WO2021073158A1 - 薄型毛细结构支撑均温板 - Google Patents

薄型毛细结构支撑均温板 Download PDF

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WO2021073158A1
WO2021073158A1 PCT/CN2020/099393 CN2020099393W WO2021073158A1 WO 2021073158 A1 WO2021073158 A1 WO 2021073158A1 CN 2020099393 W CN2020099393 W CN 2020099393W WO 2021073158 A1 WO2021073158 A1 WO 2021073158A1
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capillary
supporting
cover plate
support structure
plate
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PCT/CN2020/099393
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English (en)
French (fr)
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蔡文龙
洪广
闫晓峰
张于光
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昆山联德电子科技有限公司
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Publication of WO2021073158A1 publication Critical patent/WO2021073158A1/zh

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

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  • the invention relates to the technical field of temperature equalization plate structures, in particular to a thin capillary structure supporting temperature equalization plate.
  • the uniform temperature plate has the following shortcomings in terms of process and structure:
  • the cover plate generally adopts CNC/etching processing technology to make the support structure, so that the soaking area is reduced, the rejection rate is high, the pollution is large, the cost is high, and it is difficult to achieve true lightness and thinness;
  • the pumping and liquid injection port requires an additional casing for external operation, and a complicated (compression + welding) sealing operation is required after the pumping and liquid injection is completed;
  • the present invention provides a thin capillary structure supporting temperature equalizing plate, which makes the capillary structure in the inner cavity of the equalizing plate function as the capillary force structure of the phase change medium of the equalizing plate and has the function of supporting force structure, which improves The thermal conductivity and heat dissipation efficiency of the uniform temperature plate are improved.
  • the thin capillary structure supporting temperature equalization plate is characterized in that it includes a first cover plate and a second cover plate, the central area of the first cover plate is provided with an upper convex cavity, and the second cover plate is a flat plate structure, The outer frame cover of the first flat plate is mounted on the peripheral area of the second cover plate, and it also includes a capillary support structure.
  • a surface of the overall planar area of the capillary support structure is provided with a plurality of convex support members ,
  • the capillary support structure is arranged in the upper convex cavity, the flat surface of the overall plane area of the capillary support structure is arranged in accordance with the inner surface of the upper convex cavity, and all the convex portions of the support member
  • the dots form an equivalent plane, and the outer convex dots of all the supporting components are arranged to fit the inner surface of the second cover plate.
  • a working fluid injection hole is provided on the side wall of the upper convex cavity, and the working fluid injection hole is sealed after injecting the phase change medium and vacuuming;
  • the area of the capillary support structure covers the corresponding area of the upper convex cavity to ensure the heat conduction capacity and heat dissipation efficiency of the uniform temperature plate;
  • the capillary support structure is specifically a powder sintered support structure
  • the powder sintered support structure is sintered according to a preset thickness, and a plurality of convex support members are arranged on the inner surface of the powder sintered support structure facing the second cover plate
  • the supporting part and the powder sintering support structure are integrally sintered and molded, and the powder inside the powder sintering support structure after sintering forms a guide passage for cooling the working fluid, and the guide passage covers the passage in the corresponding support component;
  • the supporting components include, but are not limited to, cylindrical, cubic, hemispherical, or ellipsoidal, and all supporting components are arranged in a rectangular array on the corresponding surface of the powder sintering supporting structure to ensure simple and convenient production;
  • the capillary support structure is specifically a mesh support structure formed by assembling capillary metal tubes, the capillary metal tubes of the mesh support structure are filled with working fluid, and the inner surface of the mesh support structure corresponds to the inner surface of the second cover plate.
  • the heat source end of the first cover plate is heated, the working fluid boils and evaporates into a gas, the gaseous working fluid is liquefied at the ends of the two cover plates away from the heat source to release energy, and the liquid working fluid returns to the heat source under the action of the capillary wick Position, work again and again, the capillary support structure is used as the capillary force structure of the phase change working medium of the uniform temperature plate, and at the same time, the support component with the support structure is formed.
