WO2020192038A1 - 一种柔性显示模组、柔性显示屏和胶带 - Google Patents

一种柔性显示模组、柔性显示屏和胶带 Download PDF

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Publication number
WO2020192038A1
WO2020192038A1 PCT/CN2019/106184 CN2019106184W WO2020192038A1 WO 2020192038 A1 WO2020192038 A1 WO 2020192038A1 CN 2019106184 W CN2019106184 W CN 2019106184W WO 2020192038 A1 WO2020192038 A1 WO 2020192038A1
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area
layer
flexible display
bonding
bonding area
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PCT/CN2019/106184
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English (en)
French (fr)
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丁立薇
廖富
赵永丰
王留洋
朱召吉
单奇
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云谷（固安）科技有限公司
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Publication of WO2020192038A1 publication Critical patent/WO2020192038A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

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  • This application relates to the field of flexible display technology, and in particular to a flexible display module, a flexible display screen and an adhesive tape.
  • the flexible OLED display includes a flexible display screen and a driver chip, which are electrically connected through bonding.
  • a driver chip which are electrically connected through bonding.
  • it is very easy to cause the area around the bonding area to warp, and then cause the metal wire to break. Damage to the flexible display.
  • the embodiments of the present application are dedicated to providing a flexible display module, a flexible display screen and an adhesive tape to solve the problem of easy warping of the area around the bonding area of the flexible display screen in the prior art.
  • the first aspect of the present application provides a flexible display module, including a flexible substrate, including a first bonding area and a first non-bonding area located around the first bonding area; a flip chip film, the bonding is connected to the first Bonding area; and the first reinforcement layer, covering the first bonding area and the non-bonding area to reduce the thickness difference between the first bonding area and the first non-bonding area.
  • the second aspect of the present application provides a flexible display screen, including the above-mentioned flexible display module.
  • a third aspect of the present application provides an adhesive tape including: a first area; and a second area surrounding the first area, the thickness of the first area being smaller than the thickness of the second area.
  • the first reinforcement layer is provided to cover the first bonding area and the first non-bonding area around the first bonding area to reduce the size of the first state.
  • the thickness difference between the fixed area and the first non-bonded area reduces the probability of warping in the first non-bonded area located around the first bonded area and improves the reliability of the flexible display module.
  • FIG. 1a is a schematic structural diagram of a flexible display module provided by the first embodiment of this application.
  • Fig. 1b is a left side view of the flexible display module shown in Fig. 1a.
  • FIG. 2a is a schematic structural diagram of a flexible display module provided by the second embodiment of this application.
  • Fig. 2b is a schematic cross-sectional view of the flexible display module shown in Fig. 2a along the line L 1 -L 2 .
  • FIG. 3a is a schematic diagram showing the structure of an adhesive tape provided by the third embodiment of the application.
  • Figure 3b is a schematic cross-sectional view of the tape shown in Figure 3a along the line L 3 -L 4 .
  • FIG. 4 is a schematic structural diagram of a flexible display module provided by a fourth embodiment of this application.
  • FIG. 1a is a schematic structural diagram of a flexible display module provided by the first embodiment of this application.
  • Fig. 1b is a left side view of the flexible display module shown in Fig. 1a.
  • the flexible display module 100 includes a flexible display panel 10 and a chip on film 20 connected by bonding.
  • the flexible display panel 10 includes a flexible substrate 11, the flexible substrate 11 includes a display region. 1 S and S in addition to the non-display region of the display region other than the 1 S 2, S display region.
  • the organic light emitting layer 13 positioned on layer 12 of the drive unit, a drive unit and a cladding layer 12 and the organic light emitting layer 13 and the package substrate 11 in contact with the flexible layer 14 comprises a non-display area S 2 P pin region, a flip-chip
  • the film 20 is bonded to the pin area P to form the bonding area Q of the flexible display module 100.
  • the flexible substrate 11 may be, for example, ultra-thin glass, metal film, organic polymer film, etc.
