WO2023030313A1 - 一种支撑组件、显示模组和电子设备 - Google Patents

一种支撑组件、显示模组和电子设备 Download PDF

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Publication number
WO2023030313A1
WO2023030313A1 PCT/CN2022/115824 CN2022115824W WO2023030313A1 WO 2023030313 A1 WO2023030313 A1 WO 2023030313A1 CN 2022115824 W CN2022115824 W CN 2022115824W WO 2023030313 A1 WO2023030313 A1 WO 2023030313A1
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WO
WIPO (PCT)
Prior art keywords
adhesive layer
support assembly
support plate
openings
bending area
Prior art date
Application number
PCT/CN2022/115824
Other languages
English (en)
French (fr)
Inventor
张玉军
郭宁
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to US18/271,469 priority Critical patent/US20240057270A1/en
Priority to EP22863448.1A priority patent/EP4261813A1/en
Publication of WO2023030313A1 publication Critical patent/WO2023030313A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/03—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes specially adapted for displays having non-planar surfaces, e.g. curved displays
    • G09G3/035—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes specially adapted for displays having non-planar surfaces, e.g. curved displays for flexible display surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1641—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being formed by a plurality of foldable display components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/05—5 or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the technical field of display screens, in particular to a support assembly, a display module and electronic equipment.
  • the display module of the folding screen device has a multi-layer stack structure
  • the multi-layer stack structure may include a support plate, a base material, a display panel and at least one protective layer in order from bottom to top, wherein the support plate, the base material, the display panel The panel and at least one protective layer are bonded together through an adhesive layer (for example: optical clear adhesive (OCA), pressure sensitive adhesive (PSA), etc.).
  • OCA optical clear adhesive
  • PSA pressure sensitive adhesive
  • the display module includes at least one bending area, and the display module is used to generate bending in the bending area, so as to realize the opening and closing of the body of the folding screen device.
  • the display module When the display module is bent, its various layer structures will generate internal stress due to deformation and interaction. Under the action of internal stress, the original bonded state between the layers of the display module may be destroyed, resulting in structural peeling between some layers, resulting in stamping or damage to the display module.
  • Embodiments of the present application provide a support assembly, a display module, and an electronic device, so as to reduce the internal stress generated when the display module of the foldable screen device is bent, avoid the peeling phenomenon, and improve the reliability of the display module.
  • the embodiment of the present application provides a support assembly, including: a support plate, a first adhesive layer, a base material, and a second adhesive layer; the support plate, the first adhesive layer, the base material, and the second adhesive layer
  • the upper stack is set; the base material and the support plate are laminated through the first adhesive layer, and the support component is used to bond with other structures through the second adhesive layer to form a display module of the folding screen device; the support component includes a bending area, and supports
  • the assembly is used to generate bending in the bending area.
  • the support assembly is provided with a plurality of first openings in the bending area. The plurality of first openings are distributed in an array at intervals. The stacking direction of the layers, the base material and the second adhesive layer at least runs through the support plate and the base material.
  • the support assembly provided by the embodiment of the present application at least hollows out the support plate and the base material by setting the first opening, which reduces the internal stress of the support assembly when it is bent and the support assembly acts on the display module. Internal stresses on other structures. Therefore, the bonding state between the layers of the display module will not be damaged by internal stress, and the display module will not produce peeling phenomenon after bending, which improves the reliability of the display module.
  • a plurality of first openings penetrate the support plate, the first adhesive layer, the base material and the second adhesive layer along the stacking direction.
  • the first opening runs through the entire support assembly along the stacking direction, effectively reducing the internal stress of the support plate, the first adhesive layer, the base material and the second adhesive layer during bending.
  • a plurality of first openings are disposed on the support plate and the base material, and penetrate through the support plate and the base material along the stacking direction.
  • the first opening only penetrates the support plate and the substrate along the stacking direction, while the first adhesive layer and the second adhesive layer still maintain a complete structure without opening holes, which is beneficial to reduce the internal stress of the support assembly and reduce the support assembly. processing difficulty.
  • the first opening is a strip-shaped hole, and the length direction of the first opening is parallel to the axis of the bending of the support assembly; the plurality of first openings are aligned along the direction parallel to the axis and The direction perpendicular to the axis line is distributed in an array at intervals.
  • the strip-shaped holes can form a larger hollow area on the support component, which is beneficial to provide a larger deformation space for the support plate, the substrate and other materials, improve the bending performance of the support plate and the substrate and other materials, and reduce bending time internal stress.
  • the support assembly is further provided with a plurality of second openings in the bending area, and the plurality of second openings are distributed in an array at intervals; the plurality of second openings are arranged on the side of the support plate facing away from the first adhesive layer
  • the surface of the board, and a certain depth H is formed along the stacking direction, and the depth H is smaller than the thickness B of the supporting board in the stacking direction.
  • the second opening can realize hollowing out of the support plate in areas other than the first opening, which is beneficial to improving the bending performance of the support plate in areas other than the first opening and reducing internal stress during bending.
  • the second opening is a strip-shaped hole, and the length direction of the second opening is parallel to the axis; the second opening extends continuously from one end surface of the support plate to the other along the axis. One end face; a plurality of second openings are distributed in an array at intervals along a direction perpendicular to the axis.
  • the strip-shaped holes can form a larger hollow area on the support plate, which is beneficial to provide a larger deformation space for the support plate, improve the bending performance of the support plate, and reduce the internal stress during bending.
  • the bending area includes an inner bending area
  • the support assembly is used to bend the inner bending area toward the direction of the second adhesive layer, and a plurality of first openings are arranged in the inner bending area.
  • the bending area includes an outer bending area
  • the support assembly is used for bending toward the support plate in the outer bending area
  • a plurality of second openings are arranged in the outer bending area.
  • both the first adhesive layer and the second adhesive layer are pressure-sensitive adhesives.
  • the embodiment of the present application provides a display module
  • the display module includes: the support assembly provided in the first aspect of the embodiment of the present application and its various implementations, a display panel, a third adhesive layer, a first protection layer, the fourth adhesive layer and the second protective layer; the support assembly, the display panel, the third adhesive layer, the first protective layer, the fourth adhesive layer and the second protective layer are stacked from bottom to top; the display panel and the support assembly
  • the substrate is laminated through the second adhesive layer, the first protective layer is bonded to the display panel through the third adhesive layer, and the second protective layer is bonded to the first protective layer through the fourth adhesive layer.
  • the display module provided by the embodiment of the present application has less stress when it is bent. Therefore, the bonding state between the layers of the display module will not be damaged by internal stress, and the display module will not be damaged after bending. A peeling phenomenon will occur, which improves the reliability of the display module.
  • the display panel is an organic light emitting diode (OLED) display panel.
  • OLED organic light emitting diode
  • both the third adhesive layer and the fourth adhesive layer are optical adhesives.
  • the first protective layer is a polarizing layer
  • the second protective layer is ultra-thin glass or transparent polyimide film.
  • the embodiment of the present application provides an electronic device, the electronic device includes one or more display modules, wherein at least one display module is the display provided in the second aspect of the embodiment of the present application and its various implementations. mod.
  • FIG. 1 is a schematic structural diagram of a folding screen device shown in an embodiment of the present application
  • Fig. 2 is a schematic diagram of the unfolded display module shown in the embodiment of the present application.
  • Fig. 3 is a schematic diagram of the form of the display module of the folding screen device shown in the embodiment of the present application in the folded state of the fuselage;
  • FIG. 4 is a schematic structural diagram of a display module of a current folding screen device
  • Fig. 5 is a schematic structural diagram of the support assembly provided by the first embodiment of the present application.
  • Fig. 6 is a schematic diagram of the pattern of the hollow structure provided by the embodiment of the present application.
  • Fig. 7 is a schematic structural diagram of a support assembly provided by the second embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a display module provided by a third embodiment of the present application.
  • Fig. 9 is a schematic diagram of a simulated bending test of a display module provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a display module provided by a fourth embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of a folding screen device shown in an embodiment of the present application.
  • structure a in FIG. 1 is a schematic structural diagram of an inner folding screen device
  • structure b in FIG. 1 is a structural schematic diagram of an outer folding screen device.
  • the inner folding screen device means that the body 10 of the electronic device can be folded toward the side of the display module 11, and the display module 11 is hidden in the body of the electronic device after the body 10 of the electronic device is folded.
  • the outer folding screen device refers to the electronic device.
  • the fuselage 10 can be folded toward the back side of the fuselage 10, and the display module 11 wraps around the outside of the fuselage 10 of the electronic device after the fuselage 10 of the electronic device is folded, thus forming the display module 11 in the folded state of the fuselage 10.
