WO2021017748A1 - 电子设备及电子设备的组装方法 - Google Patents

电子设备及电子设备的组装方法 Download PDF

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Publication number
WO2021017748A1
WO2021017748A1 PCT/CN2020/099961 CN2020099961W WO2021017748A1 WO 2021017748 A1 WO2021017748 A1 WO 2021017748A1 CN 2020099961 W CN2020099961 W CN 2020099961W WO 2021017748 A1 WO2021017748 A1 WO 2021017748A1
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WIPO (PCT)
Prior art keywords
cover plate
electronic device
plate
cover
structure layer
Prior art date
Application number
PCT/CN2020/099961
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English (en)
French (fr)
Inventor
王雪锋
Original Assignee
Oppo广东移动通信有限公司
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Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2021017748A1 publication Critical patent/WO2021017748A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Definitions

  • This application relates to the field of mechanical technology, and in particular to an electronic device and an assembly method of the electronic device.
  • the soaking plate has a heat dissipation function, and electronic devices usually use the soaking plate to dissipate heat from the chip.
  • electronic devices usually use the soaking plate to dissipate heat from the chip.
  • the use of double-sided adhesive to bond the soaking plate to the middle frame of the electronic device will cause the thickness of the electronic device to increase, which is not conducive to the slim design of the electronic device.
  • the embodiments of the present application provide an electronic device and an assembling method of the electronic device, which can reduce the thickness of the electronic device.
  • An embodiment of the present application provides an electronic device, and the electronic device includes:
  • a heat dissipation device includes a first cover plate, a second cover plate, a capillary structure layer and a support, the second cover plate and the first cover plate are enclosed to form a closed cavity, and the capillary structure layer Located in the sealed cavity, the capillary structure layer extends from the surface of the first cover plate facing the second cover plate, the capillary structure layer and the first cover plate are integrally arranged, so The supporting member is located in the enclosed cavity, the supporting member is located on the surface of the first cover plate facing the first cover plate, and the supporting member is against the capillary structure layer; and
  • the middle frame at least partially constitutes the first cover plate.
  • the embodiment of the present application also provides an assembling method of an electronic device, the electronic device includes a middle frame, and the assembling method of the electronic device includes:
  • a first plate is provided, the first plate includes a first cover plate and a capillary structure layer that are fixedly connected, the first cover plate and the capillary structure layer are integrally arranged, and the first cover plate is at least partially covered by The middle frame composition;
  • the second plate comprising a second cover plate and a support fixedly connected
  • the second plate and the first plate are fixed so that a closed cavity is formed between the second plate and the first plate, and the support member and the capillary structure layer are located in the closed cavity. In the cavity, the support member is against the capillary structure layer.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Fig. 2 is a schematic structural diagram of a CC cross-sectional view of the electronic device provided in Fig. 1.
  • FIG. 3 is a schematic structural diagram of a partial enlarged view of a region P of the electronic device provided in FIG. 2.
  • FIG. 4 is a schematic structural diagram of another CC cross-sectional view of the electronic device provided in FIG. 1.
  • FIG. 5 is a schematic structural diagram of a partial enlarged view of the area Q of the electronic device provided in FIG. 4.
  • FIG. 6 is a schematic structural diagram of another CC cross-sectional view of the electronic device provided in FIG. 1.
  • FIG. 7 is a schematic structural diagram of a partial enlarged view of a region R of the electronic device provided in FIG. 6.
  • FIG. 8 is a schematic diagram of a partial structure of a first electronic device provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of a partial structure of a second type of electronic device provided by an embodiment of the present application.
  • FIG. 10 is a schematic diagram of a partial structure of a third electronic device provided by an embodiment of the present application.
  • FIG. 11 is a schematic diagram of a partial structure of a fourth electronic device provided by an embodiment of the present application.
  • FIG. 12 is a schematic diagram of a partial structure of a fifth electronic device provided by an embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of a cross-sectional view of the electronic device in FIG. 13.
  • FIG. 15 is a schematic structural diagram of another cross-sectional view of the electronic device in FIG. 13.
  • FIG. 16 is a schematic structural diagram of another electronic device provided by an embodiment of the present application.
  • FIG. 17 is a schematic flowchart of a method for assembling an electronic device according to an embodiment of the present application.
  • FIG. 18 is a schematic diagram of the structure corresponding to S100 in FIG. 17.
  • FIG. 19 is a schematic diagram of the structure corresponding to S200 in FIG. 17.
  • FIG. 20 is a schematic diagram of the structure corresponding to S300 in FIG. 17.
  • FIG. 21 is a schematic flowchart of another method for assembling an electronic device according to an embodiment of the present application.
  • FIG. 22 is a schematic diagram of the structure corresponding to S110 in FIG. 21.
  • FIG. 23 is a schematic diagram of the structure corresponding to S120 in FIG. 21.
  • FIG. 24 is a schematic flowchart of yet another method for assembling an electronic device according to an embodiment of the present application.
  • FIG. 25 is a schematic diagram of the structure corresponding to S130 in FIG. 24.
  • FIG. 26 is a schematic diagram of the structure corresponding to S140 in FIG. 24.
  • FIG. 27 is a schematic flowchart of another method for assembling an electronic device according to an embodiment of the present application.
  • FIG. 28 is a schematic diagram of the structure corresponding to S150 in FIG. 27.
  • FIG. 29 is a schematic diagram of the structure corresponding to S160 in FIG. 27.
  • FIG. 30 is a schematic flowchart of another method for assembling an electronic device according to an embodiment of the present application.
  • FIG. 31 is a schematic diagram of the structure corresponding to S210 in FIG. 30.
  • FIG. 32 is a schematic diagram of the structure corresponding to S220 in FIG. 30.
  • FIG. 33 is a schematic flowchart of another method for assembling an electronic device according to an embodiment of the present application.
  • FIG. 34 is a schematic diagram of the structure corresponding to S230 in FIG. 33.
  • FIG. 35 is a schematic diagram of the structure corresponding to S240 in FIG. 33.
  • FIG. 36 is a schematic diagram of the structure corresponding to S250 in FIG. 33.
  • FIG. 37 is a schematic flowchart of another method for assembling an electronic device according to an embodiment of the present application.
  • FIG. 38 is a schematic diagram of the structure corresponding to S260 in FIG. 37.
  • FIG. 39 is a schematic diagram of the structure corresponding to S270 in FIG. 37.
  • FIG. 40 is a schematic flowchart of yet another method for assembling an electronic device according to an embodiment of the present application.
  • FIG. 41 is a schematic flowchart of another method for assembling an electronic device according to an embodiment of the present application.
  • An embodiment of the present application provides an electronic device, and the electronic device includes:
  • a heat dissipation device includes a first cover plate, a second cover plate, a capillary structure layer and a support, the second cover plate and the first cover plate are enclosed to form a closed cavity, and the capillary structure layer Located in the sealed cavity, the capillary structure layer extends from the surface of the first cover plate facing the second cover plate, the capillary structure layer and the first cover plate are integrally arranged, so The supporting member is located in the enclosed cavity, the supporting member is located on the surface of the first cover plate facing the first cover plate, and the supporting member is against the capillary structure layer; and
  • the middle frame at least partially constitutes the first cover plate.
  • the support member and the second cover plate are integrally arranged, the support member includes a plurality of support columns, and the plurality of support columns are arranged in an array on the surface of the second cover plate to Cross-connected channels are formed in the airtight cavity.
  • the outline size of the support member gradually decreases from one side of the second cover plate toward the side of the first cover plate.
  • the first cover plate has a receiving groove
  • the capillary structure layer is located in the receiving groove
  • the second cover plate is closed at the opening position of the receiving groove so that the first cover plate and The sealed cavity is formed between the second cover plates.
  • the second cover plate includes a cover part and a connecting part extending from one side of the cover part, the connecting part is connected to the first cover plate, and the support member is from the cover part Extending toward one side of the first cover plate, the cover part, the connecting part and the first cover plate are surrounded to form the closed cavity.
  • the covering portion and the connecting portion are integrally arranged, and the connecting portion extends from a direction perpendicular to the plane where the covering portion is located.
  • the first cover plate has a first containing groove
  • the capillary structure layer is located in the first containing groove
  • the second cover plate has a second containing groove
  • the support is located in the second containing groove.
  • the first containing groove and the second containing groove constitute the sealed cavity.
  • the heat dissipating device further includes a sealing element, which is arranged around the circumference of the connecting part of the second cover plate and the first cover plate, so as to improve the sealing performance of the sealed cavity.
  • the heat dissipation device further includes a pouring port for injecting a heat dissipation medium into the enclosed cavity.
  • the electronic device further includes a display screen and an electronic element
  • the display screen is carried on the heat dissipation device
  • the electronic element is located on the side of the heat dissipation device away from the display screen. The heat from the electronic components is conducted away.
  • the electronic device further includes an adhesive member for fixing the display screen to the first cover plate, and the adhesive member is arranged to avoid the second cover plate.
  • the display screen has a display area and a non-display area surrounding the display area, and the heat dissipating device is at least partially arranged directly opposite to the display area.
  • the embodiment of the present application also provides an assembling method of an electronic device, the electronic device includes a middle frame, and the assembling method of the electronic device includes:
  • a first plate is provided, the first plate includes a first cover plate and a capillary structure layer that are fixedly connected, the first cover plate and the capillary structure layer are integrally arranged, and the first cover plate is at least partially covered by The middle frame composition;
  • the second plate comprising a second cover plate and a support fixedly connected
  • the second plate and the first plate are fixed so that a closed cavity is formed between the second plate and the first plate, and the support member and the capillary structure layer are located in the closed cavity. In the cavity, the support member is against the capillary structure layer.
