WO2023005303A1 - 一种电子设备以及中框的制造方法 - Google Patents

一种电子设备以及中框的制造方法 Download PDF

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Publication number
WO2023005303A1
WO2023005303A1 PCT/CN2022/089551 CN2022089551W WO2023005303A1 WO 2023005303 A1 WO2023005303 A1 WO 2023005303A1 CN 2022089551 W CN2022089551 W CN 2022089551W WO 2023005303 A1 WO2023005303 A1 WO 2023005303A1
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WO
WIPO (PCT)
Prior art keywords
welding
frame
middle plate
holes
hole
Prior art date
Application number
PCT/CN2022/089551
Other languages
English (en)
French (fr)
Inventor
张春晓
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to EP22808565.0A priority Critical patent/EP4149096A4/en
Publication of WO2023005303A1 publication Critical patent/WO2023005303A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly

Definitions

  • the present application relates to the field of communication technology, and in particular to an electronic device and a manufacturing method of a middle frame.
  • Laser welding generally uses a continuous laser beam to complete the joining of materials.
  • Laser radiation heats the surface of the workpiece, and the surface heat diffuses to the interior through heat conduction.
  • the parameters such as the width, energy, peak power and repetition frequency of the laser pulse, the workpiece is melted to form a specific molten pool.
  • the absorption of the incident laser is related to the smoothness of the welding surface. The smoother the surface, the higher the reflectivity of the laser and the lower the absorption of the laser, which will directly affect the welding quality.
  • the metal middle frame of the mobile terminal can be obtained by connecting the middle plate and the frame into one by laser welding, wherein the middle plate is generally die-cast aluminum alloy, and the frame is generally formed aluminum.
  • the welding surfaces of the midplate and frame are usually machined.
  • the surface of the machined aluminum alloy is smooth, and at this time, the reflectivity of the laser can be greater than 70%. That is to say, at this time, less than 30% of the laser light is absorbed by the middle frame metal.
  • the embodiment of the present application provides an electronic device and a manufacturing method of the middle frame, by increasing the laser absorption rate, improving the quality of the solder joints, and then solving some problems affecting the performance of the whole machine (such as poor test of the antenna of the whole machine).
  • an embodiment of the present application provides an electronic device.
  • the electronic device includes a middle frame, and the middle frame includes: a frame and a middle plate; the frame is arranged around the edge of the middle plate; the middle plate is provided with a plurality of welding columns; A plurality of through holes corresponding to the position and size of the plurality of welding posts, the plurality of welding posts and the plurality of through holes form a one-to-one correspondence with the holes; the surfaces of the plurality of welding posts and the surfaces of the plurality of through holes are rough surfaces;
  • the frame and the middle plate are connected by laser welding at the joints of each welding column and the through hole, and the rough surface is used to increase the laser absorption at the joint of the welding column and the through hole during laser welding.
  • the laser absorption at the joint between the welding post and the through hole is effectively increased, the welding quality is improved, and some problems affecting the performance of the whole machine (such as poor test of the antenna of the whole machine) are solved.
  • the welding columns and the through holes are formed in a one-to-one correspondence to form a hole axis fit to complete the positioning of the frame and the middle plate, thereby determining Welding area and welding surface, so as to ensure that the welding surface is a rough surface, thereby improving the laser absorption of the welding surface.
  • the plurality of welding posts are all rectangular welding posts with rounded corners; and the plurality of through holes are all rectangular through holes with rounded corners.
  • the strength of the welding post is improved by providing the welding post with rounded rectangles, so that the root of the welding post is less prone to breakage during welding.
  • the plurality of welding columns includes at least one first welding column and at least one second welding column, the first welding column is a circular welding column, and the second welding column is a rounded rectangular welding column;
  • the holes include at least one first through hole and at least one second through hole, the first through hole is a circular through hole, and the second through hole is a rounded rectangular through hole; wherein, at least one first welding column and at least one first through hole A one-to-one correspondence of the through holes forms a hole-axis fit, and at least one second welding post and at least one second through-hole correspond to one-to-one form a hole-axis fit.
  • the middle plate is a rectangular middle plate, and at least one first welding post and/or at least one second welding post are arranged on each edge of the middle plate.
  • the strength of the welding column is improved, so that the root of the welding column is not easy to break during welding.
  • the realization method can also reduce the requirement of processing precision, which is beneficial to mass production.
  • the middle frame further includes: an exhaust groove; the exhaust groove is arranged around the root of at least one first welding column and/or at least one second welding column, and the exhaust groove is used to exhaust the gas produced during laser welding. gas and increase the depth of the weld pool during laser welding.
  • the rough surface of the welding post is obtained by film treatment, and the welding post meets the requirement that the surface glossiness is less than 20Gu.
  • the surface roughness of the through hole is between Ra3.2 ⁇ Ra5.
  • the surface roughness value of the through hole reaches Ra3.2-Ra5
  • the surface gloss of the welding column is less than 20Gu, which effectively improves the welding laser absorption rate, thereby improving the welding quality.
  • the embodiment of the present application provides a method for manufacturing a middle frame.
  • the middle frame includes a middle plate and a frame.
  • the method includes: obtaining the middle plate through a die-casting molding process, and setting a plurality of welding columns on the middle plate; coating the middle plate Processing, so that at least the surface of the plurality of welding posts is a rough surface; machining the profile aluminum to obtain a frame, the frame is provided with a plurality of through holes corresponding to the positions and sizes of the plurality of welding posts; surface treatment is performed on the frame , so that at least the surface of the plurality of through holes is a rough surface; the frame is installed on the middle plate, so that the plurality of welding columns correspond to the plurality of through holes to form a hole axis fit; the frame and the middle plate are connected to each welding column
  • the joints with the through holes are connected into an integral structure by laser welding.
  • the surface gloss and roughness of the frame are reduced by chemical sanding, and the surface gloss and roughness of the middle plate are reduced by film treatment.
  • the surface roughness of the frame reaches Ra3.2 ⁇ Ra5
  • the surface of the middle plate The surface gloss is less than 20Gu, which can effectively improve the welding laser absorption rate, thereby improving the welding quality.
  • make the laser absorption rate reach more than 60%, the welding process is more stable, and it is easy to obtain greater penetration under low power welding power.
  • performing film treatment on the middle plate to at least make the surfaces of the plurality of welding posts a rough surface includes: performing film treatment on the middle plate to at least make the surfaces of the plurality of welding posts meet the requirement that the surface glossiness is less than 20 Gu.
  • surface treatment is performed on the frame to at least make the surface of the plurality of through holes a rough surface, including: performing chemical sandblasting on the frame so that the surface roughness of the through hole surface is at least Ra3.2 ⁇ Ra5 between.
  • the surface roughness value of the through hole reaches Ra3.2-Ra5
  • the surface gloss of the welding column is less than 20Gu, which effectively improves the welding laser absorption rate, thereby improving the welding quality.
  • Figure 1 is a schematic diagram of a common middle frame structure at present
  • Figure 2a is a schematic diagram of a split structure of a spliced middle frame
  • Figure 2b is a schematic diagram of the A-A partial section of the welding area in the middle frame
  • Fig. 3 is a schematic diagram of welding laser absorption in which the welding surface in the middle frame shown in Fig. 2a is a machined surface;
  • Fig. 4a is a schematic structural diagram of a first embodiment of a middle frame provided by the present application.