  • Surrounding the fuselage 10 forms a surround screen, which presents the effect of a normal straight screen when the fuselage 10 is unfolded.
  • FIG. 2 is a schematic view of the unfolded display module shown in the embodiment of the present application.
  • the display module may include at least one bending area 31 , and the area outside the bending area 31 is a planar area 32 .
  • the bending area 31 refers to the area where the display module will bend when the body of the folding screen device is folded
  • the plane area 32 refers to the area where the display module will not bend when the body of the folding screen device is folded. area.
  • the number of bending areas 31 is determined by the number of folds of the body of the folding screen device. If the body of the folding screen device is only folded once (that is, a single folding screen device), the display module may include a bending area 31.
  • the display module may include two bending regions 31 .
  • the display module shown in FIG. 2 includes a bending area 31, and the plane area 32 is located on the left and right sides of the bending area 31, and is used to realize the left and right bending of the body of the folding screen device.
  • the number of the bending areas 31 of the display module is beyond the scope of the discussion of the embodiment of the present application, so the following will not elaborate further.
  • FIG. 3 takes an inner folding screen device as an example, and shows a schematic view of a display module of the folding screen device in a folded state of the fuselage 10 .
  • the bending area in the folded state of the fuselage 10 , the bending area can form an inner bending area 41 and an outer bending area 42 at different positions.
  • the inner bending area 41 refers to the area where the display module bends toward the side displaying images
  • the outer bending area 42 refers to the area where the display module bends toward the side of the support plate.
  • Whether the bending area can form the inner bending area 41 or the outer bending area 42 depends on the bending direction of the fuselage 10 and the structural design of the technician. Therefore, in different folding screen devices, the inner bending area 41 and the outer bending area 42 The distribution of may be different, which is not limited in this embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a display module of a current folding screen device.
  • the display module of the folding screen device has a multi-layer stack structure, which may include a support plate 51, a base material 52, a display panel 53, a first protective layer 54 and a second protective layer from bottom to top. Second protective layer 55 .
  • the support plate 51 can be, for example, a TA4 titanium alloy plate
  • the base material 52 can be, for example, a polyimide PI base material
  • the display panel 53 can be, for example, a flexible organic light-emitting diode (Organic Light-Emitting Diode, OLED) display panel.
  • OLED Organic Light-Emitting Diode
  • a protective layer 54 may be, for example, a polarizer, and a second protective layer 55 may be, for example, a cover.
  • a pressure-sensitive adhesive 56 is provided between the support plate 51 and the base material 52, and the support plate 51 and the base material 52 are bonded together through the pressure-sensitive adhesive 56;
  • a pressure-sensitive adhesive is provided between the base material 52 and the display panel 53 57, the base material 52 and the display panel 53 are pasted together by the pressure-sensitive adhesive 57;
  • an optical glue 58 is arranged between the display panel 53 and the first protective layer 54, and the display panel 53 and the first protective layer 54 are pasted by the optical glue 58 Together;
  • optical glue 59 is provided between the first protective layer 54 and the second protective layer 55 , and the first protective layer 54 and the second protective layer 55 are bonded together through the optical glue 59 .
  • the structure composed of support plate 51/pressure-sensitive adhesive 56/substrate 52/pressure-sensitive adhesive 57 usually exists as a separate component. For the convenience of description,
  • the support plate 51 of the display module will be hollowed out in the bending area.
  • the hollowing out of the support plate 51 can reduce the internal stress when the display module is bent to a certain extent, from the actual test, the internal stress when the display module is bent is still very large.
  • the display panel 53 The internal stress of the optical adhesive 58 between the first protective layer 54 and the first protective layer 54 is the largest, causing the optical adhesive 58 to be easily peeled off from the bonded state with the display panel 53 and the first protective layer 54, resulting in peeling, resulting in stamping of the display module or damaged.
  • the first embodiment of the present application provides a support assembly, which can further reduce the internal stress of the display module when it is bent, and avoid peeling.
  • Fig. 5 is a schematic structural diagram of the support assembly provided by the first embodiment of the present application. As shown in Figure 5, the support assembly includes: a support plate 100, a first adhesive layer 200, a base material 300 and a second adhesive layer 400, wherein the support plate 100, the first adhesive layer 200, the base material 300 and the second adhesive layer Layers 400 are stacked from bottom to top. Specifically:
  • the support plate 100 can be used as the lowermost layer of the support assembly, and is generally made of high-modulus plates, such as TA4 titanium alloy, stainless steel, polyvinyl alcohol (polyvinyl alcohol, PVA) high-modulus fibers, etc., or other materials with certain plasticity and rigidity.
  • the supporting plate 100 is used to support and maintain the shape of the display module in various opening and closing states of the folding screen device body.
  • the first adhesive layer 200 is disposed on the support plate 100 , and the first adhesive layer 200 may be, for example, an adhesive layer formed of pressure-sensitive adhesive, or an adhesive layer formed of optical adhesive.
  • the base material 300 is disposed on the first adhesive layer 200 , and the base material 300 is attached to the support plate 100 through the first adhesive layer 200 .
  • the substrate 300 may be, for example, a polyester film PET or a polyimide PI substrate.
  • the base material 300 serves as the connecting structure between the support assembly and other structures of the display module, its surface facing the support plate 100 is bonded to the support plate 100 through the first adhesive layer 200, and the surface facing away from the support plate 100 is used for display Other structures of the module (for example: display panel) are attached.
  • the second adhesive layer 400 is disposed on the substrate 300 , and the second adhesive layer 400 may be, for example, an adhesive layer formed of pressure-sensitive adhesive, or an adhesive layer formed of optical adhesive.
  • the supporting component is used to bond together with other structures of the display module through the second adhesive layer 400 to form a complete display module of the folding screen device.
  • the first adhesive layer 200 is disposed on the surface of the base material 300 facing the support plate 100
  • the second adhesive layer 400 is disposed on the surface of the base material 300 facing away from the support plate 100. Therefore, the first adhesive layer 200 , the base material 300 and the second adhesive layer 400 actually constitute a double-sided adhesive structure, and the support plate 100 and other structures of the display module can be regarded as bonded together through the double-sided adhesive.
  • the first adhesive layer 200 and the second adhesive layer 400 can be coated or bonded on both sides of the substrate 300 first to form a double-sided adhesive, and then the double-sided adhesive can be pasted on the support plate 100; First, coat or bond the first adhesive layer 200 on the support plate 100, then stick the base material 300 on the first adhesive layer 200, and finally coat or stick the base material 300 on the surface of the base material 300 facing away from the support plate 100. Connect the second adhesive layer 400 .
  • the support assembly provided in the embodiment of the present application is also provided with a hollow structure.
  • the hollow structure can be arranged, for example, in the bending area of the support component.
  • the hollow structure may at least include a plurality of first openings 510 , and the plurality of first openings 510 are distributed in an array at intervals in the bending region of the supporting component.
  • the first opening 510 may be a through hole, which is provided on the support plate 100, the first adhesive layer 200, the base material 300 and the second adhesive layer 400, and along the support plate 100, the second adhesive layer
  • the stacking direction of the first adhesive layer 200, the substrate 300 and the second adhesive layer 400 (which may be a direction perpendicular to the support plate 100) runs through the support plate 100, the first adhesive layer 200, the substrate 300 and the second The adhesive layer 400 runs through the entire support assembly. In this way, in the bending area of the support assembly, the support plate 100, the first adhesive layer 200, the base material 300 and the second adhesive layer 400 of the support assembly are all removed through the first opening 510, reducing the size of the support plate 100. , the internal stress of the first adhesive layer 200 , the substrate 300 and the second adhesive layer 400 during bending.
  • the bending area of the support assembly includes an outer bending area and an inner bending area
  • the plurality of first openings The holes 510 are preferably distributed in the inner bending area of the support assembly, so as to reduce the internal stress of the support assembly and the display module in the inner bending area.
  • the hollow structure further includes at least one second opening 520 .
  • the bending area of the support assembly includes an outer bending area and an inner bending area
  • at least one second opening 520 may be provided in the outer bending area of the support assembly.
  • a plurality of second openings 520 are distributed in an array at intervals.
  • the second opening 520 may be a blind hole, which is arranged on the surface of the support plate 100 facing away from the base material 300, and forms a certain depth H toward the base material 300.
  • the depth H of the second opening 520 is less than The thickness B of the support plate 100 .
