WO2022224487A1 - Matrice de moulage, dispositif de moulage de résine et procédé pour la fabrication d'un article moulé en résine - Google Patents

Matrice de moulage, dispositif de moulage de résine et procédé pour la fabrication d'un article moulé en résine Download PDF

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Publication number
WO2022224487A1
WO2022224487A1 PCT/JP2021/046086 JP2021046086W WO2022224487A1 WO 2022224487 A1 WO2022224487 A1 WO 2022224487A1 JP 2021046086 W JP2021046086 W JP 2021046086W WO 2022224487 A1 WO2022224487 A1 WO 2022224487A1
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WIPO (PCT)
Prior art keywords
molding
mold
resin
substrate
pot
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Application number
PCT/JP2021/046086
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English (en)
Japanese (ja)
Inventor
宮景孝之
吉田周平
市橋秀男
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020237031755A priority Critical patent/KR20230145466A/ko
Priority to CN202180097206.9A priority patent/CN117177853A/zh
Publication of WO2022224487A1 publication Critical patent/WO2022224487A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14122—Positioning or centering articles in the mould using fixed mould wall projections for centering the insert

Definitions

  • the present disclosure relates to a mold, a resin molding apparatus, and a method of manufacturing a resin molded product.
  • Substrates to which electronic elements such as semiconductor chips (hereinafter sometimes simply referred to as "chips") are connected are generally used as electronic components by sealing with resin.
  • a resin molding apparatus for transfer molding a molding die having an upper mold and a lower mold to which a substrate is supplied, a release film supply mechanism for supplying a release film to the mold surface of the upper mold, and a mold. and a mold clamping mechanism for clamping the mold (see, for example, Patent Document 1).
  • a bridge portion is formed in a pot piece provided in a lower mold, and when the mold is clamped by a mold clamping mechanism, the outer peripheral edge of the substrate is attached to the lower mold. and the bridging portion.
  • positioning pins are formed on the lower mold so as to project upward, and when the substrate is supplied to the lower mold, the substrate is positioned by matching the V-notches provided on the substrate with the positioning pins. .
  • the lower mold is provided with a positioning pin as in the resin molding apparatus described in Patent Document 1, it is desired to supply the release film to the mold surface of the lower mold for reasons such as preventing the lower mold from being soiled. Sometimes the positioning pins get in the way and can't be handled.
  • a characteristic configuration of the molding die according to the present disclosure includes a molding die body that holds an object to be molded and has a cavity to which a resin material is supplied, and the molding die body has a pot to which the resin material is supplied. and a cull block forming, between itself and the pot block, a resin flow path for allowing the resin material to flow from the pot toward the cavity, wherein the pot block presses the molding object. It has a protruding portion that protrudes in a possible state, and the protruding portion is formed with an insertion member that is inserted into a hole formed in the molding object.
  • the characteristic configuration of the resin molding apparatus includes the mold, a mold release film supply mechanism that supplies a mold release film to the mold surface of the mold body to which the molding object is supplied, and the mold. and a mold clamping mechanism for clamping the mold.
  • the method for manufacturing a resin molded product according to the present disclosure is characterized by a release film supply step of supplying the release film to the mold body, and a molding object supply step of supplying the molding object onto the mold release film. a positioning step of moving the pot block and the molding die body relatively close to each other to insert the insertion member into the hole to position the molding object; and a molding step of supplying the resin material to the cavity to resin-mold the object to be molded while the mold is clamped.
  • FIG. 1] is a schematic plan view showing a resin molding apparatus.
  • FIG. 1] is a schematic front view showing a molding die.
  • FIG. [Fig. 3] is a perspective view showing a pot block and a cull block;
  • FIG. 3] is a perspective view of a pot block and a lower mold;
  • FIG. 2] is an enlarged perspective view showing a pot block and a lower mold on which a substrate is placed;
  • FIG. 4 shows the first stage of the positioning process;
  • FIG. 4 shows the second stage of the positioning process;
  • Fig. 3 shows the third stage of the positioning process;
  • FIG. 4 shows the fourth stage of the positioning process;
  • FIG. 5 shows the fifth stage of the positioning process;
  • FIG. 12] is an enlarged perspective view showing a pilot pin according to another embodiment;
  • a substrate (molding object) to which a semiconductor chip or the like is connected is used as an electronic component by sealing with resin.