  • the organic polymer film mentioned here includes polyimide film (PI), polyethylene film, polypropylene film, Any of polystyrene film, polycarbonate film, polyterephthalate plastic film, and polyethersulfone resin film.
  • the encapsulation layer 14 includes a stacked organic layer and an inorganic layer. The application does not limit the material of the flexible substrate 11 and the specific structure of the packaging layer 14.
  • the flexible display module of FIG. 1a and FIG. 1b 100, Q is the thickness of the bonding area must be greater than the non-display region S 2 in the thickness of the non-bonding region D in addition to the bonding region Q, so that the entire subsequent terminal During the machine assembly process, the uneven forces on the bonding area Q and the non-bonding area D caused the non-bonding area D around the bonding area Q to warp.
  • FIG. 2a is a schematic structural diagram of a flexible display module provided by the second embodiment of this application.
  • Fig. 2b is a schematic cross-sectional view of the flexible display module shown in Fig. 2a along the line L 1 -L 2 .
  • the flexible display module 200 differs from the flexible display module 100 shown in FIGS.
  • the flexible display module 200 further includes a reinforcing layer 30, which 30 covers the bonding area Q and the non-bonding area D located around the bonding area Q to reduce the thickness difference between the bonding area Q and the non-bonding area D, that is, the thickness distribution of the reinforcing layer 30 is uneven to realize the opposition Compensation for the thickness difference between the fixed area Q and the non-bonded area D.
  • the area of the reinforcing layer 30 corresponding to the bonding area Q is thin, and the area corresponding to the non-bonding area D is thick.
  • the reinforcement layer 30 covers the bonding area Q and the non-bonding area D so that the thickness difference between the bonding area Q and the non-bonding area D is reduced to zero, that is, the superimposed reinforcement
  • the thickness of the bonded area Q and the non-bonded area D after the layer 30 are equal.
  • the probability of warping of the non-bonding area D around the bonding area Q can be minimized, thereby avoiding metal wire breakage.
  • the non-bonding region D comprises only non-display area in the partial region S 2 in addition to the bonding region Q.
  • the x-axis direction is the longitudinal direction
  • the y-axis direction is the width direction
  • the length of the reinforcing layer 30 is equal to the length of the flexible substrate 11
  • the reinforcing layer 30 is less than the width of the non-display region 2a of S 2
  • the width is greater than the width of the bonding area Q, that is, the reinforcing layer 30 covers the entire edge area where the bonding area Q on the flexible substrate 11 is located.
  • the length of the reinforcing layer 30 is less than the length of the flexible substrate 11 and larger than the length of the bonding region Q
  • the width of the reinforcing layer is equal to the width of the non-display area S 2 30 and greater than the width of the bonding region Q.
  • the non-bonding area D includes all areas in the non-display area S 2 except for the bonding area Q.
  • the reinforcement layer 30 covers the bonding area Q and the part of the non-bonding area D around the bonding area Q, the partial coverage of the non-bonding area D is set reasonably according to the actual situation. , This application does not limit this.
  • the probability of warping of the non-bonding area D located around the bonding area Q can be reduced, thereby improving the reliability of the flexible display module.
  • FIG. 3a is a schematic diagram showing the structure of an adhesive tape provided by the third embodiment of the application.
  • Figure 3b is a schematic cross-sectional view of the tape shown in Figure 3a along the line L 3 -L 4 .
  • the tape 300 is equivalent to the reinforcing layer 30 in FIGS. 2a and 2b.
  • the tape 300 shown in FIG. 3a can be cut according to actual needs, for example, cut along the line L3-L4, and use the upper half as The reinforcing layer 30 is attached to the corresponding position shown in FIG. 2a.
  • the adhesive tape 300 includes a first area E 1 and a second area E 2 except the first area E 1.
  • the first area E 1 corresponds to the bonding area Q
  • the second area E 2 Corresponding to the non-bonding area D, the thickness of the first area E 1 is smaller than the thickness of the second area E 2 .
  • the number of film layers in the first area E1 of the tape 300 is smaller than the number of film layers in the second area E2. In this way, it is easier to control the thickness of each film layer and simplify the preparation process.