  • the support plate 100 can have a larger deformation space in the outer bending area, so the internal stress generated by the support plate 100 in the outer bending area is smaller, which is beneficial to reduce the stress of the support assembly and the display module in the outer bending area.
  • the surface of the support plate 100 facing the substrate 300 can still maintain a continuous structure in the outer bending area, which also ensures the structural strength of the outer bending area.
  • the hollow structure can be obtained by laser cutting or etching on the support component.
  • the hollow structure can be made after the support plate 100, the first adhesive layer 200, the base material 300 and the second adhesive layer 400 are bonded into an integrated structure, for example: the support plate 100, the first adhesive layer 200, the base material 300 After bonding the second adhesive layer 400 into an integrated structure, the material at the position where the first opening 510 needs to be formed is cut and removed by using a laser cutting process, and the cutting depth penetrates the support plate 100, the first adhesive layer 200, the base material 300 and the The second adhesive layer 400 , so as to obtain the first opening 510 .
  • the hollow structure can be made before the support plate 100, the first adhesive layer 200, the base material 300 and the second adhesive layer 400 are bonded into an integrated structure, for example: the support plate 100 and the first adhesive layer 200, the base material 300 Before laminating with the second adhesive layer 400, laser cutting process can be used to cut and remove the material at the position where the first opening 510 (and the second opening 520) needs to be formed on the support plate 100 to obtain the first opening 510 (and the second opening 520).
  • the second opening 520) is located at the part of the support plate 100; in addition, laser cutting technology can also be used to shape the first opening according to the needs of the double-sided adhesive formed by the first adhesive layer 200, the base material 300 and the second adhesive layer 400
  • the material at the position of 510 is cut and removed to obtain the part of the first opening 510 located on the double-sided adhesive; finally, the support plate 100 with the first opening 510 (and the second opening 520) and the support plate with the first opening 510
  • the double-sided tape of the hole 510 is pasted into a supporting component with a hollow structure.
  • the hollow structure can be obtained by cutting according to a specific pattern.
  • Fig. 6 is a schematic diagram of the pattern of the hollow structure provided by the embodiment of the present application.
  • the first opening 510 may be, for example, a bar-shaped hole, the length direction of the first opening 510 is parallel to the axis L of the bending of the support assembly, and a plurality of The first openings 510 are distributed in an array along a direction parallel to the axis L and a direction perpendicular to the axis L at intervals. In a direction parallel to the axis L and a direction perpendicular to the axis L, there is a certain interval between two adjacent first openings 510 .
  • a plurality of first openings 510 are distributed from one end of the support plate 100 to the other end of the support plate 100, so that the support assembly is at any position parallel to the axis L. Can have good bending performance. In a direction perpendicular to the axis L, a plurality of first openings 510 are distributed within a certain width range.
  • the second opening 520 may be, for example, a bar-shaped hole, the length direction of the second opening 520 is parallel to the axis L of the bending of the support assembly, and a plurality of second openings 520
  • the openings 520 are distributed in an array at intervals along a direction perpendicular to the axis L, and there is a certain interval between two adjacent second openings 520 .
  • the length of the second opening 520 is preferably the same as the width of the support plate 100 in a direction parallel to the axis L, so that the second opening 520 extends continuously from one end surface of the support plate 100 along the axis L to the other side end surface, so as to penetrate the support plate 100 along the axis L direction.
  • the support assembly provided by the first embodiment of the present application reduces the internal stress of each layer structure of the support assembly through the first opening structure, so that the support assembly acts on other structures of the display module (such as acting on The stress on the optical glue) is further reduced, so that the bonding state between the layers of the display module will not be destroyed due to excessive stress, and the display module will not produce peeling after bending. Improved display module reliability.
  • the second embodiment of the present application provides a support assembly, which can further reduce the internal stress of the display module when it is bent, and avoid peeling.
  • Fig. 7 is a schematic structural diagram of a support assembly provided by the second embodiment of the present application.
  • the support assembly includes: a support plate 100, a first adhesive layer 200, a base material 300 and a second adhesive layer 400, wherein the support plate 100, the first adhesive layer 200, the base material 300 and the second adhesive layer Layers 400 are stacked from bottom to top.
  • a plurality of first openings 510 are only provided on the support plate 100 and the base material 300 , while the first adhesive layer 200 and the second adhesive layer 400 are not provided with the first openings 510 .
  • the first opening 510 extends from the plate surface of the support plate 100 facing away from the base material 300 to the plate surface of the support plate 100 facing the base material 300, thereby penetrating the support plate 100;
  • the first opening 510 extends from the surface of the substrate 300 facing the support plate 100 to the surface of the substrate 300 facing away from the support plate 100 , thereby penetrating through the substrate 300 . Since the first adhesive layer 200 is not provided with the first opening 510 , it is completely coated between the support plate 100 and the base material 300 .
  • the second adhesive layer 400 is completely coated on the surface of the substrate 300 facing away from the support plate 100 because the first opening 510 is not provided.
  • the support plate 100 and the base material 300 of the support assembly are removed through the first opening 510, which enables the support plate 100 and the base material 300 to obtain a larger deformation space when the support assembly is bent. , which is conducive to the release of internal stress and reduces the internal stress of each layer of the supporting component.
  • the first opening 510 can be obtained on the support plate 100 and the substrate 300 by laser cutting or etching.
  • the first opening 510 can be made before the support plate 100 and the base material 300 are bonded together.
  • the material at the position where the first opening 510 needs to be formed on the support plate 100 can be cut and removed by using a laser cutting process to obtain the first opening 510 located on the support plate 100.
  • the material at the position where the first opening 510 needs to be formed in the base material 300 can be cut and removed by using a laser cutting process, so as to obtain the position of the first opening 510 located on the base material 300 part; then, coating or bonding the first adhesive layer 200 on the substrate 300 with the first opening 510; finally, the support plate 100 with the first opening 510 and the support plate with the first adhesive layer 200
  • the base material 300 of the first opening 510 is pasted into an integral structure.
  • the first opening 510 can be made after the support plate 100 and the base material 300 are bonded together.
  • the first adhesive layer 200 can be coated or bonded on the base material 300 first, and the support plate 100 and the base material 300 can be bonded into an integrated structure through the first adhesive layer 200; then, the support plate 100 and the base material 300 can be pasted together
  • the final integrated structure performs a laser cutting or etching process to cut and remove the supporting plate 100 and the material of the base material 300 where the first opening 510 needs to be formed, thereby obtaining the first opening 510 and the first opening 510 disposed on the supporting plate 100.
  • the first opening 510 is disposed on the substrate 300 .
  • the support assembly provided by the second embodiment of the present application reduces the internal stress of each layer structure of the support assembly through the first opening structure, and further reduces the stress that the support assembly acts on other stacked structures of the display module. In this way, the bonding state between the layers of the display module will not be damaged due to excessive stress, and the display module will not produce peeling after bending, which improves the reliability of the display module.
  • the third embodiment of the present application provides a display module. Compared with the traditional bendable display module, the internal stress of the display module provided by the third embodiment of the present application is smaller when it is bent, Peeling can be avoided.
  • FIG. 8 is a schematic structural diagram of a display module provided by a third embodiment of the present application.
  • the display module includes: the support assembly provided in the first embodiment of the present application and various implementations thereof, a display panel 610 , a third adhesive layer 620 , a first protective layer 630 , a fourth adhesive layer 640 and The second protective layer 650 , wherein the support assembly, the display panel 610 , the third adhesive layer 620 , the first protective layer 630 , the fourth adhesive layer 640 and the second protective layer 650 are stacked from bottom to top.
  • the support assembly provided in the first embodiment of the present application and various implementations thereof
  • a display panel 610 includes: the support assembly provided in the first embodiment of the present application and various implementations thereof, a display panel 610 , a third adhesive layer 620 , a first protective layer 630 , a fourth adhesive layer 640 and The second protective layer 650 , wherein the support assembly, the display panel 610 , the third adhesive layer 620 , the first
  • the support assembly can be used as the bottom layer of the display module, and as shown in FIG. 5 , the support assembly can include: a support plate 100 ; The substrate 300, the substrate 300 is attached to the support plate 100 through the first adhesive layer 200; the second adhesive layer 400 arranged on the substrate 300; and the support plate 100, the first adhesive layer 200, the substrate 300 and the first opening 510 of the second adhesive layer 400 , and/or, the second opening 520 disposed on the support plate 100 .
  • the display panel 610 is disposed on the second adhesive layer 400 , and the display panel 610 is attached to the substrate 300 through the second adhesive layer 400 .
