WO2023032732A1 - スイッチング電源装置 - Google Patents

スイッチング電源装置 Download PDF

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Publication number
WO2023032732A1
WO2023032732A1 PCT/JP2022/031556 JP2022031556W WO2023032732A1 WO 2023032732 A1 WO2023032732 A1 WO 2023032732A1 JP 2022031556 W JP2022031556 W JP 2022031556W WO 2023032732 A1 WO2023032732 A1 WO 2023032732A1
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WO
WIPO (PCT)
Prior art keywords
power supply
inductor
circuit board
magnetic body
common
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/031556
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English (en)
French (fr)
Japanese (ja)
Inventor
達也 細谷
修 三木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2023545461A priority Critical patent/JP7658447B2/ja
Publication of WO2023032732A1 publication Critical patent/WO2023032732A1/ja
Priority to US18/587,254 priority patent/US20240206071A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
    • H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
    • H02M3/10—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F37/00—Fixed inductances not covered by group H01F17/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Definitions

  • the present invention relates to a switching power supply device comprising a plurality of inductors magnetically coupled with each other and a composite inductor forming a smoothing inductor for smoothing output current and output voltage.
  • Patent Document 1 discloses a coupled inductor that adopts a structure in which a conductor is wound around each rung portion that is a ladder-shaped crosspiece.
  • the current ripple flowing through each inductor can be reduced.
  • the current ripple included in the output current obtained by combining the currents flowing in each inductor and the voltage ripple superimposed on the output voltage are not reduced or increase due to non-uniformity of the combined output current.
  • an object of the present invention is to configure a plurality of inductors that are magnetically coupled to each other on a single circuit board, to provide a smoothing inductor that is low-profile, has excellent coupled inductor performance, and is magnetically independent of the coupled inductors. Equipped with a composite inductor with excellent smoothing inductor performance that reduces the current ripple included in the output current, which is the sum of the currents flowing through each inductor, and the voltage ripple included in the output voltage. ) to provide a high-performance switching power supply device.
  • a switching power supply device as an example of the present disclosure includes: In a switching power supply device composed of a plurality of power conversion circuits having composite inductors and a control circuit for the power conversion circuits,
  • the composite inductor comprises a circuit board on which a plurality of inductor windings are formed, and a common magnetic body incorporated in the circuit board,
  • the circuit board has an electrical connection point with one end of each of the plurality of inductor windings as a common potential, having a common wiring that electrically connects the electrical connection point and one of the output terminals;
  • the common magnetic body has an inner leg that penetrates the inner side of the plurality of inductor windings and an outer leg that penetrates the outer side of the plurality of inductor windings, a smoothing capacitor electrically connected between one of the output terminals and the other of the output terminals and mounted on the circuit board;
  • a smoothing filter is configured by the inductance of the common wiring and the smoothing capacitor,
  • a plurality of inductors are magnetically coupled to each other, and magnetic fluxes generated by flowing currents through a plurality of windings formed on one circuit board cancel each other out, thereby reducing the magnetic flux density distributed in the magnetic material.
  • a compact, low-profile coupled inductor that suppresses saturation and has excellent power conversion characteristics, and a smoothing inductor that reduces output current ripple and output voltage ripple.