  • the "the first plate includes a first cover plate and a capillary structure layer that are fixedly connected” includes:
  • the first sheet material is processed by a die casting process to form an integrated first cover plate and a capillary structure layer, and the capillary structure layer is located on one side of the first cover plate.
  • the "the first plate includes a first cover plate and a capillary structure layer that are fixedly connected” includes:
  • the second sheet material is etched to form an integrated first cover plate and a capillary structure layer, and the capillary structure layer is located on one side of the first cover plate.
  • the "the second plate includes a fixedly connected second cover plate and a supporting member” includes:
  • the first blank is etched to form an integrated second cover plate and a support, and the support is located on one side of the second cover.
  • the "the second plate includes a fixedly connected second cover plate and a supporting member” includes:
  • the "the second plate includes a fixedly connected second cover plate and a supporting member” includes:
  • the fourth blank is processed by a die-casting process to form an integrated second cover plate and a support, and the support is located on one side of the second cover.
  • the "fixing the second plate and the first plate so that a closed cavity is formed between the second plate and the first plate” includes:
  • a laser welding process is used to weld the connection part of the second cover plate and the first cover plate, so that a closed cavity is formed between the second cover plate and the first cover plate.
  • the assembling method of the electronic device further includes:
  • Dispensing is performed on the peripheral side of the connection part between the second cover plate and the first cover plate after the welding process, so as to improve the sealing performance of the sealed cavity.
  • the electronic device 1 provided by the embodiment of the present application includes a heat dissipation device 10 and a middle frame 20.
  • the heat dissipation device 10 includes a first cover 100, a second cover 200, and a capillary. With the structural layer 300 and the supporting member 400, the middle frame 20 at least partially constitutes the first cover 100.
  • the second cover 200 and the first cover 100 are enclosed to form a closed cavity A; the capillary structure layer 300 is located in the closed cavity A, and the capillary structure layer 300 is separated from the first cover
  • the plate 100 extends from the surface facing the second cover plate 200, the capillary structure layer 300 and the first cover plate 100 are integrally arranged; the support 400 is located in the enclosed cavity A, so The supporting member 400 is located on the surface of the first cover plate 100 facing the first cover plate 100, and the supporting member 400 is against the capillary structure layer 300.
  • the electronic device 1 may be any device with a display function.
  • tablet computers mobile phones, e-readers, remote controls, personal computers (PC), notebook computers, in-vehicle devices, Internet TVs, wearable devices and other smart devices with display functions.
  • PC personal computers
  • the heat dissipation device 10 is used to dissipate heat for the electronic components 30 of the electronic equipment 1, and the electronic components 30 may be heating devices such as circuit boards, chips, batteries, etc. of the electronic equipment 1.
  • the middle frame 20 of the electronic device 1 constitutes the first cover plate 100. Since the heat sink 10 reuses the structure of the middle frame 20 of the electronic device 1, compared to the traditional technology, the heat sink 10 is bonded to the middle frame with double-sided tape. In the form of the frame 20, the heat dissipation device 10 provided in this embodiment does not require double-sided adhesive bonding, so that the heat on one side of the middle frame 20 can be quickly transferred to the enclosed cavity A of the heat dissipation device 10, which helps to improve the heat dissipation effect.
  • the first cover plate 100 and the capillary structure layer 300 are made of aluminum alloy, and the second cover plate 200 and the support 400 are made of copper.
  • the capillary structure layer 300 and the first cover plate 100 are integrated, that is, the capillary structure layer 300 and the first cover plate 100 are formed together in the same processing process.
  • the supporting member 400 and the capillary structure layer 300 are both located in the enclosed cavity A, and the supporting member 400 is supported between the second cover plate 200 and the capillary structure layer 300, so that the second cover plate 200 and The capillary structure layer 300 maintains a preset distance, and prevents the second cover 200 and the capillary structure layer 300 from being deformed due to external force.
  • the capillary structure layer 300 and the first cover plate 100 form an integrated structure through die-casting processing, which facilitates mass production.
  • the capillary structure layer 300 and the first cover plate 100 are etched to form an integrated structure.
  • the capillary structure layer 300 is a metal mesh structure, and the capillary structure layer 300 resists the inner wall of the closed cavity A.
  • the capillary structure layer 300 is used to provide capillary force.
  • the capillary force is generated at the inner meniscus on the three-phase interface.
  • the direction of capillary force the direction of action always points to the concave surface of the curved liquid surface (concave and convex meniscus refers to the side relative to the liquid phase).
  • the heat dissipation device 10 may be a soaking plate, which is a closed cavity A with a capillary structure on the inner wall, usually made of copper.
  • the cooling liquid in the closed cavity A starts to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat energy and rapidly expands in volume.
  • the cooling medium in the gas phase quickly fills the entire cavity, and condensation will occur when the gas phase medium contacts a relatively cold area.
  • the heat accumulated during evaporation is released by the phenomenon of condensation, and the condensed cooling liquid will return to the evaporation heat source through the capillary channel of the capillary structure. This operation process is repeated in the enclosed cavity A.
  • the support 400 is fixed on the surface of the second cover 200.
  • the support 400 and the second cover 200 are an integrated structure, and the support 400 can also be connected to the second cover 200.
  • the second cover plate 200 is integrally arranged, that is, formed together in the same processing procedure.
  • the support 400 and the second cover plate 200 are formed by a die-casting process or a CNC process.
  • the support member 400 and the second cover plate 200 are two independent structures, and the support member 400 is fixed to the surface of the second cover plate 200 by a welding process.
  • the support 400 and the second cover 200 can be formed by different processing techniques.
  • the second cover 200 is formed by stamping
  • the support 400 is formed by CNC processing.
  • the efficiency of producing the second cover 200 can improve the processing accuracy of the support 400.
  • the electronic device 1 provided by the embodiment of the present application adopts the middle frame 20 of the electronic device 1 to form the first cover 100 of the heat dissipation device 10.
  • the middle frame 20 structure of the electronic device 1 By reusing the middle frame 20 structure of the electronic device 1, the size of the electronic device 1 can be reduced. thickness.
  • the double-sided tape is used to bond the heat sink 10 to the middle frame 20, the electronic device 1 provided in the embodiment of the present application does not need to be bonded by double-sided tape, so that the heat on one side of the middle frame 20 can be
  • the rapid transmission to the airtight cavity A of the heat dissipation device 10 helps to improve the heat dissipation effect.
  • the capillary structure layer 300 and the middle frame 20 of the electronic device 1 are integrally formed, which can improve the structural strength of the electronic device 1, without additional fixing structure between the capillary structure layer 300 and the middle frame 20, which further reduces The volume of the electronic device 1 can thereby reduce the thickness of the electronic device 1.
  • the supporting member 400 and the second cover 200 are integrally arranged, and the supporting member 400 includes a plurality of supporting columns 410, and the plurality of supporting columns 410 are arranged in the first The surfaces of the two cover plates 200 are arranged in an array to form cross-connected channels 420 in the sealed cavity A.
  • the second cover 200 and the support 400 are made of aluminum alloy.
  • the supporting member 400 and the second cover plate 200 are integrated, that is, the supporting member 400 and the second cover plate 200 are formed together in the same processing process.
  • the supporting member 400 and the second cover plate 200 form an integrated structure through die casting. In another embodiment, the supporting member 400 and the second cover 200 form an integrated structure through an etching process.
  • a plurality of support columns 410 are uniformly distributed in an array on the second cover 200, and the support columns 410 are supported between the capillary structure layer 300 and the second cover 200, so that the second cover 200 and the first cover 200
  • the volume of the closed cavity A between the cover plates 100 is kept stable, and the deformation of the second cover plate 200 and the first cover plate 100 is reduced.
  • the heights of the plurality of support columns 410 are kept the same, so that the distance between the second cover 200 and the first cover 100 is kept constant, which helps to reduce the second cover 200 And the deformation of the first cover 100.
  • the supporting column 410 is located in the sealed cavity A and is used to form a cross-connected channel 420 in the sealed cavity A, so that heat can be fully mixed and transmitted in the sealed cavity A, thereby improving the heat dissipation device 10's heat dissipation effect.
  • the outline size of the support member 400 gradually decreases from the side of the second cover 200 toward the side of the first cover 100.
  • the support 400 and the second cover 200 integrated with mold processing are used, since the support 400 is a vertebral body structure design, it is easy to demold.
  • the taper angle design is helpful to improve the integrated design of the supporting member 400 and the second cover 200.
  • the first cover plate 100 has a receiving groove 100a
  • the capillary structure layer 300 is located in the receiving groove 100a
  • the second cover plate 200 covers an opening position of the receiving groove 100a , To form the sealed cavity A between the first cover plate 100 and the second cover plate 200.
  • the surface of the first cover plate 100 is provided with a receiving groove 100a
  • the capillary structure layer 300 extends from the surface of the first cover plate 100 where the receiving groove 100a is opened, and the capillary structure layer 300 is located in the In the receiving groove 100a
  • the second cover 200 covers the opening position of the receiving groove 100a
  • the support 400 is located on the surface of the second cover 200 facing the capillary structure layer 300
  • the supporting member 400 is against the capillary structure layer 300, so that a closed cavity A with stable volume is formed between the first cover plate 100 and the second cover plate 200, which can reduce the size of the first cover plate 100 And the second cover 200 is deformed under the action of external force.
  • the second cover 200 includes a cover 210 and a connecting portion 220 extending from one side of the cover 210, and the connecting portion 220 is connected to the first cover 100,
  • the supporting member 400 extends from one side of the covering portion 210 toward the first cover plate 100, and the covering portion 210, the connecting portion 220 and the first cover plate 100 are enclosed to form a space The airtight cavity A.
  • the covering portion 210 and the connecting portion 220 surround the receiving area 230, the connecting portion 220 is connected to the first cover 100, and the covering portion 210 is connected to the first
  • the cover plates 100 are arranged at intervals.
