CN219770279U - Silicon wafer conveying device and silicon wafer sorting machine - Google Patents
Silicon wafer conveying device and silicon wafer sorting machine Download PDFInfo
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- CN219770279U CN219770279U CN202320197049.5U CN202320197049U CN219770279U CN 219770279 U CN219770279 U CN 219770279U CN 202320197049 U CN202320197049 U CN 202320197049U CN 219770279 U CN219770279 U CN 219770279U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 86
- 239000010703 silicon Substances 0.000 title claims abstract description 86
- 239000000463 material Substances 0.000 claims abstract description 27
- 235000012431 wafers Nutrition 0.000 claims description 73
- 230000007246 mechanism Effects 0.000 claims description 27
- 238000001514 detection method Methods 0.000 claims description 26
- 238000003708 edge detection Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 9
- 238000007599 discharging Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a silicon wafer conveying device and a silicon wafer sorting machine. The silicon chip conveyor is used for carrying the silicon chip to the magazine from the transfer chain, includes: the transverse moving module comprises a base and a sliding plate capable of horizontally moving along the base; the mounting end of the top is provided with a first mounting shaft and a second mounting shaft; the first rotating assembly comprises a first rotating shaft and a first driving unit; the first installation shaft of the first rotating shaft is in rotating connection with the axis of the second installation shaft; the first driving unit can drive the first rotating shaft to rotate by a first preset angle; the second rotating assembly comprises a second rotating shaft and a second driving unit; the second rotating shaft and the second installation shaft rotate to connect the shaft to coincide with the axis of the first installation shaft; the second driving unit can drive the second rotating shaftAnd rotating a second preset angle. The silicon wafer conveying device enables the Bernoulli sucker to rotate simultaneously along the first installation shaft and the second installation shaft, enables the silicon wafer to be in an inclined posture matched with the bottom surface of the material box, and avoids the problem that the corners of the silicon wafer are damaged 。
Description
Technical Field
The utility model relates to silicon wafer production equipment, in particular to a silicon wafer conveying device and a silicon wafer sorting machine.
Background
In the silicon wafer production process, it is often necessary to detect and sort a silicon wafer at a certain stage. The industry typically employs a handling module with bernoulli chucks and sorts the wafers using cassettes with inclined bottom surfaces. In the sorting process, after the silicon wafer is separated from the Bernoulli chuck, the wafer body often falls into the material box in a generally horizontal posture, so that a certain corner of the silicon wafer can firstly contact with the highest point of the bottom surface, and damage is very easy to generate.
Disclosure of Invention
An object of the present utility model is to overcome the above-mentioned drawbacks of the prior art, and to provide a silicon wafer conveying device, which can adjust a silicon wafer to an inclined posture adapted to the bottom surface of a lower magazine before placing the silicon wafer, so as to avoid crashing the corners of the silicon wafer.
Another object of the present utility model is to provide a silicon wafer separator having the silicon wafer conveying apparatus.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
According to one aspect of the present utility model, a silicon wafer transporting apparatus for transporting silicon wafers from a transport line to cassettes located on both sides of the transport line, comprises:
the transverse moving module is horizontally arranged above the conveying line and comprises a base and a sliding plate capable of horizontally moving along the base, and the projection of a sliding plate moving path on the horizontal plane is perpendicular to the conveying direction of the conveying line;
the Bernoulli sucker is provided with a mounting end at the top, and the mounting end is provided with a first mounting shaft and a second mounting shaft with vertical intersecting axes;
the first rotating assembly comprises a first rotating shaft and a first driving unit; the first rotating shaft is rotatably arranged on the sliding plate and is rotatably connected with the first mounting shaft, and the axis of the first rotating shaft is coincident with that of the second mounting shaft; the first driving unit can drive the first rotating shaft to rotate by a first preset angle;
the second rotating assembly comprises a second rotating shaft and a second driving unit; the second rotating shaft is rotatably arranged on the sliding plate and is rotatably connected with the second mounting shaft, and the second rotating shaft is overlapped with the axis of the first mounting shaft; the second driving unit can drive the second rotating shaft to rotate by a second preset angle.
