WO2022202059A1 - Procédé de fabrication de tampon à polir - Google Patents

Procédé de fabrication de tampon à polir Download PDF

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Publication number
WO2022202059A1
WO2022202059A1 PCT/JP2022/007227 JP2022007227W WO2022202059A1 WO 2022202059 A1 WO2022202059 A1 WO 2022202059A1 JP 2022007227 W JP2022007227 W JP 2022007227W WO 2022202059 A1 WO2022202059 A1 WO 2022202059A1
Authority
WO
WIPO (PCT)
Prior art keywords
detection window
polishing pad
manufacturing
end point
window member
Prior art date
Application number
PCT/JP2022/007227
Other languages
English (en)
Japanese (ja)
Inventor
佳秀 川村
光紀 糸山
仁志 関谷
哲平 立野
堅一 小池
大和 ▲高▼見沢
Original Assignee
富士紡ホールディングス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021050341A external-priority patent/JP2022148596A/ja
Priority claimed from JP2021051702A external-priority patent/JP2022149504A/ja
Priority claimed from JP2021156483A external-priority patent/JP2023047519A/ja
Priority claimed from JP2021156497A external-priority patent/JP2023047530A/ja
Priority claimed from JP2021156530A external-priority patent/JP2023047558A/ja
Priority claimed from JP2021160631A external-priority patent/JP2023050503A/ja
Application filed by 富士紡ホールディングス株式会社 filed Critical 富士紡ホールディングス株式会社
Publication of WO2022202059A1 publication Critical patent/WO2022202059A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

L'invention concerne un procédé de fabrication d'un tampon à polir qui comprend une couche de polissage présentant une fenêtre de détection de point d'extrémité, le procédé comportant : une étape de durcissement destinée à fixer un élément de fenêtre de détection de point d'extrémité à l'intérieur d'une matrice, et le durcissement d'une résine durcissable qui est en contact avec l'élément de fenêtre de détection de point d'extrémité de manière à former une feuille de résine dans laquelle l'élément de fenêtre de détection de point d'extrémité est incorporée ; et une étape de tranchage destinée à trancher la feuille de résine de manière à former la couche de polissage. Dans l'étape de durcissement, l'élément fenêtre de détection de point d'extrémité est fixé de manière à être suspendu à partir d'un gabarit de fixation de position qui est installé au sommet de la matrice.
PCT/JP2022/007227 2021-03-24 2022-02-22 Procédé de fabrication de tampon à polir WO2022202059A1 (fr)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2021050341A JP2022148596A (ja) 2021-03-24 2021-03-24 研磨パッドの製造方法
JP2021-050341 2021-03-24
JP2021051702A JP2022149504A (ja) 2021-03-25 2021-03-25 研磨パッドの製造方法
JP2021-051702 2021-03-25
JP2021-156530 2021-09-27
JP2021156483A JP2023047519A (ja) 2021-09-27 2021-09-27 研磨パッド及び研磨加工物の製造方法
JP2021156497A JP2023047530A (ja) 2021-09-27 2021-09-27 研磨パッドの製造方法
JP2021-156483 2021-09-27
JP2021156530A JP2023047558A (ja) 2021-09-27 2021-09-27 研磨パッドの製造方法
JP2021-156497 2021-09-27
JP2021-160631 2021-09-30
JP2021160631A JP2023050503A (ja) 2021-09-30 2021-09-30 終点検出用窓材の製造方法

Publications (1)

Publication Number Publication Date
WO2022202059A1 true WO2022202059A1 (fr) 2022-09-29

Family

ID=83396976

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/007227 WO2022202059A1 (fr) 2021-03-24 2022-02-22 Procédé de fabrication de tampon à polir

Country Status (2)

Country Link
TW (1) TW202245980A (fr)
WO (1) WO2022202059A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4530584B1 (fr) * 1965-12-02 1970-10-03
JP2005210143A (ja) * 1995-08-21 2005-08-04 Rohm & Haas Electronic Materials Cmp Holdings Inc 研磨パッドの製造方法及び研磨パッド
JP2006069158A (ja) * 2004-09-06 2006-03-16 Bridgestone Corp 成形用の金型及び成形方法
JP2006110686A (ja) * 2004-10-15 2006-04-27 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2012071416A (ja) * 2010-09-29 2012-04-12 Rohm & Haas Electronic Materials Cmp Holdings Inc 光安定性ポリマー終点検出窓を有するケミカルメカニカルポリッシングパッドおよびそれを用いた研磨方法
JP2012524672A (ja) * 2009-04-23 2012-10-18 アプライド マテリアルズ インコーポレイテッド 研磨パッド窓の処理
JP2013539233A (ja) * 2010-09-30 2013-10-17 ネクスプラナー コーポレイション 渦電流終点検出のための研磨パッド

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4530584B1 (fr) * 1965-12-02 1970-10-03
JP2005210143A (ja) * 1995-08-21 2005-08-04 Rohm & Haas Electronic Materials Cmp Holdings Inc 研磨パッドの製造方法及び研磨パッド
JP2006069158A (ja) * 2004-09-06 2006-03-16 Bridgestone Corp 成形用の金型及び成形方法
JP2006110686A (ja) * 2004-10-15 2006-04-27 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2012524672A (ja) * 2009-04-23 2012-10-18 アプライド マテリアルズ インコーポレイテッド 研磨パッド窓の処理
JP2012071416A (ja) * 2010-09-29 2012-04-12 Rohm & Haas Electronic Materials Cmp Holdings Inc 光安定性ポリマー終点検出窓を有するケミカルメカニカルポリッシングパッドおよびそれを用いた研磨方法
JP2013539233A (ja) * 2010-09-30 2013-10-17 ネクスプラナー コーポレイション 渦電流終点検出のための研磨パッド

Also Published As

Publication number Publication date
TW202245980A (zh) 2022-12-01

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