WO2024014060A1 - Moule, dispositif de moulage de résine et méthode de production d'article en résine moulé - Google Patents

Moule, dispositif de moulage de résine et méthode de production d'article en résine moulé Download PDF

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Publication number
WO2024014060A1
WO2024014060A1 PCT/JP2023/010929 JP2023010929W WO2024014060A1 WO 2024014060 A1 WO2024014060 A1 WO 2024014060A1 JP 2023010929 W JP2023010929 W JP 2023010929W WO 2024014060 A1 WO2024014060 A1 WO 2024014060A1
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Prior art keywords
resin
mold
block
molding
elastic member
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PCT/JP2023/010929
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English (en)
Japanese (ja)
Inventor
諸橋信行
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Ｔｏｗａ株式会社
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Publication of WO2024014060A1 publication Critical patent/WO2024014060A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Definitions

  • the present disclosure relates to a mold, a resin molding device, and a method for manufacturing a resin molded product.
  • a substrate or the like on which a semiconductor chip is fixed is generally used as an electronic component by being sealed with resin.
  • resin molding apparatus for resin-sealing a substrate, etc. there has been known one equipped with a mold for transfer molding for manufacturing semiconductor packages such as MAP (molded array packaging) (for example, Patent Document 1 reference).
  • MAP molded array packaging
  • an air vent block is used to close the air vent groove. It is described that this prevents the resin material from being unfilled due to air remaining in the cavity, and also prevents the resin material from flowing out of the mold. Furthermore, as a countermeasure against variations in the thickness of the substrate, it is described that an elastic member is used for the lower mold cavity block and a floating pin is used for the upper mold cavity block, so that the cavity block has a floating structure.
  • the pressing force acting on the substrate during resin molding be small.
  • the elastic force of the elastic member and the pressing force of the floating pin are maximized to prevent burrs from flowing between the lower mold cavity block and the upper mold cavity block before flowing the resin material into the cavity. It is necessary to press down the floating part of the mold cavity block. As a result, a large press is required for resin molding, and an unnecessarily excessive pressing force is applied to the board during resin molding, which causes the air vent groove to collapse and air to remain in the cavity without being sufficiently exhausted. voids may occur or the entire cavity may not be filled with the resin material.
  • a characteristic configuration of the molding die according to the present disclosure includes a lower mold cavity block on which a molding object is placed, a lower mold including a pot block in which a pot filled with the resin material is formed, and a cavity and an air vent groove.
  • an upper mold cavity block having an upper mold cavity block, an upper mold including a cull block disposed above the pot block and movable up and down independently of the upper mold cavity block, and pressing the lower mold cavity block toward the upper mold.
  • a first elastic member presses the upper die cavity block and the cull block, and presses a plurality of elastically deformable supporting members and the cull block to move the cull block below the lower surface of the upper die cavity block. and a second elastic member capable of protruding the block.
  • a characteristic configuration of the resin molding apparatus according to the present disclosure is that it includes the mold described above and a mold clamping mechanism that clamps the mold.
  • a feature of the method for manufacturing a resin molded product according to the present disclosure is a method for manufacturing a resin molded product using the resin molding apparatus described above, comprising: supplying the molding object and the resin material to the mold; and the second elastic member is elastically deformed by the first mold clamping force to bring the cull block and the pot block into contact, and to bring the lower surface of the upper mold cavity block into contact with the upper surface of the molding object.
  • a mold, a resin molding device, and a method for manufacturing a resin molded product that can stably manufacture a resin molded product by reducing the pressing force that acts on a substrate during resin molding. I can do it.
  • FIG. 1 is a schematic diagram showing a resin molding apparatus according to the present embodiment.
  • FIG. 2 is a schematic diagram showing a mold clamping mechanism of the resin molding apparatus.
  • FIG. 2 is a schematic diagram showing a molding process including a mold clamping process.
  • 1 is a graph showing the relationship between the molding time, the position of the transfer mechanism, the mold clamping force, and the supply pressure of molten resin in the molding process.
  • a molded object such as a substrate on which a semiconductor chip (hereinafter sometimes simply referred to as a "chip”) is fixed is used as an electronic component by being sealed with a resin.
  • This electronic component is used, for example, as a high frequency module board for mobile communication terminals, a power control module board, a device control board, and the like.
  • As one of the techniques for resin-sealing a molded object there is a transfer method in which a BGA (Ball Grid Array) substrate or the like is sealed with resin to manufacture a semiconductor package.
  • a substrate on which a chip is fixed is placed in a cavity of a mold, a resin tablet made of solidified powder resin is supplied to a pot of the mold, heated and melted, and then the mold is removed.
