CN117566413A - Substrate feeding mechanism, plastic packaging machine and working method of plastic packaging machine - Google Patents
Substrate feeding mechanism, plastic packaging machine and working method of plastic packaging machine Download PDFInfo
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- CN117566413A CN117566413A CN202410060520.5A CN202410060520A CN117566413A CN 117566413 A CN117566413 A CN 117566413A CN 202410060520 A CN202410060520 A CN 202410060520A CN 117566413 A CN117566413 A CN 117566413A
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- 230000007246 mechanism Effects 0.000 title claims abstract description 146
- 239000000758 substrate Substances 0.000 title claims abstract description 101
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 28
- 238000013459 approach Methods 0.000 claims abstract description 10
- 230000007704 transition Effects 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
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- 238000012858 packaging process Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/82—Rotary or reciprocating members for direct action on articles or materials, e.g. pushers, rakes, shovels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G59/00—De-stacking of articles
- B65G59/06—De-stacking from the bottom of the stack
- B65G59/067—De-stacking from the bottom of the stack articles being separated substantially perpendicularly to the axis of the stack
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the field of chip production, in particular to a substrate feeding mechanism, a plastic packaging machine and a working method thereof. The invention provides a substrate feeding mechanism, which comprises: a feeding table top is provided with a feeding station; the two sides of the feeding station are respectively provided with a positioning mechanism and a sheet-finishing mechanism; after the wafer box is placed on the feeding station, the whole wafer mechanism rotates to be abutted with the wafer box and pushes the wafer box to tilt towards one side of the positioning mechanism; after the wafer box is inclined, the whole wafer mechanism contracts along the height direction, so that the substrate shakes and approaches to one side of the positioning mechanism along with the inclination direction of the wafer box. One side of the loading station is blocked by a rotatable hinged plate so as to prevent the equipment from vibrating to shake the substrate from the wafer box. Through setting up whole piece inclined plane and a plurality of whole piece unit, through whole piece unit with the box perk in whole piece in-process to shake the base plate to positioning guide rail one side, so that reduce the base plate vibration damage, and ensure to get the piece fork and take out the base plate when getting the piece.
Description
Technical Field
The invention relates to the field of chip production, in particular to a substrate feeding mechanism, a plastic packaging machine and a working method thereof.
Background
When the plastic packaging machine is used for plastic packaging of the substrates, a feeding mechanism is usually arranged, a plurality of substrates are placed in the wafer boxes, the wafer boxes are placed on the feeding mechanism, the feeding mechanism can automatically convey the wafer boxes to the processing stations, and then the feeding mechanism sequentially extracts the substrates from the wafer boxes to carry out corresponding plastic packaging processes.
However, in the prior art, the substrates need to be stored and pulled out from the cassette, so that both sides of the cassette are opened. However, vibration is inevitably generated in the whole equipment in operation, so that the substrate is likely to deviate in the wafer box in the conveying process of the feeding mechanism, slide out of the wafer box or strike other parts of the feeding mechanism, and damage and the like are caused. Therefore, it is necessary to design a substrate feeding mechanism, a plastic packaging machine and a working method thereof.
Disclosure of Invention
The invention aims to provide a substrate feeding mechanism, a plastic packaging machine and a working method thereof, so as to solve the problems.
In order to achieve the above object, the present invention provides a substrate feeding mechanism, including: the feeding table top is provided with a feeding station; and
the two sides of the feeding station are respectively provided with a positioning mechanism and a sheet-arranging mechanism, and the bottom of the sheet-arranging mechanism is hinged with the feeding table top;
the opening side of the wafer box faces the positioning mechanism and the wafer arranging mechanism respectively;
the positioning mechanism is abutted with the bottom of the wafer box, the wafer arranging mechanism is abutted with the top of the wafer box, and the wafer arranging mechanism can be arranged in a telescopic way; wherein the method comprises the steps of
After the wafer box is placed on the feeding station, the wafer arranging mechanism rotates to be abutted with the wafer box and pushes the wafer box to tilt towards one side of the positioning mechanism;
after the wafer box is inclined, the whole wafer mechanism contracts along the height direction, so that the substrate shakes and approaches to one side of the positioning mechanism along with the inclination direction of the wafer box.
