WO2022230273A1 - 部品装着装置、及び、部品装着方法 - Google Patents

部品装着装置、及び、部品装着方法 Download PDF

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Publication number
WO2022230273A1
WO2022230273A1 PCT/JP2022/003678 JP2022003678W WO2022230273A1 WO 2022230273 A1 WO2022230273 A1 WO 2022230273A1 JP 2022003678 W JP2022003678 W JP 2022003678W WO 2022230273 A1 WO2022230273 A1 WO 2022230273A1
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WO
WIPO (PCT)
Prior art keywords
component
unit
mark
illumination
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/003678
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English (en)
French (fr)
Japanese (ja)
Inventor
康一 岡田
秀雄 森
鷹則 松田
壮一郎 郡司
秀夫 工藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2023517052A priority Critical patent/JP7833700B2/ja
Publication of WO2022230273A1 publication Critical patent/WO2022230273A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present disclosure relates to a component mounting device and a component mounting method.
  • each of the component mounting apparatuses mounts a component such as an electronic component at a position where cream solder is printed on the board.
  • a moving head is provided with a nozzle and a mark
  • a camera captures an image of the part held by the nozzle and the mark, and analyzes the captured image to determine the relative position and orientation deviation between the mark and the part. and corrects the relative positional and orientational deviations between the nozzle and the component based on the calculated positional and orientational deviations.
  • Patent Document 1 discloses a configuration in which an illumination unit is provided in a camera that captures images of parts and marks from below, and the components and marks are illuminated from below when capturing images for component recognition. .
  • the purpose of the present disclosure is to provide a technique that can illuminate both parts and marks with appropriate brightness when imaging for part recognition.
  • a component mounting apparatus includes a movable head unit, a nozzle provided in the head unit and capable of picking up a component at a lower end, and a nozzle provided next to the nozzle in the head unit.
  • a mark unit configured to include a predetermined mark and a first illumination unit for illuminating the mark, a second illumination unit for illuminating the component sucked by the nozzle from below, and the component sucked by the nozzle, in this order from top to bottom. and a component imaging unit that captures an image of the marked component and the mark of the mark unit from below.
  • a component mounting method moves a head unit having a nozzle capable of picking up a component at its lower end, and a predetermined mark is provided next to the nozzle in the head unit in order from bottom to top. and a first illumination unit that illuminates the mark, and causes the second illumination unit that illuminates the component sucked by the nozzle from below to emit light,
  • a part imaging unit images the part sucked by the nozzle and the mark of the mark unit from below.
  • FIG. 2 is a top view illustrating the mechanical configuration of the component mounting device according to the present embodiment
  • FIG. 2 is a side view illustrating the mechanical configuration of the component mounting device shown in FIG. 1
  • 3 is a perspective view illustrating the operation of the moving head and component holding nozzles shown in FIG. 2
  • FIG. 3 is a side view illustrating the mechanical configuration of the component recognition camera and head unit shown in FIG. 2
  • FIG. 5 is a perspective view illustrating the mechanical configuration of the lighting unit shown in FIG. 4
  • FIG. 4 is a perspective view showing a configuration example of the mark unit shown in FIG. 3
  • FIG. 2 is a block diagram illustrating the functional configuration of a control unit of the component mounting apparatus shown in FIG. 1; Flowchart illustrating component mounting processing according to the present embodiment Flowchart showing the details of imaging processing of the component and the reference mark shown in FIG. A diagram for explaining a method of controlling the lighting of the mark illumination section.
  • unit or "apparatus” used in the embodiments is not limited to a physical configuration that is mechanically implemented by hardware, but also includes those that implement the functions of the configuration by software such as programs. .
  • function of one configuration may be implemented by two or more physical configurations, or the functions of two or more configurations may be implemented by, for example, one physical configuration.
  • FIG. 1 is a top view illustrating the mechanical configuration of a component mounting apparatus 1 according to this embodiment.
  • FIG. 2 is a side view illustrating the mechanical configuration of the component mounting device 1 shown in FIG.
  • the axis extending in the height direction from the floor on which the component mounting apparatus 1 is installed is defined as the Z axis.
  • the Y axis is perpendicular to the Z axis (that is, parallel to the floor surface) and extends from the front surface of the component mounting apparatus 1 (lower side of the paper surface of FIG. 1) to the back surface of the component mounting apparatus 1 (upper side of the paper surface of FIG. 1). and
  • An axis perpendicular to the Y-axis and the Z-axis is defined as the X-axis.
  • the positive direction of the Z-axis is “up”
  • the negative direction of the Z-axis is “down”
  • the positive direction of the Y-axis is "forward”
  • the negative direction of the Y-axis is “back”
  • the positive direction of the X-axis is The direction may be called “right” and the negative direction of the Y-axis may be called “left”. It should be noted that these directions are used for convenience of explanation, and are not intended to limit the attitude of the structure in actual use.
  • One or a plurality of component mounting apparatuses 1 are arranged in a mounting board manufacturing line for mounting and manufacturing various components P on a board W.
  • the component mounting apparatus 1 mounts a component P in a predetermined position and orientation on a board W transported from the upstream of the mounting board manufacturing line.
  • the component mounting apparatus 1 includes a main body mechanism section 10 (an example of a component mounting section) and a control section 40 .
  • the body mechanism unit 10 is configured to attach parts P (e.g., IC (Integrated Circuit), electronic parts such as transistors or capacitors, lead parts, chip parts and/or BGA (Ball Grid Array) parts) to the substrate W mainly by the operation of each part mechanism. ), etc.