According to the silicon wafer conveying device, the sliding plate of the traversing module moves to the upper side of the conveying line, the Bernoulli sucker sucks the silicon wafer on the conveying line, and then the traversing module drives the Bernoulli sucker to reach the left side or the right side of the conveying line, so that the silicon wafer is placed in the material box on the left side or the right side of the material box. In the process that the slide board removed, first rotating assembly and second rotating assembly can drive the Bernoulli sucking disc and take place to rotate simultaneously along the first installation axle and the second installation axle of its installation end, make the silicon chip be in the slope gesture that the horizontal gesture had become with the magazine bottom surface adaptation by beginning in the below of Bernoulli sucking disc, in this way, when the silicon chip falls into the magazine from the Bernoulli sucking disc, the lower surface of silicon chip can take place steady contact with the whole original silicon chip in the magazine, when having avoided among the prior art silicon chip level to fall down, its corner takes place the contact with the slope silicon chip that exists in the magazine at first, the problem of damage produces, the qualification rate of product has been improved.
According to an embodiment of the utility model, the first driving unit comprises a first track pad, a first rocker arm, a first guide rod, a first connecting block, wherein:
the first track board is fixedly arranged on the transverse moving module and is provided with a first guide slideway;
the first rocker arm is fixedly connected to the first rotating shaft;
the first guide rod is vertically and slidably arranged on the sliding plate, and a first roller moving along the first guide slideway is arranged at the first end of the first guide rod;
one end of the first connecting block is rotationally connected with the first rocker arm, and the other end of the first connecting block is rotationally connected with the second end of the first guide rod; when the sliding plate moves along the base, the first guide slide way drives the first guide rod to vertically lift through the first roller so as to drive the first rotating shaft to rotate.
The driving mode with simple structure and reliable operation is provided, a driving piece is not required to be additionally arranged, and the cost is low.
According to an embodiment of the utility model, the second driving unit comprises a second track pad, a second rocker arm, a second guide rod and a second connecting block, wherein:
the second track board is fixedly arranged on the transverse moving module, and is provided with a second guide slideway;
the second rocker arm is fixedly connected to the second rotating shaft;
the second guide rod is vertically and slidably arranged on the sliding plate, and a first end of the second guide rod is provided with a second roller moving along a second guide slideway;
one end of the second connecting block is rotationally connected with the second rocker arm, and the other end of the second connecting block is rotationally connected with the second end of the second guide rod; when the sliding plate slides, the second guide slideway drives the second guide rod to slide so as to drive the second rotating shaft to rotate.
The driving mode with simple structure and reliable operation is provided, a driving piece is not required to be additionally arranged, and the cost is low.
According to one embodiment of the utility model, the first guide bar is a linear bearing vertically arranged on the slide plate.
Simple structure, the cost is lower, the maintenance of being convenient for.
According to an embodiment of the present utility model, the first driving unit further includes a first auxiliary guide rod slidably disposed on the sliding plate, and a first connecting plate having two ends rotatably connected to the first guide rod and the first auxiliary guide rod, respectively, and an axis of the first auxiliary guide rod is parallel to an axis of the first guide rod.
The first guide rod is prevented from rotating by taking the first guide rod as an axis, so that the roller is separated from the track plate.
According to an embodiment of the present utility model, the second driving unit further includes a second auxiliary guide rod slidably disposed on the sliding plate, and a second connecting plate having two ends rotatably connected to the second guide rod and the second auxiliary guide rod, respectively, and an axis of the second auxiliary guide rod is parallel to an axis of the second guide rod.
The second guide rod is prevented from rotating by taking the second guide rod as an axis, so that the roller is separated from the track plate.
According to an embodiment of the present utility model, the first driving unit includes a first cylinder, a first rocker arm, and a first connection block, wherein:
the first air cylinder is fixedly arranged on the sliding plate, and the driving end of the first air cylinder is vertically downward;
the first rocker arm is fixedly connected to the first rotating shaft;
the first connecting block is respectively connected with the driving end of the first cylinder and the first rocker arm in a rotating way.
