WO2022233170A1

WO2022233170A1 - Wafer guiding system for silicon wafers

Info

Publication number: WO2022233170A1
Application number: PCT/CN2022/076598
Authority: WO
Inventors: 林佳继; 周欢; 时祥
Original assignee: 拉普拉斯(无锡)半导体科技有限公司
Priority date: 2021-05-07
Filing date: 2022-02-17
Publication date: 2022-11-10
Also published as: CN113394145A; CN113394145B

Abstract

Disclosed is a wafer guiding system for silicon wafers. The system comprises a conveying apparatus, a buffer apparatus, a storage apparatus, a wafer take-up apparatus and a wafer receiving apparatus. The conveying apparatus comprises a feeding conveying mechanism and a discharging conveying mechanism. The feeding conveying mechanism conveys a basket loaded with unprocessed silicon wafers to the buffer apparatus. The discharging conveying mechanism conveys an empty basket or a basket loaded with processed silicon wafers, the basket being inputted by the buffer apparatus. The conveying apparatus, the buffer apparatus and the storage apparatus convey the empty basket or the basket loaded with silicon wafers. The wafer take-up apparatus is used for conveying the silicon wafers between the storage apparatus and the wafer receiving apparatus. In the present invention, an automatic feeding procedure for conveying unprocessed silicon wafers from a basket to a wafer receiving apparatus, and an automatic discharging procedure for guiding processed silicon wafers from a wafer receiving apparatus to the basket are achieved. In the present invention, an upper wafer receiving mechanism and a lower wafer receiving mechanism are used. The upper wafer receiving mechanism and a lower wafer receiving mechanism work cooperatively, so that the wafer take-up apparatus is always in a wafer-guiding state, and the wafer guiding working efficiency is increased to the greatest extent.

Description

A silicon wafer guide system

technical field

The invention belongs to the field of photovoltaics, and relates to a silicon wafer guide system.

Background technique

The flower basket is an important tool during the transportation of silicon wafers. The number of silicon wafers placed in different flower baskets is not the same and the spacing of the silicon wafers in the flower basket is also different. With the increasing complexity, the requirements for wafer loading and unloading devices are also getting higher and higher, and the efficiency requirements are also getting higher and higher. In addition, the silicon wafer contacting the conveyor belt is prone to belt printing and contamination, and the original structure cannot meet the production capacity and quality requirements. The present invention effectively solves this problem.

SUMMARY OF THE INVENTION

In order to overcome the deficiencies of the prior art, the present invention provides a silicon wafer guide system.

In order to achieve the above purpose, the present invention adopts the following technical scheme: a guide system for silicon wafers, which is characterized in that: it includes a conveying device, a buffering device, a storage device, a wafer picking device and a wafer splicing device, and the conveying device includes a feeding and conveying mechanism. And the unloading conveying mechanism, the loading conveying mechanism conveys the flower baskets loaded with unprocessed silicon wafers to the buffer device, the unloading conveying mechanism conveys the empty flower baskets input from the buffer device or the flower baskets loaded with processed silicon wafers, the conveying device, buffer The device and the storage device convey the empty flower baskets or the flower baskets loaded with silicon wafers, and the wafer pick-up device is used for the transfer of the silicon wafers between the storage device and the wafer splicing device.

Further; the feeding and conveying mechanism transports the flower baskets loaded with unprocessed silicon wafers to the buffer device, the unloading conveying mechanism transports the empty flower baskets input from the buffer device or the flower baskets loaded with processed silicon wafers, the feeding and conveying mechanism and The structure of the unloading conveying mechanism is the same. There are two sets of the feeding conveying mechanism, and the two groups are symmetrically distributed. Symmetrical two groups of incoming material-to-shoot sensors, two groups of incoming material-to-shoot sensors and incoming material blocking cylinder control the flower baskets to be transported to the buffer device one by one.

Further; the buffer device includes a buffer lift mechanism and a buffer transport mechanism, the buffer lift mechanism is connected with the buffer transport mechanism, and controls the buffer transport mechanism to rise and fall, respectively docking with the feeding transport mechanism and the unloading transport mechanism, so that the flower baskets are located between the two. The buffer lifting mechanism includes a buffer frame and a buffer motor fixed on the buffer frame. The output end of the buffer motor is fixedly connected with a ball screw, and the ball screw is connected with a buffer moving block slidingly connected with the buffer frame. The buffer moving block is fixedly connected with the buffer conveying mechanism, and the buffer motor drives the buffer moving block to move up and down to drive the buffer conveying mechanism to rise and fall.

Further; the storage device includes an upper flower basket storage mechanism and a lower flower basket storage mechanism, the upper flower basket storage mechanism and the lower flower basket storage mechanism have the same structure and are distributed up and down, the upper flower basket storage mechanism is provided with two groups, and the two sets of upper flower basket storage mechanisms are respectively Corresponding to the two sets of buffer conveying mechanisms, the upper flower basket storage mechanism includes an upper storage rack and an upper storage conveying mechanism. The feeding conveying mechanism, the buffer device, the upper storage conveying mechanism and the lower storage conveying mechanism constitute the output path for loading unprocessed silicon wafer flower baskets. , the upper storage conveying mechanism, the lower storage conveying mechanism, the buffer device and the lowering conveying mechanism constitute the empty flower basket or the input path for loading the processed silicon wafer flower basket.

