WO2022246894A1 - 电子枪测试平台 - Google Patents

电子枪测试平台 Download PDF

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Publication number
WO2022246894A1
WO2022246894A1 PCT/CN2021/098303 CN2021098303W WO2022246894A1 WO 2022246894 A1 WO2022246894 A1 WO 2022246894A1 CN 2021098303 W CN2021098303 W CN 2021098303W WO 2022246894 A1 WO2022246894 A1 WO 2022246894A1
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WIPO (PCT)
Prior art keywords
module
mobile
test
silicon wafer
electron gun
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PCT/CN2021/098303
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English (en)
French (fr)
Inventor
王鑫
孟庆浪
孙伟强
蒋俊海
Original Assignee
中科晶源微电子技术（北京）有限公司
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Publication of WO2022246894A1 publication Critical patent/WO2022246894A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M7/00—Vibration-testing of structures; Shock-testing of structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Definitions

  • the present application relates to the field of semiconductor equipment, in particular to an electron gun test platform.
  • the electron gun test platform is used to enable the silicon wafer to be picked up and positioned to meet the requirements of the electron gun test during the testing process of the electron gun, such as the deviation of the placement position of the silicon wafer.
  • the main working principle of the platform is to use the vacuum feeding device to send the silicon wafer to the position required for the electron gun test on the moving platform after the vacuum pressure is broken. The accuracy and speed of the placement determine the speed and stability of the electron gun during the test process.
  • the existing electron gun test platform mainly pushes the silicon wafer to the two-dimensional XY motion module through the vacuum feeding device, and there will be gap errors in the connection in this way.
  • this application proposes an electron gun test platform, which effectively solves the error of the connection gap caused by picking and placing the silicon wafer, and the repeated positioning error of the moving module and the vacuum feeding device.
  • an electron gun test platform including a test chamber
  • the test cavity is provided with a parallel transfer module and a mobile carrier module;
  • the mobile carrier module is fixed to the inner wall of the test cavity, the top of the mobile carrier module is suitable for placing silicon wafers or silicon wafer carrier boxes, and the parallel transfer module is arranged on the mobile carrier module. the side of the mould;
  • the parallel transfer module includes a driving device, a fixed seat, a moving frame and a clamping piece;
  • the fixed seat is fixedly installed on the side of the mobile carrier module, and the fixed seat is fixed to the inner wall of the test cavity;
  • the driving device is fixed on the fixed seat, the output end of the driving device is fixedly connected to one side of the moving frame, and the other side of the moving frame is rotatably connected to the clamping member;
  • the clamping part is suitable for clamping the wafer carrier box, and the driving device drives the clamping part to move on the top of the mobile carrier module.
  • the moving frame includes a first rotating member and a second rotating member
  • the output end of the driving device is fixedly connected to the first rotating member, and the other end of the first rotating member is hinged to the clamping member;
  • a hinge seat is provided on the fixed frame, one side of the second rotating member is hinged to the hinge seat, and the other side of the second rotating member is hinged to the clamping member;
  • the second rotating member rotates synchronously with the first rotating member.
  • a first articulated rod and a second articulated rod are provided on a side of the clamping member facing the first rotating member;
  • Both the first hinged rod and the second hinged rod are fixed to the clamping member, the side of the first rotating member that is not fixedly connected to the driving device is hinged to the first hinged rod, the A side of the second rotating member that is not hinged to the hinge part is hinged to the second hinged rod.
  • the clamping member includes a first part and a second part, both of the first part and the second part are plate-shaped, and the first part and the second part It is connected in an "L", and the second part is provided with a clamping part on the side plate facing away from the first part, which is used to clamp the silicon wafer carrier box;
  • the mobile frame set is rotatably connected to the side plate surface of the first part away from the second part, and the clamping part is arranged towards the top of the mobile carrier module.
  • the mobile carrier module includes a mobile module
  • the mobile module is fixedly installed on the bottom inner wall of the test cavity, and a mobile platform is installed on the mobile module, and the mobile module drives the mobile platform to move.
  • the top of the mobile platform is suitable for Place the silicon wafer or the silicon wafer carrier box.
  • it also includes a transition isolation cavity, and the transition isolation cavity is communicated with the test cavity;
  • the inside of the transition isolation cavity is equipped with a transport module, and the top of the transport module is suitable for placing silicon wafers or silicon wafer carrier boxes;
  • An isolation door is provided at the connection between the transition isolation cavity and the test cavity, and the isolation door isolates the transition isolation cavity and the test cavity;
  • the isolation door is provided with a lifting assembly for controlling the opening or closing of the isolation door;
  • the side of the transitional isolation chamber away from the test chamber is provided with an access opening, and an end cover is detachably installed at the access opening, and the end cover is provided with the access opening.
  • the lifting assembly includes a lifting motor and a rotating lead screw;
  • the lifting motor is fixedly installed on the bottom inner wall of the test cavity, and the output end of the lifting motor is arranged towards the top of the test cavity;
  • the rotating lead screw is fixedly connected to the output end of the lifting motor
  • a connecting portion is provided on the side wall of the isolation door, and an internal thread is provided on the connecting portion, and the internal thread on the connecting portion is matched with the rotating lead screw.
  • the top of the test chamber is provided with an installation hole, and the installation hole is set through the top side wall of the test chamber;
  • the mounting hole is set at the top position of the parallel transfer module
  • the mounting hole is suitable for installing an electron gun.
  • the driving device is fixedly connected to the moving frame through a beryllium copper tapered bushing;
  • the moving device and the clamping piece are rotatably connected through a beryllium copper tapered bushing.
  • the electron gun test platform of the embodiment of the present application is provided with a test chamber, and the parallel movement module and the mobile carrier module are installed in the test chamber, wherein the top of the mobile carrier module is used to place a silicon wafer or a silicon wafer carrier box, And the mobile carrier module is more capable of moving in the test cavity.