  • the first area E1 and the second area E2 of the adhesive tape 300 may be set to have an equal number of film layers, and the thickness of at least one film layer in the first area E1 and the second area E2 may be different. The uneven distribution of the thickness of the tape 300 is realized.
  • the present invention does not limit the number of film layers included in the first area E1 and the second area E2 in the adhesive tape 300.
  • the first area E1 includes a substrate layer 31, and the second area E2 includes a substrate layer 31 and an adhesive layer 32 that are stacked.
  • the base material layer 31 may be formed of polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyacrylate, and polyetherimide.
  • the adhesive layer 32 can be an optically transparent adhesive (Optically Clear Adhesive, OCA).
  • both the first area E1 and the second area E2 include a substrate layer 31 and an adhesive layer 32, and the thickness of the adhesive layer 32 in the first area E1 is smaller than the thickness of the adhesive layer 32 in the second area E2 .
  • the corresponding adhesive tape 300 above the flip-chip film 20 also includes an adhesive layer 32, so that the adhesive tape 300 can be secured Better fit with the film layer underneath, improving reliability.
  • the thickness of the adhesive layer 32 is equal to the thickness of the chip on film 20.
  • the sum of the thickness of the base layer 31, the thickness of the adhesive layer 32, and the thickness of the flexible substrate 11 is equal to the base layer 31
  • the sum of the thickness of the thickness, the thickness of the chip on film 20, and the thickness of the flexible substrate 11 makes the thickness distribution of the bonding area Q and the surrounding non-bonding area D uniform after the tape 300 is attached.
  • the thickness of the adhesive glue is considered, the thickness of the glue layer 32 should be It is greater than the thickness of the chip on film 20, specifically the thickness of the adhesive layer 32 is equal to the sum of the thickness of the chip on film 20 and the thickness of the bonding adhesive.
  • the adhesive tape 300 further covers the back surface of the flexible substrate 11 (that is, the surface of the flexible substrate 11 facing away from the chip-on-chip film 20), and the adhesive tape 300 covering the back surface of the flexible substrate 11 has a uniform thickness.
  • the adhesive tape 300 covering the back surface of the flexible substrate 11 has a uniform thickness.
  • only the first area E1 of the tape 300 or only the second area E2 can be used to cover the back of the flexible substrate 11, so that the part of the tape 300 on the back of the flexible substrate 11 is equivalent to a support film, which can further reduce the probability of edge warping .
  • the adhesive tape 300 is only an exemplary implementation form of the reinforcement layer 30, and the present invention does not limit the specific implementation form of the reinforcement layer 300.
  • FIG. 4 is a schematic structural diagram of a flexible display module provided by a fourth embodiment of this application.
  • the flexible display module 400 is based on the flexible display module 200 shown in FIG. 2a and FIG. 2b, and further includes a flexible printed circuit board (Flexible Printed Circuit Board, which is bonded and connected to the flip chip film 20).
  • FPC Flexible Printed Circuit Board
  • the bonding area Q, the non-bonding area D, and the reinforcing layer 30 corresponding to the bonding area Q shown in FIGS. 2a and 2b are respectively referred to as the first bonding area Q1
  • the first non-bonding area D1 and the first reinforcing layer 51, the reinforcing layer corresponding to the bonding area between the flexible circuit board 40 and the chip on film 20 is called the second reinforcing layer 52.
  • the flexible circuit board 40 includes an edge area, the edge area includes a pin area and a non-pin area located around the pin area, and the flip chip 20 is bonded to the pin area.
  • the non-lead area forms a second non-bonding area D2 located around the second bonding area Q2, and the second reinforcing layer 52 covers
  • the second bonding area Q2 and the second non-bonding area D2 are used to reduce the thickness difference between the second bonding area Q2 and the second non-bonding area D2.
  • the thickness composition of the first reinforcement layer 51 and the second reinforcement layer 52 are the same.
  • the first reinforcing layer 51 is actually used to compensate the thickness of the chip on film 20 on the flexible substrate 11.
