WO2023005497A1 - Pcb的制备方法及pcb - Google Patents

Pcb的制备方法及pcb Download PDF

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Publication number
WO2023005497A1
WO2023005497A1 PCT/CN2022/099404 CN2022099404W WO2023005497A1 WO 2023005497 A1 WO2023005497 A1 WO 2023005497A1 CN 2022099404 W CN2022099404 W CN 2022099404W WO 2023005497 A1 WO2023005497 A1 WO 2023005497A1
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WIPO (PCT)
Prior art keywords
soft
hard
area
board
boundary line
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PCT/CN2022/099404
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English (en)
French (fr)
Inventor
林宇超
肖璐
朱光远
袁继旺
张志远
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生益电子股份有限公司
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Publication of WO2023005497A1 publication Critical patent/WO2023005497A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Definitions

  • This application relates to the technical field of PCB (Printed Circuit Boards, printed circuit boards), for example, to a method for preparing a PCB and a PCB.
  • PCB Printed Circuit Boards, printed circuit boards
  • Rigid-flex board is a combination of flexible circuit board and rigid circuit board through pressing and other processes to form a flexible circuit board (Flexible Printed Circuit Board, FPC) and a printed circuit board (Printed Circuit Boards, PCB)
  • FPC Flexible Printed Circuit Board
  • PCB printed circuit Boards
  • the protective tape 6 under the suspended area cannot be removed.
  • the current process method is to use a non-flowing or low-fluidity prepreg 3, and the surface of the cover film 4 is not covered with the protective tape 6. , but this process method limits the selection of prepreg 3 types.
  • the protective tape 6 is not pasted on the cover film 4, and the resin dust will adhere to the surface of the cover film 4 during the lamination process. Residual glue spots are formed on the surface, which affects product quality and leads to scrapping.
  • the present application provides a method for preparing a PCB and the PCB, which can overcome the problem in the related art that the protective tape located under the suspended hard board cannot be removed.
  • An embodiment of the present application provides a method for preparing a PCB, including: providing a flexible board, a rigid board, and a prepreg; A first soft and hard boundary line is formed between the hard bonding areas, a second soft and hard boundary line is formed between the preset opening area of the hard board and the orthographic projection area of the soft area, and the preset opening area The area does not exceed the orthographic projection area of said soft zone;
  • Covering films are respectively pasted on the two facing surfaces of the hard board and the soft board, and the covering area of the covering film is not smaller than the orthographic projection area of the soft area;
  • a protective tape is pasted on the surface of the cover film on the soft board, and the covering area of the protective tape exceeds the preset opening area and shrinks along the first soft-hard boundary line, and the protective tape and The adhesive force of the cover film is less than the adhesive force of the protective tape and the prepreg;
  • the windowing area is the remaining area of the orthographic projection area of the soft area except the preset opening area, and the windowing area at the position of the second soft-hard boundary line retract along the second hard-soft boundary line;
  • the cover After pressing, the cover is opened, and at the same time, the protective tape is taken out by using the prepreg in the preset opening area.
  • the preparation method further includes: taking the surface of the hard board facing the soft board as a pre-cut surface after the covering film is pasted and before the laminated boards are laminated sequentially.
  • the position of the first soft-hard boundary line at at least one end is pre-cut to form at least one end groove for resisting glue.
  • the preparation method further includes: before lamination of the sequential laminated boards, taking the board surface of the hard board facing the soft board as a pre-cut surface, and performing pre-cutting in the preset opening area. Cut to form the middle groove.
  • the window opening area of the prepreg at the position of the first hard-soft boundary line expands outward along the first hard-soft boundary line.
  • the width of the end groove extends a first distance toward the soft area and a second distance toward the soft-hard joint area along the adjacent first soft-hard junction line, the The first distance is less than the second distance.
  • the protective tape shrinks back along the first soft-hard boundary line by a distance greater than the first distance.
  • the prepreg at the window opening area at the position of the first hard-soft boundary line, expands outward along the first hard-soft boundary line by a distance not less than the second distance.
  • the first distance is 0.3mm
  • the second distance is 0.5mm
  • the protective tape shrinks inwardly by more than 0.5mm along the first soft-hard boundary line
  • the window opening area at the soft-hard boundary line is expanded by 0.5mm along the first soft-hard boundary line, and the window opening area at the second soft-hard boundary line is retracted by 0.5mm along the second soft-hard boundary line .
  • the protective tape is a single-sided tape, and the adhesive side of the single-sided tape is attached to the surface of the cover film on the soft board.
  • An embodiment of the present application provides a PCB, and the PCB is manufactured by any one of the PCB preparation methods described above.
  • Fig. 1 is a side view of a rigid-flex board designed with a suspended structure at one end in the related art.