  • a high-performance switching power supply unit with excellent power integrity (ensuring power supply quality) can be obtained, which is provided with a composite inductor, can be made smaller and thinner, can achieve highly accurate output voltage and output voltage fluctuation suppression.
  • FIG. 1 is a perspective view of a power supply module 201 with a composite inductor according to the first embodiment.
  • FIG. 2 is a perspective view of the circuit board of the power supply module 201.
  • FIG. FIG. 3 is an exploded perspective view of the power supply module 201.
  • FIG. FIG. 4 is a circuit diagram of the multiphase power supply device 301 according to the first embodiment.
  • FIG. 5A is a waveform diagram of current flowing through one inductor of the multi-phase power supply 301.
  • FIG. FIG. 5B is a waveform diagram of current flowing through one inductor of a multiphase power supply device as a comparative example.
  • FIG. 6 shows the relationship of current ripple to the ratio of leakage inductance Lk and mutual inductance Lm.
  • FIG. 7A and 7B are partial cross-sectional views of the power supply module 201
  • FIG. 7C is a partial plan view of the power supply module 201
  • FIG. 8A, 8B, and 8C are partial cross-sectional views of a power supply module 201 different from the examples shown in FIGS. 7A, 7B, and 7C. and a partial plan view.
  • FIG. 9 is a partial cross-sectional view of a power supply module 201 that is still different from the example shown in FIG. 8B.
  • FIG. 10 is an exploded perspective view of the power supply module 202 according to the second embodiment.
  • FIG. 11 is an exploded perspective view of the power supply module 203 according to the third embodiment.
  • FIG. 12 is a perspective view of a power supply module 204 with composite inductors according to the fourth embodiment.
  • 13 is a perspective view of the circuit board of the power supply module 204.
  • FIG. 14 is an exploded perspective view of the power supply module 204.
  • FIG. 15 is a circuit diagram of a multiphase power supply device 304 according to the fourth embodiment.
  • FIG. 1 is a perspective view of a power supply module 201 with a composite inductor according to the first embodiment.
  • FIG. 2 is a perspective view of the circuit board of the power supply module 201.
  • FIG. 3 is an exploded perspective view of the power supply module 201.
  • the power supply module 201 includes a circuit board 1, a plurality of components mounted on the circuit board 1, and a lower magnetic body 4B and an upper magnetic body 4U incorporating the circuit board 1 from both sides.
  • the lower magnetic body 4B and the upper magnetic body 4U constitute a "common magnetic body" according to the present invention.
  • the circuit board 1 is formed with four inductor windings 2A, 2B, 2C, and 2D.
  • Common wirings 3A, 3B, 3C, 3D, and 3E are formed on the circuit board 1 to electrically connect one end of each of the plurality of inductor windings 2A, 2B, 2C, and 2D in common.
  • the circuit board 1 is provided with an input power supply wiring 6 and a ground wiring 7 .
  • the ground wiring 7 corresponds to the "reference potential wiring" according to the present invention.
  • the inductor windings 2A, 2B, 2C, 2D and the common wirings 3A, 3B, 3C, 3D are formed along the plane of the circuit board 1 so as to be rotationally symmetrical by 90°.
  • the circuit board 1 is a multi-layer circuit board, and the inductor windings 2A, 2B, 2C, and 2D are provided with multiple layers of conductor patterns formed on the circuit board 1 and multiple via conductors that connect these multiple conductor patterns between layers. With this configuration, the parasitic resistance of the inductor windings 2A, 2B, 2C, 2D can be reduced, and power loss can be reduced.
  • the circuit board 1 has openings 5i inside the inductor windings 2A, 2B, 2C, and 2D. Also, openings 5o are formed outside the inductor windings 2A, 2B, 2C, and 2D.
  • the upper surface of the lower magnetic body 4B has inner legs 4i that pass through the openings 5i and outer legs 4o that pass through the openings 5o.
  • the lower surface of the upper magnetic body 4U has an outer leg 4o inserted through the opening 5o. The sum of the height of the outer leg 4o of the lower magnetic body 4B and the height of the outer leg 4o of the upper magnetic body 4U is equal to the height of the inner leg 4i.