The suction cup is adjusted to be in an inclined posture by using the air cylinder, so that the speed is high, and the maintenance is convenient.
According to an embodiment of the present utility model, the second driving unit includes a second cylinder, a second rocker arm, and a second connection block, wherein:
the second cylinder is fixedly arranged on the sliding plate, and the driving end of the second cylinder is vertically downward;
the second rocker arm is fixedly connected to the second rotating shaft;
the second connecting block is respectively connected with the driving end of the second cylinder and the second rocker arm in a rotating way.
The suction cup is adjusted to be in an inclined posture by using the air cylinder, so that the speed is high, and the maintenance is convenient.
According to another aspect of the utility model, a silicon wafer sorting machine comprises a loading area, a detecting area, a discharging area and a conveying line, wherein the conveying line sequentially passes through the loading area, the detecting area and the discharging area, and the silicon wafer sorting machine comprises:
the feeding area is configured to convey the silicon wafer from the basket to the conveying line;
the detection zone comprises at least one of the following detection mechanisms:
size detection mechanism, edge detection mechanism, hidden crack detection mechanism, hole detection mechanism, thickness detection mechanism, resistivity detection mechanism, PN type detection mechanism;
the blanking area comprises at least one silicon wafer conveying device and a plurality of material boxes positioned on two sides of the conveying line, the silicon wafer conveying device conveys silicon wafers from the conveying line to the material boxes at preset positions, and one surface of each material box for bearing a battery piece forms an included angle with the horizontal plane.
The sorting machine using the silicon wafer conveying device can safely place the silicon wafers into the material box, avoid damage in the placing process and improve the product yield.
Drawings
The above and other features and advantages of the present utility model will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
FIG. 1 is a schematic view of a silicon wafer transport apparatus according to an embodiment of the present utility model;
FIG. 2 is a schematic view of the wafer transport apparatus of FIG. 1 with the susceptor removed;
FIG. 3 is a schematic illustration of the first and second rotating assemblies of FIG. 1;
fig. 4 is a schematic view of the first and second rotating assemblies of fig. 3 from another angle.
In the figure: 1. a traversing module; 11. a base; 12. a slide plate; 2. bernoulli suction cups; 21. a mounting end; 22. a first mounting shaft; 23. a second mounting shaft; 31. a first rotating shaft; 321. a first track pad; 3210. a first wire slideway; 322. a first rocker arm; 323. a first guide bar; 324. a first connection block; 325. a first auxiliary guide rod; 326. a first connection plate; 41. a second rotating shaft; 421. a second track pad; 4210. a second guide slide; 422. a second rocker arm; 423. a second guide bar; 4231. a second roller; 424. a second connection block; 425. a second auxiliary guide rod; 426. a second connecting plate; 5. a photoelectric sensor.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted.
As shown in fig. 1 to 4, the embodiment of the utility model discloses a silicon wafer conveying device for conveying silicon wafers from a conveying line to material boxes positioned at two sides of the conveying line. The silicon wafer conveying device comprises a traversing module 1, a Bernoulli sucker 2, a first rotating assembly and a second rotating assembly.
The traversing module 1 is horizontally arranged above the conveying line, and the traversing module 1 comprises a base 11 and a sliding plate 12. The slide plate 12 is horizontally movable along the base 11, and the movement path of the slide plate 12 is perpendicular to the projection of the conveying direction of the conveying line on the horizontal plane. In the present embodiment, the base 11 is provided with a linear guide, and the slide plate 12 is slidably engaged with the linear guide, thereby being horizontally movable. The base 11 may be provided with a linear guide member of the prior art such as a bar and a dovetail groove, and slidably engaged with the slide plate 12. A screw, linear bearing, rack and pinion mechanism existing mechanism for driving the slide plate 12 to move may be further provided between the slide plate 12 and the base 11.
