WO2023103058A1 - 显示面板以及其制造方法 - Google Patents

显示面板以及其制造方法 Download PDF

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Publication number
WO2023103058A1
WO2023103058A1 PCT/CN2021/139352 CN2021139352W WO2023103058A1 WO 2023103058 A1 WO2023103058 A1 WO 2023103058A1 CN 2021139352 W CN2021139352 W CN 2021139352W WO 2023103058 A1 WO2023103058 A1 WO 2023103058A1
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Prior art keywords
pads
display panel
microns
manufacturing
driving substrate
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PCT/CN2021/139352
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English (en)
French (fr)
Inventor
周世新
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Tcl华星光电技术有限公司
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Priority to JP2021577100A priority Critical patent/JP2024503944A/ja
Publication of WO2023103058A1 publication Critical patent/WO2023103058A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the invention relates to the field of display technology, in particular to a display panel with a high-reflectivity inclined pad.
  • mini-LED mini-light-emitting diode
  • a layer of reflective ink is coated on the surface of the driving substrate of the display panel, so that the The light emitted by the mini LEDs in the display panel is reflected as much as possible.
  • the reflectivity of the display panel can be adjusted by adjusting the coating thickness of the reflective ink and the window opening precision.
  • the most commonly used manufacturing method of the reflective ink is to apply the reflective ink on the driving substrate of the display panel by inkjet printing or screen printing, and then apply the reflective ink to the drive substrate by exposure and development.
  • the reflective ink is cured and windows are opened to expose a plurality of pads for bonding the mini LEDs.
  • FIG. 1 is a partial structural diagram of the display panel in the prior art.
  • the display panel includes the driving substrate 100', the plurality of welding pads 200', the reflective ink 300', and a plurality of the mini LEDs 400'.
  • a pair of pads 200' is electrically connected to one mini LED 400' and a plurality of traces 110' in the driving substrate 100'.
  • the reflective ink 300' is located between two adjacent pairs of pads 200' to reflect the light emitted by the plurality of mini LEDs 400'.
  • the coating thickness of the reflective ink is designed to be about 60 microns.
  • the reflective ink 300' is a light-curable material, the reflective ink 300' near the surface can be completely cured due to sufficient light, but the reflective ink 300' near the bottom layer cannot be cured due to insufficient light. Fully cured. The reflective ink 300' that is not fully cured will be washed away by the developing solution in the subsequent process, thereby forming the undercut shape UC as shown in FIG. 1 .
  • the defects of the undercut shape UC of the reflective ink 300' will cause the reflectivity of the display panel to drop by 15% to 20%, seriously reducing the performance of the display panel. display effect.
  • the display panel in the prior art has the technical problem that the reflective ink cannot be fully cured, so a display panel with a high-reflectivity inclined pad is needed to solve the above technical problem.
  • the invention provides a display panel with a high-reflectivity inclined pad.
  • the display panel includes a driving substrate, a plurality of welding pads, a reflective layer, and a plurality of light emitting units.
  • the driving substrate includes a plurality of wires of the driving circuit of the display panel.
  • the plurality of welding pads are disposed on the driving substrate and are electrically connected to the plurality of wires of the driving circuit in the driving substrate. Every two pads are arranged in pairs. Each of the pads includes a frustum of a cone.
  • the reflective layer is disposed between two adjacent pairs of pads.
  • the material of the reflective layer includes photocurable reflective ink.
  • Each light emitting unit is electrically connected to a pair of pads.
  • the included angle between at least one side surface and the bottom surface of the truncated cone of each pad is between 40 degrees and 50 degrees.
  • the included angle between at least one side surface and the bottom surface of the frustum of each pad is 45 degrees.
  • each pad is a truncated quadrangular pyramid or a truncated cone.
  • the materials of the pads include copper, aluminum, silver, cobalt, palladium, iron, cadmium, nickel, and combinations thereof.
  • the height of each pad ranges from 8 microns to 10 microns.
  • the reflective layer has a thickness ranging from 55 microns to 60 microns.
  • the invention also provides a manufacturing method of the display panel.
  • the manufacturing method of the display panel includes the following steps:
  • the driving substrate including a plurality of wires of the driving circuit of the display panel
  • a plurality of pads are formed on the drive substrate, the plurality of pads are electrically connected to the plurality of wires of the drive circuit in the drive substrate, and every two pads are arranged in pairs, each said pad is formed as a frustum;
  • a reflective layer is formed on the driving substrate, the reflective layer is formed between two adjacent pairs of the pads, and the material of the reflective layer includes photocurable reflective ink;
  • Each pair of pads is electrically connected to a light emitting unit.
  • the included angle between at least one side surface and the bottom surface of the truncated cone of each pad is between 40 degrees and 50 degrees.
  • the included angle between at least one side surface and the bottom surface of the frustum of each pad is 45 degrees.
  • each pad is a truncated quadrangular pyramid or a truncated cone.
  • the materials of the pads include copper, aluminum, silver, cobalt, palladium, iron, cadmium, nickel, and combinations thereof.
  • the height of each pad ranges from 8 microns to 10 microns.
  • the reflective layer has a thickness ranging from 55 microns to 60 microns.
