured as described above, but the alkenyl group content of each polyorganosiloxane and the mixture thereof
- the average value calculated by summing the values obtained by multiplying the respective alkenyl group contents by the mixing ratio may be used as the alkenyl group content of the component (A).
- the alkenyl group content of component (A) is preferably 0.001 to 0.3 mmol/g on average, more preferably 0.003 to 0.24 mmol/g. is more preferably 0.010 to 0.20 mmol/g, and even more preferably 0.025 to 0.10 mmol/g.
- the alkenyl group is not particularly limited as long as it has a carbon-carbon double bond and is capable of addition reaction.
- the alkenyl group preferably has 2 to 20 carbon atoms, more preferably 2 to 8 carbon atoms, and even more preferably 2 to 6 carbon atoms.
- Alkenyl groups may have a branched structure or a ring structure.
- the position of the carbon-carbon double bond in the hydrocarbon constituting the alkenyl group can be any position. From the viewpoint of reactivity, the carbon-carbon double bond is preferably at the end of the group.
- a preferred example of the alkenyl group is a vinyl group, since it facilitates the synthesis of polyorganosiloxane. That is, it is preferable that the alkenyl group in the component (A) is a vinyl group and the content of the vinyl group is 0.001 to 0.3 mmol/g on average.
- component (A) has at least one alkenyl group bonded to a silicon atom in one molecule.
- Component (A) forms a network structure through an addition reaction with hydrosilyl groups (Si—H groups) of component (B), which will be described later.
- Component (A) is typically represented by general formula (1): R 1 m R 2 n SiO (4-mn)/2 (1) (In the formula, R 1 is an unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturation; R 2 is an alkenyl group; m is an integer from 0 to 2; n is an integer of 1-3, provided that m+n is 1-3. ) It has at least one alkenyl group-containing siloxane unit represented by in the molecule.
- R 1 is an unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturation.
- R 1 is specifically an alkyl group, such as a C 1 -C 6 alkyl group (eg, methyl, ethyl, propyl, etc.); a cycloalkyl group, such as a C 3 -C 10 cycloalkyl group (eg, cyclohexyl, etc.); aryl groups, such as C 6 -C 20 aryl groups (eg, phenyl, tolyl, xylyl, naphthyl, anthracenyl, etc.); aralkyl groups, such as C 7 -C 13 aralkyl groups (eg, 2-phenylethyl, 2-phenylpropyl etc.); substituted hydrocarbon groups such as halogen-substituted hydrocarbon groups (eg, chloromethyl, chlorophenyl, 3,3,3-trifluoropropy
- alkyl group is preferred from the viewpoint of ease of synthesis, etc. Among them, methyl, ethyl and propyl are preferred, and methyl is more preferred.
- an aryl group can be used in combination, and among them, phenyl is preferable from the viewpoint of ease of synthesis and the like.
- component (A) may contain a linear polyorganosiloxane having one alkenyl group at each end of the molecular main chain.
- the linear polyorganosiloxane has, for example, formula (I): (In the formula, R a1 is independently a C 2 -C 6 alkenyl group, R b1 is independently a C 1 -C 6 alkyl group or a C 6 -C 20 aryl group; n1 is a number that makes the average alkenyl group content of linear polyorganosiloxane 0.3 mmol/g or less).
- C 2 -C 6 alkenyl groups include, for example, vinyl groups, allyl groups, 3-butenyl groups, 5-hexenyl groups, and the like.
- Examples of C 1 -C 6 alkyl groups include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group and the like.
- C 6 -C 20 aryl groups include, for example, phenyl groups, naphthyl groups, anthracenyl groups, and the like.
- R a1 is preferably a vinyl group because it is easy to synthesize and does not impair the fluidity of the composition before curing and the heat resistance of the cured product.
- R b1 is preferably a C 1 -C 6 alkyl group, particularly preferably a methyl group, from the viewpoints of ease of synthesis and excellent balance of fluidity of the composition, mechanical strength of the cured product, and the like. Therefore, the component (A) is preferably a polymethylvinylsiloxane whose both ends are closed with dimethylvinylsiloxane units and whose middle unit is a dimethylsiloxane unit.
- the content of polymethylvinylsiloxane whose both ends are blocked with dimethylvinylsiloxane units and whose middle unit is composed of dimethylsiloxane units, in 100% by mass of component (A) is preferably 30% by mass or more, and 50% by mass. % or more, and more preferably 80 mass % or more.
- the upper limit of the content is 100% by mass.
- Component (A) is a mixture of polymethylvinylsiloxane whose both ends are blocked with dimethylvinylsiloxane units and whose intermediate units are composed of dimethylsiloxane units, and other linear, branched or cyclic alkenyl group-containing polyorganosiloxanes. It may be a mixture.
- the alkenyl group in component (A) is a vinyl group
- the vinyl group content is 0.001 to 0.3 mmol/g.
- the vinyl group content of component (A) is preferably 0.001 to 0.3 mmol/g on average, and preferably 0.003 to 0.24 mmol/g. g, more preferably 0.010 to 0.20 mmol/g, even more preferably 0.025 to 0.10 mmol/g.
- component (A) component can be used commercially available. Polyorganosiloxane into which alkenyl groups have been introduced by a known reaction may also be used. Component (A) may be classified according to the position or type of substituent, the degree of polymerization, etc., and may be used as a single compound or as a mixture of two or more compounds. Since component (A) is polyorganosiloxane, it may be a mixture of polyorganosiloxanes with various degrees of polymerization.
- the amount of component (A) to be blended is preferably 70.0 to 99.8% by mass based on 100% by mass of the UV-curable silicone composition. , more preferably 80.0 to 99.7% by mass, more preferably 90.0 to 99.7% by mass.
- Component (B) is a polyorganohydrogensiloxane having at least three silicon-bonded hydrogen atoms per molecule.