  • a molten resin made from a resin tablet is supplied into a cavity while the mold is closed, hardened, and then the mold is opened to produce a resin molded product.
  • Powder-like resin includes not only powder-like resin but also resin tablets made of solid resin made by compacting powder-like resin, both of which can be melted by heating and turned into liquid. becomes molten resin.
  • This powdery resin may be a thermoplastic resin or a thermosetting resin. When a thermosetting resin is heated, its viscosity decreases, and when it is further heated, it polymerizes and hardens to become a cured resin.
  • the powdery resin in this embodiment is preferably a resin tablet made of solid resin for ease of handling.Furthermore, in order to reliably fill the gap between the chip and the substrate with molten resin, a finely divided filler is used.
  • a highly fluid thermosetting resin containing the following is preferable.
  • FIG. 1 shows a schematic configuration of a resin molding apparatus 100 according to the present embodiment.
  • the resin molding apparatus 100 is an apparatus that uses a mold C to mold a resin-molded substrate Sa (an example of a molding object) with a resin.
  • the substrate Sa before resin molding has a rectangular shape, and a semiconductor chip is fixed in advance.
  • the resin molding apparatus 100 includes a CPU 1 as a central control device, a storage unit 8 that stores control information such as control programs, a molding mechanism 2 that has a mold C, a drive mechanism that drives each part described below, and an operation command from a user.
  • a touch panel 9 is provided that accepts input of information related to processing and abnormality processing, and displays various output information of the resin molding apparatus 100.
  • the CPU 1 constitutes a control section 10 that controls the operation of each section of the resin molding apparatus 100 by executing programs stored in the storage section 8 .
  • the resin molding apparatus 100 includes a supply module M1 having an in-magazine 7 for accommodating a plurality of pre-resin molding substrates Sa, a molding module M2 having a mold C, and a resin molding module M2 having a mold C, and a resin after the pre-resin molding substrates Sa are molded with resin.
  • Each module of the storage module M3 having an out magazine 72 for storing the molded substrate Sb (an example of a resin molded product) is connected in this order as an integrated device.
  • the supply module M1, the molding module M2, and the accommodation module M3 are provided with a guide G arranged linearly across each of these modules.
  • the guide G is a rail-shaped member on which a loader 40 and an unloader 44, which will be described later, travel.
  • the guide G is arranged on the back side of each module.
  • Each module is configured to be detachable from each other and can be increased or decreased.
  • the resin molding apparatus 100 of this embodiment has two molding modules M2.
  • the resin molding apparatus 100 may have only one molding module M2, or may have three or more molding modules M2.
  • the drive mechanism includes a loader 40, a substrate supply unit 42, an unloader 44, a mold clamping mechanism 35, and a transfer mechanism 39 (see FIG. 2), which will be described later.
  • the loader 40 is a transport mechanism that carries the substrate Sa before resin molding into the mold C.
  • the substrate supply unit 42 is a transport mechanism that pushes out the resin-molded substrate Sa from the in-magazine 7 and delivers it to the alignment mechanism 70.
  • the unloader 44 is a transport mechanism that transports the resin-molded substrate Sb from the mold C.
  • the transfer mechanism is a mechanism for supplying a melted resin from a resin tablet T (an example of a resin material) from a pot to a cavity in the mold C.
  • the mold clamping mechanism 35 is a mechanism for clamping the mold C.
  • the transfer mechanism 39 is driven independently of the mold clamping mechanism 35.
  • the loader 40, substrate supply unit 42, and unloader 44 each have an actuator 40b, an actuator 42b, and an actuator 44b.
  • the actuator 40b, the actuator 42b, and the actuator 44b are air cylinders depending on the respective installation locations and distances to drive each part.
  • the substrate supply unit 42 is a mechanism that pushes out the resin-molded substrates Sa one by one from the in-magazine 7, which is a storage container that accommodates a plurality of resin-molded substrates Sa at intervals in the vertical direction, and conveys them to the alignment mechanism 70. be.
  • the substrate supply unit 42 has an actuator 42b. In this embodiment, the substrate supply unit 42 uses the actuator 42b to push out the resin-molded substrate Sa from the in-magazine 7 and move it to the alignment mechanism 70 arranged adjacent to the in-magazine 7.
  • the alignment mechanism 70 has a rotating disk 70a, and when the substrate Sa to be resin molded is placed, the rotating disk 70a is rotated so that it is in a state suitable for picking up the substrate Sa to be resin molded by the loader 40. , align the substrates Sa before resin molding.
  • the substrate supply unit 42, the in-magazine 7, and the alignment mechanism 70 are provided in the supply module M1.
  • the substrate supply unit 42, the in-magazine 7, and the alignment mechanism 70 are arranged on the front side of the guide G in the supply module M1.