  • the step of forming a plurality of pads on the driving substrate further includes the following steps:
  • the thickness of the electroplating seed layer ranges from 0.5 micron to 1 micron.
  • the material of the electroplating seed layer includes copper, aluminum, silver, cobalt, palladium, iron, cadmium, nickel, and combinations thereof.
  • the material of the photoresist includes negative photoresist.
  • the depth of the hole is greater than or equal to the height of each pad, and the difference between the depth of the hole and the height of each pad is within 0 Between microns and 5 microns.
  • the photoresist has a thickness ranging from 10 microns to 12 microns.
  • the invention provides the display panel and its manufacturing method.
  • the display panel includes the driving substrate, the plurality of welding pads, the reflection layer, and the plurality of light emitting units.
  • the driving substrate includes a plurality of wires of the driving circuit of the display panel.
  • the plurality of welding pads are disposed on the driving substrate and are electrically connected to the plurality of wires of the driving circuit in the driving substrate. Every two pads are arranged in pairs. Each of the pads includes the frustum.
  • the reflective layer is disposed between two adjacent pairs of pads.
  • the material of the reflective layer includes the photocurable reflective ink.
  • Each light emitting unit is electrically connected to a pair of pads. Since each of the pads includes the truncated cone, the present invention can utilize the plurality of pads with high reflectivity slopes to solve the problem that the light-cured reflective layer cannot be fully cured in the prior art. Ink technical problems.
  • FIG. 1 is a partial structural schematic diagram of a display panel in the prior art.
  • FIG. 2 is a partial structural diagram of the display panel of the present invention.
  • FIG. 3 is a three-dimensional schematic diagram of the pads of the display panel of the present invention.
  • FIG. 4 is another schematic perspective view of the pads of the display panel of the present invention.
  • 5 to 12 are structural schematic diagrams of the manufacturing process of the display panel of the present invention.
  • the display panel includes a driving substrate 100 , a plurality of bonding pads 200 , and a plurality of light emitting units 400 .
  • the driving substrate 100 includes a plurality of wires 110 of the driving circuit of the display panel.
  • the plurality of pads 200 are disposed on the driving substrate 100 and electrically connected to the plurality of wires 110 of the driving circuit in the driving substrate 100 .
  • the plurality of pads 200 serve as bonding pads for bonding the light emitting unit 400 , and every two pads 200 are arranged in pairs.
  • the light emitting unit 400 is electrically connected to a pair of pads 200 , that is, each pair of pads 200 includes an anode and a cathode to electrically connect the plurality of wires 110 of the driving substrate 100 .
  • the present invention provides a reflective layer 300 on the driving substrate 100 of the display panel, so that the light emitted by the light emitting unit 400 is Reflect as much of the display panel as possible.
  • the reflective layer 300 is disposed between two adjacent pairs of the pads 200 , that is, surrounds the area where the light-emitting element is intended to be bonded.
  • the material of the reflective layer 300 includes reflective ink whose main color is white, preferably, light-curable reflective ink.
  • each pad 200 configures the shape of each pad 200 to include a frustum.
  • the frustum is formed by truncating the top of a general cone, and the cross section is parallel to the bottom surface 220 of the cone.
  • the frustum is also called a parallel frustum, a frustum, and a platform.
  • each pad 200 of the present invention is configured as a bevel
  • the cured light can be reflected during the process of exposing the photocurable reflective ink of the reflective layer 300 to the region of the reflective layer 300 close to the bottom layer.
  • the reflective layer 300 near the surface can be fully cured due to sufficient light
  • the reflective layer 300 near the bottom layer can also be fully irradiated and fully cured due to the reflected light from the plurality of pads 200. solidified.
  • each of the pads 200 is a truncated quadrangular pyramid, preferably, may be a truncated regular quadrangular pyramid.
  • Each pad 200 includes a top surface 210 , a bottom surface 220 , and four side surfaces 230 .
  • the top surface 210 is parallel to the bottom surface 220
  • four side surfaces 230 connect the top surface 210 and the bottom surface 220 .
  • one side 230 of each pad 200 is configured such that the angle ⁇ between one side 230 of each pad 200 and the bottom surface 220 ranges from 40 degrees to 50 degrees, preferably 45 degrees.
  • each pad 200 may also be a truncated cone, preferably, may be a truncated right cone.
  • Each pad 200 includes a top surface 210 , a bottom surface 220 , and a side surface 230 .
  • the top surface 210 is parallel to the bottom surface 220
  • a side surface 230 connects the top surface 210 and the bottom surface 220 .
  • the angle ⁇ between the side surface 230 of each pad 200 and the bottom surface 220 ranges from 40 degrees to 50 degrees, preferably 45 degrees.
  • the pad 200 of the truncated right cone can more evenly reflect the curing light to the reflective layer 300 near the bottom layer.
  • the reflective layer 300 makes the light-curable reflective ink of the reflective layer 300 be cured more completely.
  • the The material of the plurality of pads 200 is configured as a metal material with high reflectivity.
  • the material of the plurality of pads 200 includes copper, aluminum, silver, cobalt, palladium, iron, cadmium, nickel, and combinations thereof.
