WO2021109175A1 - 薄型均温板 - Google Patents

薄型均温板 Download PDF

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Publication number
WO2021109175A1
WO2021109175A1 PCT/CN2019/124215 CN2019124215W WO2021109175A1 WO 2021109175 A1 WO2021109175 A1 WO 2021109175A1 CN 2019124215 W CN2019124215 W CN 2019124215W WO 2021109175 A1 WO2021109175 A1 WO 2021109175A1
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Prior art keywords
cover plate
cavity
plate
thin
capillary structure
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PCT/CN2019/124215
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English (en)
French (fr)
Inventor
齐跃庭
张于光
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昆山联德电子科技有限公司
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Publication of WO2021109175A1 publication Critical patent/WO2021109175A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/001—Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core

Definitions

  • the present invention relates to the technical field of uniform temperature plate structure, in particular to a thin-type uniform temperature plate.
  • the uniform temperature plate has gradually replaced the traditional heat pipe for heat dissipation.
  • the uniform temperature plate has a divergent steam path, has a good 2D surface thermal conductivity, and has a high-density thermal conductivity, and has the characteristics of lightness and thinness.
  • the capillary structure is mostly a regular structure shape, and it cannot fit the plate well when it encounters an irregular step plate, which will affect the flow and conduction of the phase change medium and reduce the heat conduction capacity.
  • the present invention provides a thin uniform temperature plate, which enables the uniform temperature plate to reduce the thickness, increase the heat exchange capacity, reduce the overall weight, and meet the ever-increasing heat exchange requirements according to the heat exchange requirements.
  • Thin-type temperature equalizing plate characterized in that it comprises a first cover plate and a second cover plate, the central area of the first cover plate is provided with an upper convex cavity, and the outer frame of the first cover plate is installed on the
  • the combination of the upper convex cavity and the second cover directly below the peripheral area of the second cover plate forms a cavity, and the inner wall array of the upper convex cavity corresponding to the surface area of the cavity is arranged with A plurality of downward convex support structures, a single-layer capillary structure is arranged in the cavity, one surface of the single-layer capillary structure is arranged in contact with the downward convex inner wall of the downward convex support structure, and the other single-layer capillary structure A surface is arranged on the inner surface of the corresponding area of the second cover plate, which further includes a working fluid injection hole, the working fluid injection hole communicates with the cavity, and the working fluid injection hole is injecting the phase change medium and evacuating After sealing.
  • the second cover plate is specifically a sheet metal bottom plate
  • the outer frame of the first cover plate is brazed and welded to the peripheral area of the second cover plate, and the first cover plate corresponds to the outer part of the brazing area of the second cover plate close to the cavity.
  • a ring of concave solder-proof overflow groove is provided at the edge position, and the solder-proof overflow groove prevents solder from overflowing into the cavity and causing pollution;
  • the area of the second cover plate corresponding to the heat source portion is provided with a lower convex cavity, and a corresponding capillary structure is arranged in the lower convex cavity.
  • the advantage of the sheet metal forming process is used to make the sheet metal bottom plate convex
  • the overmolding process replaces the original sheet metal block welding or pasting process.
  • the heat source part directly contacts the uniform temperature plate, and the thermal resistance is reduced by about 0.6 to 0.9W/°C, which also effectively increases the inner cavity space.
  • the welding process of the sheet metal block increases the sheet metal block invading about 100% of the cavity space;
  • the side wall of the lower convex cavity has a circular arc edge transition structure to ensure that external components will not be damaged;
  • the bottom of the lower convex support structure extends into the area of the lower convex cavity, and the single-layer capillary structure corresponding to the area of the lower convex cavity is set in the lower convex cavity corresponding to the lower convex cavity.
  • the bottom of the downward convex support structure in the body region is close to the corresponding surface of the single-layer capillary structure;
  • a multilayer folded capillary structure is arranged in the lower convex cavity, and the bottom layer of the multilayer folded capillary structure is arranged closely to the bottom surface of the lower convex cavity,
  • the upper layer of the multi-layer folded capillary structure is arranged close to the lower surface of the corresponding area of the single-layer capillary structure, and the folded multi-layer capillary structure replaces the solid convex column, which reduces the space occupied by the cavity by about 60-70% compared with the convex column;
  • the exposed upper surface of the etched upper plate is a flat surface, and the cavity is specifically formed by a combination of grooves formed by etching;
  • the working fluid injection hole is arranged on the exposed surface of the sheet metal bottom plate
  • the exposed upper surface of the sheet metal upper plate is provided with an inner groove corresponding to the lower convex support structure, and the bottom edge of the lower convex support structure and the exposed upper surface
  • the connection position is the connecting hypotenuse that is flared from bottom to top.