  • the parallel transfer module is used to clamp the silicon wafer carrier box, and the fixed seat in the parallel transfer module is fixed to the test chamber, providing installation components for the driving device, moving frame and clamping parts.
  • the driving device drives the mobile frame to rotate, and drives the clamping part on the mobile frame to move to the side of the silicon wafer carrier box where the silicon wafer is placed, and the clamping part clamps the silicon wafer carrier.
  • the driving device drives the holding member holding the silicon wafer carrier to move to one side of the mobile carrier module, and places the silicon wafer carrier on the top of the mobile carrier module to complete the placement of the silicon wafer.
  • the electron gun test platform of the embodiment of the present application effectively solves the error of the connection gap caused by picking and placing the silicon wafer and the repeated positioning error of the moving module and the vacuum feeding device through the above structure.
  • Fig. 1 shows the front view of the electron gun test platform of the embodiment of the present application
  • Fig. 2 shows the left side view of the electron gun test platform of the embodiment of the present application
  • Fig. 3 shows the top view of the electron gun test platform of the embodiment of the present application
  • Fig. 4 shows the front view of the parallel transfer module of the electron gun test platform of the embodiment of the present application
  • FIG. 5 shows a left side view of the parallel transfer module of the electron gun test platform of the embodiment of the present application.
  • first and second are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features.
  • “plurality” means two or more, unless otherwise specifically defined.
  • FIG. 1 shows the front view of the electron gun test platform of the embodiment of the present application.
  • Fig. 2 shows a left view of the electron gun test platform of the embodiment of the present application.
  • Fig. 3 shows a top view of the electron gun test platform of the embodiment of the present application.
  • FIG. 4 shows a front view of the parallel transfer module 200 of the electron gun test platform of the embodiment of the present application.
  • FIG. 5 shows a left side view of the parallel transfer module 200 of the electron gun test platform according to the embodiment of the present application.
  • Fig. 1 shows the front view of the electron gun test platform of the embodiment of the present application.
  • Fig. 2 shows a left view of the electron gun test platform of the embodiment of the present application.
  • Fig. 3 shows a top view of the electron gun test platform of the embodiment of the present application.
  • FIG. 4 shows a front view of the parallel transfer module 200 of the electron gun test platform of the embodiment of the present application.
  • FIG. 5 shows a left side view of the parallel transfer module 200
  • the electron gun test platform includes: a test cavity 100, and the inside of the test cavity 100 is provided with a parallel transfer module 200 and a mobile carrier module 300 , wherein the mobile carrier module 300 is fixedly connected to the inner wall of the test chamber 100, the top of the mobile carrier module 300 places a silicon wafer or a silicon wafer carrier box, and the parallel transfer module 200 is arranged on the mobile carrier module 300 on the side.
  • the parallel transfer module 200 includes a driving device 210, a fixed seat 220, a moving frame 230 and a clamping member 240, wherein the fixed seat 220 is fixedly installed on the side of the mobile carrier module 300, and the fixed seat 220 is connected to the test cavity 100 The inner wall is fixed.
  • the driving device 210 is fixedly installed on the fixed base 220 , the output shaft of the driving device 210 is fixedly connected to one side of the moving frame 230 , and the other side of the moving frame 230 is rotatably connected to the clamping member 240 .
  • the clamping part 240 is used to clamp the wafer carrier box, and the driving device 210 drives the clamping part 240 to move on the top of the mobile carrier module 300 .
  • the electron gun test platform of the embodiment of the present application is provided with a test chamber 100, and the parallel movement module and the mobile carrier module 300 are installed in the test chamber 100, wherein the top of the mobile carrier module 300 is used to place silicon chips or The silicon wafer carrier box, and the mobile carrier module 300 is more capable of moving in the test cavity 100 .
  • the parallel transfer module 200 is used to clamp the silicon wafer carrier box, and the fixed seat 220 in the parallel transfer module 200 is fixed to the test cavity 100, providing installation for the driving device 210, the moving frame 230 and the clamping member 240. part.
  • the driving device 210 drives the mobile frame 230 to rotate, and drives the clamping member 240 on the mobile frame 230 to move to the side of the silicon wafer carrier box where the silicon wafer is placed, and clamps Member 240 holds the silicon wafer carrier.
  • the driving device 210 drives the clamping member 240 holding the silicon wafer carrier to move to the side of the mobile carrier module 300, and places the silicon wafer carrier on the top of the mobile carrier module 300 to complete the silicon wafer. place.
  • the electron gun test platform of the embodiment of the present application effectively solves the error of the connection gap caused by picking and placing the silicon wafer and the repeated positioning error of the moving module and the vacuum feeding device through the above structure.
  • the moving frame 230 includes a first rotating member 231 and a second rotating member 232, wherein the output end of the driving device 210 is fixedly connected to the first rotating member 231, and the other end of the first rotating member 231 It is hingedly arranged with the clamping member 240 .
  • a hinge seat is provided on the fixed frame, one side of the second rotating member 232 is hinged to the hinge seat, and the other side of the second rotating member 232 is hinged to the clamping frame.
  • the driving device 210 drives the first rotating member 231 to rotate
  • the second rotating member 232 rotates synchronously with the first rotating member 231 .
  • the moving frame 230 is configured as the first rotating member 231 and the second rotating member 232 , thereby making the structure of the embodiment of the present application more stable.
  • the clamping member 240 is provided with a first hinged rod 260 and a second hinged rod 250 on one side facing the first rotating member 231, wherein the first hinged rod 260, the second hinged rod 260
  • the hinged rods 250 are all fixed to the clamping member 240, the side of the first rotating member 231 that is not fixedly connected to the driving device 210 is hinged to the first hinged rod 260, and the side of the second rotating member 232 that is not hinged to the hinge portion is hinged to the second rotating member 232.
  • the two hinged rods 250 are hinged.
