WO2022134112A1 - 显示基板及其制备方法、显示装置 - Google Patents

显示基板及其制备方法、显示装置 Download PDF

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Publication number
WO2022134112A1
WO2022134112A1 PCT/CN2020/139715 CN2020139715W WO2022134112A1 WO 2022134112 A1 WO2022134112 A1 WO 2022134112A1 CN 2020139715 W CN2020139715 W CN 2020139715W WO 2022134112 A1 WO2022134112 A1 WO 2022134112A1
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WIPO (PCT)
Prior art keywords
light
substrate
layer
emitting devices
away
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PCT/CN2020/139715
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English (en)
French (fr)
Inventor
李金鹏
孙海威
李沛
张腾
李健
曹鹏军
汪志强
舒宗英
Original Assignee
京东方科技集团股份有限公司
京东方晶芯科技有限公司
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Application filed by 京东方科技集团股份有限公司, 京东方晶芯科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2020/139715 priority Critical patent/WO2022134112A1/zh
Priority to CN202080003768.8A priority patent/CN114981993A/zh
Priority to US17/760,817 priority patent/US20230163264A1/en
Priority to TW112115988A priority patent/TW202337025A/zh
Priority to TW110136459A priority patent/TWI805003B/zh
Publication of WO2022134112A1 publication Critical patent/WO2022134112A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a display substrate, a preparation method thereof, and a display device.
  • Sub-millimeter light-emitting diode Mini Light Emitting Diode, referred to as Mini LED
  • micro light-emitting diode Micro Light Emitting Diode, referred to as Micro LED
  • a display substrate includes: a substrate; a plurality of light-emitting devices arranged on one side of the substrate, the plurality of light-emitting devices are arranged at intervals from each other; the plurality of light-emitting devices are divided into multiple groups, and each group of light-emitting devices includes at least a light-emitting device; a first light-adjusting layer, disposed between each adjacent two groups of light-emitting devices, and having a gap with at least one side surface of the adjacent light-emitting devices; and, disposed on the plurality of light-emitting devices and
  • the first light adjustment layer is a first fixed layer on the side away from the substrate; the first fixed layer is a light-transmitting film.
  • the first light-modulating layer includes multiple layers of light-modulating sublayers arranged in layers.
  • the multi-layer light conditioning sub-layers include: a first light conditioning sub-layer and a second light conditioning sub-layer that are stacked in a direction perpendicular to and away from the substrate.
  • the orthographic projection of the first light conditioning sub-layer on the substrate coincides with the orthographic projection of the second light conditioning sub-layer on the substrate, or, the second light conditioning sub-layer is located on the substrate. within the orthographic projection on the substrate.
  • a surface of the first light adjustment layer away from the substrate is level with the surface of the light emitting device away from the substrate, or lower than the surface of the light emitting device.
  • the light emitting device is away from one side surface of the substrate.
  • the The ratio of the distance between the surface of the first light adjusting layer away from the substrate and the substrate to the distance between the surface of the light-emitting device away from the substrate and the substrate Greater than or equal to 4:5 and less than 1:1.
  • each side of the at least one light emitting device has a gap with the first light-modulating layer.
  • the outer boundary of the orthographic projection of the first light-modulating layer on the substrate coincides with or approximately coincides with the edge of the substrate; the first light-modulating layer is away from the substrate
  • the included angle between one side surface of the first light adjustment layer and the side surface of the first light adjustment layer corresponding to the edge of the substrate is a right angle or an approximate right angle.
  • the portion of the first light adjustment layer located between the two adjacent light emitting devices having a plurality of cross-sections parallel to the substrate.
  • the orthographic projection on the substrate of a section other than the section closest to the substrate and the section farthest from the substrate, the section located closest to the substrate is on the substrate within the orthographic projection range.
  • a cross section of a portion of the first light adjustment layer located between the two adjacent light emitting devices include trapezoids or near trapezoids.
  • the areas of orthographic projections of the plurality of cross sections on the substrate decrease sequentially along a direction perpendicular to and away from the substrate.
  • the length of the trapezoid or the approximate trapezoid near the lower base of the substrate is greater than the length of the upper base away from the substrate.
  • the first light adjustment layer is located between the two adjacent light emitting devices.
  • the cross-sectional shape of the part includes an approximate trapezoid
  • the approximate trapezoid is far from the upper bottom edge of the substrate, and the side located between the upper bottom edge and the lower bottom edge of the approximate trapezoid close to the substrate Smooth edge transitions.
  • each set of light emitting devices includes one light emitting device.
  • the first light adjustment layer is located between any two adjacent light emitting devices.
  • a portion of the first pinned layer is located in a gap between the first light modulation layer and an adjacent light emitting device.
  • the display substrate further includes: a second fixing layer; the second fixing layer is a light-transmitting film.
  • the second fixing layer includes a plurality of fixing patterns arranged at intervals from each other.
  • a fixing pattern wraps around a group of light-emitting devices to fix the group of light-emitting devices.
  • the first light adjustment layer is located in a gap between any two adjacent fixed patterns among the plurality of fixed patterns, and is in contact with the plurality of fixed patterns.
  • the first fixed layer is located on a side of the second fixed layer and the first light adjustment layer away from the substrate.
  • a cross section of a portion of the first light adjustment layer located between the two adjacent light emitting devices include trapezoids or near trapezoids.
  • the length of the trapezoid or the approximate trapezoid near the lower base of the substrate is smaller than the length of the upper base away from the substrate.
  • each group of light emitting devices includes at least two light emitting devices, and the fixing pattern fixes the at least two light emitting devices.
  • the light emitting device is configured to emit light of one color.
  • the color of light emitted by each light-emitting device includes at least one color.
  • the display substrate further includes: a plurality of light-transmitting particles disposed on a side of the first fixed layer away from the substrate.
  • the plurality of light-transmitting particles are configured such that a propagation direction of at least a portion of the light rays incident on the plurality of light-transmitting particles is changed.
  • the plurality of light-transmitting particles are arranged in an array.
  • the range of the distance between any two adjacent light-transmitting particles is 100 ⁇ m ⁇ 5 ⁇ m.
  • the thickness of each light-transmitting particle was in the range of 9 ⁇ m ⁇ 3 ⁇ m.
  • the size of the orthographic projection of each light-transmitting particle on the substrate is in the range of 50 ⁇ m ⁇ 5 ⁇ m.
  • the surface shape of the plurality of light-transmitting particles includes at least one of pyramid, wedge, arc and spherical.
  • the display substrate further comprises: a plurality of functional devices; at least one functional device and the plurality of light emitting devices are located on the same side of the substrate.
  • the plurality of functional devices are configured to provide sensing signals and/or to provide control signals to the plurality of light emitting devices.
  • a side surface of the first fixed layer away from the substrate is higher than a side surface of the at least one functional device away from the substrate, and higher than a side surface of the at least one functional device away from the substrate.
  • the plurality of light emitting devices are away from one side surface of the substrate.
  • the plurality of functional devices includes a plurality of driver chips.
  • the plurality of driver chips are located on the same side of the substrate as the plurality of light emitting devices; one driver chip is electrically connected to a group of light emitting devices; the driver chip is configured to provide control to the group of light emitting devices Signal.
  • the display substrate further includes: a second light adjustment layer disposed on a surface of the plurality of driving chips away from the substrate; the second light adjustment layer is configured to reduce the number of driving chips The reflection of light incident on its surface.
  • a side surface of the first fixed layer away from the substrate is higher than a side surface of the driving integrated circuit away from the substrate.
  • the material of the second light adjustment layer is the same as the material of the first light adjustment layer; or, the material of the second light adjustment layer is the same as the material of the first fixed layer.
  • the display substrate further comprises: a light reflection layer disposed on the side surface of the light emitting device.
  • the light reflective layer is configured to reflect light emitted from the light emitting device and incident on the light reflective layer.
  • a side surface of the first light adjustment layer away from the substrate is higher than a side surface of the light emitting device away from the substrate.
  • the The ratio between the distance between the side surface of the first light adjustment layer away from the substrate and the substrate and the dimension of the light-emitting device in the direction parallel to the substrate is greater than or equal to 1 :1, and less than or equal to
  • a method for preparing a display substrate includes: providing a substrate; one side of the substrate is provided with a plurality of light-emitting devices spaced from each other, the plurality of light-emitting devices are divided into multiple groups, and each group of light-emitting devices includes at least one light-emitting device .
  • a first light-adjusting layer is formed between each adjacent two groups of light-emitting devices by using an inkjet printing process; a gap is formed between the first light-adjusting layer and at least one side surface of the adjacent light-emitting devices.
  • An inkjet printing process is used to form a first fixed layer on the side of the plurality of light-emitting devices away from the substrate and the side of the first light adjustment layer away from the substrate; the first fixed layer is transparent light film.
  • forming the first light adjustment layer between each adjacent two groups of light-emitting devices by using an inkjet printing process includes: using an inkjet printing process to sequentially form multiple layers of light between each adjacent two groups of light-emitting devices A conditioning sublayer; the multilayer light conditioning sublayers are stacked to form the first light conditioning layer.
  • using an inkjet printing process to sequentially form multiple layers of light adjustment sublayers between each adjacent two groups of light-emitting devices includes: using an inkjet printing process to form between each adjacent two groups of light-emitting devices A first light adjustment sub-layer is formed therebetween; there is a gap between the first light adjustment sub-layer and the adjacent light-emitting device.
  • a second light conditioning sublayer is formed on the side of the first light conditioning sublayer away from the substrate by an inkjet printing process; the second light conditioning sublayer covers the first light conditioning sublayer, and is connected to the first light conditioning sublayer. There is a gap between at least one side surface of adjacent light emitting devices.
  • the step of forming a first light adjustment layer between each adjacent two groups of light-emitting devices by an inkjet printing process includes: forming a retaining wall on an edge of the substrate by an inkjet printing process;
  • the orthographic projection of the retaining wall on the substrate is annular, and the thickness of the retaining wall and the distance between the surface of the side surface of the plurality of light-emitting devices away from the substrate and the substrate are equal or roughly equal.
  • An inkjet printing process is used to form a filling part in the retaining wall; the filling part and the retaining wall form the first light-adjusting layer, and the first light-adjusting layer is away from the surface of one side of the substrate,
  • the included angle with the side surface of the first light adjusting layer corresponding to the edge of the substrate is a right angle or an approximate right angle.
  • the preparation method before the inkjet printing process is used to form the first light adjustment layer between each adjacent two groups of light-emitting devices, the preparation method further includes: using the inkjet printing process A fixed pattern is formed on a side away from the substrate; the fixed pattern surrounds a group of light-emitting devices, so as to fix the group of light-emitting devices; a plurality of fixed patterns constitute a second fixed layer.
  • a display device in yet another aspect, includes: the display substrate as described in any of the above embodiments.
  • FIG. 1 is a top view of a display substrate according to some embodiments of the present disclosure.
  • FIG. 2 is a cross-sectional view along the A-A' direction of the display substrate shown in FIG. 1;
  • Fig. 3 is the partial schematic diagram in the sectional view shown in Fig. 2;
  • Fig. 4 is the partial schematic diagram in the sectional view shown in Fig. 2;
  • Fig. 5 is the partial schematic diagram in the sectional view shown in Fig. 2;
  • FIG. 6 is another cross-sectional view along the A-A' direction of the display substrate shown in FIG. 1;
  • FIG. 7 is a light path diagram of a display substrate according to some embodiments of the present disclosure.
  • FIG. 8 is another cross-sectional view along the A-A' direction of the display substrate shown in FIG. 1;
  • FIG. 9 is another light path diagram of a display substrate according to some embodiments of the present disclosure.
  • FIG. 10 is still another light path diagram of a display substrate according to some embodiments of the present disclosure.
  • FIG. 11 is still another light path diagram of a display substrate according to some embodiments of the present disclosure.
  • FIG. 12 is another cross-sectional view along the A-A' direction of the display substrate shown in FIG. 1;
  • FIG. 13 is a top view of another display substrate according to some embodiments of the present disclosure.
  • FIG. 14 is a cross-sectional view of the display substrate shown in FIG. 11 along the B-B' direction;
  • FIG. 15 is another cross-sectional view of the display substrate shown in FIG. 11 along the B-B' direction;
  • FIG. 16 is another cross-sectional view of the display substrate shown in FIG. 11 along the B-B' direction;
  • 17 is a SEM (Scanning Electron Microscope, scanning electron microscope) image of a light-transmitting particle according to some embodiments of the present disclosure
  • FIG. 19 is a structural diagram of a light emitting device according to some embodiments of the present disclosure.
  • FIG. 20 is a structural diagram of a substrate according to some embodiments of the present disclosure.
  • 21 is a structural diagram of a display substrate according to some embodiments of the present disclosure.
  • FIG. 22 is a structural diagram of another substrate according to some embodiments of the present disclosure.
  • FIG. 23 is a partial structural diagram of a display substrate according to some embodiments of the present disclosure.
  • FIG. 24 is a flowchart of a method for fabricating a display substrate according to some embodiments of the present disclosure.
  • Figure 25 is a flow chart of a preparation method of S200 in the flow chart shown in Figure 24;
  • Figure 26 is a flow chart of another preparation method of S200 in the flow chart shown in Figure 24;
  • FIG. 27 is a flowchart of another method for fabricating a display substrate according to some embodiments of the present disclosure.
  • FIGS. 28( a ) to 28 ( g ) are diagrams showing steps of preparing a display substrate according to some embodiments of the present disclosure
  • FIGS. 29( a ) to 29 ( d ) are diagrams showing the steps of preparing another display substrate according to some embodiments of the present disclosure.
  • FIG. 30 is a structural diagram of a light conditioning sub-layer according to some embodiments of the present disclosure.
  • FIG. 31 is a structural diagram of a light modulation layer according to some embodiments of the present disclosure.
  • FIG. 32 is a structural diagram of a first pinned layer according to some embodiments of the present disclosure.
  • FIG. 33 is a structural diagram of another first pinned layer according to some embodiments of the present disclosure.
  • FIG. 34 is a structural diagram of a display device according to some embodiments of the present disclosure.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
  • plural means two or more.
  • connection and its derivatives may be used.
  • the term “connected” may be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.
  • At least one of A, B, and C has the same meaning as “at least one of A, B, or C”, and both include the following combinations of A, B, and C: A only, B only, C only, A and B , A and C, B and C, and A, B, and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • Exemplary embodiments are described herein with reference to cross-sectional and/or plan views that are idealized exemplary drawings.
  • the thickness of layers and regions are exaggerated for clarity. Accordingly, variations from the shapes of the drawings due to, for example, manufacturing techniques and/or tolerances, are contemplated.
  • example embodiments should not be construed as limited to the shapes of the regions shown herein, but to include deviations in shapes due, for example, to manufacturing. For example, an etched area shown as a rectangle will typically have curved features.
  • the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
  • Mini LED or Micro LED can emit light of various colors, such as red, green, blue or white.
  • the Mini LEDs or Micro LEDs can be arranged in the sub-pixel area of the display substrate and displayed directly as a part of the sub-pixels.
  • the display substrate is applied with multiple Mini LEDs as an example.
  • a black material is usually arranged between the plurality of Mini LEDs, so as to use the black material to improve the contrast ratio of the display substrate.
  • black glue is usually coated in the gaps between the above-mentioned multiple Mini LEDs and on the surfaces of the multiple Mini LEDs, so that the black glue is in contact with the sides and surfaces of the Mini LEDs, so as to facilitate the
  • the black glue is used to improve the contrast of the display substrate and fix each Mini LED.
  • the black glue is usually silica gel doped with black particles, in the process of grinding the black glue, the black particles are easily disintegrated from the silica gel, resulting in uneven surface of the ground black glue and poor consistency. .
  • a black film is usually provided on a film (such as polyethylene terephthalate, Polyethylene terephthalate, PET for short) to form a black film, and then the black film of the black film is attached to the display substrate.
  • the plurality of Mini LEDs are opposite to each other, and the black film is pressed on the display substrate by a pressing process, so that the plurality of Mini LEDs penetrate into the black glue and are in contact with the black glue.
  • the area of the black film will be larger than that of the display substrate. After pressing the black film on the display substrate, it is necessary to use a laser process to remove the part of the black film beyond the edge of the display substrate, which will cause the remaining part of the black film to be removed.
  • the edge of the thin film in the film is damaged to cause a phenomenon of whitening, which in turn leads to a poor splicing effect of a substrate formed by splicing a plurality of display substrates.
  • some embodiments of the present disclosure provide a display substrate 100 .
  • the display substrate 100 has a plurality of sub-pixel regions P, and the plurality of sub-pixel regions P can be arranged in an array, for example.
  • the display substrate 100 may include: a substrate 1 .
  • the types of the substrate 1 may include multiple types, and settings may be selected according to actual needs.
  • the substrate 1 may be a rigid substrate.
  • the rigid substrate is, for example, a glass substrate or a PMMA (Polymethyl methacrylate, polymethyl methacrylate) substrate.
  • the substrate 1 may be a flexible substrate.
  • the flexible substrate is, for example, a PET (Polyethylene terephthalate, polyethylene terephthalate) substrate, a PEN (Polyethylene naphthalate two formic acid glycol ester, polyethylene naphthalate) substrate or a PI (Polyimide, polyimide) substrate.
  • the display substrate 100 may further include: a plurality of light emitting devices 2 disposed on one side of the substrate 1 .
  • the plurality of light emitting devices 2 are arranged at intervals from each other, that is, there is a gap between any two adjacent light emitting devices 2 .
  • the above-mentioned plurality of light-emitting devices 2 have various setting modes, and the setting can be selected according to actual needs.
  • one light-emitting device 2 may be disposed in one sub-pixel area P, and at this time, the one light-emitting device 2 may be used to display the sub-pixels in the corresponding sub-pixel area P.
  • a plurality of light-emitting devices 2 may be disposed in one sub-pixel region P, and in this case, the plurality of light-emitting devices 2 may be jointly used for displaying the sub-pixels in the corresponding sub-pixel region P.
  • the process of displaying only a part of the light-emitting devices 2 in the plurality of light-emitting devices 2 in the sub-pixel area P may display, and when a certain light-emitting device 2 in the part of the light-emitting devices 2 is abnormal, Instead of the light emitting device 2, other light emitting devices 2 may be used for display.
  • the above-mentioned plurality of light-emitting devices 2 may be divided into multiple groups, wherein each group of light-emitting devices 2 may include at least one light-emitting device 2 .
  • each group of light emitting devices 2 may include one light emitting device.
  • each group of light emitting devices 2 may include two light emitting devices 2 .
  • each group of light emitting devices 2 may include three light emitting devices 2 .
  • a group of light-emitting devices 2 may correspond to one or two or even more sub-pixel regions P, for example.
  • a group of light-emitting devices 2 may correspond to one sub-pixel region P, for example.
  • the display substrate 100 may further include: a first light adjustment layer 3 .
  • the first light adjustment layer 3 is disposed between each adjacent two groups of light emitting devices 2 .
  • each group of light-emitting devices 2 includes at least one light-emitting device 2 . That is, each group of light emitting devices 2 may include one light emitting device 2 or at least two light emitting devices 2 .
  • the setting manner of the first light adjusting layer 3 is related to the number of light emitting devices 2 included in each group of light emitting devices 2, and the setting can be selected according to actual needs.
  • each group of light emitting devices 2 may include one light emitting device 2 .
  • the first light-adjusting layer 3 is disposed between each adjacent two groups of light-emitting devices 2 , that is, the first light-adjusting layer 3 may be located between any two adjacent light-emitting devices 2 . At this time, a part of the first light adjustment layer 3 is disposed between every two adjacent light emitting devices 2 .
  • the first light-adjusting layer 3 may be in the shape of a mesh, and each mesh is provided with a light-emitting device 2 .
  • each group of light emitting devices 2 may include at least two light emitting devices 2 .
  • the first light adjustment layer 3 is disposed between each adjacent two groups of light emitting devices 2 , that is, the first light adjustment layer 3 may be located between every two adjacent light emitting devices 2 in a part of the light emitting devices 2 . At this time, a part of the first light adjustment layer 3 is disposed between each adjacent two groups of light emitting devices 2 .
  • the first light-adjusting layer 3 may be in the shape of a grid, and each mesh is provided with a group of light-emitting devices 2 (ie, at least two light-emitting devices 2 ).
  • the three light-emitting devices 2 are arranged in the arrangement shown in The first light adjustment layer 3 is not disposed between two adjacent light emitting devices 2 .
  • the above-mentioned adjacent light emitting devices 2 refer to at least one light emitting device 2 among all the light emitting devices 2 adjacent to the first light adjusting layer 3 .
  • the at least one side surface refers to at least one side surface of one light emitting device 2 of the at least one light emitting device 2 adjacent to the first light conditioning layer 3 .
  • the side surface refers to a surface that is perpendicular or approximately perpendicular to the substrate 1 among the multiple surfaces of the light-emitting device 2 .
  • the first light-adjusting layer 3 is disposed adjacent to the plurality of light-emitting devices 2, and there is a gap between one side surface of one light-emitting device 2 in the plurality of light-emitting devices 2 and the first light-adjusting layer 3, and the one light-emitting device 2 has a gap.
  • the remaining side surfaces of the light emitting device 2 are in contact with the first light adjusting layer 3
  • the side surfaces of the light emitting devices 2 in the plurality of light emitting devices 2 except the one light emitting device 2 are all in contact with the first light adjusting layer 3 .
  • each side surface of the at least one light emitting device 2 and the first light adjustment layer have a gap.
  • the first light adjustment layer 3 is disposed adjacent to the plurality of light emitting devices 2 , and there are gaps between the first light adjustment layer 3 and each side surface of one light emitting device 2 . That is, no contact is formed between the first light adjustment layer 3 and the light emitting device 2 .
  • the first light adjustment layer 3 is disposed adjacent to the plurality of light emitting devices 2 , and there are gaps between the first light adjustment layer 3 and each side surface of the at least two light emitting devices 2 . That is, no contact is formed between the first light adjustment layer 3 and the at least two light emitting devices 2 .
  • the first light-adjusting layer 3 is formed by curing a flowable light-absorbing material.
  • the first light adjustment layer 3 is configured to absorb at least a part of the light incident on the first light adjustment layer 3 .
  • the light incident on the first light adjusting layer 3 may include: natural light incident on the first light adjusting layer 3 from the outside world, and/or light emitted by the light emitting device 2 .
  • the substrate 1 may reflect natural light incident on the surface of the substrate 1 .
  • the first light adjustment layer 3 can be used to absorb at least a part of the natural light incident on the substrate 1, so as to reduce the reflection of the natural light by the substrate 1.
  • the first light adjustment layer 3 can be used to reduce the amount of natural light incident on the display substrate 100 from the outside and reflected by the substrate 1 , so that the display state of the display substrate 100 appears as a dark state. (that is, the light-emitting device 2 does not emit light), the display surface of the display substrate 100 can be made to be in a darker state, thereby effectively improving the contrast ratio of the display substrate 100 .
  • the propagation direction of the light emitted by the light emitting device 2 is basically any direction.
  • the first light-adjusting layer 3 is disposed between the adjacent two groups of light-emitting devices 2 , at least a part of the light emitted by the light-emitting device 2 and incident on the first light-adjusting layer 3 can be absorbed by the first light-adjusting layer 3 .
  • the first light adjustment layer 3 can be used to weaken or even eliminate the light mixing phenomenon, thereby improving the display effect of the display substrate 100 .