- Component (B) functions as a cross-linking agent and forms a network structure through an addition reaction with the alkenyl group of component (A).
- Component (B) has excellent curability of the composition compared to polyorganohydrogensiloxane having two silicon-bonded hydrogen atoms in one molecule, and can form a network structure with component (A). Even when using a polyorganosiloxane having a low alkenyl group content, such as component (A), it is possible to obtain a composition having excellent curability and mechanical properties of the cured product while maintaining storage stability. can.
- the hydrogen atom of component (B) may be bonded to the silicon atom at the end of the molecular chain, to the silicon atom in the middle of the molecular chain, or to both.
- the molecular structure of component (B) is not particularly limited as long as the siloxane bond is the main skeleton, and may be linear, branched, cyclic or three-dimensional network, and the siloxane skeleton is divalent. may be interrupted by an organic group of
- the component (B) may have a silicon-bonded hydroxyl group or an alkoxy group such as a methoxy group or an ethoxy group.
- Component (B) may be used alone or in combination of two or more.
- Component (B) is typically represented by general formula (2): R 3 p H q SiO (4-pq)/2 (2) (In the formula, R 3 is an unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturation; p is an integer from 0 to 2; q is an integer of 1-3, provided that p+q is 1-3. ) It has at least three siloxane units containing hydrogen atoms bonded to silicon atoms represented by in the molecule. Examples of R 3 include those similar to those of R 1 in formula (1), and preferred embodiments are also the same. Component (B) preferably contains 3 to 100, more preferably 5 to 50, silicon-bonded hydrogen atoms per molecule.
- the content of hydrogen atoms bonded to silicon atoms in component (B) is preferably 5.5 mmol/g or more on average. It is more preferably 0 to 12.0 mmol/g, still more preferably 7.0 to 11.0 mmol/g, and particularly preferably 8.0 to 11.0 mmol/g.
- the component (B) contains (B1) R c1 2 HSiO 1/2 units (wherein R c1 is independently a C 1 -C 6 alkyl or C 6 -C 20 aryl groups) and SiO 4/2 units.
- R c1 is independently a C 1 -C 6 alkyl or C 6 -C 20 aryl groups
- SiO 4/2 units SiO 4/2 units.
- the component (B1) may have a branched structure, a cyclic structure, or a three-dimensional network structure (a structure in which SiO 4/2 units are densely packed).
- R c1 is preferably a C 1 -C 6 alkyl group, particularly preferably methyl, from the viewpoint of ease of synthesis and the like.
- the component (B1) is preferably a polyorganohydrogensiloxane having 3 to 6 SiO 4/2 units and 6 to 12 R c1 2 HSiO 1/2 units bonded; R c1 2 HSiO 1/2 ] 6 [SiO 4/2 ] 3 , [R c1 2 HSiO 1/2 ] 8 [SiO 4/2 ] 4 , [R c1 2 HSiO 1/2 ] 10 [SiO 4/2 ] 5 , [R c1 2 HSiO 1/2 ] 12 [SiO 4/2 ] 6 , 3 to 6 SiO 4/2 units form a cyclic siloxane skeleton, and each SiO 4/2 unit has 2 Particularly preferred are cyclic polyorganohydrogensiloxanes having R c1 2 HSiO 1/2 units attached.
- the content of component (B1) relative to 100% by mass of component (B) is preferably 50% by mass or more, and preferably 70% by mass or more. More preferably, it is 90% by mass or more.
- the upper limit of the content of component (B1) relative to 100% by mass of component (B) is 100% by mass.
- the viscosity of component (B) at 23°C is preferably 1 to 100 mPa ⁇ s, more preferably 1 to 50 mPa ⁇ s. Viscosity was measured using a rotational viscometer according to JIS K 6249, No. Values measured under the conditions of 1 or 2 rotors, 60 rps, and 23°C.
- component (B) component can be used commercially available.
- the component (B) can also be synthesized by known reactions.
- Component (B) may be classified according to the position or type of the substituent, the degree of polymerization, etc., and may be used as a single compound or as a mixture of two or more compounds. Since component (B) is a polyorganohydrogensiloxane, it may be a mixture of polyorganohydrogensiloxanes with various degrees of polymerization.
- component (B) should contain 0.6 to 2 silicon-bonded hydrogen atoms per 1 mol of alkenyl groups in component (A). It is preferably blended in the range of 2 mol, more preferably in the range of 0.8 to 1.8 mol, further preferably in the range of 1.0 to 1.6 mol. A range of 2 to 1.4 mol is particularly preferred.
- Component (C) is a catalyst that is activated by ultraviolet rays to promote the addition reaction between the alkenyl groups of component (A) and the hydrosilyl groups (Si—H groups) of component (B).
- the component (C) is preferably a platinum-based catalyst having a cyclic diene compound as a ligand.
- Component (C) may be used alone or in combination of two or more.
- Platinum-based catalysts having a cyclic diene compound as a ligand include (1,5-cyclooctadienyl) diphenyl platinum complex, (1,5-cyclooctadienyl) dipropyl platinum complex, (2,5-norboradiene) Dimethyl platinum complex, (2,5-norboradiene) diphenyl platinum complex, (cyclopentadienyl) dimethyl platinum complex, (methylcyclopentadienyl) diethyl platinum complex, (trimethylsilylcyclopentadienyl) diphenyl platinum complex, (methylcyclo octa-1,5-dienyl)diethylplatinum complex, (cyclopentadienyl)trimethylplatinum complex, (cyclopentadienyl)ethyldimethylplatinum complex, (cyclopentadienyl)acetyldimethylplatinum complex, (methylcyclopentadienyl)
- the amount of component (C) is preferably an amount of 0.1 to 500 ppm as platinum metal mass, and an amount of 1 to 100 ppm, based on the total mass of components (A) and (B). more preferably 3 to 70 ppm, and particularly preferably 5 to 20 ppm. If the amount of component (C) is less than 0.1 ppm, the addition reaction due to UV irradiation may be slowed down or may not cure. Yellowing of the product is likely to occur, resulting in high cost.