  • Fig. 2 is a side view of a rigid-flex board in the related art with a structure design with both ends suspended.
  • Fig. 3 is a flowchart of a method for preparing a rigid-flex board provided by an embodiment of the present application.
  • Fig. 4 and Fig. 5 are schematic diagrams of the preparation process of the rigid-flex board provided by an embodiment of the present application.
  • Fig. 6 is a top view of a prepreg provided by an embodiment of the present application.
  • Soft board 1 hard board 2, prepreg 3, first soft-hard boundary line A, second soft-hard boundary line B, cover film 4, middle groove 5, protective tape 6, end groove 7.
  • an embodiment of the present application provides a PCB preparation method, which can use the prepreg 3 to remove the protective tape 6 from the opening gap while opening the cover. Pulling off does not require an additional process to remove the protective tape 6 after opening the cover, which can effectively remove the protective tape 6 and greatly reduces the difficulty and complexity of the operation.
  • the preparation method of PCB provided by an embodiment of the present application includes:
  • step 101 a soft board 1 , a hard board 2 and a prepreg 3 are provided.
  • the flexible board 1 includes a soft area and a soft-hard joint area.
  • the first soft-hard boundary line A is formed between the soft area and the soft-hard joint area.
  • the second soft-hard boundary line B is formed between them, and the preset opening area does not exceed the orthographic projection area of the soft area.
  • the first soft-hard boundary line A and the second soft-hard boundary line B are straight lines perpendicular to the PCB board surface.
  • the first soft-hard boundary line A includes The two boundary lines at both ends of the width direction of the soft zone, the width direction refers to the direction in which the soft-hard joint zone on one side of the soft zone points to the soft-hard joint zone on the other side of the soft zone, the second soft-hard junction Line B includes two boundary lines located at both ends of the preset opening area, and the length of the soft zone in the width direction determines the bendable radius of the soft zone.
  • Extending the second hard and soft boundary line B along the left end to the left, and extending the second hard and soft boundary line B along the right end to the right are collectively referred to as expanding along the second hard and soft boundary line B; extending the second hard and soft boundary line B along the left end
  • the soft-hard boundary line B extends to the right, and the second soft-hard boundary line B on the right extends to the left, collectively referred to as shrinking along the second soft-hard boundary line B.
  • the preset opening area needs to be smaller than the soft area.
  • the preset opening area when the first soft-hard boundary line A and the second soft-hard boundary line B do not coincide at all, the preset opening area is located in the middle of the orthographic projection area of the soft area, and the outer layer after opening the cover
  • the hard board 2 will form a suspended structure at both ends above the soft area; when the first soft-hard boundary line A coincides with the second soft-hard boundary line B, the preset opening area is located in the orthographic projection area of the soft area.
  • the hard board 2 of the outer layer will form a suspended structure at one end above the soft area. Therefore, the position of the preset opening area can be designed according to actual needs.
  • the size of the preset opening area and the soft area can be equal, so that the soft area can be completely exposed outside after the cover is opened.
  • the embodiment of the present application does not specify the size and position of the preset opening area. limit.
  • step 102 the covering film 4 is pasted on the facing surfaces of the hard board 2 and the flexible board 1 , and the pasting area of the covering film 4 is not smaller than the orthographic projection area of the soft area.
  • the cover film 4 on the hard board 2 and the cover film 4 on the soft board 1 have different functions:
  • the cover film 4 attached to the soft board 1 is used to protect the circuit in the soft board area and enhance the bending performance;
  • the cover film 4 attached on the hard board 2 has the following functions:
  • the cover film 4 on the hard board 2 and the soft board 1 is closed together, which can have the effect of blocking glue.
  • the cover film The sticking area of 4 is generally selected to be larger than the orthographic projection area of the soft area, so that the surrounding edges of the cover film 4 can be pressed between the hard board 2 and the soft board 1 during pressing, so that the cover film 4 cannot be moved.
  • step 103 the surface of the rigid board 2 facing the soft board 1 is used as the pre-cut surface, and the middle groove 5 is formed by pre-cutting in the preset opening area.
  • the purpose of pre-cutting to form the middle groove 5 is, on the one hand, to facilitate the depth control accuracy in the subsequent uncapping process, avoiding the uncapping from being too deep or too shallow, and to facilitate the subsequent depth-controlled uncapping operation.
  • the burrs will affect the appearance and even scratch the soft board 1; on the other hand, it can limit the prepreg 3 in the middle.
  • the closing process flows to both sides to avoid the situation that the lid cannot be opened.
  • step 103 can also be omitted, that is, the object of the present invention can also be achieved after performing subsequent processes without performing a pre-cutting operation on the hard board 2 .
  • step 104 the protective tape 6 is pasted on the surface of the cover film 4 on the flexible board 1.