Further; the film-taking device includes two groups of film-taking suction cup mechanisms, two groups of film-taking lifting mechanisms and film-taking lateral movement mechanisms, a group of film-taking suction cup mechanisms and a group of film-taking lifting mechanisms form a film-taking lifting mechanism, and two groups are The film-taking lifting mechanism is symmetrically arranged, and the film-taking transverse movement mechanism is located between the two groups of film-receiving and lifting mechanisms and is respectively connected with the two groups of film-receiving and lifting mechanisms. Control the docking of the suction cup mechanism with the storage device and the splicing device respectively.

Further; the suction cup mechanism for taking the film includes a suction assembly, a fixing assembly and a spacing adjustment power assembly, the suction assembly includes a first suction cup assembly and a second suction cup assembly, the first suction cup assembly includes several first suction cups, and the second suction cup assembly includes several For the second suction cups, a plurality of first suction cups and a plurality of second suction cups are staggeredly distributed through the fixing components, and a gap groove is formed between the adjacent first suction cups and the second suction cups, and the silicon wafer is sucked into the gap groove.

Further; the first suction cup and the second suction cup have the same structure, the first suction cup includes a fixed plate and a suction plate, the suction plate includes an air intake part, a suction part, a suction cup side part and a sealing part, and the air intake part is fixed with Along the horizontal air intake groove, the suction part and the side part of the suction cup are fixedly provided with a suction groove, a gas channel is communicated between the suction groove and the suction groove, and the first suction cup sucks silicon wafers through the suction groove.

Further; the spacing fastening device includes a first connecting piece and a second connecting piece, the first connecting piece includes a top end and a connecting end, the diameter of the top end is larger than the diameter of the connecting end, and a first suction cup is fixed on the fixing plate. The spacing holes and the third spacing holes, the first spacing holes and the third spacing holes on the adjacent first suction cups are in opposite positions, so that the first spacing holes on one set of first suction cups are opposite to those on another adjacent set of first suction cups. The positions of the third spacing holes are opposite, the first spacing holes are connected with the second spacing holes, the size of the first spacing holes matches the size of the top end of the first connecting piece, the size of the third spacing holes matches the size of the connecting end of the first connecting piece, and the The connecting end of one connecting piece is inserted into the third spacing holes on one set of first suction cups, the top end of the first connecting piece is inserted into the first spacing holes on the other set of first suction cups, and the top end of the first connecting piece is at the first spacing The distance of the hole is controlled by the movement of the hole or/and the distance is controlled by controlling the length of the connecting end inserted into the third distance hole, and the second connecting piece is inserted into the second distance hole and extends to another adjacent group of first suction cups.

Further; the splicing device includes an upper splicing mechanism and a lower splicing mechanism, the upper splicing mechanism and the lower splicing mechanism are respectively provided with two groups, the upper splicing mechanism and the lower splicing mechanism have the same structure and are distributed up and down, and the upper The splicing mechanism includes an adjustment assembly and a splicing assembly. The splicing assemblies are provided with two groups. The opposite sides of the two sets of splicing assemblies are fixed with splicing plates. The adjacent splicing plates form splicing grooves for receiving silicon wafers. The component arranges the silicon wafers entering the splicing slot. The length direction of the splicing slot is consistent with the conveying direction of the silicon wafers of the splicing device. The adjacent splicing slots are arranged in parallel.

Further; the length of the buffer conveying mechanism matches the length of a single flower basket, that is, the buffer conveying mechanism is used for conveying a single flower basket; the feeding and conveying mechanism is also provided with a number of sensors, and the number of sensors is the same as the number of the flower baskets that the feeding and conveying mechanism can carry at one time. Consistent, and the distance between adjacent sensors can be adjusted. The sensor detects the full and short material status of the flower basket; the buffer conveying mechanism is fixed with a buffer blocking cylinder on the end face of the conveying direction, and two sets of symmetrical buffer cylinders are fixed on both sides of the buffer blocking cylinder. Sensors, two sets of buffer-to-shoot sensors and buffer-blocking cylinders control the conveyance of a single flower basket and control the speed and time of flower basket delivery; the buffer device also includes a buffer sensing device, which includes an upper buffer sensor, a lower buffer sensor, and a limit buffer sensor, The buffer conveying mechanism is provided with a buffer block, the buffer block moves up and down with the buffer conveyor mechanism, and the cooperation between the buffer block and the upper buffer sensor and the lower buffer sensor controls the buffer conveyor mechanism and the feeding conveyor mechanism and the unloading conveyor mechanism of the conveying device respectively. The docking, limiting buffer sensor limits the position of the buffer conveying mechanism; the upper flower basket storage mechanism of the storage device is provided with a beam sensor for detecting whether there are silicon wafers in the flower basket and an orientation sensor for detecting the orientation of the incoming flower basket.

To sum up, the benefits of the present invention are:

1) The present invention replaces the original elastic belt conveying silicon wafer mechanism, avoids belt printing and contamination during the conveying process of silicon wafers, and avoids the occurrence of cards and fragments during conveying, greatly improving the efficiency of guide wafers.

2) The present invention realizes the automatic feeding process of transporting unprocessed silicon wafers from the flower basket to the splicing device and the automatic unloading process of introducing the processed silicon wafers from the splicing device to the flower basket, and the maximum efficiency is achieved through this layout. purpose of the guide.