  • the material of the plurality of pads 200 also has high conductivity, so it can be used as the bonding pad of the plurality of light emitting units 400 to stably supply current to the plurality of light emitting units 400 .
  • the thickness range of the reflective layer 300 is configured between 55 microns and 60 microns, if the reflective layer 300 passes through the patterning process of the prior art , there may be defects of the undercut profile approximately 10 microns high. Therefore, in the present invention, at least one of the side surfaces 230 of each of the solder pads 200 is configured so that the angle ⁇ between the bottom surface 220 and the bottom surface 220 is in the range of 40 degrees to 50 degrees, and each of the solder pads 200 is matched with each other.
  • the height range of the disc 200 is configured between 8 microns and 10 microns.
  • the photocurable reflective ink of the reflective layer 300 can be cured as a whole after the patterning process, thereby avoiding the problem of display panels in the prior art.
  • the defect of the undercut shape of the reflective layer due to incomplete curing. This enables the reflective layer 300 of the display panel of the present invention to achieve a reflectivity above a theoretical value, that is, the reflectivity of the reflective layer 300 reaches above 92.5%, thereby enhancing the display effect of the display panel , and reducing the energy consumption of the display panel.
  • the invention also provides a manufacturing method of the display panel.
  • the manufacturing method of the display panel includes the following steps S1-S4. Please refer to FIG. 5 to FIG. 12 , which are structural schematic diagrams of the manufacturing process of the display panel of the present invention.
  • the driving substrate 100 includes the plurality of wires 110 of the driving circuit of the display panel.
  • this step further includes the following steps S21-S26.
  • an electroplating seed layer 500 on the surface of the driving substrate 100 .
  • a metal thin film of the electroplating seed layer 500 must first be formed.
  • the thickness of the electroplating seed layer ranges from 0.5 micron to 1 micron, and preferably, the thickness of the electroplating seed layer 500 may be 0.6 micron.
  • the electroplating seed layer 500 can be selected from the same material as the plurality of welding pads 200. Copper, aluminum, silver, cobalt, palladium, iron, cadmium, nickel, and combinations thereof.
  • the present invention forms the photoresist 600 with a thickness ranging from 10 microns to 12 microns on the electroplating seed layer 500 . Since the predetermined height range of the plurality of pads 200 is between 8 microns and 10 microns, the predetermined thickness range of the photoresist 600 of the present invention is configured to be greater than or equal to the predetermined height of the plurality of pads 200 scope.
  • the photoresist 600 is opened with a plurality of frustum-shaped cavities 610 to provide the subsequent plurality of The forming space of the pad 200 .
  • the depth of the hole 610 is greater than or equal to the predetermined height of each of the pads 200, and the depth of the hole 610 is the same as the predetermined height of each of the pads. The height difference ranges from 0 microns to 5 microns.
  • the material of the photoresist 600 in the present invention includes a negative photoresist 600 .
  • the negative photoresist 600 can be a commercially available model such as Merck CPT-100. Due to the characteristics of the negative photoresist 600 , after the photoresist 600 is patterned, an undercut structure as shown in FIG. 7 will be formed. The shape of the undercut structure, such as the bevel angle, can be adjusted through the exposure degree, development time, or baking time of the photoresist 600 . In this way, a predetermined plurality of frustum-shaped cavities 610 can be formed according to actual implementation needs.
  • the materials of the plurality of pads 200 such as copper, aluminum, silver, etc.
  • an electroplating process such as wet electroplating. , cobalt, palladium, iron, cadmium, nickel, and combinations thereof, etc., under the guidance of the electroplating seed layer 500, fill the cavities 610 of a plurality of frustums to form each of the frustums a pad 200 .
  • the photoresist 600 Removing the photoresist 600. As shown in FIG. 9, after the plurality of bonding pads 200 are formed in the plurality of holes 610 of the photoresist 600, the photoresist 600 can be formed from the electroplating seed layer 500 and the plurality of holes 610. The plurality of pads 200 are peeled off.
  • step S24 Etching the plurality of pads 200 and the electroplating seed layer 500 to remove the electroplating seed layer 500 outside the region formed by the plurality of pads 200 .
  • step S21 since step S21 first forms the entire layer of the electroplating seed layer 500, in this case, the plurality of wires 110 of the driving substrate 100 are all electrically connected to the electroplating seed layer 500.
  • Layer 500 In order to insulate each of the bonding pads 200 from each other and electrically connect the plurality of traces 110 of the driving circuit in the driving substrate 100 , all the bonding pads 200 formed by the plurality of bonding pads 200 must be removed. The electroplating seed layer 500 outside the above-mentioned area.
  • the electroplating seed layer 500 outside the region formed by the plurality of pads 200 may be removed by etching the plurality of pads 200 and the electroplating seed layer 500 entirely. Since the electroplating seed layer 500 has a thickness of about 0.6 ⁇ m, only the shallow surfaces of the plurality of pads 200 need to be sacrificed to achieve insulation of each of the pads 200 from each other.
  • step S3 Forming a reflective layer 300 on the driving substrate 100 .
  • the reflective layer 300 will be formed between two adjacent pairs of the pads 200 .
