WO2022242054A1 - 一种基于5g通讯的印制线路板制作方法 - Google Patents

一种基于5g通讯的印制线路板制作方法 Download PDF

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WO2022242054A1
WO2022242054A1 PCT/CN2021/129226 CN2021129226W WO2022242054A1 WO 2022242054 A1 WO2022242054 A1 WO 2022242054A1 CN 2021129226 W CN2021129226 W CN 2021129226W WO 2022242054 A1 WO2022242054 A1 WO 2022242054A1
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circuit board
manufacturing
circuit boards
layer circuit
printed circuit
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PCT/CN2021/129226
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English (en)
French (fr)
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郑晓蓉
王康兵
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智恩电子(大亚湾)有限公司
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Publication of WO2022242054A1 publication Critical patent/WO2022242054A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Definitions

  • the present application relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing printed circuit boards based on 5G communication.
  • the layout method adopts positive layout, the substrate material cannot be fully and rationally utilized, and the co-located micro-connection between PCS leads to poor dimensional stability;
  • the method of reducing transmission loss, by increasing the roughness of the board surface to obtain higher copper foil adhesion can solve the mechanical properties of the product, but the skin effect of the signal will become more and more serious, due to the "standing wave ", "reflection” and other signal losses, so that it cannot meet the impedance matching degree of 5G communication HDI, and the produced substrate has poor plasticity of metallization and strength;
  • This application provides a method for manufacturing printed circuit boards based on 5G communication, which solves the problems of low production efficiency, high cost, poor dimensional stability, conflicts between reducing transmission loss and improving adhesion, and low lamination efficiency in the existing substrates. question.
  • this application provides a printed circuit board manufacturing method based on 5G communication, including inner layer circuit manufacturing, lamination process, drilling process, copper plating process, outer layer circuit production, wet film process, Surface technology, post-processing;
  • the material cutting and lithography processes are carried out according to the preset typesetting method to obtain the inner layer circuit board; in the lamination process, the pre-laminated multiple The inner circuit board.
  • the preset typesetting method is a small-size pattern typesetting, specifically: each PCS in the inner circuit board includes at least 8 micro-connectors, and between any two PCSs Independent of each other, honeycomb copper foil is laid between two arrays;
  • the PCS is the smallest unit of a circuit area in the inner circuit board, multiple PCSs form one array, and multiple arrays form the inner circuit board.
  • This basic solution adopts small-sized layout layout of inner circuit boards, which can make full use of substrate materials; set up two independent PCSs, and each PCS is matched with more than 8 micro-connectors to provide higher support for PCS Force, which can effectively prevent PCS deformation; between two arrays, honeycomb copper foil is laid, using the characteristics of honeycomb shape with many water chestnuts and not easy to deform, the size of the inner circuit board is further solidified through internal force; thus ensuring the size Stability, improve the uniformity of copper plating and high product yield.
  • the pre-laminated multiple inner circuit boards include:
  • This solution performs single-point thermal melting on the laminated PP film, copper foil, and blackened inner circuit board to complete the basic fixation of the PCB as a whole; through X-ray confirmation, the layer deviation can be effectively detected. Reduce the scrap due to the irreversibility of pressing; then fix the four sides by hot-melting on the four sides to prevent the sliding plate from shifting, and achieve a fixed side with a larger coverage to provide a higher support surface against shearing force, thereby improving the production of the circuit Fineness (that is, improve line accuracy), further improve product yield.
  • the substrate in the manufacture of the inner layer circuit, includes a substrate material layer and a copper foil layer, and a coupling agent is covered between the substrate material layer and the copper foil layer;
  • the coupling agent is covered between the inner circuit boards; the coupling agent is a phenolic ring-containing halogen-based resin.
  • This solution uses a phenol ring-containing halogen-containing resin as a coupling agent to fix the bonding structure between the substrate material layer and the copper foil layer, and between the inner circuit board, and uses the coupling agent to generate a "molecular bridge" to improve the coupling of the board surface Coordination improves the interface between inorganic and organic substances. While reducing the roughness of the board surface and reducing transmission loss, it also improves the bonding force between the bonding surfaces, thereby greatly improving the performance of the composite material.
  • a dry film is applied to cover the substrate coated with a uniform water film by a wet method; the water film contains the coupling agent.
