WO2022252504A1 - 一种氧化锆增韧氧化铝陶瓷板及其制备方法 - Google Patents
一种氧化锆增韧氧化铝陶瓷板及其制备方法 Download PDFInfo
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- WO2022252504A1 WO2022252504A1 PCT/CN2021/130571 CN2021130571W WO2022252504A1 WO 2022252504 A1 WO2022252504 A1 WO 2022252504A1 CN 2021130571 W CN2021130571 W CN 2021130571W WO 2022252504 A1 WO2022252504 A1 WO 2022252504A1
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- zirconia
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- ceramic plate
- toughened alumina
- alumina ceramic
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- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 title claims abstract description 192
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims abstract description 83
- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000000919 ceramic Substances 0.000 claims abstract description 45
- 238000005245 sintering Methods 0.000 claims abstract description 37
- 238000005266 casting Methods 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000000843 powder Substances 0.000 claims abstract description 17
- 239000011230 binding agent Substances 0.000 claims abstract description 13
- 239000002270 dispersing agent Substances 0.000 claims abstract description 13
- 239000002131 composite material Substances 0.000 claims abstract description 12
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 239000003960 organic solvent Substances 0.000 claims abstract description 8
- 239000004014 plasticizer Substances 0.000 claims abstract description 8
- 239000002002 slurry Substances 0.000 claims description 36
- 239000010410 layer Substances 0.000 claims description 33
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 21
- 238000002360 preparation method Methods 0.000 claims description 20
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 13
- 238000009694 cold isostatic pressing Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 11
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 7
- BAECOWNUKCLBPZ-HIUWNOOHSA-N Triolein Natural products O([C@H](OCC(=O)CCCCCCC/C=C\CCCCCCCC)COC(=O)CCCCCCC/C=C\CCCCCCCC)C(=O)CCCCCCC/C=C\CCCCCCCC BAECOWNUKCLBPZ-HIUWNOOHSA-N 0.000 claims description 7
- PHYFQTYBJUILEZ-UHFFFAOYSA-N Trioleoylglycerol Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC(OC(=O)CCCCCCCC=CCCCCCCCC)COC(=O)CCCCCCCC=CCCCCCCCC PHYFQTYBJUILEZ-UHFFFAOYSA-N 0.000 claims description 7
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 7
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 7
- PHYFQTYBJUILEZ-IUPFWZBJSA-N triolein Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CCCCCCCC)COC(=O)CCCCCCC\C=C/CCCCCCCC PHYFQTYBJUILEZ-IUPFWZBJSA-N 0.000 claims description 7
- 229940117972 triolein Drugs 0.000 claims description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- 238000000498 ball milling Methods 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 6
- 238000010345 tape casting Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- UCVPKAZCQPRWAY-UHFFFAOYSA-N dibenzyl benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC=2C=CC=CC=2)C=1C(=O)OCC1=CC=CC=C1 UCVPKAZCQPRWAY-UHFFFAOYSA-N 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- -1 polyethylene Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 229920001290 polyvinyl ester Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052802 copper Inorganic materials 0.000 abstract description 10
- 239000010949 copper Substances 0.000 abstract description 10
- 238000003475 lamination Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 5
- 230000007704 transition Effects 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract description 3
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 2
- 238000005253 cladding Methods 0.000 abstract 1
- 238000004321 preservation Methods 0.000 description 28
- 238000001035 drying Methods 0.000 description 19
- 239000011812 mixed powder Substances 0.000 description 16
- 235000015895 biscuits Nutrition 0.000 description 15
- 238000010586 diagram Methods 0.000 description 13
- 238000000227 grinding Methods 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 239000005416 organic matter Substances 0.000 description 10
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 7
- 238000002156 mixing Methods 0.000 description 5
- 239000008029 phthalate plasticizer Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 239000002245 particle Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 102000011759 adducin Human genes 0.000 description 1
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- 229910003460 diamond Inorganic materials 0.000 description 1
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
- C04B35/111—Fine ceramics
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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Definitions
- the invention relates to the technical field of ceramic materials, in particular to a zirconia toughened alumina ceramic plate and a preparation method thereof.
- Layered ceramic composites consist of alternating layers of whisker or particle reinforcement. This composite material allows the combination of two strengthening mechanisms, the first acting at the microstructural scale, at the interlayer, through the grain structure-induced stress transition; the second acting at the macroscopic scale, at the interlayer interface, through the grain Whisker structure-induced stress transitions.
- first acting at the microstructural scale, at the interlayer through the grain structure-induced stress transition
- second acting at the macroscopic scale at the interlayer interface
- grain Whisker structure-induced stress transitions due to the difference in thermal expansion between different component layers, residual stress is generated during the cooling process of sintering temperature, and it is also easy to cause problems such as delamination, bulging, and cracking of ceramic sintered plates, which affect the mechanical properties of ceramic substrates.
- the adhesion of copper lines on the substrate is also a problem at present, based on the poor wettability and poor adhesion of copper metal and zirconia, which is due to the thermal expansion coefficient of zirconia (11.4x10 -6 ), The large tolerance of expansion coefficient with copper metal makes it difficult to cover the circuit, and the covered circuit is often disconnected; in addition, the thermal conductivity of the working layer of the substrate in direct contact has a great influence on the heat dissipation of the circuit.