  • Fig. 4b is a schematic diagram of splitting the middle frame shown in Fig. 4a;
  • Fig. 5 is a partially enlarged schematic diagram of the welding column when the middle plate in the middle frame provided by the present application is die-cast aluminum;
  • Fig. 6 is a partially enlarged schematic diagram of a middle frame provided by the present application.
  • Fig. 7a is a schematic structural diagram of an embodiment of a middle frame in a middle board provided by the present application.
  • Fig. 7b is a partial B-B sectional schematic diagram of the middle plate shown in Fig. 7a;
  • Fig. 8a is a pre-process flow chart of the middle frame in a manufacturing method of the middle frame provided by the present application;
  • Fig. 8b is a process flow chart of the pre-process of the middle plate in a manufacturing method of the middle frame provided by the present application;
  • Fig. 8c is a process flow diagram of a manufacturing method of a middle frame provided by the present application.
  • FIG. 9 is a schematic diagram of absorption of a welding laser in a manufacturing method of a middle frame provided by the present application.
  • Terminal devices in the form of mobile phones and tablet computers usually include a middle frame structure.
  • Figure 1 is a schematic diagram of a common middle frame structure at present.
  • the middle frame may generally consist of a middle board 2 and a frame 1 arranged around the edge of the middle board.
  • the middle frame can be regarded as the supporting structure of the terminal device.
  • the main board, camera, speaker, battery, handset and other components inside the terminal device can be fixed on the middle board.
  • the connection between the middle board and the frame of the middle frame can also be formed by injection molding.
  • the matching shape of the edge of the rear cover or the edge of the display screen of the terminal device enables the rear cover or display screen of the terminal device to be fastened to both sides of the middle frame.
  • the middle frame of the terminal device generally includes a plastic middle frame and a metal middle frame.
  • the metal middle frame can be an integrally formed structure, which can be obtained through a series of processes on the metal blank.
  • the metal blank is first processed by stamping or forging to form an integrated frame and middle plate structure; then it is obtained by machining The structure of the injection molding position at the junction of the middle plate and the frame, and then inject plastic material into the injection molding position to obtain a shape that matches the edge of the back cover of the terminal device or the edge of the display screen, and finally mechanically process to meet the size requirements and perform surface treatment.
  • the machining process is time-consuming and costly, which seriously affects the development cycle of the whole machine and its competitiveness in the market.
  • Fig. 2a is a schematic diagram of a disassembled structure of a middle frame of a stitching structure.
  • the frame 1 and the middle plate 2 are mutually independent structures. 1 and the middle plate 2 are connected together by laser welding.
  • the frame 1 can be made of formed aluminum
  • the middle plate 2 can be made of die-cast aluminum alloy.
  • Fig. 2b is a schematic diagram of A-A partial cross-section of the welding area in the middle frame.
  • the middle plate 2 is provided with a welding column 21, and the frame 1 is provided with a through hole 11 corresponding to the position and size of the welding column 21.
  • the frame 1 can be placed on the middle plate 2 first. Firstly, the welding post 21 of the middle plate 2 is inserted into the through hole 11 of the frame 1 to realize the positioning of the frame 1 and the middle plate 2, and then the welding post 21 and the through hole 11 are welded together by laser.
  • Fig. 3 is a schematic diagram of welding laser absorption in which the welding surface of the middle frame shown in Fig. 2a is a machined surface.
  • the laser light is incident on the welding area formed by the welding column 21 and the through hole 11, a part of the incident laser light is reflected, and the remaining part of the incident laser light is absorbed by the middle frame metal, and the absorbed laser light It is used to heat the surface of the welding area (ie, the welding surface) to melt the welding column 21 to form a specific molten pool, so as to realize the welding of the frame 1 and the middle plate 2 .
  • the absorption of the incident laser is related to the smoothness of the welding surface, the smoother the surface, the higher the reflectivity of the laser.
  • the reflectivity of the laser can be greater than 70%. That is to say, at this time, less than 30% of the laser light is absorbed by the metal of the middle frame. Too low laser absorption rate will affect the welding quality of laser welding, resulting in virtual welding of solder joints/insufficient depth of molten pool/bubbles/cracks/bursts. point and so on.
  • an embodiment of the present application provides a middle frame.
  • Fig. 4a is a schematic structural diagram of a first embodiment of a middle frame provided by the present application.
  • the middle frame is composed of a middle board 2 and a frame 1 arranged around the edge of the middle board.
  • Fig. 4b is a disassembled schematic diagram of the middle frame shown in Fig. 4a. As shown in FIG. 4 b , multiple welding posts are provided on the middle plate 2 ; multiple through holes are provided on the frame 1 ; and the positions and sizes of the multiple through holes correspond to the multiple welding posts.
  • the frame 1 When laser welding the frame 1 and the middle plate 2, the frame 1 can be placed on the middle plate 2 first, so that the plurality of welding columns of the middle plate 2 can be inserted into the multiple through holes of the frame 1 in a one-to-one correspondence, so that A plurality of welding posts and a plurality of through-holes form a one-to-one correspondence between the holes and shafts to realize the positioning of the frame 1 and the middle plate 2, and then use a laser to weld the welding posts and the through-holes of each hole shaft matching together to realize the frame 1 and the solder connection of the middle plate 2.
  • the surfaces of multiple welding columns and the surfaces of multiple through holes are all rough surfaces; the frame and the middle plate are connected by laser welding at the joints of each welding column and through holes, and the rough surface It is used to increase the laser absorption at the joint between the welding post and the through hole during laser welding. Due to the unevenness of the rough surface, the laser will generate multiple reflections of the laser on the rough surface, and the repeated absorption of the multiple reflections of the laser by the rough surface will increase the laser absorption.
  • the surface roughness of the frame 1 reaches Ra3.2 ⁇ Ra5, and the surface gloss of the middle plate 2 is less than 20Gu.
  • the frame 1 can increase its surface roughness by removing materials, such as chemical sanding; the middle plate 2 can ensure the glossiness requirement by adding a dense film layer, such as film treatment.
  • a dense film layer such as film treatment.
  • this application does not make a limitation.
  • chemical blasting may be performed on the entire frame 1, or only locally on the welding surface, which is not limited in this application.
  • the film treatment may be performed on the entire middle plate 2 , or only locally on the welding surface, which is not limited in this application.
  • the shapes and/or sizes of the plurality of welding columns may be the same or different.
  • the plurality of welding columns may all be circular welding columns, or all be rounded rectangular welding columns, or all be welding columns of a certain shape, correspondingly , the plurality of through holes may all be circular through holes, or all be rounded rectangular through holes, or all be through holes of a certain other shape.
  • the plurality of welding columns have the same shape and/or size, which can reduce the processing difficulty, lower the precision requirement of the blank, and facilitate mass production.
  • a part of the welding posts may be circular welding posts, and another part of the welding posts may be rounded rectangular welding posts, correspondingly, the first part of the through holes may be circular through holes, and another part of the through holes may be rectangular through holes with rounded corners.
  • the frame and the middle plate are connected by small cylinders, the strength is weak, and the root of the welding column is prone to breakage; when the rounded rectangular welding column is set, the connection position between the frame and the middle plate is high in strength, and the root of the welding column is not easy to break fracture.
  • the rounded rectangular welding column can ensure the welding strength, and the number of circular welding columns can be reasonably set to reduce the accuracy requirements of the blank, which is conducive to mass production .
  • At least one first welding post 201 and at least one second welding post 202 are provided on the middle plate 2; a first through hole 101 and a second through hole 102 are provided on the frame 1 ;
  • the first welding column 201 is a circular welding column, and the second welding column 202 is a rounded rectangular welding column; the first through hole 101 is a circular through hole, and the second through hole 102 is a rounded rectangular through hole;
  • the hole 101 corresponds to the position and size of the first welding post 201 ;
  • the second through hole 102 corresponds to the position and size of the second welding post 202 .