  • the first rotating member 231 and the second rotating member 232 are both in the shape of a plate, the hinge seat is in the shape of a rod, and the hinge seat is arranged above the driving device 210, and After the first rotating member 231 and the second rotating member 232 are installed, the first rotating member 231 and the second rotating member 232 are arranged in parallel.
  • the first rotating member 231 , the second rotating member 232 , the clamping member 240 and the fixing seat 220 form a parallelogram translation mechanism, which makes the structure of the embodiment of the present application more stable.
  • both the plate surface of the second rotating member 232 and the plate surface of the first rotating member 231 are set towards the fixed seat 220, and the second rotating member 232 is adjacent to the fixed seat.
  • Block 220 is provided.
  • the clip 240 includes a first part 241 and a second part 242, both of which are plate-shaped, and the first part 241 and the second part 242 are connected in a " L" plate shape.
  • the second component 242 is provided with a clamping portion on a side plate facing away from the first component 241 , and the clamping portion is used for clamping the silicon wafer carrier box.
  • the moving frame 230 is rotatably connected to the side surface of the first part 241 away from the second part 242 , and the clamping part is set towards the top of the mobile carrier module 300 .
  • the clamping part of the clamping part 240 can be located at the top position of the mobile carrier module 300 by the structure of the clamping part 240 described above.
  • the clamping part is in the shape of a groove, and clamps are provided on the opposite groove walls of the clamping part, and the clamps are formed along the groove wall of the clamping part.
  • the plate shape is set, so that the silicon wafer carrier box can be clamped more stably through the above-mentioned structure.
  • the fixing seat 220 is in the shape of an "L"-shaped plate, so that the driving device 210 is fixedly installed on one side of the fixing seat 220, and fixed The seat 220 is fixedly connected to the inner wall of the test cavity 100 on the board surface where the driving device 210 is not fixed.
  • the driving device 210 may be implemented by using a motor, which will not be repeated here.
  • the mobile carrier module 300 includes a mobile module, wherein the mobile module is fixedly installed on the bottom inner wall of the test gun, a mobile platform is installed on the mobile module, and the mobile module drives the mobile Platform, the top of the mobile platform is used to place silicon wafers or silicon wafer carrier boxes.
  • the mobile platform provides a place for the silicon wafer or the silicon wafer carrier box, and the movement of the mobile platform can be controlled by the mobile module, so that the silicon wafer can be transported in the test chamber 100 .
  • the mobile module includes a first support seat, a second support seat, a third support seat, a fourth support seat, a first driving screw, a first stable rod, a second drive screw and a second stabilizer rod.
  • Both the first support base and the second support base are plate-shaped, and the first support base and the second support base are fixedly connected to the bottom inner wall of the test cavity 100, and the plate surface of the first support base and the second support base.
  • the board surfaces are oppositely arranged, and the board surface of the first support seat and the board surface of the second support seat are arranged at intervals.
  • the two ends of the first driving screw are respectively rotatably connected to the first supporting base and the second supporting base, and the first driving screw is provided with an extending end extending out of the first supporting base, and the extending end of the first driving screw is A drive motor is fixedly mounted on the end for driving the first drive screw to rotate.
  • Both ends of the first stabilizing bar are respectively fixedly connected with the first supporting seat and the second supporting seat, and the first stabilizing bar and the first driving screw are arranged in parallel.
  • Both the third support seat and the fourth support seat are plate-shaped, and the plate surface of the third support seat is provided with a first connection hole and a second connection hole, wherein the first connection hole is a threaded hole, and the first connection hole is connected to the second connection hole.
  • the first driving screw is matched, and the second connecting hole is matched with the first stabilizing rod.
  • a third connection hole and a fourth connection hole are provided on the plate surface of the fourth support seat, and the third connection hole is a threaded hole, the third connection hole matches the first driving screw, the fourth connection hole and the first stable The bars match.
  • the third supporting base and the fourth supporting base are parallelly rotatably mounted on the first driving screw and the first stabilizing bar, so that the first driving screw can drive the third supporting base and the fourth supporting base to move.
  • the two ends of the second driving screw are respectively rotatably connected to the third supporting base and the fourth supporting base, and the second driving screw is provided with an extending end stretching out from the third supporting base, and the extending end of the second driving screw is A drive motor is fixedly mounted on the end for driving the second drive screw to rotate.
  • Both ends of the second stabilizing bar are respectively fixedly connected with the third supporting seat and the fourth supporting seat, and the second stabilizing bar and the second driving screw are arranged in parallel.
  • the mobile platform is plate-shaped, and the bottom of the mobile platform is provided with a fifth support seat and a sixth support seat, wherein the fifth support seat is provided with an internal thread hole matching the second driving screw, and the sixth support seat is provided with a There is a through hole matched with the second stabilizing bar, so that the moving platform can be driven to move by the rotation of the second driving screw, thus, the silicon wafer can be moved in the test chamber 100 through the above structure.
  • the first stabilizing bar and the second stabilizing bar are optical bars, thereby making the movement of the silicon wafer more stable.
  • a transitional isolation chamber 900 is further included, and the transitional isolation chamber 900 is communicated with the test chamber 100 .
  • a transport module 400 is installed inside the transition isolation chamber 900 , and the top of the transport module 400 is used to place silicon wafers or silicon wafer carrier boxes.
  • An isolation door 500 is provided at the connection between the transition isolation chamber 900 and the test chamber 100 , and the isolation door 500 isolates the transition isolation chamber 900 and the test chamber 100 .
  • the isolation door 500 is provided with a lifting assembly 600, which is used to control the opening or closing of the isolation door 500.
  • the side of the transitional isolation chamber 900 facing away from the test chamber 100 is provided with a pick-and-place opening, and an end cover is detachably installed at the pick-and-place opening. 700, the end cover 700 is provided with a pick-and-place opening.