  • the control section 40 controls the operation of the body mechanism section 10 .
  • the body mechanism section 10 includes a mounter body 11 configured by a base 12 and the like, and a head unit 23 configured to be movable with respect to the mounter body 11 .
  • the control unit 40 is accommodated inside the base 12 (see below) of the component mounting apparatus 1 and controls various mechanisms such as the mounting machine main body 11 and the head unit 23 .
  • a substrate transport mechanism 13 is arranged along the X direction (transport direction of the substrate W) shown in FIG.
  • the substrate transport mechanism 13 includes a pair of conveyor units 14 extending along the X direction.
  • the substrate transport mechanism 13 transports the substrate W placed on the pair of conveyor portions 14 and positions and holds it at a predetermined mounting work position.
  • a pair of front and rear component supply mechanisms 15 are disposed facing each other on both front and rear sides of the substrate transport mechanism 13 .
  • Each of the pair of component supply mechanisms 15 has a feeder base 16 provided with a slot 17 .
  • a plurality of tape feeders 18 are mounted in parallel in the slots 17 as parts feeders.
  • the component mounting device 1 further includes a feeder cart 19 .
  • the feeder cart 19 includes a truck portion 20 on which a plurality of wheels are arranged, and a plurality of reel stock portions (not shown) arranged above the truck portion 20 .
  • a reel 21 is accommodated in each of the plurality of reel stock units.
  • a carrier tape 22 accommodating a component P is pulled out from each of the reels 21 and the component P is supplied to the tape feeder 18 of the component supply mechanism 15 .
  • the tape feeder 18 of the component supply mechanism 15 supplies the components P by pitch feeding the carrier tape 22 in the tape feeding direction.
  • FIG. A position where the component holding nozzle 27 picks up the component P may be called a component pick-up position.
  • a plurality of moving heads 26 and component holding nozzles 27 may be present, for example, arranged in a plurality of columns and/or a plurality of rows. may be arranged in
  • the head unit 23 is arranged above the base 12 and is configured to be movable between a mounting work position where the component supply mechanism 15 and the substrate W are arranged, and a component extraction position. Specifically, the head unit 23 is linearly moved along the X direction and the Y direction by an X-axis table mechanism 25 and a Y-axis table mechanism 24 which are arranged orthogonally to each other on a plane substantially parallel to the surface of the substrate W. It is possible.
  • a Y-axis table mechanism 24 is arranged along the Y direction on the upper surface of the base 12 .
  • a pair of front and rear X-axis table mechanisms 25 are arranged along the X direction, and are attached to each of the Y-axis table mechanisms 24 so as to be slidable along the Y direction.
  • a moving head 26 is attached to each tip of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction. That is, the moving head 26 is mounted on the head unit 23 , and the moving head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24 .
  • the moving head 26 is arbitrarily positioned on a plane substantially parallel to the surface of the substrate W, that is, on a horizontal plane (XY plane).
  • Both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are composed of linear guide driving mechanisms.
  • a component recognition camera 28 which is an example of a component imaging unit, is arranged between the front and rear pair of the component supply mechanism 15 and the substrate transport mechanism 13.
  • a component holding nozzle 27 (see below) attached to the moving head 26 moves and passes above the component recognition camera 28 while picking up the component P from the component supply mechanism 15 and holding it by suction. At this time, the component recognition camera 28 captures the image of the component P sucked and held by the passing component holding nozzle 27 one or more times while illuminating it at a predetermined timing.
  • a nozzle holder 38 and a waste box 37 are further arranged between the front and rear pair of the component supply mechanism 15 and the substrate transfer mechanism 13 .
  • the nozzle holder 38 accommodates a plurality of types of component holding nozzles 27 of the moving head 26 corresponding to the components P to be held.
  • the moving head 26 is mounted with the component holding nozzle 27 suitable for the object to be held.
  • the disposal box 37 is formed in a box-like shape and has an internal space, in which parts P and the like determined to be defective as a result of recognition of imaging results by the component recognition camera 28 are discarded.
  • FIG. 3 is a perspective view illustrating operations of the moving head 26 and the component holding nozzle 27 shown in FIG.
  • FIG. 3 omits depiction of an illumination unit and its associated components (for example, a reflector), and the mark unit 60, which will be described later.
  • an illumination unit and its associated components for example, a reflector
  • the component holding nozzle 27 uses, for example, air pressure to suck and hold the component P from the tape feeder 18 of the component supply mechanism 15, and moves up and down individually.
  • the moving head 26 also includes a Z-axis elevating mechanism (not shown) that individually raises and lowers each of the component holding nozzles 27, and a ⁇ -axis rotating mechanism (not shown) that individually rotates each of the component holding nozzles 27 around the nozzle axis. shown) and By driving the Y-axis table mechanism 24 and the X-axis table mechanism 25, the moving head 26 is arbitrarily positioned on the horizontal plane (XY plane). By this movement, the moving head 26 picks up the component P from the component pick-up position of the tape feeder 18 of the component supply mechanism 15 by sucking it with the component holding nozzle 27 .
  • the component recognition camera 28 images the component P from below while the component holding nozzle 27 holding the component P is moving to the position of the substrate W.
  • the control unit 40 analyzes the image captured by the component recognition camera 28 and recognizes the component P.
  • the controller 40 calculates the relative position and orientation of the component P held by the component holding nozzle 27 with respect to the component holding nozzle 27 .
