WO2021120351A1 - 一种显示模组及其制备方法及电子装置 - Google Patents
一种显示模组及其制备方法及电子装置 Download PDFInfo
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- WO2021120351A1 WO2021120351A1 PCT/CN2020/070839 CN2020070839W WO2021120351A1 WO 2021120351 A1 WO2021120351 A1 WO 2021120351A1 CN 2020070839 W CN2020070839 W CN 2020070839W WO 2021120351 A1 WO2021120351 A1 WO 2021120351A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Definitions
- the present invention relates to the field of display technology, in particular to a display module, a preparation method thereof, and an electronic device.
- Mini/Micro-LED display panels Compared with liquid crystal display panels and organic light-emitting diode (OLED) display panels, Mini/Micro-LED display panels have strong color reproduction, wide viewing angle, high refresh rate, high contrast, high stability, and low The advantages of power consumption and high gray scale have become the mainstream display technology of the next generation.
- OLED organic light-emitting diode
- the Mini/Micro-LED display panel is bent along the bending area to bend the binding area to the back of the display area to obtain the display module, but the existing display panel is in the bending process, Due to the large stress, it is easy to damage the display area, thereby reducing the product yield.
- the purpose of the present invention is to provide a display module, a manufacturing method thereof, and an electronic device, which can reduce damage to the display area and improve the product yield.
- the present invention provides a display panel, including:
- a display panel, the cross-sectional structure of the display panel includes:
- a curved flexible drive substrate which includes a display area, a bending area, and a binding area; wherein the curved flexible drive substrate has a cavity;
- the display unit is bound in the display area; the display unit includes a plurality of miniature light-emitting diodes;
- the supporting body is arranged in the cavity, and the shape of the longitudinal section of the supporting body is a rectangle with rounded corners.
- the present invention also provides a method for manufacturing a display module, which includes:
- the micro light emitting diode chip Transferring the micro light emitting diode chip to the flexible drive substrate and packaging it to obtain a display panel;
- the micro light emitting diode chip includes a plurality of micro light emitting diodes;
- a support body is attached to the side of the display panel located in the display area away from the micro light emitting diode chip; the longitudinal section of the support body is a rectangle with rounded corners;
- the bending area of the display panel is bent, and the display panel is attached to the support body.
- the present invention also provides an electronic device, which includes the above-mentioned display module.
- the display module and the preparation method thereof and the electronic device of the present invention include a support body; a display panel, the cross-sectional structure of the display panel includes: a curved flexible drive substrate, which includes a display area, a curved area, and a binding area;
- the curved flexible drive substrate has a cavity; the display unit is bound in the display area; the display unit includes a plurality of micro light-emitting diodes; wherein the support body is arranged in the cavity, and the support body
- the shape of the longitudinal cross-section is a rounded rectangle; due to the use of a rounded rectangular support body, the bending area is prevented from being subjected to greater stress, thereby avoiding damage to the display area, thereby improving the product yield.
- FIG. 1 is a schematic structural diagram of the first step of the manufacturing method of the display module of the present invention
- FIG. 2 is a schematic structural diagram of the second step of the manufacturing method of the display module of the present invention.
- FIG. 3 is a schematic diagram of the structure of the third step of the manufacturing method of the display module of the present invention.
- FIG. 4 is a schematic structural diagram of the fourth step of the manufacturing method of the display module of the present invention.
- FIG. 5 is a schematic diagram of the structure of the fifth step of the manufacturing method of the display module of the present invention.
- FIG. 6 is a schematic structural diagram of the sixth step of the manufacturing method of the display module of the present invention.
- FIG. 7 is a schematic structural diagram of the seventh step of the manufacturing method of the display module of the present invention.
- Figure 8 is a schematic diagram of the structure of the support of the present invention.
- FIG. 9 is a schematic diagram of the structure of the display device of the present invention.
- FIG. 1 is a schematic structural diagram of the first step of the manufacturing method of the display module of the present invention.
- the present invention provides a method for manufacturing a display module, including:
- a flexible drive substrate 12 is prepared on a glass substrate 11, where the flexible drive substrate 12 includes a flexible substrate and a drive layer provided on the flexible substrate.