  • the design of this scheme includes a water film with a coupling agent combined with a wet film, so that the resin layer of the dry film has coupling properties, because the water and copper surface form a weak chemical bond similar to hydrogen bonds during the lamination process, thus ensuring During the development and etching process of the dry film, the edges of the dry film will not be damaged, and the lines will have no dog teeth or burrs.
  • the multi-layer circuit board is assembled and covered with a preset coating;
  • the preset coating includes LowDk/Df ink, a rectifying agent, and a coupling agent.
  • chemical pretreatment is carried out with preset spray pressure and preset line speed to remove pollutants on the copper surface to increase copper Surface roughness; wherein, the preset spray pressure and the preset linear speed are both 80% of the conventional spray pressure and conventional linear speed settings.
  • the direct distance between the transmission roller and the transmission roller is controlled within 2mm.
  • This solution can improve the transportation stability of inner circuit boards or multi-layer circuit boards by reducing the spray pressure and line speed, and shorten the distance between the conveying rollers, thereby reducing the risk of board jamming.
  • the inner layer circuit and the outer layer circuit in the production of the inner layer circuit and the outer layer circuit, it includes: DES connection, leaving the board to be image transferred for at least 30 minutes, and placing the board with the independent circuit facing down.
  • the substrate material layer is filled with a filler, and the filler is a silicon-based complex.
  • fillers silicon complexes
  • the stability and dispersion of silicon complexes can be used to effectively improve the strength of PCB products, improve the production efficiency and durability of products.
  • Fig. 1 is a working flow chart of a method for manufacturing a printed circuit board based on 5G communication provided by an embodiment of the present application;
  • Fig. 2 is a schematic layout diagram of small-size pattern layout provided by the embodiment of the present application.
  • Fig. 3 is the working flow diagram of making the inner layer circuit in Fig. 1 provided by the embodiment of the present application;
  • Fig. 4 is the working flow diagram of the lamination process in Fig. 1 provided by the embodiment of the present application;
  • Fig. 5 is a work flow diagram of making the outer layer circuit in Fig. 1 provided by the embodiment of the present application.
  • a printed circuit board manufacturing method based on 5G communication provided in the embodiment of the present application, as shown in Figure 1, in this embodiment, includes: inner layer circuit manufacturing, lamination process, drilling process, and copper plating process , Outer circuit production, wet film process, surface process, post process;
  • the inner layer circuit In the production of the inner layer circuit, see Fig. 2 and Fig. 3, carry out the material cutting and lithography process according to the preset typesetting method, and obtain the inner layer circuit board.
  • the process edge of the inner layer circuit board is not less than 10nm, and an impedance strip is also provided on the process edge.
  • the default typesetting method is small-size pattern typesetting, specifically: each PCS in the inner layer circuit board includes at least 8 micro-connectors, and any two PCSs are independent of each other, and any two PCSs are independent of each other. A honeycomb copper foil is laid between them; the PCS is arranged in an irregular and compact order;
  • PCS is a unit of measurement, that is, the abbreviation of pieces, which means one or piece.
  • a PCS is the smallest unit of a circuit area in an inner circuit board, multiple PCSs form an array, and multiple arrays form an inner circuit board.
  • the embodiment of the present application adopts the layout of the inner circuit board with small-sized patterns, which can make full use of the substrate material; set up two independent PCSs, and each PCS is matched with more than 8 micro-connectors to provide PCS with higher
  • the supporting force can effectively prevent the deformation of PCS; laying honeycomb copper foil between two arrays, using the characteristics of honeycomb shape with many water chestnuts and not easy to deform, the size of the inner circuit board is further solidified through internal force; thus ensuring Dimensional stability, improved copper plating uniformity and high product yield. Design preheating rules, press and laminate multiple inner layer circuit boards that have been pre-laminated, the yield rate is high, and the production cost is correspondingly reduced.
  • the substrate in the material cutting process, includes a substrate material layer and a copper foil layer, and a coupling agent is covered between the substrate material layer and the copper foil layer.
  • the dry film is covered on the substrate coated with a uniform water film by wet film lamination; wherein, the water film contains a coupling agent.
  • the water film containing a coupling agent is designed to cooperate with the wet film, so that the resin layer of the dry film has coupling properties, because the water and copper surface form a weak chemical bond between hydrogen bonds and van der Waals forces during the film pressing process strength, so as to ensure that the dry film will not be damaged during the development and etching process, and the circuit will have no dog teeth or burrs.