- the UV-curable silicone composition may contain other ingredients as long as they do not impair the purpose and effect of the composition.
- Other components include flame retardants, adhesion agents, heat resistance agents, diluents, thixotropic agents such as fumed silica, inorganic or organic pigments, inhibitors of addition reaction curing catalysts, and resins other than polyorganosiloxane. etc. can be appropriately blended.
- the UV-curable silicone composition also contains polyorganosiloxanes other than component (A), such as alkenyl-free polyorganosiloxanes; and polyorganohydrogensiloxanes other than component (B), such as 2 polyorganohydrogensiloxane having silicon-bonded hydrogen atoms up to 1; an addition reaction curing catalyst other than component (C), for example, an addition reaction curing catalyst that is activated by heating;
- component (A) such as alkenyl-free polyorganosiloxanes
- component (B) such as 2 polyorganohydrogensiloxane having silicon-bonded hydrogen atoms up to 1
- an addition reaction curing catalyst other than component (C) for example, an addition reaction curing catalyst that is activated by heating
- Other components may be used alone or in combination of two or more.
- the UV-curable silicone composition may be a one-component composition containing all components (A) to (C); and (C) component in separate containers, respectively.
- the first agent contains components (A) and (C) and does not contain component (B); the second agent contains component (B) and does not contain component (C). preferably not included.
- the second agent may contain the (A) component.
- the first part and the second part are mixed at the time of use to prepare an ultraviolet curable silicone composition.
- component (A) in order to focus only on the influence of the interaction between the alkenyl group of component (A) and component (C) on storage stability, the first agent consisting of only components (A) and (C) and , and the second agent consisting only of the component (B), the aging treatment was performed only on the first agent and evaluated.
- component (A) also improves the storage stability of a one-liquid composition that further contains component (B) in addition to component (A) and component (C).
- a one-liquid UV-curable silicone composition can be obtained by mixing components (A) to (C) and, if necessary, other components in a mixer such as a planetary mixer. At the time of mixing, if necessary, the mixture may be mixed while being heated in the range of 50 to 150°C.
- a mixer such as a planetary mixer.
- the UV curable silicone composition contains powder, it is preferred to perform the kneading operation under high shear for a uniform finish.
- a kneading device there are a three-roll mill, a colloid mill, a sand grinder, etc. Among them, a method using three rolls is preferable.
- the first and second agents are prepared separately.
- the first agent can be obtained by mixing the components (A), (C) and, if necessary, other components with a mixer such as a planetary mixer.
- the second agent can be obtained by mixing the component (B) and, if necessary, the component (A) and other components with a mixer such as a planetary mixer. At the time of mixing, if necessary, the mixture may be mixed while being heated in the range of 50 to 150°C.
- the first agent and/or the second agent contain powder, it is preferable to carry out a kneading operation in the same manner as the one-liquid UV-curable silicone composition.
- the UV-curable silicone composition preferably has a viscosity at 23°C of 100,000 mPa ⁇ s or less, more preferably 50 to 50,000 mPa ⁇ s, from the standpoint of spreadability during application.
- the viscosity of the first agent and the second agent is preferably 10 to 100,000 mPa ⁇ s, It is more preferably 50 to 50,000 mPa ⁇ s, and particularly preferably 100 to 20,000 mPa ⁇ s.
- the UV-curable silicone composition is preferably stored at room temperature or below in the dark.
- the viscosities of the UV-curable silicone composition, the first part and the second part are values measured using a viscoelasticity measuring device, using a 25 mm cone plate, a shear rate of 10/s, and 23°C.
- UV-curable silicone compositions can be cured by irradiation with UV light.
- the irradiation dose is preferably 100 to 10,000 mJ/cm 2 , more preferably 300 to 6,000 mJ/cm 2 , still more preferably 500 to 5,000 mJ/cm 2 .
- the irradiation amount is a measured value of UVA.
- UVA refers to ultraviolet rays in the range of 315-400 nm.
- the composition has good curability when irradiated with ultraviolet rays having a wavelength in the range of 250 to 450 nm, for example.
- Examples of light sources that emit ultraviolet rays of such wavelengths include a high-pressure mercury lamp (UV-7000) manufactured by Ushio Inc., a metal halide lamp (UVL-4001M3-N1) manufactured by Ushio Inc., and a metal halide lamp manufactured by JM tech in Korea (JM -MTL 2KW), Mitsubishi Electric Corporation UV irradiation lamp (OSBL360), GS Yuasa UV irradiation machine (UD-20-2), Toshiba Corporation fluorescent lamp (FL-20BLB)), Heraeus H bulb, H plus bulb, V bulb, D bulb, D bulb, Q bulb and M bulb manufactured by Co., Ltd., LED lamp (HLDL-155UV) manufactured by CCS Co., Ltd., and the like.
- UV-7000 high-pressure mercury lamp
- UVL-4001M3-N1 metal halide lamp
- JM tech in Korea JM -MTL 2KW
- Mitsubishi Electric Corporation UV irradiation lamp OSBL360
- the curing time of the composition is generally 30 minutes or less, preferably 10 minutes or less, although it depends on the amount of UV irradiation. Whether or not the curing of the composition has progressed can be visually determined. It can also be quantitatively evaluated by the time etc. For example, under the condition of 23 ° C. after ultraviolet irradiation, if the time until the storage elastic modulus G' reaches 100 Pa is within 30 minutes, preferably within 10 minutes, It can be said that the curing time is short and the handleability is excellent, so it is preferable.