  • the two cover plates of the uniform temperature plate no longer need to process complex structures, so For positioning in the thickness direction, the thickness of the material can be processed with the thinnest sheet metal material of 0.05mm, which greatly reduces the cost; and the traditional support structure occupies the internal space of the temperature equalization plate, which hinders the gas-liquid return of the phase change material in the internal cavity , It is not conducive to the heat conduction of the uniform temperature plate, and the capillary structure supports the uniform temperature plate without additional supporting parts, and the support structure can also have a good capillary function, with larger internal space, better heat conduction capacity, and improved heat dissipation efficiency.
  • Fig. 1 is a schematic structural diagram of an exploded view of a specific embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of an exploded view of the second embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of an exploded view of specific embodiment 3 of the present invention.
  • FIG. 4 is a schematic diagram of a partially enlarged structure at A in FIG. 3;
  • Figure 5 is a schematic top view of the structure of the present invention.
  • the thin capillary structure supports the temperature equalizing plate, see Figure 1 to Figure 5. It includes a first cover plate 1 and a second cover plate 2. The central area of the first cover plate 1 is provided with an upper convex cavity 11, and the second cover plate 2 It is a flat plate structure. The outer frame 12 of the first flat plate 1 is covered on the peripheral area of the second cover plate 2. It also includes a capillary support structure.
  • One surface of the overall planar surface of the capillary support structure is provided with a number of convex supports
  • the capillary support structure is arranged in the upper convex cavity 11, and the flat surface of the overall plane area of the capillary support structure is arranged to fit the inner surface of the upper convex cavity 11, and the outer convex points of all the support components form an equivalent plane ,
  • the outer bumps of all the supporting parts are arranged to fit the inner surface of the second cover plate 2,
  • a working fluid injection hole 13 is provided on the side wall of the upper convex cavity 11, and the working fluid injection hole 13 is provided with a seal 14 after the phase change medium is injected and vacuumed;
  • the area of the capillary support structure covers the corresponding area of the upper convex cavity 11 to ensure the thermal conductivity and heat dissipation efficiency of the uniform temperature plate.
  • the capillary support structure When the capillary support structure is specifically a powder sintered support structure 3, it sinters the powder sintered support structure 3 according to a preset thickness, and the powder sintered support structure 3 faces the second cover plate A number of protruding support members 31 are arranged on the inner surface.
  • the support members 31 and the powder sintering support structure 3 are integrally sintered and molded.
  • the powder inside the powder sintering support structure 3 after sintering and molding forms a guide passage for the cooling medium before the powder is formed. Covers the passages in the corresponding support parts 31; all the support parts 31 are arranged in a rectangular array on the corresponding surface of the powder sintered support structure 3 to ensure simple and convenient production.
  • the supporting member 31 is specifically cylindrical.
  • the supporting member 31 is specifically cubic.
  • the capillary support structure is specifically a mesh support structure 4 formed by assembling capillary metal tubes.
  • the capillary metal tubes of the mesh support structure 4 are filled with working fluid, and the mesh support structure 4 corresponds to A number of convex three-dimensional braided protrusions 41 are arranged on the inner surface of the second cover plate 2, and the outer convex points of the three-dimensional braided protrusions 41 arranged in an array form an equivalent plane, and all three-dimensional braided protrusions
  • the outer convex points of 41 are arranged in a position corresponding to the inner surface of the second cover plate.
  • the capillary structure is used as the capillary force structure of the phase change medium of the uniform temperature plate while forming a supporting structure function.
  • the two cover plates of the uniform temperature plate no longer need to process complex structures.
  • the thickness of the material can be the thinnest 0.05mm
  • the sheet metal material is processed, and the cost is greatly reduced; the supporting structure in the prior art occupies the internal space of the uniform temperature plate, which hinders the gas-liquid return of the phase change material in the internal cavity, and is not conducive to the heat conduction of the uniform temperature plate.
