WO2022244071A1 - 部品突上げ装置及び部品実装装置 - Google Patents

部品突上げ装置及び部品実装装置 Download PDF

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Publication number
WO2022244071A1
WO2022244071A1 PCT/JP2021/018640 JP2021018640W WO2022244071A1 WO 2022244071 A1 WO2022244071 A1 WO 2022244071A1 JP 2021018640 W JP2021018640 W JP 2021018640W WO 2022244071 A1 WO2022244071 A1 WO 2022244071A1
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WO
WIPO (PCT)
Prior art keywords
push
component
magnet
wafer
die
Prior art date
Application number
PCT/JP2021/018640
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
洋平 岸本
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to CN202180097917.6A priority Critical patent/CN117280453A/zh
Priority to PCT/JP2021/018640 priority patent/WO2022244071A1/ja
Priority to KR1020237035708A priority patent/KR20230158099A/ko
Priority to JP2023522019A priority patent/JPWO2022244071A1/ja
Priority to DE112021007307.9T priority patent/DE112021007307T5/de
Priority to TW110126899A priority patent/TWI830034B/zh
Publication of WO2022244071A1 publication Critical patent/WO2022244071A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/6839—Separation by peeling using peeling wedge or knife or bar

Definitions

  • the present invention includes a component push-up device that pushes up and separates a die (bare chip) from below a wafer sheet when picking up the die (bare chip) from the wafer attached to the wafer sheet, and the component push-up device. It relates to a component mounting apparatus.
  • a component mounting apparatus that picks up a die (bare chip) from a diced wafer and mounts it on a substrate is known.
  • a wafer camera takes an image of a wafer carried into a predetermined position (component placement area) inside the machine by a wafer feeder to recognize the wafer, and then the die is picked by a head equipped with a die holding function. The action of doing is repeated.
  • the component mounting device is equipped with a component push-up device that separates the die from the wafer sheet prior to die picking by pushing up the die from below the wafer attached to the wafer sheet.
  • the component push-up device includes a columnar suction housing and a push-up pin provided at the center thereof so as to be retractable. With the wafer sheet sucked from below by the suction housing, the die is pushed up from below by the push-up pin. Push up.
  • Japanese Laid-Open Patent Publication No. 2002-100000 discloses a component push-up device that includes a unit called a suction pot that includes a suction housing and a push-up pin, and that the suction pot is replaceable.
  • a clamping mechanism is incorporated in the suction pot, and it can be attached to, detached from, or replaced by operating a lever on a predetermined mounting portion.
  • the present invention has been made in view of the above-mentioned problems, and its object is to make it possible to change the push-up tool such as the suction housing and the push-up pin in a component push-up device with a simpler configuration. .
  • a component push-up device is a component push-up device that separates a die from a wafer sheet by pushing up the die from below the wafer attached to the wafer sheet, wherein the wafer an attracting surface that attracts the lower surface of the sheet under negative pressure; and a thrust tool that includes a thrust pin that is provided so as to be retractable from the attracting surface to the wafer sheet side and protrudes from the attracting surface to push up the die; a support member that is relatively movable along the wafer and detachably supports the push-up tool, and a magnet is provided on one side of the push-up tool and the support member. At least the surface facing the magnet on the other side is made of a magnetic material.
  • a component mounting apparatus includes a component supply unit in which a wafer that has been diced and attached to a wafer sheet is placed, and a die is picked from the wafer placed in the component supply unit. a component transfer head that transfers the component onto a substrate by means of the component transfer head;
  • FIG. 1 is a top plan view showing the overall configuration of a component mounting apparatus according to an embodiment of the present invention (a component mounting apparatus provided with a component pushing-up apparatus of the present invention).
  • FIG. 2 is a schematic perspective view showing a head unit and a push-up unit.
  • FIG. 3 is a perspective view of a push-up unit.
  • FIG. 4 is an enlarged perspective view of a main portion of the push-up unit.
  • FIG. 5 is a perspective view of the push-up head.
  • FIG. 6 is a cross-sectional view of the push-up head.
  • FIGS. 7A to 7C are explanatory diagrams of the pushing-up operation of the die by the pushing-up head.
  • FIG. 8 is a table showing the magnetic pole relationship between the fixed magnets of the attraction housing and the fixed magnets of the attraction housing.
  • FIG. 1 is a top plan view showing the overall configuration of a component mounting apparatus 1 according to an embodiment of the present invention.