- a cured product of an ultraviolet-curable silicone composition can be suitably used as a sealing material.
- An article using a cured product of an ultraviolet curable silicone composition as a sealant has excellent water resistance and durability at the adhesive surface and the sealed portion. It can be suitably used as a sealing material or bonding material.
- UV-curable silicone compositions are excellent in pot life and storage stability. Therefore, for example, it can be used as an adhesive for bonding image display devices such as liquid crystal, plasma, and organic EL, or as a sealing agent for sealing LED elements or OLED elements.
- a polymethylvinylsiloxane was used in which the intermediate units consisted of D units.
- (C) component platinum-based catalyst activated by ultraviolet rays (methylcyclopentadienyl) trimethylplatinum complex (manufactured by Strem Chemicals, Inc. (Germany), amount of platinum: 61.1% by mass)
- Example 1 In order to prevent the catalyst from being activated by ultraviolet rays, the component (C) was handled in a yellow room. Component (C) was diluted to 0.05% by mass with M Vi D m2 M Vi (2). To 100 parts by mass of M Vi D m1 M Vi (1), 3.4 parts by mass of the diluted solution of component (C) (component (C): 0.00170 parts by mass, M Vi D m2 M Vi (2): 3 .39830 parts by mass) and 0.36 parts by mass of component (B) were added and mixed to obtain a one-liquid UV-curable silicone composition of Example 1.
- Example 2-6 and Comparative Examples 1-3 In the same manner as in Example 1, except that the components (A) to (C) and their blending amounts in Example 1 were changed as shown in Table 1, Examples 2 to 6 and Comparative Examples 1 to 3 One-liquid type A UV curable silicone composition was obtained.
- the storage modulus G' of the UV-curable silicone composition was measured over time using a viscoelasticity measuring device MCR301 (manufactured by Anton Paar) before and after UV irradiation. Using the above viscoelasticity measuring device and an 8 mm parallel plate, measurement of the storage elastic modulus G' of the UV-curable silicone composition at 23° C. was started at a frequency of 1 Hz.
- the UV-curable silicone composition was irradiated with UV rays at an illuminance of 100 mW/cm 2 for 10 seconds (irradiation dose of 1,000 mJ/cm 2 ), and the time from the start of irradiation until the storage elastic modulus G' reached 100 Pa was defined as the gelation time.
- the gelation time was measured until 60 minutes after the start of irradiation with ultraviolet rays, and if the storage elastic modulus G' had not reached 100 Pa at that time, the gelation time was assumed to be >60 minutes. Table 2 shows the results.
- Example 1-1 In order to prevent the catalyst from being activated by ultraviolet rays, the component (C) was handled in a yellow room. Component (C) was diluted to 0.05% by mass with M Vi D m2 M Vi (2). To 100 parts by mass of M Vi D m1 M Vi (1), 3.4 parts by mass of the diluted solution of component (C) (component (C): 0.00170 parts by mass, M Vi D m2 M Vi (2): 3 .39830 parts by mass) were added and mixed to obtain a first agent. The first agent was transferred to a light-shielding black resin container and sealed. The component (B) was used as it was as the second agent. In this manner, a two-component UV-curable silicone composition of Example 1-1 having the same composition as in Example 1 was obtained.
- Examples 2-1 to 6-1 and Comparative Examples 1-1 to 3-1 Examples 2-1 to 6-1 and Comparative Two-component UV-curable silicone compositions of Examples 1-1 to 3-1 were obtained.
- the light-shielding container containing each first agent was placed in a dryer set at 60° C. It was stored for a week and subjected to aging treatment. According to the composition shown in Table 1, the second agent was added to the first agent after the aging treatment and mixed to obtain an ultraviolet curable silicone composition. Viscosity and gel time were measured on the compositions thus obtained. Table 2 shows the results.
- Examples 1 to 3 and 1-1 to 3-1 in which the alkenyl group content of component (A) was 0.025 to 0.10 mmol/g on average, were prepared after aging the first agent.
- the change in gelation time of the composition is much less, and regardless of the presence or absence of aging treatment, the gelation time is short and the curability is excellent, which is preferable.
- the UV-curable silicone compositions of -1 to 3-1 show large changes in viscosity and gelation time of compositions prepared after aging treatment of the first agent, and are inferior in storage stability. Regardless of the presence or absence, the gelation time was long and the curability was poor.
- a cured product of an ultraviolet-curable silicone composition is useful as an electronic component sealing material, an optical component sealing material, or a bonding material.