  • the flowable light-absorbing material means that the light-absorbing material has fluid properties. After the flowable light-absorbing material is dropped onto a surface with protrusions and depressions to form a film, the film can flow from the protrusions to the depressions, regardless of the shape of the depressions, based on the presence of surface tension of the liquid , the surface of the side of the film away from the protrusions and depressions is basically kept as a relatively flat surface without unevenness.
  • Curing refers to that after a flowable light-absorbing material is used to form a thin film, and the thin film flows for a certain period of time, the thin film is converted into a solid state, so that the form of the thin film remains in the form when it was converted into a solid state.
  • the first light-adjusting layer 3 is formed by curing a flowable light-absorbing material, that is, the surface of the first light-adjusting layer 3 on the side away from the substrate 1 is basically a relatively flat surface without unevenness. Consistency is high. Also, there is no difference in appearance between the portion at the edge and the portion at the center of the first light conditioning layer 3 .
  • the texture of the surface of the side surface of the first light adjustment layer 3 away from the substrate 1 is, for example, similar to that of baking paint.
  • the material of the first light adjustment layer 3 may include, for example, a polyacetic acid resin material, which may be doped with carbon powder or dye, for example, so that the color of the first light adjustment layer 3 is darker and can be irradiated to It absorbs its own light.
  • the color of the first light adjustment layer 3 includes but is not limited to black.
  • the color of the first light adjustment layer 3 may also be green or brown.
  • the color of the first light adjustment layer 3 can be selected and set according to actual needs, so as to realize the corresponding function (for example, to reflect the light irradiated to itself, etc.).
  • the display substrate 100 may further include: a first fixed layer 4 disposed on the side of the plurality of light emitting devices 2 and the first light adjustment layer 3 away from the substrate 1 .
  • the first fixing layer 4 is a light-transmitting film. That is, the first fixed layer 4 may have better light transmittance, which can reduce or avoid the loss of light passing through the first fixed layer 4, so that the light emitting device 2 emits light to make the display substrate 100 display. In the process, it can have higher light extraction efficiency.
  • the light transmittance of the first fixing layer 4 may range from 96% to 98%.
  • the light transmittance can be 96%, 96.5%, 97%, 97.9%, or 98%.
  • the surface of the first fixed layer 4 on the side away from the substrate 1 may be higher than the surface of the plurality of light emitting devices 2 on the side away from the substrate 1 .
  • the first fixed layer 4 can cover the above-mentioned plurality of light emitting devices 2 , so that the plurality of light emitting devices 2 can be located within the orthographic projection range of the first fixed layer 4 on the substrate 1 .
  • the surfaces of the multiple light emitting devices 2 away from the substrate 1 can be prevented from being exposed, and the surfaces of the multiple light emitting devices 2 away from the substrate 1 can be protected to prevent the multiple light emitting devices 2 from being damaged.
  • the first fixing layer 4 covers at least a part of the above-mentioned first light adjusting layer 3 .
  • the outer boundary of the orthographic projection of the first light adjustment layer 3 on the substrate 1 and the orthographic projection boundary of the first fixed layer 4 on the substrate 1 may at least partially overlap, or, the outer boundary of the first light adjustment layer 3 on the substrate 1 may at least partially overlap.
  • the orthographic projection is located within the orthographic projection range of the first fixed layer 4 on the substrate 1, or, the orthographic projection of the first fixed layer 4 on the substrate 1 is located within the orthographic projection range of the first light adjustment layer 3 on the substrate 1 Inside.
  • the first fixing layer 4 is formed by curing a flowable light-transmitting material. That is, the surface of the side of the first fixed layer 4 away from the substrate 1 is basically a relatively flat surface without unevenness, and the consistency of the surface is relatively high. Also, there is no difference in appearance between the portion located at the edge and the portion located in the middle of the first fixing layer 4 .
  • the texture of the surface of the side of the first fixed layer 4 away from the substrate 1 is, for example, similar to that of baking paint.
  • the material of the first fixed layer 4 may include, for example, a polyacetic acid resin material, which may be doped with, but not limited to, titanium dioxide or diffusion powder, for example.
  • the first fixing layer 4 is configured to fix the plurality of light emitting devices 2 and the first light adjusting layer 3 .
  • the first fixed layer 4 is located on the side of the above-mentioned plurality of light emitting devices 2 and the first light adjustment layer 3 away from the substrate 1, which can make the first fixed layer 4 and the plurality of light emitting devices 2 have a certain bonding force, and make There is a certain bonding force between the first fixed layer 4 and the first light adjustment layer 3 .
  • the first fixed layer 4 is a one-sided film, the first fixed layer 4 can fix the plurality of light emitting devices 2 through the first light regulating layer 3 , and the first light regulating layer 3 can be fixed by the plurality of light emitting devices 2 to be fixed.
  • a part of the first pinned layer 4 is located in the gap between the first light adjustment layer 3 and the adjacent light emitting devices 2 .
  • the flowable light-transmitting material is cured before, the flowable light-transmitting material can flow into the gap between the first light-adjusting layer 3 and the adjacent light-emitting device 2 to fill the gap, thereby making the first fixed layer 4 formed by curing the part in the gap.
  • the contact area between the first fixed layer 4 and the light emitting device 2 and between the first fixed layer 4 and the first light adjustment layer 3 can be increased, and the contact area between the first fixed layer 4 and the light emitting device 2 and the first
  • the bonding force between the fixed layer 4 and the first light adjustment layer 3 further enhances the fixation effect of the first fixed layer 4 on the light emitting device 2 and the first light adjustment layer 3 .
  • the first light adjustment layer 3 is disposed between two adjacent light emitting devices 2, and the light emitting device 2 and the first light adjustment layer 3 are far away from the substrate.
  • the first fixed layer 4 is formed on one side of the 1, which can not only absorb the natural light incident on the first light adjustment layer 3 from the outside by using the first light adjustment layer 3, improve the contrast of the display substrate 100, and improve the contrast of the display substrate 100. 2.
  • the light emitted and incident on the first light adjusting layer 3 is absorbed, weakening or even eliminating the light mixing phenomenon, and improving the display effect of the display substrate 100.
  • the first fixed layer 4 can also be used for the light-emitting device 2 and the first light adjusting layer 3. Fixing is performed to prevent the light-emitting device 2 from falling off.
  • the fixing effect of the adjustment layer 3 can also make the surface of the first light adjustment layer 3 away from the substrate 1 and the surface of the first fixed layer 4 away from the substrate 1 to be basically relatively flat surfaces, and between the two surfaces. There is no difference in appearance between the part at the edge and the part at the center. This can effectively improve the consistency of the surface of the first light adjustment layer 3 away from the substrate 1 and the surface of the first fixed layer 4 away from the substrate 1, and improve the consistency of the substrate formed by splicing a plurality of display substrates 100. Stitching effect.
  • the first light adjustment layer 3 includes multiple layers of light adjustment sub-layers 31 arranged in layers.
  • a layer of light adjustment sub-layers 31 can be formed in one corresponding preparation process, and then a multi-layer light adjustment sub-layer 31 can be obtained after corresponding preparation processes performed multiple times at a time.
  • the above-mentioned multilayer light conditioning sub-layer 31 may include: a first light conditioning sub-layer 31 a and a second light conditioning sub-layer 31 b stacked in a direction perpendicular to and away from the substrate 1 .
  • the orthographic projection of the first light conditioning sub-layer 31 a on the substrate 1 coincides with the orthographic projection of the second light conditioning sub-layer 31 b on the substrate 1 . That is, the orthographic projection area of the first light conditioning sublayer 31a on the substrate 1 is equal to the orthographic projection area of the second light conditioning sublayer 31b on the substrate 1, and the second light conditioning sublayer 31b can cover the first light
  • the adjustment sub-layer 31 a is away from the side surface of the substrate 1 .
  • the orthographic projection of the first light conditioning sub-layer 31 a on the substrate 1 is located within the orthographic projection range of the second light conditioning sub-layer 31 b on the substrate 1 . That is, the orthographic projection area of the first light conditioning sublayer 31a on the substrate 1 is smaller than the orthographic projection area of the second light conditioning sublayer 31b on the substrate 1, and the second light conditioning sublayer 31b can not only cover the first light
  • the surface of the adjustment sub-layer 31 a away from the substrate 1 may also cover the surface of the first light adjustment sub-layer 31 a facing the adjacent light emitting device 2 .
  • no other light adjustment sub-layer 31 may be disposed between the first light adjustment sub-layer 31a and the second light adjustment sub-layer 31b, that is, the two are in direct contact.
  • at least one layer of light conditioning sub-layer 31 may also be disposed between the first light conditioning sub-layer 31a and the second light conditioning sub-layer 31b.
  • first light conditioning sub-layer 31a may be in contact with the substrate 1, and no other light conditioning sub-layer 31 is disposed therebetween.
  • at least one layer of light adjustment sublayer 31 may also be disposed between the first light adjustment sublayer 31 a and the substrate 1 .
  • the first light conditioning sub-layer 31a under the condition that the first light conditioning sub-layer 31a is in contact with the substrate 1, the first light conditioning sub-layer 31a can be formed in the first corresponding preparation process.
  • the orthographic projection area of the first light adjustment sub-layer 31 a on the substrate 1 is small, for example, there may be gaps between all the adjacent light emitting devices 2 . In this way, the formation of the subsequent light adjustment sub-layer 31 can be avoided.
  • the positional relationship between the first light adjustment layer 3 and the light emitting device 2 includes various positions, which can be selected and set according to actual needs.
  • the first light adjustment layer 3 is on a side surface far away from the substrate 1 , and the light-emitting device 2 is far away from the substrate 1 on a side surface flat.
  • the surface of the first light adjustment layer 3 away from the substrate 1 and the surface of the light emitting device 2 away from the substrate 1 are located on the same plane, and the surface of the first light adjustment layer 3 away from the substrate 1 and the substrate
  • the distance between 1 is equal to the distance between the surface of the light-emitting device 2 away from the substrate 1 and the substrate 1 .
  • the pitch can be 80 ⁇ m.
  • the above-mentioned light-emitting devices 2 may refer to all the light-emitting devices 2 included in the display substrate 100 , or may refer to a part of the light-emitting devices 2 among all the light-emitting devices 2 included in the display substrate 100 .
  • the descriptions about the light emitting device 2 in the following two examples are the same, and will not be repeated below.
  • the surface of the first light adjustment layer 3 is far from the substrate 1 , and is lower than a surface of the light-emitting device 2 far away from the substrate 1 . side surface.
  • the ratio of the distance between the surface of the first light adjustment layer 3 away from the substrate 1 and the substrate 1 and the distance between the surface of the light emitting device 2 away from the substrate 1 and the substrate 1 Can be greater than or equal to 4:5 and less than 1:1.
  • the distance between the surface of the light-emitting device 2 away from the substrate 1 and the substrate 1 as 80 ⁇ m the distance between the surface of the first light adjustment layer 3 away from the substrate 1 and the substrate 1
  • the spacing may be greater than or equal to 64 ⁇ m (that is, 80% of the spacing between the surface of the light-emitting device 2 away from the substrate 1 and the substrate 1 ), and less than 80 ⁇ m.
  • the distance between the surface of the first light adjustment layer 3 away from the substrate 1 and the substrate 1 may be 64 ⁇ m, 70 ⁇ m, 71 ⁇ m, 73 ⁇ m, or 79.9 ⁇ m.
  • the side surface of the first light adjustment layer 3 away from the substrate 1 is higher than a surface of the light emitting device 2 away from the substrate 1 . side surface.
  • the first light adjustment layer 3 can absorb the light emitted by the light emitting device 2 and incident on the first light adjustment layer 3 , the first light adjustment layer 3 is far away from the substrate 1 relative to the substrate 1 .
  • the side surface of the bottom 1 is higher than the side surface of the light-emitting device 2 away from the substrate 1, the exit angle of the light emitted by the light-emitting device 2 can be reduced, and the viewing angle of the display substrate 100 can be reduced. Privacy function.
  • the ratio of the distance between the surface of the first light adjustment layer 3 on the side away from the substrate 1 and the substrate 1 and the distance between the dimensions of the light emitting device 2 in the direction parallel to the substrate 1 may be Greater than or equal to 1:1 and less than or equal to
  • the ratio of the distance between the surface of the first light adjusting layer 3 away from the side of the substrate 1 and the substrate 1 and the distance between the dimensions of the light-emitting device 2 in the direction parallel to the substrate 1 is equal to 1:
  • the viewing angle of the display substrate 100 may be 90°.
  • the ratio of the distance between the surface of the first light adjusting layer 3 on the side away from the substrate 1 and the substrate 1 to the dimension of the light emitting device 2 in the direction parallel to the substrate 1 is equal to In the case of , the viewing angle of the display substrate 100 may be 60°. That is, the viewing angle of the display substrate 100 may range from 60° to 90°.
  • the size of the light-emitting device 2 in the direction parallel to the substrate 1 may refer to the range formed by the side length and the diagonal length of the orthographic shape of the light-emitting device 2 on the substrate 1 any value of .
  • the side length of the square is, for example, 100 ⁇ m
  • the diagonal length of the square is, for example, Then the size range of the light-emitting device 2 in the direction parallel to the substrate 1 can be The range of the distance between the surface of the first light adjustment layer 3 away from the substrate 1 and the substrate 1 can be
  • the shape of the orthographic projection of the light emitting device 2 on the substrate 1 may also be other shapes, and the size of the shape may also be other sizes.
  • the present disclosure is only for the purpose of simply and clearly explaining the distance between the surface of the first light adjustment layer 3 on the side away from the substrate 1 and the substrate 1 and the size of the light emitting device 2 in the direction parallel to the substrate 1 .
  • the shape of the orthographic projection of the light-emitting device 2 on the substrate 1 and the size of the shape are not limited to those shown in the above examples.
  • a smooth transition can be made between the side surface of the first light adjustment layer 3 in contact with the light emitting device 2 and the side surface of the first light adjustment layer 3 away from the substrate 1 .
  • the range of the viewing angle of the display substrate 100 is the range of the angle formed between the light beam L and the tangent of the smooth transition portion in the first light adjustment layer 3 . Based on this, the ratio of the distance between the surface of the first light adjustment layer 3 away from the substrate 1 and the distance between the substrate 1 and the dimension of the light emitting device 2 in the direction parallel to the substrate 1 may be greater than
  • the distance range between the surface of the side close to the light emitting device 2 and the surface of the side far from the substrate 1 can be selected and set according to actual needs,
  • the light emitting device 2 and the first light adjusting layer 3 can be fixed, and the light transmittance can be relatively high.
  • the distance between the surface of the side close to the light emitting device 2 and the surface of the side away from the substrate may range from 40 ⁇ m to 50 ⁇ m.
  • the pitch may be 40 ⁇ m, 42 ⁇ m, 45 ⁇ m, 46.5 ⁇ m, 50 ⁇ m, or the like.
  • the first light adjustment layer 3 is located between the two adjacent light emitting devices 2 .
  • the part in between has a plurality of cross-sections F parallel to the substrate 1 .
  • the orthographic projection of a section F on the substrate 1 except a section F closest to the substrate 1 and a section F farthest away from the substrate 1, and a section F located closest to the substrate 1 is on the substrate 1 within the orthographic projection range.
  • a section F of the first light adjustment layer 3 closest to the substrate 1 may refer to a side surface of the first light adjustment layer 3 that is close to the substrate 1 .
  • a section F of the first light adjustment layer 3 that is farthest from the substrate 1 may refer to a surface of the first light adjustment layer 3 on a side away from the substrate 1 .
  • a section F other than a section F closest to the substrate 1 and a section F farthest from the substrate 1 may refer to, among the above-mentioned plurality of sections F, a section F located closest to the substrate 1 and a section F farthest away from the substrate 1 Any section F among a plurality of sections F between one section F of the substrate 1 .
  • the section F that is, a section F other than a section F closest to the substrate 1 and a section F farthest away from the substrate 1.
  • the orthographic projection area is smaller than the orthographic projection area of a section F closest to the substrate 1 on the substrate 1, and the perimeter of the outer boundary of the orthographic projection of the section F on the substrate 1 is smaller than that of the section F located closest to the substrate 1
  • the perimeter of the orthographic outer boundary on the substrate 1, the orthographic outer boundary of the section F on the substrate 1 does not overlap with the orthographic outer boundary of the section F closest to the substrate 1 on the substrate 1 or partially overlap.
  • the figure formed by the section F and the section F closest to the substrate 1 is narrower at one end (corresponding to the section F) and wider at the opposite end (corresponding to the section F closest to the substrate 1). graphics.
  • the projection relationship between the section F and a section F farthest from the substrate 1 may include various types.
  • the orthographic projection of a section F farthest from the substrate 1 on the substrate 1 may coincide with the orthographic projection of the section F on the substrate 1 .
  • the orthographic projection of a section F farthest from the substrate 1 on the substrate 1 may be located within the range of the orthographic projection of the section F on the substrate 1 .
  • the orthographic projection area of each of the above-mentioned sections F on the substrate 1 may gradually decrease (not decrease one by one).
  • the orthographic projection of the section F on the substrate 1 may be located within the range of the orthographic projection of the section F farthest from the substrate 1 on the substrate 1 . Based on unavoidable reasons of the manufacturing process or special design, the orthographic projection area of a section F farthest from the substrate 1 on the substrate 1 may be larger than the orthographic projection area of the section F on the substrate 1 .
  • the portion of the first light adjusting layer 3 located between the two adjacent light emitting devices 2 may have three cross sections F parallel to the substrate 1 .
  • the three sections F parallel to the substrate 1 are the first section f1 , the second section f2 and the third section f3 , respectively.
  • the first section f1 is a section F closest to the substrate 1
  • the third section f3 is a section F farthest from the substrate 1 .
  • the orthographic projection of the second section f2 on the substrate 1 is located within the range of the orthographic projection of the first section f1 on the substrate 1 .
  • the orthographic boundary of the second section f2 on the substrate 1 does not overlap or partially overlaps with the orthographic boundary of the first section f1 on the substrate 1 .
  • the area of the orthographic projection of the second section f2 on the substrate 1 is smaller than the area of the orthographic projection of the first section f1 on the substrate 1 .
  • the orthographic projection of the third section f3 on the substrate 1 may be located within the range of the orthographic projection of the second section f2 on the substrate 1, or the orthographic projection of the third section f3 on the substrate 1 may be the same as the second section.
  • the orthographic projections of f2 on the substrate 1 coincide.
  • the orthographic projection area of the third section f3 on the substrate 1 is smaller than or equal to the orthographic projection of the second section f2 on the substrate 1 .
  • the orthographic projection area of the third section f3 on the substrate 1 may also be larger than the orthographic projection area of the second section f2 on the substrate 1 .
  • the first light-adjusting layer of the first light-adjusting layer 3 is located in the two adjacent light-emitting devices.
  • the cross-sectional shape of the portion between 2 may include various shapes.
  • the above-mentioned cross-sectional shape may be, for example, a rectangle (ie, a rectangle or a positive direction).
  • the material of the first light adjusting layer 3 is filled more, so that the material of the first light adjusting layer 3 is in contact with the above-mentioned two adjacent light emitting devices 2 . At this time, there is no gap between the first light adjustment layer 3 and the two adjacent light emitting devices 2 , and the first light adjustment layer 3 is in contact with the two adjacent light emitting devices 2 .
  • the above-mentioned cross-sectional shape may be, for example, a trapezoid or an approximate trapezoid.
  • the material of the first light adjustment layer 3 is less filled, so that the material of the first light adjustment layer 3 does not form contact with the above-mentioned two adjacent light emitting devices 2 .
  • an approximate trapezoid refers to a shape similar to a trapezoid, and the approximate trapezoid may be partially irregular compared to a more regular trapezoid.
  • the side c located between the upper base b2 and the lower base b1 of the approximate trapezoid is non-linear.
  • the upper base b2 of the approximate trapezoid and the side c located between the upper base b2 and the lower base b1 are rounded transition.
  • the first light-adjusting layer 3 is formed by curing a flowable light-absorbing material, after the material of the first light-adjusting layer 3 is disposed on one side of the substrate 1, based on the existence of the surface tension of the liquid, the first light-adjusting layer 3 formed by curing can be cured.
  • the part of the light adjusting layer 3 located between the two adjacent light-emitting devices 2, the cross-sectional shape along the direction perpendicular to the center line of the substrate 1 and the two adjacent light-emitting devices 2 includes an approximate trapezoid, and the approximate trapezoid is A smooth transition between the upper bottom edge b2 and the side edge c.
  • the areas of the orthographic projections of the above-mentioned plurality of sections F on the substrate 1 decrease sequentially.
  • the length of the lower bottom edge b1 close to the substrate 1 is greater than the length of the upper portion away from the substrate 1 .
  • the area of the orthographic projection of the first section f1 on the substrate 1 is greater than the area of the orthographic projection of the second section f2 on the substrate 1, and the area of the orthographic projection of the second section f2 on the substrate 1 is greater than that of the third section f3 The area of the orthographic projection on the substrate 1 .
  • the orthographic projection of the third section f3 on the substrate 1 may be within the range of the orthographic projection of the second section f2 on the substrate 1, or the orthographic projection of the third section f3 on the substrate 1 may be the same as the second section.
  • the orthographic projections of f2 on the substrate 1 coincide.
  • the orthographic projection of the second section f2 on the substrate 1 may be within the range of the orthographic projection of the first section f1 on the substrate 1, or the orthographic projection of the second section f2 on the substrate 1 may be within the range of the orthographic projection of the first section f1 on the substrate 1.
  • the orthographic projections on the substrate 1 coincide.
  • the cross-sectional shape of the portion of the first light adjustment layer 3 located between two adjacent light emitting devices 2 may be a normal trapezoid or an approximate normal trapezoid.
  • the regular trapezoid may be a right-angled trapezoid
  • the approximate regular trapezoid may be an approximate right-angled trapezoid.
  • the angle between the side surface d of the first light adjustment layer 3 away from the substrate 1 and the side surface e of the first light adjustment layer 3 corresponding to the edge of the substrate 1 is Right angle or near right angle.
  • the side surface e of the first light adjustment layer 3 corresponding to the edge of the substrate 1 refers to the surface where the first light adjustment layer 3 is connected to the edge of the substrate 1, and between the surface and the surface where the substrate 1 is located.
  • There is an included angle (for example, the included angle is less than or equal to 90°), and there is an included angle between the surface and the side surface d of the first light adjustment layer 3 away from the substrate 1 (the included angle is, for example, greater than or equal to 90°) .
  • the angle between the side surface d of the first light adjustment layer 3 away from the substrate 1 and the side surface e of the first light adjustment layer 3 corresponding to the edge of the substrate 1 is a right angle or an approximate right angle, which means that the first light adjustment layer 3 is at a right angle or an approximate right angle.
  • the side surface d of the light adjustment layer 3 away from the substrate 1 is directly connected with the side surface e of the first light adjustment layer 3 corresponding to the edge of the substrate 1, and there is no smooth transition or basically no smooth transition between the two, and there is no smooth transition between the two.
  • Chamfers are formed or substantially not formed.
  • the first fixed layer 4 is a light-transmitting film
  • the main visual effect is provided by the first light adjustment layer 3 .
  • the display substrate 100 may further include: a second fixing layer 5 .
  • the second fixing layer 5 includes a plurality of fixing patterns 51 arranged at intervals from each other. That is, there is a gap between any two adjacent fixed patterns 51, and no contact is formed.
  • the arrangement of the plurality of fixed patterns 51 can be selected and set according to actual needs.