  • the circuit can be finer (up to 30/30um) by using a thinner dry film (20um) line level).
  • the substrate material layer is filled with a filler, and the filler is a silicon complex.
  • a filler (silicon complex) is added to the substrate material layer, and the stability and dispersion of the silicon complex can be used to effectively improve the strength of the PCB product, improve the production efficiency and durability of the product.
  • the PP film is consistent with the type of the inner circuit board, so as to ensure the consistency of the expansion and contraction of the laminated PP and the substrate;
  • the glue content can be selected according to the residual copper rate of each layer of the specific product; in addition, the addition of the coupling agent ensures that the PP and circuit / Copper foil has good adhesion; it should be noted that the position of the vent hole cannot be pre-melted.
  • the laminated PP film, copper foil and the blackened inner circuit board are firstly melted at a single point to complete the basic fixation of the PCB as a whole; through X-ray confirmation, the layer deviation can be effectively detected , to reduce the scrap due to the irreversibility of pressing; then fix the four sides by hot-melting the four sides to prevent the deviation of the slide plate, realize a fixed side with a larger coverage, and provide a higher support surface against shearing force, thereby improving the reliability of the line Production fineness (that is, improve line accuracy), further improve product yield.
  • the coupling agent is covered between the inner circuit boards.
  • the coupling agent is a phenol ring-containing halogen-based resin.
  • a phenolic ring-containing halogen-containing resin is used as a coupling agent to fix the bonding structure between the substrate material layer and the copper foil layer, and between the inner circuit board, and use the coupling agent to generate a "molecular bridge" to improve the board surface.
  • Coupling and coordination can improve the interface between inorganic and organic substances. While reducing the roughness of the board surface and reducing transmission loss, it also improves the bonding force between the bonding surfaces, thereby greatly improving the performance of the composite material.
  • the direct distance between the transmission roller and the transmission roller is controlled within 2mm.
  • the transportation stability of the inner circuit board or multilayer circuit board can be improved, thereby reducing the risk of board jamming.
  • the board to be image-transferred is left to stand for at least 30 minutes, the inner layer circuit board or multi-layer circuit board is placed with the independent circuit facing down, and the etching factor is controlled to be not less than 4 for DES connection.
  • the DES connection is the abbreviation of the development (DEVELOPING), etching (ETCHING), and stripping (STRIP) connection.
  • AOI Automatic Optical Inspection
  • the machine automatically scans the multi-layer circuit board through the camera, collects images, compares the tested solder joints with the qualified parameters in the database, and checks out the defects on the circuit board through image processing, and passes the display Or automatic flags to display/mark defects.
  • the inner layer AOI and the outer layer AOI are automatic optical inspection for the inner layer circuit board and the outer layer circuit board (multilayer circuit board) respectively.
  • plasma degumming is added before electroplating to increase the hole filling performance of the product; the pulse electroplating VCP line is selected, and the plating plate is about 20mm larger than the product to be electroplated, and the chuck clip is short
  • the electroplating uniformity can be controlled at 95%, and the copper conversion rate on the hole surface is 98%.
  • the multi-layer circuit board is assembled and covered by a preset coating.
  • the preset coating includes LowDk/Df ink, rectifying agent and coupling agent, for example, add 2-3ml of rectifying agent and coupling agent to 1 kg of LowDk/Df ink, and mix to obtain the preset coating.
  • DK in the circuit board is the dielectric constant, so LOW Dk is the low dielectric constant; Df in the circuit board is the dielectric loss factor, so LOW Df is the low dielectric loss factor.
  • the inspection is carried out according to the IPC-2 standard.
  • this application effectively improves the wiring and solder mask adhesion by adopting multiple aspects such as material selection (coupling agent, LowDk/Df ink), engineering data optimization (small size pattern layout), on-site process improvement, etc. , reduce line burrs, and further solve the problems of poor impedance stability and serious signal skin effect.