  • the position and orientation of the component P relative to the component holding nozzle 27 are based on the position and orientation when the component holding nozzle 27 holds the component P accurately.
  • the relative position and orientation of the component P with respect to the component holding nozzle 27 may be referred to as the displacement amount of the component P in position and orientation.
  • the amount of displacement of the part P may be expressed as the amount of movement in the X and Y directions on the XY plane.
  • the deviation amount of the orientation of the part P may be expressed as a rotation angle on the XY plane.
  • a substrate recognition camera 36 (see FIGS. 1 and 2) is fixed to the moving head 26.
  • the board recognition camera 36 (see FIGS. 1 and 2) is arranged on the lower surface side of the X-axis table mechanism 25 and moves integrally with the moving head 26.
  • the substrate recognition camera 36 passes over the substrate W positioned by the substrate transport mechanism 13 and picks up an image of the substrate W.
  • the position and orientation of the substrate W are detected by similarly recognizing this imaging result (imaging information).
  • the control unit 40 moves the component holding nozzle 27 of the moving head 26 to the mounting point of the component P held by the component holding nozzle 27, and mounts the component P at the mounting point. Wear it in your posture.
  • the mounting point indicates a position on the board W where the component P should be mounted.
  • the mounting orientation indicates the orientation (for example, orientation) when the component P is mounted at the mounting point.
  • the moving head 26 performs XY movement and axial rotation so as to correct the amount of deviation in the position and orientation of the component P described above, and then mounts the component P at the mounting point.
  • the relative displacement between the component holding nozzle 27 and the component P is corrected, and the component P is accurately mounted on the mounting point.
  • the component mounting apparatus 1 picks up and mounts a plurality of components P by the component holding nozzles 27 of the moving head 26, and moves them back to the component picking position until the mounting at the plurality of mounting points on the substrate W is completed. repeats a series of tasks. By repeating this work, a large number of components P are sequentially mounted on each of the substrates W that are sequentially transported. After mounting, the substrate W on which all the components P are mounted is transported to a downstream process. In this manner, the mounter main body 11 and the head unit 23 operate in cooperation, and this cooperative operation is executed according to instructions from the control section 40 .
  • a series of work units consisting of forward movement from picking up of the part P at the part picking position to mounting of the part P at the mounting work position, and subsequent return movement to the part picking position are defined.
  • forward movement from the component removal position to the mounting work position in one turn may be hereinafter simply referred to as "forward movement in one turn”.
  • FIG. 4 is a side view illustrating the mechanical configuration of the component recognition camera 28 and head unit 23 shown in FIG.
  • FIG. 5 is a perspective view illustrating the mechanical configuration of the lighting unit section 31 shown in FIG. 4. As shown in FIG.
  • the component recognition camera 28 includes an imaging sensor section 29 and a lighting unit section 31.
  • the imaging sensor unit 29 is arranged so that the optical axis extends in the vertical direction (Z direction), and images the component P moving above the component recognition camera 28 from below.
  • the imaging sensor unit 29 includes a substantially cylindrical housing (not shown), and a lens 71 and an imaging device 72 built in the housing.
  • the number of lenses 71 may be one, or plural.
  • the imaging device 72 may be configured by a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor).
  • the imaging sensor unit 29 has a shutter function, and performs exposure and imaging at a predetermined timing according to a command from an imaging processing unit 47 (see below) of the control unit 40 .
  • the imaging sensor unit 29 transmits the result (captured image) captured by the imaging element 72 to the control unit 40 . Note that the imaging sensor section 29 and the head unit 23 will be described in more detail later.
  • the component recognition camera 28 can take images according to the scan imaging method, and may have an ROI (Region Of Interest) function using an area sensor.
  • the component recognition camera 28 may use the ROI function to set a plurality of ROIs (for example, two ROIs) for the imaging sensor unit 29 and continuously switch the ROIs to perform imaging.
  • the illumination unit section 31 includes a box-shaped housing, a plurality of component illumination sections 33, a plurality of transmitted illumination sections 34, a plurality of side illumination sections 35, and a coaxial illumination section 39.
  • the component illumination section 33 may also be referred to as an oblique illumination section or a reflected illumination section.
  • the part illumination section 33, the transmission illumination section 34, the side illumination section 35, and the coaxial illumination section 39 are arranged inside the housing.
  • the housing of the illumination unit section 31 is arranged on the upper side of the housing of the imaging sensor section 29 so as to be connected in a stacked state.
  • the plurality of side lighting units 35 are arranged in an annular shape along the horizontal direction.
  • the plurality of component lighting units 33 are positioned below the side lighting unit 35 and inside the annular ring formed by the plurality of side lighting units 35 so that a space is formed in the center. placed around the A plurality of transmitted illumination units 34 are arranged between the component illumination unit 33 and the side illumination unit 35 .
  • the coaxial illumination section 39 and the reflector C are arranged below the component illumination section 33 .
  • the component illumination section 33 is arranged substantially parallel to the bottom wall (that is, XY plane, horizontal plane) of the housing of the illumination unit section 31 .
  • the component illumination section 33 is provided so that the irradiation direction is along the optical axis of the imaging sensor section 29 .
  • the component illumination unit 33 irradiates light along the substantially vertical direction (Z direction).
  • a transmissive glass (not shown) may be horizontally arranged between the component P held by the component holding nozzle 27 and the component illumination section 33 .