- the flexible substrate is a bendable substrate made of flexible materials, which has the characteristics of being stretchable, bendable or bendable, and its materials can include but not limited to polyimide (PI), polyterephthalate Polyethylene Terephthalate (PET) and Polycarbonate (PC) can also be other flexible materials, which are not limited here.
- the thickness of the flexible substrate can be set according to empirical values.
- the driving layer may include a plurality of thin film transistors.
- the cross-sectional structure of the driving layer includes an active layer, a gate layer, a source and drain layer, a gate insulating layer disposed between the active layer and the gate layer, and a gate insulating layer disposed between the gate and the gate.
- the thin film transistor may be one of a top gate structure thin film transistor, a bottom gate structure thin film transistor, a single gate structure thin film transistor, and a double gate structure thin film transistor, which is not limited herein.
- S102 Transfer a Mini/Micro-LED chip to the flexible drive substrate, and package it to obtain a display panel;
- the Mini/Micro-LED chip 13 includes a plurality of micro-LEDs 131, wherein the Mini/Micro-LED chip 13 is transferred to the flexible drive substrate 12, Its precision packaging is used to obtain a flexible miniature light-emitting diode display panel.
- the Mini/Micro-LED chip 13 is electrically connected to the flexible driving substrate 12.
- a packaging film 14 may be used to package the micro light emitting diode chip 13.
- the flatness range of the packaging film 14 must reach ⁇ 10 ⁇ m.
- the chip on film 15 is bound in the binding area 103 of the display panel.
- the outer pin bonding (OLB) area is protected by using a flexible protective film 16, and the flexible protective film 16 can support the flexible driving substrate 12 below.
- the glass substrate 11 is removed by a laser lift off (LLO) process
- the flexible drive substrate 12 adjacent to the chip on film can also be removed by a laser cutting process
- a part, that is, a part of the flexible drive substrate 12 at both ends is cut off, so that the width of the flexible drive substrate 12 is narrowed.
- S106 Attach the support body to the side of the display panel located in the display area away from the micro light emitting diode chip 13;
- the colloid can be Optically Clear Adhesive (OCA).
- the bending area 102 is bent through a pad bending process, so that the binding area 103 is bent below the support body 20, and then the bent flexible drive substrate 12 is attached to the support body 20 Together and fix it to obtain a display module.
- the chip on film 15 in the bonding area 103 is also connected to a driving circuit board, and the driving circuit board is provided with a driving chip.
- the bonding method can use double-sided tape or glue for bonding.
- the present invention also provides a display module, which includes a display panel 10 and a supporting body 20.
- the cross-sectional structure of the display panel 10 includes: a curved flexible drive substrate 12 and a display unit 30.
- the flexible driving substrate 12 may include a flexible substrate and a driving layer provided on the flexible substrate.
- the bent flexible drive substrate 12 includes a display area 101, a bending area 102, and a binding area 103; the bent flexible drive substrate 12 has a cavity; when the binding area 103 passes through the bending area 102 from the support body 20 The first side is bent to the second side of the support body 20 to form the cavity. That is, the binding area 103 is bent from the upper surface of the support body 20 to the lower surface of the support body 20 through the bending area 102 to form the cavity.
- the display unit 30 is bound in the display area 101; the display unit 30 includes a plurality of micro light emitting diodes 131; in one embodiment, the display unit 30 further includes an encapsulation layer 14 that covers the plurality of micro light emitting diodes 131, used to protect the micro light emitting diode 131, the encapsulation layer 14 may be an alternating layer of an inorganic layer and an organic layer.
- the supporting body 20 is disposed in the cavity, and the shape of the longitudinal cross section of the supporting body 20 is a rounded rectangle. In one embodiment, in order to prevent the splicing seam from exceeding the display area, the size of the support body 20 is smaller than the size of the display area 101.
- the support body 20 is attached to the inner side wall of the cavity 20.
- the display area 101 is attached to the surface of the first side (upper side) of the support body 20; the bending area 102 is attached to the side wall of the support body 20; The binding area 103 is attached to the surface of the second side (lower side) of the support body 20.