  • the covering portion 210 and the connecting portion 220 are integrally arranged, and the connecting portion 220 extends from a direction perpendicular to the plane where the covering portion 210 is located.
  • the second cover plate 200 can be formed by a stamping process to form the cover part 210 and the connecting part 220 integrally.
  • the sealing performance of the connection between the cover part 210 and the connecting part 220 can be enhanced, and the other
  • the connection strength between the cover portion 210 and the connection portion 220 can be increased.
  • the covering portion 210 and the connecting portion 220 are two independent structures, and the covering portion 210 and the connecting portion 220 are formed separately, and then the covering portion 210 and the connecting portion 220 are formed separately.
  • the second cover plate 200 is obtained by fixing by welding.
  • the first cover plate 100 has a first receiving groove 100b
  • the capillary structure layer 300 is located in the first receiving groove 100b
  • the second cover plate 200 has a second receiving groove 200a.
  • the supporting member 400 is located in the second containing groove 200a, and the first containing groove 100b and the second containing groove 200a constitute the sealed cavity A.
  • the first receiving groove 100b of the first cover plate 100 and the second receiving groove 200a of the second cover plate 200 jointly constitute the sealed cavity A.
  • the first receiving groove 100b and the second receiving groove 200a are directly opposite, the capillary structure layer 300 is at least partially located in the first receiving groove 100b, and the supporting member 400 is at least partially located in the second receiving groove Within 200a.
  • the electronic device 1 further includes a sealing member 150, the sealing member 150 is arranged around the circumference of the connecting part of the second cover 200 and the first cover 100 to lift the The tightness of the sealed cavity A.
  • the sealing member 150 may be a sealing ring or a sealant.
  • the sealing member 150 is arranged on the peripheral side of the connection part between the second cover plate 200 and the first cover plate 100, and is used for secondary sealing the connection part between the second cover plate 200 and the first cover plate 100, In order to improve the sealing performance of the sealed cavity A.
  • the electronic device 1 further includes a pouring port 250, and the pouring port 250 is used to inject a heat dissipation medium 260 into the enclosed cavity A.
  • the heat dissipation medium 260 may be air or other heat absorption medium.
  • the heat dissipation medium 260 may also be a liquid cooling medium, such as water, alcohol, liquid nitrogen and the like.
  • the heat dissipation medium 260 is injected through the pouring port 250. Firstly, the airtight cavity A is evacuated, and then the heat dissipation medium 260 is injected into the airtight cavity A, and then the pouring port 250 is sealed to seal the heat dissipation medium 260 in the airtight cavity A.
  • the capillary structure layer 300 is used to provide capillary force for the heat dissipation medium 260 so that the heat dissipation medium 260 can better flow in the closed cavity A, thereby helping to improve the heat dissipation effect of the heat dissipation device 10.
  • the electronic device 1 provided in the embodiment of the present application also includes a display screen 40 and an electronic component 30.
  • the electronic component 30 is located on the side of the heat dissipation device 10 away from the display screen 40, and the heat dissipation device 10 is used to conduct heat from the electronic component 30 to avoid any damage to the The display screen 40 causes interference.
  • the electronic device 1 may be any device with a display function.
  • tablet computers mobile phones, e-readers, remote controls, personal computers (PC), notebook computers, in-vehicle devices, Internet TVs, wearable devices and other smart devices with display functions.
  • PC personal computers
  • the display screen 40 includes a display panel 41 and a cover glass 42.
  • the display panel 41 may be a liquid crystal display panel 41 or a flexible display panel 41.
  • the electronic component 30 may be a heating device such as a circuit board, a chip, or a battery of the electronic device 1.
  • the heat sink 10 is used to dissipate the electronic components 30 of the electronic device 1, and the middle frame 20 of the electronic device 1 constitutes the first cover plate 100.
  • the heat sink 10 reuses the structure of the middle frame 20 of the electronic device 1 Compared with the traditional technique in which double-sided tape is used to bond the heat sink 10 to the middle frame 20, the heat sink 10 provided in this embodiment does not need to contact the double-sided tape, so that the heat on one side of the middle frame 20 can be quickly.
  • the transmission to the airtight cavity A of the heat dissipation device 10 helps to improve the heat dissipation effect.
  • the area of the first cover plate 100 is larger than the area of the second cover plate 200.
  • the first cover plate 100 is composed of the middle frame 20 of the electronic device 1, and the display screen 40 is carried on the first cover plate.
  • the cover 100 is located on the side of the first cover 100 adjacent to the second cover 200, and the electronic component 30 is located on the side of the first cover 100 away from the second cover 200, That is, the electronic components 30 are respectively located on opposite sides of the first cover 100.
  • the heat dissipating device 10 is located between the electronic component 30 and the display screen 40 to transmit heat from the electronic component 30 through the heat dissipating device 10 to prevent the heat from the electronic component 30 from generating to the display screen 40 Interference affects the display function of the display screen 40.
  • the electronic device 1 further includes an adhesive 50, the adhesive 50 is used to fix the display screen 40 to the first cover 100, and the adhesive 50 avoids Open the second cover 200 and set.
  • the adhesive 50 may be a glue, and the adhesive 50 is used to fix the display screen 40 and the first cover 100.
  • the adhesive member 50 is disposed on the peripheral side of the display screen 40 to fix the display screen 40 on the first cover plate 100. At this time, the adhesive member 50 does not cover the second cover plate 200.
  • the area between the display screen 40 and the display screen 40 can reduce the size of the electronic device 1 in the thickness direction, and realize the thin and light design of the electronic device 1.
  • the adhesive member 50 is arranged to avoid the second cover 200. In this case, the thickness of the electronic device 1 can be reduced.
  • the adhesive member 50 is disposed on the peripheral side of the display screen 40 to fix the display screen 40 on the first cover plate 100, and the surface of the display screen 40 facing the second cover plate 200
  • a heat insulating layer 55 is provided on the surface, and the heat insulating layer 55 is used to block the heat from the electronic component 30 and prevent the heat from the electronic component 30 from interfering with the display of the display screen 40.
  • This process can be considered as a secondary heat insulation process.
  • the heat dissipation device 10 conducts heat from the electronic component 30 for the first time to avoid heat accumulation; the second time, the heat insulation layer 55 conducts the heat from the electronic component 30. Blocking and avoiding heat conduction toward one side of the display screen 40 can further solve the adverse effect of the heat generation of the electronic component 30 on the display screen 40 under the premise of reducing the thickness of the electronic device 1.
  • the display screen 40 has a display area 40 a and a non-display area 40 b surrounding the display area 40 a, and the heat sink 10 is at least partially disposed directly opposite the display area 40 a.
  • the heat sink 10 is arranged at least partly facing the display area 40a, and the heat sink 10 is arranged between the display screen 40 and the electronic component 30, which can prevent the heat from the electronic component 30 from being conducted to the display.
  • the screen 40 then causes the problem of poor display.
  • the non-display area 40b is arranged around the display area 40a, by arranging the heat sink 10 corresponding to the display area 40a, the non-display area 40b can also be better radiated.
  • the assembling method of the electronic device provided by the embodiment of the present application includes but is not limited to steps S100, S200, and S300.
  • S100, S200, and S300 are introduced as follows.
  • the first plate 510 includes a first cover plate 100 and a capillary structure layer 300 that are fixedly connected, the first cover plate 100 and the capillary structure layer 300 are integrally arranged, the The first cover 100 is composed of at least part of the middle frame 20. Refer to Figure 18.
  • the first plate 510 is made of aluminum alloy
  • the first cover plate 100 constitutes the first cover plate 100 of the heat sink 10
  • the capillary structure layer 300 is a mesh-like metal structure
  • the capillary structure layer 300 constitutes the capillary structure layer of the heat sink 10 300.
  • the first cover plate 100 and the capillary structure layer 300 are made of aluminum alloy.
  • the first cover plate 100 and the capillary structure layer 300 are an integrated structure, that is, the first cover plate 100 and the capillary structure layer 300 are Formed together in the same process.
  • the capillary structure layer 300 and the first cover plate 100 form an integrated structure through die casting.
  • the capillary structure layer 300 and the first cover plate 100 are etched to form an integrated structure.
  • S200 Provide a second plate 520, which includes a second cover plate 200 and a support 400 that are fixedly connected. Refer to Figure 19.
  • the second plate 520 is made of copper, the second cover 200 constitutes the second cover 200 of the heat dissipation device 10, and the support 400 constitutes the support 400 of the heat dissipation device 10.
  • the second plate 520 and the first plate 510 are covered and fixed to each other to form a closed cavity A between the first plate 510 and the second plate 520, and the support 400 and the capillary structure layer 300 are located in the closed cavity A Inside, and the supporting member 400 resists the capillary structure layer 300.
  • the second plate 520 and the first plate 510 can be fixed by laser welding, laser welding and glue dispensing, or other fixing methods.
  • the capillary structure layer 300 is a metal mesh structure, and the capillary structure layer 300 resists the inner wall of the closed cavity A.
  • the capillary structure layer 300 is fixed to the surface of the second cover plate 200.
  • the capillary structure layer 300 is fixed to the surface of the second cover plate 200 through a sintering process.
  • the capillary structure layer 300 is fixed to the surface of the second cover 200 by a welding process.
  • the capillary structure layer 300 may also be integrated with the second cover 200, that is, formed together in the same processing process.
  • S120 Process the first sheet material 550 using a die-casting process to form an integrated first cover plate 100 and a capillary structure layer 300, and the capillary structure layer 300 is located on one side of the first cover plate 100 .
  • a die-casting process to form an integrated first cover plate 100 and a capillary structure layer 300, and the capillary structure layer 300 is located on one side of the first cover plate 100 .