  • the component illumination unit 33 emits light at timing t1 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the lower surface of the component P held by the component holding nozzle 27 is illuminated by the light emitted from the component illumination section 33 and passing through the transmission glass.
  • the imaging sensor unit 29 images the component P at the timing t1.
  • the plurality of component illumination units 33 may constitute a reflected illumination channel.
  • the control unit 40 may perform light emission control in units of reflected illumination channels.
  • the transmissive illumination unit 34 is arranged obliquely with respect to the bottom wall and side walls (that is, the Z direction) of the housing.
  • the transmission illumination section 34 is provided so that the irradiation direction is oblique to the optical axis of the imaging sensor section 29 .
  • a shielding plate B is arranged between the component illumination section 33 and the transmitted illumination section 34 .
  • the shielding plate B is arranged obliquely with respect to both the bottom wall and the side wall of the housing, similarly to the transmitted illumination section 34 .
  • the transmissive illumination unit 34 When the transmissive illumination unit 34 emits light, it obliquely emits light with respect to the vertical direction (Z direction) and horizontal direction (XY plane).
  • the transmitted illumination unit 34 emits light at timing t2 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28 .
  • the component P held by the component holding nozzle 27 is illuminated by the light emitted from the transmission illumination section 34 and reflected by the reflector of the moving head 26 .
  • the imaging sensor unit 29 images the component P at the timing t2.
  • the plurality of transmitted illumination units 34 may constitute a transmitted illumination channel.
  • the control unit 40 may perform light emission control in units of transillumination channels.
  • the side lighting section 35 is arranged substantially parallel to the side wall of the housing of the lighting unit section 31 .
  • the side lighting section 35 is provided so that the irradiation direction is perpendicular to the optical axis of the imaging sensor section 29 .
  • the side illumination section 35 is arranged above the component illumination section 33 and the transmission illumination section 34 . When the side illumination unit 35 emits light, it emits light along the horizontal plane.
  • the side illumination unit 35 emits light at timing t3 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the side of the component P held by the component holding nozzle 27 is illuminated by the light emitted from the side illumination section 35 .
  • the imaging sensor unit 29 images the component P at the timing t3.
  • the coaxial lighting section 39 is arranged substantially parallel to the side wall of the housing of the lighting unit section 31 .
  • the coaxial illumination unit 39 is provided so that the irradiation direction is perpendicular to the optical axis of the imaging sensor unit 29 .
  • the coaxial illumination section 39 is arranged below the component illumination section 33 .
  • a reflector C for example, a mirror included in the component recognition camera 28 is arranged at a position separated from the coaxial illumination unit 39 in the direction along the XY plane. The light emitted from the coaxial illumination unit 39 is reflected upward by the reflector C and illuminates the upper part of the reflector C. As shown in FIG.
  • the coaxial illumination unit 39 emits light at timing t4 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the lower part of the component P held by the component holding nozzle 27 is illuminated from the coaxial illumination unit 39, reflected upward by the reflector C, and the central space surrounded by the plurality of component illumination units 33 and the transmitted light are emitted. Illuminated by light passing through glass.
  • the imaging sensor unit 29 images the component P at the timing t4.
  • coaxial illumination unit 39 may constitute a coaxial illumination channel.
  • the control unit 40 may perform light emission control in units of coaxial illumination channels.
  • the light emission timings t1 to t4 of the lighting units 33, 34, 35, and 39 may be any one of a plurality of imaging timings within the forward movement time in one turn. Also, the light emission timings of the lighting units 33, 34, 35, and 39 may overlap. For example, at least two of the plurality of illumination units 33, 34, 35, and 39 may emit light at the same time to illuminate the part P.
  • FIG. 6 is a perspective view showing a configuration example of the mark unit 60 shown in FIG.
  • FIG. 7 is a diagram for explaining the positional relationship between the part P and the reference mark 61. As shown in FIG.
  • the head unit 23 includes a downwardly extending moving head 26 and a downwardly extending mark unit 60 .
  • a component holding nozzle 27 is attached to the moving head 26 .
  • the mark unit 60 is provided adjacent to the moving head 26 at a predetermined distance from the moving head 26 .
  • the mark unit 60 has a rectangular parallelepiped housing, and includes a reference mark 61, a diffusion plate 63, and a mark illumination section 62 in order from bottom to top inside the housing. consists of
  • the shape of the casing of the mark unit 60 is not limited to a rectangular parallelepiped, and may be, for example, a cylindrical shape extending downward.
  • the reference mark 61 is a predetermined mark and is arranged on the lower surface of the mark unit 60 .
  • the diffuser plate 63 is a translucent plate that diffuses and transmits light, and is arranged above the reference mark 61 .
  • the mark illumination unit 62 is a device capable of emitting light, represented by an LED, and is arranged above the diffuser plate 63 . As a result, the light emitted from the mark illumination unit 62 is diffused by the diffuser plate 63 and passes through the diffuser plate 63 to uniformly illuminate the reference mark 61 . Therefore, the component recognition camera 28 can capture an image of the uniformly illuminated reference mark 61 , thereby improving the recognition accuracy of the reference mark 61 .
  • the reference mark 61 is used when recognizing the component P by the component recognition camera 28 and calculating the amount of deviation of the position and orientation of the component P with respect to the component holding nozzle 27 .
  • the component recognition camera 28 captures an image including the component P and the reference mark 61 .
  • the control unit 40 analyzes the captured image, recognizes the component P and the reference mark 61 , and calculates the relative position and orientation deviation amount of the component P with respect to the reference mark 61 . Then, the controller 40 uses the calculated deviation amount to calculate the deviation amount of the position and orientation of the component P with respect to the component holding nozzle 27 as described above.