  • the capillary structure supports the uniform temperature plate without additional supporting parts, and the support structure can also have a good capillary function.
  • the internal space is larger, the heat conduction capacity is better, and the heat dissipation efficiency is improved; this technology can make the thickness of the uniform temperature plate the thinnest. 0.3mm, it can be light and thin, its structure is simpler, the processing technology is less, the production cost is reduced, and the heat dissipation efficiency is also improved. It is also in line with the development trend of light and thin modern electronic products.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明提供了薄型毛细结构支撑均温板,其使得均温板内腔内的毛细结构在作为均温板相变介质毛细力结构的同时、具有支撑力结构的功能,其提高了均温板的热传导能力和散热效率。其包括第一盖板、第二盖板,所述第一盖板的中心区域设置有上凸腔体,所述第二盖板为平板结构,所述第一平板的外边框盖装于所述第二盖板的外围区域,其还包括有毛细支撑结构,所述毛细支撑结构的整体平面面域的一表面设置有若干外凸的支撑部件,所述毛细支撑结构位于所述上凸腔体内布置,所述毛细支撑结构的整体平面面域的平面表面贴合所述上凸腔体的内表面布置,所有的所述支撑部件的外凸点形成一等效平面,所有的支撑部件的外凸点贴合所述第二盖板的内表面布置。

Description

薄型毛细结构支撑均温板 技术领域
本发明涉及均温板结构的技术领域,具体为薄型毛细结构支撑均温板。
背景技术
随着科技的发展,人们生活水平的提高,高热流密度散热与高均温性是现在载荷散热技术发展的趋势。均温板良好的导热性能,使其应用越来越广泛,电子芯片和器件越来越轻薄化,轻薄化和加工工艺简单的均温板越来越被需求。
现有技术中均温板在工艺和结构方面存在如下不足:
1盖板一般采用CNC/蚀刻的加工工艺来做支撑结构,均热面积减少,废品率高,污染大,成本高,并很难做到真正的轻薄化;
2采用其他辅助结构来做均温板的支撑,例如柱状,或凹凸体,增加均温板的加工流程及难度,也很难做到轻薄化;
3抽气注液口需要额外的套管进行外接操作,并且完成抽气注液后需要复杂的(压合+焊接)封口操作;
这种情况下,急需一种新型均温板结构。
发明内容
针对上述问题,本发明提供了薄型毛细结构支撑均温板,其使得均温板内腔内的毛细结构在作为均温板相变介质毛细力结构的同时、具有支撑力结构的功能,其提高了均温板的热传导能力和散热效率。
薄型毛细结构支撑均温板,其特征在于:其包括第一盖板、第二盖板, 所述第一盖板的中心区域设置有上凸腔体,所述第二盖板为平板结构,所述第一平板的外边框盖装于所述第二盖板的外围区域,其还包括有毛细支撑结构,所述毛细支撑结构的整体平面面域的一表面设置有若干外凸的支撑部件,所述毛细支撑结构位于所述上凸腔体内布置,所述毛细支撑结构的整体平面面域的平面表面贴合所述上凸腔体的内表面布置,所有的所述支撑部件的外凸点形成一等效平面,所有的支撑部件的外凸点贴合所述第二盖板的内表面布置。
其进一步特征在于:
所述上凸腔体的侧壁上设置有一处工质注入孔,所述工质注入孔在注入相变介质并抽真空后封口;
所述毛细支撑结构的面域覆盖所述上凸腔体的对应面域,确保均温板的热传导能力和散热效率;
所述毛细支撑结构具体为粉末烧结支撑结构时,其根据预设厚度烧结粉末烧结支撑结构,在所述粉末烧结支撑结构的朝向所述第二盖板内表面上排布若干外凸的支撑部件,所述支撑部件连同粉末烧结支撑结构整体烧结成型,烧结成型后的粉末烧结支撑结构的内部的粉末之前形成冷却工质的导向通路,导向通路涵盖对应的支撑部件内的通路;