  • the display panel 610 is used to display images, and the display panel 610 may be, for example, a flexible organic light-emitting diode (Organic Light-Emitting Diode, OLED) display panel, or other flexible display panels, such as a flexible Micro LED display panel, Mini LED display panel wait.
  • OLED Organic Light-Emitting Diode
  • the third adhesive layer 620 is disposed on the display panel 610 , for example, the third adhesive layer 620 may be an adhesive layer formed of optical adhesive, or may be an adhesive layer formed of pressure sensitive adhesive.
  • the first protective layer 630 is disposed on the third adhesive layer 620 , and the first protective layer 630 is attached to the display panel 610 through the third adhesive layer 620 .
  • the first protective layer 630 may be, for example, a polarizer.
  • the fourth adhesive layer 640 is disposed on the first protective layer 630, and the fourth adhesive layer 640 may be, for example, an adhesive layer formed of optical adhesive, or an adhesive layer formed of pressure sensitive adhesive.
  • the second protective layer 650 is disposed on the fourth adhesive layer 640.
  • the second protective layer 650 is used as the cover plate of the display module and can be made of ultra-thin glass or transparent polyimide film to have good bending performance.
  • FIG. 9 is a schematic diagram of a simulated bending test of a display module provided by an embodiment of the present application.
  • FIG. 9 in order to verify the ability of the display module provided by the embodiment of the present application to reduce the internal stress during bending, it is possible to simulate the bending state of the folding screen device body inside the display module in the folded state, and select Some sampling points are used for internal stress sampling. Since the third adhesive layer usually bears the largest internal stress, the embodiment of the present application selects two sampling points on the third adhesive layer, which are respectively located at P1 at the rounded corner of the area of the second opening 520 and in the area of the second opening 520 Fillet P2.
  • the embodiment of the present application also selects two sampling points in the fourth adhesive layer, which are respectively located at P3 at the outer corner of the area of the second opening 520 and at P4 at the inner corner of the area of the second opening 520 .
  • the sampling results are shown in Table 1:
  • the display module provided by the third embodiment of the present application has less stress when it is bent. Therefore, the bonding state between the layers of the display module will not be damaged by internal stress, and the display module The group does not produce peeling phenomenon after being bent, which improves the reliability of the display module.
  • the fourth embodiment of the present application provides a display module. Compared with the traditional bendable display module, the internal stress of the display module provided by the fourth embodiment of the present application is smaller when it is bent. Peeling can be avoided.
  • FIG. 10 is a schematic structural diagram of a display module provided by a fourth embodiment of the present application.
  • the display module includes: the support assembly provided in the second embodiment of the present application and its implementations, a display panel 610 , a third adhesive layer 620 , a first protective layer 630 , a fourth adhesive layer 640 and The second protective layer 650 , wherein the support assembly, the display panel 610 , the third adhesive layer 620 , the first protective layer 630 , the fourth adhesive layer 640 and the second protective layer 650 are stacked from bottom to top.
  • the support assembly provided in the second embodiment of the present application and its implementations
  • a display panel 610 includes: the support assembly provided in the second embodiment of the present application and its implementations, a display panel 610 , a third adhesive layer 620 , a first protective layer 630 , a fourth adhesive layer 640 and The second protective layer 650 , wherein the support assembly, the display panel 610 , the third adhesive layer 620 , the first protective layer
  • the support assembly can be used as the bottom layer of the display module, and as shown in FIG. 7 , the support assembly can include: a support plate 100 ; The base material 300, the base material 300 is pasted together with the support plate 100 through the first adhesive layer 200; the second adhesive layer 400 arranged on the base material 300; and the first opening through the support plate 100 and the base material 300 510 , and/or, the second opening 520 disposed on the support plate 100 .
  • the display panel 610 is disposed on the second adhesive layer 400 , and the display panel 610 is attached to the substrate 300 through the second adhesive layer 400 .
  • the display panel 610 is used to display images, and the display panel 610 may be, for example, a flexible organic light emitting diode OLED display panel, or other flexible display panels, such as flexible Micro LED display panels, Mini LED display panels, and the like.
  • the third adhesive layer 620 is disposed on the display panel 610 , for example, the third adhesive layer 620 may be an adhesive layer formed of optical adhesive, or may be an adhesive layer formed of pressure sensitive adhesive.
  • the first protective layer 630 is disposed on the third adhesive layer 620 , and the first protective layer 630 is attached to the display panel 610 through the third adhesive layer 620 .
  • the first protective layer 630 may be, for example, a polarizing layer.
  • the fourth adhesive layer 640 is disposed on the first protective layer 630 , for example, the fourth adhesive layer 640 may be an adhesive layer formed of optical adhesive, or may be an adhesive layer formed of pressure sensitive adhesive.
  • the second protective layer 650 is disposed on the fourth adhesive layer 640.
  • the second protective layer 650 is used as the cover plate of the display module and can be made of ultra-thin glass or transparent polyimide film to have good bending performance.
  • Table 2 shows the results of the simulated bending test and sampling performed on the display module provided by the fourth embodiment of the present application by adopting the simulated bending test and sampling method shown in FIG. 9 .
  • the display module provided by the fourth embodiment of the present application has less stress when it is bent. Therefore, the bonding state between the layers of the display module will not be damaged by internal stress, and the display module The group does not produce peeling phenomenon after being bent, which improves the reliability of the display module.
  • the embodiment of the present application also provides an electronic device, for example, the electronic device may be a folding screen device, a scrolling screen device, or any electronic device with a bendable display screen.
  • the electronic device may include one or more display modules, wherein at least one display module is the display module provided in the third embodiment or the fourth embodiment of the present application, or at least one display module includes the display module of the first embodiment of the present application. example or the support assembly provided in the second embodiment and various implementations thereof.
  • the electronic device may be an inner folding screen device, and the inner folding screen device may include an inner screen module and an outer screen module, wherein the inner screen module refers to a display module that is hidden when the fuselage is folded.
  • the outer screen module refers to the display module that is exposed in any state of the fuselage, and the inner screen module is the display module provided in the third embodiment or the fourth embodiment of the present application.