  • the loader 40 is a transport mechanism that carries the substrate Sa before resin molding into the mold C.
  • the loader 40 is movable along the guide G from the supply module M1 to the forming module M2.
  • the loader 40 has a loader pickup section 40a that picks up the substrate Sa before resin molding and the resin tablet T.
  • the loader pickup section 40a includes a plurality of pairs of claws (not shown) that extend downward.
  • the loader pickup section 40a drives the pair of claws by an actuator (not shown) to pick up the resin-molded substrate Sa from the alignment mechanism 70, transports it to the lower mold LM of the mold C, and places it on the lower mold LM (carry-in do).
  • an actuator not shown
  • pick-up the picking-up operation by the loader pickup section 40a will be simply referred to as "pick-up.”
  • the loader pickup section 40a also picks up the resin tablet T from the resin supply device 79 by driving a resin material holding claw using another actuator (not shown).
  • the resin tablet T is also picked up in the same manner as the resin-molded substrate Sa. However, in this embodiment, one resin tablet T is picked up for each nail.
  • the loader pickup section 40a can be moved back and forth from the back side to the front side in FIG. 1 by an actuator 40b.
  • the loader 40 moves the loader pickup section 40a forward and backward to pick up the resin-molded substrate Sa from the alignment mechanism 70, moves from the supply module M1 to the molding module M2, and carries the resin-molded substrate Sa into the mold C. do.
  • the loader 40 moves the loader pickup section 40a forward and backward to pick up the resin tablet T from the resin supply device 79, moves from the supply module M1 to the molding module M2, and carries the resin tablet T into the mold C.
  • the unloader 44 is a transport mechanism that transports the resin-molded substrate Sb from the mold C.
  • the unloader 44 is movable along the guide G from the molding module M2 to the storage module M3.
  • the unloader 44 has an unloader pickup section 44a that picks up resin-molded substrates Sb and the like.
  • the unloader pickup section 44a can be moved back and forth from the back side to the front side in FIG. 1 by an actuator 44b.
  • the unloader 44 moves the unloader pickup section 44a forward and backward to pick up the resin-molded substrate Sb from the lower mold LM of the mold C, moves from the molding module M2 to the accommodation module M3, and accommodates the resin-molded substrate Sb. It is carried into the gate break mechanism 71 of module M3.
  • the unloader 44 transports the resin-molded substrate Sb from which unnecessary resin portions have been removed by the gate break mechanism 71 to the out magazine 72 and stores it therein.
  • the unloader pickup section 44a includes a plurality of pairs of claws (not shown) that extend downward.
  • the pickup of the unloader pickup section 44a is performed in the same manner as the pickup of the loader pickup section 40a.
  • the molding module M2 has tie bars 32 erected at the four corners of a lower fixed plate 31 that is rectangular in plan view, and an upper fixed plate 33 that is rectangular in plan view near the upper end of the tie bar 32. It is provided.
  • a movable platen 34 having a rectangular shape in plan view is provided between the lower fixed platen 31 and the upper fixed platen 33.
  • the movable platen 34 has holes at its four corners through which the tie bars 32 pass, and is movable up and down along the tie bars 32.
  • a mold clamping mechanism 35 which is a device for moving the movable platen 34 up and down, is provided above the lower fixed platen 31.
  • the mold clamping mechanism 35 includes an electric motor Ma composed of a servo motor or the like as a driving source, and a strain gauge, a load cell, etc. for measuring the mold clamping force (hereinafter referred to as "clamping force") of the mold C. It includes a load sensor Wa configured.
  • the mold clamping mechanism 35 can clamp the mold C by moving the movable platen 34 upward, and can open the mold C by moving the movable platen 34 downward.
  • the mold C includes a lower mold LM and an upper mold UM.
  • the lower mold LM and the upper mold UM are composed of molds and the like that are arranged opposite to each other.
  • the lower die LM is placed on a lower die plate 38 placed on the movable platen 34.
  • the lower mold LM includes a base block 51, a side block 52 placed on the base block 51, a lower mold cavity block 53, and a pot block 54.
  • the side block 52 is attached to the base block 51.
  • a first elastic member 55 is arranged between the base block 51 and the lower mold cavity block 53, and the first elastic member 55 is arranged so that the lower mold cavity block 53 is positioned above the upper mold UM with respect to the base block 51. It's pushing towards me.
  • An example of the first elastic member 55 is one in which a plurality of disc springs are laminated.
  • the lower mold cavity block 53 is configured to be movable vertically relative to the base block 51 and the side blocks 52 by elastically deforming the first elastic member 55. That is, the lower mold LM has a floating structure in which the lower mold cavity block 53 is movable in the vertical direction.