  • the upper sheet metal plate processes the supporting convex hull into an inclination pattern to ensure function and strength. At the same time, the inner inclination part releases more space for the inside of the cavity.
  • the etching process reduces the encroachment of the convex column by about 30-40% of the cavity space, and the steam channel and space are more conducive to the transfer and release of heat energy; taking advantage of the sheet metal forming process, the upper plate of the sheet metal will support only the material on the back of the convex hull Thickness, while ensuring function and strength, greatly reduces the weight of the material. In practical applications, the etching process reduces the weight of the convex column by about 60-70%;
  • a working fluid injection hole is provided on the side wall of the convex cavity of the first cover plate
  • the single-layer capillary structure is specifically a mesh structure, a sintered powder structure or a mesh + sintered powder composite structure, and the material of the single-layer capillary structure is specifically copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy or stainless steel material;
  • the multi-layer folded capillary structure is specifically a mesh structure, a sintered powder structure or a mesh + sintered powder composite structure, and the material of the multi-layer folded capillary structure is specifically copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy Or stainless steel material;
  • the shape of the downward convex support structure is specifically cylindrical, frustum, cube, cube, hemisphere, ellipsoid, and all the downward convex support structures are arranged in a rectangular array to ensure simple and convenient manufacturing;
  • the material of the first cover plate and the second cover plate is copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy or stainless steel.
  • the thickness of the uniform temperature plate can be 0.25mm, which greatly improves the light and thin characteristics of the uniform temperature plate.
  • the characteristics can be reduced or added at any position. It has good compatibility with complex mechanisms and heat conduction.
  • the method is that the two-dimensional plane multi-directional conduction design has small limitations and high efficiency.
  • the entire technical product can use corrosion-resistant materials to provide more efficient thermal conductivity and reliability and life without surface treatment; a single-layer capillary structure is provided in the cavity, and one of the surfaces of the single-layer capillary structure is attached The lower convex inner wall of the convex support structure is arranged, the other surface of the single-layer capillary structure is arranged on the inner surface of the corresponding area of the second cover plate, which also includes the working fluid injection hole, the outer periphery of the first cover plate and the second cover plate Using laser welding/solder welding/ultrasonic welding process sealing combination, the working fluid is pumped and injected from the position of the working fluid injection hole, and the working fluid enters and exits the interior of the uniform temperature plate through the channel of the working fluid injection hole.
  • the laser welding/ultrasonic welding method seals the working fluid injection hole, and the temperature of the second cover plate is increased when the heat source is contacted.
  • the liquid phase will quickly evaporate into a hot gaseous working fluid in a vacuum ultra-low pressure environment while absorbing heat energy, hot gaseous
  • the working fluid in the gap in the capillary structure is transferred to other places to liquefy into liquid, and at the same time release heat energy.
  • the liquid working fluid flows back to the heat source location through the capillary structure, and it works again and again, which enables the uniform temperature plate to reduce the thickness according to the heat exchange needs. , Increase the heat exchange capacity, reduce the overall weight, and meet the ever-increasing heat exchange demand.
  • Fig. 1 is a schematic structural diagram of a front view of a first embodiment of the present invention
  • Fig. 2 is a schematic diagram of the A-A section structure of Fig. 1;
  • Fig. 3 is a schematic structural diagram of a front view of a second embodiment of the present invention.
  • Fig. 4 is a schematic diagram of the B-B cross-sectional structure of Fig. 3;
  • FIG. 5 is a schematic structural diagram of a front view of a specific embodiment 3 of the present invention.
  • Fig. 6 is a schematic diagram of the C-C cross-sectional structure of Fig. 5;
  • FIG. 7 is a schematic structural diagram of a front view of a specific embodiment 4 of the present invention.
  • Fig. 8 is a schematic diagram of the D-D cross-sectional structure of Fig. 7;
  • FIG. 9 is a schematic structural diagram of a rear view of specific embodiment 5 of the present invention.
  • Fig. 10 is a schematic diagram of the E-E cross-sectional structure of Fig. 9;
  • FIG. 11 is a schematic structural diagram of a front view of a sixth embodiment of the present invention.
  • Figure 12 is a schematic diagram of the F-F cross-sectional structure of Figure 11;
  • Figure 13 is a partial enlarged view of G in Figure 2;
  • Fig. 14 is a partial enlarged view of H in Fig. 8;
  • Thin-type temperature equalizing plate see Figure 1 to Figure 12: It includes a first cover plate 1, a second cover plate 2, the central area of the first cover plate 1 is provided with an upper convex cavity 4, and the outer frame of the first cover plate 1 4 The upper convex cavity 4 and the second cover 2 directly below the upper convex cavity 4 and the second cover 2 directly below it are combined to form a cavity 5.