  • Techniques for resin-sealing molding objects include a transfer method and the like. As one of the transfer methods, the object to be molded is placed on the release film that is adsorbed to the lower mold of the mold, and a resin tablet (resin material) is supplied to the pot of the mold.
  • a method of resin-molding an object to be molded by heating and melting the resin by heating and supplying the molten resin to the cavity can be mentioned.
  • the powdery resin includes not only powdery resin but also resin tablets formed of solid resin obtained by pressing powdery resin. It becomes a molten resin.
  • This powdery resin may be either a thermoplastic resin or a thermosetting resin. When the thermosetting resin is heated, its viscosity decreases, and when it is further heated, it polymerizes and hardens to become a cured resin. As described below, it is desirable to use a thermosetting resin when resin-molding and sealing the pre-molding substrate to which the semiconductor chip is connected.
  • FIG. 1 shows a schematic plan view of a resin molding apparatus 30 in this embodiment.
  • the resin molding apparatus 30 includes a molding module 3, a supply module 4, a control section 6, and a transport mechanism.
  • the molding module 3 is a part for resin-sealing an object to be molded, and has a mold including a mold main body M that holds the pre-molding substrate Sa (object to be molded).
  • the control unit 6 includes at least a program stored in hardware such as an HDD or memory as software for controlling the operation of the resin molding apparatus 30, and includes a computer ASIC, FPGA, CPU, or other hardware processor. Executed by
  • the resin molding apparatus 30 in this embodiment is an apparatus for resin-molding the pre-molding substrate Sa to which a semiconductor chip or the like is connected.
  • the molding module 3 molds the pre-molding substrate Sa (molding object) with resin to mold the molded substrate Sb (resin molding product).
  • a plurality of molding modules 3 are provided, and each molding module 3 can be attached or detached independently. Details of the resin molding apparatus 30 will be described later.
  • the number of molding modules 3 may be one, or three or more.
  • the supply module 4 is for supplying the pre-molding substrate Sa and the resin tablet T to the molding module 3 and receiving the molded substrate Sb from the molding module 3. It includes a mechanism 45 and a substrate receiving portion 46 .
  • a loader 41 and an unloader 42 included in the transport mechanism wait inside the supply module 4 .
  • the substrate supply mechanism 43 delivers the stock pre-molded substrates Sa to the substrate alignment mechanism 44 .
  • a plurality of semiconductor chips are aligned vertically and/or horizontally and connected to the pre-molding substrate Sa.
  • the substrate alignment mechanism 44 puts the pre-molding substrate Sa delivered from the substrate supply mechanism 43 into a state suitable for transportation.
  • the resin supply mechanism 45 stocks the resin tablets T, and arranges the resin tablets T in a state suitable for transportation. Note that the pre-molding substrate Sa may be one to which one semiconductor chip is connected.
  • the transport mechanism includes a loader 41 that transports the pre-molding substrate Sa and the resin tablet T to which the semiconductor chips and the like before resin sealing are connected, and an unloader 42 that transports the molded substrate Sb after resin sealing. .
  • the loader 41 receives the pre-molding substrate Sa from the substrate alignment mechanism 44, receives the resin tablet T from the resin supply mechanism 45, and moves from the supply module 4 to each molding module 3 on the rail.
  • the pre-molding substrate Sa and the resin tablet T can be transferred to the molding die main body M (lower mold LM).
  • the unloader 42 can take out the molded substrates Sb from the molding modules 3 , move on the rails from each molding module 3 to the substrate storage section 46 , and store the molded substrates Sb in the substrate storage section 46 .
  • a semiconductor chip or the like is sealed with a cured resin obtained by solidifying a molten resin.
  • substrate accommodation part 46 may be arrange
  • the resin molding device 30 of the molding module 3 will be described in detail below.
  • the resin molding apparatus 30 includes an upper mold UM ( an example of a cull block), a lower mold LM disposed facing the upper mold UM and provided with a resin injection mechanism 7 for injecting molten resin into the upper mold cavity MCa, and clamping the upper mold UM and the lower mold LM. and a release film supply mechanism 8 for supplying the release film F.
  • the lower die LM in this embodiment is formed with a lower die cavity MCb into which molten resin is injected from the upper die cavity MCa through a resin flow hole (not shown) provided in the pre-molding substrate Sa.
  • the operation of the mold clamping mechanism 5 is controlled by the controller 6 .