  • the photo-curable reflective ink of the reflective layer 300 is coated on the drive substrate 100 by inkjet printing or screen printing, and then through the pre-baking process, exposure process, development process, and main baking etc., to completely cure the light-curable reflective ink of the reflective layer 300 .
  • the exposure process can be laser direct imaging (laser direct imaging, LDI) process.
  • each pad 200 of the present invention is configured as a slope Therefore, during the exposure process of the photocurable reflective ink on the reflective layer 300, the curing light can be reflected to the region of the reflective layer 300 close to the bottom layer. In this way, no matter the reflective layer 300 near the surface can be fully cured due to sufficient light, and the reflective layer 300 near the bottom layer can also be fully irradiated and fully cured due to the reflected light from the plurality of pads 200. solidify.
  • step S4 Electrically connect one light emitting unit 400 to each pair of pads 200 .
  • the plurality of light emitting units 400 can be electrically connected to the plurality of pads 200 .
  • the plurality of light emitting units 400 are soldered by reflow (mass reflow bonding) process, bonding the light emitting unit 400 to a pair of pads 200 .
  • the invention provides the display panel and its manufacturing method.
  • the display panel includes the driving substrate 100 , the plurality of pads 200 , the reflective layer 300 , and the plurality of light emitting units 400 .
  • the driving substrate 100 includes a plurality of wires 110 of the driving circuit of the display panel.
  • the plurality of pads 200 are disposed on the driving substrate 100 and electrically connected to the plurality of wires 110 of the driving circuit in the driving substrate 100 . Every two pads 200 are arranged in pairs. Each pad 200 includes the frustum.
  • the reflective layer 300 is disposed between two adjacent pairs of the pads 200 .
  • the material of the reflective layer 300 includes the photocurable reflective ink.
  • Each light emitting unit 400 is electrically connected to a pair of pads 200 . Since each of the bonding pads 200 includes the frustum, the present invention can utilize the plurality of bonding pads 200 with high reflectivity slopes to solve the problem that the prior art cannot fully cure the reflective layer. Technical issues with curing reflective inks.