  • the elastic force of the first elastic member 55 is set so that it starts elastic deformation before the floating pin 63, which will be described later, when the mold is clamped.
  • the upper surface of the lower mold cavity block 53 and the upper surface 58 of the side block 52 are flush with each other in the lower mold LM.
  • the substrate Sa before resin molding is placed on the upper surface of the lower mold cavity block 53 with the surface on which the semiconductor chip Sc etc. are fixed facing upward.
  • the lower mold cavity block 53 has a built-in lower mold heater 36 that heats the substrate Sa before resin molding and the resin tablet T.
  • the lower mold LM has two lower mold cavity blocks 53, 53, and a pot block 54 is arranged at a position sandwiched between the two lower mold cavity blocks 53, 53.
  • a pot 54b which is a cylindrical recess, is formed in the pot block 54, and the inside of the pot 54b is filled with resin tablets T (resin that melts when heated).
  • a plunger 54a driven by an electric motor Mb such as a servo motor is inserted below the pot block 54 so as to be movable up and down.
  • An elastic member (not shown) is provided at the support portion of the plunger 54a, and the plunger 54a is slightly displaced by the elastic force of the elastic member to release excessive pressing force, and when the resin tablet T is melted during pressure retention. It is now possible to adapt to variations in the amount of resin.
  • the lower die LM has a load sensor Wb composed of a strain gauge, a load cell, etc. for measuring the force with which the plunger 54a pushes out the molten resin Ta (an example of a resin material).
  • the upper mold UM is arranged facing the lower mold LM.
  • the upper mold UM includes a holder base 61 fixed to the lower surface of the upper fixed platen 33, a pin holder 62 fixed to the lower surface of the holder base 61, and a plurality of floating pins 63 (an example of a support member) connected to the pin holder 62. It has a supported upper mold cavity block 64 and a cull block 65.
  • the plurality of floating pins 63 are each inserted into a plurality of through holes formed in the pin holder 62, and the upper and lower ends are not fixed to the holder base 61, the upper mold cavity block 64, and the cull block 65.
  • the length of the floating pin 63 arranged above the cull block 65 is the same as the length of the floating pin 63 arranged above the upper mold cavity block 64.
  • the cull block 65 is further supported by the holder base 61 via the second elastic member 66 so that its lower surface 69 protrudes below the lower surface 68 of the upper mold cavity block 64.
  • the other end of the floating pin 63 placed on the cull block 65 held by the pin holder 62 is spaced apart from the holder base 61.
  • the upper mold cavity block 64 and the cull block 65 are spaced apart from the pin holder 62.
  • a cavity MC which is a recess into which molten resin Ta is supplied, is formed in the lower surface 68 of the upper mold cavity block 64.
  • the upper mold cavity block 64 has a built-in upper mold heater 37 that heats the cavity MC. There is.
  • the upper mold cavity block 64 faces the lower mold cavity block 53 and the side blocks 52.
  • the upper mold UM has two upper mold cavity blocks 64, 64, and a cull block 65 is arranged at a position sandwiched between the two upper mold cavity blocks 64, 64.
  • the cull block 65 has a runner 65a that causes the molten resin Ta to flow from the pot 54b of the pot block 54 toward the cavity MC. That is, the cull block 65 is arranged above the pot block 54.
  • the upper mold cavity block 64 and the cull block 65 are configured as separate members, and the cull block 65 is configured to be movable up and down (movable in the vertical direction) independently of the upper mold cavity block 64.
  • the cull block 65 is provided with a gate 65b, which is an entrance through which the molten resin Ta flows from the runner 65a into the cavity MC.
  • the cull block 65 is supported by the holder base 61 via a second elastic member 66 whose one end is fixed to the holder base 61.
  • the cull block 65 is configured such that the lower surface 69 of the cull block 65 protrudes below the lower surface 68 of the upper mold cavity block 64 by the second elastic member 66 before the mold C is clamped.
  • An example of the second elastic member 66 is one in which a plurality of disc springs are laminated. The elastic force of the second elastic member 66 is set so that it starts elastic deformation before the first elastic member 55 when the mold is clamped.
  • An air vent groove 64a for discharging air from the cavity MC to the outside of the upper mold UM is formed on the lower surface 68 of the upper mold cavity block 64 at a location spaced apart from the gate 65b.
  • the air vent groove 64a is configured to be opened and closed by an air vent block 67.
  • One end of the air vent block 67 is attached to the pin holder 62, and the air vent block 67 is inserted into a through hole formed in the upper die cavity block 64 so as to be located in the middle of the air vent groove 64a when moving forward.