The bernoulli chuck 2 is a common component in the field of silicon wafer production, and attracts the silicon wafer by the bernoulli principle so as to transport the silicon wafer, and a photoelectric sensor 5 can be further arranged on the bernoulli chuck 2 and used for judging whether the silicon wafer is adsorbed in place by the bernoulli chuck. In the present embodiment, the top of the bernoulli chuck 2 is provided with a mounting end 21, and the mounting end 21 is provided with a first mounting shaft 22 and a second mounting shaft 23 whose axes intersect perpendicularly. The projection angles of the first mounting shaft 22 and the second mounting shaft 23 on the horizontal plane with the conveying direction of the conveying line are different from 0 degrees. Preferably, the included angle may be 45 ° or 135 ° or other included angles more suitable for the bottom surface of the ingredient box.
The first rotating component and the second rotating component are used for driving the Bernoulli sucker to deflect. As shown in fig. 3 and 4, the first rotating assembly includes a first rotating shaft 31 and a first driving unit. The first rotating shaft 31 is rotatably disposed on the slide plate 12 and is rotatably connected to the first mounting shaft 22, and the axis of the first rotating shaft 31 coincides with the axis of the second mounting shaft 23. The first driving unit can drive the first rotation shaft 31 to rotate by a first predetermined angle. The second rotating assembly includes a second rotating shaft 41 and a second driving unit. The second rotating shaft 41 is rotatably disposed on the slide plate 12 and is rotatably connected to the second mounting shaft 23, and an axis of the second rotating shaft 41 coincides with an axis of the first mounting shaft 22. The second driving unit can drive the second rotating shaft 41 to rotate by a first predetermined angle. The first predetermined angle and the second predetermined angle are included angles between the silicon wafer and the horizontal plane after being adjusted (at this time, the silicon wafer is approximately parallel to the bottom surface of the material box), the numerical value ranges of the first predetermined angle and the second predetermined angle can be [ 5,25 ], preferably, both the first predetermined angle and the second predetermined angle can be 10 degrees, and the first predetermined angle and the second predetermined angle are not limited to the first predetermined angle and the second predetermined angle, and are determined according to the actual inclination condition of the material box, so long as the silicon wafer sucked by the bernoulli sucker 2 is parallel to the bottom surface of the material box for bearing the silicon wafer.
The configuration of the first driving unit is not limited as long as the purpose of driving the first shaft 31 to rotate by a predetermined angle can be achieved, and for example, it may be directly connected to the first shaft 31 by a motor mechanism such as a stepping motor. The second drive unit is the same.
In this embodiment, the first driving unit adopts a mechanical linkage structure, and includes a first track plate 321, a first rocker arm 322, a first guide rod 323, and a first connecting block 324. The first track board 321 is a strip-shaped flat board structure, which is fixedly arranged on the base 11 of the traversing module 1, and a first guiding slideway 3210 is arranged on the first track board 321. The first rocker arm 322 is fixedly connected to the first shaft 31. The first guide bar 323 is vertically slidably disposed on the sliding plate 12, and a first end of the first guide bar 323 is provided with a first roller 3231 sliding along the first guide sliding way 3210. One end of the first link block 324 is rotatably connected to the first swing arm 322, and the other end is rotatably connected to the second end of the first guide bar 323. When the slide plate 12 moves along the base 11, the first roller 3231 drives the first guide rod 323 to lift by the first guiding slide way 3210 with gradually changed height so as to drive the first rotating shaft 31 to rotate, and thus the bernoulli chuck 2 can be driven to rotate around the second mounting shaft 23 coaxial with the first rotating shaft 31.
In this embodiment, the first guiding slide 3210 includes a first section, a middle section and a second section, wherein the middle section is located directly above the conveyor belt, the first section and the second section of the first guiding slide 3210 are respectively located above the cartridges on two sides of the conveyor belt, and the middle section and the first section of the first guiding slide 3210 are higher than the second section thereof, so that when the slide plate 12 moves from the middle section of the base 11 to the second section, the first roller 3231 is lowered under the guidance of the first guiding slide 3210, and drives the first guide rod 323 to descend.