  • the reference mark 61 (that is, the lower surface of the mark unit 60) is located at the same position as the lower end of the component holding nozzle 27 or above the lower end of the component holding nozzle 27.
  • FIG. 7B when the component holding nozzle 27 is axially rotated in order to correct the amount of deviation of the orientation of the component P when mounting the component P (that is, the orientation of the component P is rotated), the part P does not collide with the mark unit 60. Therefore, according to the present embodiment, it is possible to handle a part P having a size that interferes with the reference mark 61 when the orientation of the part P is rotated.
  • FIG. 8 is a block diagram illustrating the functional configuration of the controller 40 of the component mounting apparatus 1 shown in FIG. 1. As shown in FIG.
  • the control unit 40 of the component mounting apparatus 1 is a general-purpose computer equipped with a storage device represented by ROM (Read Only Memory) and RAM (Random Access Memory), and an arithmetic device represented by CPU (Central Processing Unit). may be configured.
  • the computing device implements the software configuration (functional configuration) shown in FIG. 8 by reading and executing the computer program held in the storage device. That is, each block illustrated within the control unit 40 in FIG. 8 represents a function realized by software. However, at least part of the functions expressed as blocks may be realized by physical configuration (hardware) of the "apparatus" without being limited to software.
  • the control unit 40 includes a storage unit 41 , a mechanism driving unit 46 and an imaging processing unit 47 .
  • the mechanism driving section 46 controls driving of the body mechanism section 10 .
  • the mechanism driving section 46 controls the driving of the substrate transport mechanism 13, the component supply mechanism 15, and the head unit 23, and causes the substrate transport mechanism 13, the component supply mechanism 15, and the head unit 23 to cooperate.
  • the storage unit 41 holds at least mounting information 42 , component information 43 and imaging information 45 .
  • the mounting information 42 includes information such as the type of component P to be mounted on each board W, and the mounting position and mounting orientation (for example, orientation) of the component P on the board W.
  • the component information 43 may include information such as the external shape of each type of component P, the presence or absence of electrodes, and the number of electrodes.
  • the imaging information 45 includes information indicating the light emission timing of the mark illumination unit 62 and the component illumination unit 33, information indicating the amount of light emitted by each of the mark illumination unit 62, the component illumination unit 33, and the like, and an image of the component P.
  • Information indicating timing may be included. Multiple times may be sufficient as the frequency
  • the imaging timing may be read as shutter timing. Also, the number of light emission timings may be plural.
  • the imaging information 45 may include information indicating the light emission timing of the illumination channel and information indicating the imaging timing of the imaging sensor unit 29 within the forward movement in one turn.
  • the imaging processing unit 47 includes a camera control unit 48 and a component recognition unit 50.
  • the camera control section 48 controls the imaging of the imaging sensor section 29 and the light emission of the illumination unit section 31 at the imaging timing. For example, the camera control unit 48 reads the imaging information 45 from the storage unit 41 . Then, the camera control unit 48 causes the illumination channel to emit light at each image capturing timing indicated by the image capturing information 45, and causes the image sensor unit 29 to capture an image of the component P.
  • the component recognition unit 50 recognizes the features of the component P included in the image captured by the imaging sensor unit 29 based on the image.
  • the features of the part P include at least one of the position of the part P, the posture of the part P, the polarity of the part P, the three-dimensional shape of the part P, the outline of the part P, and the characters added to the part P. good.
  • the moving head 26 and the component holding nozzle 27 mount the component P on the mounting point of the board W based on the recognition result by the component recognition unit 50 .
  • the imaging information of the board recognition camera 36 may also be transmitted to the imaging processing unit 47 .
  • the imaging processing unit 47 may recognize the position and orientation of the substrate W from the imaging information (image), and transmit the recognition result to the mechanism driving unit 46, similarly to the component recognition unit 50 .
  • FIG. 9 is a flowchart illustrating component mounting processing according to the present embodiment.
  • FIG. 10 is a flow chart showing details of imaging processing of the part P and the reference mark 61 shown in FIG. That is, the processing shown in FIG. 10 corresponds to detailed description of step S104 in FIG.
  • the component mounting apparatus 1 starts the following processing.
  • the control unit 40 determines whether or not it is time to correct the change over time of the component mounting apparatus 1 (S101).
  • the aging correction process is a process performed to correct distortion of the device due to heat generation or the like. For example, in the aging correction process, an image of the device in the initial state is captured by the component recognition camera 28, the captured image is stored, an image of the device in the current state is captured by the component recognition camera 28, and the image of the device in the initial state is stored. The captured image is compared with the captured image of the device in the current state, and correction is performed based on the change over time.
  • the process of step S101 may use the image captured by the component recognition camera 28 in this secular change correction process.
  • the control unit 40 measures the position of the reference mark 61 on the XY plane using the image captured by the component recognition camera 28 in the aging correction process. (S102).
  • a position on the XY plane is hereinafter referred to as an XY position.
  • the control unit 40 moves the head unit 23 and the reference mark 61 in the positive direction of the X-axis at a low speed (for example, 600 mm/sec) while passing over the part recognition camera 28, thereby moving the reference mark 61.
  • XY position may be measured. Thereby, the XY position of the reference mark 61 can be measured more accurately.
  • the component holding nozzle 27 picks up and holds the component P at the component extraction position (S103). Then, the component holding nozzle 27 passes above the component recognition camera 28 .