  • the pasted area of the protective tape 6 exceeds the preset opening area and shrinks along the first soft-hard junction line A, and the protective tape 6 and The adhesive force of the cover film 4 is smaller than the adhesive force of the protective tape 6 and the prepreg 3 .
  • the function of the protective tape 6 is to prevent resin dust and the like from adhering to the surface of the cover film 4 during the lamination process, and the protective tape 6 needs to be removed later.
  • the protective tape 6 is a single-sided adhesive tape, and the adhesive side of the single-sided adhesive tape is attached to the surface of the cover film 4 on the soft board 1, so as to protect the cover film 4 on the soft board 1 from resin dust, etc. Adhesion.
  • step 105 the prepreg 3 is windowed, and the windowed area is the remaining area of the orthographic projection area of the soft area except the preset opening area, and the windowed area at the position of the second hard-soft boundary line B is along the second Two soft and hard boundary line B is retracted.
  • the plan view of the prepreg 3 is shown in Figure 6.
  • the prepreg 3 includes two left and right window opening areas.
  • the window opening area must be retracted along the second hard-soft boundary line B.
  • step 106 the hard board 2, the prepreg 3 and the soft board 1 are laminated and pressed together in sequence.
  • step 107 after pressing, control the deep milling to the middle groove 5 in the preset opening area, and then open the cover, and use the prepreg 3 in the middle groove 5 to tape out the protective tape 6 at the same time.
  • the hard board 2 adheres to the protective tape 6 on the soft board 1 through the prepreg 3 in the preset opening area.
  • the protective tape 6 will follow the hard board 2 and the prepreg 3 in the opening area. Take it out under the action of external force.
  • the cover film 4 will remain on the flexible board 1 and also have the function of enhancing the toughness of the suspended part.
  • the pre-preg 3 is bonded with the protective tape 6 attached to the surface of the cover film 4, and then in the opening process
  • the adhesive force of the prepreg 3 is directly used to pull the protective tape 6 out of the opening gap, and there is no need to remove the protective tape 6 through an additional process after the cover is opened.
  • the present application is not limited to the operation sequence of the above-mentioned steps 102 to 105.
  • the processing sequence of the soft board 1, the hard board 2 and the prepreg 3 can be flexibly adjusted according to the situation, or processed at the same time, and It does not affect the subsequent process and production effect.
  • the surface of the cover film 4 on the soft board 1 is covered with a protective tape 6. Afterwards, and before lamination and lamination in sequence, take the surface of the hard board 2 facing the soft board 1 as the pre-cutting surface, and perform pre-cutting at the position of the first soft-hard boundary line A at at least one end to form at least one for The end groove 7 for resisting glue.
  • the inner groove 7 is used to realize the glue-resistance function on both sides, so as to prevent the glue from flowing to the ends of both sides of the protective tape 6 so as to cause the two ends of the protective tape 6 to adhere to the PCB.
  • the window opening area of the prepreg 3 at the first soft-hard boundary line A is expanded along the first soft-hard boundary line A to reduce the glue flow of the prepreg 3 to the first soft-hard boundary line A The other side of the risk of the end of the protective tape 6.
  • the width of the end groove 7 extends along the first soft-hard junction line A close to the first distance toward the soft area and the second distance toward the soft-hard joint area, and the first distance is smaller than the second distance. In this way, when pressing, the flow glue can be more filled to the side of the end groove 7 close to the soft and hard joint area, and less filled to the side of the end groove 7 close to the soft area, so as to avoid more The multi-flow glue is exposed.
  • the shrinkage distance of the protective tape 6 along the first hard-soft boundary line A is greater than the first distance;
  • the extended distance of the line A is not less than the second distance, which can further improve the glue-resisting effect.
  • the two layers of cover film 4 located on the upper and lower surfaces of the protective tape 6 can be closed together, which can also achieve a certain effect of resisting glue, and at the same time avoid glue flow and bonding of the protective tape 6 .
  • the protective tape 6 shrinks inwardly by more than 0.5mm along the first soft-hard boundary line A; the first distance is 0.3mm, and the second distance is 0.5mm;
  • the window opening area is expanded 0.5mm along the first soft-hard boundary line A, and the window opening area at the second soft-hard boundary line B is retracted 0.5mm along the second soft-hard boundary line B; the middle groove 5 and the end
  • the depth of the external groove 7 is 30% ⁇ 50% of the hard plate 2 thickness. Based on this parameter design, a good glue-repelling effect can be achieved, which ensures the effective removal of the protective tape 6 and reduces the difficulty of removing the protective tape 6 .
  • An embodiment of the present application also provides a PCB, which is manufactured by the above PCB preparation method. Since the PCB is covered with a protective tape 6 on the surface of the cover film 4 during the preparation process, the resin dust can be effectively adhered to the surface of the cover film 4 during the lamination process, thereby improving product quality; at the same time, the protective tape 6. It can be easily and jointly removed in the uncapping process, which greatly reduces the difficulty and complexity of tape removal.