  • At least one first welding post 201 is in a one-to-one correspondence with at least one first through hole 101 to form a one-to-one axial fit
  • at least one second welding post 202 is in a one-to-one correspondence with at least one second through hole 102 to form a one-to-one axial fit.
  • the middle frame is used as a structural component.
  • the frame 1 and the middle plate 2 can both be set to be rectangular.
  • the long sides of the rounded rectangles of the second welding posts 202 and the second through holes 102 are preferably parallel to the edges of the adjacent middle plate.
  • each edge of the middle plate is preferably at least corresponding to A second welding post 202 is provided, and correspondingly, a second through hole 102 corresponding to its size and position is provided on the frame 1 .
  • the frame 1 When laser welding the frame and the middle plate, the frame 1 can be placed on the middle plate 2 first, so that the first welding column 201 of the middle plate 2 is inserted into the first through hole 101 of the frame 1, and the middle plate 2
  • the second welding column 202 of the frame 1 is inserted into the second through hole 102 of the frame 1 to realize the positioning of the frame 1 and the middle plate 2, and then the first welding column 201 and the first through 2 hole 101 are welded together by laser, and the second The two welding posts 202 and the second through hole 102 are welded together to realize the welding connection between the frame 1 and the middle plate.
  • the plurality of first welding columns 201 and the plurality of second welding columns 202 are distributed around the middle plate 2 at intervals on the edge of the middle plate 2, and the plurality of first welding columns 201 and the plurality of second welding columns 202 It is preferably distributed alternately, and there is a certain distance between two adjacent welding columns.
  • the rectangular middle plate 2 as an example, one or more welding columns are distributed on each edge of the upper surface of the middle plate 2.
  • at least one first welding column 201 and at least one welding column 201 are arranged on each side of the upper surface of the middle plate 2.
  • a second welding column 202 for example, in the structure shown in Figure 4b, each short side of the middle plate 2 is distributed with a first welding column and a second welding column, and each long side is distributed with two first welding columns.
  • a welding column and a second welding column, the two first welding columns may or may not be adjacent.
  • a plurality of first through holes 101 corresponding to the number, position and size of the plurality of first welding posts 201 are provided on the frame 1, and a plurality of first through holes 101 corresponding to the number, position and size of the plurality of second welding posts 202 are provided on the frame 1.
  • a plurality of second through holes 102 It can be understood that the greater the number of welding columns, the higher the welding strength, but the processing accuracy requirements are also increased. Therefore, the number of welding columns should be kept within a reasonable numerical range. This application does not apply to the number of welding columns The number is specifically limited.
  • the distance between the centers of the adjacent first welding posts 201 and the second welding posts 202 is a first preset distance.
  • the first preset distance can be determined by the size of the middle frame. The larger the size of the middle frame, the larger the first preset distance; Smaller, the higher the welding strength, so the first preset distance will not increase without limit. The present application does not limit the specific value of the first preset distance.
  • the thickness of the frame 1 is smaller than the height of the first welding post 201, and the height difference is preferably 0.3-0.5 mm; the thickness of the frame 1 is smaller than the height of the second welding post 202, and the height difference is preferably 0.3-0.5 mm .
  • the midplate is die-cast aluminum.
  • Fig. 5 is a partially enlarged schematic diagram of a welding column provided by the present application when the middle plate in the middle frame is made of die-cast aluminum. As shown in FIG. 5 , both the first welding column 201 and the second welding column 202 are columns with a small top and a large root, that is, the dimension L of the top of the welding column is smaller than the dimension I of the root of the welding column. The inclination angle of the bus bar is limited by the die-casting process, which is not limited in this application.
  • the gap between the first through hole 101 and the first welding post 201 is preferably 0.05-0.08 mm; at the head of the first welding post 201, the first through hole 101 and the The gap between the first welding column 201 is preferably 0.1mm-0.2mm; at the root of the second welding column 202, the gap between the second through hole 102 and the second welding column 202 is preferably 0.05-0.08mm; the second welding column 202 head , the gap between the second through hole 102 and the second welding post 202 is preferably 0.1mm-0.2mm.
  • FIG. 6 is a partially enlarged schematic diagram of a middle frame provided in the present application. As shown in FIG. 6 , the exhaust groove 203 is disposed around the root of the second welding post 202 .
  • Fig. 7a is a schematic structural diagram of an embodiment of a middle frame in a middle board provided by the present application.
  • the second welding column 202 is a rectangular welding column with rounded corners
  • the exhaust groove 203 is an annular groove arranged around the second welding column 202 having a rectangular shape with rounded corners.
  • Fig. 7b is a partial B-B sectional schematic view of the middle plate shown in Fig. 7a.
  • the exhaust groove 203 has a certain depth, and the exhaust groove 203 is used for exhausting gas generated during laser welding and increasing the depth of the weld pool during laser welding.
  • the root of the first welding column 201 can also be provided with an exhaust groove in a surrounding manner, with a certain depth, and the exhaust groove is used to discharge the gas generated during laser welding and increase the depth of the welding pool during laser welding .
  • the middle frame and middle plate provided by the present application are provided with rounded rectangular welding columns, which can improve the laser absorption rate of the welding surface, thereby improving the welding quality of the welding joint between the middle plate and the frame.
  • the welding column with rounded corners has high strength, so that the root of the welding column is not easy to break during welding; the exhaust groove is added at the root of the welding column to facilitate exhaust and increase the depth of the welding pool, so that the effective welding increases.
  • This application further solves some problems affecting the performance of the whole machine (such as poor test of the antenna of the whole machine) by improving the quality of solder joints.
  • Fig. 8a is a flow chart of the pre-process of the middle frame in a manufacturing method of the middle frame provided by the present application. As shown in Fig. 8a, the manufacturing method of the middle frame includes the following steps S1-S2.
  • the frame is a rectangular annular frame, and a plurality of through holes are provided on the frame, and the shapes and/or sizes of the plurality of through holes may be the same or different.
  • the multiple through holes may all be circular through holes, or all be rounded rectangular through holes, or all be through holes of a certain other shape.
  • some of the through holes may be circular through holes, and the other part of the through holes may be rectangular through holes with rounded corners.
  • the frame is provided with a first through hole and a second through hole, the first through hole is a circular through hole, and the second through hole is a rounded rectangular through hole.
  • the plurality of first through holes and the plurality of second through holes are distributed around the frame at intervals on the edge of the frame, the plurality of first through holes and the plurality of second through holes are preferably alternately distributed, and two adjacent There is a certain distance between the through holes.
  • one or more through holes are distributed on each side of the upper surface of the frame, preferably at least one first through hole and at least one second through hole are provided on each side of the upper surface of the frame, for example , in the structure shown in Figure 4b, each short side of the frame is distributed with a first through hole and a second through hole, and each long side is distributed with two first through holes and a second through hole, which The two first through holes may or may not be adjacent.
  • the frame obtained in S1 is chemically sanded to make the surface roughness of the product reach Ra3.2 ⁇ Ra5.
  • the surface of the frame after the chemical sand blasting treatment is in a matte state.
  • chemical sand blasting refers to immersing the product in an acidic solution, supplemented with organic additives, and corroding at high temperature.
  • Fig. 8b is a process flow chart of the pre-process of the middle plate in a manufacturing method of the middle frame provided by the present application. As shown in Fig. 8b, the process flow of the middle plate includes the following steps S01-S02.