  • the component recognition camera 28 performs imaging processing of the component P held by the component holding nozzle 27 passing above and the reference mark 61 adjacent to the component holding nozzle 27 (S104). Details of the processing in step S104 will be described later (see FIG. 10).
  • the control unit 40 analyzes the image captured in step S104, recognizes the XY position of the reference mark 61, and recognizes the XY position and orientation of the component P (S105).
  • the control unit 40 measures the first stage XY position and orientation of the part P based on the relative positional relationship between the reference mark 61 and the part P recognized in step S105 (S106). By measuring the first-stage XY position and orientation of the component P using the reference mark 61 in this way, even if the head unit 23 shakes during image capturing in step S104, the relative position of the component P to the reference mark 61 can be determined. Since the physical position does not change, the controller 40 can accurately measure the XY position and orientation of the part P in the first stage.
  • control unit 40 considers the deviation between the XY position of the reference mark 61 measured in step S106 and the XY position of the reference mark 61 measured in step S101, and calculates the XY position of the part P in the first stage. From the position, a second stage XY position is calculated which indicates the XY position of the part P more accurately. For example, the control unit 40 calculates the XY position of the part P in the second stage by the following formula 1.
  • Second stage XY position of component P First stage XY position of component P ⁇ (XY position of reference mark 61 recognized in step S105 ⁇ XY position of reference mark 61 measured in step S101) (Equation 1)
  • the control unit 40 accurately determines the XY position of the component P in the first stage and the XY position in the second stage, and the orientation of the component P. well calculated.
  • the second-stage XY position of the component P calculated by Equation 1 may correspond to the displacement amount of the position of the component P with respect to the component holding nozzle 27 described above.
  • the above steps S104 to S106 may be performed for each of these sets.
  • the component holding nozzle 27 mounts the component P on the board W (S107). At this time, the component holding nozzle 27 may mount the component P on the substrate W after moving and axially rotating so as to correct the deviation amount of the position and orientation of the component P calculated in step S106. As described above, the lower surface of the mark unit 60 is positioned at the same level as or above the lower end of the component holding nozzle 27. Therefore, in S107, the component holding nozzle 27 rotates the direction of the component P for correction. Even if it does, the part P does not collide with the mark unit 60 . Therefore, the component mounting apparatus 1 can handle a component P having a size that interferes with the reference mark 61 when the direction of the component P is rotated.
  • control unit 40 determines whether or not production has ended. If the control unit 40 determines that production has not ended (S108: NO), it returns to the process of step S101, and if it determines that production has ended (S108: YES), it ends this process.
  • the process of measuring the position and orientation of the component P relative to the reference mark 61 described above is a scan in which the component holding nozzle 27 obliquely passes over the component recognition camera 28 in the XY plane (hereinafter referred to as oblique scan). ), and need not be performed when the component holding nozzle 27 passes over the component recognition camera 28 in the X direction on the XY plane (hereinafter referred to as linear scan). This is because the head unit 23 tends to sway when performing oblique scanning, but does not sway much when performing linear scanning.
  • step S104 in FIG. 9 will be described in detail.
  • the component recognition camera 28 determines whether or not at least part of the component P held by the component holding nozzle 27 overlaps the reference mark 61 (S201). That is, the component recognition camera 28 determines whether or not at least part of the component P covers the reference mark 61 when viewed from below.
  • the component recognition camera 28 may perform the determination using the image captured by the imaging device 72 .
  • the component recognition camera 28 lights both the mark illumination unit 62 and the component illumination unit 33 (S202).
  • the component recognition camera 28 (imaging sensor unit 29) images the component P held by the component holding nozzle 27 (S203).
  • the component recognition camera 28 turns off both the mark illumination unit 62 and the component illumination unit 33 (S204). This completes the processing of step S104 shown in FIG. Accordingly, at the timing of imaging the component P, the reference mark 61 is illuminated by the mark illumination unit 62 and the component P is illuminated by the component illumination unit 33, so that the imaging sensor unit 29 can clearly see both the reference mark 61 and the component P. can be imaged.
  • the component recognition camera 28 lights up the component lighting unit 33 (S210). At this time, the part recognition camera 28 does not turn on the mark illumination section 62 .
  • the component recognition camera 28 (imaging sensor unit 29) images the component P held by the component holding nozzle 27 (S211).
  • the component recognition camera 28 turns off the component illumination section 33 (S212). This completes the processing of step S104 shown in FIG. If the mark illumination unit 62 is turned on when at least part of the component P overlaps the reference mark 61, the part of the component P is illuminated by the mark illumination unit 62, and the captured image of the component P has uneven brightness. can occur. The brightness unevenness of the captured image can reduce the recognition accuracy of the component P.
  • the mark illumination section 62 does not light up, so such a problem does not occur. . Therefore, it is possible to avoid deterioration in recognition accuracy of the component P.
  • 11A and 11B are diagrams for explaining a method of controlling lighting of the mark illumination section 62.
  • FIG. 11A and 11B are diagrams for explaining a method of controlling lighting of the mark illumination section 62.
  • the component mounting apparatus 1 includes an FA controller 82.
  • the FA controller 82 may be an example of the control section 40 shown in FIG.
  • the component recognition camera 28 is connected to the FA controller 82 through a predetermined communication cable 84 capable of transmitting and receiving data.
  • the component recognition camera 28 also includes a component illumination control section 73 that controls illumination of the component illumination section 33 .