所述支撑部件包括但不限于为圆柱形、立方体形、半球形、椭球形,所有的支撑部件成矩形阵列排布于所述粉末烧结支撑结构的对应表面,确保制作简单、方便;
所述毛细支撑结构具体为毛细金属管组装形成的网目支撑结构,所述网目支撑结构的毛细金属管内填充有工质,网目支撑结构的对应于所述第二盖 板的内表面排布有若干外凸的立体编织状凸起,所述立体编织状凸起的外凸点形成一等效平面,所有的立体编织状凸起的外凸点贴合所述第二盖板的内表面对应位置布置。
采用上述技术方案后,第一盖板的热源端受热,工质沸腾蒸发为气体,气态工质在两块盖板的远离热源端液化释放能量,液态工质在毛细芯的作用下回到热源位置,周而复始工作,毛细支撑结构在作为均温板相变工质毛细力结构的同时、成型出具有支撑力结构的支撑部件,均温板的两块盖板不再需要加工复杂的结构、从而进行厚度向定位,其用料厚度可以使用最薄0.05mm的钣金材料进行加工,成本大幅降低;且传统支撑结构占用均温板内部空间,对内部腔体相变物质气液回流起到阻碍,不利于均温板的热传导,而毛细结构支撑均温板没有额外的支撑部件,支撑结构也能有很好的毛细功能,内部空间更大,热传导能力更好,提高散热效率。
附图说明
图1为本发明的具体实施例一爆炸图结构示意图;
图2为本发明的具体实施例二爆炸图结构示意图;
图3为本发明的具体实施例三爆炸图结构示意图;
图4为图3的A处局部放大结构示意图;
图5为本发明的俯视图结构示意图;
图中序号所对应的名称如下:
第一盖板1、上凸腔体11、外边框12、工质注入孔13、封口14、第二盖板2、粉末烧结支撑结构3、支撑部件31、网目支撑结构4、立体编织状凸起41。
具体实施方式
薄型毛细结构支撑均温板,见图1-图5:其包括第一盖板1、第二盖板2,第一盖板1的中心区域设置有上凸腔体11,第二盖板2为平板结构,第一平板1的外边框12盖装于第二盖板2的外围区域,其还包括有毛细支撑结构,毛细支撑结构的整体平面面域的一表面设置有若干外凸的支撑部件,毛细支撑结构位于上凸腔体11内布置,毛细支撑结构的整体平面面域的平面表面贴合上凸腔体11的内表面布置,所有的支撑部件的外凸点形成一等效平面,所有的支撑部件的外凸点贴合第二盖板2的内表面布置,
上凸腔体11的侧壁上设置有一处工质注入孔13,工质注入孔13在注入相变介质并抽真空后设置封口14;
毛细支撑结构的面域覆盖上凸腔体11的对应面域,确保均温板的热传导能力和散热效率。
具体实施例一、二,见图1、图2:毛细支撑结构具体为粉末烧结支撑结构3时,其根据预设厚度烧结粉末烧结支撑结构3,在粉末烧结支撑结构3的朝向第二盖板内表面上排布若干外凸的支撑部件31,支撑部件31连同粉末烧结支撑结构3整体烧结成型,烧结成型后的粉末烧结支撑结构3的内部的粉末之前形成冷却工质的导向通路,导向通路涵盖对应的支撑部31件内的通路;所有的支撑部件31成矩形阵列排布于粉末烧结支撑结构3的对应表面,确保制作简单、方便。
具体实施例一、见图1:支撑部件31具体为圆柱形。
具体实施例二、见图2:支撑部件31具体为立方体形。
具体实施例三、见图3和图4:毛细支撑结构具体为毛细金属管组装形成 的网目支撑结构4,网目支撑结构4的毛细金属管内填充有工质,网目支撑结构4的对应于第二盖板2的内表面排布有若干外凸的立体编织状凸起41,阵列排布的立体编织状凸起41的外凸点形成一等效平面,所有的立体编织状凸起41的外凸点贴合第二盖板的内表面对应位置布置。
其有益效果如下:
毛细结构在作为均温板相变介质毛细力结构的同时成型出具有支撑力结构的功能,均温板的两块盖板不再需要加工复杂的结构,用料厚度可以使用最薄0.05mm的钣金材料进行加工,成本大幅降低;现有技术中的支撑结构占用均温板内部空间,对内部腔体相变物质气液回流起到阻碍,不利于均温板的热传导。毛细结构支撑均温板没有额外的支撑部件,支撑结构也能有很好的毛细功能,内部空间更大,热传导能力更好,提高散热效率;本技术可使均温板的厚度最薄可达到0.3mm,做到轻薄化,其结构更简单,加工工艺少,降低生产成本,也提高了散热效率。也符合现代电子产品轻薄化发展趋势。
对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现本发明。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本发明的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。