Further, the whole piece mechanism comprises a whole piece inclined plane which is arranged towards the wafer box, and the whole piece inclined plane is obliquely arranged in a direction away from the positioning mechanism along a vertical downward direction; and
a plurality of whole-piece units are arranged on the whole-piece inclined plane, the head ends and the tail ends of two adjacent whole-piece units are connected, and the head ends and the tail ends of the two adjacent whole-piece units form a folding angle; wherein the method comprises the steps of
After the wafer box is placed on the feeding station, the bottom end of the whole wafer inclined plane is abutted with the top of one side of the opening of the wafer box, and the wafer box is pushed to tilt towards one side of the positioning mechanism;
when the whole sheet mechanism contracts in the height direction, the sheet box sequentially passes through the folding angles among the whole sheet units along the whole sheet inclined plane, and the sheet box drives the substrate to shake at each folding angle so as to enable the substrate to approach the direction of the positioning mechanism.
Further, the whole piece unit comprises a straight surface section and an inclined surface section, and a folding angle is formed at the intersection of the straight surface section and the inclined surface section; wherein the method comprises the steps of
When the wafer box slides to the folded angle along the straight section, the wafer box drives the substrate to shake.
Further, the inclined surface section comprises a guide surface and a transition surface, the guide surface is connected with the transition surface, and the guide surface and the transition surface are respectively connected with the straight surface sections of two adjacent integral units; and
and a folding angle is formed between the guide surface and the transition surface.
Further, the whole sheet mechanism further comprises a hinge plate and a telescopic plate, the hinge plate is hinged with the feeding table top, the telescopic plate is arranged at the top of the hinge plate, and the telescopic plate is elastically connected with the hinge plate;
the whole inclined plane is arranged on one side of the expansion plate, which faces the positioning mechanism.
Further, a telescopic groove is formed in the top of the hinge plate, and the telescopic plate is arranged in the telescopic groove;
a plurality of expansion springs are arranged in the expansion grooves, and two ends of each expansion spring are respectively connected with the hinge plate and the expansion plate.
Further, a supporting plate is further arranged on one side of the feeding table top, and a limiting block is arranged on one side of the supporting plate towards the expansion plate;
the top of expansion plate has seted up the buckle groove, the buckle groove with the stopper is corresponding.
Further, a positioning sensor is arranged on the limiting block.
Further, the positioning mechanism is a positioning guide rail, and the positioning guide rail extends along the conveying direction of the cassette.
In addition, the invention also provides a plastic packaging machine, which uses the substrate feeding mechanism, and further comprises a working platform, wherein the substrate feeding mechanism is arranged on the working platform; and
the two sides of the feeding table top are also respectively provided with a pushing mechanism and a sheet taking mechanism, and the movable end of the pushing mechanism is arranged towards the feeding station;
one side of the sheet taking mechanism facing the feeding station is provided with a sheet taking station; wherein the method comprises the steps of
After the pushing mechanism pushes the wafer box from the feeding station to the wafer taking station, the wafer taking mechanism sequentially pushes out the substrates in the wafer box.
The pushing mechanism comprises a pushing plate and a pushing cylinder, the movable end of the pushing cylinder is connected with the pushing plate, and the pushing plate is arranged on one side of the feeding station; wherein the method comprises the steps of
After the sheet box is placed on the feeding station, the pushing cylinder pushes the sheet box to slide towards the sheet taking station.
Further, the sheet taking mechanism comprises a lifting assembly and a sheet taking assembly, the lifting assembly comprises a positioning plate, a screw rod and a lifting plate, the lifting plate is arranged on one side of the positioning plate in a sliding manner, the screw rod is rotationally connected with the positioning plate, and the screw rod is in threaded connection with the lifting plate;
one side of the lifting plate is provided with a bottom bracket so as to form the sheet taking station;
the piece taking assembly comprises a piece taking support, a piece taking cylinder and a piece taking fork, wherein the piece taking support is arranged on the working platform, the piece taking cylinder is arranged on the piece taking support, the piece taking fork faces to the bottom bracket, and the movable end of the piece taking cylinder is connected with the piece taking fork.
In addition, the invention also provides a working method of the plastic packaging machine, wherein the plastic packaging machine is used, S1, the fully loaded sheet box is placed on a feeding station, and the hinge plate drives the expansion plate to rotate until the whole inclined plane is abutted with the sheet box and pushes the sheet box to incline to one side of the positioning guide rail;
s2, the expansion plate contracts downwards, and the wafer box sequentially forms folding angles with all the wafer units along the wafer inclined planes, so that the wafer box drives the substrate to shake and approaches to one side of the positioning guide rail;
s3, driving a pushing plate to push the sheet box to slide to the bottom bracket along the feeding table board by the pushing cylinder;
s4, the slice taking cylinder drives the slice taking fork to be inserted from the opening of the slice box and pushes out the substrate at the corresponding position from the opening at the other side of the slice box;
s5, the slice taking cylinder drives the slice taking fork to return, and the screw rod drives the lifting plate to drive the bottom bracket to descend until the next substrate is aligned with the slice taking fork in height;
s6, repeating the steps S4 and S5 until all the substrates in the wafer box are taken out.