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Abstract

一种显示面板，包括驱动基板（100）、多个焊盘（200）、反射层（300）、以及多个发光单元（400）。驱动基板（100）包括显示面板的驱动电路的多个走线（110）。多个焊盘（200）设置于驱动基板（100）上，并且电性连接驱动基板（100）中的驱动电路的多个走线（110）。每二个焊盘（200）成对设置。每一焊盘（200）包括平截锥体。反射层（300）设置于相邻的二对焊盘（200）之间。反射层（300）的材料包括光固化反射油墨。每一发光单元（400）电性连接一对焊盘（200）。

Description

显示面板以及其制造方法 技术领域
本发明涉及显示技术领域，尤其涉及一种具有高反射率斜面焊盘的显示面板。
 背景技术
随著显示技术的发展，各类型的显示面板应运而生。相较于液晶（liquid crystal，LC）显示技术以及有机发光二极管（organic light-emitting diode，OLED）显示技术，迷你发光二极管（mini-light-emitting diode，mini-LED）显示技术具有更优异的响应速度、显示色域、对比度、分辨率、以及能耗表现等优点，并且所述迷你发光二极管显示技术还能够实现超高分区数的精准调光，因此发展前景可期，进而成为各大显示面板厂商布局的热点。
在应用所述迷你发光二极管显示技术的显示面板中，为了提高亮度以及出光效率，并且降低能耗，现有技术在所述显示面板的驱动基板的表面涂布一层反射油墨，以使得所述显示面板中的迷你发光二极管发出的光线被尽可能地反射出去。通过调整所述反射油墨的涂布厚度以及开窗精度便能够调整所述显示面板的反射率。目前，所述反射油墨最常用的制造方法为通过喷墨印刷或是丝网印刷将所述反射油墨涂布于所述显示面板的所述驱动基板上，并且再通过曝光以及显影等方式将所述反射油墨固化并且开窗，以暴露用以绑定（bonding）所述迷你发光二极管的多个焊盘。
 技术问题
请参照图1，其为现有技术的所述显示面板的部分结构示意图。所述显示面板包括所述驱动基板100’、所述多个焊盘200’、所述反射油墨300’、以及多个所述迷你发光二极管400’。一对所述焊盘200’电性连接一个所述迷你发光二极管400’以及所述驱动基板100’中的多个走线110’。所述反射油墨300’位于相邻的二对所述焊盘200’之间用以反射多个所述迷你发光二极管400’所发出的所述光线。
现有技术为了尽可能地提高所述显示面板的所述反射率，因此将所述反射油墨的涂布厚度设计在大约60微米上下。然而，由于所述反射油墨300’为光固化材料，因此靠近表层的所述反射油墨300’能够因照光充足而被完全固化，但是靠近底层的所述反射油墨300’却因照光不足而无法被充分固化。而不完全固化的所述反射油墨300’会在后续制程受到显影液的冲洗而流失，进而形成如图1所示的底切造型UC。通过发明人的仿真试验计算，所述反射油墨300’的这些所述底切造型UC的缺陷将会造成所述显示面板的所述反射率下降15％～20％，严重降低所述显示面板的显示效果。
现有技术的所述显示面板具有无法充分固化所述反射油墨的技术问题，因此需要一种具有高反射率斜面焊盘的显示面板，来解决上述的技术问题。
 技术解决方案
本发明提供一种具有高反射率斜面焊盘的显示面板。所述显示面板包括驱动基板、多个焊盘、反射层、以及多个发光单元。所述驱动基板包括所述显示面板的驱动电路的多个走线。所述多个焊盘设置于所述驱动基板上，并且电性连接所述驱动基板中的所述驱动电路的所述多个走线。每二个所述焊盘成对设置。每一所述焊盘包括平截锥体。所述反射层设置于相邻的二对所述焊盘之间。所述反射层的材料包括光固化反射油墨。每一所述发光单元电性连接一对所述焊盘。
在一实施例中，每一所述焊盘的所述平截锥体的至少一个侧面与底面的夹角范围在40度～50度之间。
在本实施例中，每一所述焊盘的所述平截锥体的至少一个侧面与底面的夹角为45度。
在一实施例中，每一所述焊盘为平截四角椎体或者平截圆锥体。
在一实施例中，所述多个焊盘的材料包括铜、铝、银、钴、钯、铁、镉、镍、以及其组合。
在一实施例中，每一所述焊盘的高度范围在8微米～10微米之间。
在本实施例中，所述反射层的厚度范围在55微米～60微米之间。
本发明还提供一种显示面板的制造方法。所述显示面板的制造方法包括以下步骤：
形成驱动基板，所述驱动基板包括所述显示面板的驱动电路的多个走线；
在所述驱动基板上形成多个焊盘，所述多个焊盘电性连接所述驱动基板中的所述驱动电路的所述多个走线，每二个所述焊盘成对设置，每一所述焊盘形成为平截锥体；
在所述驱动基板上形成反射层，所述反射层形成于相邻的二对所述焊盘之间，所述反射层的材料包括光固化反射油墨；以及
在每一对所述焊盘上电性连接发光单元。
在一实施例中，每一所述焊盘的所述平截锥体的至少一个侧面与底面的夹角范围在40度～50度之间。
在本实施例中，每一所述焊盘的所述平截锥体的至少一个侧面与底面的夹角为45度。
在一实施例中，每一所述焊盘为平截四角椎体或者平截圆锥体。
在一实施例中，所述多个焊盘的材料包括铜、铝、银、钴、钯、铁、镉、镍、以及其组合。
在一实施例中，每一所述焊盘的高度范围在8微米～10微米之间。
在本实施例中，所述反射层的厚度范围在55微米～60微米之间。
在一实施例中，在所述驱动基板上形成多个焊盘的步骤中，还包括以下步骤：