  • the number of core boards included in the PCB can be increased, for example, adding at least one other core board between the hard board 2 and the soft board 1, and/or adding At least one other core board can be manufactured according to the conventional procedures such as stacking boards, pressing and opening windows, and will not be repeated here.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

一种PCB的制备方法及PCB。所述制备方法包括：提供软板、硬板和半固化片；在硬板和软板相向的两板面上分别贴覆覆盖膜；在硬板的预设开盖区域预切形成中间凹槽；在软板上的覆盖膜表面贴覆保护胶带；对半固化片开窗，开窗区域为软性区正投影区域的除所述预设开盖区域外的剩余区域；将硬板、半固化片和软板按序叠板压合；压合后开盖，同时利用所述预设开盖区域内的所述半固化片粘带出所述保护胶带。

Description

PCB的制备方法及PCB
本申请要求申请日为2021年7月27日、申请号为202110849660.7的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及PCB(Printed Circuit Boards，印制电路板)技术领域，例如涉及一种PCB的制备方法及PCB。
背景技术
软硬结合板，是将柔性电路板与硬性电路板经过压合等工序组合在一起，形成同时具有柔性电路板(Flexible Printed Circuit Board，FPC)特性与印制电路板(Printed Circuit Boards，PCB)特性的电路板；因软硬结合板既有一定的刚性区域，也有一定的挠性区域，挠性区域可以弯曲，因此在节省产品内部空间、减少成品体积以及提高产品性能等方面有很大的优势。
相关技术中，软硬结合板有一类局部硬板悬空的结构设计，这种软板区一侧保留悬空硬板的设计，如图1所示的两端悬空结构设计和图2所示的一端悬空设计，该结构设计能够对软性区起到较好的保护作用。
但此类设计的实现目前存在一个问题，就是悬空区域下面的保护胶带6无法去除，为此目前采用的工艺方法是使用不流动或低流动度的半固化片3，覆盖膜4表面不贴保护胶带6，但此工艺方法局限了半固化片3类型的选用，另外覆盖膜4上不贴保护胶带6，层压排板过程树脂粉尘便会粘附在覆盖膜4表面，经过高温高压过程容易在覆盖膜4表面上形成残胶点，影响产品品质，导致报废。
发明内容
本申请提供一种PCB的制备方法及PCB，能够克服相关技术存在的无法去除位于悬空硬板下方的保护胶带的问题。
本申请一实施例提供了一种PCB的制备方法，包括：提供软板、硬板和半固化片；其中，所述软板包括软性区和软硬结合区，所述软性区和所述软硬结合区之间形成第一软硬交界线，所述硬板的预设开盖区域与所述软性区的正投影区域之间形成第二软硬交界线，且所述预设开盖区域不超出所述软性区的正投 影区域；
在所述硬板和所述软板相向的两板面上分别贴覆覆盖膜，所述覆盖膜的贴覆区域不小于所述软性区的正投影区域；
在所述软板上的覆盖膜表面贴覆保护胶带，所述保护胶带的贴覆区域超出所述预设开盖区域且沿所述第一软硬交界线内缩，且所述保护胶带与所述覆盖膜的粘力小于所述保护胶带与所述半固化片的粘力；
对所述半固化片进行开窗，开窗区域为所述软性区正投影区域的除所述预设开盖区域外的剩余区域，且于所述第二软硬交界线位置的开窗区域部分沿所述第二软硬交界线内缩；
将所述硬板、所述半固化片和所述软板按序叠板压合；及
压合后开盖，同时利用所述预设开盖区域内的所述半固化片粘带出所述保护胶带。
可选的，所述制备方法还包括：在所述贴覆覆盖膜之后以及在所述按序叠板压合之前，以所述硬板的面向所述软板的板面为预切面，在至少一端的所述第一软硬交界线位置进行预切，形成至少一个用于阻胶的端部凹槽。
可选的，所述制备方法还包括：在所述按序叠板压合前，以所述硬板的面向所述软板的板面为预切面，在所述预设开盖区域进行预切形成中间凹槽。
可选的，所述半固化片的于所述第一软硬交界线位置的开窗区域部分，沿所述第一软硬交界线外扩。