  • the first sheet material 550 is made of aluminum alloy material, and the first sheet material 550 is die-casted by stamping parts 555 to deform the first sheet material 510 to obtain an integrated first cover plate 100 and capillary structure layer 300 , And the capillary structure layer 300 is located on one side of the first cover 100.
  • the first cover plate 100 constitutes the first cover plate 100 of the heat dissipation device 10
  • the capillary structure layer 300 constitutes the capillary structure layer 300 of the heat dissipation device 10.
  • the die-casting process is performed on the first plate material 550 to obtain the first cover plate 100 and the capillary structure layer 300 having a predetermined shape.
  • the "S100: provide a first plate 510, the first plate 510 includes a fixedly connected first cover plate 100 and a capillary structure layer 300" includes but is not limited to S130 and S140, S130 and S140 are introduced as follows.
  • S130 Provide the second sheet 560. Refer to Figure 25.
  • S140 Perform an etching process on the second plate material 560 to form an integrated first cover plate 100 and a capillary structure layer 300, and the capillary structure layer 300 is located on one side of the first cover plate 100. Refer to Figure 26.
  • the second sheet material 560 is made of aluminum alloy, and the second sheet material 560 is etched to deform the second sheet material 520 to obtain an integrated first cover plate 100 and capillary structure layer 300, and the capillary structure
  • the layer 300 is located on one side of the first cover plate 100.
  • the first cover plate 100 constitutes the first cover plate 100 of the heat dissipation device 10
  • the capillary structure layer 300 constitutes the capillary structure layer 300 of the heat dissipation device 10.
  • CNC processing is performed on the second sheet material 560 after the etching process to obtain the first cover plate 100 and the capillary structure layer 300 having a predetermined size.
  • the first material 570 is made of copper.
  • S160 The surface of the first material 570 is processed by an embossing process to form an integrated first cover 100 and a capillary structure layer 300, and the capillary structure layer 300 is located on the first cover 100 Side. Refer to Figure 29.
  • the embossing process is to place the material between the upper and lower molds, change the thickness of the material under pressure, and fill the convex and concave parts of the mold cavity with undulating fine lines with the extruded material , And a forming method of forming undulations, swellings and words or patterns on the surface of the workpiece.
  • Such as coins, medals, etc. are all formed by embossing.
  • the first cover plate 100 constitutes the first cover plate 100 of the heat dissipation device 10
  • the capillary structure layer 300 constitutes the capillary structure layer 300 of the heat dissipation device 10.
  • the capillary structure layer 300 is a metal mesh structure. Specifically, a mold is used to imprint the surface of the first material 570, so that the pattern of the mold is displayed on the surface of the first material 570, thereby obtaining an integrated first cover 100 and a capillary structure layer 300, and the capillary The structure layer 300 is located on one side of the first cover plate 100.
  • the "S200: provide a second plate 520, the second plate 520 includes a second cover plate 200 and a support 400 that are fixedly connected" includes but is not limited to S210 and S220, S210 and S220 are introduced as follows.
  • S210 Provide a first blank 610. Refer to Figure 31.
  • S220 Perform an etching process on the first blank 610 to form an integrated second cover 200 and a support 400, and the support 400 is located on one side of the second cover 200. Refer to Figure 32.
  • the first blank 610 is made of aluminum alloy, and the first blank 610 is etched to deform the first blank 610 to obtain the integrated second cover 200 and the support 400, and the support 400 is located on one side of the second cover 200.
  • the second cover 200 constitutes the second cover 200 of the heat dissipation device 10
  • the support 400 constitutes the support 400 of the heat dissipation device 10.
  • CNC machining is performed on the first blank 610 after the etching process, so as to obtain the second cover 200 and the support 400 having a predetermined size.
  • the "S200: provide a second plate 520, the second plate 520 includes a second cover plate 200 and a support 400 that are fixedly connected" includes but is not limited to S230 , S240 and S250, about S230, S240 and S250 are introduced as follows.
  • S230 Provide a second blank 620 and a third blank 630. Refer to Figure 34.
  • S240 Perform CNC machining on the second blank 620 to obtain the support 400. Refer to Figure 35.
  • the second blank 620 and the third blank 630 are made of copper.
  • the second blank 620 and the third blank 630 are separate structures.