  • the component mounting apparatus 1 is an apparatus that mounts a die 7a (component) diced from a wafer 7 on a substrate P.
  • FIG. The component mounting apparatus 1 includes a base 2 , a conveyor 3 , a head unit 4 , a component supply section 5 (component placement area), a wafer supply apparatus 6 , a camera unit 32U and a push-up unit 40 .
  • FIG. 2 is a schematic perspective view showing the head unit 4 and the push-up unit 40 not shown in FIG.
  • the base 2 is a mounting base for various devices provided in the component mounting apparatus 1 .
  • the conveyor 3 is a transport line for the substrate P installed on the base 2 so as to extend in the X direction.
  • the conveyor 3 carries the board P from the outside to a predetermined mounting work position, and carries the board P out of the machine from the work position after the mounting work.
  • the position where the substrate P is shown in FIG. 1 is the mounting work position.
  • the component supply unit 5 supplies a plurality of dies 7a arranged by dicing from the wafer 7 .
  • the head unit 4 picks the die 7a in the component supply unit 5, moves to the mounting work position, and mounts the die 7a on the board P.
  • the head unit 4 includes a plurality of heads 4H (“component transfer heads” of the present invention) that attract and hold the die 7a during the picking.
  • the head 4H can move back and forth (up and down) in the Z direction with respect to the head unit 4 and can rotate about its axis.
  • the head unit 4 is equipped with a substrate recognition camera 31 that captures an image of the substrate P. As shown in FIG. The feducial mark attached to the board P is recognized from the photographed image of the board recognition camera 31, and the positional deviation is corrected at the time of component mounting.
  • the component mounting apparatus 1 includes a drive mechanism D1 that allows the head unit 4 to move horizontally (X and Y directions) between the component supply unit 5 and the board P held at the mounting position.
  • the drive mechanism D1 includes a pair of Y-axis fixed rails 13, a first Y-axis servomotor 14 and a ball screw shaft 15 on the +X side and the -X side, and a support frame 16 constructed between the pair of Y-axis fixed rails 13. It has The ball screw shaft 15 is screwed onto a nut 17 provided on the support frame 16 .
  • the drive mechanism D ⁇ b>1 also includes a guide member (not shown) mounted on the support frame 16 , a first X-axis servomotor 18 and a ball screw shaft 19 .
  • the guide member supports the head unit 4 so as to be movable in the X direction, and the ball screw shaft 19 is screwed to a nut (not shown) provided on the head unit 4 .
  • the head unit 4 moves in the horizontal direction (X and Y directions). That is, when the ball screw shaft 15 is rotationally driven by the first Y-axis servomotor 14, the head unit 4 moves together with the support frame 16 in the Y direction. Further, the head unit 4 moves in the X direction with respect to the support frame 16 by rotationally driving the ball screw shaft 19 by the first X-axis servomotor 18 .
  • the component supply unit 5 includes a wafer supply device 6 that supplies a plurality of dies 7a in the form of wafers 7 to a predetermined component extraction work position (wafer stage 10).
  • the wafer feeder 6 includes a wafer holding frame 8 that holds a wafer sheet 8a. An assembly of a large number of dies 7a, 7a, .
  • the wafer feeder 6 feeds the dies 7a to the component extraction work position in such a manner that the wafer holding frame 8 is replaced.
  • the wafer supply device 6 includes a wafer storage elevator 9, a wafer stage 10 and a wafer conveyor 11.
  • the wafer storage elevator 9 stores the wafer sheets 8a to which the wafers 7 are adhered on the wafer holding frame 8 in multiple stages.
  • a wafer stage 10 is installed on the base 2 at a position on the -Y side of the wafer storage elevator 9 .
  • the wafer stage 10 is arranged at a position aligned on the +Y side with respect to the mounting work position where the substrate P is stopped.
  • a wafer conveyor 11 draws the wafer holding frame 8 from the wafer storage elevator 9 onto the wafer stage 10 .
  • the camera unit 32U is a unit that is movable in the X and Y directions, and includes the wafer camera 32. Wafer camera 32 images a portion of wafer 7 positioned on wafer stage 10, that is, die 7a within the camera's field of view. Based on this captured image, the position of the die 7a to be picked up is recognized.
  • the component mounting apparatus 1 includes a drive mechanism D2 that allows the camera unit 32U to move in the horizontal direction (X and Y directions) between the component supply unit 5 and a predetermined standby position.