- the support body 20 includes a support plate 21 and may also include a heat dissipation layer 22.
- the material of the heat dissipation layer 23 may be copper.
- the material of the support plate 21 is one of glass, polyimide, polyethylene terephthalate, or polyaluminum chloride.
- the thickness of the support plate 21 is less than the preset thickness, and the preset thickness is, for example, 500 um, so that the thickness of the support can be reduced.
- the present invention also provides a display device, including: two display modules 10 described above, and the two display modules are spliced together to form a display device. It is understandable that the number of display modules can be more than two.
- the display device may further include a back plate (not shown in the figure), the back plate has an accommodating cavity; at least two of the display modules 10 are spliced in the accommodating cavity.
- the present invention adopts a rounded rectangular support body, not only a display module with a very narrow frame is realized, but also a smooth transition of the bending area can be made, and the bending area can be prevented from being affected by a large stress and damaging the display area, thereby improving the product quality. rate.
- the display module and the preparation method thereof and the electronic device of the present invention include a support body; a display panel, the cross-sectional structure of the display panel includes: a curved flexible drive substrate, which includes a display area, a curved area, and a binding area;
- the curved flexible drive substrate has a cavity; the display unit is bound in the display area; the display unit includes a plurality of micro light-emitting diodes; wherein the support body is arranged in the cavity, and the support body
- the shape of the longitudinal cross-section is a rounded rectangle; due to the use of a rounded rectangular support body, the bending area is prevented from being subjected to greater stress, thereby avoiding damage to the display area, thereby improving the product yield.