  • the upper mold UM is held by an upper mold holder 31 , and this upper mold holder 31 is fixed to an upper platen 32 . Also, the upper mold UM is attached to the upper mold holder 31 via the upper mold base plate 33 .
  • the lower mold LM is held by a lower mold holder 34 , and the lower mold holder 34 is fixed to a movable platen 35 that moves up and down by the mold clamping mechanism 5 . In addition, the lower mold LM is attached to the lower mold holder 34 via the lower mold base plate 36 .
  • a combination of a servomotor and a ball screw mechanism, or a combination of an air cylinder or a hydraulic cylinder and a rod can be used.
  • a release film supply mechanism 8 supplies a release film F between the upper mold UM and the lower mold LM.
  • a resin material having properties such as heat resistance, release properties, flexibility, and extensibility is used. copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene/hexafluoropropylene copolymer), polypropylene, polystyrene, polyvinylidene chloride, and the like.
  • the release film supply mechanism 8 includes a delivery mechanism (not shown) that delivers the release film F and a recovery mechanism (not shown) that recovers the release film F.
  • the delivery mechanism can deliver the release film F before use between the upper mold UM and the lower mold LM, and the recovery mechanism can recover the used release film F used for resin molding.
  • the lower mold LM is provided with an adsorption mechanism (not shown) for adsorbing the release film F to the mold surface by means of a vacuum pump or the like.
  • the operation of the release film supply mechanism 8 is controlled by the controller 6 .
  • the resin injection mechanism 7 includes a pot block 71 formed with a pot 71a for accommodating the resin tablet T, and a transfer mechanism 72 having a plunger 72a provided in the pot 71a.
  • the pot 71a is formed of a cylindrical member 73, for example. This tubular member 73 is fitted into a through hole formed in the pot block 71 .
  • the pot block 71 is elastically supported by an elastic member 74 so as to be able to move up and down with respect to the lower die LM. That is, the pot block 71 is provided so as to be able to move up and down with respect to the lower die LM via the elastic member 74 .
  • the elastic member 74 is provided below the pot block 71 and presses the pot block 71 in a direction away from the lower die LM.
  • the upper end of the pot block 71 is formed with an overhanging portion 71A (an example of a projecting portion) that overhangs the mold surface, which is the upper surface of the lower mold LM.
  • the protruding portion 71A protrudes so as to be able to press the pot-side end portion of the opposing pre-molded substrate Sa, and a pilot pin 71Aa (an example of an insertion member), which will be described later, is formed on the lower surface.
  • a cull portion 71b, a runner 71c, and a gate 71d are formed as a resin flow path for introducing molten resin injected from the pot 71a into the upper mold cavity MCa.
  • the upper surface of the protruding portion 71A is in contact with the upper mold UM (cull block), and the lower surface thereof is formed between the mold surface of the lower mold LM.
  • the front substrate Sa is sandwiched.
  • the transfer mechanism 72 moves the plunger 72a to inject molten resin from the pot 71a into the upper mold cavity MCa while the upper mold UM and the lower mold LM are clamped.
  • the transfer mechanism 72 is provided inside the pot 71a and includes a plunger 72a for pumping the molten resin, a fixed block 72b to which the plunger 72a is fixed, and a plunger driving mechanism for moving the plunger 72a via the fixed block 72b. 72c.
  • the operation of the plunger drive mechanism 72c is controlled by the controller 6.
  • the fixed block 72b has a substantially rectangular parallelepiped shape, and a plurality of plungers 72a are fixed in a straight line on one surface (upper surface) of the rectangular shape.
  • the layout of the plurality of plungers 72a corresponds to the layout of the pots 71a, which will be described later.
  • the plurality of plungers 72a are fixed to the fixed block 72b by, for example, fixing screws.
  • the fixed block 72b may be provided with a constant pressure mechanism using an elastic member or the like for uniformizing the pressure with which each plunger 72a injects the molten resin.
  • the plunger drive mechanism 72c vertically moves the plurality of plungers 72a with respect to the plurality of pots 71a collectively by the same movement amount by vertically moving the fixed block 72b with respect to the lower die LM.
  • the plunger drive mechanism 72c of this embodiment is provided below the fixed block 72b.
  • a combination of a servomotor and a ball screw mechanism, or a combination of an air cylinder or a hydraulic cylinder and a rod can be used.