3) In the present invention, the upper and lower splicing mechanisms, as well as the upper splicing mechanism and the lower splicing mechanism, work together to keep the fetching device always in the guide state, thereby maximizing the working efficiency of the guide.

4) The present invention realizes the purpose of sequentially introducing the silicon wafers on the storage device into the contact grooves by controlling the lifting and lowering of the suction cup mechanism by the lifting mechanism.

5) In the present invention, the beam sensor is used to detect whether there are silicon wafers in the flower basket, and the orientation sensor is used to detect the orientation of the flower basket, so as to prevent the reverse placement error when the flower basket is transported, and improve the automatic control degree of the equipment. The flower basket is full and short of material to be detected, which realizes the fine control of the number of silicon wafers.

Description of drawings

FIG. 1 is a schematic diagram of the assembly of the system of the present invention.

FIG. 2 is a schematic diagram of a cache device of the present invention.

FIG. 3 is a schematic diagram of the film taking device of the present invention.

FIG. 4 is a schematic diagram 1 of the suction cup mechanism of the present invention.

FIG. 5 is a second schematic diagram of the suction cup mechanism of the present invention.

FIG. 6 is a schematic diagram 1 of the first suction cup of the present invention.

FIG. 7 is a second schematic diagram of the first suction cup of the present invention.

FIG. 8 is a schematic diagram 3 of the first suction cup of the unsealed portion of the present invention.

FIG. 9 is a schematic diagram of the assembly of the first suction cup of the present invention.

FIG. 10 is a schematic sectional view of A-A in FIG. 9 .

FIG. 11 is a schematic sectional view of B-B in FIG. 9 .

FIG. 12 is a schematic diagram of the upper connection mechanism of the present invention.

Detailed ways

The embodiments of the present invention are described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments may be combined with each other under the condition of no conflict.

It should be noted that the drawings provided in the following embodiments are only used to illustrate the basic concept of the present invention in a schematic way, so the drawings only show the components related to the present invention rather than the number, shape and number of components in actual implementation. For dimension drawing, the type, quantity and proportion of each component can be changed at will in actual implementation, and the component layout may also be more complicated.

All directional indications (such as up, down, left, right, front, rear, horizontal, vertical, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement situation between the components under a certain posture etc., if the specific posture changes, the directional indication also changes accordingly.

Example 1:

As shown in Figure 1-12, a wafer guide system for silicon wafers includes a conveying device, a buffering device 2, a storage device, a wafer picking device 4 and a splicing device. Or the flower basket loaded with silicon wafers is transported, and the wafer taking device 4 is used for the transportation of silicon wafers between the storage device and the wafer receiving device.

The conveying device includes a feeding conveying mechanism 1 and an unloading conveying mechanism 8. The feeding and conveying mechanism 1 conveys the flower baskets loaded with unprocessed silicon wafers to the buffer device 2. The flower baskets of the processed silicon wafers are conveyed. In this embodiment, the feeding and conveying mechanism 1 and the unloading conveying mechanism 8 have the same structure. The following structure describes the feeding and conveying mechanism 1 as an example. The two groups are symmetrically distributed. The feeding and conveying mechanism 1 adopts an AGV conveyor line, and its length can accommodate multiple groups of flower baskets to be transported at the same time. There are two symmetrical sets of incoming material-to-shoot sensors fixed on both sides of the end face of the feeding conveying mechanism 1. The two sets of incoming material-to-shoot sensors and the incoming material blocking cylinder work together to realize the purpose of conveying the flower baskets to the buffer device 2 one by one. In addition, The feeding and conveying mechanism 1 is also provided with a number of sensors. The number of sensors is consistent with the number of flower baskets that the feeding and conveying mechanism 1 can carry at one time, and the distance between adjacent sensors is adjustable. Fine control of the number of wafers.

The buffer device 2 is provided with two groups, which are respectively opposite to the two groups of feeding and conveying mechanisms 1 or the two groups of unloading and conveying mechanisms 8. The buffer device 2 includes a buffer lifting mechanism 21 and a buffer transport mechanism 22. The buffer lifting mechanism 21 and the buffer transport mechanism 22 Connect and control the lifting and lowering of the buffer conveying mechanism 22, so that the buffer conveying mechanism 22 is docked with the feeding conveying mechanism 1 and the unloading conveying mechanism 8 respectively, so as to realize the transportation of flower baskets between the two. In this embodiment, the buffer lifting mechanism 21 uses balls The screw drive mode controls the lifting and lowering of the buffer conveying mechanism 22. Specifically, the buffer lifting mechanism 21 includes a buffer frame 215 and a buffer motor 214 fixed on the buffer frame 215. The output end of the buffer motor 214 is connected to the ball screw (Fig. Not shown) fixed connection, the ball screw is connected with a buffer moving block 211 that is slidingly connected with the buffer frame 215, the buffer moving block 211 is fixedly connected with the buffer conveying mechanism 22, and the buffer motor 214 drives the buffer moving block 211 to move up and down to drive The buffer conveying mechanism 22 lifts up and down, as shown in FIG. 2 , the two groups of buffer conveying mechanisms 22 are positioned opposite to each other; the length of the buffer conveying mechanism 22 matches the length of a single flower basket, that is, the buffer conveying mechanism 22 is used for conveying a single flower basket, and the buffer conveying mechanism 22 is conveying A cache blocking cylinder is fixed on the end face of the direction, and two sets of symmetrical cache shooting sensors are fixed on both sides of the cache blocking cylinder. The two sets of cache shooting sensors and the cache blocking cylinder work together to achieve the purpose of conveying a single flower basket and control the flower basket conveying at the same time. speed and time.