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Abstract
本发明提供一种显示模组及其制备方法及电子装置，该显示模组包括：弯曲的柔性驱动基板，其包括显示区域、弯曲区域以及绑定区域；其中所述弯曲的柔性驱动基板具有一腔体；显示单元，绑定在所述显示区域内；所述显示单元包括多个微型发光二极管；其中支撑体设于所述腔体内，所述支撑体的纵向截面的形状为圆角矩形。
Description
本发明涉及显示技术领域，特别是涉及一种显示模组及其制备方法及电子装置。
相比于液晶显示面板和有机发光二极管（OLED）显示面板，微型发光二极管（Mini/Micro-LED）显示面板由于具有色彩还原性强、宽视角、高刷新率、高对比度、高稳定性、低功耗、高灰度等优势，成为下一代主流的显示技术。
目前将微型发光二极管（Mini/Micro-LED）显示面板沿弯折区域进行弯曲，以将绑定区域弯折到显示区的背面，得到显示模组，但是现有的显示面板在弯曲过程中，由于所受应力较大，容易损坏显示区域，从而降低了产品良率。
因此，有必要提供一种显示模组及其制备方法及电子装置，以解决现有技术所存在的问题。
本发明的目的在于提供一种显示模组及其制备方法及电子装置，能够减避免显示区域受损，提高了产品良率。
为解决上述技术问题，本发明提供一种显示面板，包括：
支撑体；
显示面板，所述显示面板的截面结构包括：
弯曲的柔性驱动基板，其包括显示区域、弯曲区域以及绑定区域；其中所述弯曲的柔性驱动基板具有一腔体；
显示单元，绑定在所述显示区域内；所述显示单元包括多个微型发光二极管；
其中所述支撑体设于所述腔体内，所述支撑体的纵向截面的形状为圆角矩形。
本发明还提供一种显示模组的制备方法，其包括：
在玻璃基板上制备柔性驱动基板；
将微型发光二极管芯片转移至所述柔性驱动基板上，并对其进行封装，得到显示面板；所述微型发光二极管芯片包括多个微型发光二极管；
将覆晶薄膜绑定在所述显示面板的绑定区域内；
在所述显示面板上设置柔性保护膜；
去除所述柔性驱动基板下方的玻璃基板；
在位于显示区域的显示面板中远离微型发光二极管芯片的一侧贴合支撑体；所述支撑体的纵向截面的形状为圆角矩形；
将所述显示面板的弯曲区域弯曲，并将显示面板与所述支撑体进行贴合。
本发明还提供一种电子装置，其包括上述显示模组。
本发明的显示模组及其制备方法及电子装置，包括支撑体；显示面板，所述显示面板的截面结构包括：弯曲的柔性驱动基板，其包括显示区域、弯曲区域以及绑定区域；其中所述弯曲的柔性驱动基板具有一腔体；显示单元，绑定在所述显示区域内；所述显示单元包括多个微型发光二极管；其中所述支撑体设于所述腔体内，所述支撑体的纵向截面的形状为圆角矩形；由于采用圆角矩形的支撑体，避免弯折区域所受应力较大，从而避免损坏显示区域，进而提高了产品良率。
图1为本发明显示模组的制作方法第一步的结构示意图；
图2为本发明显示模组的制作方法第二步的结构示意图；
图3为本发明显示模组的制作方法第三步的结构示意图；
图4为本发明显示模组的制作方法第四步的结构示意图；
图5为本发明显示模组的制作方法第五步的结构示意图；
图6为本发明显示模组的制作方法第六步的结构示意图；
图7为本发明显示模组的制作方法第七步的结构示意图；
图8为本发明支撑体的结构示意图；
图9为本发明显示装置的结构示意图
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是以相同标号表示。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别不同对象，而不是用于描述特定顺序。此外，术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。
请参照图1至图9，图1为本发明显示模组的制作方法第一步的结构示意图。
在一种实施例中，本发明提供一种显示模组的制备方法，包括：
S101、在玻璃基板上制备柔性驱动基板；
