WO2021203825A1 - 散热装置、散热装置的制备方法及电子设备 - Google Patents

散热装置、散热装置的制备方法及电子设备 Download PDF

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Publication number
WO2021203825A1
WO2021203825A1 PCT/CN2021/075524 CN2021075524W WO2021203825A1 WO 2021203825 A1 WO2021203825 A1 WO 2021203825A1 CN 2021075524 W CN2021075524 W CN 2021075524W WO 2021203825 A1 WO2021203825 A1 WO 2021203825A1
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WIPO (PCT)
Prior art keywords
capillary structure
heat dissipation
cover plate
area
dissipation device
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PCT/CN2021/075524
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English (en)
French (fr)
Inventor
杨鑫
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Oppo广东移动通信有限公司
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Publication of WO2021203825A1 publication Critical patent/WO2021203825A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Definitions

  • the present application provides a heat dissipation device and a preparation method of the heat dissipation device, which is conducive to achieving a lighter and thinner heat dissipation device; at the same time, an electronic device including the heat dissipation device is also provided to improve the heat dissipation performance of the electronic device, which is beneficial to the electronic device The lightness and thinness.
  • the present application provides a method for manufacturing a heat sink, including:
  • the first cover plate including a first area and a second area
  • At least one first capillary structure is formed in the first area, and at least one second capillary structure is formed in the second area, the thickness of the first capillary structure is greater than the thickness of the second capillary structure;
  • the present application provides an electronic device including a heating element and a heat dissipation device.
  • the heat dissipation device includes a first cover plate, a second cover plate, a capillary structure, and a working fluid.
  • the first cover plate and the heat dissipation device The second cover plate is covered to form a closed accommodating space, the capillary structure is arranged on the surface of the first cover plate close to the accommodating space, and the working fluid is filled in the accommodating space, wherein,
  • the first cover plate includes a first area and a second area, and the capillary structure includes at least one first capillary structure arranged in the first area and at least one second capillary structure arranged in the second area, so The thickness of the first capillary structure is greater than the thickness of the second capillary structure, and the heating element is arranged in close contact with the first area of the first cover plate.
  • FIG. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of a heat dissipation device according to another embodiment of the application.
  • FIG. 3 is a top view of the first cover plate according to an embodiment of the application.
  • FIG. 4 is a top view of the first cover plate according to another embodiment of the application.
  • FIG. 5 is a schematic flow chart of a method for manufacturing a heat dissipation device according to an embodiment of the application.
  • FIG. 6 is a schematic structural diagram of an electronic device according to an embodiment of the application.
  • FIG. 7 is a schematic cross-sectional view of an electronic device according to another embodiment of the application.
  • the embodiment of the present application provides a heat dissipation device, which includes a first cover plate, a second cover plate, a capillary structure, and a working fluid.
  • the first cover plate and the second cover plate cover together to form a closed accommodating space
  • the capillary structure is arranged on the surface of the first cover plate close to the accommodating space, and the working fluid is filled in the accommodating space, wherein the first cover plate includes a first area and a second area
  • the capillary structure includes at least one first capillary structure arranged in the first area and at least one second capillary structure arranged in the second area, and the thickness of the first capillary structure is greater than that of the second capillary structure. The thickness of the structure.
  • first capillary structure and the second capillary structure are arranged at intervals on the surface of the first cover plate.
  • the distance between the first capillary structure and the second capillary structure is greater than 100 ⁇ m.
  • a plurality of the first capillary structures are arranged in an array on the first cover plate, and a plurality of the second capillary structures are arranged in an array on the first cover plate.
  • the first area has a plurality of the first capillary structures, and the distance between adjacent first capillary structures is greater than 100 ⁇ m; the second area has a plurality of the second capillary structures, adjacent to each other. The spacing between the second capillary structures is greater than 100 ⁇ m.
  • the thickness of the first capillary structure is 85 ⁇ m-120 ⁇ m
  • the thickness of the second capillary structure is 20 ⁇ m-80 ⁇ m.
  • the thickness ratio of the first capillary structure and the second capillary structure is (1.1-6):1.
  • the first capillary structure abuts against the second cover plate.
  • the material of the capillary structure includes at least one of copper, titanium, nickel and tin or stainless steel.
  • the heat dissipation device further includes a supporting structure, the supporting structure is arranged in the accommodating space and abuts against the first cover plate and the second cover plate.
  • the supporting structure abuts against the capillary structure.
  • the thermal conductivity of the first cover plate is greater than 10 W/(m ⁇ K); the thermal conductivity of the second cover plate is greater than 10 W/(m ⁇ K).
  • the thickness of the first cover plate is less than or equal to 200 ⁇ m; the thickness of the second cover plate is less than or equal to 200 ⁇ m.
  • the first cover plate includes a first horizontal layer and a first frame arranged on the edge of the first horizontal layer; the second cover plate includes a second horizontal layer and a first frame arranged on the surface of the second horizontal layer. The second border of the edge.
  • the thickness of the heat dissipation device is less than or equal to 280 ⁇ m.
  • the embodiment of the present application also provides a method for manufacturing a heat dissipation device, including:
  • the first cover plate including a first area and a second area
  • At least one first capillary structure is formed in the first area, and at least one second capillary structure is formed in the second area, the thickness of the first capillary structure is greater than the thickness of the second capillary structure;
  • a working fluid is injected into the accommodating space, and a heat dissipation device is formed after sealing.
  • the forming at least one first capillary structure in the first area and forming at least one second capillary structure in the second area includes:
  • a second metal mesh is provided, and the second metal mesh is cut and arranged in the second area to form at least one second capillary structure.
  • the embodiment of the present application also provides an electronic device, including a heating element and a heat dissipation device.
  • the heat dissipation device includes a first cover plate, a second cover plate, a capillary structure, and a working fluid.
  • the first cover plate and the second cover plate The two cover plates are combined to form a closed accommodating space, the capillary structure is arranged on the surface of the first cover plate close to the accommodating space, and the working fluid is filled in the accommodating space, wherein the The first cover plate includes a first area and a second area.
  • the capillary structure includes at least one first capillary structure disposed in the first area and at least one second capillary structure disposed in the second area.
  • the thickness of the first capillary structure is greater than the thickness of the second capillary structure, and the heating element is arranged in close contact with the first area of the first cover plate.
  • the electronic device further includes a middle plate, and the heat dissipation device is embedded in the middle plate and is arranged in close contact with the heating element.
  • FIG. 1 is a schematic structural diagram of a heat dissipation device 100 according to an embodiment of the application, including a first cover plate 10, a second cover plate 20, a capillary structure 30 and a working fluid.
  • the first cover plate 10 and the second cover plate The plate 20 is covered to form a closed accommodating space 40, the capillary structure 30 is arranged on the surface of the first cover plate 10 close to the accommodating space 40, and the working fluid is filled in the accommodating space 40, which is not shown in FIG.
  • the first cover plate 10 includes a first area 11 and a second area 12, and the capillary structure 30 includes at least one first capillary structure 31 arranged in the first area 11 and at least one second capillary structure 32 arranged in the second area 12, The thickness of the first capillary structure 31 is greater than the thickness of the second capillary structure 32.
  • the first cover plate 10 of the heat sink 100 when the first cover plate 10 of the heat sink 100 is in contact with the heat source, it absorbs heat and is transferred to the working fluid in the accommodating space 40.
  • the working fluid absorbs the heat and vaporizes to form steam, which passes through the housing of the heat sink 100
  • the space 40 which can also be referred to as a heat dissipation channel, transfers heat from the first cover plate 10 to the second cover plate 20, and transfers the heat to the outside through the second cover plate 20.
  • the vapor condenses and turns into liquid, and the capillary force generated by the capillary structure 30 drains it to the first cover plate 10, and the heat dissipation process described above is cyclically performed to complete the heat dissipation.
  • This application uses the first capillary structure 31 and the second capillary structure 32 with different thicknesses.