  • the transition isolation chamber 900 and the test chamber 100 are first isolated by the isolation door 500, and then the end cover 700 is removed, and the silicon wafer or the silicon wafer carrier box is placed on the transport module 400, Afterwards, the upper end cover 700 is installed, and the lifting assembly 600 is used to lower the isolation door 500, and the silicon wafer or silicon wafer carrier box is transported to the side of the test chamber 100 through the transport module 400, and the silicon wafer or silicon wafer carrier is clamped by the fixture. box to complete the transportation of silicon wafers. Therefore, through the above structure, the vacuum environment in the test chamber 100 can not be damaged, which ensures the cleanliness of the internal environment of the test chamber 100 and maintains the vacuum degree.
  • the lifting assembly 600 includes a lifting motor 610 and a rotating screw 620, the lifting motor 610 is fixedly installed on the bottom inner wall of the test cavity 100, and the output end of the lifting motor 610 faces the test cavity The top of the body 100 is set.
  • the rotating lead screw 620 is fixedly connected with the output end of the lifting motor 610.
  • the side wall of the isolation door 500 is provided with a connecting portion 510, and the connecting portion 510 is provided with an internal thread, and the internal thread on the connecting portion 510 matches the rotating lead screw 620. . Thereby, it is convenient to lift and lower the isolation door 500 .
  • the two lifting assemblies 600 are respectively arranged on two sides of the isolation door 500 .
  • the lifting and lowering of the isolation door 500 is more stable.
  • the volume of the transition isolation chamber 900 is smaller than the volume of the test chamber 100 .
  • the transportation module 400 can adopt the transmission mode of the motor lead screw.
  • the transitional isolation chamber 900 protrudes into the test chamber 100, and the bottom of the side of the transitional isolation chamber 900 protruding into the test chamber 100 is provided with a lift Hole, lift hole and isolation door 500 matches. This enables the isolation door 500 to extend into the transitional isolation cavity 900 from the lifting hole.
  • the top of the test cavity 100 is provided with installation holes, the installation holes are set through the top side wall of the test cavity 100, and the installation holes are set at the top position of the parallel transfer module 200
  • the mounting hole is suitable for installing the electron gun 800 .
  • the installation of the electron gun 800 is facilitated.
  • the driving device 210 is fixedly connected to the moving frame 230 through a beryllium copper tapered bushing, and the moving device and the clamping member 240 are rotationally connected through a beryllium copper tapered bushing.
  • the beryllium-copper tapered bushing can ensure the rigidity of the overall structure and actively further eliminate the gap, thereby realizing point-to-point transfer and providing positioning accuracy.
  • the workflow of the electron gun test platform in the embodiment of the present application is as follows: open the end cover 700, put the silicon wafer carrier box into the pick-and-place opening, and place the silicon wafer carrier box containing the silicon wafers in the transportation module 400 on, and install the end cap 700 on.
  • the lifting motor 610 drives the isolation door 500 to descend by rotating the lead screw 620, the transport module 400 sends the wafer carrier box into the test chamber 100 and then stops, the driving device 210 drives the first rotating rod to rotate, and the first rotating rod moves to drive the second rotating rod.
  • the rotating rod moves, and the first rotating rod and the second rotating rod drive the clamping member 240 to move, clamp the silicon wafer carrier box, and place the silicon wafer carrier box on the mobile platform.
  • the mobile platform is provided with a groove for placing the silicon chip carrier.
  • the mobile module moves to the side away from the transitional isolation chamber 900 to disengage the silicon wafer carrier from the groove on the mobile platform, and then the driving device 210 drives the clamping part 240 to reset. At this time, the test operation is started.
  • the silicon wafer needs to be replaced, the above-mentioned process can be operated in a direction to complete a complete cycle.
  • the embodiment of the present application will realize the point-to-point transfer of the parallel link structure instead of the linear movement of the module, and the transition isolation cavity 900 is added to prevent the vacuum environment in the vacuum cavity from being damaged, and the human eye can directly observe the silicon
  • the positioning groove of the wafer box effectively improves the transfer positioning accuracy of the silicon wafer, the cleanliness of the environment in the vacuum chamber, and maintains the vacuum degree, and reduces energy consumption.