  • the lower end of the air vent block 67 is set to be above the lower surface 68 of the upper mold cavity block 64 before the mold C is clamped.
  • the inside of the cavity MC is operated by operating a pump (not shown).
  • the air in the cavity MC can be discharged to the outside of the upper mold UM, and when the air vent block 67 advances (moves downward) to close the air vent groove 64a, the air in the cavity MC (and the molten resin Ta) can be discharged to the outside of the upper mold UM. It becomes impossible to eject.
  • the air vent block 67 Since the air vent block 67 according to this embodiment has one end attached to the pin holder 62, when the floating pin 63 is compressed by mold clamping by the mold clamping mechanism 35, the air vent block 67 is attached to the upper mold cavity block 64. It can be moved relatively forward (moved downward). Therefore, a special drive mechanism for advancing and retracting the air vent block 67 is not required, and the configuration of the mold C can be simplified and the mold C can be constructed at low cost.
  • the manufacturing method of the resin molded product includes a supply step of supplying the resin molded substrate Sa and the resin tablet T to the mold C, a mold clamping step of clamping the mold C, and a gate 65b.
  • the method includes a molding step of resin molding the substrate Sa before resin molding by filling the supplied molten resin Ta into the cavity MC.
  • This molding process is a process in which the molding module M2 resin-moldes the pre-resin-molded substrate Sa between the time when the pre-resin-molded substrate Sa is carried into the molding module M2 and the resin-molded substrate Sb is taken out from the molded module M2.
  • the molding process includes a mold clamping process. The operation of the mold C and the mold clamping mechanism 35 in the molding process is controlled by the control unit 10.
  • the loader 40 is heated in advance with the housing space for the resin tablets T being insulated. Further, the heaters 36 and 37 are energized to heat the mold C in advance (see also FIG. 2). Then, the plurality of resin-molded substrates Sa taken out from the in-magazine 7 are placed on the alignment mechanism 70.
  • the alignment mechanism 70 has a rotating disk 70a, and when the substrate Sa to be resin molded is placed, the rotating disk 70a is rotated so that it is in a state suitable for picking up the substrate Sa to be resin molded by the loader 40. The substrates Sa before resin molding are aligned.
  • the loader pickup section 40a picks up the resin-molded substrate Sa from the alignment mechanism 70 using the actuator 40b and places it on the loader 40, and also picks up the resin tablet T from the resin supply device 79 and places it in the storage space of the resin tablet T of the loader 40. accommodate. Then, the loader 40 transports the resin-molded substrate Sa to the molding module M2, and places the resin-molded substrate Sa with the side on which the semiconductor chip Sc is fixed facing upward on the substrate setting part of the lower mold LM. , the resin tablet T is housed in the pot 54b of the pot block 54 (see FIG. 2).
  • the lower mold heater 36 built in the lower mold LM heats the resin tablet T and turns it into molten resin Ta. Note that, before the movable platen 34 is raised by the mold clamping mechanism 35, which will be described later, a release film (not shown) is adsorbed onto the lower surface 68 of the upper mold cavity block 64 of the upper mold UM.
  • the molding process including the mold clamping process will be explained.
  • the movable platen 34 is moved upward by the mold clamping mechanism 35 to relatively move the lower mold LM in the direction of the upper mold UM, as shown in FIG. 3(A).
  • the pot block 54 and the cull block 65 are brought into contact.
  • the upper surface 56 of the resin-molded substrate Sa placed on the lower mold LM is not in contact with the lower surface 68 of the upper mold cavity block 64.
  • Figure 4 shows a graph (A) in which the horizontal axis shows the molding time for manufacturing a resin molded product and the vertical axis shows the position of the transfer mechanism.
  • the horizontal axis shows the molding time
  • the vertical axis shows the clamping force ( B)
  • a graph (C) in which the horizontal axis represents the molding time and the vertical axis represents the supply pressure of the molten resin Ta to the cavity MC. That is, the items on the horizontal axes of graphs (A), (B), and (C) in FIG. 4 are common, and the items on the vertical axes are different.
  • the position of the transfer mechanism is set to zero (reference position) in the state shown in FIG. 3(A). The state shown in FIG.
  • FIG. 3(A) is indicated by time (a) in graphs (A), (B), and (C) of FIG. 4. That is, at time (a), graph (A) shows that the transfer mechanism has not moved upward from the reference position, and graph (B) shows that mold clamping force due to the elastic force of the second elastic member 66 is not yet generated. First, it can be seen from graph (C) that the supply pressure is zero because the supply of molten resin Ta has not yet started.
  • the mold clamping state shown in FIG. 3(A) will be referred to as a first mold clamping state. Note that each time (timing) from time (a) to time (e) shown in FIG. 4 is set in advance by the control unit.