  • the working fluid at the first capillary structure 31 and the second capillary structure 32 absorbs heat and vaporizes, because the first capillary structure 31 Thicker than the second capillary structure 32, therefore, the vapor formed by the vaporization of the working fluid at the first capillary structure 31 has a wider and higher diffusion range in the thickness direction than the vapor formed by the vaporization of the working fluid at the second capillary structure 32 ,
  • the heat dissipation area is larger, so that the heat dissipation effect of the first region 11 will be better and more obvious.
  • the first area 11 of the first cover plate 10 corresponds to the heat source, which can be but not limited to heating elements, etc., which can increase the vapor diffusion area during the heat dissipation process and improve the heat dissipation effect, which is beneficial to reduce the thickness of the heat dissipation device 100 and takes into account
  • the required heat dissipation effect can realize the lightness and thinness of the heat dissipation device 100, while reducing the use of the material of the second capillary structure 32 in the second area 12, which is economical and conducive to large-scale applications in industry, and further reduces the heat dissipation device.
  • the weight of 100 is economical and conducive to large-scale applications in industry, and further reduces the heat dissipation device.
  • the capillary structure 30 includes at least one first capillary structure 31 in the first region 11 and at least one second capillary structure 32 in the second region 12.
  • the first capillary structure 31 and the second capillary structure 32 are arranged on the surface of the first cover plate 10 at intervals. It can be understood that there is a distance between the first capillary structure 31 and the second capillary structure 32 at this time.
  • the first capillary structure 31 and the second capillary structure 32 are continuously arranged on the surface of the first cover plate 10, and there is no space between the first capillary structure 31 and the second capillary structure 32 at this time.
  • the working fluid in the first capillary structure 31 and the second capillary structure 32 is heated and vaporized, and then the first capillary structure 31 and the second capillary structure 32 spreads out near the surface of the second cover plate 20, that is, the gas-liquid separation is realized in the thickness direction of the capillary structure 30, which can be called the gas-liquid separation in the vertical direction.
  • the working fluid in the first capillary structure 31 and the second capillary structure 32 is heated and vaporized, and then the first capillary structure 31 and the second capillary structure 32 spread out in the transverse direction, which can be said to achieve gas-liquid separation in the horizontal direction.
  • the heat dissipation channel after the gas-liquid separation in the horizontal direction has more volume occupied by the first capillary structure 31 and the second capillary structure 32, which makes the heat dissipation channel wider and the heat dissipation area larger.
  • the distance between the first capillary structure 31 and the second capillary structure 32 is greater than 100 ⁇ m, which increases the heat dissipation area and increases the heat dissipation effect, thereby appropriately reducing the thickness of the heat dissipation device 100, which is effective in taking into account the heat dissipation performance.
  • the heat dissipation device 100 is thinner and lighter.
  • the distance between the first capillary structure 31 and the second capillary structure 32 is greater than 150 ⁇ m, which further improves the heat dissipation effect.
  • the first area 11 of the first cover 10 includes one or more first capillary structures 31.
  • the first region 11 has a plurality of first capillary structures 31.
  • a plurality of first capillary structures 31 may be continuously arranged on the first region 11 without intervals.
  • a plurality of first capillary structures 31 are arranged at intervals in the first region 11 to realize gas-liquid separation in the horizontal direction.
  • the heat dissipation channel is more effective.
  • the heat dissipation area is wider and the heat dissipation area is larger, which improves the heat dissipation efficiency of the heat dissipation device 100.
  • first capillary structures 31 when a plurality of first capillary structures 31 are continuously arranged, a greater capillary force can be generated, so that the accommodating space 40 cannot be filled during the heat transfer process of the steam. It will be re-drained into the first capillary structure 31, and the accommodating space 40 cannot be fully utilized. However, when a plurality of first capillary structures 31 are arranged at intervals, the accommodating space 40 can be more fully utilized and the heat dissipation area can be increased.
  • the distance between adjacent first capillary structures 31 is greater than 100 ⁇ m, which increases the heat dissipation area and increases the heat dissipation effect, which is beneficial to reduce the thickness of the heat dissipation device 100 and realize the lightness and thinness of the heat dissipation device 100. Further, the distance between adjacent first capillary structures 31 is greater than 150 ⁇ m, 180 ⁇ m, 200 ⁇ m, or 210 ⁇ m, which further improves the heat dissipation area and the heat dissipation effect. In another embodiment, the plurality of first capillary structures 31 are arranged in an array on the first cover plate 10 to make the heat dissipation process more uniform and improve the uniformity of heat dissipation.
  • the second area 12 of the first cover plate 10 includes one or more second capillary structures 32.
  • the second region 12 has a plurality of second capillary structures 32.
  • a plurality of second capillary structures 32 may be continuously arranged on the second region 12 without intervals.
  • a plurality of second capillary structures 32 are arranged at intervals in the second region 12 to realize gas-liquid separation in the horizontal direction. Compared with the continuous arrangement of a plurality of second capillary structures 32, the heat dissipation channel is more effective.
  • the heat dissipation area is wider and the heat dissipation area is larger, which improves the heat dissipation efficiency of the heat dissipation device 100.
  • a greater capillary force can be generated, so that the accommodating space 40 cannot be filled during the heat transfer process of the steam. It will be re-drained into the second capillary structure 32, and the accommodating space 40 cannot be fully utilized.
  • the accommodating space 40 can be more fully utilized and the heat dissipation area can be increased.
  • the distance between the adjacent second capillary structures 32 is greater than 100 ⁇ m, which increases the heat dissipation area and increases the heat dissipation effect, which is beneficial to reduce the thickness of the heat dissipation device 100 and achieve a lighter and thinner heat dissipation device 100. Furthermore, the distance between adjacent second capillary structures 32 is greater than 150 ⁇ m, 180 ⁇ m, 200 ⁇ m or 210 ⁇ m, which further improves the heat dissipation area and the heat dissipation effect. In another embodiment, the plurality of second capillary structures 32 are arranged in an array on the first cover plate 10 to make the heat dissipation process more uniform and improve the uniformity of heat dissipation.
  • the first capillary structure 31 abuts against the second cover plate 20. It can be understood that the first capillary structure 31 has a first end and a second end opposite in the thickness direction, the first capillary structure 31 is disposed on the first cover plate 10, and the first end of the first capillary structure 31 and the first end When the cover plate 10 abuts, the second end of the first capillary structure 31 abuts the second cover plate 20.
  • the thickness of the first capillary structure 31 is consistent with the size of the accommodating space 40 in the thickness direction of the first capillary structure 31, so that after the working fluid in the first capillary structure 31 vaporizes to form steam, it can fill the entire first capillary structure 31.
  • the accommodating space 40 corresponding to the area 11 the accommodating space 40 is more effectively used.
  • the heat dissipation area corresponding to the heat source position is increased, thereby improving the heat dissipation effect, which is beneficial to reduce the thickness of the heat dissipation device 100 and realize the heat dissipation device 100's thin and light.
  • the second region 12 when the second region 12 includes a plurality of second capillary structures 32, please refer to FIG.
  • the plurality of second capillary structures 32 may divide the containing space 40 to form a plurality of interconnected The sub-spaces form multiple interconnected heat dissipation channels.
  • the cross-section of the first capillary structure 31 may be, but not limited to, a square, a rectangle, a circle, an ellipse, a rhombus, an irregular shape, or the like. It is understandable that when there are a plurality of first capillary structures 31 and a plurality of second capillary structures 32, the first capillary structures 31 can also be arranged as heat dissipation channels that are not connected to each other, and the second capillary structures 32 are arranged between them. For heat dissipation channels that are connected to each other, the first capillary structures 31 may also be configured as mutually connected heat dissipation channels, and the second capillary structures 32 may be configured as mutually disconnected heat dissipation channels.
  • the first region 11 corresponding to the heat source can have a larger heat dissipation area and improve the heat dissipation effect during application.
  • the thickness of the first capillary structure 31 and the second capillary structure 32 can be selected according to actual needs.
  • the first capillary structure 31 and the second capillary structure 32 may be micron-level capillary structures 30.
