WO2022254908A1 - 伸縮性実装基板 - Google Patents

伸縮性実装基板 Download PDF

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Publication number
WO2022254908A1
WO2022254908A1 PCT/JP2022/014498 JP2022014498W WO2022254908A1 WO 2022254908 A1 WO2022254908 A1 WO 2022254908A1 JP 2022014498 W JP2022014498 W JP 2022014498W WO 2022254908 A1 WO2022254908 A1 WO 2022254908A1
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WO
WIPO (PCT)
Prior art keywords
stretchable
electrode
wiring
module
elastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/014498
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English (en)
French (fr)
Japanese (ja)
Inventor
匡彦 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2022551319A priority Critical patent/JP7450742B2/ja
Priority to CN202290000156.8U priority patent/CN219718608U/zh
Priority to US17/978,357 priority patent/US12363823B2/en
Publication of WO2022254908A1 publication Critical patent/WO2022254908A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/263—Bioelectric electrodes therefor characterised by the electrode materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • the present invention relates to elastic mounting substrates.
  • Such devices include devices comprising a stretchable base material and electronic components mounted on the stretchable base material.
  • Such a device is also called a stretchable substrate, and is placed in close contact with the living body by expansion and contraction of the stretchable base material, and can follow the movement of the living body.
  • the above equipment is also proposed to be used to heal the body and speed up natural recovery by irradiating the body with electromagnetic waves or passing minute currents through the body.
  • Patent Literature 1 discloses a stretchable substrate comprising a substrate made of a material having stretchability (also referred to as a stretchable substrate) and islands made of a material having a Young's modulus larger than that of the substrate. is embedded in a substrate to form an element (also called an electronic component) on the island.
  • the stretchable base material that comes into direct contact with the living body is sometimes disposable in consideration of hygiene, so it is required to reduce the manufacturing cost.
  • the elastic wires are routed around the electronic parts, it is likely that the elastic wires need to cross each other. In places where the elastic wirings intersect each other, it is necessary to provide an insulating layer for insulation between the vertically overlapping elastic wirings, and there is a problem that the flexibility of the elastic wiring board is reduced. rice field.
  • stretchable wires are less conductive than regular metal wires. Therefore, in order to suppress an increase in the wiring resistance of the entire elastic wiring board, it is required to shorten the wiring length of the elastic wiring as much as possible.
  • FIG. 1 is a top view schematically showing an example of a conventional stretchable mounting board.
  • the present invention has been made to solve the above-described problems, and an elastic mounting board that can improve the mounting density of electronic components and reduce the manufacturing cost while maintaining the flexibility of the entire elastic mounting board.
  • An object of the present invention is to provide a flexible mounting board.
  • a stretchable mounting board of the present invention is a stretchable mounting board comprising a stretchable wiring board and a module mounted on the surface of the stretchable wiring board, wherein the stretchable wiring board comprises a stretchable base material. and stretchable wiring arranged on the stretchable substrate, the module comprising: a multilayer substrate; a plurality of electronic components mounted on a main surface of the multilayer substrate; a plurality of first electrodes and second electrodes provided and electrically connected to the elastic wiring substrate; and internal wiring electrically connecting the first electrodes and the second electrodes inside the multilayer substrate. and the module includes a first electrode placement region in which a plurality of the first electrodes are concentratedly arranged, and a second electrode placement region in which a plurality of the second electrodes are concentratedly arranged.
  • the module has a two-electrode arrangement region, the module has a node electrode pair consisting of an internal wiring and the first electrode and the second electrode electrically connected by the internal wiring, and the node electrode pair and the elastic wiring arranged on the elastic substrate intersect when the elastic wiring substrate is viewed from above.
  • FIG. 1 is a top view schematically showing an example of a conventional stretchable mounting board.
  • FIG. 2 is a perspective view schematically showing an example of the stretchable mounting substrate of the present invention.
  • FIG. 3 is a perspective view schematically showing another example of the stretchable mounting substrate of the present invention.
  • 4 is a perspective view of the module shown in FIGS. 2 and 3;
  • FIG. 5 is a see-through top view enlarging the area where the module of the elastic mounting substrate shown in FIGS. 2 and 3 is mounted.