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  • Engineering & Computer Science (AREA)
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

一种电子枪测试平台，包括测试腔体（100）；测试腔体（100）内设有平行移载模组（200）和移动载具模组（300）；移动载具模组（300）与测试腔体（100）的内壁固定，移动载具模组（300）的顶部适用于放置硅片或者硅片载盒，平行移载模组（200）设置在移动载具模组（300）的旁侧；平行移载模组（200）包括驱动装置（210）、固定座（220）、移动架（230）和夹持件（240）；其中，固定座（220）固定安装在移动载具模组（300）旁侧，固定座（220）与测试腔体（100）的内壁固定；驱动装置（210）固定在固定座（220）上，驱动装置（210）的输出端与移动架（230）的一侧固定连接，移动架（230）的另一侧与夹持件（240）转动连接；夹持件（240）适用于夹持硅片载盒，驱动装置（210）驱动夹持件（240）在移动载具模组（300）的顶部移动。能有效解决取放硅片带来的接驳间隙存在的误差，以及运动模组和真空馈入装置的重复定位误差。

Description

电子枪测试平台 技术领域
本申请涉及半导体设备领域，尤其涉及一种电子枪测试平台。
背景技术
在电子枪的制造过程中，电子枪测试平台用来使电子枪在测试过程中能够使硅片放取及定位满足电子枪测试要求，比如硅片放置位置偏差等。该平台的主要工作原理是破坏真空压力后，利用真空馈入装置将硅片送至运动平台上电子枪测试所需位置，放置的精度及速度决定了电子枪在测试过程中调节参数得快捷稳定等。
现有电子枪测试平台主要是通过真空馈入装置将硅片推送至二维XY运动模组，这样的方式接驳会存在间隙误差。
发明内容
有鉴于此，本申请提出了一种电子枪测试平台，其有效的解决了取放硅片带来的接驳间隙存在的误差，以及运动模组和真空馈入装置的重复定位误差。
根据本申请的一方面，提供了一种电子枪测试平台，包括测试腔体；
所述测试腔体内设有平行移载模组和移动载具模组；
所述移动载具模组与所述测试腔体的内壁固定，所述移动载具模组的顶部适用于放置硅片或者硅片载盒，所述平行移载模组设置在所述移动载具模组的旁侧；
所述平行移载模组包括驱动装置、固定座、移动架和夹持件；
其中，所述固定座固定安装在所述移动载具模组旁侧，所述固定座与所述测试腔体的内壁固定；
所述驱动装置固定在所述固定座上，所述驱动装置的输出端与所述移动 架的一侧固定连接，所述移动架的另一侧与所述夹持件转动连接；
所述夹持件适用于夹持所述硅片载盒，所述驱动装置驱动所述夹持件在所述移动载具模组的顶部移动。
在一种可能的实现方式中，所述移动架包括第一转动件和第二转动件；
其中，所述驱动装置的输出端与所述第一转动件固定连接，所述第一转动件的另一端与所述夹持件铰接；
所述固定架上设有铰接座，所述第二转动件的一侧与所述铰接座铰接，所述第二转动件的另一侧与所述夹持件铰接；
所述第二转动件与所述第一转动件同步转动。
在一种可能的实现方式中，所述夹持件朝向所述第一转动件的一侧设有第一铰接杆和第二铰接杆；
所述第一铰接杆和所述第二铰接杆均与所述夹持件固定，所述第一转动件未与所述驱动装置固定连接的一侧与所述第一铰接杆铰接，所述第二转动件未与所述铰接部铰接的一侧与所述第二铰接杆铰接。
在一种可能的实现方式中，所述夹持件包括第一部件和第二部件，所述第一部件和所述第二部件均呈板状，所述第一部件和所述第二部件呈“L”连接，所述第二部件背离所述第一部件的一侧板面上设有夹持部，用于夹持所述硅片载盒；
所述移动架组转动连接在所述第一部件背离所述第二部件的一侧板面上，所述夹持部朝向所述移动载具模组的顶部设置。
在一种可能的实现方式中，所述移动载具模组包括移动模组；
所述移动模组固定安装在所述测试腔体的底部内壁上，所述移动模组上移动安装有移动平台，所述移动模组驱动所述移动平台移动，所述移动平台的顶部适用于放置所述硅片或者所述硅片载盒。
在一种可能的实现方式中，还包括过渡隔离腔体，所述过渡隔离腔体与所述测试腔体连通设置；
所述过渡隔离腔体的内部安装有运输模组，所述运输模组的顶部适用于 放置硅片或者硅片载盒；
所述过渡隔离腔体和所述测试腔体连通处设有隔离门，所述隔离门隔离所述过渡隔离腔体和所述测试腔体；
所述隔离门上设置有升降组件，用于控制所述隔离门的打开或者关闭；
所述过渡隔离腔体背离所述测试腔体的一侧设有取放口，所述取放口处可拆卸安装有端盖，所述端盖盖设所述取放口设置。
在一种可能的实现方式中，所述升降组件包括升降电机和转动丝杠；
所述升降电机固定安装在所述测试腔体的底部内壁上，所述升降电机的输出端朝向所述测试腔体的顶部设置；
所述转动丝杠与所述升降电机的输出端固定连接；
所述隔离门的侧壁上设置有连接部，所述连接部上设有内螺纹，所述连接部上的内螺纹与所述转动丝杠相匹配。
在一种可能的实现方式中，所述升降组件设有两个，两个所述升降组件分别设置在所述隔离门的两侧。
在一种可能的实现方式中，所述测试腔体的顶部设有安装孔，所述安装孔贯穿所述测试腔体的顶部侧壁设置；
所述安装孔设置在所述平行移载模组的顶部位置处；
所述安装孔处适用于安装电子枪。
在一种可能的实现方式中所述驱动装置与所述移动架通过铍铜锥形轴套固定连接；
所述移动装置和所述夹持件通过铍铜锥形轴套转动连接。，