  • the inner wall of the upper convex cavity 4 corresponds to the area of the cavity
  • a number of lower convex support structures 6 are arranged in an array, a single-layer capillary structure 7 is arranged in the cavity 6, and one surface of the single-layer capillary structure 7 is arranged to fit the lower convex inner wall of the lower convex support structure 6, and the single-layer capillary structure 7
  • the other surface of the second cover plate 2 is attached to the inner surface of the corresponding area of the second cover plate 2, and it also includes a working fluid injection hole 8, which communicates with the cavity 5, and the working fluid injection hole 8 is injecting the phase change medium and evacuating After sealing.
  • the second cover plate 2 is specifically a sheet metal bottom plate 201; the sheet metal bottom plate 201 makes it possible to reduce or add features at any position in terms of design, which has good compatibility with complex mechanisms. Specifically, the sheet metal bottom plate 201 can be easily set or set according to design requirements.
  • the working fluid injection hole 8 and the downward convex cavity 202 are not provided, and the positions of the working fluid injection hole 8 and the downward convex cavity 202 are conveniently arranged.
  • the outer frame 4 of the first cover plate 1 is welded to the peripheral area of the second cover plate 2 by brazing, and the first cover plate 1 corresponds to the position of the brazing area of the second cover plate 2 close to the outer edge of the cavity 5
  • a ring of concave solder-proof overflow groove 11 is provided, and the solder-proof overflow groove 11 prevents solder from overflowing into the cavity 5 and causing pollution.
  • the first cover plate 1 is specifically a sheet metal upper plate 101, and the exposed upper surface of the sheet metal upper plate 101 is provided with an inner groove 102 corresponding to the lower convex support structure 6, and The connection position between the bottom edge of the convex support structure 6 and the exposed upper surface is the connecting hypotenuse 103 flared from bottom to top, the sheet metal bottom plate 201 is a flat plate structure, and only a single-layer capillary structure 7 is arranged in the cavity 5.
  • the first cover plate 1 is specifically a sheet metal upper plate 101, and the exposed upper surface of the sheet metal upper plate 101 is provided with an inner groove 102 corresponding to the lower convex support structure 6, and The connection position between the bottom edge of the convex support structure 6 and the exposed upper surface is the connecting hypotenuse 103 that is flared from bottom to top.
  • the area of the sheet metal bottom plate 201 corresponding to the heat source portion is provided with a lower convex cavity 202 and a lower convex cavity 202
  • the side wall of is an arc edge transition structure 203
  • the bottom of the lower convex support structure 6 extends into the area of the lower convex cavity 202
  • the area of the single-layer capillary structure 7 corresponding to the lower convex cavity 202 is modeled on the lower convex cavity 202 is set, corresponding to the bottom of the lower convex support structure 6 in the area of the lower convex cavity 202, close to the corresponding surface of the single-layer capillary structure 7.
  • the heat source part 10 is installed in contact with the exposed surface of the lower convex cavity 202.
  • the first cover plate 1 is specifically a sheet metal upper plate 101, and the exposed upper surface of the sheet metal upper plate 101 is provided with an inner groove 102 corresponding to the lower convex support structure 6.
  • the connection position between the bottom edge of the convex support structure 6 and the exposed upper surface is the connecting hypotenuse 103 flared from bottom to top.
  • the area of the sheet metal bottom plate 201 corresponding to the heat source portion 10 is provided with a lower convex cavity 202, a lower convex cavity
  • the side wall of 202 is a transitional structure with arc edges.
  • a multi-layer folded capillary structure 9 is arranged in the lower convex cavity.
  • the bottom layer of the multi-layer folded capillary structure 9 is arranged close to the bottom surface of the lower convex cavity 202.
  • the multi-layer folded capillary structure 9 The upper layer is arranged close to the lower surface of the corresponding area of the single-layer capillary structure 7.
  • the heat source part 10 is installed in contact with the exposed surface of the lower convex cavity 202.
  • a working fluid injection hole 8 is provided on the side wall of the upper convex cavity 4 of the upper sheet metal plate 101.
  • the first cover plate 1 is specifically an etched upper plate 104, the exposed upper surface of the etched upper plate 104 is a flat surface, and the cavity 5 is specifically formed by a combination of grooves 105 formed by etching;
  • the gold bottom plate 201 is a flat plate structure, and only a single-layer capillary structure 7 is arranged in the cavity 5.