  • the upper mold UM is formed with an upper mold cavity MCa that accommodates the chip 13 of the pre-molding substrate Sa and into which molten resin is injected. Further, the upper mold UM is formed with a concave space 81 and a gate 82 connecting the cull portion 71b, the runner 71c and the gate 71d of the pot block 71 to the upper mold cavity MCa. In other words, between the upper die UM and the pot block 71, there are a cull portion 71b, a runner 71c, a gate 71d, a recessed space 81, and a gate 71b, which is a resin flow path through which the molten resin flows from the pot 71a toward the upper die cavity MCa.
  • the recessed space 81 in this embodiment forms a space for a resin pool before communicating with the upper mold cavity MCa from the gate 71d. However, this resin reservoir space may be omitted.
  • the upper mold UM is provided with a plurality of ejector pins 83 for releasing the molded substrate Sb from the upper mold UM.
  • These ejector pins 83 are provided so as to pass through the upper die UM at required locations so as to be able to move up and down with respect to the upper die UM, and are fixed to an ejector plate 84 provided above the upper die UM.
  • the ejector plate 84 is provided on the upper platen 32 and the like via an elastic member 85 and has a return pin 86 .
  • the return pins 86 come into contact with the area outside the mounting area of the pre-molded substrate Sa in the lower mold LM, whereby the ejector plate 84 rises with respect to the upper mold UM.
  • the ejector pin 83 is retracted into the mold surface of the upper mold UM when the mold is clamped.
  • the ejector plate 84 descends with respect to the upper mold UM due to the elastic force of the elastic member 85, and the ejector pins 83 eject the molded substrate Sb from the upper mold UM. Release the mold.
  • the resin flow path composed of the cull portion 71b, the runner 71c, the gate 71d, the recessed space 81 and the gate 82 is formed between the plurality of pots 71a and the upper mold cavity MCa.
  • the upper mold cavity MCa communicates with the lower mold cavity MCb through the resin flow hole provided in the pre-molding substrate Sa.
  • the pot-side end of the pre-molding substrate Sa is sandwiched between the lower surface of the projecting portion 71A of the pot block 71 and the mold surface of the lower mold LM.
  • the plunger drive mechanism 72c raises the plunger 72a to inject molten resin into the upper mold cavity MCa and the lower mold cavity MCb, thereby resin-sealing the chips 13 and the like of the pre-molding substrate Sa.
  • FIG. 3 shows a perspective view of the pot block 71 and the upper mold UM (cull block) included in the mold viewed from above.
  • FIG. 4 is a side perspective view of the pot block 71 and the lower mold LM
  • FIG. 5 is an enlarged perspective view of the pot block 71 and the lower mold LM on which the pre-molding substrate Sa is placed.
  • the mold has a mold body M, and the mold body M includes a pot block 71, a lower mold LM on which the pot block 71 can be raised and lowered, and an upper mold UM provided with a cull block. I'm in.
  • the pot block 71 of this embodiment has a plurality of pots 71a arranged in a straight line.
  • FIG. 3B shows an example in which eight pots 71a are formed in one pot block 71, the present invention is not limited to this and may be changed as appropriate.
  • a plurality of cull portions 71b are formed on the upper surface of the pot block 71 corresponding to each of the plurality of pots 71a, and a plurality of runners 71c and gates 71d are formed corresponding to each of the plurality of cull portions 71b. ing.
  • the pot block 71 has a plurality of pots 71a to which resin tablets T are supplied.
  • Each pot 71a has, in plan view, a cull portion 71b including a portion surrounding the pot 71a, runners 71c extending from the cull portion 71b and serving as a plurality of (four in the figure) branch paths, and ends of the runners 71c. It is in communication with the gate 71d.
  • Unnecessary resin remains on the cull portion 71b, the runner 71c and the gate 71d of the pot block 71 after the resin molding of the pre-molding substrate Sa. This unnecessary resin is hardened resin that remains between the upper mold UM and the resin injection mechanism 7 after resin molding, and is hardened resin that remains on the pot block 71 in this embodiment.
  • the upper die UM has a recessed space 81 partly formed in a portion facing the cull portion 71 b and the runner 71 c of the pot block 71 , and a resin reservoir in the recessed space 81 described above.
  • a gate 82 is formed at the tip of the space. As described above, the cull portion 71b, the runner 71c, the gate 71d, the recessed space 81 and the gate 82 form a resin flow path through which the molten resin flows from the pot 71a toward the upper mold cavity MCa.
