WO2022249657A1 - 導電接続体及びソケット - Google Patents
導電接続体及びソケット Download PDFInfo
- Publication number
- WO2022249657A1 WO2022249657A1 PCT/JP2022/011362 JP2022011362W WO2022249657A1 WO 2022249657 A1 WO2022249657 A1 WO 2022249657A1 JP 2022011362 W JP2022011362 W JP 2022011362W WO 2022249657 A1 WO2022249657 A1 WO 2022249657A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive
- mesh
- conductive connector
- fibrous body
- covered
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 238000011282 treatment Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
- 239000000835 fiber Substances 0.000 abstract description 17
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 239000004065 semiconductor Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
Definitions
- the present invention relates to a conductive connector and a socket, and more particularly to a conductive connector and a socket used in connectors for electronic devices, sockets for semiconductors, and the like.
- Patent Document 1 discloses a contact probe that is arranged between a pair of conductive members facing each other and electrically connects between the conductive members, and has a contact portion that contacts one of the conductive members and a A substantially U-shaped wiring member made of a bundle of copper wires connected to contact points through an intermediate portion, and a block-shaped rubber-like elastic body having a structure in which the wiring member other than the contact points is embedded. a covering member manufactured by molding.
- the contact probe disclosed in Patent Literature 1 is covered with a block-shaped rubber-like elastic body having a structure in which the wiring member is covered with a portion other than the contact portion. is not easy.
- the wiring member is less likely to follow the displacement of the block-shaped rubber-like elastic body, so excessive stress is likely to be applied only partially. Therefore, there is a problem that wires are likely to break at those sites as they are used. In addition, there is a problem that the contact portion of the wiring member tends to peel off from the covering member due to its structure.
- an object of the present invention is to provide a conductive connector that does not have such inconvenience.
- the conductive connector and socket of the present invention are: a non-conductive elastic body; a mesh-like fibrous body having a coated region whose surface is coated with metal; with The non-conductive elastic body is covered with the mesh-like fibrous body in a ⁇ shape.
- the semiconductor device in which the connection objects are arranged two-dimensionally or three-dimensionally can be used. It can be used preferably.
- the mesh-like fibrous body can be a fibrous body in which a non-coated region is formed, which is not coated with metal, in contrast to metal fibers coated with metal.
- the uncovered region is preferably formed by chemical or mechanical treatment.
- FIGS. 1A to 1E are schematic configuration diagrams of a conductive connector 1000 according to Embodiment 1 of the present invention.
- the conductive connector 1000 is roughly classified into a mesh-like fibrous body 100 and a non-conductive elastic body 200, which will be described below.
- FIG. 1A shown in the center is a right side view
- FIG. 1B shown above is a plan view
- FIG. 1C shown below is a bottom view
- FIG. 1D shown on the left is a front view
- FIG. 1E shown on the right is a rear view. It is a diagram.
- FIG. 1E does not show the non-conductive elastic body 200 for convenience of explanation.
- the left side view is not shown in FIG. 1, it is symmetrical with the right side view.
- the mesh-like fibrous body 100 can have a coated region 10 whose surface is coated with a metal containing a noble metal and an uncoated region 20 whose surface is not coated with metal.
- the covered area 10 would face the central area 10A shown in FIG. 1E, and the uncovered area 20 would face the peripheral area 20A in FIG. 1E.
- the entire mesh-like fibrous body 100 may be used as the covered area 10 and the uncovered area 20 may not be formed.
- the formation of the uncovered region 20 prevents the adjacent conductive connectors 1000 from coming into contact with each other and short-circuiting when, for example, the contact objects with the conductive connectors 1000 are arranged with relatively short gaps. It has the advantage of being able to
- the mesh-like fibrous body 100 has a mesh-like shape, the opposite surface thereof can be in contact with the conductive elastic body 200 entirely. Although it depends on the mesh size of the mesh-like fibrous body 100, it is set to 500 mPa to 100,000 mPa, preferably 5,000 mPa to 50,000 mPa, more preferably 11,000 mPa to 14,000 mPa, and the conductive elastic body 200 is made to enter the mesh. , together with its anchor effect, achieves high adhesion to the conductive elastic body 200 .
- the mesh fibrous body 100 forms folded portions 110 at the upper and lower ends of the covering region 10 .
- the folded portion 110 also contributes to the adhesion between the mesh-like fibrous body 100 and the conductive elastic body 200 .
- FIG. 1 shows a state in which the folded portion 110 is folded back 180 degrees
- the folded portion 110 is not limited to this and may be folded, for example, about 120 degrees to 150 degrees.
- the size and number of the folded portions 110 are not limited to those shown in FIG.
- the mesh-like fibrous body 100 has a general shape of ⁇ , and therefore has springiness.