In this embodiment, the first guide bar 323 may be connected to the slide plate 12 through a linear bearing vertically disposed on the slide plate 12, so that ready-made parts may be purchased, processing steps may be reduced, and maintenance may be facilitated. The first guide bar 323 can also have other cross-sectional shapes such as square, dovetail, etc., and can be engaged with the corresponding slide on the slide plate 12. As shown in fig. 3, the first driving unit may further include a first auxiliary guide bar 325 slidably disposed on the slide plate 12, and a first connection plate 326 having both ends rotatably connected to the first guide bar 323 and the first auxiliary guide bar 325, respectively, wherein an axis of the first auxiliary guide bar 325 is parallel to an axis of the first guide bar 323, and when the first guide bar 323 is lifted, deflection of the first guide bar 323 around the axis thereof may be prevented due to connection restriction of the first connection plate 326, thereby preventing the first roller 3231 from being separated from the first guide rail 3210.
As shown in fig. 1 and 4, the second driving unit has a structure similar to that of the first driving unit, and includes a second track pad 421, a second swing arm 422, a second guide rod 423, and a second connection block 424. The second track board 421 is a strip-shaped flat board structure, which is fixedly disposed on the base 11 of the traversing module 1, and a second guiding rail 4210 is disposed on the second track board 421, and the second roller 4231 moves along the second guiding rail 4210. The second rocker arm 422 is fixedly connected to the second rotating shaft 41. The second guide rod 423 is vertically slidably disposed on the sliding plate 12, and a first end of the second guide rod 423 is provided with a second roller 4231 sliding along the second guiding rail 4210. One end of the second connection block 424 is rotatably connected to the second swing arm 422, and the other end is rotatably connected to the second end of the second guide rod 423. When the slide plate 12 moves along the base 11, the second guiding rail 4210 drives the second roller 4231 to drive the second guide rod 423 to lift and finally drive the second rotating shaft 41 to rotate, so that the bernoulli chuck 2 can be driven to rotate around the first mounting shaft 22 coaxial with the second rotating shaft 41.
In this embodiment, the second guiding rail 4210 also includes a first section, a middle section and a second section, the middle section is located right above the conveyor belt, the first section and the second section are respectively located above the cartridges on two sides of the conveyor belt, and the middle section and the second section of the second guiding rail 4210 are higher than the first section, so that when the sliding plate 12 moves from the middle of the base 11 to the first section, the second roller 4231 moves downward from a high position under the guidance of the second guiding rail 4210, and drives the second guide rod 423 to descend.
In this embodiment, the second guide 423 may be connected to the slide plate 12 through a linear bearing vertically disposed on the slide plate 12, so that ready-made parts may be purchased, reducing the processing steps. The second guide 423 may have other cross-sectional shapes such as square and dovetail, and may be engaged with the slide 12 by a corresponding slide. As shown in fig. 4, the second driving unit may further include a second auxiliary guide bar 425 slidably disposed on the sliding plate 12, and a second connection plate 424 having two ends rotatably connected to the second guide bar 423 and the second auxiliary guide bar 425, respectively, wherein an axis of the second auxiliary guide bar 425 is parallel to an axis of the second guide bar 423, and the second guide bar 423 is prevented from being deflected about its axis by connection restriction of the second connection plate 424, so as to prevent the second roller 4231 from being separated from the second guide rail 4210.
In the silicon wafer conveying device, the first driving unit and the second driving unit can also adopt cylinder structures. Specifically, the first driving unit includes a first cylinder, a first rocker arm, and a first connection block, wherein: the first air cylinder is fixedly arranged on the sliding plate, and the driving end of the first air cylinder is vertically downward; the first rocker arm is fixedly connected to the first rotating shaft; the first connecting block is respectively connected with the driving end of the first cylinder and the first rocker arm in a rotating way. The second drive unit includes second cylinder, second rocking arm and second connecting block, wherein: the second cylinder is fixedly arranged on the sliding plate, and the driving end of the second cylinder is vertically downward; the second rocker arm is fixedly connected to the second rotating shaft; the second connecting block is respectively connected with the driving end of the second cylinder and the second rocker arm in a rotating way.