  • the pot block 71 has an overhanging portion 71A projecting so as to be able to press the pot-side end portion of the pre-molding substrate Sa.
  • the protruding portion 71A in this embodiment exists continuously over the existing region of the pre-molding substrate Sa.
  • a plurality of pilot pins 71Aa are formed on the lower surface of the protruding portion 71A to be inserted into a plurality of (three in the drawing) holes H formed in the pot-side end portion of the pre-molding substrate Sa during mold clamping. ing.
  • the projecting portion 71A may be formed by being divided only at the location where the pilot pin 71Aa is provided.
  • the plurality of pilot pins 71Aa in this embodiment are provided at positions corresponding to the center hole H formed in the pot-side end portion of the pre-molding substrate Sa and the holes H provided at both ends, respectively. It is made up of one column. These pilot pins 71Aa are configured in a tapered truncated cone shape, and all have the same shape.
  • the pilot pins 71Aa may be provided corresponding to the number and positions of the holes H of the pre-molding substrate Sa, and the number and arrangement are not particularly limited. In addition, all the pilot pins 71Aa may not have the same shape, and different shapes may be mixed.
  • the pilot pin 71Aa is formed with a dimension that penetrates the hole H of the pre-molding substrate Sa, and the lower mold LM is formed with a groove 9 into which the pilot pin 71Aa is inserted.
  • the pilot pin 71Aa has a linear portion 75 on the proximal side surface and a flat surface 76 on the distal end surface. They are connected at a tapered portion 77 that narrows toward them.
  • the corners of the linear portion 75 and the flat surface 76 are preferably R-chamfered or C-chamfered so that they can be easily inserted into the hole H.
  • the tapered portion 77 allows the pre-molding substrate Sa to move in any horizontal direction such as front, back, left, and right, and the diameter and thickness are the same as those of the hole H.
  • the pre-molding substrate Sa is fixed.
  • the flat surface 76 does not damage the pre-molding substrate Sa.
  • the grooves 9 in this embodiment are three bottomed holes provided corresponding to the number and positions of the pilot pins 71Aa and the holes H of the pre-molding substrate Sa.
  • the groove 9 is provided with a taper on the side wall, the diameter of which decreases toward the bottom wall.
  • the plurality of grooves 9 provided in the lower die LM may be configured in a columnar shape without taper, may be formed in a single elongated hole shape by connecting all the grooves, or may be formed in a long hole shape by connecting several elongated holes. It may be formed in a hole shape.
  • FIG. A method for manufacturing a resin molded product (molded substrate Sb) includes a release film supply step of supplying a release film F to a lower mold LM, and a molding object supply step of supplying a pre-molding substrate Sa onto the release film F.
  • This molding process is a process in which the resin molding apparatus 30 resin molds the pre-molded substrate Sa during the period from the loading of the pre-molded substrate Sa into the molding module 3 to the unloading of the molded substrate Sb from the molding module 3 .
  • the molten resin is supplied to both surfaces of the pre-molding substrate Sa by supplying the molten resin to the upper mold cavity MCa and the lower mold cavity MCb, thereby performing double-sided molding.
  • the loader 41 is heated in advance while the housing space for the resin tablet T is insulated, and the mold main body M is also heated. Then, the pre-molded substrate Sa taken out from the substrate supply mechanism 43 is placed on the loader 41 . Also, the resin tablets T aligned by the resin supply mechanism 45 are stored in the resin tablet T storage space of the loader 41 . Then, the loader 41 conveys the pre-molding substrate Sa and the resin tablet T to the molding module 3, and stores the resin tablet T in the pot 71a of the lower mold LM. By housing the resin tablet T in the pot 71a, the heater incorporated in the lower mold LM heats the resin tablet T to become a molten resin.
  • the release film supply mechanism 8 supplies the release film F before use between the upper mold UM and the lower mold LM (see FIG. 2).
  • the mold clamping mechanism 5 whose driving force is controlled by the control unit 6 moves the lower mold LM toward the upper mold UM to bring the release film F before use into close contact with the lower mold LM.
  • the release film F is adsorbed to the mold surface of the lower mold LM by the adsorption mechanism, and the pre-molding substrate Sa is supplied onto the release film F.
  • a loader (not shown) described in Japanese Patent No. 6655148 can be used.