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

本申请涉及电路板制作技术领域，提供一种基于5G通讯的印制线路板制作方法，在内层线路制作中，根据预设排版方式进行开料和微影工序，得到内层线路板；在层压工艺中，采用预热熔规则压合预叠合好的多个内层线路板；本申请采用小尺寸花样排版布局内层线路板，可充分利用基板材料；设置两两之间相互独立的PCS，以及每一PCS匹配8个以上的微联端，向PCS提供更高的支撑力，可有效防止PCS变形；在两两array之间铺设有蜂窝状铜箔，利用蜂窝状含菱角多、不易变形的特性，通过内作用力进一步地固化内层线路板的尺寸；从而保证尺寸安定性，提高镀铜均匀性高以及产品良品率。设计预热熔规则，压合预叠合好的多个所述内层线路板，良品率高、生产成本也相应的降低。

Description

一种基于5G通讯的印制线路板制作方法 技术领域
本申请涉及电路板制作技术领域，尤其涉及一种基于5G通讯的印制线路板制作方法。
背景技术
随着5G时代的到来，以及计算机、信息通信设备的高性能/智能化、网络化的发展，需要更加高速地传递处理大容量的信息。因此，传递的信号渐渐趋向高频化，针对通讯产品对信号处理和传输的高频高速化要求越来越严。PCB企业也对5G产品的原材料提出了新的要求，PTFE/罗杰斯等大量low DK、hight TG基板投入生产。而此类基板虽然具备满足5G信号传输的要求，但是依旧存在以下缺点：
1、排版方式，采用正排，基板材料无法得到充分的合理利用，PCS之间共位微联，导致尺寸安定性差；
2、降低传输损耗方法，通过增加板面的粗糙度而获得较高的铜箔附着力虽然可以解决产品的机械性能，但信号的趋肤效应就会变得越来越严重，因“驻波”、“反射”等造成的信号损失，从而无法满足5G通讯HDI阻抗匹配度，且制作出的基板金属化、强度的可塑性差；
3、工艺铆合、铆钉压合方式，因打孔所产生的偏位导致无法制作精细线路，单点热熔支撑面很小，容易产生因支撑力不足以抵消压合所产生的扭曲力而导致滑板偏位。
申请内容
本申请提供一种基于5G通讯的印制线路板制作方法，解决了现有的基板制作效率低、成本高尺寸安定性差，降低传输损耗与提高粘合力互相矛盾， 以及压合效率低的技术问题。
为解决以上技术问题，本申请提供一种基于5G通讯的印制线路板制作方法，包括内层线路制作、层压工艺、钻孔工艺、沉铜电镀工艺、外层线路制作、湿膜工艺、表面工艺、后工序；
在所述内层线路制作中，根据预设排版方式进行开料和微影工序，得到内层线路板；在所述层压工艺中，采用预热熔规则压合预叠合好的多个所述内层线路板。
在进一步的实施方案中，所述预设排版方式为小尺寸花样排版，具体为：所述内层线路板中的每一PCS包括至少包括8个微联端，且两两所述PCS之间相互独立，两两array之间铺设有蜂窝状铜箔；
其中，所述PCS为所述内层线路板中的线路区域的最小单位，多个所述PCS组成一个所述array，多个所述array组成所述内层线路板。
本基础方案采用小尺寸花样排版布局内层线路板，可充分利用基板材料；设置两两之间相互独立的PCS，以及每一PCS匹配8个以上的微联端，向PCS提供更高的支撑力，可有效防止PCS变形；在两两array之间铺设有蜂窝状铜箔，利用蜂窝状含菱角多、不易变形的特性，通过内作用力进一步地固化内层线路板的尺寸；从而保证尺寸安定性，提高镀铜均匀性高以及产品良品率。
在进一步的实施方案中，所述采用预热熔规则压合预叠合好的多个所述内层线路板包括：
A、对多个待压合的所述内层线路板进行等离子除胶；
B、叠合PP胶片、铜箔及经过黑化处理的所述内层线路板，并采用热熔机进行四边提前热熔；
C、经过x-ray确认后，对前次热熔后的待压合结构进行全边热熔得到多层线路板。