  • the middle plate is obtained through a die-casting molding process.
  • multiple welding posts are provided on the middle plate, and the shapes and/or sizes of the multiple welding posts may be the same or different.
  • the plurality of welding posts may all be circular welding posts, or all be rounded rectangular welding posts, or all be welding posts of a certain other shape.
  • some of the welding columns may be circular welding columns, and the other part of the welding columns may be rounded rectangular welding columns.
  • the plurality of through holes provided on the frame in the above S1 corresponds to the number, position and size of the plurality of welding posts provided in step S01.
  • the middle plate is provided with a first welding column and a second welding column, the first welding column is a circular welding column, and the second welding column is a rounded rectangular welding column; it can be understood that the above S1
  • the first through hole on the middle frame corresponds to the position and size of the first welding column set in this step S01; the second through hole on the middle frame of the above S1 corresponds to the position and size of the second welding column set in this step S01. correspond.
  • a plurality of first welding columns and a plurality of second welding columns are distributed on the edge of the middle plate at intervals around the middle plate, and the plurality of first welding columns and the plurality of second welding columns are preferably distributed alternately, adjacent to each other. There is a certain distance between the two welding posts.
  • one or more welding columns are distributed on each edge of the upper surface of the middle plate, preferably at least one first welding column and at least one second welding column are arranged on each side of the upper surface of the middle plate.
  • each short side of the middle plate is distributed with a first welded column and a second welded column
  • each long side is distributed with two first welded columns and a second welded column.
  • Welding columns the two first welding columns may or may not be adjacent to each other.
  • the surface of the blank obtained in S01 is treated with a coating film so that its surface gloss is less than 20 Gu.
  • the surface of the middle plate after film treatment is in a matte state, and the lower the specular reflectance, the lower the gloss.
  • the film treatment refers to reacting the phosphate with the blank of the die-cast aluminum plate to form a dense film layer that closely adheres to the surface of the metal.
  • Fig. 8c is a process flow diagram of a manufacturing method of a middle frame provided by the present application. As shown in FIG. 8b, the manufacturing method of the middle frame includes the following steps S001-S004.
  • the welding method is laser welding.
  • the frame is placed on the middle plate, so that the first welding post of the middle plate is inserted into the first through hole of the frame, and the second welding post of the middle plate Inserting it into the second through hole of the frame to realize the positioning of the frame and the middle plate, and then using a laser to weld the first welding column and the first through hole together, and welding the second welding column and the second through hole together, and then Weld the frame and mid-plate together.
  • the distance between the weld seam and the side wall is greater than 0.4 mm, so as to avoid the problem of blocking the laser path due to too small a size.
  • FIG. 9 is a schematic diagram of absorption of a welding laser in a manufacturing method of a middle frame provided by the present application.
  • the surface gloss and roughness of the frame are reduced by chemical sandblasting, and the surface gloss and roughness of the middle plate are reduced by film treatment, so that the laser absorption rate can reach more than 60%, and the welding process is more stable. High power welding power is easy to obtain greater penetration.
  • an exhaust groove is added to the root of the die-casting aluminum alloy welding column, that is, the exhaust groove is arranged around the root of the second welding column, and the exhaust groove has a certain depth to facilitate exhaust and increase the depth of the weld pool.
  • the nanopore size is preferably 40-60 nm.
  • S004 perform in-mold injection molding on the middle frame processed in S003, that is, fill the space between the middle plate and the frame with plastic, thereby increasing the bonding force between the die-casting aluminum alloy middle plate and the profile aluminum middle frame.
  • machining can be carried out before injection molding, so that the outer length and width of the product can ensure the dimensional accuracy in place before injection molding, thereby ensuring the stability of the gap between the outer length and width of the product and the slider of the injection mold;
  • the injection positioning hole needs to be processed in place at the same clamping position as the product shape, so as to ensure the stability of the gap between the product's outer length and width and the injection mold slider.
  • polishing the product surface by using a polishing wheel polishing the product surface by using a polishing wheel; obtaining the required product surface hardness, wear resistance and corrosion resistance performance and product appearance through anodic oxidation Effect.
  • the middle frame is used to fix the back cover, screen and internal components, and a bracket and a battery are arranged between the middle frame and the back cover.
  • one side of the middle frame is assembled with the screen, which acts as a partition between the screen and electronic components; at the same time, the middle frame also provides a more reliable and firm installation foundation for each electronic component; the middle frame
  • the other side of the phone is assembled with the back cover to protect the mobile terminal from impact.
  • the manufacturing method of the middle frame provided by this application reduces the surface gloss and roughness of the frame by chemical sand blasting, and reduces the gloss and roughness of the middle plate by film treatment, so that the laser absorption rate can reach more than 60%, and the welding process is more stable , and it is easy to obtain a larger penetration depth under low-power welding power; in one implementation mode, an exhaust groove is added to the root of the die-casting aluminum alloy welding post to facilitate exhaust and increase the depth of the welding pool.
  • This application further solves some problems affecting the performance of the whole machine (such as poor test of the antenna of the whole machine) by improving the quality of solder joints.
  • the embodiment of the present application also provides an electronic device, including the middle frame provided in the above embodiments, the middle frame can be obtained by the manufacturing method of the middle frame provided in the embodiment of the present application, and the terminal device can include, for example, a mobile terminal, a tablet computer, a personal Computers, workstation equipment, large-screen equipment (such as smart screens, smart TVs, etc.), handheld game consoles, home game consoles, virtual reality equipment, augmented reality equipment, mixed reality equipment, etc., vehicle-mounted intelligent terminals, self-driving cars, user premises Equipment (customer-premises equipment, CPE), etc.