  • the end surface of the pre-molding substrate Sa is pressed against the side surface of the pot block 71 to position the pre-molding substrate Sa to some extent. It is difficult to position with high precision due to reasons such as surface roughness.
  • the mold clamping mechanism 5 whose driving force is controlled by the control unit 6 moves the upper mold UM and the lower mold LM closer to each other to clamp the upper mold UM and the lower mold LM.
  • the mold clamping mechanism 5 raises the lower die LM and the pot block 71 (see FIG. 6A), and when the upper surface of the pot block 71 comes into contact with the upper die UM, the pot block 71 stops rising (see FIG. 6B). .
  • the elastic member 74 see FIG. 2 is contracted and the pot block 71 is lowered relative to the lower die LM (FIGS. 6C to 6D). (see FIG.
  • the pilot pin 71Aa passes through the hole H of the pre-molding substrate Sa. 6D to 6E). At this time, the release film F comes into contact with the flat surface 76 of the pilot pin 71Aa and deforms into a locally bent state.
  • the pilot pin 71Aa is configured in a tapered truncated cone shape, when the pilot pin 71Aa is inserted into the hole H of the pre-molded substrate Sa, the tapered portion 77 of the truncated cone shape , the pre-molded substrate Sa is moved to an appropriate position, and the truncated cone-shaped linear portion 75 is fitted into the hole H of the pre-molded substrate Sa, whereby the position can be fixed.
  • the pilot pin 71Aa is formed with a dimension that penetrates the hole H, positioning can be performed even when the thickness of the pre-molded substrate Sa is thin.
  • the sidewall of the groove 9 into which the pilot pin 71Aa is inserted has a taper in which the diameter decreases toward the bottom wall, the pilot pin 71Aa does not interfere with the groove 9 .
  • the molten resin obtained by melting the resin tablet T housed in the lower mold LM is injected into the cavities MCa and MCb by the transfer mechanism 72 whose driving force is controlled by the controller 6 .
  • the pre-molding substrate Sa is molded on both sides (see FIG. 2).
  • the lower mold LM is moved downward to open the mold.
  • an operation gate breaking operation
  • the molded substrate Sb and unnecessary resin are separated.
  • the molded substrate Sb is released from the lower mold LM and the upper mold UM, and accommodated in the substrate accommodation section 46 by the unloader 42 (see FIG. 1).
  • the package substrate is cut (individualized) by a cutting device so as to remove unnecessary portions including the holes H, and formed.
  • the cut product is used as an electronic component after undergoing quality inspection.
  • the projecting portion 71A of the pot block 71 is provided with the pilot pin 71Aa to be inserted into the hole H formed in the pre-molding substrate Sa. Guided to position and positioned. As a result, when resin-molding the pre-molding substrate Sa, the filling position of the molten resin becomes accurate, and the molding accuracy is improved. Further, the pre-molded substrate Sa that is positioned accurately is pressed by the projecting portion 71A and the pilot pin 71Aa is inserted into the hole H of the pre-molded substrate Sa, so that the pre-molded substrate Sa moves under resin pressure. There is no inconvenience to do so.
  • molten resin is supplied to both sides of the pre-molding substrate Sa to perform double-sided molding.
  • the pre-molding substrate Sa is likely to move due to resin pressure.
  • the pre-molding substrate Sa moves due to resin pressure.
  • the release film F is attached to the lower mold LM. F may be adsorbed.
  • the ejector pin 83 of the above-described embodiment is not required, and a separate mechanism for supplying the release film F to the upper mold UM is preferably provided.
  • the lower mold cavity MCb is formed in the lower mold LM, but the lower mold cavity MCb may be omitted when there is no need to resin-seal the lower surface of the pre-molding substrate Sa. In this case, only one side facing the upper mold UM (the upper surface of the pre-molding substrate Sa) is resin-molded. preferable.
  • the pre-molding substrate Sa is supplied to the lower mold LM, but the pre-molding substrate Sa is supplied to the upper mold UM, and the upper surface of the projecting portion 71A of the pot block 71 and the upper mold The pre-molding substrate Sa may be sandwiched between the mold surface of the UM.
  • the pilot pin 71Aa is provided on the upper surface of the projecting portion 71A, and the groove 9 is provided in the upper mold UM.
  • the pilot pin 71Aa (another example of the insertion member) may have a cylindrical shape on the proximal end side and a conical shape on the distal end side. Even in this case, the conical tapered portion contacts the side surface of the hole H of the pre-molding substrate Sa, and the pre-molding substrate Sa can be moved to an appropriate position and fixed at the cylindrical base end portion.