  • the thickness of the first capillary structure 31 is greater than 80 ⁇ m, and the thickness of the second capillary structure 32 is less than or equal to 80 ⁇ m, so that the working fluid in the first capillary structure 31 can sufficiently dissipate heat after being vaporized, and the second capillary structure 31
  • the thickness of the structure 32 is relatively small, so there is no need to increase the weight of the heat sink 100 too much.
  • the thickness of the first capillary structure 31 is 85 ⁇ m-120 ⁇ m, and the thickness of the second capillary structure 32 is 20 ⁇ m-80 ⁇ m, which can improve the heat dissipation effect of the heat dissipation device 100 and reduce the volume of the heat dissipation device 100, and at the same time
  • the thickness of the heat dissipation device 100 is not too large, which is beneficial to realize the lightness and thinness of the heat dissipation device 100.
  • the thickness of the first capillary structure 31 is 90 ⁇ m-120 ⁇ m, and the thickness of the second capillary structure 32 is 40 ⁇ m-70 ⁇ m.
  • the thickness ratio of the first capillary structure 31 to the second capillary structure 32 is (1.1-6):1, and then the steam corresponding to the first region 11 can have a larger heat dissipation space during the heat dissipation process. Improve heat dissipation efficiency. Further, the thickness ratio of the first capillary structure 31 to the second capillary structure 32 is (1.5-4):1.
  • the material of the capillary structure 30 is a metal material.
  • the material of the capillary structure 30 includes at least one of copper, titanium, nickel, and tin or stainless steel; that is, the material of the first capillary structure 31 and the second capillary structure 32 includes copper, titanium, and nickel.
  • the materials of the first capillary structure 31 and the second capillary structure 32 may be the same or different.
  • the material of the first capillary structure 31 and the second capillary structure 32 is copper.
  • the material of the first capillary structure 31 is copper-titanium alloy
  • the material of the second capillary structure 32 is copper.
  • the preparation of the capillary structure 30 can be selected according to actual needs, as long as it can provide capillary force.
  • the capillary structure 30 may be cut from a metal mesh.
  • the capillary structure 30 may be made of sintered metal mesh.
  • the capillary structure 30 may be formed by etching. In the embodiment of the present application, by providing the first capillary structure 31 and the second capillary structure 32 with different thicknesses, there is no need for a thinner first capillary structure 31, so there is no need to use a finer manufacturing process, which is more economical and economical.
  • the heat dissipation device 100 includes a first cover plate 10 and a second cover plate 20, and the first cover plate 10 and the second cover plate 20 cover together to form a sealed accommodating space 40.
  • first and second in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • the capillary structure 30 is provided on the first cover plate 10. When in use, the surface of the first cover plate 10 away from the second cover plate 20 is attached to the heat source, including direct attachment and indirect attachment through other components.
  • the capillary structure 30 can also be provided on the second cover plate 20, at this time the second cover plate 20 is away from the surface of the first cover plate 10 and attached to the heat source.
  • the first cover plate 10 includes a first area 11 and a second area 12, the first area 11 and the second area 12 are adjacent, for example, but not limited to the first area 11 surrounding the second area 12, or The second area 12 surrounds the first area 11, or the first area 11 and the second area 12 are adjacently arranged.
  • the setting mode and range of the first area 11 and the second area 12 can be selected according to actual needs, and the range of the first area 11 can be designed but not limited to the size of the heat source.
  • the thickness of the first cover plate 10 is less than or equal to 200 ⁇ m, and the thickness of the second cover plate 20 is less than or equal to 200 ⁇ m. Further, the thickness of the first cover plate 10 is less than or equal to 180 ⁇ m, and the thickness of the second cover plate 20 is less than or equal to 180 ⁇ m. Furthermore, the thickness of the first cover plate 10 is less than or equal to 150 ⁇ m, and the thickness of the second cover plate 20 is less than or equal to 150 ⁇ m. In the present application, the first cover plate 10 and the second cover plate 20 are composed of materials with thermal conductivity.
  • the thermal conductivity of the first cover plate 10 is greater than 10 W/(m ⁇ K), and the thermal conductivity of the second cover plate 20 is greater than 10 W/(m ⁇ K), so that the heat dissipation device 100 has an excellent heat dissipation effect .
  • the material of the first cover plate 10 includes at least one of copper, titanium, nickel and tin or stainless steel
  • the material of the second cover plate 20 includes at least one of copper, titanium, nickel and tin or Stainless steel.
  • the material of the first cover plate 10 is titanium, copper-titanium alloy, copper-nickel alloy, copper-tin alloy or stainless steel
  • the material of the second cover plate 20 is titanium, copper-titanium alloy, copper-nickel alloy, copper-tin alloy or stainless steel.
  • the first cover plate 10 includes a first horizontal layer and a first frame arranged on the edge of the surface of the first horizontal layer.
  • the first cover plate 10 can be manufactured by, but not limited to, integral molding.
  • the first cover plate 10 has a horizontal structure.
  • the second cover plate 20 includes a second horizontal layer and a second frame provided on the edge of the surface of the second horizontal layer.
  • the second cover plate 20 can be, but not limited to, be made by integral molding.
  • the second cover 20 has a horizontal structure.
  • the first frame abuts against the second frame to form an accommodating space 40.
  • first frame and the second cover plate 20 of the horizontal structure abut to form an accommodating space 40.
  • the second frame abuts against the first cover plate 10 of the horizontal structure to form the accommodating space 40.
  • the horizontal structure of the first cover plate 10 and the second cover plate 20 can be, but not limited to, forming the accommodating space 40 by welding or gluing, such as laser welding, diffusion welding, solder welding, and glue bonding. Wait.
  • the accommodating space 40 is in a vacuum state, so that the working fluid can easily be vaporized and conduct heat conduction.
  • the vacuum degree in the accommodating space 40 is 10 -3 -10 -1 Pa.
  • the degree of vacuum in the accommodating space 40 is 10 -2 -10 -1 Pa.
  • the working fluid in the heat dissipation device 100 absorbs heat and vaporizes quickly. This process can take away a large amount of heat, thereby completing a heat dissipation cycle.
  • the working fluid is selected from substances that do not chemically react with the first cover plate 10, the second cover plate 20, and the capillary structure 30.
  • the working fluid is selected from water, propylene glycol, acetone or methanol.
  • the working fluid may be, but is not limited to, deionized water.
  • the filling amount of the working fluid in the accommodating space 40 also affects the heat dissipation efficiency of the heat dissipation device 100.
  • the filling amount of the working fluid in the accommodating space 40 is 15%-70%, which can effectively dissipate heat without making the heat sink 100 excessively heavy. Further, the filling amount of the working fluid in the accommodating space 40 is 30%-65%.
  • the heat dissipation device 100 includes at least one supporting structure 50.
  • the supporting structure 50 is disposed in the accommodating space 40 and abuts against the first cover plate 10 and the second cover plate 20.
  • the supporting structure 50 when a plurality of capillary structures 30 are arranged on the first cover plate 10 at intervals, the supporting structure 50 abuts the capillary structure 30, thereby not affecting the heat dissipation space, which facilitates efficient heat dissipation.
  • the supporting structure 50 includes at least one first supporting structure and at least one second supporting structure, the first supporting structure abuts against the first capillary structure 31, and the second supporting structure abuts against the second capillary structure 32.
  • the first capillary structure 31 abuts the second cover plate 20
  • the support structure 50 abuts the capillary structure 30, so that the accommodating space 40 can form a plurality of mutually connected heat dissipation channels, or the accommodating space 40 can form a plurality of mutually disconnected heat dissipation channels.
  • the thickness of the support structure 50 is selected according to actual needs, and can be, but is not limited to, 20 ⁇ m-120 ⁇ m. It is understandable that the support structure 50 mainly supports the heat dissipation device 100, and the selection of its material can be selected according to needs, and it can be but not limited to metal, such as copper, copper alloy, and the like.