  • FIG. 6 is a perspective view schematically showing another example of a module that constitutes the stretchable mounting substrate of the present invention.
  • FIG. 7 is a transparent top view schematically showing an example of a state in which the module shown in FIG. 6 is mounted on an elastic wiring board.
  • FIG. 8 is a cross-sectional view schematically showing an example of a double-sided mounting module.
  • the elastic mounting substrate of the present invention will be described below. It should be noted that the present invention is not limited to the following configurations, and may be modified as appropriate without departing from the gist of the present invention.
  • the present invention also includes a combination of a plurality of individual preferred configurations described below.
  • FIG. 2 is a perspective view schematically showing an example of the stretchable mounting substrate of the present invention.
  • the elastic mounting board 1 includes an elastic wiring board 10 and a module 100 .
  • the stretchable wiring board 10 includes a stretchable base material 11 and stretchable wiring 13 arranged on the stretchable base material 11 .
  • the stretchable base material 11 is made of, for example, a stretchable resin material.
  • the resin material include thermoplastic polyurethane and the like.
  • the thickness of the stretchable base material 11 is not particularly limited, it is preferably 100 ⁇ m or less, more preferably 1 ⁇ m or less, from the viewpoint of not inhibiting the stretching of the surface of the living body when attached to the living body. Moreover, the thickness of the stretchable base material 11 is preferably 0.1 ⁇ m or more.
  • the elastic wiring 13 preferably contains conductive particles and resin.
  • a mixture of metal powder such as Ag, Cu, and Ni as conductive particles and elastomeric resin such as silicone resin can be used.
  • the average particle size of the conductive particles is not particularly limited, it is preferably 0.01 ⁇ m or more and 10 ⁇ m or less.
  • the thickness of the elastic wiring 13 is not particularly limited, it is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less. Moreover, the thickness of the elastic wiring is preferably 0.01 ⁇ m or more.
  • the line width of the elastic wiring 13 is not particularly limited, it is preferably 0.1 ⁇ m or more, and more preferably 10 mm or less.
  • the minimum line width of the stretchable wiring 13 refers to the line width of the shortest portion of the stretchable wiring 13 arranged on the stretchable base material 11 .
  • the stretchable wiring does not cross over the stretchable base material.
  • the stretchable wiring 13 does not cross over the stretchable base material 11 .
  • the circuit becomes more complicated as the number of electronic components mounted on the stretchable substrate increases.
  • it is likely to be necessary to form a cross wiring by crossing the stretchable wirings on the stretchable base material.
  • forming the cross wiring causes a problem that flexibility of the elastic mounting board is reduced in the area where the cross wiring is formed.
  • it is necessary to add a manufacturing process. For example, it is necessary to provide an insulating layer on the lower elastic wiring, and then provide the elastic wiring further thereon. Such complication of the manufacturing process undesirably increases the manufacturing cost.
  • a total of three cross wirings are generated in the region indicated by X and the region indicated by Y.
  • a step of forming the stretchable wiring 513 on the stretchable base material 511 a step of forming an insulating layer and a stretchable wiring layer as an upper layer are performed.
  • a process of forming wiring is required. If the stretchable wiring does not cross over the stretchable base material, the manufacturing process for providing the cross wiring on the stretchable mounting board is not required, and the manufacturing cost can be reduced. In addition, it is possible to prevent the flexibility of the elastic wiring board from being lowered due to the formation of the cross wiring.
  • Electrodes 30 (30a, 30b, 30c, 30d, 30e) and electrodes 40 (40a, 40b, 40c, 40d, 40e) are provided on the surface of the elastic wiring board 10 for electrical connection with electronic components described later. is provided. These electrodes are connected to elastic wires 13 arranged on the elastic base material 11 .
  • the electrode preferably contains conductive particles and resin.
  • the conductive particles and resin the same materials as those for the stretchable wiring 13 can be preferably used.
  • An electronic component may be mounted on the stretchable wiring board.
  • an electronic component 120 is mounted on the stretchable wiring board 10 shown in FIG.
  • the electronic component mounted on the stretchable wiring board is preferably an electronic component that acquires biometric data or an electronic component that irradiates electromagnetic waves.