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Abstract
Description
保存安定性の問題を解決すべく、2剤型の組成物とすることも行われている。しかし、その場合でも、2剤のうちの1剤である光活性型硬化触媒を含む組成物は、経時により粘度及び硬化性の変動が見られ、保存安定性を改善した2剤型の紫外線硬化性シリコーン樹脂組成物が、求められている。
[1](A)1分子中に少なくとも1個のアルケニル基を有し、アルケニル基含有量が平均して0.3mmol/g以下であるポリオルガノシロキサン;(B)1分子中に少なくとも3個の、ケイ素原子に結合した水素原子を有するポリオルガノハイドロジェンシロキサン;及び(C)紫外線により活性化する白金系触媒を含む、紫外線硬化性シリコーン組成物。
[2](A)成分におけるアルケニル基がビニル基であり、ビニル基の含有量が平均して0.001~0.3mmol/gである、[1]に記載の紫外線硬化性シリコーン組成物。
[3](B)成分のケイ素原子に結合した水素原子の含有量が、平均して5.5mmol/g以上である、[1]又は[2]に記載の紫外線硬化性シリコーン組成物。
[4](B)成分が、(B1)Rc1 2HSiO1/2単位(式中、Rc1は、独立して、C1-C6アルキル基又はC6-C20アリール基である)及びSiO4/2単位を含むポリオルガノハイドロジェンシロキサンを含む、[1]~[3]のいずれか1つに記載の紫外線硬化性シリコーン組成物。
[5](B1)成分が、3~6個のSiO4/2単位及び6~12個のRc1 2HSiO1/2単位が結合しているポリオルガノハイドロジェンシロキサンである、[4]に記載の紫外線硬化性シリコーン組成物。
[6](C)成分が環状ジエン化合物を配位子に有する白金系触媒である、[1]~[5]のいずれか1つに記載の紫外線硬化性シリコーン組成物。
[7]第1剤及び第2剤からなる紫外線硬化性シリコーン組成物であって、第1剤が(A)成分及び(C)成分を含み、(B)成分を含まず;第2剤が(B)成分を含み、(C)成分を含まない、[1]~[6]のいずれか1つに記載の紫外線硬化性シリコーン組成物。
[8][1]~[7]のいずれか1つに記載の紫外線硬化性シリコーン組成物の硬化物を含む、封止材。
[9]電子部品封止材、光学部品封止材又は貼り合わせ材である、[8]に記載の封止材。
M:(CH3)3SiO1/2
MH:H(CH3)2SiO1/2
MVi:CH2=CH(CH3)2SiO1/2
D:(CH3)2SiO2/2
DH:H(CH3)SiO2/2
DVi:CH2=CH(CH3)SiO2/2
T:CH3SiO3/2
Q:SiO4/2(四官能性)
シロキサン化合物は、上記の構造単位を組み合わせて構築されるものであるが、上記構造単位のメチル基がフッ素のようなハロゲン、フェニル基のような炭化水素基等、他の基に置き換わったものを少なくとも部分的に含んでいてもよい。また、例えばDH 20D20と記した場合には、DH単位が20個続いた後D単位が20個続くことを意図するものではなく、各々の単位は任意に配列していてもよいことが理解される。シロキサン化合物は、T単位又はQ単位により、3次元的に様々な構造を取ることができる。
(A)成分は、1分子中に少なくとも1個のアルケニル基を有し、アルケニル基含有量が平均して0.3mmol/g以下であるポリオルガノシロキサンである。(A)成分は、紫外線硬化性シリコーン組成物のベースポリマーとして機能する。アルケニル基は、分子主鎖の分子鎖末端に結合していても、分子鎖途中の側鎖に結合していても、両方に結合していてもよい。本明細書において、分子主鎖とは、分子中で相対的に最も長い結合鎖を表す。(A)成分の分子構造は、シロキサン結合が主骨格であるものであれば、特に制限されず、直鎖状、分岐鎖状、環状又は三次元網目状のいずれでもよく、シロキサン骨格が2価の有機基により中断されていてもよい。(A)成分は、単独でも、二種以上を併用してもよい。
なかでも、硬化性及び保存安定性のバランスを図り、硬化物に適度な硬度を与える観点から、(A)成分は、1分子中に2個のアルケニル基を有するポリオルガノシロキサンを含むことが好ましく、分子主鎖の両末端に各1つのアルケニル基を有する直鎖状のポリオルガノシロキサンを含むことがより好ましい。この場合、(A)成分は、(A)成分100質量%に対して、1分子中に2個のアルケニル基を有するポリオルガノシロキサンを30質量%以上含むことが好ましく、50質量%以上含むことがより好ましく、80質量%以上含むことがさらに好ましい。(A)成分100質量%に対する、1分子中に2個のアルケニル基を有するポリオルガノシロキサンの含有量の上限は100質量%である。
(A)成分のアルケニル基含有量は、1H NMR測定により、CH2=CH-基及びCH3-基のピーク面積から、CH2=CH-基及びCH3-基のモル比を求め、該モル比から特定される(A)成分の分子量とCH2=CH-基のモル数とから算出される値である。また、1H NMR測定に加え、29Si NMR測定により各単位(MVi単位、D単位等)の比を算出した結果を併用してもよい。
(A)成分が複数のポリオルガノシロキサンの混合物である場合、(A)成分のアルケニル基含有量は、上記内容で測定されるのが好ましいが、各ポリオルガノシロキサンのアルケニル基含有量とその混合比が判明している場合、それぞれのアルケニル基含有量にその混合比を乗じた値を合計して算出される平均値を、前記(A)成分のアルケニル基含有量としてもよい。
R1 mR2 nSiO(4-m-n)/2 (1)
(式中、
R1は、脂肪族不飽和結合を有しない、非置換又は置換の1価の炭化水素基であり;
R2は、アルケニル基であり;
mは、0~2の整数であり;
nは、1~3の整数であり、但し、m+nは1~3である。)
で示されるアルケニル基含有シロキサン単位を、分子中に少なくとも1個有する。
(式中、
Ra1は、独立して、C2-C6アルケニル基であり、
Rb1は、独立して、C1-C6アルキル基又はC6-C20アリール基であり、
n1は、直鎖状ポリオルガノシロキサンのアルケニル基含有量を平均して0.3mmol/g以下とする数である)で表すことができる。
(A)成分100質量%中の、両末端がジメチルビニルシロキサン単位で閉塞され、中間単位がジメチルシロキサン単位からなるポリメチルビニルシロキサンの含有量は、30質量%以上であることが好ましく、50質量%以上であることがより好ましく、80質量%以上であることがさらに好ましい。前記含有量の上限は100質量%である。