  • first mold clamping force mold clamping force
  • FIG. 3(B) shows a state in which the molten resin Ta is supplied with the positional relationship between the lower mold LM and the upper mold UM as described above.
  • a pump (not shown) discharges the air in the cavity MC from the air vent groove 64a to the outside of the upper mold UM, and an electric motor Mb moves the plunger 54a upward to remove the molten resin Ta. , from the pot 54b through the runner 65a of the cull block 65 to the gate 65b.
  • supply of molten resin Ta to cavity MC is started.
  • the start of this supply is indicated by time (b) in graphs (A), (B), and (C) of FIG. That is, at time (b), the transfer mechanism including the plunger 54a starts to move upward from graph (A), and from graph (B), the first mold clamping force is maintained after time (a) has elapsed.
  • the movable platen is further moved upward by the mold clamping mechanism to mold the mold. Increase the tightening force (see graph (B) in Figure 4).
  • the first elastic member 55 is elastically deformed, and as shown in FIG. 3(C), the side block 52 of the lower mold LM and the upper mold cavity block 64 of the upper mold UM come into contact with each other, resulting in resin molding.
  • the upper surface 56 of the front substrate Sa is flush with the upper surface 58 of the side block 52 and the upper surface 57 of the pot block 54.
  • the floating pin 63 is elastically deformed, and when the compression amount reaches the maximum, the pin holder 62 and the upper die cavity block 64 comes into contact. As a result, the air vent block 67 closes the air vent groove 64a, as shown in FIG. 3(C). As a result, the air in the cavity MC cannot be discharged to the outside, but since the cavity MC is almost filled with molten resin Ta and there is almost no air left, there is a risk that voids will occur after the molten resin Ta hardens. That's not it.
  • the mold clamping state at this time will be referred to as a third mold clamping state, and the mold clamping force will be referred to as a second mold clamping force.
  • the compression caused by the elastic deformation of the floating pin 63 in FIGS. 3(B) to 3(C) is exaggerated.
  • the actual amount of compression of the floating pin 63 is small.
  • the control unit 10 opens the mold C by lowering the clamping force of the mold clamping mechanism to move the movable platen downward. Then, the resin-molded substrate Sb is released from the cavity MC, and the resin molding is completed.
  • the resin-molded substrate Sb is picked up by the unloader pickup section 44a of the unloader 44, and the resin-molded substrate Sb is moved by the unloader 44 from the molding module M2 to the storage module M3. Then, after removing unnecessary resin parts from the resin-molded substrate Sb by the gate break mechanism 71, it is stored in the out magazine 72 (see FIG. 1).
  • the second elastic member 66 by elastically deforming the second elastic member 66, the upper surface 56 of the resin-molded substrate Sa and the lower surface 68 of the upper mold cavity block 64 are brought into contact, and the first elastic member 55 and the floating pin 63 are
  • the resin supply can be started with no elastic force acting on the pre-resin molding substrate Sa and the upper mold cavity block 64, or with only a slight elastic force acting thereon.
  • a large mold clamping force (pressing force) sufficient to elastically deform the first elastic member 55 was applied to the substrate before resin molding.
  • the second elastic member 66 is set to start elastic deformation before the first elastic member 55, that is, the elastic modulus of the second elastic member 66 is the same as that of the first elastic member 55. Since it is set smaller than the coefficient, it is possible to reduce the pressing force that acts on the substrate during resin molding.
  • the first elastic member 55 and the floating pin 63 are elastically deformed immediately before the filling of the molten resin Ta into the cavity MC is completed, and the upper surface 56 of the substrate Sa before resin molding and the side block 52 are first The upper surface 58 and the upper surface 57 of the pot block 54 are flush with each other, and immediately thereafter, the floating pin 63 is completely elastically deformed, and the air vent groove 64a is closed by the air vent block 67.
  • the first elastic member 55 applies the elastic force that causes the floating pin 63 to start elastic deformation. It was necessary to set it considerably larger than the elastic force that causes deformation.
  • most of the cavity MC can be filled with resin with a mold clamping force smaller than that of the conventional mold clamping force (in this embodiment, the first mold clamping force). It is not necessary to set the elastic force for starting the elastic deformation to be large as in the conventional case, and the final mold clamping force (in this embodiment, the second mold clamping force) can also be set smaller than in the conventional case. As a result, the pressing force acting on the substrate during resin molding can be reduced.
  • the powdered resin of the resin tablet T is a highly fluid thermosetting resin containing a filler, but it does not need to be highly fluid. Further, it is not necessary to contain filler.
  • both the first elastic member 55 and the second elastic member 66 are exemplified as laminated disc springs, but the present invention is not limited to this. Any elastic member can be used, such as a compression coil spring.