  • the steam in the first region 11 corresponding to the heat source can have a larger heat dissipation space in application, thereby improving the heat dissipation efficiency, and at the same time
  • the second region 12 without a corresponding heat source does not need to be provided with a thicker capillary structure 30, which reduces the use of materials and reduces the weight of the heat dissipation device 100, thereby reducing the thickness of the heat dissipation device 100 and achieving a lighter and thinner heat dissipation device 100.
  • the thickness of the heat dissipation device 100 is less than or equal to 280 ⁇ m. Further, the thickness of the heat dissipation device 100 is less than or equal to 250 ⁇ m.
  • FIG. 5 is a schematic flowchart of a manufacturing method of a heat dissipation device 100 according to an embodiment of the application, including the following steps:
  • Operation 101 Provide a first cover plate and a second cover plate, the first cover plate including a first area and a second area.
  • the first cover plate 10 and the second cover plate 20 can be made by, but not limited to, directly cut metal plates, and the metal plates can meet the requirements of the first cover plate 10 and the second cover plate 20 in the heat sink 100 The thermal conductivity and mechanical properties are sufficient.
  • the thickness of the first cover plate 10 is less than or equal to 200 ⁇ m
  • the thickness of the second cover plate 20 is less than or equal to 200 ⁇ m.
  • the first cover plate 10 includes a first area 11 and a second area 12, and the first area 11 and the second area 12 are adjacent to each other.
  • Operation 102 forming at least one first capillary structure in the first area, and forming at least one second capillary structure in the second area, where the thickness of the first capillary structure is greater than the thickness of the second capillary structure.
  • a first metal mesh may be provided, but not limited to, the first metal mesh is cut and arranged in the first region 11 to form at least one first capillary structure 31; a second metal mesh is provided, and the second metal mesh After the net is cut, it is arranged in the second area 12 to form at least one second capillary structure 32.
  • the preparation method is simple and convenient, does not require the use of large-scale equipment and precision equipment, and can realize industrialized production.
  • the first capillary structure 31 and the second capillary structure 32 may be formed by sintering, or may be formed by etching. The arrangement of the first capillary structure 31 and the second capillary structure 32 is as above, and will not be repeated here.
  • Operation 103 Cover the first cover plate and the second cover plate to form a closed accommodating space, and the first capillary structure and the second capillary structure are arranged in the accommodating space.
  • the enclosed accommodating space 40 may be formed but not limited to welding or gluing.
  • the welding includes at least one of laser welding, diffusion welding, and solder welding.
  • Solder welding includes low-temperature solder or high-temperature solder
  • diffusion welding includes vacuum diffusion welding or gas shielded diffusion welding.
  • the adhesive material can be, but not limited to, double epoxy-based adhesive material, silicon-based adhesive material, etc.
  • the welding can be performed under a nitrogen atmosphere at a welding temperature of 600°C to 900°C.
  • the heat dissipation device 100 further includes a supporting structure 50, the supporting structure 50 is disposed in the accommodating space 40 and abuts against the first cover plate 10 and the second cover plate 20.
  • Operation 104 Inject a working fluid into the accommodating space, and form the heat dissipation device 100 after sealing.
  • the accommodating space 40 is in a vacuum state, so that the working fluid can easily be vaporized and conduct heat conduction.
  • the vacuum degree in the accommodating space 40 is 10 -3 -10 -1 Pa.
  • a liquid-filled pipe is welded into the accommodating space 40, a working fluid is injected into the accommodating space 40 through the liquid-filled pipe, and the heat sink 100 is formed after vacuuming and sealing.
  • the preparation method of the heat sink 100 provided in the present application is simple, can be completed without using sophisticated equipment, has a low preparation cost, and the prepared heat sink 100 has excellent heat dissipation performance, is lighter and thinner, and is beneficial to application.
  • the present application also provides an electronic device, including the heat dissipation device 100 of any of the foregoing embodiments.
  • the electronic device can be, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a watch, MP3, MP4, GPS navigator, a digital camera, etc.
  • the heat dissipation device 100 can be, but is not limited to, a uniform temperature plate.
  • FIG. 6 is a schematic structural diagram of an electronic device according to an embodiment of the application.
  • the electronic device includes a panel 300 and a housing 400.
  • the panel 300 and the housing 400 form a receiving space, and the receiving space includes a heating element 200 and a heat sink 100.
  • the heating element 200 and the first area 11 of the heat sink 100 are arranged in close contact, the working fluid corresponding to the first area 11 has a larger heat dissipation space after vaporization, which can achieve faster heat dissipation and improve heat dissipation efficiency; at the same time, the heat dissipation
  • the device 100 can be appropriately reduced in thickness while also taking into account excellent heat dissipation performance.
  • the thickness of the second capillary structure 32 of the second region 12 is relatively thin, which is beneficial to reduce the weight of the heat dissipation device 100, and thereby facilitates the realization of lighter and thinner electronic equipment.
  • the heat sink 100 can directly contact the heating element 200, or it can contact the heating element 200 through the middle plate.
  • the middle plate needs to be processed so that the heat sink 100 can be embedded in it, that is, the heat sink 100 can be in contact with the heating element 200.
  • the heating element 200 is directly attached or indirectly attached, and the heating element 200 is provided corresponding to the first area of the heat dissipation device 100.
  • FIG. 7, is a schematic cross-sectional view of an electronic device according to another embodiment of the application.
  • the electronic device includes a heating element 200, a heat dissipation device 100, and a middle plate 500.
  • the heat dissipation device 100 is embedded in the middle plate 500 and is attached to the heating element 200. set up.
  • the heat dissipation device is thicker, it will affect the mechanical properties of the middle board of the mobile phone, thereby affecting the overall strength of the mobile phone. It affects the overall performance of the mobile phone.
  • the heat dissipation device 100 provided in the present application has a small weight, and does not increase the weight of the mobile phone too much, and has a good application prospect.