  • a fixing pattern 51 surrounds a group of light-emitting devices 2 to fix the group of light-emitting devices 2 .
  • one fixed pattern 51 surrounds a group of light emitting devices 2 , which may be: one fixed pattern 51 may be located on the peripheral side of the group of light emitting devices 2 .
  • a fixing pattern 51 may be located on the peripheral side of the light emitting device 2 , in contact with each side surface of the light emitting device 2 , to fix the light emitting device 2 .
  • a fixed pattern 51 may be located on the peripheral side of each light-emitting device 2 in the plurality of light-emitting devices 2 , and the plurality of light-emitting devices 2 Each side surface of each light emitting device 2 in the device 2 is in contact with each other, and the plurality of light emitting devices 2 are fixed.
  • a fixed pattern 51 surrounds a group of light-emitting devices 2 , which may be: a fixed pattern 51 may be located on the peripheral side of the group of light-emitting devices 2 and on a side surface away from the substrate 1 .
  • a fixed pattern 51 may be located on the peripheral side of the light-emitting device 2 and its surface on one side away from the substrate 1 , and on the sides and the surface of the light-emitting device 2 .
  • the light-emitting device 2 is fixed by contacting the surface of the side away from the substrate 1 .
  • one fixed pattern 51 may be located on the peripheral side of each light-emitting device 2 among the plurality of light-emitting devices 2 and away from each other.
  • One side surface of the substrate 1 is in contact with each side surface of each light emitting device 2 in the plurality of light emitting devices 2 and the side surface of the light emitting device 2 away from the substrate 1 , and the plurality of light emitting devices 2 are fixed.
  • each group of light emitting devices 2 includes at least two light emitting devices 2 , and one fixing pattern 51 fixes the at least two light emitting devices 2 .
  • a light-emitting device 2 is configured to emit light of one color.
  • the light may be red light, green light or blue light.
  • the light can be magenta light, yellow light, or cyan light.
  • the light can also be white light.
  • the color of light emitted by each light-emitting device 2 includes at least one color.
  • each light emitting device 2 includes one color
  • the color of the light emitted by each light emitting device 2 in the above at least two light emitting devices 2 is the same.
  • the colors of the light emitted by each light emitting device 2 include at least two
  • the colors of the light emitted by each light emitting device 2 in the above at least two light emitting devices 2 may be different or partially the same.
  • a group of light emitting devices 2 includes three light emitting devices 2, and the three light emitting devices 2 may include at least one of red light emitting devices, green light emitting devices, and blue light emitting devices.
  • the three light-emitting devices 2 may constitute one pixel unit.
  • the above-mentioned light-emitting device 2 may also include a white light-emitting device.
  • the second fixing layer 5 is a light-transmitting film. That is, the second fixed layer 5 can have better light transmittance, which can reduce or avoid the loss of light passing through each fixed pattern 51 , and then the light emitting device 2 emits light to make the display substrate 100 display. , can have higher light extraction efficiency.
  • the second fixing layer 5 is formed by curing a flowable light-transmitting material.
  • the time interval between the formation of the material of the second fixed layer 5 on the substrate 1 and the curing of the material of the second fixed layer 5 is relatively small, and based on the existence of the surface tension of the liquid, the The cross-sectional shape of the fixed patterns 51 is or similar to the shape shown in FIG. 15 and FIG. 16 , so that the side surface of each fixed pattern 51 away from the substrate 1 is arc-shaped.
  • each fixed pattern 51 covers and surrounds a corresponding group of light emitting devices 2, its orthographic projection area on the substrate 1 is relatively small.
  • the orthographic projection of the side surface of each fixed pattern 51 away from the substrate 1 on the substrate 1 is located within the orthographic projection range of the side surface of the fixed pattern 51 close to the substrate 1 on the substrate 1 .
  • the first light adjustment layer 3 may be located in a gap between any two adjacent fixed patterns 51 among the above-mentioned plurality of fixed patterns 51 , and may be fixed with the plurality of fixed patterns 51 .
  • the patterns 51 are in contact.
  • the first light adjustment layer 3 and the adjacent light emitting devices 2 are separated by the second fixing layer 5 , and are not in contact with the adjacent light emitting devices 2 .
  • the first light adjustment layer 3 may be in the shape of a mesh, and each mesh is provided with a group of light emitting devices 2 covered and surrounded by a fixed pattern 51 .
  • each fixed pattern 51 away from the substrate 1 on the substrate 1 is located within the orthographic projection range of the side surface of the fixed pattern 51 close to the substrate 1 on the substrate 1, it is located in each
  • the size of the gap between two adjacent fixed patterns 51 in a direction parallel to the substrate 1 decreases sequentially along a direction perpendicular to and away from the substrate 1 .
  • the direction perpendicular to the substrate 1 and the two adjacent light emitting devices 2 is formed.
  • the cross-sectional shape of the portion of the first light adjustment layer 3 located between the two adjacent light emitting devices 2 includes a trapezoid or an approximate trapezoid.
  • the length of the trapezoid or the approximate trapezoid close to the lower base b1 of the substrate 1 is smaller than the length of the upper base b2 away from the substrate 1 . That is, the trapezoid or approximate trapezoid is an inverted trapezoid.
  • the part of the first light adjustment layer 3 located between the two adjacent fixed patterns 51 is far from the shape of the side surface of the substrate 1 , for example, it can be an arc shape .
  • the influence of the first light adjustment layer 3 on the light emitting device 2 can be weakened, and the Mura phenomenon of the display substrate 100 at a larger viewing angle can be improved.
  • the first pinned layer 4 may be located on the side of the second pinned layer 5 and the first light adjustment layer 3 away from the substrate 1 .
  • the orthographic projection of the second pinned layer 5 on the substrate 1 may be located within the range of the orthographic projection of the first pinned layer 4 on the substrate 1 .
  • the first fixed layer 4 By arranging the first fixed layer 4 on the side of the second fixed layer 5 and the first light adjustment layer 3 away from the substrate 1 , the first fixed layer 4 can be used for the second fixed layer 5 and the first light adjustment layer 3 After fixing, and then fixing the light-emitting device 2 , the first fixing layer 4 can also be used to make the entire display substrate 100 have a relatively flat surface, thereby improving the surface consistency.
  • the display substrate 100 may further include: a plurality of light-transmitting particles 6 disposed on the side of the first fixed layer 4 away from the substrate 1 .
  • the plurality of light-transmitting particles 6 may, for example, be disposed on a surface of the first fixed layer 4 on a side away from the substrate 1 .
  • the plurality of light-transmitting particles 6 are configured such that the propagation direction of at least a portion of the light rays incident on the plurality of light-transmitting particles 6 is changed.
  • the change of the propagation direction of the light by the light-transmitting particles 6 is related to the shape of the light-transmitting particles 6 .
  • the surface shapes of the plurality of light-transmitting particles 6 include at least one of pyramid and wedge shape.
  • the tip of the pyramid or wedge is located on the side away from the substrate 1 .
  • the plurality of light-transmitting particles 6 can gather at least a part of the light emitted by the plurality of light-emitting devices 2 and passing through the plurality of light-transmitting particles 6 , which is beneficial to improve the display brightness of the display substrate 100 .
  • the surface of the first light adjusting layer 3 is farther away from the substrate 1 than the surface of the light-emitting device 2 farther away from the substrate 1, the light-emitting diode of the display substrate 100 can be further reduced.
  • the viewing angle further improves the privacy protection effect of the display substrate 100 .
  • the surface shapes of the above-mentioned plurality of light-transmitting particles 6 include at least one of an arc surface and a spherical surface.
  • the plurality of light-transmitting particles 6 can diffuse at least a part of the light emitted from the plurality of light-emitting devices 2 and passing through the plurality of light-transmitting particles 6 , which is beneficial to improve the uniformity of light emission of the display substrate 100 .
  • the plurality of light-transmitting particles 6 can also cause diffuse reflection of at least a part of the light incident to the plurality of light-transmitting particles 6 from the outside, thereby improving the display effect of the display substrate 100 .
  • the above-mentioned plurality of light-transmitting particles 6 may be arranged in an array. That is, the plurality of light-transmitting particles 6 may be arranged in a plurality of rows along the first direction X, and arranged in a plurality of columns along the second direction Y.
  • first direction X and the second direction Y intersect.
  • included angle between the first direction X and the second direction Y may be 90°.
  • the display substrate 100 can have a better viewing angle range and appearance effect.
  • the distance between any two adjacent light-transmitting particles is in the range of 100 ⁇ m ⁇ 5 ⁇ m.
  • the distance refers to the minimum distance between two adjacent light-transmitting particles.
  • the distance between any two adjacent light-transmitting particles may be 95 ⁇ m, 97 ⁇ m, 100 ⁇ m, 104 ⁇ m, or 105 ⁇ m, or the like.
  • the display substrate 100 can have a better viewing angle range and appearance effect.
  • each light-transmitting particle 6 is in the range of 9 ⁇ m ⁇ 3 ⁇ m.
  • each light-transmitting particle 6 may be 6 ⁇ m, 7 ⁇ m, 9 ⁇ m, 11 ⁇ m or 12 ⁇ m, or the like.
  • the display substrate 100 can have a better viewing angle range and appearance effect.
  • the size of the orthographic projection of each light-transmitting particle 6 on the substrate 1 is in the range of 50 ⁇ m ⁇ 5 ⁇ m.
  • the size of the orthographic projection of each light-transmitting particle 6 on the substrate 1 refers to the distance between two points where a straight line passing through the center of the orthographic projection intersects with the boundary of the orthographic projection.
  • the aforementioned dimensions can be, for example, the maximum pitch, the minimum pitch or the average pitch.
  • the size may be the diameter of the circle. If the shape of the orthographic projection of each light-transmitting particle 6 on the substrate 1 includes a square, the size may be the diagonal length or the side length of the square.
  • the size of the orthographic projection of each light-transmitting particle 6 on the substrate 1 may be 45 ⁇ m, 46 ⁇ m, 47 ⁇ m, 50 ⁇ m, 52 ⁇ m, or 55 ⁇ m, or the like.
  • the display substrate 100 can have a better viewing angle range and appearance effect.
  • the material of the above-mentioned plurality of light-transmitting particles 6 may be a material with high light transmittance, so that the light-extraction rate of the light-emitting device 2 can be prevented from being affected by the arrangement of the light-transmitting particles 6 .
  • the material of the light-transmitting particles 6 may include a polyacetic acid resin material, which may be doped with titanium dioxide or diffusing powder, for example.
  • the light-transmitting particles 6 may be formed by curing a flowable light-transmitting material.
  • the time length between the drop of the flowable light-transmitting material to the surface of the first fixed layer 4 away from the substrate 1 and the curing and shaping can be selected and set according to the needs, so as to achieve The shape of the light-transmitting particles 6 formed by curing is made into a desired shape.
  • the display substrate 100 may further include: a light reflection layer 7 disposed on the side surface of each light emitting device 2 .
  • the light-reflecting layer 7 may be located on each side of each light-emitting device 2 , for example.
  • the light reflective layer 7 is configured to reflect light emitted by each light emitting device 2 and incident on the light reflective layer 7 .
  • the light emitted by a light-emitting device 2 can be incident on the light-reflecting layer 7 provided on the side thereof, and under the reflection of the light-reflecting layer 7, the light is reflected back to the light-emitting device 2, and away from the substrate 1 from the light-emitting device 2 shot from one side.
  • the utilization rate of the light emitted by the light emitting device 2 can be improved, the light efficiency of the display substrate 100 can be improved, and the power consumption of the display substrate 100 can be reduced.
  • the material of the light reflection layer 7 includes various materials, which can be selected and set according to actual needs, as long as it can reflect the light emitted by the light emitting device 2 without affecting the electrical performance of the light emitting device 2 .
  • the material of the light reflection layer 7 includes, but is not limited to, white ink.
  • the electrical connection between the light emitting device 2 and the substrate 1 is usually performed by using solder joints.
  • a plurality of solder joints may be provided on the substrate 1 , and the plurality of solder joints may include a plurality of anode solder joints 11 and a plurality of cathode solder joints 12 .
  • the structure of the light-emitting device 2 and the connection method between the light-emitting device 2 and the substrate 1 are schematically described by taking the light-emitting device 2 as a Mini LED as an example.
  • the above-mentioned light-emitting device 2 includes a substrate 22 , an N-type semiconductor layer 23 , a light-emitting layer 21 , a P-type semiconductor layer 24 , a current blocking layer 25 , a conductive layer 26 , and a Bragg reflection layer that are stacked in sequence.
  • Layer 27 , cathode electrode pins 28 and anode electrode pins 29 wherein the cathode electrode pins 28 are connected to the N-type semiconductor layer 23 , and the anode electrode pins 29 are connected to the conductive layer 26 .
  • the light-emitting layer 21 can emit light.
  • the light emitted by each light emitting layer 21 may be emitted to the outside after passing through the substrate 22 , the light adjusting layer 3 and the first fixing layer 4 in sequence.
  • the cathode electrode pins 28 are electrically connected to the cathode pads 12 (for example, the cathode electrode pins 28 are inserted into the cathode pads 12), and the anode electrode pins 28 are electrically connected to the cathode pads 12.
  • Pins 29 may be electrically connected to anode pads 11 (eg, anode electrode pins 29 are inserted into anode pads 11).
  • the distance between the surface of the light-emitting device 2 away from the substrate 1 and the substrate 1 may be the sum of the thickness of the solder joint and the thickness of the light-emitting device 2 .
  • the display substrate 100 further includes: a plurality of functional devices 8 . At least one functional device 8 of the plurality of functional devices 8 is arranged on the same side of the substrate as the light emitting device 2 .
  • the plurality of functional devices 8 described above are configured to provide sensing signals and/or to provide control signals to the light emitting device 2 . That is, the above-mentioned multiple functional devices 8 can all be used to provide sensing signals, and can also all be used to provide control signals to the light emitting device 2 . Of course, a part of the above-mentioned multiple functional devices 8 can be used to provide sensing signals, and the other part can be used to provide control signals to the light-emitting device 2 .
  • the above-mentioned multiple functional devices 8 may include touch sensing devices, infrared sensing devices, distance sensing devices, and the like.
  • the above-mentioned multiple functional devices 8 may include a driver integrated circuit (Integrated Circuit, IC for short) and the like.
  • a driver integrated circuit Integrated Circuit, IC for short
  • the first fixed layer 4 is away from the surface of the side of the substrate 1 with respect to the substrate 1, which is higher than the At least one functional device 8 is away from one side surface of the substrate 1 . That is, the distance between the side surface of the first fixed layer 4 away from the substrate 1 and the substrate 1 is greater than the distance between the side surface of the at least one functional device 8 away from the substrate 1 and the substrate 1 .
  • the light-emitting device 2 there are various ways to drive the light-emitting device 2 to display an image on the display substrate 100 , and the settings can be selected according to needs.
  • the display substrate 100 may directly drive the light-emitting device 2 by using a driving chip (also referred to as a driving IC) to drive and emit light.
  • a driving chip also referred to as a driving IC
  • the above-mentioned multiple functional devices 8 may include: multiple driver chips 81 .
  • the plurality of driving chips 81 are located on the same side of the substrate 1 as the light emitting device 2 . Among them, one driver chip 81 can be electrically connected to a group of light emitting devices 2 .
  • one driving chip 81 may be electrically connected to three light-emitting devices 2 .
  • the three light-emitting devices 2 include, for example, a red light-emitting device, a green light-emitting device, and a blue light-emitting device.
  • a plurality of power supply voltage signal lines Vcc extending along the first direction X
  • a plurality of first voltage signal lines VR extending along the second direction Y
  • a plurality of A second voltage signal line VGB a plurality of data lines Data.
  • the anode electrode pin 29 of each red light-emitting device may be electrically connected to a first voltage signal line VR through the anode pad 11, and the anode electrode pin 29 of each green light-emitting device may be The anode pad 11 is electrically connected to a second voltage signal line VGB, and the anode electrode pin 29 of each blue light-emitting device can be electrically connected to a second voltage signal line VGB through the anode pad 11 .
  • the driver chip 81 may have six pins, three of which are electrically connected to the cathode electrode pins 28 of the three light-emitting devices 2 through the cathode pads 12 in one-to-one correspondence.
  • one pin may be electrically connected to a data line Data
  • one pin may be electrically connected to a power supply voltage signal line Vcc
  • the other pin may be grounded.
  • the display substrate 100 may further include: a second light adjustment layer 9 disposed on a surface of the above-mentioned plurality of driving chips 81 on one side away from the substrate 1 .
  • the second light adjustment layer 9 is configured to reduce the reflection of the light incident on the surface of the plurality of driving chips 81 described above.
  • the surface of the side surface of the driving chip 81 away from the substrate 1 has a higher reflectivity to light.
  • the reflection of the light incident on the surface of the driving chip 81 can be reduced, so that when the display state of the display substrate 100 is in the dark state (that is, the light-emitting device 2 does not emit light),
  • the display surface of the display substrate 100 can be made to be in a darker state, thereby effectively improving the contrast ratio of the display substrate 100 .
  • the material of the second light adjustment layer 9 is the same as the material of the first fixed layer 4 .
  • the material of the first fixed layer 4 has high light transmittance, it still has a certain loss to the light passing through itself.
  • the material of the second light adjustment layer 9 is set to be the same as the material of the first fixed layer 4 , during the process of light passing through the second light adjustment layer 9 and incident on the surface of the driving chip 81 on the side away from the substrate 1 , So that the light has a certain loss, after the side surface of the driving chip 81 away from the substrate 1 reflects the lost light, the reflected light can pass through the second light adjustment layer 9 and enter the outside world. There will be further losses. Thereby, the reflection of the light incident on the surface of the driving chip 81 can be reduced.
  • the material of the second light adjustment layer 9 may be the same as the material of the first light adjustment layer 3 .
  • the second light adjustment layer 9 can be used to effectively absorb the light, thereby reducing the driving chip 81 .
  • the distance between the side surface of the second light adjustment layer 9 close to the driving chip 81 and the side surface of the second light adjustment layer 9 away from the driving chip 81 (that is, the thickness of the second light adjustment layer 9) can be selected and set according to actual needs, It is sufficient that the reflection of the light incident on the surface of the driving chip 81 can be reduced.
  • the thickness of the second light adjustment layer 9 may range from 20 ⁇ m to 40 ⁇ m. This not only ensures the effect of reducing light reflection, but also avoids the waste of materials.
  • the thickness of the second light adjustment layer 9 may be 20 ⁇ m, 25 ⁇ m, 30 ⁇ m, 33 ⁇ m, or 40 ⁇ m, or the like.
  • a surface of the first fixed layer 4 away from the substrate 1 is higher than a surface of the driver chip 81 away from the substrate 1 .
  • the surface of the second light adjustment layer 9 on the side away from the substrate 1 is equal to the surface of the first fixed layer 4 away from the substrate 1, or higher than the surface of the first fixed layer 4 away from the substrate 1. side surface.
  • the distance between the surface of the second light adjustment layer 9 away from the substrate 1 and the substrate 1 and the distance between the surface of the first fixed layer 4 away from the substrate 1 and the substrate 1 can be avoided The difference is large and affects the appearance of the display substrate 100 .
  • the distance between the side surface of the second light adjustment layer 9 away from the substrate 1 and the substrate 1, and the distance between the side surface of the first fixed layer 4 away from the substrate 1 and the distance between the substrate 1 may range from 0 ⁇ m to 20 ⁇ m.
  • the display substrate 100 may be driven by a pixel driving circuit to drive the light-emitting device 2 to emit light.
  • a plurality of gate lines Gate extending along the first direction X, a plurality of data lines Data and a plurality of electrode leads 13 extending along the second direction Y may be disposed on the substrate 1 .
  • the plurality of gate lines Gate and the plurality of data lines Data intersect each other to define the above-mentioned plurality of sub-pixel regions P.
  • one pixel driving circuit 14 may be provided in each sub-pixel region P.
  • the plurality of pixel driving circuits 14 arranged in a row along the first direction X may be electrically connected to a gate line Gate, and the plurality of pixel driving circuits 14 arranged in a row along the second direction Y may be electrically connected to a data line Data.
  • One electrode lead 13 corresponds to a plurality of pixel driving circuits 14 arranged in a row along the second direction Y.
  • the structure of the pixel driving circuit 14 may include various types.
  • the structure of the pixel driving circuit 14 may include structures such as “2T1C”, “6T1C”, “7T1C”, “6T2C” or “7T2C”.
  • T represents a thin film transistor
  • a number preceding "T” represents the number of thin film transistors
  • C represents a storage capacitor
  • a number preceding "C” represents the number of storage capacitors.
  • one thin film transistor is a driving transistor.
  • the present disclosure takes the pixel driving circuit 14 as an example of a “2T1C” structure.
  • each sub-pixel region P may be provided with one anode pad 11 and one cathode pad 12 .
  • the anode pads 11 can be electrically connected to the pixel driving circuit 14
  • the cathode pads 12 can be electrically connected to the corresponding electrode leads 14 .
  • the anode electrode pin 29 of the light emitting device 2 can be inserted into the anode pad 11
  • the cathode electrode lead 28 can be inserted into the cathode pad 12 to realize the electrical connection between the light emitting device 2 , the pixel driving circuit 14 and the electrode lead 13 .
  • the pixel driving circuit 14 is configured to provide a driving voltage for the light emitting device 2 ;
  • the electrode lead 13 is configured to provide a common voltage for the light emitting device 2 .
  • the display substrate 100 of the present disclosure can also drive the light emitting device 2 to emit light in a passive driving manner, which will not be repeated here.
  • the first light adjustment layer 3 can cover at least the above-mentioned traces. part.
  • an insulating layer may be provided between the first light adjusting layer 3 and the above-mentioned wirings, which can not only protect the above-mentioned wirings, but also avoid corrosion of the above-mentioned wirings and affect the electrical performance of the above-mentioned wirings.
  • Some embodiments of the present disclosure provide a method of fabricating a display substrate. As shown in FIG. 24 and FIG. 27 , the preparation method includes S100 to S300.
  • the substrate 1 is provided.
  • One side of the substrate 1 is provided with a plurality of light emitting devices 2 spaced apart from each other, the plurality of light emitting devices 2 are divided into a plurality of groups, and each group of light emitting devices 2 includes at least one light emitting device 2 .
  • the above-mentioned plurality of light emitting devices 2 may include Mini LEDs.
  • a mass transfer technology Mass Transfer Technology
  • a mass transfer technology can be used to transfer the plurality of light-emitting devices 2 to one side of the substrate 1 .
  • the substrate 1 after disposing a plurality of light emitting devices 2 on the substrate 1 , it may be cleaned to remove foreign matter on the surface of the substrate 1 and the side surfaces of each light emitting device 2 and the side surface away from the substrate 1 , increasing the surface energy, so that the substrate 1 and each light-emitting device 2 have a higher bonding force with the subsequently formed thin film.
  • At least one of ultrasonic cleaning, plasma cleaning and air gun blowing can be used to clean the substrate 1 and each light-emitting device 2.
  • Each light-emitting device 2 may be cleaned.
  • an inkjet printing process is used to form a first light adjustment layer 3 between each adjacent two groups of light-emitting devices 2. There is a gap between the first light adjustment layer 3 and at least one side surface of the adjacent light emitting device 2 .
  • the material of the first light adjustment layer 3 includes a flowable light absorbing material.
  • the first light adjustment layer 3 is configured to absorb at least a portion of the light incident on the first light adjustment layer 3 .