  • the first cover plate 1 is specifically an etched upper plate 104, the exposed upper surface of the etched upper plate 104 is a flat surface, and the cavity 5 is specifically formed by a combination of grooves 105 formed by etching.
  • the area of the gold bottom plate 201 corresponding to the heat source portion is provided with a lower convex cavity 202, the side wall of the lower convex cavity 202 is a circular arc edge transition structure 203, and the bottom of the lower convex supporting structure 6 extends into the area of the lower convex cavity 202
  • the single-layer capillary structure 7 corresponds to the area of the lower convex cavity 202 and is set on the lower convex cavity 201, corresponding to the bottom of the lower convex support structure 6 in the area of the lower convex cavity 202, which is close to the single-layer capillary structure 7
  • the heat source part is installed in contact with the exposed surface of the lower convex cavity 202.
  • the first cover plate 1 is specifically an etched upper plate 104, the exposed upper surface of the etched upper plate 104 is a flat surface, and the cavity is specifically formed by a combination of grooves 105 formed by etching, and the sheet metal
  • the area of the bottom plate 201 corresponding to the heat source portion is provided with a lower convex cavity 202, the side wall of the lower convex cavity 202 is a circular arc edge transition structure 203, and the lower convex cavity 202 is arranged with a multi-layer folded capillary structure 9, which is multi-layer folded
  • the bottom layer of the capillary structure 9 is arranged close to the bottom surface of the lower convex cavity 202, and the upper layer of the multi-layer folded capillary structure 9 is arranged close to the lower surface of the corresponding area of the single-layer capillary structure 7.
  • the heat source part is arranged under the convex cavity 202.
  • the exposed surface of the cavity 202 is installed in contact with each other.
  • the working fluid injection hole 8 is arranged on the exposed surface of the sheet metal bottom plate 201;
  • the single-layer capillary structure 7 is specifically a mesh structure, a sintered powder structure, or a mesh+sintered powder composite structure, and the material of the single-layer capillary structure 7 is specifically copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy or stainless steel material;
  • the multi-layer folded capillary structure 9 is specifically a mesh structure, a sintered powder structure or a mesh + sintered powder composite structure, and the material of the multi-layer folded capillary structure 9 is specifically copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy Or stainless steel material;
  • the shape of the downward convex support structure 6 is specifically cylindrical, truncated cone, cube, cube, hemispherical, and ellipsoid. All the downward convex support structures are arranged in a rectangular array to ensure simple and convenient production;
  • the material of the first cover plate 1 and the second cover plate 2 is copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy or stainless steel.
  • top-bottom relationship and the top-bottom relationship mentioned in the text can be interchanged in the actual process, and can become the left-right position relationship in the reversed state of use.
  • the thin-type uniform temperature plate is bent and formed into a three-dimensional shape in the finished state, which is suitable for use in special devices, such as wearable electronic devices (VR/AR glasses, electronic bracelets, watches, etc.).
  • wearable electronic devices VR/AR glasses, electronic bracelets, watches, etc.
  • the working principle is as follows: the working fluid is pumped and injected from the position of the working fluid injection hole, and the working fluid enters and exits the interior of the uniform temperature plate through the channel of the working fluid injection hole. After the working fluid is pumped and injected, the resistance welding/laser welding/ultrasonic welding is used in the working fluid. The material injection hole is sealed, and the temperature of the second cover plate is increased when the heat source is contacted. The liquid phase will quickly evaporate into a hot gaseous working fluid in a vacuum and ultra-low pressure environment and absorb heat at the same time. The hot gaseous working fluid is in the capillary structure. The gap is transferred to other places to liquefy into liquid and release heat at the same time.
  • the liquid working fluid flows back to the heat source position through the capillary structure, and it works again and again, which enables the uniform temperature plate to be thinner, increase heat exchange capacity, and reduce according to heat exchange needs.
  • the overall weight meets the ever-increasing demand for heat exchange.