- the present invention proposes the following technical solutions:
- the present invention provides a zirconia toughened alumina ceramic plate, which consists of the following components in parts by weight:
- alumina powder 50-99.5 parts of alumina powder, 0-45 parts of zirconia, 0-20 parts of sintering aid, 30-60 parts of organic solvent; 0.5-5 parts of dispersant, 0.5-20 parts of binder and plasticizer share.
- the organic solvent is at least one of butyl acetate, ethyl acetate, and absolute ethanol.
- the dispersant is at least one of triolein, polyvinyl ester, and polyethylene;
- the binder is polyvinyl butyral, acrylate, polyvinyl alcohol at least one of;
- the plasticizer is at least one of dibutyl phthalate, dibenzyl phthalate, and glycerol.
- the zirconia toughened alumina ceramic plate has a layered structure, and the difference in zirconia content between adjacent layers is in the range of 0-22 parts.
- the zirconia content in the surface layer of the zirconia toughened alumina ceramic plate is 0-7 parts.
- the present invention provides a method for preparing a zirconia toughened alumina ceramic plate as described in the first aspect, the process steps are as follows:
- Cutting, stacking, and warm-pressing forming cutting the casting billet according to the preset size; cross-stacking the casting billets with different zirconia content to obtain a laminate, and then warm-pressing the laminate Molding, cold isostatic pressing at 180-250MPa, to obtain green substrate;
- step (1) is to add zirconia, alumina and sintering aids to absolute ethanol to form a mixed powder, and ultrasonically disperse for half an hour; put grinding balls, the ball-to-material ratio is 2:1, and ball mill After 8-10 hours, the premixed slurry is obtained; the ball milled slurry is put into a rotary evaporator, and dried at 70°C; after the powder is dried, it is sieved through a 100-mesh sieve to obtain a mixed prefabricated powder.
- Step (2) is to add organic solvent and dispersant to the mixed prefabricated powder, add grinding balls, the ball-to-material ratio is 2:1, perform ball milling for 8 hours once, then add plasticizer and binder, and conduct secondary ball milling for 8 hours ; Vacuum defoaming the ball-milled slurry for half an hour to obtain casting slurry.
- Step (4) is to cut the cast billet according to the preset size; cross-stack the cast billet with different zirconia content to obtain a laminated body, and then place the laminated body between two aluminum heating plates, the temperature 70-80°C, pressure greater than 10MPa, heat preservation and pressure-holding for half an hour; then cold isostatic pressing, pressure 180-250MPa, to obtain the green substrate.
- the difference in the amount of zirconia in adjacent cast billets is in the range of 0-22 parts.
- the zirconia content of the cast blank located on the surface layer is 0-7 parts.
- the zirconia-toughened alumina ceramic plate provided in the embodiment of the present invention has a layered structure, and the difference in the amount of zirconia between adjacent layers is in the range of 0-22 parts.
- two casting blanks with different zirconia content can be used for cross-stacking.
- 0 parts/21 parts, 3 parts/18 parts, 5 parts/16 parts can be used according to the zirconia content.
- Parts, 7 parts/15 parts, etc. are cross-stacked to obtain a laminated structure.
- the surface layer of the zirconia toughened alumina ceramic plate is designed as a high thermal conductivity layer with a low thermal expansion coefficient, specifically, the pure alumina ceramic layer or less doped Alumina ceramic layer with zirconia.
- step (4) the temperature for warm-pressing the laminated body is 50-80° C., and the pressure is greater than 10 MPa.
- step (5) the sintering temperature is 1300-1600°C.
- the cracks are repeatedly hindered by the alternating interlayer phase interface, and the crack deflects at the interface without causing the whole ceramic to break, which can significantly improve the strength of the ZTA ceramic.
- the working layer located on the surface layer can be designed as a low thermal expansion coefficient (8.5x10-6/°C), a high thermal conductivity material of pure alumina or alumina with a small amount of zirconia to improve the wetting of copper metal and the substrate Sex, improve adhesion; high thermal conductivity layer as the working layer, improve the overall thermal conductivity of the substrate.
- a low thermal expansion coefficient 8.5x10-6/°C
- a high thermal conductivity material of pure alumina or alumina with a small amount of zirconia to improve the wetting of copper metal and the substrate Sex, improve adhesion
- high thermal conductivity layer as the working layer improve the overall thermal conductivity of the substrate.
- the zirconia undergoes phase transformation and toughening, thereby significantly improving the strength, toughness and reliability of the alumina ceramics; and by adding sintering aids to reduce Sintering temperature, while promoting the densification of the sintered body.
- Fig. 2 is the fracture microstructure diagram of the sintered body of zirconia toughened alumina layered functionally graded ceramic plate in Example 6;
- Fig. 3 is the fracture microstructure diagram of the sintered body of zirconia toughened alumina layered functionally graded ceramic plate in Example 7;
- Fig. 4 is a SEM image of the bonding interface of the sintered body of the zirconia toughened alumina layered functionally graded ceramic plate in Example 6.