Abstract

一种支撑组件、显示模组和电子设备。支撑组件包括：支撑板(21)、第一胶层(200)、基材(300)和第二胶层(400)；支撑板(21)、第一胶层(200)、基材(300)和第二胶层(400)自下而上堆叠设置；基材(300)与支撑板(21)通过第一胶层(200)贴合，支撑组件用于通过第二胶层（400）与其他结构贴合，组成折叠屏设备的显示模组；支撑组件包括弯折区，支撑组件用于在弯折区产生弯折，支撑组件在弯折区设置有多个第一开孔（510），多个第一开孔（510）沿着支撑板（21）、第一胶层（200）、基材（300）和第二胶层（400）的堆叠方向至少贯穿支撑板（21）和基材（300）。本支撑组件，通过第一开孔（510）减小了支撑组件弯折时的内应力和支撑组件作用到显示模组其他结构上的内应力，因此显示模组在弯折后不会产生结构剥离现象，提高了显示模组的可靠性。

Description

一种支撑组件、显示模组和电子设备
本申请要求于2021年9月2日提交到国家知识产权局、申请号为202111026467.X、发明名称为“一种支撑组件、显示模组和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示屏技术领域，尤其涉及一种支撑组件、显示模组和电子设备。
背景技术
近年来，电子设备的显示屏技术发展迅速，特别是可弯曲的柔性屏的产生使得电子设备得以开发出更多的产品形态，其中，折叠屏设备就是目前新兴的一种产品形态。目前，折叠屏设备的显示模组具有多层堆叠结构，该多层堆叠结构自下而上依次可以包括支撑板、基材、显示面板和至少一个保护层，其中，支撑板、基材、显示面板和至少一个保护层之间通过胶层(例如：光学胶(optically clear adhesive，OCA)、压敏胶(pressure sensitive adhesive，PSA)等)贴合在一起。
显示模组包括至少一个弯折区，显示模组用于在弯折区产生弯折，以实现折叠屏设备的机身开合。当显示模组发生弯折时，其各层结构由于形变和相互作用会产生内应力。在内应力的作用下，显示模组的各层结构之间原有的贴合状态可能会被破坏，导致某些层之间产生结构剥离(peeling)，导致显示模组出现模印或者损坏。
发明内容
本申请实施例提供了一种支撑组件、显示模组和电子设备，以减小折叠屏设备的显示模组在弯折时产生的内应力，避免peeling现象，提高显示模组的可靠性。
第一方面，本申请实施例提供了一种支撑组件，包括：支撑板、第一胶层、基材和第二胶层；支撑板、第一胶层、基材和第二胶层自下而上堆叠设置；基材与支撑板通过第一胶层贴合，支撑组件用于通过第二胶层与其他结构贴合，组成折叠屏设备的显示模组；支撑组件包括弯折区，支撑组件用于在弯折区产生弯折，支撑组件在弯折区设置有多个第一开孔，多个第一开孔间隔阵列分布，多个第一开孔沿着支撑板、第一胶层、基材和第二胶层的堆叠方向至少贯穿支撑板和基材。
本申请实施例提供的支撑组件，通过设置第一开孔的方式，至少对支撑板和基材进行了挖空处理，减小了支撑组件弯折时的内应力和支撑组件作用到显示模组其他结构上的内应力。因此，显示模组各层结构之间的贴合状态不会被内应力破坏，显示模组在弯折后不会产生peeling现象，提高了显示模组的可靠性。
在一种实现方式中，多个第一开孔沿着堆叠方向贯穿支撑板、第一胶层、基材和第二胶层。这样，第一开孔沿着堆叠方向贯穿整个支撑组件，有效地降低了支撑板、第一胶层、基材和第二胶层在弯折时的内应力。
在一种实现方式中，多个第一开孔设置于支撑板和基材上，并且沿着堆叠方向贯穿支撑板和基材。这样第一开孔沿着堆叠方向仅贯穿支撑板和基材，而第一胶层和第二胶 层依然保持完整结构，无需开孔，有利于在降低支撑组件内应力的同时，降低支撑组件的加工难度。
在一种实现方式中，第一开孔为条形孔，第一开孔的长度方向与支撑组件弯折的轴心线平行；多个第一开孔沿着平行于轴心线的方向和垂直于轴心线的方向间隔阵列分布。条形孔能够在支撑组件上形成更大的挖空面积，有利于为支撑板、基材等材料提供更大的形变空间，提高支撑板和基材等材料的弯折性能，减小弯折时的内应力。
在一种实现方式中，支撑组件在弯折区还设置有多个第二开孔，多个第二开孔间隔阵列分布；多个第二开孔设置于支撑板的背对第一胶层的板面，并且沿着堆叠方向形成一定的深度H，深度H小于支撑板在堆叠方向上的厚度B。这样，第二开孔可以在第一开孔以外的区域实现对支撑板的挖空处理，有利于提高支撑板在第一开孔以外区域的弯折性能，减小弯折时的内应力。
在一种实现方式中，第二开孔为条形孔，第二开孔的长度方向与轴心线平行；第二开孔沿着轴心线方向从支撑板的一侧端面连续延伸至另一侧端面；多个第二开孔沿着垂直于轴心线的方向间隔阵列分布。条形孔能够在支撑板上形成更大的挖空面积，有利于为支撑板提供更大的形变空间，提高支撑板的弯折性能，减小弯折时的内应力。
在一种实现方式中，弯折区包括内弯区，支撑组件用于在内弯区向第二胶层方向弯折，多个第一开孔设置于内弯区。
在一种实现方式中，弯折区包括外弯区，支撑组件用于在外弯区向支撑板方向弯折，多个第二开孔设置于外弯区。
在一种实现方式中，第一胶层和第二胶层均为压敏胶。
第二方面，本申请实施例提供了一种显示模组，该显示模组包括：本申请实施例第一方面及其各实现方式提供的支撑组件、显示面板、第三胶层、第一保护层、第四胶层和第二保护层；支撑组件、显示面板、第三胶层、第一保护层、第四胶层和第二保护层自下而上堆叠设置；显示面板与支撑组件的基材通过第二胶层贴合，第一保护层与显示面板通过第三胶层贴合，第二保护层与第一保护层通过第四胶层贴合。
本申请实施例提供的显示模组，在弯折时具有更小的更应力，因此，显示模组各层结构之间的贴合状态不会被内应力破坏，显示模组在弯折后不会产生peeling现象，提高了显示模组的可靠性。
在一种实现方式中，显示面板为有机发光二极管OLED显示面板。
在一种实现方式中，第三胶层和第四胶层均为光学胶。
在一种实现方式中，第一保护层为偏光层，第二保护层为超薄玻璃或者透明聚酰亚胺薄膜。
第三方面，本申请实施例提供了一种电子设备，该电子设备包括一个或者多个显示模组，其中，至少一个显示模组为本申请实施例第二方面及其各实现方式提供的显示模组。
附图说明
图1是本申请实施例示出的折叠屏设备的结构示意图；
图2是本申请实施例示出的显示模组展开后的示意图；
图3是本申请实施例示出的折叠屏设备在机身折叠状态下的显示模组的形态示意图；
图4是目前一种折叠屏设备的显示模组的结构示意图；
图5是本申请第一实施例提供的支撑组件的结构示意图；
图6是本申请实施例提供的镂空结构的图案示意图；
图7是本申请第二实施例提供的支撑组件的结构示意图；
图8是本申请第三实施例提供的显示模组的结构示意图；
图9是本申请实施例提供的显示模组仿真弯折测试的示意图；
图10是本申请第四实施例提供的显示模组的结构示意图。
图示说明：
其中，10-机身，11-显示屏，21-支撑板，22-显示面板，23-盖板，31-弯折区，32-平面区，41-内弯区，42-外弯区，51-支撑板，52-基材，53-显示面板，54-第一保护层，55-第二保护层，56-压敏胶，57-压敏胶，58-光学胶，59-光学胶，100-支撑板，200-第一胶层，300-基材，400-第二胶层，510-第一开孔，520-第二开孔，610-显示面板，620-第三胶层，630-第一保护层，640-第四胶层，650-第二保护层。
具体实施方式
近年来，电子设备的显示屏技术发展迅速，特别是可弯曲的柔性屏的产生使得电子设备得以开发出更多的产品形态，其中，折叠屏设备就是目前新兴的一种产品形态。
目前，折叠屏设备根据显示模组折叠方向的不同，可以分为内折叠屏设备和外折叠屏设备。图1是本申请实施例示出的折叠屏设备的结构示意图。其中，图1中的结构a是内折叠屏设备的结构示意图，图1中的结构b是外折叠屏设备的结构示意图。如图1的结构a所示，内折叠屏设备是指电子设备的机身10能够向显示模组11一侧折叠，显示模组11在电子设备的机身10折叠后隐藏于电子设备的机身10内侧，由此形成显示模组11在机身10折叠状态下隐藏，在机身10展开状态下呈现的效果；如图1中的结构b所示，外折叠屏设备是指电子设备的机身10能够向机身10背面一侧折叠，显示模组11在电子设备的机身10折叠后环绕于电子设备的机身10外侧，由此形成显示模组11在机身10折叠状态下环绕机身10，形成环绕屏，在机身10展开状态下呈现正常直屏的效果。