  • a mobile terminal including the middle frame provided in the above embodiments
  • the middle frame can be obtained by the manufacturing method of the middle frame provided in the embodiment of the present application
  • the terminal device can include, for example, a mobile terminal, a tablet computer, a personal Computers, workstation equipment, large-screen equipment (such as smart screens, smart TVs, etc.), handheld game consoles, home game consoles, virtual reality equipment, augmented reality

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Abstract

一种电子设备，包括中框，中框包括边框（1）和中板（2）；边框（1）环绕中板（2）边缘设置；中板（2）设置有多个焊接柱（21）；边框（1）设置有与多个焊接柱（21）位置和尺寸相对应的多个通孔（11），多个焊接柱（21）与多个通孔（11）一一对应形成孔轴配合；多个焊接柱（21）的表面和多个通孔（11）的表面均为粗糙表面；边框（1）和中板（2）在各个焊接柱（21）和通孔（11）的配合处通过激光焊接连接，粗糙表面用于在激光焊接时增加焊接柱（21）和通孔（11）配合处的激光吸收量。通过设置粗糙表面，有效提高焊接激光吸收率，进而提高焊接质量。还提供了一种中框的制造方法。

Description

一种电子设备以及中框的制造方法
本申请要求在2021年7月29日提交中国专利局、申请号为202110869182.6、发明名称为“一种电子设备以及中框的制造方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，尤其涉及一种电子设备以及中框的制造方法。
背景技术
激光焊接一般采用连续激光光束完成材料的连接。激光辐射加热工件表面，表面热量通过热传导向内部扩散，通过控制激光脉冲的宽度、能量、峰值功率和重复频率等参数，使工件熔化，形成特定的熔池。可见，入射激光的吸收率越高，在工件内部扩散的热量越高，越有利于形成熔池。而入射激光的吸收量与焊接表面的光滑程度有关，表面越光滑，激光的反射率越高，激光的吸收率越低，这样会直接影响焊接质量。
移动终端的金属中框可以通过将中板和边框以激光焊接连接为一体的方式获得，其中，中板一般为压铸铝合金，边框一般为成型铝。中板和边框的焊接表面通常采用机加工的方式。机加工后的铝合金表面光滑，此时，激光的反射率可以大于70％。也就是说，此时只有不到30％的激光被中框金属吸收。
然而，过低的激光吸收率，会影响激光焊接的焊接质量，造成焊点虚焊、熔池深度不足、气泡、裂纹以及炸点等问题，进而影响整机的质量。
发明内容
本申请实施例提供了一种电子设备以及中框的制造方法，通过提高激光吸收率，提高焊点质量，进而解决某些影响整机性能的问题(如整机天线测试不良)。
第一方面，本申请实施例提供了一种电子设备，电子设备包括中框，中框包括：边框和中板；边框环绕中板边缘设置；中板设置有多个焊接柱；边框设置有与多个焊接柱位置和尺寸相对应的多个通孔，多个焊接柱与多个通孔一一对应形成孔轴配合；多个焊接柱的表面和多个通孔的表面均为粗糙表面；边框与中板在各个焊接柱和通孔的配合处通过激光焊接连接，粗糙表面用于在激光焊接时增加焊接柱与通孔配合处的激光吸收量。
这样，通过设置粗糙表面，有效提高焊接柱与通孔配合处的激光吸收量，提高焊接质量，进而解决某些影响整机性能的问题(如整机天线测试不良)。另外，通过设置多个焊接柱以及与焊接柱一一对应的通孔，在焊接时，使得焊接柱和通孔通过一一对应形成孔轴配合的方式，完成边框和中板的定位，从而确定焊接区域以及焊接表面，从而保证焊接表面为粗糙表面，进而提高焊接表面的激光吸收量。
在一种实现方式中，多个焊接柱均为圆角矩形焊接柱；多个通孔均为圆角矩形通孔。
这样，通过设置圆角矩形的焊接柱，提高焊接柱强度，使得焊接时，焊柱根部不易发生断裂问题。
在一种实现方式中，多个焊接柱包括至少一个第一焊接柱和至少一个第二焊接柱，第一焊接柱为圆形焊接柱，第二焊接柱为圆角矩形焊接柱；多个通孔包括至少一个第一通孔和至少一个第二通孔，第一通孔为圆形通孔，第二通孔为圆角矩形通孔；其中，至少一个第一焊接柱与至少一个第一通孔一一对应形成孔轴配合，至少一个第二焊接柱与至少一个第二通孔一一对应形成孔轴配合。
在一种实现方式中，中板为矩形中板，中板的每一条边线上设置有至少一个第一焊接柱和/或至少一个第二焊接柱。
这样，通过设置至少一个第一焊接柱和至少一个第二焊接柱，既提高焊接柱强度，使得焊接时，焊柱根部不易发生断裂问题，相对于全部设置为第二焊接柱的技术方案，本实现方式又能使得加工精度的要求降低，有利于批量生产。
在一种实现方式中，中框还包括；排气槽；排气槽围绕设置在至少一个第一焊接柱和/或至少一个第二焊接柱的根部，排气槽用于排出激光焊接时产生的气体以及增加激光焊接时焊接熔池深度。
这样，通过在压铸铝合金焊接柱根部增加排气槽，便于排气及增加焊接熔池深度。
在一种实现方式中，焊接柱的粗糙表面是由皮膜处理得到的，焊接柱满足表面光泽度小于20Gu。
在一种实现方式中，通孔的表面粗糙度值在Ra3.2～Ra5之间。
这样，通过设置粗糙表面，通孔的表面粗糙度值达到Ra3.2～Ra5，焊接柱的表面光泽度＜20Gu，有效提高焊接激光吸收率，进而提高焊接质量。
第二方面，本申请实施例提供了一种中框的制造方法，中框包括中板和边框，方法包括：通过压铸成型工艺获得中板，中板设置多个焊接柱；对中板进行皮膜处理，以至少使多个焊接柱的表面为粗糙表面；对型材铝进行机加工，得到边框，边框上设置有与多个焊接柱位置和尺寸相对应的多个通孔；对边框进行表面处理，以至少使多个通孔的表面为粗糙表面；将边框安装于中板之上，使多个焊接柱与多个通孔一一对应形成孔轴配合；将边框与中板在各个焊接柱和通孔的配合处通过激光焊接连接成一体结构。
这样，通过化学打砂降低边框表面光泽度及粗糙度，以及通过皮膜处理降低中板表面光泽度及粗糙度，通过设置粗糙表面，边框的表面粗糙度值达到Ra3.2～Ra5，中板的表面光泽度＜20Gu，有效提高焊接激光吸收率，进而提高焊接质量。使激光吸收率达到60％以上，焊接过程更稳定，且在小功率焊接功率下易获得较大熔深。
在一种实现方式中，对中板进行皮膜处理，以至少使多个焊接柱的表面为粗糙表面，包括：对中板进行皮膜处理，以至少使多个焊接柱的表面满足表面光泽度小于20Gu。
在一种实现方式中，对边框进行表面处理，以至少使多个通孔的表面为粗糙表面，包括：对边框进行化学打砂，以至少使通孔表面的表面粗糙度值在Ra3.2～Ra5之间。
