CN218230676U - Silicon chip detection equipment - Google Patents

Silicon chip detection equipment Download PDF

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Publication number
CN218230676U
CN218230676U CN202222551464.4U CN202222551464U CN218230676U CN 218230676 U CN218230676 U CN 218230676U CN 202222551464 U CN202222551464 U CN 202222551464U CN 218230676 U CN218230676 U CN 218230676U
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China
Prior art keywords
silicon wafer
conveying line
tray
detection box
bottom plate
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CN202222551464.4U
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Chinese (zh)
Inventor
赖学明
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Suzhou Yaode Semiconductor Co ltd
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Suzhou Yaode Semiconductor Co ltd
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Abstract

The utility model discloses a silicon wafer detection device, which comprises a bottom plate and a detection box body, wherein conveying openings are formed at the bottoms of two side walls of the detection box body, oblique correlation photoelectric sensors are installed on the two side walls of the detection box body in the length direction, a conveying line is installed on the bottom plate and penetrates out of the detection box body through the conveying openings, a motor is installed on the conveying line and drives the conveying line to work, a material placing disc is detachably installed on the conveying line and used for placing a silicon wafer to be detected, a cylinder is installed on the bottom plate and is relatively positioned right below the middle part of a connecting line of a transmitting end and a receiving end, a tray is installed on an extension shaft of the cylinder, and a position sensor is installed on the inner wall of the detection box body and used for detecting the motion position of the material placing disc on the conveying line; the utility model discloses can solve current silicon chip and detect and need pass through artifical the detection to cause detection efficiency lower, and easily damage the problem on silicon chip surface.