The cache device 2 further includes a cache sensing device. The cache sensing device includes an upper cache sensor 210, a lower cache sensor 213 and a limit cache sensor 212. The upper cache sensor 210 and the lower cache sensor 213 are located at both ends of the cache rack 215, and the limit cache sensor 212 Located above the upper buffer sensor 210 and close to the upper buffer sensor 210, the upper buffer sensor 210, the lower buffer sensor 213, and the limit buffer sensor 212 have the same structure. The buffer conveying mechanism 22 is provided with a buffer block 216. The buffer block 216 follows the buffer. The conveying mechanism 22 goes up and down, and the upper buffer sensor 210 adopts the photosensitive principle. The upper buffer sensor 210, the lower buffer sensor 213 and the limit buffer sensor 212 include oppositely arranged induction plates. One side of the sensor board emits a light beam, and the other side of the sensor board senses the light beam. When the buffer block 216 moves with the buffer conveying mechanism 22 to between the sensor boards of the upper buffer sensor 210, the sensor end cannot receive the light beam signal, and the buffer motor 214 is controlled to make The buffer conveying mechanism 22 is opposite to the feeding conveying mechanism 1. At this time, the feeding and conveying mechanism 1 conveys the flower baskets loaded with unprocessed silicon wafers to the buffer conveying mechanism 22, and the buffer conveying mechanism 22 transports the flower baskets loaded with unprocessed silicon wafers to storage. When the buffer block 216 moves with the buffer conveying mechanism 22 to between the induction plates of the lower buffer sensor 213, the sensing end cannot receive the beam signal, and the buffer motor 214 is controlled to make the buffer conveying mechanism 22 and the unloading conveying mechanism 8 opposite in position , the buffer conveying mechanism 22 conveys the flower baskets loaded with unprocessed silicon wafers to the storage device, and after the conveying line is turned over, the storage device conveys the empty flower baskets or the flower baskets loaded with processed silicon wafers to the buffer conveying mechanism 22, and the buffer conveying mechanism 22 The empty flower baskets Or the flower baskets loaded with processed silicon wafers are transported to the unloading conveying mechanism 8, so as to realize automatic transportation of unloaded, unprocessed silicon wafers, and flower baskets loaded with processed silicon wafers; if there is a problem with the upper buffer sensor 213, the buffer conveying mechanism 22 will continue. When moving, when the buffer block 216 moves between the sensing plates that limit the buffer sensor 212 , the buffer motor 214 is controlled by a signal to stop working. In summary, the upper buffer sensor 210 and the lower buffer sensor 213 control the buffer conveying mechanism 22 It is respectively connected with the feeding conveying mechanism 1 and the discharging conveying mechanism 8 to limit the buffer sensor 212 to perform double protection for the buffer conveying mechanism 22 , which further improves the reliability and safety of the buffer device 2 .

The storage device includes an upper flower basket storage mechanism 3 and a lower flower basket storage mechanism 7. The upper flower basket storage mechanism 3 and the lower flower basket storage mechanism 7 have the same structure and are distributed up and down. The structure of the flower basket storage mechanism 3 is described below. The upper flower basket storage mechanism 3 is provided with two The upper flower basket storage mechanism 3 includes the upper storage rack 31 and the upper storage conveying mechanism 32, the feeding conveying mechanism 1, the buffer conveying mechanism 22, the upper The storage conveying mechanism 32 and the lower storage conveying mechanism constitute an output path for loading unprocessed silicon wafer flower baskets. Specifically, the loading conveying mechanism 1 transports the flower basket loaded with unprocessed silicon wafers to the upper storage conveying mechanism 32 and the lower storage conveying mechanism 22 through the buffer conveying mechanism 22. The lower storage conveying mechanism of the flower basket storage mechanism 7, when the conveying line is turned over, the upper storage conveying mechanism 32 and the lower storage conveying mechanism convey the empty flower baskets or the flower baskets loaded with processed silicon wafers to the buffer conveying mechanism 22, and the buffer conveying mechanism 22 will empty the flower baskets. The flower baskets or the flower baskets loaded with the processed silicon wafers are conveyed to the unloading conveying mechanism 8. The length of the upper storage conveying mechanism 32 matches the length of a single flower basket, and the flower baskets conveyed to the upper storage conveying mechanism 32 are fixed by the clamping device to prevent the chip taking device. 4. The offset is caused when taking the pieces, which affects the efficiency of taking pieces. In this embodiment, the upper flower basket storage mechanism 3 is provided with a beam sensor for detecting whether there are silicon wafers in the flower basket and an orientation sensor for detecting the orientation of the incoming flower basket. The orientation sensor prevents reverse placement errors when the flower basket is conveyed.