可选的，所述端部凹槽的宽度，沿靠近的所述第一软硬交界线，朝所述软性区延伸第一距离，朝所述软硬结合区延伸第二距离，所述第一距离小于所述第二距离。
可选的，所述保护胶带沿所述第一软硬交界线内缩的距离大于所述第一距离。
可选的，所述半固化片，于所述第一软硬交界线位置的开窗区域部分，沿所述第一软硬交界线外扩的距离不小于所述第二距离。
可选的，所述第一距离为0.3mm，所述第二距离为0.5mm；所述保护胶带沿所述第一软硬交界线内缩0.5mm以上；所述半固化片，于所述第一软硬交界线位置的开窗区域部分沿第一软硬交界线外扩0.5mm，于所述第二软硬交界线位置的开窗区域部分沿所述第二软硬交界线内缩0.5mm。
可选的，所述保护胶带为单面胶带，所述单面胶带的粘胶面贴合所述软板 上的覆盖膜表面。
本申请一实施例提供了一种PCB，所述PCB由以上任一项所述的PCB的制备方法制作而成。
附图说明
图1为相关技术中的采用一端悬空结构设计的软硬结合板的侧视图。
图2为相关技术中的采用两端悬空结构设计的软硬结合板的侧视图。
图3为本申请一实施例提供的软硬结合板的制备方法流程图。
图4和图5为本申请一实施例提供的软硬结合板的制备工序示意图。
图6为本申请一实施例提供的半固化片的俯视图。
图示说明：
软板1、硬板2、半固化片3、第一软硬交界线A、第二软硬交界线B、覆盖膜4、中间凹槽5、保护胶带6、端部凹槽7。
具体实施方式
为解决保护胶带6因被悬空部分遮挡而难以通过额外手段去除的问题，本申请一实施例提供一种PCB的制备方法，能够在开盖的同时利用半固化片3将保护胶带6从开盖缝隙中抽离，无需在开盖后通过额外工序来去除保护胶带6，既能够有效去除保护胶带6，又大大降低了操作难度和复杂度。
针对图1所示的采用一端悬空结构设计的PCB和图2所示的采用两端悬空设计的PCB，两者的区别主要在于开盖区域的位置不同，而两者的制作方法基本相同，因此下面结合图1的制备方法以及图2所示的采用两端悬空设计的PCB的制作工序示意图为例，来详细描述该PCB的制备方法。
请参阅图3至图5，本申请一实施例提供的PCB的制备方法，包括：
步骤101中，提供软板1、硬板2和半固化片3。
软板1包括软性区和软硬结合区，软性区和软硬结合区之间形成第一软硬交界线A，硬板2的预设开盖区域与软性区的正投影区域之间形成第二软硬交界线B，且预设开盖区域不超出软性区的正投影区域。
在一实施例中，第一软硬交界线A和第二软硬交界线B为垂直于PCB板面的直线，在图4中所示的侧视图中，第一软硬交界线A包括位于软性区的宽度方向两 端的两条交界线，宽度方向指的是位于软性区一侧的软硬结合区指向位于软性区另一侧的软硬结合区的方向，第二软硬交界线B包括位于预设开盖区域两端的两条交界线，软性区的宽度方向长度决定了软性区的可弯折半径。
为便于描述，下文中将沿左端的第一软硬交界线A向左侧延伸、沿右端的第一软硬交界线A向右侧延伸，统称为沿第一软硬交界线A外扩；将沿左端第一软硬交界线A向右侧延伸、沿右端第一软硬交界线A向左侧延伸，统称为沿第一软硬交界线A内缩。将沿左端的第二软硬交界线B向左侧延伸、沿右端的第二软硬交界线B向右侧延伸，统称为沿第二软硬交界线B外扩；将沿左端的第二软硬交界线B向右侧延伸、沿右端的第二软硬交界线B向左侧延伸，统称为沿第二软硬交界线B内缩。
为实现悬空结构设计，预设开盖区域需要小于软性区。在一实施例中，第一软硬交界线A与第二软硬交界线B完全不重合时，预设开盖区域位于软性区的正投影区域的中间位置，在开盖后外层的硬板2在软性区上方将会形成两端悬空结构；第一软硬交界线A与第二软硬交界线B有一条重合时，预设开盖区域位于软性区的正投影区域的一端边界位置，在开盖后外层的硬板2在软性区上方将会形成一端悬空结构。因此，可根据实际需求来设计预设开盖区域的位置。
在其他实施例中，预设开盖区域与软性区的尺寸可以相等，这样在开盖后软性区可以完全裸露于外，本申请实施例对预设开盖区域的大小和位置不作具体限制。
步骤102中，在硬板2和软板1相向的两板面上分别贴覆覆盖膜4，覆盖膜4的贴覆区域不小于软性区的正投影区域。
硬板2上的覆盖膜4和软板1上的覆盖膜4有不同作用：
①软板1上贴覆的覆盖膜4，用于保护软板区线路，增强弯折性能；
②硬板2上贴覆的覆盖膜4，作用在于：
a.由于软性区的半固化片3开窗，该区域位置在压合后会出现板面凹陷问题，导致在后续外层图形制作流程中该位置贴膜不良，在蚀刻线路时出现渗蚀造成线路开路等问题。因此，此位置的硬板2上选择贴覆合适厚度的覆盖膜4，可以用于弥补此位置的高度差，避免出现凹陷问题，