  • the material of the first light adjustment layer 3 can flow, in the process of forming the first light adjustment layer 3 between two adjacent light emitting devices 2 by an inkjet printing process, an inkjet printing device can be used to make the flowable material flowable.
  • the light-absorbing material is drop-printed between two adjacent light-emitting devices 2 , and then cured to obtain a first light-adjusting layer 3 .
  • the first light-adjusting layer 3 in a desired shape can be obtained by setting the time interval between the drop-printing of the material of the first light-adjusting layer 3 between two adjacent light-emitting devices 2 and the curing process.
  • the material of the first light-adjusting layer 3 has a wider range of flow and spread, so that the first light-adjusting layer 3 formed by curing has a planar shape, a small thickness, and is located on the substrate.
  • the orthographic projection area on 1 is larger.
  • the material of the first light-adjusting layer 3 flows and spreads in a small range, so that the first light-adjusting layer 3 formed by curing is in a block shape, has a large thickness, and is on the substrate 1 .
  • the orthographic projection area of is smaller.
  • the curing process may include various manners, which may be specifically selected and determined according to the properties of the material of the first light adjustment layer 3 .
  • the method of curing treatment can be photocuring treatment, thermal curing treatment or other chemical and physical treatment methods.
  • the present disclosure may employ ultraviolet curing (ie, UV curing) treatments.
  • ultraviolet curing ie, UV curing
  • using an inkjet printing process to form the first light adjustment layer 3 between each adjacent two groups of light-emitting devices 2 includes: using an inkjet printing process to emit light in each adjacent two groups of light-emitting devices 2 Multiple layers of light adjustment sub-layers 31 are formed between the devices 2 in sequence. The multilayer light-adjusting sub-layers 31 are stacked to form the first light-adjusting layer 3 .
  • the first light adjustment layer 3 is formed through multiple inkjet printing processes. For example, after each layer of the light-adjusting film is formed, the light-adjusting film is cured to form a light-adjusting sub-layer 31 .
  • the thickness of the light-adjusting film formed by inkjet printing may be about 5 ⁇ m, and the energy for curing the light-adjusting film by UV curing treatment may be about 3000 mJ.
  • the distance between the surface of the first light adjustment layer 3 on the side away from the substrate 1 and the substrate 1 is 80 ⁇ m.
  • the thickness of the light-adjusting sub-layer 31 is 5 ⁇ m each time, 16 layers of light-adjusting sub-layers 31 stacked in sequence can be formed through 16 inkjet printing processes to obtain the first light-adjusting layer 3 .
  • an inkjet printing process is used to sequentially form multiple layers of light adjustment sub-layers 31 between each adjacent two groups of light-emitting devices 2 , including: S210 - S220 .
  • an inkjet printing process is used to form a first light adjustment sub-layer 31 a between each adjacent two groups of light-emitting devices 2 .
  • the first light conditioning sublayer 31 a is in contact with the substrate 1 and has a gap with the adjacent light emitting device 2 .
  • the distance between the nozzle for ejecting the material of the first light adjustment layer 3 and the light emitting device 2 in the inkjet printing apparatus in the direction parallel to the substrate 1 can be adjusted so as to make the formed
  • the distance between the first light adjustment sub-layer 31a and the adjacent light emitting device 2 in the direction parallel to the substrate 1 is a required distance.
  • the distance between the nozzle and the light emitting device 2 in a direction parallel to the substrate 1 may be greater than the position error of the light emitting device 2 .
  • the distance between the showerhead and the light emitting device 2 in a direction parallel to the substrate 1 may range from 10 ⁇ m to 25 ⁇ m.
  • the distance between the shower head and the light emitting device 2 may be 10 ⁇ m, 13 ⁇ m, 17 ⁇ m, 20 ⁇ m, or 25 ⁇ m, or the like.
  • the distance can be in the range of 10 ⁇ m ⁇ 25 ⁇ m
  • the material of the first sub-light adjustment layer 31 a is dropped on the side of the light-emitting device 2 away from the substrate 1 to affect the light efficiency of the display substrate 100 .
  • the distance between the nozzle and the light-emitting device 2 in the direction perpendicular to the substrate 1 can also be adjusted to avoid collision between the nozzle and the light-emitting device 2, which will affect the quality of the light-emitting device 2 and the quality of the light-emitting device 2 and the substrate.
  • the connection between the base 1 has a bad effect.
  • the end of the nozzle close to the substrate 1 may be higher than the surface of the light-emitting device 2 away from the substrate 1, and the two are in a direction perpendicular to the substrate 1.
  • the spacing can be about 1mm.
  • an inkjet printing process is used to form a second light adjustment sublayer 31b on the side of the first light adjustment sublayer 31a away from the substrate.
  • the second light conditioning sublayer 31b covers the first light conditioning sublayer 31a and has a gap with at least one side surface of the adjacent light emitting device 2 .
  • the material of the first light adjustment layer 3 since the material of the first light adjustment layer 3 has flowability, after the material of the first light adjustment layer 3 is printed and dropped onto the surface of the first light adjustment sub-layer 31a on the side away from the substrate 1, The material will flow.
  • the orthographic projection of the thin film formed after flow spreading (the second light-conditioning sub-layer 31b after curing) on the substrate 1 coincides with the orthographic projection of the first light-conditioning sub-layer 31a on the substrate 1, That is, the thin film formed after the flow spreading covers the surface of the first light conditioning sub-layer 31a away from the substrate, so that the second light conditioning sub-layer 31b formed after the curing treatment is only located away from the first light conditioning sub-layer 31a. on one side surface of the substrate 1 .
  • the orthographic projection of the first light conditioning sub-layer 31a on the substrate 1 is located within the orthographic projection range of the thin film formed after the flow spreading on the substrate 1, that is, the thin film formed after the flow spreading covers the first
  • the side surface of the light conditioning sub-layer 31a away from the substrate covers at least a part of the side surface of the first light conditioning sub-layer 31a, so that the second light conditioning sub-layer 31b formed after curing is not only located in the first light conditioning sub-layer 31b.
  • the layer 31a also covers at least a part of the side surface of the first light adjustment sub-layer 31a on the surface of the side away from the substrate 1 .
  • the thin film formed after the flow spreading may have a gap with at least one side surface of the adjacent light emitting device 2 , and can also be in contact with adjacent light-emitting devices 2 . That is, the second light adjustment sub-layer 31b formed after the curing process may have a gap with the adjacent light-emitting device 2, or may be in contact with the adjacent light-emitting device 2.
  • multiple layers of light conditioning sub-layers 31 may also be formed by stacking sequentially on the side of the second light conditioning sub-layer 31b away from the substrate 1 .
  • the description of the structure of the multi-layer light adjustment sub-layer 31 to be formed subsequently reference may be made to the description of the structure of the second light adjustment sub-layer 31b, which will not be repeated here.
  • the structure diagram of the light-adjusting sub-layers 31 layered in sequence can be as shown in FIG. Figure 31 shows a structural diagram after forming 16 layers of light conditioning sub-layers 31 stacked in sequence.
  • the multilayered light conditioning sub-layers 31 may cover areas of the substrate 1 other than the area covered by the light emitting device 2 .
  • the materials of the above-mentioned multilayer light adjustment sub-layers 31 may be the same, so that the hardness, color, etc. of each light adjustment sub-layer 31 are the same.
  • the materials of the above-mentioned multilayer light adjustment sub-layers 31 can also be different, so that the hardness and color of each light adjustment sub-layer 31 can be different, which can be set according to actual needs. For example, along a direction perpendicular to and away from the substrate 1 , the hardness of each light-conditioning sub-layer 31 gradually decreases, or the color of each light-conditioning sub-layer 31 gradually becomes lighter.
  • the first fixing layer 4 is a light-transmitting thin film, and is configured to fix the above-mentioned plurality of light emitting devices 2 and the first light adjusting layer 3 .
  • the material of the first fixing layer 4 includes a flowable light-transmitting material.
  • the inkjet printing process is used to form the first fixed layer on the side of the plurality of light emitting devices 2 away from the substrate 1 and the side of the first light adjustment layer 3 away from the substrate 1
  • inkjet printing equipment can be used to drop and print the flowable light-transmitting material on the side of the plurality of light-emitting devices 2 away from the substrate 1 and the side of the first light adjustment layer 3 away from the substrate 1. , and then curing treatment is performed to obtain the first fixed layer 4 .
  • the material of the first fixed layer 4 will penetrate into the gap, fill the gap, and obtain the first light-emitting device after curing.
  • the surface of the side of the first fixing layer 4 away from the substrate 1 is still a relatively flat surface.
  • the material of the first fixed layer 4 is only located on the side of the plurality of light-emitting devices 2 away from the substrate 1 and the first light-adjusting layer 3. The side away from the substrate 1.
  • the method of curing the first fixed layer 4 may refer to the method of curing the first light adjusting layer 3 , which will not be repeated here.
  • the inkjet printing process is used to form the first fixed layer 4 on the side of the plurality of light-emitting devices 2 away from the substrate 1 and the side of the first light adjustment layer 3 away from the substrate 1,
  • it may include: using an inkjet printing process to form a multi-layer fixed sub-layer on the side of the plurality of light emitting devices 2 away from the substrate 1 and the side of the first light adjustment layer 3 away from the substrate 1 .
  • the multi-layer fixed sublayers are stacked to form the first fixed layer 4 .
  • the first fixed layer 4 is formed through multiple inkjet printing processes. For example, after each layer of the fixed film is formed, the fixed film is cured to form a fixed sub-layer.
  • the thickness of the fixed film formed by inkjet printing may be about 10 ⁇ m, and the energy for curing the fixed film by UV curing treatment may be about 3000 mJ.
  • the surface of the first light adjustment layer 31 away from the substrate 1 is level with the surface of the light emitting device 2 away from the substrate 1, and the surface of the first fixed layer 4 is close to the substrate 1 and a surface away from the substrate 1.
  • the spacing between the side surfaces is 40 ⁇ m as an example.
  • the first fixed layer 4 can be obtained by forming four fixed sub-layers stacked in sequence through four inkjet printing processes.
  • the structural diagram of the first fixed layer 4 may be as shown in FIG. 32 .
  • the surface of the first light adjustment layer 31 away from the substrate 1 is level with the surface of the light emitting device 2 away from the substrate 1, and the surface of the first fixed layer 4 is close to the substrate 1 and a surface away from the substrate 1.
  • the spacing between the side surfaces is 60 ⁇ m as an example.
  • the structure diagram of the first fixed layer 4 may be as shown in FIG. 33 .
  • the preparation method of the display substrate further includes: using an inkjet printing process to install the driving chips 81 away from the substrate 1 by using an inkjet printing process.
  • a second light adjustment layer 9 is formed on one surface.
  • the above-mentioned inkjet printing process is used to form the first light adjustment layer on the side surface of each driving chip 81 away from the substrate 1.
  • the two light adjusting layers 9 may include: before the above S300, using the material of the first light adjusting layer 3 and using an inkjet printing process to form a multilayer film on the surface of the plurality of driving chips 81 away from the substrate 1. Wherein, each layer of thin film is formed by curing after inkjet printing. The multilayer films are laminated to form the second light-modulating layer 9 .
  • the thickness of the film formed by inkjet printing may be about 5 ⁇ m, and the energy for curing the fixed film by the UV curing treatment method may be about 3000 mJ.
  • the second light adjustment layer 9 When the thickness of the second light adjustment layer 9 is 40 ⁇ m, and the thickness of the thin film formed each time is 5 ⁇ m, the second light adjustment layer 9 can be obtained through eight inkjet printing processes. When the thickness of the second light adjustment layer 9 is 20 ⁇ m, and the thickness of the thin film formed each time is 5 ⁇ m, the second light adjustment layer 9 can be obtained through four inkjet printing processes.
  • the inkjet printing process is used to form the second light on the side surface of each driving chip 81 away from the substrate 1.
  • the adjustment layer 9 may include: in the above S300, during the process of forming the first fixed layer 4, the second light adjustment layer 9 is simultaneously formed.
  • the thickness of the second light adjustment layer 9 is 40 ⁇ m, and the process of forming the second light adjustment layer 9 may refer to the process of forming the first fixed layer 4 , which will not be repeated here.
  • beneficial effects that can be achieved by the method for fabricating a display substrate provided by some embodiments of the present disclosure are the same as the beneficial effects that can be achieved by the display substrate 100 provided in some of the above-mentioned embodiments, and are not repeated here.
  • the present disclosure adopts the inkjet printing process to form the first light adjustment layer 3, which can avoid forming the material of the first light adjustment layer 3 (that is, the light absorbing material) on the surface of the light-emitting device 2 away from the substrate 1, and further can It is avoided to affect the light extraction efficiency of the light emitting device 2 and to avoid increasing the power consumption of the display substrate 100 .
  • the printing accuracy of the inkjet printing process is high, and the surface flatness of the first light adjustment layer 3 and/or the first fixed layer 4 formed by multiple inkjet printing is relatively high, which is beneficial to improve the appearance of the display substrate 100 .
  • the preparation method of the display substrate may further include: S150 .
  • each fixing pattern 51 covers the set of light emitting devices 2 and surrounds the set of light emitting devices 2 to fix the set of light emitting devices 2 .
  • the plurality of fixed patterns 51 constitute the second fixed layer 5 .
  • the material of the second pinned layer 5 includes a flowable light transmissive material.
  • the fixed pattern 51 may be formed by, for example, multiple inkjet printing processes.
  • each fixing pattern 51 fixes the three light-emitting devices 2 .
  • the material film formed in each inkjet printing process may be located between every two adjacent light-emitting devices 2 among the three light-emitting devices 2, and surround the three light-emitting devices 2.
  • Each of the light-emitting devices 2 is in contact with each side surface of the three light-emitting devices 2 .
  • the thin film formed by each inkjet printing may only be located on the side of the three light-emitting devices 2 away from the substrate 1 to cover the three light-emitting devices 2 .
  • the next film may be formed on the side of the film away from the substrate 1 after being formed by curing.
  • the first light adjusting layer 3 can be formed between the adjacent two groups of light-emitting devices 2 by using an inkjet printing process.
  • the first light adjustment layer 3 may be formed between every two adjacent fixed patterns 51 by using an inkjet printing process. The first light adjustment layer 3 is in contact with each fixed pattern 51 .
  • the step of forming the first light adjustment layer 3 between two adjacent light emitting devices 2 by an inkjet printing process may include: S250 to S260 .
  • a retaining wall 35 is formed on the edge of the substrate 1 by an inkjet printing process.
  • the orthographic projection of the retaining wall 35 on the substrate 1 is annular, and the thickness of the retaining wall 35 is equal to or approximately equal to the distance between the surface of the plurality of light emitting devices 2 away from the substrate 1 and the substrate 1 .
  • the retaining walls 35 may be formed using a multi-pass inkjet printing process.
  • the process of forming the retaining wall 35 may refer to the process of forming the multi-layer light adjustment sub-layer 31 , which will not be repeated here.
  • a portion of the retaining wall 35 may be formed after each inkjet printing process.
  • the orthographic projection of a part of the retaining wall 35 on the substrate 1 is annular.
  • the orthographic projection of the retaining wall 35 on the substrate 1 is an annular shape, and the outer boundary of the orthographic projection of the annular shape and the edge of the substrate 1 overlap.
  • the orthographic projection of the retaining wall 35 on the substrate 1 is a polygonal ring, and the outer boundary of the polygonal ring orthographic projection overlaps with the side of the substrate 1 .
  • the cross-sectional shape of the retaining wall 35 may be rectangular or approximately rectangular.
  • the approximate rectangle refers to that, compared with a relatively regular rectangle, it may have some irregularities.
  • the distance between the light-emitting device 2 closest to the edge of the substrate 1 and the edge of the substrate 1 may be 100 ⁇ m to 200 ⁇ m.
  • the width of the barrier wall 35 may be 10%-20% of the distance between the light emitting device 2 closest to the edge of the substrate 1 and the edge of the substrate 1 .
  • the width of the retaining wall 35 (that is, the dimension of the cross-sectional shape of the retaining wall 35 in the direction parallel to the substrate 1 ) may range from 20 ⁇ m to 40 ⁇ m.
  • the width of the retaining wall 35 may be 20 ⁇ m, 23 ⁇ m, 29 ⁇ m, 37 ⁇ m, or 40 ⁇ m, or the like.
  • the filling portion 36 is formed in the retaining wall 35 by using an inkjet printing process.
  • the filling portion 36 and the retaining wall 35 form the first light-adjusting layer 3, and the side surface d of the first light-adjusting layer 3 away from the substrate 1 and the side surface e of the first light-adjusting layer 3 corresponding to the edge of the substrate 1 are formed.
  • the included angle is a right angle or an approximate right angle.
  • fill 36 may be formed using a multiple inkjet printing process.
  • the process of forming the filling portion 36 may refer to the process of forming the multi-layer light adjustment sub-layer 31 , which will not be repeated here.
  • each light adjustment sub-layer 31 includes a part located in the area where the blocking wall 35 is located, and a part located in the area where the filling part 36 is located.
  • the filling part 36 is located in the space enclosed by the retaining wall 35 , and a side surface of the filling part 36 away from the substrate 1 and a surface of the retaining wall 35 away from the substrate 1
  • the side surface is flat or approximately flat, so that the side surface d of the first light adjustment layer 3 formed away from the substrate 1 and the side surface e of the first light adjustment layer 3 corresponding to the edge of the substrate 1 are at right angles Or an approximate right angle, that is, the side surface d of the first light adjustment layer 3 away from the substrate 1 is directly connected with the side surface e of the first light adjustment layer 3 corresponding to the edge of the substrate 1, and there is no space between the two.
  • the thickness of the prepared retaining wall 35 ′ is relatively small (much smaller than the distance between the surface of the light-emitting device 2 away from the substrate 1 and the substrate 1 ), so that in the retaining wall 35 After the filling portion 36' is formed in the ', and the formed first light adjustment layer 3' reaches a desired thickness, the first light adjustment layer 3' is kept away from a portion of the substrate 1 based on the existence of the surface tension of the liquid. A chamfer is formed between the side surface d' and the side surface e' of the first light adjustment layer 3' corresponding to the edge of the substrate 1, which affects the splicing effect of the display substrate.
  • the thickness of the retaining wall 35 in the present disclosure is relatively large (for example, it can be realized by prolonging the residence time of the nozzle of the inkjet printing device at the edge of the substrate 1), so that the subsequently formed first light adjustment layer 3 can be kept away from the substrate.
  • the included angle between the side surface d of the bottom 1 and the side surface e of the first light adjustment layer 3 corresponding to the edge of the substrate 1 is a right angle or an approximate right angle, which improves the splicing effect of the display substrate 100 .
  • the curing energy of the subsequently formed first fixed layer 4 can be increased, the fluidity of the material of the first fixed layer 4 can be reduced, and the splicing effect of the display substrate 100 can be further improved.
  • an injection molding process is usually used to form black glue in the gaps between the above-mentioned Mini LEDs and on the surfaces of the plurality of Mini LEDs, so that the black glue and the side surfaces of the Mini LEDs and the Mini LEDs are formed. surface contact.
  • the solution of using the molding process to form the black glue cannot correspond to the edgeless process product, which will lead to poor splicing effect of the substrates spliced by multiple display substrates.
  • the display substrate 100 is formed by using an inkjet printing process, which can correspond to an edgeless process product.
  • an inkjet printing process which can correspond to an edgeless process product.
  • the preparation method of the display substrate may further include: using an inkjet printing process to form multiple Translucent particles 6.
  • the material of the light-transmitting particles 6 includes a flowable light-transmitting material.
  • the light-transmitting particles of the desired shape can be obtained by controlling the time interval between the ejection of the flowable light-transmitting material and the curing of the flowable light-transmitting material by the nozzle of the inkjet printing device. 6.
  • the curing process starts when the flowable light-transmitting material is dropped to the side of the first fixed layer 4 away from the substrate 1 .
  • the surface shape of the light-transmitting particles 6 can be, for example, a pyramid or a wedge.
  • the curing process is started after the flowable light-transmitting material has dropped to the side of the first fixed layer 4 away from the substrate 1 for a period of time.
  • the surface shape of the light-transmitting particles 6 can be, for example, an arc. surface or spherical surface.
  • the thickness of each light-transmitting particle 6 is 9 ⁇ m as an example.
  • the process of forming the light-transmitting particles 6 may be as follows: using an inkjet printing process to form a pattern with a thickness of 9 ⁇ m, and then performing curing treatment by UV curing to obtain the light-transmitting particles 6 .
  • the energy of the curing treatment may be 3000 mJ.
  • the display substrate 100 may be baked, and the structures formed by the inkjet printing process may be further cured, so that the shapes of the structures are more stable.
  • the temperature at which the above structures are baked and cured may be 120° C., and the time may be 1 hour.
  • the preparation method of the display substrate 100 provided by the present disclosure has high preparation precision, and can realize the printing preparation of patterns of smaller size. In this way, when the reflection of light needs to be reduced in a local area or narrow side of the display substrate 100 (for example, the side of the substrate 1 along the thickness direction), the preparation method of the display substrate 100 provided by the present disclosure can be used, A flowable light absorbing material (for example, the material of the first light adjustment layer 3 ) is printed at the corresponding position, and then the material is cured.
  • a flowable light absorbing material for example, the material of the first light adjustment layer 3
  • the display device 1000 includes the display substrate 100 as provided in some of the above embodiments.
  • the display substrate 100 included in the above-mentioned display device 1000 has the same structure and beneficial effects as those of the display substrate 100 provided in some of the above-mentioned embodiments, and details are not described herein again.
  • the above-mentioned display device 1000 further includes: a housing for installing the above-mentioned display substrate 100 , and/or a camera installed on the display substrate 100 , and the like.
  • the above-mentioned display device 1000 may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, and the like.