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Abstract

本发明提供了薄型均温板，其使得均温板能够根据换热需要，减薄厚度、增大换热能力，降低整体重量，满足不断增长的换热需求。其包括第一盖板、第二盖板，所述第一盖板的中心区域设置有上凸腔体，所述第一盖板的外边框盖装于所述第二盖板的外围区域后上凸腔体和其正下方的第二盖板的组合形成容腔，所述上凸腔体的对应于所述容腔的面域的内壁阵列排布有若干下凸支撑结构，所述容腔内设置有单层毛细结构，所述单层毛细结构的其中一表面贴合所述下凸支撑结构的下凸内壁布置，所述单层毛细结构的另一表面贴合所述第二盖板的对应区域内表面布置，其还包括有工质注入孔，所述工质注入孔连通容腔，所述工质注入孔在注入相变介质并抽真空后封口。

Description

薄型均温板 技术领域
本发明涉及均温板结构的技术领域，具体为薄型均温板。
背景技术
随着电脑、平板电脑、手机功能和外观的不断升级，功耗和轻薄化的体验的要求也不断提高。均温板已经逐渐取代传统的热管进行散热。均温板具有发散型的蒸汽路径有良好的2D面导热能力，和对高密度热能传导能力，并具有轻薄特点。
目前均温板在生产、使用中还存在一些不足：
1随着薄型趋势，内部真空腔体体积不断被压缩，性能随之降低。
2板材凸柱多为实体，产品重量难以降低。
3如果热源与均温板距离较远，需要另外黏贴或焊接一个接触面金属块，热源到均温板的热阻抗被极大的提升，且增加重量和成本。
4毛细结构多为规则结构形状，遇到不规则段差板材时不能很好贴合板材，对相变介质的流动传导造成影响，热传导能力降低。
在这种背景下，急需一种新型均温板结构。
发明内容
针对上述问题，本发明提供了薄型均温板，其使得均温板能够根据换热需要，减薄厚度、增大换热能力，降低整体重量，满足不断增长的换热需求。
薄型均温板，其特征在于：其包括第一盖板、第二盖板，所述第一盖板的中心区域设置有上凸腔体，所述第一盖板的外边框盖装于所述第二盖板的 外围区域后上凸腔体和其正下方的第二盖板的组合形成容腔，所述上凸腔体的对应于所述容腔的面域的内壁阵列排布有若干下凸支撑结构，所述容腔内设置有单层毛细结构，所述单层毛细结构的其中一表面贴合所述下凸支撑结构的下凸内壁布置，所述单层毛细结构的另一表面贴合所述第二盖板的对应区域内表面布置，其还包括有工质注入孔，所述工质注入孔连通容腔，所述工质注入孔在注入相变介质并抽真空后封口。
其进一步特征在于：所述第二盖板具体为钣金底板；
所述第一盖板的外边框通过钎焊焊接于所述第二盖板的外围区域，所述第一盖板对应于所述第二盖板的钎焊区域的靠近所述容腔的外缘位置设置有一圈内凹的防焊料溢出槽，所述防焊料溢出槽防止焊料溢入容腔、造成污染；
所述第二盖板的对应于热源部分的区域设置有下凸腔体，所述下凸腔体内布置有对应的毛细结构，其利用钣金成型工艺的优势，使得钣金底板由钣金凸包成型工艺代替原来的钣金块焊接或黏贴工艺，热源部分直接接触均温板，热阻抗降低约0.6～0.9W/℃，其同时又效增大了内腔空间。实际应用中较为钣金块焊接工艺增大钣金块侵占腔体空间约100％；
所述下凸腔体的侧壁为圆弧边过渡结构，确保不会损伤外部元器件；
所述下凸支撑结构的底部延伸至所述下凸腔体的区域内，所述单层毛细结构对应于下凸腔体的区域仿形于下凸腔体设置，对应于所述下凸腔体区域内的下凸支撑结构的底部紧贴所述单层毛细结构的对应表面；
所有的下凸支撑结构的底部处于同一平面位置时，所述下凸腔体内布置有多层折叠毛细结构，所述多层折叠毛细结构的底层紧贴所述下凸腔体的底部表面布置，所述多层折叠毛细结构的上层紧贴所述单层毛细结构的对应区 域的下表面布置，折叠多层毛细结构代替实体凸柱，较凸柱侵占腔体空间减少约60～70％；
所述第一盖板具体为蚀刻上板时，所述蚀刻上板的外露上表面为平面，所述容腔具体为蚀刻形成的凹槽组合形成；
所述工质注入孔布置于所述钣金底板的外露表面布置；