(B)成分は、1分子中に少なくとも3個の、ケイ素原子に結合した水素原子を有するポリオルガノハイドロジェンシロキサンである。(B)成分は、架橋剤として機能し、(A)成分のアルケニル基との付加反応により、網状構造を形成する。(B)成分は、1分子中に2個の、ケイ素原子に結合した水素原子を有するポリオルガノハイドロジェンシロキサンに比べ、組成物の硬化性に優れ、(A)成分と網状構造を形成できるため、(A)成分のように、アルケニル基含有量が少ないポリオルガノシロキサンを使用した場合でも、保存安定性を維持しつつ、硬化性及び硬化物の機械的特性に優れた組成物とすることができる。
R3 pHqSiO(4-p-q)/2 (2)
(式中、
R3は、脂肪族不飽和結合を有しない、非置換又は置換の1価の炭化水素基であり;
pは、0~2の整数であり;
qは、1~3の整数であり、但し、p+qは1~3である。)
で示されるケイ素原子に結合した水素原子を含有するシロキサン単位を、分子中に少なくとも3個有する。R3としては、一般式(1)におけるR1と同様のものが挙げられ、好ましい態様も同様である。(B)成分において、ケイ素原子に結合した水素原子は、一分子中、3~100個であることが好ましく、より好ましくは、5~50個である。
なかでも、(B1)成分は、3~6個のSiO4/2単位及び6~12個のRc1 2HSiO1/2単位が結合しているポリオルガノハイドロジェンシロキサンであることが好ましく;[Rc1 2HSiO1/2]6[SiO4/2]3、[Rc1 2HSiO1/2]8[SiO4/2]4、[Rc1 2HSiO1/2]10[SiO4/2]5、[Rc1 2HSiO1/2]12[SiO4/2]6のように、3~6個のSiO4/2単位が環状シロキサン骨格を形成し、各SiO4/2単位に2個のRc1 2HSiO1/2単位が結合している、環状ポリオルガノハイドロジェンシロキサンであることが特に好ましい。
(C)成分は、紫外線により活性化し、(A)成分のアルケニル基と、(B)成分のヒドロシリル基(Si-H基)との間の付加反応を促進するための触媒である。触媒活性が良好な観点から、(C)成分は、環状ジエン化合物を配位子に有する白金系触媒であると好ましい。(C)成分は、単独でも、二種以上を併用してもよい。
紫外線硬化性シリコーン組成物は、その目的・効果を損なうものでない限り、その他の成分を配合することができる。その他の成分としては、難燃剤、接着性付与剤、耐熱付与剤、希釈剤、フュームドシリカ等のチクソ性付与剤、無機又は有機顔料、付加反応硬化触媒の抑制剤、ポリオルガノシロキサン以外の樹脂等を適宜配合することができる。また、紫外線硬化性シリコーン組成物は、(A)成分以外のポリオルガノシロキサン、例えば、アルケニル基非含有のポリオルガノシロキサン;(B)成分以外のポリオルガノハイドロジェンシロキサン、例えば、1分子中に2個以下の、ケイ素原子に結合した水素原子を有するポリオルガノハイドロジェンシロキサン;(C)成分以外の付加反応硬化触媒、例えば、加熱により活性化する付加反応硬化触媒;等を配合することができる。その他の成分は、それぞれ単独でも、2種以上の組合せであってもよい。
紫外線硬化性シリコーン組成物は、(A)~(C)成分をすべて含む1液型の組成物であってもよく;組成物の保存安定性のいっそうの改善を考慮して、(B)成分及び(C)成分をそれぞれ別の容器に含む2液型の組成物であってもよい。
2液型の組成物とする場合、第1剤が(A)成分及び(C)成分を含み、(B)成分を含まず;第2剤が(B)成分を含み、(C)成分を含まないことが好ましい。この場合、第2剤は、(A)成分を含んでいてもよい。2液型の組成物では、使用時に第1剤及び第2剤を混合し、紫外線硬化性シリコーン組成物を作製する。
実施例では、(A)成分のアルケニル基と(C)成分との相互作用が保存安定性に与える影響のみに焦点を当てるべく、(A)成分及び(C)成分のみからなる第1剤と、(B)成分のみからなる第2剤と、からなる2液型の組成物について、第1剤についてのみエージング処理を行い、評価を行っている。(A)成分及び(C)成分に加え、(B)成分をさらに含む1液型の組成物についても同様に、(A)成分の使用によって、組成物の保存安定性は改善される。
1液型の紫外線硬化性シリコーン組成物は、(A)~(C)成分、さらに必要に応じてその他の成分をプラネタリー型ミキサー等の混合機で混合することにより得ることができる。混合時には、必要に応じて50~150℃の範囲で加熱しながら混合してもよい。紫外線硬化性シリコーン組成物が粉体を含む場合、均一仕上げのために、高剪断力下で混練操作を行うことが好ましい。混練装置としては、3本ロール、コロイドミル、サンドグラインダー等があるが、中でも3本ロールによる方法が好ましい。
紫外線硬化性シリコーン組成物は、紫外線の照射により硬化させることができる。照射量は、100~10,000mJ/cm2が好ましく、より好ましくは300~6,000mJ/cm2であり、さらに好ましくは500~5,000mJ/cm2である。なお、照射量は、UVAの測定値である。ここで、UVAは、315~400nmの範囲の紫外線をいう。組成物は、紫外線の波長、例えば、250~450nmの範囲を有する紫外線を照射したときの硬化性が良好である。このような波長の紫外線を放出する光源として、例えば、ウシオ電機株式会社製の高圧水銀ランプ(UV-7000)、メタルハライドランプ(UVL-4001M3-N1)、韓国:JM tech社製のメタルハライドランプ(JM-MTL 2KW)、三菱電機株式会社製の紫外線照射灯(OSBL360)、株式会社GSユアサ製の紫外線照射機(UD-20-2)、株式会社東芝製の蛍光ランプ(FL-20BLB))、Heraeus社製のHバルブ、Hプラスバルブ、Vバルブ、Dバルブ、Qバルブ及びMバルブ、シーシーエス株式会社製のLEDランプ(HLDL-155UV)等が挙げられる。
使用した各成分は、以下のとおりである。ここで、記号は以下を意味する。
M:(CH3)3SiO1/2
MH:H(CH3)2SiO1/2
MVi:CH2=CH(CH3)2SiO1/2
D:(CH3)2SiO2/2
DH:H(CH3)SiO2/2
DVi:CH2=CH(CH3)SiO2/2
Q:SiO4/2(四官能性)
以下に示す、両末端がMVi単位で閉塞され、中間単位がD単位からなるポリメチルビニルシロキサンを使用した。
MViDm1MVi(1):ビニル基含有量が平均して0.030mmol/g
MViDm2MVi(2):ビニル基含有量が平均して0.049mmol/g
MViDm3MVi(3):ビニル基含有量が平均して0.075mmol/g