- the invention provides a zirconia toughened alumina ceramic plate, which contains Al 2 O 3 , MgO, CaO and CeO 2 . Its preparation method comprises the following steps:
- the cast biscuit obtained in step (3) is cut into pieces, and laminated according to the structure of Example 1 in the schematic diagram of the zirconia toughened alumina layered functionally gradient ceramic plate in Fig. 1 ; Place the laminated green body between two aluminum heating plates, the temperature is 70-80 ° C, the pressure is greater than 10 MPa, heat preservation and pressure for half an hour; then cold isostatic pressing, the pressure is 200 MPa, to obtain the green body substrate;
- the debinding temperature is 500° C., heat preservation for 1 hour, and remove organic matter; sintering temperature is 1550° C., heat preservation for 2 hours, to obtain an alumina ceramic substrate.
- step (3) the cast biscuit obtained in step (3) is cut into pieces, and laminated according to the structure of Example 2 in the schematic diagram of the zirconia toughened alumina layered functionally gradient ceramic plate in Fig. 1 ; Place the laminated green body between two aluminum heating plates, the temperature is 70-80 ° C, the pressure is greater than 10 MPa, heat preservation and pressure for half an hour; then cold isostatic pressing, the pressure is 200 MPa, to obtain the green body substrate;
- Debinding temperature is 500°C, heat preservation for 1 hour, to remove organic matter
- sintering temperature is 1550°C, heat preservation for 2 hours, to obtain zirconia toughened alumina ceramic substrate.
- the invention provides a zirconia toughened alumina ceramic plate, the preparation method of which comprises the following steps:
- step (3) the cast biscuit obtained in step (3) is cut into pieces, and laminated according to the example three structure in the schematic diagram of the zirconia toughened alumina layered functionally gradient ceramic plate in Fig. 1 ; Place the laminated green body between two aluminum heating plates, the temperature is 70-80 ° C, the pressure is greater than 10 MPa, heat preservation and pressure for half an hour; then cold isostatic pressing, the pressure is 200 MPa, to obtain the green body substrate;