  • the second non-bonding area D2 is located on the flexible circuit board 40.
  • the second reinforcing layer 52 is actually used to compensate the thickness of the chip on film 20 on the flexible circuit board 40. It can be seen that both the first reinforcement layer 51 and the second reinforcement layer 52 are used to compensate the thickness of the chip on film 20.
  • the thickness composition of the first reinforcement layer 51 and the second reinforcement layer 52 can be set to be the same, that is, the first The thickness of each film layer in the reinforcing layer 51 and the thickness of each film layer in the second reinforcing layer 52 are respectively equal, which facilitates the formulation of uniform standards and facilitates the industrial production of the reinforcing layer.
  • the thickness composition of the first reinforcing layer 51 and the second reinforcing layer 52 may also be different.
  • the material composition of the first reinforcement layer 51 and the second reinforcement layer 52 are different; or the number of film layers of the first reinforcement layer 51 and the second reinforcement layer 52 are different; or the first reinforcement layer
  • the thickness of at least one of the film layer 51 and the second reinforcing layer 52 is different. Since the hardness of the flexible substrate 11, the chip-on-chip 20, and the flexible circuit board 40 are all different, the greater the hardness difference between the two bonded to each other, the greater the probability and degree of edge warping, so it can be set
  • the material composition of the first reinforcing layer 51 and the second reinforcing layer 52 are different to match the hardness difference between the first bonding zone Q1 and the second bonding zone Q2.
  • the hardness of the flexible circuit board 40, the flexible substrate 11, and the chip-on-chip 20 decreases in order. Therefore, the first non-bonding area D1 is compared with the second non-bonding area D2. D1 is more prone to warpage.