Description

Silicon chip detection equipment
Technical Field
The utility model relates to a semiconductor silicon chip field especially relates to a silicon chip check out test set.
Background
In the semiconductor field, silicon wafers are typically the starting material for integrated circuits. Various semiconductor devices can be manufactured by performing photolithography, ion implantation, or the like on a silicon wafer. Whether the silicon wafer is lack of wafers or is lack of wafers during packaging has an extremely important influence on subsequent processing and device performance.
At present, when a silicon wafer is detected, the silicon wafer needs to be horizontally placed on a workbench manually, whether the front side of the silicon wafer has defects is observed firstly, then the silicon wafer is turned over, the back side of the silicon wafer faces upwards, and whether the back side of the silicon wafer has defects is observed.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above disadvantages, an object of the present invention is to provide a silicon wafer detecting apparatus.
In order to achieve the above object, the utility model discloses a bottom plate and install the detection box on its upper portion, the both sides wall bottom that detects box width direction has the delivery port, install oblique correlation photoelectric sensing ware's transmitting terminal and receiving terminal on detection box length direction's the both sides wall respectively, silicon chip check out test set still includes:
the conveying line is arranged on the bottom plate and penetrates out of the detection box body through the conveying opening,
a motor installed on the conveying line and driving the conveying line to work,
the object placing disc is detachably arranged on the conveying line and is used for placing the silicon wafer to be detected,
the cylinder is arranged on the bottom plate and is relatively positioned right below the middle part of the connecting line of the transmitting end and the receiving end,
a tray installed on an extension shaft of the cylinder,
and the position sensor is arranged on the inner wall of the detection box body and used for detecting the movement position of the object placing disc on the conveying line.
In a preferred technical scheme of the silicon wafer detection equipment, a guide rod is arranged on the conveying line along the length direction of the bottom plate and used for guiding the object placing plate.
In the preferable technical scheme of the silicon wafer detection equipment, the bottom plate of the object placing tray is provided with at least one positioning hole, a positioning rod is arranged on the tray corresponding to the positioning hole, and the positioning rod can be inserted into the positioning hole.
In a preferred technical scheme of the silicon wafer detection equipment, a sucker is arranged on the upper surface of the tray.
In the preferable technical scheme of the silicon wafer detection equipment, a limiting piece is installed on the surface wall of the tray on one side opposite to the conveying direction of the conveying line, and the limiting piece is used for braking the object placing disc on the conveying line.
In a preferred technical scheme of the silicon wafer detection equipment, a matte layer is arranged on the inner wall of the detection box body.
In a preferred technical scheme of the silicon wafer detection equipment, the lower surface of the object placing disc is provided with irregular grains.
The beneficial effects of the utility model are that, this application will place the multilayer of silicon chip through the transfer chain and put the thing dish and carry to the detection case internal, and drive the tray through the cylinder, the tray will put the thing dish and hold in the palm, in order to realize putting the thing dish and reciprocating in the detection case internal, make oblique correlation photoelectric sensing ware can accomplish the scanning to the silicon chip, thereby whether there is few or oblique piece in the detection silicon chip, then avoid there being the silicon chip product flow to market of few or oblique piece, and it is high to have detection efficiency, detect advantages such as easy operation.
Drawings
Fig. 1 is a front view of the present invention;
FIG. 2 is a schematic view of the detection box body of the present invention after being removed;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
in the figure: the device comprises a bottom plate 1, a detection box body 2, a conveying opening 3, an oblique correlation photoelectric sensor 4, a conveying line 5, a conveying frame 51, a belt wheel 52, a rotating shaft 53, a conveying belt 54, a motor 6, an object placing disc 7, an air cylinder 8, a tray 9, a guide rod 11, a positioning rod 12, a suction disc 13 and a limiting piece 14.
Detailed Description
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention.
It should be noted that in the description of the present invention, the terms "upper", "lower", "left", "right", "front", "rear", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, it should be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "connected" and "connected" in the description of the present invention are to be construed broadly and may be, for example, fixedly connected, detachably connected or integrally connected. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1 to 3, the utility model discloses a silicon chip check out test set includes bottom plate 1 and installs detection box 2 on its upper portion, 2 width direction's of detection box both sides wall bottom has delivery port 3, install transmitting terminal and the receiving terminal of oblique correlation photoelectric sensing ware 4 on 2 length direction's of detection box both sides wall respectively, silicon chip check out test set still includes:
the conveying line 5 is arranged on the bottom plate 1 and penetrates out of the detection box body 2 through the conveying opening 3,
a motor 6 installed on the conveyor line 5 and driving the conveyor line 5 to operate,
the object placing disc 7 is detachably arranged on the conveying line 5 and is used for placing the silicon wafer to be detected,
the cylinder 8 is arranged on the bottom plate 1 and is relatively positioned right below the middle part of a connecting line between the transmitting end and the receiving end,
a tray 9 installed on an extension shaft of the cylinder 8,
and the position sensor is arranged on the inner wall of the detection box body 2 and is used for detecting the movement position of the object placing disc 7 on the conveying line 5.
Referring to fig. 1-3, the lateral sides of the two sides of the width direction of the detection box 2 are provided with a conveying opening 3 to form an inlet and an outlet, the lateral walls of the two sides of the length direction of the detection box 2 are respectively provided with an emitting end and a receiving end of an oblique correlation photoelectric sensor 4, the receiving end is connected with an external detection system, the conveying line 5 comprises a conveying frame 51, a belt wheel 52, a rotating shaft 53 and a conveying belt 54, the belt wheel 52 is rotatably installed on the conveying frame 51 through the rotating shaft 53, the conveying belt 54 is installed on the belt wheel 52, a motor 6 is installed on the conveying frame 51 and used for driving the rotating shaft 53 to rotate, a storage tray 7 is detachably placed on the conveying belt 54, the storage tray 7 is provided with multiple layers from top to bottom and used for placing silicon wafers on the storage tray 7, an air cylinder 8 is installed on the upper surface of the middle part of the bottom plate 1, the air cylinder 8 extends out of the shaft and is provided with a tray 9, the air cylinder 8 is positioned right below the middle part of a connecting line between the emitting end and the receiving end of the oblique correlation photoelectric sensor 4, and the inner wall of the detection box 2 is further provided with a position sensor used for detecting the movement position of the storage tray 7.
In the initial state, the tray 9 is positioned below the conveyor belt 54.
When the silicon wafer needs to be detected by the device, the silicon wafer is firstly placed on the object placing disc 7, the object placing disc 7 is horizontally placed on the conveying belt 54, the motor 6 is controlled to work, the motor 6 drives the rotating shaft 53 to rotate, then the conveying belt 54 rotates along with the rotating shaft, the object placing disc 7 moves towards the detection box body 2, when the position sensor detects that the object placing disc 7 is in position, the motor 6 stops rotating, the object placing disc 7 stops advancing, the extending shaft of the control cylinder 8 drives the tray 9 to move upwards, the tray 9 supports the object placing disc 7, and meanwhile, the transmitting end and the receiving end of the oblique-incidence photoelectric sensor 4 are controlled to work, so that the silicon wafer placed on each layer of the object placing disc 7 is scanned, whether the silicon wafer has few wafers or oblique wafers or not is detected, the silicon wafer products with few wafers or oblique wafers are prevented from flowing to the market, and the device has the advantages of high detection efficiency, simplicity in detection operation and the like.
In one or more embodiments, a guide rod 11 is arranged on the conveying line 5 along the length direction of the bottom plate 1, and the guide rod 11 is used for guiding the object placing tray 7.
Referring to fig. 2, the guide rods 11 are mounted on the conveying frame 51, the guide rods 11 are parallel to the conveying belt 54, the two guide rods 11 are used for limiting the movement of the object placing tray 7 on the conveying belt 54, so that the object placing tray 7 is prevented from being deviated, the accuracy of scanning the silicon wafer by the oblique correlation photoelectric sensor 4 is effectively guaranteed, and the detection efficiency of qualified products of the silicon wafer is improved.
In one or more embodiments, the bottom plate 1 of the tray 7 has at least one positioning hole, and the positioning rod 12 is disposed on the tray 9 corresponding to the positioning hole, and the positioning rod 12 can be inserted into the positioning hole.
Referring to fig. 3, the bottom plate 1 of the tray 7 is provided with two positioning holes, and the tray 9 is correspondingly provided with two positioning rods 12 capable of being inserted into the positioning holes; after the position sensor detects that the object placing disc 7 moves in place, the control motor 6 stops rotating, the extension shaft of the control cylinder 8 drives the tray 9 to move upwards, so that the positioning rod 12 is inserted into the positioning hole in the bottom of the object placing disc 7, the object placing disc 7 is prevented from shaking when moving upwards along with the tray 9, the silicon wafer is prevented from dropping, and the stability and the safety of silicon wafer detection are effectively guaranteed.
In one or more embodiments, the upper surface of the tray 9 is provided with a suction cup 13.
Referring to fig. 3, after the limiting rod completely enters the limiting hole, the bottom of the object placing plate 7 is adsorbed by the sucking disc 13, so that the stability of the object placing plate 7 during ascending or descending in the detection box 2 is further ensured.
In one or more embodiments, a stopper 14 is mounted on a surface wall of the tray 9 on a side facing a conveying direction of the conveyor line 5, and the stopper 14 is used for stopping the storage tray 7 on the conveyor line 5.
Referring to fig. 3, the limiting member 14 is mounted on a side wall of the tray 9 in the length direction and is located on the side opposite to the conveying direction of the conveying line 5; in the initial state, the extension shaft of the control cylinder 8 drives the tray 9 to move upwards, so that the upper end of the limiting piece 14 is higher than the bottom of the storage tray 7, and the positioning rod 12 is lower than the bottom of the storage tray 7.
The limiting part 14 limits the article placing disc 7, so that when the article placing disc 7 stops moving in place, the problem that the article placing disc 7 continues to slide forward for a certain distance due to inertia of the article placing disc 7 is effectively solved, the stability of the article placing disc 7 during lifting due to the fact that the positioning rod 12 cannot be inserted into the positioning hole is further avoided, and after detection is completed, the air cylinder 8 is controlled to move the upper end of the limiting part 14 downwards to the bottom of the article placing disc 7.
In one or more embodiments, the inner wall of the detection box 2 is provided with a matte layer. Through the arrangement, the surface light scattering of the silicon wafer can be effectively reduced, and the detection effect on few silicon wafers or oblique silicon wafers is further improved.
In one or more embodiments, the lower surface of the tray 7 has irregular lines. With this arrangement, the friction between the tray 7 and the conveyor belt 54 can be increased, and the stability of the tray 7 during conveyance can be improved.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims (7)