- the mesh-like fibrous body 100 has portions in which the upper surface and the lower surface are parallel to each other, the ⁇ shape referred to in this specification is not limited to this aspect in a strict sense. Therefore, referring to FIG. 1A, the mesh-like fibrous body 100 includes, for example, a curved upper side.
- the mesh-like fibrous body 100 preferably has a shape that can secure a large contact surface according to the shape of the object to be contacted.
- the conductive connector 1000 can be used for testing semiconductor devices. It is brought into contact with the electrode terminal of the electronic component inspection device. In this state, when a voltage is applied to a normal semiconductor device, a current flows through the covering region 10 of the mesh-like fibrous body 100 toward the inspection device.
- the non-conductive elastic body 200 is covered on its upper surface, front surface, and lower surface by a mesh-like fibrous body 100 having a general ⁇ shape.
- the non-conductive elastic body 200 can be made of, for example, a silicone resin material. A resin material can also be used.
- the mesh-like fibrous body 100 has only one corner portion on the lower side, the stress applied to that portion is limited, and the conductive connecting member 1000 has a ⁇ shape without any corners.
- the conductive connector 1000 when it is placed on a substrate of a semiconductor device or the like, it may be arranged as shown in the drawing in order to increase the mounting surface and stabilize it.
- the application of the conductive connector 1000 is mainly described as an inspection apparatus for semiconductor devices. It can also be used for internal wiring.
- the conductive connector 1000 may be connected to a wiring board or the like provided in a semiconductor device or the like by a conductive adhesive, reflow soldering, or the like.
- soldering can be done by raising the temperature up to about 260° C., so if the material of the non-conductive elastic body 200 is made of a material having heat resistance of about 280° C., the conductive connector 1000 can be used as the substrate of the semiconductor device. It is also possible to connect to, for example, by soldering.
- FIG. 2 is a perspective view of a part of the covering region 10 of the mesh-like fibrous body 100 that constitutes the conductive connector 1000 shown in FIG.
- the mesh fabric 100 can be a woven fabric, a non-woven fabric, or the like, such as an insulating material.
- the mesh-like fibrous body 100 is manufactured by weaving a plurality of fibers 5 arranged in a grid.
- the thickness of the mesh fibrous body 100 is, for example, about 5 ⁇ m to 200 ⁇ m, preferably about 10 ⁇ m to 150 ⁇ m, more preferably about 20 ⁇ m to 100 ⁇ m.
- the fiber 5 itself may be an insulating material (non-conductive fiber) having flexibility, and for example, a material appropriately selected from glass fiber, chemical fiber, carbon fiber, and the like can be used.
- each fiber 5 shown in FIG. 2 is coated with a metal to form a coated region 10.
- a metal As the metal referred to here, gold, silver, platinum, etc., or alloys containing these as main components, for example, having electrical conductivity can be used.
- the specifications such as the diameter and strength of the fiber 5 are not particularly limited, but the thickness of the metal itself is about 0.1 ⁇ m to 20 ⁇ m, preferably about 2 ⁇ m to 10 ⁇ m, and the hardness is 1 or more. can be selected.
- the manufacturing method of the mesh-like fibrous body 100 is irrelevant.
- the fibers 5 without forming the covering region 10 may be woven in a grid pattern, and then the region where the covering region 10 is to be formed may be brought into contact with a metal plating solution or a metal gas.
- the fibers 5 coated with a metal in advance may be woven in a grid pattern, and then the regions where the non-coated regions 20 are to be formed may be formed by etching using an etchant suitable for the metal.
- an etchant suitable for the metal it is necessary to use an etchant that does not dissolve the fiber 5 itself.
- the mesh-like fibrous body 100 having the covered regions 10 and the uncovered regions 20 can be produced by any method, but in particular, the mesh-like fibrous body 100 does not have the uncovered regions 20 and the covered regions 10 In the case of using only one, the latter method is preferable because the manufacturing efficiency is high.
- the uncovered region 20 is not necessarily formed by etching, and may be formed by chemical treatment other than etching. Examples of such treatment include mechanical treatments such as sandblasting and ion irradiation.
- FIG. 3 is a schematic perspective view of part of the conductive connector 1000 of Embodiment 2 of the present invention.
- the conductive connecting member 1000 has a shape in which the members shown in FIG. 1 are continuously and repeatedly arranged linearly two-dimensionally.
- the conductive connector 1000 may have a shape in which the members shown in FIG. 1 are continuously and repeatedly arranged two-dimensionally in a plane.
- the conductive connector 1000 shown in FIG. 1 can also be manufactured by once manufacturing the conductive connector 1000 shown in FIG.
- the number and size of the covered regions 10 and the non-covered regions 20 may be appropriately selected according to the number, size and dimensions of the electrode terminals to be inspected.
- FIG. 4 is an explanatory diagram of the mesh-like fibrous body 100 that constitutes the conductive connector 1000 shown in FIG.