所述第一盖板具体为钣金上板时，所述钣金上板的外露上表面设置有对应于下凸支撑结构的内凹槽，所述下凸支撑结构的底边和外露上表面的连接位置为自下而上扩口的连接斜边，钣金上板将支撑作用凸包加工为倾角式样，保证功能和强度的同时内倾角部分释放更多空间给与腔体内部，实际应用中较为蚀刻工艺减小凸柱侵占腔体空间约30～40％，蒸汽通道及空间更有利于热能传递和释放；利用钣金成型工艺的优势，钣金上板将支撑作用凸包背部只有材料厚度，保证功能和强度的同时较大的减小了材料重量，实际应用中较为蚀刻工艺减小凸柱重量约60～70％；
所述第一盖板的上凸腔体的侧壁上设置有一处工质注入孔；
所述单层毛细结构具体为网目结构、烧结粉末结构或网目+烧结粉末复合结构，所述单层毛细结构的材质具体为铜、铜合金、铝、铝合金、钛、钛合金或不锈钢材料；
所述多层折叠毛细结构具体为网目结构、烧结粉末结构或网目+烧结粉末复合结构，所述多层折叠毛细结构的材质具体为铜、铜合金、铝、铝合金、钛、钛合金或不锈钢材料；
所述下凸支撑结构的形状具体为圆柱形、圆锥台形、正方体型、立方体形、半球形、椭球形，所有的下凸支撑结构成矩形阵列排布，确保制作简单、 方便；
所述第一盖板、第二盖板的材质为铜、铜合金、铝、铝合金、钛、钛合金或不锈钢材料。
采用上述技术方案后，均温板能够将厚度做到0.25mm，极大的提升了均温板的轻薄特性，设计方面可以在任何位置减少或增加特征对复杂机构有很好的兼容性，热传导方式为二维平面多方向传导设计局限性小、效率高。整个技术产品可使用耐腐蚀材质在不做表面处理的情况下可以提供更高效热传导性能的和可靠性及寿命；容腔内设置有单层毛细结构，单层毛细结构的其中一表面贴合下凸支撑结构的下凸内壁布置，单层毛细结构的另一表面贴合第二盖板的对应区域内表面布置，其还包括有工质注入孔，第一盖板和第二盖板的外周采用激光焊接/焊料焊接/超声波焊接工艺密封结合，从工质注入孔位置抽气注工质，工质从工质注入孔通道进出均温板内部，完成抽气注工质后使用电阻焊/激光焊/超声波焊方式在工质注入孔处封口，第二盖板的某处接触热源温度升高，液态个您告知在真空超低压环境中迅速蒸发为热气态工质同时吸收热能，热气态工质在被毛细结构内的间隙传递到他处液化为液态，同时释放热能，液态的工质通过毛细结构回流到热源位置，周而复始工作，其使得均温板能够根据换热需要，减薄厚度、增大换热能力，降低整体重量，满足不断增长的换热需求。
附图说明
图1为本发明的具体实施例一的主视图结构示意图；
图2为图1的A-A剖结构示意图；
图3为本发明的具体实施例二的主视图结构示意图；
图4为图3的B-B剖结构示意图；
图5为本发明的具体实施例三的主视图结构示意图；
图6为图5的C-C剖结构示意图；
图7为本发明的具体实施例四的主视图结构示意图；
图8为图7的D-D剖结构示意图；
图9为本发明的具体实施例五的后视图结构示意图；
图10为图9的E-E剖结构示意图；
图11为本发明的具体实施例六的主视图结构示意图；
图12为图11的F-F剖结构示意图；
图13为图2的G处局部放大图；
图14为图8的H处局部放大图；
图中序号所对应的名称如下：
第一盖板1、钣金上板101、内凹槽102、连接斜边103、蚀刻上板104、凹槽105、第二盖板2、钣金底板201、下凸腔体202、圆弧边过渡结构203、上凸腔体3、外边框4、容腔5、下凸支撑结构6、单层毛细结构7、工质注入孔8、多层折叠毛细结构9、热源部分10、防焊料溢出槽11。
具体实施方式
薄型均温板，见图1-图12：其包括第一盖板1、第二盖板2，第一盖板1的中心区域设置有上凸腔体4，第一盖板1的外边框4盖装于第二盖板2的外围区域后上凸腔体4和其正下方的第二盖板2的组合形成容腔5，上凸腔体4的对应于容腔的面域的内壁阵列排布有若干下凸支撑结构6，容腔6内设置有单层毛细结构7，单层毛细结构7的其中一表面贴合下凸支撑结构6的下凸内 壁布置，单层毛细结构7的另一表面贴合第二盖板2的对应区域内表面布置，其还包括有工质注入孔8，工质注入孔连通容腔5，工质注入孔8在注入相变介质并抽真空后封口。第二盖板2具体为钣金底板201；钣金底板201使得在设计方面在任何位置减少或增加特征对复杂机构有很好的兼容性，具体为钣金底板201根据设计需求可方便设置或不设置工质注入孔8、下凸腔体202，且工质注入孔8、下凸腔体202的位置布置方便。第一盖板1的外边框4通过钎焊焊接于第二盖板2的外围区域，第一盖板1对应于所述第二盖板2的钎焊区域的靠近容腔5的外缘位置设置有一圈内凹的防焊料溢出槽11，防焊料溢出槽11防止焊料溢入容腔5、造成污染。