例如，如图1所示，在玻璃基板11上制备柔性驱动基板12，其中柔性驱动基板12包括柔性衬底以及设于柔性衬底上的驱动层。柔性衬底是通过柔性材料制备形成的可弯曲的衬底基板，具有可伸展、可弯曲或可弯曲等特性，其材料可以包括但不限于聚酰亚胺(Polyimide，PI)、聚对苯二甲酸乙二醇酯(Polyethylene Terephthalate，PET)以及聚碳酸酯(Polycarbonate，PC)，还可以是其他柔性材料，在此不做限制。柔性衬底的厚度可以根据经验值设定。驱动层可以包括多个薄膜晶体管，驱动层的截面结构包括有源层、栅极层、源漏极层、设置在有源层和栅极层之间的栅极绝缘层以及设置在栅极与源漏极层之间的层间绝缘层。在本实施例中，薄膜晶体管可以为顶栅结构的薄膜晶体管、底栅结构的薄膜晶体管、单栅极结构薄膜晶体管、双栅极结构薄膜晶体管中的一种，在此不做限定。
S102、将微型发光二极管（Mini/Micro-LED）芯片转移至所述柔性驱动基板上，并对其进行封装，得到显示面板；
如图2所示，微型发光二极管（Mini/Micro-LED）芯片13包括多个微型发光二极管131，其中将微型发光二极管（Mini/Micro-LED）芯片13转移至所述柔性驱动基板12上，对其精密封装获得柔性微型发光二极管显示面板。微型发光二极管（Mini/Micro-LED）芯片13与所述柔性驱动基板12进行电性连接。
在一实施方式中，可采用封装膜14对所述微型发光二极管芯片13进行封装。该封装膜14的平整度范围须达到±10µm。
S103、将覆晶薄膜绑定在显示面板的绑定区域内；
如图3所示，将覆晶薄膜15绑定在显示面板的绑定区域103内。
S104、在显示面板上设置柔性保护膜；
如图4所示，通过使用柔性保护膜16对外引脚接合(OLB)区进行保护，且柔性保护膜16能够对下方的柔性驱动基板12进行支撑。
S105、去除显示面板的柔性驱动基板下的玻璃基板；
如图5所示，在一实施方式中，通过激光整面剥离工艺（LLO，Laser lift off）去除玻璃基板11，此外还可通过激光切割工艺将与覆晶薄膜相邻的柔性驱动基板12切除一部分，也即将位于两端的柔性驱动基板12切除掉一部分，使得柔性驱动基板12的宽度变窄。
S106、在位于显示区域的显示面板中远离微型发光二极管芯片13的一侧贴合支撑体；
如图6所示，在显示区域101的柔性驱动基板12的下表面涂布胶体，在支撑体20的上表面涂布胶体，然后将支撑体20的上表面和柔性驱动基板12的下表面贴合在一起，该胶体可以为光学胶（Optically Clear Adhesive，OCA）。
S107、将显示面板的弯曲区域弯曲，并将显示面板与支撑体进行贴合。
如图7所示，通过垫弯（pad bending）工艺对弯折区域102进行弯折，使得绑定区域103弯曲至支撑体20的下方，然后将弯折的柔性驱动基板12与支撑体20贴合固定，获得显示模组。绑定区域103中的覆晶薄膜15还与驱动电路板连接，驱动电路板上设置有驱动芯片。贴合方式可以采用双面胶带或胶水进行贴合。
如图7所示，本发明还提供一种显示模组，其包括：显示面板10和支撑体20。
所述显示面板10的截面结构包括：弯曲的柔性驱动基板12和显示单元30。所述柔性驱动基板12可包括柔性衬底和设于所述柔性衬底上的驱动层。
弯曲的柔性驱动基板12包括显示区域101、弯曲区域102以及绑定区域103；其中弯曲的柔性驱动基板12具有一腔体；当所述绑定区域103通过弯曲区域102从所述支撑体20的第一侧弯曲至所述支撑体20的第二侧形成该腔体。也即所述绑定区域103通过弯曲区域102从所述支撑体20的上表面弯曲至所述支撑体20的下表面形成该腔体。
显示单元30绑定在所述显示区域101内；所述显示单元30包括多个微型发光二极管131；在一实施方式中，显示单元30还包括封装层14，封装层14覆盖多个微型发光二极管131，用于保护微型发光二极管131，封装层14可为无机层和有机层的交替层。所述支撑体20设于所述腔体内，所述支撑体20的纵向截面的形状为圆角矩形。在一实施方式中，为了避免拼接缝超过显示区域，所述支撑体20的尺寸小于所述显示区域101的尺寸。
为了提高显示模组的稳定性，所述支撑体20与所述腔体20的内侧壁贴合。在一实施方式中，所述显示区域101与所述支撑体20的第一侧（上侧）的表面贴合；所述弯折区域102与所述支撑体20的侧壁贴合；所述绑定区域103与所述支撑体20的第二侧（下侧）的表面贴合。
如图8所示，所述支撑体20包括支撑板21，还可包括散热层22。为了便于显示模组进行散热，所述散热层23的材料可为铜。支撑板21的材料为玻璃、聚酰亚胺、聚对苯二甲酸乙二醇酯或聚合氯化铝中的一种。其中所述支撑板21的厚度小于预设厚度，预设厚度比如为500um，从而可以减小支撑体的厚度。
如图9所示，本发明还提供一种显示装置，包括：两个上述显示模组10，且两个显示模组彼此拼接在一起组成显示装置。可以理解的显示模组的数量可以为两个以上。
其中所述显示装置还可包括背板（图中未示出），所述背板具有一容纳腔；至少两个所述显示模组10在所述容纳腔内拼接。