- FIG. 4A shows a rear view corresponding to FIG. 1E
- FIG. 4B shows a perspective view including the non-conductive elastic body 200.
- the folded portions 110 can be provided at appropriate intervals.
- the conductive connector 1000 shown in FIG. 4 does not have corners in the mesh-like fibrous body 100 .
- the non-conductive elastic body 200 has a rectangular parallelepiped shape, the upper and lower ends thereof are uneven. This irregular shape occurs when the conductive connector 1000 is manufactured using a jig 3000 shown in FIG. 6A, which will be described later, and is not essential to the conductive connector 1000.
- FIG. 5 is a perspective view showing a state in which the plurality of conductive connectors 1000 shown in FIG. 4 are attached to the socket 2000.
- the socket 2000 includes a socket body 2100 to which a plurality of conductive connectors 1000 are attached, and positioning pins 2200 provided at four corners of the socket body 2100 .
- the socket main body 2100 has conductive connectors 1000 each having seven covering regions 10, for example, arranged in 14 rows and 2 columns. It is only an example.
- FIGS. 6A to 6D are schematic manufacturing process diagrams of the conductive connector 1000 shown in FIG.
- the manufacturing process of the conductive connector 1000 shown in FIGS. 6A to 6D is merely an example, and is not limited to this.
- a conductive connector 1000 may be manufactured.
- the adhesive or the like should enter the mesh of the mesh-like fibrous body 100 .
- the adhesive also has the above-mentioned heat resistance, it is preferable because the application is not limited.
- FIG. 6A shows a jig 3000 for manufacturing the conductive connector 1000.
- the jig 3000 has a substantially rectangular parallelepiped shape. Side walls are formed on the top surface of the jig 3000 along both long sides. These side walls, together with the upper surface of the jig 3000, form a channel 3200 into which the resin that forms the non-conductive elastic body 200 is poured. A comb portion composed of a plurality of protrusions 3100 is formed on each side wall.
- FIG. 6B shows a mesh fibrous body 100 having covered regions 10 and uncovered regions 20.
- the mesh-like fibrous body 100 may be manufactured by the method described with reference to FIG. Here, the mesh-like fibrous body 100 is drawn as if it already has a ⁇ shape.
- the mesh-like fibrous body 100 shown in FIG. 6B is attached to the jig 3000 shown in FIG. , a state in which the non-conductive elastic body 200 is formed.
- the mesh-like fibrous body 100 is attached to the jig 3000 in such a manner that each non-covered region 20 and each convex portion 3100 correspond to each other.
- FIG. 6D shows a state in which the completed conductive connector 1000 is removed from the jig 3000.
- FIG. 6D it can be seen that the non-conductive elastic body 200 is covered with the ⁇ -shaped mesh fiber body 100 .
- the teeth of a slicer can be inserted between the projections 3100 in the state of FIG.
- the uncovered region 20 of the conductive connector 1000 removed from the jig 3000 can also be cut into round slices.
- the covering regions 10 are formed in a matrix, for example, and the jigs 3000 shown in FIG. 6A are continuously arranged in the lateral direction. should be used.
- the conductive connector 1000 of each embodiment of the present invention is easy to manufacture, has a low risk of disconnection, and can be used semi-permanently.
- FIG. 1 is a schematic configuration diagram of a conductive connector 1000 according to Embodiment 1 of the present invention
- FIG. FIG. 2 is a perspective view showing a portion of a covering region 10 of a mesh-like fibrous body 100 that constitutes the conductive connector 1000 shown in FIG. 1
- FIG. 10 is a schematic perspective view of part of a conductive connector 1000 according to Embodiment 2 of the present invention
- FIG. 4 is an explanatory diagram of a mesh-like fibrous body 100 that constitutes the conductive connector 1000 shown in FIG. 3
- 5 is a perspective view showing a state in which the plurality of conductive connectors 1000 shown in FIG. 4 are attached to the socket 2000
- FIG. 5 is a schematic manufacturing process diagram of the conductive connector 1000 shown in FIG. 4.