具体实施例一，见图1、图2：第一盖板1具体为钣金上板101，钣金上板101的外露上表面设置有对应于下凸支撑结构6的内凹槽102，下凸支撑结构6的底边和外露上表面的连接位置为自下而上扩口的连接斜边103，钣金底板201为平板结构，容腔5内仅布置有单层毛细结构7。
具体实施例二，见图3、图4：第一盖板1具体为钣金上板101，钣金上板101的外露上表面设置有对应于下凸支撑结构6的内凹槽102，下凸支撑结构6的底边和外露上表面的连接位置为自下而上扩口的连接斜边103，钣金底板201对应于热源部分的区域设置有下凸腔体202，下凸腔体202的侧壁为圆弧边过渡结构203，下凸支撑结构6的底部延伸至下凸腔体202的区域内，单层毛细结构7对应于下凸腔体202的区域仿形于下凸腔体202设置，对应于下凸腔体202区域内的下凸支撑结构6的底部紧贴单层毛细结构7的对应表面，具体使用时，热源部分10与下凸腔体202的外露表面接触安装。
具体实施例三，见图5、图6：第一盖板1具体为钣金上板101，钣金上 板101的外露上表面设置有对应于下凸支撑结构6的内凹槽102，下凸支撑结构6的底边和外露上表面的连接位置为自下而上扩口的连接斜边103，钣金底板201对应于热源部分10的区域设置有下凸腔体202，下凸腔体202的侧壁为圆弧边过渡结构，下凸腔体内布置有多层折叠毛细结构9，多层折叠毛细结构9的底层紧贴下凸腔体202的底部表面布置，多层折叠毛细结构9的上层紧贴单层毛细结构7的对应区域的下表面布置，具体使用时，热源部分10与下凸腔体202的外露表面接触安装。
具体实施例一至三中，钣金上板101的上凸腔体4的侧壁上设置有一处工质注入孔8。
具体实施例四，见图7、图8：第一盖板1具体为蚀刻上板104，蚀刻上板104的外露上表面为平面，容腔5具体为蚀刻形成的凹槽105组合形成；钣金底板201为平板结构，容腔5内仅布置有单层毛细结构7。
具体实施例五，见图9、图10：第一盖板1具体为蚀刻上板104，蚀刻上板104的外露上表面为平面，容腔5具体为蚀刻形成的凹槽105组合形成，钣金底板201对应于热源部分的区域设置有下凸腔体202，下凸腔体202的侧壁为圆弧边过渡结构203，下凸支撑结构6的底部延伸至下凸腔体202的区域内，单层毛细结构7对应于下凸腔体202的区域仿形于下凸腔体201设置，对应于下凸腔体202区域内的下凸支撑结构6的底部紧贴单层毛细结构7的对应表面，具体使用时，热源部分与10下凸腔体202的外露表面接触安装。
具体实施例六，见图11、图12：第一盖板1具体为蚀刻上板104，蚀刻上板104的外露上表面为平面，容腔具体为蚀刻形成的凹槽105组合形成，钣金底板201对应于热源部分的区域设置有下凸腔体202，下凸腔体202的侧 壁为圆弧边过渡结构203，下凸腔体202内布置有多层折叠毛细结构9，多层折叠毛细结构9的底层紧贴下凸腔体202的底部表面布置，多层折叠毛细结构9的上层紧贴单层毛细结构7的对应区域的下表面布置，具体使用时，热源部分与10下凸腔体202的外露表面接触安装。
具体实施例四至六种，工质注入孔8布置于钣金底板201的外露表面；
单层毛细结构7具体为网目结构、烧结粉末结构或网目+烧结粉末复合结构，所述单层毛细结构7的材质具体为铜、铜合金、铝、铝合金、钛、钛合金或不锈钢材料；
多层折叠毛细结构9具体为网目结构、烧结粉末结构或网目+烧结粉末复合结构，所述多层折叠毛细结构9的材质具体为铜、铜合金、铝、铝合金、钛、钛合金或不锈钢材料；
下凸支撑结构6的形状具体为圆柱形、圆锥台形、正方体型、立方体形、半球形、椭球形，所有的下凸支撑结构成矩形阵列排布，确保制作简单、方便；
第一盖板1、第二盖板2的材质为铜、铜合金、铝、铝合金、钛、钛合金或不锈钢材料。
文中所提及的上下关系以及顶底关系在实际过程中可进行互换、且可在翻转使用状态下成为左右位置关系。
薄型均温板在成品状态下进行折弯成型再加工使其变为三维形状，适用于特殊设备使用，例如穿戴电子设备(VR/AR眼镜、电子手环、手表等)。