  • the drive mechanism D2 includes a pair of Y-axis fixed rails 33 on the +X side and the -X side, a second Y-axis servomotor 34 and a ball screw shaft 35 arranged on the +X side, and between the pair of Y-axis fixed rails 33. and a suspended support frame 36 .
  • the ball screw shaft 35 is screwed onto a nut 37 provided on the support frame 36 .
  • the drive mechanism D ⁇ b>2 also includes a guide member (not shown) mounted on the support frame 36 , a second X-axis servomotor 38 and a ball screw shaft 39 .
  • the guide member supports the camera unit 32U so as to be movable in the X direction, and the ball screw shaft 39 is screwed to a nut (not shown) provided on the camera unit 32U.
  • the camera unit 32U moves in the horizontal direction (X and Y directions). That is, when the ball screw shaft 35 is rotationally driven by the second Y-axis servomotor 34, the camera unit 32U moves together with the support frame 36 in the Y direction. Further, the camera unit 32U moves in the X direction with respect to the support frame 36 by rotationally driving the ball screw shaft 39 by the second X-axis servomotor 38 .
  • the push-up unit 40 is arranged below the component supply unit 5, and pushes up the die 7a to be picked up by the head 4H from the lower surface side of the wafer sheet 8a.
  • the push-up unit 40 is arranged on the base 2 so as to be movable in the XY directions over a range corresponding to the wafer stage 10 .
  • the component mounting apparatus 1 includes a drive mechanism D3 that allows the push-up unit 40 to move.
  • the drive mechanism D3 includes a support frame 42 movable along a pair of guide rails 41 extending in the Y direction, a ball screw shaft 43 extending in the Y direction, and a third Y-axis servomotor 44.
  • the ball screw shaft 43 is screwed into a nut (not shown) provided on the support frame 42 .
  • the X-direction movement mechanism includes a guide member (not shown) mounted on the support frame 42 , a third X-axis servomotor 46 and a ball screw shaft 45 .
  • the guide member supports the push-up unit 40 so as to be movable in the X direction, and the ball screw shaft 45 is screwed to a nut (not shown) provided on the push-up unit 40 .
  • the push-up unit 40 moves in the horizontal direction (X and Y directions). That is, when the ball screw shaft 43 is rotationally driven by the third Y-axis servomotor 44, the push-up unit 40 moves together with the support frame 42 in the Y direction. Further, the ball screw shaft 45 is rotationally driven by the third X-axis servomotor 46, so that the push-up unit 40 moves in the X direction with respect to the support frame 42. As shown in FIG.
  • the push-up unit 40 has two push-up heads 50A and 50B each provided with a push-up pin 71 for pushing up the die 7a (only the push-up pin 71 is shown in FIG. 2), as will be described in detail later.
  • the push-up unit 40 raises the push-up pins 71 to push up the die 7a through the wafer sheet 8a when the die 7a is sucked by the head 4H.
  • the pushing-up unit 40 and the drive mechanism D3 described above correspond to the "parts pushing-up device" of the present invention.
  • a component recognition camera 30 is installed on the base 2 .
  • the component recognition camera 30 images the die 7a sucked by the head 4H of the head unit 4 from below before being mounted on the substrate P. As shown in FIG. Based on this captured image, it is determined whether the head 4H has picked up the die 7a abnormally or picked up incorrectly.
  • the basic operation of the component mounting apparatus 1 described above is as follows. First, the wafer holding frame 8 is pulled out from the wafer storage elevator 9 by the wafer conveyor 11 . Accordingly, the wafer sheet 8a to which the assembly (wafer 7) of the many dies 7a, 7a, . . .
  • the camera unit 32U moves above the wafer stage 10 and images the wafer 7.
  • the imaging by the camera unit 32U is for recognition of the group of dies 7a to be picked up by the head 4H in the later picking operation.
  • the camera unit 32U When the imaging of the group of dies 7a is completed, the camera unit 32U is retracted from above the wafer stage 10, while the head unit 4 is placed above the wafer stage 10 and the push-up unit 40 is placed below the wafer 7, respectively. Then, the head 4H picks from the wafer 7 a group of dies 7a recognized by the imaging by the camera unit 32U. At this time, the push-up pins 71 of the push-up unit 40 are raised to push up the die 7a through the wafer sheet 8a.