b.压合时硬板2和软板1上的覆盖膜4闭合在一起，可以起到阻胶效果，为防止覆盖膜4在压合工序中产生移位，确保良好的保护效果，覆盖膜4的贴覆区域通常选择大于软性区的正投影区域，这样在压合时覆盖膜4的四周边缘可被压合 至硬板2和软板1之间，使得覆盖膜4不可移动。
步骤103中，以硬板2的面向软板1的板面为预切面，在预设开盖区域进行预切形成中间凹槽5。
本申请一实施例中，预切形成中间凹槽5的目的，一方面在于便于后续开盖工序中的控深精度，避免开盖过深或者过浅，而且有利于后续控深开盖操作，减少毛刺披锋等问题，如果不预切，由于硬板2下表面的铜层贴合软板1，毛刺影响表观甚至会刮伤软板1；另一方面可以限制中间的半固化片3在压合过程向两侧流动，避免出现无法开盖的情况。
在其他实施方式中，也可省略掉步骤103，即对硬板2不进行预切操作，执行后续流程后也能够实现本发明的目的。
步骤104中，在软板1上的覆盖膜4表面贴覆保护胶带6，保护胶带6的贴覆区域超出预设开盖区域且沿第一软硬交界线A内缩，且保护胶带6与覆盖膜4的粘力小于保护胶带6与半固化片3的粘力。
保护胶带6的作用在于避免层压排板过程中树脂粉尘等粘附在覆盖膜4表面，后续该保护胶带6需要去除。
为便于后续保护胶带6能够完全且轻易的在半固化片3的粘力作用下从开窗区域带出，需要确保保护胶带6与覆盖膜4的粘力小于保护胶带6与半固化片3的粘力。在一实施例中，保护胶带6为单面胶带，并将单面胶带的粘胶面贴合软板1上的覆盖膜4表面，以保护软板1上的覆盖膜4不被树脂粉尘等粘附。
步骤105中，对半固化片3进行开窗，开窗区域为软性区正投影区域的除预设开盖区域外的剩余区域，且于第二软硬交界线B位置的开窗区域部分沿第二软硬交界线B内缩。
该半固化片3的平面图如图6所示，半固化片3包括左右两个开窗区域，为避免因流胶至预设开盖区域的侧壁导致难以开盖，位于第二软硬交界线B位置的开窗区域部分须沿第二软硬交界线B内缩。
步骤106中，将硬板2、半固化片3和软板1按序叠板压合。
步骤107中，压合后，在预设开盖区域控深铣至中间凹槽5，之后开盖，同时利用中间凹槽5内的半固化片3粘带出保护胶带6。
本步骤中，硬板2通过预设开盖区域内的半固化片3粘住软板1上的保护胶带6，在开盖时，保护胶带6会跟随开盖区域内的硬板2和半固化片3在外力作用下取出。同时，覆盖膜4会保留在软板1上，还具有增强悬空部分韧性的作用。
综上，本实施例中，通过在硬板2上预切的中间凹槽5内填充半固化片3，利用该半固化片3与贴覆于覆盖膜4表面的保护胶带6粘接，进而在开盖流程中直接利用半固化片3的粘力将保护胶带6从开盖缝隙中抽离出来，无需在开盖后再通过额外的工序来去除保护胶带6。
在一实施例中，本申请并不局限于上述步骤102至105的操作顺序，实际应用中可根据情况来灵活调整软板1、硬板2和半固化片3各自的加工顺序，或者同时加工，并不影响后续的工序及制作效果。
在又一实施例中，为避免因流胶至保护胶带6的两端而导致保护胶带6的抽离难度增加，如图4所示，在软板1上的覆盖膜4表面贴覆保护胶带6之后、以及在按序叠板压合之前，以硬板2的面向软板1的板面为预切面，在至少一端的第一软硬交界线A位置进行预切，形成至少一个用于阻胶的端部凹槽7。
在制作图1所示的仅一端悬空的PCB时，由于预设开盖区域位于软性区的正投影区域的边界位置，使得一端的第一软硬交界线A和第二软硬交界线B重合，因此只需在另一端的第一软硬交界线A的位置开设端部凹槽7，以实现该侧的阻胶功能，避免流胶至保护胶带6的该侧端部以造成保护胶带6的一端与PCB粘连。
在制作图2所示的两端悬空的PCB时，由于预设开盖区域位于软性区的正投影区域的中间位置，此时可在两端的第一软硬交界线A的位置分别开设端部凹槽7，以实现两侧的阻胶功能，避免流胶至保护胶带6的两侧端部以造成保护胶带6的两端与PCB粘连。
在一实施例中，半固化片3的于第一软硬交界线A位置的开窗区域部分，沿第一软硬交界线A外扩，以降低半固化片3流胶至位于第一软硬交界线A另一侧的保护胶带6的端部的风险。
端部凹槽7的宽度，沿靠近的第一软硬交界线A，朝软性区延伸第一距离，朝软硬结合区延伸第二距离，第一距离小于第二距离。这样在压合时，流胶可较多的填充至端部凹槽7的靠近软硬结合区的一侧、较少的填充至端部凹槽7的靠近软性区的一侧，避免较多流胶裸露于外。
在一实施例中，保护胶带6沿第一软硬交界线A内缩的距离大于第一距离；半固化片3，于第一软硬交界线A位置的开窗区域部分，沿第一软硬交界线A外扩的距离不小于第二距离，这样可进一步提升阻胶效果。
在高温压合时，位于保护胶带6上下表面的两层覆盖膜4可闭合在一起，也能够达到一定的阻胶效果，同时避免流胶与保护胶带6粘接。