  • Electronic components that acquire biological data include, for example, acceleration sensors, temperature sensors, oxygen saturation sensors, and moisture sensors.
  • a coil component is an example of an electronic component that irradiates a living body with electromagnetic waves.
  • Electronic components mounted on the stretchable wiring board may be covered with a sealing resin or the like.
  • a sealing resin When the electronic component is covered with the sealing resin, it is possible to prevent the electronic component from deteriorating in characteristics due to the influence of moisture.
  • FIG. 3 is a perspective view schematically showing another example of the stretchable mounting substrate of the present invention.
  • the elastic mounting board 2 shown in FIG. 3 is the same as the elastic mounting board 1 shown in FIG. 2 except that the electronic components and modules mounted on the elastic mounting board 10 are sealed with a sealing resin 170. is.
  • the electronic component 122 mounted on the stretchable wiring board 10 is sealed with a sealing resin 170 .
  • a module mounted on the elastic wiring board may be covered with a sealing resin or the like.
  • the sealing resin it is possible to prevent the characteristics of the module and the electronic components mounted in the module from deteriorating due to the influence of moisture.
  • the module 100 mounted on the stretchable wiring board 10 is covered with the sealing resin 170 .
  • the sealing resin is usually formed so as to cover an area larger than the electronic component in consideration of errors in the manufacturing process.
  • the encapsulating resin does not have flexibility like the stretchable base material. Therefore, as the number of electronic components increases, the ratio of the resin covering the surface of the stretchable substrate increases, and the flexibility of the stretchable substrate tends to decrease. This problem becomes particularly conspicuous when the mounting density of electronic components increases to such an extent that the sealing resins covering the electronic components come into contact with each other. That is, when sealing electronic components with a sealing resin, there is a problem that the flexibility of the stretchable substrate is reduced as the mounting density of the electronic components is increased.
  • the elastic wiring board of the present invention can reduce the number of electronic components directly mounted on the elastic wiring board by using a module. While protecting the components from the effects of moisture, it is possible to improve the mounting density of the electronic components and suppress the reduction in the flexibility of the stretchable wiring board.
  • sealing resins examples include epoxy resins, acrylic resins, and silicone resins.
  • the stretchable mounting substrate of the present invention preferably has a flat portion.
  • the upper surface of the electronic component 122 is flat. Therefore, it can be said that the elastic mounting substrate 1 has a flat portion.
  • the stretchable mounting board has a flat portion, it can be used as a suction portion when using a mounting machine or the like when handling the stretchable mounting board.
  • the top surface of the sealing resin is flat, it can be used as a suction part when using a mounting machine. become a department.
  • the top surface of the sealing resin 170 that seals the module 100 and the top surface of the sealing resin 170 that seals the electronic component 122 are flat. Therefore, it can be said that the elastic mounting substrate 2 has a flat portion.
  • FIG. 4 is a perspective view of the module shown in FIGS. 2 and 3; FIG. A module 100 shown in FIG. , 130c, 130d, 130e) and second electrodes 140 (140a, 140b, 140c, 140d, 140e), and internal wiring for electrically connecting the first electrodes and the second electrodes inside the multilayer substrate. .
  • the number of the electronic components 120 mounted on the main surface of the multilayer substrate 110 is nine.
  • a region (region A 1 indicated by a broken line in FIG. 4) where the plurality of first electrodes 130 (130a, 130b, 130c, 130d, 130e ) are concentrated is the first electrode placement region A1 .
  • a region where the plurality of second electrodes 140 (140a, 140b, 140c, 140d, 140e) are arranged intensively is the second electrode arrangement region B 1 .
  • the two electrodes connected by the internal wiring form a node electrode pair. an electrode.
  • a node electrode pair will be described later.
  • the first electrode placement area A1 is located on one side 100a when the module is viewed from above, and the second electrode placement area B1 faces the side 100a on which the first electrode placement area A1 is placed. It is located on side 100b.
  • the electrodes placed in the first electrode placement area A1 and the second electrode placement area B 1 can be lengthened.
  • the first electrode arrangement area is located on one side of the module in plan view, and the first electrode arrangement area is arranged in the second electrode arrangement area. It is preferably located on the side opposite to the side.