  • the third blank 630 constitutes the second cover 200 of the heat dissipation device 10, and the second blank 620 is CNC processed to form the support 400. Then the support 400 is fixed to the third blank 630 so that the support 400 is located on one side of the third blank 630.
  • the support 400 is fixed to the third blank 630 by a sintering process. In another embodiment, the support 400 is fixed to the third blank 630 by a welding process.
  • the "S200: provide a second plate 520, the second plate 520 includes a fixedly connected second cover 200 and a support 400" includes but is not limited to S260 And S270, about S260 and S270 are introduced as follows.
  • S270 Process the fourth blank 640 by using a die casting process to form an integrated second cover 200 and a support 400, and the support 400 is located on one side of the second cover 200. Refer to Figure 39.
  • the fourth blank 640 is made of aluminum alloy, and the fourth blank 640 is die-casted to deform the fourth blank 640 to obtain an integrated second cover 200 and support 400, and the support 400 is located on one side of the second cover 200.
  • the second cover 200 constitutes the second cover 200 of the heat dissipation device 10
  • the support 400 constitutes the support 400 of the heat dissipation device 10.
  • the fourth blank 640 after the die-casting process is CNC processed to obtain the second cover 200 and the support 400 with preset dimensions.
  • the enclosed cavity A includes but is not limited to S310 and S320.
  • S310 and S320 are introduced as follows.
  • S310 Splicing the second cover 200 and the first cover 100.
  • S320 Use a laser welding process to weld the connection part of the second cover 200 and the first cover 100, so that a closed cavity is formed between the second cover 200 and the first cover 100 Body A.
  • the first plate 510 and the second plate 520 are fixed by laser welding, and a sealed cavity A is formed between the first plate 510 and the second plate 520.
  • Laser welding is an efficient and precise welding method that uses a high-energy density laser beam as a heat source. It is mainly used for welding thin-walled materials and low-speed welding.
  • the welding process is of thermal conductivity type, that is, the surface of the workpiece is heated by laser radiation. The workpiece melts, forming a specific molten pool. Due to its unique advantages, it has been successfully applied to precision welding of micro and small parts.
  • the electronic assembly method of the device also includes but is not limited to S321 introduced as follows.
  • S321 Dispensing treatment is performed on the circumferential side of the connection part between the second cover plate 200 and the first cover plate 100 after the welding process, so as to improve the sealing performance of the sealed cavity A.
  • laser welding is performed on the connecting part of the second cover 200 and the first cover 100 first, and then the welded second cover 200 and the The circumferential side of the connecting part of the first cover plate 100 is processed by the glue dispensing process, which is equivalent to improving the sealing performance of the sealed cavity A twice.
  • the connecting part of the second cover 200 and the first cover 100 can be sealed by dispensing glue multiple times. And can use continuous dispensing and discontinuous dispensing.

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Abstract

本申请实施例提供一种电子设备及电子设备的组装方法。所述电子设备包括散热装置及中框，所述散热装置包括第一盖板、第二盖板、毛细结构层和支撑件，所述中框至少部分构成所述第一盖板；所述第二盖板和所述第一盖板围设形成密闭腔体；所述毛细结构层位于所述密闭腔体内，所述毛细结构层自所述第一盖板面对所述第二盖板的表面延伸出来，所述毛细结构层和所述第一盖板为一体化设置；所述支撑件位于所述密闭腔体内，所述支撑件位于所述第一盖板面对所述第一盖板的表面，且所述支撑件抵持于所述毛细结构层。本申请实施例提供的电子设备结构较为紧凑，可以减小电子设备的厚度。

Description

电子设备及电子设备的组装方法 技术领域
本申请涉及机械技术领域，尤其涉及一种电子设备及电子设备的组装方法。
背景技术
均热板具有散热功能，电子设备通常采用均热板对芯片进行散热。相关技术中，采用双面胶将均热板粘接于电子设备的中框上，会导致电子设备的厚度增加，不利于电子设备的轻薄化设计。
发明内容
本申请实施例提供一种电子设备及电子设备的组装方法，可以减小电子设备的厚度。
本申请实施例提供一种电子设备，所述电子设备包括：
散热装置，所述散热装置包括第一盖板、第二盖板、毛细结构层和支撑件，所述第二盖板和所述第一盖板围设形成密闭腔体，所述毛细结构层位于所述密闭腔体内，所述毛细结构层自所述第一盖板面对所述第二盖板的表面延伸出来，所述毛细结构层和所述第一盖板为一体化设置，所述支撑件位于所述密闭腔体内，所述支撑件位于所述第一盖板面对所述第一盖板的表面，且所述支撑件抵持于所述毛细结构层；及
中框，所述中框至少部分构成所述第一盖板。
本申请实施例还提供一种电子设备的组装方法，所述电子设备包括中框，所述电子设备的组装方法包括：
提供第一板材，所述第一板材包括固定连接的第一盖板和毛细结构层，所述第一盖板和所述毛细结构层为一体化设置，所述第一盖板由至少部分所述中框构成；
提供第二板材，所述第二板材包括固定连接的第二盖板和支撑件；
将所述第二板材与所述第一板材固定，以使得所述第二板材和所述第一板材之间形成密闭腔体，且使得所述支撑件和所述毛细结构层位于所述密闭腔体内，所述支撑件抵持于所述毛细结构层。
附图说明
为了更清楚地说明本申请实施方式的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的一种电子设备的结构示意图。
图2是图1中提供的电子设备的一种CC剖视图的结构示意图。
图3是图2中提供的电子设备的区域P的局部放大视图的结构示意图。
图4是图1中提供的电子设备的另一种CC剖视图的结构示意图。
图5是图4中提供的电子设备的区域Q的局部放大视图的结构示意图。
图6是图1中提供的电子设备的又一种CC剖视图的结构示意图。
图7是图6中提供的电子设备的区域R的局部放大视图的结构示意图。
图8是本申请实施例提供的第一种电子设备的局部结构示意图。
图9是本申请实施例提供的第二种电子设备的局部结构示意图。
图10是本申请实施例提供的第三种电子设备的局部结构示意图。
图11是本申请实施例提供的第四种电子设备的局部结构示意图。
图12是本申请实施例提供的第五种电子设备的局部结构示意图。
图13是本申请实施例提供的一种电子设备的结构示意图。
图14是图13中电子设备的一种剖视图的结构示意图。
图15是图13中电子设备的另一种剖视图的结构示意图。
图16是本申请实施例提供的另一种电子设备的结构示意图。
图17是本申请实施例提供的一种电子设备的组装方法的流程示意图。
图18是图17中S100对应的结构示意图。
图19是图17中S200对应的结构示意图。
图20是图17中S300对应的结构示意图。
图21是本申请实施例提供的另一种电子设备的组装方法的流程示意图。
图22是图21中S110对应的结构示意图。
图23是图21中S120对应的结构示意图。
图24是本申请实施例提供的又一种电子设备的组装方法的流程示意图。
图25是图24中S130对应的结构示意图。
图26是图24中S140对应的结构示意图。
图27是本申请实施例提供的又一种电子设备的组装方法的流程示意图。
图28是图27中S150对应的结构示意图。
图29是图27中S160对应的结构示意图。
图30是本申请实施例提供的又一种电子设备的组装方法的流程示意图。
图31是图30中S210对应的结构示意图。