由于本发明采用圆角矩形的支撑体，不仅实现了极窄边框的显示模组，而且能够使得弯折区域平滑过渡，避免弯折区域所受应力较大而影响损坏显示区域，提高了产品良率。
本发明的显示模组及其制备方法及电子装置，包括支撑体；显示面板，所述显示面板的截面结构包括：弯曲的柔性驱动基板，其包括显示区域、弯曲区域以及绑定区域；其中所述弯曲的柔性驱动基板具有一腔体；显示单元，绑定在所述显示区域内；所述显示单元包括多个微型发光二极管；其中所述支撑体设于所述腔体内，所述支撑体的纵向截面的形状为圆角矩形；由于采用圆角矩形的支撑体，避免弯折区域所受应力较大，从而避免损坏显示区域，进而提高了产品良率。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。
Claims (20)
- 一种显示模组，其包括：支撑体；以及显示面板，所述显示面板的截面结构包括：弯曲的柔性驱动基板，其包括显示区域、弯曲区域以及绑定区域；其中所述弯曲的柔性驱动基板具有一腔体；显示单元，绑定在所述显示区域内；所述显示单元包括多个微型发光二极管；其中所述支撑体设于所述腔体内，所述支撑体的纵向截面的形状为圆角矩形。
- 根据权利要求1所述的显示模组，其中所述支撑体与所述腔体的内侧壁贴合。
- 根据权利要求2所述的显示模组，其中所述显示区域与所述支撑体的第一侧的表面贴合；所述弯折区域与所述支撑体的侧壁贴合；所述绑定区域与所述支撑体的第二侧的表面贴合。
- 根据权利要求1所述的显示模组，其中所述支撑体还包括支撑板和散热层，所述散热层设于所述支撑板的下方。
- 根据权利要求4所述的显示模组，其中所述支撑板的材料包括玻璃、聚酰亚胺、聚对苯二甲酸乙二醇酯以及聚合氯化铝中的至少一种。
- 根据权利要求4所述的显示模组，其中所述支撑板的厚度小于预设厚度。
- 根据权利要求1所述的显示模组，其中所述支撑体的尺寸小于所述显示区域的尺寸。
- 根据权利要求1所述的显示模组，其中所述柔性驱动基板包括柔性衬底和设于所述柔性衬底上的驱动层。
- 一种显示模组的制备方法，其包括：在玻璃基板上制备柔性驱动基板；将微型发光二极管芯片转移至所述柔性驱动基板上，并对其进行封装，得到显示面板；所述微型发光二极管芯片包括多个微型发光二极管；将覆晶薄膜绑定在所述显示面板的绑定区域内；在所述显示面板上设置柔性保护膜；去除所述柔性驱动基板下方的玻璃基板；在位于显示区域的显示面板中远离微型发光二极管芯片的一侧贴合支撑体；所述支撑体的纵向截面的形状为圆角矩形；以及将所述显示面板的弯曲区域弯曲，并将显示面板与所述支撑体进行贴合。
- 根据权利要求9所述的显示模组的制备方法，其中所述支撑体与所述腔体的内侧壁贴合。
- 根据权利要求9所述的显示模组的制备方法，其中所述支撑体还包括支撑板和散热层，所述散热层设于所述支撑板的下方。
- 根据权利要求9所述的显示模组的制备方法，其中所述支撑体的尺寸小于所述显示区域的尺寸。
- 一种电子装置，其包括：至少两个如显示模组，其包括：支撑体；显示面板，所述显示面板的截面结构包括：弯曲的柔性驱动基板，其包括显示区域、弯曲区域以及绑定区域；其中所述弯曲的柔性驱动基板具有一腔体；显示单元，绑定在所述显示区域内；所述显示单元包括多个微型发光二极管；其中所述支撑体设于所述腔体内，所述支撑体的纵向截面的形状为圆角矩形。
- 根据权利要求13所述的电子装置，其中所述支撑体与所述腔体的内侧壁贴合。
- 根据权利要求14所述的电子装置，其中所述显示区域与所述支撑体的第一侧的表面贴合；所述弯折区域与所述支撑体的侧壁贴合；所述绑定区域与所述支撑体的第二侧的表面贴合。
- 根据权利要求13所述的电子装置，其中所述支撑体还包括支撑板和散热层，所述散热层设于所述支撑板的下方。
- 根据权利要求16所述的电子装置，其中所述支撑板的材料包括玻璃、聚酰亚胺、聚对苯二甲酸乙二醇酯以及聚合氯化铝中的至少一种。
- 根据权利要求16所述的电子装置，其中所述支撑板的厚度小于预设厚度。
- 根据权利要求13所述的电子装置，其中所述支撑体的尺寸小于所述显示区域的尺寸。
- 根据权利要求13所述的电子装置，其中所述柔性驱动基板包括柔性衬底和设于所述柔性衬底上的驱动层。
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| CN113763819B (zh) * | 2021-09-14 | 2023-05-16 | 京东方科技集团股份有限公司 | 支撑结构及其制备方法、显示装置 |
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