  • the pilot pin 71Aa may have any shape, such as a prism shape, as long as it can be inserted into the hole H of the pre-molding substrate Sa.
  • the pilot pin 71Aa has a height dimension that passes through the hole H of the pre-molding substrate Sa. good.
  • the cull block is integrally formed with the upper die UM, but the cull block may be provided separately from the upper die UM.
  • the pot block 71 is elastically supported by the elastic member 74 so as to be movable up and down with respect to the lower mold LM.
  • a movable plate may be provided to support Sa.
  • the pot block 71 and the lower die LM are moved relatively close to each other by independently moving up the movable blocks.
  • the pilot pin 71Aa is inserted into the hole H of the pre-molded substrate Sa.
  • the pre-molding substrate Sa resin-molded by the resin molding apparatus 30 in the above-described embodiment is, for example, a semiconductor substrate (silicon wafer, etc.), a metal substrate (lead frame, etc.), a glass substrate, a ceramic It is a substrate, a resin substrate, or a wiring substrate.
  • the characteristic configuration of the molding die is that it has a cavity (upper mold cavity MCa) that holds a molding object (pre-molding substrate Sa) and is supplied with a resin material (molten resin obtained by melting the resin tablet T).
  • the mold body M comprises a pot block 71 having a pot 71a to which a resin material (resin tablet T) is supplied, and a resin material (molten resin) flowing from the pot 71a toward the cavity (upper mold cavity MCa).
  • a cull block (upper mold UM) that forms a resin flow path (cull portion 71b, runner 71c, gate 71d, concave space 81 and gate 82) for flowing the resin between the pot block 71 and the pot block 71 has a protruding portion (protruding portion 71A) that protrudes in a state capable of pressing the molding object (pre-molding substrate Sa).
  • Sa is formed with an insertion member (pilot pin 71Aa) to be inserted into the hole H formed in the hole H.
  • the projecting portion 71A of the pot block 71 is provided with a pilot pin 71Aa that is inserted into the hole H formed in the pre-molding substrate Sa.
  • the pre-molding substrate Sa is guided and positioned at an appropriate position with respect to the mold main body M (lower mold LM).
  • the pre-molded substrate Sa that is positioned accurately is pressed by the projecting portion 71A and the pilot pin 71Aa is inserted into the hole H of the pre-molded substrate Sa, so that the pre-molded substrate Sa moves under resin pressure. There is no inconvenience to do so.
  • the insertion member (pilot pin 71Aa) may be configured in a tapered truncated cone shape.
  • pilot pin 71Aa is configured to have a tapered truncated cone shape as in this configuration, when the pilot pin 71Aa is inserted into the hole H of the pre-molded substrate Sa, the tapered portion 77 of the truncated cone shape comes into contact with the side surface of the hole H. By doing so, the pre-molding substrate Sa can be moved to an appropriate position.
  • the insertion member (pilot pin 71Aa) is formed with a dimension that penetrates the hole H, and the mold main body M (lower mold LM) is formed with a groove 9 into which the insertion member (pilot pin 71Aa) is inserted. It's okay to be.
  • the pilot pin 71Aa is formed with a dimension that penetrates the hole H, positioning can be performed even when the pre-molding substrate Sa is thin. Moreover, if the groove 9 into which the pilot pin 71Aa is inserted is provided in the lower die LM, the pilot pin 71Aa does not need to be a movable member that can move back and forth, and the manufacturing cost can be reduced.
  • the characteristic configuration of the resin molding apparatus 30 includes any one of the above-described molding die (1) to (3) and a molding die main body M (lower mold LM) to which a molding object (pre-molding substrate Sa) is supplied.
  • a release film supply mechanism 8 that supplies the release film F to the mold surface of the mold, and a mold clamping mechanism 5 that clamps the mold.
  • the mold surface of the lower mold LM to which the pre-molding substrate Sa is supplied is A release film F can be supplied. As a result, it is possible to prevent the mold main body M from being soiled during resin molding.
  • the method for manufacturing a resin molded product (molded substrate Sb) using the resin molding apparatus 30 described in (4) is characterized in that the release film F is supplied to the mold main body M (lower mold LM).