  • the hardness of the first reinforcement layer 51 can be higher than that of the second reinforcement layer 52. This higher hardness can be achieved by using a material with higher hardness, or It can be achieved by increasing the thickness of the film layer, or by increasing the number of film layers.
  • the bonding position involved in the bonding method of bonding the chip on film is taken as an example, including the bonding position between the flexible substrate 11 and the chip on film 20, As well as the bonding position between the chip on glass 20 and the flexible circuit board 40, those skilled in the art should understand that the reinforcing layer can also be applied to other bonding positions, such as bonding the chip on the substrate (Chip On Glass, COG).
  • the bonding position between the chip and the substrate is driven, or the flexible circuit board is bonded to the glass (FPC On Glass) bonding method in the bonding position between the flexible circuit board and the substrate.
  • the present application also provides a flexible display screen, including the flexible display module provided in any of the above embodiments.
  • the probability of edge warping can be reduced, and the reliability of the flexible display screen is higher.

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  • General Physics & Mathematics (AREA)
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

一种柔性显示模组、柔性显示屏和胶带，柔性显示模组包括柔性基板，包括第一邦定区和位于所述第一邦定区周围的第一非邦定区；覆晶薄膜，邦定连接在所述第一邦定区；及第一补强层，覆盖所述第一邦定区和所述第一非邦定区以缩小所述第一邦定区和所述第一非邦定区之间的厚度差。通过设置覆盖邦定区和邦定区周围的非邦定区的补强层来缩小二者的厚度差，可以降低邦定区周围区域发生翘曲的概率。

Description

一种柔性显示模组、柔性显示屏和胶带 技术领域
本申请涉及柔性显示技术领域，具体涉及一种柔性显示模组、柔性显示屏和胶带。
背景技术
柔性有机发光二极管显示器(Organic Light Emitting Display,OLED)作为新一代移动电子产品的显示装置而备受关注。柔性OLED显示器包括柔性显示屏和驱动芯片，二者之间通过邦定实现电连接，然而，由于柔性显示屏的柔软特性，极易造成邦定区周围区域翘曲，进而造成金属线断裂，从而损坏柔性显示屏。
发明内容
有鉴于此，本申请实施例致力于提供一种柔性显示模组、柔性显示屏和胶带，以解决现有技术中柔性显示屏的邦定区周围区域易翘曲的问题。
本申请第一方面提供了一种柔性显示模组，包括柔性基板，包括第一邦定区和位于第一邦定区周围的第一非邦定区；覆晶薄膜，邦定连接在第一邦定区；以及第一补强层，覆盖第一邦定区和非邦定区以缩小第一邦定区和第一非邦定区之间的厚度差。