  • the head unit 4 moves from above the wafer stage 10 to above the substrate P at the mounting work position via the component recognition camera 30. As a result, the die 7a sucked by the head 4H is mounted on the substrate P. As shown in FIG.
  • the camera unit 32U After picking the die 7a, when the head unit 4 moves from above the wafer stage 10, the camera unit 32U enters and moves above the wafer stage 10 in synchronization with this movement. After that, the head unit 4 and the camera unit 32U are moved above the wafer stage 10 so as to be sequentially replaced, and the picking of the die 7a and the mounting operation on the substrate P are repeated.
  • FIG. 3 is a perspective view of the push-up unit 40
  • FIG. 5 is a perspective view of the push-up heads 50A and 50B provided in the push-up unit 40
  • FIG. 6 is a cross-sectional view of the push-up heads 50A and 50B.
  • the push-up unit 40 has a base frame 47 connected to the drive mechanism D3.
  • the base frame 47 includes a pair of push-up heads 50A and 50B, a switching mechanism D4 for switching between the push-up heads 50A and 50B, and a first lifting mechanism D5 for advancing and retreating (elevating) the push-up heads 50A and 50B in the Z direction. and a second elevating mechanism D6 for advancing and retreating (elevating) in the Z direction the thrusting pins 71 provided in the thrusting heads 50A and 50B.
  • the push-up heads 50A and 50B push up the die 7a through the wafer sheet 8a when the die 7a is sucked by the head 4H.
  • the push-up heads 50A and 50B have basically the same structure except for the type of push-up tool 60 described later.
  • the push-up head 50A (50B) includes a base member 52 and a push-up tool 60 attached to the base member 52.
  • the push-up tool 60 includes a suction housing 62 and a pin holder 63 for sucking the wafer sheet 8a from below.
  • the pin holder 63 is composed of a cylindrical holder body 70 with a ceiling and a push-up pin 71 held at the upper end thereof. This push-up pin 71 pushes up the die 7a.
  • a pin holder 63 having an optimum push-up pin 71 corresponding to the die 7a is selected from among a plurality of types of pin holders 63 and incorporated into the push-up head 50A (50B).
  • the push-up head 50A (50B) has a push-up main shaft 74 supported by the base member 52 so as to be able to move up and down.
  • the pin holder 63 is detachably fixed to the upper end of the push-up main shaft 74 .
  • the push-up main shaft 74 is a spline shaft, and is supported vertically (movably in the Z direction) by a spline bearing 75 fixed in a through hole 55 formed in the base member 52 .
  • a cylindrical pin base 72 is fixed near the upper end of the push-up main shaft 74 so that the push-up main shaft 74 projects slightly upward (referred to as a projecting portion 74a).
  • the pin base 72 includes a base body portion 72a and a fixed magnet 72b stacked on the upper end thereof.
  • the stationary magnet 72b has a ring shape that is flat in the Z direction, and is arranged on the base body portion 72a with the protrusion 74a penetrating through the center of the fixed magnet 72b. being stopped.
  • the pin holder 63 is arranged on the pin base 72 with the projecting portion 74a inserted inside the holder body 70 and positioned in the circumferential direction with respect to the projecting portion 74a.
  • the entire holder body 70, or at least the surface of the holder body 70 facing the pin base 72 (fixed magnet 72b) is made of a magnetic material such as iron. That is, the pin holder 63 is fixed to the pin base 72 by the magnetic force of the fixed magnet 72b.
  • the pin holder 63 (holder main body 70) and the pin base 72 have the same outer diameter, and when the pin holder 63 is fixed to the pin base 72, they form an integral columnar shape.
  • a lower end portion of the push-up main shaft 74 protrudes downward from the base member 52, and a columnar follower member 76 is provided at the lower end portion.
  • a coil spring 78 is mounted between the follower member 76 of the push-up main shaft 74 and the lower surface of the base member 52 . The elastic force of the coil spring 78 urges the push-up main shaft 74 downward (-Z direction), and as a result, the pin base 72 is held at the lower end position (position shown in FIG. 6) where the pin base 72 comes into contact with the spline bearing 75. It is
  • the suction housing 62 includes a hollow cylindrical portion 65 having a suction surface 66 for sucking the wafer sheet 8a at its upper end, and a flange portion 67 connected to its lower end.
  • the suction housing 62 is attached to the upper surface 54 of the base member 52 via a flange portion 67 .