MViDm4MVi(4):ビニル基含有量が平均して0.178mmol/g
MViDm5MVi(5):ビニル基含有量が平均して0.227mmol/g
MViDm6MVi(6):ビニル基含有量が平均して0.341mmol/g
MViDm7MVi(7):ビニル基含有量が平均して0.887mmol/g
MViDm3MVi(3)/MDViQレジン=60/40:ビニル基含有量が平均して0.475mmol/g(MDViQレジンは、1分子中に5個のビニル基を有し、ビニル基含有量は、1.075mmol/gである。)
平均単位式がMH 8Q4で示される架橋性ポリメチルハイドロジェンシロキサン(SiH量:10.78mmol/g)
(メチルシクロペンタジエニル)トリメチル白金錯体(Strem Chemicals, Inc.社製(ドイツ)、白金量:61.1質量%)
紫外線による触媒の活性化を防止するため、(C)成分の取り扱いは、イエロールーム内で行った。(C)成分をMViDm2MVi(2)により0.05質量%に希釈した。MViDm1MVi(1)100質量部に、前記(C)成分の希釈液3.4質量部((C)成分:0.00170質量部、MViDm2MVi(2):3.39830質量部)及び(B)成分0.36質量部を添加、混合して、実施例1の1液型紫外線硬化性シリコーン組成物を得た。
実施例1における(A)~(C)成分及びその配合量を、表1のように変更した以外は実施例1と同様にして、実施例2~6及び比較例1~3の1液型紫外線硬化性シリコーン組成物を得た。
粘度及びゲル化時間の測定は、遮光条件下で行われた。
粘弾性測定装置MCR301(Anton Paar社製)を使用し、紫外線硬化性シリコーン組成物の23℃における粘度(Pa・s)を、25mmコーンプレートを用い、せん断速度10/s、90秒値として測定した。結果を表2に示す。
紫外線硬化性シリコーン組成物について、粘弾性測定装置MCR301(Anton Paar社製)を使用し、紫外線の照射前後の貯蔵弾性率G’を経時的に測定した。前記粘弾性測定装置を使用し、8mmパラレルプレートを用い、周波数1Hzにて、紫外線硬化性シリコーン組成物の23℃における貯蔵弾性率G’の測定を開始した。照度100mW/cm2の紫外線を紫外線硬化性シリコーン組成物に10秒間照射(照射量1,000mJ/cm2)し、照射開始時から貯蔵弾性率G’が100Paに達するまでの時間をゲル化時間とした。ゲル化時間が短いほど速硬化性であり、硬化性に優れていると判断した。なお、ゲル化時間の測定は、紫外線の照射開始60分後まで行い、その時点で貯蔵弾性率G’が100Paに達していない場合は、ゲル化時間:>60分とした。結果を表2に示す。
実施例1~6及び比較例1~3の紫外線硬化性シリコーン組成物において、エージング処理が組成物の粘度及びゲル化時間に与える影響を調べた。
紫外線による触媒の活性化を防止するため、(C)成分の取り扱いは、イエロールーム内で行った。(C)成分をMViDm2MVi(2)により0.05質量%に希釈した。MViDm1MVi(1)100質量部に、前記(C)成分の希釈液3.4質量部((C)成分:0.00170質量部、MViDm2MVi(2):3.39830質量部)を添加、混合して、第1剤を得た。第1剤を遮光性黒色の樹脂製容器に移し、密閉した。(B)成分をそのまま第2剤として使用した。このようにして、実施例1と同一配合である実施例1-1の2液型紫外線硬化性シリコーン組成物を得た。
実施例1-1における(A)~(C)成分及びその配合量を、表1のように変更した以外は実施例1-1と同様にして、実施例2-1~6-1及び比較例1-1~3-1の2液型紫外線硬化性シリコーン組成物を得た。
さらに、1液型の組成物の粘度に対する、第1剤をエージング処理後に調製した組成物の粘度の変化率、及び1液型の組成物のゲル化時間に対する、第1剤をエージング処理後に調製した組成物のゲル化時間の変化量を算出した。結果を表2に示す。表中、n.d.は、測定不能であったことを示す。
Claims (9)
- (A)1分子中に少なくとも1個のアルケニル基を有し、アルケニル基含有量が平均して0.3mmol/g以下であるポリオルガノシロキサン;
(B)1分子中に少なくとも3個の、ケイ素原子に結合した水素原子を有するポリオルガノハイドロジェンシロキサン;及び
(C)紫外線により活性化する白金系触媒
を含む、紫外線硬化性シリコーン組成物。 - (A)成分におけるアルケニル基がビニル基であり、ビニル基の含有量が平均して0.001~0.3mmol/gである、請求項1記載の紫外線硬化性シリコーン組成物。
- (B)成分のケイ素原子に結合した水素原子の含有量が、平均して5.5mmol/g以上である、請求項1又は2に記載の紫外線硬化性シリコーン組成物。
- (B)成分が、(B1)Rc1 2HSiO1/2単位(式中、Rc1は、独立して、C1-C6アルキル基又はC6-C20アリール基である)及びSiO4/2単位を含むポリオルガノハイドロジェンシロキサンを含む、請求項1又は2に記載の紫外線硬化性シリコーン組成物。
- (B1)成分が、3~6個のSiO4/2単位及び6~12個のRc1 2HSiO1/2単位が結合しているポリオルガノハイドロジェンシロキサンである、請求項4記載の紫外線硬化性シリコーン組成物。
- (C)成分が環状ジエン化合物を配位子に有する白金系触媒である、請求項1又は2に記載の紫外線硬化性シリコーン組成物。
- 第1剤及び第2剤からなる紫外線硬化性シリコーン組成物であって、
第1剤が(A)成分及び(C)成分を含み、(B)成分を含まず;第2剤が(B)成分を含み、(C)成分を含まない、請求項1又は2に記載の紫外線硬化性シリコーン組成物。 - 請求項1又は2に記載の紫外線硬化性シリコーン組成物の硬化物を含む、封止材。
- 電子部品封止材、光学部品封止材又は貼り合わせ材である、請求項8に記載の封止材。
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003213132A (ja) | 2002-01-23 | 2003-07-30 | Shin Etsu Chem Co Ltd | オルガノポリシロキサンゲル組成物 |
JP2009220384A (ja) * | 2008-03-17 | 2009-10-01 | Shin Etsu Chem Co Ltd | シリコーンゴム薄膜被覆層の形成方法、及びシリコーンゴム薄膜被覆物品 |
JP2013087199A (ja) * | 2011-10-18 | 2013-05-13 | Shin-Etsu Chemical Co Ltd | 付加硬化型オルガノポリシロキサン組成物の硬化方法 |