本申请的第二方面提供了一种柔性显示屏，包括上述柔性显示模组。
本申请的第三方面提供了一种胶带，包括：第一区域；和第二区域，包围第一区域，第一区域的厚度小于第二区域的厚度。
根据本申请提供的柔性显示模组、柔性显示屏和胶带，通过设置覆盖第一邦定区和第一邦定区周围的第一非邦定区的第一补强层，来缩小第一邦定区和第一非邦定区的厚度差，从而降低了位于第一邦定区周围的第一非邦定区 发生翘曲的概率，提高了柔性显示模组的可靠性。
附图简要说明
图1a所示为本申请第一实施例提供的一种柔性显示模组的结构示意图。
图1b所示为图1a所示柔性显示模组的左视图。
图2a所示为本申请第二实施例提供的一种柔性显示模组的结构示意图。
图2b为图2a所示柔性显示模组沿L 1-L 2线的截面示意图。
图3a所示为本申请第三实施例提供的一种胶带的结构示意图。
图3b为图3a所示胶带沿L 3-L 4线的截面示意图。
图4所示为本申请第四实施例提供的柔性显示模组的结构示意图。
实施本申请的方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
图1a所示为本申请第一实施例提供的一种柔性显示模组的结构示意图。图1b所示为图1a所示柔性显示模组的左视图。如图1a和图1b所示，该柔性显示模组100包括邦定连接的柔性显示面板10和覆晶薄膜20。具体而言，柔性显示面板10包括柔性基板11，柔性基板11包括显示区S 1和除了显示区S 1之外的非显示区S 2，显示区S 1包括位于柔性基板11上的驱动单元层12，位于驱动单元层12上的有机发光层13，以及包覆驱动单元层12和有机发光层13并与柔性基板11接触的封装层14，非显示区S 2包括引脚区P，覆晶薄膜20邦定在引脚区P以形成柔性显示模组100的邦定区Q。
其中，柔性基板11例如可以是超薄玻璃、金属薄膜、有机聚合物薄膜等，这里提到的有机聚合物薄膜包括聚酰亚胺薄膜(Polyimide Film,PI)、聚乙烯薄膜、聚丙烯薄膜、聚苯乙烯薄膜、聚碳酸酯薄膜、聚对苯二甲酸类塑 料薄膜、聚醚砜树脂薄膜中的任一种。封装层14包括叠置的有机层和无机层。本申请对柔性基板11的材料，封装层14的具体结构均不作限定。
如图1a和图1b所示的柔性显示模组100，邦定区Q的厚度必定大于非显示区S 2中除了邦定区Q之外的非邦定区D的厚度，从而使得后续终端整机组装过程中，邦定区Q和非邦定区D受力不均，所导致的邦定区Q周围的非邦定区D发生翘曲的问题。
图2a所示为本申请第二实施例提供的一种柔性显示模组的结构示意图。图2b为图2a所示柔性显示模组沿L 1-L 2线的截面示意图。如图2a和图2b所示，该柔性显示模组200和图1a、图1b所示柔性显示模组100的区别仅在于，该柔性显示模组200进一步包括补强层30，该补强层30覆盖邦定区Q和位于邦定区Q周围的非邦定区D，以缩小邦定区Q和非邦定区D的厚度差，即补强层30的厚度分布不均从而实现对邦定区Q和非邦定区D之间厚度差的补偿，具体而言，补强层30与邦定区Q对应的区域薄，与非邦定区D对应的区域厚。
在一个实施例中，如图2b所示，补强层30覆盖邦定区Q和非邦定区D以使邦定区Q和非邦定区D的厚度差缩小为零，即叠加补强层30之后的邦定区Q和非邦定区D的厚度相等。当邦定区Q和非邦定区D的厚度相等时，可以最大程度地降低邦定区Q周围的非邦定区D发生翘曲的概率，进而避免金属线断裂。
在本实施例中，结合图1a和图2a可以看出，非邦定区D只包括非显示区S 2中除了邦定区Q之外的部分区域。例如，如图2a所示，以x轴方向为长度方向，以y轴方向为宽度方向，补强层30的长度等于柔性基板11的长度，补强层30的宽度小于非显示区S 2的宽度并且大于邦定区Q的宽度，即，补强层30覆盖柔性基板11上邦定区Q所在的整个边缘区域。又例如，补强层30的长度小于柔性基板11的长度并且大于邦定区Q的长度，补强层30的宽度等于非显示区S 2的宽度并且大于邦定区Q的宽度。
应当理解，非邦定区D包括非显示区S 2中除了邦定区Q之外的全部区 域。实际应用过程中，只要确保补强层30覆盖邦定区Q和邦定区Q周围的非邦定区D的局部即可，该非邦定区D的局部的被覆盖范围根据实际情况合理设置，本申请对此不作限定。
根据本实施例提供的柔性显示模组，通过设置补强层30，可以降低位于邦定区Q周围的非邦定区D发生翘曲的概率，从而提高柔性显示模组的可靠性。
图3a所示为本申请第三实施例提供的一种胶带的结构示意图。图3b为图3a所示胶带沿L 3-L 4线的截面示意图。该胶带300相当于图2a和图2b中的补强层30，具体使用时，可以根据实际需要对图3a所示的胶带300进行裁剪，例如沿L3-L4线进行裁剪，将上半部分作为补强层30贴附到图2a所示的相应位置。如图3a和图3b所示，该胶带300包括第一区域E 1和除了第一区域E 1之外的第二区域E 2，第一区域E 1对应邦定区Q，第二区域E 2对应非邦定区D，第一区域E 1的厚度小于第二区域E 2的厚度。