Compared with the prior art, the invention has the following beneficial effects: one side of the loading station is blocked by a rotatable hinged plate so as to prevent the equipment from vibrating to shake the substrate from the wafer box. Through setting up whole piece inclined plane and a plurality of whole piece unit, through whole piece unit with the box perk in whole piece in-process to shake the base plate to positioning guide rail one side, so that reduce the base plate vibration damage, and ensure to get the piece fork and take out the base plate when getting the piece.
Drawings
The invention will be further described with reference to the drawings and examples.
Fig. 1 shows a perspective view of a plastic packaging machine of the present invention;
FIG. 2 shows a schematic structural view of the feeding mesa of the present invention;
FIG. 3 is a schematic view showing the structure of the sheet taking mechanism of the present invention;
fig. 4 is a partial structural view showing a substrate loading mechanism of the present invention;
FIG. 5 shows a schematic view of the structure of the whole inclined plane of the present invention;
fig. 6 shows a partial enlarged view of the portion a in fig. 5.
In the figure:
1. a feeding table top; 11. a support plate; 12. a limiting block; 13. positioning a sensor;
2. positioning a guide rail;
3. a sheet-finishing mechanism; 31. a whole inclined plane; 32. a whole sheet unit; 321. a straight section; 322. a guide surface; 323. a transition surface; 33. a hinged plate; 331. a telescopic slot; 332. a telescopic spring; 34. a telescoping plate; 341. a buckle groove;
4. a working platform;
5. a pushing mechanism; 51. a pushing plate; 52. a pushing cylinder;
6. a sheet taking mechanism; 61. a lifting assembly; 611. a positioning plate; 612. a screw rod; 613. a lifting plate; 614. a bottom bracket; 62. a sheet taking assembly; 621. a piece taking bracket; 622. a slice taking cylinder; 623. and taking a slice fork.
Detailed Description
The invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the invention and therefore show only the structures which are relevant to the invention.
In a first embodiment, as shown in fig. 1 to 6, the present embodiment provides a substrate feeding mechanism, including: the feeding table top 1 is provided with a plurality of supporting feet below the feeding table top 1, so that the feeding table top 1 is supported up to lift the feeding table top 1 to a height convenient for operators to operate. The feeding table top 1 is provided with a feeding station, and the wafer box can be prevented from being arranged on the feeding station so as to realize subsequent automatic feeding. The magazine is whole rectangular magazine, has a plurality of slot that sets gradually along the direction of height in the magazine inside to the both sides of magazine all are uncovered to set up, in order to make things convenient for the operator to insert inside the magazine with the base plate from one side level, and finally realize a plurality of magazine and laminate the state in proper order.
It should be noted that in the prior art, after the wafer box is usually placed at the loading station, the wafer box is automatically pushed away by other devices, then after the wafer box reaches the plastic packaging station of the specified plastic packaging machine, the corresponding mechanism sequentially takes down the substrate on the wafer box for plastic packaging, after the wafer box is unloaded, an operator can take the wafer box away, and a new fully loaded wafer box is placed at the loading station again for the next working cycle. In the above-mentioned process of placing to plastic packaging, because the base plate needs to be pushed out from the inside of the wafer box in proper order, therefore the circumference of wafer box needs to be in the both sides opening of length direction in order to realize above-mentioned process. However, under the above conditions, the device itself inevitably vibrates during operation, so that the device vibrates to drive the wafer box to vibrate, and the wafer box drives the substrate to vibrate, and the substrate is relatively light, and the two sides of the wafer box are open, so that the substrate may gradually deviate from the wafer box or even slide out of the wafer box during vibration, and as a result, flaws or damages to the substrate may be caused. On the other hand, in the case of producing a substrate, the substrate is subjected to heat treatment in the preceding step, and the substrate subjected to heat treatment is likely to be slightly bent, and the bent substrate can be repaired by the extrusion process, but in this step, the bent substrate may still exist. Therefore, the distance between the slots of the cassette is slightly greater than the thickness of the substrate, so that the substrates can be inserted conveniently, the possibility of vibration falling of the substrates can be increased due to the non-uniform sizes of the slots and the substrates, and meanwhile, if the substrates reach the pick-up position, the curved substrates shift to one side of the pick-up mechanism, the mechanism can be blocked at the parts of the substrate bulge and the cassette, and the substrates cannot be correctly inserted into the corresponding slots, so that the substrates cannot be removed.