  • a plurality of electronic components are mounted on the module.
  • Electronic components mounted on a multilayer substrate include amplifiers (operational amplifiers, transistors, etc.), chip capacitors, chip resistors, and the like.
  • the form in which the electronic component is mounted is not particularly limited, and may be mounted as a bare chip, ball grid array (BGA), chip scale package (CSP), surface mount component (SMD), or the like.
  • the stretchable mounting board of the present invention includes a module on which a plurality of electronic components are mounted, it is possible to reduce the number of electronic components directly mounted on the stretchable wiring board.
  • the multilayer substrate that makes up the module is made up of multiple insulating layers.
  • the number of insulating layers laminated in the multilayer substrate is not particularly limited, but is preferably four or more.
  • the number of lamination of the insulating layers of the multilayer substrate constituting the module is preferably larger than the number of lamination of the elastic base material constituting the elastic wiring substrate.
  • Materials for the insulating layer include resins such as phenolic resins, epoxy resins, polyimide resins, bismaleimide triazine resins, fluorine resins, polyphenylene oxide resins, and low-temperature sintering ceramic materials.
  • the resin constituting the insulating layer may be impregnated into a base material made of paper or glass fiber.
  • a low-temperature sintering ceramic material is a ceramic material that can be sintered at a firing temperature of 1000° C. or less and can be co-fired with silver or copper, which are preferably used as metal materials for internal wiring. means.
  • the low-temperature sintering ceramic material preferably includes SiO 2 —CaO—Al 2 O 3 —B 2 O 3 -based glass ceramic or SiO 2 —MgO—Al 2 O 3 —B 2 O 3 -based glass ceramic.
  • the multilayer board has internal wiring.
  • the internal wiring electrically connects a plurality of electrodes provided on the main surface of the multilayer substrate inside the multilayer substrate.
  • the internal wiring may connect the first electrode and the second electrode provided on the multilayer substrate, or may connect the first electrode or the second electrode provided on the multilayer substrate and the electronic component mounted on the multilayer substrate. may be connected to each other, or a plurality of electronic components mounted on a multilayer substrate may be connected to each other.
  • Materials that make up the internal wiring include copper, silver, tin, nickel, gold, and alloys thereof.
  • FIG. 5 is a see-through top view enlarging the area where the module of the elastic mounting substrate shown in FIGS. 2 and 3 is mounted.
  • the module shown in FIG. 4 is mounted on an elastic wiring board provided with electrodes 30 (30a, 30b, 30c, 30d, 30e) and electrodes 40 (40a, 40b, 40c, 40d, 40e). ing.
  • a rectangular shape indicated by a two-dot chain line indicates the position of the module 100 mounted on the elastic wiring board 10 .
  • the multilayer substrate 110 forming the module 100 has internal wiring 150a and internal wiring 150b.
  • the stretchable mounting substrate of the present invention it can be said that part of the stretchable wiring originally arranged on the stretchable base material is mounted as internal wiring within the module.
  • the internal wiring 150a electrically connects the first electrode 130a and the second electrode 140d.
  • the first electrode 130a and the second electrode 140d connected by the internal wiring 150a have the same potential.
  • the internal wiring 150b electrically connects the first electrode 130b and the second electrode 140a.
  • the first electrode 130b and the second electrode 140a connected by the internal wiring 150b have the same potential.
  • first electrode 130a and the second electrode 140d form a node electrode pair
  • first electrode 130b and the second electrode 140a form a node electrode pair
  • the module 100 has two node electrode pairs.
  • the two electrodes (the first electrode 130a and the second electrode 140d, and the first electrode 130b and the second electrode 140a) constituting the node electrode pair are arranged in the first electrode arrangement area A1 and the second electrode arrangement area B1. are provided separately. In other words, the two electrodes that make up the node electrode pair are not placed in the same electrode placement area.
  • the internal wiring forming the node electrode pair and the stretchable wiring arranged on the stretchable base material cross each other when the stretchable mounting substrate is viewed from above.
  • the internal wiring 150a and the internal wiring 150b cross the elastic wiring 13 connected to the electrode 30d and the elastic wiring 13 connected to the electrodes 40c and 40e, respectively. ing.