  • the board recognition camera 36 is connected to the FA controller 82 through a predetermined communication cable 85 capable of transmitting and receiving data.
  • a substrate illumination unit 81 for illuminating the substrate W is provided near the substrate recognition camera 36 .
  • the board illumination section 81 is connected to a board illumination control section 80 that controls illumination of the board illumination section 81 .
  • the board illumination control section 80 is connected to the FA controller 82 through a predetermined communication cable 85 capable of transmitting and receiving data.
  • the board recognition camera 36, the board lighting control section 80, and the board lighting section 81 are mounted on the head unit 23. That is, by moving the head unit 23, the board recognition camera 36, the board illumination control section 80, and the board illumination section 81 can be moved.
  • the communication cable 85 connecting the FA controller 82 and the substrate recognition camera 36, and the communication cable 85 connecting the FA controller 82 and the substrate illumination control section 80 can be driven and cables are housed in a cable carrier (for example, Cableveyor (registered trademark)) that protects the cable carrier.
  • a cable carrier for example, Cableveyor (registered trademark)
  • the mark lighting section 62 is connected to the board lighting control section 80 through an electric cable 86 . Lighting of the mark illumination unit 62 may be controlled in the process of step S202 in FIG. 10 by the process illustrated in steps S301 to S303.
  • the imaging processing unit 47 transmits a lighting trigger for the component lighting unit 33 to the component lighting control unit 73, and also transmits a communication signal.
  • a lighting trigger for the mark illumination unit 62 is transmitted to the FA controller 82 through the cable 84 .
  • the imaging processing section 47 may determine the timing to start imaging based on the encoder information indicating the position of the head unit 23 .
  • the FA controller 82 transmits the lighting trigger for the mark illumination unit 62 received through the communication cable 84 to the substrate illumination control unit 80 through the communication cable 85.
  • the board illumination control unit 80 receives a lighting trigger for the mark illumination unit 62 through the communication cable 85, and causes the mark illumination unit 62 to emit light through the electric cable 86.
  • the component illumination control unit 73 receives a lighting trigger from the imaging processing unit 47 and causes the component illumination unit 33 to emit light.
  • the component recognition camera 28 can light up the component illumination section 33 and the mark illumination section 62 to capture an image of the component P. That is, the imaging timing of the component P and the reference mark 61 can be synchronized with the lighting timing of the component illumination section 33 and the mark illumination section 62 .
  • the amount of light emitted by the mark illumination unit 62 may be registered in advance in the substrate illumination control unit 80 before starting production.
  • the light emission amount of the mark illumination section 62 may be changeable by setting.
  • the component illumination unit 33 can be caused to emit light with an amount of light that makes the component P have appropriate brightness
  • the mark illumination unit 62 can be made to emit light with an amount of light that makes the reference mark 61 have appropriate brightness. Therefore, the component recognition camera 28 can capture a clear image of both the component P and the reference mark 61 .
  • the mark illumination unit 62 may be controlled to be turned off by the processing illustrated in the following steps S311 to S313.
  • the imaging processing unit 47 transmits a turn-off trigger for the parts lighting unit 33 to the parts lighting control unit 73, and also communicates with the parts lighting control unit 73.
  • a trigger for turning off the mark illumination unit 62 is transmitted to the FA controller 82 through the cable 84 .
  • the FA controller 82 transmits the turn-off trigger for the mark illumination unit 62 received through the communication cable 84 to the substrate illumination control unit 80 through the communication cable 85.
  • the substrate illumination control unit 80 receives the turn-off trigger for the mark illumination unit 62 through the communication cable 85, and turns off the mark illumination unit 62.
  • the component lighting control unit 73 receives a turn-off trigger from the imaging processing unit 47 and turns off the component lighting unit 33 .
  • the turn-on trigger and extinguishment trigger of the mark illumination unit 62 from the component recognition camera 28 to the FA controller 82 and the turn-on trigger and extinguishment trigger of the mark illumination unit 62 from the FA controller 82 to the board illumination control unit 80 are It may be transmitted by LVDS (Low Voltage Differential Signaling) used for shutter control of the camera 36 . Thereby, lighting and extinguishing of the mark illumination section 62 can be controlled at high speed.
  • LVDS Low Voltage Differential Signaling
  • the configuration shown in FIG. 11 has the following advantages. If a new illumination control unit for controlling the mark illumination unit 62 is provided and a new communication cable is used to connect it to the FA controller 82, the mark illumination unit 62 can move freely together with the head unit 23. Therefore, it is necessary to conduct a new durability test on the communication cable.
  • the existing cable between the FA controller 82 and the substrate illumination control unit 80 which has already been inserted into the cable carrier 83 and passed the durability test, Illumination of the mark illumination section 62 can be controlled through the communication cable 85 . As a result, the mark illumination section 62 can be provided in the head unit 23 at low cost without conducting a new durability test.
  • the component mounting apparatus 1 includes a movable head unit 23, a nozzle (component holding nozzle) 27 provided in the head unit 23 and capable of picking up a component at the lower end thereof, and a A mark unit 60 that includes, in order from the bottom to the top, a predetermined mark 61 and a first lighting unit (mark lighting unit) 62 that illuminates the mark 61; A second lighting unit (component lighting unit) 33 that illuminates from below, and a component imaging unit (component recognition camera) 28 that images the component P sucked by the nozzle 27 and the mark 61 of the mark unit 60 from below.