图32是图30中S220对应的结构示意图。
图33是本申请实施例提供的又一种电子设备的组装方法的流程示意图。
图34是图33中S230对应的结构示意图。
图35是图33中S240对应的结构示意图。
图36是图33中S250对应的结构示意图。
图37是本申请实施例提供的又一种电子设备的组装方法的流程示意图。
图38是图37中S260对应的结构示意图。
图39是图37中S270对应的结构示意图。
图40是本申请实施例提供的又一种电子设备的组装方法的流程示意图。
图41是本申请实施例提供的又一种电子设备的组装方法的流程示意图。
具体实施方式
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式仅仅是本申请一部分实施方式，而不是全部的实施方式。基于本申请中的实施方式，本领域普通技术人员在没有付出创造性劳动前提下所获得的所有其他实施方式，都属于本申请保护的范围。本文出现的第一、第二等只是名称上的区分，既不表示数量多少，也不表示先后顺序。
本申请实施例提供了一种电子设备，所述电子设备包括：
散热装置，所述散热装置包括第一盖板、第二盖板、毛细结构层和支撑件，所述第二盖板和所述第一盖板围设形成密闭腔体，所述毛细结构层位于所述密闭腔体内，所述毛细结构层自所述第一盖板面对所述第二盖板的表面延伸出来，所述毛细结构层和所述第一盖板为一体化设置，所述支撑件位于所述密闭腔体内，所述支撑件位于所述第一盖板面对所述第一盖板的表面，且所述支撑件抵持于所述毛细结构层；及
中框，所述中框至少部分构成所述第一盖板。
其中，所述支撑件与所述第二盖板为一体化设置，所述支撑件包括若干个支撑柱，若干个所述支撑柱在所述第二盖板的表面呈阵列排布，以在所述密闭腔体内形成交叉连通的通道。
其中，所述支撑件的轮廓尺寸自所述第二盖板的一侧朝向所述第一盖板的一侧逐渐减小。
其中，所述第一盖板具有收容槽，所述毛细结构层位于所述收容槽内，所述第二盖板盖合于所述收容槽的开口位置，以在所述第一盖板和所述第二盖板之间形成所述密闭腔体。
其中，所述第二盖板包括盖合部和自所述盖合部一侧延伸出来的连接部，所述连接部连接于所述第一盖板，所述支撑件自所述盖合部朝向所述第一盖板的一侧延伸出来，所述盖合部、所述连接部和所述第一盖板围设形成所述密闭腔体。
其中，所述盖合部和所述连接部为一体化设置，且所述连接部自垂直于所述盖合部所在平面的方向延伸出来。
其中，所述第一盖板具有第一容纳槽，所述毛细结构层位于所述第一容纳槽内，所述第二盖板具有第二容纳槽，所述支撑件位于所述第二容纳槽内，所述第一容纳槽和所述第二容纳槽构成所述密闭腔体。
其中，所述散热装置还包括密封件，所述密封件环绕设置于所述第二盖板与所述第一盖板连接部位的周侧，以提升所述密闭腔体的密封性。
其中，所述散热装置还包括浇注口，所述浇注口用于向所述密闭腔体内注入散热介质。
其中，所述电子设备还包括显示屏和电子元件，所述显示屏承载于所述散热装置，所述电子元件位于所述散热装置背离所述显示屏的一侧，所述散热装置用于将来自所述电子元件的热量传导出去。
其中，所述电子设备还包括粘接件，所述粘接件用于将所述显示屏固定于所述第一盖板，且所述粘接件避开所述第二盖板设置。
其中，所述显示屏具有显示区和环绕所述显示区的非显示区，所述散热装置至少部分正对所述显示区设置。
本申请实施例还提供了一种电子设备的组装方法，所述电子设备包括中框，所述电子设备的组装方法包括：
提供第一板材，所述第一板材包括固定连接的第一盖板和毛细结构层，所述第一盖板和所述毛细结构层为一体化设置，所述第一盖板由至少部分所述中框构成；
提供第二板材，所述第二板材包括固定连接的第二盖板和支撑件；
将所述第二板材与所述第一板材固定，以使得所述第二板材和所述第一板材之间形成密闭腔体，且使得所述支撑件和所述毛细结构层位于所述密闭腔体内，所述支撑件抵持于所述毛细结构层。
其中，所述“所述第一板材包括固定连接的第一盖板和毛细结构层”包括：
提供第一板料；
采用压铸工艺对所述第一板料进行加工，以形成一体化设置的第一盖板和毛细结构层，所述毛细结构层位于所述第一盖板的一侧。
其中，所述“所述第一板材包括固定连接的第一盖板和毛细结构层”包括：
提供第二板料；
对所述第二板料进行蚀刻处理，以形成一体化设置的第一盖板和毛细结构层，且所述毛细结构层位于所述第一盖板的一侧。
其中，所述“所述第二板材包括固定连接的第二盖板和支撑件”包括：
提供第一坯件；
对所述第一坯件进行蚀刻处理，以形成一体化设置的第二盖板和支撑件，且所述支撑件位于所述第二盖板的一侧。
其中，所述“所述第二板材包括固定连接的第二盖板和支撑件”包括：
提供第二坯件和第三坯件；
对所述第二坯件进行CNC加工，以得到支撑件；
将所述支撑件固定于所述第三坯件的一侧，所述第三坯件构成所述第二盖板，其中，所述“将所述支撑件固定于所述第三坯件的一侧”包括采用烧结工艺固定或者采用焊接工艺固定。
其中，所述“所述第二板材包括固定连接的第二盖板和支撑件”包括：
提供第四坯件；
采用压铸工艺对所述第四坯件进行加工，以形成一体化设置的第二盖板和支撑件，且所述支撑件位于所述第二盖板的一侧。
其中，所述“将所述第二板材与所述第一板材固定，以使得所述第二板材和所述第一板材之间形成密闭腔体”包括：
将所述第二盖板与所述第一盖板进行拼接；
采用激光焊接工艺对所述第二盖板和所述第一盖板的连接部位进行焊接，以使得所述第二盖板和所述第一盖板之间形成密闭腔体。
其中，在所述“采用激光焊接工艺对所述第二盖板和所述第一盖板的连接部位进行焊接”之后，所述电子设备的组装方法还包括：
对经过焊接处理后的所述第二盖板与所述第一盖板的连接部位的周侧进行点胶处理，以提升所述密闭腔体的密封性。
请一并参阅图1、图2和图3，本申请实施例提供的电子设备1包括散热装置10和中框20，所述散热装置10包括第一盖板100、第二盖板200、毛细结构层300和支撑件400，所述中框20至少部分构成所述第一盖板100。所述第二盖板200和所述第一盖板100围设形成密闭腔体A；所述毛细结构层300位于所述密闭腔体A内，所述毛细结构层300自所述第一盖板100面对所述第二盖板200的表面延伸出来，所述毛细结构层300和所述第一盖板100为一体化设置；所述支撑件400位于所述密闭腔体A内，所述支撑件400位于所述第一盖板100面对所述第一盖板100的表面，且所述支撑件400抵持于所述毛细结构层300。
其中，所述电子设备1可以是任何具备显示功能的设备。例如：平板电脑、手机、电子阅读器、遥控器、个人计算机(Personal Computer，PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等具有显示功能的智能设备。
所述散热装置10用于为电子设备1的电子元件30进行散热，所述电子元件30可以为电子设备1的电路板、芯片、电池等发热器件。所述电子设备1的中框20构成第一盖板100，由于散热装置10复用了电子设备1的中框20结构，相对于传统技术中，采用双面胶将散热装置10粘接于中框20的方式，本实施方式提供的散热装置10无需双面胶粘接，使得中框20一侧的热量可以快速的传输至散热装置10的密闭腔体A内，有助于提升散热效果。
所述第一盖板100、所述毛细结构层300为铝合金材质，所述第二盖板200和支撑件400为铜材质。所述毛细结构层300与第一盖板100为一体化设置，即毛细结构层300与第一盖板100在同一加工工序中一并形成。所述支撑件400和所述毛细结构层300均位于所述密闭腔体A内，所述支撑件400支撑于第二盖板200和毛细结构层300之间，以使得第二盖板200和毛细结构层300之间的保持预设间距，且避免第二盖板200和毛细结构层300由于外力作用而产生变形。
在一种实施方式中，所述毛细结构层300和所述第一盖板100通过压铸加工形成一体化结构，有助于批量化生产。在另一种实施方式中，所述毛细结构层300和所述第一盖板100通过蚀刻处理形成一体化结构。其中，所述毛细结构层300为金属网格结构，且所述毛细结构层300抵持于所述密闭腔体A的内壁。
所述毛细结构层300用于提供毛细力。毛细力的产生是在三相界面上内弯液面产生的。毛细力的方向：作用方向始终指向弯曲液面的凹面(凹凸弯液面是指相对于液相一侧言的)。所述散热装置10可以为均热板，均热板是一个内壁具有毛细结构的密闭腔体A，通常由铜制成。当来自电子元件30的热量传导至密闭腔体A时，密闭腔体A里的冷却液在低真空度的环境中受热后开始产生冷却液的气化现象，此时吸收热能并且体积迅速膨胀，气相的冷却介质迅速充满整个腔体，当气相介质接触到比较冷的区域时便会产生凝结的现象。借由凝结的现象释放出在蒸发时累积的热，凝结后的冷却液会借由毛细结构的 毛细管道再回到蒸发热源处，此运作流程在密闭腔体A内周而复始的进行。
所述支撑件400固定于第二盖板200的表面，在一种实施方式中，所述支撑件400与所述第二盖板200为一体化结构，所述支撑件400也可以与所述第二盖板200一体化设置，即在同一加工工序中一并形成，所述支撑件400和所述第二盖板200通过压铸加工工艺成型或者采用CNC加工工艺成型。在另一种实施方式中，所述支撑件400与所述第二盖板200分别为两个相互独立的结构，所述支撑件400通过焊接工艺固定于所述第二盖板200的表面。此时，所述支撑件400和所述第二盖板200可以分别采用不同的加工工艺成型，如，采用冲压形成所述第二盖板200，采用CNC加工形成支撑件400，一方面可以提高生产第二盖板200的效率，另一方面，可以提高支撑件400的加工精度。
本申请实施例提供的电子设备1，采用电子设备1的中框20构成所述散热装置10的第一盖板100，通过复用电子设备1的中框20结构，可以减小电子设备1的厚度。且相对于传统技术中，采用双面胶将散热装置10粘接于中框20的方式，本申请实施例提供的电子设备1无需采用双面胶粘接，使得中框20一侧的热量可以快速的传输至散热装置10的密闭腔体A内，有助于提升散热效果。且进一步的，将毛细结构层300与电子设备1的中框20一体成型，可以提升电子设备1的结构强度，无需额外设置毛细结构层300与中框20之间的固定结构，进一步减小了电子设备1的体积，从而可以减小电子设备1的厚度。
请继续参阅图4和图5，所述支撑件400与所述第二盖板200为一体化设置，所述支撑件400包括若干个支撑柱410，若干个所述支撑柱410在所述第二盖板200的表面呈阵列排布，以在所述密闭腔体A内形成交叉连通的通道420。
所述第二盖板200、所述支撑件400为铝合金材质。所述支撑件400与第二盖板200为一体化设置，即支撑件400与第二盖板200在同一加工工序中一并形成。
在一种实施方式中，所述支撑件400和所述第二盖板200通过压铸加工形成一体化结构。在另一种实施方式中，所述支撑件400和所述第二盖板200通过蚀刻处理形成一体化结构。
具体的，若干个支撑柱410在第二盖板200上呈现阵列均匀分布，所述支撑柱410支撑于毛细结构层300和第二盖板200之间，以使得第二盖板200和第一盖板100之间的密闭腔体A的体积保持稳定，减小第二盖板200和第一盖板100产生的变形。在一种实施方式中，若干个所述支撑柱410的高度保持一致，从而使得第二盖板200和第一盖板100之间的间距保持不变，有助于减小第二盖板200和第一盖板100产生的变形。
所述支撑柱410位于所述密闭腔体A内，用于在所述密闭腔体A内形成交叉连通的通道420，可以使得热量在密闭腔体A内得到充分混合和传输，进而提升散热装置10的散热效果。
请继续参阅图6和图7，所述支撑件400的轮廓尺寸自所述第二盖板200的一侧朝向所述第一盖板100的一侧逐渐减小。具体的，当采用模具加工一体化的支撑件400和第二盖板200时，由于支撑件400为椎体结构设计，便于脱模。且采用锥角设计，有助于改善一体化设计的支撑件400和第二盖板200。
请继续参阅图8，所述第一盖板100具有收容槽100a，所述毛细结构层300位于所述收容槽100a内，所述第二盖板200盖合于所述收容槽100a的开口位置，以在所述第一盖板100和所述第二盖板200之间形成所述密闭腔体A。