  • the configuration of the internal wiring described above can be said to be an example in which the elastic wirings cross each other when the elastic wirings are used instead of the internal wirings formed in the module. Therefore, it can be said that the stretchable mounting board of the present invention has a configuration that can avoid the arrangement of stretchable wirings that would result in cross wirings being formed on the stretchable base material. Therefore, it is possible to suppress a decrease in flexibility of the stretchable mounting substrate and an increase in manufacturing cost due to the formation of the cross wiring.
  • internal wirings forming pairs of node electrodes intersect with each other in plan view inside the multilayer substrate when the module is viewed in plan view.
  • an internal wiring 150a forming a node electrode pair and an internal wiring 150b forming another node electrode pair intersect when the module 100 is viewed from above.
  • the internal wiring 150a and the internal wiring 150b are located in different layers of the multilayer substrate. Therefore, even if the internal wiring 150a and the internal wiring 150b intersect in plan view, the internal wiring 150a and the internal wiring 150b are not in electrical contact.
  • the line width of the internal wiring 150a and the internal wiring 150b provided in the module 100 is the minimum line width of the elastic wiring 13 (the length indicated by the double arrow w2 in FIG. 5). length indicated by ).
  • the minimum line width of the internal wiring is preferably shorter than the minimum line width of the stretchable wiring. If the minimum line width of the internal wiring is shorter than the minimum line width of the elastic wiring, the wiring density of the module can be made higher than the wiring density of the elastic substrate, which contributes to the miniaturization of the elastic mounting substrate. do.
  • the minimum line width of the internal wiring is not particularly limited, it is preferably 100 ⁇ m or less, for example.
  • the shortest distance between the first electrode arranged in the first electrode arrangement area A1 and the second electrode arranged in the second electrode arrangement area B1 is the length indicated by the double arrow L1 .
  • This length L 1 is preferably longer than the minimum line width w 2 of the elastic wiring 13 arranged on the elastic substrate 11 . That is, it is preferable that the shortest distance between the first electrode and the second electrode forming the node electrode pair is longer than the minimum line width of the elastic wiring.
  • the length L1 is longer than the length w2 , there is an elastic gap between the first electrode arranged in the first electrode arrangement area A1 and the second electrode arranged in the second electrode arrangement area B1 . It can be said that there is a gap through which the wiring 13 can pass. Therefore, it is possible to provide the elastic wiring 13 between the elastic wiring board 10 and the module 100 so as to cross the module 100 in plan view.
  • the minimum interval between elastic wirings is the minimum interval at which patterns can be formed so as not to interfere with each other when two elastic wirings are arranged in parallel.
  • the minimum spacing of the stretchable wirings is appropriately determined according to the material constituting the stretchable wiring, the material constituting the stretchable base material, the voltage of the power source connected to the stretchable mounting board, and the like.
  • the minimum spacing of the stretchable wiring is, for example, preferably 300 ⁇ m or less, more preferably 200 ⁇ m or less.
  • the length L1 is preferably greater than the sum of the minimum line width of the elastic wiring and twice the minimum spacing of the elastic wiring. If the length L1 is greater than the sum of the minimum line width of the elastic wiring and the double value of the minimum spacing of the elastic wiring, then the length L1 between the electrodes is placed between the elastic wiring board and the module. It is possible to form a pattern in which one stretchable wire having a minimum line width passing through the halving point is arranged so as not to interfere with the electrodes.
  • the shortest distance between the first electrode and the second electrode constituting the node electrode pair is twice the minimum line width of the stretchable wiring and the minimum spacing of the stretchable wiring. Preferably greater than the sum of the values.
  • the length L1 is preferably larger than the sum of two times the minimum line width of the elastic wiring and three times the minimum spacing of the elastic wiring. If the length L1 is greater than the sum of two times the minimum line width of the elastic wiring and three times the minimum spacing of the elastic wiring, there will be no gap between the elastic wiring board and the module between the electrodes. It is possible to form a pattern in which two elastic wirings with the minimum line width passing through two points that divide the length L1 into three equal parts are arranged so as not to interfere with adjacent electrodes and adjacent elastic wirings.