  • the lower magnetic body 4B and the upper magnetic body 4U are incorporated so as to sandwich the circuit board 1 from both sides.
  • An adhesive layer having a relative magnetic permeability of 1 or more is provided on the opposed surfaces of the lower magnetic body 4B and the upper magnetic body 4U to join the lower magnetic body 4B and the upper magnetic body 4U.
  • the adhesive layer having a relative magnetic permeability of 1 or more is a solidified layer of an adhesive obtained by kneading magnetic powder such as ferrite powder or metal powder into an adhesive.
  • the lower magnetic body 4B, the upper magnetic body 4U, and the inductor windings 2A, 2B, 2C, and 2D form four inductors.
  • the common wiring 3E constitutes an inductor.
  • the inductor windings 2A, 2B, 2C, 2D are magnetically coupled to each other by the lower magnetic body 4B and the upper magnetic body 4U, and the inductors by common wiring and the inductor windings 2A, 2B, 2C, 2D are not substantially magnetically coupled.
  • each inductor Since the inductor windings 2A, 2B, 2C, and 2D are in a relationship of 90° rotational symmetry along the surface of the circuit board 1, each inductor has a uniform magnetic coupling relationship with other inductors. As a result, variations in inductance of each inductor can be reduced.
  • FIG. 4 is a circuit diagram of the multiphase power supply device 301 according to this embodiment.
  • This multiphase power supply device 301 comprises a power supply module 201 and a control circuit for the power supply module 201 .
  • the power supply module 201 is mounted on the circuit board of the electronic device.
  • a control circuit for the power supply module 201 is provided on this circuit board.
  • the multi-phase power supply device 301 connects an input power source E with a voltage Vi to the input section, and outputs an output voltage Vo from the output section.
  • the power supply module 201 includes switching ICs IC1, IC2, IC3 and IC4, inductors L0, L1, L2, L3 and L4, and smoothing capacitors Co0, Co1, Co2, Co3 and Co4.
  • Inductors L1, L2, L3, and L4 are composed of composite inductors 101.
  • FIG. These inductors L1, L2, L3 and L4 are composed of inductor windings 2A, 2B, 2C and 2D, a lower magnetic body 4B and an upper magnetic body 4U.
  • Each of IC1, IC2, IC3, and IC4 includes a high-side switching element and a low-side switching element.
  • the inductor L0 is composed of the common wiring 3E.
  • the inductance of the common line 3E and the smoothing capacitors Co1, Co2, Co3, Co4, and Co0 constitute a .pi.-type smoothing filter. By setting the cut-off frequency of this smoothing filter to the switching frequency or higher than the switching frequency, the ripple voltage and switching noise are effectively reduced.
  • the circuit board 1 is mounted with switching ICs IC1, IC2, IC3, IC4, smoothing capacitors Co0, Co1, Co2, Co3, Co4, and the like.
  • the smoothing capacitors Co1, Co2, Co3 and Co4 are connected between the common wirings 3A, 3B, 3C and 3D and the ground wiring .
  • These smoothing capacitors Co1, Co2, Co3 and Co4 are connected between the ground wiring 7 and the vicinity of the connecting portions of the inductor windings 2A, 2B, 2C and 2D and the common wirings 3A, 3B, 3C and 3D. ing.
  • the smoothing capacitor Co0 is connected between the common wiring 3E and the ground wiring 7.
  • the MPU shown in FIG. 4 is the control circuit of the power supply module 201.
  • This MPU receives a power supply voltage from an input power supply E through a register Reg.
  • the input capacitor Ci smoothes the input power supply voltage of the power supply module 201 .
  • the MPU provides multiphase switching control signals to IC1, IC2, IC3 and IC4.
  • IC1, IC2, IC3, and IC4 pass multiphase (four-phase) currents to inductors L1, L2, L3, and L4. Smoothing capacitors Co0, Co1, Co2, Co3 and Co4 smooth the output voltage Vo.
  • FIG. 5A is a waveform diagram of current flowing through one inductor of the multiphase power supply 301.
  • FIG. FIG. 5B is a waveform diagram of current flowing through one inductor of a multiphase power supply device as a comparative example. The conditions are as follows.
  • FIG. 7A and 7B are partial cross-sectional views of the power supply module 201
  • FIG. 7C is a partial plan view of the power supply module 201.