When the silicon wafer conveying device is used, the sliding plate 12 of the traversing module moves to the upper part of the conveying line, the Bernoulli sucker 2 sucks silicon wafers on the conveying line, and then the traversing module drives the Bernoulli sucker 2 to reach the left side or the right side of the conveying line, and the silicon wafers are placed in a material box on the left side or the right side of the material box. In the moving process of the sliding plate 12, one of the first rotating assembly and the second rotating assembly can drive the Bernoulli chuck to rotate along the first mounting shaft 22 or the second mounting shaft 23 at the mounting end of the Bernoulli chuck, so that the silicon wafer is changed into an inclined posture matched with the bottom surface of the material box from a horizontal posture at the beginning below the Bernoulli chuck 2, and therefore, when the silicon wafer falls into the material box from the Bernoulli chuck 2, the lower surface of the silicon wafer is stably contacted with the whole original silicon wafer in the material box, the problem that the corners of the silicon wafer are firstly contacted with the existing inclined silicon wafer in the material box to generate damage when the silicon wafer falls down horizontally in the prior art is avoided, and the qualification rate of products is improved.
The embodiment of the utility model also discloses a silicon wafer sorting machine which comprises a feeding area, a detecting area, a discharging area and a conveying line, wherein the conveying line sequentially passes through the feeding area, the detecting area and the discharging area, and the feeding area can take out the silicon wafer from the basket and convey the silicon wafer to the conveying line. The detection zone comprises at least one of the following detection mechanisms: size detection mechanism, edge detection mechanism, hidden crack detection mechanism, hole detection mechanism, thickness detection mechanism, resistivity detection mechanism, PN type detection mechanism. The blanking area comprises at least one silicon wafer conveying device and a plurality of material boxes positioned on two sides of the conveying line, the silicon wafer conveying device conveys silicon wafers from the conveying line to the material boxes at preset positions, and one surface of each material box for bearing a battery piece forms an included angle with the horizontal plane.
The exemplary embodiments of the present utility model have been particularly shown and described above. It is to be understood that the utility model is not to be limited to the disclosed embodiments, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims (9)
1. A silicon wafer conveying device for conveying silicon wafers from a conveying line to material boxes positioned at two sides of the conveying line, comprising:
the transverse moving module is horizontally arranged above the conveying line and comprises a base and a sliding plate capable of horizontally moving along the base, and the projection of the sliding plate moving path on the horizontal plane is perpendicular to the conveying direction of the conveying line;
the top of the Bernoulli sucker is provided with a mounting end, and the mounting end is provided with a first mounting shaft and a second mounting shaft with axes which are vertically intersected;
the first rotating assembly comprises a first rotating shaft and a first driving unit; the first rotating shaft is rotatably arranged on the sliding plate and is rotatably connected with the first mounting shaft, and the axis of the first rotating shaft is coincident with the axis of the second mounting shaft; the first driving unit can drive the first rotating shaft to rotate by a first preset angle;
the second rotating assembly comprises a second rotating shaft and a second driving unit; the second rotating shaft is rotatably arranged on the sliding plate and is rotatably connected with the second mounting shaft, and the axis of the second rotating shaft is coincident with that of the first mounting shaft; the second driving unit can drive the second rotating shaft to rotate by a second preset angle.
2. The silicon wafer transport apparatus of claim 1, wherein the first drive unit comprises a first track pad, a first rocker arm, a first guide bar, a first connecting block, wherein:
the first track board is fixedly arranged on the transverse moving module, and is provided with a first guide slideway;
the first rocker arm is fixedly connected to the first rotating shaft;
the first guide rod is vertically and slidably arranged on the sliding plate, and a first roller moving along the first guide slideway is arranged at the first end of the first guide rod;
one end of the first connecting block is rotationally connected with the first rocker arm, and the other end of the first connecting block is rotationally connected with the second end of the first guide rod; when the sliding plate moves along the base, the first guide slide way drives the first guide rod to vertically lift through the first roller so as to drive the first rotating shaft to rotate.