本方案对叠合的PP胶片、铜箔及经过黑化处理的内层线路板先进行单点热熔，以完成PCB整体的基本固定；通过X-ray确认，可有效检测出层偏情况，减小因压合不可逆性的报废；随后通过四边热熔固定四边，防止滑板偏位，实现覆盖面更为大的固定边，以提供更高的支撑面对抗剪切力，从而可提高线路的制作精细度(即提高线路精度)，进一步提高产品良品率。
在进一步的实施方案中，在所述内层线路制作中，基板包括基板材料层和铜箔层，所述基板材料层和所述铜箔层之间覆盖有偶联剂；在所述层压工艺中，所述内层线路板之间覆盖有所述偶联剂；所述偶联剂为酚环含卤素类树脂。
本方案采用酚环含卤素类树脂作为偶联剂，以固定基板材料层和铜箔层之间、内层线路板之间的结合结构，利用偶联剂生成“分子桥”提高板面的耦合配位性，改善无机物与有机物之间的界面作用，在降低板面的粗糙度、减少传输损耗的同时，还提高了结合面之间的结合力，从而大大提高复合材料的性能。
在进一步的实施方案中，在内层线路制作中，采用湿法贴膜将干膜覆盖在涂布有均匀水膜的所述基板上；所述水膜中包含有所述偶联剂。
本方案设计包含有偶联剂的水膜配合湿法贴膜，使得干膜的树脂层具备耦合性，在于水、铜面在压膜的过程中形成类似于氢键的弱化学结合力，从而保障干膜在显影、蚀刻过程中，干膜边不会破损、线路无狗牙、毛边。
在进一步的实施方案中，在所述湿膜工艺中，采用预设涂层对多层线路板进行组焊覆盖；所述预设涂层包括LowDk/Df油墨和整流剂、偶合剂。
在进一步的实施方案中，在所述内层线路制作和所述外层线路制作中，均采用预设喷压、预设线速进行化学前处理，去除铜面上的污染物，以增加铜面粗糙度；其中，所述预设喷压、所述预设线速均为至常规喷压、常规线速设置的80％。
另外，传送滚轮与传送滚轮直接的距离控制在2mm以内。
本方案通过降低喷压、线速，缩小传送滚轮之间的距离，可一高内层线路板或多层线路板的运输稳定性，从而降低卡板风险。
在进一步的实施方案中，在所述内层线路制作和所述外层线路制作中，包括：DES连线，将需做影像转移的板子静置至少30min、以独立线路朝下的方式放置所述内层线路板或多层线路板、控制蚀刻因子不小于4进行DES连线。
在进一步的实施方案中，所述基板材料层填充有填充剂，所述填充剂为硅类络合物。
本方案在基板材料层中添加填充剂(硅类络合物)，利用硅类络合物的稳定性和分散性，可有效提高PCB产品的强度，提高产品的生产效率以及使用耐久度。
附图说明
图1是本申请实施例提供的一种基于5G通讯的印制线路板制作方法的工作流程图；
图2是本申请实施例提供的小尺寸花样排版的排版示意图；
图3是本申请实施例提供的图1中内层线路制作的工作流程图；
图4是本申请实施例提供的图1中层压工艺的工作流程图；
图5是本申请实施例提供的图1中外层线路制作的工作流程图。
其中，1-PCS，2-array，3-微联端。
具体实施方式
下面结合附图具体阐明本申请的实施方式，实施例的给出仅仅是为了说明目的，并不能理解为对本申请的限定，包括附图仅供参考和说明使用，不构成对本申请专利保护范围的限制，因为在不脱离本申请精神和范围基础上，可以对本申请进行许多改变。
本申请实施例提供的一种基于5G通讯的印制线路板制作方法，如图1所示，在本实施例中，包括；内层线路制作、层压工艺、钻孔工艺、沉铜电镀工艺、外层线路制作、湿膜工艺、表面工艺、后工序；
在内层线路制作中，参见图2、图3，根据预设排版方式进行开料和微影工序，得到内层线路板。内层线路板的工艺边不小于10nm，工艺边上还设有阻抗条。
在本实施例中，预设排版方式为小尺寸花样排版，具体为：内层线路板中的每一PCS包括至少包括8个微联端，且两两PCS之间相互独立，两两array之间铺设有蜂窝状铜箔；其中的PCS采用无规则紧密式排序；
PCS是一种计量单位，即pieces的缩写，就是个、件的意思。
其中，PCS为内层线路板中的线路区域的最小单位，多个PCS组成一个array，多个array组成内层线路板。