其工作原理如下：从工质注入孔位置抽气注工质，工质从工质注入孔通道进出均温板内部，完成抽气注工质后使用电阻焊/激光焊/超声波焊方式在 工质注入孔处封口，第二盖板的某处接触热源温度升高，液态个您告知在真空超低压环境中迅速蒸发为热气态工质同时吸收热能，热气态工质在被毛细结构内的间隙传递到他处液化为液态，同时释放热能，液态的工质通过毛细结构回流到热源位置，周而复始工作，其使得均温板能够根据换热需要，减薄厚度、增大换热能力，降低整体重量，满足不断增长的换热需求。
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。

Claims (15)

  1. 薄型均温板，其特征在于：其包括第一盖板、第二盖板，所述第一盖板的中心区域设置有上凸腔体，所述第一盖板的外边框盖装于所述第二盖板的外围区域后上凸腔体和其正下方的第二盖板的组合形成容腔，所述上凸腔体的对应于所述容腔的面域的内壁阵列排布有若干下凸支撑结构，所述容腔内设置有单层毛细结构，所述单层毛细结构的其中一表面贴合所述下凸支撑结构的下凸内壁布置，所述单层毛细结构的另一表面贴合所述第二盖板的对应区域内表面布置，其还包括有工质注入孔，所述工质注入孔连通容腔，所述工质注入孔在注入相变介质并抽真空后封口。
  2. 如权利要求1所述的薄型均温板，其特征在于：所述第二盖板具体为钣金底板。
  3. 如权利要求1所述的薄型均温板，其特征在于：所述第一盖板的外边框通过钎焊焊接于所述第二盖板的外围区域，所述第一盖板对应于所述第二盖板的钎焊区域的靠近所述容腔的外缘位置设置有一圈内凹的防焊料溢出槽.
  4. 如权利要求2所述的薄型均温板，其特征在于：所述第二盖板的对应于热源部分的区域设置有下凸腔体，所述下凸腔体内布置有对应的毛细结构。
  5. 如权利要求4所述的薄型均温板，其特征在于：所述下凸腔体的侧壁为圆弧边过渡结构。
  6. 如权利要求4所述的薄型均温板，其特征在于：所述下凸支撑结构的底部延伸至所述下凸腔体的区域内，所述单层毛细结构对应于下凸腔体的区域仿形于下凸腔体设置，对应于所述下凸腔体区域内的下凸支撑结构的底部紧贴所述单层毛细结构的对应表面。
  7. 如权利要求4所述的薄型均温板，其特征在于：所有的下凸支撑结构的底部处于同一平面位置时，所述下凸腔体内布置有多层折叠毛细结构，所述多层折叠毛细结构的底层紧贴所述下凸腔体的底部表面布置，所述多层折叠毛细结构的上层紧贴所述单层毛细结构的对应区域的下表面布置。
  8. 如权利要求1所述的薄型均温板，其特征在于：所述第一盖板具体为蚀刻上板时，所述蚀刻上板的外露上表面为平面，所述容腔具体为蚀刻形成的凹槽组合形成。
  9. 如权利要求8所述的薄型均温板，其特征在于：所述工质注入孔布置于所述钣金底板的外露表面布置。
  10. 如权利要求1所述的薄型均温板，其特征在于：所述第一盖板具体为钣金上板时，所述钣金上板的外露上表面设置有对应于下凸支撑结构的内凹槽，所述下凸支撑结构的底边和外露上表面的连接位置为自下而上扩口的连接斜边。
  11. 如权利要求10所述的薄型均温板，其特征在于：所述第一盖板的上凸腔体的侧壁上设置有一处工质注入孔。
  12. 如权利要求1所述的薄型均温板，其特征在于：所述单层毛细结构具体为网目结构、烧结粉末结构或网目+烧结粉末复合结构；所述单层毛细结构的材质具体为铜、铜合金、铝、铝合金、钛、钛合金或不锈钢材料。
  13. 如权利要求7所述的薄型均温板，其特征在于：所述多层折叠毛细结构具体为网目结构、烧结粉末结构或网目+烧结粉末复合结构；所述多层折叠毛细结构的材质具体为铜、铜合金、铝、铝合金、钛、钛合金或不锈钢材料。
  14. 如权利要求1所述的薄型均温板，其特征在于：所述下凸支撑结构的形状具体为圆柱形、圆锥台形、正方体型、立方体形、半球形、椭球形，所有的下凸支撑结构成矩形阵列排布。
  15. 如权利要求1所述的薄型均温板，其特征在于：所述第一盖板、第二盖板的材质为铜、铜合金、铝、铝合金、钛、钛合金或不锈钢材料。
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