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Abstract

本申请提供了一种散热装置，包括第一盖板、第二盖板、毛细结构和工作流体，所述第一盖板和所述第二盖板盖合形成密闭的容置空间，所述毛细结构设置在所述第一盖板靠近所述容置空间的表面，所述工作流体填充在所述容置空间内，其中，所述第一盖板包括第一区域和第二区域，所述毛细结构包括设置在所述第一区域的至少一个第一毛细结构和设置在所述第二区域的至少一个第二毛细结构，所述第一毛细结构的厚度大于所述第二毛细结构的厚度。通过设置厚度不同的第一毛细结构和第二毛细结构，以增加散热过程中的散热面积，提高散热效率，进而有利于减小散热装置的厚度，实现散热装置的轻薄化。本申请还提供了散热装置的制备方法和电子设备。

Description

散热装置、散热装置的制备方法及电子设备 技术领域
本申请属于热传导技术领域，具体涉及散热装置、散热装置的制备方法及电子设备。
背景技术
电子设备运作时会产生热量，直接导致电子设备温度急剧升高，因此，需要借助散热装置将热量快速散发。然而，传统散热装置较厚，占据一定的空间，进而限制了电子设备朝轻薄化的发展。
发明内容
鉴于此，本申请提供一种散热装置及散热装置的制备方法，有利于实现散热装置的轻薄化；同时，还提供包括所述散热装置的电子设备，提高电子设备的散热性能，有利于电子设备的轻薄化。
第一方面，本申请提供了一种散热装置，包括第一盖板、第二盖板、毛细结构和工作流体，所述第一盖板和所述第二盖板盖合形成密闭的容置空间，所述毛细结构设置在所述第一盖板靠近所述容置空间的表面，所述工作流体填充在所述容置空间内，其中，所述第一盖板包括第一区域和第二区域，所述毛细结构包括设置在所述第一区域的至少一个第一毛细结构和设置在所述第二区域的至少一个第二毛细结构，所述第一毛细结构的厚度大于所述第二毛细结构的厚度。
第二方面，本申请提供了一种散热装置的制备方法，包括：
提供第一盖板和第二盖板，所述第一盖板包括第一区域和第二区域；
在所述第一区域成型至少一个第一毛细结构，在所述第二区域成型至少一个第二毛细结构，所述第一毛细结构的厚度大于所述第二毛细结构的厚度；
将所述第一盖板和所述第二盖板盖合形成密闭的容置空间，所述第一毛细结构和所述第二毛细结构设置在所述容置空间内；
向所述容置空间内注入工作流体，密封后形成散热装置。
第三方面，本申请提供了一种电子设备，包括发热元件和散热装置，所述散热装置包括第一盖板、第二盖板、毛细结构和工作流体，所述第一盖板和所述第二盖板盖合形成密闭的容置空间，所述毛细结构设置在所述第一盖板靠近所述容置空间的表面，所述工作流体填充在所述容置空间内，其中，所述第一盖板包括第一区域和第二区域，所述毛细结构包括设置在所述第一区域的至少一个第一毛细结构和设置在所述第二区域的至少一个第二毛细结构，所述第一毛细结构的厚度大于所述第二毛细结构的厚度，所述发热元件与所述第一盖板的所述第一区域贴合设置。
附图说明
为了更清楚地说明本申请实施方式中的技术方案，下面将对本申请实施方式中所需要 使用的附图进行说明。
图1为本申请一实施例的散热装置的结构示意图。
图2为本申请另一实施例的散热装置的结构示意图。
图3为本申请一实施例的第一盖板的俯视图。
图4为本申请另一实施例的第一盖板的俯视图。
图5为本申请一实施例的散热装置的制备方法的流程示意图。
图6为本申请一实施例的电子设备的结构示意图。
图7为本申请另一实施例的电子设备的截面示意图。
标号说明：
第一盖板-10，第一区域-11，第二区域-12，第二盖板-20，毛细结构-30，第一毛细结构-31，第二毛细结构-32，容置空间-40，支撑结构-50，散热装置-100，发热元件-200，面板-300，壳体-400，中板-500。
具体实施方式
以下是本申请的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本申请的保护范围。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
本申请实施例提供了一种散热装置，包括第一盖板、第二盖板、毛细结构和工作流体，所述第一盖板和所述第二盖板盖合形成密闭的容置空间，所述毛细结构设置在所述第一盖板靠近所述容置空间的表面，所述工作流体填充在所述容置空间内，其中，所述第一盖板包括第一区域和第二区域，所述毛细结构包括设置在所述第一区域的至少一个第一毛细结构和设置在所述第二区域的至少一个第二毛细结构，所述第一毛细结构的厚度大于所述第二毛细结构的厚度。
其中，所述第一毛细结构和所述第二毛细结构间隔设置在所述第一盖板的表面。
其中，所述第一毛细结构和所述第二毛细结构之间的间距大于100μm。
其中，多个所述第一毛细结构在所述第一盖板上呈阵列排布，多个所述第二毛细结构在所述第一盖板上呈阵列排布。
其中，所述第一区域具有多个所述第一毛细结构，相邻所述第一毛细结构之间的间距大于100μm；所述第二区域具有多个所述第二毛细结构，相邻所述第二毛细结构之间的间距大于100μm。
其中，所述第一毛细结构的厚度大于80μm，所述第二毛细结构的厚度小于或等于80μm。
其中，所述第一毛细结构的厚度为85μm-120μm，所述第二毛细结构的厚度为20μm-80μm。
其中，所述第一毛细结构和所述第二毛细结构的厚度比为(1.1-6)：1。
其中，所述第一毛细结构与所述第二盖板抵接。
其中，所述毛细结构的材质包括铜、钛、镍和锡中的至少一种或不锈钢。
其中，所述散热装置还包括支撑结构，所述支撑结构设置在所述容置空间内，且与所述第一盖板和所述第二盖板抵接。
其中，所述支撑结构与所述毛细结构抵接。
其中，所述第一盖板的导热系数大于10W/(m·K)；所述第二盖板的导热系数大于10W/(m·K)。
其中，所述第一盖板的厚度小于或等于200μm；所述第二盖板的厚度小于或等于200μm。
其中，所述第一盖板包括第一水平层和设置在所述第一水平层表面边缘的第一边框；所述第二盖板包括第二水平层和设置在所述第二水平层表面边缘的第二边框。
其中，所述散热装置的厚度小于或等于280μm。
本申请实施例还提供了一种散热装置的制备方法，包括：
提供第一盖板和第二盖板，所述第一盖板包括第一区域和第二区域；
在所述第一区域成型至少一个第一毛细结构，在所述第二区域成型至少一个第二毛细结构，所述第一毛细结构的厚度大于所述第二毛细结构的厚度；
将所述第一盖板和所述第二盖板盖合形成密闭的容置空间，所述第一毛细结构和所述第二毛细结构设置在所述容置空间内；
向所述容置空间内注入工作流体，密封后形成散热装置。
其中，所述在所述第一区域成型至少一个第一毛细结构，在所述第二区域成型至少一个第二毛细结构包括：
提供第一金属网，将所述第一金属网裁切后设置在所述第一区域，形成至少一个所述第一毛细结构；
提供第二金属网，将所述第二金属网裁切后设置在所述第二区域，形成至少一个所述第二毛细结构。
本申请实施例还提供了一种电子设备，包括发热元件和散热装置，所述散热装置包括第一盖板、第二盖板、毛细结构和工作流体，所述第一盖板和所述第二盖板盖合形成密闭的容置空间，所述毛细结构设置在所述第一盖板靠近所述容置空间的表面，所述工作流体填充在所述容置空间内，其中，所述第一盖板包括第一区域和第二区域，所述毛细结构包括设置在所述第一区域的至少一个第一毛细结构和设置在所述第二区域的至少一个第二毛细结构，所述第一毛细结构的厚度大于所述第二毛细结构的厚度，所述发热元件与所述第一盖板的所述第一区域贴合设置。
其中，所述电子设备还包括中板，所述散热装置嵌入所述中板中，并与所述发热元件 贴合设置。
请参考图1，图1为本申请一实施例的散热装置100的结构示意图，包括第一盖板10、第二盖板20、毛细结构30和工作流体，第一盖板10和第二盖板20盖合形成密闭的容置空间40，毛细结构30设置在第一盖板10靠近容置空间40的表面，工作流体填充在容置空间40内，未在图1中示出；其中，第一盖板10包括第一区域11和第二区域12，毛细结构30包括设置在第一区域11的至少一个第一毛细结构31和设置在第二区域12的至少一个第二毛细结构32，第一毛细结构31的厚度大于第二毛细结构32的厚度。