3. The silicon wafer transport apparatus according to claim 2, wherein the second driving unit comprises a second track pad, a second rocker arm, a second guide bar, a second connection block, wherein:
the second track board is fixedly arranged on the transverse moving module, and is provided with a second guide slideway;
the second rocker arm is fixedly connected to the second rotating shaft;
the second guide rod is vertically and slidably arranged on the sliding plate, and a first end of the second guide rod is provided with a second roller moving along the second guide slideway;
one end of the second connecting block is rotationally connected with the second rocker arm, and the other end of the second connecting block is rotationally connected with the second end of the second guide rod; when the sliding plate slides, the second guide slide way drives the second guide rod to slide so as to drive the second rotating shaft to rotate.
4. The silicon wafer transport apparatus of claim 2 wherein the first guide bar is a linear bearing vertically disposed on the slide plate.
5. The silicon wafer transporting apparatus according to claim 4, wherein the first driving unit further comprises a first auxiliary guide rod slidably disposed on the slide plate, and a first connecting plate having both ends rotatably connected to the first guide rod and the first auxiliary guide rod, respectively, and an axis of the first auxiliary guide rod is parallel to an axis of the first guide rod.
6. The silicon wafer conveying device according to claim 3, wherein the second driving unit further comprises a second auxiliary guide rod arranged on the sliding plate in a sliding manner, and a second connecting plate with two ends respectively connected with the second guide rod and the second auxiliary guide rod in a rotating manner, and the axis of the second auxiliary guide rod is parallel to the axis of the second guide rod.
7. The silicon wafer transport apparatus according to claim 1, wherein the first driving unit comprises a first cylinder, a first rocker arm, and a first connection block, wherein:
the first air cylinder is fixedly arranged on the sliding plate, and the driving end of the first air cylinder is vertically downward;
the first rocker arm is fixedly connected to the first rotating shaft;
the first connecting block is respectively connected with the driving end of the first cylinder and the first rocker arm in a rotating way.
8. The silicon wafer transport apparatus according to claim 1, wherein the second driving unit comprises a second cylinder, a second rocker arm, and a second connection block, wherein:
the second air cylinder is fixedly arranged on the sliding plate, and the driving end of the second air cylinder is vertically downward;
the second rocker arm is fixedly connected to the second rotating shaft;
the second connecting block is respectively connected with the driving end of the second cylinder and the second rocker arm in a rotating way.
9. The utility model provides a silicon chip sorter, its characterized in that includes material loading district, detection area, unloading district and transfer chain, the transfer chain passes in proper order the material loading district, detection area, unloading district, wherein:
the feeding area is configured to convey the silicon wafer from the basket to the conveying line;
the detection zone comprises at least one of the following detection mechanisms:
size detection mechanism, edge detection mechanism, hidden crack detection mechanism, hole detection mechanism, thickness detection mechanism, resistivity detection mechanism, PN type detection mechanism;
the blanking area comprises at least one silicon wafer conveying device as claimed in any one of claims 1 to 8 and a plurality of material boxes positioned on two sides of the conveying line, wherein the silicon wafer conveying device conveys silicon wafers from the conveying line to the material boxes at preset positions, and one surface of each material box for bearing a battery piece forms an included angle with the horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320197049.5U CN219770279U (en) | 2023-02-13 | 2023-02-13 | Silicon wafer conveying device and silicon wafer sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320197049.5U CN219770279U (en) | 2023-02-13 | 2023-02-13 | Silicon wafer conveying device and silicon wafer sorting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219770279U true CN219770279U (en) | 2023-09-29 |
Family
ID=88138621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320197049.5U Active CN219770279U (en) | 2023-02-13 | 2023-02-13 | Silicon wafer conveying device and silicon wafer sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219770279U (en) |
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2023
- 2023-02-13 CN CN202320197049.5U patent/CN219770279U/en active Active
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