本申请实施例电子枪测试平台设有测试腔体，平行移动模组和移动载具模组均安装在测试腔体内，其中，移动载具模组的顶部用于放置硅片或者硅片载盒，且移动载具模组更够在测试腔体内进行移动。平行移载模组用于夹持硅片载盒，且平行移载模组中的固定座与测试腔体固定，为驱动装置、移动架和夹持件提供了安装部件。在硅片输送至移动载具模组时，驱动装置驱动移动架进行转动，带动移动架上的夹持件向放置硅片的硅片载盒的一侧移 动，并夹持件夹持硅片载体。之后驱动装置在驱动夹持有硅片载盒的夹持件向移动载具模组一侧移动，并将硅片载盒放置在移动载具模组的顶部，完成硅片的放置。本申请实施例电子枪测试平台通过上述的结构有效的解决了取放硅片带来的接驳间隙存在的误差，以及运动模组和真空馈入装置的重复定位误差。
根据下面参考附图对示例性实施例的详细说明，本申请的其它特征及方面将变得清楚。
附图说明
包含在说明书中并且构成说明书的一部分的附图与说明书一起示出了本申请的示例性实施例、特征和方面，并且用于解释本申请的原理。
图1示出本申请实施例的电子枪测试平台的主视图；
图2示出本申请实施例的电子枪测试平台的左视图；
图3示出本申请实施例的电子枪测试平台的俯视图；
图4示出本申请实施例的电子枪测试平台的平行移载模组的主视图；
图5示出本申请实施例的电子枪测试平台的平行移载模组的左视图。
具体实施方式
以下将参考附图详细说明本申请的各种示例性实施例、特征和方面。附图中相同的附图标记表示功能相同或相似的元件。尽管在附图中示出了实施例的各种方面，但是除非特别指出，不必按比例绘制附图。
其中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明或简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在这里专用的词“示例性”意为“用作例子、实施例或说明性”。这里作为“示例性”所说明的任何实施例不必解释为优于或好于其它实施例。
另外，为了更好的说明本申请，在下文的具体实施方式中给出了众多的具体细节。本领域技术人员应当理解，没有某些具体细节，本申请同样可以实施。在一些实例中，对于本领域技术人员熟知的方法、手段、元件和电路未作详细描述，以便于凸显本申请的主旨。
图1示出本申请实施例的电子枪测试平台的主视图。图2示出本申请实施例的电子枪测试平台的左视图。图3示出本申请实施例的电子枪测试平台的俯视图。图4示出本申请实施例的电子枪测试平台的平行移载模组200的主视图。图5示出本申请实施例的电子枪测试平台的平行移载模组200的左视图。如图1、图2、图3、图4或图5所示，该电子枪测试平台包括：测试腔体100，测试腔体100的内部设有平行移载模组200和移动载具模组300，其中，移动载具模组300与测试腔体100的内壁固定连接，移动载具模组300的顶部放置硅片或者硅片载盒，平行移载模组200设置在移动载具模组300的旁侧。平行移载模组200包括驱动装置210、固定座220、移动架230和夹持件240，其中，固定座220固定安装在移动载具模组300的旁侧，固定座220与测试腔体100的内壁固定。驱动装置210固定安装在固定座220上，驱动装置210的输出轴与移动架230的一侧固定连接，移动架230的另一侧与夹持件240转动连接。夹持件240用于夹持硅片载盒，驱动装置210驱动夹持件240在移动载具模组300的顶部移动。
本申请实施例电子枪测试平台设有测试腔体100，平行移动模组和移动载具模组300均安装在测试腔体100内，其中，移动载具模组300的顶部用于放置硅片或者硅片载盒，且移动载具模组300更够在测试腔体100内进行移动。 平行移载模组200用于夹持硅片载盒，且平行移载模组200中的固定座220与测试腔体100固定，为驱动装置210、移动架230和夹持件240提供了安装部件。在硅片输送至移动载具模组300时，驱动装置210驱动移动架230进行转动，带动移动架230上的夹持件240向放置硅片的硅片载盒的一侧移动，并夹持件240夹持硅片载体。之后驱动装置210在驱动夹持有硅片载盒的夹持件240向移动载具模组300一侧移动，并将硅片载盒放置在移动载具模组300的顶部，完成硅片的放置。本申请实施例电子枪测试平台通过上述的结构有效的解决了取放硅片带来的接驳间隙存在的误差，以及运动模组和真空馈入装置的重复定位误差。
在一种可能的实现方式中，移动架230包括第一转动件231和第二转动件232，其中，驱动装置210的输出端与第一转动件231固定连接，第一转动件231的另一端与夹持件240铰接设置。固定架上设有铰接座，第二转动件232的一侧与铰接座铰接，第二转动件232的另一侧与夹持架铰接设置，在驱动装置210驱动第一转动件231转动时，第二转动件232与第一转动件231同步转动。本申请实施例通过将移动架230设置为第一转动件231和第二转动件232，由此使得本申请实施例的结构更加的稳定。
更进一步的，在一种可能的实现方式中，夹持件240朝向第一转动件231的一侧设有第一铰接杆260和第二铰接杆250，其中，第一铰接杆260、第二铰接杆250均与夹持件240固定，第一转动件231未与驱动装置210固定连接的一侧与第一铰接杆260铰接，第二转动件232未与与铰接部铰接的一侧与第二铰接杆250铰接。由此，进一步的优化了本申请实施例的结构。
此处，应当指出的是，在一种可能的实现方式中，第一转动件231和第二转动件232均呈板状，铰接座呈杆状，铰接座设置在驱动装置210的上方，且第一转动件231和第二转动件232安装后，第一转动件231和第二转动件232平行设置。由此，第一转动件231、第二转动件232、夹持件240与固定座220形成一个平行四边形的平动机构，使得本申请实施例的结构更加的稳固。
此处，还应当指出的是，在一种可能的实现方式中，第二转动件232的 板面和第一转动件231的板面均朝向固定座220设置，且第二转动件232邻近固定座220设置。