- Debinding temperature is 500°C, heat preservation for 1 hour, to remove organic matter
- sintering temperature is 1550°C, heat preservation for 2 hours, to obtain zirconia toughened alumina ceramic substrate.
- the invention provides a zirconia toughened alumina ceramic plate, the preparation method of which comprises the following steps:
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Abstract
一种氧化锆增韧氧化铝陶瓷板及其制备方法,涉及陶瓷材料技术领域。该陶瓷板由以下重量份组分组成:氧化铝粉体50~99.5份,氧化锆0~45份、烧结助剂0~20份,有机溶剂30~60份;分散剂0.5~5份,粘结剂与增塑剂的混合物0.5~20份。通过控制叠层陶瓷复合材料由不同掺量的氧化锆增强的氧化铝及其叠层组成方式,提高陶瓷基板抗弯强度和热导率,同时使基板能够和亲电路工作层具有良好的相容性能;进一步地,通过流延叠层的方法,将工作层设计为亲电路的材料层,改善基板与电路之间的附着性,提高陶瓷基板与覆铜层电路结合强度,减少了传统基板在覆铜前要做一个过渡层处理工艺,提高生产效率,降低生产成本。
Description
本发明涉及陶瓷材料技术领域,尤其涉及一种氧化锆增韧氧化铝陶瓷板及其制备方法。
陶瓷基板作为电路板基材,在使用过程中对电子元器件进行承载与保护,同时电路运行产生的热量在放热冷却的过程中会产生一定的热应力,这就使得基板材料需要有一定的强度和热导率,才能保证在使用过程中不会因为热应力的存在缩短了整个电路板的使用寿命,提高电子元件的可靠性和稳定性。
一方面,即使是同一种材料,不同的层间结构也会受到应力的不同影响。层状陶瓷复合材料由晶须或颗粒增强的交替层组成。这种复合材料允许两种增强机制的结合,第一种作用于微观结构的尺度,在层间,通过颗粒结构诱导应力转变;第二种作用于宏观尺度,在层间的界面处,通过晶须结构诱导应力转变。在这些叠层结构中,由于不同成分层之间热膨胀的差异,在烧结温度冷却过程中产生残余应力,同时也容易造成陶瓷烧结板分层、鼓包、开裂等问题,影响陶瓷基板机械性能。
另一方面,铜线路在基板上的附着性目前也是一个问题,基于铜金属与氧化锆的润湿性比较差,粘附性比较差,这是由于氧化锆热膨胀系数(11.4x10
-6),与铜金属膨胀系数容差大,导致线路难以覆上,覆上的电路经常会断开;此外,直接接触的基板工作层的热导率对电路散热有很大影响。
因此,如何改善陶瓷基板的力学性能、提高热导率,以提高基板的可靠性,是本领域技术人员亟需解决的问题。
发明内容
本发明所要解决的技术问题是如何改善陶瓷基板的力学性能、提高热导率,以提高基板的可靠性。
本发明的首要目的在于提供一种颗粒增韧层状结构补强的氧化锆增韧氧化铝(ZTA)复合陶瓷板。另一目的在于提供上述层状结构的ZTA复合陶瓷板的制备方法,该方法采用流延成型方法,可以完成不同氧化锆掺杂的氧化铝坯体制备,并利用流延坯体厚度以及堆叠方式,使得制备出的氧化锆增韧氧化铝基板具有更高的力学性能和热导率,同时可以降低烧结温度,提高基板可靠性。
为了解决上述问题,本发明提出以下技术方案:
第一方面,本发明提供一种氧化锆增韧氧化铝陶瓷板,由以下重量份组分组成:
氧化铝粉体50~99.5份,氧化锆0~45份、烧结助剂0~20份,有机溶剂30~60份;分散剂0.5~5份,粘结剂与增塑剂的混合物0.5~20份。
其进一步地技术方案为,所述烧结助剂为Y
2O
3、MgO、CaO、SiO
2、CeO
2、La
2O
5、BaO、SrO、Sc
2O
3、Sm
2O
3、Eu
2O
3、Gd
2O
3、Dy
2O
3和Ho
2O
3中的至少一种。
其进一步地技术方案为,所述有机溶剂为乙酸丁酯、乙酸乙酯、无水乙醇中的至少一种。
其进一步地技术方案为,所述分散剂为三油酸甘油酯、聚乙烯酸酯、聚乙烯中的至少一种;所述粘结剂为聚乙烯醇缩丁醛、丙烯酸酯、聚乙烯醇中的至少一种;增塑剂为邻苯二甲酸二丁酯、邻苯二甲酸二苄酯、丙三醇中的至少一种。
其进一步地技术方案为,所述氧化锆增韧氧化铝陶瓷板为层状结构,相邻层间的氧化锆掺量相差范围为0-22份。
其进一步地技术方案为,所述氧化锆增韧氧化铝陶瓷板表面层的氧化锆掺量为0-7份。