The film-taking device 4 includes two groups of film-taking suction cup mechanisms 41, two groups of film-taking lifting mechanisms 42, and a film-taking traversing mechanism 43. The film-taking and lifting mechanisms are symmetrically arranged, and the film-receiving and traversing mechanism 43 is located between the two groups of film-receiving and lifting mechanisms and is respectively connected with the two groups of film-receiving and lifting mechanisms. The traverse mechanism 43 controls the docking of the film-taking suction cup mechanism 41 with the storage device and the film-splicing device; the film-taking lifting mechanism 42 controls the film-taking suction cup mechanism 41 to rise and fall, and the film-taking traverse mechanism 43 controls the film-taking suction cup mechanism 41 to move laterally. In the embodiment, the film fetching and lifting mechanism 42 has the same structure as the buffer lifting mechanism 21, and adopts a ball screw drive to control the lifting and lowering of the film fetching suction cup mechanism 41. The structure of the device is the same. The pickup sensing device controls the upward and downward extreme positions of the pickup suction cup mechanism 41 to ensure that the pickup suction cup mechanism 41 moves within the set range, thereby improving the reliability and safety of the pickup device 4 .

The film removal device 4 also includes a film removal rotation mechanism 44. The film removal rotation mechanism 44 is located between the film removal suction cup mechanism 41 and the film removal lifting mechanism 42. The film removal rotation mechanism 44 includes a swing cylinder, and the swing cylinder controls the film removal suction cup mechanism 41 to rotate. In this embodiment, the rotation angle is preferably 180° or approximately 180°, and the rotation angle is determined according to the position of the storage device and the splicing device relative to the retrieving device 4 .

The suction cup mechanism 41 includes a suction assembly 411, a fixing assembly 412 and a spacing adjustment power assembly. The suction assembly 411 includes a first suction cup assembly and a second suction cup assembly. The first suction cup assembly includes several first suction cups, and the second suction cup assembly includes several first suction cups. Two suction cups, the fixing assembly 412 includes a mounting plate 4123, a fixing plate 4122, and a plurality of connecting rods 4141 connecting the mounting plate 4123 and the fixing plate 4122. The first suction cup and the second suction cup are respectively sleeved and fixed on the connecting rods 4141. A suction cup and a second suction cup are staggered. A gap groove is formed between the adjacent first suction cups and the second suction cups. The silicon wafer is sucked into the gap groove. A spacing fastening device 415 is provided, and the spacing fastening device 415 controls the spacing of the gap grooves.

The mounting plate 4123 of the fixing assembly 412 and the fixing plate 4122 form an installation area for installing the suction assembly 411. The first suction cup assembly and the second suction cup assembly are located in the installation area. Fixed connection, in this embodiment, the number of connecting rods 4141 is set to four groups, the first suction cup assembly and the second suction cup assembly are respectively matched with two sets of connecting rods 4141 to ensure the stability of the first suction cup assembly and the second suction cup assembly. A machine board 4121 is fixed between the board 4123 and the fixing board 4122 . The mounting board 4123 , the fixing board 4122 and the machine board 4121 form a stable rack-type structure.

The distance adjustment power assembly includes a cylinder 413. The cylinder 413 is fixedly connected to the fixing assembly 412 through the air intake frame 4124. The end face of the telescopic rod of the cylinder 413 is fixed with a push plate 4133, which is located on the first suction cup assembly and the second suction cup assembly. A group of connecting rods 4141 penetrate through the push plate 4133 and are slidably connected to the push plate 4133. The cylinder 413 drives the push plate 4133 to slide along the connecting rod 4141. Each group of the first suction cup and the second suction cup is connected with an intake pipe joint 4132, which is externally connected to the intake pipe joint 4132. Vacuum generator for gas circulation.

The number of the first suction cups matches the number of the second suction cups, and the structures of the first suction cups and the second suction cups in this embodiment are the same. The suction plate 4111 includes an air intake part 4113, a suction part 4111, a suction cup side part 4114 and a sealing part 4115. The air intake part 4113 is fixed with an air intake groove 41131 for horizontal air intake, and the suction part 4111 and the suction cup side part 4114 are fixed There is a suction groove 41111, a gas channel is communicated between the air inlet groove 41131 and the suction groove 41111, and the first suction cup sucks the silicon wafer through the suction groove 41111.

The fixing plate 4112 is provided with a mounting hole 41123 and a slot. The mounting hole 41123 serves as a through hole for the connecting rod 4141. The connecting rod 4141 passes through the mounting hole 41123 to connect several first suction cups. The mounting hole 41123 is provided with sliding or rolling components, such as Bushings, sliding bearings, etc., are bushings in this example, the mounting holes 41123 and the slot are respectively connected with fastening holes 41124, and the fasteners are pushed into the fastening holes 41124 to keep the sliding or rolling component and the first suction cup fixed, The air inlet 4113 is inserted into the slot, and the fasteners are pushed into the fastening holes 41124 to fix the air inlet 4113 in the slot, so as to ensure the stability of the fixing plate 4112 and the suction plate 4111 .

The intake part 4113 and the suction part 4111 are smoothly connected by the inclined table, and the angle formed between the inclined table and the end face of the intake part 4113 and the end face of the suction part 4111 is an obtuse angle, which prevents accumulation and helps to improve the pass rate. The air inlet pipe joint 4132 communicates with each other, the air intake direction of the air inlet groove 41131 is the horizontal direction, and the air inlet pipe joint 4132 and the suction cup side portion 4114 are located on different sides of the suction portion 4111 .