  • An annular boss portion 53 protrudes from the upper surface 54 of the base member 52 around the through hole 55, while a concave portion 67b corresponding to the boss portion 53 is formed on the lower surface of the flange portion 67.
  • the suction housing 62 is arranged on the upper surface 54 of the base member 52 with the boss portion 53 fitted (inserted) into the concave portion 67b.
  • a notch portion 67a is formed in the peripheral portion of the flange portion 67, and a positioning pin 69 erected on the upper surface 54 is inserted into the notch portion 67a. Thereby, the suction housing 62 is positioned in the circumferential direction with respect to the base member 52 .
  • a plurality of fixed magnets 68 are arranged at equal intervals in the circumferential direction around the boss portion 53 on the upper surface 54 of the base member 52 . These fixed magnets 68 are embedded in the base member 52 so that their upper surfaces and the upper surface 54 of the base member 52 are flush with each other.
  • the entire attraction housing 62 or at least the surface of the attraction housing 62 facing the base member 52 (fixed magnet 68) is made of a magnetic material such as iron. That is, the attraction housing 62 is fixed to the base member 52 by the magnetic force of the stationary magnet 68 .
  • a gap is formed between the inner ceiling surface of the cylindrical portion 65 of the suction housing 62 and the holder body 70 of the pin holder 63 to allow the pin holder 63 to move up and down.
  • the push-up main shaft 74 rises from the lower end position and the pin holder 63 rises to a position where it contacts the ceiling surface of the cylindrical portion 65 or a position in the vicinity thereof, the push-up pin 71 is formed on the attracting surface 66 (ceiling surface). protrudes from the pin hole 66a. This protrusion enables the die 7 a to be pushed up by the push-up pin 71 .
  • the base member 52 and the pin base 72 correspond to the "support member” of the present invention. Specifically, the base member 52 and the pin base 72 correspond to the "base portion” and the “movable portion,” respectively.
  • the push-up head 50A has a negative pressure supply mechanism for sucking the wafer sheet 8a.
  • This negative pressure supply mechanism includes a negative pressure port portion 57 provided in the lower portion of the base member 52 and a negative pressure passage 56 formed inside the base member 52 .
  • the negative pressure port portion 57 is connected to a negative pressure generator 58 (see FIG. 3) through a pipe (not shown).
  • the negative pressure passage 56 introduces the negative pressure supplied to the negative pressure port portion 57 into the through hole 55 . Thereby, a negative pressure is supplied to the interior of the suction housing 62 (cylindrical portion 65 ) through the through hole 55 .
  • the attraction surface 66 is formed with a plurality of concentrically formed annular grooves and openings (not shown) that communicate the annular grooves with the interior of the attraction housing 62 .
  • a negative pressure passage formed between the suction housing 62 and the pin holder 63 communicates with each opening, and negative pressure is supplied to each annular groove through each opening (wafer sheet 8a is sucked through each annular groove). ), the wafer sheet 8 a is attracted to the attraction surface 66 .
  • the push-up unit 40 has a movable frame 48 that can move in the X direction with respect to the base frame 47.
  • the push-up heads 50A and 50B are mounted on the movable frame 48 side by side in the X direction.
  • the movable frame 48 is connected to an operating shaft 49a of a first air cylinder 49 fixed to the base frame 47, and the operation of the first air cylinder 49 causes the movable frame 48 to move back and forth in the X direction.
  • one thrust head 50A is placed at a predetermined working position Wp (state shown in FIG. 3), and when it is placed at the retracted position, the other thrust head 50B is placed.
  • the switching mechanism D4 is composed of the movable frame 48 and the first air cylinder 49. As shown in FIG.
  • the push-up heads 50A and 50B are vertically supported by a pair of guide rails 51 provided on the movable frame 48 and extending in the Z direction.
  • a first elevating mechanism D5 for elevating the push-up heads 50A and 50B includes the pair of guide rails 51, a first push-up member 81, a second air cylinder 80, and a cam mechanism (not shown).
  • the first push-up member 81 is provided so as to be able to move up and down below the push-up head 50A (50B) arranged at the working position Wp.
  • the first push-up member 81 moves up and down by the actuation of the cam mechanism by the second air cylinder 80, and raises and lowers the push-up head 50A (50B) arranged at the working position Wp between the raised position and the lowered position.
  • the raised position is a height position at which the suction surface 66 of the suction housing 62 contacts or approaches the lower surface of the wafer sheet 8a of the wafer holding frame 8 placed on the wafer stage 10 .