第二方面,本发明提供制备如第一方面所述氧化锆增韧氧化铝陶瓷板的方法,工艺步骤如下:
(1)配制复合陶瓷粉体:将氧化锆和氧化铝按比例混合,同时加入烧结助剂,混合均匀,得到预制粉体;
(2)配制流延浆料:在预制粉体中按比例先加入有机溶剂,分散剂,进行第一次球磨,再加入粘结剂和增塑剂的混合物,进行第二次球磨,得到流延浆料;
(3)制备流延坯体:将(2)得到的流延浆料通过流延机制成厚度为80-200μm 的流延坯;
(4)裁片、叠片、温压成型:对所述流延坯按预设尺寸进行裁片;将不同氧化锆掺量的流延坯交叉堆叠得到层叠体,再将层叠体进行温压成型,于180-250MPa冷等静压,得到素坯基板;
(5)对所述素坯基板进行排胶烧结,得到氧化锆增韧氧化铝陶瓷板。
具体地,步骤(1)为,将氧化锆、氧化铝以及烧结助剂加入无水乙醇中,配成混合粉体,超声分散半小时;放入研磨球,球料比为2:1,球磨8~10h,得到预混浆料;将球磨后的浆料放入旋转蒸发仪,70℃干燥;粉体干燥后,过100目筛网过筛,得到混合好的预制粉体。
步骤(2)为,向混合好的预制粉体加入有机溶剂、分散剂,加入研磨球,球料比2:1,一次球磨8h,再加入增塑剂和粘结剂,进行二次球磨8h;将球磨后的浆料进行真空除泡半小时,得到流延浆料。
步骤(3)为,将流延浆料倒入流延机装料槽,调整刮刀高度250~350um,一区干燥温度40℃,二区干燥速度50℃,三区干燥速度65℃,制得80~200um厚的均匀无开裂流延素坯;
步骤(4)为,对所述流延坯按预设尺寸进行裁片;将不同氧化锆掺量的流延坯交叉堆叠得到层叠体,再将层叠体放置在两块铝加热板中间,温度70~80℃,压力大于10MPa,保温保压半小时;再经冷等静压,压力180-250MPa,得到素坯基板。
步骤(5)为,排胶烧结,排胶温度为500~600℃,保温1~2h,排除有机物;烧结温度1550℃,保温2h,得到氧化锆增韧氧化铝陶瓷板。
其进一步地技术方案为,所述层叠体的不同流延坯中,相邻流延坯的氧化锆掺量相差范围为0-22份。
其进一步地技术方案为,所述层叠体中,位于表面层的流延坯的氧化锆掺量为0-7份。
需要说明的是,本发明实施例提供的氧化锆增韧氧化铝陶瓷板为层状结构,相邻层间的氧化锆掺量相差范围为0-22份。
例如,可采用两种不同氧化锆掺量的流延坯进行交叉堆叠,在其他实施例中,可按氧化锆掺量的份数0份/21份、3份/18份、5份/16份、7份/15份等交叉堆 叠得到层叠结构。
进一步地,为改善铜金属与基板润湿性,提高附着性,将氧化锆增韧氧化铝陶瓷板的表面层设计为低热膨胀系数的高导热层,具体为采用纯氧化铝陶瓷层或少掺量氧化锆的氧化铝陶瓷层。
其进一步地技术方案为,步骤(4)中,对层叠体进行温压成型的温度为50~80℃,压力大于10MPa。
其进一步地技术方案为,步骤(5)中,烧结的温度为1300~1600℃。
在本发明方案中,可以达到在氧化锆增韧氧化铝陶瓷板的氧化锆掺量相同的情况下,通过以两种(如图1中的实例6-7所示)或三种(如图1中的实例8-9所示)以上不同氧化锆掺量的氧化铝素坯,以交叉堆叠(如图1中的实例6-7所示)或先堆叠一部分再交叉堆叠(如图1中的实例9所示)的方式,提高氧化锆增韧氧化铝陶瓷板的强度。当氧化锆增韧氧化铝陶瓷板受外力冲击时,裂纹多次受到交替的层间相界面的阻碍,裂纹在界面处偏转不致使整块陶瓷断裂,可以显著提高ZTA陶瓷强度。
此外,可通过将位于表面层的工作层设计为低热膨胀系数(8.5x10-6/℃),高导热材料的纯氧化铝或少掺量氧化锆的氧化铝,以改善铜金属与基板润湿性,提高附着性;高导热层为工作层,提高基板整体热导率。
本发明相对现有技术具有如下的优点及效果:
(1)本发明通过在氧化铝陶瓷中加入氧化锆,在烧结体断裂时,氧化锆发生相变增韧,从而显著提高氧化铝陶瓷的强度、韧性和可靠性;并通过加入烧结助剂降低烧结温度,同时促进烧结体致密化。
(2)本发明通过对流延工艺素坯进行功能梯度层状设计,设计表面层为高热导层,即直接接触电路的工作层为高导热层,有利于电路散热快速传导,提高基板导热;同时高热层具有较小的热膨胀系数,与铜电路热膨胀系数容差较小,提高陶瓷基板与镀铜层结合强度。
(3)通过本发明的制备方法,在氧化锆掺量相同的条件下,制备的氧化锆增韧氧化铝功能梯度陶的抗弯强度高达930MPa,热导率也达25W·mk以上,抗弯强度显著提高,热导率好,可用于氧化铝陶瓷基板,薄膜电阻、电路芯片、LED、 低端IGBT功能模块等电子领域。
图1是实施例1~9氧化锆增韧氧化铝层状功能梯度陶瓷板的层叠结构原理图;
图2是实施例6氧化锆增韧氧化铝层状功能梯度陶瓷板烧结体的断口显微结构图;
图3是实施例7氧化锆增韧氧化铝层状功能梯度陶瓷板烧结体的断口显微结构图;
图4是实施例6氧化锆增韧氧化铝层状功能梯度陶瓷板烧结体结合界面的SEM图。
下面将结合本发明实施例中的附图,对实施例中的技术方案进行清楚、完整地描述。显然,以下将描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1