在所述驱动基板表面形成电镀种子层；
在所述电镀种子层上形成光刻胶；
图案化所述光刻胶，以在每一所述焊盘预定形成的区域形成平截锥体的空穴；
电镀所述光刻胶以及所述电镀种子层，以形成填满所述光刻胶的所述空穴的所述焊盘；
移除所述光刻胶；以及
蚀刻所述多个焊盘以及所述电镀种子层，以移除所述多个焊盘形成的所述区域以外的电镀种子层。
在一实施例中，所述电镀种子层的厚度范围在0.5微米～1微米之间。
在一实施例中，所述电镀种子层的材料包括铜、铝、银、钴、钯、铁、镉、镍、以及其组合。
在一实施例中，所述光刻胶的材料包括负性光刻胶。
在一实施例中，所述空穴的深度大于或等于每一所述焊盘的高度，并且所述空穴的所述深度与每一所述焊盘的所述高度的差值范围在0微米～5微米之间。
在一实施例中，所述光刻胶的厚度范围在10微米～12微米之间。
 有益效果
本发明提供一种所述显示面板及其制造方法。所述显示面板包括所述驱动基板、所述多个焊盘、所述反射层、以及所述多个发光单元。所述驱动基板包括所述显示面板的驱动电路的多个走线。所述多个焊盘设置于所述驱动基板上，并且电性连接所述驱动基板中的所述驱动电路的所述多个走线。每二个所述焊盘成对设置。每一所述焊盘包括所述平截锥体。所述反射层设置于相邻的二对所述焊盘之间。所述反射层的所述材料包括所述光固化反射油墨。每一所述发光单元电性连接一对所述焊盘。由于每一所述焊盘包括所述平截锥体，因此本发明能够利用具有高反射率斜面的所述多个焊盘，解决现有技术无法充分固化所述反射层的所述光固化反射油墨的技术问题。
 附图说明
图1为现有技术的显示面板的部分结构示意图。
图2为本发明的显示面板的部分结构示意图。
图3为本发明的所述显示面板的焊盘的一种立体示意图。
图4为本发明的所述显示面板的所述焊盘的另一种立体示意图。
图5～图12为本发明的所述显示面板的制造过程的结构示意图。
 本发明的实施方式
为了让本发明之上述及其他目的、特征、优点能更明显易懂，下文将特举本发明优选实施例，并配合附图，作详细说明如下。
请参照图2，其为本发明的显示面板的部分结构示意图。所述显示面板包括驱动基板100、多个焊盘200、以及多个发光单元400。所述驱动基板100包括所述显示面板的驱动电路的多个走线110。所述多个焊盘200设置于所述驱动基板100上，并且电性连接所述驱动基板100中的所述驱动电路的所述多个走线110。所述多个焊盘200作为绑定（bonding）所述发光单元400的绑定垫，每二个所述焊盘200成对设置。所述发光单元400电性连接一对所述焊盘200，即每一对所述焊盘200包括阳极以及阴极以电性连接所述驱动基板100的所述多个走线110。
为了提高所述显示面板的亮度以及出光效率，并且降低所述显示面板的能耗，本发明在所述显示面板的驱动基板100上设置反射层300，以使得所述发光单元400发出的光线被尽可能地反射出所述显示面板。在一实施例中，所述反射层300设置于相邻的二对所述焊盘200之间，即包围所述发光元件预定被绑定的区域。所述反射层300的材料包括主要颜色为白色的反射油墨，优选地，包括光固化反射油墨。通过发明人的仿真试验，当其厚度范围在55微米～60微米之间时，反射率可以达到92.5％以上。
为了使得所述反射层300的所述光固化反射油墨在曝光的制程中能够充分地被照射到光线，因此本发明将每一所述焊盘200的造型配置为包括平截锥体。所述平截锥体由一般锥体截去顶部而成，并且截面与所述锥体的底面220平行。所述平截锥体又称做平行截头锥体、平截头体、以及台体。
由于本发明的每一所述焊盘200的至少一所述侧面230被配置为斜面，因此在所述反射层300的所述光固化反射油墨被曝光的所述制程中，得以将固化光线反射到所述反射层300靠近底层的区域。如此一来，不论是靠近表层的所述反射层300能够因照光充足而被完全固化，并且靠近底层的所述反射层300也能因所述多个焊盘200的反射光充足照射并且被完全固化。
请参照图3，其为本发明的所述显示面板的一个所述焊盘200的一种立体示意图。在本实施例中，每一所述焊盘200为平截四角锥体，优选地，可以为平截正四角锥体。每一所述焊盘200包括顶面210、底面220、以及四个侧面230。在每一所述焊盘200中，所述顶面210与所述底面220平行，并且四个侧面230连接所述顶面210以及底面220。如图所示，本发明将每一所述焊盘200的一个所述侧面230配置为与所述底面220的夹角θ范围在40度～50度之间，优选地为45度。
请参照图4，其为本发明的所述显示面板的一个所述焊盘200的另一种立体示意图。在本实施例中，每一所述焊盘200还可以为平截圆锥体，优选地，可以为平截正圆锥体。每一所述焊盘200包括顶面210、底面220、以及侧面230。在每一所述焊盘200中，所述顶面210与所述底面220平行，并且侧面230连接所述顶面210以及底面220。如图所示，本发明将每一所述焊盘200的所述侧面230配置为与所述底面220的夹角θ范围在40度～50度之间，优选地为45度。
相较于图3所示的平截四角锥体的一个所述焊盘200，平截正圆锥体的所述焊盘200更能够平均地反射所述固化光线至所述反射层300靠近底层的所述反射层300，使得所述反射层300的所述光固化反射油墨被固化的更加完全。
在一实施例中，本发明为了将所述固化光线尽可能地反射至靠近底层的所述反射层300，以使得所述反射层300的所述光固化反射油墨能够被完全固化，因此将所述多个焊盘200的材料配置为高反射率的金属材料。优选地，所述多个焊盘200的所述材料包括铜、铝、银、钴、钯、铁、镉、镍、以及其组合。并且，所述多个焊盘200的所述材料还具有高导电性，因此才能够作为所述多个发光单元400的所述绑定垫，以稳定供应电流给所述多个发光单元400。