  • FIG. 7C shows only the inductor winding 2A appearing in FIGS. 2, 3, and the like.
  • 7(A) is a cross-sectional view along line AA in FIG. 7(C)
  • FIG. 7(B) is a cross-sectional view along line BB in FIG. 7(C).
  • the inductor winding 2A includes a plurality of layers of conductor patterns P formed on the circuit board 1 and via conductors V that connect the plurality of layers of the conductor patterns P between layers.
  • FIGS. 7A, 7B, and 7C are partial cross-sectional views of a power supply module 201 different from the examples shown in FIGS. 7A, 7B, and 7C. and a partial plan view.
  • 8A and 8B are partial cross-sectional views of the power supply module 201
  • FIG. 8C is a partial plan view of the power supply module 201.
  • FIG. FIG. 8(C) shows only the inductor winding 2A appearing in FIGS. 2, 3 and the like.
  • 8A is a cross-sectional view along line AA in FIG. 8C
  • FIG. 8B is a cross-sectional view along line BB in FIG. 8C.
  • the inductor winding 2A includes a plurality of layers of conductor patterns P formed on the circuit board 1 and via conductors V that connect the plurality of layers of the conductor patterns P between layers.
  • a plurality of via conductors are dispersed in the planar direction. In this manner, the conductor pattern P may be connected between layers at a plurality of locations.
  • FIG. 9 is a partial cross-sectional view of a power supply module 201 that is further different from the example shown in FIG. 8(B). 7(B), 8(B), etc. show examples in which four layers of conductor patterns P are interconnected by three layers of via conductors V, but in the example of FIG. 9, nine layers of conductor patterns P are connected. Interlayer connections are made by via conductors V in eight layers. In this way, the conductor pattern may be further multi-layered.
  • FIG. 10 is an exploded perspective view of the power supply module 202 according to the second embodiment.
  • the power supply module 201 shown in FIG. 3 in the first embodiment differs in the structure of the outer leg 4o and the opening 5o of the common magnetic body.
  • the lower magnetic body 4B and the upper magnetic body 4U have outer legs 4o that surround the inner legs 4i. are provided on the lower magnetic body 4B and the upper magnetic body 4U.
  • Other configurations are as shown in the first embodiment.
  • the outer legs 4o provided on the common magnetic body may not have a shape surrounding the entire circumference of each inner leg 4i.
  • a power supply module having a common magnetic body and a configuration of openings different from those of the power supply modules shown in the first and second embodiments will be described.
  • FIG. 11 is an exploded perspective view of the power supply module 203 according to the third embodiment.
  • the power supply module 202 shown in FIG. 10 in the first embodiment differs in the structure of the outer leg 4o of the common magnetic body.
  • the lower magnetic body 4B and the upper magnetic body 4U are provided with the outer legs 4o for shielding the inner legs 4i adjacent to each other.
  • An outer leg 4o is provided on the lower magnetic body 4B and the upper magnetic body 4U at the surrounded position.
  • Other configurations are as shown in the first embodiment.
  • the outer leg 4o provided on the common magnetic body may be a common single outer leg formed at a position surrounded by the respective inner legs 4i.
  • FIG. 12 is a perspective view of a power supply module 204 having a composite inductor according to the fourth embodiment.
  • 13 is a perspective view of the circuit board of the power supply module 204.
  • FIG. 14 is an exploded perspective view of the power supply module 204.
  • the power supply module 204 includes a circuit board 1, a plurality of components mounted on the circuit board 1, and a lower magnetic body 4B and an upper magnetic body 4U incorporating the circuit board 1 from both sides.
  • the lower magnetic body 4B and the upper magnetic body 4U constitute a "common magnetic body" according to the present invention.
  • the circuit board 1 is formed with four inductor windings 2A, 2B, 2C, and 2D.
  • Common wirings 3A, 3B, 3C, 3D, and 3E are formed on the circuit board 1 to electrically connect one end of each of the plurality of inductor windings 2A, 2B, 2C, and 2D in common.