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Abstract

一种显示基板（100），包括：衬底（1）；设置在衬底（1）一侧的多个发光器件（2），多个发光器件（2）相互间隔设置；多个发光器件（2）分为多组，每组发光器件（2）包括至少一个发光器件（2）；第一光线调节层（3），设置在每相邻的两组发光器件（2）之间，且与相邻的发光器件（2）的至少一个侧面之间具有间隙；以及，设置在多个发光器件（2）及第一光线调节层（3）远离衬底（1）一侧的第一固定层（4）；第一固定层（4）为透光薄膜。

Description

显示基板及其制备方法、显示装置 技术领域
本公开涉及显示技术领域，尤其涉及一种显示基板及其制备方法、显示装置。
背景技术
次毫米发光二极管(Mini Light Emitting Diode，简称Mini LED)和微型发光二极管(Micro Light Emitting Diode，简称Micro LED)因具有自发光、高效率、高亮度、高可靠度、节能及反应速度快等诸多优点，被应用至微显示、手机电视等中等尺寸显示到影院大屏幕显示等领域中。
发明内容
一方面，提供一种显示基板。所述显示基板包括：衬底；设置在所述衬底一侧的多个发光器件，所述多个发光器件相互间隔设置；所述多个发光器件分为多组，每组发光器件包括至少一个发光器件；第一光线调节层，设置在每相邻的两组发光器件之间，且与相邻的发光器件的至少一个侧面之间具有间隙；以及，设置在所述多个发光器件及所述第一光线调节层远离所述衬底一侧的第一固定层；所述第一固定层为透光薄膜。
在一些实施例中，所述第一光线调节层包括层叠设置的多层光线调节子层。所述多层光线调节子层包括：沿垂直且远离所述衬底的方向层叠设置的第一光线调节子层和第二光线调节子层。所述第一光线调节子层在所述衬底上的正投影，与所述第二光线调节子层在所述衬底上的正投影重合，或者，位于所述第二光线调节子层在所述衬底上的正投影范围内。
在一些实施例中，相对于所述衬底，所述第一光线调节层远离所述衬底的一侧表面，与发光器件远离所述衬底的一侧表面持平，或者，低于所述发光器件远离所述衬底的一侧表面。
在一些实施例中，在相对于所述衬底，所述第一光线调节层远离所述衬底的一侧表面低于所述发光器件远离所述衬底的一侧表面的情况下，所述第一光线调节层远离所述衬底的一侧表面和所述衬底之间的间距，与所述发光器件远离所述衬底的一侧表面和所述衬底之间的间距的比例大于或等于4:5，且小于1:1。
在一些实施例中，至少一个发光器件的各侧面与所述第一光线调节层之间均具有间隙。
在一些实施例中，所述第一光线调节层在所述衬底上的正投影的外边界，与所述衬底的边缘重合或大约重合；所述第一光线调节层远离所述衬底的一侧表面，与所述第一光线调节层的对应所述衬底边缘的侧面之间的夹角为直角或近似直角。
在一些实施例中，沿垂直于所述衬底及所述相邻两个发光器件的中心线连线方向，所述第一光线调节层的位于所述相邻两个发光器件之间的部分，具有平行于所述衬底的多个截面。除最靠近所述衬底的一个截面和最远离所述衬底的一个截面以外的一个截面在所述衬底上的正投影，位于最靠近所述衬底的一个截面在所述衬底上的正投影范围内。
在一些实施例中，沿垂直于所述衬底及相邻两个发光器件的中心线连线方向，所述第一光线调节层的位于所述相邻两个发光器件之间的部分的剖面形状包括梯形或近似梯形。
在一些实施例中，沿垂直并远离所述衬底的方向，所述多个截面在所述衬底上的正投影的面积依次减小。所述梯形或近似梯形靠近所述衬底的下底边的长度，大于远离所述衬底的上底边的长度。
在一些实施例中，在沿垂直于所述衬底及所述相邻两个发光器件的中心线连线方向，所述第一光线调节层的位于所述相邻两个发光器件之间的部分的剖面形状包括近似梯形的情况下，所述近似梯形远离所述衬底的上底边，与位于所述上底边和所述近似梯形靠近所述衬底的下底边之间的侧边圆滑过渡。
在一些实施例中，每组发光器件包括一个发光器件。所述第一光线调节层位于任意相邻的两个发光器件之间。
在一些实施例中，所述第一固定层的一部分，位于所述第一光线调节层和相邻的发光器件之间的间隙内。
在一些实施例中，所述显示基板，还包括：第二固定层；所述第二固定层为透光薄膜。所述第二固定层包括相互间隔设置的多个固定图案。一个固定图案包围绕一组发光器件，以对所述一组发光器件进行固定。所述第一光线调节层位于所述多个固定图案中任意相邻的两个固定图案之间的间隙内，且与所述多个固定图案相接触。所述第一固定层位于所述第二固定层和所述第一光线调节层远离所述衬底的一侧。
在一些实施例中，沿垂直于所述衬底及相邻两个发光器件的中心线连线方向，所述第一光线调节层的位于所述相邻两个发光器件之间的部分的剖面形状包括梯形或近似梯形。所述梯形或近似梯形靠近所述衬底的下底边的长度，小于远离所述衬底的上底边的长度。
在一些实施例中，每组发光器件包括至少两个发光器件，所述固定图案对所述至少两个发光器件进行固定。所述发光器件被配置为，发出一种颜色的光线。所述至少两个发光器件中，各发光器件所发出的光线的颜色包括至少一种。
在一些实施例中，所述显示基板，还包括：设置在所述第一固定层远离所述衬底一侧的多个透光颗粒。所述多个透光颗粒被配置为，使得入射至所述多个透光颗粒的光线中的至少一部分的传播方向发生改变。
在一些实施例中，所述多个透光颗粒呈阵列状排布。其中，任意相邻的两个透光颗粒之间的间距的范围为100μm±5μm。各透光颗粒的厚度的范围为9μm±3μm。各透光颗粒在所述衬底上的正投影的尺寸的范围为50μm±5μm。和/或，所述多个透光颗粒的表面形状包括棱锥、楔形、弧面和球面中的至少一种。
在一些实施例中，所述显示基板，还包括：多个功能器件；至少一个功能器件与所述多个发光器件位于所述衬底的同一侧。所述多个功能器件被配置为，提供传感信号，和/或，为所述多个发光器件提供控制信号。
在一些实施例中，相对于所述衬底，所述第一固定层远离所述衬底的一侧表面，高于所述至少一个功能器件远离所述衬底的一侧表面，且高于所述多个发光器件远离所述衬底的一侧表面。
在一些实施例中，所述多个功能器件包括多个驱动芯片。所述多个驱动芯片与所述多个发光器件位于所述衬底的同一侧；一个驱动芯片与一组发光器件电连接；所述驱动芯片被配置为，向所述一组发光器件提供控制信号。所述显示基板还包括：设置在所述多个驱动芯片远离所述衬底的一侧表面上的第二光线调节层；所述第二光线调节层被配置为，减少所述多个驱动芯片对入射至其表面上的光线的反射。
在一些实施例中，相对于所述衬底，所述第一固定层远离所述衬底的一侧表面，高于所述驱动集成电路远离所述衬底的一侧表面。
在一些实施例中，所述第二光线调节层的材料与所述第一光线调节层的材料相同；或 者，所述第二光线调节层的材料与所述第一固定层的材料相同。
在一些实施例中，所述显示基板，还包括：设置在所述发光器件的侧面的光反射层。所述光反射层被配置为，对由所述发光器件发出并入射至所述光反射层的光线进行反射。
在一些实施例中，相对于所述衬底，所述第一光线调节层远离所述衬底的一侧表面，高于所述发光器件远离所述衬底的一侧表面。
在一些实施例中，在相对于所述衬底，所述第一光线调节层远离所述衬底的一侧表面高于所述发光器件远离所述衬底的一侧表面的情况下，所述第一光线调节层远离所述衬底的一侧表面和所述衬底之间的间距，与所述发光器件在平行于所述衬底的方向上的尺寸之间的比例大于或等于1:1，且小于或等于
Figure PCTCN2020139715-appb-000001
另一方面，提供一种显示基板的制备方法。所述显示基板的制备方法包括：提供衬底；所述衬底的一侧设置有相互间隔的多个发光器件，所述多个发光器件分为多组，每组发光器件包括至少一个发光器件。采用喷墨打印工艺在每相邻的两组发光器件之间形成第一光线调节层；所述第一光线调节层与相邻的发光器件的至少一个侧面之间具有间隙。采用喷墨打印工艺在所述多个发光器件远离所述衬底的一侧及所述第一光线调节层远离所述衬底的一侧形成第一固定层；所述第一固定层为透光薄膜。其中，所述采用喷墨打印工艺在每相邻的两组发光器件之间形成第一光线调节层，包括：采用喷墨打印工艺在每相邻的两组发光器件之间依次形成多层光线调节子层；所述多层光线调节子层层叠形成所述第一光线调节层。
在一些实施例中，所述采用喷墨打印工艺在每相邻的两组发光器件之间依次形成多层光线调节子层，包括：采用喷墨打印工艺在每相邻的两组发光器件之间形成第一光线调节子层；所述第一光线调节子层与相邻的发光器件之间具有间隙。采用喷墨打印工艺在所述第一光线调节子层远离所述衬底的一侧形成第二光线调节子层；所述第二光线调节子层覆盖所述第一光线调节子层，且与相邻的发光器件的至少一个侧面之间具有间隙。
在一些实施例中，所述采用喷墨打印工艺在每相邻的两组发光器件之间形成第一光线调节层的步骤包括：采用喷墨打印工艺在所述衬底的边缘形成挡墙；所述挡墙在所述衬底上的正投影呈环状，所述挡墙的厚度及所述多个发光器件远离所述衬底的一侧表面与所述衬底之间的间距相等或大致相等。采用喷墨打印工艺在所述挡墙内形成填充部；所述填充部和所述挡墙形成所述第一光线调节层，所述第一光线调节层远离所述衬底的一侧表面，与所述第一光线调节层的对应所述衬底边缘的侧面之间的夹角为直角或近似直角。
在一些实施例中，在所述采用喷墨打印工艺在每相邻的两组发光器件之间形成第一光线调节层之前，所述制备方法还包括：采用喷墨打印工艺在每组发光器件远离所述衬底的一侧形成固定图案；所述固定图案包围一组发光器件，以对所述一组发光器件进行固定；多个固定图案构成第二固定层。
又一方面，提供一种显示装置。所述显示装置，包括：如上述任一实施例中所述的显示基板。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实 际尺寸、方法的实际流程等的限制。
图1为根据本公开一些实施例中的一种显示基板的俯视图；
图2为图1所示显示基板的一种沿A-A＇向的剖视图；
图3为图2所示剖视图中的局部示意图；
图4为图2所示剖视图中的局部示意图；
图5为图2所示剖视图中的局部示意图；
图6为图1所示显示基板的另一种沿A-A＇向的剖视图；
图7为根据本公开一些实施例中的显示基板的一种光路图；
图8为图1所示显示基板的又一种沿A-A＇向的剖视图；
图9为根据本公开一些实施例中的显示基板的另一种光路图；
图10为根据本公开一些实施例中的显示基板的又一种光路图；
图11为根据本公开一些实施例中的显示基板的又一种光路图；
图12为图1所示显示基板的又一种沿A-A＇向的剖视图；
图13为根据本公开一些实施例中的另一种显示基板的俯视图；
图14为图11所示显示基板的一种沿B-B＇向的剖视图；
图15为图11所示显示基板的另一种沿B-B＇向的剖视图；
图16为图11所示显示基板的又一种沿B-B＇向的剖视图；
图17为根据本公开一些实施例中的一种透光颗粒的SEM(Scanning Electron Microscope，扫描电子显微镜)成象图；
图18为根据本公开一些实施例中的另一种透光颗粒的SEM成象图；
图19为根据本公开一些实施例中的一种发光器件的结构图；
图20为根据本公开一些实施例中的一种衬底的结构图；
图21为根据本公开一些实施例中的一种显示基板的结构图；
图22为根据本公开一些实施例中的另一种衬底的结构图；
图23为根据本公开一些实施例中的一种显示基板的局部结构图；
图24为根据本公开一些实施例中的一种显示基板的制备方法的流程图；
图25为图24所示流程图中S200的一种制备方法的流程图；
图26为图24所示流程图中S200的另一种制备方法的流程图；
图27为根据本公开一些实施例中的另一种显示基板的制备方法的流程图；
图28(a)～图28(g)为根据本公开一些实施例中的一种显示基板的制备步骤图；
图29(a)～图29(d)为根据本公开一些实施例中的另一种显示基板的制备步骤图；
图30为根据本公开一些实施例中的一种光线调节子层的结构图；
图31为根据本公开一些实施例中的一种光线调节层的结构图；
图32为根据本公开一些实施例中的一种第一固定层的结构图；
图33为根据本公开一些实施例中的另一种第一固定层的结构图；
图34为根据本公开一些实施例中的一种显示装置的结构图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然， 所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。
“A、B和C中的至少一个”与“A、B或C中的至少一个”具有相同含义，均包括以下A、B和C的组合：仅A，仅B，仅C，A和B的组合，A和C的组合，B和C的组合，及A、B和C的组合。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
本文中“被配置为”的使用意味着开放和包容性的语言，其不排除适用于或被配置为执行额外任务或步骤的设备。
另外，“基于”的使用意味着开放和包容性，因为“基于”一个或多个所述条件或值的过程、步骤、计算或其他动作在实践中可以基于额外条件或超出所述的值。
如本文所使用的那样，“约”或“近似”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
在相关技术中，Mini LED或Micro LED可以发出多种颜色的光，例如红色、绿色、蓝色或白色。在将多个Mini LED或多个Micro LED应用到显示基板中时，Mini LED或Micro LED能够设置在显示基板所具有的子像素区域内，直接作为子像素的一部分进行显示。
此处，以显示基板应用有多个Mini LED为例。在相关技术中，通常会在该多个Mini LED之间设置黑色材料，以利用该黑色材料提高显示基板的对比度。
在一种实现方式中，通常会在上述多个Mini LED之间的间隙内以及该多个Mini LED的表面涂覆黑胶，使得该黑胶与各Mini LED的侧面及表面相接触，以便于利用该黑胶提 高显示基板的对比度，并对各Mini LED进行固定。但是，采用涂覆工艺形成黑胶后，需要增加研磨工艺对黑胶的表面进行研磨，减薄黑胶的厚度。由于黑胶通常为掺杂有黑色颗粒的硅胶，这样在对黑胶进行研磨的过程中，该黑色颗粒容易从硅胶中崩离脱落，导致研磨后的黑胶的表面凹凸不平，一致性较差。
在另一种实现方式中，通常会在薄膜(例如聚对苯二甲酸乙二醇酯，Polyethylene terephthalate，简称PET)上设置黑胶形成黑膜，然后将该黑膜的黑胶与显示基板上的多个Mini LED相对，采用压合工艺将黑膜压合在显示基板上，使得该多个Mini LED刺入黑胶内，并与黑胶相接触。但是，黑膜的面积会大于显示基板的面积，在将黑膜压合在显示基板上后，还需要采用镭射工艺将黑膜超出显示基板的边缘的部分去除，这样会导致保留下来的部分黑膜中的薄膜边缘被破坏而出现泛白的现象，进而会导致由多个显示基板拼接而成的基板的拼接效果较差。
基于此，本公开的一些实施例提供了一种显示基板100。如图22所示，该显示基板100具有多个子像素区域P，该多个子像素区域P例如可以呈阵列状排布。
在一些示例中，如图2～图12及图14～图16所示，显示基板100可以包括：衬底1。
此处，衬底1的类型可以包括多种，可以根据实际需要选择设置。
示例性的，衬底1可以为刚性衬底。该刚性衬底例如为玻璃衬底或PMMA(Polymethyl methacrylate，聚甲基丙烯酸甲酯)衬底。
示例性的，衬底1可以为柔性衬底。该柔性衬底例如为PET(Polyethylene terephthalate，聚对苯二甲酸乙二醇酯)衬底、PEN(Polyethylene naphthalate two formic acid glycol ester，聚萘二甲酸乙二醇酯)衬底或PI(Polyimide，聚酰亚胺)衬底。
在一些示例中，如图1、图2、图6、图8及图12～图16所示，显示基板100还可以包括：设置在衬底1一侧的多个发光器件2。该多个发光器件2相互间隔设置，也即，任意相邻的两个发光器件2之间具有间隙。
上述多个发光器件2具有多种设置方式，可以根据实际需要选择设置。
例如，一个子像素区域P内可以设置有一个发光器件2，此时，该一个发光器件2可以用于进行相应子像素区域P中子像素的显示。
又如，一个子像素区域P内可以设置有多个发光器件2，此时，该多个发光器件2可以共同用于进行相应子像素区域P中子像素的显示。在此情况下，在进行显示的过程中，子像素区域P内的多个发光器件2可以仅有一部分发光器件2进行显示，在该部分发光器件2中的某个发光器件2出现异常时，可以使用其他发光器件2代替该发光器件2进行显示。
示例性的，上述多个发光器件2可以分为多组，其中，每组发光器件2可以包括至少一个发光器件2。
例如，每组发光器件2可以包括一个发光器件。又如，每组发光器件2可以包括两个发光器件2。又如，每组发光器件2可以包括三个发光器件2。
在一个子像素区域P内可以设置有一个发光器件2的情况下，一组发光器件2例如可以与一个或两个甚至更多子像素区域P相对应。
在一个子像素区域P内可以设置有多个发光器件2的情况下，一组发光器件2例如可以与一个子像素区域P相对应。
在一些示例中，如图1～图16所示，显示基板100还可以包括：第一光线调节层3。该 第一光线调节层3设置在每相邻的两组发光器件2之间。
其中，每组发光器件2包括至少一个发光器件2。也即，每组发光器件2可以包括一个发光器件2，也可以包括至少两个发光器件2。
此处，第一光线调节层3的设置方式与每组发光器件2所包括的发光器件2的数量相关，具有可以根据实际需要选择设置。
示例性的，如图1所示，每组发光器件2可以包括一个发光器件2。第一光线调节层3设置在每相邻的两组发光器件2之间，也即，第一光线调节层3可以位于任意相邻的两个发光器件2之间。此时，每相邻的两个发光器件2之间均设置有第一光线调节层3的一部分。第一光线调节层3可以呈网格状，每个网眼内设置有一个发光器件2。
示例性的，如图13所示，每组发光器件2可以包括至少两个发光器件2。第一光线调节层3设置在每相邻的两组发光器件2之间，也即，第一光线调节层3可以位于一部分发光器件2中每相邻的两个发光器件2之间。此时，每相邻的两组发光器件2之间均设置有第一光线调节层3的一部分。第一光线调节层3可以呈网格状，每个网眼内设置有一组发光器件2(也即至少两个发光器件2)。
如图13所示，以一组发光器件2包括三个发光器件2为例，该三个发光器件2例如采用如图13所示的排列方式进行排列，则一组发光器件2中，每相邻的两个发光器件2之间未设置第一光线调节层3。
在一些示例中，如图1、图2、图6、图8和图12～图16所示，第一光线调节层3与相邻的发光器件2的至少一个侧面之间具有间隙。
此处，上述相邻的发光器件2指的是，与第一光线调节层3相邻的所有发光器件2中的至少一个发光器件2。该至少一个侧面指的是，与第一光线调节层3相邻的至少一个发光器件2中一个发光器件2的至少一个侧面。侧面指的是，发光器件2所具有的多个面中，与衬底1垂直或大约垂直的面。
示例性的，第一光线调节层3与多个发光器件2相邻设置，且该多个发光器件2中的一个发光器件2的一个侧面与第一光线调节层3之间具有间隙，该一个发光器件2的其余侧面与第一光线调节层3之间相接触，该多个发光器件2中除该一个发光器件2以外的发光器件2的侧面均与第一光线调节层3相接触。
示例性的，至少一个发光器件2的各侧面与第一光线调节层之间均具有间隙。
例如，第一光线调节层3与多个发光器件2相邻设置，且第一光线调节层3与一个发光器件2的各侧面之间均具有间隙。也即，第一光线调节层3与该发光器件2之间均未形成接触。
又如，第一光线调节层3与多个发光器件2相邻设置，且第一光线调节层3与至少两个发光器件2的各侧面之间均具有间隙。也即，第一光线调节层3与该至少两个发光器件2之间均未形成接触。
在一些示例中，第一光线调节层3采用可流动的吸光材料固化形成。第一光线调节层3被配置为，对入射至第一光线调节层3的光线中的至少一部分进行吸收。
此处，入射至第一光线调节层3的光线可以包括：由外界入射至第一光线调节层3的自然光，和/或，发光器件2所发出的光线。
示例性的，衬底1会对入射至衬底1的表面上的自然光形成反射。在衬底1上设置第一光线调节层3后，可以利用第一光线调节层3对射向衬底1的自然光的至少一部分进行 吸收，减少衬底1对自然光的反射。这样在显示基板100进行显示的过程中，可以利用第一光线调节层3减少由外界入射至显示基板100并被衬底1反射的自然光的量，进而在显示基板100的显示态表现为暗态(也即发光器件2不出光)的情况下，可以使得显示基板100的显示面处于更黑的状态，有效提高显示基板100的对比度。
示例性的，发光器件2所发出的光线的传播反向基本为任意方向。在相邻的两组发光器件2之间设置第一光线调节层3后，可以利用第一光线调节层3对由发光器件2发出并入射至第一光线调节层3的光线的至少一部分进行吸收。这样在显示基板100进行显示的过程中，可以利用第一光线调节层3削弱甚至消除混光现象，提高显示基板100的显示效果。
需要说明的是，可流动的吸光材料指的是，该吸光材料具有流体性质。在将该可流动的吸光材料滴落在具有凸起和凹陷的表面上形成一薄膜后，该薄膜能够从凸起处向凹陷处流动，且无论凹陷处的形状如何，基于液体表面张力的存在，该薄膜的背离凸起和凹陷的一侧表面基本保持为较为平整的表面，而无凹凸不平的现象。
固化指的是，在采用可流动的吸光材料形成一薄膜，且该薄膜流动一定时间后，将该薄膜转化为固态，使得该薄膜的形态保持在转化为固态时的形态。
第一光线调节层3采用可流动的吸光材料固化形成，也即，第一光线调节层3的远离衬底1的一侧表面基本为较为平整的表面，而无凹凸不平的现象，该表面的一致性较高。而且，第一光线调节层3的位于边缘的部分和位于中部的部分之间的外观无差异。第一光线调节层3远离衬底1的一侧表面的质感例如类似于烤漆的质感。
示例性的，第一光线调节层3的材料例如可以包括聚乙酸树脂材料，其中例如可以掺杂有碳粉或染剂等，以使得第一光线调节层3的颜色较深，能够对照射至其自身的光线进行吸收。其中，第一光线调节层3的颜色包括但不限于黑色。
例如，第一光线调节层3的颜色还可以为绿色或棕色等。第一光线调节层3的颜色可以根据实际需要选择设置，以实现相应的功能(例如对照射至其自身的光线进行反射等)。
在一些示例中，如图1～图16所示，显示基板100还可以包括：设置在上述多个发光器件2及第一光线调节层3远离衬底1一侧的第一固定层4。
在一些示例中，第一固定层4为透光薄膜。也即，第一固定层4可以具有较好的光线透过率，这样可以减少或者避免对穿过第一固定层4的光线产生损耗，进而在发光器件2发光以使得显示基板100进行显示的过程中，可以具有较高的出光效率。
示例性的，第一固定层4的光线透过率的范围可以为96％～98％。例如光线透过率可以为96％、96.5％、97％、97.9％或98％等。