需要说明的是，通过发明人的仿真试验，当所述反射层300的所述厚度范围被配置在55微米～60微米之间时，若所述反射层300通过现有技术的图案化制程后，可能存在大约10微米高的所述底切造型的缺陷。因此，本发明将每一所述焊盘200的至少一所述侧面230配置为与所述底面220的所述夹角θ范围在40度～50度之间，并且配合将每一所述焊盘200的高度范围配置在8微米～10微米之间。
得益于本发明的所述多个焊盘200的结构设计，所述反射层300的所述光固化反射油墨在图案化制程后，能够整体性地固化，进而避免现有技术的显示面板的反射层因为固化不完全而出现的底切造型的缺陷。这使得本发明的所述显示面板的所述反射层300能够达成理论值以上的反射率，即所述反射层300的所述反射率达到92.5％以上，以此增强所述显示面板的显示效果、以及降低所述显示面板的能耗。
本发明还提供一种显示面板的制造方法。所述显示面板的制造方法包括以下步骤S1～S4。请参照图5～图12，其为本发明的所述显示面板的制造过程的结构示意图。
S1. 形成所述驱动基板100。所述驱动基板100包括所述显示面板的所述驱动电路的所述多个走线110。
S2. 在所述驱动基板100上形成所述多个焊盘200。所述多个焊盘200与所述驱动基板的所述多个走线110电性连接。为形成所述多个焊盘200，本步骤还包括以下步骤S21～S26。
S21. 在所述驱动基板100表面形成电镀种子层500。如图5所示，为了将金属的所述多个焊盘200形成于非金属的所述驱动基板100的表面，首先必须形成一层所述电镀种子层500的金属薄膜。所述电镀种子层的厚度范围在0.5微米～1微米之间，并且优选地，所述电镀种子层500形成的厚度可以为0.6微米。
在本步骤中，为了使后续将形成的所述多个焊盘200与所述电镀种子层500均质，所述电镀种子层500可以选用与所述多个焊盘200的所述材料相同的铜、铝、银、钴、钯、铁、镉、镍、以及其组合。
S22. 在所述电镀种子层500上形成光刻胶600。如图6所示，本发明接着在所述电镀种子层500上形成厚度范围在10微米～12微米之间的所述光刻胶600。由于所述多个焊盘200的预定高度范围在8微米～10微米之间，因此本发明的所述光刻胶600预定厚度范围被配置为大于或等于所述多个焊盘200的预定高度范围。
S23. 图案化所述光刻胶600，以在每一所述焊盘200预定形成的区域形成平截锥体的空穴610。如图7所示，通过光罩曝光、显影、以及冲洗等图案化工艺，将所述光刻胶600开设出多个平截锥体的所述空穴610，以提供后续的所述多个焊盘200的成形空间。在一实施例中，所述空穴610的深度大于或等于每一所述焊盘200的预定形成的高度，并且所述空穴610的所述深度与每一所述焊盘的预定形成的所述高度的差值范围在0微米～5微米之间。
需要说明的是，本发明的所述光刻胶600的材料包括负性光刻胶600。优选地，所述负性光刻胶600可以选择市售型号例如Merck CPT-100。由于所述负性光刻胶600的特性，在所述光刻胶600图案化后，将会形成如图7所示的底切结构。而所述底切结构的造型，例如斜面角等，都能够通过所述光刻胶600的曝光程度、显影时间、或是烘烤时间等进行调整。如此一来，便能够依据实际实施需要而形成预定的多个平截锥体的所述空穴610。
S24. 电镀所述光刻胶600以及所述电镀种子层500，以形成填满所述光刻胶600的所述空穴610的所述焊盘200。如图8所示，在所述光刻胶600开设出多个所述空穴610后，便能够通过例如湿式电镀的电镀工艺将所述多个焊盘200的材料，例如铜、铝、银、钴、钯、铁、镉、镍、以及其组合等，在所述电镀种子层500的引导下，填入多个平截锥体的所述空穴610，以形成平截锥体的每一所述焊盘200。
S25. 移除所述光刻胶600。如图9所示，在所述多个焊盘200形成于所述光刻胶600的多个所述空穴610后，便能够将所述光刻胶600自所述电镀种子层500以及所述多个焊盘200上剥离。
S24. 蚀刻所述多个焊盘200以及所述电镀种子层500，以移除所述多个焊盘200形成的所述区域以外的电镀种子层500。如图10所示，由于步骤S21首先形成了整层的所述电镀种子层500，在这种状况下，所述驱动基板100的所述多个走线110皆是电性接所述电镀种子层500。为了将每一所述焊盘200彼此绝缘并且各自电性连接所述驱动基板100中的所述驱动电路的所述多个走线110，则必须移除所述多个焊盘200形成的所述区域以外的电镀种子层500。
在本步骤中，可以通过整面地蚀刻所述多个焊盘200以及所述电镀种子层500，已移除所述多个焊盘200形成的所述区域以外的电镀种子层500。由于所述电镀种子层500厚度大约为0.6微米，因此仅需要牺牲所述多个焊盘200的浅薄表面，即可达成每一所述焊盘200彼此绝缘。
S3. 在所述驱动基板100上形成反射层300。如图11所示，在步骤S2完成后，所述反射层300将形成于相邻的二对所述焊盘200之间。通过喷墨印刷或是丝网印刷将所述反射层300的所述光固化反射油墨涂布于所述驱动基板100上，并且再通过预烘烤工艺、曝光工艺、显影工艺、以及主烘烤等工艺，将所述反射层300的所述光固化反射油墨完全固化。在本步骤中，优选地，所述曝光工艺可以为镭射直接成像（laser direct imaging，LDI）工艺。