在本申请中，散热装置100中第一盖板10与热源接触时，吸收热量，并传递至容置空间40内的工作流体，工作流体吸收热量后汽化形成蒸汽，通过散热装置100的容置空间40，也可以称之为散热通道，将热量从第一盖板10传递至第二盖板20，经由第二盖板20传递至外界。在热传递过程中，蒸汽冷凝变为液体，毛细结构30产生的毛细作用力将其引流至第一盖板10，循环进行上述散热过程，进而完成散热。本申请采用了具有不同厚度的第一毛细结构31和第二毛细结构32，在散热过程中，第一毛细结构31和第二毛细结构32处的工作流体吸热汽化，由于第一毛细结构31比第二毛细结构32厚，因此，第一毛细结构31处的工作流体汽化形成的蒸汽，比第二毛细结构32处的工作流体汽化形成的蒸汽在厚度方向上的扩散范围更广、更高，散热面积更大，进而使得第一区域11的散热效果会更佳明显。在实际应用中，第一盖板10的第一区域11与热源对应，可以但不限于发热元件等，提高散热过程中蒸汽扩散面积，提升散热效果，有利于降低散热装置100的厚度，兼顾了所需的散热效果，可以实现散热装置100的轻薄化，同时减少第二区域12中第二毛细结构32材料的使用，经济节约，有利于在工业上的大规模应用，还进一步降低了散热装置100的重量。
在本申请中，毛细结构30包括在第一区域11的至少一个第一毛细结构31和在第二区域12的至少一个第二毛细结构32。在本申请一实施方式中，请参阅图1，第一毛细结构31和第二毛细结构32间隔设置在第一盖板10的表面。可以理解的，此时第一毛细结构31和第二毛细结构32之间具有间距。在本申请另一实施方式中，第一毛细结构31和第二毛细结构32连续设置在第一盖板10的表面，此时第一毛细结构31和第二毛细结构32之间没有间距。第一毛细结构31和第二毛细结构32连续设置时，在散热过程中，第一毛细结构31和第二毛细结构32中的工作流体受热汽化后，从第一毛细结构31和第二毛细结构32靠近第二盖板20的表面扩散出去，即在毛细结构30厚度方向上实现气液分离，可以称之为垂直方向上实现气液分离。第一毛细结构31和第二毛细结构32间隔设置时，在散热过程中，第一毛细结构31和第二毛细结构32中的工作流体受热汽化后，从第一毛细结构31和第二毛细结构32横向尺寸方向上扩散出去，可以称之为在水平方向上实现气液分离。相对于垂直方向上的气液分离，水平方向上的气液分离后的散热通道多出了第一毛细结构31和第二毛细结构32占用的体积，使散热通道更宽，散热面积更大，进而更有利于散热效率的提升。在本申请一实施方式中，第一毛细结构31和第二毛细结构32之间的间距大于100μm，提高散热面积，增加散热效果，进而可以适当减小散热装置100的厚度，在兼 顾散热性能的同时，实现散热装置100的轻薄化。进一步的，第一毛细结构31和第二毛细结构32之间的间距大于150μm，进一步提高散热效果。
在本申请实施方式中，第一盖板10的第一区域11包括一个或多个第一毛细结构31。请参阅图1，第一区域11具有多个第一毛细结构31。在一实施例中，多个第一毛细结构31可以连续不间隔的设置在第一区域11上。在另一实施例中，多个第一毛细结构31间隔设置在第一区域11，进而实现在水平方向上的气液分离，与多个第一毛细结构31连续设置相比，其散热通道更宽，散热面积更大，提高了散热装置100的散热效率，并且，多个第一毛细结构31连续设置时能够产生更大的毛细作用力，使得蒸汽传递热量过程中，不能充满容置空间40就会被重新引流至第一毛细结构31中，无法充分利用容置空间40，而多个第一毛细结构31间隔设置时可以更充分地利用容置空间40，提高散热面积。在一实施例中，相邻的第一毛细结构31之间的间距大于100μm，提高散热面积，增加散热效果，有利于降低散热装置100的厚度，实现散热装置100的轻薄化。进一步的，相邻的第一毛细结构31之间的间距大于150μm、180μm、200μm或210μm，进一步提高散热面积和散热效果。在另一实施例中，多个第一毛细结构31在第一盖板10上呈阵列排布，以使得散热过程更加均匀，提高散热均匀性。
在本申请实施方式中，第一盖板10的第二区域12包括一个或多个第二毛细结构32。请参阅图1，第二区域12具有多个第二毛细结构32。在一实施例中，多个第二毛细结构32可以连续不间隔的设置在第二区域12上。在另一实施例中，多个第二毛细结构32间隔设置在第二区域12，进而实现在水平方向上的气液分离，与多个第二毛细结构32连续设置相比，其散热通道更宽，散热面积更大，提高了散热装置100的散热效率，并且，多个第二毛细结构32连续设置时能够产生更大的毛细作用力，使得蒸汽传递热量过程中，不能充满容置空间40就会被重新引流至第二毛细结构32中，无法充分利用容置空间40，而多个第二毛细结构32间隔设置时可以更充分地利用容置空间40，提高散热面积。在一实施例中，相邻的第二毛细结构32之间的间距大于100μm，提高散热面积，增加散热效果，有利于降低散热装置100的厚度，实现散热装置100的轻薄化。进一步的，相邻的第二毛细结构32之间的间距大于150μm、180μm、200μm或210μm，进一步提高散热面积和散热效果。在另一实施例中，多个第二毛细结构32在第一盖板10上呈阵列排布，以使得散热过程更加均匀，提高散热均匀性。
在本申请实施方式中，请参阅图2，第一毛细结构31与第二盖板20抵接。可以理解的，第一毛细结构31在厚度方向上具有相对的第一端和第二端，第一毛细结构31设置在第一盖板10上，第一毛细结构31的第一端与第一盖板10抵接，则第一毛细结构31的第二端与第二盖板20抵接。也就是说，第一毛细结构31的厚度与容置空间40在第一毛细结构31厚度方向上的尺寸一致，进而使得第一毛细结构31中的工作流体汽化形成蒸汽后，可以充满整个第一区域11对应的容置空间40内，更加有效地利用容置空间40，在实际应用中，对应热源位置处的散热面积提高，进而提升散热效果，有利于降低散热装置100的厚度，实现散热装置100的轻薄化。
在本申请实施方式中，当第一区域11包括多个第一毛细结构31时，请参阅图3，多个第一毛细结构31可以将容置空间40进行分割，形成至少一个位于相邻第一毛细结构31之间的散热通道。当具有多个散热通道时，多个散热通道之间相互不连通。在本申请另外的实施方式中，当第一区域11包括多个第一毛细结构31时，请参阅图4，多个第一毛细结构31可以将容置空间40进行分割，形成多个相互连通的子空间，即形成多个相互连通的散热通道。在一实施例中，第一毛细结构31的横截面可以但不限于为正方形、长方形、圆形、椭圆形、菱形、不规则形状等。
在本申请实施方式中，当第二区域12包括多个第二毛细结构32时，请参阅图3，多个第二毛细结构32可以将容置空间40进行分割，形成至少一个位于相邻第二毛细结构32之间的散热通道。当具有多个散热通道时，多个散热通道之间相互不连通。在本申请另外的实施方式中，当第二区域12包括多个第二毛细结构32时，请参阅图4，多个第二毛细结构32可以将容置空间40进行分割，形成多个相互连通的子空间，即形成多个相互连通的散热通道。在一实施例中，第一毛细结构31的横截面可以但不限于为正方形、长方形、圆形、椭圆形、菱形、不规则形状等。可以理解的，当具有多个第一毛细结构31和多个第二毛细结构32时，还可以将第一毛细结构31之间设置为相互不连通的散热通道，第二毛细结构32之间设置为相互连通的散热通道，也可以将第一毛细结构31之间设置为相互连通的散热通道，第二毛细结构32之间设置为相互不连通的散热通道。
在本申请中，通过设置不同厚度的第一毛细结构31和第二毛细结构32，以使得在应用时，与热源对应的第一区域11能够具有更大的散热面积，提高散热效果。第一毛细结构31和第二毛细结构32的厚度可以根据实际需要进行选择，为了有利于散热装置100的轻薄化，第一毛细结构31和第二毛细结构32可以为微米级的毛细结构30。在本申请实施方式中，第一毛细结构31的厚度大于80μm，第二毛细结构32的厚度小于或等于80μm，以使得第一毛细结构31中的工作流体汽化后能够充分散热，同时第二毛细结构32的厚度相对较小，不用过多增加散热装置100的重量。在一实施例中，第一毛细结构31的厚度为85μm-120μm，第二毛细结构32的厚度为20μm-80μm，既可以提高散热装置100的散热效果，又降低了散热装置100的体积，同时散热装置100的厚度不会过大，有利于实现散热装置100的轻薄化。在另一实施例中，第一毛细结构31的厚度为90μm-120μm，第二毛细结构32的厚度为40μm-70μm。在本申请实施方式中，第一毛细结构31与第二毛细结构32的厚度比为(1.1-6)：1，继而在散热过程中对应第一区域11的蒸汽可以具有更大的散热空间，提高散热效率。进一步的，第一毛细结构31与第二毛细结构32的厚度比为(1.5-4)：1。