具体的，所述第一盖板100的表面开设有收容槽100a，所述毛细结构层300自所述第一盖板100开设收容槽100a的表面延伸出来，所述毛细结构层300位于所述收容槽100a内，所述第二盖板200盖合于所述收容槽100a的开口位置，所述支撑件400位于所述第二盖板200面对所述毛细结构层300的表面，且所述支撑件400抵持于所述毛细结构层300，以使得所述第一盖板100和所述第二盖板200之间形成体积稳定的密闭腔体A，可以减小第一盖板100和第二盖板200在外力作用下产生变形的情况。
请继续参阅图9，所述第二盖板200包括盖合部210和自所述盖合部210一侧延伸出来的连接部220，所述连接部220连接于所述第一盖板100，所述支撑件400自所述盖合部210朝向所述第一盖板100的一侧延伸出来，所述盖合部210、所述连接部220和所述第一盖板100围设形成所述密闭腔体A。
具体的，所述盖合部210和所述连接部220围设形成所述收容区230，所述连接部220连接于所述第一盖板100，所述盖合部210与所述第一盖板100之间间隔设置。
在一种实施方式中，所述盖合部210和所述连接部220为一体化设置，且所述连接部220自垂直于所述盖合部210所在平面的方向延伸出来。
具体的，所述第二盖板200可采用冲压工艺形成一体化设置的所述盖合部210和所述连接部220，一方面可以增强盖合部210和连接部220连接的密封性，另一方面可以增加盖合部210和连接部220之间的连接强度。当连接部220自垂直于盖合部210所在的平面的方向延伸出来时，连接部220对盖合部210的作用力垂直于盖合部210，进一步增加了第二盖板200的结构强度。
在另一种实施方式中，所述盖合部210和所述连接部220分别为两个独立的结构，盖合部210和连接部220分别独立成型，然后将盖合部210和连接部220通过焊接的方式固定以得到第二盖板200。
请继续参阅图10，所述第一盖板100具有第一容纳槽100b，所述毛细结构层300位于所述第一容纳槽100b内，所述第二盖板200具有第二容纳槽200a，所述支撑件400位于所述第二容纳槽200a内，所述第一容纳槽100b和所述第二容纳槽200a构成所述密闭腔体A。
具体的，在本实施方式中，第一盖板100的第一容纳槽100b和第二盖板200的第二容纳槽200a共同构成所述密闭腔体A。所述第一容纳槽100b和所述第二容纳槽200a正对，所述毛细结构层300至少部分位于所述第一容纳槽100b内，所述支撑件400至少部分位于所述第二容纳槽200a内。
请继续参阅图11，所述电子设备1还包括密封件150，所述密封件150环绕设置于所述第二盖板200与所述第一盖板100连接部位的周侧，以提升所述密闭腔体A的密封性。
其中，所述密封件150可以为密封圈，也可以为密封胶。所述密封件150设置于所述第二盖板200与所述第一盖板100连接部位的周侧，用于对第二盖板200和第一盖板100的连接部位进行二次密封，以提升密闭腔体A的密封性能。
请继续参阅图12，所述电子设备1还包括浇注口250，所述浇注口250用于向所述密闭腔体A内注入散热介质260。
其中，所述散热介质260可以为空气，也可以为其他的吸热介质。所述散热介质260还可以为液态的冷却介质，如，水、酒精、液氮等。所述散热介质260通过所述浇注口250注入。首先对所述密闭腔体A进行抽真空处理，然后往所述密闭腔体A内注入散热介质260，再对浇注口250进行密封，以将散热介质260密封于密闭腔体A内。所述毛细结构层300用于为所述散热介质260提供毛细力，以便所述散热介质260可以更好的在所述密闭腔体A内流动，从而有助于提升散热装置10的散热效果。
请继续参阅图13和图14，本申请实施例提供的所述电子设备1除了包括中框20以外，所述电子设备1还包括显示屏40和电子元件30，所述显示屏40承载于所述散热装置10，所述电子元件30位于所述散热装置10背离所述显示屏40的一侧，所述散热装置10用于将来自所述电子元件30的热量传导出去，以避免对所述显示屏40形成干扰。
其中，所述电子设备1可以是任何具备显示功能的设备。例如：平板电脑、手机、电子阅读器、遥控器、个人计算机(Personl Computer，PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等具有显示功能的智能设备。
所述显示屏40包括显示面板41和盖板玻璃42，所述显示面板41可以为液晶显示面板41，也可以为柔性显示面板41。所述电子元件30可以为电子设备1的电路板、芯片、电池等发热器件。所述散热装置10用于为电子设备1的电子元件30进行散热，所述电子设备1的中框20构成第一盖板100，由于散热装置10复用了电子设备1的中框20结构，相对于传统技术中，采用双面胶将散热装置10粘接于中框20的方式，本实施方式提供的散热装置10无需接触于双面胶粘接，使得中框20一侧的热量可以快速的传输至散热装置10的密闭腔体A内，有助于提升散热效果。
所述第一盖板100的面积大于所述第二盖板200的面积，所述第一盖板100由所述电子设备1的中框20构成，所述显示屏40承载于所述第一盖板100，且位于所述第一盖板100邻近所述第二盖板200 的一侧，所述电子元件30位于所述第一盖板100背离所述第二盖板200的一侧，即所述电子元件30分别位于所述第一盖板100的相对的两侧。所述散热装置10位于所述电子元件30和所述显示屏40之间，以将来自所述电子元件30的热量通过散热装置10传输出去，以避免来自电子元件30的热量对显示屏40产生干扰，影响显示屏40的显示功能。
请继续参阅图15，所述电子设备1还包括粘接件50，所述粘接件50用于将所述显示屏40固定于所述第一盖板100，且所述粘接件50避开所述第二盖板200设置。
具体的，所述粘接件50可以为胶体，所述粘接件50用于将显示屏40与第一盖板100进行固定。在一种实施方式中，所述粘接件50设置于显示屏40的周侧，以将显示屏40固定于第一盖板100上，此时，粘接件50没有覆盖第二盖板200和显示屏40之间的区域，可以减小电子设备1厚度方向的尺寸，实现电子设备1的轻薄化设计。也就是说，所述粘接件50避开第二盖板200设置，此时，可以减小电子设备1的厚度。
在一种实施方式中，所述粘接件50设置于显示屏40的周侧，以将显示屏40固定于第一盖板100上，且在显示屏40面对第二盖板200的的表面设置有绝热层55，所述绝热层55用于阻隔来自电子元件30的热量，避免来自电子元件30的热量对显示屏40的显示造成干扰。此过程可以认为是二次隔热的过程，第一次由散热装置10对来自电子元件30的热量进行传导，以避免热量聚集；第二次是由绝热层55对来自电子元件30的热量进行阻隔，避免热量朝向显示屏40的一侧传导，从而可以在减小电子设备1的厚度的前提下，进一步解决电子元件30的发热对显示屏40的不良影响。
请继续参阅图16，所述显示屏40具有显示区40a和环绕所述显示区40a的非显示区40b，所述散热装置10至少部分正对所述显示区40a设置。
具体的，为了便于显示屏40内部的线路排布，通过会将电子元件30设置于显示屏40内部对应显示屏40的显示区40a位置，可以减少线路的缠绕问题。为此，在本实施方式中，将散热装置10至少部分正对显示区40a设置，且将散热装置10设置于显示屏40和电子元件30之间，可以避免来自电子元件30的热量传导至显示屏40上进而导致显示不良的问题。且由于非显示区40b环绕显示区40a设置，通过将散热装置10对应显示区40a设置，也可以较好的实现对非显示区40b进行散热。
请继续参阅图17，本申请实施例提供的电子设备的组装方法包括但不限于步骤S100、S200和S300，关于S100、S200和S300介绍如下。
S100：提供第一板材510，所述第一板材510包括固定连接的第一盖板100和毛细结构层300，所述第一盖板100和所述毛细结构层300为一体化设置，所述第一盖板100由至少部分所述中框20构成。请参阅图18。
其中，第一板材510为铝合金材质，第一盖板100构成散热装置10的第一盖板100，毛细结构层300为网格状金属结构，毛细结构层300构成散热装置10的毛细结构层300。所述第一盖板100、所述毛细结构层300为铝合金材质，所述第一盖板100和所述毛细结构层300为一体化结构，即第一盖板100与毛细结构层300在同一加工工序中一并形成。在一种实施方式中，所述毛细结构层300和所述第一盖板100通过压铸加工形成一体化结构。在另一种实施方式中，所述毛细结构层300和所述第一盖板100通过蚀刻处理形成一体化结构。
S200：提供第二板材520，所述第二板材520包括固定连接的第二盖板200和支撑件400。请参阅图19。
其中，第二板材520为铜材质，所述第二盖板200构成散热装置10的第二盖板200，支撑件400构成散热装置10的支撑件400。
S300：将所述第二板材520与所述第一板材510固定，以使得所述第二板材520和所述第一板材510之间形成密闭腔体A，且使得所述支撑件400和所述毛细结构层300位于所述密闭腔体A内，所述支撑件400抵持于所述毛细结构层300。请参阅图20。
关于散热装置10的结构此处不再赘述，参见前面的描述。
具体的，将第二板材520和第一板材510相互盖合固定，以在第一板材510和第二板材520之间形成密闭腔体A，支撑件400和毛细结构层300位于密闭腔体A内，且支撑件400抵持于毛细结构层300。将第二板材520与第一板材510固定的方式可以为激光焊接，也可以为激光焊接与点胶相互配合的方式，还可以为其他的固定方式。
其中，所述毛细结构层300为金属网格结构，且所述毛细结构层300抵持于所述密闭腔体A的内壁。所述毛细结构层300固定于第二盖板200的表面，在一种实施方式中，所述毛细结构层300通过烧结工艺固定于所述第二盖板200的表面。在另一种实施方式中，所述毛细结构层300通过焊接工艺固定于所述第二盖板200的表面。所述毛细结构层300也可以与所述第二盖板200一体化设置，即在同一加工工序中一并形成。
请继续参阅图21，在一种实施方式中，所述“S100：提供第一板材510，所述第一板材510包括固定连接的第一盖板100和毛细结构层300”包括但不限于S110和S120，关于S110和S120介绍如下。
S110：提供第一板料550。请参阅图22。
S120：采用压铸工艺对所述第一板料550进行加工，以形成一体化设置的第一盖板100和毛细结构层300，所述毛细结构层300位于所述第一盖板100的一侧。请参阅图23。
其中，第一板料550为铝合金材质，采用冲压件555对第一板料550进行压铸加工，以使得第一板材510变形，以得到一体化设置的第一盖板100和毛细结构层300，且毛细结构层300位于第一盖板100的一侧。所述第一盖板100构成散热装置10的第一盖板100，所述毛细结构层300构成散热装置10的毛细结构层300。进一步的，在对第一板料550进行压铸处理后，再对经过压铸处理后的第一板料550进行蚀刻处理，以得到具有预设形状的第一盖板100和毛细结构层300。
请继续参阅图24，在另一种实施方式中，所述“S100：提供第一板材510，所述第一板材510包括固定连接的第一盖板100和毛细结构层300”包括但不限于S130和S140，关于S130和S140介绍如下。
S130：提供第二板料560。请参阅图25。
S140：对所述第二板料560进行蚀刻处理，以形成一体化设置的第一盖板100和毛细结构层300，且所述毛细结构层300位于所述第一盖板100的一侧。请参阅图26。
其中，第二板料560为铝合金材质，对第二板料560进行蚀刻处理，以使得第二板材520变形，以得到一体化设置的第一盖板100和毛细结构层300，且毛细结构层300位于第一盖板100的一侧。所述第一盖板100构成散热装置10的第一盖板100，所述毛细结构层300构成散热装置10的毛细结构层300。进一步的，在对第二板料560进行蚀刻处理后，再对经过蚀刻处理后的第二板料560进行CNC加工，以得到具有预设尺寸的第一盖板100和毛细结构层300。
请继续参阅图27，在另一种实施方式中，所述“S100：提供第一板材510，所述第一板材510包括固定连接的第一盖板100和毛细结构层300”包括但不限于S150和S160，关于S150和S160介绍如下。