此外,应当理解,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起 见,本领域技术人员应当将说明书作为一个整体,各实施例中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。

Claims (6)

  1. 薄型毛细结构支撑均温板,其特征在于:其包括第一盖板、第二盖板,所述第一盖板的中心区域设置有上凸腔体,所述第二盖板为平板结构,所述第一平板的外边框盖装于所述第二盖板的外围区域,其还包括有毛细支撑结构,所述毛细支撑结构的整体平面面域的一表面设置有若干外凸的支撑部件,所述毛细支撑结构位于所述上凸腔体内布置,所述毛细支撑结构的整体平面面域的平面表面贴合所述上凸腔体的内表面布置,所有的所述支撑部件的外凸点形成一等效平面,所有的支撑部件的外凸点贴合所述第二盖板的内表面布置。
  2. 如权利要求1所述的薄型毛细结构支撑均温板,其特征在于:所述上凸腔体的侧壁上设置有一处工质注入孔,所述工质注入孔在注入相变介质并抽真空后封口。
  3. 如权利要求1或2所述的薄型毛细结构支撑均温板,其特征在于:所述毛细支撑结构的面域覆盖所述上凸腔体的对应面域。
  4. 如权利要求1所述的薄型毛细结构支撑均温板,其特征在于:所述毛细支撑结构具体为粉末烧结支撑结构时,其根据预设厚度烧结粉末烧结支撑结构,在所述粉末烧结支撑结构的朝向所述第二盖板内表面上排布若干外凸的支撑部件,所述支撑部件连同粉末烧结支撑结构整体烧结成型,烧结成型后的粉末烧结支撑结构的内部的粉末之前形成冷却工质的导向通路,导向通路涵盖对应的支撑部件内的通路。
  5. 如权利要求4所述的薄型毛细结构支撑均温板,其特征在于:所述支撑部件包括但不限于为圆柱形、立方体形、半球形、椭球形,所有的支撑部件成矩形阵列排布于所述粉末烧结支撑结构的对应表面。
  6. 如权利要求1所述的薄型毛细结构支撑均温板,其特征在于:所述毛细支撑结构具体为毛细金属管组装形成的网目支撑结构,所述网目支撑结构的毛细金属管内填充有工质,网目支撑结构的对应于所述第二盖板的内表面排布有若干外凸的立体编织状凸起,所述立体编织状凸起的外凸点形成一等效平面,所有的立体编织状凸起的外凸点贴合所述第二盖板的内表面对应位置布置。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113747758A (zh) * 2021-08-24 2021-12-03 苏州浪潮智能科技有限公司 一种电子设备及其散热装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110567304A (zh) * 2019-10-15 2019-12-13 联德精密材料(中国)股份有限公司 薄型毛细结构支撑均温板
CN111322891A (zh) * 2020-02-25 2020-06-23 张于光 一种均温板散热器
CN212931119U (zh) * 2020-08-03 2021-04-09 昆山联德电子科技有限公司 一种薄型均温板
CN112589387B (zh) * 2020-11-30 2022-07-01 瑞声科技(南京)有限公司 均温板加工方法及均温板
CN113865396A (zh) * 2021-10-26 2021-12-31 惠州奥诺吉散热技术有限公司 一种均温板
CN114705071B (zh) * 2022-05-13 2022-09-09 华为技术有限公司 移动终端、均温板和均温板的制作方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002062067A (ja) * 2000-08-21 2002-02-28 Fujikura Ltd 平板型ヒートパイプ
JP2004238672A (ja) * 2003-02-05 2004-08-26 Fujikura Ltd 平板型ヒートパイプの製造方法
CN201715908U (zh) * 2010-06-07 2011-01-19 锘威科技(深圳)有限公司 一体式烧结型平板热管
JP2013053837A (ja) * 2011-09-06 2013-03-21 Kiko Kagi Kofun Yugenkoshi 板型ヒートパイプの構造