在一种可能的实现方式中，夹持件240包括第一部件241和第二部件242，第一部件241和第二部件242均呈板状，第一部件241和第二部件242连接呈“L”板状。第二部件242背离第一部件241的一侧板面上设有夹持部，夹持部用于夹持硅片载盒。移动架230转动连接在第一部件241背离第二部件242的一侧板面上，夹持部朝向移动载具模组300的顶部设置。由此，通过上述夹持件240的结构使用夹持件240的夹持部能够处于移动移动载具模组300的顶部位置处。
此处，应当指出的是，在一种可能的实现方式中，夹持部呈凹槽状，夹持部相对设置的槽壁上均设有夹件，夹件呈沿夹持部的槽壁设置的板状，由此，可以通过上述的结构更够更加的稳固的夹持硅片载盒。
此处，还应当指出的是，在一种可能的实现方式中，固定座220呈“L”形的板状，由此使得驱动装置210固定安装在固定座220的一侧板面上，固定座220未固定驱动装置210的板面上与测试腔体100的内壁固定连接。
此处，还应当指出的是，在一种可能的实现方法中，驱动装置210可以采用电机来实现，此处不做赘述。
在一种可能的实现方式中，移动载具模组300包括移动模组，其中，移动模组固定安装在测试枪的底部内壁上，移动模组上移动安装有移动平台，移动模组驱动移动平台，移动平台的顶部用于放置硅片或者硅片载盒。由此，通过移动平台为硅片或者硅片载盒提供了放置空间，通过移动模组能够控制移动平台移动，由此，能够使得硅片在测试腔体100内进行传输。
此处，应当指出的是，在一种可能的实现方式中，移动模组包括第一支撑座、第二支撑座、第三支撑座、第四支撑座、第一驱动丝杠、第一稳定杠、第二驱动丝杠和第二稳定杠。第一支撑座和第二支撑座均呈板状，且第一支撑座和第二支撑座均与测试腔体100的底部内壁固定连接，且第一支撑座的板面和第二支撑座的板面相对设置，第一支撑座的板面和第二支撑座的板面 间隔设置。第一驱动丝杠的两端分别转动连接在第一支撑座和第二支撑座上，且第一驱动丝杠设有伸出第一支撑座的伸出端，第一驱动丝杠的伸出端上固定安装有驱动电机，用于驱动第一驱动丝杠转动。第一稳定杠的两端分别与第一支撑座和第二支撑座固定连接，第一稳定杠和第一驱动丝杠平行设置。
第三支撑座和第四支撑座均呈板状，且第三支撑座的板面上开设有第一连接孔和第二连接孔，其中，第一连接孔为螺纹孔，第一连接孔与第一驱动丝杠相匹配，第二连接孔和第一稳定杠向匹配。第四支撑座的板面上开设有第三连接孔和第四连接孔，且第三连接孔为螺纹孔，第三连接孔与第一驱动丝杠相匹配，第四连接孔和第一稳定杠相匹配。由此，使得第三支撑座和第四支撑座平行的转动安装在第一驱动丝杠、第一稳定杠上，使得第一驱动丝杠能够驱动第三支撑座和第四支撑座移动。
第二驱动丝杠的两端分别转动连接在第三支撑座和第四支撑座上，且第二驱动丝杠设有伸出第三支撑座的伸出端，第二驱动丝杠的伸出端上固定安装有驱动电机，用于驱动第二驱动丝杠转动。第二稳定杠的两端分别与第三支撑座和第四支撑座固定连接，第二稳定杠和第二驱动丝杠平行设置。移动平台呈板状，移动平台的底部设有第五支撑座和第六支撑座，其中，第五支撑座上开设有与第二驱动丝杠相匹配的内螺纹孔，第六支撑座上开设有与第二稳定杠相匹配的通孔，由此，可以通过第二驱动丝杠的转动驱动移动平台移动，由此，通过上述的结构使得硅片能够在测试腔体100内进行移动。
此处，还应当指出的是，在一种可能的实现方式中，第一稳定杠和第二稳定杠为光杠，由此，使得硅片的移动更加的平稳。
在一种可能的实现方式中，还包括过渡隔离腔体900，过渡隔离腔体900和测试腔体100连通设置。过渡隔离腔体900的内部安装有运输模组400，运输模组400的顶部用于放置硅片或者硅片载盒。过渡隔离腔体900和测试腔体100的连通处设有隔离门500，隔离门500隔离过渡隔离腔体900和测试腔体100。隔离门500上设置有升降组件600，用于控制隔离门500的打开或者关闭，过渡隔离腔体900背离测试腔体100的一侧设有取放口，取放口处可拆卸安装 有端盖700，端盖700盖设取放口设置。由此，在硅片进行放置时候，先用隔离门500将过渡隔离腔体900和测试腔体100隔离，之后拆下端盖700，将硅片或者硅片载盒放置在运输模组400上，之后安装上端盖700，使用升降组件600，将隔离门500下降，通过运输模组400将硅片或者硅片载盒运输至测试腔体100一侧，夹具件夹持将硅片或者硅片载盒，完成硅片的运输。由此，通过上述的结构可以使得测试腔体100内的真空环境不被破坏，保证了测试腔体100内部环境的洁净及保持真空度。
更进一步的，在一种可能的实现方式中，升降组件600包括升降电机610和转动丝杠620，升降电机610固定安装在测试腔体100的底部内壁上，升降电机610的输出端朝向测试腔体100的顶部设置。转动丝杠620与升降电机610的输出端固定连接，隔离门500的侧壁上设置有连接部510，连接部510上设有内螺纹，连接部510上的内螺纹与转动丝杠620相匹配。由此，方便了隔离门500进行升降。
更进一步的，在一种可能的实现方式中，升降组件600设有两个，两个升降组件600分别设置在隔离门500的两侧。由此，使得隔离门500的升降更加的稳固。
此处，应当指出的是，在一种可能的实现方式中，过渡隔离腔体900的体积小于测试腔体100的体积。运输模组400可以采用电机丝杠的传输方式。
此处，还应当指出的是，在一种可能的实现方式中，过渡隔离腔体900伸入测试腔体100设置，过渡隔离腔体900伸入测试腔体100的一侧的底部开设有升降孔，升降孔与隔离门500相匹配。使得隔离门500能够从升降孔伸入过渡隔离腔体900。
更进一步的，在一种可能的实现方式中，测试腔体100的顶部设有安装孔，安装孔贯穿测试腔体100的顶部侧壁设置，安装孔设置在平行移载模组200的顶部位置处，安装孔处适用于安装电子枪800。由此，方便了电子枪800的安装。
在一种可能的实现方式中，驱动装置210与移动架230通过铍铜锥形轴套 固定连接，移动装置和夹持件240通过铍铜锥形轴套转动连接。通过铍铜锥形轴套可以保证整体的结构的刚性及主动进一步的消除了间隙，从而实现点对点的移载并提供了定位精度。