本发明提供一种氧化锆增韧氧化铝陶瓷板,含有Al
2O
3、MgO、CaO、CeO
2。其制备方法包括以下步骤:
(1)混料干燥:将95~99.9gAl
2O
3、0.1~5g烧结助剂MgO、CaO、CeO
2,加入无水乙醇中,配成混合粉体,超声分散半小时;放入研磨球,球料比为2:1,球磨10h,得到预混浆料;将球磨后的浆料放入旋转蒸发仪,70℃干燥;粉体干燥后,过100目筛网过筛,得到混合粉体;
(2)配制流延浆料:将混合粉体加入25~30g乙酸丁酯,15~20g乙酸乙酯,10~20无水乙醇,并加入0.1~2g三油酸甘油酯分散剂,加入研磨球,球料比2:1,一次球磨8h,再加入5~10g邻苯二甲酸二丁酯增塑剂和5~10g聚乙烯醇缩丁醛粘结剂,进行二次球磨8h;将球磨后浆料进行真空除泡半小时;
(3)流延:将浆料倒入流延机装料槽,调整刮刀高度300~350um,一区干 燥温度40℃,二区干燥速度50℃,三区干燥速度65℃,制得90~120um均匀无开裂流延素坯;
(4)叠层温压:将步骤(3)制得的流延素坯进行裁片,按图1氧化锆增韧氧化铝层状功能梯度陶瓷板的原理图中的实例一结构进行叠层;将叠层好的素坯放置在两块铝加热板中间,温度70~80℃,压力大于10MPa,保温保压半小时;再经冷等静压,压力200MPa,得到素坯基板;
(5)排胶烧结:排胶温度500℃,保温1h,排除有机物;烧结温度1550℃,保温2h,得到氧化铝陶瓷基板。
实施例2
本发明提供一种氧化锆增韧氧化铝陶瓷板,含有Al
2O
3—3Y-ZrO
2。其制备方法包括以下步骤:
(1)混料:将93gAl
2O
3、7g3Y-ZrO
2,加入无水乙醇中,配成混合粉体,超声分散半小时;放入研磨球,球料比为2:1,球磨10h,得到预混浆料;将球磨后的浆料放入旋转蒸发仪,70℃干燥;粉体干燥后,过100目筛网过筛,得到混合粉体;
(2)配制流延浆料:将混合粉体加入25~30g乙酸丁酯,15~20g乙酸乙酯,10~20无水乙醇,并加入0.1~2g三油酸甘油酯分散剂,加入研磨球,球料比2:1,一次球磨8h,再加入5~10g邻苯二甲酸二丁酯增塑剂和5~10g聚乙烯醇缩丁醛粘结剂,进行二次球磨8h;将球磨后浆料进行真空除泡半小时;
(3)流延:将浆料倒入流延机装料槽,调整刮刀高度300~350um,一区干燥温度40℃,二区干燥速度50℃,三区干燥速度65℃,制得90~120um均匀无开裂流延素坯;
(4)叠层温压:将步骤(3)制得的流延素坯进行裁片,按图1氧化锆增韧氧化铝层状功能梯度陶瓷板的原理图中的实例二结构进行叠层;将叠层好的素坯放置在两块铝加热板中间,温度70~80℃,压力大于10MPa,保温保压半小时;再经冷等静压,压力200MPa,得到素坯基板;
(5)排胶烧结:排胶温度500℃,保温1h,排除有机物;烧结温度1550℃,保温2h,得到氧化锆增韧氧化铝陶瓷基板。
实施例3
本发明提供一种氧化锆增韧氧化铝陶瓷板,其制备方法包括以下步骤:
(1)混料:将86gAl
2O
3、14g3Y-ZrO
2,加入无水乙醇中,配成混合粉体,超声分散半小时;放入研磨球,球料比为2:1,球磨10h,得到预混浆料;将球磨后的浆料放入旋转蒸发仪,70℃干燥;粉体干燥后,过100目筛网过筛,得到混合粉体;
(2)配制流延浆料:将混合粉体加入25~30g乙酸丁酯,15~20g乙酸乙酯,10~20无水乙醇,并加入0.1~2g三油酸甘油酯分散剂,加入研磨球,球料比2:1,一次球磨8h,再加入5~10g邻苯二甲酸二丁酯增塑剂和5~10g聚乙烯醇缩丁醛粘结剂,进行二次球磨8h;将球磨后浆料进行真空除泡半小时;
(3)流延:将浆料倒入流延机装料槽,调整刮刀高度300~350um,一区干燥温度40℃,二区干燥速度50℃,三区干燥速度65℃,制得90~120um均匀无开裂流延素坯;
(4)叠层温压:将步骤(3)制得的流延素坯进行裁片,按图1氧化锆增韧氧化铝层状功能梯度陶瓷板的原理图中的实例三结构进行叠层;将叠层好的素坯放置在两块铝加热板中间,温度70~80℃,压力大于10MPa,保温保压半小时;再经冷等静压,压力200MPa,得到素坯基板;
(5)排胶烧结:排胶温度500℃,保温1h,排除有机物;烧结温度1550℃,保温2h,得到氧化锆增韧氧化铝陶瓷基板。
实施例4
本发明提供一种氧化锆增韧氧化铝陶瓷板,其制备方法包括以下步骤:
(1)混料:将79gAl
2O
3、21g3Y-ZrO
2,加入无水乙醇中,配成混合粉体,超声分散半小时;放入研磨球,球料比为2:1,球磨10h,得到预混浆料;将球磨后的浆料放入旋转蒸发仪,70℃干燥;粉体干燥后,过100目筛网过筛,得到混合粉体;
(2)配制流延浆料:将混合粉体加入25~30g乙酸丁酯,15~20g乙酸乙酯,10~20无水乙醇,并加入0.1~2g三油酸甘油酯分散剂,加入研磨球,球料比2:1,一次球磨8h,再加入5~10g邻苯二甲酸二丁酯增塑剂和5~10g聚乙烯醇缩丁醛粘结剂,进行二次球磨8h;将球磨后浆料进行真空除泡半小时;