CN103398613A (zh) * 2013-07-22 2013-11-20 施金城 均热板及其制造方法
CN203454875U (zh) * 2013-07-22 2014-02-26 施金城 均热板
CN204478896U (zh) * 2015-01-14 2015-07-15 厦门大学 一种具有嵌套式多孔吸液芯的平板热管
CN106813525A (zh) * 2017-02-08 2017-06-09 锘威科技(深圳)有限公司 一种平板热管结构及其制造方法
CN107764117A (zh) * 2017-10-27 2018-03-06 南京航空航天大学 一种基于碳纳米管阵列的吸液芯支撑柱一体结构平板热管
JP2018204841A (ja) * 2017-06-01 2018-12-27 古河電気工業株式会社 平面型ヒートパイプ
US20190271510A1 (en) * 2011-10-17 2019-09-05 Asia Vital Components Co., Ltd. Manufacturing method of vapor chamber
CN110567304A (zh) * 2019-10-15 2019-12-13 联德精密材料(中国)股份有限公司 薄型毛细结构支撑均温板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202182665U (zh) * 2011-07-04 2012-04-04 昆山巨仲电子有限公司 具有受热凸部的均温板结构
TWI641795B (zh) * 2015-07-27 2018-11-21 英商極致科技股份有限公司 Plate temperature equalization device
CN211451989U (zh) * 2019-10-15 2020-09-08 昆山联德电子科技有限公司 薄型毛细结构支撑均温板

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002062067A (ja) * 2000-08-21 2002-02-28 Fujikura Ltd 平板型ヒートパイプ
JP2004238672A (ja) * 2003-02-05 2004-08-26 Fujikura Ltd 平板型ヒートパイプの製造方法
CN201715908U (zh) * 2010-06-07 2011-01-19 锘威科技(深圳)有限公司 一体式烧结型平板热管
JP2013053837A (ja) * 2011-09-06 2013-03-21 Kiko Kagi Kofun Yugenkoshi 板型ヒートパイプの構造
US20190271510A1 (en) * 2011-10-17 2019-09-05 Asia Vital Components Co., Ltd. Manufacturing method of vapor chamber
CN103398613A (zh) * 2013-07-22 2013-11-20 施金城 均热板及其制造方法
CN203454875U (zh) * 2013-07-22 2014-02-26 施金城 均热板
CN204478896U (zh) * 2015-01-14 2015-07-15 厦门大学 一种具有嵌套式多孔吸液芯的平板热管
CN106813525A (zh) * 2017-02-08 2017-06-09 锘威科技(深圳)有限公司 一种平板热管结构及其制造方法
JP2018204841A (ja) * 2017-06-01 2018-12-27 古河電気工業株式会社 平面型ヒートパイプ
CN107764117A (zh) * 2017-10-27 2018-03-06 南京航空航天大学 一种基于碳纳米管阵列的吸液芯支撑柱一体结构平板热管
CN110567304A (zh) * 2019-10-15 2019-12-13 联德精密材料(中国)股份有限公司 薄型毛细结构支撑均温板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113747758A (zh) * 2021-08-24 2021-12-03 苏州浪潮智能科技有限公司 一种电子设备及其散热装置

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