在本实施例中，如图3b所示，该胶带300中第一区域E1的膜层数量小于第二区域E2的膜层数量。这样，更容易控制各膜层厚度，简化制备过程。在其它实施例中，也可以将胶带300的第一区域E1和第二区域E2设置为相等数量的膜层，并通过控制第一区域E1和第二区域E2中至少一个膜层厚度不等来实现胶带300厚度分布不均。本发明对胶带300中第一区域E1和第二区域E2包括的膜层数量不作限定。
在本实施例中，如图3b所示，第一区域E1包括基材层31，第二区域E2包括叠置的基材层31和胶层32。具体而言，该基材层31的形成材料可以是聚酰亚胺、聚对苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、聚碳酸酯、聚丙烯酸酯、聚醚酰亚胺、聚醚砜、聚对苯二甲酸乙二醇酯、乙烯-醋酸乙烯共聚物、聚乙烯醇、聚二甲基硅氧烷、聚乙烯中的任一种，胶层32可以是光学透明胶(Optically Clear Adhesive，OCA)。
在一个实施例中，第一区域E1和第二区域E2均包括基材层31和胶层32，并且第一区域E1中的胶层32的厚度小于第二区域E2中的胶层32的厚 度。这样，当将该胶带300应用于图2a和图2b所示的柔性显示模组100时，参阅图2b，相当于覆晶薄膜20上方对应的胶带300也包括胶层32，从而可以确保胶带300与其下方膜层更好地贴合，提高可靠性。
在一个实施例中，如图3b所示，胶层32的厚度等于覆晶薄膜20的厚度。这种情况下，当将该胶带300应用到柔性显示模组100时，参阅图2b，基材层31的厚度、胶层32的厚度、柔性基板11的厚度三者之和等于基材层31的厚度、覆晶薄膜20的厚度、柔性基板11的厚度三者之和，从而使得贴附完胶带300之后的邦定区Q和其周围的非邦定区D厚度分布均匀。本领域技术人员应当理解，这种情况下，相当于忽略了柔性基板11和覆晶薄膜20邦定时用到的粘合胶的厚度，若考虑该粘合胶的厚度，胶层32的厚度应当大于覆晶薄膜20的厚度，具体来说胶层32的厚度等于覆晶薄膜20的厚度和邦定用粘合胶的厚度之和。
在一个实施例中，胶带300进一步覆盖柔性基板11的背面(即柔性基板11的背离覆晶薄膜20的表面)，覆盖柔性基板11的背面的胶带300厚度均匀。例如，可以只利用胶带300的第一区域E1或只利用第二区域E2覆盖柔性基板11的背面，这样胶带300位于柔性基板11背面的部分相当于一个支撑膜，可以进一步降低边缘翘曲的概率。
本领域技术人员应当理解，胶带300只是补强层30的一种示例性的实现形式，本发明对补强层300的具体实现形式不作限定。
图4所示为本申请第四实施例提供的柔性显示模组的结构示意图。如图4所示，该柔性显示模组400在图2a、图2b所示的柔性显示模组200的基础上，进一步包括与覆晶薄膜20邦定连接的柔性电路板(Flexible Printed Circuit Board,FPC)40，柔性电路板40和覆晶薄膜20之间的邦定区对应设置有补强层。
具体而言，为了便于描述，将图2a和图2b所示的邦定区Q、非邦定区D和与邦定区Q对应设置的补强层30分别称为第一邦定区Q1、第一非邦定区D1和第一补强层51，将对应柔性电路板40和覆晶薄膜20之间的邦定区设置 的补强层称为第二补强层52。如图4所示的柔性显示模组400中，柔性电路板40包括边缘区域，边缘区域包括引脚区和位于引脚区周围的非引脚区，覆晶薄膜20邦定连接在引脚区以形成覆晶薄膜20和柔性电路板40之间的第二邦定区Q2，非引脚区形成位于第二邦定区Q2周围的第二非邦定区D2，第二补强层52覆盖第二邦定区Q2和第二非邦定区D2以缩小第二邦定区Q2和第二非邦定区D2之间的厚度差。
在一个实施例中，第一补强层51和第二补强层52的厚度组成相同。例如，如图4所示，由于第一非邦定区D1位于柔性基板11上，这种情况下，第一补强层51实际上是为了在柔性基板11上补偿覆晶薄膜20的厚度。同理由于第二非邦定区D2位于柔性电路板40上，这种情况下，第二补强层52实际上是为了在柔性电路板40上补偿覆晶薄膜20的厚度。可见，第一补强层51和第二补强层52均是为了补偿覆晶薄膜20的厚度，因此可以设置第一补强层51和第二补强层52厚度组成相同，即，第一补强层51中的各膜层厚度和第二补强层52中的各膜层厚度分别相等，这样便于制定统一标准，利于补强层的工业化生产。当然，在其它实施例中，也可以设置第一补强层51和第二补强层52的厚度组成不同。