示例性的，相对于衬底1，第一固定层4远离衬底1的一侧表面，可以高于上述多个发光器件2远离衬底1的一侧表面。
这样第一固定层4可以对上述多个发光器件2形成覆盖，使得该多个发光器件2可以位于第一固定层4在衬底1上的正投影范围内。这样能够避免该多个发光器件2远离衬底1的一侧表面处于暴露状态，可以对该多个发光器件2远离衬底1的一侧表面形成保护，避免该多个发光器件2受到损伤。
示例性的，第一固定层4覆盖上述第一光线调节层3的至少一部分。第一光线调节层3在衬底1上的正投影外边界与第一固定层4在衬底1上的正投影边界可以至少部分重合，或者，第一光线调节层3在衬底1上的正投影位于第一固定层4在衬底1上的正投影范围 内，或者，第一固定层4在衬底1上的正投影位于第一光线调节层3在衬底1上的正投影范围内。
在一些示例中，第一固定层4采用可流动的可透光材料固化形成。也即，第一固定层4的远离衬底1的一侧表面基本为较为平整的表面，而无凹凸不平的现象，该表面的一致性较高。而且，第一固定层4的位于边缘的部分和位于中部的部分之间的外观无差异。第一固定层4远离衬底1的一侧表面的质感例如类似于烤漆的质感。
示例性的，第一固定层4的材料例如可以包括聚乙酸树脂材料，其中例如可以掺杂但不局限于掺杂钛白粉或扩散粉等。
在一些示例中，第一固定层4被配置为，对该多个发光器件2及第一光线调节层3进行固定。
此处，第一光线调节层3和衬底1之间具有一定的结合力(例如为粘接力)，可以使得第一光线调节层3较为牢固的固定在衬底1上。第一固定层4位于上述多个发光器件2和第一光线调节层3远离衬底1的一侧，可以使得第一固定层4和多个发光器件2之间具有一定的结合力，且使得第一固定层4和第一光线调节层3之间具有一定的结合力。由于第一固定层4为一面状薄膜，可以使得第一固定层4通过第一光线调节层3对该多个发光器件2进行固定，并通过该多个发光器件2对第一光线调节层3进行固定。
在一些示例中，如图2～图6、图8和图12所示，第一固定层4的一部分，位于第一光线调节层3和相邻的发光器件2之间的间隙内。
由于第一固定层4采用可流动的可透光材料固化形成，在第一光线调节层3和相邻的发光器件2之间具有间隙的情况下，在对可流动的可透光材料进行固化之前，该可流动的可透光材料可以流动至第一光线调节层3和相邻的发光器件2之间的间隙内，对该间隙进行填充，进而使得固化形成的第一固定层4中的一部分，位于该间隙内。
这样可以增大第一固定层4与发光器件2之间以及第一固定层4和第一光线调节层3之间的接触面积，增大第一固定层4与发光器件2之间以及第一固定层4和第一光线调节层3之间的结合力，进而增强第一固定层4对发光器件2及第一光线调节层3的固定效果。
由此，本公开的一些实施例所提供的显示基板100，通过在相邻两个发光器件2之间设置第一光线调节层3，并在发光器件2和第一光线调节层3远离衬底1的一侧形成第一固定层4，不仅可以利用该第一光线调节层3对由外界入射至该第一光线调节层3的自然光进行吸收，提高显示基板100的对比度，并对由发光器件2发出并入射至第一光线调节层3的光线进行吸收，削弱甚至消除混光现象，提高显示基板100的显示效果，还可以利用第一固定层4对发光器件2和第一光线调节层3进行固定，避免出现发光器件2脱落的情况。
而且，通过采用可流动的吸光材料固化形成第一光线调节层3，采用可流动的可透光材料固化形成第一固定层4，不仅可以提高第一固定层4对发光器件2及第一光线调节层3的固定效果，还可以使得第一光线调节层3远离衬底1的一侧表面以及第一固定层4远离衬底1的一侧表面基本为较为平整的表面，且两者表面中位于边缘的部分和位于中部的部分之间的外观无差异。这样可以有效提高第一光线调节层3远离衬底1的一侧表面以及第一固定层4远离衬底1的一侧表面的一致性，并提高由多个显示基板100拼接而成的基板的拼接效果。
在一些实施例中，如图3所示，第一光线调节层3包括层叠设置的多层光线调节子层31。
在制备形成第一光线调节层3的过程中，可以在一次相应的制备工艺中形成一层光线调节子层31，进而可以在经过多次一次进行的相应制备工艺后，得到由多层光线调节子层31构成的第一光线调节层3。基于此，第一光线调节层3并不是在一次制备工艺中制备形成的，第一光线调节层3的结构不是不可区分的一体结构。这样可以进一步提高第一光线调节层3远离衬底1的一侧表面的一致性。
在一些示例中，如图3所示，上述多层光线调节子层31可以包括：沿垂直且远离衬底1的方向层叠设置的第一光线调节子层31a和第二光线调节子层31b。
示例性的，第一光线调节子层31a在衬底1上的正投影，与第二光线调节子层31b在衬底1上的正投影重合。也即，第一光线调节子层31a在衬底1上的正投影面积和第二光线调节子层31b在衬底1上的正投影面积相等，第二光线调节子层31b可以覆盖第一光线调节子层31a远离衬底1的一侧表面。
示例性的，如图3所示，第一光线调节子层31a在衬底1上的正投影位于第二光线调节子层31b在衬底1上的正投影范围内。也即，第一光线调节子层31a在衬底1上的正投影面积小于第二光线调节子层31b在衬底1上的正投影面积，第二光线调节子层31b不仅可以覆盖第一光线调节子层31a远离衬底1的一侧表面，还可以覆盖第一光线调节子层31a朝向相邻的发光器件2的表面。
此处，上述第一光线调节子层31a和第二光线调节子层31b之间，可以未设置其他光线调节子层31，也即，两者直接接触。或者，上述第一光线调节子层31a和第二光线调节子层31b之间也可以设置有至少一层光线调节子层31。
上述第一光线调节子层31a可以与衬底1相接触，两者之间未设置其他光线调节子层31。当然，第一光线调节子层31a与衬底1之间也可以设置有至少一层光线调节子层31。
其中，在第一光线调节子层31a与衬底1相接触的情况下，第一光线调节子层31a则可以在第一次相应的制备工艺中形成。第一光线调节子层31a在衬底1上的正投影面积较小，例如可以与相邻的所有发光器件2之间具有间隙。这样可以避免影响后续光线调节子层31的形成。
在一些实施例中，第一光线调节层3与发光器件2之间的位置关系包括多种，可以根据实际需要选择设置。
在一些示例中，如图9、图14和图16所示，相对于衬底1，第一光线调节层3远离衬底1的一侧表面，与发光器件2远离衬底1的一侧表面持平。
也即，第一光线调节层3远离衬底1的一侧表面和发光器件2远离衬底1的一侧表面位于同一平面，第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距，与发光器件2远离衬底1的一侧表面和衬底1之间的间距相等。
示例性的，以发光器件2远离衬底1的一侧表面和衬底1之间的间距为80μm为例，则第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距可以为80μm。
此处，上述发光器件2可以指的是显示基板100所包括的所有发光器件2，也可以指的是显示基板100所包括的所有发光器件2中的一部分发光器件2。以下两个示例中关于发光器件2的说明相同，下面不再赘述。
在另一些示例中，如图2、图8和图12所示，相对于衬底1，第一光线调节层3远离 衬底1的一侧表面，低于发光器件2远离衬底1的一侧表面。
在此情况下，第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距，与发光器件2远离衬底1的一侧表面和衬底1之间的间距的比例可以大于或等于4:5，且小于1:1。
示例性的，以发光器件2远离衬底1的一侧表面和衬底1之间的间距为80μm为例，则第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距可以大于或等于64μm(也即发光器件2远离衬底1的一侧表面和衬底1之间的间距的80％)，且小于80μm。例如，第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距可以为64μm、70μm、71μm、73μm或79.9μm等。
在又一些示例中，如图6、图7和图10所示，相对于衬底1，第一光线调节层3远离衬底1的一侧表面，高于发光器件2远离衬底1的一侧表面。
如图7所示，由于第一光线调节层3可以对由发光器件2发出并入射至第一光线调节层3的光线进行吸收，这样在相对于衬底1，第一光线调节层3远离衬底1的一侧表面，高于发光器件2远离衬底1的一侧表面的情况下，可以减小发光器件2发出的光线的出射角度，进而可以减小显示基板100的可视角度，实现防窥功能。
在此情况下，第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距，与发光器件2在平行于衬底1的方向上的尺寸之间的间距的比例可以大于或等于1:1，且小于或等于
Figure PCTCN2020139715-appb-000002
其中，在第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距，与发光器件2在平行于衬底1的方向上的尺寸之间的间距的比例等于1:1的情况下，显示基板100的可视角度可以为90°。在第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距，与发光器件2在平行于衬底1的方向上的尺寸之间的间距的比例等于
Figure PCTCN2020139715-appb-000003
的情况下，显示基板100的可视角度可以为60°。也即，显示基板100的可视角度的范围可以为60°～90°。
示例性的，发光器件2在平行于衬底1的方向上的尺寸可以指的是，发光器件2在衬底1上的正投影的形状的边长以及对角线长度所构成的范围之内的任一值。
以发光器件2在衬底1上的正投影形状为正方形为例，该正方形的边长例如为100μm，该正方形的对角线长度例如为
Figure PCTCN2020139715-appb-000004
则发光器件2在平行于衬底1的方向上的尺寸的范围可以为
Figure PCTCN2020139715-appb-000005
第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距的范围可以为
Figure PCTCN2020139715-appb-000006
此处，发光器件2在衬底1上的正投影形状还可以为其他形状，该形状的尺寸还可以为其他尺寸。本公开仅是为了较为简单清楚的说明第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距以及发光器件2在平行于衬底1的方向上的尺寸之间的关系，并未将发光器件2在衬底1上的正投影形状及该形状的尺寸限定为上述示例中所示的内容。
需要说明的是，如图10所示，第一光线调节层3和发光器件2相接触的侧面以及第一光线调节层3远离衬底1的一侧表面之间可以圆滑过渡。此时，显示基板100的可视角度的范围则为光线L与第一光线调节层3中圆滑过渡部分的切线之间形成的角度的范围。基于此，第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距，与发光器件2在平行于衬底1的方向上的尺寸之间的间距的比例可以大于
Figure PCTCN2020139715-appb-000007
在一些实施例中，第一固定层4中与发光器件2相对的部分，靠近发光器件2的一侧表面和其远离衬底1的一侧表面之间的间距范围可以根据实际需要选择设置，能够实现对 发光器件2和第一光线调节层3的固定，并具有较高的光线透过率即可。
示例性的，第一固定层4中与发光器件2相对的部分，靠近发光器件2的一侧表面和其远离衬底的一侧表面之间的间距范围可以为40μm～50μm。例如，该间距可以为40μm、42μm、45μm、46.5μm或50μm等。
在一些实施例中，如图4所示，沿垂直于衬底1及相邻两个发光器件2的中心线连线方向，第一光线调节层3的位于该相邻两个发光器件2之间的部分，具有平行于衬底1的多个截面F。其中，除最靠近衬底1的一个截面F和最远离衬底1的一个截面F以外的一个截面F在衬底1上的正投影，位于最靠近衬底1的一个截面F在衬底1上的正投影范围内。
在一些示例中，第一光线调节层3的最靠近衬底1的一个截面F可以指的是，第一光线调节层3的靠近衬底1的一侧表面。第一光线调节层3的最远离衬底1的一个截面F可以指的是，第一光线调节层3的远离衬底1的一侧表面。除最靠近衬底1的一个截面F和最远离衬底1的一个截面F以外的一个截面F可以指的是，上述多个截面F中，位于最靠近衬底1的一个截面F和最远离衬底1的一个截面F之间的多个截面F中的任一截面F。
示例性的，除最靠近衬底1的一个截面F和最远离衬底1的一个截面F以外的一个截面F在衬底1上的正投影，位于最靠近衬底1的一个截面F在衬底1上的正投影范围内，也即，该截面F(也即除最靠近衬底1的一个截面F和最远离衬底1的一个截面F以外的一个截面F)在衬底1上的正投影面积小于最靠近衬底1的一个截面F在衬底1上的正投影面积，该截面F在衬底1上的正投影外边界的周长小于位于最靠近衬底1的一个截面F在衬底1上的正投影外边界的周长，该截面F在衬底1上的正投影外边界与最靠近衬底1的一个截面F在衬底1上的正投影外边界无交叠或部分重叠。由该截面F和最靠近衬底1的一个截面F所构成的图形为一端(对应为该截面F)较窄、相对的另一端(对应为最靠近衬底1的一个截面F)较宽的图形。
其中，该截面F与最远离衬底1的一个截面F之间的投影关系可以包括多种。
示例性的，最远离衬底1的一个截面F在衬底1上的正投影可以与该截面F在衬底1上的正投影重合。或者，最远离衬底1的一个截面F在衬底1上的正投影可以位于该截面F在衬底1上的正投影范围内。此时，上述各截面F在衬底1上的正投影面积可以逐渐减小(并非逐一减小)。
示例性的，如图4所示，该截面F在衬底1上的正投影可以位于最远离衬底1的一个截面F在衬底1上的正投影范围内。基于制备工艺不可避免的原因或者特殊的设计，最远离衬底1的一个截面F在衬底1上的正投影面积可以大于该截面F在衬底1上的正投影面积。
如图4所示，以上述第一光线调节层3的位于该相邻两个发光器件2之间的部分，可以具有三个平行于衬底1的截面F为例。沿垂直且远离衬底1的方向，该平行于衬底1的三个截面F分别为第一截面f1、第二截面f2和第三截面f3。第一截面f1为最靠近衬底1的一个截面F，第三截面f3为最远离衬底1的一个截面F。
例如，第二截面f2在衬底1上的正投影位于第一截面f1在衬底1上的正投影范围内。第二截面f2在衬底1上的正投影边界和第一截面f1在衬底1上的正投影边界无交叠或者部分交叠。第二截面f2在衬底1上的正投影面积小于第一截面f1在衬底1上的正投影的面积。
例如，第三截面f3在衬底1上的正投影可以位于第二截面f2在衬底1上的正投影范围内，或者，第三截面f3在衬底1上的正投影可以和第二截面f2在衬底1上的正投影重合。第三截面f3在衬底1上的正投影面积小于或等于第二截面f2在衬底1上的正投影。当然，第三截面f3在衬底1上的正投影面积也可以大于第二截面f2在衬底1上的正投影面积。
在一些实施例中，沿垂直于衬底1及相邻的两个发光器件2的中心线连线方向，第一光线调节层3的第一光线调节层的位于该相邻的两个发光器件2之间的部分的剖面形状可以包括多种。
在一些示例中，如图2、图8和图12所示，上述剖面形状例如可以为矩形(也即长方形或正方向)。
也即，在形成第一光线调节层3的过程中，第一光线调节层3的材料填充得较多，使得第一光线调节层3的材料与上述相邻两个发光器件2相接触。此时，第一光线调节层3与上述相邻两个发光器件2之间无间隙，第一光线调节层3与上述相邻两个发光器件2相接触。
在另一些示例中，如图3～图5所示，上述剖面形状例如可以梯形或近似梯形。
也即，在形成第一光线调节层3的过程中，第一光线调节层3的材料填充得较少，使得第一光线调节层3的材料与上述相邻两个发光器件2未形成接触。此时，经固化后形成的第一光线调节层3与上述相邻两个发光器件2之间可以具有间隙，第一光线调节层3与上述相邻两个发光器件2未形成接触。
示例性的，近似梯形指的是，其形状与梯形类似，相比于较为规则的梯形，近似梯形可以有部分不规则。例如，如图4所示，位于该近似梯形的上底边b2和下底边b1之间的侧边c为非直线形。
在一些示例中，如图5所示，在上述剖面形状包括近似梯形的情况下，该近似梯形的上底边b2，与位于该上底边b2和下底边b1之间的侧边c圆滑过渡。
由于第一光线调节层3采用可流动的吸光材料固化形成，在将第一光线调节层3的材料设置在衬底1的一侧后，基于液体表面张力的存在，可以使得固化形成的第一光线调节层3位于相邻两个发光器件2之间的部分，沿垂直于衬底1及该相邻两个发光器件2的中心线连线方向的剖面形状包括近似梯形，且该近似梯形的上底边b2和侧边c之间圆滑过渡。
在一些示例中，如图5所示，沿垂直并远离衬底1的方向，上述多个截面F在衬底1上的正投影的面积依次减小。第一光线调节层3的位于相邻两个发光器件2之间的部分的剖面形状所包括的梯形或近似梯形中，靠近衬底1的下底边b1的长度，大于远离衬底1的上底边b2的长度。
继续以第一光线调节层3的位于该相邻两个发光器件2之间的部分，具有平行于衬底1的三个截面F为例。则第一截面f1在衬底1上的正投影的面积大于第二截面f2在衬底1上的正投影的面积，第二截面f2在衬底1上的正投影的面积大于第三截面f3在衬底1上的正投影的面积。
其中，第三截面f3在衬底1上的正投影可以位于第二截面f2在衬底1上的正投影范围内，或者，第三截面f3在衬底1上的正投影可以和第二截面f2在衬底1上的正投影重合。第二截面f2在衬底1上的正投影可以位于第一截面f1在衬底1上的正投影范围内， 或者，第二截面f2在衬底1上的正投影可以和第一截面f1在衬底1上的正投影重合。也即，第一光线调节层3的位于相邻两个发光器件2之间的部分的剖面形状，可以为正梯形或近似正梯形。该正梯形可以为直角梯形，该近似正梯形可以为近似直角梯形。
在一些实施例中，如图2所示，第一光线调节层3远离衬底1的一侧表面d，与第一光线调节层3的对应衬底1边缘的侧面e之间的夹角为直角或近似直角。
示例性的，第一光线调节层3的对应衬底1边缘的侧面e指的是，第一光线调节层3与衬底1的边缘相连接的表面，该表面与衬底1所在表面之间具有夹角(该夹角例如小于或等于90°)，且该表面与第一光线调节层3远离衬底1的一侧表面d之间具有夹角(该夹角例如大于或等于90°)。
第一光线调节层3远离衬底1的一侧表面d，与第一光线调节层3的对应衬底1边缘的侧面e之间的夹角为直角或近似直角，也就意味着，第一光线调节层3远离衬底1的一侧表面d与第一光线调节层3的对应衬底1边缘的侧面e之间直接相连接，两者之间无圆滑过渡或基本无圆滑过渡，进而未形成或基本未形成倒角。
由于第一固定层4为透光薄膜，在用户观看显示基板100的过程中，主要视觉效果由第一光线调节层3提供。通过将第一光线调节层3远离衬底1的一侧表面d，与第一光线调节层3的对应衬底1边缘的侧面e设置为直角或近似直角，在将多个显示基板100进行拼接后，相邻两个第一光线调节层3之间的无缝隙或基本无缝隙，在视觉上可以将多个显示基板100中的多个第一光线调节层3视为一体的结构，这样有利于提高由多个显示基板100拼接而成的基板的拼接效果。
在一些实施例中，如图13～图16所示，显示基板100还可以包括：第二固定层5。
在一些示例中，如图13所示，第二固定层5包括相互间隔设置的多个固定图案51。也即，任意相邻两个固定图案51之间具有间隙，未形成接触。其中，该多个固定图案51的排布方式可以根据实际需要选择设置。
在一些示例中，如图13～图16所示，一个固定图案51包围一组发光器件2，以对该一组发光器件2进行固定。
示例性的，一个固定图案51包围一组发光器件2，可以为：一个固定图案51可以位于该一组发光器件2的周侧。
例如，在一组发光器件2包括一个发光器件2的情况下，一个固定图案51可以位于该发光器件2的周侧，与该发光器件2的各侧面相接触，对该发光器件2进行固定。或者，如图14所示，在一组发光器件2包括多个发光器件2的情况下，一个固定图案51可以位于该多个发光器件2中各发光器件2的周侧，与该多个发光器件2中的各发光器件2的各侧面相接触，对该多个发光器件2进行固定。
示例性的，一个固定图案51包围一组发光器件2，可以为：一个固定图案51可以位于该一组发光器件2的周侧及远离衬底1的一侧表面。
例如，在一组发光器件2包括一个发光器件2的情况下，一个固定图案51可以位于该发光器件2的周侧及其远离衬底1的一侧表面，与该发光器件2的各侧面及远离衬底1的一侧表面相接触，对该发光器件2进行固定。或者，如图15和图16所示，在一组发光器件2包括多个发光器件2的情况下，一个固定图案51可以位于该多个发光器件2中各发光器件2的周侧及其远离衬底1的一侧表面，与该多个发光器件2中的各发光器件2的各侧面及其远离衬底1的一侧表面相接触，对该多个发光器件2进行固定。
在一些示例中，每组发光器件2包括至少两个发光器件2，一个固定图案51对该至少两个发光器件2进行固定。
示例性的，一个发光器件2被配置为，发出一种颜色的光线。例如，该光线可以为红色光、绿色光或蓝色光。又如，该光线可以为品红色光、黄色光或青色光。当然，该光线还可以为白色光。
示例性的，上述至少两个发光器件2中，各发光器件2所发出的光线的颜色包括至少一种。
在各发光器件2所发出的光线的颜色包括一种的情况下，上述至少两个发光器件2中的各发光器件2所发出的光线的颜色相同。
在各发光器件2所发出的光线的颜色包括至少两种的情况下，上述至少两个发光器件2中的各发光器件2所发出的光线的颜色可以均不相同，也可以部分相同。
例如，一组发光器件2包括三个发光器件2，该三个发光器件2可以包括红色发光器件、绿色发光器件和蓝色发光器件中的至少一个。在该三个发光器件2包括一个红色发光器件、一个绿色发光器件和一个蓝色发光器件的情况下，该三个发光器件2可以构成一个像素单元。
当然，上述发光器件2还可以包括白色发光器件。
示例性的，第二固定层5为透光薄膜。也即，第二固定层5可以具有较好的光线透过率，这样可以减少或者避免对穿过各固定图案51的光线产生损耗，进而在发光器件2发光以使得显示基板100进行显示的过程中，可以具有较高的出光效率。
示例性的，第二固定层5采用可流动的的可透光材料经固化形成。其中，第二固定层5的材料形成在衬底1上与对第二固定层5的材料进行固化的时间间隔较小，且基于液体表面张力的存在，可以使得第二固定层5中的各固定图案51的剖面形状，为或类似于如图15和图16中所示的形状，使得各固定图案51远离衬底1的一侧表面呈弧形。其中，在各固定图案51在覆盖且围绕相应的一组发光器件2的基础上，其在衬底1上的正投影面积较小。每个固定图案51远离衬底1的一侧表面在衬底1上的正投影，位于该固定图案51靠近衬底1的一侧表面在衬底1上的正投影范围内。