  • the substrate Sa before resin molding has a rectangular shape, but it is not limited to this.
  • a substrate of any shape such as a circular substrate, can be used.
  • the size of the substrate is not limited either.
  • the cavity MC of the upper mold cavity block 64 becomes larger, and the area other than the cavity MC of the upper mold cavity block 64 that contacts the upper surface 56 of the substrate Sa before resin molding becomes relatively large. becomes smaller.
  • the pressure acting on the upper surface 56 of the pre-resin-molding substrate Sa due to the mold clamping force becomes larger compared to the case where the upper mold cavity block 64 with a small cavity MC is used.
  • the mold clamping force in which only the second elastic member 66 exerts the elastic force when supplying the molten resin Ta is Even if the size of the substrate Sa before resin molding is large, it is possible to prevent excessive pressing force from acting on the substrate Sa before resin molding.
  • the time (c) time
  • the mold clamping force may be controlled to be changed based on the resin pressure of the molten resin Ta measured by the load sensor Wb. Further, the mold clamping force may be controlled to be changed based on the position of the transfer mechanism 39 (the position of the plunger 54a) shown in graph (A) of FIG. 4.
  • the cull block 65 was disposed only on the upper mold UM, but the present invention is not limited to this.
  • the cull blocks may be arranged separately in the upper mold UM and the lower mold LM.
  • Characteristic configuration of the mold C includes a lower mold cavity block 53 on which the molding object (substrate Sa before resin molding) is placed, and a pot 54b filled with resin material (resin tablet T, molten resin Ta).
  • a lower mold LM including a pot block 54 formed therein; an upper mold cavity block 64 having a cavity MC and an air vent groove 64a;
  • the upper mold UM including the cull block 65, the first elastic member 55 that presses the lower mold cavity block 53 toward the upper mold UM, and the plurality of elastically deformable members that press the upper mold cavity block 64 and the cull block 65. (floating pin 63); and a second elastic member 66 capable of pressing the cull block 65 and protruding the cull block 65 below the lower surface of the upper mold cavity block 64. .
  • the cull block 65 is caused to protrude below the lower surface 68 of the upper mold cavity block 64 by the second elastic member 66 before the mold is clamped, that is, in a state in which the mold is not clamped. In this way, the cull block 65 is pressed. As a result, during mold clamping, the cull block 65 comes into contact with the pot block 54 of the lower mold LM before the upper mold cavity block 64. Thereafter, the upper mold cavity block 64 and the upper surface 56 of the molding object (substrate Sa before resin molding) come into contact with each other due to the deformation of the second elastic member 66, and thereby the resin material (molten resin Ta) can be supplied to the cavity MC. Therefore, it is possible to prevent excessive pressing force from acting on the molding object (substrate Sa before resin molding) during mold clamping (resin molding).
  • the first elastic member 55 starts elastic deformation before the plurality of support members (floating pins 63) during mold clamping. 55 elastic forces may be set.
  • the second elastic member 66 starts elastic deformation before the first elastic member 55 during mold clamping. 66 elastic forces may be set.
  • a characteristic configuration of the resin molding apparatus 100 is that it includes the mold C described in any one of (1) to (3) above, and a mold clamping mechanism 35 that clamps the mold C. be.
  • a resin molded product (resin molded substrate Sb) can be manufactured using the mold C described in any one of (1) to (3) above. can.
  • a feature of the method for manufacturing a resin molded product (resin molded substrate Sb) using the resin molding apparatus 100 described in (4) above is that the molding object (substrate Sa before resin molding) is placed in the mold C, and the resin In the supply process of supplying the material (resin tablet T), the second elastic member 66 is elastically deformed by the first mold clamping force to bring the cull block 65 and the pot block 54 into contact, and also to contact the lower surface 68 of the upper mold cavity block 64.
  • the resin material (resin tablet T, molten resin Ta) filled in the pot 54b is supplied to the cavity MC by contacting the upper surface 56 of the molding object (substrate Sa before resin molding), and the air vent groove is filled with the second mold clamping force.
  • the present invention includes a mold clamping step of closing 64a, and a molding step of resin molding the object to be molded (substrate Sa before resin molding).
  • the second elastic member 66 is elastically deformed by the first mold clamping force to bring the cull block 65 and the pot block 54 into contact with each other, and the lower surface 68 of the upper mold cavity block 64 and the molding object (substrate Sa before resin molding) contact with the upper surface 56 of.
  • the resin material (molten resin Ta) is supplied to the cavity MC, and then the air vent groove 64a is closed by the second mold clamping force to manufacture the molded resin product (resin molded substrate Sb). process).