In this embodiment, the suction cup side portions 4114 are arranged in two groups, the air inlet portion 4113, the suction portion 4111 and the two groups of suction cup side portions 4114 form an F-shaped structure, and the air inlet portion 4113 and the suction portion 4111 form an F-shaped vertical structure, The two sets of suction cup side parts 4114 are fixed on the side of the suction part 4111, and are connected with the suction part 4111 at a set angle, preferably the angle is a right angle or an approximate right angle. It is beneficial to the import and export of silicon wafers when sucking and separating silicon wafers.

The gas channel includes a ventilation groove 41113 fixed on the side of the suction cup and opening outward. The ventilation groove 41113 is communicated with the air inlet groove 41131. The front side of the ventilation groove 41113 is connected with a sealing cavity 41114. The width of the sealing cavity 41114 is greater than the width of the ventilation groove 41113. The sealing cavity 41114 is matched with the sealing part 4115. The sealing part 4115 is installed in the sealing cavity 41114. After the sealing part 4115 is installed, it is on the same plane as the side of the suction part 4111, so as to avoid affecting the suction of the silicon wafer. Slot 1 and ventilation slot 2 located on the side part 4114 of the suction cup are formed. The ventilation slot 1 and the two groups of ventilation slots 2 form an F-shaped structure. The ventilation slot 1 is communicated with the air inlet slot 41131 and the ventilation slot 2 respectively. Through holes 41112, in this embodiment, there are five groups of through holes 41112, of which two groups of through holes 41112 are respectively fixed on the second ventilation groove, and the remaining three groups of through holes 41112 are fixed on the first ventilation groove. The ventilation groove 41113 is located on the opposite side of the suction part 4111. The width of the suction groove 41111 matches the diameter of the through hole 41112. The suction groove 41111 is composed of the suction groove 1 located on the suction part 4111 and the suction groove 2 located on the side part 4114 of the suction cup. The two groups of through holes 41112 are respectively located in the two groups of suction grooves and communicate with the second suction grooves, and the three groups of through holes 41112 are evenly distributed in the first suction grooves, namely The ventilation groove 41113 is communicated with the suction groove 41111 through the through hole 41112. The distribution position of the through hole 41112 increases the contact area between the first suction cup and the silicon wafer, and at the same time, the force of sucking the silicon wafer is kept balanced, so as to prevent the silicon wafer from being partially stressed or stressed. Non-uniform, improve the suction efficiency of silicon wafers.

As shown in FIGS. 10-11 , taking the first suction cup assembly as an example, the spacing fastening device 415 includes a first connecting piece 4151 and a second connecting piece 4152 . The first connecting piece 4151 includes a top end and a connecting end, and the diameter of the top end is larger than that of the connecting piece. The diameter of the end, the first spacing hole 41121 and the third spacing hole 41125 are fixed on the fixing plate 4112 of the first suction cup, and the first spacing hole 41121 and the third spacing hole 41125 on the adjacent first suction cup The first spacing hole 41121 on the first suction cup is opposite to the third spacing hole 41125 on the adjacent other group of first suction cups. The first spacing hole 41121 communicates with the second spacing hole 41122, the first spacing hole 41121 and the second spacing hole 41121 The spacing holes 41122 form a counterbore structure, the size of the first spacing hole 41121 is larger than the size of the third spacing hole 41125, the size of the first spacing hole 41121 matches the size of the top of the first connector 4151, and the size of the third spacing hole 41125 is the same as that of the first spacing hole 41125. The size of the connecting end of the connecting piece 4151 is matched. When the first connecting piece 4151 is assembled, the connecting end of the first connecting piece 4151 is fixedly connected with the third spacing holes 41125 on a set of first suction cups, and the top of the first connecting piece 4151 is inserted into The distance between the first spacing holes 41121 on the other set of first suction cups can be controlled by the movement of the top of the first connecting piece 4151 in the first spacing hole 41121, and the length of the connecting end inserted into the third spacing hole 41125 can also be controlled, and further To control the spacing, the second connecting member 4152 is inserted into the second spacing hole 41122 and extends to another adjacent group of first suction cups, and the second connecting member 4152 controls the minimum value of the spacing. The spacing adjustment process in this embodiment is as follows, as shown in FIG. 5 As shown, the air cylinder 413 drives the push plate 4133 to move, and then pushes the first set of first suction cups adjacent to it. The distance between the first set of suction cups and the second set of first suction cups is the minimum value, the cylinder 413 continues to work, and drives the third set of first suction cups to slide through the abutting force of the second connecting piece 4152, and operates sequentially until the distance between the first suction cup assemblies reaches At the minimum value, the cylinder 413 works in reverse, so that the spacing of the first suction cup assembly reaches the maximum value, thereby controlling the spacing of the gap grooves, so that the device can be adapted to the extraction of different silicon wafers, and the application range of the device is improved.

The splicing device includes an upper splicing mechanism 5 and a lower splicing mechanism 6. The upper splicing mechanism 5 and the lower splicing mechanism 6 are respectively provided with two groups. The upper splicing mechanism 5 and the lower splicing mechanism 6 have the same structure. The structure of the splicing mechanism 5 is described. The upper splicing mechanism 5 includes an adjustment assembly 51 and a splicing assembly 52. The splicing assemblies 52 are provided with two groups. The adjacent contact plate 521 constitutes a contact groove for receiving silicon wafers. The adjustment assembly 51 moves relative to the contact assembly 52 to align the silicon wafers entering the contact groove to ensure the order of the silicon wafers and facilitate subsequent processes. In addition, two groups of The spacing of the splicing components 52 can be adjusted manually to adapt to different sizes of silicon wafers. The length direction of the splicing slot is consistent with the conveying direction of the silicon wafers of the wafer fetching device 4. The adjacent splicing slots are arranged in parallel. For the purpose of sequentially introducing the silicon wafers into the contact grooves.