  • the length L1 is preferably greater than the sum of three times the minimum line width of the elastic wiring and four times the minimum spacing of the elastic wiring. If the length L1 is greater than the sum of 3 times the minimum line width of the elastic wiring and 4 times the minimum spacing of the elastic wiring, there is no gap between the elastic wiring board and the module between the electrodes It is possible to form a pattern in which three stretchable wirings with a minimum line width passing through three points that divide the length L1 into quarters are arranged so as not to interfere with adjacent electrodes and/or adjacent stretchable wirings. can.
  • all the electrodes are arranged on the side 100a and the side 100b of the module 100.
  • the electrodes may be arranged away from the sides of the module.
  • FIG. 6 is a perspective view schematically showing another example of a module that constitutes the stretchable mounting board of the present invention.
  • Module 102 shown in FIG. 6 corresponds to module 100 shown in FIG. 4 in which electrodes 130f, 130g, 140f, and 140g are further provided on the main surface on which electronic components are not mounted. That is, the module 102 shown in FIG. 6 is upside down from the module 100 shown in FIG.
  • the electrode 130f, the electrode 130g, the electrode 140f, and the electrode 140g are all electrodes provided at positions away from the sides of the module.
  • the electrode provided in the module when determining to which of the first electrode arrangement region and the second electrode arrangement region the electrode provided in the module belongs, if the electrode constitutes a node electrode pair, the internal wiring It shall belong to an electrode placement region different from the electrode placement region in which the paired electrodes connected by are placed. On the other hand, if the electrode provided in the module is not an electrode forming a node electrode pair, it belongs to the electrode arrangement area where the electrode arranged closest in plan view is arranged.
  • the electrodes 130a, 130b, 130c, 130d and 130e belong to the first electrode placement area A2 .
  • the electrodes 140a, 140b, 140c, 140d and 140e belong to the second electrode arrangement region B2 . That is, electrodes 130a, 130b, 130c, 130d and 130e are first electrodes, and electrodes 140a, 140b, 140c, 140d and 140e are second electrodes.
  • the electrode closest to the electrode 130f is the first electrode 130b. Since the first electrode 130b belongs to the first electrode arrangement area A2 , the electrode 130f also belongs to the first electrode arrangement area A2 . That is, the electrode 130f is the first electrode.
  • the electrode closest to the electrode 130g is the first electrode 130d. Since the first electrode 130d belongs to the first electrode placement area A2 , the electrode 130g also belongs to the first electrode placement area A2 . That is, the electrode 130g is the first electrode.
  • the electrode closest to the electrode 140f is the second electrode 140b. Since the second electrode 140b belongs to the second electrode arrangement region B2 , the electrode 140f also belongs to the second electrode arrangement region B2 . That is, the electrode 140f is the second electrode.
  • the electrode closest to the electrode 140g is the second electrode 140d. Since the second electrode 140d belongs to the second electrode placement region B2 , the electrode 140g also belongs to the second electrode placement region B2 . That is, the electrode 140g is the second electrode.
  • first electrodes 130a, 130b, 130c, 130d, 130e, 130f, and 130g are arranged in the first electrode arrangement area A2 .
  • second electrodes 140a, 140b, 140c, 140d, 140e, 140f, and 140g are arranged in the second electrode arrangement region B2 .
  • FIG. 7 is a transparent top view schematically showing an example of a state in which the module shown in FIG. 6 is mounted on an elastic wiring board.
  • the elastic wirings provided on the elastic mounting substrate only the elastic wirings that are not electrically connected to the electrodes constituting the module are illustrated, and the other elastic wirings are omitted. .
  • FIG. 7 on an elastic wiring board provided with electrodes 30 (30a, 30b, 30c, 30d, 30e, 30f, 30g) and electrodes 40 (40a, 40b, 40c, 40d, 40e, 40f, 40g),
  • the module shown in FIG. 6 is installed.
  • a rectangular shape indicated by a two-dot chain line indicates the position of the module 102 mounted on the elastic wiring board.
  • the multilayer substrate forming the module 102 has internal wirings 150c and 150d.