这样，通过设置粗糙表面，通孔的表面粗糙度值达到Ra3.2～Ra5，焊接柱的表面光泽度＜20Gu，有效提高焊接激光吸收率，进而提高焊接质量。
附图说明
图1是目前一种常见的中框结构示意图；
图2a是一种拼接结构的中框的拆分结构示意图；
图2b是中框中焊接区域的A-A局部剖面示意图；
图3是图2a所示的中框中焊接表面为机加工表面的焊接激光吸收示意图；
图4a是本申请提供的一种中框的第一种实施例的结构示意图；
图4b是图4a所示的中框的拆分示意图；
图5是本申请提供的一种中框中中板为压铸铝时焊接柱的局部放大示意图；
图6是本申请提供的一种中框的局部放大示意图；
图7a是本申请提供的一种中框中中板的一种实施例的结构示意图；
图7b是图7a所示的中板的局部B-B剖面示意图；
图8a是本申请提供的一种中框的制造方法中边框的前序工艺流程图；
图8b是本申请提供的一种中框的制造方法中中板的前序工艺流程图；
图8c是本申请提供的一种中框的制造方法的工艺流程图；
图9是本申请提供的一种中框的制造方法中焊接激光的吸收示意图。
具体实施方式
手机、平板电脑等形态的终端设备通常包含中框结构。图1是目前一种常见的中框结构示意图。如图1所示，中框一般可以由中板2以及环绕中板边缘设置的边框1组成。中框可以视作终端设备的支撑结构，终端设备内部的主板、摄像头、扬声器、电池、听筒等组件均可以固定于中板上，中框的中板和边框的连接处还可以通过注塑形成与终端设备的后盖边缘或显示屏边缘相匹配的形状，使终端设备的后盖或显示屏能够扣合在中框的两侧。
终端设备的中框一般包括塑料中框和金属中框。金属中框可以是一体成型结构，可以通过对金属毛坯件进行一系列工艺制程得到，例如，先通过冲压或者锻造工艺加工金属毛坯件，成型出一体的边框和中板结构；然后通过机械加工得到中板和边框的连接处的注塑位结构，再向注塑位注入塑性材料得到与终端设备的后盖边缘或显示屏边缘相匹配的形状，最后再机械加工以满足尺寸要求以及进行表面处理。在上述工艺制程中，机械加工制程耗时长，成本高，严重影响整机开发周期及在市场竞争力。
因此，为了缩短产品开发周期及降低开发成本，一些金属中框由原来的一体结构改为拼接结构。图2a是一种拼接结构的中框的拆分结构示意图。如图2a所示，在拼接结构的中框中，边框1和中板2是相互独立的结构，在制作拼接结构的中框时，首先分别制作出边框1和中板2，然后再将边框1和中板2通过激光焊接连接在一起。一般来说，边框1可以为成型铝材质，中板2可以为压铸铝合金材质。图2b是中框中焊接区域的A-A局部剖面示意图。如图2所示，中板2上设置有焊接柱21，边框1上设置与焊接柱21的位置和尺寸相对应的通孔11，在焊接时，可以首先将边框1置于中板2之上，使中板2的焊接柱21插入到边框1的通孔11中，实现边框1与中板2的定位，然后采用激光将焊接柱21和通孔11焊接在一起。
可以理解的是，为保证焊接强度，通常，中板2上连续设置多个焊接柱21，则边 框1上设置多个与“焊接柱21”对应的通孔11，用以在激光焊接时，焊接柱21插入对应的通孔11中。
图3是图2a所示的中框的焊接表面为机加工表面的焊接激光吸收示意图。如图3所示，焊接时，激光作为入射光，射入焊接柱21和通孔11形成的焊接区域，一部分入射激光被反射，剩下的部分入射激光被中框金属吸收，被吸收的激光用以加热焊接区域的表面(即焊接表面)，使焊接柱21熔化，形成特定的熔池，以实现边框1和中板2的焊接。
入射激光的吸收量与焊接表面的光滑程度有关，表面越光滑，激光的反射率越高。例如：当焊接表面采用机加工的方式时，激光的反射率可以大于70％。也就是说，此时只有不到30％的激光被中框金属吸收，过低的激光吸收率，会影响激光焊接的焊接质量，造成焊点虚焊/熔池深度不足/气泡/裂纹/炸点等问题。
为提高焊接表面的激光吸收率，进而提高中板和边框的焊接结合处的焊接质量，本申请实施例提供一种中框。
图4a是本申请提供的一种中框的第一种实施例的结构示意图。如图4a所示，中框由中板2以及环绕中板边缘设置的边框1组成。
图4b是图4a所示的中框的拆分示意图。如图4b所示，中板2上设置有多个焊接柱；边框1上设置有多个通孔；多个通孔与多个焊接柱的位置和尺寸相对应。在对边框1和中板2激光焊接时，可以首先将边框1置于中板2之上，使中板2的多个焊接柱一一对应地插入到边框1的多个通孔中，使多个焊接柱与多个通孔一一对应地形成孔轴配合，实现边框1与中板2的定位，然后采用激光分别将各个孔轴配合的焊接柱和通孔焊接在一起，进而实现边框1和中板2的焊接连接。
其中，为提高焊接表面的激光吸收率，多个焊接柱的表面和多个通孔的表面均为粗糙表面；边框与中板在各个焊接柱和通孔的配合处通过激光焊接连接，粗糙表面用于在激光焊接时增加焊接柱与通孔配合处的激光吸收量。由于粗糙表面凹凸不平，激光会在粗糙表面上产生激光多次反射，粗糙表面对激光多次反射的重复吸收，使得激光吸收量提高。
在一种实现方式中，边框1的表面粗糙度值达到Ra3.2～Ra5，中板2的表面光泽度＜20Gu。可以理解的是，边框1可以采用去除材料的形式增大其表面粗糙度，例如化学打砂；中板2可以采用增加致密膜层的方式保证光泽度要求，例如皮膜处理。对于具体的加工形式，本申请不作限定。另外，可以对边框1的整体进行化学打砂，也可以仅针对焊接表面局部进行化学打砂，本申请也不作限定。同样的，可以对中板2的整体进行皮膜处理，也可以仅针对焊接表面局部进行皮膜处理，本申请也不作限定。
本申请实施例中，多个焊接柱的形状和/或尺寸可以相同，也可以不同。例如，当多个焊接柱的形状和/或尺寸相同时，多个焊接柱可以均为圆形焊接柱，或者均为圆角矩形焊接柱，或者均为其他某一形状的焊接柱，相应地，多个通孔可以均为圆形通孔，或者均为圆角矩形通孔，或者均为其他某一形状的通孔。多个焊接柱形状和/或尺寸相同，可以减少加工难度，降低对毛坯件精度要求，有利于批量生产。又例如，当多个焊接柱的形状和/或尺寸不同时，一部分焊接柱可以是圆形焊接柱，另一部分焊接柱可以是圆角矩形焊接柱，相应地，第一部分通孔可以是圆形通孔，另一部分通孔可以是 圆角矩形通孔。设置圆形焊接柱时，边框与中板采用小圆柱连接方式，强度较弱，易发生焊柱根部断裂；设置圆角矩形焊接柱，边框与中板的连接位置强度高，焊柱根部不易发生断裂。通过同时设置圆形焊接柱和圆角矩形焊接柱，能够在圆角矩形焊接柱保证焊接强度的情况下，通过合理设置圆形焊接柱的数量，使得降低对毛坯件精度要求，有利于批量生产。
进一步参见图4b，在一种实现方式中，中板2上设置有至少一个第一焊接柱201和至少一个第二焊接柱202；边框1上设置有第一通孔101和第二通孔102；第一焊接柱201为圆形焊接柱，第二焊接柱202为圆角矩形焊接柱；第一通孔101为圆形通孔，第二通孔102为圆角矩形通孔；第一通孔101与第一焊接柱201的位置和尺寸相对应；第二通孔102与第二焊接柱202的位置和尺寸相对应。其中，至少一个第一焊接柱201与至少一个第一通孔101一一对应形成孔轴配合，至少一个第二焊接柱202与至少一个第二通孔102一一对应形成孔轴配合。