本申请实施例采用小尺寸花样排版布局内层线路板，可充分利用基板材料；设置两两之间相互独立的PCS，以及每一PCS匹配8个以上的微联端，向PCS提供更高的支撑力，可有效防止PCS变形；在两两array之间铺设有蜂窝状铜箔，利用蜂窝状含菱角多、不易变形的特性，通过内作用力进一步地固化内层线路板的尺寸；从而保证尺寸安定性，提高镀铜均匀性高以及产 品良品率。设计预热熔规则，压合预叠合好的多个内层线路板，良品率高、生产成本也相应的降低。
在本实施例中，在内层线路制作中：
在开料工艺中，基板(覆铜板)包括基板材料层和铜箔层，基板材料层和铜箔层之间覆盖有偶联剂。在压膜工艺中，采用湿法贴膜将干膜覆盖在涂布有均匀水膜的基板上；其中，水膜中包含有偶联剂。
本实施例设计包含有偶联剂的水膜配合湿法贴膜，使得干膜的树脂层具备耦合性，在于水、铜面在压膜的过程中形成介于氢键和范德华力的弱化学结合力，从而保障干膜在显影、蚀刻过程中，干膜边不会破损、线路无狗牙、毛边，同时还可通过使用更薄的干膜(20um)，使得电路更精细(达到30/30um线路等级)。
在本实施例中，基板材料层填充有填充剂，填充剂为硅类络合物。
本实施例在基板材料层中添加填充剂(硅类络合物)，利用硅类络合物的稳定性和分散性，可有效提高PCB产品的强度，提高产品的生产效率以及使用耐久度。
在层压工艺中，参见图4，采用预热熔规则压合预叠合好的多个内层线路板，包括：
A、对多个待压合的内层线路板进行等离子除胶；
B、叠合PP胶片、铜箔及经过黑化处理的内层线路板，并采用热熔机进行四边提前热熔；
C、经过x-ray确认后，对前次热熔后的待压合结构进行全边热熔得到多层线路板。
其中，PP胶片与内层线路板型号一致，从而保证压合PP、基板涨缩的一 致性；胶含量可根据具体产品各层的残铜率进行选择；另外，偶合剂的加入保证PP与线路/铜箔具有很好的附着力；需注意的是排气孔位置不可预熔。
本实施例对叠合的PP胶片、铜箔及经过黑化处理的内层线路板先进行单点热熔，以完成PCB整体的基本固定；通过X-ray确认，可有效检测出层偏情况，减小因压合不可逆性的报废；随后通过四边热熔固定四边，防止滑板偏位，实现覆盖面更为大的固定边，以提供更高的支撑面对抗剪切力，从而可提高线路的制作精细度(即提高线路精度)，进一步提高产品良品率。
其中，内层线路板之间覆盖有偶联剂。
在本实施例中，偶联剂为酚环含卤素类树脂。
本实施例采用酚环含卤素类树脂作为偶联剂，以固定基板材料层和铜箔层之间、内层线路板之间的结合结构，利用偶联剂生成“分子桥”提高板面的耦合配位性，改善无机物与有机物之间的界面作用，在降低板面的粗糙度、减少传输损耗的同时，还提高了结合面之间的结合力，从而大大提高复合材料的性能。
在本实施例中，参见图3、图5，在内层线路制作和外层线路制作中：
均采用预设喷压、预设线速进行化学前处理，去除铜面上的污染物，以增加铜面粗糙度；其中，预设喷压、预设线速均为至常规喷压、常规线速设置的80％。
另外，传送滚轮与传送滚轮直接的距离控制在2mm以内。
本实施例通过降低喷压、线速，缩小传送滚轮之间的距离，可一高内层线路板或多层线路板的运输稳定性，从而降低卡板风险。
其中的DES连线测试，将需做影像转移的板子静置至少30min、以独立线路朝下的方式放置内层线路板或多层线路板、控制蚀刻因子不小于4进行 DES连线。
其中，DES连线为显影(DEVELOPING)、蚀刻(ETCHING)、去膜(STRIP)连线的简称。
蚀刻因子为在蚀刻型金属引线框架的生产过程中“蚀刻深度与横向蚀刻之比”；蚀刻因子＝蚀刻线厚/【(上线宽-下线宽)/2】。
在本实施例中，AOI(Automatic Optical Inspection)为自动光学检测。在自动检测线路板时，机器通过摄像头自动扫描多层线路板，采集图像，将测试的焊点与数据库中的合格的参数进行比较，经过图像处理，检查出线路板上的缺陷，并通过显示器或自动标志把缺陷显示/标示出来。其中，内层AOI和外层AOI为分别对内层线路板和外层线路板(多层线路板)的自动光学检测。