图2是本申请实施例示出的显示模组展开后的示意图。如图3所示，显示模组可以包括至少一个弯折区31，弯折区31以外的区域则为平面区32。其中，弯折区31是指在折叠屏设备的机身折叠时显示模组会发生弯折的区域，平面区32是指在折叠屏设备的机身折叠时显示模组不会发生弯折的区域。弯折区31的数量由折叠屏设备机身的折叠数量决定，如果折叠屏设备的机身只折叠一次(即单折叠屏设备)，那么显示模组可以包括一个弯折区31，如果折叠屏设备的机身折叠两次(即双折叠屏设备)，那么显示模组可以包括两个弯折区31。作为示例地，图2示出的显示模组包括一个弯折区31，平面区32位于弯折区31的左右两侧，用于实现折叠屏设备机身的左右弯折。显示模组的弯折区31数量不在本申请实施例的讨论范围内，因此以下不再过多展开说明。
图3以内折叠屏设备为例，示出了折叠屏设备在机身10折叠状态下的显示模组的形态示意图。如图3所示，在机身10折叠状态下，弯折区在不同的位置可以形成内弯区41和外弯区42。其中，内弯区41是指显示模组向显示图像的一侧弯曲的区域，外弯区42是指显示模组向支撑板的一侧弯曲的区域。弯折区具体能够形成内弯区41还是外弯区42，取决于机身10的弯折方向以及技术人员的结构设计，因此在不同的折叠屏设备 中，内弯区41和外弯区42的分布可能不同，本申请实施例对此不做限定。
图4是目前一种折叠屏设备的显示模组的结构示意图。如图4所示，折叠屏设备的显示模组具有多层堆叠结构，该多层堆叠结构自下而上依次可以包括支撑板51、基材52、显示面板53、第一保护层54和第二保护层55。其中：支撑板51例如可以是TA4钛合金板材，基材52例如可以是聚酰亚胺PI基材，显示面板53例如可以是柔性有机发光二极管(Organic Light-Emitting Diode，OLED)显示面板，第一保护层54例如可以是偏光层Polarizer，第二保护层55例如可以是盖板。进一步地，支撑板51和基材52之间设置有压敏胶56，支撑板51和基材52通过压敏胶56贴合在一起；基材52和显示面板53之间设置有压敏胶57，基材52和显示面板53通过压敏胶57贴合在一起；显示面板53和第一保护层54之间设置有光学胶58，显示面板53和第一保护层54通过光学胶58贴合在一起；第一保护层54和第二保护层55之间设置有光学胶59，第一保护层54和第二保护层55通过光学胶59贴合在一起。一般来说，在实际生产中，支撑板51/压敏胶56/基材52/压敏胶57所组成的结构通常作为一个单独的组件存在，为便于描述，本申请将这个组件称作支撑组件。
进一步如图4所示，为降低显示模组弯折时的内应力，显示模组的支撑板51会在弯折区进行挖空处理。对支撑板51的挖空处理虽然能够一定程度地减小显示模组弯折时的内应力，但从实际测试来看，显示模组弯折时的内应力依然很大，其中，显示面板53与第一保护层54之间的光学胶58承受的内应力最大，导致光学胶58很容易与显示面板53和第一保护层54从贴合状态剥离，产生peeling，导致显示模组出现模印或者损坏。
下面是本申请的第一实施例。
本申请的第一实施例提供了一种支撑组件，该支撑组件能够进一步降低显示模组弯折时的内应力，避免peeling产生。图5是本申请第一实施例提供的支撑组件的结构示意图。如图5所示，该支撑组件包括：支撑板100、第一胶层200、基材300和第二胶层400，其中，支撑板100、第一胶层200、基材300和第二胶层400自下而上堆叠设置。具体来说：
支撑板100可以作为支撑组件的最下层，一般采用高模量板材制成，例如TA4钛合金、不锈钢、聚乙烯醇(polyvinyl alcohol，PVA)高模纤维等，也可以是其他具有一定塑性和刚性的材质，支撑板100用于在折叠屏设备机身的各种开合状态下支撑和保持显示模组的形态。
第一胶层200设置于支撑板100之上，第一胶层200例如可以是压敏胶形成的胶层，也可以是光学胶形成的胶层。
基材300设置于第一胶层200之上，基材300通过第一胶层200与支撑板100贴合在一起。基材300例如可以是聚脂薄膜PET或者聚酰亚胺PI基材等。基材300作为支撑组件与显示模组的其他结构之间的连接结构，其面向支撑板100的表面通过第一胶层200与支撑板100贴合，背对支撑板100的表面用于与显示模组的其他结构(例如：显示面板)贴合。
第二胶层400设置于基材300之上，第二胶层400例如可以是压敏胶形成的胶层，也可以是光学胶形成的胶层。支撑组件用于通过第二胶层400与显示模组的其他结构贴合在一起，形成完整的折叠屏设备的显示模组。
本申请实施例中，第一胶层200设置于基材300的面向支撑板100的表面，第二胶 层400设置在基材300的背对支撑板100的表面，因此，第一胶层200、基材300和第二胶层400实际构成了一种双面胶结构，支撑板100与显示模组的其他结构可以视作是通过双面胶贴合在一起。
具体实现中，可以首先在基材300的两面涂布或者粘接第一胶层200和第二胶层400，形成双面胶，然后再将双面胶贴合在支撑板100上；也可以首先在支撑板100上涂布或者粘接第一胶层200，然后再将基材300贴合在第一胶层200上，最后在基材300的背对支撑板100的表面涂布或者粘接第二胶层400。
进一步如图5所示，本申请实施例提供的支撑组件还设置有镂空结构。镂空结构例如可以设置在支撑组件的弯折区。镂空结构至少可以包括多个第一开孔510，多个第一开孔510在支撑组件的弯折区间隔阵列分布。
本申请实施例中，第一开孔510可以是通孔，设置于支撑板100、第一胶层200、基材300和第二胶层400，并且沿着所述支撑板100、所述第一胶层200、所述基材300和所述第二胶层400的堆叠方向(可以是垂直于支撑板100的方向)依次贯穿支撑板100、第一胶层200、基材300和第二胶层400，从而贯穿整个支撑组件。这样，在支撑组件的弯折区，支撑组件的支撑板100、第一胶层200、基材300和第二胶层400均通过第一开孔510进行了材料去除，减小了支撑板100、第一胶层200、基材300和第二胶层400在弯折时的内应力。
进一步地，当支撑组件的弯折区包括外弯区和内弯区时，考虑到支撑组件在内弯区通常会以更小的半径弯折，弯曲程度更大，因此，多个第一开孔510优选分布在支撑组件的内弯区，以降低支撑组件和显示模组在内弯区的内应力。
进一步如图5所示，在一种实现方式中，镂空结构还包括至少一个第二开孔520。当支撑组件的弯折区包括外弯区和内弯区时，至少一个第二开孔520可以设置在支撑组件的外弯区，当外弯区的第二开孔520数量为多个时，多个第二开孔520间隔阵列分布。
具体实现中，第二开孔520可以是盲孔，设置在支撑板100的背对基材300的板面，并且向基材300方向形成一定的深度H，第二开孔520的深度H小于支撑板100的厚度B。这样，当支撑组件弯折时，支撑板100在外弯区可以具有更大的形变空间，因此支撑板100在外弯区产生的内应力更小，有利于降低支撑组件和显示模组在外弯区的整体应力，并且，支撑板100的面向基材300的板面在外弯区依然能够保持连续结构，也保证了外弯区的结构强度。
本申请实施例中，镂空结构可以在支撑组件上采用激光切割或者刻蚀工艺得到。
示例性的，镂空结构可以在支撑板100、第一胶层200、基材300和第二胶层400贴合成一体结构之后制作，例如：在支撑板100、第一胶层200、基材300和第二胶层400贴合成一体结构之后，采用激光切割工艺将需要成型第一开孔510的位置的材料切割去除，切割深度一次性贯穿支撑板100、第一胶层200、基材300和第二胶层400，从而得到第一开孔510。
示例性的，镂空结构可以在支撑板100、第一胶层200、基材300和第二胶层400贴合成一体结构之前制作，例如：在支撑板100与第一胶层200、基材300和第二胶层400贴合之前，可以采用激光切割工艺将支撑板100的需要成型第一开孔510(和第二开孔520)的位置的材料切割去除，得到第一开孔510(和第二开孔520)的位于支撑板100的部分；另外，还可以采用激光切割工艺对第一胶层200、基材300和第二胶层400形 成的双面胶的需要成型第一开孔510的位置的材料切割去除，得到第一开孔510的位于双面胶的部分；最后，将带有第一开孔510(和第二开孔520)的支撑板100和带有第一开孔510的双面胶贴合成带有镂空结构的支撑组件。
本申请实施例中，镂空结构可以根据特定的图案pattern切割得到。
图6是本申请实施例提供的镂空结构的图案示意图。根据图6示出的图案，在一种实现方式中，第一开孔510例如可以是条形孔，第一开孔510的长度方向与支撑组件弯折的轴心线L平行，并且多个第一开孔510沿着平行于轴心线L的方向和垂直于轴心线L的方向间隔阵列分布。在平行于轴心线L的方向和垂直于轴心线L的方向，相邻两个第一开孔510之间均具有一定的间隔。另外，在平行于轴心线L的方向，多个第一开孔510从支撑板100的一端分布至支撑板100的另一端，使得支撑组件在平行于轴心线L的方向的任意位置均能具备良好的弯折性能。在垂直于轴心线L的方向，多个第一开孔510分布在一定的宽度范围内。