In order to solve the above-described problem, in the present embodiment, the positioning mechanism and the sheet-integrating mechanism 3 are designed. Specifically, the whole piece mechanism 3 and the positioning mechanism are respectively arranged at two sides of the feeding station, the back plate is arranged at the outer side of the positioning mechanism, meanwhile, the whole piece mechanism 3 is hinged with the feeding tread, and the opening side of the wafer box faces to the positioning mechanism and the whole piece mechanism 3 respectively. In this embodiment, as a preference, when the operator can operate, the whole sheet mechanism 3 rotates to topple over on the feeding table top 1, at this time, the feeding station is opened, the operator can place the fully loaded sheet box on the feeding station, then the operator rotates the whole sheet mechanism 3 to be vertical, at this time, the whole sheet mechanism 3 can cooperate the backboard to shield the feeding station from two sides, and meanwhile, the movable space in the opening direction of the sheet box is also shielded, at this time, even if equipment vibration exists, the substrate can be effectively protected from falling out of the sheet box. In addition, in order to further ensure that the base plate can not deviate to the whole piece mechanism 3 one side to prevent the condition that follow-up unable piece of getting from appearing, in this embodiment, design positioning mechanism for with the bottom butt of magazine, the top butt with the magazine when whole piece mechanism 3 is vertical put simultaneously, through above-mentioned design, positioning mechanism and whole piece mechanism 3 in both sides respectively with the top and the bottom butt of magazine, and then whole piece mechanism 3 can push the magazine to the backplate one side to the perk. The whole piece mechanism 3 also can be telescopically arranged, after the whole piece mechanism 3 pushes the wafer box to the perk, an operator can further drive the whole piece mechanism 3 to shrink along the height direction, at the moment, the whole piece mechanism 3 intermittently pushes the wafer box to enable the wafer box to shake, and under the state that the wafer box is inclined towards the back plate direction at the moment, the substrate inside the wafer box is continuously close to the back plate direction along with shaking until the substrate is attached to the back plate. Through the mode, the offset direction of the substrate can be controlled, so that the substrate is prevented from being offset towards the direction of the whole sheet mechanism 3, further, each substrate can be smoothly taken down in the follow-up sheet taking process, meanwhile, the substrate and the backboard are in inclined contact, and the substrate and the backboard are in line contact, so that the damage of the backboard to the substrate is small during vibration.
In order to achieve the above effect that the whole wafer mechanism 3 abuts against the wafer cassette and drives the substrate to shake, in this embodiment, as an option, the whole wafer mechanism 3 includes a whole wafer inclined plane 31 disposed toward the wafer cassette, and the whole wafer inclined plane 31 is disposed obliquely in a direction away from the positioning mechanism along a vertically downward direction. Through the arrangement, after the wafer box is placed to the feeding station, the whole wafer inclined plane 31 and the positioning mechanism can be abutted with the wafer box from two sides, and meanwhile, the whole wafer inclined plane 31 can push the wafer box to tilt towards the back plate direction by taking the positioning mechanism as a fulcrum. Meanwhile, a plurality of whole-piece units 32 are arranged on the whole-piece inclined plane 31, the head ends and the tail ends of two adjacent whole-piece units 32 are connected, and the head ends and the tail ends of two adjacent whole-piece units 32 form a folding angle. Through the arrangement, when the whole sheet mechanism 3 contracts along the height direction, the sheet box slides along the whole sheet inclined plane 31 to form a first folding angle position, at this time, along with the continuous descending of the whole sheet mechanism 3, the second whole sheet unit 32 continuously tilts the sheet box along the folding angle direction, the sheet box drives the substrate inside to synchronously move, when the sheet box reaches the second folding angle position, the movement direction of the sheet box suddenly changes, the substrate moves along the original movement direction under the action of inertia, at this time, the condition that the movement of the first substrate and the sheet box is not uniform occurs, namely, the substrate shakes, along with the continuous descending of the whole sheet mechanism 3, the sheet box passes through the plurality of whole sheet units 32 and circulates the process, and the effect that the substrate gradually approaches to the back plate direction can be realized.