WO2013084425A1 (ja) * | 2011-12-09 | 2013-06-13 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | シリコーンゴム発泡体用組成物、シリコーンゴム発泡体の製造方法およびシリコーンゴム発泡体 |
JP2015110752A (ja) * | 2013-11-05 | 2015-06-18 | 信越化学工業株式会社 | 紫外線硬化性接着性オルガノポリシロキサン組成物 |
JP2015214637A (ja) * | 2014-05-09 | 2015-12-03 | 信越化学工業株式会社 | 熱可塑性樹脂基板とオルガノポリシロキサン樹脂とを接着する方法 |
JP2019210351A (ja) | 2018-06-01 | 2019-12-12 | 信越化学工業株式会社 | 画像表示装置用紫外線硬化型液状オルガノポリシロキサン組成物、その硬化方法、画像表示装置部材の貼合方法、及び画像表示装置 |
WO2019240124A1 (ja) * | 2018-06-12 | 2019-12-19 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 成形用ポリオルガノシロキサン組成物、光学用部材、および成形方法 |
WO2019240122A1 (ja) * | 2018-06-12 | 2019-12-19 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | シリコーン硬化物の製造方法、シリコーン硬化物および光学用部材 |
WO2020111141A1 (ja) * | 2018-11-28 | 2020-06-04 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 硬化性ポリオルガノシロキサン組成物、およびポリオルガノシロキサン硬化物 |
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2022
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- 2022-12-13 WO PCT/JP2022/045907 patent/WO2023112925A1/ja active Application Filing
- 2022-12-13 EP EP22907449.7A patent/EP4450560A1/en active Pending
- 2022-12-13 JP JP2022577633A patent/JP7337470B1/ja active Active
- 2022-12-13 CN CN202280083268.9A patent/CN118541449A/zh active Pending
- 2022-12-15 TW TW111148276A patent/TW202338007A/zh unknown
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003213132A (ja) | 2002-01-23 | 2003-07-30 | Shin Etsu Chem Co Ltd | オルガノポリシロキサンゲル組成物 |
JP2009220384A (ja) * | 2008-03-17 | 2009-10-01 | Shin Etsu Chem Co Ltd | シリコーンゴム薄膜被覆層の形成方法、及びシリコーンゴム薄膜被覆物品 |
JP2013087199A (ja) * | 2011-10-18 | 2013-05-13 | Shin-Etsu Chemical Co Ltd | 付加硬化型オルガノポリシロキサン組成物の硬化方法 |
WO2013084425A1 (ja) * | 2011-12-09 | 2013-06-13 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | シリコーンゴム発泡体用組成物、シリコーンゴム発泡体の製造方法およびシリコーンゴム発泡体 |
JP2015110752A (ja) * | 2013-11-05 | 2015-06-18 | 信越化学工業株式会社 | 紫外線硬化性接着性オルガノポリシロキサン組成物 |
JP2015214637A (ja) * | 2014-05-09 | 2015-12-03 | 信越化学工業株式会社 | 熱可塑性樹脂基板とオルガノポリシロキサン樹脂とを接着する方法 |
JP2019210351A (ja) | 2018-06-01 | 2019-12-12 | 信越化学工業株式会社 | 画像表示装置用紫外線硬化型液状オルガノポリシロキサン組成物、その硬化方法、画像表示装置部材の貼合方法、及び画像表示装置 |
WO2019240124A1 (ja) * | 2018-06-12 | 2019-12-19 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 成形用ポリオルガノシロキサン組成物、光学用部材、および成形方法 |
WO2019240122A1 (ja) * | 2018-06-12 | 2019-12-19 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | シリコーン硬化物の製造方法、シリコーン硬化物および光学用部材 |
WO2020111141A1 (ja) * | 2018-11-28 | 2020-06-04 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 硬化性ポリオルガノシロキサン組成物、およびポリオルガノシロキサン硬化物 |
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CN118541449A (zh) | 2024-08-23 |
KR20240116795A (ko) | 2024-07-30 |
JPWO2023112925A1 (ja) | 2023-06-22 |
JP7337470B1 (ja) | 2023-09-04 |
TW202338007A (zh) | 2023-10-01 |
EP4450560A1 (en) | 2024-10-23 |
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