  • a second elevating mechanism D6 for elevating the push-up pin 71 includes a second push-up member 82, a Z-axis servomotor 84, and a transmission mechanism 83. Each element of the second elevating mechanism D6 is assembled to a bracket (not shown) fixed to the first lifting member 81. As shown in FIG. Therefore, the second lifting mechanism D6 moves up and down together with the first lifting member 81. As shown in FIG.
  • the second push-up member 82 is arranged on the -Y side of the first push-up member 81 below the push-up head 50A (50B) arranged at the working position Wp.
  • the second push-up member 82 is a block-shaped member having a flat upper surface.
  • the second push-up member 82 is movably supported by a guide member (not shown) fixed to the bracket, and is driven by a Z-axis servomotor 84 via a transmission mechanism 83 such as a screw feed mechanism. ascending and descending along
  • Reference numeral 58 in FIG. 3 denotes a negative pressure generator fixed to the base frame 47.
  • the negative pressure generator 58 is connected to the negative pressure ports 57 of the push-up heads 50A and 50B via piping (not shown).
  • the negative pressure generator 58 switches between supplying negative pressure for attracting the wafer sheet to the push-up heads 50A and 50B and stopping the supply (release to the atmosphere).
  • FIGS. 7A to 7C are explanatory diagrams of the pushing-up operation of the die 7a by the pushing-up heads 50A and 50B. 7, illustration of the die 7a (wafer 7) is omitted.
  • the push-up unit 40 is arranged below the wafer 7 and pushes up the die 7a through the wafer sheet 8a when the head 4H picks the die 7a from the wafer 7, as described above.
  • a specific operation of the push-up unit 40 is as follows.
  • the push-up head used for pushing up the die 7a is placed at the working position Wp by the operation of the switching mechanism D4. Further, the thrusting unit 40 is moved by the operation of the driving mechanism D3, and the thrusting head 50A (50B) arranged at the working position Wp is arranged below the die 7a to be pushed up (FIG. 7(A)).
  • the thrusting head 50A (50B) located at the working position Wp is lifted by the operation of the first lifting mechanism D5 (Fig. 7(B)).
  • the suction surface 66 of the suction housing 62 contacts or approaches the lower surface of the wafer sheet 8a, and the wafer sheet 8a is suctioned by the suction surface 66 under negative pressure.
  • This negative pressure suction is performed substantially simultaneously with the timing when the push-up head 50A (50B) reaches the raised end position (simultaneously when the suction surface 66 abuts or approaches the lower surface of the wafer sheet 8a).
  • the pin holder 63 moves up and down together with the push-up main shaft 74 due to the operation of the second elevating mechanism D6.
  • the push-up pin 71 protrudes from the suction housing 62 (suction surface 66), penetrates the wafer sheet 8a, and pushes up the die 7a (FIG. 7(C)).
  • the push-up pins 71 pin holders 63
  • the mode of elevation either a mode in which the push-up pin 71 is continuously raised and lowered, or a mode in which the push-up pin 71 temporarily stays at the position after being raised and then descends is performed.
  • the push-up pin 71 pin holder 63
  • the negative pressure supply from the negative pressure generator 58 is stopped.
  • the push-up unit 40 is moved by the operation of the drive mechanism D3, and the push-up head 50A (50B) is arranged below the die 7a to be pushed up next. in short.
  • the push-up unit 40 moves while the suction surface 66 of the suction housing 62 slides along the lower surface of the wafer sheet 8a and approaches along the lower surface of the wafer sheet 8a.
  • the wafer sheet 8a is sucked under negative pressure, and after the push-up pins 71 (pin holders 63) are raised and lowered by the operation of the second elevating mechanism D6 to push up the next die 7a (FIG. 7(C)), the wafer sheet 8a of negative pressure adsorption is stopped. Thereafter, the above-described pushing-up operation of the die 7a is repeated in the same manner.
  • the thrust-up tools 60 suitable for the die 7a to be thrust-up are incorporated in the thrust-up heads 50A and 50B. ) is required to replace the thrust tool 60 .
  • the push-up tool 60 since the push-up tool 60 includes the suction housing 62 and the pin holder 63, these need to be replaced.
  • the attraction housing 62 is fixed to the base member 52 by the fixed magnet 68, as described above.