The structure of the whole sheet unit 32 is specifically described below, the whole sheet unit 32 includes a straight section 321 and an inclined section, the straight section 321 is consistent with the height direction of the whole sheet mechanism 3, and the intersection of the inclined section and the straight section 321 forms an obtuse included angle, thus forming a bevel. When the wafer box slides to the folding angle along the straight surface section 321, the movement direction of the wafer box is changed because the wafer box can only slide along the inclined surface section, and the substrate in the wafer box can not change the movement direction immediately under the inertia effect, so that the movement direction of the wafer box and the substrate are inconsistent, and the wafer box drives the substrate to shake.
In order to avoid the excessive tilting angle of the cassette along the inclined plane section, in this embodiment, the inclined plane section includes a guiding surface 322 and a transition surface 323, where the guiding surface 322 is connected to the transition surface 323, and the guiding surface 322 and the transition surface 323 are respectively connected to the straight surface sections 321 of two adjacent integral units 32. The angle between the guiding surface 322 and the straight surface section 321 is smaller than the angle between the transition surface 323 and the straight surface section 321, so that a break angle is formed between said guiding surface 322 and said transition surface 323. That is, the connection between the transition surface 323 and the straight surface section 321 is smoother, the guiding surface 322 is used for guiding the wafer box to incline, and the transition surface 323 is used for guiding the wafer box to gradually approach the straight surface section 321, so as to avoid the collision between the substrate and the wafer box caused by overlarge tilting angle of the wafer box.
The structure of the sheet-integrating mechanism 3 is specifically described below, and the sheet-integrating mechanism 3 further includes a hinge plate 33 and a telescoping plate 34. The hinge plate 33 is hinged to the feeding table top 1, the expansion plate 34 is arranged at the top of the hinge plate 33, and the expansion plate 34 is elastically connected with the hinge plate 33. Through the arrangement, an operator can drive the hinged plate 33 and the telescopic plate 34 to rotate around the feeding table top 1 to be horizontal or vertical through the hinged plate 33 so as to open or close the feeding station. Meanwhile, the whole inclined plane 31 is arranged on one side of the expansion plate 34 facing the positioning mechanism, so that when the expansion plate 34 is in a vertical state, the whole inclined plane 31 can be abutted with the top of the wafer box. In addition, the expansion plate 34 is elastically connected to the hinge plate 33, so that an operator can control the effect that the expansion plate 34 is contracted toward the hinge plate 33 or the expansion plate 34 is opened.
In order to achieve the above effect, in this embodiment, optionally, a telescopic slot 331 is formed at the top of the hinge plate 33, and the telescopic plate 34 is disposed in the telescopic slot 331. A plurality of expansion springs 332 are arranged in the expansion grooves 331, and two ends of each expansion spring 332 are respectively connected with the hinge plate 33 and the expansion plate 34. Through the above arrangement, when the hinge plate 33 rotates to the vertical state, the wafer box is grounded to the bottom of the whole wafer inclined plane 31, and then an operator presses the expansion plate 34 along the vertical direction, so that the expansion plate 34 can extrude the expansion spring 332, and then the expansion plate 34 contracts inwards towards the expansion groove 331, so that the whole wafer inclined plane 31 continuously extrudes the wafer box from top to bottom, and each whole wafer unit 32 drives the wafer box and the substrate to shake.
In order to limit the hinge plate 33 and enable the expansion plate 34 to keep a vertical state when being contracted, in this embodiment, a supporting plate 11 is further installed on one side of the feeding table top 1, and the supporting plate 11 is provided with a limiting block 12 towards one side of the expansion plate 34. The top of the expansion plate 34 is provided with a fastening groove 341, and the fastening groove 341 corresponds to the limiting block 12. The limiting block 12 is provided with a magnet, and meanwhile, the corresponding position of the hinge plate 33 is also provided with a magnet, so when an operator rotates the hinge plate 33 to be vertical, the hinge plate 33 can be adsorbed by magnetic force and is tightly attached to one side of the limiting block 12, at the moment, the operator presses the telescopic plate 34, the limiting groove can be inserted into the buckling groove 341, further, the horizontal movement of the telescopic plate 34 is not limited by the limiting block 12, and only the telescopic plate can slide up and down, and through the arrangement, the reliable movement of the telescopic plate 34 can be ensured. In addition, a positioning sensor 13 is provided on the stopper 12. When the hinge plate 33 rotates to be closely attached to the limiting block 12 in a magnetic attraction mode, the positioning sensor 13 receives signals to indicate that the hinge plate 33 is reliably positioned, namely, the feeding station is in a closed state. The positioning mechanism is a positioning guide rail 2, and the positioning guide rail 2 extends along the conveying direction of the wafer box. The positioning guide rail 2 is a strip-shaped protruding block, and is arranged on one side of the backboard to separate the wafer box from the backboard, so that the backboard can tilt by taking the positioning guide rail 2 as a pivot, and meanwhile, the positioning guide rail can be used as a direction guide to ensure the wafer box to move correctly when the subsequent substrate moves.