1. The utility model provides a silicon chip check out test set, includes the bottom plate and installs the detection box on its upper portion, detection box width direction's both sides wall bottom has the delivery port, install oblique correlation photoelectric sensing ware's transmitting terminal and receiving terminal, its characterized in that on detection box length direction's the both sides wall respectively: the silicon wafer detection device further comprises:
the conveying line is arranged on the bottom plate and penetrates out of the detection box body through the conveying opening,
a motor installed on the conveying line and driving the conveying line to work,
the object placing disc is detachably arranged on the conveying line and is used for placing the silicon wafer to be detected,
the cylinder is arranged on the bottom plate and is relatively positioned right below the middle part of the connecting line of the transmitting end and the receiving end,
a tray installed on an extension shaft of the cylinder,
and the position sensor is arranged on the inner wall of the detection box body and is used for detecting the movement position of the object placing disc on the conveying line.
2. The silicon wafer detection device according to claim 1, wherein: and a guide rod is arranged on the conveying line along the length direction of the bottom plate and used for guiding the object placing plate.
3. The silicon wafer detection device according to claim 2, wherein: the bottom plate of the object placing tray is provided with at least one positioning hole, the tray is provided with a positioning rod corresponding to the positioning hole, and the positioning rod can be inserted into the positioning hole.
4. The silicon wafer detection device according to claim 3, wherein: and the upper surface of the tray is provided with a sucker.
5. The silicon wafer detection device according to claim 3, wherein: and a limiting piece is arranged on the surface wall of the tray on one side opposite to the conveying direction of the conveying line, and the limiting piece is used for braking the object placing tray on the conveying line.
6. The silicon wafer detection device according to claim 1, wherein: and a matte layer is arranged on the inner wall of the detection box body.
7. The silicon wafer detection device according to claim 1, wherein: the lower surface of the object placing disc is provided with irregular grains.
CN202222551464.4U 2022-09-26 2022-09-26 Silicon chip detection equipment Active CN218230676U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222551464.4U CN218230676U (en) 2022-09-26 2022-09-26 Silicon chip detection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222551464.4U CN218230676U (en) 2022-09-26 2022-09-26 Silicon chip detection equipment

Publications (1)

Publication Number Publication Date
CN218230676U true CN218230676U (en) 2023-01-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222551464.4U Active CN218230676U (en) 2022-09-26 2022-09-26 Silicon chip detection equipment

Country Status (1)

Country Link
CN (1) CN218230676U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117434018A (en) * 2023-12-20 2024-01-23 山东奥客隆太阳能科技有限公司 Photovoltaic material detection equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117434018A (en) * 2023-12-20 2024-01-23 山东奥客隆太阳能科技有限公司 Photovoltaic material detection equipment

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