  • the resin material (molten resin Ta) is supplied with the first mold clamping force until the air vent groove 64a is closed with the second mold clamping force, and the resin molded product (resin molded substrate Sb) is manufactured.
  • a resin molded product (resin molded substrate Sb) can be manufactured without applying an excessive pressing force to the product (resin molded substrate Sa).
  • the second mold clamping force can be significantly reduced compared to the mold clamping force in the second mold clamping process of the resin sealing device disclosed in Patent Document 1, and the mold clamping press The machine can be made smaller. Furthermore, since the pressing force acting on the air vent groove 64a that contacts the upper surface 56 of the molding object (substrate Sa before resin molding) can be reduced, it is possible to prevent the air vent groove 64a from being crushed.
  • the amount of compression of the support member (floating pin 63) by the second mold clamping force may be closed when the maximum value is reached.
  • the air in the cavity MC is discharged from the air vent groove 64a, so the air vent groove 64a is not closed until immediately before the cavity MC is filled with the resin material (molten resin Ta). Therefore, with this method, the air vent groove 64a is closed when the compression amount of the support member (floating pin 63) reaches the maximum due to the second mold clamping force, so that the resin material (molten resin Ta) is not filled.
  • a resin molded product (resin molded substrate Sb) can be manufactured without applying the pressing force by the second mold clamping force to the molding object (substrate Sa before resin molding) until just before the resin molding.
  • the method for manufacturing a resin molded product (resin molded substrate Sb) according to any one of (5) to (7) above is such that when the amount of elastic deformation of the first elastic member 55 reaches a maximum, , the upper surface 56 of the molding object (substrate Sa before resin molding) and the upper surface 57 of the pot block 54 may be flush with each other.
  • the timing at which the pressing force due to the elastic force of the first elastic member 55 acts on the object to be molded can be delayed;
  • the time required to act on the substrate Sa) can be shortened.
  • the present disclosure can be used in a mold, a resin molding device, and a method for manufacturing a resin molded product.
  • Mold clamping mechanism 53 Lower mold cavity block 54: Pot block 54b: Pot 55: First elastic member 63: Floating pin (support member) 64: Upper mold cavity block 64a: Air vent groove 65: Cal block 66: Second elastic member 100: Resin molding device C: Molding mold LM: Lower mold MC: Cavity Sa: Substrate before resin molding (molding object) Sb: Resin molded substrate (resin molded product) T: Resin tablet (resin material) Ta: Molten resin (resin material) UM: Upper mold

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne un moule (C) comprenant : un moule inférieur (LM) comprenant des blocs de cavité de moule inférieur (53) et un bloc de culot (54) ayant un culot (54b) formé ; un moule supérieur (UM) comprenant des blocs de cavité de moule supérieur (64) et un bloc de culture (65) disposé sur le bloc de culot (54) et pouvant monter et descendre indépendamment des blocs de cavité de moule supérieur (64) ; des premiers éléments élastiques (55), qui poussent les blocs de cavité de moule inférieur (53) vers le moule supérieur (UM) ; une pluralité d'éléments de support (63) qui poussent les blocs de cavité de moule supérieur (64) et le bloc de culture (65) et sont élastiquement déformables ; et un second élément élastique (66) qui pousse le bloc de culture (65) et peut amener le bloc de culture (65) à faire saillie vers le bas à partir des surfaces inférieures des blocs de cavité de moule supérieur (64).
PCT/JP2023/010929 2022-07-15 2023-03-20 Moule, dispositif de moulage de résine et méthode de production d'article en résine moulé WO2024014060A1 (fr)

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JP2022-114140 2022-07-15
JP2022114140A JP2024011855A (ja) 2022-07-15 2022-07-15 成形型、樹脂成形装置及び樹脂成形品の製造方法

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168121A (ja) * 1999-12-06 2001-06-22 Towa Corp 電子部品の樹脂封止成形方法
JP2016152305A (ja) * 2015-02-17 2016-08-22 アピックヤマダ株式会社 モールド金型、樹脂モールド装置及び樹脂モールド方法
JP2017007170A (ja) * 2015-06-19 2017-01-12 アピックヤマダ株式会社 モールド金型、樹脂モールド装置及び樹脂モールド方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168121A (ja) * 1999-12-06 2001-06-22 Towa Corp 電子部品の樹脂封止成形方法
JP2016152305A (ja) * 2015-02-17 2016-08-22 アピックヤマダ株式会社 モールド金型、樹脂モールド装置及び樹脂モールド方法
JP2017007170A (ja) * 2015-06-19 2017-01-12 アピックヤマダ株式会社 モールド金型、樹脂モールド装置及び樹脂モールド方法

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