In a second embodiment, the present embodiment is implemented on the basis of the first embodiment, and the present embodiment provides a plastic packaging machine, where the plastic packaging machine further includes a working platform 4, and the substrate feeding mechanism is disposed on the working platform 4, where the substrate feeding mechanism is shown in the first embodiment. The two sides of the feeding table top 1 are also respectively provided with a pushing mechanism 5 and a sheet taking mechanism 6, and the movable end of the pushing mechanism 5 is arranged towards the feeding station. After the sheet box is placed on the feeding station, the pushing mechanism 5 can push the sheet box to slide along the feeding station from one side until the sheet box falls on the sheet taking mechanism 6. And one side of the sheet taking mechanism 6 facing the feeding station is provided with a sheet taking station. After the wafer box falls to the loading station, the wafer taking mechanism 6 drives the substrates in the wafer box to be taken out in sequence.
The structure of the pushing mechanism 5 is specifically described below, and the pushing mechanism 5 includes a pushing plate 51 and a pushing cylinder 52. The bottom of the pushing cylinder 52 is provided with a supporting frame which is arranged on the working platform 4. The movable end of the pushing cylinder 52 is connected with the pushing plate 51, and the pushing plate 51 is arranged at one side of the feeding station. Alternatively, the pushing plate 51 is located above the feeding table top 1, a chute is formed in the feeding table top 1, the chute is parallel to the length direction of the positioning guide rail 2, and the bottom of the pushing plate 51 passes through the chute and is connected with the movable end of the pushing cylinder 52. After the sheet box is placed at the feeding station, the pushing cylinder 52 pushes the sheet box to slide towards the sheet taking station.
The structure of the sheet taking mechanism 6 will be specifically described, the sheet taking mechanism 6 includes a lifting assembly 61 and a sheet taking assembly 62, and the lifting assembly 61 includes a positioning plate 611, a screw 612 and a lifting plate 613. The positioning plate 611 is mounted on the working platform 4, the lifting plate 613 is slidably disposed on one side of the positioning plate 611, the screw rod 612 is rotatably connected with the positioning plate 611, and the screw rod 612 is in threaded connection with the lifting plate 613. The top of the screw rod 612 is optionally connected with the movable end of a motor, and a bottom bracket 614 is arranged on one side of the lifting plate 613 to form the sheet taking station. Through the arrangement, when the motor is started, the screw rod 612 can be driven to rotate, so that the screw rod 612 drives the lifting plate 613 to slide up and down along one side of the positioning plate 611, and then the bottom bracket 614 drives the wafer box to slide up and down after the wafer box moves onto the bottom bracket 614. The sheet taking assembly 62 comprises a sheet taking support 621, a sheet taking cylinder 622 and a sheet taking fork 623, the sheet taking support 621 is mounted on the working platform 4, the sheet taking cylinder 622 is mounted on the sheet taking support 621, the sheet taking fork 623 is arranged towards the bottom bracket 614, and the movable end of the sheet taking cylinder 622 is connected with the sheet taking fork 623. Through the arrangement, when the bottom bracket 614 drives the wafer box to move to the lowest layer of substrates and align with the wafer taking fork 623, the wafer taking cylinder 622 drives the wafer taking fork 623 to extend into the slot from the opening of the wafer box to push out the substrates in the corresponding slot, then the wafer taking fork 623 returns, the bottom bracket 614 drives the wafer box to descend to the upper layer of substrates and align with the wafer taking fork 623, the wafer taking cylinder 622 drives the wafer taking fork 623 to extend into the slot from the opening of the wafer box again to push out the substrates in the corresponding slot, and the substrates in the wafer box can be completely taken out by repeating the process.