在一实施例中，保护胶带6沿第一软硬交界线A内缩0.5mm以上；第一距离为0.3mm，第二距离为0.5mm；半固化片3，于第一软硬交界线A位置的开窗区域部分沿第一软硬交界线A外扩0.5mm，于第二软硬交界线B位置的开窗区域部分沿第二软硬交界线B内缩0.5mm；中间凹槽5和端部凹槽7的深度均为硬板2厚度的30％～50％。基于此参数设计，可以实现良好的阻胶效果，保障了保护胶带6的有效去除，降低了保护胶带6的去除难度。
本申请一实施例还提供了一种PCB，该PCB由上述PCB的制备方法制作而成。由于该PCB在制备过程中，于覆盖膜4的表面贴覆有保护胶带6，因此能够有效层压排板过程中树脂粉尘粘附于覆盖膜4表面，提升了产品品质；同时，该保护胶带6能够在开盖工序中被轻易的连带去除，大大降低了胶带的去除难度和复杂度。
可以理解的，在其他实施例中，可以增加PCB所包含的芯板数量，例如在硬板2与软板1之间增加至少一张其他芯板，和/或在硬板2的外层增加至少一张其他芯板，具体制作时按照常规的叠板压合开窗等工序即可，此处不再赘述。

Claims (10)

  1. 一种PCB的制备方法，包括：
    提供软板、硬板和半固化片；其中，所述软板包括软性区和软硬结合区，所述软性区和所述软硬结合区之间形成第一软硬交界线，所述硬板的预设开盖区域与所述软性区的正投影区域之间形成第二软硬交界线，且所述预设开盖区域不超出所述软性区的正投影区域；
    在所述硬板和所述软板相向的两板面上分别贴覆覆盖膜，所述覆盖膜的贴覆区域不小于所述软性区的正投影区域；
    在所述软板上的覆盖膜表面贴覆保护胶带，所述保护胶带的贴覆区域超出所述预设开盖区域且沿所述第一软硬交界线内缩，且所述保护胶带与所述覆盖膜的粘力小于所述保护胶带与所述半固化片的粘力；
    对所述半固化片进行开窗，开窗区域为所述软性区正投影区域的除所述预设开盖区域外的剩余区域，且于所述第二软硬交界线位置的开窗区域部分沿所述第二软硬交界线内缩；
    将所述硬板、所述半固化片和所述软板按序叠板压合；及
    压合后开盖，同时利用所述预设开盖区域内的所述半固化片粘带出所述保护胶带。
  2. 根据权利要求1所述的PCB的制备方法，还包括：在所述贴覆覆盖膜之后以及在所述按序叠板压合之前，以所述硬板的面向所述软板的板面为预切面，在至少一端的所述第一软硬交界线位置进行预切，形成至少一个用于阻胶的端部凹槽。
  3. 根据权利要求1或2所述的PCB的制备方法，还包括：在所述按序叠板压合前，以所述硬板的面向所述软板的板面为预切面，在所述预设开盖区域进行预切形成中间凹槽。
  4. 根据权利要求2所述的PCB的制备方法，其中，所述半固化片的于所述第一软硬交界线位置的开窗区域部分，沿所述第一软硬交界线外扩。
  5. 根据权利要求4所述的PCB的制备方法，其中，所述端部凹槽的宽度，沿靠近的所述第一软硬交界线，朝所述软性区延伸第一距离，朝所述软硬结合区延伸第二距离，所述第一距离小于所述第二距离。
  6. 根据权利要求5所述的PCB的制备方法，其中，所述保护胶带沿所述第一软硬交界线内缩的距离大于所述第一距离。
  7. 根据权利要求5所述的PCB的制备方法，其中，所述半固化片，于所述第 一软硬交界线位置的开窗区域部分，沿所述第一软硬交界线外扩的距离不小于所述第二距离。
  8. 根据权利要求7所述的PCB的制备方法，其中，所述第一距离为0.3mm，所述第二距离为0.5mm；
    所述保护胶带沿所述第一软硬交界线内缩0.5mm以上；
    所述半固化片，于所述第一软硬交界线位置的开窗区域部分沿第一软硬交界线外扩0.5mm，于所述第二软硬交界线位置的开窗区域部分沿所述第二软硬交界线内缩0.5mm。
  9. 根据权利要求1所述的PCB的制备方法，其中，所述保护胶带为单面胶带，所述单面胶带的粘胶面贴合所述软板上的覆盖膜表面。
  10. 一种PCB，所述PCB由权利要求1至9中任一项所述的PCB的制备方法制作而成。
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CN113382536B (zh) * 2021-07-27 2023-06-30 生益电子股份有限公司 一种pcb的制备方法及pcb
CN114025484A (zh) * 2021-09-24 2022-02-08 安捷利美维电子(厦门)有限责任公司 具有跨芯板层凹槽的基板的制作方法
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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106793582A (zh) * 2016-11-25 2017-05-31 深圳崇达多层线路板有限公司 一种刚挠结合板的制作方法