在本实施例的沉铜电镀工艺中，在电镀之前新增等离子除胶，以增加产品的灌孔性；选择脉冲电镀VCP线、比待电镀产品大20mm左右的陪镀板，夹头夹短边，采用小电流、长时间的电镀参数，可将电镀均匀性控制在95％、孔面铜转化率98％。
在本实施例中，在湿膜工艺中，采用预设涂层对多层线路板进行组焊覆盖。预设涂层包括LowDk/Df油墨和整流剂、偶合剂，例如在1千克的LowDk/Df油墨中添加2～3ml的整流剂、偶合剂，混合得到预设涂层。
其中，线路板中的DK就是介电常数，所以LOW Dk就是低介电常数；线路板中的Df就是介质损耗因子，所以LOW Df就是低介质损耗因子。
在后工序中，依IPC-2级标准进行检验。
综上所述，本申请通过采用材料选择(偶联剂、LowDk/Df油墨)、工程资料优化(小尺寸花样排版)、现场工艺改进等等多个方面，有效地改善线路、 阻焊附着力，减小线路毛边，还进一步解决阻抗稳定性差、信号趋肤效应严重的问题。
上述实施例为本申请较佳的实施方式，但本申请的实施方式并不受上述实施例的限制，其他的任何未背离本申请的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本申请的保护范围之内。

Claims (8)

  1. 一种基于5G通讯的印制线路板制作方法，包括内层线路制作、层压工艺、钻孔工艺、沉铜电镀工艺、外层线路制作、湿膜工艺、表面工艺、后工序，其特征在于：
    在所述内层线路制作中，根据预设排版方式进行开料和微影工序，得到内层线路板；在所述层压工艺中，采用预热熔规则压合预叠合好的多个所述内层线路板；
    所述预设排版方式为小尺寸花样排版，具体为：所述内层线路板中的每一块包括至少包括8个微联端，且两两所述块之间相互独立，两两排列之间铺设有蜂窝状铜箔；
    其中，所述块为所述内层线路板中的线路区域的最小单位，多个所述块组成一个所述排列，多个所述排列组成所述内层线路板。
  2. 如权利要求1所述的一种基于5G通讯的印制线路板制作方法，其特征在于，所述采用预热熔规则压合预叠合好的多个所述内层线路板包括：
    A、对多个待压合的所述内层线路板进行等离子除胶；
    B、叠合PP胶片、铜箔及经过黑化处理的所述内层线路板，并采用热熔机进行四边提前热熔；
    C、经过x-ray确认后，对前次热熔后的待压合结构进行全边热熔得到多层线路板。
  3. 如权利要求1所述的一种基于5G通讯的印制线路板制作方法，其特征在于：在所述内层线路制作中，基板包括基板材料层和铜箔层，所述基板材料层和所述铜箔层之间覆盖有偶联剂；在所述层压工艺中，所述内层线路板之间覆盖有所述偶联剂；所述偶联剂为酚环含卤素类树脂。
  4. 如权利要求3所述的一种基于5G通讯的印制线路板制作方法，其特征在于：在内层线路制作中，采用湿法贴膜将干膜覆盖在涂布有均匀水膜的所述基板上；所述水膜中包含有所述偶联剂。
  5. 如权利要求1所述的一种基于5G通讯的印制线路板制作方法，其特征在于：在所述湿膜工艺中，采用预设涂层对多层线路板进行组焊覆盖；所述预设涂层包括LowDk/Df油墨和整流剂、偶合剂。
  6. 如权利要求1所述的一种基于5G通讯的印制线路板制作方法，其特征在于：在所述内层线路制作和所述外层线路制作中，均采用预设喷压、预设线速进行化学前处理，去除铜面上的污染物，以增加铜面粗糙度；其中，所述预设喷压、所述预设线速均为至常规喷压、常规线速设置的80％。
  7. 如权利要求1所述的一种基于5G通讯的印制线路板制作方法，其特征在于，在所述内层线路制作和所述外层线路制作中，包括：DES连线，将需做影像转移的板子静置至少30min、以独立线路朝下的方式放置所述内层线路板或多层线路板、控制蚀刻因子不小于4进行DES连线。
  8. 如权利要求4所述的一种基于5G通讯的印制线路板制作方法，其特征在于：所述基板材料层填充有填充剂，所述填充剂为硅类络合物。
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