In a third embodiment, the present embodiment is implemented on the basis of the second embodiment, and the present embodiment provides a working method of a plastic packaging machine, using the plastic packaging machine shown in the second embodiment, where the specific working method is as follows: s1, placing a full-loaded wafer box on a loading station, and driving a telescopic plate 34 to rotate by a hinged plate 33 until a whole inclined plane 31 is abutted with the wafer box and pushing the wafer box to incline towards one side of a positioning guide rail 2;
s2, the expansion plate 34 is contracted downwards, and the wafer box sequentially bends with each whole wafer unit 32 along the whole wafer inclined plane 31, so that the wafer box drives the substrate to shake and approaches to one side of the positioning guide rail 2;
s3, a pushing cylinder 52 drives a pushing plate 51 to push the sheet box to slide onto a bottom bracket 614 along the feeding table top 1;
s4, the slice taking cylinder 622 drives the slice taking fork 623 to be inserted from the opening of the slice box and pushes out the substrate at the corresponding position from the opening at the other side of the slice box;
s5, a piece taking cylinder 622 drives a piece taking fork 623 to return, and a screw rod 612 drives a lifting plate 613 to drive a bottom bracket 614 to descend until the next substrate is aligned with the height of the piece taking fork 623;
s6, repeating the steps S4 and S5 until all the substrates in the wafer box are taken out.
It should be noted that, technical features such as other components of the plastic packaging machine related to the present application should be considered as the prior art, and specific structures, working principles, and control manners and spatial arrangement manners possibly related to the technical features should be selected conventionally in the art, and should not be considered as the point of the invention of the present application, which is not further specifically described in detail.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (13)
1. Substrate feed mechanism, its characterized in that includes:
the feeding table top (1) is provided with a feeding station; and
the two sides of the feeding station are respectively provided with a positioning mechanism and a sheet arranging mechanism (3), and the bottom of the sheet arranging mechanism (3) is hinged with the feeding table top (1);
the opening side of the wafer box faces the positioning mechanism and the wafer arranging mechanism (3) respectively;
the positioning mechanism is abutted with the bottom of the wafer box, the wafer arranging mechanism (3) is abutted with the top of the wafer box, and the wafer arranging mechanism (3) is arranged in a telescopic way; wherein the method comprises the steps of
After the wafer box is placed on the feeding station, the whole wafer mechanism (3) rotates to be abutted with the wafer box and pushes the wafer box to tilt towards one side of the positioning mechanism;
after the wafer box is inclined, the whole wafer mechanism (3) contracts along the height direction, so that the substrate shakes and approaches to one side of the positioning mechanism along with the inclination direction of the wafer box.
2. The substrate loading mechanism according to claim 1, wherein,
the whole piece mechanism (3) comprises a whole piece inclined surface (31) which is arranged towards the wafer box, and the whole piece inclined surface (31) is obliquely arranged in a direction away from the positioning mechanism along a vertical downward direction; and
a plurality of whole-piece units (32) are arranged on the whole-piece inclined plane (31), the head ends and the tail ends of two adjacent whole-piece units (32) are connected, and the head ends and the tail ends of the two adjacent whole-piece units (32) form a folding angle; wherein the method comprises the steps of
After the wafer box is placed at the feeding station, the bottom end of the whole wafer inclined plane (31) is abutted with the top of one side of the opening of the wafer box, and the wafer box is pushed to tilt towards one side of the positioning mechanism;
when the whole sheet mechanism (3) contracts along the height direction, the sheet box sequentially passes through folding angles among the whole sheet units (32) along the whole sheet inclined plane (31), and the sheet box drives the substrate to shake at each folding angle so as to enable the substrate to approach the direction of the positioning mechanism.
3. The substrate loading mechanism according to claim 2, wherein,
the integral unit (32) comprises a straight surface section (321) and an inclined surface section, and a folding angle is formed at the intersection of the straight surface section (321) and the inclined surface section; wherein the method comprises the steps of
When the wafer box slides to the folded angle along the straight section (321), the wafer box drives the substrate to shake.
4. The substrate loading mechanism according to claim 3, wherein,
the inclined surface section comprises a guide surface (322) and a transition surface (323), the guide surface (322) is connected with the transition surface (323), and the guide surface (322) and the transition surface (323) are respectively connected with straight surface sections (321) of two adjacent integral units (32); and
a bevel is formed between the guide surface (322) and the transition surface (323).
5. The substrate loading mechanism according to claim 4, wherein,
the whole sheet mechanism (3) further comprises a hinge plate (33) and a telescopic plate (34), the hinge plate (33) is hinged with the feeding table top (1), the telescopic plate (34) is arranged at the top of the hinge plate (33), and the telescopic plate (34) is elastically connected with the hinge plate (33);
the whole inclined plane (31) is arranged on one side of the expansion plate (34) facing the positioning mechanism.
6. The substrate loading mechanism according to claim 5, wherein,
the top of the hinge plate (33) is provided with a telescopic groove (331), and the telescopic plate (34) is arranged in the telescopic groove (331);
a plurality of telescopic springs (332) are arranged in the telescopic grooves (331), and two ends of each telescopic spring (332) are respectively connected with the hinge plate (33) and the telescopic plate (34).
