JP7833700B2 - 部品装着装置、及び、部品装着方法 - Google Patents

部品装着装置、及び、部品装着方法

Info

Publication number
JP7833700B2
JP7833700B2 JP2023517052A JP2023517052A JP7833700B2 JP 7833700 B2 JP7833700 B2 JP 7833700B2 JP 2023517052 A JP2023517052 A JP 2023517052A JP 2023517052 A JP2023517052 A JP 2023517052A JP 7833700 B2 JP7833700 B2 JP 7833700B2
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JP
Japan
Prior art keywords
unit
component
mark
illumination
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023517052A
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English (en)
Japanese (ja)
Other versions
JPWO2022230273A1 (https=
Inventor
康一 岡田
秀雄 森
鷹則 松田
壮一郎 郡司
秀夫 工藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of JPWO2022230273A1 publication Critical patent/JPWO2022230273A1/ja
Application granted granted Critical
Publication of JP7833700B2 publication Critical patent/JP7833700B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2023517052A 2021-04-30 2022-01-31 部品装着装置、及び、部品装着方法 Active JP7833700B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021077914 2021-04-30
JP2021077914 2021-04-30
PCT/JP2022/003678 WO2022230273A1 (ja) 2021-04-30 2022-01-31 部品装着装置、及び、部品装着方法

Publications (2)

Publication Number Publication Date
JPWO2022230273A1 JPWO2022230273A1 (https=) 2022-11-03
JP7833700B2 true JP7833700B2 (ja) 2026-03-23

Family

ID=83848225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023517052A Active JP7833700B2 (ja) 2021-04-30 2022-01-31 部品装着装置、及び、部品装着方法

Country Status (2)

Country Link
JP (1) JP7833700B2 (https=)
WO (1) WO2022230273A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002144267A (ja) 2000-11-06 2002-05-21 Fuji Mach Mfg Co Ltd 電気部品吸着ノズル，倍率検出方法，吸着位置検出方法
JP2005011950A (ja) 2003-06-18 2005-01-13 Yamaha Motor Co Ltd 表面実装機
WO2008056721A1 (en) 2006-11-06 2008-05-15 Panasonic Corporation Moving device and electronic component mounting apparatus
JP2013026278A (ja) 2011-07-15 2013-02-04 Fuji Mach Mfg Co Ltd 電子部品実装装置
JP2015111631A (ja) 2013-12-06 2015-06-18 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 認識装置、認識方法、実装装置及び実装方法
JP2018006583A (ja) 2016-07-01 2018-01-11 富士機械製造株式会社 部品実装機及び部品実装システム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002144267A (ja) 2000-11-06 2002-05-21 Fuji Mach Mfg Co Ltd 電気部品吸着ノズル，倍率検出方法，吸着位置検出方法
JP2005011950A (ja) 2003-06-18 2005-01-13 Yamaha Motor Co Ltd 表面実装機
WO2008056721A1 (en) 2006-11-06 2008-05-15 Panasonic Corporation Moving device and electronic component mounting apparatus
JP2013026278A (ja) 2011-07-15 2013-02-04 Fuji Mach Mfg Co Ltd 電子部品実装装置
JP2015111631A (ja) 2013-12-06 2015-06-18 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 認識装置、認識方法、実装装置及び実装方法
JP2018006583A (ja) 2016-07-01 2018-01-11 富士機械製造株式会社 部品実装機及び部品実装システム

Also Published As

Publication number Publication date
JPWO2022230273A1 (https=) 2022-11-03
WO2022230273A1 (ja) 2022-11-03

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