进一步如图6所示，在一种实现方式中，第二开孔520例如可以是条形孔，第二开孔520的长度方向与支撑组件弯折的轴心线L平行，多个第二开孔520沿垂直于轴心线L的方向间隔阵列分布，相邻两个第二开孔520之间具有一定的间隔。第二开孔520的长度优选与支撑板100在平行于轴心线L的方向上的宽度相同，这样，第二开孔520沿着轴心线L方向从支撑板100的一侧端面连续延伸至另一侧端面，从而沿着轴心线L方向贯穿支撑板100。
由此可见，本申请第一实施例提供的支撑组件，通过第一开孔结构降低了支撑组件各层结构的内应力，使支撑组件作用到显示模组的其他结构上的应力(例如作用到光学胶上的应力)进一步减小，这样，显示模组的各层结构之间的贴合状态不会因为所受应力过大而被破坏，显示模组在弯折后不会产生peeling现象，提高了显示模组的可靠性。
下面是本申请的第二实施例。
本申请的第二实施例提供了一种支撑组件，该支撑组件能够进一步降低显示模组弯折时的内应力，避免peeling产生。图7是本申请第二实施例提供的支撑组件的结构示意图。如图7所示，该支撑组件包括：支撑板100、第一胶层200、基材300和第二胶层400，其中，支撑板100、第一胶层200、基材300和第二胶层400自下而上堆叠设置。
本申请第二实施例提供的支撑组件与本申请第一实施例提供的支撑组件的区别在于：
多个第一开孔510仅设置于支撑板100和基材300上，第一胶层200和第二胶层400则不设置第一开孔510。其中，在支撑板100上，第一开孔510从支撑板100的背对基材300的板面延伸至支撑板100的面向基材300的板面，从而贯穿支撑板100；在基材300上，第一开孔510从基材300的面向支撑板100的表面延伸至基材300的背对支撑板100的表面，从而贯穿基材300。第一胶层200由于不设置第一开孔510而在支撑板100和基材300之间完整涂布。第二胶层400由于不设置第一开孔510而在基材300的背对支撑板100的表面完整涂布。
本申请实施例中，支撑组件的支撑板100和基材300通过第一开孔510进行了材料去除，这使得支撑组件在弯折时，支撑板100和基材300能够获得更大的形变空间，有利于内部应力的释放，降低支撑组件各层结构的内应力。
本申请实施例中，第一开孔510可以在支撑板100和基材300上采用激光切割或者刻蚀工艺得到。
示例性的，第一开孔510可以在支撑板100和基材300贴合之前制作。例如：在支撑板100与基材300贴合之前，可以采用激光切割工艺将支撑板100的需要成型第一开孔510的位置的材料切割去除，得到第一开孔510的位于支撑板100的部分；并且，还可以在基材300涂布胶层之前，采用激光切割工艺将基材300的需要成型第一开孔510的位置的材料切割去除，得到第一开孔510的位于基材300的部分；然后，在带有第一开孔510基材300涂布或粘接第一胶层200；最后，通过第一胶层200将带有第一开孔510的支撑板100和带有第一开孔510的基材300贴合成一体结构。
示例性的，第一开孔510可以在支撑板100和基材300贴合之后制作。例如：可以首先在基材300涂布或粘接第一胶层200，通过第一胶层200将支撑板100和基材300贴合成一体结构；然后，对支撑板100和基材300贴合后的一体结构执行激光切割或者刻蚀工艺，将支撑板100和基材300的需要成型第一开孔510的位置的材料分别切割去除，从而得到设置在支撑板100的第一开孔510和设置在基材300的第一开孔510。
本申请第二实施例的其他未具体展开的特征请参照本申请的第一实施例，此处不再赘述。
由此可见，本申请第二实施例提供的支撑组件，通过第一开孔结构降低了支撑组件各层结构的内应力，使支撑组件作用到显示模组的其他层叠结构上的应力进一步减小，这样，显示模组的各层结构之间的贴合状态不会因为所受应力过大而被破坏，显示模组在弯折后不会产生peeling现象，提高了显示模组的可靠性。
下面是本申请的第三实施例。
本申请的第三实施例提供了一种显示模组，与传统的可弯折的显示模组相比，本申请的第三实施例提供的显示模组在弯折时的内应力更小，能够避免peeling产生。
图8是本申请第三实施例提供的显示模组的结构示意图。如图8所示，该显示模组包括：本申请第一实施例及其各实现方式提供的支撑组件、显示面板610、第三胶层620、第一保护层630、第四胶层640和第二保护层650，其中，支撑组件、显示面板610、第三胶层620、第一保护层630、第四胶层640和第二保护层650自下而上堆叠设置。具体来说：
支撑组件可以作为显示模组的最下层，该支撑组件如图5所示可以包括：支撑板100；设置于支撑板100之上的第一胶层200；设置于第一胶层200之上的基材300，基材300通过第一胶层200与支撑板100贴合在一起；设置于基材300之上的第二胶层400；以及贯穿支撑板100、第一胶层200、基材300和第二胶层400的第一开孔510，和/或，设置于支撑板100上的第二开孔520。
显示面板610设置于第二胶层400之上，显示面板610通过第二胶层400与基材300贴合在一起。显示面板610用于显示图像，显示面板610例如可以是柔性有机发光二极管(Organic Light-Emitting Diode，OLED)显示面板，也可以是其他柔性显示面板，例如柔性的Micro LED显示面板、Mini LED显示面板等。
第三胶层620设置于显示面板610之上，第三胶层620例如可以是光学胶形成的胶层，也可以是压敏胶形成的胶层。
第一保护层630设置于第三胶层620之上，第一保护层630通过第三胶层620与显示面板610贴合在一起。第一保护层630例如可以是偏光层Polarizer。
第四胶层640设置于第一保护层630之上，第四胶层640例如可以是光学胶形成的 胶层，也可以是压敏胶形成的胶层。
第二保护层650设置于第四胶层640之上，第二保护层650作为显示模组的盖板，可以采用超薄玻璃或者透明聚酰亚胺薄膜等材料制成，以具备良好的弯曲性能。
图9是本申请实施例提供的显示模组仿真弯折测试的示意图。如图9所示，为了验证本申请实施例提供的显示模组降低弯折时的内应力的能力，可以将显示模组以内折叠屏设备机身折叠状态下的状态进行仿真弯折，并且选取一些采样点进行内应力采样。由于第三胶层通常承受的内应力最大，因此本申请实施例在第三胶层选取了两个采样点，分别位于第二开孔520区域外圆角处P1和第二开孔520区域内圆角处P2。另外，本申请实施例还在第四胶层选取了两个采样点，分别位于第二开孔520区域外圆角处P3和第二开孔520区域内圆角处P4。采样结果如表1所示：
Figure PCTCN2022115824-appb-000001
表1
由表1可以看出：在第二开孔区域外圆角处，第三胶层所受到的内应力相比于传统的显示模组方案下降了15％，第四胶层所受到的内应力相比于传统的显示模组方案下降了8％；在第二开孔区域内圆角处，第三胶层所受到的内应力相比于传统的显示模组方案下降了15％，第四胶层所受到的内应力相比于传统的显示模组方案下降了12％。
由此可见，本申请第三实施例提供的显示模组，在弯折时具有更小的更应力，因此，显示模组各层结构之间的贴合状态不会被内应力破坏，显示模组在弯折后不会产生peeling现象，提高了显示模组的可靠性。
下面是本申请的第四实施例。
本申请的第四实施例提供了一种显示模组，与传统的可弯折的显示模组相比，本申请的第四实施例提供的显示模组在弯折时的内应力更小，能够避免peeling产生。
图10是本申请第四实施例提供的显示模组的结构示意图。如图10所示，该显示模组包括：本申请第二实施例及其各实现方式提供的支撑组件、显示面板610、第三胶层620、第一保护层630、第四胶层640和第二保护层650，其中，支撑组件、显示面板610、第三胶层620、第一保护层630、第四胶层640和第二保护层650自下而上堆叠设置。具体来说：
支撑组件可以作为显示模组的最下层，该支撑组件如图7所示可以包括：支撑板100；设置于支撑板100之上的第一胶层200；设置于第一胶层200之上的基材300，基材300通过第一胶层200与支撑板100贴合在一起；设置于基材300之上的第二胶层400；以及贯穿支撑板100和基材300的第一开孔510，和/或，设置于支撑板100上的第二开孔520。
显示面板610设置于第二胶层400之上，显示面板610通过第二胶层400与基材300贴合在一起。显示面板610用于显示图像，显示面板610例如可以是柔性有机发光二极管OLED显示面板，也可以是其他柔性显示面板，例如柔性的Micro LED显示面板、Mini  LED显示面板等。