7. The substrate loading mechanism according to claim 6, wherein,
a supporting plate (11) is further arranged on one side of the feeding table top (1), and a limiting block (12) is arranged on one side, facing the expansion plate (34), of the supporting plate (11);
the top of expansion plate (34) has seted up buckle groove (341), buckle groove (341) with stopper (12) are corresponding.
8. The substrate loading mechanism according to claim 7, wherein,
the limiting block (12) is provided with a positioning sensor (13).
9. The substrate loading mechanism according to claim 8, wherein,
the positioning mechanism is a positioning guide rail (2), and the positioning guide rail (2) extends along the conveying direction of the wafer box.
10. The plastic packaging machine using the substrate feeding mechanism according to claim 9, further comprising:
the substrate feeding mechanism is arranged on the working platform (4); and
the two sides of the feeding table top (1) are also respectively provided with a pushing mechanism (5) and a sheet taking mechanism (6), and the movable end of the pushing mechanism (5) is arranged towards the feeding station;
one side of the sheet taking mechanism (6) facing the feeding station is provided with a sheet taking station; wherein the method comprises the steps of
After the pushing mechanism (5) pushes the wafer box from the loading station to the wafer taking station, the wafer taking mechanism (6) sequentially pushes out the substrates in the wafer box.
11. The plastic packaging machine as claimed in claim 10, wherein,
the pushing mechanism (5) comprises a pushing plate (51) and a pushing cylinder (52), the movable end of the pushing cylinder (52) is connected with the pushing plate (51), and the pushing plate (51) is arranged on one side of the feeding station; wherein the method comprises the steps of
After the sheet box is placed on the feeding station, the pushing cylinder (52) pushes the sheet box to slide towards the sheet taking station.
12. The plastic packaging machine as claimed in claim 11, wherein,
the sheet taking mechanism (6) comprises a lifting assembly (61) and a sheet taking assembly (62), the lifting assembly (61) comprises a positioning plate (611), a screw rod (612) and a lifting plate (613), the lifting plate (613) is slidably arranged on one side of the positioning plate (611), the screw rod (612) is rotationally connected with the positioning plate (611), and the screw rod (612) is in threaded connection with the lifting plate (613);
a bottom bracket (614) is arranged on one side of the lifting plate (613) so as to form the sheet taking station;
get piece subassembly (62) including getting piece support (621), getting piece cylinder (622) and getting piece fork (623), get piece support (621) and install on work platform (4), get piece cylinder (622) and install get piece support (621) are last, get piece fork (623) orientation bottom bracket (614) sets up, just get the expansion end of piece cylinder (622) with get piece fork (623) and be connected.
13. A method for operating a plastic packaging machine, using a plastic packaging machine as claimed in claim 12, characterized in that,
s1, placing a fully loaded wafer box on a loading station, driving a telescopic plate (34) to rotate by a hinged plate (33) until a whole inclined plane (31) is abutted with the wafer box, and pushing the wafer box to incline towards one side of a positioning guide rail (2);
s2, the expansion plate (34) is contracted downwards, and the wafer box sequentially bends with each wafer-forming unit (32) along the wafer-forming inclined plane (31) so that the wafer box drives the substrate to shake and approaches to one side of the positioning guide rail (2);
s3, a pushing cylinder (52) drives a pushing plate (51) to push the sheet box to slide onto a bottom bracket (614) along the feeding table top (1);
s4, a piece taking cylinder (622) drives a piece taking fork (623) to be inserted from the opening of the box and push out a substrate at a corresponding position from the opening at the other side of the box;
s5, a piece taking cylinder (622) drives a piece taking fork (623) to return, and a screw rod (612) drives a lifting plate (613) to drive a bottom bracket (614) to descend until the next substrate is aligned with the piece taking fork (623) in height;
s6, repeating the steps S4 and S5 until all the substrates in the wafer box are taken out.
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| CN202410060520.5A CN117566413B (en) | 2024-01-16 | 2024-01-16 | Substrate feeding mechanism, plastic packaging machine and working method of plastic packaging machine |
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| CN202410060520.5A CN117566413B (en) | 2024-01-16 | 2024-01-16 | Substrate feeding mechanism, plastic packaging machine and working method of plastic packaging machine |
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| CN203682602U (en) * | 2013-12-05 | 2014-07-02 | 中国电子科技集团公司第四十八研究所 | Silicon chip feeding and discharging device |
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| CN117566413B (en) | 2024-03-15 |
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