在本申请中，毛细结构30的材质为金属材料。在一实施例中，毛细结构30的材质包括铜、钛、镍和锡中的至少一种或不锈钢；也就是说，第一毛细结构31和第二毛细结构32的材质包括铜、钛、镍和锡中的至少一种或不锈钢，第一毛细结构31和第二毛细结构32的材质可以相同，也可以不同。例如，第一毛细结构31和第二毛细结构32的材质为铜。又如，第一毛细结构31的材质为铜钛合金，第二毛细结构32的材质为铜。在本申请中， 毛细结构30的制备可以根据实际需要进行选择，其可以提供毛细作用力即可。在一实施例中，毛细结构30可以为金属网裁切而成。在另一实施例中，毛细结构30可以为烧结金属网制成。在又一实施例中，毛细结构30可以通过刻蚀形成。在本申请实施方式中，通过设置了具有厚度差异的第一毛细结构31和第二毛细结构32，无需较薄的第一毛细结构31，因此无需使用较为精细的制备工艺，更加经济节约。
在本申请中，散热装置100包括第一盖板10和第二盖板20，第一盖板10和第二盖板20盖合形成密闭的容置空间40。可以理解的，本申请中的术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。其中，毛细结构30设置在第一盖板10上，在应用时，第一盖板10远离第二盖板20的表面与热源贴合设置，包括直接贴合设置以及通过其他部件间接贴合设置；当然毛细结构30也可以设置在第二盖板20上，此时第二盖板20远离第一盖板10的表面与热源贴合设置。在本申请中，第一盖板10包括第一区域11和第二区域12，第一区域11和第二区域12相邻接，例如可以但不限于第一区域11围绕第二区域12，或第二区域12围绕第一区域11，或第一区域11和第二区域12相邻设置。第一区域11和第二区域12的设置方式和范围可以根据实际需要进行选择，可以但不限于根据热源的大小设计第一区域11的范围。
在本申请中，为了实现散热装置100的轻薄化，可选的，第一盖板10的厚度小于或等于200μm，第二盖板20的厚度小于或等于200μm。进一步的，第一盖板10的厚度小于或等于180μm，第二盖板20的厚度小于或等于180μm。更进一步的，第一盖板10的厚度小于或等于150μm，第二盖板20的厚度小于或等于150μm。在本申请中，第一盖板10和第二盖板20由具有导热性能的材质组成。在一实施例中，第一盖板10的导热系数大于10W/(m·K)，第二盖板20的导热系数大于10W/(m·K)，以使得散热装置100具有优异的散热效果。在一实施例中，第一盖板10的材质包括铜、钛、镍和锡中的至少一种或不锈钢，第二盖板20的材质包括铜、钛、镍和锡中的至少一种或不锈钢。进一步的，第一盖板10的材质为钛、铜钛合金、铜镍合金、铜锡合金或不锈钢，第二盖板20的材质为钛、铜钛合金、铜镍合金、铜锡合金或不锈钢，以使得第一盖板10和第二盖板20具有较好的力学性能，有利于降低其厚度的同时保证散热装置100的良好性能。可以理解的，第一盖板10和第二盖板20的材质可以相同，也可以不同，第一盖板10或第二盖板20与毛细结构30的材质可以相同，也可以不同。在一实施例中，第一盖板10和第二盖板20可以为单层结构，也可以为多层结构，具体的根据实际需要进行选择。
在本申请实施方式中，第一盖板10包括第一水平层和设置在第一水平层表面边缘的第一边框，此时第一盖板10可以但不限于为一体成型制得。在本申请另一实施方式中，第一盖板10为水平结构。在本申请实施方式中，第二盖板20包括第二水平层和设置在第二水平层表面边缘的第二边框，此时第二盖板20可以但不限于为一体成型制得。在本申请另一实施方式中，第二盖板20为水平结构。在一实施例中，第一边框与第二边框抵接，形成容置空间40。在另一实施例中，第一边框和水平结构的第二盖板20抵接形成容置空间40。在另一实施例中，第二边框和水平结构的第一盖板10抵接形成容置空间40。在另一实施 例中，水平结构的第一盖板10和第二盖板20可以但不限于通过焊接、胶粘形成容置空间40，例如激光焊接、扩散焊接、焊料焊接、胶材粘结等。
在本申请中，容置空间40为真空状态，以使工作流体可以容易地实现汽化，进行热量传导。可选的，容置空间40内的真空度为10 -3-10 -1Pa。进一步的，容置空间40内的真空度为10 -2-10 -1Pa。
在本申请中，散热装置100中的工作流体吸收热量，并迅速汽化，这一过程能带走大量的热量，进而完成一个散热循环。可以理解的，工作流体选自与第一盖板10、第二盖板20和毛细结构30不发生化学反应的物质。可选的，工作流体选自水、丙二醇、丙酮或甲醇。具体的，工作流体可以但不限于为去离子水。工作流体在容置空间40的填充量也会影响散热装置100的散热效率，填充量过少，一个散热循环中带走的热量有限，填充量过多，增加散热装置100重量。可选的，容置空间40内工作流体的填充量为15％-70％，即可以有效的进行散热，又不会使散热装置100过重。进一步的，容置空间40内工作流体的填充量为30％-65％。
在本申请中，为了满足散热装置100轻薄化的需求，同时又要具备较强的力学性能，因此，可以在容置空间40内设置支撑结构50，对散热装置100的容置空间40起到一定的支撑作用，同时还有利于工作流体在支撑结构50延伸方向上的扩散效率。在一实施例中，请参阅图1，散热装置100包括至少一个支撑结构50，支撑结构50设置在容置空间40内，且与第一盖板10和第二盖板20抵接。在一实施例中，当多个毛细结构30间隔设置在第一盖板10上时，支撑结构50与毛细结构30抵接，进而不会影响散热空间，有利于散热的高效进行。进一步的，支撑结构50包括至少一个第一支撑结构和至少一个第二支撑结构，第一支撑结构与第一毛细结构31抵接，第二支撑结构与第二毛细结构32抵接。在另一实施例中，当第一毛细结构31与第二盖板20抵接时，则无需设置第一支撑结构。在本申请中，支撑结构50与毛细结构30抵接，可以使得容置空间40形成多个相互连通的散热通道，也可以使得容置空间40形成多个相互不连通的散热通道。在本申请中，支撑结构50的厚度根据实际需要进行选择，可以但不限于为20μm-120μm。可以理解的，支撑结构50主要对散热装置100起到支撑作用，其材质的选择可以根据需要进行选定，可以但不限于为金属，例如铜、铜合金等。
在本申请中，通过设置不同厚度的第一毛细结构31和第二毛细结构32，使得在应用中，对应热源的第一区域11的蒸汽可以具有更大的散热空间，进而提高散热效率，同时没有对应热源的第二区域12无需设置较厚的毛细结构30，减少了材质的使用，并降低了散热装置100的重量，进而可以降低散热装置100的厚度，实现散热装置100的轻薄化。可选的，散热装置100的厚度小于或等于280μm。进一步的，散热装置100的厚度小于或等于250μm。
本申请还提供了一种散热装置的制备方法，该制备方法制备上述任一实施例的散热装置100。请参阅图5，图5为本申请一实施例的散热装置100的制备方法的流程示意图，包括如下步骤：
操作101：提供第一盖板和第二盖板，第一盖板包括第一区域和第二区域。
在操作101中，第一盖板10和第二盖板20可以但不限于直接裁切金属板制得，金属板能够满足散热装置100中的第一盖板10和第二盖板20所需的导热性能和力学性能即可。为了实现散热装置100的轻薄化，可选的，第一盖板10的厚度小于或等于200μm，第二盖板20的厚度小于或等于200μm。在本申请中，第一盖板10包括第一区域11和第二区域12，第一区域11和第二区域12相邻接。
操作102：在第一区域成型至少一个第一毛细结构，在第二区域成型至少一个第二毛细结构，第一毛细结构的厚度大于第二毛细结构的厚度。