可以理解的是，在手机、平板等电子设备中，设备本身的形态为矩形，因此中框作为结构部件，为适应设备形态，其边框1和中板2可以均设置为矩形。当中板2和边框1为矩形时，第二焊接柱202和第二通孔102的圆角矩形的长边优选与其临近的中板的边线平行，另外，中板的每一条边线上优选至少对应设置有一个第二焊接柱202，相应的，边框1上设置与之尺寸和位置对应的第二通孔102。
在对边框和中板激光焊接时，可以首先将边框1置于中板2之上，使中板2的第一焊接柱201插入到边框1的第一通孔101中，并且，中板2的第二焊接柱202插入到边框1的第二通孔102中，实现边框1与中板2的定位，然后采用激光将第一焊接柱201和第一通2孔101焊接在一起，将第二焊接柱202和第二通孔102焊接在一起，进而实现边框1和中板的焊接连接。
在一种实现方式中，多个第一焊接柱201与多个第二焊接柱202围绕中板2间隔分布在中板2的边缘，多个第一焊接柱201与多个第二焊接柱202优选交替分布，相邻两个焊接柱之间具有一定的距离。以矩形的中板2为例，中板2上表面的每条边线均分布有一个或者多个焊接柱，优选中板2上表面的每条边上设置有至少一个第一焊接柱201和至少一个第二焊接柱202，例如，在图4b示出的结构中，中板2的每个短边分布有一个第一焊接柱和一个第二焊接柱，每个长边分布有两个第一焊接柱和一个第二焊接柱，这两个第一焊接柱可以相邻，也可以不相邻。边框1上设置与多个第一焊接柱201的数量、位置和尺寸相对应的多个第一通孔101，边框1上设置与多个第二焊接柱202的数量、位置和尺寸相对应的多个第二通孔102。可以理解的是，焊接柱的个数越多，焊接强度越高，但是加工精度要求也随之提高，因此，焊接柱的个数应保持在一个合理的数值范围，本申请不对焊接柱的个数作具体限定。
在一种实现方式中，相邻设置的第一焊接柱201与第二焊接柱202的中心距为第一预设距离。可以理解的是，第一预设距离可以由中框的尺寸确定，中框的尺寸越大，第一预设距离越大；但同时，技术人员考虑到焊接强度，即第一预设距离越小，焊接强度越高，因此第一预设距离不会无限制的增加。本申请对第一预设距离的具体数值不作限定。
在一种实现方式中，边框1的厚度小于第一焊接柱201的高度，高度差优选为 0.3-0.5mm；边框1的厚度小于第二焊接柱202的高度，高度差优选为0.3-0.5mm。
在一种实现方式中，中板为压铸铝。图5是本申请提供的一种中框中中板为压铸铝时焊接柱的局部放大示意图。如图5所示的，第一焊接柱201和第二焊接柱202均为顶部小根部大的柱体，即焊接柱顶部尺寸L小于焊接柱根部尺寸I。母线的倾斜角受压铸工艺限制，本申请不做限制。
在一种实现方式中，第一焊接柱201根部处，第一通孔101和第一焊接柱201的间隙优选为0.05-0.08mm；第一焊接柱201头部处，第一通孔101和第一焊接柱201的间隙优选为0.1mm-0.2mm；第二焊接柱202根部处，第二通孔102和第二焊接柱202的间隙优选为0.05-0.08mm；第二焊接柱202头部处，第二通孔102和第二焊接柱202的间隙优选为0.1mm-0.2mm。
一种实现方式中，图6是本申请提供的一种中框的局部放大示意图。如图6所示，排气槽203围绕第二焊接柱202的根部设置。
图7a是本申请提供的一种中框中中板的一种实施例的结构示意图。如图7a所示，第二焊接柱202为圆角矩形焊接柱，排气槽203为环形槽，围绕呈圆角矩形的第二焊接柱202设置。图7b是图7a所示的中板的局部B-B剖面示意图。如图7b所示，排气槽203具有一定的深度，排气槽203用于排出激光焊接时产生的气体以及增加激光焊接时焊接熔池深度。
一种实现方式中，第一焊接柱201的根部也可以以围绕的方式设置排气槽，具有一定的深度，排气槽用于排出激光焊接时产生的气体以及增加激光焊接时焊接熔池深度。
本申请提供的中框，边框1的表面粗糙度值达到Ra3.2～Ra5，中板2的表面光泽度＜20Gu，有效提高焊接激光吸收率，提高焊接质量。在一种实现方式中，本申请提供的中框中中板设置有圆角矩形的焊接柱，能够提高焊接表面的激光吸收率，进而提高中板和边框的焊接结合处的焊接质量。这样，圆角矩形的焊接柱强度高，使得焊接时，焊柱根部不易发生断裂问题；焊柱根部增加排气槽，便于排气及增加焊接熔池深度，使得有效焊接增加。本申请通过提高焊点质量，进而解决某些影响整机性能的问题(如整机天线测试不良)。
下面结合附图说明，本申请提供的一种如上述实施例所示的中框的制造方法。
图8a是本申请提供的一种中框的制造方法中边框的前序工艺流程图。如图8a所示，该中框的制造方法包括以下步骤S1-S2。
S1，对型材铝进行机加工，得到边框。
在一种实现方式中，边框为矩形的环状边框，边框上设置有多个通孔，多个通孔的形状和/或尺寸可以相同，也可以不同。例如，当多个通孔的形状和/或尺寸相同时，多个通孔可以均为圆形通孔，或者均为圆角矩形通孔，或者均为其他某一形状的通孔。又例如，当多个通孔的形状和/或尺寸不同时，一部分通孔可以是圆形通孔，另一部分通孔可以是圆角矩形通孔。
在一种实现方式中，边框上设置有第一通孔和第二通孔，第一通孔为圆形通孔，第二通孔为圆角矩形通孔。
在一种实现方式中，多个第一通孔与多个第二通孔围绕边框间隔分布在边框的边 缘，多个第一通孔与多个第二通孔优选交替分布，相邻两个通孔之间具有一定的距离。以矩形的边框为例，边框上表面的每条边线均分布有一个或者多个通孔，优选边框上表面的每条边上设置有至少一个第一通孔和至少一个第二通孔，例如，在图4b示出的结构中，边框的每个短边分布有一个第一通孔和一个第二通孔，每个长边分布有两个第一通孔和一个第二通孔，这两个第一通孔可以相邻，也可以不相邻。
S2，对边框进行表面处理，以至少使多个通孔的表面为粗糙表面。
将S1中得到的边框，通过化学打砂处理，使产品表面粗糙度值达到Ra3.2～Ra5。
一种实现方式中，可以理解的是，经化学打砂处理后的边框表面为亚光状态。
一种实现方式中，化学打砂是指：将产品浸泡于酸性溶液中，辅以有机添加物，并在高温中腐蚀。
图8b是本申请提供的一种中框的制造方法中中板的前序工艺流程图。如图8b所示，中板的工艺流程包括以下步骤S01-S02。
S01，通过压铸成型工艺获得中板。
一种实现方式中，中板上设置多个焊接柱，多个焊接柱的形状和/或尺寸可以相同，也可以不同。例如，当多个焊接柱的形状和/或尺寸相同时，多个焊接柱可以均为圆形焊接柱，或者均为圆角矩形焊接柱，或者均为其他某一形状的焊接柱。又例如，当多个焊接柱的形状和/或尺寸不同时，一部分焊接柱可以是圆形焊接柱，另一部分焊接柱可以是圆角矩形焊接柱。可以理解的是，上述S1中边框上设置有多个通孔与本步骤S01中设置的多个焊接柱的数量、位置和尺寸相对应。
在一种实现方式中，中板上设置有第一焊接柱和第二焊接柱，第一焊接柱为圆形焊接柱，第二焊接柱为圆角矩形焊接柱；可以理解的是，上述S1中边框上第一通孔与本步骤S01中设置的第一焊接柱的位置和尺寸相对应；上述S1中边框上第二通孔与本步骤S01中设置的第二焊接柱的位置和尺寸相对应。
在一种实现方式中，多个第一焊接柱与多个第二焊接柱围绕中板间隔分布在中板的边缘，多个第一焊接柱与多个第二焊接柱优选交替分布，相邻两个焊接柱之间具有一定的距离。以矩形的中板为例，中板上表面的每条边线均分布有一个或者多个焊接柱，优选中板上表面的每条边上设置有至少一个第一焊接柱和至少一个第二焊接柱，例如，在图4b示出的结构中，中板的每个短边分布有一个第一焊接柱和一个第二焊接柱，每个长边分布有两个第一焊接柱和一个第二焊接柱，这两个第一焊接柱可以相邻，也可以不相邻。