In the implementation process of this embodiment, the feeding and conveying mechanism 1 transports the flower baskets loaded with unprocessed silicon wafers to the upper storage and conveying mechanism 32 through the buffer conveying mechanism 22, and the film-taking transverse movement mechanism 43 and the film-taking lifting mechanism 42 control the film-taking suction cup mechanism 41 is matched with the flower basket located on the upper storage and conveying mechanism 32, and the silicon wafers are sucked and transported to the wafer slot of the upper wafer connection mechanism 5 through the wafer suction cup mechanism 41 in turn, which is convenient for the subsequent processing of the wafers. For wafer working efficiency, the buffer lifting mechanism 21 controls the buffer conveying mechanism 22 to be opposite to the lower storage conveying mechanism. The flower baskets loaded with unprocessed silicon wafers are conveyed to the lower storage conveying mechanism through the buffer conveying mechanism 22. The suction cup mechanism 41 will be located in the lower storage conveying mechanism. The silicon wafers in the upper flower basket are sucked and transported to the splicing groove of the lower splicing mechanism 6. The above mechanisms operate alternately in turn, ensuring that the slicing device 4 is always in the guide state, and maximizes the working efficiency of the guide. The silicon wafers in the flower baskets on the storage conveying mechanism 32 and the lower storage conveying mechanism are completely exported, the upper storage conveying mechanism 32 and the lower storage conveying mechanism are reversed, and the empty flower baskets are conveyed to the buffer conveying mechanism 22, and then to the unloading conveying mechanism 8 , so as to realize the feeding process of transporting the unprocessed silicon wafers from the flower basket to the splicing device. After the silicon wafer processing is completed, the above process is reversed to realize the unloading process of introducing the processed silicon wafers from the splicing device to the flower basket. This cycle is repeated to realize automatic loading and unloading of silicon wafers.

In this embodiment, the suction component 411 may further include a vacuum filter, and the vacuum filter can filter impurities in the air to protect the normal use of the equipment, thereby increasing the service life of the equipment.

In other embodiments, the fixing portion 411 and the suction plate 4111 may also adopt an integral molding process.

In other embodiments, the suction assembly 411 may include only the first suction cup assembly or the second suction cup assembly.

In other embodiments, one set of suction cup side parts 4114 can also be provided, the suction cup side part 4114, the air intake part 4113 and the suction part 4111 form a T-shaped vertical structure, or the number of suction cup side parts 4114 can be set to three groups or four groups Or more.

In other embodiments, the film removal and rotation mechanism 44 may also use a rotary motor to control the rotation of the film removal suction cup mechanism 41 .

Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Claims

A guide system for silicon wafers, which is characterized in that it includes a conveying device, a buffering device, a storage device, a wafer picking device and a wafer splicing device, and the conveying device includes a feeding conveying mechanism and an unloading conveying mechanism. The flower baskets of unprocessed silicon wafers are conveyed to the buffer device, the unloading conveying mechanism conveys the empty flower baskets input from the buffer device or the flower baskets loaded with processed silicon wafers, and the conveying device, the buffer device and the storage device are used for empty flower baskets or loaded silicon wafers. The flower baskets are transported, and the wafer pick-up device is used for the transfer of silicon wafers between the storage device and the wafer device.
A silicon wafer guide system according to claim 1, characterized in that: the feeding conveying mechanism and the discharging conveying mechanism are distributed up and down, the feeding conveying mechanism and the discharging conveying mechanism have the same structure, and the feeding conveying mechanism has the same structure. There are two groups, and the two groups are symmetrically distributed. The feeding and conveying mechanism is fixed with incoming material blocking cylinders at both ends of the conveying direction, and two symmetrical groups of incoming material opposite-shooting sensors are fixed on both sides of the end face of the feeding and conveying mechanism. A group of incoming material-to-shoot sensors and incoming material blocking cylinders control the flower baskets to be transported to the buffer device one by one.
A silicon wafer guide system according to claim 1, wherein the buffer device comprises a buffer lift mechanism and a buffer transport mechanism, the buffer lift mechanism is connected with the buffer transport mechanism, and controls the buffer transport mechanism to rise and fall, respectively. It is connected with the feeding conveying mechanism and the unloading conveying mechanism, so that the flower basket can be conveyed between the two. The buffer lifting mechanism includes a buffer frame and a buffer motor fixed on the buffer frame. The output end of the buffer motor is fixed with the ball screw. The ball screw is connected with a buffer moving block slidingly connected with the buffer frame, the buffer moving block is fixedly connected with the buffer conveying mechanism, and the buffer motor drives the buffer moving block to move up and down to drive the buffer conveying mechanism to rise and fall.
A silicon wafer guide system according to claim 2, wherein the storage device comprises an upper flower basket storage mechanism and a lower flower basket storage mechanism, the upper flower basket storage mechanism and the lower flower basket storage mechanism have the same structure and are distributed up and down, There are two sets of upper flower basket storage mechanisms, and the two sets of upper flower basket storage mechanisms correspond to the two sets of buffer conveying mechanisms respectively. The conveying mechanism and the lower storage conveying mechanism constitute the output path for loading unprocessed silicon wafer flower baskets. The upper storage conveying mechanism, the lower storage conveying mechanism, the buffer device and the lowering conveying mechanism constitute the empty flower basket or the input path for loading the processed silicon wafer flower basket.
A silicon wafer guide system according to claim 1, characterized in that: the wafer extraction device comprises two groups of wafer extraction suction cup mechanisms, two groups of wafer extraction and lift mechanisms, and wafer extraction and lateral movement mechanisms, and one group of wafer extraction mechanisms The suction cup mechanism and a group of film removal and lifting mechanisms form a film removal and lifting mechanism. The two groups of film removal and lifting mechanisms are symmetrically arranged. The film traverse mechanism controls the transverse movement of the film fetching and lifting mechanism, and the film traverse mechanism controls the docking of the film fetching suction cup mechanism with the storage device and the film splicing device respectively.
A silicon wafer guide system according to claim 5, wherein the suction cup mechanism for taking the wafer comprises a suction assembly, a fixing assembly and a spacing adjustment power assembly, and the suction assembly includes a first suction cup assembly and a second suction cup assembly , the first suction cup assembly includes a plurality of first suction cups, the second suction cup assembly includes a plurality of second suction cups, a plurality of first suction cups and a plurality of second suction cups are staggered through the fixing assembly, and a gap groove is formed between the adjacent first suction cups and the second suction cups , the silicon wafer is sucked into the gap groove.
The silicon wafer guide system according to claim 6, wherein the first suction cup and the second suction cup have the same structure, the first suction cup includes a fixing plate and a suction plate, and the suction plate includes an air inlet, The suction part, the side part of the suction cup and the sealing part, the air inlet part is fixed with an air inlet groove for horizontal air intake, the suction part and the side part of the suction cup are fixed with a suction groove, and a gas channel is connected between the air inlet groove and the suction groove. The first suction cup sucks the silicon wafer through the suction groove.
A silicon wafer guide system according to claim 6, wherein the spacing fastening device comprises a first connecting piece and a second connecting piece, the first connecting piece comprises a top and a connecting end, and the diameter of the top is The diameter of the first suction cup is larger than the diameter of the connecting end, the first spacing hole and the third spacing hole are fixed on the fixing plate of the first suction cup, and the first spacing hole and the third spacing hole on the adjacent first suction cups are in opposite positions, so that a group of first suction cups The first spacing hole is opposite to the third spacing hole on another adjacent group of first suction cups, the first spacing hole is communicated with a second spacing hole, and the size of the first spacing hole matches the size of the top of the first connector. The size of the third spacing hole matches the size of the connecting end of the first connecting piece, the connecting end of the first connecting piece is inserted into the third spacing hole on one set of first suction cups, and the top of the first connecting piece is inserted into another set of first suction cups The first spacing hole, the spacing is controlled by the movement of the top end of the first connecting piece in the first spacing hole or/and by controlling the length of the connecting end inserted into the third spacing hole to control the spacing, the second connecting piece is inserted into the second spacing hole and moves toward the first spacing hole. Another adjacent group of first suction cups extends.
A silicon wafer guide system according to claim 1, characterized in that: the splicing device comprises an upper splicing mechanism and a lower splicing mechanism, and the upper splicing mechanism and the lower splicing mechanism are respectively provided with two groups The upper and lower splicing mechanisms have the same structure and are distributed up and down. The upper splicing mechanism includes an adjustment assembly and a splicing assembly. There are two sets of splicing assemblies, and splicing plates are fixed on the opposite sides of the two sets of splicing assemblies. , the adjacent splicing plates form splicing grooves for receiving silicon wafers, and the adjustment component regulates the silicon wafers entering the splicing grooves. The grooves are arranged in parallel, and the wafer pick-up device transports the silicon wafers into the wafer grooves.
A silicon wafer guide system according to claim 3, wherein the length of the buffer conveying mechanism matches the length of a single flower basket, that is, the buffer conveying mechanism is used for conveying a single flower basket; the feeding and conveying mechanism is further provided with Several sensors, the number of sensors is the same as the number of flower baskets carried by the feeding conveying mechanism at one time, and the distance between adjacent sensors is adjustable. Cylinder, cache blocking cylinder There are two symmetrical sets of cache-to-shoot sensors fixed on both sides of the cylinder. The two sets of cache-to-shoot sensors and the cache blocking cylinder control the conveyance of a single flower basket and control the speed and time of the flower basket delivery; the cache device also includes a cache sensing device The buffer sensing device includes an upper buffer sensor, a lower buffer sensor and a limit buffer sensor. The buffer conveyor mechanism is provided with a buffer block, the buffer block moves up and down with the buffer conveyor mechanism, and the buffer block, the upper buffer sensor and the lower buffer sensor cooperate to control The buffer conveying mechanism is respectively connected with the feeding conveying mechanism and the discharging conveying mechanism of the conveying device, and the buffer sensor is limited to limit the position of the buffer conveying mechanism; the upper flower basket storage mechanism of the storage device is provided with a sensor for detecting whether there are silicon wafers in the flower basket. Through-beam sensor and orientation sensor for detecting the orientation of incoming flower baskets.