JP2017152493A (ja) * 2016-02-23 2017-08-31 京セラ株式会社 印刷配線板の製造方法
CN107846793A (zh) * 2017-10-30 2018-03-27 高德（江苏）电子科技有限公司 一种软硬结合板使用硬板方式压合的工艺
CN110446371A (zh) * 2019-09-05 2019-11-12 高德（江苏）电子科技有限公司 一种软硬结合板使用纯胶半压的加工方法
CN112672510A (zh) * 2020-12-07 2021-04-16 高德（无锡）电子有限公司 一种超薄印刷线路软硬结合板树脂塞孔的加工方法
CN112672514A (zh) * 2020-12-30 2021-04-16 黄石西普电子科技有限公司 一种软硬结合板的制备方法及其软硬结合板
CN112739072A (zh) * 2020-11-29 2021-04-30 黄石西普电子科技有限公司 一种软硬结合板的制备方法
CN113382536A (zh) * 2021-07-27 2021-09-10 生益电子股份有限公司 一种pcb的制备方法及pcb
CN114173484A (zh) * 2021-12-15 2022-03-11 生益电子股份有限公司 刚挠结合板及其制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202059677U (zh) * 2011-05-26 2011-11-30 颜坚展 一种防积水型柔性印刷电路板
CN102933042B (zh) * 2012-10-17 2015-01-14 无锡江南计算技术研究所 软硬结合板凹槽区软板防粘胶方法
CN104582309A (zh) * 2013-10-14 2015-04-29 北大方正集团有限公司 软硬结合电路板及其制作方法
US20170238416A1 (en) * 2016-02-17 2017-08-17 Multek Technologies Limited Dummy core restrict resin process and structure
CN108617113A (zh) * 2018-06-13 2018-10-02 深圳崇达多层线路板有限公司 一种pp加保护胶带制作软硬结合板的方法
KR101980102B1 (ko) * 2019-01-16 2019-05-20 신덕전자(주) 리지드 플렉시블 ｐｃｂ 제조방법
CN112654179A (zh) * 2020-12-07 2021-04-13 高德（无锡）电子有限公司 一种印刷线路软硬结合板后开盖的加工工艺

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017152493A (ja) * 2016-02-23 2017-08-31 京セラ株式会社 印刷配線板の製造方法
CN106793582A (zh) * 2016-11-25 2017-05-31 深圳崇达多层线路板有限公司 一种刚挠结合板的制作方法
CN107846793A (zh) * 2017-10-30 2018-03-27 高德（江苏）电子科技有限公司 一种软硬结合板使用硬板方式压合的工艺
CN110446371A (zh) * 2019-09-05 2019-11-12 高德（江苏）电子科技有限公司 一种软硬结合板使用纯胶半压的加工方法
CN112739072A (zh) * 2020-11-29 2021-04-30 黄石西普电子科技有限公司 一种软硬结合板的制备方法
CN112672510A (zh) * 2020-12-07 2021-04-16 高德（无锡）电子有限公司 一种超薄印刷线路软硬结合板树脂塞孔的加工方法
CN112672514A (zh) * 2020-12-30 2021-04-16 黄石西普电子科技有限公司 一种软硬结合板的制备方法及其软硬结合板
CN113382536A (zh) * 2021-07-27 2021-09-10 生益电子股份有限公司 一种pcb的制备方法及pcb
CN114173484A (zh) * 2021-12-15 2022-03-11 生益电子股份有限公司 刚挠结合板及其制作方法

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