- FIG. 4 is an explanatory diagram of a mesh-like fibrous body 100 that constitutes the conductive connector 1000 shown in FIG. 3
- 5 is a perspective view showing a state in which the plurality of conductive connectors 1000 shown in FIG
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Geometry (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Connecting Device With Holders (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
非導電弾性体と、
表面が金属で被覆された被覆領域を有する網目状繊維体と、
を備え、
前記非導電弾性体の周囲を前記網目状繊維体が⊂字状となる態様で覆っている。
図1A~図1Eは、本発明の実施形態1の導電接続体1000の模式的な構成図である。導電接続体1000は、以下説明する、網目状繊維体100と、非導電弾性体200と、に大別される。
図3は、本発明の実施形態2の導電接続体1000の一部の模式的な斜視図である。導電接続体1000は、図1に示したものが線状に2次元に連続的に繰り返し配列されたような形状をしている。もっとも、導電接続体1000は、図1に示したものが面状に2次元に連続的に繰り返し配列されたような形状としてもよい。
10 被覆領域
20 非被覆領域
100 網目状繊維体
200 非導電弾性体
1000 導電接続体
2000 ソケット
2100 ソケット本体
2200 位置決めピン
Claims (4)
- 非導電弾性体と、
表面が金属で被覆された被覆領域を有する網目状繊維体と、
を備え、
前記非導電弾性体の周囲を前記網目状繊維体が⊂字状となる態様で覆っている導電接続体。 - 前記網目状繊維体は、金属が被覆されていない非被覆領域と前記被覆領域とが交互に配されている、請求項1記載の導電接続体。
- 金属が被覆されていない非被覆領域は、化学的処理又は機械的処理によって形成されている、請求項1記載の導電接続体。
- 請求項1~3のいずれか記載の導電接続体が複数装着されたソケット。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022517121A JPWO2022249657A1 (ja) | 2021-05-27 | 2022-03-14 | |
KR1020237034677A KR20240014040A (ko) | 2021-05-27 | 2022-03-14 | 전도성 커넥터 및 소켓 |
CN202280034974.4A CN117321426A (zh) | 2021-05-27 | 2022-03-14 | 导电连接体以及插座 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2021-089048 | 2021-05-27 | ||
JP2021089048 | 2021-05-27 |
Publications (1)
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WO2022249657A1 true WO2022249657A1 (ja) | 2022-12-01 |
Family
ID=84228548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2022/011362 WO2022249657A1 (ja) | 2021-05-27 | 2022-03-14 | 導電接続体及びソケット |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022249657A1 (ja) |
KR (1) | KR20240014040A (ja) |
CN (1) | CN117321426A (ja) |
TW (1) | TW202246780A (ja) |
WO (1) | WO2022249657A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06196229A (ja) * | 1992-09-30 | 1994-07-15 | Whitaker Corp:The | 電気コネクタ組立体 |
JPH0719812B2 (ja) * | 1987-04-09 | 1995-03-06 | 東京エレクトロン株式会社 | 検査装置 |
JP2001155833A (ja) * | 1999-11-26 | 2001-06-08 | Chichibu Fuji Co Ltd | Icソケット |
JP2002350462A (ja) * | 2001-05-22 | 2002-12-04 | Canon Inc | 電圧印加プローブ、電子源の製造装置及び製造方法 |
JP2005062076A (ja) * | 2003-08-19 | 2005-03-10 | Eight Kogyo:Kk | 電気的接続装置 |
JP2006343269A (ja) * | 2005-06-10 | 2006-12-21 | Japan Aviation Electronics Industry Ltd | 検査装置 |
JP2011113891A (ja) * | 2009-11-27 | 2011-06-09 | Sagami Shokai:Kk | 多接点コネクターとしての導電接続材 |
-
2022
- 2022-03-14 CN CN202280034974.4A patent/CN117321426A/zh active Pending
- 2022-03-14 KR KR1020237034677A patent/KR20240014040A/ko unknown
- 2022-03-14 JP JP2022517121A patent/JPWO2022249657A1/ja active Pending
- 2022-03-14 WO PCT/JP2022/011362 patent/WO2022249657A1/ja active Application Filing
- 2022-05-24 TW TW111119311A patent/TW202246780A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0719812B2 (ja) * | 1987-04-09 | 1995-03-06 | 東京エレクトロン株式会社 | 検査装置 |
JPH06196229A (ja) * | 1992-09-30 | 1994-07-15 | Whitaker Corp:The | 電気コネクタ組立体 |
JP2001155833A (ja) * | 1999-11-26 | 2001-06-08 | Chichibu Fuji Co Ltd | Icソケット |
JP2002350462A (ja) * | 2001-05-22 | 2002-12-04 | Canon Inc | 電圧印加プローブ、電子源の製造装置及び製造方法 |
JP2005062076A (ja) * | 2003-08-19 | 2005-03-10 | Eight Kogyo:Kk | 電気的接続装置 |
JP2006343269A (ja) * | 2005-06-10 | 2006-12-21 | Japan Aviation Electronics Industry Ltd | 検査装置 |
JP2011113891A (ja) * | 2009-11-27 | 2011-06-09 | Sagami Shokai:Kk | 多接点コネクターとしての導電接続材 |
Also Published As
Publication number | Publication date |
---|---|
CN117321426A (zh) | 2023-12-29 |
JPWO2022249657A1 (ja) | 2022-12-01 |
TW202246780A (zh) | 2022-12-01 |
KR20240014040A (ko) | 2024-01-31 |
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