(3)流延:将浆料倒入流延机装料槽,调整刮刀高度300~350um,一区干 燥温度40℃,二区干燥速度50℃,三区干燥速度65℃,制得90~120um均匀无开裂流延素坯;
(4)叠层温压:将步骤(3)制得的流延素坯进行裁片,按图1氧化锆增韧氧化铝层状功能梯度陶瓷板的原理图中的实例四结构进行叠层;将叠层好的素坯放置在两块铝加热板中间,温度70~80℃,压力大于10MPa,保温保压半小时;再经冷等静压,压力200MPa,得到素坯基板;
(5)排胶烧结:排胶温度500℃,保温1h,排除有机物;烧结温度1550℃,保温2h,得到氧化锆增韧氧化铝陶瓷基板。
实施例5
本发明提供一种氧化锆增韧氧化铝陶瓷板,其制备方法包括以下步骤:
(1)混料:将89.5gAl
2O
3、10.5g3Y-ZrO
2,加入无水乙醇中,配成混合粉体,超声分散半小时;放入研磨球,球料比为2:1,球磨10h,得到预混浆料;将球磨后的浆料放入旋转蒸发仪,70℃干燥;粉体干燥后,过100目筛网过筛,得到混合粉体;
(2)配制流延浆料:将混合粉体加入25~30g乙酸丁酯,15~20g乙酸乙酯,10~20无水乙醇,并加入0.1~2g三油酸甘油酯分散剂,加入研磨球,球料比2:1,一次球磨8h,再加入5~10g邻苯二甲酸二丁酯增塑剂和5~10g聚乙烯醇缩丁醛粘结剂,进行二次球磨8h;将球磨后浆料进行真空除泡半小时;
(3)流延:将浆料倒入流延机装料槽,调整刮刀高度300~350um,一区干燥温度40℃,二区干燥速度50℃,三区干燥速度65℃,制得90~120um均匀无开裂流延素坯;
(4)叠层温压:将步骤(3)制得的流延素坯进行裁片,按图1氧化锆增韧氧化铝层状功能梯度陶瓷板的原理图中的实例五结构进行叠层,将叠层好的素坯放置在两块铝加热板中间,温度70~80℃,压力大于10MPa,保温保压半小时;再经冷等静压,压力200MPa,得到素坯基板;
(5)排胶烧结:排胶温度500℃,保温1h,排除有机物;烧结温度1550℃,保温2h,得到氧化锆增韧氧化铝陶瓷基板。
实施例6
本发明提供一种氧化锆增韧氧化铝陶瓷板,其制备方法包括以下步骤:
(1)将实施例1和实施例4得到的流延素坯,按图1氧化锆增韧氧化铝层状功能梯度陶瓷板的原理图中的实例六结构进行交替叠层,将叠层好的素坯放置在两块铝加热板中间,温度70~80℃,压力大于10MPa,保温保压半小时;再经冷等静压,压力200MPa,得到素坯基板。
(2)排胶烧结:排胶温度500℃,保温1h,排除有机物;烧结温度1550℃,保温2h,得到氧化锆增韧氧化铝陶瓷基板。
本实施例的氧化锆增韧氧化铝层状功能梯度陶瓷板烧结体的断口显微结构如图2所示,结合界面的SEM图如图4所示。
实施例7
(1)将实施例2和实施例3得到的流延素坯,按图1氧化锆增韧氧化铝层状功能梯度陶瓷板的原理图中的实例七结构进行叠层,将叠层好的素坯放置在两块铝加热板中间,温度70~80℃,压力大于10MPa,保温保压半小时;再经冷等静压,压力200MPa,得到素坯基板。
(2)排胶烧结:排胶温度500℃,保温1h,排除有机物;烧结温度1550℃,保温2h,得到氧化锆增韧氧化铝陶瓷基板。
本实施例的氧化锆增韧氧化铝层状功能梯度陶瓷板烧结体的断口显微结构如图3所示。
实施例8
(1)将实施例1、实施例4和实施例5得到的流延素坯,按图1氧化锆增韧氧化铝层状功能梯度陶瓷板的原理图中的实例八结构进行叠层,即三种不同掺量交替堆叠,外表层为Al
2O
3,将叠层好的素坯放置在两块铝加热板中间,温度70~80℃,压力大于10MPa,保温保压半小时;再经冷等静压,压力200MPa,得到素坯基板。
(2)排胶烧结:排胶温度500℃,保温1h,排除有机物;烧结温度1550℃,保温2h,得到氧化锆增韧氧化铝陶瓷基板。
实施例9
(1)将实施例1、实施例4和实施例5得到的流延素坯,按图1氧化锆增韧氧化铝层状功能梯度陶瓷板的原理图中的实例九结构进行叠层,即先对一种掺量进行堆叠,再对实施例4和5交叉堆叠,最后再三种堆叠起来,将叠层好 的素坯放置在两块铝加热板中间,温度70~80℃,压力大于10MPa,保温保压半小时;再经冷等静压,压力200MPa,得到素坯基板。
(2)排胶烧结:排胶温度500℃,保温1h,排除有机物;烧结温度1550℃,保温2h,得到氧化锆增韧氧化铝陶瓷基板。
效果验证
用金刚石工具分别对实施例1~9所制得的氧化锆增韧氧化铝层状复合陶瓷进行加工,用各实施例的复合陶瓷分别制成多根3mm×4mm×36mm的样条,以及10mm×10mm×2mm方块。
实施例1~9制备的氧化铝复合陶瓷进行如下性能测试:
(a)抗弯强度:取每个实施例中10根样条用于测试三点抗弯强度,跨距为30mm,加载速度为0.5mm/min;
(b)热导率:取每个实施例中3个方块,采用闪光法测试其热扩散系数。