  • the insertion member (pilot pin 71Aa) is inserted into the hole H of the pre-molding substrate Sa to position the molding object (pre-molding substrate Sa), and the mold is clamped by the mold clamping mechanism 5.
  • This method includes a positioning step in which the pot block 71 and the lower die LM are moved relatively close to each other to insert the pilot pins 71Aa into the holes H of the pre-molded substrate Sa to position the pre-molded substrate Sa. Therefore, when the pre-molding substrate Sa is resin-molded in the molding process, the filling position of the molten resin becomes accurate, and the molding accuracy is improved.
  • the resin material (molten resin) may be supplied to both surfaces of the object to be molded (pre-molding substrate Sa) to perform double-sided molding.
  • the resin material is supplied to both sides of the pre-molding substrate Sa in the molding process to perform double-sided molding.
  • the pre-molding substrate Sa is likely to move due to resin pressure.
  • the pre-molding substrate Sa moves due to resin pressure.
  • the present disclosure can be used for a mold, a resin molding apparatus, and a method for manufacturing a resin molded product.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne une matrice de moulage comprenant un corps de matrice de moulage comportant une cavité MCa qui contient un objet Sa à mouler et à laquelle une matière de résine T est apportée, le corps de matrice de moulage comprenant un bloc pot (71) comportant un pot (71a) auquel la matière de résine T est apportée et un bloc culot UM qui forme des passages d'écoulement de résine (71b, 71d, 81, 82), qui amènent la matière de résine T à s'écouler du pot (71a) vers la cavité MCa, entre le bloc pot (71) et le bloc culot ; le bloc pot (71) a une partie en saillie (71A) faisant saillie dans un état dans lequel l'objet Sa à mouler peut être poussé ; et un élément d'introduction (71Aa) introduit dans un trou H formé dans l'objet Sa à mouler étant formé dans la partie en saillie (71A).
PCT/JP2021/046086 2021-04-21 2021-12-14 Matrice de moulage, dispositif de moulage de résine et procédé pour la fabrication d'un article moulé en résine WO2022224487A1 (fr)

Priority Applications (2)

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KR1020237031755A KR20230145466A (ko) 2021-04-21 2021-12-14 성형몰드, 수지 성형 장치 및 수지 성형품의 제조 방법
CN202180097206.9A CN117177853A (zh) 2021-04-21 2021-12-14 成型模具、树脂成型装置以及树脂成型品的制造方法

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JP2021071908A JP7447050B2 (ja) 2021-04-21 2021-04-21 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP2021-071908 2021-04-21

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08142107A (ja) * 1994-11-21 1996-06-04 Apic Yamada Kk 樹脂モールド装置及び樹脂モールド用リリースフィルム
JP2019034445A (ja) * 2017-08-10 2019-03-07 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP2020064919A (ja) * 2018-10-16 2020-04-23 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、搬送方法、及び樹脂成形品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3244519B2 (ja) 1991-08-26 2002-01-07 昭和電工株式会社 アクリル官能性メチルフルオロアルキルシルセスキオキサン化合物
JP2000043096A (ja) 1998-07-28 2000-02-15 Sony Corp 樹脂封止装置
JP6058431B2 (ja) * 2013-03-08 2017-01-11 アピックヤマダ株式会社 樹脂モールド装置、および樹脂モールド方法
JP6244229B2 (ja) 2014-03-07 2017-12-06 株式会社日立製作所 荷電粒子ビーム照射システム、シンクロトロンおよびそのビーム出射方法
JP6298719B2 (ja) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP7102238B2 (ja) 2018-06-08 2022-07-19 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法
JP6981935B2 (ja) 2018-08-23 2021-12-17 アピックヤマダ株式会社 モールド金型及びそれを備えた樹脂モールド装置
JP7160770B2 (ja) 2019-07-22 2022-10-25 アピックヤマダ株式会社 樹脂モールド装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08142107A (ja) * 1994-11-21 1996-06-04 Apic Yamada Kk 樹脂モールド装置及び樹脂モールド用リリースフィルム
JP2019034445A (ja) * 2017-08-10 2019-03-07 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP2020064919A (ja) * 2018-10-16 2020-04-23 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、搬送方法、及び樹脂成形品の製造方法

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JP2022166592A (ja) 2022-11-02
JP7447050B2 (ja) 2024-03-11
CN117177853A (zh) 2023-12-05
TW202241686A (zh) 2022-11-01
TWI802220B (zh) 2023-05-11

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