  • a movable head unit 23 a nozzle (component holding nozzle) 27 provided in the head unit 23 and capable of picking up a component at the lower end thereof
  • a A mark unit 60 that includes, in order from the bottom to the top, a predetermined mark 61 and a first lighting unit (mark lighting unit) 62 that illuminates the mark 61;
  • a second lighting unit (component lighting unit) 33 that illuminates
  • the mark 61 is illuminated by the first illumination unit 62 and the component P is illuminated by the second illumination unit 33, so that the component imaging unit (for example, the component recognition camera 28) can clearly see both the mark 61 and the component P. It can be imaged.
  • the component imaging unit for example, the component recognition camera 28
  • the mark unit 60 further includes a diffuser plate 63 between the mark 61 and the first illumination section 62 that diffuses and transmits the light from the first illumination section 62. may be configured. As a result, the light from the first illumination unit 62 is diffused and transmitted through the diffusion plate 63 and illuminates the mark 61, so that the component imaging unit can image the mark 61 whose entirety is uniformly illuminated. .
  • the first lighting section 62 and the second lighting section 33 may emit light at the timing when the component imaging section images the component P. Thereby, the component imaging unit can clearly image both the mark 61 illuminated by the first illumination unit 62 and the component P illuminated by the second illumination unit 33 .
  • the first lighting unit 62 does not need to emit light when at least part of the component P sucked by the nozzle 27 overlaps the mark 61 as viewed from below. As a result, it is possible to prevent the component P from being illuminated by the light emitted from the first illumination unit 62 and causing uneven brightness in the captured image of the component P.
  • a third lighting unit for example, a board an illumination unit 81
  • an illumination control unit for example, a board illumination control unit 80
  • FA controller illumination control unit
  • a cable carrier 83 in which the communication cable 85 is inserted and which operates in accordance with the movement of the head unit 23.
  • a first lighting section 62 can be provided in the head unit 23 .
  • the head unit 23 having a nozzle (component holding nozzle) 27 capable of sucking the component P at its lower end is moved.
  • the first illumination section 62 of the mark unit 60 that includes a predetermined mark 61 and a first illumination section (for example, the mark illumination section 62) that illuminates the mark 61 is caused to emit light
  • the A second illumination unit (component illumination unit) 33 that illuminates the component P from below is made to emit light
  • the component P sucked by the nozzle 27 and the mark 61 of the mark unit 60 are captured by the component imaging unit (for example, the component recognition camera 28).
  • the component imaging unit for example, the component recognition camera 28
  • the technology of the present disclosure is useful for devices that mount components on substrates.
  • Component Mounting Device 10 Main Body Mechanism Section 11 Mounting Machine Main Body 12 Base 13 Board Transfer Mechanism 14 Conveyor Section 15 Component Supply Mechanism 16 Feeder Base 17 Slot 18 Tape Feeder 19 Feeder Cart 20 Truck Section 21 Reel 22 Carrier Tape 23 Head Unit 24 Y Axis table mechanism 25 X-axis table mechanism 26 Moving head 27 Component holding nozzle 28 Component recognition camera 29 Imaging sensor section 31 Illumination unit section 33 Component illumination section 34 Transmission illumination section 35 Side illumination section 36 Board recognition camera 37 Waste box 38 Nozzle holder 39 coaxial illumination unit 40 control unit 41 storage unit 42 mounting information 43 component information 45 imaging information 46 mechanism driving unit 47 imaging processing unit 48 camera control unit 50 component recognition unit 60 mark unit 61 reference mark 62 mark illumination unit 63 diffusion plate 71 lens 72 image pickup device 73 component illumination control unit 80 substrate illumination control unit 81 substrate illumination unit 82 FA controller 83 cable carrier 84 communication cable 85 communication cable 86 electric cable B shielding plate C reflector P component W substrate

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  • Supply And Installment Of Electrical Components (AREA)
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Publication number Priority date Publication date Assignee Title
JP2002144267A (ja) * 2000-11-06 2002-05-21 Fuji Mach Mfg Co Ltd 電気部品吸着ノズル，倍率検出方法，吸着位置検出方法
JP2005011950A (ja) * 2003-06-18 2005-01-13 Yamaha Motor Co Ltd 表面実装機
JP2010509749A (ja) * 2006-11-06 2010-03-25 パナソニック株式会社 移動装置および電子部品実装装置
JP2013026278A (ja) * 2011-07-15 2013-02-04 Fuji Mach Mfg Co Ltd 電子部品実装装置
JP2015111631A (ja) * 2013-12-06 2015-06-18 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 認識装置、認識方法、実装装置及び実装方法

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Publication number Priority date Publication date Assignee Title
JP6806475B2 (ja) * 2016-07-01 2021-01-06 株式会社Ｆｕｊｉ 部品実装機及び部品実装システム

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002144267A (ja) * 2000-11-06 2002-05-21 Fuji Mach Mfg Co Ltd 電気部品吸着ノズル，倍率検出方法，吸着位置検出方法
JP2005011950A (ja) * 2003-06-18 2005-01-13 Yamaha Motor Co Ltd 表面実装機
JP2010509749A (ja) * 2006-11-06 2010-03-25 パナソニック株式会社 移動装置および電子部品実装装置
JP2013026278A (ja) * 2011-07-15 2013-02-04 Fuji Mach Mfg Co Ltd 電子部品実装装置
JP2015111631A (ja) * 2013-12-06 2015-06-18 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 認識装置、認識方法、実装装置及び実装方法

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