  • the pin holder 63 is also fixed to the pin base 72 by a fixed magnet 72b. Therefore, the operator simply lifts and removes the suction housing 62 and the pin holder 63 from the base member 52 and the like in this order, and sets the new suction housing 62 and the pin holder 63 in the reverse order to their original positions.
  • the push-up tool 60 can be easily exchanged without any need.
  • the attraction forces of the stationary magnets 68 and 72b are both set within the range of 5 to 30N.
  • the range of the adsorption force is determined experimentally so that the adsorption stability of the adsorption housing 62 and the pin holder 63 and the operability of manual attachment/detachment by the operator can be compatible. Therefore, the operator can easily replace the suction housing 62 and the pin holder 63 with one touch.
  • the push-up tool 60 (suction housing 62 and pin holder 63) can be changed with a simpler structure than the conventional structure (Patent Document 1) having a clamp mechanism for replacing the push-up tool. becomes possible.
  • Patent Document 1 the conventional structure having a clamp mechanism for replacing the push-up tool. becomes possible.
  • it is basically a structure in which the fixed magnets 68 and 72b are simply incorporated in the base member 52, there is no significant increase in weight of the push-up head 50A (50B). Therefore, the increased weight of the push-up head 50A (50B) does not cause a problem that time loss tends to occur when the push-up unit 40 is moved.
  • fixed magnets 68 and 72b for fixing the push-up tool 60 are arranged only on the base member 52 and pin base 72 side. Therefore, the fixed magnets 68 and 72b can be shared for a plurality of types of push-up tools 60, which is rational.
  • the direction of the magnetic poles of the fixed magnet 68 that fixes the attraction housing 62 and the direction of the magnetic poles of the fixed magnet 72b that fixes the pin holder 63 are set to be the same. ing. That is, no repulsive force acts between the fixed magnet 68 and the fixed magnet 72b.
  • the upper surface side of the fixed magnet 72b (pin holder magnet) is the N pole
  • the upper surface side of the fixed magnet 68 (attraction housing magnet) is also set to the N pole (combination 1).
  • the upper surface of the fixed magnet 72b is the S pole
  • the upper surface of the fixed magnet 68 is also set to the S pole (combination 2).
  • the push-up heads 50A and 50B cause the suction surface 66 of the suction housing 62 to slide along or come close to the lower surface of the wafer sheet 8a when moving to the position of the next die 7a of the same wafer 7. to move (FIG. 7(B)).
  • the position of the fixed magnet 72b (second magnet) that fixes the pin holder 63 is positioned above the position of the fixed magnet 68 (first magnet) that fixes the attraction housing 62.
  • the adsorption housing 62 may rise against the elastic force of the coil spring 78 .
  • the push-up pins 71 may unintentionally protrude from the suction housing 62 and damage the wafer sheet 8a.
  • the configuration of the push-up unit 40 in which the fixed magnets 68 and 72b have the same magnetic pole direction there is no room for the repulsive force to occur, and the above-described inconveniences can be avoided.
  • the component mounting apparatus 1 described above is an example of a preferred embodiment of a component mounting apparatus to which the component pushing-up apparatus according to the present invention is applied. , can be changed as appropriate without departing from the gist of the present invention. For example, it is possible to employ the following configuration.
  • fixed magnets 68 and 72b for fixing the push-up tool 60 are arranged on the side of the base member 52 and the base body portion 72a.
  • the fixed magnets 68 and 72b may be provided on the push-up tool 60 (suction housing 62 and pin holder 63) side, or may be provided on both sides.
  • the fixed magnets 68 for fixing the attraction housing 62 are provided at regular intervals around the boss portion 53 on the upper surface 54 of the base member 52, and the fixed magnets 72b for fixing the pin holder 63 are provided in a ring shape. It is however, as long as the fixed magnets 68 and 72b can be detachably fixed to the attraction housing 62 and the pin holder 63, other specific aspects may be used.
  • the push-up tool 60 (attraction There is an advantage that the thrusting tool 60 can be stably fixed by applying a magnetic force to the housing 62 and the pin holder 63) in a well-balanced manner.
  • the component push-up apparatus according to the present invention is applied to a component mounting apparatus. It can be applied to various devices such as a taping device or a component mounting device that mounts the die on a substrate.