S02，对中板进行皮膜处理，以至少使多个焊接柱的表面为粗糙表面。
在一种实现方式中，将S01中得到的毛坯件的表面皮膜处理，使其表面光泽度＜20Gu。
可以理解的是，经皮膜处理处理后的中板表面为亚光状态，镜面反射率越低，光泽度也越低。
一种实现方式中，皮膜处理是指，通过磷酸盐与压铸铝的中板毛坯件发生反应，生成一层致密膜层紧密附在金属的表面。
图8c是本申请提供的一种中框的制造方法的工艺流程图。如图8b所示，中框的制造方法包括以下步骤S001-S004。
S001，将边框安装于中板之上，使多个焊接柱与多个通孔一一对应形成孔轴配合。
S002，将边框与中板在各个焊接柱和通孔的配合处通过激光焊接连接成一体结构。
在一种实现方式中，焊接方式为激光焊接，首先将边框置于中板之上，使中板的第一焊接柱插入到边框的第一通孔中，并且，中板的第二焊接柱插入到边框的第二通孔中，实现边框与中板的定位，然后采用激光将第一焊接柱和第一通孔焊接在一起，将第二焊接柱和第二通孔焊接在一起，进而将边框和中板焊接在一起。
一种实现方式中，焊缝距侧壁距离＞0.4mm，避免因尺寸过小导致遮挡激光路径的问题。
图9是本申请提供的一种中框的制造方法中焊接激光的吸收示意图。如图9所示，通过化学打砂降低边框表面光泽度及粗糙度，以及通过皮膜处理降低中板表面光泽度及粗糙度，使激光吸收率达到60％以上，焊接过程更稳定，且在小功率焊接功率下易获得较大熔深。
一种实现方式中，压铸铝合金焊柱根部增加排气槽，即，排气槽围绕第二焊接柱的根部设置，排气槽具有一定的深度，便于排气及增加焊接熔池深度。
S003，将上述S002中得到的中框表面经过化学腐蚀，使金属表面形成纳米级的孔洞。
在一种实现方式中，纳米孔大小优选为40～60nm。
S004，对经S003处理的中框进行模内注塑，即，对中板与边框之间进行塑胶填充，从而，增加压铸铝合金中板与型材铝中框结合力。
可以理解的是，注塑前可以通过进行机加工，使得产品外长宽尺寸在注塑前保证尺寸精度到位，进而保证产品外长宽与注塑模具滑块配合间隙稳定性；
另外，注塑定位孔需保证和产品外形同夹位加工到位，保证产品外长宽与注塑模具滑块配合间隙稳定性。
可以理解的是，一种实现方式中，还可以包括以下步骤：通过利用抛光轮对产品表面进行打磨抛光处理；通过阳极氧化，获得需求的产品表面硬度，耐磨及腐耐蚀性能及产品外观效果。
S005，通过对完成注塑的中框进行机加工，以获得产品最终触摸屏(touchpad，TP)面/背板(black plate，BP)面及外形形状。
中框用于固定后盖、屏幕及内部元器件，在中框和后盖之间设置有支架和电池。具体来说，中框的一侧与屏幕装配在一起，起到屏幕和电子零部件之间隔层的作用；同时，中框也为各个电子零部件提供一个更可靠更牢固的安装地基；中框的另一侧与后盖装配在一起，保护移动终端免受冲击。
本申请提供的中框的制造方法，通过化学打砂降低边框表面光泽度及粗糙度，以及通过皮膜处理降低中板表面光泽度及粗糙度，使激光吸收率达到60％以上，焊接过程更稳定，且在小功率焊接功率下易获得较大熔深；一种实现方式中，压铸铝合金焊柱根部增加排气槽，便于排气及增加焊接熔池深度。本申请通过提高焊点质量，进而解决某些影响整机性能的问题(如整机天线测试不良)。
本申请实施例还提供一种电子设备，包括上述实施例提供的中框，该中框可以用本申请实施例提供的中框制造方法得到，该终端设备例如可以包括移动终端、平板电 脑、个人电脑、工作站设备、大屏设备(例如：智慧屏、智能电视等)、掌上游戏机、家用游戏机、虚拟现实设备、增强现实设备、混合现实设备等、车载智能终端、自动驾驶汽车、用户驻地设备(customer-premises equipment，CPE)等。

Claims (10)

  1. 一种电子设备，其特征在于，包括：中框，所述中框包括边框和中板；
    所述边框环绕所述中板边缘设置；
    所述中板设置有多个焊接柱；
    所述边框设置有与所述多个焊接柱位置和尺寸相对应的多个通孔，所述多个焊接柱与所述多个通孔一一对应形成孔轴配合；
    所述多个焊接柱的表面和所述多个通孔的表面均为粗糙表面；
    所述边框与所述中板在各个所述焊接柱和所述通孔的配合处通过激光焊接连接，所述粗糙表面用于在所述激光焊接时增加所述焊接柱与所述通孔配合处的激光吸收量。
  2. 根据权利要求1所述的电子设备，其特征在于，
    所述多个焊接柱均为圆角矩形焊接柱；
    所述多个通孔均为圆角矩形通孔。
  3. 根据权利要求1所述的电子设备，其特征在于，
    所述多个焊接柱包括至少一个第一焊接柱和至少一个第二焊接柱，所述第一焊接柱为圆形焊接柱，所述第二焊接柱为圆角矩形焊接柱；
    所述多个通孔包括至少一个第一通孔和至少一个第二通孔，所述第一通孔为圆形通孔，所述第二通孔为圆角矩形通孔；
    其中，所述至少一个第一焊接柱与所述至少一个第一通孔一一对应形成孔轴配合，所述至少一个第二焊接柱与所述至少一个第二通孔一一对应形成孔轴配合。
  4. 根据权利要求3所述的电子设备，其特征在于，所述中板为矩形中板，所述中板的每一条边线上设置有至少一个第一焊接柱和/或至少一个所述第二焊接柱。
  5. 根据权利要求3所述的电子设备，其特征在于，还包括；排气槽；
    所述排气槽围绕设置在至少一个所述第一焊接柱和/或至少一个所述第二焊接柱的根部，所述排气槽用于排出所述激光焊接时产生的气体以及增加所述激光焊接时焊接熔池深度。
  6. 根据权利要求1-5任一项所述的电子设备，其特征在于，所述焊接柱的粗糙表面是由皮膜处理得到的，所述焊接柱满足表面光泽度小于20Gu。
  7. 根据权利要求1-5任一项所述的电子设备，其特征在于，所述通孔的表面粗糙度值在Ra3.2～Ra5之间。
  8. 一种中框的制造方法，其特征在于，所述中框包括中板和边框，所述方法包括：
    通过压铸成型工艺获得所述中板，所述中板设置多个焊接柱；
    对所述中板进行皮膜处理，用以至少使所述多个焊接柱的表面为粗糙表面；
    对型材铝进行机加工，得到所述边框，所述边框上设置有与所述多个焊接柱位置和尺寸相对应的多个通孔；
    对所述边框进行表面处理，以至少使所述多个通孔的表面为粗糙表面；
    将所述边框安装于所述中板之上，使所述多个焊接柱与所述多个通孔一一对应形成孔轴配合；
    将所述边框与所述中板在各个所述焊接柱和所述通孔的配合处通过激光焊接连接成一体结构。
  9. 根据权利要求8所述的中框的制造方法，其特征在于，所述对所述中板进行皮膜处理，以至少使所述多个焊接柱的表面为粗糙表面，包括：所述对所述中板进行皮膜处理，以至少使所述多个焊接柱的表面满足表面光泽度小于20Gu。
  10. 根据权利要求8所述的中框的制造方法，其特征在于，对所述边框进行表面处理，以至少使所述多个通孔的表面为粗糙表面，包括：对所述边框进行化学打砂，以至少使所述通孔表面的表面粗糙度值在Ra3.2～Ra5之间。
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