  • the circuit board 1 has openings 5i inside the inductor windings 2A, 2B, 2C, and 2D. Also, openings 5o are formed outside the inductor windings 2A, 2B, 2C, and 2D. Furthermore, openings 5o1 and 5o2 are formed on both sides of the common wiring 3E.
  • the upper surface of the lower magnetic body 4B is formed with an inner leg 4i passing through the opening 5i, an outer leg 4o passing through the opening 5o, and outer legs 4o1 and 4o2 passing through the openings 5o1 and 5o2. .
  • the lower magnetic body 4B, the upper magnetic body 4U, and the inductor windings 2A, 2B, 2C, and 2D form four inductors.
  • An inductor is configured by the lower magnetic body 4B, the upper magnetic body 4U, and the common wiring 3E.
  • the inductor windings 2A, 2B, 2C, 2D are magnetically coupled to each other by the lower magnetic body 4B and the upper magnetic body 4U, and the inductors by the common wiring 3E and the inductor windings 2A, 2B, 2C, 2D are not substantially magnetically coupled. .
  • each inductor Since the inductor windings 2A, 2B, 2C, and 2D have a 180° rotationally symmetrical relationship along the surface of the circuit board 1, each inductor has a uniform magnetic coupling relationship with other inductors. As a result, variations in inductance of each inductor can be reduced.
  • FIG. 15 is a circuit diagram of the multiphase power supply device 304 according to this embodiment.
  • This multi-phase power supply 304 comprises a power supply module 204 and a control circuit for the power supply module 204 .
  • the power supply module 204 is mounted on the circuit board of the electronic device.
  • a control circuit for the power supply module 204 is provided on this circuit board.
  • the multi-phase power supply device 304 connects the input power supply E of the voltage Vi to the input section, and outputs the output voltage Vo from the output section.
  • the power supply module 204 includes switching ICs IC1, IC2, IC3 and IC4, inductors L0, L1, L2, L3 and L4, and smoothing capacitors Co0, Co1, Co2, Co3 and Co4.
  • Inductors L 0 , L 1 , L 2 , L 3 and L 4 are composed of composite inductors 104 .
  • the inductors L1, L2, L3 and L4 are composed of inductor windings 2A, 2B, 2C and 2D, a lower magnetic body 4B and an upper magnetic body 4U.
  • Each of IC1, IC2, IC3, and IC4 includes a high-side switching element and a low-side switching element.
  • the inductor L0 is composed of a common wiring 3E, a lower magnetic body 4B and an upper magnetic body 4U.
  • the inductor L0 and the smoothing capacitors Co1, Co2, Co3, Co4, and Co0 constitute a .pi.-type smoothing filter.
  • the inductor L0 with a predetermined inductance can be formed even with the short common wiring 3E, so the area of the smoothing filter formation portion can be reduced. Further, since the line length of the common wiring 3E can be shortened, the parasitic resistance can be reduced, and the attenuation in the frequency characteristic attenuation range of the smoothing filter can be increased.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Dc-Dc Converters (AREA)
PCT/JP2022/031556 2021-08-30 2022-08-22 スイッチング電源装置 Ceased WO2023032732A1 (ja)

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JP2023545461A JP7658447B2 (ja) 2021-08-30 2022-08-22 スイッチング電源装置
US18/587,254 US20240206071A1 (en) 2021-08-30 2024-02-26 Switching power supply device

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JP2021139811 2021-08-30
JP2021-139811 2021-08-30

Related Child Applications (1)

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US18/587,254 Continuation US20240206071A1 (en) 2021-08-30 2024-02-26 Switching power supply device

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2025203780A1 (ja) * 2024-03-29 2025-10-02 パナソニックＩｐマネジメント株式会社 電力変換装置、及び電力変換システム

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Publication number Priority date Publication date Assignee Title
US20070090915A1 (en) * 2005-10-25 2007-04-26 Jinghai Zhou Multiphase voltage regulator having coupled inductors with reduced winding resistance
JP2007194474A (ja) * 2006-01-20 2007-08-02 Hitachi Metals Ltd フェライト積層部品、及びこれを用いたマルチフェ−ズコンバ−タ
JP2015088668A (ja) * 2013-10-31 2015-05-07 株式会社東芝 電力伝送用インダクタ

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