第三胶层620设置于显示面板610之上，第三胶层620例如可以是光学胶形成的胶层，也可以是压敏胶形成的胶层。
第一保护层630设置于第三胶层620之上，第一保护层630通过第三胶层620与显示面板610贴合在一起。第一保护层630例如可以是偏光层。
第四胶层640设置于第一保护层630之上，第四胶层640例如可以是光学胶形成的胶层，也可以是压敏胶形成的胶层。
第二保护层650设置于第四胶层640之上，第二保护层650作为显示模组的盖板，可以采用超薄玻璃或者透明聚酰亚胺薄膜等材料制成，以具备良好的弯曲性能。
表2是采用图9示出的仿真弯折测试和采样方式，对本申请第四实施例提供的显示模组进行仿真弯折测试和采样的结果。
Figure PCTCN2022115824-appb-000002
表2
由表2可以看出：在第二开孔区域外圆角处，第三胶层所受到的内应力相比于传统的显示模组方案下降了15％，第四胶层所受到的内应力相比于传统的显示模组方案下降了8％；在第二开孔区域内圆角处，第三胶层所受到的内应力相比于传统的显示模组方案下降了12％，第四胶层所受到的内应力相比于传统的显示模组方案下降了9％。
由此可见，本申请第四实施例提供的显示模组，在弯折时具有更小的更应力，因此，显示模组各层结构之间的贴合状态不会被内应力破坏，显示模组在弯折后不会产生peeling现象，提高了显示模组的可靠性。
本申请实施例还提供了一种电子设备，该电子设备例如可以是折叠屏设备、卷轴屏设备、或者任意一种显示屏可弯折的电子设备。该电子设备可以包括一个或者多个显示模组，其中，至少一个显示模组为本申请第三实施例或者第四实施例提供的显示模组，或者至少一个显示模组包含本申请第一实施例或者第二实施例及其各实现方式提供的支撑组件。例如，该电子设备可以是内折叠屏设备，该内折叠屏设备可以包括一个内屏模组和一个外屏模组，其中，内屏模组指的是在机身折叠状态下隐藏的显示模组，外屏模组指的是在机身任何状态下都外露的显示模组，该内屏模组为本申请第三实施例或者第四实施例提供的显示模组。
容易理解的是，本领域技术人员在本申请提供的几个实施例的基础上，可以对本申请的实施例进行结合、拆分、重组等得到其他实施例，这些实施例均没有超出本申请的保护范围。
以上的具体实施方式，对本申请的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上仅为本申请的具体实施方式而已，并不用于限定本申请的保护范围，凡在本申请的技术方案的基础之上，所做的任何修改、等同替换、改进等，均应包括在本申请的保护范围之内。

Claims (22)

  1. 一种支撑组件，其特征在于，包括：
    支撑板、第一胶层、基材和第二胶层；
    所述支撑板、所述第一胶层、所述基材和所述第二胶层自下而上堆叠设置；
    所述基材与所述支撑板通过所述第一胶层贴合，所述支撑组件用于通过所述第二胶层与其他结构贴合，组成折叠屏设备的显示模组；
    所述支撑组件包括弯折区，所述支撑组件用于在所述弯折区产生弯折，所述支撑组件在所述弯折区设置有多个第一开孔，多个所述第一开孔间隔阵列分布，多个所述第一开孔沿着所述支撑板、所述第一胶层、所述基材和所述第二胶层的堆叠方向至少贯穿所述支撑板和所述基材。
  2. 根据权利要求1所述的支撑组件，其特征在于，多个所述第一开孔沿着所述堆叠方向贯穿所述支撑板、所述第一胶层、所述基材和所述第二胶层。
  3. 根据权利要求1所述的支撑组件，其特征在于，多个所述第一开孔设置于所述支撑板和所述基材上，并且沿着所述堆叠方向贯穿所述支撑板和所述基材。
  4. 根据权利要求1-3任一项所述的支撑组件，其特征在于，
    所述第一开孔为条形孔，所述第一开孔的长度方向与所述支撑组件弯折的轴心线平行；
    多个所述第一开孔沿着平行于所述轴心线的方向和垂直于所述轴心线的方向间隔阵列分布。
  5. 根据权利要求4所述的支撑组件，其特征在于，
    所述支撑组件在所述弯折区还设置有多个第二开孔，多个所述第二开孔间隔阵列分布；
    多个所述第二开孔设置于所述支撑板的背对所述第一胶层的板面，并且沿着所述堆叠方向形成一定的深度H，所述深度H小于所述支撑板在所述堆叠方向上的厚度B。
  6. 根据权利要求5所述的支撑组件，其特征在于，
    所述第二开孔为条形孔，所述第二开孔的长度方向与所述轴心线平行；
    所述第二开孔沿着所述轴心线方向从所述支撑板的一侧端面连续延伸至另一侧端面；
    多个所述第二开孔沿着垂直于所述轴心线的方向间隔阵列分布。
  7. 根据权利要求1-6任一项所述的支撑组件，其特征在于，
    所述弯折区包括内弯区，所述支撑组件用于在所述内弯区向所述第二胶层方向弯折，多个所述第一开孔设置于所述内弯区。
  8. 根据权利要求5或6所述的支撑组件，其特征在于，
    所述弯折区包括外弯区，所述支撑组件用于在所述外弯区向所述支撑板方向弯折，多个所述第二开孔设置于所述外弯区。
  9. 根据权利要求1-8任一项所述的支撑组件，其特征在于，
    所述第一胶层和所述第二胶层均为压敏胶。
  10. 一种显示模组，其特征在于，包括：
    权利要求1-9任一项所述的支撑组件、显示面板、第三胶层、第一保护层、第四胶层和第二保护层；
    所述支撑组件、所述显示面板、所述第三胶层、所述第一保护层、所述第四胶层和所述第二保护层自下而上堆叠设置；
    所述显示面板与所述支撑组件的基材通过所述第二胶层贴合，所述第一保护层与所述显示面板通过所述第三胶层贴合，所述第二保护层与所述第一保护层通过所述第四胶层贴合。
  11. 根据权利要求10所述的显示模组，其特征在于，
    所述显示面板为有机发光二极管OLED显示面板。
  12. 根据权利要求10或11所述的显示模组，其特征在于，
    所述第三胶层和所述第四胶层均为光学胶。
  13. 根据权利要求10-12任一项所述的显示模组，其特征在于，
    所述第一保护层为偏光层，所述第二保护层为超薄玻璃或者透明聚酰亚胺薄膜。
  14. 一种电子设备，其特征在于，包括一个或者多个显示模组，其中，至少一个显示模组为权利要求10-13任一项所述的显示模组。
  15. 一种支撑组件，其特征在于，包括：
    支撑板、第一胶层、基材和第二胶层；
    所述支撑板、所述第一胶层、所述基材和所述第二胶层自下而上堆叠设置；
    所述基材与所述支撑板通过所述第一胶层贴合，所述支撑组件用于通过所述第二胶层与其他结构贴合，组成折叠屏设备的显示模组；
    所述支撑组件包括弯折区，所述支撑组件用于在所述弯折区产生弯折，所述支撑组件在所述弯折区设置有多个第一开孔，多个所述第一开孔间隔阵列分布，多个所述第一开孔设置于所述支撑板和所述基材上，并且沿着所述堆叠方向贯穿所述支撑板和所述基材。
  16. 根据权利要求15所述的支撑组件，其特征在于，多个所述第一开孔沿着所述堆叠方向贯穿所述支撑板、所述第一胶层、所述基材和所述第二胶层。
  17. 根据权利要求15或16所述的支撑组件，其特征在于，
    所述第一开孔为条形孔，所述第一开孔的长度方向与所述支撑组件弯折的轴心线平行；
    多个所述第一开孔沿着平行于所述轴心线的方向和垂直于所述轴心线的方向间隔阵列分布。
  18. 根据权利要求17所述的支撑组件，其特征在于，
    所述支撑组件在所述弯折区还设置有多个第二开孔，多个所述第二开孔间隔阵列分布；
    多个所述第二开孔设置于所述支撑板的背对所述第一胶层的板面，并且沿着所述堆叠方向形成一定的深度H，所述深度H小于所述支撑板在所述堆叠方向上的厚度B。
  19. 根据权利要求18所述的支撑组件，其特征在于，
    所述第二开孔为条形孔，所述第二开孔的长度方向与所述轴心线平行；
    所述第二开孔沿着所述轴心线方向从所述支撑板的一侧端面连续延伸至另一侧端面；
    多个所述第二开孔沿着垂直于所述轴心线的方向间隔阵列分布。
  20. 根据权利要求15所述的支撑组件，其特征在于，
    所述弯折区包括内弯区，所述支撑组件用于在所述内弯区向所述第二胶层方向弯折，多个所述第一开孔设置于所述内弯区。
  21. 根据权利要求18所述的支撑组件，其特征在于，
    所述弯折区包括外弯区，所述支撑组件用于在所述外弯区向所述支撑板方向弯折，多个所述第二开孔设置于所述外弯区。
  22. 根据权利要求15所述的支撑组件，其特征在于，
    所述第一胶层和所述第二胶层均为压敏胶。
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