在一些示例中，如图14～图16所示，第一光线调节层3可以位于上述多个固定图案51中任意相邻的两个固定图案51之间的间隙内，且与该多个固定图案51相接触。此时，第一光线调节层3和相邻的发光器件2之间通过第二固定层5隔开，而未与相邻的发光器件2形成接触。第一光线调节层3可以呈网格状，每个网眼内设置有被一个固定图案51所覆盖且围绕的一组发光器件2。
由于每个固定图案51远离衬底1的一侧表面在衬底1上的正投影，位于该固定图案51靠近衬底1的一侧表面在衬底1上的正投影范围内，则位于每相邻的两个固定图案51之间的间隙，在平行于衬底1的方向上的尺寸，沿垂直且远离衬底1的方向上依次减小。
基于此，如图14～图16所示，在每相邻的两个固定图案51之间的间隙内形成第一光线调节层3后，沿垂直于衬底1及相邻两个发光器件2的中心线连线方向，第一光线调节层3的位于该相邻两个发光器件2之间的部分的剖面形状包括梯形或近似梯形。且该梯形或近似梯形靠近衬底1的下底边b1的长度，小于远离衬底1的上底边b2的长度。也即，该梯形或近似梯形为倒梯形。
此外，如图15所示，基于液体表面张力的存在，第一光线调节层3的位于相邻两个固 定图案51之间的部分远离衬底1的一侧表面的形状，例如可以为弧形。
通过设置第二固定层5，可以弱化第一光线调节层3对发光器件2的影响，改善显示基板100在较大可视角度下的Mura现象。
在一些示例中，如图14～图16所示，第一固定层4可以位于第二固定层5和第一光线调节层3远离衬底1的一侧。
示例性的，上述第二固定层5在衬底1上的正投影可以位于第一固定层4在衬底1上的正投影范围内。
通过将第一固定层4设置在第二固定层5和第一光线调节层3远离衬底1的一侧，既可以利用第一固定层4对第二固定层5和第一光线调节层3进行固定，进而对发光器件2进行固定，还可以利用第一固定层4使得显示基板100整体具有较为平整的表面，提高表面一致性。
在一些实施例中，如图8、图12和图16所示，显示基板100还可以包括：设置在第一固定层4远离衬底1一侧的多个透光颗粒6。该多个透光颗粒6例如可以设置在第一固定层4远离衬底1的一侧表面上。
在一些示例中，上述多个透光颗粒6被配置为，使得入射至该多个透光颗粒6的光线中的至少一部分的传播方向发生改变。
需要说明的是，透光颗粒6对光线的传播方向的改变，与透光颗粒6的形状相关。
示例性的，如图10所示，上述多个透光颗粒6的表面形状包括棱锥和楔形中的至少一种。棱锥或楔形的尖端位于远离衬底1的一侧。此时，上述多个透光颗粒6能够使的由多个发光器件2发出并穿过该多个透光颗粒6的至少一部分光线发生聚集，这样有利于提高显示基板100的显示亮度。
在此情况下，若相对于衬底1，第一光线调节层3远离衬底1的一侧表面，高于发光器件2远离衬底1的一侧表面，则可以进一步减小显示基板100的可视角度，进一步提升显示基板100的防窥效果。
示例性的，如图9所示，上述多个透光颗粒6的表面形状包括弧面和球面中的至少一种。此时，上述多个透光颗粒6能够使来由多个发光器件2发出并穿过该多个透光颗粒6的至少一部分光线发生扩散，这样有利于提高显示基板100的出光均匀性。此外，上述多个透光颗粒6还能够使得由外界入射至该多个透光颗粒6的至少一部分光线发生漫反射，提高显示基板100的显示效果。
在一些示例中，如图17和图18所示，上述多个透光颗粒6可以呈阵列状排布。也即，该多个透光颗粒6可以沿第一方向X排列成多行，并沿第二方向Y排列成多列。
此处，第一方向X和第二方向Y相交。示例性的，第一方向X和第二方向Y之间的夹角可以为90°。
通过将多个透光颗粒6较为规则的排列，可以使得显示基板100具有较好的可视角度范围和外观效果。
在一些示例中，上述多个透光颗粒6中，任意相邻的两个透光颗粒之间的间距的范围为100μm±5μm。此处，该间距指的是相邻的两个透光颗粒之间的最小间距。
示例性的，任意相邻的两个透光颗粒之间的间距可以为95μm、97μm、100μm、104μm或105μm等。
通过将多个透光颗粒6中任意相邻的两个透光颗粒之间的间距设置为上述范围，可以 使得显示基板100具有较好的可视角度范围和外观效果。
在一些示例中，各透光颗粒6的厚度的范围为9μm±3μm。
示例性的，各透光颗粒6的厚度可以为6μm、7μm、9μm、11μm或12μm等。
通过将各透光颗粒6的厚度设置为上述范围，可以使得显示基板100具有较好的可视角度范围和外观效果。
在一些示例中，各透光颗粒6在衬底1上的正投影的尺寸的范围为50μm±5μm。此处，各透光颗粒6在衬底1上的正投影的尺寸指的是，经过该正投影的中心的直线，与该正投影的边界相交的两点之间的间距。上述尺寸例如可以为最大间距、最小间距或平均间距。
例如，如果各透光颗粒6在衬底1上的正投影的形状包括圆形，则该尺寸可以为圆形的直径。如果各透光颗粒6在衬底1上的正投影的形状包括正方形，则该尺寸可以为正方形的对角线长度或边长。
示例性的，各透光颗粒6在衬底1上的正投影的尺寸可以为45μm、46μm、47μm、50μm、52μm或55μm等。
通过将各透光颗粒6在衬底1上的正投影的尺寸设置为上述范围，可以使得显示基板100具有较好的可视角度范围和外观效果。
值得一提的是，上述多个透光颗粒6的材料可以为具有较高光线透过率的材料，这样可以避免因透光颗粒6的设置而影响发光器件2的出光率。
示例性的，透光颗粒6的材料可以包括聚乙酸树脂材料，其中例如可以掺杂有钛白粉或扩散粉等。
此外，透光颗粒6可以为可流动的可透光材料固化形成。这样在制备形成透光颗粒6的过程中，可以根据需要选择设置可流动的可透光材料滴落至第一固定层4远离衬底1的一侧表面和固化定型之间的时间长度，以使得固化形成的透光颗粒6的形状为所需的形状。
在一些实施例中，如图9所示，显示基板100还可以包括：设置在各发光器件2的侧面的光反射层7。该光反射层7例如可以位于每个发光器件2的各个侧面。
在一些示例中，光反射层7被配置为，对由各发光器件2发出并入射至光反射层7的光线进行反射。
例如，一个发光器件2所发出的光线可以入射至其侧面所设置的光反射层7，并在该光反射层7的反射作用下，反射回发光器件2，并从发光器件2远离衬底1的一侧射出。
通过设置光反射层7，可以提高发光器件2所发出的光线的利用率，提高显示基板100的光效，进而降低显示基板100的功耗。
光反射层7的材料包括多种，可以根据实际需要选择设置，以能够对发光器件2发出的光线进行反射、且不影响发光器件2的电学性能为准。例如，光反射层7的材料包括但不限于白色油墨。
需要说明的是，发光器件2与衬底1之间的通常采用焊点进行电连接。
在一些实施例中，如图17和图19所示，衬底1上可以设置有多个焊点，该多个焊点可以包括多个阳极焊点11和多个阴极焊点12。
下面，如图19所示，以发光器件2为Mini LED为例，对发光器件2的结构及发光器件2与衬底1之间的连接方式进行示意性说明。
在一些示例中，如图19所示，上述发光器件2包括依次层叠设置的基底22、N型半 导体层23、发光层21、P型半导体层24、电流阻隔层25、导电层26、布拉格反射层27、阴极电极引脚28以及阳极电极引脚29，其中，阴极电极引脚28与N型半导体层23连接，阳极电极引脚29与导电层26连接。
示例性的，发光层21能够发出光线。每个发光层21所发出的光线，可以在依次穿过基底22、光线调节层3和第一固定层4之后，射向外界。
在将如图19中所示的结构应用于显示基板100中的情况下，阴极电极引脚28与阴极焊点12电连接(例如阴极电极引脚28插入阴极焊点12内)，阳极电极引脚29可以与阳极焊点11电连接(例如阳极电极引脚29插入阳极焊点11内)。
示例性的，发光器件2远离衬底1的一侧表面与衬底1之间的间距，可以为焊点的厚度和发光器件2的厚度之和。
在一些实施例中，如图12所示，显示基板100还包括：多个功能器件8。该多个功能器件8中的至少一个功能器件8与发光器件2设置在衬底的同一侧。
在一些示例中，上述多个功能器件8被配置为，提供传感信号，和/或，为发光器件2提供控制信号。也即，上述多个功能器件8可以均用于提供传感信号，也可以均用于为发光器件2提供控制信号。当然，上述多个功能器件8中的一部分可以用于提供传感信号，另一部分用于为发光器件2提供控制信号。
示例性的，上述多个功能器件8可以包括触控传感器件、红外传感器件或距离传感器件等。
示例性的，上述多个功能器件8可以包括驱动集成电路(Integrated Circuit，简称IC)等。
在一些示例中，在上述至少一个功能器件8与发光器件2设置在衬底的同一侧的情况下，相对于衬底1，第一固定层4远离衬底1的一侧表面，高于该至少一个功能器件8远离衬底1的一侧表面。也即，第一固定层4远离衬底1的一侧表面与衬底1之间的间距大于该至少一个功能器件8远离衬底1的一侧表面与衬底1之间的间距。
在本公开中，对发光器件2进行驱动以使得显示基板100进行图像显示的方式包括多种，可以根据需要选择设置。
在一些实施例中，显示基板100可以采用驱动芯片(也可称为驱动IC)直接驱动的方式，对发光器件2进行驱动发光。
在一些示例中，如图12和图21所示，上述多个功能器件8可以包括：多个驱动芯片81。该多个驱动芯片81与发光器件2位于衬底1的同一侧。其中，一个驱动芯片81可以与一组发光器件2电连接。
示例性的，如图21所示，在一组发光器件2包括三个发光器件2的情况下，一个驱动芯片81可以与三个发光器件2电连接。该三个发光器件2例如包括一个红色发光器件、一个绿色发光器件和一个蓝色发光器件。
示例性的，如图21所示，衬底1上还可以设置有沿第一方向X延伸的多条供电电压信号线Vcc，沿第二方向Y延伸的多条第一电压信号线VR、多条第二电压信号线VGB和多条数据线Data。
示例性的，如图21所示，每个红色发光器件的阳极电极引脚29可以通过阳极焊点11与一条第一电压信号线VR电连接，每个绿色发光器件的阳极电极引脚29可以通过阳极焊点11与一条第二电压信号线VGB电连接，每个蓝色发光器件的阳极电极引脚29可以 通过阳极焊点11与一条第二电压信号线VGB电连接。
示例性的，如图21所示，驱动芯片81可以有六个引脚，其中三个引脚分别通过阴极焊点12与三个发光器件2的阴极电极引脚28一一对应地电连接。另外三个引脚中，一个引脚可以与一条数据线Data电连接，一个引脚可以与一条供电电压信号线Vcc电连接，另一个引脚可以接地。
在一些示例中，如图12所示，显示基板100还可以包括：设置在上述多个驱动芯片81远离衬底1的一侧表面上的第二光线调节层9。该第二光线调节层9被配置为，减少上述多个驱动芯片81对入射至其表面上的光线的反射。
此处，驱动芯片81远离衬底1的一侧表面对光线的反射率较高。通过设置第二光线调节层9，以减少驱动芯片81对入射至其表面上的光线的反射，这样在显示基板100的显示态表现为暗态(也即发光器件2不出光)的情况下，可以使得显示基板100的显示面处于更黑的状态，有效提高显示基板100的对比度。
示例性的，第二光线调节层9的材料与第一固定层4的材料相同。虽然第一固定层4的材料具有较高的光线透过率，但是对穿过其自身的光线仍具有一定的损耗。通过将第二光线调节层9的材料设置为与第一固定层4的材料相同，可以在光线穿过第二光线调节层9入射至驱动芯片81远离衬底1的一侧表面的过程中，使得该光线产生一定的损耗，在驱动芯片81远离衬底1的一侧表面对损耗后的光线进行反射后，可以在反射后的光线穿过第二光线调节层9射入外界的过程中，进一步产生一定的损耗。由此，可以减少驱动芯片81对入射至其表面上的光线的反射。
示例性的，第二光线调节层9的材料可以与第一光线调节层3的材料相同。此时，在光线穿过第二光线调节层9入射至驱动芯片81远离衬底1的一侧表面的过程中，可以利用第二光线调节层9对该光线进行有效的吸收，减少驱动芯片81对入射至其表面上的光线的反射。
此处，第二光线调节层9靠近驱动芯片81的一侧表面和其远离驱动芯片81的一侧表面之间的间距(也即第二光线调节层9的厚度)可以根据实际需要选择设置，能够减少驱动芯片81对入射至其表面上的光线的反射即可。
示例性的，第二光线调节层9的厚度的范围可以为20μm～40μm。这样既可以确保减少光线反射的效果，又可以避免材料的浪费。
例如，第二光线调节层9的厚度可以为20μm、25μm、30μm、33μm或40μm等。
此外，示例性的，相对于衬底1，第一固定层4远离衬底1的一侧表面，高于驱动芯片81远离衬底1的一侧表面。相对于衬底1，第二光线调节层9远离衬底1的一侧表面，与第一固定层4远离衬底1的一侧表面持平，或者高于第一固定层4远离衬底1的一侧表面。
这样可以避免第二光线调节层9远离衬底1的一侧表面与衬底1之间的间距，以及第一固定层4远离衬底1的一侧表面与衬底1之间的间距之间的差值较大而影响显示基板100的外观效果。
例如，第二光线调节层9远离衬底1的一侧表面与衬底1之间的间距，以及第一固定层4远离衬底1的一侧表面与衬底1之间的间距之间的差值的范围可以为0μm～20μm。
需要说明的是，上述示例仅为显示基板100采用驱动芯片对发光器件2进行直接驱动的一种示例性说明，驱动芯片和发光器件2之间还可以有其他的连接方式，此处不再赘述。
在另一些实施例中，显示基板100可以采用像素驱动电路驱动的方式，对发光器件2进行驱动发光。
在一些示例中，如图22所示，衬底1上可以设置有沿第一方向X延伸的多条栅线Gate，及沿第二方向Y延伸的多条数据线Data和多条电极引线13。该多条栅线Gate和多条数据线Data相互交叉限定出上述多个子像素区域P。
在一个子像素区域P内设置有一个发光器件2的情况下，每个子像素区域P内可以设置有一个像素驱动电路14。其中，沿第一方向X排列成一排的多个像素驱动电路14可以与一条栅线Gate电连接，沿第二方向Y排列成一排的多个像素驱动电路14可以与一条数据线Data电连接。一条电极引线13与沿第二方向Y排列成一排的多个像素驱动电路14相对应。
此处，像素驱动电路14的结构可以包括多种。示例性的，像素驱动电路14的结构可以包括“2T1C”、“6T1C”、“7T1C”、“6T2C”或“7T2C”等结构。此处，“T”表示为薄膜晶体管，位于“T”前面的数字表示为薄膜晶体管的数量，“C”表示为存储电容器，位于“C”前面的数字表示为存储电容器的数量。每种结构的像素驱动电路14所包括的多个薄膜晶体管中，有一个薄膜晶体管为驱动晶体管。如图22所示，本公开以像素驱动电路14为“2T1C”结构为例。
示例性的，如图22和图23所示，每个子像素区域P中可以设置有一个阳极焊点11和一个阴极焊点12。阳极焊点11可以与像素驱动电路14电连接，阴极焊点12可以与相应的电极引线14电连接。这样发光器件2的阳极电极引脚29可以插入阳极焊点11内，阴极电极引脚28可以插入阴极焊点12内，实现发光器件2与像素驱动电路14及电极引线13之间的电连接。
此处，像素驱动电路14被配置为，为发光器件2提供驱动电压；电极引线13被配置为，为发光器件2提供公共电压。这样，在像素驱动电路14和电极引线13之间的配合下，便可以控制发光器件2的发光状态，进而使得显示基板100实现图像显示。
需要说明的是，上述示例仅为显示基板100采用有源驱动方式对发光器件2进行驱动的一种示例性说明，有源驱动中涉及的电路还可以有其他的结构，此处不再赘述。
当然，本公开的显示基板100还可以采用无源驱动的方式对发光器件2进行驱动发光，此处不再赘述。
值得一提的是，在衬底1上设置有上述走线(也即数据线Data、栅线Gate或构成晶体管的导线等)的情况下，第一光线调节层3可以覆盖上述走线的至少一部分。其中，第一光线调节层3和上述走线之间可以设置有绝缘层，这样不仅可以对上述走线进行保护，还可以避免对上述走线造成腐蚀，影响上述走线的电气性能。
本公开的一些实施例提供了一种显示基板的制备方法。如图24和图27所示，该制备方法包括S100～S300。
S100，如图28(a)所示，提供衬底1。衬底1的一侧设置有相互间隔的多个发光器件2，该多个发光器件2分为多组，每组发光器件2包括至少一个发光器件2。
在一些示例中，上述多个发光器件2可以包括Mini LED。在衬底1的一侧设置多个发光器件2时，例如可以采用巨量转移技术(Mass Transfer Technology)将多个发光器件2转移至衬底1的一侧。
此处，关于衬底1的结构、多个发光器件2的结构以及衬底1和多个发光器件2之间 的连接可以参照上述一些实施例中的说明，此处不再赘述。
在一些示例中，在衬底1上设置多个发光器件2之后，可以对其进行清洗，以清除衬底1的表面以及各发光器件2的侧面及远离衬底1的一侧表面上的异物，增加表面能，使得衬底1和各发光器件2与后续形成的薄膜之间具有较高的结合力。
示例性的，在对衬底1和各发光器件2进行清洗时，可以采用超声波清洗的方式、等离子体(Plasma)清洗的方式和气枪吹的方式中的至少一种，能够对衬底1和各发光器件2进行清洗即可。
S200，如图28(e)和图29(c)所示，采用喷墨打印工艺在每相邻的两组发光器件2之间形成第一光线调节层3。第一光线调节层3与相邻的发光器件2的至少一个侧面之间具有间隙。
示例性的，第一光线调节层3的材料包括可流动的吸光材料。第一光线调节层3被配置为，对入射至第一光线调节层3的光线的至少一部分进行吸收。
由于第一光线调节层3的材料能够流动，因此，在采用喷墨打印工艺在相邻两个发光器件2之间形成第一光线调节层3的过程中，可以采用喷墨打印设备将可流动的可吸光材料滴落打印在相邻两个发光器件2之间，然后进行固化处理，得到第一光线调节层3。其中，可以通过设定第一光线调节层3的材料滴落打印在相邻两个发光器件2之间以及进行固化处理之间的时间间隔，得到所需形状的第一光线调节层3。
例如，在上述之间间隔较长的情况下，第一光线调节层3的材料流动蔓延的范围较大，使得固化形成的第一光线调节层3成面状，厚度较小，且在衬底1上的正投影面积较大。在上述之间间隔较短的情况下，第一光线调节层3的材料流动蔓延的范围较小，使得固化形成的第一光线调节层3成块状，厚度较大，且在衬底1上的正投影面积较小。
示例性的，固化处理的方式可以包括多种，具体可以根据第一光线调节层3的材料的性能选择确定。例如，固化处理的方式可以为光固化处理、热固化处理或其他化学物理处理方式。
例如，本公开可以采用紫外固化(也即UV固化)处理的方式。
在一些示例中，在上述S200中，采用喷墨打印工艺在每相邻的两组发光器件2之间形成第一光线调节层3，包括：采用喷墨打印工艺在每相邻的两组发光器件2之间依次形成多层光线调节子层31。该多层光线调节子层31层叠形成第一光线调节层3。
也即，第一光线调节层3为经过多次喷墨打印工艺形成。例如，在每形成一层光线调节薄膜后，对该光线调节薄膜进行固化处理，形成一光线调节子层31。
示例性的，喷墨打印形成的光线调节薄膜的厚度可以大约为5μm，采用UV固化处理方式对该光线调节薄膜进行固化处理的能量可以大约为3000mJ。
以第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距为80μm为例。此时，如果每次形成光线调节子层31的厚度为5μm，则可以经过16次喷墨打印工艺形成16层依次层叠的光线调节子层31，得到第一光线调节层3。
在一些示例中，如图25所示，采用喷墨打印工艺在每相邻的两组发光器件2之间依次形成多层光线调节子层31，包括：S210～S220。
S210，如图28(c)所示，采用喷墨打印工艺在每相邻的两组发光器件2之间形成第一光线调节子层31a。第一光线调节子层31a与衬底1相接触、且与相邻的发光器件2之间具有间隙。
在喷墨打印之前，可以调整喷墨打印设备中用于喷出第一光线调节层3的材料的喷头与发光器件2之间在平行于衬底1的方向上的间距，以便于使得所形成的第一光线调节子层31a与相邻发光器件2之间在平行于衬底1的方向上的间距为所需的间距。
示例性的，在喷墨打印之前，喷头与发光器件2之间在平行于衬底1的方向上的间距可以大于发光器件2的位置误差。
例如，喷头与发光器件2之间在平行于衬底1的方向上的间距的范围可以为10μm～25μm。例如，喷头与发光器件2之间的间距可以为10μm、13μm、17μm、20μm或25μm等。这样不仅可以使得所形成的第一光线调节子层31a与相邻发光器件2之间在平行于衬底1的方向上具有一定的间距(该间距的范围可以为10μm～25μm)，还可以避免将第一子光线调节层31a的材料滴落在发光器件2远离衬底1的一侧，影响显示基板100的光效。
在喷墨打印之前，还可以调整喷头与发光器件2之间在垂直于衬底1的方向上的间距，以避免喷头与发光器件2发生碰撞，对发光器件2的品质及发光器件2与衬底1之间的连接产生不良影响。
示例性的，在喷墨打印之前，相对于衬底1，喷头靠近衬底1的一端，可以高于发光器件2远离衬底1的一侧表面，两者在垂直于衬底1的方向上的间距大约可以为1mm。
S220，如图28(d)所示，采用喷墨打印工艺在第一光线调节子层31a远离衬底的一侧形成第二光线调节子层31b。第二光线调节子层31b覆盖第一光线调节子层31a，且与相邻的发光器件2的至少一个侧面之间具有间隙。
示例性的，由于第一光线调节层3的材料具有可流动性，在将第一光线调节层3的材料打印滴落在第一光线调节子层31a远离衬底1的一侧表面上后，该材料会出现流动现象。
例如，流动蔓延后所形成的薄膜(经固化处理后则为第二光线调节子层31b)在衬底1上的正投影与第一光线调节子层31a在衬底1上的正投影重合，也即，流动蔓延后所形成的薄膜覆盖第一光线调节子层31a远离衬底的一侧表面，进而使得固化处理后形成的第二光线调节子层31b仅位于第一光线调节子层31a远离衬底1的一侧表面上。
又如，第一光线调节子层31a在衬底1上的正投影位于流动蔓延后所形成的薄膜在衬底1上的正投影范围内，也即，流动蔓延后所形成的薄膜覆盖第一光线调节子层31a远离衬底的一侧表面，并覆盖第一光线调节子层31a的侧面的至少一部分，进而使得固化处理后形成的第二光线调节子层31b，不仅位于第一光线调节子层31a远离衬底1的一侧表面上，还覆盖第一光线调节子层31a的侧面的至少一部分。
此处，在流动蔓延后所形成的薄膜覆盖第一光线调节子层31a的侧面的至少一部分的基础上，流动蔓延后所形成的薄膜可以和相邻发光器件2的至少一个侧面之间具有间隙，也可以和相邻发光器件2相互接触。也即，固化处理后形成的第二光线调节子层31b可以和相邻发光器件2之间具有间隙，也可以和相邻发光器件2相互接触。
需要说明的是，在形成第二光线调节子层31b之后，还可以在第二光线调节子层31b远离衬底1的一侧依次层叠形成多层光线调节子层31。其中，后续形成的多层光线调节子层31的结构的说明可以参照对第二光线调节子层31b的结构的说明，此处不再赘述。
示例性的，在第一光线调节层3远离衬底1的一侧表面和衬底1之间的间距为80μm、且每次形成光线调节子层31的厚度为5μm的情况下，在形成8层依次层叠的光线调节子层31后的结构图可以如图30所示，该多层光线调节子层31例如可以位于发光器件2的 周围区域。在形成16层依次层叠的光线调节子层31后的结构图可以如图31所示，该多层光线调节子层31例如可以覆盖衬底1中除被发光器件2覆盖的区域以外的区域。