S150：提供第一材料570。请参阅图28。
其中，第一材料570为铜材质。
S160：对所述第一材料570的表面采用压印工艺进行处理，以形成一体化设置的第一盖板100和毛细结构层300，且所述毛细结构层300位于所述第一盖板100的一侧。请参阅图29。
其中，压印工艺是将材料放在上、下模之间，在压力作用下使其材料厚度发生变化，并将挤压外的材料，充塞在有起伏细纹的模具形腔凸、凹处，而在工件表面得到形成起伏鼓凸及字样或花纹的一种成形方法。如硬币，纪念章等，都是用压印的方法成形的。
所述第一盖板100构成散热装置10的第一盖板100，所述毛细结构层300构成散热装置10的毛细结构层300。所述毛细结构层300为金属网格结构。具体的，采用模具对第一材料570的表面进行压印，以使得模具的图案被显现于第一材料570的表面，从而得到一体化设置的第一盖板100和毛细结构层300，且毛细结构层300位于第一盖板100的一侧。
请继续参阅图30，在一种实施方式中，所述“S200：提供第二板材520，所述第二板材520包括固 定连接的第二盖板200和支撑件400”包括但不限于S210和S220，关于S210和S220介绍如下。
S210：提供第一坯件610。请参阅图31。
S220：对所述第一坯件610进行蚀刻处理，以形成一体化设置的第二盖板200和支撑件400，且所述支撑件400位于所述第二盖板200的一侧。请参阅图32。
其中，第一坯件610为铝合金材质，对第一坯件610进行蚀刻处理，以使得第一坯件610变形，以得到一体化设置的第二盖板200和支撑件400，且支撑件400位于第二盖板200的一侧。所述第二盖板200构成散热装置10的第二盖板200，所述支撑件400构成散热装置10的支撑件400。进一步的，在对第一坯件610进行蚀刻处理后，再对经过蚀刻处理后的第一坯件610进行CNC加工，以得到具有预设尺寸的第二盖板200和支撑件400。
请继续参阅图33，在另一种实施方式中，所述“S200：提供第二板材520，所述第二板材520包括固定连接的第二盖板200和支撑件400”包括但不限于S230、S240和S250，关于S230、S240和S250介绍如下。
S230：提供第二坯件620和第三坯件630。请参阅图34。
S240：对所述第二坯件620进行CNC加工，以得到支撑件400。请参阅图35。
S250：将所述支撑件400固定于所述第三坯件630的一侧，所述第三坯件630构成所述第二盖板200，其中，所述“将所述支撑件400固定于所述第三坯件630的一侧”包括采用烧结工艺固定或者采用焊接工艺固定。请参阅图36。
其中，第二坯件620和第三坯件630均为铜材质。第二坯件620和第三坯件630为分别独立的结构，第三坯件630构成散热装置10的第二盖板200，第二坯件620经过CNC加工后形成支撑件400。然后再将支撑件400固定于第三坯件630，且使得支撑件400位于第三坯件630的一侧。
在一种实施方式中，将支撑件400采用烧结工艺固定于第三坯件630上。在另一种实施方式中，将支撑件400采用焊接工艺固定于第三坯件630上。
请继续参阅图37，在又一种实施方式中，所述“S200：提供第二板材520，所述第二板材520包括固定连接的第二盖板200和支撑件400”包括但不限于S260和S270，关于S260和S270介绍如下。
S260：提供第四坯件640。请参阅图38。
S270：采用压铸工艺对所述第四坯件640进行加工，以形成一体化设置的第二盖板200和支撑件400，且所述支撑件400位于所述第二盖板200的一侧。请参阅图39。
其中，第四坯件640为铝合金材质，对第四坯件640进行压铸加工，以使得第四坯件640变形，以得到一体化设置的第二盖板200和支撑件400，且支撑件400位于第二盖板200的一侧。所述第二盖板200构成散热装置10的第二盖板200，所述支撑件400构成散热装置10的支撑件400。进一步的，在对第四坯件640进行压铸处理后，再对经过压铸处理后的第四坯件640进行CNC加工，以得到具有预设尺寸的第二盖板200和支撑件400。
请继续参阅图40，在一种实施方式中，所述“S300：将所述第二板材520与所述第一板材510固定，以使得所述第二板材520和所述第一板材510之间形成密闭腔体A”包括但不限于S310和S320，关于S310和S320介绍如下。
S310：将所述第二盖板200与所述第一盖板100进行拼接。
S320：采用激光焊接工艺对所述第二盖板200与所述第一盖板100的连接部位进行焊接，以使得所述第二盖板200与所述第一盖板100之间形成密闭腔体A。
具体的，采用激光焊接的方式将第一板材510与第二板材520固定，且在第一板材510和第二板材520之间形成密闭腔体A。激光焊接是利用高能量密度的激光束作为热源的一种高效精密焊接方法。主要用于焊接薄壁材料和低速焊接，焊接过程属热传导型，即激光辐射加热工件表面，表面热量通过热传导向内部扩散，通过控制激光脉冲的宽度、能量、峰值功率和重复频率等参数，使工件熔化，形成特定的熔池。由于其独特的优点，已成功应用于微、小型零件的精密焊接中。
请继续参阅图41，在一种实施方式中，在所述“S320：采用激光焊接工艺对所述第二盖板200与所述第一盖板100的连接部位进行焊接”之后，所述电子设备的组装方法还包括但不限于S321介绍如下。
S321：对经过焊接处理后的所述第二盖板200和所述第一盖板100的连接部位的周侧进行点胶处理，以提升所述密闭腔体A的密封性。
具体的，在本实施方式中，先对所述第二盖板200和所述第一盖板100的连接部位进行激光焊接，然后再对经过焊接后的所述第二盖板200和所述第一盖板100的连接部位的周侧进行点胶工艺处理，相当于是二次提升密闭腔体A的密封性。
进一步的，可以采用多次点胶的方式对所述第二盖板200和所述第一盖板100的连接部位进行点胶密封。且可以采用连续点胶和间断点胶的方式进行。
以上对本申请实施例进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种电子设备，其特征在于，所述电子设备包括：
    散热装置，所述散热装置包括第一盖板、第二盖板、毛细结构层和支撑件，所述第二盖板和所述第一盖板围设形成密闭腔体，所述毛细结构层位于所述密闭腔体内，所述毛细结构层自所述第一盖板面对所述第二盖板的表面延伸出来，所述毛细结构层和所述第一盖板为一体化设置，所述支撑件位于所述密闭腔体内，所述支撑件位于所述第一盖板面对所述第一盖板的表面，且所述支撑件抵持于所述毛细结构层；及
    中框，所述中框至少部分构成所述第一盖板。
  2. 如权利要求1所述的电子设备，其特征在于，所述支撑件与所述第二盖板为一体化设置，所述支撑件包括若干个支撑柱，若干个所述支撑柱在所述第二盖板的表面呈阵列排布，以在所述密闭腔体内形成交叉连通的通道。
  3. 如权利要求1或者2所述的电子设备，其特征在于，所述支撑件的轮廓尺寸自所述第二盖板的一侧朝向所述第一盖板的一侧逐渐减小。
  4. 如权利要求1所述的电子设备，其特征在于，所述第一盖板具有收容槽，所述毛细结构层位于所述收容槽内，所述第二盖板盖合于所述收容槽的开口位置，以在所述第一盖板和所述第二盖板之间形成所述密闭腔体。
  5. 如权利要求1所述的电子设备，其特征在于，所述第二盖板包括盖合部和自所述盖合部一侧延伸出来的连接部，所述连接部连接于所述第一盖板，所述支撑件自所述盖合部朝向所述第一盖板的一侧延伸出来，所述盖合部、所述连接部和所述第一盖板围设形成所述密闭腔体。
  6. 如权利要求5所述的电子设备，其特征在于，所述盖合部和所述连接部为一体化设置，且所述连接部自垂直于所述盖合部所在平面的方向延伸出来。
  7. 如权利要求1所述的电子设备，其特征在于，所述第一盖板具有第一容纳槽，所述毛细结构层位于所述第一容纳槽内，所述第二盖板具有第二容纳槽，所述支撑件位于所述第二容纳槽内，所述第一容纳槽和所述第二容纳槽构成所述密闭腔体。
  8. 如权利要求1-7任意一项所述的电子设备，其特征在于，所述散热装置还包括密封件，所述密封件环绕设置于所述第二盖板与所述第一盖板连接部位的周侧，以提升所述密闭腔体的密封性。
  9. 如权利要求1所述的电子设备，其特征在于，所述散热装置还包括浇注口，所述浇注口用于向所述密闭腔体内注入散热介质。
  10. 如权利要求1所述的电子设备，其特征在于，所述电子设备还包括显示屏和电子元件，所述显示屏承载于所述散热装置，所述电子元件位于所述散热装置背离所述显示屏的一侧，所述散热装置用于将来自所述电子元件的热量传导出去。
  11. 如权利要求10所述的电子设备，其特征在于，所述电子设备还包括粘接件，所述粘接件用于将所述显示屏固定于所述第一盖板，且所述粘接件避开所述第二盖板设置。
  12. 如权利要求10所述的电子设备，其特征在于，所述显示屏具有显示区和环绕所述显示区的非显示区，所述散热装置至少部分正对所述显示区设置。
  13. 一种电子设备的组装方法，其特征在于，所述电子设备包括中框，所述电子设备的组装方法包括：
    提供第一板材，所述第一板材包括固定连接的第一盖板和毛细结构层，所述第一盖板和所述毛细结构层为一体化设置，所述第一盖板由至少部分所述中框构成；
    提供第二板材，所述第二板材包括固定连接的第二盖板和支撑件；
    将所述第二板材与所述第一板材固定，以使得所述第二板材和所述第一板材之间形成密闭腔体，且使得所述支撑件和所述毛细结构层位于所述密闭腔体内，所述支撑件抵持于所述毛细结构层。
  14. 如权利要求13所述的电子设备的组装方法，其特征在于，所述“所述第一板材包括固定连接的第一盖板和毛细结构层”包括：
    提供第一板料；
    采用压铸工艺对所述第一板料进行加工，以形成一体化设置的第一盖板和毛细结构层，所述毛细结构层位于所述第一盖板的一侧。
  15. 如权利要求13所述的电子设备的组装方法，其特征在于，所述“所述第一板材包括固定连接的第一盖板和毛细结构层”包括：
    提供第二板料；
    对所述第二板料进行蚀刻处理，以形成一体化设置的第一盖板和毛细结构层，且所述毛细结构层位于所述第一盖板的一侧。
  16. 如权利要求13所述的电子设备的组装方法，其特征在于，所述“所述第二板材包括固定连接的第二盖板和支撑件”包括：
    提供第一坯件；
    对所述第一坯件进行蚀刻处理，以形成一体化设置的第二盖板和支撑件，且所述支撑件位于所述第二盖板的一侧。
  17. 如权利要求13所述的电子设备的组装方法，其特征在于，所述“所述第二板材包括固定连接的第二盖板和支撑件”包括：
    提供第二坯件和第三坯件；
    对所述第二坯件进行CNC加工，以得到支撑件；
    将所述支撑件固定于所述第三坯件的一侧，所述第三坯件构成所述第二盖板，其中，所述“将所述支撑件固定于所述第三坯件的一侧”包括采用烧结工艺固定或者采用焊接工艺固定。
  18. 如权利要求13所述的电子设备的组装方法，其特征在于，所述“所述第二板材包括固定连接的第二盖板和支撑件”包括：
    提供第四坯件；
    采用压铸工艺对所述第四坯件进行加工，以形成一体化设置的第二盖板和支撑件，且所述支撑件位于所述第二盖板的一侧。
  19. 如权利要求13所述的电子设备的组装方法，其特征在于，所述“将所述第二板材与所述第一板材 固定，以使得所述第二板材和所述第一板材之间形成密闭腔体”包括：
    将所述第二盖板与所述第一盖板进行拼接；
    采用激光焊接工艺对所述第二盖板和所述第一盖板的连接部位进行焊接，以使得所述第二盖板和所述第一盖板之间形成密闭腔体。
  20. 如权利要求19所述的电子设备的组装方法，其特征在于，在所述“采用激光焊接工艺对所述第二盖板和所述第一盖板的连接部位进行焊接”之后，所述电子设备的组装方法还包括：
    对经过焊接处理后的所述第二盖板与所述第一盖板的连接部位的周侧进行点胶处理，以提升所述密闭腔体的密封性。
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