在操作102中，可以但不限于为提供第一金属网，将第一金属网裁切后设置在第一区域11，形成至少一个第一毛细结构31；提供第二金属网，将第二金属网裁切后设置在第二区域12，形成至少一个第二毛细结构32，该制备方法简单方便，无需大型设备、精密设备的使用，能够实现工业化生产。在另一实施例中，第一毛细结构31和第二毛细结构32可以通过烧结形成，还可以通过刻蚀形成。第一毛细结构31和第二毛细结构32的设置方式如上，在此不再赘述。
操作103：将第一盖板和第二盖板盖合形成密闭的容置空间，第一毛细结构和第二毛细结构设置在容置空间内。
在操作103中，可以但不限于通过焊接、胶粘的方式形成密闭的容置空间40。可选的，焊接包括激光焊接、扩散焊接、焊料焊接中的至少一种。焊料焊接包括低温焊料或高温焊料，扩散焊接包括真空扩散焊或气体保护扩散焊，胶粘的材料可以但不限于为双环氧基胶材、硅基胶材等。在一实施例中，可以在氮气气氛下，焊接温度为600℃-900℃时进行焊接。当散热装置100还包括支撑结构50时，支撑结构50设置在容置空间40内，并与第一盖板10和第二盖板20抵接。
操作104：向容置空间内注入工作流体，密封后形成散热装置100。
在操作104中，容置空间40为真空状态，以使工作流体可以容易地实现汽化，进行热量传导。可选的，容置空间40内的真空度为10 -3-10 -1Pa。在一实施例中，向容置空间40内焊接充液管，经充液管向容置空间40内注入工作流体，经抽真空和密封后形成散热装置100。
本申请提供的散热装置100的制备方法简单，无需使用精密的设备即可完成，制备成本低，且制得的散热装置100散热性能优异，更为轻薄，有利于应用。
本申请还提供了一种电子设备，包括上述任一实施例的散热装置100。可以理解的，电子设备可以但不限于为手机、平板电脑、笔记本电脑、手表、MP3、MP4、GPS导航仪、数码相机等，散热装置100可以但不限于为均温板。
请参阅图6，为本申请一实施例的电子设备的结构示意图，电子设备包括面板300和壳体400，面板300和壳体400形成收容空间，收容空间内包括了发热元件200和散热装置100，其中，发热元件200与散热装置100中的第一区域11贴合设置，第一区域11对应的工作流体汽化后的散热空间较大，可以实现更快速的散热，提高散热效率；同时该散 热装置100可以适当降低厚度还能兼顾优异的散热性能，同时第二区域12的第二毛细结构32厚度较薄，有利于散热装置100重量的降低，进而有利于实现电子设备的轻薄化。在实际应用中，散热装置100可以直接与发热元件200接触，也可以通过中板与发热元件200接触，此时需要对中板进行处理，以使散热装置100嵌入其中，即散热装置100可以与发热元件200直接贴合设置或间接贴合设置，发热元件200与散热装置100中的第一区域对应设置。请参阅图7，为本申请另一实施例的电子设备的截面示意图，电子设备包括发热元件200、散热装置100和中板500，散热装置100嵌入中板500中，并与发热元件200贴合设置。以手机为例，散热装置较厚，则会影响手机中板的力学性能，进而影响手机整体强度，而本申请提供的散热装置100可以将其厚度降低，并且还不影响散热性能，进而不会影响手机整体性能，同时，本申请提供的散热装置100重量较小，也不会过多增加手机的重量，具有良好的应用前景。
以上对本申请实施方式所提供的内容进行了详细介绍，本文对本申请的原理及实施方式进行了阐述与说明，以上说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种散热装置，其特征在于，包括第一盖板、第二盖板、毛细结构和工作流体，所述第一盖板和所述第二盖板盖合形成密闭的容置空间，所述毛细结构设置在所述第一盖板靠近所述容置空间的表面，所述工作流体填充在所述容置空间内，其中，所述第一盖板包括第一区域和第二区域，所述毛细结构包括设置在所述第一区域的至少一个第一毛细结构和设置在所述第二区域的至少一个第二毛细结构，所述第一毛细结构的厚度大于所述第二毛细结构的厚度。
  2. 如权利要求1所述的散热装置，其特征在于，所述第一毛细结构和所述第二毛细结构间隔设置在所述第一盖板的表面。
  3. 如权利要求2所述的散热装置，其特征在于，所述第一毛细结构和所述第二毛细结构之间的间距大于100μm。
  4. 如权利要求1所述的散热装置，其特征在于，多个所述第一毛细结构在所述第一盖板上呈阵列排布，多个所述第二毛细结构在所述第一盖板上呈阵列排布。
  5. 如权利要求1所述的散热装置，其特征在于，所述第一区域具有多个所述第一毛细结构，相邻所述第一毛细结构之间的间距大于100μm；所述第二区域具有多个所述第二毛细结构，相邻所述第二毛细结构之间的间距大于100μm。
  6. 如权利要求1所述的散热装置，其特征在于，所述第一毛细结构的厚度大于80μm，所述第二毛细结构的厚度小于或等于80μm。
  7. 如权利要求6所述的散热装置，其特征在于，所述第一毛细结构的厚度为85μm-120μm，所述第二毛细结构的厚度为20μm-80μm。
  8. 如权利要求1所述的散热装置，其特征在于，所述第一毛细结构和所述第二毛细结构的厚度比为(1.1-6)：1。
  9. 如权利要求1所述的散热装置，其特征在于，所述第一毛细结构与所述第二盖板抵接。
  10. 如权利要求1所述的散热装置，其特征在于，所述毛细结构的材质包括铜、钛、镍和锡中的至少一种或不锈钢。
  11. 如权利要求1所述的散热装置，其特征在于，所述散热装置还包括支撑结构，所述支撑结构设置在所述容置空间内，且与所述第一盖板和所述第二盖板抵接。
  12. 如权利要求11所述的散热装置，其特征在于，所述支撑结构与所述毛细结构抵接。
  13. 如权利要求1所述的散热装置，其特征在于，所述第一盖板的导热系数大于10W/(m·K)；所述第二盖板的导热系数大于10W/(m·K)。
  14. 如权利要求1所述的散热装置，其特征在于，所述第一盖板的厚度小于或等于200μm；所述第二盖板的厚度小于或等于200μm。
  15. 如权利要求1所述的散热装置，其特征在于，所述第一盖板包括第一水平层和设置 在所述第一水平层表面边缘的第一边框；所述第二盖板包括第二水平层和设置在所述第二水平层表面边缘的第二边框。
  16. 如权利要求1所述的散热装置，其特征在于，所述散热装置的厚度小于或等于280μm。
  17. 一种散热装置的制备方法，其特征在于，包括：
    提供第一盖板和第二盖板，所述第一盖板包括第一区域和第二区域；
    在所述第一区域成型至少一个第一毛细结构，在所述第二区域成型至少一个第二毛细结构，所述第一毛细结构的厚度大于所述第二毛细结构的厚度；
    将所述第一盖板和所述第二盖板盖合形成密闭的容置空间，所述第一毛细结构和所述第二毛细结构设置在所述容置空间内；
    向所述容置空间内注入工作流体，密封后形成散热装置。
  18. 如权利要求17所述的制备方法，其特征在于，所述在所述第一区域成型至少一个第一毛细结构，在所述第二区域成型至少一个第二毛细结构包括：
    提供第一金属网，将所述第一金属网裁切后设置在所述第一区域，形成至少一个所述第一毛细结构；
    提供第二金属网，将所述第二金属网裁切后设置在所述第二区域，形成至少一个所述第二毛细结构。
  19. 一种电子设备，其特征在于，包括发热元件和散热装置，所述散热装置包括第一盖板、第二盖板、毛细结构和工作流体，所述第一盖板和所述第二盖板盖合形成密闭的容置空间，所述毛细结构设置在所述第一盖板靠近所述容置空间的表面，所述工作流体填充在所述容置空间内，其中，所述第一盖板包括第一区域和第二区域，所述毛细结构包括设置在所述第一区域的至少一个第一毛细结构和设置在所述第二区域的至少一个第二毛细结构，所述第一毛细结构的厚度大于所述第二毛细结构的厚度，所述发热元件与所述第一盖板的所述第一区域贴合设置。
  20. 如权利要求19所述的电子设备，其特征在于，所述电子设备还包括中板，所述散热装置嵌入所述中板中，并与所述发热元件贴合设置。
PCT/CN2021/075524 2020-04-08 2021-02-05 散热装置、散热装置的制备方法及电子设备 WO2021203825A1 (zh)

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