  • a component push-up device is a component push-up device that separates a die from a wafer sheet by pushing up the die from below the wafer attached to the wafer sheet, wherein the wafer an attracting surface that attracts the lower surface of the sheet under negative pressure; and a thrust tool that includes a thrust pin that is provided so as to be retractable from the attracting surface to the wafer sheet side and protrudes from the attracting surface to push up the die; a support member that is relatively movable along the wafer and detachably supports the push-up tool, and a magnet is provided on one side of the push-up tool and the support member. At least the surface facing the magnet on the other side is made of a magnetic material.
  • this part push-up device, it is possible to change (replace) the push-up tool with a simpler structure than the conventional structure with a dedicated clamping mechanism.
  • the support member includes a base portion and a movable portion that moves up and down relative to the base portion, and the push-up tool moves the suction surface to an upper end.
  • a hollow suction housing that is detachably supported by the base portion; a pin holder that ascends and descends together with the magnet, wherein the magnet is provided on one side of the attraction housing and the base portion, and at least the opposing surface of the magnet on the other side is formed of the magnetic material, and the pin holder and the movable portion, the magnet is provided on one side thereof, and at least the opposing surface of the magnet on the other side is formed of the magnetic material.
  • the magnet is provided on the side of the support member in the component push-up device.
  • the magnet is common to a plurality of push-up tools (attraction housing and pin holder), resulting in a rational configuration.
  • the pin holder is attached to the suction housing by the movable portion.
  • the second magnet which is the magnet for fixing the pin holder to the movable portion, is arranged above the first magnet, which is the magnet for fixing the attraction housing to the base portion.
  • a repulsive force acts between the two magnets, preventing proper operation of the pin holder. Avoided.
  • the magnets are provided intermittently at equal intervals around the push-up center of the push-up tool, or continuously in an annular shape.
  • the attraction force of the push-up tool by the magnet is within a range of 5 to 30N.
  • a component mounting apparatus includes a component supply section in which a wafer that has been diced and attached to a wafer sheet is placed, and a die is picked from the wafer placed in the component supply section. and the component push-up device according to any one of the above aspects, which pushes up the die from below the wafer sheet when the die is picked by the component transfer head. Prepare.
  • this component mounting apparatus since it is equipped with the component push-up device as described above, it is possible to change (replace) the push-up tool with a simple configuration.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
PCT/JP2021/018640 2021-05-17 2021-05-17 部品突上げ装置及び部品実装装置 WO2022244071A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN202180097917.6A CN117280453A (zh) 2021-05-17 2021-05-17 元件上推装置以及元件安装装置
PCT/JP2021/018640 WO2022244071A1 (ja) 2021-05-17 2021-05-17 部品突上げ装置及び部品実装装置
KR1020237035708A KR20230158099A (ko) 2021-05-17 2021-05-17 부품 밀어올림 장치 및 부품 실장 장치
JP2023522019A JPWO2022244071A1 (de) 2021-05-17 2021-05-17
DE112021007307.9T DE112021007307T5 (de) 2021-05-17 2021-05-17 Bauteilhochdrückvorrichtung und Bauteilmontagevorrichtung
TW110126899A TWI830034B (zh) 2021-05-17 2021-07-22 零件頂起裝置及零件安裝裝置

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169321A (ja) * 2011-02-10 2012-09-06 Fuji Mach Mfg Co Ltd ダイ供給装置
JP2013168664A (ja) * 2013-04-04 2013-08-29 Renesas Electronics Corp 半導体装置の製造方法および半導体製造装置
JP2015142135A (ja) * 2014-01-29 2015-08-03 セメス株式会社Ｓｅｍｅｓ Ｃｏ．， Ｌｔｄ． ダイエジェクティング装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102213777B1 (ko) * 2018-02-02 2021-02-08 주식회사 엘지화학 반도체용 접착 필름

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169321A (ja) * 2011-02-10 2012-09-06 Fuji Mach Mfg Co Ltd ダイ供給装置
JP2013168664A (ja) * 2013-04-04 2013-08-29 Renesas Electronics Corp 半導体装置の製造方法および半導体製造装置
JP2015142135A (ja) * 2014-01-29 2015-08-03 セメス株式会社Ｓｅｍｅｓ Ｃｏ．， Ｌｔｄ． ダイエジェクティング装置

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DE112021007307T5 (de) 2024-01-25
KR20230158099A (ko) 2023-11-17
TWI830034B (zh) 2024-01-21
CN117280453A (zh) 2023-12-22
JPWO2022244071A1 (de) 2022-11-24

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