  • the internal wiring 150c electrically connects the first electrode 130f and the second electrode 140g.
  • the first electrode 130f and the second electrode 140g connected by the internal wiring 150c have the same potential.
  • the internal wiring 150d electrically connects the first electrode 130g and the second electrode 140f.
  • the first electrode 130g and the second electrode 140f connected by the internal wiring 150d have the same potential. Accordingly, the first electrode 130f and the second electrode 140g are a node electrode pair, and the first electrode 130g and the second electrode 140f are a node electrode pair.
  • module 102 has two node electrode pairs.
  • FIG. 7 shows elastic wiring 13 that traverses module 102 in the longitudinal direction of the drawing.
  • the shortest distance between the first electrode arranged in the first electrode arrangement area A2 and the second electrode arranged in the second electrode arrangement area B2 (the length indicated by the double arrow L2 in FIG. 7) is longer than the minimum line width w 2 of the elastic wiring 13 . Therefore, it is possible to provide the elastic wiring 13 between the elastic wiring board 10 and the module 102 so as to cross the module 102 in plan view.
  • the module used for the stretchable mounting board of the present invention may be a double-sided mounting module in which electronic components are mounted on both main surfaces of the multilayer board. If the module is a double-sided module, the number of electronic components and wiring that can be mounted in the same area can be increased, so the module can be miniaturized.
  • FIG. 8 is a cross-sectional view schematically showing an example of a double-sided mounting module.
  • double-sided mounting module 200 shown in FIG. 8 electronic component 220a, electronic component 220b, and electronic component 220c are mounted on one main surface 210a of multilayer substrate 210, and the other main surface 210b is the main surface opposite to one main surface 210a.
  • An electronic component 220d is mounted on the .
  • the other main surface 210b is provided with terminals 230 in addition to the electronic component 220d.
  • the double-sided mounting module 200 is sealed with a sealing resin 170 .
  • the stretchable mounting board of the present invention can be obtained, for example, by a process of preparing a stretchable wiring board, a process of preparing a module, and a process of mounting the module on the stretchable wiring board.

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PCT/JP2022/014498 2021-06-03 2022-03-25 伸縮性実装基板 Ceased WO2022254908A1 (ja)

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JP2022551319A JP7450742B2 (ja) 2021-06-03 2022-03-25 伸縮性実装基板
CN202290000156.8U CN219718608U (zh) 2021-06-03 2022-03-25 伸缩性安装基板
US17/978,357 US12363823B2 (en) 2021-06-03 2022-11-01 Stretchable mounting substrate

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JP2021093823 2021-06-03

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750462A (ja) * 1993-08-03 1995-02-21 Nippon Cement Co Ltd 電子回路基板
JP2004303944A (ja) * 2003-03-31 2004-10-28 Matsushita Electric Ind Co Ltd モジュール基板及びその製造方法
JP2017147379A (ja) * 2016-02-19 2017-08-24 パナソニックＩｐマネジメント株式会社 表面実装ジャンパー基板

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JP6323982B2 (ja) 2013-02-26 2018-05-16 株式会社フジクラ 伸縮性基板を備える電子部品及びその製造方法
WO2019065668A1 (ja) * 2017-09-29 2019-04-04 株式会社村田製作所 高周波モジュールおよび通信装置
WO2020153044A1 (ja) * 2019-01-21 2020-07-30 株式会社村田製作所 伸縮性配線基板
JP7331423B2 (ja) * 2019-04-08 2023-08-23 大日本印刷株式会社 配線基板及び配線基板の製造方法
WO2022113662A1 (ja) * 2020-11-25 2022-06-02 株式会社村田製作所 伸縮性配線基板及び生体貼り付けデバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750462A (ja) * 1993-08-03 1995-02-21 Nippon Cement Co Ltd 電子回路基板
JP2004303944A (ja) * 2003-03-31 2004-10-28 Matsushita Electric Ind Co Ltd モジュール基板及びその製造方法
JP2017147379A (ja) * 2016-02-19 2017-08-24 パナソニックＩｐマネジメント株式会社 表面実装ジャンパー基板

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US20230048568A1 (en) 2023-02-16
US12363823B2 (en) 2025-07-15

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