综上所述，本申请实施例电子枪测试平台的工作流程为：打开端盖700将硅片载盒放入取放口处，并将装有硅片的硅片载盒放置在运输模组400上，并将端盖700安装上。升降电机610通过转动丝杠620带动隔离门500下降，运输模组400将硅片载盒送入测试腔体100后停止，驱动装置210驱动第一转动杆转动，第一转动杆移动带动第二转动杆移动，第一转动杆和第二转动杆带动夹持件240移动，并夹持硅片载盒，并将硅片载盒放置在移动平台上。此处，应当这次的是，移动平台上设有放置硅片载体的凹槽。移动模组向远离过渡隔离腔体900的一侧移动，将硅片载盒脱离移动平台上的凹槽，之后驱动装置210驱动夹持件240复位，此时，开设测试工作。在需要更换硅片时候，可以对上述的过程进行方向操作，完成一个完成的循环。由此本申请实施例将可实现点对点移载的平行连杆结构代替模组的直线运动，并且加入了过渡隔离腔体900使真空腔内的真空环境不被破坏，人眼可直接观察到硅片载盒定位槽，从而有效的提高了硅片的移载定位精度、真空腔内环境的洁净度及保持真空度，并且减少了能耗。
以上已经描述了本申请的各实施例，上述说明是示例性的，并非穷尽性的，并且也不限于所披露的各实施例。在不偏离所说明的各实施例的范围和精神的情况下，对于本技术领域的普通技术人员来说许多修改和变更都是显而易见的。本文中所用术语的选择，旨在最好地解释各实施例的原理、实际应用或对市场中的技术的改进，或者使本技术领域的其它普通技术人员能理解本文披露的各实施例。

Claims (10)

  1. 一种电子枪测试平台，其特征在于，包括测试腔体；
    所述测试腔体内设有平行移载模组和移动载具模组；
    所述移动载具模组与所述测试腔体的内壁固定，所述移动载具模组的顶部适用于放置硅片或者硅片载盒，所述平行移载模组设置在所述移动载具模组的旁侧；
    所述平行移载模组包括驱动装置、固定座、移动架和夹持件；
    其中，所述固定座固定安装在所述移动载具模组旁侧，所述固定座与所述测试腔体的内壁固定；
    所述驱动装置固定在所述固定座上，所述驱动装置的输出端与所述移动架的一侧固定连接，所述移动架的另一侧与所述夹持件转动连接；
    所述夹持件适用于夹持所述硅片载盒，所述驱动装置驱动所述夹持件在所述移动载具模组的顶部移动。
  2. 根据权利要求1所述的电子枪测试平台，其特征在于，所述移动架包括第一转动件和第二转动件；
    其中，所述驱动装置的输出端与所述第一转动件固定连接，所述第一转动件的另一端与所述夹持件铰接；
    所述固定架上设有铰接座，所述第二转动件的一侧与所述铰接座铰接，所述第二转动件的另一侧与所述夹持件铰接；
    所述第二转动件与所述第一转动件同步转动。
  3. 根据权利要求2所述的电子枪测试平台，其特征在于，所述夹持件朝向所述第一转动件的一侧设有第一铰接杆和第二铰接杆；
    所述第一铰接杆和所述第二铰接杆均与所述夹持件固定，所述第一转动件未与所述驱动装置固定连接的一侧与所述第一铰接杆铰接，所述第二转动件未与所述铰接部铰接的一侧与所述第二铰接杆铰接。
  4. 根据权利要求1所述的电子枪测试平台，其特征在于，所述夹持件包括第一部件和第二部件，所述第一部件和所述第二部件均呈板状，所述第一部件和所述第二部件呈“L”连接，所述第二部件背离所述第一部件的一侧 板面上设有夹持部，用于夹持所述硅片载盒；
    所述移动架组转动连接在所述第一部件背离所述第二部件的一侧板面上，所述夹持部朝向所述移动载具模组的顶部设置。
  5. 根据权利要求1所述的电子枪测试平台，其特征在于，所述移动载具模组包括移动模组；
    所述移动模组固定安装在所述测试腔体的底部内壁上，所述移动模组上移动安装有移动平台，所述移动模组驱动所述移动平台移动，所述移动平台的顶部适用于放置所述硅片或者所述硅片载盒。
  6. 根据权利要求1所述的电子枪测试平台，其特征在于，还包括过渡隔离腔体，所述过渡隔离腔体与所述测试腔体连通设置；
    所述过渡隔离腔体的内部安装有运输模组，所述运输模组的顶部适用于放置硅片或者硅片载盒；
    所述过渡隔离腔体和所述测试腔体连通处设有隔离门，所述隔离门隔离所述过渡隔离腔体和所述测试腔体；
    所述隔离门上设置有升降组件，用于控制所述隔离门的打开或者关闭；
    所述过渡隔离腔体背离所述测试腔体的一侧设有取放口，所述取放口处可拆卸安装有端盖，所述端盖盖设所述取放口设置。
  7. 根据权利要求6所述的电子枪测试平台，其特征在于，所述升降组件包括升降电机和转动丝杠；
    所述升降电机固定安装在所述测试腔体的底部内壁上，所述升降电机的输出端朝向所述测试腔体的顶部设置；
    所述转动丝杠与所述升降电机的输出端固定连接；
    所述隔离门的侧壁上设置有连接部，所述连接部上设有内螺纹，所述连接部上的内螺纹与所述转动丝杠相匹配。
  8. 根据权利要求6所述的电子枪测试平台，其特征在于，所述升降组件设有两个，两个所述升降组件分别设置在所述隔离门的两侧。
  9. 根据权利要求1至8任一项所述的电子枪测试平台，其特征在于，所 述测试腔体的顶部设有安装孔，所述安装孔贯穿所述测试腔体的顶部侧壁设置；
    所述安装孔设置在所述平行移载模组的顶部位置处；
    所述安装孔处适用于安装电子枪。
  10. 根据权利要求1至8任一项所述的电子枪测试平台，其特征在于，所述驱动装置与所述移动架通过铍铜锥形轴套固定连接；
    所述移动装置和所述夹持件通过铍铜锥形轴套转动连接。
PCT/CN2021/098303 2021-05-27 2021-06-04 电子枪测试平台 WO2022246894A1 (zh)

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