(c)结合强度:取每个实例中3个方块,通过直接键合法镀上5mm*5mm铜层,厚度为40um,用于焊接强度测试,位移施加速度200um/s。
表1 实施例1~9制备的氧化锆增韧氧化铝层状复合陶瓷的性能测试结果
由表1的实施例1-4测试结果可知,氧化锆增韧氧化铝陶瓷基板抗弯强度随氧化锆掺量增加而提高,但热导率下降。实施例5~9的测试结果显示,在氧化锆 掺量相同的情况下,经过功能梯度的堆叠后制备的陶瓷样品,热力学性能均有很大提高;同时通过将工作层设计为高导热层,基板与覆铜层结合强度增加,提高了陶瓷基板整体可靠性。
可见,在氧化锆(10.5g)掺量相同的情况下(实施例5~9),制备的氧化锆增韧氧化铝功能梯度陶的抗弯强度高达930MPa,热导率也达25W·mk以上。
需要说明的是,图1所示的氧化锆增韧氧化铝层状功能梯度陶瓷板的原理图中,各实例在实施过程中,层数为N,图仅为示例,不代表具体层数。
关于实施例6-9的氧化锆掺量数值说明如下:
实施例6-9为不同氧化锆掺量的流延素坯交替叠加,交替层数一样,(由于每层素坯厚度为100um左右,在多层堆叠达到一定厚度4-5mm后,表面多加一层相对整体厚度可忽略不计),因此整体总掺量计算为每种掺量的平均;例如,实施例6的氧化锆掺量为实施例1的0g掺量加实施例4的21g掺量之和的平均。
综上,本发明提供的氧化锆增韧氧化铝陶瓷板及其制备方法,通过控制叠层陶瓷复合材料由不同掺量的氧化锆增强的氧化铝及其叠层组成方式,提高陶瓷基板抗弯强度和热导率,同时使基板能够和亲电路工作层具有良好的相容性能;进一步地,通过流延叠层的方法,将工作层设计为亲电路的材料层,改善基板与电路之间的附着性,提高陶瓷基板与覆铜层电路结合强度,减少了传统基板在覆铜前要做一个过渡层处理工艺,提高生产效率,降低生产成本。
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详细描述的部分,可以参见其他实施例的相关描述。
以上所述,为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到各种等效的修改或替换,这些修改或替换都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以权利要求的保护范围为准。
Claims (10)
- 一种氧化锆增韧氧化铝陶瓷板,其特征在于,由以下重量份组分组成:氧化铝粉体50~99.5份,氧化锆0~45份、烧结助剂0~20份,有机溶剂30~60份;分散剂0.5~5份,粘结剂与增塑剂的混合物0.5~20份。
- 如权利要求1所述的氧化锆增韧氧化铝陶瓷板,其特征在于,所述烧结助剂为Y 2O 3、MgO、CaO、SiO 2、CeO 2、La 2O 5、BaO、SrO、Sc 2O 3、Sm 2O 3、Eu 2O 3、Gd 2O 3、Dy 2O 3和Ho 2O 3中的至少一种。
- 如权利要求1所述的氧化锆增韧氧化铝陶瓷板,其特征在于,所述有机溶剂为乙酸丁酯、乙酸乙酯、无水乙醇中的至少一种。
- 如权利要求1所述的氧化锆增韧氧化铝陶瓷板,其特征在于,所述分散剂为三油酸甘油酯、聚乙烯酸酯、聚乙烯中的至少一种;所述粘结剂为聚乙烯醇缩丁醛、丙烯酸酯、聚乙烯醇中的至少一种;增塑剂为邻苯二甲酸二丁酯、邻苯二甲酸二苄酯、丙三醇中的至少一种。
- 如权利要求1所述的氧化锆增韧氧化铝陶瓷板,其特征在于,所述氧化锆增韧氧化铝陶瓷板为层状结构,相邻层间的氧化锆掺量相差范围为0-22份。
- 制备如权利要求1-5任一项所述氧化锆增韧氧化铝陶瓷板的方法,其特征在于,工艺步骤如下:(1)配制复合陶瓷粉体:将氧化锆和氧化铝按比例混合,同时加入烧结助剂,混合均匀,得到预制粉体;(2)配制流延浆料:在预制粉体中按比例先加入有机溶剂,分散剂,进行第一次球磨,再加入粘结剂和增塑剂的混合物,进行第二次球磨,得到流延浆料;(3)制备流延坯体:将(2)得到的流延浆料通过流延机制成厚度为80-200μm的流延坯;(4)裁片、叠片、温压成型:对所述流延坯按预设尺寸进行裁片;将不同氧化锆掺量的流延坯交叉堆叠得到层叠体,再将层叠体进行温压成型,于180-250MPa冷等静压,得到素坯基板;(5)对所述素坯基板进行排胶烧结,得到氧化锆增韧氧化铝陶瓷板。
- 如权利要求6所述氧化锆增韧氧化铝陶瓷板的制备方法,其特征在于,所述层叠体中,相邻流延坯的氧化锆掺量相差范围为0-22份。
- 如权利要求7所述氧化锆增韧氧化铝陶瓷板的制备方法,其特征在于, 所述层叠体中,位于表面层的流延坯的氧化锆掺量为0-7份。
- 如权利要求6所述氧化锆增韧氧化铝陶瓷板的制备方法,其特征在于,步骤(4)中,对层叠体进行温压成型的温度为50~80℃,压力大于10MPa。
- 如权利要求6所述氧化锆增韧氧化铝陶瓷板的制备方法,其特征在于,步骤(5)中,烧结的温度为1300~1600℃。
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