示例性的，上述多层光线调节子层31的材料可以相同，进而使得各光线调节子层31的硬度、颜色等相同。
当然，上述多层光线调节子层31的材料也可以不同，这样可以使得各光线调节子层31的硬度、颜色等不同，具体可以根据实际需要设置。例如，沿垂直且远离衬底1的方向，各光线调节子层31的硬度逐渐减小，或者，各光线调节子层31的颜色逐渐变浅。
S300，如图28(f)和图29(d)所示，采用喷墨打印工艺在上述多个发光器件2远离衬底1的一侧及第一光线调节层3远离衬底1的一侧形成第一固定层4。第一固定层4为透光薄膜，被配置为对上述多个发光器件2及第一光线调节层3进行固定。
示例性的，第一固定层4的材料包括可流动的可透光材料。
由于第一固定层4的材料能够流动，因此，在采用喷墨打印工艺在多个发光器件2远离衬底1的一侧及第一光线调节层3远离衬底1的一侧形成第一固定层4的过程中，可以采用喷墨打印设备将可流动的可透光材料滴落打印在多个发光器件2远离衬底1的一侧及第一光线调节层3远离衬底1的一侧，然后进行固化处理，得到第一固定层4。
此处，在第一光线调节层3与相邻的发光器件2之间具有间隙的情况下，第一固定层4的材料会渗入该间隙内，对该间隙进行填充，在经过固化处理得到第一固定层4后，第一固定层4远离衬底1的一侧表面仍为较为平整的表面。在第一光线调节层3与相邻的发光器件2之间无间隙的情况下，第一固定层4的材料则仅位于多个发光器件2远离衬底1的一侧及第一光线调节层3远离衬底1的一侧。
对第一固定层4进行固化处理的方式可以参照对第一光线调节层3进行固化处理的方式，此处不再赘述。
在一些示例中，在上述S300中，采用喷墨打印工艺在上述多个发光器件2远离衬底1的一侧及第一光线调节层3远离衬底1的一侧形成第一固定层4，例如可以包括：采用喷墨打印工艺在上述多个发光器件2远离衬底1的一侧及第一光线调节层3远离衬底1的一侧形成多层固定子层。该多层固定子层层叠形成第一固定层4。
也即，第一固定层4为经过多次喷墨打印工艺形成。例如，在每形成一层固定薄膜后，对该固定薄膜进行固化处理，形成一固定子层。
示例性的，喷墨打印形成的固定薄膜的厚度可以大约为10μm，采用UV固化处理方式对该固定薄膜进行固化处理的能量可以大约为3000mJ。
以第一光线调节层31远离衬底1的一侧表面与发光器件2远离衬底1的一侧表面持平、且第一固定层4靠近衬底1的一侧表面和远离衬底1的一侧表面之间的间距为40μm为例。此时，如果每次形成固定子层的厚度为10μm，则可以经过4次喷墨打印工艺形成4层依次层叠的固定子层，得到第一固定层4。第一固定层4的结构图可以如图32所示。
以第一光线调节层31远离衬底1的一侧表面与发光器件2远离衬底1的一侧表面持平、且第一固定层4靠近衬底1的一侧表面和远离衬底1的一侧表面之间的间距为60μm为例。则第一固定层4的结构图可以如图33所示。
需要说明的是，在上述S100中，在衬底1上还设置有多个驱动芯片81的情况下，显示基板的制备方法还包括：采用喷墨打印工艺在各驱动芯片81远离衬底1的一侧表面上形成第二光线调节层9。
示例性的，在第二光线调节层9的材料可以与第一光线调节层3的材料相同的情况下，上述采用喷墨打印工艺在各驱动芯片81远离衬底1的一侧表面上形成第二光线调节层9可以包括：在上述S300之前，采用第一光线调节层3的材料、并采用喷墨打印工艺，在上述多个驱动芯片81远离衬底1的一侧表面形成多层薄膜。其中，每层薄膜在喷墨打印形成后，经固化处理形成。该多层薄膜层叠形成第二光线调节层9。
示例性的，喷墨打印形成的薄膜的厚度可以大约为5μm，采用UV固化处理方式对该固定薄膜进行固化处理的能量可以大约为3000mJ。
在第二光线调节层9的厚度为40μm、且每次形成的薄膜的厚度为5μm的情况下，则可以经过8次喷墨打印工艺得到第二光线调节层9。在第二光线调节层9的厚度为20μm、且每次形成的薄膜的厚度为5μm的情况下，则可以经过4次喷墨打印工艺得到第二光线调节层9。
示例性的，在第二光线调节层9的材料与第一固定层4的材料相同的情况下，上述采用喷墨打印工艺在各驱动芯片81远离衬底1的一侧表面上形成第二光线调节层9可以包括：在上述S300中，在形成第一固定层4的过程中，同时形成第二光线调节层9。
例如，第二光线调节层9的厚度为40μm，形成第二光线调节层9的过程可以参照形成第一固定层4的过程，此处不再赘述。
本公开的一些实施例所提供的显示基板的制备方法所能实现的有益效果，与上述一些实施例中所提供的显示基板100所能实现的有益效果相同，此处不再赘述。
此外，本公开采用喷墨打印工艺形成第一光线调节层3，可以避免在发光器件2远离衬底1的一侧表面上形成第一光线调节层3的材料(也即吸光材料)，进而可以避免影响发光器件2的出光效率，避免增加显示基板100的功耗。而且，喷墨打印工艺的打印精度较高，经多次喷墨打印形成的第一光线调节层3和/或第一固定层4的表面平整度较高，有利于提高显示基板100的外观效果。
在一些实施例中，如图27所示，在上述S200之前，显示基板的制备方法还可以包括：S150。
S150，如图29(a)所示，采用喷墨打印工艺在每组发光器件2远离衬底1的一侧形成固定图案51。每个固定图案51覆盖该一组发光器件2，且围绕该一组发光器件2，以对该一组发光器件2进行固定。多个固定图案51构成第二固定层5。
此处，关于固定图案51的结构以及第二固定层5的结构可以参照上述一些实施例中的说明，此处不再赘述。
在一些示例中，第二固定层5的材料包括可流动的可透光材料。固定图案51例如可以采用多次喷墨打印工艺形成。
示例性的，以一组发光器件2包括三个发光器件2、每个固定图案51对三个发光器件2进行固定为例。例如，在先的多次喷墨打印过程中，每次喷墨打印的过程中所形成的材料薄膜可以位于该三个发光器件2中每相邻两个发光器件2之间，且围绕该三个发光器件2，与该三个发光器件2的各侧面相互接触。在后的多次喷墨打印过程中，每次喷墨打印形成的薄膜可以仅位于该三个发光器件2远离衬底1的一侧，对该三个发光器件2形成覆盖。
此处，在每次喷墨打印的过程中形成材料薄膜之后，可以经过固化处理成型之后，再在该薄膜远离衬底1的一侧形成下一薄膜。
在形成第二固定层5之后，如图29(b)和图29(c)所示，便可以采用喷墨打印工艺 在相邻两组发光器件2之间形成第一光线调节层3。示例性的，具体可以采用喷墨打印工艺在每相邻的两个固定图案51之间形成第一光线调节层3。该第一光线调节层3与各固定图案51相接触。
在一些实施例中，如图26所示，在上述S200中，采用喷墨打印工艺在相邻两个发光器件2之间形成第一光线调节层3的步骤，可以包括：S250～S260。
S250，如图28(b)和图29(b)所示，采用喷墨打印工艺在衬底1的边缘形成挡墙35。挡墙35在衬底1上的正投影呈环状，挡墙35的厚度与上述多个发光器件2远离衬底1的一侧表面与衬底1之间的间距相等或大致相等。
在一些示例中，挡墙35可以采用多次喷墨打印工艺形成。其中，形成挡墙35的过程可以参照形成多层光线调节子层31的过程，此处不再赘述。
例如，在每次喷墨打印工艺之后，均可以形成挡墙35的一部分。该挡墙35的一部分在衬底1上的正投影呈环状。
在一些示例中，在衬底1的形状呈圆形的情况下，挡墙35在衬底1上的正投影呈圆环状，且该圆环状正投影的外边界与衬底1的边相重叠。在衬底1的形状呈多边形的情况下，挡墙35在衬底1上的正投影呈多边形的环状，且该多边形的环状正投影的外边界与衬底1的边相重叠。
在一些示例中，如图28(b)和图29(b)所示，沿垂直于衬底1的方向，挡墙35的剖面形状可以为矩形或近似矩形。其中，近似矩形指的是，相比于较为规则的矩形，其可以有部分不规则。
示例性的，考虑到制备形成显示基板100的工艺误差及对多个显示基板100进行拼接后的物理拼缝，最靠近衬底1的边缘的发光器件2与衬底1的边缘之间的间距可以为100μm～200μm。在制备形成挡墙35后，挡墙35的宽度可以为最靠近衬底1的边缘的发光器件2与衬底1的边缘之间的间距10％～20％。
基于此，挡墙35的宽度(也即挡墙35的剖面形状在平行于衬底1的方向上的尺寸)的范围可以为20μm～40μm。例如，挡墙35的宽度可以为20μm、23μm、29μm、37μm或40μm等。
S260，如图28(e)和图29(c)所示，采用喷墨打印工艺在挡墙35内形成填充部36。填充部36和挡墙35形成第一光线调节层3，第一光线调节层3远离衬底1的一侧表面d，与第一光线调节层3的对应衬底1边缘的侧面e之间的夹角为直角或近似直角。
在一些示例中，填充部36可以采用多次喷墨打印工艺形成。其中，形成填充部36的过程可以参照形成多层光线调节子层31的过程，此处不再赘述。其中，每层光线调节子层31包括位于挡墙35所在区域的一部分，以及位于填充部36所在区域的一部分。
在一些示例中，如图28(e)所示，填充部36位于挡墙35所围成的空间内，且填充部36远离衬底1的一侧表面与挡墙35远离衬底1的一侧表面持平或大约持平，使得所形成的第一光线调节层3远离衬底1的一侧表面d，与第一光线调节层3的对应衬底1边缘的侧面e之间的夹角为直角或近似直角，也即，使得第一光线调节层3远离衬底1的一侧表面d与第一光线调节层3的对应衬底1边缘的侧面e之间直接相连接，两者之间无过渡或基本无过渡，进而未形成或基本未形成倒角。
需要说明的是，在相关技术中，制备形成的挡墙35＇的厚度较小(远小于发光器件2远离衬底1的一侧表面与衬底1之间的间距)，这样在挡墙35＇内形成填充部36＇、并使 得所形成的的第一光线调节层3＇达到所需厚度后，基于液体表面张力的存在，会使得该第一光线调节层3＇远离衬底1的一侧表面d＇与第一光线调节层3＇的对应衬底1边缘的侧面e＇之间形成倒角，影响显示基板的拼接效果。
而本公开中的挡墙35的厚度较大(例如可以通过延长喷墨打印设备的喷头在衬底1边缘位置处停留时间来实现)，这样可以使得后续形成的第一光线调节层3远离衬底1的一侧表面d与第一光线调节层3的对应衬底1边缘的侧面e之间的夹角为直角或近似直角，提高显示基板100的拼接效果。
而且，在此基础上，例如可以增加后续形成的第一固定层4的固化能量，降低第一固定层4的材料的流动性，进一步提高显示基板100的拼接效果。
此外，在相关技术中，通常会采用注塑成型(molding)工艺在上述多个Mini LED之间的间隙内以及该多个Mini LED的表面形成黑胶，使得该黑胶与各Mini LED的侧面及表面相接触。但是采用molding工艺形成黑胶的方案无法对应无边工艺产品，会导致由多个显示基板拼接而成的基板的拼接效果较差。
而本公开通过采用喷墨打印工艺形成显示基板100，能够对应无边工艺产品。在上述增大挡墙35的厚度的基础上，相比于采用molding工艺形成的显示基板，能够有效提高拼接效果。
在一些实施例中，如图28(g)所示，在上述S300之后，显示基板的制备方法还可以包括：采用喷墨打印工艺在第一固定层4远离衬底1的一侧形成多个透光颗粒6。透光颗粒6的材料包括可流动的可透光材料。
在一些示例中，可以通过控制喷墨打印设备的喷头喷出可流动的可透光材料与对该可流动的可透光材料进行固化处理之间的时间间隔，得到所需形状的透光颗粒6。
示例性的，从可流动的可透光材料滴落至第一固定层4远离衬底1的一侧则开始进行固化处理，此时，透光颗粒6的表面形状例如可以为棱锥或楔形。
示例性的，在可流动的可透光材料滴落至第一固定层4远离衬底1的一侧一段时间之后再开始进行固化处理，此时，透光颗粒6的表面形状例如可以为弧面或球面。
在一些示例中，以各透光颗粒6的厚度为9μm为例。形成透光颗粒6的过程可以为：采用一次喷墨打印工艺，形成厚度为9μm的图案，然后采用UV固化的方式进行固化处理，得到透光颗粒6。其中，固化处理的能量可以为3000mJ。
在一些实施例中，在形成显示基板100之后，可以对显示基板100进行烘烤处理，对采用喷墨打印工艺形成的各结构进行进一步地固化处理，使得该各结构的形状更为稳定。
示例性的，对上述各结构进行烘烤固化处理的温度可以为120℃，时间可以为1h。
需要说明的是，由上述内容可知，本公开所提供的显示基板100的制备方法，制备精度较高，可以实现较小尺寸的图案的打印制备。这样在显示基板100的局部区域或较窄的侧边(例如衬底1的沿厚度方向的侧边)需要减少光线的反射的情况下，可以采用本公开所提供的显示基板100的制备方法，在相应的位置打印可流动的可吸光材料(例如为第一光线调节层3的材料)，然后对该材料进行固化处理。
本公开的一些实施例提供了一种显示装置1000。如图34所示，该显示装置1000包括如上述一些实施例中提供的显示基板100。
上述显示装置1000所包括的显示基板100，具有与上述一些实施例中提供的显示基板100相同的结构和有益效果，此处不再赘述。
在一些示例中，上述显示装置1000还包括：用于安装上述显示基板100的外壳，和/或，安装在显示基板100上的摄像头等。
在一些实施例中，上述显示装置1000可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (28)

  1. 一种显示基板，包括：
    衬底；
    设置在所述衬底一侧的多个发光器件，所述多个发光器件相互间隔设置；所述多个发光器件分为多组，每组发光器件包括至少一个发光器件；
    第一光线调节层，设置在每相邻的两组发光器件之间，且与相邻的发光器件的至少一个侧面之间具有间隙；以及，
    设置在所述多个发光器件及所述第一光线调节层远离所述衬底一侧的第一固定层；所述第一固定层为透光薄膜。
  2. 根据权利要求1所述的显示基板，其中，所述第一光线调节层包括层叠设置的多层光线调节子层；
    所述多层光线调节子层包括：沿垂直且远离所述衬底的方向层叠设置的第一光线调节子层和第二光线调节子层；
    所述第一光线调节子层在所述衬底上的正投影，与所述第二光线调节子层在所述衬底上的正投影重合，或者，位于所述第二光线调节子层在所述衬底上的正投影范围内。
  3. 根据权利要求1或2所述的显示基板，其中，相对于所述衬底，所述第一光线调节层远离所述衬底的一侧表面，与发光器件远离所述衬底的一侧表面持平，或者，低于所述发光器件远离所述衬底的一侧表面。
  4. 根据权利要求3所述的显示基板，其中，在相对于所述衬底，所述第一光线调节层远离所述衬底的一侧表面低于所述发光器件远离所述衬底的一侧表面的情况下，所述第一光线调节层远离所述衬底的一侧表面和所述衬底之间的间距，与所述发光器件远离所述衬底的一侧表面和所述衬底之间的间距的比例大于或等于4:5，且小于1:1。
  5. 根据权利要求1～4中任一项所述的显示基板，其中，至少一个发光器件的各侧面与所述第一光线调节层之间均具有间隙。
  6. 根据权利要求1～5中任一项所述的显示基板，其中，所述第一光线调节层在所述衬底上的正投影的外边界，与所述衬底的边缘重合或大约重合；
    所述第一光线调节层远离所述衬底的一侧表面，与所述第一光线调节层的对应所述衬底边缘的侧面之间的夹角为直角或近似直角。
  7. 根据权利要求1～6中任一项所述的显示基板，其中，沿垂直于所述衬底及所述相邻两个发光器件的中心线连线方向，所述第一光线调节层的位于所述相邻两个发光器件之间的部分，具有平行于所述衬底的多个截面；
    除最靠近所述衬底的一个截面和最远离所述衬底的一个截面以外的一个截面在所述衬底上的正投影，位于最靠近所述衬底的一个截面在所述衬底上的正投影范围内。
  8. 根据权利要求7所述的显示基板，其中，沿垂直于所述衬底及相邻两个发光器件的中心线连线方向，所述第一光线调节层的位于所述相邻两个发光器件之间的部分的剖面形状包括梯形或近似梯形。
  9. 根据权利要求8所述的显示基板，其中，沿垂直并远离所述衬底的方向，所述多个截面在所述衬底上的正投影的面积依次减小；
    所述梯形或近似梯形靠近所述衬底的下底边的长度，大于远离所述衬底的上底边的长度。
  10. 根据权利要求8或9所述的显示基板，其中，在沿垂直于所述衬底及所述相邻两 个发光器件的中心线连线方向，所述第一光线调节层的位于所述相邻两个发光器件之间的部分的剖面形状包括近似梯形的情况下，
    所述近似梯形远离所述衬底的上底边，与位于所述上底边和所述近似梯形靠近所述衬底的下底边之间的侧边圆滑过渡。
  11. 根据权利要求1～10中任一项所述的显示基板，其中，每组发光器件包括一个发光器件；
    所述第一光线调节层位于任意相邻的两个发光器件之间。
  12. 根据权利要求1～11中任一项所述的显示基板，其中，所述第一固定层的一部分，位于所述第一光线调节层和相邻的发光器件之间的间隙内。
  13. 根据权利要求1～6中任一项所述的显示基板，还包括：第二固定层；所述第二固定层为透光薄膜；
    所述第二固定层包括相互间隔设置的多个固定图案；
    一个固定图案包围一组发光器件，以对所述一组发光器件进行固定；
    所述第一光线调节层位于所述多个固定图案中任意相邻的两个固定图案之间的间隙内，且与所述多个固定图案相接触；
    所述第一固定层位于所述第二固定层和所述第一光线调节层远离所述衬底的一侧。
  14. 根据权利要求13所述的显示基板，其中，沿垂直于所述衬底及相邻两个发光器件的中心线连线方向，所述第一光线调节层的位于所述相邻两个发光器件之间的部分的剖面形状包括梯形或近似梯形；
    所述梯形或近似梯形靠近所述衬底的下底边的长度，小于远离所述衬底的上底边的长度。
  15. 根据权利要求13或14所述的显示基板，其中，每组发光器件包括至少两个发光器件，所述固定图案对所述至少两个发光器件进行固定；
    所述发光器件被配置为，发出一种颜色的光线；
    所述至少两个发光器件中，各发光器件所发出的光线的颜色包括至少一种。
  16. 根据权利要求1～15中任一项所述的显示基板，还包括：设置在所述第一固定层远离所述衬底一侧的多个透光颗粒；
    所述多个透光颗粒被配置为，使得入射至所述多个透光颗粒的光线中的至少一部分的传播方向发生改变。
  17. 根据权利要求16所述的显示基板，其中，所述多个透光颗粒呈阵列状排布；其中，任意相邻的两个透光颗粒之间的间距的范围为100μm±5μm；
    各透光颗粒的厚度的范围为9μm±3μm；
    各透光颗粒在所述衬底上的正投影的尺寸的范围为50μm±5μm；
    和/或，
    所述多个透光颗粒的表面形状包括棱锥、楔形、弧面和球面中的至少一种。
  18. 根据权利要求1～17中任一项所述的显示基板，还包括：多个功能器件；至少一个功能器件与所述多个发光器件位于所述衬底的同一侧；
    所述多个功能器件被配置为，提供传感信号，和/或，为所述多个发光器件提供控制信号。
  19. 根据权利要求18所述的显示基板，其中，相对于所述衬底，所述第一固定层远 离所述衬底的一侧表面，高于所述至少一个功能器件远离所述衬底的一侧表面，且高于所述多个发光器件远离所述衬底的一侧表面。
  20. 根据权利要求18或19所述的显示基板，其中，所述多个功能器件包括多个驱动芯片；
    所述多个驱动芯片与所述多个发光器件位于所述衬底的同一侧；一个驱动芯片与一组发光器件电连接；所述驱动芯片被配置为，向所述一组发光器件提供控制信号；
    所述显示基板还包括：设置在所述多个驱动芯片远离所述衬底的一侧表面上的第二光线调节层；所述第二光线调节层被配置为，减少所述多个驱动芯片对入射至其表面上的光线的反射。
  21. 根据权利要求20所述的显示基板，其中，
    所述第二光线调节层的材料与所述第一光线调节层的材料相同；或者，
    所述第二光线调节层的材料与所述第一固定层的材料相同。
  22. 根据权利要求1～21中任一项所述的显示基板，还包括：设置在所述发光器件的侧面的光反射层；
    所述光反射层被配置为，对由所述发光器件发出并入射至所述光反射层的光线进行反射。
  23. 根据权利要求1～22中任一项所述的显示基板，其中，相对于所述衬底，所述第一光线调节层远离所述衬底的一侧表面，高于所述发光器件远离所述衬底的一侧表面；
    和/或，
    所述第一光线调节层远离所述衬底的一侧表面和所述衬底之间的间距，与所述发光器件在平行于所述衬底的方向上的尺寸之间的比例大于或等于1:1，且小于或等于
    Figure PCTCN2020139715-appb-100001
  24. 一种显示基板的制备方法，包括：
    提供衬底；所述衬底的一侧设置有相互间隔的多个发光器件，所述多个发光器件分为多组，每组发光器件包括至少一个发光器件；
    采用喷墨打印工艺在每相邻的两组发光器件之间形成第一光线调节层；所述第一光线调节层与相邻的发光器件的至少一个侧面之间具有间隙；
    采用喷墨打印工艺在所述多个发光器件远离所述衬底的一侧及所述第一光线调节层远离所述衬底的一侧形成第一固定层；所述第一固定层为透光薄膜；
    其中，所述采用喷墨打印工艺在每相邻的两组发光器件之间形成第一光线调节层，包括：
    采用喷墨打印工艺在每相邻的两组发光器件之间依次形成多层光线调节子层；所述多层光线调节子层层叠形成所述第一光线调节层。
  25. 根据权利要求24所述的显示基板的制备方法，其中，
    所述采用喷墨打印工艺在每相邻的两组发光器件之间依次形成多层光线调节子层，包括：
    采用喷墨打印工艺在每相邻的两组发光器件之间形成第一光线调节子层；所述第一光线调节子层与相邻的发光器件之间具有间隙；
    采用喷墨打印工艺在所述第一光线调节子层远离所述衬底的一侧形成第二光线调节子层；所述第二光线调节子层覆盖所述第一光线调节子层，且与相邻的发光器件的至少一个侧面之间具有间隙。
  26. 根据权利要求24或25所述的显示基板的制备方法，其中，
    所述采用喷墨打印工艺在每相邻的两组发光器件之间形成第一光线调节层的步骤包括：
    采用喷墨打印工艺在所述衬底的边缘形成挡墙；所述挡墙在所述衬底上的正投影呈环状，所述挡墙的厚度及所述多个发光器件远离所述衬底的一侧表面与所述衬底之间的间距相等或大致相等；
    采用喷墨打印工艺在所述挡墙内形成填充部；所述填充部和所述挡墙形成所述第一光线调节层，所述第一光线调节层远离所述衬底的一侧表面，与所述第一光线调节层的对应所述衬底边缘的侧面之间的夹角为直角或近似直角。
  27. 根据权利要求24～26中任一项所述的显示基板的制备方法，其中，
    在所述采用喷墨打印工艺在每相邻的两组发光器件之间形成第一光线调节层之前，所述制备方法还包括：
    采用喷墨打印工艺在每组发光器件远离所述衬底的一侧形成固定图案；所述固定图案包围一组发光器件，以对所述一组发光器件进行固定；多个固定图案构成第二固定层。
  28. 一种显示装置，包括：如权利要求1～23中任一项所述的显示基板。
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