如图11所示，在所述反射层300的所述光固化反射油墨在被进行所述曝光工艺时，由于本发明的每一所述焊盘200的至少一所述侧面230被配置为斜面，因此在所述反射层300的所述光固化反射油墨在曝光的制程中，得以将所述固化光线反射到所述反射层300靠近底层的区域。如此一来，不论是靠近表层的所述反射层300能够因照光充足而被完全固化，并且靠近底层的所述反射层300也能因所述多个焊盘200的反射光充足照射并且被完全固化。
S4. 在每一对所述焊盘200上电性连接一个所述发光单元400。如图12所示，在步骤S3完成后，便可以将所述多个发光单元400与多个所述焊盘200电性连接。在本步骤中，所述多个发光单元400通过回流焊接（mass reflow bonding）工艺，将所述发光单元400与一对所述焊盘200绑定。
本发明提供一种所述显示面板及其制造方法。所述显示面板包括所述驱动基板100、所述多个焊盘200、所述反射层300、以及所述多个发光单元400。所述驱动基板100包括所述显示面板的驱动电路的多个走线110。所述多个焊盘200设置于所述驱动基板100上，并且电性连接所述驱动基板100中的所述驱动电路的所述多个走线110。每二个所述焊盘200成对设置。每一所述焊盘200包括所述平截锥体。所述反射层300设置于相邻的二对所述焊盘200之间。所述反射层300的所述材料包括所述光固化反射油墨。每一所述发光单元400电性连接一对所述焊盘200。由于每一所述焊盘200包括所述平截锥体，因此本发明能够利用具有高反射率斜面的所述多个焊盘200，解决现有技术无法充分固化所述反射层的所述光固化反射油墨的技术问题。
以上仅是本发明的优选实施方式，应当指出，对于所属领域技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (20)

  1. 一种显示面板，包括：
    驱动基板，包括所述显示面板的驱动电路的多个走线；
    多个焊盘，设置于所述驱动基板上，并且电性连接所述驱动基板中的所述驱动电路的所述多个走线，每二个所述焊盘成对设置，每一所述焊盘包括平截锥体；
    反射层，设置于相邻的二对所述焊盘之间，所述反射层的材料包括光固化反射油墨；以及
    多个发光单元，每一所述发光单元电性连接一对所述焊盘。
  2. 如权利要求1所述的显示面板，其中，每一所述焊盘的所述平截锥体的至少一个侧面与底面的夹角范围在40度～50度之间。
  3. 如权利要求2所述的显示面板，其中，每一所述焊盘的所述平截锥体的至少一个侧面与底面的夹角为45度。
  4. 如权利要求1所述的显示面板，其中，每一所述焊盘为平截四角椎体或者平截圆锥体。
  5. 如权利要求1所述的显示面板，其中，所述多个焊盘的材料包括铜、铝、银、钴、钯、铁、镉、镍、以及其组合。
  6. 如权利要求1所述的显示面板，其中，每一所述焊盘的高度范围在8微米～10微米之间。
  7. 如权利要求6所述的显示面板，其中，所述反射层的厚度范围在55微米～60微米之间。
  8. 一种显示面板的制造方法，包括以下步骤：
    形成驱动基板，所述驱动基板包括所述显示面板的驱动电路的多个走线；
    在所述驱动基板上形成多个焊盘，所述多个焊盘电性连接所述驱动基板中的所述驱动电路的所述多个走线，每二个所述焊盘成对设置，每一所述焊盘形成为平截锥体；
    在所述驱动基板上形成反射层，所述反射层形成于相邻的二对所述焊盘之间，所述反射层的材料包括光固化反射油墨；以及
    在每一对所述焊盘上电性连接发光单元。
  9. 如权利要求8所述的显示面板的制造方法，其中，每一所述焊盘的所述平截锥体的至少一个侧面与底面的夹角范围在40度～50度之间。
  10. 如权利要求9所述的显示面板的制造方法，其中，每一所述焊盘的所述平截锥体的至少一个侧面与底面的夹角为45度。
  11. 如权利要求8所述的显示面板的制造方法，其中，每一所述焊盘为平截四角椎体或者平截圆锥体。
  12. 如权利要求8所述的显示面板的制造方法，其中，所述多个焊盘的材料包括铜、铝、银、钴、钯、铁、镉、镍、以及其组合。
  13. 如权利要求8所述的显示面板的制造方法，其中，每一所述焊盘的高度范围在8微米～10微米之间。
  14. 如权利要求13所述的显示面板的制造方法，其中，所述反射层的厚度范围在55微米～60微米之间。
  15. 如权利要求8所述的显示面板的制造方法，其中，在所述驱动基板上形成多个焊盘的步骤中，还包括以下步骤：
    在所述驱动基板表面形成电镀种子层；
    在所述电镀种子层上形成光刻胶；
    图案化所述光刻胶，以在每一所述焊盘预定形成的区域形成平截锥体的空穴；
    电镀所述光刻胶以及所述电镀种子层，以形成填满所述光刻胶的所述空穴的所述焊盘；
    移除所述光刻胶；以及
    蚀刻所述多个焊盘以及所述电镀种子层，以移除所述多个焊盘形成的所述区域以外的电镀种子层。
  16. 如权利要求15所述的显示面板的制造方法，其中，所述电镀种子层的厚度范围在0.5微米～1微米之间。
  17. 如权利要求15所述的显示面板的制造方法，其中，所述电镀种子层的材料包括铜、铝、银、钴、钯、铁、镉、镍、以及其组合。
  18. 如权利要求15所述的显示面板的制造方法，其中，所述光刻胶的材料包括负性光刻胶。
  19. 如权利要求15所述的显示面板的制造方法，其中，所述空穴的深度大于或等于每一所述焊盘的高度，并且所述空穴的所述深度与每一所述焊盘的所述高度的差值范围在0微米～5微米之间。
  20. 如权利要求15所述的显示面板的制造方法，其中，所述光刻胶的厚度范围在10微米～12微米之间。
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