在一个实施例中，第一补强层51和第二补强层52的材料组成不同；或者第一补强层51和第二补强层52的膜层数量不同；或者第一补强层51和第二补强层52中至少有一个膜层的厚度不同。由于柔性基板11、覆晶薄膜20、柔性电路板40三者的硬度均不同，相互邦定的两者之间的硬度差越大，发生边缘翘曲的概率和程度越大，因此可以通过设置第一补强层51和第二补强层52的材料组成不同来匹配第一邦定区Q1和第二邦定区Q2之间的硬度差异。例如，柔性电路板40、柔性基板11、覆晶薄膜20三者的硬度依次减小，因此第一非邦定区D1相比于第二非邦定区D2而言，第一非邦定区D1更容易发生翘曲，这种情况下，可以设置第一补强层51相比于第二补强层52的硬度更高，该硬度更高可以通过采用硬度更高的材料实现，还可以通过增加膜层的厚度实现，也可以通过增加膜层数量实现。
上述任一实施例均以将芯片邦定在薄膜上(Chip On Film,COF)的邦定方式中涉及的邦定位置为例，包括柔性基板11和覆晶薄膜20之间的绑定位置，以及覆晶薄膜20和柔性电路板40之间的绑定位置，本领域技术人员应当理解，补强层也可以应用于其它邦定位置，例如将芯片邦定于基板上(Chip On Glass,COG)的邦定方式中驱动芯片和基板之间的邦定位置，或者将柔性电路板邦定到玻璃上(FPC On Glass)邦定方式中的柔性电路板和基板之间的邦定位置。
本申请还提供了一种柔性显示屏，包括上述任一实施例提供的柔性显示模组。
通过采用本申请实施例提供的柔性显示模组，可以降低边缘发生翘曲的概率，柔性显示屏可靠性更高。
应当理解，本申请实施例描述中所用到的限定词“第一”和“第二”仅用于更清楚的阐述技术方案，并不能用于限制本发明的保护范围。
以上所述仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换等，均应包含在本申请的保护范围之内。

Claims (16)

  1. 一种柔性显示模组，包括：
    柔性基板，包括第一邦定区和位于所述第一邦定区周围的第一非邦定区；
    覆晶薄膜，邦定连接在所述第一邦定区；及
    第一补强层，覆盖所述第一邦定区和所述第一非邦定区以缩小所述第一邦定区和所述第一非邦定区之间的厚度差。
  2. 如权利要求1所述的柔性显示模组，其中，所述第一补强层包括第一区域和第二区域，所述第一区域覆盖所述第一邦定区，所述第二区域覆盖所述第一非邦定区，所述第一区域的厚度小于所述第二区域的厚度。
  3. 如权利要求2所述的柔性显示模组，其中，所述第一区域的膜层数量小于等于所述第二区域的膜层数量。
  4. 如权利要求2或3所述的柔性显示模组，其中，所述第一区域包括基材层，所述第二区域包括叠置的所述基材层和胶层。
  5. 如权利要求2或3所述的柔性显示模组，其中，所述第一区域和所述第二区域分别包括叠置的基材层和胶层，所述第一区域的胶层的厚度小于所述第二区域的胶层的厚度。
  6. 如权利要求1-5任一所述的柔性显示模组，还包括柔性电路板和第二补强层；所述柔性电路板包括第二邦定区和位于所述第二邦定区周围的第二非邦定区，所述覆晶薄膜邦定连接在所述柔性电路板的第二邦定区；所述第二补强层覆盖所述第二邦定区和所述第二非邦定区以缩小所述第二邦定区和所述第二非邦定区之间的厚度差。
  7. 如权利要求6所述的柔性显示模组，其中，所述第一补强层和所述第二补强层的厚度和组成分别相同。
  8. 如权利要求6所述的柔性显示模组，其中，所述第一补强层和所述第二补强层的材料不同。
  9. 如权利要求6所述的柔性显示模组，其中，所述第一补强层和所述第 二补强层的膜层数量不同。
  10. 如权利要求4所述的柔性显示模组，其中，所述基材层的形成材料包括聚酰亚胺、聚对苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、聚碳酸酯、聚丙烯酸酯、聚醚酰亚胺、聚醚砜、聚对苯二甲酸乙二醇酯、乙烯-醋酸乙烯共聚物、聚乙烯醇、聚二甲基硅氧烷、聚乙烯中的任一种，所述胶层为光学透明胶。
  11. 如权利要求1-5中任一所述的柔性显示模组，其中，所述补强层为胶带。
  12. 一种柔性显示屏，包括权利要求1-11任一所述的柔性显示模组。
  13. 一种胶带，包括：
    第一区域；和
    第二区域，包围所述第一区域，所述第一区域的厚度小于所述第二区域的厚度。
  14. 如权利要求13所述的胶带，其中，所述第一区域的膜层数量小于等于所述第二区域的膜层数量。
  15. 如权利要求14所述的胶带，其中，所述第一区域包括基材层，所述第二区域包括叠置的所述基材层和胶层。
  16. 如权利要求14所述的胶带，其中，所述第一区域和所述第二区域分别包括叠置的基材层和胶层，所述第一区域的胶层的厚度小于所述第二区域的胶层的厚度。
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